JP2016189428A - Electrostatic chuck device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrostatic chuck device capable of inhibiting temperature unevenness from occurring on the placement surface of an electrostatic chuck part in the horizontal direction in which the placement surface is spread.SOLUTION: An electrostatic chuck device 10 includes a chuck push-up mechanism 70 which pushes up a predetermined chuck push-up place P on a cooling base part 60 side of an electrostatic chuck part 20 so that the electrostatic chuck part 20 is separated from the cooling base part 60.Thickness of an adhesion layer 50 of a desired portion out of the adhesion layer 50 is changed by pushing up the chuck push-up place P of the electrostatic chuck part 20 with the chuck push-up mechanism 70.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electrostatic chuck device that adsorbs a plate-like sample with electrostatic force.

A semiconductor manufacturing apparatus using plasma, such as a plasma etching apparatus or a plasma CVD apparatus, includes an electrostatic chuck device that fixes a plate-like sample, and a plasma irradiation mechanism that irradiates the fixed plate-like sample with plasma. The plate sample is, for example, a disk-shaped wafer.
The electrostatic chuck device has an electrostatic chuck portion having a placement surface on which a plate-like sample is placed, a cooling base portion for cooling the electrostatic chuck portion, and the electrostatic chuck portion and the cooling base portion are bonded together. And an adhesive layer formed between the electrostatic chuck portion and the cooling base portion.

  When the plasma irradiation mechanism is activated, the surface temperature of the plate-like sample fixed to the mounting surface of the electrostatic chuck portion increases. Therefore, the electrostatic chuck device is an internal electrode for electrostatic adsorption that electrostatically attracts the plate-like sample to the mounting surface so as to suppress an increase in the surface temperature of the plate-like sample and to obtain a desired temperature distribution of the plate-like sample. An electrostatic chuck portion having a temperature adjusting base portion through which a cooling medium such as water or a fluorine-based refrigerant circulates, and an electric heater formed on the inside of the electrostatic chuck portion or the surface opposite to the mounting surface. Such a heating member is provided (patent document 1).

  And the whole lower side of a plate-shaped sample is cooled with the base part for temperature control, and the whole range of a plate-shaped sample is uniformly made into desired temperature by heating the predetermined range of a plate-shaped sample with a heating member.

JP 2008-300491 A

  The plasma etching apparatus includes a heater unit for the purpose of adjusting the processing temperature of the plate-like sample and equalizing the etching rate of the plate-like sample. For example, thinning is required for a semiconductor formed by wear, and for thinning, it is required to make the temperature in the wafer surface uniform during processing of a plasma etching apparatus.

  The temperature of the plate sample is affected by the shape of the cooling base, the pattern of the heater, the heat transfer coefficient between the heater and the cooling base, and the plasma state. It is necessary to design the chuck device, particularly the heater unit. In particular, in order to cope with various plasma irradiation conditions, a heater unit capable of adjusting the temperature according to the plasma irradiation conditions is required.

When the plate-like sample has a disk shape, first, an electrostatic chuck device is used in which the heater portion is composed of a plurality of heater patterns, and then the plurality of heater patterns are arranged concentrically on the electrostatic chuck portion. In this case, the temperature of the plate-shaped sample can be adjusted in the radial direction by individually controlling the amount of power supplied to the plurality of heater patterns, but the temperature distribution on the concentric circumference cannot be adjusted. Therefore, a method of increasing the number of divisions of the heater pattern has been proposed so that the temperature of both the radial direction and the circumferential direction of the plate-like sample can be adjusted.
However, increasing the number of heater pattern divisions increases the number of power supply sources, and also increases the number of high-frequency cut filters that protect the power supply source so that the high frequency does not affect the power supply source. There is a problem that the temperature control between the plurality of divided heater patterns is complicated.

In addition, by designing the heater unit in consideration of changes in the plasma state and temperature changes in the cooling channel of the cooling base unit accompanying changes in the amount of power supplied to the heater unit, the temperature on the same circumference The distribution can be a predetermined temperature distribution.
However, in this case, it can be applied only under limited conditions, and there is a problem that a heater unit needs to be designed for each process condition.
In addition, the allowable control values of the thickness, width, and adhesive layer thickness of the heater section that satisfy the limited conditions are narrow, and there is a problem that causes an increase in manufacturing cost and a decrease in yield.

  The subject of this invention is providing the electrostatic chuck apparatus which can suppress generation | occurrence | production of the nonuniformity of the temperature of the mounting surface of an electrostatic chuck part in the horizontal direction where a mounting surface spreads.

  The inventor adjusts the heat transfer between the heater and the cooling base by changing the thickness of the adhesive layer between the heater and the cooling base after manufacturing the electrostatic chuck device having the heater. It is found that the temperature of the mounting surface of the electrostatic chuck portion can be adjusted, and further, the adjustment is performed by measuring the temperature of the mounting surface with a thermograph or the like. The inventors have found that the in-plane temperature can be made uniform by pushing up the electrostatic chuck portion of the surface, and the following invention has been completed.

