JP2016192558A - Gas cell and magnetic measuring apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily seal a package while making fluid easy to circulate between an interior and an exterior of the package.SOLUTION: A sealing member having a through hole is provided between a package having an opening and a lid covering the opening, and the package is joined to the lid. Cleaning liquid and a coating agent are circulated through the through hole between an interior and an exterior of the package and the sealing material is melted to seal the through hole.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a method for sealing a package.

  A technique for sealing an electronic component or a semiconductor package is known. For example, in Cited Document 1, in the manufacture of display devices such as PDP (Plasma Display Panel) and FED (Field Emission Display), a sealing material is disposed in the vent hole and melted by irradiating with laser light. A method for sealing a space between a front panel and a rear panel is described. Cited Document 2 describes a method of sealing a through hole by placing a sealing member in a through hole provided at the bottom of a container and melting the sealing member by laser beam irradiation. In Cited Document 3, pores are formed inside a cylindrical glass tube, and after exhaust and gas are sealed through the pores, a laser beam is applied to the glass around the pores and heated and melted. A method for hermetically sealing by closing the pores is described.

JP 2008-103184 A JP 2008-57995 A JP-A-61-51746

Incidentally, an optical pumping type magnetic sensor is known as a device for detecting a magnetic field emitted from a living heart or the like. For this magnetic sensor, a gas cell in which an alkali metal gas is sealed is used. When manufacturing this gas cell, after forming the casing (package) of the gas cell, a coating agent is allowed to flow into the casing to form a film on the inner surface of the casing. However, in the method described in Patent Document 1 or 2 described above, since the sealing material seals the through hole of the package, it is difficult to cause the coating agent to flow into the package. Moreover, in the method described in Patent Document 3 described above, it is necessary to heat at a high temperature in order to seal the pores of the cylindrical glass tube, so that the package cannot be easily sealed.
An object of the present invention is to easily seal a package while allowing fluid to easily flow between the inside and the outside of the package.

The present invention provides a sealing step having a through hole between a package having an opening and a lid covering the opening, and joining the package and the lid, and the inside and outside of the package A package sealing method comprising: a flow step of circulating a fluid through the through hole; and a sealing step of melting the sealing material to seal the through hole. I will provide a.
According to this sealing method, the package can be easily sealed while facilitating fluid flow between the inside and the outside of the package.

In a preferred aspect, in the joining step, a joining material is applied to a surface where the package and the lid are joined, and a rod-shaped member is provided between the package and the lid so that one end protrudes to the outside. The sealing material may be formed of the bonding material by arranging and melting the bonding material to bond the package and the lid, and after cooling, the rod-shaped member is pulled out.
According to this sealing method, the sealing material can be easily provided between the package and the lid.

In a preferred embodiment, in the bonding step, a bonding material having a melting point of a first temperature is applied to a surface where the package and the lid are bonded, and the melting point is between the package and the lid. A sealing material that is formed of a material having a second temperature higher than the first temperature and has a through hole is disposed, and the bonding material is heated at a temperature that is equal to or higher than the first temperature and lower than the second temperature. Then, when the bonding material is melted, the package and the lid are bonded, and in the sealing step, the sealing material may be heated at a temperature equal to or higher than the second temperature.
According to this sealing method, the sealing material can be easily provided between the package and the lid.

In a preferred aspect, in the joining step, a housing part that contains alkali metal atoms is disposed in the package, and a first sealing having a first through hole between the package and the lid. And a second sealing material having a second through hole are provided, and in the distribution step, a coating agent is introduced into the package through the first through hole, and the coating is performed. A film is formed on the inner surface of the package by the agent, the coating agent flows out to the outside through the second through hole, and in the sealing step, the first sealing material is melted, and the first In the first sealing step for sealing one through hole, the destruction step for irradiating the housing portion with laser light to destroy the housing portion, and the sealing step, the housing portion was destroyed. After a fixed time Elapsed since the melted first sealing member may comprise a second sealing step of sealing the second through-hole.
According to this sealing method, it is possible to easily manufacture a package in which a film is formed on the inner surface by a coating agent and an alkali metal atom is enclosed.

In a preferred aspect, in the joining step, a plurality of the packages are arranged side by side and connected together, and a third through hole that communicates adjacent packages is provided between the package and the lid. In the second sealing step, the third sealing material is heated in order from the second sealing material, and the third sealing material is melted. Thus, the third through hole may be sealed in order, and the second through hole may be sealed after all the third through holes are sealed.
According to this sealing method, a film is formed on the inner surface by the coating agent, and a plurality of packages in which alkali metal atoms are enclosed can be manufactured together.

