JP2016197497A - Operation detector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an operation detector which can improve electromagnetic compatibility while suppressing the manufacturing cost.SOLUTION: An operation detector 1 comprises: an operation panel 7 having an operation area 72 in which operations are performed; a detection electrode 3 which detects an operation performed in the operation area 72 of the operation panel 7; a board 2 on which the detection electrode 3 is arranged; a grounding electrode 4 arranged on the board 2; a non-conductive part 61, arranged between the board 2 and the operation panel 7, which is made of a plurality of adhesive compounds that integrate a member making contact with a front face 6a and a member making contact with a rear face 6b, and which is also made of a non-conducting adhesive compound 60 in accordance with the detection electrode 3; and a bonding part 6 having a conductive part 63 made of a conducting adhesive compound 62 in accordance with the grounding electrode 4.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an operation detection device.

  As a conventional technique, a first substrate having a plurality of first strip electrodes arranged in parallel to each other on the first facing surface side, insulated from the first strip electrode, An input device comprising: a second substrate having a plurality of second strip electrodes arranged in parallel to each other along a direction different from the strip electrode on a second facing surface side facing the first facing surface Is known (for example, see Patent Document 1).

  In this input device, a shield layer is disposed on the back surface of the second substrate, and this shield layer is connected to a ground terminal.

JP 2010-128648 A

  However, in the conventional input device, since the shield layer is disposed on the back surface of the second substrate, electromagnetic waves are emitted from the first strip electrode and the second strip electrode toward the surface of the first substrate. There is a problem in electromagnetic compatibility (EMC) such as emission and immunity in which external electromagnetic waves are incident from the surface. Further, in the conventional input device, if a shield layer is provided near the surface in order to improve electromagnetic compatibility, there is a problem that the manufacturing cost increases.

  Accordingly, an object of the present invention is to provide an operation detection device capable of improving electromagnetic compatibility while suppressing manufacturing costs.

  One embodiment of the present invention includes an operation panel having an operation region in which an operation is performed, a detection electrode that detects an operation performed in the operation region of the operation panel, a base on which the detection electrode is disposed, and a grounding disposed on the base The electrode is disposed between the base and the operation panel, and is formed by a plurality of bonding agents that integrate a member that contacts the front surface and a member that contacts the back surface, and is formed by a non-conductive bonding agent corresponding to the detection electrode. Provided is an operation detection device including a non-conductive portion and a joint portion having a conductive portion formed by a conductive bonding agent corresponding to a ground electrode.

  According to the present invention, electromagnetic compatibility can be improved while suppressing manufacturing costs.

Fig.1 (a) is an example of the expanded view of the operation detection apparatus 1 which concerns on 1st Embodiment, FIG.1 (b) is a top view which shows an example of an operation detection apparatus, FIG.1 (c) ) Is an example of a cross-sectional view of a cross section taken along line I (c) -I (c) shown in FIG. FIG. 2A is a schematic diagram illustrating an example of a joint portion of the operation detection device according to the first embodiment, and FIG. 2B is a schematic diagram illustrating an example of a joint portion according to the first modification. FIG. 2C is a schematic diagram illustrating an example of a joint portion according to the second modification. FIG. 3 is an essential part cross-sectional view showing an example of the operation detection apparatus according to the second embodiment.

(Summary of embodiment)
An operation detection apparatus according to an embodiment includes an operation panel having an operation area in which an operation is performed, a detection electrode that detects an operation performed in the operation area of the operation panel, a base on which the detection electrode is disposed, and a base disposed on the base Formed by a plurality of bonding agents, which are arranged between the ground electrode, the base and the operation panel, and a member in contact with the front surface and a member in contact with the back surface, and a non-conductive bonding agent corresponding to the detection electrode A non-conductive portion to be formed and a bonding portion having a conductive portion formed by a conductive bonding agent corresponding to the ground electrode are schematically configured.

  In this operation detection device, the conductive portion can suppress the electromagnetic wave emitted from the detection electrode and can suppress the electromagnetic wave incident from the surface of the operation panel. In the operation detection device, since the conductive portion is formed of a bonding agent that joins the members, the number of parts is reduced and the manufacturing cost is suppressed as compared with the case where the conductive members are arranged. Therefore, the operation detection apparatus can improve electromagnetic compatibility, suppressing manufacturing cost.

