JP2016187415A - Game machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a game machine which allows a projection device to stably operate by providing an appropriate heat countermeasure to the projection device, while being capable of supporting various game machine specifications and projecting a high quality video presenting an enhanced video visual effect on a plurality of projection surfaces.SOLUTION: A game machine has a projector X for projecting a video by irradiation light and a screen drive mechanism for relatively displacing a plurality of projection surfaces with respect to the projector X. The projector X has a cover case X22, a plurality of optical means provided inside the cover case X22 for projecting a video, and a heat sink 243Xc for dissipating heat generated at the plurality of optical means. The heat sink 243Xc is exposed to the outside of the cover case X22.SELECTED DRAWING: Figure 125

Description

  The present invention relates to a gaming machine such as a pachislot machine or a pachinko machine.

  Some conventional gaming machines use a projector instead of a liquid crystal display device that displays video for games (see Patent Documents 1 and 2). In such a gaming machine, an image is projected from a projector onto a projection surface such as a screen.

JP-A-6-35066 JP 2009-240459 A

  However, in the conventional gaming machines as described above, there is no particular countermeasure for the projector. For example, if the projector becomes high temperature, the projection of the image may be hindered, or the device in the projector may be damaged due to high temperature. There was a risk. In addition, the gaming machine as described above has a problem in making the heat countermeasures of the projector uniform, because the space in which the projector is arranged and the presentation device arranged around the projector may differ depending on the specification.

  The present invention has been made in view of the above-described problems, and by appropriately taking measures against heat for the projection apparatus, it is possible to stably operate and to be able to cope with various game machine specifications. An object of the present invention is to provide a gaming machine capable of projecting a high-definition video having a high visual effect on a plurality of projection surfaces.

  In order to achieve the above object, the present invention provides the following gaming machines.

A gaming machine according to one aspect of the present invention,
A projection device (for example, projector device X, X ′, X ″, etc.) that projects an image by irradiation light;
A plurality of projection surfaces (for example, the reflection surfaces of the reflection portions D1 to D4, the projection surface E11a, the projection surface F1a, etc.) capable of displaying the image projected by the projection device;
A projection plane drive mechanism (for example, front screen drive mechanism E2, reel) that displaces at least one projection plane (for example, projection plane E11a, projection plane F1a, etc.) of the plurality of projection planes relative to the projection apparatus. Screen drive mechanism F2 etc.),
The projector is
A case (for example, a cover case X22),
A plurality of optical means (for example, LED light sources 240R, 240G, 240B, DMD241, etc.) disposed inside the case for projecting images;
A heat radiating member (for example, a heat sink 243Xc) for dissipating heat generated by the plurality of optical means,
The heat dissipation member is exposed to the outside of the case.

  According to such a configuration, the heat generated in the case of the projection apparatus can be efficiently exhausted to the outside of the case by the heat radiating member. In addition to being operated, it can be adapted to various game machine specifications, and can display a high-quality image with a high visual effect on a plurality of projection surfaces.

As a preferred embodiment of the present invention,
The projection apparatus has other heat radiating means (for example, heat radiating plates 2430 and 2431, heat sink 243Xa, etc.) disposed at a position different from the heat radiating member,
The heat radiating means is housed in the case.

  According to such a configuration, heat can be exhausted also by other heat dissipating means arranged in the case, so that an appropriate heat countermeasure can be taken for the projection apparatus.

As a preferred embodiment of the present invention,
The heat radiating member is configured to be removable from the projection device.

  According to such a configuration, since it is also possible to remove the heat radiating member according to the specifications of the gaming machine, it is possible to take appropriate heat countermeasures for the projection device for each type of gaming machine.

A gaming machine according to another aspect of the present invention,
A gaming machine body (for example, a housing 2),
A front door (for example, an upper door mechanism UD, a lower door mechanism DD, etc.) disposed in the gaming machine main body;
A projection device for projecting an image by irradiation light (for example, a projector device X ″);
A display device (for example, display unit A) capable of displaying the image projected by the projection device,
The projector is
A case (for example, a cover case X22),
A plurality of optical means (for example, LED light sources 240R, 240G, 240B, DMD241, etc.) disposed inside the case for projecting images;
A heat dissipating member (heat dissipating plate 2430) for dissipating heat generated by the plurality of optical means,
The heat radiating member is connected to an upper portion (upper wall G4) of the gaming machine main body.

  According to such a configuration, heat generated in the case of the projection device can be efficiently exhausted to the upper part of the gaming machine main body by the heat radiating member, so that an appropriate heat countermeasure is applied to the projection device. In addition to being able to operate stably, it can cope with various game machine specifications, and can display high-quality images with high visual effects on a plurality of projection surfaces.

  According to the present invention, it is possible to stably operate the projector by taking appropriate heat countermeasures, and to support various game machine specifications, and to provide a plurality of high-quality images with high visual effects. It is possible to provide a gaming machine that can be projected on the projection plane.

It is a front perspective view of a gaming machine. It is a back surface perspective view of a gaming machine. It is a front view of a gaming machine. It is a front view of a gaming machine when the upper door mechanism and the lower door mechanism are opened. It is a disassembled perspective view of a gaming machine. It is a disassembled perspective view of a gaming machine. It is a longitudinal cross-sectional view of a display unit. It is an upper perspective view of a projector apparatus. It is a perspective view when a display unit is attached to a cabinet. It is a downward perspective view of a projector apparatus. It is a front view of a display unit. It is a perspective view of a display unit. It is a left side exploded perspective view of a display unit. It is a right side exploded perspective view of a display unit. It is a back perspective view of a display unit. It is explanatory drawing which shows the irradiation state to a fixed screen mechanism. It is explanatory drawing which shows the irradiation state to a front screen mechanism. It is explanatory drawing which shows the irradiation state to a reel screen mechanism. It is a disassembled perspective view of a front screen mechanism. It is a perspective view of a reel screen mechanism. It is a block diagram which shows the circuit structure of a projector apparatus. It is a whole perspective view of a projector apparatus. It is a disassembled perspective view of a projector apparatus. It is a figure which shows the lens unit of a projector apparatus. It is a top view which shows the upper base and lower base for fixing a projector apparatus. FIG. 26 is a cross-sectional view of the upper pedestal and the lower pedestal along the line XXVI-XXVI in FIG. 25. It is a disassembled perspective view of an upper base and a lower base. It is a figure for demonstrating the positioning method of an upper base. It is a figure for demonstrating the attitude | position adjustment method of a lower side base. It is a figure which shows the connection form of a projector apparatus and adjustment PC. It is a perspective view which shows the case of a projector apparatus. It is a perspective view which shows the state which has arrange | positioned the heat sink and the optical element in the case of a projector apparatus. It is a figure for demonstrating the air flow path formed in the case of a projector apparatus. It is a front view which shows the inside of a cabinet. It is a side view of the cabinet of the state which opened the upper door mechanism and the lower door mechanism. It is a disassembled perspective view of a lower door mechanism. It is a block diagram which shows the system configuration | structure of a gaming machine. It is a block diagram which shows the circuit structure of a main control board. It is a block diagram which shows the circuit structure of a sub control board. It is a block diagram which shows the circuit structure of a reel drive board | substrate. It is a block diagram which shows the circuit structure of a door relay board | substrate. It is a block diagram which shows the circuit structure of a sub relay board | substrate. It is a block diagram which shows the circuit structure of a scaler board | substrate. It is a block diagram which shows the circuit structure of a multi-output scaler LSI. It is a block diagram which shows the circuit structure of a sub liquid crystal I / F board | substrate. It is a schematic diagram which shows the division | segmentation display pattern of a projector apparatus and a sub liquid crystal display device. It is a schematic diagram which shows the modification 1 of a division | segmentation display pattern. It is a schematic diagram which shows the modification 2 of a division | segmentation display pattern. It is a schematic diagram which shows the modification 3 of a division | segmentation display pattern. It is a schematic diagram which shows the modification 4 of a division | segmentation display pattern. It is a schematic diagram which shows the modification 5 of a division | segmentation display pattern. It is a schematic diagram which shows the modification 6 of a division | segmentation display pattern. It is explanatory drawing for demonstrating the communication specification of a gaming machine. It is a figure which shows the command exchanged between a scaler board | substrate and a sub control board. It is a figure which shows the command exchanged between a sub liquid crystal I / F board | substrate and a sub control board. It is a figure which shows the command exchanged between a projector control board-sub control board. It is a figure which shows the error information transmitted as a command from each board | substrate. It is a schematic diagram which shows the memory map of PC for adjustment. It is a flowchart which shows the process at the time of power activation of a main control board. It is a flowchart which shows the interruption process of a main control board. It is a schematic diagram which shows the memory map 1 of a sub control board. It is a schematic diagram which shows the memory map 2 of a sub control board. It is a flowchart which shows the process at the time of power activation of a sub control board. It is a flowchart which shows the LED control task of a sub control board. It is a flowchart which shows the sound control task of a sub control board. It is a flowchart which shows the screen accessory control task of a sub control board. It is a flowchart which shows the screen accessory control process of a sub control board. It is a flowchart which shows the focus change request process of a sub control board. It is a flowchart which shows the main task of a sub control board. It is a flowchart which shows the main board | substrate communication task of a sub control board. It is a flowchart which shows the command analysis process of a sub control board. It is a flowchart which shows the animation task of a sub control board. It is a flowchart which shows the subdevice task of a sub control board. It is a flowchart which shows the subdevice reception interruption process of a sub control board. It is a flowchart which shows the subdevice initialization process of a sub control board. It is a flowchart which shows the scaler control process of a sub control board. It is a flowchart which shows the process at the time of the scaler control reception of a sub control board. It is a flowchart which shows the process at the time of the scaler starting parameter request | requirement reception of a sub control board. It is a flowchart which shows the scaler setting change process of a sub control board. It is a flowchart which shows the process at the time of the scaler status command reception of a sub control board. It is a flowchart which shows the scaler reception confirmation reception process of a sub control board. It is a flowchart which shows the sub liquid crystal control process of a sub control board. It is a flowchart which shows the process at the time of sub liquid crystal control reception of a sub control board. It is a flowchart which shows the process at the time of the sub liquid crystal starting parameter request | requirement reception of a sub control board. It is a flowchart which shows the sub liquid crystal setting change process of a sub control board. It is a flowchart which shows the process at the time of sub liquid crystal status command reception of a sub control board. It is a flowchart which shows the sub liquid crystal reception confirmation reception process of a sub control board. It is a flowchart which shows the projector control process of a sub control board. It is a flowchart which shows the process at the time of the projector control reception of a sub control board. It is a flowchart which shows the process at the time of the projector starting parameter request | requirement reception of a sub control board. It is a flowchart which shows the projector setting change process of a sub control board. It is a flowchart which shows the process at the time of the reception confirmation reception of the projector of a sub control board. It is a flowchart which shows the process at the time of the projector error notification reception of a sub control board. It is a flowchart which shows the process at the time of the projector status reception of a sub control board. It is a flowchart which shows the projector drift correction process of a sub control board. It is a schematic diagram which shows the memory map 1 of a scaler board | substrate. It is a schematic diagram which shows the memory map 2 of a scaler board | substrate. It is a flowchart which shows the main process of a scaler board | substrate. It is a flowchart which shows the 1st serial line reception interruption process of a scaler board | substrate. It is a flowchart which shows the initialization process of a scaler board | substrate. It is a flowchart which shows the subdevice bypass transmission process of a scaler board | substrate. It is a flowchart which shows the process at the time of the sub-control-scaler reception of a scaler board | substrate. It is a flowchart which shows the self-diagnosis process of a scaler board | substrate. It is a flowchart which shows the process at the time of the sub control-scaler transmission of a scaler board | substrate. It is a flowchart which shows the sub control bypass transmission process of a scaler board | substrate. It is a schematic diagram which shows the memory map of a projector control board. It is a flowchart which shows the projector control main process of a projector control board. It is a flowchart which shows the serial line reception interruption process of a projector control board. It is a flowchart which shows the initialization process of a projector control board. It is a flowchart which shows the process at the time of sub control-projector reception of a projector control board. It is a flowchart which shows the internal setting change process of a projector control board. It is a flowchart which shows the projector setting value storage process of a projector control board. It is a flowchart which shows the self-diagnosis process of a projector control board. It is a flowchart which shows the process at the time of sub control-projector transmission of a projector control board. It is a flowchart which shows the status transmission data creation process of a projector control board. It is a schematic diagram which shows the memory map of a sub liquid crystal I / F board | substrate. It is a flowchart which shows the sub liquid crystal control main process of a sub liquid crystal I / F board | substrate. It is a flowchart which shows the serial line reception interruption process of a sub liquid crystal I / F board. It is a flowchart which shows the initialization process of a sub liquid crystal I / F board | substrate. It is a flowchart which shows the process at the time of sub-liquid crystal I / F board | substrate sub control-sub liquid crystal reception. It is a flowchart which shows the self-diagnosis process of a sub liquid crystal I / F board | substrate. It is a flowchart which shows the transmission process between the sub control of sub liquid crystal I / F board | substrate, and sub liquid crystal. It is a figure which shows the adjustment screen at the time of the optical adjustment of a projector apparatus. It is a figure which shows the adjustment screen at the time of the optical adjustment of a projector apparatus. It is a disassembled perspective view which shows the 1st modification of a projector apparatus. It is a disassembled perspective view which shows the 2nd modification of a projector apparatus. It is a front view which shows the arrangement | positioning form of the projector apparatus which concerns on a 3rd modification.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  As shown in FIGS. 1 to 5, the gaming machine 1 is a so-called pachislot machine. The gaming machine 1 can be played using coins, medals, game balls, tokens, and the like, as well as game media such as a card storing game value information assigned to or attached to a player. In the following description, medals are used.

  In the following description, the side (direction) from the gaming machine 1 toward the player is referred to as the front side (front direction) of the gaming machine 1, and the opposite side to the front side is referred to as the rear side (rear direction, depth direction). The right side and the left side when viewed from the player are referred to as the right side (right direction) and the left side (left direction) of the gaming machine 1, respectively. The direction including the front side and the rear side is referred to as the front-rear direction or the thickness direction, and the direction including the right side and the left side is referred to as the left-right direction or the width direction. The direction orthogonal to the front-rear direction (thickness direction) and the left-right direction (width direction) is referred to as the up-down direction or the height direction.

  As shown in FIGS. 1 and 2, the appearance of the gaming machine 1 is constituted by a rectangular box-shaped housing 2. The housing 2 includes a metal cabinet G having a rectangular opening on the front side as a gaming machine main body, an upper door mechanism UD disposed at the upper front of the cabinet G, and a lower disposed at the lower front of the cabinet G. And a door mechanism DD.

  In addition, two openings G41 penetrating in the vertical direction are formed in the upper surface wall G4 of the cabinet G at a predetermined interval in the horizontal direction. A wooden plate member G42 is attached to the upper surface wall G4 so as to close each of the two openings G41.

  As shown in FIG. 3, the upper door mechanism UD and the lower door mechanism DD are formed so as to correspond to the shape and size of the opening of the cabinet G. The upper door mechanism UD and the lower door mechanism DD are provided so that the upper part and the lower part of the opening in the cabinet G can be closed. The upper door mechanism UD has an upper display window UD1 at the center. The upper display window UD1 is provided with a transparent panel UD11 that transmits light.

  The lower door mechanism DD is provided with a main display window DD4 formed as a rectangular opening at a substantially upper central portion. A reel unit RU attached from the inside of the cabinet G is mounted on the back side of the main display window DD4. Further, a main control board MS is attached to the back surface of the reel unit RU.

  The reel unit RU is mainly composed of three reels RL (left reel), RC (middle reel), and RR (right reel) each having a plurality of types of symbols drawn on the outer peripheral surface thereof. These reels RL, RC, RR are arranged in parallel (one horizontal row) so that each of them can rotate in the vertical direction at a constant speed. The reels RL, RC, RR can visually recognize the operations of the reels RL, RC, RR and the symbols drawn on the reels RL, RC, RR through the main display window DD4.

  A transparent panel DD41 made of a rectangular acrylic plate or the like is attached and fixed to the surface of the main display window DD4 so that a player or the like cannot touch the reel unit RU. Below the main display window DD4, first, second and third pedestals DD2a, DD2b and DD2c having substantially horizontal surfaces are formed. The first pedestal portion DD2a located on the right side of the main display window DD4 is provided with a medal insertion slot DD5 for inserting medals. The medal insertion port DD5 is an opening through which a medal is inserted by the player. The medal inserted from the medal slot DD5 is credited or bet on the game.

  The second pedestal portion DD2b located on the left side of the main display window DD4 is provided with a maximum BET button DD8 (also referred to as a MAXBET button) as an effective line setting means for betting a credited medal. When the maximum BET button DD8 is pressed, “3” is selected as the number of inserted medals.

  A sub display device DD20 is provided in the third pedestal portion DD2c located on the front side of the main display window DD4. The sub display device DD20 displays, for example, the number of medals paid out when a winning is established and the remaining number of medals that have been credited. Since the maximum number of medals credited to the gaming machine 1 is usually 50, a credit number of 50 or less is displayed on the sub display device DD20. In the state where the maximum number of medals is credited, the inserted medals are paid out as they are from the medal payout exit DD14.

  On the front side of the maximum BET button DD8, there is provided a start lever DD6 for driving the reels RL, RC, RR to rotate by the player's operation and starting the display of the symbols in the main display window DD4. The start lever DD6 is attached to be tiltable within a predetermined angle range.

  On the right side of the start lever DD6, on the front side of the sub display device DD20, three stop buttons DD7L for respectively stopping the rotation of the three reels RL, RC, RR by the player's pressing operation (stop operation). , DD7C, DD7R are provided.

  A C / P button DD13 is provided on the left side of the maximum BET button DD8. The C / P button DD13 is used to switch the credit / payout of medals acquired by the player in the game by a push button operation. In a state where payout is selected by switching the C / P button DD13 (non-credit state), a medal is received from a medal payout exit DD14 (cancellation chute) provided in the coin guard plate portion on the lower side of the lower door mechanism DD. The medals that are paid out and paid out are stored in the medal receiving part DD15.

  A waist panel DD18 (waist light guide plate) is disposed on the lower side of the start lever DD6 and stop buttons DD7L, DD7C, DD7R. The waist panel DD18 is configured as a makeup panel using an acrylic plate or the like. On the waist panel DD18, a name representing the model of the gaming machine 1 and various patterns are drawn by printing.

  Further, a speaker DD25L is provided on the left side of the medal payout opening DD14, and a speaker DD25R is provided on the right side. The speakers DD25L and DD25R notify the player of various information related to the game using sounds such as voice and music. A sub liquid crystal display device DD19 is disposed on the right side of the main display window DD4. The sub liquid crystal display device DD19 is a so-called touch panel DD19T in which a touch sensor panel DD10T as a touch type position input device is arranged on a panel surface of a liquid crystal display panel (liquid crystal panel). The touch sensor panel may be, for example, a capacitive type that detects contact with a part of a human body (such as a fingertip) or an electrostatic pen and outputs a detection signal thereof, or It may be of a type that detects the contact of a hard substance such as a pen tip and outputs a detection signal thereof, or may be of any other type or structure (such as an in-cell structure). In the present embodiment, optical adjustment of the projector device B2 described later can be performed using the sub liquid crystal display device DD19 and the touch panel DD19T.

  The sub liquid crystal display device DD19 functions as a SUI (smart user interface). On the display screen, for example, game information such as the number of games is displayed along with the progress of the game, and by the player A message for requesting selection or input, an input key, and the like are displayed.

  In the sub liquid crystal display device DD19, for example, as the game progresses, it is possible to display contents (effect information) according to the effect related to the game. Further, as the sub liquid crystal display device DD19, for example, a jog dial or a push button or the like may be attached as an attachment having a function as a director or a dedicated attachment. Further, the sub liquid crystal display device DD19 can be omitted by distributing its function to the display unit A and the like which will be described later. Further, a sub liquid crystal display device different from the sub liquid crystal display device DD19 may be disposed on the left side of the main display window DD4. As such another sub liquid crystal display device, an LED substrate on which a plurality of full-color LEDs are mounted is provided on the back side thereof, and a display surface is provided by a transparent and decorated panel so as to be able to produce an effect. May be formed.

  As shown in FIG. 4, the inside of the cabinet G is partitioned into an upper space and a lower space by an intermediate support plate G1. That is, the intermediate support plate G1 functions as a partition plate that partitions the cabinet G into an upper space and a lower space. The upper space is a space on the rear side of the upper door mechanism UD in the cabinet G and accommodates the display unit A and the like. The lower space is a space on the rear side of the lower door mechanism DD in the cabinet G, and accommodates the reel unit RU, the main control board MS that controls the operation of the entire gaming machine 1, and the like.

(Display unit A)
As shown in FIG. 5, the display unit A is placed on the intermediate support plate G1 in the cabinet G so as to be replaceable. The display unit A is a so-called projection mapping apparatus including an irradiation unit B that emits irradiation light for image display, and a screen device C that causes an image to appear when the irradiation light from the irradiation unit B is irradiated.

  Here, the projection mapping device is for projecting an image on the surface of a three-dimensional object such as a structure or a natural object. Etc.) and an image according to the production information generated on the basis of the shape can be projected, thereby enabling an advanced and powerful production.

  The display unit A has a housing A1 with an opening formed in the front. The housing A1 includes a projector cover B1 that forms the upper part of the irradiation unit B, and a screen housing C10 of the screen device C (see FIGS. 12, 13, and the like). Although details will be described later, the screen casing C10 has a box shape having a bottom plate C1, a right side plate C2, a left side plate C3, and a back plate C4. The projector cover B1 is replaceably attached to the upper surface of the screen casing C10.

(Display unit A: Irradiation unit B)
As shown in FIG. 6, the irradiation unit B includes a projector device B2 that emits irradiation light forward, and a screen device that is disposed in front of the projector device B2 and that is configured to obliquely lower and rearward the irradiation light from the projector device B2. It has a mirror mechanism B3 that reflects in the direction C, and a projector cover B1 that houses the projector device B2 and the mirror mechanism B3.

(Display unit A: Irradiation unit B: Projector device B2)
The projector device B2 is attached to the projector cover B1 while being packaged by a case B22, and is arranged at the rear part in the cabinet G. The projector device B2 is attached to the projector cover B1 via a flat plate-like upper pedestal B220 and lower pedestal B221 arranged horizontally. The entire upper surface of the case B22 is opened. Accordingly, the lens unit B21 and the optical mechanism B24 (see FIG. 21) housed in the case B22 are positioned on the lower surface of the lower pedestal B221. The lens unit B21 forwards the irradiation light emitted from the plurality of LED light sources 240R, 240G, and 240B (see FIG. 33) of the optical mechanism B24 and reflected by the DMD 241 (Digital Micromirror Device: see FIG. 33) through the lens or the like. It arrange | positions so that it may radiate | emit toward the mirror mechanism B3. Details of the projector apparatus B2 will be described later with reference to FIGS.

(Display unit A: Irradiation unit B: Mirror mechanism B3)
As shown in FIGS. 6 and 7, a mirror mechanism B3 is disposed in front of the projector device B2 (the direction in which the irradiation light is emitted). The mirror mechanism B3 holds an optical mirror B32 by a mirror holder B31. The mirror mechanism B3 is provided on the inner surface of the reflector holding part B11 in the projector cover B1. The reflector holding portion B11 is formed at the center of the front surface of the projector cover B1, and is disposed so as to be exposed to the front side when the upper door mechanism UD is opened. The mirror mechanism B3 is attached to the reflector holding portion B11 so that the interval can be adjusted. Thereby, the reflection angle of the optical mirror B32 with respect to the traveling direction of the irradiation light emitted from the projector device B2 can be finely adjusted.

(Display unit A: Irradiation unit B: Projector cover B1)
As shown in FIG. 7, the projector device B2 and the mirror mechanism B3 are accommodated in the projector cover B1. The lower surface B2a of the projector device B2 has an inclined surface B2a1 that is inclined upward from the rear to the front at the front part thereof. As shown in FIG. 8, the projector cover B1 is arranged symmetrically in the left-right direction of the upper wall part B12 arranged horizontally, the reflector holding part B11 arranged on the front side of the upper wall part B12, and the upper wall part B12. Side wall portions B13 and B13. As for upper wall part B12, the front part protrudes ahead rather than cabinet G (refer to Drawing 5). At the center of the front part of the upper wall part B12, a reflector holding part B11 is formed so as to protrude forward, and the mirror mechanism B3 described above is held in the space formed by the protrusion so that the angle can be adjusted. Yes.

  Further, the side wall parts B13, B13 have a protruding part B131 protruding in the horizontal direction from the lower end part. The protrusion B131 has a first protrusion B131a on the front side and a second protrusion B131b on the rear side. The first protrusion B131a is positioned so as to correspond to the opening of the cabinet G when the projector cover B1 is attached to the cabinet G. The distance along the left-right direction between the tips of the first protrusions B131a protruding from the side walls B13, B13 is set to be slightly shorter than the width of the opening of the cabinet G in the left-right direction. On the other hand, when the projector cover B1 is mounted on the cabinet G, the second projecting portion B131b is positioned so as to correspond to the rear space from the opening of the cabinet G. The distance along the left-right direction between the tips of the second protrusions B131b protruding from the side wall parts B13, B13 is set to be slightly shorter than the width of the space part of the cabinet G. That is, each side wall part B13, B13 is formed so that the distance along the left-right direction between the front-end | tips of 2nd protrusion part B131b may become larger than the distance along the left-right direction of the front-end | tips of 1st protrusion part B131a. . Thus, the projector cover B1 can cover most of the internal space in the cabinet G.

  Further, a screw hole B131C penetrating in the vertical direction is formed at the tip of the second protrusion B131b. When the projector cover B1 is fixed to the right side plate C2 and the left side plate C3 (see FIG. 5), screws are screwed into the right side plate C2 and the left side plate C3 through the screw holes B131C. Further, since the projecting portions B131 project in the horizontal direction from the lower end portions of the side wall portions B13 and B13, the projecting portions B131 and the side wall portions B13 are provided at both end portions of the projector cover B1, and the concave portions B132 are formed from the front ends thereof. Are formed continuously toward the rear.

  As shown in FIG. 9, when the display unit A is mounted on the cabinet G, a space BS is defined by the recess B132 and the cabinet G. Further, the shape of the upper wall portion B12 and the side wall portion B13 of the projector cover B1 is such that the distance between the lower end portion of each side wall portion B13 and the front end portion of the second protrusion portion B131b protruding from the lower end portion is the second protrusion portion. The front part is configured to be larger than the rear part of B131b (see FIG. 8). As a result, the front space of the space BS becomes larger than the rear space. When the display unit A is mounted on the cabinet G, the opening G41 formed in the upper surface wall G4 of the cabinet G and the front space of the space BS are at least partially overlapped when viewed from above. This space BS is used as a work space for installing and fixing the gaming machine 1 on the island facility.

(Display unit A: Irradiation unit B: Perforated plate B15)
As shown in FIG. 10, a perforated plate B15 having a plurality of holes B151 is provided on the lower surface side of the projector cover B1. The perforated plate B15 is a punching metal having a plurality of holes formed by punching a plate made of metal (for example, stainless steel, iron, steel, aluminum, etc.). The plurality of holes B151 are formed to be substantially evenly distributed over the entire surface of the porous plate B15. The perforated plate B15 allows air to flow over the entire surface of the perforated plate B15, and allows air to flow from the lower side to the upper side or from the upper side to the lower side of the projector device B2. The size and the number of the holes B151 are set such that the inside of the projector cover B1 cannot be seen from the outside. The hole B151 is formed in a shape such as a circle, a square, or a hexagon, and the hole diameter is about 3 to 5 mm.

  The perforated plate B15 is formed so as to cover the first protrusion B131a and the second protrusion B131b of the projector cover B1 from the lower position. The perforated plate B15 has a front side upper part B15a, a middle side inclined part B15b, and a rear side lower part B15c. The upper part B15a is horizontally arranged. The inclined part B15b is formed to bend obliquely downward and rearward from the rear side of the upper part B15a. The lower part B15c is formed to bend in the horizontal direction from the rear side of the inclined part B15b.