The present invention also includes a package having an opening, a lid covering the opening, a through hole, provided between the package and the lid, and melted when heated to form the through hole. A housing for an electronic device is provided.
According to the housing of the electronic device, the package can be easily sealed while fluid can easily flow between the inside and the outside of the package.

In addition, the present invention provides a package having an opening, a lid covering the opening, and an alkali metal atom that is disposed in the package and that discharges the alkali metal when destroyed by laser light. And a first sealing material that has a first through hole, is provided between the package and the lid, melts when heated, and seals the first through hole; A second sealing material that has a second through hole, is provided between the package and the lid, melts when heated, and seals the second through hole. A feature cell is provided.
According to this cell, the package can be easily sealed while facilitating fluid flow between the inside and the outside of the package.

The block diagram showing the structure of a magnetic measurement apparatus. The perspective view which shows the gas cell which concerns on 1st Embodiment. The flowchart which shows the manufacturing process of the gas cell which concerns on 1st Embodiment. The figure explaining the manufacturing process of the gas cell which concerns on 1st Embodiment. The figure explaining the manufacturing process of the gas cell which concerns on 1st Embodiment. The figure explaining the manufacturing process of the gas cell which concerns on 1st Embodiment. The figure explaining the manufacturing process of the gas cell which concerns on 1st Embodiment. The figure explaining the manufacturing process of the gas cell which concerns on 1st Embodiment. The figure explaining the manufacturing process of the gas cell which concerns on 1st Embodiment. The figure explaining the manufacturing process of the gas cell which concerns on 2nd Embodiment. The figure explaining the manufacturing process of the gas cell which concerns on 2nd Embodiment. The figure explaining the manufacturing process of the gas cell which concerns on 2nd Embodiment. The figure explaining the manufacturing process of the gas cell which concerns on 2nd Embodiment. The figure explaining the manufacturing process of the gas cell which concerns on 2nd Embodiment. The figure explaining the manufacturing process of the gas cell which concerns on 2nd Embodiment. The flowchart which shows the manufacturing process of the gas cell which concerns on the modification 1. The figure explaining the manufacturing method of the gas cell which concerns on the modification 1. As shown in FIG. The figure explaining the manufacturing method of the gas cell which concerns on the modification 1. As shown in FIG. The figure explaining the manufacturing method of the gas cell which concerns on the modification 1. As shown in FIG. The figure explaining the manufacturing method of the gas cell which concerns on the modification 1. As shown in FIG. Sectional drawing of the gas cell array which concerns on the modification 2. FIG. The top view of the gas cell array which concerns on the modification 2. FIG. The top view of the package which concerns on the modification 3. FIG. Sectional drawing of the gas cell which concerns on the modification 3. FIG.

1. First Embodiment (1) Configuration FIG. 1 is a block diagram showing a configuration of a magnetic measurement apparatus 1 according to a first embodiment. The magnetic measurement apparatus 1 is a magnetic sensor that measures a magnetic field generated from a living body, such as a magnetic field generated from the heart (magnetomagnetic) or a magnetic field generated from the brain (cerebral magnetism), as an indicator of the state of the living body. The magnetic measurement apparatus 1 includes a gas cell array 10, a pump light irradiation unit 20, a probe light irradiation unit 30, and a detection unit 40. The gas cell array 10 has a plurality of gas cells 11. In the gas cell 11, an alkali metal gas (for example, cesium (Cs)) is sealed. The pump light irradiation unit 20 outputs pump light that interacts with alkali metal atoms (for example, light having a wavelength of 894 nm corresponding to the cesium D1 line). The pump light has a circularly polarized component. When pump light is irradiated, the outermost electrons of the alkali metal atoms are excited and spin polarization occurs. The spin-polarized alkali metal atom precesses due to the magnetic field B generated by the object to be measured. The spin polarization of one alkali metal atom relaxes with time, but since the pump light is CW (Continuous Wave) light, the formation and relaxation of spin polarization are repeated simultaneously and continuously. . As a result, a steady spin polarization is formed as a whole group of atoms.