An electrostatic chuck device according to the present invention includes an electrostatic chuck portion including an electrostatic chuck main body portion having a placement surface on which a plate-like sample is placed, and a push-up through hole. A cooling base portion to be cooled; an adhesive layer formed between the electrostatic chuck portion and the cooling base portion so that the electrostatic chuck portion and the cooling base portion are bonded; and the push-up through hole A chuck push-up mechanism provided therein.
The chuck push-up mechanism pushes up a predetermined chuck push-up portion on the cooling base portion side of the electrostatic chuck portion so that the electrostatic chuck portion is separated from the cooling base portion.

  In the electrostatic chuck device according to the present invention, the cooling base portion may further include an opening on the electrostatic chuck portion side of the push-up through hole between the adhesive layer and the cooling base portion. It is preferable that an insulating sheet adhered to the surface is provided, and the chuck push-up mechanism pushes up the chuck push-up portion.

  The chuck push-up mechanism preferably includes a chuck push-up member that pushes up the chuck push-up position while sliding through the push-up through hole, and a chuck push-up force applying mechanism that applies a chuck push-up force to the chuck push-up member.

  The chuck push-up mechanism preferably further includes a chuck push-up elastic member arranged between the chuck push-up member and the chuck push-up force applying mechanism.

  Another electrostatic chuck device according to the present invention includes an electrostatic chuck portion including an electrostatic chuck main body portion having a placement surface on which a plate-like sample is placed, and a push-up through hole, and the electrostatic chuck A cooling base part for cooling the part, an adhesive layer formed between the electrostatic chuck part and the cooling base part so that the electrostatic chuck part and the cooling base part adhere to each other, and the adhesive layer Between the cooling base portion and the cooling base portion so as to cover the push-up through hole, and an insulating sheet adhered to the electrostatic chuck portion side of the cooling base portion, and an insulating sheet provided in the push-up through hole A push-up mechanism. The insulating sheet push-up mechanism has a thickness of an adhesive layer between a predetermined chuck push-up location on the cooling base portion side of the electrostatic chuck portion and a sheet push-up location covering the push-through hole in the insulating sheet. The sheet push-up part is pushed up toward the chuck push-up part so that the thickness becomes thin.

The insulating sheet push-up mechanism includes an insulating sheet push-up member that pushes up the sheet push-up location while sliding through the push-up through hole, an insulating sheet push-up force applying mechanism that applies an insulating sheet push-up force to the insulating sheet push-up member, It is preferable to have an insulating sheet push-up elastic member disposed between the sheet push-up location and the insulating sheet push-up member.
It is preferable that the insulating sheet push-up mechanism further has an insulating sheet protective layer disposed between the sheet push-up location and the insulating sheet push-up elastic member.

  The insulating sheet push-up mechanism is preferably a fluid push-up mechanism that supplies a fluid such as gas or liquid from an opening opposite to the sheet push-up location of the push-up through hole.

  The electrostatic chuck portion further includes a heater portion attached to a back surface opposite to the mounting surface of the electrostatic chuck main body portion, and the chuck push-up position is a predetermined position of the heater portion. It is preferable that

  The adhesive layer preferably includes one or more selected from the group of silicon resins, acrylic resins, and polyimide resins, and in particular, heat resistance, plasma resistance, and heat with the cooling base portion. From the viewpoint of transmissibility, an adhesive obtained by adding an insulating heat conductive material such as an aluminum nitride (AlN) filler to a silicon-based adhesive is preferable.

  According to the present invention, the electrostatic chuck device includes a chuck push-up mechanism that pushes up a predetermined chuck push-up location on the cooling base portion side of the electrostatic chuck portion so that the electrostatic chuck portion is separated from the cooling base portion. For this reason, the chuck push-up mechanism can change the thickness of the adhesive layer at a desired portion of the adhesive layer by pushing up the chuck push-up portion of the electrostatic chuck portion. It is possible to provide an electrostatic chuck device that can suppress the occurrence of uneven temperature on the mounting surface of the electrostatic chuck portion.

Further, according to the present invention, the electrostatic chuck device adheres between a predetermined chuck push-up location on the cooling base portion side of the electrostatic chuck portion and a sheet push-up location covering the push-up through hole in the insulating sheet. An insulating sheet push-up mechanism is provided that pushes the sheet push-up location toward the chuck push-up location so that the thickness of the layer is reduced.
For this reason, when the insulating sheet push-up mechanism pushes the sheet push-up location toward the chuck push-up location, the adhesive layer between the pushed-up chuck push-up location and the sheet push-up location is elastically deformed, and the thickness of the adhesive layer is reduced. Since the thickness can be reduced, it is possible to provide an electrostatic chuck device capable of suppressing the occurrence of uneven temperature on the mounting surface of the electrostatic chuck portion in the horizontal direction in which the mounting surface spreads.