[First embodiment]
(Configuration of operation detection device 1)
Fig.1 (a) is an example of the expanded view of the operation detection apparatus 1 which concerns on 1st Embodiment, FIG.1 (b) is a top view which shows an example of an operation detection apparatus, FIG.1 (c) ) Is an example of a cross-sectional view of a cross section taken along line I (c) -I (c) shown in FIG. In FIG. 1B, a part of the electronic circuit unit is illustrated as an example. Note that, in each drawing according to the embodiment described below, the ratio between figures may be different from the actual ratio.

  The operation detection device 1 is a sensor device that detects contact or approach of a detection target having conductivity. As an example, the operation detection device 1 is configured to be able to operate an electronic device mounted on a vehicle. In the present embodiment, the detection target is a finger, and a touch operation performed on an operation area 72 described later is detected.

  As shown in FIG. 1A, the operation detection device 1 includes an operation panel 7 having an operation area 72 where an operation is performed, a detection electrode 3 which detects an operation performed on the operation area 72 of the operation panel 7, A plurality of joints in which a substrate on which the detection electrode 3 is disposed, a ground electrode 4 disposed on the substrate, a member disposed between the substrate and the operation panel 7 and in contact with the front surface 6a and a member in contact with the back surface 6b are integrated. A junction 6 having a non-conductive portion 61 formed of an agent and formed of a non-conductive bonding agent corresponding to the detection electrode 3 and a conductive portion 63 formed of a conductive bonding agent corresponding to the ground electrode 4. And is schematically configured.

  As an example, the substrate is a substrate 2 shown in FIG. As an example, the non-conductive bonding agent is a non-conductive adhesive 60 described later. As an example, the conductive bonding agent is a conductive adhesive 62 described later.

(Configuration of substrate 2)
The substrate 2 is a rigid substrate formed using, for example, glass epoxy. In the substrate 2, for example, as shown in FIG. 1C, the detection electrode 3, the ground electrode 4, and the electronic circuit unit 5 are arranged on the back surface 21. The substrate is not limited to a rigid substrate, and may be a flexible substrate with high flexibility.

  As an example, the detection electrode 3 is arranged at the center of the substrate 2 as shown in FIG. The ground electrode 4 is disposed around the detection electrode 3 as an example. As an example, the electronic circuit unit 5 is disposed outside the ground electrode 4 as shown in FIG.

(Configuration of detection electrode 3)
The detection electrode 3 is formed using conductive metals, such as copper and silver, for example. The detection electrode 3 has a rectangular shape. The detection electrode 3 includes a wiring 30 as shown in FIG. 1B, for example. For example, the wiring 30 is electrically connected to the electronic circuit unit 5.

  The detection electrode 3 uses, for example, the operation area 72 of the operation panel 7 as a detection range. The detection electrode 3 is driven by, for example, the electronic circuit unit 5, and when the operator's finger comes into contact with the operation region 72, capacitance is generated between the detection electrode 3 and the operator's finger. This capacitance is read by the electronic circuit unit 5, for example. For example, the electronic circuit unit 5 is configured to determine that a touch operation has been performed on the operation region 72 when the capacitance is equal to or greater than a threshold value.

  In addition, although the detection electrode 3 of this Embodiment was one electrode, it is not limited to this, The structure which a some detection electrode cross | intersects maintaining insulation may be sufficient.

(Configuration of ground electrode 4)
The ground electrode 4 is formed using, for example, a conductive metal such as copper or silver. The ground electrode 4 is disposed, for example, to suppress electromagnetic waves that pass through the operation panel 7 or the like and affect the detection electrode 3. For example, the ground electrode 4 includes a wiring 40 as shown in FIG. For example, the wiring 40 is electrically connected to the electronic circuit unit 5.

  In the ground electrode 4, the conductive portion 63 of the joint portion 6 is positioned above. Therefore, the ground electrode 4 and the conductive portion 63 perform electrostatic coupling.

(Configuration of electronic circuit unit 5)
The electronic circuit unit 5 is an electronic circuit formed by a plurality of electronic components. The electronic circuit portion 5 is disposed on the back surface 21 of the substrate 2 and is electrically connected to the detection electrode 3 and the ground electrode 4, but is not electrically connected to the conductive portion 63 of the joint portion 6. The electronic circuit part 5 has a conductive part 63 positioned above it.