  The probe light irradiation unit 30 outputs probe light having a linearly polarized light component. Before and after transmission through the gas cell 11, the polarization plane of the probe light rotates due to the Faraday effect. The rotation angle of the polarization plane is a function of the magnetic field B. The detection unit 40 detects the rotation angle of the probe light. The detection unit 40 includes a photodetector that outputs a signal corresponding to the amount of incident light, a processor that processes the signal, and a memory that stores data. The processor calculates the magnitude of the magnetic field B using the signal output from the photodetector. The processor writes data indicating the calculated result in the memory. Thus, the user can obtain information on the magnetic field B generated from the object to be measured.

  FIG. 2 is a perspective view showing the gas cell 11. The gas cell 11 is formed using a material having optical transparency such as quartz glass or borosilicate glass. The gas cell 11 has a package 12 and a lid 13. The package 12 is manufactured by glass molding, for example. The package 12 may be formed by glass processing. The package 12 has a main chamber 14 in which an alkali metal gas is enclosed. The main chamber 14 is opened toward the outside. That is, the package 12 has an opening. The lid 13 is a lid that covers the upper surface of the package 12. The lid 13 is, for example, a glass flat plate.

  A recess 15 having a V-shaped cross section is formed in the package 12 next to the main chamber 14. The recess 15 accommodates an ampoule 50 in which an alkali metal is enclosed. The ampoule 50 is a glass container, for example. The ampoule 50 is used as a housing part that houses alkali metal atoms. A groove 16 is formed on the upper surface of the package 12 from the recess 15 toward the main chamber 14. The groove 16 is also formed by, for example, glass molding. The recess 15 and the main chamber 14 are connected via the groove 16. The inner diameter of the groove 16 can flow a cleaning liquid and a coating agent, which will be described later, but is preferably large so that alkali metal atoms that are spin-polarized in the main chamber 14 are difficult to enter. In the groove 16 shown in FIG. 2, the end on the main chamber 14 side has a smaller inner diameter than the end on the recess 15 side. Further, a groove 17 is formed on the upper surface of the package 12 from the main chamber 14 to the outside, and a groove 18 is formed from the recess 15 to the outside. Further, a recess 19 having a V-shaped cross section is formed on the upper surface of the package 12 so as to intersect with the groove 17.

(2) Manufacturing Method FIG. 3 is a flowchart showing the manufacturing process of the gas cell 11. 4-9 is a figure explaining the manufacturing process of the gas cell 11. FIG. 4-9, the cross section of the gas cell 11 cut | disconnected by the II line | wire shown in FIG. 2 is shown. In step S110 (bonding step), paste-like low melting point glass 60 is applied to the surface where package 12 and lid 13 are joined. Specifically, a paste-like low melting point glass 60 is applied to the upper surface of the package 12 and the peripheral portion of the lower surface of the lid 13. The low melting point glass 60 is applied using, for example, screen printing or a dispenser. After the low melting point glass 60 is applied, the solvent component contained in the low melting point glass 60 is evaporated by heating and dried. Next, the ampoule 50 is placed in the recess 15 of the package 12. After the ampoule 50 is placed, a rod-shaped metal wire 61 is put into the groove 17 as shown in FIG. At this time, the metal wire 61 is disposed so that one end protrudes to the outside and the other end protrudes into the recess 19. Further, a rod-shaped metal wire 62 is put into the groove 18. At this time, the metal wire 62 is disposed so that one end protrudes to the outside and the other end protrudes into the recess 15. In the package 12, grooves may be formed where the metal wires 61 and 62 are arranged so that the metal wires 61 and 62 can be positioned.

  After the metal wires 61 and 62 are arranged, the lid 13 is overlaid on the package 12. As a result, the metal wires 61 and 62 are sandwiched between the package 12 and the lid 13 via the low melting point glass 60. The metal wires 61 and 62 are both formed using a metal that is difficult to be bonded to the low-melting glass 60, such as nickel. Next, heating is performed to a temperature at which the low melting point glass 60 is melted, for example, 400 ° C. while applying pressure. For this heating, for example, an annealing furnace is used. By this heating, the low melting point glass 60 between the package 12 and the lid 13 is melted, and the package 12 and the lid 13 are joined.

  The molten low melting point glass 60 covers the circumferential surface of the metal wire 61 in the groove 17. However, the low melting point glass 60 overflowing from the groove 17 falls into the recess 19. Then, in the metal wire 61, one end protruding to the outside and the other end protruding into the recess 19 are not covered with the low melting point glass 60. Accordingly, the metal wire 61 penetrates the low melting point glass 60 in the groove 17. Similarly, the molten low melting point glass 60 covers the circumferential surface of the metal wire 62 in the groove 18. However, the low melting point glass 60 overflowing from the groove 18 falls into the recess 15. Then, in the metal wire 62, one end projecting outside and the other end projecting into the recess 15 are not covered with the low melting point glass 60. Accordingly, the metal wire 62 penetrates the low melting point glass 60 in the groove 18. After cooling, the metal wires 61 and 62 are pulled out. Thereby, as shown in FIG. 5, two through holes 71 and 72 are formed between the package 12 and the lid 13. In this case, the low melting point glass 60 that forms the through holes 71 and 72 is used as a sealing material.