It is the fragmentary sectional view which abbreviate | omitted a part of 1st Embodiment of the electrostatic chuck apparatus which concerns on this invention. It is the fragmentary sectional view which abbreviate | omitted a part of 2nd Embodiment of the electrostatic chuck apparatus which concerns on this invention. FIG. 3 is a partial cross-sectional view in which a part of the operation of the electrostatic chuck device shown in FIG. 2 is omitted. It is the fragmentary sectional view which abbreviate | omitted a part of 3rd Embodiment of the electrostatic chuck apparatus which concerns on this invention. It is the fragmentary sectional view which abbreviate | omitted a part of 4th Embodiment of the electrostatic chuck apparatus which concerns on this invention.

  The electrostatic chuck devices 10, 10a, 10b, and 10c according to the present invention will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the same member and description is abbreviate | omitted.

The electrostatic chuck device 10 will be described with reference to FIG.
As shown in FIG. 1, the electrostatic chuck device 10 includes an electrostatic chuck unit 20, a cooling base unit 60, an adhesive layer 50, and a chuck push-up mechanism 70. The electrostatic chuck device 10 further includes an insulating sheet 40.

  The electrostatic chuck portion 20 includes an electrostatic chuck main body portion 21 and a heater portion 30. The electrostatic chuck main body 21 has a mounting surface on which a plate-like sample is mounted. The mounting surface side is defined as one main surface 22, and the back surface opposite to the one main surface 22 is defined as another main surface 24. It is a plate-shaped member. The electrostatic chuck main body 21 is made of ceramics and has a mounting plate, a support plate, and an insulating material layer (not shown).

The heater unit 30 is a thin heater element having one main surface 32 and another main surface 34. The heater unit 30 is bonded to the other main surface 24 of the electrostatic chuck unit 20 so that the heater unit 30 can heat the electrostatic chuck unit 20 and thus the plate-like sample placed on the electrostatic chuck unit 20. It is bonded via (not shown). That is, the heater unit 30 is attached to the other main surface 24 (back surface) opposite to the one main surface 22 (mounting surface) of the electrostatic chuck unit 20.
Further, one main surface 32 of the heater unit 30 faces the other main surface 24 opposite to the one main surface 22 (mounting surface) of the electrostatic chuck unit 20, and the other main surface 34 is a chuck push-up described later. The end of the chuck push-up member 78 of the mechanism 70 is directed toward the cooling base portion 60 so that it abuts. That is, the other principal surface 34 constitutes a part of the electrostatic chuck portion 20 on the cooling base portion 60 side.
Further, as will be described later, a part of the predetermined other main surface 34 becomes a predetermined chuck push-up location P on the cooling base portion 60 side of the electrostatic chuck portion 20.

The cooling base portion 60 is a member that cools the electrostatic chuck portion 20, and has a disk shape with a thickness having an upper surface 62 that faces the electrostatic chuck portion 20 and a lower surface 64 opposite to the upper surface 62. It is a member. The cooling base 60 has a push-up through hole 65 and a cooling flow path 68 through which a cooling medium such as water or a fluorine-based refrigerant circulates.
The temperature of the cooling base 60 is adjusted by flowing a cooling medium having a predetermined temperature through the cooling flow path 68 at a predetermined flow rate. Then, in combination with the heating of the heater unit 30, the electrostatic chuck unit 20, and by extension, the plate sample loaded on the loading surface of the electrostatic chuck unit 20 is adjusted to a desired temperature.
The material constituting the cooling base portion 60 is preferably a metal excellent in thermal conductivity, conductivity, and workability, or a composite material containing these metals, and more preferably formed of aluminum or titanium. .

The push-up through hole 65 is a through hole that opens to the upper surface 62 and the lower surface 64. The opening on the upper surface 62 side of the push-up through hole 65 faces the chuck push-up location P. The push-up through hole 65 includes a sliding hole 67 and a screwing hole 66 communicating with the sliding hole 67.
The sliding hole portion 67 is a sliding hole that is formed on the electrostatic chuck portion 20 side in the push-up through-hole 65 and that a part of a chuck lifting mechanism 70 described later slides.
The screwing hole 66 is formed on the opposite side to the electrostatic chuck part 20 in the push-up through hole 65, and is a female screwed into a push-up force applying mechanism 71 such as a male screw of a chuck push-up mechanism 70 described later. Screws are formed.

  A recess 69 is formed in the cooling base 60 at the opening of the sliding hole 67 on the upper surface 62. A ring-shaped ceramic ring 110 on which a pin 78a (to be described later) can slide is disposed in the recess 69.

  The adhesive layer 50 is formed between the electrostatic chuck part 20 and the cooling base part 60 so that the electrostatic chuck part 20 and the cooling base part 60 adhere to each other. Since the adhesive layer 50 is made of an elastic material, it has an action of relieving thermal stress due to the difference between the temperature displacement of the electrostatic chuck portion 20 and the temperature displacement of the cooling base portion 60 due to temperature change. Further, the adhesive layer 50 is elastically deformed in accordance with a change in the gap between the electrostatic chuck portion 20 and the cooling base portion 60.