  The upper part B15a of the perforated plate B15 is attached to the side wall parts B13 and B13 of the projector cover B1. Thereby, the perforated plate B15 is arranged so as to cover the front part of the projector cover B1 from the lower side with the upper part B15a and cover the lower part with the inclined part B15b and the lower part B15c from the middle part to the rear part of the projector cover B1. Yes. Further, the inclined portion B15b is disposed so as to surround the inclined surface B2a1 on the lower surface B2a of the projector device B2 when viewed from above. As shown in FIG. 7, the inclination angle of the inclined portion B15b (inclination angle with respect to the horizontal plane) is substantially the same as the inclination angle of the inclined surface B2a1. A front screen mechanism E1 in the screen device C is arranged below the perforated plate B15.

  The front screen mechanism E1 has a front standby position disposed on the upper side that is a standby posture that prohibits the appearance of an image by irradiation light, and a front exposure disposed on the lower side that is an exposure posture that permits the appearance of an image by irradiation light. The front screen mechanism E1 in the standby posture is in an inclined posture close to the inclined portion B15b of the perforated plate B15 in a substantially parallel manner. On the other hand, when the front screen mechanism E1 is in the exposed posture, a large space portion appears below the porous plate B15, and air present in the space portion reaches the porous plate B15 without flow resistance, By passing through the hole B151, it is possible to facilitate the inflow of air into the screen device C and enhance the cooling effect.

  Further, the perforated plate B15 is provided so as to cover the lower surface of the projector cover B1, so that, for example, as shown in FIG. 11, the player's eye position located on the front side is the center in the vertical direction and the horizontal direction of the screen device C. Even if the irradiation unit B is looked up from the position of the line of sight, the inside of the irradiation unit B is prevented from being visually observed by the perforated plate B15.

(Display unit A: Screen device C)
As shown in FIG. 12, the irradiation unit B configured as described above is connected to the upper surface of the screen device C by screw fastening. For example, as described above, screws are screwed into the upper surfaces of the right side plate C2 and the left side plate C3 of the screen device C through the screw holes B131C formed in the protrusion B131 of the projector cover B1. Thereby, the display unit A can unitarily handle the irradiation unit B and the screen device C as a unit.

(Display unit A: Screen device C: Screen mechanism)
Inside the screen housing C10, a plurality of screen mechanisms for causing an image to appear by irradiation of irradiation light from the irradiation unit B are provided so as to switch irradiation targets. Specifically, as shown in FIG. 13, a fixed screen mechanism D, a front screen mechanism E1, and a reel screen mechanism F1 are provided as the plurality of screen mechanisms. The projection planes of the fixed screen mechanism D, the front screen mechanism E1, and the reel screen mechanism F1 have different shapes from each other in order to diversify the image expression. The front screen mechanism E1 and the reel screen mechanism F1 are movable screens whose positions are displaced relative to the projector device B2 and the mirror mechanism B3. The front screen drive mechanism E2 and the reel screen drive mechanism F2 are respectively provided. (See FIG. 20). Note that the front screen mechanism E1 and the reel screen mechanism F1 are larger and heavier in the front screen mechanism E1. For this reason, when the front screen mechanism E1 is driven, a larger driving force is required than when the reel screen mechanism F1 is driven.

(Display unit A: Screen device C: Screen casing C10)
As described above, the screen device C includes the box-shaped screen casing C10. As shown in FIG. 13, the screen casing C10 includes a horizontally disposed bottom plate C1, a right side plate C2 erected at the right end portion of the bottom plate C1, and a left side plate C3 erected at the left end portion of the bottom plate C1. And a back plate C4 erected at the rear end of the bottom plate C1. Accordingly, the right side plate C2, the left side plate C3, and the back plate C4 are connected to the bottom plate C1 by screw fastening, so that the front side where the player is located and the upper side where the irradiation unit B is located are opened. A box-shaped screen casing C10 is formed.

  The bottom plate C1, the right side plate C2, the left side plate C3, and the back plate C4 are individually molded into a predetermined shape, and predetermined functional components such as the fixed screen mechanism D can be positioned and arranged. As a result, even if the unit of the screen device C cannot be shared as a whole, it can be shared in units of plate members of the bottom plate C1, the right side plate C2, the left side plate C3, and the back plate C4. In addition, since the plate member can be partially exchanged, the specification can be easily changed for each model of the gaming machine 1.

(Display unit A: Screen device C: Screen casing C10: Bottom plate C1)
The bottom plate C1 of the screen casing C10 is formed in a flat plate shape that is rectangular when viewed from above. The upper surface of the bottom plate C1 has a central placement portion C11 disposed at the center, and a right placement portion C12 and a left placement portion C13 disposed in the left-right direction with the center placement portion C11 as the center. . These placement parts C11, C12, C13 are formed in a concave shape. The center placement portion C11 places the fixed screen mechanism D so that it can be positioned by fitting the lower end portion of the fixed screen mechanism D. The right mounting portion C12 mounts the right movable body base C5 so as to be positioned by fitting the lower end portion of the right movable body base C5. The left placement portion C13 places the left movable body base C6 so that the left movable body base C6 can be positioned by fitting the lower end portion of the left movable body base C6. In addition, a pattern is three-dimensionally formed by unevenness on the side surface in the left-right direction of each of the right movable body base C5 and the left movable body base C6. That is, the right movable body base C5 and the left movable body base C6 also function as a decorative member. As described above, the fixed screen mechanism D, the right movable body base C5, and the left movable body base C6 can be positioned and arranged on the bottom plate C1.

  Further, the front portion C14 of the bottom plate C1 is bent downward so that the tip portion is positioned below the lower surface of the bottom plate C1. A plurality of through holes C141 are formed in the front portion C14. When the display unit A is assembled while being placed on the intermediate support plate G1 (see FIG. 5) of the cabinet G, the front portion C14 comes into contact with the front surface of the intermediate support plate G1, thereby moving the front portion C14 toward the rear in the cabinet G. It is possible to perform positioning. The display unit A can be assembled and installed from the front side of the cabinet G by being screwed to the front side of the cabinet G through the through hole C141 of the front part C14. It has become.

(Display unit A: Screen device C: Screen casing C10: Right side plate C2, Left side plate C3)
As shown in FIGS. 13 and 14, the right side plate C2 and the left side plate C3 of the screen casing C10 have operation openings C21 and C31. The operation openings C21 and C31 are formed as handles, and the display unit A can be carried by hooking the operation openings C21 and C31. The operation openings C21 and C31 are arranged on the sides of the crank gears E21 and E21 of the front screen drive mechanism E2. The opening portions C21 and C31 for operation are formed in a rectangular shape whose longitudinal direction coincides with the horizontal direction. The opening areas of the operation openings C21 and C31 are set to such an extent that the crank gears E21 and E21 can be manually operated from the outside.

  Thus, when the front screen mechanism E1 at the standby position is manually moved after the display unit A is assembled in the cabinet G, first, the display unit A is taken out from the front side of the cabinet G in which the upper door mechanism UD is opened. . Specifically, an operator located on the front side of the cabinet G releases the screw fastening of the display unit A to the cabinet G and removes the screw. Then, reaching into the cabinet G, the operation openings C21 and C31 of the display unit A are held with both hands, and the display unit A is taken out of the cabinet G. Thereafter, a hand is reached into the screen device C from one operation opening C21 of the detached display unit A, and the crank gear E21 that is visible in the horizontal direction is rotated from the operation opening C21 to thereby lock the front screen. The mechanism E1 can be easily moved from the standby position. When the locked state is released by the movement from the standby position, the front screen mechanism E1 can be quickly rotated to a desired position.

  In the state where the upper door mechanism UD is opened, the hand is reached from the front of the opening of the cabinet G into the space between the side wall G2 of the cabinet G and the right side plate C2 of the screen device C, and the operation opening C21 is reached. The crank gear E21 can be rotated by operating the crank gear E21. In this case, the front screen mechanism E1 can be unlocked without removing the display unit A from the cabinet G.

  Further, a motor housing portion C22 is formed on the right side plate C2. The drive motor F24 of the reel screen drive mechanism F2 (see FIG. 20) is positioned by the motor housing portion C22. Further, the right side plate C2 and the left side plate C3 respectively include a first support portion C23 that rotatably supports the gear shaft E21a of the crank gear E21 in the front screen drive mechanism E2, and an intermediate gear E23 in the front screen drive mechanism E2. A second support portion C24 that rotatably supports the shaft member E3 that is the gear shaft is formed. As described above, the front screen drive mechanism E2 and the reel screen drive mechanism F2 are positioned and arranged by the right side plate C2 and the left side plate C3. The right front screen drive mechanism E2B and the reel screen drive mechanism F2 of the front screen drive mechanism E2 are disposed between the right movable body base C5 and the right side plate C2 in the left-right direction. Further, the left front screen drive mechanism E2A is disposed between the left movable body base C6 and the left side plate C3 in the left-right direction.

(Display unit A: Screen device C: Screen casing C10: Back plate C4)
As shown in FIG. 15, the back plate C4 of the screen casing C10 is formed in a flat plate shape, and a recess CO for positioning and arranging the relay board CK is formed in the lower part of the back surface thereof. The relay substrate CK includes various functional components in the display unit A (for example, the projector device B2, the front screen drive mechanism E2, the reel screen drive mechanism F2, etc.) and various functional components other than the display unit A (sub control substrate SS, which will be described later). ) Is a relay board for relaying wiring (not shown). The relay substrate CK includes a screen drive control substrate CS (see FIGS. 37 and 42) that exchanges signals and the like with the screen drive mechanisms E2 and F2.

  An operation opening C41 is formed in the back plate C4. The operation opening C41 is disposed at the lower right side and faces the intermediate gear E23 of the front screen drive mechanism E2. The operation opening C41 is formed in a size that allows the intermediate gear E23 to be manually operated. Accordingly, when the front screen mechanism E1 at the standby position is manually moved after the display unit A is incorporated into the cabinet G, the display unit A is first removed from the cabinet G. After that, reaching out from the operation opening C41 into the screen device C and rotating the intermediate gear E23 visible in the horizontal direction from the operation opening C41, the locked front screen mechanism E1 can be easily moved from the standby position. Can be moved.

  Further, the back plate C4 is disposed in front of the rear ends of the right side plate C2 and the left side plate C3. Thereby, when the display unit A is placed on the intermediate support plate G1 of the cabinet G, the space GS is formed by the rear wall G3 of the cabinet G, the right side plate C2, the left side plate C3, and the back plate C4 of the screen device C. Will be defined. That is, a gap is secured between the back wall G3 and the back plate C4. As a result, even if the relay board CK is provided on the back surface of the back plate C4, the space GS can prevent the relay board CK from interfering with the back wall G3 of the cabinet G.

  Further, a through hole G11 is formed at a position facing the space GS in the intermediate support plate G1 (see FIG. 5). The through hole G11 is formed so that the opening surrounds the relay substrate CK in a top view. The relay board CK is arranged so that the connector CK1 to which wiring from a device (such as a sub-control board SS described later) housed in the lower space of the cabinet G is connected faces the through hole G11. . Thereby, the electrical connection between the relay substrate CK of the display unit A and the device accommodated in the lower space of the cabinet G is made by inserting the wiring from the device accommodated in the lower space through the through hole G11. This can be done by connecting to CK1.

  Thus, the relay board CK is arranged outside the screen device C, thereby facilitating the wiring work and making it unnecessary to secure an installation space for the relay board CK in the screen device C. The degree of freedom of design in the screen device C is expanded. Moreover, it becomes easy to discharge | emit the heat | fever which generate | occur | produces from the relay board | substrate CK outside the machine via the vent hole G3a (refer FIG. 2) formed in the back wall G3 of the cabinet G. FIG.

  Moreover, the wiring which connects the relay board CK arrange | positioned in the upper space of the cabinet G, and the apparatus accommodated in the lower space of the cabinet G passes through the through-hole G11 formed in the rear part of the intermediate support plate G1. Therefore, it becomes easy to arrange wiring behind various devices in the cabinet G. As a result, the degree of freedom in wiring can be increased.

  Since the relay board CK is arranged at the rear part in the cabinet G, it is difficult for light to reach the relay board CK. As a result, it is difficult to connect the wiring to the connector CK1 of the relay board CK. It can be. Therefore, in order to facilitate the connection of the wiring from the equipment accommodated in the lower space of the cabinet G to the relay board CK, the connector CK1 of the relay board CK passes below the intermediate support plate G1 through the through hole G11. It may be configured to protrude. Further, the color of the connector CK1 may be a color with high light reflectance (for example, white).

  As described above, the fixed screen mechanism D, the right movable body base C5, and the left movable body base C6 are positioned on the bottom plate C1. The drive motor F24 of the reel screen drive mechanism F2 is positioned on the right side plate C2, and the gear shaft E21a and the shaft member E3 of the front screen drive mechanism E2 are positioned on the right side plate C2 and the left side plate C3. The relay substrate CK is positioned with respect to the back plate C4. As described above, the fixed screen mechanism D, the screen driving mechanisms F2 and E2, and the relay substrate CK are positioned and arranged on one of the bottom plate C1, the side plates C2 and C3, and the back plate C4, respectively. Positioned and arranged on different plates. Therefore, even if the display unit A as a whole cannot be shared among the models of the gaming machine 1, it can be shared among the models on a board basis. As a result, the display unit can be manufactured at a lower cost than the case where the display unit is manufactured for each model.

  Moreover, since each board C1-C4 of the screen housing | casing C10 is connected by screw fastening, it can cancel | release connection of each board C1-C4 by loosening a screw. That is, the screen casing C10 is assembled so that the plates C1 to C4 can be replaced. As a result, the functional parts of the display unit can be exchanged on a plate-by-plate basis. Therefore, it is possible to change the specifications of the display unit A while reusing functional parts that are not subject to exchange of the display unit A. .

  As shown in FIGS. 13 and 20, the right movable body base C5 is disposed on the left inner side of the right front screen drive mechanism E2B and the reel screen drive mechanism F2. Further, the left movable body base C6 is disposed on the right inner side of the left front screen drive mechanism E2A. As a result, the right movable body base C5 and the left movable body base C6, which are decorative members, can make it difficult for the player to visually observe the drive mechanisms E2 and F2. As a result, the beauty of the gaming machine 1 can be improved. Moreover, since the recessed part for arrange | positioning the right movable body base C5 and the left movable body base C6 is formed in the baseplate C1, it becomes possible to position these at the baseplate C1 easily.

(Display unit A: Screen device C: Screen position relationship)
As shown in FIG. 16, the fixed screen mechanism D is provided in a fixed state at a fixed exposure position existing in the irradiation direction of the irradiation light. As shown in FIG. 17, the front screen mechanism E1 is provided to be rotatable between a front exposure position and a front standby position. The positional relationship between the fixed exposure position and the front exposure position is set so that the front exposure position is in the irradiation direction of the irradiation light and exists in front of the fixed exposure position. As a result, when the front screen mechanism E1 moves to the front exposure position, the front screen mechanism E1 covers the fixed screen mechanism D from the front so that the image by the irradiation light appears only on the front screen mechanism E1. It is possible. When the front screen mechanism E1 moves to the front standby position, the fixed screen mechanism D is exposed so that an image of the irradiated light can appear on the fixed screen mechanism D. That is, when the front screen mechanism E1 is disposed at the front exposure position, the front screen mechanism E1 becomes a projection target of the projector device B2. On the other hand, when the front screen mechanism E1 is disposed at the front standby position, the fixed screen mechanism D becomes the projection target of the projector device B2.

  As shown in FIG. 18, the reel screen mechanism F1 is provided so as to be rotatable between a reel exposure position and a reel standby position. The positional relationship between the reel exposure position and the fixed exposure position is set so that the reel exposure position is in the irradiation direction of the irradiation light and exists ahead of the fixed exposure position. As a result, when the reel screen mechanism F1 moves to the reel exposure position, the reel screen mechanism F1 covers the fixed screen mechanism D from the front, so that the image by the irradiation light appears only on the reel screen mechanism F1. It is possible. When the reel screen mechanism F1 is moved to the reel standby position, the fixed screen mechanism D is exposed so that an image by irradiation light can appear on the fixed screen mechanism D. That is, when the reel screen mechanism F1 is arranged at the reel exposure position, the reel screen mechanism F1 becomes a projection target of the projector device B2. On the other hand, when the reel screen mechanism F1 is disposed at the front standby position, the fixed screen mechanism D becomes a projection target of the projector device B2.

(Display unit A: Screen device C: Fixed screen mechanism D)
As shown in FIGS. 13 and 14, the fixed screen mechanism D is fixed on the bottom plate C1 of the screen casing C10 by screw fastening. The fixed screen mechanism D includes a front reflection part D1, a right surface reflection part D2, a left surface reflection part D3, and a lower surface reflection part D4. The reflecting surfaces of these reflecting portions D1 to D4 are projection surfaces onto which the irradiation light from the irradiation unit B is projected, and are set at different angles with respect to the optical axis of the irradiation light from the irradiation unit B.

  In addition, if the fixed screen mechanism D is a structure which has a reflective surface of several different angles with respect to the optical axis of irradiation light, it may have a reflective part of 2 surfaces, 3 surfaces, 5 surfaces, for example, Or you may provide the reflective part of the curved or circular-arc-shaped reflective surface in which the curvature center point which becomes an continuously different angle with respect to an optical axis is located in the front side.

  The front reflecting portion D1 has a reflecting surface opposed to the player on the front side, and reflects most of the reflected light from the irradiation unit B arranged in the upper front portion of the fixed screen mechanism D to the front. Is set to The right side reflection part D2 and the left side reflection part D3 are joined to the right side part and the left side part of the front reflection part D1, and are arranged symmetrically about the front reflection part D1. The right side reflection part D2 and the left side reflection part D3 are arranged such that the width between the front end parts is larger than the width in the left-right direction of the front reflection part D1. As a result, the right-side reflection part D2 and the left-side reflection part D3 make it possible to make the reflection direction of the irradiation light with respect to the reflection surface easier to face in the direction of the front reflection part D1, so that a part of the irradiation light appears in front while the image by the irradiation light appears. The light is reflected in the direction of the reflection part D1. In addition, with respect to the lower surface reflection part D4, the reflection direction of the irradiation light with respect to the reflection surface is easily directed toward the front reflection part D1, so that a part of the irradiation light is caused to appear in the direction of the front reflection part D1 while the image by the irradiation light appears. It is designed to reflect.

  In the fixed screen mechanism D, the brightness of the reflecting surface is set lower than the brightness of each reflecting surface of the front screen mechanism E1 and the reel screen mechanism F1. That is, in the fixed screen mechanism D, the amount of light reflected by the reflecting surface of the irradiation light is made smaller than the amount of light reflected by the reflecting surfaces of the front screen mechanism E1 and the reel screen mechanism F1. As a result, the fixed screen mechanism D is prevented from being blurred due to light mixing due to irregular reflection of the reflecting portions D1 to D4. In the fixed screen mechanism D, the brightness of the other reflection parts D2, D3, D4 may be lower than the brightness of the front reflection part D1. In this case, since the reflection of the irradiation light to the front reflection part D1 in the other reflection parts D2, D3, D4 can be reduced, white blur can be reduced while causing an image to appear strongly in the front reflection part D1.

As brightness, Brightness in the L ^* a ^* b ^* color system (L ^* a ^* b ^* color space) or the L ^* u ^* v ^* color system (L ^* u ^* v ^* color space) is adopted. However, any other color can be defined as long as other colors can be expressed by relative values with white as a reference.

  The lightness of the reflection surface of the fixed screen mechanism D and the lightness of the reflection surfaces of the front screen mechanism E1 and the reel screen mechanism F1 are the same as the lightness of the reflection surface of the fixed screen mechanism D and the reflection of the front screen mechanism E1 and the reel screen mechanism F1. If it is lower than the brightness of a surface, it will not specifically limit. For example, the brightness of the reflecting surface of the fixed screen mechanism D may be set to a value lower by about 5 to 25% (or 10 to 20%) than the brightness of the reflecting surfaces of the front screen mechanism E1 and the reel screen mechanism F1.

  In order to make the lightness of the reflection surface of the fixed screen mechanism D lower than the lightness of the reflection surfaces of the front screen mechanism E1 and the reel screen mechanism F1, the color of the paint applied to the base material of the fixed screen mechanism D is changed to the front screen. What is necessary is just to make it black rather than the color of the coating material apply | coated to the base material of the mechanism E1 and the reel screen mechanism F1. For example, a white paint is used as the coating material applied to the base material of the front screen mechanism E1 and the reel screen mechanism F1, and the coating material applied to the base material of the fixed screen mechanism D is the front screen mechanism E1 or the reel screen mechanism F1. What added the black pigment to the coating material apply | coated to a base material should just be used.

  In such a paint, the brightness of the reflection surface of the screen mechanism can be changed by changing the ratio of the white pigment (for example, titanium oxide) and the black pigment (for example, carbon black). For example, the paint applied to the base material of the front screen mechanism E1 and the reel screen mechanism F1 includes only a white pigment among white pigment and black pigment, and the paint applied to the base material of the fixed screen mechanism D includes Both a white pigment and a black pigment may be included. Further, the ratio of the black pigment to the white pigment (for example, 5 to 25% (or 5% to 25%) (or the paint applied to the fixed screen mechanism D is higher than the paint applied to the base material of the front screen mechanism E1 and the reel screen mechanism F1. It may be increased by about 10 to 20%). In addition, as a coating material applied to the base material of these screen mechanisms, a conventionally known screen coating material can be appropriately employed and can be adjusted according to a screen type (for example, a diffusion type or a reflection type). .

  Note that the black pigment is not dispersed in the coating material applied to the base material of the fixed screen mechanism D, but before the base material of the fixed screen mechanism D is molded. By doing so, the base material itself may be colored to lower the brightness of the base material itself.

  Further, from the viewpoint of preventing irregular reflection of light, members constituting the screen casing C10 such as peripheral walls (the bottom plate C1, the right side plate C2, the left side plate C3, and the back plate C4), and the interior of the screen casing C10. It is desirable that the brightness of the other members (members other than the screen) disposed in the panel is also lowered. The brightness of these members is desirably lower than the brightness of the reflecting surface of the fixed screen mechanism D. For example, it is not necessary to consider that an image is projected as a screen for the surrounding wall. The lower the better. That is, it is desirable that the color of the surrounding wall is closer to black.

(Display unit A: Screen device C: Front screen mechanism E1)
As shown in FIG. 19, the front screen mechanism E1 includes a rectangular front screen member E11 having a projection surface E11a on the entire surface, and a front screen support base E12 having patterns such as the first pattern surface E12a on both surfaces. Have. The front screen member E11 is formed by applying screen paint to a thin flat panel. Thereby, as for the front screen member E11, the projection surface E11a is formed in flat shape.

  On the other hand, the front screen support E12 has a holding recess E121 that holds the front screen member E11. The holding recess E121 has an opening shape similar to that of the projection surface E11a of the front screen member E11 in a slightly enlarged state, and accommodates the entire front screen member E11. In addition, the holding recess E121 is set in two stages of a deep part and a shallow part. The shallow portion is realized by a stepped portion E121a formed at the peripheral portion of the front screen support base E12 and a stepped portion E121b formed linearly at both ends in the short direction passing through the center portion.

  Accordingly, the front screen member E11 accommodated in the holding recess E121 is abutted and supported by the stepped portion E121a at the peripheral edge and the linear stepped portion E121b passing through the central portion, and is separated from the remaining deep portion. It is in a state. As a result, the deformation of the front screen support E12 in the deep portion is prevented from deforming the front screen member E11 and causing distortion on the projection surface E11a.

  Further, the front screen support E12 has a first pattern surface E12a in a partial region around the projection surface E11a. The first pattern surface E12a is visible to the player in front when the front screen mechanism E1 is positioned at the front exposure position. Further, the front screen support E12 has a second pattern surface E12b on the entire surface opposite to the first pattern surface E12a. The second pattern surface E12b is visible to the player in front when the front screen mechanism E1 is positioned at the front standby position. In these first pattern surface E12a and second pattern surface E12b, for example, a pattern related to a game effect is three-dimensionally formed by unevenness.

  The front screen member E11 and the front screen support E12 configured as described above are formed separately and then integrated by bonding with an adhesive. Thus, the front screen mechanism E1 is mechanically separated from the front screen member E11 even if sink marks may occur due to molding shrinkage or the like when forming a pattern or the like on the front screen support base E12. Therefore, it is possible to prevent the front screen member E11 from being distorted due to sink marks on the projection surface E11a.

  Note that the method for fixing the front screen member E11 and the front screen support E12 is not limited to bonding with an adhesive, and any method such as screw fastening may be employed.

  The flat panel constituting the front screen member E11 and the front screen support E12 are each produced by injection molding. As a material of the flat panel constituting the front screen member E11 and the front screen support base E12, a thermoplastic resin (for example, ABS resin or the like) that can cause sink marks when injection molding is performed is appropriately adopted. it can.

(Display unit A: Screen device C: Front screen drive mechanism E2)
The front screen mechanism E1 is rotatable by the driving force of the front screen drive mechanism E2. As shown in FIGS. 13 and 14, the front screen drive mechanism E2 includes a left front screen drive mechanism E2A connected to the lower surface of the left end of the front screen mechanism E1, and a right connected to the lower surface of the right end of the front screen mechanism E1. And a front screen drive mechanism E2B.

  As shown in FIG. 17, the front screen mechanism E1 is configured to be inclined upward from the rear end toward the front end when the front screen mechanism E1 is disposed at the front standby position (in the standby posture). ing. The inclination of the front screen mechanism E1 is substantially parallel to the inclined portion B15b of the perforated plate B15 and the inclined surface B2a1 on the lower surface B2a of the projector device B2.

  As described above, the posture of the front screen mechanism E1 when placed at the front standby position is set to an inclined posture in which the front screen mechanism E1 is inclined upward from the rear end portion toward the front end portion, thereby being parallel to the horizontal plane. Compared to the case of the posture, it is possible to suppress the irradiation light irradiated by the irradiation unit B from being obstructed by the front screen mechanism E1. Thereby, the vertical position of the front screen mechanism E1 when placed at the front standby position can be brought closer to the fixed screen mechanism D. As a result, the front screen mechanism E1 can be enlarged even in a limited space of the display unit A. In addition, since the lower surface B2a of the projector device B2 has the inclined surface B2a1 as described above, the vertical position of the front screen mechanism E1 when placed at the front standby position is set with respect to the projector device B2. Can be closer. As a result, the front screen mechanism E1 can be further increased in size.

  As shown in FIG. 14, the right front screen drive mechanism E2B has a crank member E22, a crank gear E21, an intermediate gear E23, a motor shaft gear E24, and a drive motor E25. The crank member E22 in the right front screen drive mechanism E2B has an upper end (one end) located at the upper position when the front end is disposed at the front exposed position (in the exposed posture) on the back of the right end of the front screen mechanism E1. It is connected to.

  The crank member E22 is pivotally supported by the right movable body base C5 (see FIG. 13) at an intermediate position. As a result, the crank member E22 can rotate the upper end portion and the lower end portion (the other end portion) with the intermediate position as the rotation center. This intermediate position coincides with the rotation center axis of the front screen mechanism E1.

  As described above, the rotation center axis of the front screen mechanism E1 is disposed above the center position of the front screen mechanism E1 disposed at the front exposure position. The crank member E22 has an upper end portion (one end portion) connected to a position where the upper end portion (one end portion) becomes an upper portion when the front screen mechanism E1 is disposed at the front exposure position (in the exposure posture) on the rear surface of the right end portion. . With the above configuration, the operation range between the front standby position and the front exposure position in the front screen mechanism E1 can be reduced, so that the front screen mechanism E1 can be increased in size.