  In step S120 (coating process), as shown in FIG. 5, the cleaning liquid is caused to flow from the through hole 71 and from the through hole 72 by a pump. In this way, after removing contaminants in the gas cell 11, a film 70 is formed on the inner surface of the main chamber 14 using a coating agent. For this coating agent, for example, paraffin or silane hydrocarbon is used. Further, hexamethyldisilane may be used as the coating agent. As a method for forming the film 70, there are a liquid phase film forming method and a vapor phase film forming method. In any method, as shown in FIG. 5, the coating agent flows in from the through hole 71 and flows out from the through hole 72. However, when the liquid phase film forming method is used, the coating agent flows into the gas cell 11 in a liquid state. On the other hand, when the vapor phase film forming method is used, the coating agent flows into the gas cell 11 in a gas state. The cleaning liquid and the coating agent are fluids that flow between the inside and the outside of the gas cell 11 through the through holes 71 and 72. That is, step S120 (coating process) is included in the flow process of flowing the fluid through the through holes 71 and 72 between the inside and the outside of the gas cell 11.

  In step S130 (first sealing step), as shown in FIG. 6, the low melting point glass 60 in which the through hole 71 is formed is irradiated with laser light through the lid 13 and heated in a vacuum environment. . Thereby, as shown in FIG. 7, the low melting glass 60 is melted and the through hole 71 is sealed. In order to improve the absorption of laser light, a light absorbing material may be added to the low melting point glass 60.

  In step S140 (ampoule breaking step), as shown in FIG. 7, the laser beam is focused on the ampoule 50 in a vacuum environment, and the ampoule 50 is irradiated with the laser beam through the lid 13. Thereby, a hole is made in the ampule 50, or the ampule 50 is cleaved and the ampule 50 is destroyed. This “destruction” refers to breaking the shape of the ampule 50 so that the inside of the ampule 50 communicates with the outside. In order to improve the absorption of laser light, a film of a light absorbing material may be formed on the ampoule. Further, the ampule 50 may be destroyed using an ultrashort pulse laser. When the ampule 50 is broken, a vaporized component may be generated. The vaporized component is exhausted from the through hole 72 to the outside. In order to secure a sufficient time for the vaporized component to be exhausted from the through hole 72, the next step S150 (second sealing step) is performed after the ampoule 50 is broken. It is done after that.

  In step S150 (second sealing step), as shown in FIG. 8, the low melting point glass 60 in which the through hole 72 is formed is irradiated with laser light through the lid 13 and heated in a vacuum environment. . As a result, as shown in FIG. 9, the low melting point glass 60 is melted and the through hole 72 is sealed.

  In step S160 (filling step), the gas cell 11 is filled with an alkali metal gas. Specifically, the alkali metal in the ampoule 50 is vaporized by heating the gas cell 11. As a result, the alkali metal gas is released from the ampoule 50. As shown in FIG. 9, the alkali metal gas released from the ampoule 50 moves to the main chamber 14 through the groove 16. Thereby, the alkali metal gas is diffused and the main chamber 14 is filled with the alkali metal gas.

  In the first embodiment, since the through holes 71 and 72 are formed in the gas cell 11, the cleaning liquid and the coating agent can easily flow in and out between the inside and the outside of the gas cell 11. The through holes 71 and 72 are formed of a low melting point glass 60 having a melting point lower than that of normal glass. Therefore, compared to the case where the through holes 71 and 72 are made of ordinary glass, the through holes 71 and 72 can be sealed even when heated at a low temperature. That is, according to the first embodiment, it is possible to easily seal the gas cell 11 while allowing the cleaning liquid and the coating agent to easily flow between the inside and the outside of the gas cell 11.