The adhesive layer 50 is made of a rubber elastic material such as silicon rubber or a highly viscous viscoelastic body. Specifically, the material having rubber elasticity such as silicon rubber preferably contains one or more selected from the group of silicon-based resins, acrylic resins, and polyimide-based resins. From the viewpoint of plasma resistance and heat transfer coefficient with the cooling base, an adhesive obtained by adding an insulating heat conductive material such as an aluminum nitride (AlN) filler to a silicon-based adhesive is preferable.
Examples of the highly viscous viscoelastic body include materials such as clay and straw. By configuring the adhesive layer 50 with a highly viscous viscoelastic body, an external force matching the temperature distribution can be applied from the back surface.
When the adhesive layer 50 is an elastic body, a force constantly acts on the elastic body, so that the pressure distribution applied to the adhesive may affect the characteristics (shape, fracture, etc.). Therefore, a structure like clay having a certain degree of fluidity is interposed between the electrostatic chuck part 20 and the cooling base part 60, thereby maintaining a balance in the adhesive layer against an external force. Thus, the load acting on the adhesive itself can be reduced.

As will be described later, the chuck push-up mechanism 70 pushes up the chuck push-up portion P of the electrostatic chuck portion 20 so that the electrostatic chuck portion 20 is separated from the cooling base portion 60, and thus the electrostatic chuck portion 20 and the cooling base portion 60. A tensile force that increases the thickness of the adhesive layer 50 acts on the adhesive layer 50 therebetween. Therefore, the adhesive layer 50 preferably has a Young's modulus, strength, and thickness that can be elastically deformed by a tensile force that increases the thickness of the adhesive layer 50. Specifically, the adhesive layer 50 preferably has a Young's modulus, strength, and thickness that can be increased to 5 μm or more, preferably 10 to 30 μm.
The adhesive layer 50 may be formed of a cured product obtained by heat-curing a silicon-based resin composition or an acrylic resin, and may be added with a filler such as ceramics in order to improve characteristics such as thermal conductivity. Note that the heat transfer coefficient of the adhesive layer 50 changes when a filler is added.

The chuck push-up mechanism 70 includes a chuck push-up member 78, a push-up force applying mechanism 71, and a chuck push-up elastic member 77, and is provided in the push-up through hole 65.
The chuck push-up member 78 has a pin 78a and a pin 78b.
The pin 78a is slidably disposed in the sliding hole 67 and the ceramic ring 110 so that the chuck push-up point P can be pushed up. The end portion of the pin 78a on the electrostatic chuck portion 20 side contacts the other main surface 34 of the heater portion 30, that is, the chuck push-up position P. The pin 78a is coated with Teflon (registered trademark) as an insulating treatment.
The pin 78 b is disposed in the sliding hole portion 67 on the opposite side of the pin 78 a from the electrostatic chuck portion 20. One end of the pin 78b faces the pin 78a through the chuck push-up elastic member 77, and the other end is in contact with a recess 76 of a push-up force applying mechanism 71, which will be described later, so as to be able to rotate and slide. The pin 78b is formed of a general material such as aluminum or stainless steel.

  The chuck push-up elastic member 77 is an elastic member such as an O-ring disposed between the pin 78 a and the pin 78 b in the sliding hole 67. The chuck push-up elastic member 77 has an action of absorbing excessive displacement of the pins 78a and 78b, for example.

  The push-up force applying mechanism 71 is a male screw that is screwed into the screw hole 66 and applies a chuck push-up force to the chuck push-up member 78. The male screw has a side surface having a male screw to be screwed into the screw hole 66, one end portion 72 having a concave portion 76, and a concave groove 75 processed by a milling cutter so that the tip of a minus driver is inserted. And the other end 73. The male screw is preferably, for example, a slotted set screw.

  The insulating sheet 40 is bonded to the upper surface 62 (surface) of the cooling base 60 so as not to cover the opening on the electrostatic chuck 20 side of the push-up through hole 65 between the adhesive layer 50 and the cooling base 60. doing. For this reason, since the insulating sheet 40 has a hole in which the pin 78a of the chuck push-up mechanism 70 can slide, the pin 78a is in contact with the hole in the state where the side surface of the pin 78a is in close contact with the hole. 34, that is, it can be in a state of being in direct contact with the chuck push-up point P.

  The electrostatic chuck device 10 described above suppresses the occurrence of uneven temperature on the mounting surface in the horizontal direction in which the mounting surface spreads as follows.

  First, the temperature of the mounting surface of the electrostatic chuck unit 20 is measured by a thermograph or the like, for example, the position of the mounting surface having a low temperature is specified. And in order to make the temperature of a mounting surface uniform, the chuck | zipper push-up mechanism 70 close | similar to the part which wants to change the thickness of the contact bonding layer 50 is specified.