  A slide groove (not shown) is formed in the lower region of the crank member E22. The slide groove is formed to have a U shape when viewed from the side. A slide member E26 (see FIG. 14) is movably engaged with the slide groove. That is, the slide member E26 is always in contact with the slide groove. The slide member E26 is rotatably supported at an eccentric position of the crank gear E21. As shown in FIG. 13, the gear shaft E21a of the crank gear E21 is rotatably supported by the right movable body base C5 and the first support portion C23 of the right side plate C2. The gear shaft E21a of the crank gear E21 has a line segment connecting the gear shaft E21a and the eccentric position when the front screen mechanism E1 is in the standby posture or the exposed posture, and the center position of the crank member E22 and the slide member E26. Are set so as to have an orthogonal relationship to the line segment connecting the two.

  Thereby, when the front screen mechanism E1 is in the standby posture or the exposed posture, even if a force is applied in a direction in which the lower region of the crank member E22 is rotated, the gear shaft E21a is applied in the direction in which all components of the force are applied. Exists and acts as a fixed end, so that the slide member E26 does not move. As a result, a truss structure is formed by a three-joint link having zero degrees of freedom with the intermediate position of the crank member E22 and the gear shaft E21a of the crank gear E21 as the fixed end and the slide member E26 as the free end. Even if it is pushed by hand, the front screen mechanism E1 does not move because the crank member E22 and the crank gear E21 act as a strong brake.

  An intermediate gear E23 is meshed with the crank gear E21. The intermediate gear E23 is pivotally supported by the right movable body base C5 and the second support portion C24 of the right side plate C2. A motor shaft gear E24 is meshed with the intermediate gear E23. The motor shaft gear E24 is connected to the drive shaft of the drive motor E25. Thereby, the right front screen drive mechanism E2B can transmit the rotational driving force of the drive motor E25 to the crank gear E21 via the motor shaft gear E24 and the intermediate gear E23.

  Here, all the components of the rotational driving force applied to the crank gear E21 coincide with the tangential direction of the turning locus of the slide member E26. When the front screen mechanism E1 is in the standby posture or the exposed posture, a line segment connecting the gear shaft E21a and the eccentric position of the slide member E26 connects the intermediate position of the crank member E22 and the center point of the slide member E26. Since it is set to have a relationship orthogonal to the line segment, the tangential direction of the turning locus is parallel to the slide groove of the crank member E22. Accordingly, when the front screen mechanism E1 is in the standby posture or the exposed posture, when the rotational driving force is applied to the crank gear E21, the crank gear E21 starts to rotate easily.

  When a rotational driving force is applied to the crank gear E21, the slide member E26 provided at the eccentric position is movable along the slide groove, so that the intermediate position of the crank member E22 and the gear shaft of the crank gear E21 are provided. A one-degree-of-freedom two-joint link is formed in which E21a is a fixed end and the slide member E26 is a free end that is movable along the slide groove. When the slide member E26 rotates, the slide member E26 slides along the slide groove so that the crank member E22 rotates about the intermediate position, and the upper region of the crank member E22 rotates. Become. As a result, the front screen mechanism E1 moves between the front standby position and the front exposure position.

  In the present embodiment, the drive motor E25 is a stepping motor, and is electrically connected to the sub control board SS via the relay board CK and the sub relay board SN (see FIG. 34). Drive controlled. The drive motor E25 may be connected to the main control board MS via the relay board CK and driven and controlled by the main control board MS.

  Further, the moving speed of the front screen mechanism E1 gradually accelerates from 0 in the stopped state in the standby posture or the exposed posture, gradually decreases after reaching the maximum speed in the intermediate posture between the standby posture and the exposed posture, When the exposure posture or the standby posture is reached, the stop state becomes zero again. Thus, the rotation can be started and stopped in a state where the angular acceleration of the crank gear E21 is small (moment of inertia), so that the torque required for the crank gear E21 can be reduced, and as a result, the drive mechanism ( It is possible to reduce failures and wear due to overloading of the intermediate gear E23, the motor shaft gear E24, and the drive motor E25).

  The right front screen drive mechanism E2B configured as described above has the same configuration as the left front screen drive mechanism E2A except for the motor shaft gear E24 and the drive motor E25. The left front screen drive mechanism E2A and the right front screen drive mechanism E2B are arranged symmetrically. The intermediate gear E23 of the left front screen drive mechanism E2A and the intermediate gear E23 of the right front screen drive mechanism E2B are connected via a shaft member E3 (see FIG. 13).

  In the above configuration, when the drive motor E25 is driven, the motor shaft gear E24 is rotated. As the motor shaft gear E24 rotates, the intermediate gears E23 and E23 and the shaft member E3 of the left front screen drive mechanism E2A and the right front screen drive mechanism E2B rotate together. Then, the crank gears E21 and E21 are rotated in conjunction with the rotation of the intermediate gears E23 and E23, whereby the front screen mechanism E1 is rotated around the rotation center axis, and the front standby position and the front It moves between exposure positions.

  As described above, by connecting the intermediate gears E23 and E23 of the left front screen drive mechanism E2A and the right front screen drive mechanism E2B by the shaft member E3, the rotational driving force of the drive motor E25 is applied to the two crank members E22. It becomes possible to transmit evenly. Therefore, compared with the case where these intermediate gears E23 and E23 are not connected by the shaft member E3, it is possible to prevent the driving load from being concentrated on one of the two crank members E22. Further, since the drive motor E25 is provided in the right front screen drive mechanism E2B arranged on the right side of the fixed screen mechanism D, the arrangement of the fixed screen mechanism D is not hindered.

  In addition, the shaft member E3 is not used as the rotation shaft of the front screen mechanism E1. For this reason, the freedom degree of arrangement | positioning of the shaft member E3 increases, and it becomes possible to arrange | position the shaft member E3 so that arrangement | positioning of other supplements, such as the fixed screen mechanism D, may not be inhibited. As a result, it is possible to increase the degree of freedom of the arrangement of the extra items while maintaining the rotation range and size of the front screen mechanism E1 at a desired level.

  Further, since the shaft member E3 is disposed behind the fixed screen mechanism D, the light projected on the fixed screen mechanism D is not hindered by the shaft member E3. Further, since the rotation center axis of the front screen mechanism E1 is disposed forward of the rear end position of the fixed screen mechanism D, it is compared with the case where it is disposed rearward of the rear end position of the fixed screen mechanism D. Thus, the length between the front screen mechanism E1 and the rotation center axis (the length of the crank member E22) can be shortened. For this reason, even when the space in the cabinet G is limited and the display unit A cannot be enlarged, the size of the front screen mechanism E1 can be maintained to a desired level.

(Display unit A: Screen device C: Reel screen mechanism F1)
As shown in FIG. 18, the reel screen mechanism F1 is a curved flat plate. The reel screen mechanism F1 has a circular arc shape when viewed from the side, which is curved in a shape that approximates the rotation direction. On the surface of the reel screen mechanism F1, a pattern is formed on the peripheral portion, and an inner peripheral area of the peripheral portion is a projection surface F1a. The projection plane F1a is an arcuate surface that protrudes upstream in the irradiation direction of light from the projector device B2 when the reel screen mechanism F1 is disposed at the reel exposure position. In addition, a pattern is formed on the rear surface on the rotation center side in the reel screen mechanism F1. The pattern on the back surface is made visible to the player in front when the reel screen mechanism F1 is positioned at the reel standby position.

  The reel screen mechanism F1 is rotatable between the reel standby position and the reel exposure position by the driving force of the reel screen drive mechanism F2. When the reel screen mechanism F1 is positioned at the reel exposure position, the projection surface F1a can appear an image by irradiation with irradiation light.

(Display unit A: Screen device C: Reel screen drive mechanism F2)
As shown in FIG. 20, the reel screen drive mechanism F2 has two arm members F21 (not shown on the right side), an arcuate gear F22, a motor shaft gear F23, and a drive motor F24. One end of each of the two arm members F21 is connected to the back surface of the right end portion and the back surface of the left end portion of the reel screen mechanism F1. A support shaft F21a (not shown on the left side) is formed on the outer surface of the other end of the two arm members F21 so as to protrude outward in the left-right direction. These support shafts F21a are rotatably supported by the right movable body base C5 and the left movable body base C6, respectively. As a result, the two arm members F21 can rotate about the support shaft F21a. These support shafts F21a coincide with the rotation center axis of the reel screen mechanism F1.

  The arcuate gear F22 is fixed to the tip of the support shaft F21a arranged on the right side. A motor shaft gear F23 is meshed with the arcuate gear F22. The drive shaft of the drive motor F24 is connected to the motor shaft gear F23. In the present embodiment, the drive motor F24 is a stepping motor, and is electrically connected to the sub control board SS via the relay board CK and the sub relay board SN (see FIG. 34). Drive controlled. The drive motor F24 may be connected to the main control board MS via the relay board CK and driven and controlled by the main control board MS.

  In the above configuration, when the drive motor F24 is driven under the control of the sub-control board SS, the motor shaft gear F23 rotates. As the motor shaft gear F23 rotates, the arcuate gear F22 rotates. Then, the arm member F21 is rotated in conjunction with the rotation of the arcuate gear F22, whereby the reel screen mechanism F1 is rotated around the rotation center axis, and the reel standby position and the reel exposure position are set. Will work between.

(Display unit A: Screen device C: Sensor mechanism)
As described above, the operation ranges of the front screen mechanism E1 and the reel screen mechanism F1 partially overlap each other (see FIGS. 17 and 18). The front screen mechanism E1 and the reel screen mechanism F1 are driven by different drive mechanisms E2 and F2, respectively. That is, the driving of the front screen mechanism E1 and the reel screen mechanism F1 is not linked (synchronized). Therefore, in order to prevent interference (contact) between the screen mechanisms E1 and F1, it is necessary to grasp the positions of the screen mechanisms E1 and F1. Therefore, in the present embodiment, the sub control board SS (see FIG. 34) grasps the position of the front screen mechanism E1 based on the number of steps of the drive motor E25 from the origin position with the front standby position as the origin position. ing. Similarly, the reel standby position is set as the origin position, and the position of the reel screen mechanism F1 is grasped based on the number of steps of the drive motor F24 from the origin position.

  However, if the operation of the front screen mechanism E1 or the reel screen mechanism F1 is not normally performed, or if the front screen mechanism E1 or the reel screen mechanism F1 is manually moved while the power is shut off, the sub-control board SS. Cannot grasp the exact positions of the front screen mechanism E1 and the reel screen mechanism F1. If the front screen mechanism E1 and the reel screen mechanism F1 are operated in such a situation, they may interfere with each other.

  Therefore, in the present embodiment, the screen device C includes a sensor mechanism (not shown) for detecting the positions of the front screen mechanism E1 and the reel screen mechanism F1. Then, the sub-control board SS performs a return operation for returning the screen mechanisms E1 and F1 to the origin position (standby position) based on the detection result from the sensor mechanism.

  For example, as described above, each of the front standby position and the reel standby position is arranged in the overlapping range in the operation range of the screen mechanisms E1 and F1, so when the front screen mechanism E1 is arranged in the front exposure position, The reel screen mechanism F1 is not disposed at the reel exposure position. For this reason, when the sensor mechanism detects that the front screen is present at the front exposed position, it indicates that the reel screen mechanism F1 is not present at the reel exposed position.

(Screen surface processing)
Next, screen surface processing will be described. A screen to be projected, such as a front reflecting portion D1, a right reflecting portion D2, a left reflecting portion D3, and a lower reflecting portion D4 of the fixed screen mechanism D, a projection surface E11a of the front screen member E11, and a projection surface F1a of the reel screen mechanism F1. In order to achieve an appropriate performance, graining is applied. The wrinkle processing is processing in which wrinkles (wrinkle patterns) are formed on the surface. The screen or the like to be projected is molded using a mold that has been subjected to a textured process, whereby a wrinkle pattern is formed on the surface of the screen or the like to be projected. Such a wrinkle pattern on the surface can effectively prevent the reflection of the light source, and can realize a good projection image.

  The texture processing includes a pattern called “pear texture”. In this embodiment, for example, a pear texture pattern having a mean depth of about 25 μm to 30 μm and a draft gradient of 3% or more (pear texture No. 5). Is preferred.

  Moreover, as surface processing of a screen etc., in order to implement | achieve moderate performance, 2 layer coating is given. Two-layer coating means that paints having different characteristics are applied to the top and bottom (in two layers). For example, a high-brightness paint having high reflectivity (for example, 2P-600 silver which is a “super bright silver” metal-like paint) is used for the undercoat, and a matte paint (for example, “matte” is used for the topcoat. HG-650 white) which is “white” can be used. Also, about 5% matting agent (silica) can be added to HG-650 white.

  In such coating, the film thickness of the top coat is, for example, 22 to 23 μm, and the film thickness of the undercoat is, for example, about 1 μm. By such coating, the glossiness at a gloss of 60 ° is 4 to 5.

  2P-600 Silver uses evaporated aluminum as the aluminum pigment, and the weight concentration (PWC) of the aluminum pigment in the coating is set to 20-30%, which is higher than that of general silver paint, and it has a higher gloss. Indicates the value (reflection performance). The composition of HG-650 white is 20-30% resin, 30-40% titanium oxide, 5-10% silica as a matting agent, 0.5-2% additive, and solvent. 30 to 40%.

  In addition, as a top coat paint, a paint in which glass or resin beads having various average particle diameters as a matting agent are added to HG-650 white in a predetermined ratio, or a paint in which silica is added to the beads is added. It can also be used. Also, HG-650F clear or a paint in which beads having various average particle diameters as a matting agent are added to the HG-650F clear in a predetermined ratio can be used. The film thickness can be variously adjusted, for example, up to 16 to 23 μm. The composition of HG-650F clear is 20-30% resin, 2-5% silica as matting agent, 0.5-2% additive, and 60-70% solvent.

  Further, as other undercoat paint, HG-650 white, or a paint obtained by adding glass-based or resin-based beads having various average particle diameters to the HG-650 white as a matting agent in a predetermined ratio can also be used. Also, the film thickness can be variously adjusted, for example, from 1 to 21 μm.

  As described above, by forming the screen to be projected by embossing or applying a two-layer coating, the reflection of the light source can be effectively prevented, and a better projection image can be displayed. Can be realized. Further, the above-described two-layer coating can be applied to a screen or an accessory that has been subjected to the texture processing. Moreover, although materials, such as a screen used as a projection object, are black or white ABS resin and transparent polycarbonate resin, for example, they are not restricted to these.

(Display Unit A: Irradiation Unit B: Electrical and Optical Configuration of Projector Device B2)
As shown in FIG. 21, the projector device B2 includes a projector control board B23, an optical mechanism B24, and a relay board CK as electrical components. A sub-control board SS, which will be described later, is connected to the projector device B2 via a relay board CK. Although not shown in FIG. 21, the relay substrate CK and the sub control substrate SS are connected via a scaler substrate SK (see FIGS. 37 and 43) described later. The sub-control board SS controls the projector control board B23 according to the screen or the effect operation of the accessory, and projects the irradiation light on the screen or the accessory via the optical mechanism B24 as a visual effect. Display video. Further, in the assembly process of the display unit A and the like, an adjustment PC (personal computer) 1000 is connected to the projector control board B23 (see FIGS. 30 and 37) of the projector device B2. The adjustment PC 1000 is used to adjust the position of irradiation light projected by the projector device B2 and to perform initial focus setting (details will be described later). In this embodiment, the adjustment PC 1000 is used as the adjustment device of the projector device B2. However, as the adjustment device of the projector device B2, a tablet PC or a so-called smartphone installed with an adjustment program (application software) is used. Alternatively, a dedicated terminal device may be used.

  The projector control board B 23 includes a control LSI 230, an EEPROM (registered trademark) 231, a DLP (registered trademark) control circuit 232, and an LED driver 233. As shown in FIG. 33, the optical mechanism B24 includes LED light sources 240R, 240G that emit light of R (red), G (green), and B (blue) as components disposed around the lens unit B21. 240B, DMD 241, and a focus mechanism 242 for performing focus adjustment on the projection lens 210 of the lens unit B21.

  The control LSI 230 controls the DLP control circuit 232 to project the irradiation light based on the command from the sub control board SS. The control LSI 230 controls the focus mechanism 242 and moves the projection lens 210 in the optical axis direction based on a command from the sub-control board SS, thereby performing focus adjustment when projecting the irradiation light. The EEPROM 231 stores data related to setting / adjustment of the projector device B2 by the control LSI 230. Although not particularly illustrated, the control LSI 230 includes a ROM in which a control program and the like are stored, and a DRAM that is used in a work area related to setting and adjustment of the projector apparatus B2.

  The DLP system of the projector apparatus B2 mainly includes a DLP control circuit 232, an LED driver 233, LED light sources 240R, 240G, 240B, and a DMD 241 of the optical mechanism B24.

  The DMD 241 is obtained by integrating mirrors corresponding to pixels according to display resolution on the main surface of a semiconductor chip. The DMD 241 is configured such that each mirror is inclined by + 10 ° or −10 ° around an axis along a diagonal line with respect to the main surface due to an electrostatic field effect of a memory element immediately below each mirror. With such a configuration, each mirror of the DMD 241 is switched between an ON state (a state in which light is reflected in a predetermined direction) and an OFF state (a state in which light is reflected outside a predetermined direction). That is, when each mirror of the DMD 241 is in an ON state, light incident from the LED light sources 240R, 240G, and 240B via a dichroic mirror (not shown) is again guided to the lens unit B21 via the dichroic mirror and the like. In the state, the light incident from the LED light sources 240R, 240G, and 240B through the dichroic mirror or the like is reflected toward the direction other than the lens unit B21.

  The DLP control circuit 232 controls the LED driver 233 that drives the LED light sources 240R, 240G, and 240B, and performs DMD 241 in a time-division manner on the RGB colors from the LED light sources 240R, 240G, and 240B via a dichroic mirror (not shown). To enter. At this time, the DLP control circuit 232 determines at which timing the mirror corresponding to which pixel is turned on or off according to the image to be projected. To determine whether the light is reflected in a predetermined direction, and the ON / OFF state of each mirror of the DMD 241 is controlled.

  Under such control of the DLP control circuit 232, the light reflected in the DMD 241 in a predetermined direction travels to the lens unit B21, passes through the projection lens 210, and enters the mirror mechanism B3. Finally, the light is reflected by the mirror mechanism B3. By being reflected, it is guided to the projection target. Thereby, irradiation light is projected with respect to the screen used as a projection target, and an accessory, and the image | video according to production is formed.

  In the present embodiment, the projector device B2 is configured as a so-called DLP projector. Further, the projector device B2 increases the projection distance to the projection target by turning back the irradiation light by the mirror mechanism B3, and makes the projection distance of the irradiation light as short as possible by setting the contrast ratio to 1000: 1, for example. ing. Thereby, the display unit A including the projector device B2 is configured to be cheaper and smaller, and is easily mounted in a limited space in the cabinet G of the gaming machine 1.

(Display unit A: Irradiation unit B: Mechanical configuration of projector device B2)
As shown in FIGS. 22 and 23, the projector apparatus B2 includes a case B22, a lens unit cover B222, an under cover B223, an upper pedestal B220, and a lower pedestal B221 as components constituting the exterior. A lens unit cover B222 is attached to the front opening B22k of the case B22. The under cover B223 is disposed on the lower surface of the case B22 so as to cover it. The under cover B223 is supported by the lower pedestal B221 via the stay B223a and is also fixed to an appropriate lower surface of the case B22. The projector device B2 is attached to the lower surface of the upper wall portion B12 (see FIG. 8) of the projector cover B1 via the upper pedestal B220 and the lower pedestal B221. In the present embodiment, the upper pedestal B220 is fixed to the lower surface of the upper wall B12, and the lower pedestal B221 is attached to the upper end of the case B22 so as to cover the upper surface opening of the case B22. Lower pedestal B221 is connected. The procedure for adjusting the attachment of the projector apparatus B2 will be described later.

  As shown in FIG. 23, FIG. 24, and FIG. 33, the projector apparatus B2 includes LED substrates 240Ra, 240Ga, 240Ba, and DMD 241 on which a lens unit B21, LED light sources 240R, 240G, and 240B are mounted as internal components. DMD board 241a, a plurality of heat sinks 243R, 243G, 243B, 243D, intake fans 244A (FAN1), 244B (FAN2), exhaust fans 245 (FAN3), and projector control board B23. The case B22 accommodates the lens unit B21 while the projection lens 210 of the lens unit B21 is covered by the lens unit cover B222, and also includes LED substrates 240Ra, 240Ga, 240Ba, a DMD substrate 241a, and a plurality of heat sinks 243R, 243G, 243B. , 243D, intake fans 244A and 244B, and exhaust fan 245 are accommodated. The projector control board B23 is fixed to the lower surface of the case B22. Although not particularly shown in FIG. 33 and the like, a temperature sensor B25 (see FIGS. 21 and 37) made of, for example, a thermistor is mounted on the LED substrates 240Ra, 240Ga, 240Ba and the DMD substrate 241a. These temperature sensors B25 detect temperatures near the LED light sources 240R, 240G, and 240B and the lens unit B21, and output a temperature detection signal to the projector control board B23.

  The lens unit B21 includes an optical case B21a that houses a dichroic mirror, a reflector, and the like (not shown), a lens group 210A that includes the projection lens 210, a lens holder B21b that is provided at the front of the optical case B21a while holding the lens group 210A, and A focus mechanism 242 provided on the front right side of the optical case B21a is provided so that a part of the lens holder B21b can be moved in the optical axis direction (front-rear direction). The optical case B21a is provided with openings that allow the LED light sources 240R, 240G, and 240B and the DMD 241 to face from the outside to the inside. The lens holder B21b has a rear portion fixed to the front portion of the optical case B21a, and the front portion is moved relative to the rear portion in the front-rear direction (optical axis direction) by the focus mechanism 242. The projection lens 210 is held. The lens unit B21 is provided with a so-called lens shift mechanism (not shown). By using this lens shift mechanism, the horizontal and vertical positions of the projected image can be finely adjusted. is there.

  The focus mechanism 242 is for focusing while changing the focal length of the projection lens 210 with respect to the reflection surfaces of the reflection portions D1 to D4 and the projection surfaces E11a and F1a that are displaced with respect to the projector device B2. The focus mechanism 242 is disposed along the optical axis direction of the projection lens 210 with a rack member 242A that can move integrally with the front portion of the lens holder B21b that holds the projection lens 210, and is screwed with the rack member 242A. The lead screw 242B is rotatable while being rotated, and the focus motor 242C is configured to rotate the lead screw 242B. The focus motor 242C is connected to the control LSI 230 of the projector control board B23.

  For example, when the focus motor 242C rotates the lead screw 242B in a predetermined direction, the rack member 242A moves to the front side by a feed screw operation, and the projection lens 210 moves to the front side together with the rack member 242A. Since the focal length is relatively long, the focal point (focus position) can be adjusted far away. On the other hand, when the focus motor 242C rotates the lead screw 242B in the direction opposite to the predetermined direction, the rack member 242A moves to the rear side by the feed screw operation, and the projection lens 210 is integrated with the rack member 242A. As a result of the movement, the focal point (focus position) is adjusted closer to a shorter focal length.

  According to such a focus mechanism 242, the focal length can be dynamically changed in conjunction with the movement of the projection planes E11a and F1a. For example, when the projection target is changed from the projection plane E11a to the projection plane F1a, or vice versa, the optical path length from the projection lens 210 to each projection target differs to some extent. The focal point (focus position) can be changed statically so as to have an appropriate focal length according to the length.

  The front portion of the lens holder B21b and the projection lens 210 are covered with a lens unit cover B222. The lens unit cover B222 is provided with a light-transmitting surface B222a that transmits the irradiation light from the projection lens 210, and the light emitted from the projection lens 210 passes through the light-transmitting surface B222a and proceeds to the mirror mechanism B3. .

  The LED board 240Ra is disposed adjacent to the right side of the rear portion of the optical case B21a in the case B22, and the LED light source 240R faces the inside of the optical case B21a. The LED substrate 240Ga is disposed in the case B22 so as to be adjacent to the back side of the rear portion of the optical case B21a, and the LED light source 240G faces the inside of the optical case B21a. The LED board 240Ba is disposed in the case B22 so as to be adjacent to the left side of the rear portion of the optical case B21a, and the LED light source 240B faces the inside of the optical case B21a. The DMD substrate 241a is disposed in the case B22 so as to be adjacent to the left side surface of the optical case B21a, and faces the DMD 241 inside the optical case B21a. Here, in the present embodiment, the LED light sources 240R, 240G, and 240B and the DMD 241 have heat generation characteristics that the LED light source 240G and the LED light source 240B tend to be relatively high, while the LED light sources 240R and the DMD 241 are relatively The trend is low.

  As shown in FIG. 24A, the focus mechanism 242 is disposed on the right side of the lens holder B21b, and the projection lens 210 is disposed on the front portion of the lens holder B21b. The front portion of the lens holder B <b> 21 b can be moved in the optical axis direction of the projection lens 210 by the focus mechanism 242. Although the details of the focus mechanism 242 are omitted, the focus mechanism 242 includes a stepping motor, a lead screw, a carriage, and the like, and is configured to be able to move the front portion of the lens holder B21b in the optical axis direction.

  In other words, the projection lens 210 is integrated with the front portion of the lens holder B21b and can be moved by the focus mechanism 242. As shown in FIG. 24A, the projection lens 210 moves from the rear side toward the front side along the optical axis direction. Or, it moves from the front side toward the rear side.

  As shown in FIG. 24A, light from the LED light sources 240R, 240G, and 240B reaches the DMD 241 via a collimator, a dichroic mirror, and the like (not shown), and is reflected by the DMD 241 and then the lens group 210A by the dichroic mirror and the like. And finally exits through the projection lens 210.

  As described above, the projection lens 210 is configured to move in the optical axis direction. As a result, focus adjustment is performed, and a clear and focused image is displayed on the screen or the accessory whose position has been changed by movement.

  Such a projector device B2 is controlled by the sub-control board SS so that video data relating to the video such as effects is transmitted from the sub-control board SS, and the video is projected onto a screen or an accessory. On the other hand, the sub-control board SS moves the screen mechanisms E1, F1 according to the contents of effects by controlling the screen drive mechanisms E2, F2.

  Here, the sub-control board SS controls the projector device B2 according to the movement of the screen mechanisms E1 and F1 due to the effect, and the projection surfaces E11a and F1a of the moved screen mechanisms E1 and F1 and the projection surface of the fixed screen mechanism D. The focus is adjusted so that the image is projected clearly.

  The heat sink 243R is disposed on the right side in the case B22, and is in partial contact with the back surface of the LED substrate 240Ra. The heat sink 243G is disposed on the rear side in the case B22, and is in partial contact with the back surface of the LED substrate 240Ga. The heat sink 243B is disposed at the center in the case B22 and partially contacts the back surface of the LED substrate 240Ba. The heat sink 243D is disposed on the left side in the case B22 and is in partial contact with the back surface of the DMD substrate 241a. Here, in this embodiment, the heat sinks 243R, 243G, 243B, and 243D have fin outer sizes that are relatively large for the heat sink 243R and the heat sink 243G, but relatively small for the heat sink 243B and the heat sink 243D. These heat sinks 243R, 243G, 243B, and 243D dissipate heat generated in each of the LED substrates 240Ra, 240Ga, 240Ba and the DMD substrate 241a into the air, so that the temperature of the optical element and the substrate is changed until the optical characteristics are largely changed. Dissipate heat efficiently so as not to raise the temperature. The heat sinks 243R, 243G, 243B, and 243D, which are heat radiating members, are made of an aluminum material having high heat conductivity in order to enhance the heat radiating effect, and have a plurality of heat radiating fins in order to increase the contact area with air.

  The intake fan 244A is disposed so as to be close to the back surface of the right front portion of the case B22, and is close to the heat sink 243R. The intake fan 244B is disposed so as to be close to the back surface of the left side portion of the case B22, and is close to the heat sink 243D. The exhaust fan 245 is disposed so as to be close to the back surface of the rear portion of the case B22, and is close to the heat sink 243G.