2. Second Embodiment In the first embodiment described above, the metal wires 61 and 62 are used to form the sealing material having the through holes 71 and 72 with the low melting point glass 60. The second embodiment is different from the first embodiment in that instead of these sealing materials, sealing materials 81 and 82 previously formed into a cylindrical shape having through holes 73 and 74 are used. About other points, it is the same as that of 1st Embodiment in general. Therefore, in the second embodiment, the description will focus on the manufacturing method of the gas cell 11. The configuration of the gas cell 11 according to the second embodiment is substantially the same as the configuration described in the first embodiment. However, the recesses 19 are not provided in the package 12. The same components as those in the first embodiment are denoted by the same reference numerals as those in FIGS. 2 and 4 to 9 described above, and the description thereof is omitted.

  FIGS. 10-15 is a figure explaining the manufacturing process of the gas cell 11 which concerns on 2nd Embodiment. In step S110 (joining step) described above, a cylindrical sealing material 81 is disposed in the groove 17 of the package 12 in place of the metal wire 61, as shown in FIG. In the groove 18 of the package 12, a cylindrical sealing material 82 is disposed instead of the metal wire 62. The sealing materials 81 and 82 are formed using a material such as low melting glass or solder having a melting point higher than that of the low melting glass 60 applied to the lid 13 and the package 12. Here, it is assumed that the melting point of the low-melting glass 60 is the temperature T1 (first temperature) and the melting point of the material forming the sealing materials 81 and 82 is the temperature T2 (second temperature). In this case, when the package 12 and the lid 13 are joined, only the low melting glass 60 applied to the lid 13 and the package 12 is melted by heating at a temperature not lower than the temperature T1 and lower than the temperature T2. Since the heating temperature at this time is lower than the melting point of the sealing materials 81 and 82, the sealing materials 81 and 82 are maintained in a cylindrical shape without melting.

  In the above-described step S120 (coating process), as shown in FIG. 11, the cleaning liquid and the coating agent are caused to flow in and out through the through holes 73 and 74 of the cylindrical sealing materials 81 and 82. In step S130 (first sealing step) described above, as shown in FIG. 12, the sealing material 81 is heated together with the low-melting glass 60 at a temperature equal to or higher than the temperature T2 by irradiation with laser light. Thereby, the sealing material 81 is melted together with the low melting point glass 60, and the through hole 73 is sealed. In step S150 (second sealing step) described above, as shown in FIG. 14, the laser beam is irradiated to heat the sealing material 82 together with the low melting point glass 60 at a temperature equal to or higher than the temperature T2. Thereby, the sealing material 82 is melted together with the low melting point glass 60, and the through hole 74 is sealed. The other steps are the same as those in the first embodiment described above, and thus the description thereof is omitted.

  Even in the method according to the second embodiment, the gas cell 11 is easily sealed while facilitating the flow of the cleaning liquid and the coating agent between the inside and the outside of the gas cell 11 as in the first embodiment described above. can do.

3. Modifications The present invention is not limited to the above-described embodiments, and various modifications can be made. Hereinafter, some modifications will be described. Two or more of the following modifications may be used in combination.

(1) Modification 1
When manufacturing the gas cell 11, you may manufacture the several gas cell 11 collectively.
FIG. 16 is a flowchart showing a method for manufacturing the gas cell 11 according to the first modification. 17-20 is a figure explaining the manufacturing method of the gas cell 11 which concerns on the modification 1. As shown in FIG. In FIGS. 17-20, the II cross section of the some gas cell 11 is shown. In the example shown in FIGS. 17 to 20, four gas cells 11A, 11B, 11C, and 11D having the same configuration as the gas cell 11 according to the second embodiment are manufactured together. In the following description, the letter “A” is added to the reference numerals for the configuration related to the gas cell 11A. Similarly, for the configuration relating to the gas cells 11B, 11C, and 11D, the characters “B”, “C”, and “D” are added to the reference numerals.

  The packages 12A to 12D are lined up in the arrow x direction and connected together. Similarly, the lids 13 </ b> A to 13 </ b> D are aligned in the direction of the arrow x and are integrally connected. The groove 18A and the groove 17B are connected between the adjacent gas cell 11A and gas cell 11B. The groove 18B and the groove 17C are connected between the adjacent gas cells 11B and 11C. A groove 18C and a groove 17D are connected between the adjacent gas cell 11C and gas cell 11D.