Next, the tip of a minus driver is inserted into the groove 75 of the specified chuck push-up mechanism 70, and the minus driver is rotated. Thereby, the male screw which is the push-up force applying mechanism 71 rotates, and the push-up force applying mechanism 71 moves to the electrostatic chuck portion 20 side according to the screwing of the screwing hole portion 66.
At this time, as the push-up force applying mechanism 71 moves, the push-up force applying mechanism 71 pushes up the pin 78b that is in contact with the recess 76 so as to be able to rotate and slide, and applies a push-up force to the pin 78b. The push-up force acting on the pin 78b acts on the other main surface 34 of the heater section 30 and the electrostatic chuck section 20 via the chuck push-up elastic member 77 and the pin 78a, and pushes up the electrostatic chuck section 20. That is, the chuck push-up mechanism 70 pushes up the chuck push-up point P and applies a chuck push-up force to the chuck push-up member 78.
Thus, the chuck push-up mechanism 70 acts as a push-up mechanism that pushes up the chuck push-up location P on the cooling base portion 60 side of the electrostatic chuck portion 20 so that the electrostatic chuck portion 20 is separated from the cooling base portion 60.

  Thus, since the electrostatic chuck device 10 can change the thickness of the adhesive layer 50 at a desired portion of the adhesive layer 50, the mounting surface of the electrostatic chuck unit 20 in the horizontal direction in which the mounting surface spreads. The occurrence of uneven temperature can be suppressed.

The electrostatic chuck apparatus 10a according to the present invention will be described with reference to FIG.
As shown in FIG. 2, the electrostatic chuck device 10 a includes an electrostatic chuck unit 20, a cooling base unit 60, an adhesive layer 50, an insulating sheet 41, and an insulating sheet push-up mechanism 80.

  The electrostatic chuck device 10a uses an insulating sheet 41 instead of the insulating sheet 40, uses an insulating sheet push-up mechanism 80 instead of the chuck push-up mechanism 70, and has no recess 69 and ceramic ring 110. 10 is the same.

  The insulating sheet 41 is an insulating sheet that covers the opening of the push-up through hole 65 on the electrostatic chuck portion 20 side, and is different from the insulating sheet 40 that does not cover the opening of the push-up through hole 65 on the electrostatic chuck portion 20 side. . A portion of the insulating sheet 41 that covers the opening on the electrostatic chuck portion 20 side of the push-up through hole 65 is a sheet push-up location Q.

The insulating sheet push-up mechanism 80 includes an insulating sheet push-up member 84 that pushes up the sheet push-up location Q while sliding the sliding hole portion 67 of the push-up through hole 65, and a push-up that applies an insulation sheet push-up force to the insulating sheet push-up member 84. A force applying mechanism 71 and an insulating sheet push-up elastic member 86 disposed between the sheet push-up location Q and the insulating sheet push-up member 84 are provided. The insulating sheet push-up mechanism 80 further includes an insulating sheet protective layer 89 disposed between the sheet push-up location Q and the insulating sheet push-up elastic member 86.
It is preferable that the insulating sheet push-up member 84 and the insulating sheet push-up elastic member 86 have the same configuration as the pin 78a and the chuck push-up elastic member 77, respectively.
The insulating sheet protective layer 89 is used for preventing scratches on the insulating sheet 41 and is preferably formed of a material having insulating properties and elasticity, for example, disc-shaped rubber.

The insulating sheet push-up mechanism 80 directs the sheet push-up location Q toward the chuck push-up location P so that the thickness of the adhesive layer 50a between the chuck push-up location P and the sheet push-up location Q in the adhesive layer 50 is reduced. Since it is pushed up, the adhesive layer 50a between the electrostatic chuck part 20 and the cooling base part 60 is subjected to a compressive force that reduces the thickness of the adhesive layer 50a.
The compressive force for reducing the thickness of the adhesive layer 50 a acts on the chuck push-up location P of the electrostatic chuck portion 20, and the electrostatic chuck portion 20 tends to move away from the cooling base portion 60.
When the electrostatic chuck portion 20 is pushed up away from the cooling base portion 60, the adhesive layer 50b in the peripheral portion between the chuck push-up location P and the sheet push-up location Q in the adhesive layer 50 is expanded, and the adhesive layer 50b. The tensile stress that increases the thickness of the film acts.
Therefore, the adhesive layer 50 has a Young's modulus, strength, and thickness that can be elastically deformed against a compressive force that reduces the thickness of the adhesive layer 50 and a tensile stress that increases the thickness of the adhesive layer 50. preferable.
Specifically, the adhesive layer 50b in the peripheral portion between the chuck push-up point P and the sheet push-up point Q, that is, the adhesive layer 50 is 5 μm or more, preferably 10 to 30 μm, and the thickness can be increased. It is preferable to have a rate, strength, and thickness.
Since the cooling capacity of the adhesive layer 50 at the chuck push-up location P is low, even when the adhesive layer 50a between the chuck push-up location P and the sheet push-up location Q is compressed, the electrostatic chuck 20 is hardly cooled. It does not affect. However, when the chuck push-up point P is pushed up and the peripheral portion between the chuck push-up point P and the sheet push-up point Q becomes thicker in the peripheral adhesive layer 50b bonded to the cooling base 60, the pushed-up portion The temperature of the electrostatic chuck portion 20 rises.