  Here, as shown in FIGS. 31 and 32, an intake port B22A is provided at the right front portion of the case B22 to which the intake fan 244A is adjacent, and the heat sink 243R is adjacent to the intake port B22A. An exhaust port B22E is provided at the right rear portion of the case B22. An intake port B22B is provided in a part of the left side of the case B22 close to the intake fan 244B, and the other part of the left side of the case B22 is arranged in the case B22 so as to be aligned with the intake port B22B. The air inlet B22C is provided so that the air reaches the three heat sinks 243G, 243B, 243D through the empty space S. An exhaust port B22D is provided at the rear of the case B22 where the exhaust fan 245 is close.

  That is, as shown in FIG. 33, in the case B22 of the projector B2, the air is forcibly sucked from the air inlet B22A by the air intake fan 244A and then exhausted from the air outlet B22E while taking heat from the heat sink 243R. An air flow path P1 is formed as an air flow. Further, in the case B22, after the air is forcibly sucked from the air inlet B22B by the air intake fan 244B, the heat is taken from the heat sink 243D, the heat sink 243B, and the heat sink 243G, and the air is forced from the air outlet B22D by the exhaust fan 45. An air flow path P2 is formed as a flow of air exhausted in the air. Further, in the case B22, an air flow path is a flow of air that is forcibly exhausted from the exhaust port B22D by the exhaust fan 45 while taking heat mainly from the heat sink 243G or the heat sink 243B after being sucked from the intake port B22C. P3 is formed.

  The projector control board B23 is attached to the lower surface of the case B22 while being covered with the under cover B223. A control LSI 230, an EEPROM 231, a DLP control circuit 232, an LED driver 233, and the like are mounted on the projector control board B23. The projector control board B23 is electrically connected to the LED boards 240Ra, 240Ga, 240Ba and the DMD board 241a arranged in the case B22, and the focus mechanism 242.

(Display unit A: Irradiation unit B: Position / attitude adjustment of projector device B2)
As shown in FIGS. 25 to 27, the upper pedestal B220 is a sheet metal member fixed to the upper wall portion B12 (see FIGS. 6 and 8) of the projector cover B1, and includes a rectangular main body portion 2200 and a main body portion 2200. The left end 2201a and the right end 2201b that are formed by bending the left and right sides downward and outward and have a step with the main body 2200 and partially extend from the rear side of the main body 2200 to the rear. And a rear end portion 2202 that extends. The main body 2200 and the rear end 2202 are provided with three connection holes 2200A for connecting the lower pedestal B221. These three connecting holes 2200 </ b> A are arranged so as not to be positioned on the same straight line in a plane (horizontal plane) along the main body 2200. Each of the left end portion 2201a and the right end portion 2201b is provided with a plurality of square holes 2201c for fixing to the lower surface of the upper wall portion B12 by screw fastening. In the present embodiment, three square holes 2201c are arranged at each of the left end portion 2201a and the right end portion 2201b, and are provided at equal intervals in the front-rear direction. The vertical and horizontal inner diameter dimensions of the square hole 2201c are larger than the screw shaft diameter of the mounting screw T (see FIG. 28) to be inserted and fastened.

  The lower pedestal B221 is a sheet metal member that substantially corresponds to the main body 2200 and the rear end 2202 of the upper pedestal B220. Three connecting screw portions 2210 are integrally formed on the lower base B221 so as to protrude upward corresponding to the three connecting holes 2200A. These three connecting screw portions 2210 are also arranged so as not to be located on the same straight line in a plane (horizontal plane) along the lower pedestal B221. The lower pedestal B 221 inserts the tip of the connecting screw portion 2210 into the connecting hole 2200A while externally fitting the coil spring 2211 to each of the connecting screw portions 2210, and sandwiches the coil spring 2211 between the main body portion 2200 and the rear end portion 2202. The nut 2213 is fastened from the upper surface side of the upper pedestal B220 to the tip of the connection screw portion 2210 via a washer 2212 while being in a state of being in a state of being connected to be suspended from the lower surface of the upper pedestal B220. Further, as shown in FIG. 23, the lower pedestal B221 is provided with a plurality of screw holes 2214 for screwing the case B22 and a plurality of screw holes 2215 for screwing the stay B 223a. The lower pedestal B221 is connected to the lower surface of the upper pedestal B220 while supporting the under cover B223 via the case B22 and the stay B223a.

  That is, as shown in FIGS. 23 and 25 to 27, the upper pedestal B220 and the lower pedestal B221 are connected to each other at three connecting portions R1, R2, and R3 so that their distances can be adjusted. Each of the connecting portions R1, R2, and R3 includes a connecting hole 2200A of the upper base B220, a connecting screw portion 2210 of the lower base B221, a coil spring 2211, a washer 2212, and a nut 2213.

  By using the upper pedestal B220 and the lower pedestal B221, the projector device B2 is attached to the upper wall portion B12 of the projector cover B1 so that the positioning and the optical axis can be adjusted.

  FIG. 28 shows an attachment form of the upper base B220 to the upper wall part B12 of the projector cover B1. The lower diagram of FIG. 28A is a diagram showing a state in which the mounting screw T is inserted and fastened into the square hole 2201c of the upper base B220, and the upper diagram of FIG. 28A is the diagram of FIG. 28A. It is sectional drawing which follows the BB 'line shown to the following figure. FIG. 28 shows the periphery of the square hole 2201c formed in the left end 2201a of the upper pedestal B220, but the periphery of the remaining square hole 2201c in the left end 2201a and the right end 2201b is the same.

  As shown in FIG. 28 (a), the mounting screw T is inserted into the square hole 2201c from below, and the mounting screw T is disposed at substantially the center of the square hole 2201c. The attachment screw T is screwed to a nut N located on the upper surface side of the upper wall portion B12 via a washer W arranged so as to follow the upper surface of the upper wall portion B12 and the lower surface of the left end portion 2201a. As a result, the left end 2201a of the upper base B220 is attached to the upper wall B12 of the projector cover B1 by screws. The right end 2201b of the upper base B220 is also attached to the upper wall B12 of the projector cover B1 by the same screwing.

  Here, the hatched portion indicated by the symbol A in FIG. 28A is a gap formed between the screw shaft of the mounting screw T and the square hole 2201c. In FIG. 28A, the screw shaft of the mounting screw T is disposed and fixed substantially at the center of the square hole 2201c. At this time, the screw shaft of the mounting screw T can be moved within the range (adjustment range) of the hatched portion indicated by the symbol A. That is, by finely adjusting the relative position of the mounting screw T to the square hole 2201c within the opening range of the square hole 2201c, the left end portion 2201a of the upper base B220 is positioned and adjusted with respect to the upper wall portion B12 of the projector cover B1. be able to. Similarly, the right end portion 2201b of the upper base B220 can be positioned and adjusted with respect to the upper wall portion B12 of the projector cover B1.

  FIG. 28B shows a state where the left end 2201a of the upper base B220 is shifted in the direction of arrow E with respect to FIG. The upper view of FIG. 28B is a cross-sectional view taken along the line D-D ′ shown in the lower view of FIG. In the state shown in FIG. 28 (b), the screw shaft of the mounting screw T is displaced relatively to the left in the opening range of the square hole 2201c, and is within the hatched portion range (adjustment range) indicated by symbol C. It is possible to move with.

  Thus, the upper base B220 is attached to the upper wall portion B12 of the projector cover B1 while being positioned and adjusted within a predetermined adjustment range that is the opening range of the square hole 2201c. That is, in the projector device B2, the mounting position with respect to the upper wall portion B12 is adjusted in the left-right direction and the front-back direction by the plurality of square holes 2201c provided in the left end portion 2201a and the right end portion 2201b of the upper base B220. As a result, the direction of light emitted from projector device B2 is easily adjusted as the reference direction so as to be perpendicular to the left-right direction and coincide with the front-rear direction.

  FIG. 29 shows a connection structure of the lower pedestal B221 with respect to the upper pedestal B220. FIG. 29 is a cross-sectional view showing a state where the lower pedestal B221 is connected to the upper pedestal B220 by the connection hole 2200A, the connection screw part 2210, the coil spring 2211, the washer 2212, and the nut 2213 in the connection part R2. In addition, although FIG. 29 shows one connection part R2, the other connection parts R1 and R3 are the same.

  The connection screw portion 2210 of the lower pedestal B221 is inserted into the connection hole 2200A from the lower surface side of the main body portion 2200 of the upper pedestal B220, and is screwed to the nut 2213 via a washer 2212 disposed on the upper surface side of the main body portion 2200. The A coil spring 2211 is externally fitted to the connecting screw portion 2210, and this coil spring 2211 is sandwiched between the lower surface of the main body 2200 and the upper surface of the lower pedestal B221 at the peripheral edge of the connecting hole 2200A. By such a coil spring 2211, the portion in the vicinity of the connecting portion R2 between the upper pedestal B220 and the lower pedestal B221 is urged in the direction away from each other (vertical direction). It is possible to prevent loosening at the joint portion.

  In such a connecting portion R2, the distance between the upper pedestal B220 and the lower pedestal B221 is changed while being biased by the coil spring 2211 by appropriately turning the nut 2213 in the tightening direction or the loosening direction. Specifically, when the nut 2213 is turned in the tightening direction, the distance between the upper pedestal B220 and the lower pedestal B221 in the connection R2 is reduced. At this time, the upper pedestal B220 is fixed to an upper wall B12 (not shown in FIG. 29). Therefore, the portion near the connecting portion R2 of the lower pedestal B221 is displaced in a direction approaching the upper pedestal B220 by appropriately tightening the nut 2213, and the height position is adjusted to a higher position. On the other hand, when the nut 2213 is turned in the loosening direction, the distance between the upper pedestal B220 and the lower pedestal B221 in the connection R2 is increased. That is, the portion near the connecting portion R2 of the lower pedestal B221 is displaced in a direction away from the upper pedestal B220 by appropriately loosening the nut 2213, and the height position is adjusted to a lower level.

  Also in the other connecting portions R1, R3, the height position of the lower pedestal B221 near the connecting portions R1, R3 can be easily adjusted by appropriately adjusting the tightening amount of the nut 2213 in the same manner as described above. Specifically, such connecting portions R1, R2, and R3 are not connected to the same straight line in the plane (horizontal plane) along the upper pedestal B220 and the lower pedestal B221. Specifically, the lines connected to each other form a triangle. Are arranged as follows. That is, since the lower pedestal B221 can finely adjust the height position by the tightening amount of the nut 2213 in each of the three connecting portions R1, R2, and R3, the posture of the lower pedestal B221 is changed in the front-rear direction, The degree of inclination in the three-dimensional space can be adjusted with respect to any of the horizontal direction and the vertical direction.

  Such posture adjustment of the lower pedestal B221 is performed while irradiating light to the screen or the like from the projector device B2 supported by the lower pedestal B221. At that time, an image is projected onto the screen or the like by the irradiation light, and the posture of the lower pedestal B221 is adjusted while confirming the image. Thereby, the optical axis direction of the light irradiated from projector apparatus B2 is adjusted so that an image is projected in an appropriate display mode on the surface of a screen or the like. That is, the optical axis direction can be adjusted in advance so that a so-called trapezoidal distortion or the like does not occur as an image display mode by adjusting the posture of the lower pedestal B221.

  As shown in FIG. 30, the adjustment in the optical axis direction and the like is performed using an adjustment PC 1000 connected to the projector apparatus B2 via the sub control board SS or the like. The projector device B2 attached to the upper wall portion B12 via the upper pedestal B220 and the lower pedestal B221 is not only adjusted in the optical axis direction but also displayed on the screen and the like during inspection at the factory. Various adjustments necessary for projecting and displaying the video are performed. The adjustment PC 1000 is temporarily connected to the projector control board B23 of the projector device B2 during the adjustment work (see FIG. 37). When the adjustment PC 1000 is operated, optical parameters relating to the projection position of the irradiation light, the focus adjustment, and the like in the projector apparatus B2 are changed by a predetermined command transmitted from the adjustment PC 1000. The projection position and the optical parameters appropriately adjusted in this way are the horizontal direction, vertical direction and focus position adjustment value data (horizontal direction position A to E adjustment value, vertical direction position A to E adjustment value, focus position A. To E adjustment value) are stored in the EEPROM 231 of the projector control board B23 (see FIG. 106). When the adjustment value data of the horizontal direction, the vertical direction, and the focus position stored in the EEPROM 231 is not supplied with power to the projector device B2 for transportation after factory shipment, and the gaming machine 1 is installed in the game hall But it can be used as is. Such horizontal position adjustment data and vertical adjustment data are acquired to control the lens shift mechanism of the lens unit B 21, and focus position adjustment value data is acquired to control the focus mechanism 242. . Note that the horizontal position A to E adjustment value, the vertical position A to E adjustment value, the focus position A to E adjustment value, the horizontal position A to E offset, the vertical position A to E offset, and the focus position described later. As for “A to E” of the A to E offset and the focus drift correction values A to E, for example, “A” is the projection surface of the fixed screen mechanism D, “B” is the projection surface E11a of the front screen member E11, and “C”. Corresponds to the adjustment value data corresponding to the projection surface F1a of the reel screen mechanism F1, and “D” and “E” are reserved in consideration of future expandability (when the number of projection surfaces increases). .

  As is apparent from the above description with reference to FIGS. 28 to 30, the projector device B <b> 2 is positioned in the left-right direction and the front-rear direction mainly according to the mounting position of the upper base B <b> 220 with respect to the upper wall B <b> 12, The optical axis direction is adjusted according to the posture of the side base B221 in the three-dimensional space.

  In the present embodiment, the connecting portions for connecting the upper pedestal B220 and the lower pedestal B221 to each other are provided at three locations. However, if the condition that at least three locations are not on the same straight line is satisfied, four locations are provided. You may make it provide a connection part above. Further, in this embodiment, the connection hole 2200A is provided in the upper pedestal B220 and the connection screw part 2210 is provided in the lower pedestal B221. However, these connection holes and connection screw parts may be provided upside down. The connecting screw portion is not limited to the one integrally formed with the pedestal as in the present embodiment, but may be any one that can be fixed to one pedestal. For example, the connecting screw portion may be a bolt that penetrates and is fixed through the lower pedestal.

(Display unit A: Irradiation unit B: Intake / exhaust structure of projector device B2)
As shown in FIGS. 31 to 33, the case B22 of the projector apparatus B2 is provided with three intake ports B22A, B22B, and B22C and two exhaust ports B22D and B22E. Of the three intake ports B22A, B22B, B22C, two intake ports B22A, B22B are provided with intake fans 244A, 244B, while one intake port B22C is not provided with an intake fan. Of the two exhaust ports B22D and B22E, one exhaust port B22D is provided with an exhaust fan 245, while the other exhaust port B22E is not provided with an exhaust fan.

  At the air inlet B22A, air is forcibly taken into the case B22 by the air intake fan 244A, and this air flow passes through the heat sink 243R as the air flow path P1, thereby depriving the heat sink 243R of heat. Thereafter, the air flow path P1 linearly flows from the heat sink 243R to the exhaust port B22E, and is naturally discharged (heat exhausted) from the exhaust port B22E to the outside of the case B22.

  Also at the air inlet B22B, air is forcibly taken into the case B22 by the air intake fan 244B. The air flow passes through the plurality of heat sinks 243D, 243B, and 243G while passing through a part of the empty space S as the air flow path P2, thereby depriving the heat sinks 243D, 243B, and 243G of heat. Thereafter, the air flow path P2 is drawn into the exhaust fan 245 so as to bend toward the exhaust port B22D, and is forcibly exhausted (exhaust heat) from the exhaust port B22D to the outside of the case B22.

  At the air inlet B22C, air is forcibly taken into the case B22 mainly by the drawing force of the exhaust fan 245. This air flow takes heat from the plurality of heat sinks 243B and 243G by passing mainly through the heat sinks 243B and 243G while passing through a considerable portion of the empty space S as the air flow path P3. Thereafter, the air flow path P3 is also drawn into the exhaust fan 245 so as to bend toward the exhaust port B22D, and is forcedly discharged from the exhaust port B22D to the outside of the case B22 while joining the air flow path P2. (Exhaust heat). The intake fans 244A and 244B and the exhaust fan 245 function as a cooling device for the projector apparatus B2.

  In the present embodiment, as described above, the LED light sources 240G and 240B exhibit relatively high heat generation characteristics, while the LED light sources 240R and DMD 241 exhibit relatively low heat generation characteristics. LED substrates 240Ga and 240Ba on which LED light sources 240G and 240B having high heat generation characteristics are mounted are in thermal contact with heat sinks 243G and 243B through which the plurality of air flow paths P2 and P3 pass.

  Here, the plurality of air flow paths P2 and P3 join together at one exhaust port B22D while flowing in from different intake ports B22B and B22C, and flow out from the exhaust port B22D using the exhaust port B22D as a common vent. It has become. As a result, the plurality of air flow paths P2 and P3 are forced to be discharged while being merged, so that a smooth flow can be obtained and the heat sinks 243G and 243B can be efficiently deprived of heat and cooled. .

  Further, since the plurality of air flow paths P2 and P3 are efficiently and forcibly exhausted by the exhaust fan 245, it is possible to effectively collect heat from the plurality of optical elements such as the LED light sources 240G and 240B and the DMD 241 in the projector device B2. Therefore, overheating of optical components such as lenses can be prevented.

  Furthermore, since three more heat sinks 243D, 243B, 243G are cooled by two air flow paths P2, P3 leading to one exhaust port B22D, they are provided corresponding to these heat sinks 243D, 243B, 243G. A plurality of optical elements such as the DMD 241 and the LED light sources 240B and 240G can be cooled more efficiently.

  In the present embodiment, the two air flow paths P2 and P3 are merged at one exhaust port 245. For example, three or more air flow paths P1 are merged at the exhaust port 245. These air flow paths may be collectively discharged from one exhaust port.

(Cabinet G)
As shown in FIG. 34, a display unit A is provided in the upper space of the cabinet G. Further, a power supply device DE and a hopper mechanism HP are provided at the bottom of the lower space of the cabinet G, and the sub-control board SS is provided on the back side (the back wall G3 side of the cabinet G) of the power supply device DE and the hopper mechanism HP. Is provided. That is, the hopper mechanism HP is disposed on the front side of the sub control board SS. A sheet metal BK is installed between the hopper mechanism HP and the sub control board SS. In addition, a sub-relay substrate SN is provided between the sub-control substrate SS and the intermediate support plate G1. Above the hopper mechanism HP, a medal replenishment mechanism MH (corresponding to a replenishment port) for replenishing metal medals from the outside is provided, and medals are dropped from the medal replenishment mechanism MH to the hopper mechanism HP. A scaler substrate SK for connecting the projector device B2, the sub liquid crystal display device DD19, and the touch panel DD19T to the sub control substrate SS is provided above the medal supply mechanism MH.

  In the present embodiment, the sheet metal BK is not in contact with the sub control board SS. The sheet metal BK may be directly attached to the bottom of the sub control board SS. Further, the thin sub-relay substrate SN that is detachably attached to the lower surface of the intermediate support plate G1 and the thin sub-control substrate SS that is detachably attached to the back wall G3 of the cabinet G are shown in side view. It is arranged in a state that the L-shape is turned upside down.

  According to the above configuration, since the sheet metal BK is provided between the sub control board SS and the hopper mechanism HP, even if a medal is dropped on the hopper mechanism HP and jumps out to the sub control board SS side, It is possible to prevent the medal from physically contacting the sub control board SS. Further, since the sheet metal BK is provided between the sub-control board SS and the hopper mechanism HP, the influence of radiation (electromagnetic field) due to contact between metal medals in the hopper mechanism HP can be prevented by the sheet metal BK. Further, since the sub control board SS is provided on the back side of the lower space of the cabinet G and is sandwiched between the back wall G3 and the sheet metal BK, the sub control board SS is removed from the cabinet G unless the sheet metal BK is removed. I can't. This enhances the security for the sub control board SS.

(Lower door mechanism DD: Lower door lock mechanism G51)
As shown in FIG. 35, the lower door locking mechanism G51 includes a locked portion G511 fixed to the right end portion of the back wall of the lower door mechanism DD, a locking portion G512 fixed to the right end portion of the cabinet G, Cylinder lock G513.

  The locked portion G511 has two rods to be locked G511a and G511b formed on both ends of a concave frame G511c at the upper and lower portions.

  The locking portion G512 has a long cylinder G5122, and a long locking plate G5121 that is slidably disposed in the vertical direction in the cylinder G5122.

  The locking plate G5121 has claw-shaped claw portions G5121a and G5121b that are locked to the locked rods G511a and G511b. The claw portions G5121a and G5121b are locked bars inserted into the openings G5122a and G5122b provided in the tube G5122 by sliding up and down in the tube G5122 along with the sliding of the locking plate G5121. Locking with respect to G511a and G511b, or locking is released. The locking plate G5121 has a spring that is biased upward.

  The claw portions G5121a and G5121b are locked with respect to the locked rods G511a and G511b when the locking plate G5121 is at a height position for locking the lower door mechanism DD, while the locking plate G5121 is locked with the lower door mechanism DD. It is set so that the locking to the locked rods G511a and G511b is released when it is lowered from the height position where the lock is released to the height position where the lock is released. Further, the claw portions G5121a and G5121b have tip surfaces inclined obliquely downward, and are pushed down by contact with the locked rods G511a and G511b.

  Although not shown in the drawing, the locking portion G512 has a lowering portion in the middle. The pulling portion enables the locking plate G5121 to be pulled downward as a key is inserted into the cylinder lock G513 and rotated. As a result, when the locking plate G5121 is lowered, the locking between the claw portions G5121a and G5121b and the locked rods G511a and G511b can be released. The lower door mechanism DD is provided with a door relay board DS for connecting electronic components and the like on the door side and the cabinet G side.

(Upper door mechanism DU: Upper door lock mechanism G52)
As shown in FIG. 35, the upper door lock mechanism G52 includes a locked portion G521 fixed to the right end portion of the back wall of the upper door mechanism DU and a lock portion G522 fixed to the right end portion of the cabinet G. Have.

  The locked portion G521 has two rods to be locked G521a and G521b formed on both ends of a concave frame G521c at the upper and lower portions.

  The locking portion G522 has a long cylinder G5222 and a long locking plate G5221 that is slidably disposed in the vertical direction in the cylinder G5222.

  The locking plate G5221 has claw-shaped claw portions G5221a and G5221b that are locked to the locked rods G521a and G521b. The claw portions G5221a and G5221b are locked rods inserted into the openings G5222a and G5222b provided in the tube G5222 by sliding up and down in the tube G5222 along with the sliding of the locking plate G5221. The locking is performed with respect to G521a and G521b, and the locking is released.

  The claw portions G5221a and G5221b are locked to the locked rods G521a and G521b when the locking plate G5221 is at a height position where the upper door mechanism DU is locked, while the locking plate G5221 is locked to the upper door mechanism DU. Is set so that the locking to the locked rods G521a and G521b is released when the lock is lowered from the height position where the lock is released to the height position where the lock is released. Further, the claw portions G5221a and G5221b are inclined at the tip end surfaces in a diagonally downward direction, and are pushed down by contact with the locked rods G521a and G521b.

  An opening (not shown) is formed in the cylinder G5222 of the locking portion G522 below the upper door mechanism DU, and a protrusion (not shown) provided on the locking plate G5221 passes through the opening. It protrudes to the inside of the cabinet G. By pulling the projection downward, the locking plate G5221 is lowered, and accordingly, the locking between the claw portions G5221a and G5221b and the locked rods G521a and G521b can be released.

  Here, the protruding portion is slid upward, and is disposed so as to contact the upper portion of the lower door mechanism DD when the locking plate G5221 is in a height position for locking the upper door mechanism DU.

  According to the above configuration, in a state where the lower door mechanism DD is closed, the upper portion of the lower door mechanism DD physically interferes with the protruding portion, thereby preventing the locking plate G5221 from sliding, and the claw portion G5221a. , G5221b and the locked rods G521a and G521b cannot be released, and the upper door mechanism DU can be locked so that it cannot be opened.

  On the other hand, when the lower door mechanism DD is open, physical interference with the protrusions on the upper portion of the lower door mechanism DD is released, so that the locking plate G5221 can slide in the cylinder G5222 and the claw portion G5221a. , G5221b can be unlocked from the locked bars G521a and G521b, and the upper door mechanism DU can be unlocked from the cabinet G.

  Thereby, in order to unlock the upper door mechanism DU, the lower door mechanism DD needs to be unlocked first by the lower door lock mechanism G51. That is, in order to open the upper door mechanism DU, the lock release operation is performed on the lower door lock mechanism G51, and after the lower door mechanism DD is opened, the lock release operation on the upper door lock mechanism G52 is required. Security for the upper space of the cabinet G can be increased. In addition, the upper space of the cabinet G can be more secure than the lower space of the cabinet G, and the lower space of the cabinet G can be accessed more smoothly than the upper space of the cabinet G. Can be a place.

  In order to unlock the lower door mechanism DD, it is necessary to unlock the cylinder lock G513 with a key. The manager of the gaming machine 1 has an advantage that the key is easy to manage because it is compact and suitable for carrying.

  Further, by the sliding of the locking plate G5221, the claw portions G5221a and G5221b are hooked on the locked bars G521a and G521b, or the hooks are released. Accordingly, the upper space of the cabinet G of the upper door mechanism DU can be locked in conjunction with the sliding of the locking plate G5221.

  Further, the upper door lock mechanism G52 is provided at the end opposite to the end portion that is pivotally supported, and is disposed on the side where the upper door mechanism DU is opened and closed, so that the upper door lock mechanism G52 is unlocked. Therefore, it is not necessary to open the lower door mechanism DD greatly. Thereby, in order to unlock the upper door mechanism DU, the lower space of the cabinet G is not unnecessarily exposed to the outside, and security can be improved.

  In the present embodiment, a one-way hinge that applies a predetermined torque in the direction in which the lower door mechanism DD is closed is employed between the lower door mechanism DD and the cabinet G. Thereby, when closing the lower door mechanism DD, torque is applied and the lower door mechanism DD can be quietly closed with respect to the cabinet G without applying a sudden load. Thereby, it is possible to prevent a sudden load from being applied to the protrusion B131 physically interfered by the lower door mechanism DD.

(Relationship between lower door DD1, reel unit RU, and main control board MS)
As shown in FIG. 36, the lower door mechanism DD of the gaming machine 1 includes a lower door DD1, a reel unit RU, and a main control board MS.

  The lower door DD1 is provided so as to be openable and closable with respect to the cabinet G (corresponding to a casing). As shown in FIG. 36, the reel unit RU is detachably provided on the back side of the lower door DD1 (inside the cabinet G (lower space side)). In addition to the reels RL, RC, RR, the reel unit RU is provided with a reel drive substrate RD for controlling the reel motor. The main control board MS is detachably provided on the back side of the reel unit RU (inside the cabinet G (lower space side)).

  The main control board MS rotates the reels RL, RC, RR of the reel unit RU based on command signals output from the start lever DD6 and stop buttons DD7L, DD7C, DD7R (see FIG. 3). By stopping, the symbols arranged on the reels RL, RC, RR are stopped and displayed.

  By integrating the lower door DD1, the reel unit RU, and the main control board MS according to the positional relationship of the lower door DD1, the reel unit RU, and the main control board MS as described above, the gaming machine 1 Can be easily performed when assembling, exchanging and disassembling parts.

  Further, the main control board MS is an important configuration for controlling the game, and measures to prevent unauthorized removal are necessary. However, since the main control board MS is integrated with the reel unit RU, the main control board MS is removed. Can be difficult.

  The main control board MS is provided on the back surface of the reel unit RU provided on the inner side of the lower door DD1. Accordingly, the main control board MS can be disposed on the back side of the cabinet G far from the lower door DD1 by the thickness of the lower door DD1 and the reel unit RU. For this reason, a physical distance can be ensured between the lower door DD1 and the main control board MS, and even if it is illegally intruded through the gap of the lower door DD1, it reaches the main control board MS. It becomes difficult to improve security.