  In step S210 (joining step), as shown in FIG. 17, a cylindrical sealing material 83A is disposed in the groove 17A. A cylindrical sealing material 83B is disposed in the groove 18A and the groove 17B. A cylindrical sealing material 83C is disposed in the groove 18B and the groove 17C. A cylindrical sealing material 83D is disposed in the groove 18C and the groove 17D. A cylindrical sealing material 83E is disposed in the groove 18D. Similar to the sealing materials 81 and 82 described above, the sealing materials 83A to 83E are formed in a cylindrical shape having through holes 75A to 75E in advance. Therefore, by disposing the sealing material 83B, the adjacent gas cell 11A and the gas cell 11B communicate with each other through the through hole 75B. Similarly, by disposing the sealing materials 83C and 83D, the adjacent gas cells 11B, 11B, and 11C communicate with each other through the through holes 75C and 75D. The through holes 75B, 75C, and 75D are used as third through holes that communicate adjacent gas cells. The through hole 75A of the sealing material 83A is used as a first through hole into which the cleaning liquid and the coating agent are introduced. The through-hole 75E of the sealing material 83E is used as a second through-hole from which the cleaning liquid and the coating agent flow out and plays a role of exhausting vaporized components generated in the destruction of the ampoule 50 to the outside. Other processes are the same as step S110 (joining process) according to the second embodiment.

  In step S220 (coating process), as shown in FIG. 17, the cleaning liquid and the coating agent are flowed in and out through the cylindrical sealing materials 83A to 83E. Other processes are the same as S120 (coating process) according to the first embodiment. In step S230 (ampoule breaking step), as shown in FIG. 18, heating is performed by irradiating laser light in the order of ampoules 50A, 50B, 50C, and 50D. This order is the order far from the sealing material 83E. As a result, the ampoules 50A, 50B, 50C, and 50D are sequentially destroyed. The vaporized component generated in the destruction of the ampoules 50A, 50B, 50C, 50D moves in the direction of the arrow x in the drawing through the through holes 75B, 75C, or 75D, and is exhausted to the outside through the through holes 75E. Other processes are the same as S140 (ampoule destruction process) according to the first embodiment.

  In step S240 (sealing process), as shown in FIG. 19, laser light is irradiated to heat the sealing material 83A at a temperature equal to or higher than the temperature T2. Thereby, the sealing material 83A is melted and the through hole 75A is sealed. Next, laser is irradiated in the order of the sealing materials 83B, 83C, and 83D, and heating is performed at a temperature equal to or higher than the temperature T2. This order is the order far from the encapsulant 83E. At this time, not only one end but each both ends are heated about each sealing material 83B-83D. Thereby, the sealing materials 83B, 83C, and 83D are melted, and the through holes 75B, 75C, and 75D are sequentially sealed. Thus, by sealing the through holes 75B, 75C, and 75D in order, it is possible to exhaust outside without hindering the movement of the vaporized component described above. After all of the through holes 75B, 75C, and 75D are sealed, the encapsulant 83E is irradiated with a laser and heated at a temperature equal to or higher than the temperature T2. Thereby, the encapsulating material 83E is melted and the through hole 75E is sealed. Other processes are the same as step S130 (first sealing step) or step S150 (second sealing step) according to the second embodiment. In FIG. 19, after all the ampoules 50A to 50D were destroyed, the sealing materials 83A to 83E were sequentially melted. In each gas cell, the operation of breaking the ampules and melting the sealing material was performed. You may repeat in order of gas cell 11A, 11B, 11C, 11D.

  Step S250 (filling step) is the same as step S160 (filling step) according to the first embodiment. In step S260 (dicing step), as shown in FIG. 20, the adjacent gas cells are cut and separated into individual gas cells 11A, 11B, 11C, and 11D. Thereby, four gas cells 11A, 11B, 11C, and 11D are manufactured collectively. In the example shown in FIGS. 17 to 20, four gas cells are arranged and manufactured together in the arrow x direction, but more gas cells may be arranged and manufactured together in the arrow x direction. Further, a plurality of gas cells 11 may be manufactured together in a two-dimensional direction. In the examples shown in FIGS. 17 to 20, one ampule is provided in each gas cell. However, the number of ampoules may be reduced if an alkali metal gas can be diffused and filled in each gas cell. .

(2) Modification 2
The gas cell array 10 is not limited to simply arranging a plurality of gas cells 11.
FIG. 21 is a cross-sectional view taken along the line II of the gas cell array E according to the second modification. This gas cell array 10E has the same configuration as that in which a plurality of main chambers 14 are provided in the gas cell 11. The gas cell array 10E includes a package 12E and a lid 13E. The package 12E has four main chambers 14A to 14D. Grooves 91 to 93 are formed on the upper surface of the package 12E in addition to the recesses 15 and 19 and the grooves 16 to 18 described above. The groove 91 connects the main chamber 14A and the main chamber 14B. The groove 92 connects the main chamber 14B and the main chamber 14C. The groove 93 connects the main chamber 14C and the main chamber 14D. The recess 15 is formed next to the main chamber 14D. The groove 17 is formed outward from the main chamber 14A. In the gas cell array 10E, the alkali metal gas released from the ampule 50 moves to the main chamber 14D through the groove 16. Subsequently, the alkali metal gas sequentially moves to the main chambers 14C, 14B, and 14A through the grooves 93, 92, and 91. As a result, the main chambers 14A to 14D are filled with the alkali metal gas.