(Structure of the joining part 6)
FIG. 2A is a schematic diagram illustrating an example of a joint portion of the operation detection device according to the first embodiment, and FIG. 2B is a schematic diagram illustrating an example of a joint portion according to the first modification. FIG. 2C is a schematic diagram illustrating an example of a joint portion according to the second modification.

  As shown in FIG. 2 (a), the joining portion 6 does not have a base material, and includes a non-conductive portion 61 made of a non-conductive pressure-sensitive adhesive 60, a conductive portion 63 made of a conductive pressure-sensitive adhesive 62, It is composed of For example, the bonding portion 6 is formed by sandwiching an adhesive layer between films, peeling one film and sticking the exposed adhesive surface to one member, and then peeling the other film and sticking the other member to the exposed adhesive surface. By attaching, the member is integrated with the member.

  The non-conductive adhesive 60 is, for example, an acrylic or silicone adhesive. The conductive adhesive 62 is imparted with conductivity by mixing conductive spherical or flaky conductive fillers with, for example, an acrylic or silicone adhesive. The conductive filler is formed using, for example, gold, silver, copper, nickel, carbon, graphite or the like.

  The non-conductive portion 61 is disposed above the detection electrode 3 so as not to reduce the detection accuracy of the operation performed on the operation region 72. Therefore, the non-conductive portion 61 has a rectangular shape corresponding to the shape of the detection electrode 3. Further, the non-conductive portion 61 is also disposed outside the conductive portion 63 as shown in FIG. The outer non-conductive portion 61 has a rectangular ring shape as shown in FIG. The nonconductive portion 61 may be disposed only above the detection electrode 3.

  As shown in FIG. 1C, the conductive part 63 is disposed at least above the ground electrode 4. The conductive portion 63 of the present embodiment is also disposed above the electronic circuit portion 5. Therefore, as shown in FIG. 1B, the conductive portion 63 has a rectangular ring shape having a sufficient width to cover the ground electrode 4 and the electronic circuit portion 5.

  Here, most of the wiring 30 of the detection electrode 3 is located below the conductive portion 63. All of the wiring 40 of the ground electrode 4 is located below the conductive portion 63. Therefore, when the operator unintentionally touches the operation panel 7 above the wiring 30 of the detection electrode 3, the conductive portion 63 is located above the wiring 30, so that erroneous detection is suppressed.

  The conductive portion 63 is not connected to any circuit in a direct current manner. That is, the conductive portion 63 is electrostatically coupled to the ground electrode 4, but the conductive portion 63 is not electrically connected to the electronic circuit portion 5 or the like by physical wiring.

  In the joint portion 6 of the present embodiment, the member that contacts the front surface 6 a is the operation panel 7, and the member that contacts the back surface 6 b is the substrate 2.

  Below, the modification 1 and the modification 2 of the junction part 6 are demonstrated.

-About the modification 1 As shown in FIG.2 (b), the junction part 6 of the modification 1 has the film 65 as a base material. For example, the film 65 is a resin film such as polyimide or polyester.

  A non-conductive adhesive 60 is disposed on the entire surface 65 a of the film 65. Further, on the back surface 65b of the film 65, a non-conductive part 61 made of a non-conductive adhesive 60 according to the detection electrode 3 and a conductive part 63 made of a conductive adhesive 62 according to the ground electrode 4 and the electronic circuit part 5; Is arranged. A non-conductive portion 61 is disposed around the conductive portion 63.

  In addition, the junction part 6 of the modification 1 may be comprised combining the nonelectroconductive adhesive tape and the electroconductive adhesive tape, for example.

About Modification 2 As shown in FIG. 2C, the joining portion 6 of Modification 2 has a non-conductive adhesive 66 applied to the front surface 65a of the film 65 and a non-conductive adhesive 66 on the back surface 65b. A conductive adhesive 67 is applied.

  Specifically, the non-conductive adhesive 66 is applied to the entire surface 65a. A non-conductive portion 61 made of a non-conductive adhesive 66 according to the detection electrode 3 and a conductive portion 63 made of a conductive adhesive 67 according to the ground electrode 4 and the electronic circuit portion 5 are located on the back surface 65b. Yes. A nonconductive adhesive 66 is applied around the conductive portion 63 so that the nonconductive portion 61 is located.

  The non-conductive adhesive 66 is, for example, an acrylic, silicone, or epoxy adhesive. Further, as an example, the conductive adhesive 67 is imparted with conductivity by mixing a spherical or flaky conductive filler having conductivity with an acrylic, silicone, or epoxy adhesive. The conductive filler is formed using, for example, gold, silver, copper, nickel, carbon, graphite or the like.