  Further, since the lower door DD1, the reel unit RU, and the main control board MS are integrated, when changing the specifications of the gaming machine 1, the exterior of the lower door DD1 is changed, and the reel design of the reel unit RU is changed. Changes and game contents can be changed together.

(System configuration of gaming machine 1)
As shown in FIG. 37, the gaming machine 1 includes, as main boards included in the system, a main control board MS, a sub control board SS, a reel drive board RD, a door relay board DS, a sub relay board SN, a scaler board SK, A projector control board B23, a sub liquid crystal I / F board SL, and a screen drive control board CS are provided. Power is supplied to the main control board MS, the sub control board SS, and the like from the power supply board DE1 of the power supply device DE when the power switch DE2 is on. Further, the gaming machine 1 includes a 7-segment display 30 for digital display, an external concentration terminal board 31 for connecting an external display and the like, a graphic board 40, as well-known components other than those described above included in the system. Sub RAM board 41, sub ROM board 42, selector 50 for medal identification, door open / close monitoring switch 51, BET switch 52, checkout switch 53, start switch 54, stop switch board 55, key switch 56 for setting, LED board 60 The LED group 61 for effects and decoration, the speaker group 62 for effects, the 24h door monitoring unit 63, and the door monitoring switch 64 are provided. Description of these known components is omitted.

  A general harness and an optical fiber cable are used for connection of each board | substrate. For example, the main control board MS is connected to these boards and the like via the harness H so as to output a control signal in one direction to each of the reel drive board RD and the 7-segment display 30. The reel drive substrate RD is connected to the door relay substrate DS via the first optical fiber cable FC1 so as to optically transmit various signals in one direction to the door relay substrate DS. The door relay board DS is connected to the main control board MS via the second optical fiber cable FC2 so as to optically transmit various signals in one direction to the main control board MS. As a result, the main control board MS, the reel drive board RD, and the door relay board DS are loop-connected through the harness H and the optical fiber cables FC1 and FC2 so as to transmit a command or the like only in one direction. The sub relay board SN is connected to a security IC 306 (not shown) of the main control board MS via an optical fiber cable (not shown), and the external concentrated terminal board 31 is connected to a security IC 307 (not shown) of the main control board MS. ) Is connected through. The security ICs 306 and 307 of the main control board MS conceal communication data by, for example, encrypting a plain text transmission command by the AES method.

  The main control board MS is a board for controlling the main game operation of the gaming machine 1. As shown in FIG. 38, the main control board MS has a main CPU 300, a main RAM 301, a main ROM 302, a clock pulse generation circuit 303, a frequency divider 304, a master I / O communication LSI 305, and security ICs 306 and 307. For example, the main CPU 300 transmits a command for controlling the reel rotation operation and the medal payout operation to the reel drive board RD through the I / O communication LSI 305. Further, the main CPU 300 optically receives signals from various switches (50 to 56) connected to the door relay board DS through the I / O communication LSI 305 and performs predetermined processing based on these signals. . Specific processing of the main control board MS (main CPU 300) will be described later.

  The sub-control board SS is a board for mainly controlling effects accompanying the game of the gaming machine 1. The sub control board SS is connected to the sub relay board SN via a connector (BtoB: board-to-board), and the sub relay board SN and the scaler board SK are connected to each other via a harness H. Various signals are exchanged in both directions.

  As shown in FIG. 39, the sub control board SS has a sub CPU 400, an SRAM (Static Random Access Memory) 401 having a backup function, and a real time clock (RTC: Real Time Clock) 402 which is a date and time measuring circuit. As possible expansion cards, a graphic board 40, a sub RAM board 41, and a sub ROM board 42 are mounted by bus connection. The graphic board 40 includes a GPU (Graphics Processing Unit) 440 and a VRAM (Video Memory) 441. For example, the sub CPU 400 transmits a signal for displacing the projection surfaces E11a and F1a to the front screen drive mechanism E2 and the reel screen drive mechanism F2 through the sub relay substrate SN and the screen drive control substrate CS (see FIG. 42). . Further, the sub CPU 400 transmits a video signal for causing the projector device B2, the sub liquid crystal display device DD19, and the like to display an image to the projector control board B23 and the sub liquid crystal I / F board SL through the scaler board SK (FIG. 43). reference). Specific processing of such a sub control board SS (sub CPU 400) will be described later.

  The reel drive substrate RD is a substrate for controlling the rotation operation of the reels RL, RC, RR in the reel unit RU and controlling the medal payout operation by the hopper mechanism HP. As shown in FIG. 40, the reel drive board RD includes an I / O communication LSI 310, a reel motor driver 311, and a hopper motor driver 312 that are slaves to the I / O communication LSI 305 that is the master of the main control board MS. For example, the I / O communication LSI 305 receives a payout signal from the hopper mechanism HP, a detection signal from the medal replenishment mechanism switch MHS that detects the drop of the medal into the hopper mechanism HP, a signal from the reel unit RU that indicates the reel rotation state, and the like. Are converted into optical signals according to a predetermined optical communication system, and these optical signals are transmitted to the main control board MS via the first optical fiber cable FC1 and the door relay board DS. Further, the I / O communication LSI 305 inputs control signals for instructing start / stop of reel rotation, payout of medals, etc. from the main control board MS via the harness H, and receives control signals corresponding to these control signals. Then, the data is output to the reel unit RU and the hopper mechanism HP through the reel motor driver 311 and the hopper motor driver 312. As described above, the main control board MS outputs a control signal based on an electrical signal, and the input to the main control board MS is performed by communication via the optical fiber cables FC1 and FC2. This is because there is a problem of quick response with the hopper mechanism HP (transmission time problem due to command transmission). In short, the main control board M and the reel drive board RD are not connected via an optical fiber cable so as not to cause a significant shift in the symbol stop position due to a delay when the reel is stopped after the stop button is pressed, for example. It is like that.

  The door relay board DS relays various signals in one direction from the reel drive board RD and various switches (50 to 56) provided on the door side to the main control board MS provided on the cabinet G side. It is a substrate. As shown in FIG. 41, the door relay board DS includes an I / O communication LSI 500 serving as a slave and an external input driver 501 with respect to the I / O communication LSI 305 serving as a master of the main control board MS. For example, the I / O communication LSI 500 receives signals from various switches and the like (50 to 56) through the external input driver 501, converts them into optical signals according to a predetermined optical communication method, and converts these optical signals. The data is transmitted to the main control board MS via the second optical fiber cable FC2. The I / O communication LSI 500 also receives a signal from the reel driver board RD, converts it to an optical signal according to a predetermined optical communication system, and converts this optical signal to the main control board via the second optical fiber cable FC2. Send to MS.

  The sub-relay board SN is a board for mainly relaying commands from the main control board MS to the sub-control board SS and relaying various signals between the production mechanism and the sub-control board SS. . As shown in FIG. 42, the sub relay board SN includes a security IC 600, a sound IC 601, a digital amplifier 602, and an I2C controller 603. For example, the sub relay board SN transmits the video signal from the sub control board SS to the scaler board SK as a bypass signal, and transmits the screen drive signal from the sub control board SS via the I2C controller 603 to the screen drive control board CS. And the detection signal of the door monitoring switch 64 is exchanged with the door monitoring unit 63 for 24 hours. The security IC 600 receives a security command (such as various commands from the encrypted main control board MS) from the main control board MS and converts the security command into plain text (decrypts the encrypted command). Transmit to the sub control board SS. The sound IC 601 receives an effect sound signal from the sub-control board SS, and transmits a signal corresponding to the sound signal to the speaker group 62 through the digital amplifier 602. The I2C controller 603 receives a lighting signal for production from the sub control board SS, transmits a signal corresponding to the lighting signal to the LED board 60, and between the sub control board SS and the screen drive control board CS. Exchange control signals and sensor signals.

  The scaler substrate SK mainly receives a video signal for production from the sub control substrate SS, divides the video signal, generates video signals corresponding to a plurality of video display numbers, and outputs these video signals to the projector device B2. And a substrate for transmitting to the sub liquid crystal display device DD19. As shown in FIG. 43, the scaler substrate SK includes an MCU (Micro Control Unit) (control LSI) 700, a multi-output scaler LSI (also referred to as resolution conversion LSI) 710, a V-by-one (registered trademark) HS transmitter 711, And SDRAM (DDR SDRAM / DDR2 SDRAM / DDR3 SDRAM, etc.) 712. The MCU 700 is connected to the sub-relay board SN and the multi-output scaler LSI 710, and to the sub liquid crystal I / F board SL and the projector control board B23. The multi-output scaler LSI 710 is connected to the sub control board SS as an input source, and is also connected to the MCU 700, the V-by-oneHS transmitter 711, the SDRAM 712, and the projector control board B23. The V-by-one HS transmitter 711 is connected to the sub liquid crystal I / F substrate SL as an output destination.

  As shown in FIG. 44, the multi-output scaler LSI 710 constitutes an MCU interface (for example, PCI Express) 800 and SDRAM interface (for example, PCI Express) 820 and a resolution conversion output block connected to the MCU 700 and SDRAM 712 (not shown). , Multiple select areas A to D801 to 804, LVDS (Low Voltage Differential Signaling) (1), (2) 811 and 812 as a differential interface, LVTTL (Low Voltage Transistor Transistor Transistor LV) as an input / output interface (1), (2) 813, 814, and DSF (Dub) constituting the video division block Having e Scaling Filter) (α) 821, DSF (β) 822.

  The multi-output scaler LSI 710 divides and converts the resolution of, for example, an LVDS signal as a video signal and outputs it. Specifically, the multi-output scaler LSI 710 divides a pair of LVDS signals (LDVS Dual: InPutA, InPutB) by differential transmission from the sub control board SS into two by DSF (α) 821 and DSF (β) 822, Further, each of the four select areas A to D801 to 804 is converted into a predetermined resolution. Thereafter, the multi-output scaler LSI 710 mainly outputs an LVDS signal for projector display (single signals of LVDS1 and LVDS2) through LVDS (1), (2) 811 and 812, and LVTTL (1), (2) 813. , 814, LVTTL signals (LVTTL1 and LVTTL2 RGB signals) for sub liquid crystal display are output. The LVDS signal output from the multi-output scaler LSI 710 is transmitted to the projector control board B23 directly or through the MCU 700, and the LVTTL signal is transmitted to the sub liquid crystal I / F board SL through the V-by-one HS transmitter 711 or the MCU 700. Is done. Specific processing of such a scaler substrate SK (MCU 700, multi-output scaler LSI 710) will be described later.

  The sub liquid crystal I / F substrate SL mainly relays the video signal (LVTTL signal) from the scaler substrate SK to the sub liquid crystal display device DD19, and between the sub control substrate SS and the touch panel DD19T via the scaler substrate SK. It is a substrate for relaying various signals. As shown in FIG. 45, the sub liquid crystal I / F substrate SL includes an MCU 900, a V-by-one HS receiver 901, a liquid crystal driver IC 902, and an LED driver IC 903. For example, the sub liquid crystal I / F substrate SL receives the video signal from the scaler substrate SK by the V-by-one HS receiver 901 and the MCU 900, and the liquid crystal driver IC 902 receives a control signal for driving the liquid crystal based on the video signal. The LED driver IC 903 transmits a control signal for driving the liquid crystal display backlight to the sub liquid crystal display device DD19. Thereby, in the sub liquid crystal display device DD19, an image is displayed at a predetermined resolution based on the image signal. Further, the MCU 900 receives an operation signal from the touch panel DD19T, and transmits a signal corresponding to the operation signal to the sub-control board SS via the scaler board SK. Thereby, the sub CPU 400 of the sub control board SS recognizes the input operation corresponding to the operation signal from the touch panel DD19T. Although not particularly illustrated, the sub liquid crystal display device DD19 incorporates a temperature sensor such as a thermistor, and a temperature detection signal from the temperature sensor is transmitted to the sub liquid crystal I / F substrate SL, so that the sub liquid crystal is displayed. The MCU 900 of the I / F board SL can recognize the temperature during operation. Specific processing of the sub liquid crystal I / F substrate SL (MCU 900) will be described later. Specific processing of the projector control board B23 (control LSI 230) shown in FIG. 21 will also be described later.

(Video split display pattern)
In the present embodiment, the sub-control board SS and the sub-control board SS are formed so as to form a divided display pattern as shown in FIG. 46 when the sub liquid crystal display device DD19 displays an effect image or when performing optical adjustment of the projector device B2. The scaler substrate SK performs signal processing to display an image. That is, as shown in FIG. 46, the sub-control board SS has video data for projector display (data block indicated by “α” with a resolution of 1280 × 800) and video data for sub-liquid crystal display (with a resolution of 480 × 800). LVDS dual-in signal composed of one synthesized signal is transmitted to the scaler substrate SK.

  The scaler substrate SK generates two video data α, β from the LVDS dual-in signal by the DSF (α), (β) 821, 822 of the multi-output scaler LSI 710, and SDRAM 712 by buffering these video data α, β. Temporarily store. The video data α and β are developed in the memory space of the SDRAM 712 in an array image as shown on the left side of FIG.

  Thereafter, the MCU 700 of the scaler substrate SK converts the video data α read from the SDRAM 712 into an LVDS1 signal for display on the projector (video signal indicated by “A” with a resolution of 1280 × 800) through the select area A801 and LVDS (1) 811. Then, the LVDS1 signal A is transmitted to the projector control board B23. At the same time, the MCU 700 converts the video data β read from the SDRAM 712 into an LVTTL1 signal (video signal indicated by “C” of resolution 480 × 800) for sub liquid crystal display through the select area C803 and LVTTL (1) 813. The LVTTL1 signal C is transmitted to the sub liquid crystal I / F substrate SL through the V-by-one HS transmitter 711. In this case, the LVDS1 signal A and the LVTTL1 signal C are transmitted at the resolution specified by the sub control board SS without converting the resolution. Accordingly, the projector device B2 can project an image with a resolution corresponding to the number of 1280 × 800 pixels, and the sub liquid crystal display device DD19 can display an image on the screen with a resolution corresponding to the number of 480 × 800 pixels.

  It should be noted that as the split display pattern, variations such as those shown in FIGS. 47 to 52 can be realized according to the display mode change such as the number of screens (display devices) for displaying video and the enlargement ratio change for resolution. ing.

(Modification 1)
For example, as shown in FIG. 47, the sub-control board SS has video data for projector display (data block indicated by “α” with a resolution of 1280 × 800) and video data for sub-liquid crystal display (with a resolution of 1024 × 768). LVDS dual-in signal composed of one synthesized signal is transmitted to the scaler substrate SK.

  At this time, the scaler substrate SK inputs the two video data α, β divided by the DSF (α), (β) 821, 822 based on the received LVDS dual-in signal as shown on the left side of FIG. The array image of pattern 1 or input pattern 2 is expanded in the memory space of SDRAM 712.

  If the enlargement ratio change (resolution change) is not set, the MCU 700 of the scaler substrate SK converts the video data α read from the SDRAM 712 into the select areas A, B 801, 802 and the LVDS as shown in the upper right of FIG. (1), (2) 811 and 812 are converted into a projector display LVDS1 + 2 signal (video signal indicated by “A + B” with a resolution of 1280 × 800), and this LVDS1 + 2 signal A + B is transmitted to the projector control board. At the same time, the MCU 700 reads the video data β read from the SDRAM 712 through the select areas C, D803, 804 and the LVTTL (1), (2) 813, 814, and the LVTTL1 + 2 signal for sub liquid crystal display (“C + D of resolution 1024 × 768” The LVTTL1 + 2 signal C + D is transmitted to the sub liquid crystal I / F substrate SL through the V-by-one HS transmitter 711. In this case, the LVDS1 + 2 signal A + B and the LVTTL1 signal C + D are transmitted at the resolution specified by the sub control board SS without converting the resolution. Accordingly, the projector device (for example, abbreviation of WXGA: Wide-XGA) projects an image with a resolution equivalent to the number of 1280 × 800 pixels, and the sub display device DD20 is changed to a sub liquid crystal display device (for example, XGA: eXtended Graphics Array). In the case where the image is provided, the video can be displayed on the screen with a resolution equivalent to the number of 1024 × 768 pixels.

  On the other hand, when the enlargement ratio change (resolution change) is set, the MCU 700 of the scaler substrate SK converts the video data α read from the SDRAM 712 into the select areas A, B 801, 802, and the like as shown in the lower right of FIG. Through LVDS (1), (2) 811 and 812, the LVDS 1 + 2 signal A + B having a resolution of 1920 × 1080, for example, corresponding to the setting value for changing the magnification rate is converted, and this LVDS1 + 2 signal A + B is transmitted to the projector control board B23. At the same time, the MCU 700 reads the video data β read from the SDRAM 712 through the select areas C, D803, 804 and the LVTTL (1), (2) 813, 814, for example, resolution 1280 × 800 according to the set value of the enlargement ratio change. The LVTTL1 + 2 signal C + D is converted to the LVTTL1 + 2 signal C + D, and the LVTTL1 + 2 signal C + D is transmitted to the sub liquid crystal I / F substrate SL through the V-by-one HS transmitter 711. In this case, the LVDS1 + 2 signal A + B and the LVTTL1 signal C + D are transmitted at a resolution different from that specified by the sub-control board SS, and the projector apparatus and the sub liquid crystal display apparatus have an appropriate resolution suitable for the display characteristics unique to each apparatus. Video can be displayed.

(Modification 2)
Also, for example, as shown in FIG. 48, the sub control board SS has video data for projector display (data block indicated by “α” of resolution 1280 × 800) and two video data (resolution) for sub liquid crystal display. The data block indicated by “β-1” of 800 × 480 and the data block indicated by “β-2” having a resolution of 800 × 480) are combined to generate an LVDS dual-in signal consisting of one combined signal as the scaler substrate SK. Send to.

  At this time, the scaler substrate SK generates three pieces of video data α, β-1, and β-2 divided by DSF (α) and (β) 821 and 822 based on the received LVDS dual-in signal as shown in FIG. The array image of any of the input patterns 1 to 3 as shown on the left side is expanded in the memory space of the SDRAM 712.

  If the enlargement ratio change (resolution change) is not set, the MCU 700 of the scaler substrate SK converts the video data α read from the SDRAM 712 into the select areas A, B 801, 802 and the LVDS as shown in the upper right of FIG. (1), (2) 811 and 812 are converted into a projector display LVDS1 + 2 signal (video signal indicated by “A + B” with a resolution of 1280 × 800), and this LVDS1 + 2 signal A + B is transmitted to the projector control board B23. At the same time, the MCU 700 transmits the two video data β-1, β-2 read from the SDRAM 712 through the select areas C, D803, 804 and the LVTTL (1), (2) 813, 814 to the LVTTL1 signal for sub liquid crystal display. And the LVTTL2 signal (video signals indicated by “C” and “D” having a resolution of 800 × 480), and the LVTTL1 signal C and the LVTTL2 signal D are transmitted through the V-by-one HS transmitter 711 to the sub liquid crystal I / F board SL. Send to. In this case, the LVDS1 + 2 signal A + B, and the LVTTL1 signal C and the LVTTL2 signal D are transmitted at the resolution specified by the sub control board SS without converting the resolution. As a result, the projector device (for example, FHD: Full-HD) projects an image with a resolution equivalent to the number of 1280 × 800 pixels, and is different from the sub liquid crystal display device DD19 as a sub liquid crystal display device. When a sub liquid crystal display device (for example, WXGA) is provided, an image can be displayed on each screen with a resolution equivalent to 800 × 480 pixels.

  On the other hand, when the enlargement ratio change (resolution change) is set, the MCU 700 of the scaler substrate SK converts the video data α read from the SDRAM 712 into the select areas A, B 801, 802, and the like as shown in the lower right of FIG. Through LVDS (1), (2) 811 and 812, the LVDS 1 + 2 signal A + B having a resolution of 1920 × 1080, for example, corresponding to the setting value for changing the magnification rate is converted, and this LVDS1 + 2 signal A + B is transmitted to the projector control board B23. At the same time, the MCU 700 sets the two video data β-1, β-2 read from the SDRAM 712 through the select areas C, D803, 804 and the LVTTL (1), (2) 813, 814. For example, the LVTTL1 signal C and the LVTTL2 signal D having a resolution of 1280 × 800 are converted into the LVTTL1 signal C and the LVTTL2 signal D, and the LVTTL1 signal C and the LVTTL2 signal D are transmitted to the sub liquid crystal I / F board SL through the V-by-one HS transmitter 711. . In this case, the LVDS1 signal A + B and the LVTTL1 signal C and the LVTTL2 signal D are transmitted at a resolution different from that specified by the sub control board SS, and the projector device (for example, FHD) and the two sub liquid crystal display devices (for example, WXGA) are transmitted. ), It is possible to appropriately display an image with a resolution suitable for display characteristics unique to each device.

(Modification 3)
Also, for example, as shown in FIG. 49, the sub control board SS includes two video data for display on the projector (data blocks indicated by “α-1” and “α-2” having a resolution of 800 × 480) and a sub-control board SS. By combining two video data for liquid crystal display (data blocks indicated by “β-1” and “β-2” with a resolution of 800 × 480), a LVDS dual-in signal composed of one composite signal is scaler substrate. Send to SK.

  At this time, the scaler substrate SK has four video data α-1, α-2, β-1, β− divided by DSF (α), (β) 821, 822 based on the received LVDS dual-in signal. 2 is expanded in the memory space of the SDRAM 712 with any array image of the input patterns 1 to 3 as shown on the left side of FIG.

  Then, the MCU 700 of the scaler substrate SK selects two pieces of video data α-1 and α-2 read from the SDRAM 712 as shown in the upper right of FIG. 49 if the enlargement ratio change (resolution change) is not set. Through the areas A, B801, 802 and LVDS (1), (2) 811, 812, converted into LVDS1 signals and LVDS2 signals (video signals indicated by “A” and “B” with a resolution of 800 × 480), These LVDS1 signal A and LVDS2 signal B are transmitted to the projector control board B23. At the same time, the MCU 700 transmits the two video data β-1, β-2 read from the SDRAM 712 through the select areas C, D803, 804 and the LVTTL (1), (2) 813, 814 to the LVTTL1 signal for sub liquid crystal display. And the LVTTL2 signal (video signals indicated by “C” and “D” having a resolution of 800 × 480), and the LVTTL1 signal C and the LVTTL2 signal D are transmitted through the V-by-one HS transmitter 711 to the sub liquid crystal I / F board SL. Send to. In this case, the LVDS1 signal A and the LVDS2 signal B, and the LVTTL1 signal C and the LVTTL2 signal D are transmitted at the resolution specified by the sub control board SS without converting the resolution. Accordingly, the projector device projects an image with a resolution equivalent to the number of 800 × 480 pixels, and when the sub liquid crystal device includes the sub liquid crystal display device DD19 and two separate display devices, the projector device is 800 ×. Images can be displayed on each screen with a resolution equivalent to 480 pixels.

  On the other hand, when the magnification change (resolution change) is set, the MCU 700 of the scaler substrate SK receives two pieces of video data α-1 and α-2 read from the SDRAM 712 as shown in the lower right of FIG. Through select areas A, B 801, 802 and LVDS (1), (2) 811, 812, for example, LVDS1 signal A and LVDS2 signal B having a resolution of 1280 × 720 according to the setting value for changing the enlargement ratio are converted into LVDS1 The signal A and the LVDS2 signal B are transmitted to the projector control board B23. At the same time, the MCU 700 sets the two video data β-1, β-2 read from the SDRAM 712 through the select areas C, D803, 804 and the LVTTL (1), (2) 813, 814. Is converted into LVTTL1 signal C and LVTTL2 signal D having a resolution of 1024 × 768, for example, and these LVTTL1 signal C and LVTTL2 signal D are transmitted to sub liquid crystal I / F board SL through V-by-one HS transmitter 711. . In this case, the LVDS1 signal A and the LVDS2 signal B, and the LVTTL1 signal C and the LVTTL2 signal D are transmitted at a resolution different from that specified by the sub control board SS. In the projector device and the three sub liquid crystal display devices, An image can be appropriately displayed at a resolution suitable for display characteristics unique to the apparatus.

(Modifications 4 to 6)
Further, for example, as shown in FIGS. 50 to 52, the sub-control board SS includes video data for projector display (data block indicated by “α” or the like) and video data for sub liquid crystal display (“β” or the like). In some cases, a plurality of LVDS single-in signals corresponding to the respective data blocks are continuously transmitted to the scaler substrate SK. Even in such a case, the signal processing similar to the above-described divided display pattern can be output separately to the LVDS signal and LVTTL signal indicating a predetermined resolution. It is possible to display an image appropriately at a resolution suitable for the display characteristics. In the present embodiment and its modifications 1 to 6, three types of resolutions, FHD, WXGA, and XGA, are exemplified. However, the present invention is not limited to these. Array) A higher-definition video may be displayed by using a display device that supports resolutions such as 2K and 4K.

  The scaler substrate may be capable of outputting a plurality of video signals to one display means. For example, the scaler board may generate and output a video signal for partial screen display and a video signal for partial screen display from one video data. The scaler board may generate and output a left-eye video signal and a right-eye video signal for 3D display from one video data. According to this, an image can be displayed by a 3D display method using parallax based on the left-eye video signal and the right-eye video signal from the scaler substrate, and the projector device can display stereoscopic images not only by projection mapping but also by parallax. It is possible to display images with a sense and power.

(Communication specifications of gaming machine 1)
As shown in FIG. 53, the communication specifications between the sub-control board SS and the scaler board SK, between the scaler board SK and the projector control board B23, and between the scaler board SK and the sub liquid crystal I / F board SL The speed (baud rate), data length, stop bit, presence / absence of parity, protocol, and communication format are defined as shown in the figure. The ID is shown separately for easy viewing of the transmission source ID and the transmission destination ID, but is actually single data of 1 byte. For example, the ID when the sub control board SS transmits data to the scaler board SK is 21H as data indicating the ID by combining the transmission source ID: 01H and the transmission destination ID: 20H. In the following description, the communication line between the sub control board SS and the scaler board SK is referred to as a first serial line, the communication line between the scaler board SK and the projector control board B23 is referred to as a second serial line, and the scaler board. The communication line between the SK-sub liquid crystal I / F substrate SL may be referred to as a third serial line.

(List of commands between each board)
As shown in FIG. 54, commands exchanged between the scaler board SK and the sub control board SS are, for example, “startup parameter request”, “parameter request”, “status”, “ “Reception confirmation” and “Error notification” are defined, and commands transmitted from the sub control board SS include, for example, “startup parameter request confirmation”, “setting completion”, “status request”, “status request completion”, “Output screen division setting number”, “output screen resolution setting”, “input screen division setting number”, and “input screen resolution setting” are defined. The contents and parameters of each command (including data positions (D1 to n) in the communication format) are as shown in FIG.

  As shown in FIG. 55, commands exchanged between the sub liquid crystal I / F substrate SL and the sub control substrate SS are, for example, “startup parameter request”, “parameter” as commands transmitted from the sub liquid crystal I / F substrate SL. “Request”, “Status”, “Reception Confirmation”, and “Error Notification” are defined, and as commands transmitted from the sub control board SS, for example, “Startup Parameter Request Confirmation”, “Setting Complete”, “Status Request” "Status request complete", "Sub liquid crystal screen resolution setting", and "Sub liquid crystal brightness setting" are defined. The contents and parameters of each command (including data positions (D1 to Dn) in the communication format) are as shown in FIG.

  As shown in FIG. 56, commands exchanged between the projector control board B23 and the sub control board SS are, for example, “startup parameter request”, “parameter request”, “reception confirmation” as commands transmitted from the projector control board B23. ”,“ Error notification ”,“ LED temperature ”,“ FAN (fan) speed ”,“ LED brightness ”,“ horizontal adjustment value ”,“ vertical adjustment value ”,“ focus adjustment value ”,“ drift correction temperature ” ”Is defined, and commands transmitted from the sub control board SS include, for example,“ start parameter request confirmation ”,“ setting completion ”,“ status request ”,“ status request completion ”,“ LED brightness setting ”,“ "Keystone distortion correction value", "White color temperature setting", "Horizontal position offset", "Horizontal position adjustment value", "Vertical position offset", " Straight position adjustment value "," Brightness setting "," Contrast setting "," gamma setting "," focus offset "," focus adjustment value "," focus drift correction value "," test pattern "is defined. The contents and parameters of each command (including data positions (D1 to n) in the communication format) are as shown in FIG.