In the gas cell array 10, cell groups including a plurality of gas cells and dummy cells may be two-dimensionally arranged (arranged in a matrix) on the xy plane.
FIG. 22 is a cross-sectional view of a gas cell array 10F according to the second modification. This cross section is parallel to the xy plane shown in the figure. The gas cell array 10F includes a gas cell 110, a gas cell 120, a gas cell 140, a gas cell 150, and a dummy cell 130. A through hole 111 is provided between the gas cell 110 and the dummy cell 130. A through hole 121 is provided between the gas cell 120 and the dummy cell 130. A through hole 141 is provided between the gas cell 140 and the dummy cell 130. A through hole 151 is provided between the gas cell 150 and the dummy cell 130. The ampule 50 is stored in the dummy cell 130. The alkali metal gas released from the ampoule 50 is diffused from the dummy cell 130 to the gas cell 110, the gas cell 120, the gas cell 140, and the gas cell 150 through the through hole 111, the through hole 121, the through hole 141, and the through hole 151. The

  Although not shown in FIG. 22 because it is a cross-sectional view, grooves 17 and 18 are formed on the upper surface of the dummy cell 130 from the dummy cell 130 to the outside in the same manner as the gas cell 11 shown in FIG. . The groove 17 and the groove 18 are provided, for example, at positions facing each other. In the gas cell array 10F, since the ampule 50 is disposed in the dummy cell 130, it is not necessary to provide the recess 15. The method for sealing the gas cell array 10F is the same as the method for sealing the gas cell 11 described above.

(3) Modification 3
The positions of the grooves 17 and 18 are not limited to the positions shown in FIG.
FIG. 23 is a plan view of a package 12F according to the third modification. The shape of the main chamber 14 shown in FIG. 23 is a rectangular parallelepiped. In this case, the spin polarization of alkali metal atoms tends to be relaxed at the corners of the main chamber 14. Therefore, the groove 17 and the groove 18 may be provided diagonally to the main chamber 14 on the upper surface of the package 12F. The grooves 17 and 18 shown in FIG. 23 are formed so as to extend in parallel with the side surface of the gas cell 11, but may be formed so as to extend from the corner of the main chamber 14 toward the corner of the gas cell 11. .

  FIG. 24 is a cross-sectional view taken along line II showing a gas cell 11G according to Modification 3. The gas cell 11G has a package 12G. The package 12G is provided with a through hole 76 that communicates the lower portion of the main chamber 14 with the outside instead of the groove 18. In this case, the through hole 76 is used as a second through hole through which the cleaning liquid or the coating agent flows out. 24 is formed so as to extend in parallel with the bottom surface of the main chamber 14, but extends downward from the bottom surface of the main chamber 14 so that the cleaning liquid and the coating agent can easily flow out. It may be formed. In the gas cell 11G shown in FIG. 24, the through hole 76 is provided in place of the groove 18, but both the groove 18 and the through hole 76 are used to exhaust the vaporized component discharged from the ampoule 50 to the outside. Both may be provided.

(4) Modification 4
The gas cell 11 is not necessarily provided with two through holes. For example, when inflow and outflow of the cleaning liquid or the coating agent are performed using one through hole, only one through hole may be provided in the gas cell 11. However, considering that the vaporized component discharged from the ampule 50 is exhausted to the outside, it is preferable to provide a through-hole on the ampule 50 side. In addition, when the film 70 is formed on the inner surface of the main chamber 14 with a coating agent in advance before the package 12 and the lid 13 are bonded, the cleaning liquid or coating is applied from the opening of the package 12 without using the through hole. The agent can flow in and out. However, after the package 12 and the lid 13 are joined, it is necessary to exhaust the vaporized component released from the ampoule 50 to the outside. Therefore, in this case, only the through hole on the ampoule 50 side may be provided. When only one through hole is provided in the gas cell 11, the entire gas cell 11 may be heated using an annealing furnace when the through hole is sealed.