  In addition, the junction part 6 of the modification 2 may be comprised combining the nonelectroconductive adhesive tape and the electroconductive adhesive tape, for example.

  In addition, although the member which contact | connects the surface 6a is the operation panel 7, and the member which contact | connects the back surface 6b is the board | substrate 2 of the junction part 6 of the modification 1 and the modification 2, It is not limited to this. Further, the joint 6 of the first and second modifications may be attached to the operation panel 7 and the substrate 2 with the front and back sides of the paper surface of FIGS. 2B and 2C reversed. Furthermore, when the detection electrode 3 etc. are arrange | positioned at the surface 20 of the board | substrate 2, the junction part 6 of the modification 1 and the modification 2 is arrange | positioned so that the surface 6a and the back surface 6b may become reverse.

(Configuration of operation panel 7)
The operation panel 7 has a rectangular shape. The operation panel 7 is formed using, for example, a resin material such as polycarbonate or polymethyl methacrylate, or a glass material.

  An operation area 72 corresponding to the detection electrode 3 is formed on the surface 70 of the operation panel 7. In addition, the back surface 71 has the surface 6a of the joint 6 attached thereto.

(Configuration of casing shield 8)
The housing shield 8 is formed in a box shape using a conductive metal material, for example. The casing shield 8 is electrically connected to the ground circuit of the operation detection device 1 and is configured to shield electromagnetic waves emitted in the normal direction of the back surface 21 of the substrate 2 of the operation detection device 1.

(Effects of the first embodiment)
The operation detection apparatus 1 according to the present embodiment can improve electromagnetic compatibility while suppressing manufacturing costs. Specifically, in the operation detection device 1, the conductive portion 63 of the joint portion 6 is located closer to the operation region 72 than the detection electrode 3, so that the conductive portion 63 transmits electromagnetic waves emitted from the detection electrode 3. It is possible to suppress the electromagnetic wave incident from the surface 70 of the operation panel 7 while suppressing the electromagnetic wave. Further, in the operation detection device 1, since the conductive portion 63 is formed by the conductive adhesive 62 that joins the members, the number of parts is reduced and the manufacturing cost is suppressed as compared with the case where the conductive members are arranged. Therefore, the operation detection apparatus 1 can improve electromagnetic compatibility, suppressing manufacturing cost.

  In the operation detection device 1, since the conductive part 63 is not connected to any circuit in a direct current manner, a wiring process is not required and the manufacturing cost is reduced compared to the case where the conductive part 63 has a conductive part connected in a direct current. The

  In the operation detection device 1, since the conductive portion 63 is also located above the electronic circuit portion 5, it is possible to suppress the influence of external electromagnetic waves received by the electronic circuit portion 5.

  Since the operation detection device 1 does not detect contact with the operation panel 7 above the wiring 30 because the wiring 30 of the detection electrode 3 is located below the conductive portion 63, the operation detection device 1 detects contact unintended by the operator. False detection is suppressed.

[Second Embodiment]
The second embodiment is different from the above-described embodiment in that a light guide is provided between the substrate and the operation panel.

  FIG. 3 is an essential part cross-sectional view showing an example of the operation detection apparatus according to the second embodiment. In the embodiments described below, parts having the same functions and configurations as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment, and description thereof is omitted.

  As shown in FIG. 3, the operation detection device 9 according to the present embodiment includes a substrate 2a, a detection electrode 3, a ground electrode 4, an electronic circuit unit 5, a joint unit 6, an operation panel 7, and a light guide. 90, an adhesive sheet 91, and an LED (light emitting diode) 93.

  The substrate 2a is a double-sided mounting substrate. As for this board | substrate 2a, LED93 is arrange | positioned at the edge part of the surface 20a. The LED 93 illuminates the operation panel 7 via the light guide 90.

  Further, as shown in FIG. 3, the detection electrode 3 and the ground electrode 4 are arranged on the surface 20a. The positional relationship between the detection electrode 3 and the ground electrode 4 is, for example, the same as that in the first embodiment.