  As shown in FIG. 57, error information transmitted from the scaler board SK by an error notification transmission command includes “self-diagnosis (RAM check) abnormality”, “scaler output setting abnormality”, “scaler input setting abnormality”, “WDT”. (Watchdog timer) -scaler ", parameters (including data position" D1 "in the communication format), error occurrence conditions, and error states are defined for each error. Error information transmitted from the sub liquid crystal I / F board SL by an error notification transmission command includes “self-diagnosis (RAM check) abnormality”, “touch panel input abnormality”, “sub liquid crystal screen setting abnormality”, “sub liquid crystal display”. There are “abnormal temperature” and “WDT-sub liquid crystal”, and parameters (including data position “D1” in the communication format), error occurrence conditions, and error states are defined for each error. The error information transmitted by the error notification transmission command from the projector control board B23 includes “LED (R) temperature abnormality”, “LED (G) temperature abnormality”, “LED (B) temperature abnormality”, “FAN1 rotation”. "Abnormal", "FAN2 rotation abnormality", "FAN3 rotation abnormality", "Voltage abnormality", "Self-diagnosis (RAM check) abnormality", "WDT-DLP", parameter (data in communication format) for each error The position “D1” or “D2” is included), an error occurrence condition, and an error state are defined. Note that error management areas of a scaler substrate SK, a projector control substrate B23, and a sub-liquid crystal I / F substrate SL described later (SDRAM memory map shown in FIG. 96, DRAM memory map shown in FIG. 106, DRAM memory shown in FIG. 116) The error information and error detection conditions set in (see map) are applied as they are.

(Memory map of PC1000 for adjustment)
As shown in FIG. 58, the memory (DRAM) of the adjustment PC 1000 has a reception storage area, a transmission storage area, and a status storage as work areas for predetermined application software when optical adjustment is performed on the projector apparatus B2. An area is provided. The storage medium (HDD) of the adjustment PC 1000 includes, as items related to optical adjustment, horizontal position A to E adjustment values, vertical position A to E adjustment values, focus position A to E adjustment values, LED luminance settings, and trapezoidal distortion. Correction values, white color temperature settings, brightness settings, contrast settings, gamma settings, test patterns, horizontal position positions A to E offset, vertical positions A to E offset, focus position offsets A to E, and the like are provided. Specific processing of the adjustment PC 1000 will be described later.

(Processing of main control board MS)
[Processing when power is turned on by main CPU 300]
FIG. 59 shows processing when the power is turned on by the main CPU 300 of the main control board MS. As shown in the figure, when the gaming machine 1 is powered on, the main CPU 300 performs a power-on process (S101). In this process, the main CPU 300 determines, for example, whether the backup is normal or whether the setting has been changed appropriately, and performs initialization according to the determination result.

  Next, the main CPU 300 performs an initialization process at the end of one game (unit game) (S102). In this process, for example, the main CPU 300 initializes by specifying a storage area for initialization at the end of one game. As a result, the data stored in the internal winning combination storing area or the display winning combination storing area of the main RAM 301 is cleared.

  Next, the main CPU 300 performs medal acceptance / start check processing (S103). In this process, the main CPU 300 sets an effective line based on the number of inserted sheets and determines whether a start operation is possible.

  Next, the main CPU 300 performs a random value acquisition process (S104). In this process, the main CPU 300 extracts and acquires random number values and stores them in the random value storage area. The random value is used in the next internal lottery process.

  Next, the main CPU 300 performs an internal lottery process (S105). In this process, the main CPU 300 determines an internal winning combination.

  Next, the main CPU 300 performs reel stop initial setting processing (S106). In this process, the main CPU 300 initializes an area related to control for stopping the rotation of the reels RL, RC, and RR.

  Next, the main CPU 300 performs a start command generation storage process (S107). In this process, the main CPU 300 generates a start command and stores the generated start command in the transmission data storage area of the main RAM 301. The start command stored in the transmission data storage area is transmitted to the sub control board SS by command transmission processing. The start command includes various kinds of information (internal winning combination, gaming state, etc.) necessary for production such as an internal winning combination. Thereby, the sub control board SS can produce an effect according to the start operation.

  Next, the main CPU 300 performs a wait process (S108). In this process, the main CPU 300 stands by so as not to accept a start operation or the like until a predetermined time (for example, 4.1 seconds) elapses from the start of the previous game.

  Next, the main CPU 300 performs a reel rotation start process (S109). In this process, the main CPU 300 requests the reels RL, RC, RR to start rotating.

  Next, the main CPU 300 performs reel rotation start command generation / storage processing (S110). In this process, the main CPU 300 generates a reel rotation start command and stores the generated reel rotation start command in the transmission data storage area of the main RAM 301. The reel rotation start command stored in the transmission data storage area is transmitted to the sub control board SS in the command transmission process. Thereby, the sub-control board SS can recognize the start of rotation of the reels RL, RC, RR, and can determine the timing for executing various effects.

  Next, the main CPU 300 performs a drawing priority order storage process (S111). In this process, the main CPU 300 determines the drawing priority order of the roles that can be displayed, and stores the drawing priority data in a predetermined storage area.

  Next, the main CPU 300 performs a reel stop control process (S112). In this process, the main CPU 300 performs a process of stopping the rotation of the reels RL, RC, RR based on the timing of the stop operation by the player, the internal winning combination, and the like.

  Next, the main CPU 300 performs a winning search process (S113). In this process, the main CPU 300 collates the symbol combination displayed along the active line with the symbol combination table after the reels RL, RC, RR are stopped, determines the display combination, and determines the number of medals to be paid out. Do.

  Next, the main CPU 300 performs a winning operation command generation / storage process (S114). In this process, the main CPU 300 generates a winning action command and stores the generated winning action command in the transmission data storage area of the main RAM 301. The winning action command stored in the transmission data storage area is transmitted from the main control board MS to the sub control board SS in the command transmission process. Thereby, the sub control board SS can determine the production content etc. according to winning.

  Next, the main CPU 300 performs medal payout processing (S115). In this process, the main CPU 300 pays out medals based on the payout number of medals determined in the process of S113.

  Next, the main CPU 300 performs medal payout end command generation storage processing (S116). In this process, the main CPU 300 generates a medal payout end command and stores the generated medal payout end command in the transmission data storage area of the main RAM 301. The medal payout end command stored in the transmission data storage area is transmitted from the main control board MS to the sub control board SS in the command transmission process. Thereby, the sub control board SS can recognize the end of the medal payout.

  Next, the main CPU 300 performs a bonus end check process (S117). In this process, the main CPU 300 ends the operation of the bonus game when a condition for ending the bonus game is satisfied.

  Next, the main CPU 300 performs a bonus operation check process (S118). In this process, the main CPU 300 starts the operation of the bonus game when a condition for starting the bonus game is satisfied. The main CPU 300 operates the regame when the regame condition is satisfied. After execution of S118, the main CPU 300 proceeds to the process of S102 again.

[Interrupt processing under the control of the main CPU (1.1172 ms)]
FIG. 60 shows an interrupt process by the main CPU 300 of the main control board MS. As shown in the figure, the main CPU 300 periodically saves the register at a predetermined cycle (1.1172 ms) (S121).

  Next, the main CPU 300 performs input port check processing (S122). In this process, the main CPU 300 confirms the presence or absence of an input signal from the door relay board DS. For example, the main CPU 300 stores signals from the start switch 54, the stop switch board 55, and the like for each interrupt process. Further, the main CPU 300 stores an input state command corresponding to input signals from various switches and the like in a transmission data storage area of the main RAM 301. The stored input state command is transmitted to the sub control board SS in a data transmission process described later. Thereby, various effects according to the start operation of the unit game and the stop operation of the reels RL, RC, RR can be executed.

  Next, the main CPU 300 performs timer update processing (S123). In this process, the main CPU 300 performs a process of updating the timer value set in a predetermined area of the main RAM 301.

  Next, the main CPU 300 performs an effect timer update process (S124). In this process, the main CPU 300 performs a process of updating the value of the effect timer set in a predetermined area of the main RAM 301.

  Next, the main CPU 300 performs a reel control process (S125). In this process, the main CPU 300 performs a process of controlling the rotation of the reels RL, RC, RR. Specifically, the main CPU 300 starts rotation of the reels RL, RC, RR in response to a request to start rotation of the reels RL, RC, RR, that is, in response to a start operation, and at a constant speed. Control is performed so that the reels RL, RC, and RR rotate. Further, control is performed so that the rotation of the reels RL, RC, RR corresponding to the stop operation stops in response to the stop operation.

  Next, the main CPU 300 performs 7SEG drive processing (S126). In this process, the main CPU 300 causes the 7-segment display 30 to display the number of credited medals, the number of payouts, and the like.

  Next, the main CPU 300 performs a data transmission process (S127). In this processing, the main CPU 300 transmits the command stored in the transmission data storage area to the sub control board SS via the security IC 306.

  Next, the main CPU 300 restores the register (S128). Thereafter, the main CPU 300 ends the interrupt process.

(Memory map of sub control board SS)
As shown in FIGS. 61 and 62, the sub-RAM board 41, the SRAM 401, and the sub-ROM board 42 of the sub-control board SS are provided with various regions when performing optical adjustment on the projector device B2.

  As shown in FIG. 61, on the sub RAM board 41, a part of a work area (for example, an area used in a task system or an LED control task described later) for the sub CPU 400 of the sub control circuit SS to perform various controls. The sub-device reception storage area, sub-device transmission storage area, scaler control reception storage area, sub liquid crystal control reception storage area, projector control reception storage area, flag Storage area, scaler setting value storage area, scaler setting confirmation storage area, sub liquid crystal setting value storage area, sub liquid crystal setting confirmation storage area, touch panel input storage area, projector setting value storage area, projector status storage area, drift correction storage area Is provided. For example, the flag storage area includes an EXT reception flag, a reception completion flag, a scaler setting completion flag, a sub liquid crystal setting completion flag, a projector setting completion flag, a scaler setting changing flag, a sub liquid crystal setting changing flag, and a projector setting changing flag. In addition, a scaler start time setting flag, a sub liquid crystal start time setting flag, and a projector start time setting flag are stored. In the touch panel input storage area, an input type, an input X coordinate, and an input Y coordinate are stored. In the drift correction storage area, a drift correction monitoring counter and a focus correction value storage area are provided. The sub-device means the sub-liquid crystal display device DD19, the touch panel DD19T, and the projector device B2 controlled by the sub-control circuit SS, as well as the front screen drive mechanism E2 and the reel screen drive mechanism F2. Such stored information will be described later.

  As shown in FIG. 62, in the SRAM 401, as part of the data that can be backed up (for example, the data in the area where the gaming state, the RT state, etc. are backed up are not shown), A setting value storage area and a projector setting value storage area are provided. In the scaler setting value storage area, the output screen division setting number, the input screen division setting number, the output screen 1 to 4 horizontal resolution, the output screen 1 to 4 vertical resolution, the input screen 1 and 2 horizontal resolution, and the input as the scaler setting value The screen 1, 2 vertical resolution is stored. In the sub liquid crystal setting value storage area, sub liquid crystal horizontal resolution, sub liquid crystal vertical resolution, and sub liquid crystal luminance are stored as sub liquid crystal setting values. In the projector set value storage area, as the projector set values, horizontal position A to E offset, horizontal position A to E adjustment value, vertical position A to E offset, vertical position A to E adjustment value, focus position offset A to E, focus drift correction values A to E, LED luminance setting, trapezoidal distortion correction value, white color temperature setting, brightness setting, contrast setting, gamma setting, and test pattern are stored. These setting values will be described later.

  As shown in FIG. 62, the sub ROM board 42 includes a part of fixed data (control program for the sub control board SS, various lottery values necessary for games, video data, sound data, LED data, objects (screen (Operation data and the like are not shown), a scaler initial value region, a sub liquid crystal initial value region, and a projector initial value region are provided. The initial value area of the scaler includes the number of output screen division settings, the number of input screen division settings, baud rate, data length, parity, stop, output screen 1 to 4 horizontal resolution, output screen 1 to 4 vertical resolution, and input screen 1 and 2 horizontal. The resolution, input screen 1, and 2 vertical resolution are stored. The sub liquid crystal initial value area stores sub liquid crystal horizontal resolution, sub liquid crystal vertical resolution, and sub liquid crystal luminance. The projector initial value area includes horizontal position A to E offset, vertical position A to E offset, focus position offset A to E, focus drift correction value A to E, LED brightness setting, trapezoidal distortion correction value, contrast setting, Stores gamma settings, white color temperature settings, brightness settings, and test patterns. Such stored information will be described later.

(Processing of sub control board SS)
[Processing at power-on by sub CPU 400]
FIG. 63 shows processing when the power is turned on by the sub CPU 400 of the sub control board SS. As shown in the figure, when the gaming machine 1 is powered on, the sub CPU 400 performs initialization processing of the sub control board SS (S131). In this processing, the sub CPU 400 initializes the task system such as error check of the SRAM 401 and initialization of the sub RAM substrate 41 (RAM clear, backup data set of the SRAM 401, etc.). The task system includes an LED control task, a sound control task, a screen accessory control task, a main task, a main board communication task, an animation task, and a sub device task, which will be described later.

  Next, the sub CPU 400 activates the LED control task (S132). In this process, the sub CPU 400 executes each process of the LED control task described later (see FIG. 64).

  Next, the sub CPU 400 activates a sound control task (S133). In this process, the sub CPU 400 executes each process of a sound control task described later (see FIG. 65).

  Next, the sub CPU 400 activates a screen accessory control task (S134). In this process, the sub CPU 400 executes each process of the screen accessory control task described later (see FIG. 66).

  Next, the sub CPU 400 activates the main task (S135). In this process, the sub CPU 400 executes each process of the main task described later (see FIG. 69).

  Next, the sub CPU 400 activates the main board communication task (S136). In this process, the sub CPU 400 executes each process of the main board communication task described later (see FIG. 70).

  Next, the sub CPU 400 activates an animation task (S137). In this process, the sub CPU 400 executes each process of an animation task described later (see FIG. 72).

  Next, the sub CPU 400 activates a sub device task (S138). In this process, the sub CPU 400 executes each process of a sub device task described later (see FIG. 73).

  Next, the sub CPU 400 performs a power interruption recovery process (S139). In this processing, the sub CPU 400 performs processing for restoring backup data at the time of power interruption. Thereafter, the sub CPU 400 ends the process when the power is turned on.

[LED control task]
FIG. 64 shows an LED control task by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 performs initialization processing of LED related data (S141).

  Next, the sub CPU 400 performs LED data analysis processing (S142).

  Next, the sub CPU 400 performs an LED effect execution process (S143).

  Next, the sub CPU 400 waits for a period of, for example, 4 msec (S144). Thereafter, the sub CPU 400 proceeds to the process of S142.

Sound control task
FIG. 65 shows a sound control task by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 performs initialization processing of sound related data (S151).
Next, the sub CPU 400 performs sound data analysis processing (S152).

  Next, the sub CPU 400 performs a sound effect execution process (S153). Thereafter, the sub CPU 400 proceeds to the process of S152.

[Screen character control task]
FIG. 66 shows a screen accessory control task by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 performs a screen accessory test process in order to confirm whether or not the screen mechanisms E1 and F1 operate normally when the power is turned on (S161). For example, as a test, the reel screen mechanism E1 is first moved to the display position and then moved to the storage position, and then the reel screen mechanism F1 is moved to the display position and then moved to the storage position. When an abnormality is detected during the test operation of the screen mechanisms E1 and F1, the projector device B2 displays a message to notify the abnormality and requests that the sound control task output a message to notify the occurrence of the abnormality.

  Next, the sub CPU 400 determines whether there is registered screen feature data (S162). In this processing, the sub CPU 400 determines whether or not screen feature data that requests the operation of the screen mechanisms E1 and F1 exists in a predetermined area of the sub RAM board 41. When the screen feature data exists (S162: Yes), the sub CPU 400 proceeds to the process of the next S163. When the screen feature data does not exist (S162: No), the sub CPU 400 proceeds to the process of S164.

  Next, the sub CPU 400 performs a screen accessory operation construction process (S163). In this process, the sub CPU 400 constructs an operation pattern of the screen driving mechanisms E2 and F2 based on the screen accessory data. As an operation pattern of the screen drive mechanisms E1 and F1, for example, in the state in which an image is projected on the front screen mechanism E1, when the accessory data for projecting the image is registered on the reel screen mechanism F1 (front screen mechanism The sub CPU 400 that executes the screen accessory operation construction process sets the storing operation pattern of the front screen mechanism E1 and the front screen when the accessory data instructing the storing operation to E1 is not registered). After the mechanism E1 is stored in the upper part, an operation pattern is constructed in the order of moving the reel screen mechanism F1 to the display surface.

  Next, the sub CPU 400 performs a screen accessory control process (S164). This process will be described later with reference to FIG.

  Next, the sub CPU 400 waits for a period of 2 msec, for example (S165). Thereafter, the sub CPU 400 proceeds to the process of S162.

[Screen character control processing]
FIG. 67 shows a screen accessory control process by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 corresponds to the operation start step from the operation pattern of the screen mechanisms E1 and F1 constructed by the above-described screen accessory operation construction process, and the screen (projection target) changes. Is determined (S171). If the screen change occurs in the operation start step (S171: Yes), the sub CPU 400 proceeds to the next step S172. If it is not an operation start step or does not correspond to the occurrence of a screen change (S171: No), the sub CPU 400 proceeds to the process of S173.

  Next, the sub CPU 400 performs a focus change request process (S172). This process will be described later with reference to FIG.

  Next, the sub CPU 400 performs front screen control processing (S173). In this process, the sub CPU 400 controls the operation of the front screen drive mechanism E2 to move the front screen mechanism E1.

  Next, the sub CPU 400 performs a reel screen control process (S174). In this process, the sub CPU 400 controls the operation of the reel screen drive mechanism F2 in order to move the reel screen mechanism F1.

  Next, the sub CPU 400 determines whether or not the value of the focus standby counter is −1 (S175). The focus standby counter is a subtraction counter for generating a predetermined waiting time when the projector apparatus B2 changes the focus position. When the value of the focus standby counter is −1 (S175: Yes), the sub CPU 400 ends the screen accessory control process. When the value of the focus standby counter is not −1 (S175: No), the sub CPU 400 proceeds to the next process of S176.

  Next, the sub CPU 400 determines whether or not the value of the focus standby counter is 0 (S176). If the value of the focus standby counter is 0 (S176: Yes), the sub CPU 400 proceeds to the process of S178. When the value of the focus standby counter is not 0 (S176: No), the sub CPU 400 proceeds to the next process of S177.

  Next, the sub CPU 400 decrements the value of the focus standby counter by 1 (S177). Thereafter, the sub CPU 400 ends the screen accessory control process.

  In S178, the sub CPU 400 requests the projector device B2 to change the focus position after the change. In this processing, the sub CPU 400 stores focus position setting change request data in the sub device transmission storage area of the sub RAM board 41, and transmits this data to the projector apparatus B2. The focus position setting change request data includes the current focus position before the change and the focus position after the change. Thereby, for example, when the image projection target is switched from the front screen mechanism E1 to the reel screen mechanism F1 or vice versa, the projector device B2 changes the focus position setting. The focus mechanism 242 is controlled based on the request data, and the projection lens 210 can be focused at the focus position corresponding to each of the screen mechanisms E1 and F2.

  Next, the sub CPU 400 sets −1 in the focus standby counter (S179). Thereafter, the sub CPU 400 ends the screen accessory control process.

[Change focus request processing]
FIG. 68 shows focus change request processing by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 obtains the current focus position (focus position A to E offset) from the current operation state of the screen mechanisms E1 and F1 (S181).

  Next, the sub CPU 400 acquires the changed focus position (focus position A to E offset) from the operation pattern of the screen mechanisms E1 and F1 constructed from the registered accessory data (S182).

  Next, the sub CPU 400 calculates the number of focus change pulses (S183). The focus change pulse number is the number of pulses of the motor drive signal supplied to the focus motor 242C when the focus position is changed, and is a required pulse number corresponding to the current focus position minus the changed focus position. Calculated as an absolute value.

  Next, the sub CPU 400 calculates a focus adjustment time (S184). The focus adjustment time is an actual working time of the focus mechanism 242 for changing the focus position. For example, when a motor drive signal for the focus motor 242C is a pulse square wave with a duty ratio of 0.5, a time (pulse) (Cycle) is multiplied by the number of focus change pulses obtained in S183.

  Next, the sub CPU 400 calculates a transmission time (setting change transmission time) for changing the focus position setting by communication with the projector control board B23 (S185). This setting change transmission time is the transmission time 1 of data exchanged between the sub control board SS and the scaler board SK and the transmission of data exchanged between the scaler board SK and the projector control board B23 in accordance with the setting change of the focus position. It is calculated as the combined time with time 2. Transmission time 1 is obtained by multiplying 1 / baud rate 1 by the number of transmission bits, which is the number of data × (data length + parity + start + stop). Similarly, the transmission time 2 is obtained by multiplying the number of transmission bits by 1 / baud rate 2. In this embodiment, the baud rate 1 is 38400 bps, the baud rate 2 is 19200 bps, the data length is 8 bits, there is no parity, the start and stop bits are 1 bit, and the transmission time 1 and the transmission time 2 obtained using these numerical values. Is calculated.

  Next, the sub CPU 400 calculates a focus change time (S186). The focus change time is calculated as the sum of the setting change transmission time obtained in S185 and the focus adjustment time obtained in S184.

  Next, the sub CPU 400 determines whether or not to change to the front screen mechanism E1 (S187). In the case of a change to the front screen mechanism E1 (S187: Yes), the sub CPU 400 proceeds to the next process of S188. If it is not a change to the front screen mechanism E1 (S187: No), the sub CPU 400 proceeds to the process of S189.

  Next, the sub CPU 400 calculates a moving time 1 for moving the front screen mechanism E1 to a predetermined position (S188). This moving time 1 is the actual working time of the front screen drive mechanism E2. For example, if the motor drive signal for the drive motor E25 of the front screen drive mechanism E2 is a pulse square wave with a duty ratio of 0.5, the pulse width is doubled. It is calculated by multiplying the required time by the required number of motor pulses. Thereafter, the sub CPU 400 proceeds to the process of S190.

  In S189, the sub CPU 400 calculates a moving time 2 when moving the reel screen mechanism F1 to a predetermined position. This movement time 2 is the actual working time of the reel screen drive mechanism F2. For example, if the motor drive signal for the drive motor F24 of the reel screen drive mechanism F2 is a pulse square wave with a duty ratio of 0.5, the pulse width is doubled. It is calculated by multiplying the required time by the required number of motor pulses.

  Next, the sub CPU 400 divides the difference between the movement times 1 and 2 obtained in S188 or S189 and the focus change time obtained in S186 by 2 corresponding to 2 msec of the processing cycle of the screen accessory control task, and calculates the result. A value corresponding to time is set in the focus standby counter (S190). As a result, for the operation of moving the screen mechanisms E1 and F1 to the predetermined position and the operation of changing the focus position, values that are just the difference between the required times are not set in the focus standby counter. The focus position can be changed to a predetermined position at the timing when the movement operation of F1 is completed. That is, it is possible to project an image with good image quality that is in focus (focus) by changing the focus position even on the screen mechanisms E1 and F1 immediately after the movement.

  Next, the sub CPU 400 determines whether or not there is focus interlock when displaying the video (for example, “1” when there is a focus interlock flag (not shown), “0” when there is no focus interlock) (S191). . The focus interlock means that the focus position is continuously changed in conjunction with the movement of the screen mechanisms E1 and F1. If there is no focus interlock (S191: No), the sub CPU 400 proceeds to the next step S192. If there is focus interlock (S191: Yes), the sub CPU 400 ends the focus change request process.

  Next, the sub CPU 400 sets 0 in the focus standby counter (S192). That is, when the focus interlock is not performed, the focus position is immediately changed at the beginning of the movement of the screen mechanisms E1 and F1, and when the focus interlock is performed, the focus position is at the timing when the movement of the screen mechanisms E1 and F1 is completed. The change of is finished. Thereafter, the sub CPU 400 ends the focus change request process.

[Main Task]
FIG. 69 shows a main task by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 performs a VSYNC (vertical synchronization signal) interrupt initialization process (S201).

  Next, the sub CPU 400 waits for a VSYNC interrupt generated at a cycle of 33 msec (S202).

  Next, the sub CPU 400 performs a drawing process (S203).

  Next, the sub CPU 400 resets the watch dog timer (WDT) (S204). Thereafter, the sub CPU 400 proceeds to the process of S202.

[Main board communication task]
FIG. 70 shows a main board communication task by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 initializes the communication message queue (S211).

  Next, the sub CPU 400 acquires a reception command from the main control board MS from the communication message queue (S212).

  Next, the sub CPU 400 determines whether or not there is a reception command (S213). When there is a reception command (S213: Yes), the sub CPU 400 proceeds to the next process of S214. When there is no reception command (S213: No), the sub CPU 400 proceeds to the process of S218.

  Next, the sub CPU 400 checks the received command (S214).

  Next, the sub CPU 400 determines whether or not the received command is a valid command (S215). If the received command is a valid command (S215: Yes), the sub CPU 400 proceeds to the process of the next S216. When the received command is not a valid command (S215: No), the sub CPU 400 proceeds to the process of S218. Note that the received command is valid, for example, that the value of the command is in the range of 01H to 10H.

  Next, the sub CPU 400 creates game information from the received command, and stores the game information in a predetermined area (not shown) of the sub RAM board 41 (S216). This game information includes, for example, an internal winning combination, a gaming state, a set value, the number of bonus games, and the like.

  Next, the sub CPU 400 performs command analysis processing (S217). This process will be described later with reference to FIG.

  Next, the sub CPU 400 waits for a period of, for example, 10 msec (S218). Thereafter, the sub CPU 400 proceeds to the process of S212.

[Command analysis processing]
FIG. 71 shows command analysis processing by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 performs a command consistency determination process (S221).

  Next, the sub CPU 400 performs effect content determination processing (S222).

  Next, the sub CPU 400 performs animation data determination processing (S223).

  Next, the sub CPU 400 performs LED data determination processing (S224).

  Next, the sub CPU 400 performs sound data determination processing (S225).

  Next, the sub CPU 400 performs a screen accessory data determination process (S226).

  Next, the sub CPU 400 registers the determined data in a predetermined area of the sub RAM board 41 (S227). Thereafter, the sub CPU 400 ends the command analysis process.

[Anime task]
FIG. 72 shows an animation task by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 checks for a change from the previous game information (S231).

  Next, the sub CPU 400 performs a main object control process (S232).

  Next, the sub CPU 400 performs a main animation task management process (S233).

  Next, the sub CPU 400 performs sub object control processing (S234).

  Next, the sub CPU 400 performs a sub animation task management process (S235).

  Next, the sub CPU 400 waits for a period of 33 msec, for example (S236). Thereafter, the sub CPU 400 proceeds to the process of S231.

[Subdevice Task]
FIG. 73 shows a sub device task by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 performs a sub device initialization process (S241). This process will be described later with reference to FIG.

  Next, the sub CPU 400 performs a scaler control process (S242). This process will be described later with reference to FIG.

  Next, the sub CPU 400 performs sub liquid crystal control processing (S243). This process will be described later with reference to FIG.

  Next, the sub CPU 400 performs projector control processing (S244). This process will be described later with reference to FIG.

  Next, the sub CPU 400 waits for a period of 10 msec, for example (S245). Thereafter, the sub CPU 400 proceeds to the process of S242.

