JP2016195089A5 - Enamelled wire, coil using the enameled wire, and electric parts using the coil - Google Patents
Enamelled wire, coil using the enameled wire, and electric parts using the coil Download PDFInfo
- Publication number
- JP2016195089A5 JP2016195089A5 JP2015075541A JP2015075541A JP2016195089A5 JP 2016195089 A5 JP2016195089 A5 JP 2016195089A5 JP 2015075541 A JP2015075541 A JP 2015075541A JP 2015075541 A JP2015075541 A JP 2015075541A JP 2016195089 A5 JP2016195089 A5 JP 2016195089A5
- Authority
- JP
- Japan
- Prior art keywords
- enameled wire
- insulating layer
- coil
- wire according
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002245 particle Substances 0.000 claims 6
- 239000000945 filler Substances 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 150000003949 imides Chemical class 0.000 claims 3
- 210000003298 Dental Enamel Anatomy 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- 239000002320 enamel (paints) Substances 0.000 claims 2
- 239000011256 inorganic filler Substances 0.000 claims 2
- 229910003475 inorganic filler Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229920003048 styrene butadiene rubber Polymers 0.000 claims 2
- 239000004962 Polyamide-imide Substances 0.000 claims 1
- 229920001721 Polyimide Polymers 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- 239000011258 core-shell material Substances 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 150000002484 inorganic compounds Chemical class 0.000 claims 1
- 229910010272 inorganic material Inorganic materials 0.000 claims 1
- 229920002312 polyamide-imide Polymers 0.000 claims 1
- 229920005587 polyester-imide Polymers 0.000 claims 1
- 239000005060 rubber Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
Claims (11)
前記エナメル被覆は、前記金属導体線の直上に形成されイミド系樹脂を主成分とする第1絶縁層と、前記第1絶縁層の直上に形成されイミド系樹脂を主成分とする第2絶縁層とを有し、
前記第2絶縁層は、該第2絶縁層に対して10質量%以上49質量%以下の範囲でフィラーを含有し、前記フィラーはスチレンブタジエンゴム粒子を含むことを特徴とするエナメル線。 An enameled wire in which an enamel coating is formed on the outer periphery of a metal conductor wire,
The enamel coating is formed immediately above the metal conductor wire and includes a first insulating layer mainly composed of an imide resin, and a second insulating layer formed directly above the first insulating layer and mainly composed of an imide resin. And
The said 2nd insulating layer contains a filler in 10 mass% or more and 49 mass% or less with respect to this 2nd insulating layer, The said filler contains a styrene butadiene rubber particle, The enamel wire characterized by the above-mentioned.
前記フィラーの平均粒子径が、0.1μm以上10μm以下であることを特徴とするエナメル線。 The enameled wire according to claim 1,
An enameled wire, wherein the filler has an average particle size of 0.1 μm or more and 10 μm or less.
前記スチレンブタジエンゴム粒子は、コアシェル構造を有するゴム粒子であることを特徴とするエナメル線。 In the enameled wire according to claim 1 or 2,
The styrene butadiene rubber particles are rubber particles having a core-shell structure.
前記フィラーは、無機フィラーを更に含むことを特徴とするエナメル線。 In the enameled wire according to any one of claims 1 to 3,
The enameled wire, wherein the filler further contains an inorganic filler.
前記無機フィラーは、ケイ素酸化物粒子および無機化合物の鱗片状粒子の少なくとも一方であることを特徴とするエナメル線。 The enameled wire according to claim 4,
The enamel wire, wherein the inorganic filler is at least one of silicon oxide particles and scale-like particles of an inorganic compound.
前記第2絶縁層の厚さは、前記第1絶縁層の厚さよりも大きいことを特徴とするエナメル線。 In the enameled wire according to any one of claims 1 to 5,
The enameled wire, wherein a thickness of the second insulating layer is larger than a thickness of the first insulating layer.
前記第2絶縁層の直上に、所定の樹脂を主成分とする第3絶縁層を更に有することを特徴とするエナメル線。 In the enameled wire according to any one of claims 1 to 6,
An enameled wire, further comprising a third insulating layer containing a predetermined resin as a main component immediately above the second insulating layer.
前記第3絶縁層の厚さは、前記第2絶縁層の厚さよりも小さいことを特徴とするエナメル線。 The enameled wire according to claim 7,
The enameled wire, wherein the thickness of the third insulating layer is smaller than the thickness of the second insulating layer.
前記イミド系樹脂は、ポリイミド、ポリアミドイミド、およびポリエステルイミドのいずれかであることを特徴とするエナメル線。 In the enameled wire according to any one of claims 1 to 8,
The enameled wire, wherein the imide-based resin is any one of polyimide, polyamideimide, and polyesterimide.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015075541A JP2016195089A (en) | 2015-04-02 | 2015-04-02 | Enamel wire, coil using enamel wire, and electrical component using coil |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015075541A JP2016195089A (en) | 2015-04-02 | 2015-04-02 | Enamel wire, coil using enamel wire, and electrical component using coil |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016195089A JP2016195089A (en) | 2016-11-17 |
JP2016195089A5 true JP2016195089A5 (en) | 2018-03-29 |
Family
ID=57323901
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015075541A Pending JP2016195089A (en) | 2015-04-02 | 2015-04-02 | Enamel wire, coil using enamel wire, and electrical component using coil |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2016195089A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109390086B (en) * | 2018-11-24 | 2023-09-12 | 宁波鑫健新材料科技有限公司 | Enameled wire for electronic expansion valve of variable-frequency air conditioner |
EP3979262A4 (en) * | 2019-05-31 | 2022-06-22 | Showa Denko Materials Co., Ltd. | Electrically-insulating resin composition and electrical insulator |
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2015
- 2015-04-02 JP JP2015075541A patent/JP2016195089A/en active Pending
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