  A ground electrode 4 and an electronic circuit unit 5 are disposed on the back surface 21a of the substrate 2a. The ground electrode 4 on the back surface 21a has a shape corresponding to the detection electrode 3 and the ground electrode 4 on the front surface 20a. The ground electrode 4 on the back surface 21 a is disposed to shield electromagnetic waves emitted from below the detection electrode 3. Therefore, the operation detection device 9 may not have the housing shield 8 of the first embodiment.

  At the junction 6, at least the non-conductive portion 61 is highly transparent so that the light 94 propagated through the LED 93 and the light guide 90 is transmitted. The non-conductive portion 61 is formed by a highly transparent non-conductive adhesive 60. This transparency is 90% or more as an example.

  As an example, the operation detection device 9 may be configured to illuminate the operation area 72 using the outside of the operation area 72 of the operation panel 7 as a light shielding area. This light shielding area is an area that does not transmit the light 94 of the LED 93 and is formed by printing. In the operation detection device 9, a design may be printed in the operation area 72.

  The operation panel 7 is formed using, for example, a resin material such as polycarbonate having a high transparency, or a glass material so that illumination by the LED 93 via the light guide 90 is performed. This transparency is 90% or more as an example.

  The light guide 90 is formed using a material having high transparency such as silicone. The front surface 90 a of the light guide 90 is in contact with the back surface 6 b of the joint portion 6. This transparency is 90% or more as an example.

  Further, the back surface 90 b is in contact with the adhesive sheet 91. That is, the light guide 90 is integrated with the operation panel 7 by the joint portion 6, and is integrated with the substrate 2 a by the adhesive sheet 91. The light guide 90 may include particles that scatter light therein.

  The pressure-sensitive adhesive sheet 91 is a sheet formed of, for example, an acrylic or silicone pressure-sensitive adhesive. The pressure-sensitive adhesive sheet 91 may be a sheet made of an adhesive such as acrylic, silicone, or epoxy.

  As an example, the LED 93 is configured to output white light 94. The LED 93 outputs light 94 toward the side surface of the light guide 90.

(Effect of the second embodiment)
Since the operation detection device 1 according to the present embodiment has the ground electrode 4 disposed on the back surface 21a of the substrate 2a, there is no need for a casing shield for shielding electromagnetic waves emitted below the detection electrode 3, and the manufacturing cost is low. It is suppressed.

  As mentioned above, although some embodiment and modification of this invention were demonstrated, these embodiment and modification are only examples, and do not limit the invention based on a claim. These novel embodiments and modifications can be implemented in various other forms, and various omissions, replacements, changes, and the like can be made without departing from the scope of the present invention. In addition, not all combinations of features described in these embodiments and modifications are necessarily essential to the means for solving the problems of the invention. Furthermore, these embodiments and modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 1 ... Operation detection apparatus, 2, 2a ... Board | substrate, 3 ... Detection electrode, 4 ... Ground electrode, 5 ... Electronic circuit part, 6 ... Junction part, 6a ... Front surface, 6b ... Back surface, 7 ... Operation panel, 8 ... Housing Shield, 9 ... Operation detection device, 20, 20a ... Front surface, 21, 21a ... Back surface, 30, 40 ... Wiring, 60 ... Non-conductive adhesive, 61 ... Non-conductive part, 62 ... Conductive adhesive, 63 ... Conductive 65, film, 65a ... front surface, 65b ... back surface, 66 ... non-conductive adhesive, 67 ... conductive adhesive, 70 ... front surface, 71 ... back surface, 72 ... operating area, 90 ... light guide, 90a ... front surface , 90b ... back side, 91 ... adhesive sheet, 94 ... light

Claims (4)

An operation panel having an operation area to be operated;
A detection electrode for detecting an operation performed on the operation area of the operation panel;
A substrate on which the detection electrode is disposed;
A ground electrode disposed on the substrate;
It is disposed between the base and the operation panel, and is formed by a plurality of bonding agents that integrate a member that contacts the front surface and a member that contacts the back surface, and is formed by a non-conductive bonding agent corresponding to the detection electrode. A non-conductive portion, and a joint portion having a conductive portion formed by a conductive bonding agent corresponding to the ground electrode;
An operation detection device comprising: The ground electrode is formed around the detection electrode;
The operation detection apparatus according to claim 1. The conductive part is not connected to any circuit in a direct current,
The operation detection device according to claim 1 or 2. An electronic circuit part electrically connected to the detection electrode is disposed on the base body,
The conductive part is located above the ground electrode and the electronic circuit part;
The operation detection device according to claim 1.

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