[Subdevice reception interrupt processing]
FIG. 74 shows sub device reception interrupt processing by the sub CPU 400 of the sub control board SS. The sub-device reception interrupt process is a reception interrupt process for capturing the communication data transmitted by the scaler substrate SK in response to an external request from the sub-device (sub liquid crystal display device DD19, touch panel DD19T, projector device B2, etc.). As shown in the figure, the sub CPU 400 determines whether or not the received data from the sub device is 'STX' indicating the start of data (S251). When the received data is “STX (Start of TeXt: 02H)” (S251: Yes), the sub CPU 400 proceeds to the process of the next S252. When the received data is not “STX” (S251: No), the sub CPU 400 proceeds to the process of S253.

  Next, the sub CPU 400 sets the ETX reception flag and the reception completion flag in the flag storage area of the sub RAM board 41 to “OFF”, and clears the sub device reception storage area (S252). Thereafter, the sub CPU 400 ends the sub device reception interrupt process.

  In S253, the sub CPU 400 stores the received data in the sub device reception storage area of the sub RAM board 41.

  Next, the sub CPU 400 determines whether or not the received data from the sub device is “ETX” indicating the end of the data (S254). When the received data is “ETX (End of TeXt: 03H)” (S254: Yes), the sub CPU 400 proceeds to the process of the next S255. When the received data is not “ETX” (S254: No), the sub CPU 400 proceeds to the process of S256.

  Next, the sub CPU 400 sets the ETX reception flag in the flag storage area of the sub RAM board 41 to 'ON' (S255). Thereafter, the sub CPU 400 ends the sub device reception interrupt process.

  In S256, the sub CPU 400 determines whether or not the ETX reception flag in the flag storage area of the sub RAM board 41 is 'ON'. When the ETX reception flag is “ON” (S256: Yes), the sub CPU 400 proceeds to the next process of S257. When the ETX reception flag is not “ON” (S256: No), the sub CPU 400 ends the sub device reception interrupt process.

  Next, the sub CPU 400 performs a sub device received data sum check process (S257).

  Next, the sub CPU 400 determines whether or not the sum value obtained in S257 is normal (S258). When the sum value is normal (S258: Yes), the sub CPU 400 proceeds to the process of S260. When the sum value is not normal (S258: No), the sub CPU 400 proceeds to the next process of S259. Specifically, in this embodiment, when determining whether or not the sum value is normal, the received data up to “ETX”, excluding “STX” of the received data, is added and received after “ETX”. The consistency of the sum value is determined by collating with the received data. The method for calculating the sum value is not limited to the addition formula, and a subtraction formula or exclusive OR (also referred to as BCC) may be used.

  Next, the sub CPU 400 discards the data in the sub device reception storage area (clears the sub device reception storage area) (S259). Thereafter, the sub CPU 400 ends the sub device reception interrupt process.

  In S260, the sub CPU 400 sets the reception completion flag in the flag storage area of the sub RAM board 41 to 'ON'. Thereafter, the sub CPU 400 ends the sub device reception interrupt process.

[Subdevice initialization processing]
FIG. 75 shows sub-device initialization processing by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 initializes a first serial line that is a communication line with the scaler substrate SK (S271).

  Next, the sub CPU 400 copies the value of the scaler setting value storage area of the SRAM 401 to the scaler setting value storage area of the sub RAM board 41 (S272). As shown in FIG. 62, the scaler setting values are the output screen division setting number, the input screen division setting number, the output screen 1 to 4 horizontal resolution, the output screen 1 to 4 vertical resolution, the input screen 1 and 2 horizontal resolution, and the input. This corresponds to a device profile indicating the control characteristics of the scaler substrate SK such as the screen 1 and the vertical resolution.

  Next, the sub CPU 400 performs a check process on the range of the scaler setting value stored in the scaler setting value storage area (S273).

  Next, the sub CPU 400 determines whether or not all the scaler setting values in the scaler setting value storage area are values within the valid range (S274). As shown in FIG. 54, the effective range of the scaler set value is defined in advance as a transmission command from the sub control board SS. If all the scaler set values are within the valid range (S274: Yes), the sub CPU 400 proceeds to the process of S276. When at least one scaler setting value is not within the valid range (S274: No), the sub CPU 400 proceeds to the next process of S275.

  Next, the sub CPU 400 initializes the scaler setting value storage area of the SRAM 401 and the scaler setting value storage area of the sub RAM board 41 as initial values (S275). As shown in FIG. 62, the initial value of the scaler setting value is written in advance in the scaler initial value area of the sub-ROM substrate 42.

  Next, the sub CPU 400 copies the value of the sub liquid crystal setting value storage area of the SRAM 401 to the sub liquid crystal setting value storage area of the sub RAM board 41 (S276). As shown in FIG. 62, the sub liquid crystal setting value corresponds to a device profile indicating display characteristics of the sub liquid crystal display device DD19 such as sub liquid crystal horizontal resolution, sub liquid crystal vertical resolution, and sub liquid crystal luminance.

  Next, the sub CPU 400 performs a check process on the range of the sub liquid crystal setting values stored in the sub liquid crystal setting value storage area (S277).

  Next, the sub CPU 400 determines whether or not all the sub liquid crystal setting values in the sub liquid crystal setting value storage area are values within the effective range (S278). When all the sub liquid crystal setting values are values within the effective range (S278: Yes), the sub CPU 400 proceeds to the process of S280. If at least one sub liquid crystal set value is not within the valid range (S278: No), the sub CPU 400 proceeds to the next step S279.

  Next, the sub CPU 400 initializes the sub liquid crystal setting value storage area of the SRAM 401 and the sub liquid crystal setting value storage area of the sub RAM substrate 41 as initial values (S279). The initial value of the sub liquid crystal setting value is written in advance in the sub liquid crystal initial value area of the sub ROM substrate 42 as shown in FIG.

  Next, the sub CPU 400 copies the value of the projector setting value storage area of the SRAM 401 to the projector setting value storage area of the sub RAM board 41 (S280). As shown in FIG. 62, the projector set values are the horizontal position A to E adjustment value, the horizontal position A to E offset, the vertical position A to E adjustment value, the vertical position A to E offset, and the focus position offset. This corresponds to a device profile indicating the display characteristics of the projector apparatus B2, such as A to E, LED luminance setting, trapezoidal distortion correction value, white color temperature setting, brightness setting, contrast setting, gamma setting, and focus drift correction value A to E.

  Next, the sub CPU 400 performs a check process on the range of the projector setting value stored in the projector setting value storage area (S281).

  Next, the sub CPU 400 determines whether or not all projector setting values in the projector setting value storage area are values within the valid range (S282). When all the projector setting values are values within the valid range (S282: Yes), the sub CPU 400 proceeds to the process of S284. If at least one projector setting value is not within the valid range (S282: No), the sub CPU 400 proceeds to the next process of S283.

  Next, the sub CPU 400 initializes the projector setting value storage area of the SRAM 401 and the projector setting value storage area of the sub RAM board 41 as initial values (S283). The initial value of the projector setting value is written in advance in the projector initial value area of the sub-ROM board 42 as shown in FIG.

  Next, the sub CPU 400 sets the scaler setting completion flag, the sub liquid crystal setting completion flag, and the projector setting completion flag in the flag storage area of the sub RAM board 41 to 'OFF' (S284). Thereafter, the sub CPU 400 ends the sub device initialization process.

[Scaler control processing]
FIG. 76 shows a scaler control process by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 determines whether or not the transmission source ID of the reception data temporarily stored in the sub device reception storage area of the sub RAM board 41 indicates “scaler (ID: 02H shown in FIG. 53)”. Is determined (S291). When the transmission source ID indicates “scaler” (S291: Yes), the sub CPU 400 proceeds to the next process of S292. When the transmission source ID does not indicate “scaler” (S291: No), the sub CPU 400 ends the scaler control process.

  Next, the sub CPU 400 performs a received data consistency check process for controlling the scaler board SK (S292). In this process, the sub CPU 400 checks whether or not the value of the command ID included in the received data matches the value of “01H” to “05H” indicating the transmission command from the scaler board SK shown in FIG. The check result is returned as a return value.

  Next, the sub CPU 400 determines from the return value of the check result whether there is an abnormality in the consistency of the received data (S293). If there is an abnormality in the consistency of the received data (S293: Yes), the sub CPU 400 proceeds to the process of the next S294. When there is no abnormality in the consistency of received data (S293: No), the sub CPU 400 proceeds to the process of S295.

  Next, the sub CPU 400 discards (clears) the data in the sub device reception storage area because the consistency of the reception data is abnormal (invalid reception data) (S294). Thereafter, the sub CPU 400 ends the scaler control process.

  In S295, the sub CPU 400 performs processing at the time of receiving the scaler control. This process will be described later with reference to FIG. Thereafter, the sub CPU 400 ends the scaler control process.

[Processing when receiving scaler control]
FIG. 77 shows processing at the time of receiving scaler control by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 copies received data from the sub device reception storage area of the sub RAM board 41 to the scaler control reception storage area (S301).

  Next, the sub CPU 400 determines whether or not the command (reception command) acquired from the received data is an “activation parameter request” (S302). When the received command is “startup parameter request (see CMD: 01H shown in the left column of FIG. 54)” (S302: Yes), the sub CPU 400 proceeds to the next process of S303. When the received command is not “activation parameter request” (S302: No), the sub CPU 400 proceeds to the process of S304.

  Next, the sub CPU 400 performs processing for receiving a scaler activation parameter request (S303). This process will be described later with reference to FIG. Thereafter, the sub CPU 400 ends the scaler control reception process.

  In S304, the sub CPU 400 determines whether or not the command (reception command) acquired from the received data is “parameter request (see CMD: 02H shown in the left column of FIG. 54)”. If the received command is a “parameter request” (S304: Yes), the sub CPU 400 proceeds to the next process of S305. If the received command is not a “parameter request” (S304: No), the sub CPU 400 proceeds to the process of S311.

  Next, the sub CPU 400 issues a scaler set value change request (see CMD: 02H, D1: 01H shown in the left column of FIG. 54) based on the parameter value (see FIG. 54) included in the parameter request reception command. It is determined whether or not there is (S305). When there is a request to change the scaler setting value (S305: Yes), the sub CPU 400 proceeds to the next process of S306. When there is no request for changing the scaler setting value (S305: No), the sub CPU 400 proceeds to the process of S309.

  Next, the sub CPU 400 sets the scaler setting changing flag in the flag storage area of the sub RAM board 41 to ‘ON’ (S306).

  Next, the sub CPU 400 acquires the setting change content (scaler setting value to be changed) from the scaler setting value storage area (see FIG. 62) (S307).

  Next, the sub CPU 400 uses the acquired setting change content as an argument (a general name of the parameter on the software indicating that the caller delivers the parameter to the subroutine function (process) of the callee), and the scaler setting change process (S308). This process will be described later with reference to FIG. Thereafter, the sub CPU 400 ends the scaler control reception process.

  In S309, the sub CPU 400 receives a status request (see CMD: 02H and D1: 02H shown in the left column of FIG. 54) from the scaler board SK based on the parameter value (see FIG. 54) included in the parameter request reception command. It is determined whether or not there is. When there is a status request (S309: Yes), the sub CPU 400 proceeds to the next process of S310. When there is no status request (S309: No), the sub CPU 400 ends the process at the time of receiving the scaler control.

  Next, the sub CPU 400 performs a status request command transmission process (S310). In this process, the sub CPU 400 transmits a status request command to the scaler substrate SK. Thereafter, the sub CPU 400 ends the scaler control reception process.

  In S311, the sub CPU 400 determines whether or not the command (reception command) acquired from the reception data is “status” (see CMD: 03H shown in the left column of FIG. 54). When the received command is 'status' (S311: Yes), the sub CPU 400 proceeds to the next process of S312. If the received command is not 'status' (S311: No), the sub CPU 400 proceeds to the process of S313.

  Next, the sub CPU 400 performs processing at the time of receiving the scaler status command (S312). This process will be described later with reference to FIG. Thereafter, the sub CPU 400 ends the scaler control reception process.

  In S313, the sub CPU 400 determines whether or not the command (reception command) acquired from the received data is “reception confirmation (see CMD: 04H shown in the left column of FIG. 54)”. If the reception command is “reception confirmation” (S313: Yes), the sub CPU 400 proceeds to the next processing of S314. When the reception command is not “reception confirmation” (S313: No), the sub CPU 400 proceeds to the process of S315.

  Next, the sub CPU 400 performs a scaler reception confirmation reception process (S314). This process will be described later with reference to FIG.

  In S315, the sub CPU 400 determines whether or not the command (reception command) acquired from the reception data is “error notification (see CMD: 05H shown in the left column of FIG. 54)”. If the received command is “error notification” (S315: Yes), the sub CPU 400 proceeds to the next process of S316. When the received command is not “error notification” (S315: No), the sub CPU 400 ends the process at the time of receiving the scaler control.

  Next, the sub CPU 400 performs processing when a scaler error occurs (S316).

  Next, the sub CPU 400 outputs a sound scaler error to the speaker group 62 so as to notify the error of the scaler board SK by sound, and simultaneously notifies the LED group 61 of the error by a light emission mode. An LED scaler error occurrence lighting request is made (S317). Thereafter, the sub CPU 400 ends the scaler control reception process.

[Processing when scaler startup parameter request is received]
FIG. 78 shows processing at the time of receiving a scaler activation parameter request by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 performs a start parameter request confirmation command transmission process (S321). In this process, the sub CPU 400 transmits a “start parameter request confirmation (see CMD: 01H shown in the right column of FIG. 54)” command to the scaler board SK.

  Next, the sub CPU 400 sets the scaler activation setting flag in the flag storage area of the sub RAM board 41 to ‘ON’ (S322). Thereafter, the sub CPU 400 ends the process at the time of receiving the scaler activation parameter request.

[Scaler setting change processing]
FIG. 79 shows scaler setting change processing by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 extracts the setting change contents of the scaler setting value received as an argument (S331).

  Next, the sub CPU 400 determines whether or not the setting change content is the output screen division setting number (S332). When the setting change content is the output screen division setting number (S332: Yes), the sub CPU 400 proceeds to the next processing of S333. When the setting change content is not the output screen division setting number (S332: No), the sub CPU 400 proceeds to the process of S334.

  Next, the sub CPU 400 performs output screen division setting number command transmission processing (S333). In this process, the sub CPU 400 rewrites the output screen division setting number in the scaler setting value storage area of the sub RAM board 41, and designates output patterns 0 to 3 as the output screen division setting numbers 1 to 4 'output screen. The command of the division setting number (see CMD: 05H shown in the right column of FIG. 54) ′ is transmitted to the scaler substrate SK. Thereafter, the sub CPU 400 ends the scaler setting change process.

  In step S334, the sub CPU 400 determines whether the setting change content is output screen resolution setting. If the setting change content is output screen resolution setting (S334: Yes), the sub CPU 400 proceeds to the next process of S335. If the setting change content is not the output screen resolution setting (S334: No), the sub CPU 400 proceeds to the process of S336.

  Next, the sub CPU 400 performs output screen resolution setting command transmission processing (S335). In this processing, the sub CPU 400 rewrites the output screen resolution in the scaler setting value storage area of the sub RAM board 41, and outputs screen number (1-4), horizontal resolution (480-4060), vertical as the output screen resolution setting. A command of “output screen resolution setting (see CMD: 06H shown in the right column of FIG. 54)” for specifying the resolution (240 to 1600) is transmitted to the scaler substrate SK. Thereafter, the sub CPU 400 ends the scaler setting change process. Specifically, as an example, when the output screen division setting number is “2”, an output screen resolution setting command is transmitted to the scaler substrate SK twice (two periods (400 msec)). Output screen number: 1 for the first time, horizontal resolution and vertical resolution corresponding to the output screen number: 1, output screen number: 2 for the second time, horizontal resolution and vertical resolution corresponding to the output screen number: 2 Sent. Similarly, in the case of an input screen resolution setting command described later, the input screen resolution setting command is transmitted to the scaler substrate SK a number of times corresponding to the number of input screen division settings.

  In S336, the sub CPU 400 determines whether or not the setting change content is the input screen division setting number. When the setting change content is the number of input screen division settings (S336: Yes), the sub CPU 400 proceeds to the next processing of S337. If the setting change content is not the input screen division setting number (S336: No), the sub CPU 400 proceeds to the process of S338.

  Next, the sub CPU 400 performs input screen division setting number command transmission processing (S337). In this processing, the sub CPU 400 rewrites the input screen division setting number in the scaler setting value storage area of the sub RAM board 41, and designates 1 or 2 as the input screen division setting number (input screen division setting number (FIG. 54)). (CMD: Refer to 07H in the right column) 'command is transmitted to the scaler substrate SK. Thereafter, the sub CPU 400 ends the scaler setting change process.

  In S338, the sub CPU 400 determines whether the setting change content is an input screen resolution setting. When the setting change content is the input screen resolution setting (S338: Yes), the sub CPU 400 proceeds to the next step S339. When the setting change content is not the input screen resolution setting (S338: No), the sub CPU 400 ends the scaler setting change process.

  Next, the sub CPU 400 performs an input screen resolution setting command transmission process (S339). In this process, the sub CPU 400 rewrites the input screen resolution in the scaler setting value storage area of the sub RAM board 41, and the input pattern (0, 1) corresponding to the input screen number (1, 2) is set as the input screen resolution setting. , A command of “input screen resolution setting (see CMD: 08H shown in the right column of FIG. 54)” for specifying the horizontal resolution (480 to 4060) and the vertical resolution (240 to 1600) is transmitted to the scaler substrate SK. . Thereafter, the sub CPU 400 ends the scaler setting change process. Such scaler setting change processing is executed when an operator of the gaming machine manufacturing factory performs a menu operation using the sub liquid crystal display device DD19 and the touch panel DD19T.

[Processing when the scaler status command is received]
FIG. 80 shows processing at the time of receiving a scaler status command by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 extracts a value from “D1” of the received data indicating the status, and determines whether or not the status type is output setting (S341). When the status type is output setting (S341: Yes), the sub CPU 400 proceeds to the next process of S342. If the status type is not output setting (S341: No), that is, if it is input setting, the sub CPU 400 proceeds to the process of S343.

  Next, the sub CPU 400 stores the output screen resolution data stored after “D2” of the status reception data in the scaler setting confirmation storage area of the sub RAM board 41 (S342). As shown in FIG. 54, the output screen resolution data includes the output division number (1 to 4), the output first to fourth screen horizontal resolution (0 to 4060), and the output first to fourth screen vertical resolution (0 to 1600). Is included. Thereafter, the sub CPU 400 proceeds to the process of S344.

  In step S <b> 343, the sub CPU 400 stores the input screen resolution data stored after “D <b> 2” of the status reception data in the scaler setting confirmation storage area of the sub RAM board 41. As shown in FIG. 54, the input screen resolution data includes the number of input divisions (1 or 2), the input first and second screen horizontal resolution (0 to 4060), and the input first and second screen vertical resolution (0 to 1600). It is.

  Next, the sub CPU 400 performs status request completion command transmission processing (S344). In this process, the sub CPU 400 transmits a command indicating completion of the status request to the scaler substrate SK. Thereafter, the sub CPU 400 ends the process at the time of receiving the scaler status command.

[Processing on receipt of scaler reception confirmation]
FIG. 81 shows processing at the time of receiving a scaler reception confirmation by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 determines whether or not the scaler setting changing flag in the flag storage area of the sub RAM board 41 is “ON” (S351). When the scaler setting changing flag is “ON” (S351: Yes), the sub CPU 400 proceeds to the next process of S352. When the scaler setting changing flag is not “ON” (S351: No), the sub CPU 400 ends the process of receiving the scaler reception confirmation.

  Next, the sub CPU 400 acquires the setting change content (the scaler setting value before the change) from the scaler setting value storage area of the sub RAM board 41 (S352).

  Next, the sub CPU 400 determines whether or not the scaler setting value storage area is an end block (-1 or 0FFFFH is stored) (S353). When the scaler set value storage area is an end block (S353: Yes), the sub CPU 400 proceeds to the process of S356. When the scaler set value storage area is not an end block (S353: No), the sub CPU 400 proceeds to the next process of S354.

  Next, the sub CPU 400 performs a scaler setting change process (S354). This processing is as shown in FIG.

  Next, the sub CPU 400 updates the data acquisition position (block number) in the scaler set value storage area (S355). Thereafter, the sub CPU 400 ends the process for receiving the scaler reception confirmation.

  In S356, the sub CPU 400 performs a setting completion command transmission process. In this process, the sub CPU 400 transmits to the scaler substrate SK a command indicating “setting completion (see CMD: 02H shown in the right column of FIG. 54)” of the scaler setting value.

  Next, the sub CPU 400 sets the scaler setting changing flag in the flag storage area of the sub RAM board 41 to 'OFF' (S357). Thereafter, the sub CPU 400 ends the process for receiving the scaler reception confirmation.

[Sub LCD control processing]
FIG. 82 shows sub liquid crystal control processing by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 indicates that the transmission source ID of the reception data temporarily stored in the sub device reception storage area of the sub RAM board 41 indicates “sub liquid crystal (ID: 04H shown in FIG. 53)”. It is determined whether or not (S361). When the transmission source ID indicates “sub liquid crystal” (S361: Yes), the sub CPU 400 proceeds to the next process of S362. When the transmission source ID does not indicate “sub liquid crystal” (S361: No), the sub CPU 400 ends the sub liquid crystal control process.

  Next, the sub CPU 400 performs a sub liquid crystal control reception data consistency check process for controlling the sub liquid crystal display device DD19 and the touch panel DD19T (S362). In this processing, the sub CPU 400 determines whether or not the value of the command ID included in the received data matches the values of “41H” to “45H” indicating the transmission command from the sub liquid crystal I / F substrate SL shown in FIG. And check results are returned as return values.

  Next, the sub CPU 400 determines whether there is an abnormality in the consistency of the received data from the return value of the check result (S363). If there is an abnormality in the consistency of the received data (S363: Yes), the sub CPU 400 proceeds to the process of the next S364. If there is no abnormality in the consistency of received data (S363: No), the sub CPU 400 proceeds to the process of S365.

  Next, the sub CPU 400 discards the data in the sub device reception storage area (S364). Thereafter, the sub CPU 400 ends the sub liquid crystal control process.

  In S365, the sub CPU 400 performs a sub liquid crystal control reception process. This process will be described later with reference to FIG. Thereafter, the sub CPU 400 ends the sub liquid crystal control process.

[Sub LCD control reception processing]
FIG. 83 shows sub liquid crystal control reception processing by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 copies received data from the sub device reception storage area of the sub RAM board 41 to the sub liquid crystal control reception storage area (S371).

  Next, the sub CPU 400 determines whether or not the command (reception command) acquired from the reception data is “activation parameter request (see CMD: 41H shown in the left column of FIG. 55)” (S372). When the received command is “activation parameter request” (S372: Yes), the sub CPU 400 proceeds to the process of the next S373. When the received command is not “activation parameter request” (S372: No), the sub CPU 400 proceeds to the process of S374.

  Next, the sub CPU 400 performs a sub liquid crystal activation parameter request reception process (S373). This process will be described later with reference to FIG. Thereafter, the sub CPU 400 ends the sub liquid crystal control reception process.

  In S374, the sub CPU 400 determines whether or not the command (reception command) acquired from the reception data is “parameter request (see CMD: 42H shown in the left column of FIG. 55)”. When the received command is “parameter request” (S374: Yes), the sub CPU 400 proceeds to the next process of S375. If the received command is not a “parameter request” (S374: No), the sub CPU 400 proceeds to the process of S381.

  Next, the sub CPU 400 determines whether or not there is a request to change the sub liquid crystal setting value based on the parameter value (see D1: 01H shown in the left column of FIG. 55) included in the parameter request reception command (see FIG. 55). S375). When there is a request for changing the sub liquid crystal setting value (S375: Yes), the sub CPU 400 proceeds to the process of the next S376. If there is no sub liquid crystal set value change request (S375: No), the sub CPU 400 proceeds to the process of S379.

  Next, the sub CPU 400 sets the sub liquid crystal setting changing flag in the flag storage area of the sub RAM board 41 to ‘ON’ (S <b> 376).

  Next, the sub CPU 400 acquires the setting change content (sub liquid crystal setting value to be changed) from the sub liquid crystal setting value storage area (see FIG. 62) (S377).

  Next, the sub CPU 400 performs a sub liquid crystal setting change process using the acquired setting change content as an argument (S378). This process will be described later with reference to FIG. Thereafter, the sub CPU 400 ends the sub liquid crystal control reception process.

  In S379, the sub CPU 400 determines whether or not there is a status request from the sub liquid crystal I / F substrate SL based on the parameter value (see D1: 02H shown in the left column of FIG. 55) included in the parameter request reception command. Determine. When there is a status request (S379: Yes), the sub CPU 400 proceeds to the next process of S380. When there is no status request (S379: No), the sub CPU 400 ends the sub liquid crystal control reception process.

  Next, the sub CPU 400 performs status request command transmission processing (S380). In this process, the sub CPU 400 transmits a status request command to the sub liquid crystal I / F substrate SL. Thereafter, the sub CPU 400 ends the sub liquid crystal control reception process.

  In S381, the sub CPU 400 determines whether or not the command (reception command) acquired from the reception data is “status” (see CMD: 43H shown in the left column of FIG. 55). If the received command is 'status' (S381: Yes), the sub CPU 400 proceeds to the next process of S382. If the received command is not 'status' (S381: No), the sub CPU 400 proceeds to the process of S383.

  Next, the sub CPU 400 performs a sub liquid crystal status command reception process (S382). This process will be described later with reference to FIG. Thereafter, the sub CPU 400 ends the sub liquid crystal control reception process.

  In S383, the sub CPU 400 determines whether or not the command (reception command) acquired from the received data is “reception confirmation (see CMD: 44H shown in the left column of FIG. 55)”. When the reception command is “reception confirmation” (S383: Yes), the sub CPU 400 proceeds to the next process of S384. When the received command is not “reception confirmation” (S383: No), the sub CPU 400 proceeds to the process of S385.

  Next, the sub CPU 400 performs a sub liquid crystal reception confirmation reception process (S384). This process will be described later with reference to FIG.

  In S385, the sub CPU 400 determines whether or not the command (reception command) acquired from the reception data is “error notification (see CMD: 45H shown in the left column of FIG. 55)”. When the received command is “error notification” (S385: Yes), the sub CPU 400 proceeds to the next step S386. When the received command is not “error notification” (S385: No), the sub CPU 400 ends the sub liquid crystal control reception processing.

  Next, the sub CPU 400 performs processing when a sub liquid crystal error occurs (S386).

  Next, the sub CPU 400 performs sound sub liquid crystal error generation output to the speaker group 62 to notify the error of the sub liquid crystal I / F substrate SL (sub liquid crystal display device DD19 or touch panel DD19T) by sound, and at the same time, An LED sub liquid crystal error occurrence lighting request is made to the LED group 61 in order to notify the error by the light emission mode (S387). Thereafter, the sub CPU 400 ends the sub liquid crystal control reception process.

[Sub LCD startup parameter request reception processing]
FIG. 84 shows a sub liquid crystal activation parameter request reception process by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 performs a start parameter request confirmation command transmission process (S391). In this process, the sub CPU 400 transmits a “start parameter request confirmation” command to the sub liquid crystal I / F substrate SL.

  Next, the sub CPU 400 sets the sub liquid crystal activation time setting flag in the flag storage area of the sub RAM board 41 to 'ON' (S392). Thereafter, the sub CPU 400 ends the sub liquid crystal activation parameter request reception process.

[Sub LCD setting change processing]
FIG. 85 shows sub liquid crystal setting change processing by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 extracts the setting change content of the sub liquid crystal setting value received as an argument (S401).

  Next, the sub CPU 400 determines whether or not the setting change content is a sub liquid crystal screen resolution setting (S402). When the setting change content is the sub liquid crystal screen resolution setting (S402: Yes), the sub CPU 400 proceeds to the next process of S403. When the setting change content is not the sub liquid crystal screen resolution setting (S402: No), the sub CPU 400 proceeds to the process of S404.