  The electrostatic chuck device 10a described above suppresses the occurrence of uneven temperature on the mounting surface in the horizontal direction in which the mounting surface spreads as follows.

As shown in FIG. 3, the tip of a minus driver is inserted into the groove 75 of the insulating sheet push-up mechanism 80 near the portion where the thickness of the adhesive layer 50 is to be changed, and the minus driver is rotated. As a result, the male screw which is the push-up force applying mechanism 71 rotates, and the male screw which is the push-up force applying mechanism 71 moves to the electrostatic chuck portion 20 side according to the screwing of the screwing hole 66, and the insulating sheet push-up member 84 also moves to the electrostatic chuck 20 side. Further, since the insulating sheet push-up member 84 moves to the electrostatic chuck portion 20 side, the insulating sheet push-up elastic member 86 and the insulating sheet protective layer 89 also move to the electrostatic chuck portion 20 side, and the sheet push-up location Q of the insulating sheet 41 Is pushed up toward the chuck push-up point P by a distance β.
Thus, the insulating sheet push-up mechanism 80 acts as a push-up mechanism that pushes the sheet push-up location Q toward the chuck push-up location P.

Since the adhesive layer 50 having the sheet push-up location Q is sandwiched between the sheet push-up location Q and the chuck push-up location P, the adhesive layer 50 is elastically deformed and elastic force, that is, the chuck push-up force is applied to the chuck push-up location. Demonstrate toward P.
The chuck push-up force received at the chuck push-up point P acts on the electrostatic chuck unit 20 through the heater unit 30, and the electrostatic chuck unit 20 at the chuck push-up point P is separated from the cooling base unit 60 by a distance α, and The entire electric chuck part 20 or the vicinity where the chuck push-up point P of the electrostatic chuck part 20 is present (in FIG. 3, the left side from the center of the electrostatic chuck part 20) is inclined.

  Thus, when the insulating sheet push-up mechanism 80 pushes the sheet push-up location Q toward the chuck push-up location P, the adhesive layer 50a between the pushed-up chuck push-up location P and the sheet push-up location Q is elastically deformed, Since the thickness of the adhesive layer 50 can be reduced, the occurrence of uneven temperature on the mounting surface of the electrostatic chuck portion 20 can be suppressed in the horizontal direction in which the mounting surface spreads.

  Further, the electrostatic chuck device 10a is provided between a predetermined chuck push-up location P on the cooling base portion 60 side of the electrostatic chuck portion 20 and a sheet push-up location Q covering the push-up through hole 65 in the insulating sheet 41. An insulating sheet push-up mechanism 80 is provided to push up the sheet push-up location Q toward the chuck push-up location P so that the thickness of the adhesive layer 50b in the peripheral portion is increased. For this reason, when the insulating sheet push-up mechanism 80 pushes the sheet push-up location Q toward the chuck push-up location P, the adhesive layer 50b in the peripheral portion between the chuck push-up location P and the sheet push-up location Q is elastically deformed. Since the thickness of the adhesive layer 50b can be increased, it is possible to suppress the occurrence of uneven temperature on the mounting surface 22 of the electrostatic chuck portion 20 in the horizontal direction in which the mounting surface 22 spreads.

The electrostatic chuck device 10b according to the present invention will be described with reference to FIG.
As shown in FIG. 4, the electrostatic chuck device 10 b is the same as the electrostatic chuck device 10 a except that an electrostatic chuck electrode 90 is provided inside the electrostatic chuck portion 20.

  The electrostatic chucking electrode 90 includes a chucking electrode 91 that is formed inside the electrostatic chuck main body 21, an exposed electrode 95 that is formed on the other main surface 24 of the electrostatic chuck main body 21, and a chucking electrode. A connection electrode portion 92 that electrically connects the electrode portion 91 and the exposed electrode portion 95 is provided. The exposed electrode portion 95 is, for example, an electrode having a disk shape having one main surface 96 and another main surface 97.

The exposed electrode portion 95 is affixed to the other main surface 24 (back surface) opposite to the one main surface 22 (mounting surface) of the electrostatic chuck portion 20.
Further, the one main surface 96 of the exposed electrode portion 95 faces the other main surface 24 opposite to the one main surface 22 (mounting surface) of the electrostatic chuck portion 20, and the other main surface 97 is a sheet push-up location. It faces the cooling base 60 side so as to face Q. That is, the other main surface 97 constitutes a part of the electrostatic chuck portion 20 on the cooling base portion 60 side.
That is, the chuck push-up location P is a predetermined position of the exposed electrode portion 95 exposed from the other main surface 24 (back surface) of the electrostatic chuck main body portion 21 in the electrostatic chucking electrode 90.

  Since the electrostatic chuck device 10b described above operates in the same manner as the electrostatic chuck device 10a, it is possible to suppress the occurrence of uneven temperature on the mounting surface in the horizontal direction where the mounting surface spreads.