(5) Modification 5
The shape of the gas cell 11 is not limited to the shape shown in FIG. The gas cell 11 shown in FIG. 2 has a rectangular parallelepiped shape. However, the gas cell 11 may have a curved surface in part, such as a polyhedron other than a rectangular parallelepiped, a sphere, or a cylinder.

(6) Modification 6
The bonding material for bonding the package 12 and the lid 13 is not limited to low-melting glass. For example, solder may be used. Further, the package 12 and the lid 13 may be joined by optical contact. In this case, the bonding material is applied only to the grooves 17 and 18. Further, the bonding material may be applied to both the package 12 and the lid 13, or may be applied only to the upper surface of the package 12.

(7) Modification 7
The shape of the sealing material is not limited to a cylindrical shape having a through hole. For example, the shape of the sealing material may be a three-dimensional shape other than a cylindrical shape having a through hole, such as a polyhedron such as a cube or a rectangular parallelepiped, a sphere, or a cylinder. In this case, in the first embodiment, grooves 17 and 18 that match the shape of the sealing material are formed. In the second embodiment, the sealing materials 81 and 82 having such a shape are used. Further, the material of the sealing material is not limited to low melting point glass or solder. For example, a resin may be used.

(8) Modification 8
The rod-shaped member disposed between the package 12 and the lid 13 is not limited to the metal wires 61 and 62 formed using nickel. This rod-shaped member may be obtained by applying nickel plating to a rod-shaped member formed using a material other than nickel. The rod-shaped member is preferably formed using a material that is difficult to be joined to a joining material used for joining the package 12 and the lid 13. When it is difficult to pull out the rod-shaped member, ultrasonic vibration may be applied to peel off the bonding interface between the rod-shaped member and the bonding material.

(9) Modification 9
The alkali metal atom may be introduced into the gas cell 11 in any state of solid, liquid, or gas. The alkali metal only needs to be gasified at least during the measurement, and does not always need to be in a gas state.

(10) Modification 10
The application of the gas cell 11 is not limited to a magnetic sensor. For example, the gas cell 11 may be used for an atomic oscillator.

(11) Modification 11
The package sealed using the package sealing method according to the present invention is not limited to the gas cell 11. For example, a hermetically sealed package is used for a housing of an electronic device such as a gyro sensor using quartz or MEMS (Micro Electro Mechanical Systems), an acceleration sensor, a pressure sensor, a tilt sensor, or a crystal oscillator. The package sealing method according to the present invention may be used to seal this hermetic package. Specifically, a sealing material having a through hole is provided between the hermetic sealing package and the lid in the same manner as in the first embodiment, the second embodiment, or the modification described above, and the hermetic sealing package and the lid are provided. And the fluid is circulated through the through hole between the inside and the outside of the hermetic sealing package, the sealing material is melted, and the through hole is sealed. Thus, a package having an opening, a lid covering the opening, a through-hole, provided between the package and the lid, and melted when heated to seal the through-hole. An electronic device housing comprising a stop is provided.

  DESCRIPTION OF SYMBOLS 1 ... Magnetic measuring apparatus, 10 ... Gas cell array, 11 ... Gas cell, 12 ... Package, 13 ... Lid, 50 ... Ampoule, 61, 62 ... Metal wire, 71, 72 ... Through-hole.

Claims (6)

A first chamber and a second chamber connected to the first chamber via a connection hole and having a longitudinal direction;
The second chamber has a V-shaped cross section when viewed in the longitudinal direction,
Alkaline metal gas is sealed in the first chamber and the second chamber,
Alkali metal atoms are disposed in the second chamber,
The alkali metal atom is disposed in an ampoule cleaved in the second chamber,
The ampule has a longitudinal direction arranged along the longitudinal direction of the second chamber.   The gas cell according to claim 1, wherein a direction in which the connection hole extends intersects with the longitudinal direction. The first chamber, the second chamber and the connection hole are a package having a main chamber, a recess and a groove,
The said main chamber is formed with the cover which covers the opening part, the said recessed part, and the said groove | channel, and the sealing material which joins the said package and the said cover, The Claim 1 or 2 characterized by the above-mentioned. Gas cell.   The gas cell according to claim 3, wherein a first hole extends outward from the first chamber, and an end of the first hole is sealed with the sealing material.   The gas cell according to claim 3 or 4, wherein a second hole extends outward from the second chamber, and a terminal of the second hole is sealed with the sealing material. .   A magnetometer comprising the gas cell according to claim 1.

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