The electrostatic chuck device 10c according to the present invention will be described with reference to FIG.
As shown in FIG. 5, the electrostatic chuck device 10 c is static except that the push-up through hole 65 is used as the push-up through hole 100 and the fluid supply means C is used instead of the insulating sheet push-up mechanism 80. It is the same as the electric chuck device 10a.

The fluid supply means C is a compressor that supplies a fluid such as gas or liquid to the push-up through hole 100.
The fluid supply means C is detachably and hermetically connected to the push-up through hole 100, and fluid such as gas or liquid from the opening on the opposite side (lower surface 64) to the sheet push-up point Q that covers the push-up through hole 100. Supply.

The push-up through hole 100 opens on the upper surface 62 and the lower surface 64 of the cooling base portion 60. The push-up through-hole 100 includes a fluid pressing hole portion 102 having an opening on the upper surface 62 and a fluid supply hole portion 104 communicating with the fluid pressing hole portion 102 and having an opening on the lower surface 64. The fluid pressing hole portion 102 has a larger diameter than the fluid supply hole portion 104 so that an opening having the same size as the sheet pressing portion Q is formed in the upper surface 62.
The opening on the upper surface 62 side of the fluid pressing hole portion 102 of the lifting through hole 100 is covered with a sheet lifting position Q.

  The electrostatic chuck device 10c described above suppresses the occurrence of uneven temperature on the mounting surface in the horizontal direction in which the mounting surface spreads as follows.

When the fluid is supplied from the fluid supply means C to the push-up through hole 100, the fluid pressure in the push-up through hole 100 becomes higher than the atmospheric pressure outside the electrostatic chuck device 10c, and the flow withstand pressure is increased as the insulation sheet push-up force. Push point Q up.
Thus, since the electrostatic chuck device 10c acts in the same manner as the electrostatic chuck device 10a, the occurrence of uneven temperature on the mounting surface can be suppressed in the horizontal direction where the mounting surface spreads.

  As is clear from the above description, the electrostatic chuck device 10 sets the predetermined chuck push-up location P on the cooling base portion 60 side of the electrostatic chuck portion 20 so that the electrostatic chuck portion 20 is separated from the cooling base portion 60. A chuck push-up mechanism 70 for pushing up is provided. For this reason, since the chuck push-up mechanism 70 pushes up the chuck push-up portion P of the electrostatic chuck portion 20, the thickness of the adhesive layer 50 in a desired portion of the adhesive layer 50 can be changed. In the expanding horizontal direction, it is possible to suppress the occurrence of uneven temperature on the mounting surface of the electrostatic chuck unit 20.

  The electrostatic chuck devices 10 a, 10 b, and 10 c cover a predetermined chuck push-up location P on the cooling base portion 60 side of the electrostatic chuck portion 20 and the push-up through hole 65 or the push-up through hole 100 in the insulating sheet 41. An insulating sheet push-up mechanism 80 or a fluid supply means C that pushes the sheet push-up location Q toward the chuck push-up location P is provided so that the thickness of the adhesive layer 50 between the sheet push-up location Q is reduced. For this reason, when the insulating sheet push-up mechanism 80 or the fluid supply means C pushes the sheet push-up point Q toward the chuck push-up point P, the adhesive layer 50 between the pushed-up chuck push-up point P and the sheet push-up point Q is formed. Since the elastic deformation can be performed and the thickness of the adhesive layer 50 can be reduced, it is possible to suppress the occurrence of uneven temperature on the mounting surface of the electrostatic chuck portion in the horizontal direction in which the mounting surface spreads.

It goes without saying that the present invention is not limited to the embodiment described above.
For example, although the insulating sheet push-up mechanism 80 on the left side of the electrostatic chuck device 10a is operated on the paper surface of FIG. 3, the right insulating sheet push-up mechanism 80 on the electrostatic chuck device 10a may be operated. In this case, the electrostatic chuck portion 20 is deformed into a V shape that is separated from the cooling base portion 60 as it proceeds from the center of the sheet of FIG.

  For example, in the electrostatic chuck device 10b, it has been described that the suction electrode portion 91 of the electrostatic suction electrode 90 is formed inside the electrostatic chuck main body portion 21, but the opposite side from the mounting surface, that is, other It may be provided on the main surface 24.

  Further, in the electrostatic chuck device 10, the insulating sheet 40 is provided between the adhesive layer 50 and the cooling base portion 60 so as not to cover the opening on the electrostatic chuck portion 20 side of the push-up through hole 65. Although it has been described that it is adhered to the upper surface 62 (surface) of 60, an insulating sheet 41 that covers the opening on the electrostatic chuck portion 20 side of the push-up through hole 65 may be used. In this case, the chuck push-up mechanism 70 pushes up the chuck push-up location P via the sheet push-up location Q of the insulating sheet 41.

  Further, in the electrostatic chuck device 10c, a plurality of depressions may be formed on the upper surface 62 side of the cooling base 60, and the fluid from the fluid supply means C may be supplied to the depressions selected from the plurality of depressions.

  Further, although the heater unit 30 has been described as being formed on the other main surface 24 of the electrostatic chuck unit 20, the heater unit 30 may be formed inside the electrostatic chuck unit 20. In this case, the chuck push-up location P is a predetermined location on the other main surface 24 of the electrostatic chuck portion 20.

DESCRIPTION OF SYMBOLS 10, 10a, 10b, 10c Electrostatic chuck apparatus 20 Electrostatic chuck part 21 Electrostatic chuck main body part 22 One main surface of electrostatic chuck main body part 24 Other main surface of electrostatic chuck main body part 30 Heater part 32 One heater part Main surface 34 Other main surface of heater section 40 Insulating sheet that does not cover opening 41 Insulating sheet that covers opening 50 Adhesive layer 50a Adhesive layer between chuck push-up location and sheet push-up location 50b Between chuck push-up location and sheet push-up location 60 Cooling base part 62 Upper surface of cooling base part 64 Lower surface of cooling base part 65 Push-up through hole 66 Screw-in hole part of push-up through hole 67 Sliding hole part of push-up through hole 68 Cooling base Cooling channel for cooling part 69 Recessed part of cooling base part 70 Chuck push-up mechanism 71 Push-up force applying mechanism (male thread)
72 One end portion of the push-up force applying mechanism 73 Other end portion of the push-up force applying mechanism 75 Recessed groove of the push-up force applying mechanism 76 Recessed portion of the push-up force applying mechanism 77 Chuck push-up elastic member 78 Chuck push-up members 78a, 78b Chuck push-up member pins 80 Insulating Sheet Pushing Mechanism 84 Insulating Sheet Pushing Member for Insulating Sheet Pushing Mechanism 86 Insulating Sheet Pushing Elastic Member for Insulating Sheet Pushing Mechanism 89 Insulating Sheet Protection Layer for Insulating Sheet Pushing Mechanism 90 Electrostatic Suction Electrode 91 Suction Electrostatic Suction Electrode Electrode portion 92 Electrode electrode connection electrode portion 95 Electrostatic adsorption electrode exposed electrode portion 96 One main surface of exposed electrode portion 97 Other main surface of exposed electrode portion 100 Push-up through hole 102 Push-up through hole Fluid pressure hole 104 Fluid supply hole part of push-up through hole 110 Ceramic ring C Fluid supply means P Chuck push-up of electrostatic chuck part Sheet push-up portion of the Tokoro Q insulating sheet

Claims (5)

An electrostatic chuck portion including an electrostatic chuck main body portion having a placement surface on which a plate-like sample is placed;
A cooling base portion having a push-up through hole and cooling the electrostatic chuck portion;
An adhesive layer formed between the electrostatic chuck portion and the cooling base portion so that the electrostatic chuck portion and the cooling base portion are bonded;
A chuck lifting mechanism provided in the lifting through-hole,
The electrostatic chuck apparatus, wherein the chuck push-up mechanism pushes up a predetermined chuck push-up portion on the cooling base portion side of the electrostatic chuck portion so that the electrostatic chuck portion is separated from the cooling base portion. Furthermore, an insulating sheet adhered to the surface of the cooling base portion is provided between the adhesive layer and the cooling base portion so as not to cover the opening on the electrostatic chuck portion side of the push-up through hole,
The electrostatic chuck apparatus according to claim 1, wherein the chuck lifting mechanism pushes up the chuck lifting position.   The chuck lifting mechanism includes a chuck lifting member that pushes up the chuck lifting position while sliding through the lifting through hole, and a chuck lifting force applying mechanism that applies a chuck lifting force to the chuck lifting member. Or the electrostatic chuck apparatus of 2. An electrostatic chuck portion including an electrostatic chuck main body portion having a placement surface on which a plate-like sample is placed;
A cooling base portion having a push-up through hole and cooling the electrostatic chuck portion;
An adhesive layer formed between the electrostatic chuck portion and the cooling base portion so that the electrostatic chuck portion and the cooling base portion are bonded;
Between the adhesive layer and the cooling base portion, an insulating sheet adhered to the electrostatic chuck portion side of the cooling base portion so as to cover the push-up through hole;
An insulating sheet push-up mechanism provided in the push-up through hole,
The insulating sheet push-up mechanism has a thickness of an adhesive layer between a predetermined chuck push-up location on the cooling base portion side of the electrostatic chuck portion and a sheet push-up location covering the push-through hole in the insulating sheet. An electrostatic chuck device that pushes up the sheet push-up part toward the chuck push-up part so as to be thin.   The insulating sheet push-up mechanism includes an insulating sheet push-up member that pushes up the sheet push-up location while sliding through the push-up through hole, an insulating sheet push-up force applying mechanism that applies an insulating sheet push-up force to the insulating sheet push-up member, The electrostatic chuck device according to claim 4, further comprising an insulating sheet push-up elastic member disposed between the sheet push-up portion and the insulating sheet push-up member.