  Next, the sub CPU 400 performs a sub liquid crystal screen resolution setting command transmission process (S403). In this processing, the sub CPU 400 rewrites the sub liquid crystal screen resolution in the sub liquid crystal setting value storage area of the sub RAM board 41 and sets a sub liquid crystal screen resolution (see CMD: 45H shown in the right column of FIG. 55). Is transmitted to the sub liquid crystal I / F substrate SL. Thereafter, the sub CPU 400 ends the sub liquid crystal setting change process.

  In step S404, the sub CPU 400 determines whether the setting change content is a sub liquid crystal luminance setting. When the setting change content is the sub liquid crystal luminance setting (S404: Yes), the sub CPU 400 proceeds to the next process of S405. When the setting change content is not the sub liquid crystal luminance setting (S404: No), the sub CPU 400 ends the sub liquid crystal setting changing process.

  Next, the sub CPU 400 performs a sub liquid crystal brightness setting command transmission process (S405). In this processing, the sub CPU 400 rewrites the sub liquid crystal luminance in the sub liquid crystal setting value storage area of the sub RAM substrate 41 and sets a sub liquid crystal luminance command (see CMD: 46H shown in the right column of FIG. 55). Transmit to the liquid crystal I / F substrate SL. Thereafter, the sub CPU 400 ends the sub liquid crystal setting change process.

[Process when receiving sub LCD status command]
FIG. 86 shows processing at the time of receiving a sub liquid crystal status command by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 extracts a value from “D1” of the received data indicating the status, and determines whether or not the status type is a touch input based on the value (S411). When the status type is touch input (S411: Yes), the sub CPU 400 proceeds to the next process of S412. If the status type is not touch input (S411: No), that is, if it is liquid crystal setting, the sub CPU 400 proceeds to the process of S413.

  Next, the sub CPU 400 stores the touch input data included in the status reception command in the touch panel input storage area of the sub RAM board 41 (S412). As shown in FIG. 55, the touch input data includes an input type and input X and Y coordinates related to the touch panel DD19T. Thereafter, the sub CPU 400 proceeds to the process of S414.

  In step S413, the sub CPU 400 stores the liquid crystal setting data included in the status reception command in the sub liquid crystal setting confirmation storage area of the sub RAM board 41. As shown in FIG. 55, the liquid crystal setting data includes horizontal resolution (200 to 800) and vertical resolution (200 to 800).

  Next, the sub CPU 400 performs status request completion command transmission processing (S414). In this process, the sub CPU 400 transmits a command indicating completion of the status request (see CMD: 44H shown in the right column of FIG. 55) to the sub liquid crystal I / F substrate SL. Thereafter, the sub CPU 400 ends the sub liquid crystal status command reception process.

[Sub liquid crystal reception confirmation reception processing]
FIG. 87 shows a sub liquid crystal reception confirmation reception process by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 determines whether or not the sub liquid crystal setting changing flag in the flag storage area of the sub RAM board 41 is 'ON' (S421). When the sub liquid crystal setting changing flag is “ON” (S421: Yes), the sub CPU 400 proceeds to the next processing of S422. When the sub liquid crystal setting changing flag is not “ON” (S421: No), the sub CPU 400 ends the sub liquid crystal reception confirmation reception process.

  Next, the sub CPU 400 acquires setting change contents (sub liquid crystal setting values to be changed) from the sub liquid crystal setting value storage area (see FIG. 62) of the sub RAM board 41 (S422).

  Next, the sub CPU 400 determines whether or not the sub liquid crystal setting value storage area is an end block (S423). When the sub liquid crystal set value storage area is an end block (S423: Yes), the sub CPU 400 proceeds to the process of S426. When the sub liquid crystal set value storage area is not an end block (S423: No), the sub CPU 400 proceeds to the next process of S424.

  Next, the sub CPU 400 performs a sub liquid crystal setting change process using the acquired setting change content as an argument (S424). This process is as shown in FIG.

  Next, the sub CPU 400 updates the data acquisition position (block number) in the sub liquid crystal set value storage area (S425). Thereafter, the sub CPU 400 ends the sub liquid crystal reception confirmation reception process.

  In S426, the sub CPU 400 performs a setting completion command transmission process. In this process, the sub CPU 400 transmits a command indicating the completion of the setting of the sub liquid crystal setting value (see CMD: 42H shown in the right column of FIG. 55) to the sub liquid crystal I / F substrate SL.

  Next, the sub CPU 400 sets the sub liquid crystal setting changing flag in the flag storage area of the sub RAM board 41 to ‘OFF’ (S427). Thereafter, the sub CPU 400 ends the sub liquid crystal reception confirmation reception process.

[Projector control processing]
FIG. 88 shows projector control processing by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 determines whether or not the transmission source ID of the reception data temporarily stored in the sub device reception storage area of the sub RAM board 41 indicates “projector (see ID: 03H shown in FIG. 53)”. Is determined (S431). When the transmission source ID indicates “projector” (S431: Yes), the sub CPU 400 proceeds to the next process of S432. When the transmission source ID does not indicate “projector” (S431: No), the sub CPU 400 ends the projector control process.

  Next, the sub CPU 400 performs a projector control received data consistency check process for controlling the projector device B2 (S432). In this process, the sub CPU 400 checks whether or not the value of the command ID included in the received data matches the value of “81H” to “8BH” indicating the transmission command from the projector control board B23 shown in FIG. The check result is returned as a return value.

  Next, the sub CPU 400 determines whether there is an abnormality in the consistency of the received data from the return value of the check result (S433). If there is an abnormality in the consistency of received data (S433: Yes), the sub CPU 400 proceeds to the process of the next S434. When there is no abnormality in the consistency of received data (S433: No), the sub CPU 400 proceeds to the process of S435.

  Next, the sub CPU 400 discards the data in the sub device reception storage area (S434). Thereafter, the sub CPU 400 ends the projector control process.

  In S435, the sub CPU 400 performs projector control reception processing. This process will be described later with reference to FIG.

  Next, the sub CPU 400 performs projector drift processing (S436). This process will be described later with reference to FIG. Thereafter, the sub CPU 400 ends the projector control process.

[Processing during projector control reception]
FIG. 89 shows projector control reception processing by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 copies received data from the sub device reception storage area of the sub RAM board 41 to the projector control reception storage area (S441).

  Next, the sub CPU 400 determines whether or not the command (reception command) acquired from the reception data is “activation parameter request (see CMD: 81H shown in the left column of FIG. 56)” (S442). When the received command is “activation parameter request” (S442: Yes), the sub CPU 400 proceeds to the process of the next S443. When the received command is not the “activation parameter request” (S442: No), the sub CPU 400 proceeds to the process of S444.

  Next, the sub CPU 400 performs a projector activation parameter request reception process (S443). This process will be described later with reference to FIG. Thereafter, the sub CPU 400 ends the projector control reception process.

  In S444, the sub CPU 400 determines whether or not the command (reception command) acquired from the received data is “parameter request (see CMD: 82H shown in the left column of FIG. 56)”. If the received command is “parameter request” (S444: Yes), the sub CPU 400 proceeds to the next process of S445. If the received command is not a “parameter request” (S444: No), the sub CPU 400 proceeds to the process of S451.

  Next, the sub CPU 400 makes a projector setting value change request (see CMD: 82H and D1: 01H shown in the left column of FIG. 56) based on the parameter value (see FIG. 56) included in the parameter request reception command. It is determined whether or not there is (S445). If there is a request to change the projector setting value (S445: Yes), the sub CPU 400 proceeds to the next process of S446. When there is no request for changing the projector setting value (S445: No), the sub CPU 400 proceeds to the process of S449.

  Next, the sub CPU 400 sets the projector setting changing flag in the flag storage area of the sub RAM board 41 to “ON” (S446).

  Next, the sub CPU 400 acquires the setting change content (the projector setting value to be changed) from the projector setting value storage area (S447).

  Next, the sub CPU 400 performs projector setting change processing using the acquired setting change content as an argument (S448). This process will be described later with reference to FIG. Thereafter, the sub CPU 400 ends the projector control reception process.

  In S449, the sub CPU 400 requests a status request from the projector control board B23 (see CMD: 82H and D1: 02H shown in the left column of FIG. 56) based on the parameter value (see FIG. 56) included in the parameter request reception command. It is determined whether or not there is. If there is a status request (S449: Yes), the sub CPU 400 proceeds to the next process of S450. If there is no status request (S449: No), the sub CPU 400 ends the projector control reception process.

  Next, the sub CPU 400 performs a status request command transmission process (S450). In this process, the sub CPU 400 transmits a status request command to the projector control board B23. Thereafter, the sub CPU 400 ends the projector control reception process.

  In S451, the sub CPU 400 determines whether or not the command (reception command) acquired from the received data is “reception confirmation (see CMD: 83H shown in the left column of FIG. 56)”. When the reception command is “reception confirmation” (S451: Yes), the sub CPU 400 proceeds to the next process of S452. If the reception command is not 'reception confirmation' (S451: No), the sub CPU 400 proceeds to the process of S453.

  Next, the sub CPU 400 performs a projector reception confirmation reception process (S452). This process will be described later with reference to FIG.

  In S453, the sub CPU 400 determines whether or not the command (reception command) acquired from the received data is “error notification (see CMD: 84H shown in the left column of FIG. 56)”. When the received command is “error notification” (S453: Yes), the sub CPU 400 proceeds to the next process of S454. If the received command is not “error notification” (S453: No), the sub CPU 400 proceeds to the process of S455.

  Next, the sub CPU 400 performs a projector error notification reception process (S454). This process will be described later with reference to FIG. Thereafter, the sub CPU 400 ends the projector control reception process.

  In S455, the sub CPU 400 determines whether or not the command (reception command) acquired from the reception data is a status-related command (see CMD: 85H to 8BH shown in the left column of FIG. 56). If the received command is a status-related command (S455: Yes), the sub CPU 400 proceeds to the next process of S456. If the received command is not a status-related command (S455: No), the sub CPU 400 ends the projector control reception process.

  Next, the sub CPU 400 performs a projector status reception process (S456). This process will be described later with reference to FIG. Thereafter, the sub CPU 400 ends the projector control reception process.

[Projector startup parameter request reception processing]
FIG. 90 shows a projector activation parameter request reception process by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 performs a start parameter request confirmation command transmission process (S461). In this processing, the sub CPU 400 transmits a “start parameter request confirmation” command to the projector control board B23.

  Next, the sub CPU 400 sets the projector startup setting flag in the flag storage area of the sub RAM board 41 to ‘ON’ (S462). Thereafter, the sub CPU 400 terminates the projector activation parameter request reception process.

[Projector setting change processing]
FIG. 91 shows projector setting change processing by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 extracts the setting change content of the projector setting value received as an argument (S471).

  Next, the sub CPU 400 determines whether or not the setting change content is a horizontal position offset (horizontal position A to E offset) (S472). When the setting change content is a horizontal position offset (S472: Yes), the sub CPU 400 proceeds to the next process of S473. When the setting change content is not the horizontal position offset (S472: No), the sub CPU 400 proceeds to the process of S474.

  Next, the sub CPU 400 performs horizontal position offset command transmission processing (S473). In this process, the sub CPU 400 rewrites the horizontal position offset (horizontal position A to E offset) in the projector set value storage area of the sub RAM board 41 and sets a command for setting the horizontal position offset (in the right column of FIG. 56). CMD: see 88H) is transmitted to the projector control board B23. Thereafter, the sub CPU 400 ends the projector setting change process.

  In S474, the sub CPU 400 determines whether or not the setting change content is a vertical position offset (vertical direction positions A to E offset). When the setting change content is the vertical position offset (S474: Yes), the sub CPU 400 proceeds to the next process of S475. When the setting change content is not the vertical position offset (S474: No), the sub CPU 400 proceeds to the process of S476.

  Next, the sub CPU 400 performs vertical position offset command transmission processing (S475). In this processing, the sub CPU 400 rewrites the vertical position offset (vertical direction positions A to E offset) in the projector setting value storage area of the sub RAM board 41 and sets a command for setting the vertical position offset (in the right column of FIG. 56). CMD: 8AH shown) is transmitted to the projector control board B23. Thereafter, the sub CPU 400 ends the projector setting change process.

  In S476, the sub CPU 400 determines whether or not the setting change content is a focus offset (focus position offsets A to E). When the setting change content is a focus offset (S476: Yes), the sub CPU 400 proceeds to the next process of S477. When the setting change content is not the focus offset (S476: No), the sub CPU 400 proceeds to the process of S478.

  Next, the sub CPU 400 performs a focus position offset command transmission process (S477). In this processing, the sub CPU 400 rewrites the focus position offsets A to E in the projector setting value storage area of the sub RAM board 41 and sets the focus position offsets A to E (CMD: shown in the right column of FIG. 56: 8FH reference) is transmitted to the projector control board B23. Thereafter, the sub CPU 400 ends the projector setting change process.

  In S478, the sub CPU 400 determines whether or not the setting change content is focus drift correction (focus drift correction values A to E). If the setting change content is focus drift correction (S478: Yes), the sub CPU 400 proceeds to the next process of S479. If the setting change content is not focus drift correction (S478: No), the sub CPU 400 proceeds to the process of S480.

  Next, the sub CPU 400 performs focus drift correction value command transmission processing (S479). In this processing, the sub CPU 400 rewrites the focus drift correction values A to E in the projector set value storage area of the sub RAM board 41 and sets the focus drift correction values A to E (shown in the right column of FIG. 56). CMD: 91H) is transmitted to the projector control board B23. Thereafter, the sub CPU 400 ends the projector setting change process.

  In S480, the sub CPU 400 determines whether or not the setting change content is LED brightness setting. When the setting change content is LED brightness setting (S480: Yes), the sub CPU 400 proceeds to the next processing of S481. When the setting change content is not LED brightness setting (S480: No), the sub CPU 400 proceeds to the process of S482.

  Next, the sub CPU 400 performs LED brightness setting command transmission processing (S481). In this process, the sub CPU 400 rewrites the LED brightness setting in the projector set value storage area of the sub RAM board 41, and issues a command (see CMD: 85H shown in the right column of FIG. 56) for setting the LED brightness to the projector control board. Transmit to B23. Thereafter, the sub CPU 400 ends the projector setting change process.

  In S482, the sub CPU 400 determines whether or not the setting change content is a trapezoidal distortion correction value. When the setting change content is a trapezoidal distortion correction value (S482: Yes), the sub CPU 400 proceeds to the next process of S483. When the setting change content is not the trapezoidal distortion correction value (S482: No), the sub CPU 400 proceeds to the process of S484.

  Next, the sub CPU 400 performs trapezoidal distortion correction value command transmission processing (S483). In this processing, the sub CPU 400 rewrites the trapezoidal distortion correction value in the projector set value storage area of the sub RAM board 41 and sets a command (see CMD: 86H shown in the right column of FIG. 56) for setting the trapezoidal distortion correction value. Transmit to the projector control board B23. Thereafter, the sub CPU 400 ends the projector setting change process.

  In step S484, the sub CPU 400 determines whether the setting change content is a contrast setting. When the setting change content is the contrast setting (S484: Yes), the sub CPU 400 proceeds to the next process of S485. If the setting change content is not the contrast setting (S484: No), the sub CPU 400 proceeds to the process of S486.

  Next, the sub CPU 400 performs contrast setting command transmission processing (S485). In this process, the sub CPU 400 rewrites the contrast setting in the projector setting value storage area of the sub RAM board 41 and sends a command (see CMD: 8CH shown in the right column of FIG. 56) for setting the contrast to the projector control board B23. Send to. Thereafter, the sub CPU 400 ends the projector setting change process.

  In S486, the sub CPU 400 determines whether or not the setting change content is gamma setting. If the setting change content is gamma setting (S486: Yes), the sub CPU 400 proceeds to the next processing of S487. If the setting change content is not gamma setting (S486: No), the sub CPU 400 proceeds to the process of S488.

  Next, the sub CPU 400 performs gamma setting command transmission processing (S487). In this process, the sub CPU 400 rewrites the gamma setting in the projector setting value storage area of the sub RAM board 41 and sends a command (see CMD: 8EH shown in the right column of FIG. 56) for setting the gamma value to the projector control board B23. Send to. Thereafter, the sub CPU 400 ends the projector setting change process.

  In step S488, the sub CPU 400 determines whether the setting change content is a white color temperature. If the setting change content is the white color temperature (S488: Yes), the sub CPU 400 proceeds to the next process of S489. When the setting change content is not the white color temperature (S488: No), the sub CPU 400 proceeds to the process of S490.

  Next, the sub CPU 400 performs white color temperature command transmission processing (S489). In this process, the sub CPU 400 rewrites the white color temperature in the projector set value storage area of the sub RAM board 41 and controls the command for setting the white color temperature (see CMD: 87H shown in the right column of FIG. 56). Transmit to the substrate B23. Thereafter, the sub CPU 400 ends the projector setting change process.

  In S490, the sub CPU 400 determines whether or not the setting change content is brightness. If the setting change content is brightness (S490: Yes), the sub CPU 400 proceeds to the next processing of S491. When the setting change content is not brightness (S490: No), the sub CPU 400 proceeds to the process of S492.

  Next, the sub CPU 400 performs a brightness command transmission process (S491). In this processing, the sub CPU 400 rewrites the brightness in the projector set value storage area of the sub RAM board 41 and sends a command (see CMD: 8CH shown in the right column of FIG. 56) for setting the brightness to the projector control board B23. To send. Thereafter, the sub CPU 400 ends the projector setting change process.

  In S492, the sub CPU 400 determines whether the setting change content is a test pattern. When the setting change content is a test pattern (S492: Yes), the sub CPU 400 proceeds to the next process of S493. If the setting change content is not a test pattern (S492: No), the sub CPU 400 ends the projector setting change process.

  Next, the sub CPU 400 performs a test pattern command transmission process (S493). In this processing, the sub CPU 400 rewrites the test pattern in the projector set value storage area of the sub RAM board 41, and sends a command (see CMD: 92H shown in the right column of FIG. 56) for setting the test pattern to the projector control board B23. Send to. Thereafter, the sub CPU 400 ends the projector setting change process. Such projector setting change processing is executed when a maintenance worker in the game hall or an inspection worker makes various optical adjustments to the projector device B2 before shipment from the factory.

[Projector reception confirmation reception process]
FIG. 92 shows processing upon reception of a projector reception confirmation by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 determines whether or not the projector setting changing flag in the flag storage area of the sub RAM board 41 is 'ON' (S501). When the projector setting changing flag is “ON” (S501: Yes), the sub CPU 400 proceeds to the next process of S502. If the projector setting changing flag is not “ON” (S501: No), the sub CPU 400 ends the process for receiving the projector reception confirmation.

  Next, the sub CPU 400 acquires setting change contents (projector setting values to be changed) from the projector setting value storage area of the sub RAM board 41 (S502).

  Next, the sub CPU 400 determines whether or not the projector setting value storage area is an end block (S503). When the projector setting value storage area is an end block (S503: Yes), the sub CPU 400 proceeds to the process of S506. If the projector setting value storage area is not an end block (S503: No), the sub CPU 400 proceeds to the next step S504.

  Next, the sub CPU 400 performs projector setting change processing using the acquired setting change content as an argument (S504). This process is as shown in FIG.

  Next, the sub CPU 400 updates the data acquisition position (block number) in the projector setting value storage area (S505). Thereafter, the sub CPU 400 ends the process for receiving the reception confirmation of the projector.

  In S506, the sub CPU 400 performs a setting completion command transmission process. In this process, the sub CPU 400 transmits a command (see CMD: 82H shown in the right column of FIG. 56) indicating completion of setting of the projector setting value to the projector control board B23.

  Next, the sub CPU 400 sets the projector setting changing flag in the flag storage area of the sub RAM board 41 to 'OFF' (S507). Thereafter, the sub CPU 400 ends the process for receiving the reception confirmation of the projector.

[Processing when receiving projector error notifications]
FIG. 93 shows processing at the time of receiving a projector error notification by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 performs projector error occurrence processing in response to an error notification from the projector control board B23 (S511).

  Next, the sub CPU 400 outputs a projector error occurrence display request to the sub liquid crystal I / F substrate SL in order to display the error of the projector control board B23 (projector device B2) on the sub liquid crystal display device DD19 (S512). ).

  Next, the sub CPU 400 makes a sound projector error occurrence output request to the speaker group 62 to notify the error of the projector control board B23 (projector apparatus B2) by sound (S513). Thereafter, the sub CPU 400 ends the projector error notification reception process.

[Processing when projector status is received]
FIG. 94 shows a projector status reception process by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 determines whether or not the type of the command acquired from the projector control board B23 by reception is 'LED temperature (see CMD: 85H shown in the left column of FIG. 56)' (S521). . When the command type is “LED temperature” (S521: Yes), the sub CPU 400 proceeds to the next process of S522. When the command type is not “LED temperature” (S521: No), the sub CPU 400 proceeds to the process of S523.

  Next, the sub CPU 400 stores the LED temperature data included in the acquired command as a status (parameter value, CMD: 85H, refer to D1 to D3 shown in the left column of FIG. 56) in the projector status storage area of the sub RAM board 41. (S522). Thereafter, the sub CPU 400 proceeds to the process of S535.

  In S523, the sub CPU 400 determines whether or not the type of the command acquired from the projector control board B23 by reception is “FAN rotation speed (see CMD: 86H shown in the left column of FIG. 56)”. When the command type is 'FAN rotation speed' (S523: Yes), the sub CPU 400 proceeds to the next process of S524. When the command type is not “FAN rotation speed” (S523: No), the sub CPU 400 proceeds to the process of S525.

  Next, the sub CPU 400 stores the FAN rotational speed data included in the acquired command as the status (parameter value, CMD: 86H, refer to D1 to D3 shown in the left column of FIG. 56) in the projector status storage area of the sub RAM board 41. (S524). Thereafter, the sub CPU 400 proceeds to the process of S535.

  In S525, the sub CPU 400 determines whether or not the type of the command acquired from the projector control board B23 by reception is “LED brightness (see CMD: 87H shown in the left column of FIG. 56)”. If the command type is 'LED brightness' (S525: Yes), the sub CPU 400 proceeds to the next process of S526. If the command type is not 'LED luminance' (S525: No), the sub CPU 400 proceeds to the process of S527.

  Next, the sub CPU 400 saves the LED luminance data included in the acquired command as a status (parameter value, CMD: 87H, refer to D1 to D3 shown in the left column of FIG. 56) in the projector status storage area of the sub RAM board 41. (S526). Thereafter, the sub CPU 400 proceeds to the process of S535.

  In S527, the sub CPU 400 determines whether or not the type of the command acquired from the projector control board B23 by reception is “horizontal adjustment value (see CMD: 88H shown in the left column of FIG. 56)”. When the command type is “horizontal adjustment value” (S527: Yes), the sub CPU 400 proceeds to the next processing of S528. When the command type is not “horizontal adjustment value” (S527: No), the sub CPU 400 proceeds to the process of S529.

  Next, the sub CPU 400 saves the horizontal direction adjustment value included in the acquired command as a status (parameter value, CMD: 88H, D1 to D10 shown in the left column of FIG. 56) in the projector status storage area of the sub RAM board 41. (S528). Thereafter, the sub CPU 400 proceeds to the process of S535.

  In step S529, the sub CPU 400 determines whether or not the command type acquired from the projector control board B23 by reception is “vertical adjustment value (CMD: 89H shown in the left column of FIG. 56)”. When the command type is 'vertical adjustment value' (S529: Yes), the sub CPU 400 proceeds to the next process of S530. When the command type is not “vertical adjustment value” (S529: No), the sub CPU 400 proceeds to the process of S531.

  Next, the sub CPU 400 stores the vertical adjustment value included in the acquired command as a status (parameter value, CMD: 89H, see D1 to D5 shown in the left column of FIG. 56) in the projector status storage area of the sub RAM board 41. (S530). Thereafter, the sub CPU 400 proceeds to the process of S535.

  In S531, the sub CPU 400 determines whether or not the type of command acquired from the projector control board B23 by reception is “focus adjustment value (CMD: refer to 8AH shown in the left column of FIG. 56)”. When the command type is 'focus adjustment value' (S531: Yes), the sub CPU 400 proceeds to the next process of S532. If the command type is not 'focus adjustment value' (S531: No), the sub CPU 400 proceeds to the process of S533.

  Next, the sub CPU 400 stores the focus adjustment value included in the acquired command as a status (parameter value, CMD: 8AH, see D1 to D10 shown in the left column of FIG. 56) in the projector status storage area of the sub RAM board 41. (S532). Thereafter, the sub CPU 400 proceeds to the process of S535.

  In S533, the sub CPU 400 determines whether or not the command type acquired from the projector control board B23 by reception is “drift correction temperature (see CMD: 8BH shown in the left column of FIG. 56)”. If the command type is 'drift correction temperature' (S533: Yes), the sub CPU 400 proceeds to the next process of S534. If the command type is not 'drift correction temperature' (S533: No), the sub CPU 400 proceeds to the process of S535.

  Next, the sub CPU 400 stores the drift temperature included in the acquired command as a status (parameter value, see CMD: 8BH, D1 shown in the left column of FIG. 56) in the projector status storage area of the sub RAM board 41 (S534). .

  Next, the sub CPU 400 performs status request completion command transmission processing (S535). In this processing, the sub CPU 400 transmits a command indicating completion of the status request (see CMD: 84H shown in the right column of FIG. 56) to the projector control board B23. Thereafter, the sub CPU 400 ends the projector status reception process.

[Projector drift correction processing]
FIG. 95 shows projector drift correction processing by the sub CPU 400 of the sub control board SS. As shown in the figure, the sub CPU 400 adds 1 to the value of the drift correction monitoring counter of the sub RAM board 41 (S541). The drift correction monitoring counter is an addition counter for measuring the timing of periodically performing correction and monitoring of the temperature drift related to the optical characteristics of the projector device B2.

  Next, the sub CPU 400 determines whether or not the value of the drift correction monitoring counter is equal to or greater than 120 (approximately equivalent to 1 minute) as a predetermined value (S542). When the value of the drift correction monitoring counter is equal to or greater than the predetermined value (S542: Yes), the sub CPU 400 proceeds to the next process of S543. If the value of the drift correction monitoring counter is less than the predetermined value (S542: No), the sub CPU 400 proceeds to the process of S545.

  Next, the sub CPU 400 clears the value of the drift correction monitoring counter (S543).

  Next, the sub CPU 400 sets a status request command (see CMD: 83H shown in the right column of FIG. 56) with the projector control board B23 as a transmission destination in the sub device transmission storage area of the sub RAM board 41 (S544). At this time, a drift correction temperature (refer to CMD: 83H, D1, * 1 shown in the right column of FIG. 56) is specified as a parameter in the status request command. Thereafter, the sub CPU 400 ends the projector drift correction process. Note that the command set in the process of S544 is transmitted to the projector control board B23 by the process of S450 of FIG.

  Next, the sub CPU 400 determines whether or not the command (reception command) acquired from the received data is 'drift correction temperature (see CMD: 8BH shown in the left column of FIG. 56)' (S545). When the received command is 'drift correction temperature' (S545: Yes), the sub CPU 400 proceeds to the next processing of S546. If the received command is not 'drift correction temperature' (S545: No), the sub CPU 400 ends the projector drift correction process.

  Next, the sub CPU 400 obtains the drift correction temperature from the projector status storage area of the sub RAM board 41 and obtains the position coefficient of the focus position (S546). The position coefficient of the focus position is a constant factor for obtaining an optimal correction position (focus correction value) according to the temperature characteristics for each of the focus positions A to E. For example, such a position coefficient may be transmitted as a status from the projector control board B23, or may be stored in advance in the sub-ROM board 42 or the like, or may be displayed on the adjustment screen at the time of optical adjustment shown in FIG. A menu for inputting the position coefficient may be provided and set.

  Next, the sub CPU 400 calculates the focus drift correction value by multiplying the acquired drift correction temperature and the position coefficient (S547). The focus drift correction value means a value obtained by correcting the focus position according to the ambient temperature around the lens.

  Next, the sub CPU 400 determines whether or not the latest focus drift correction value calculated in S547 is equal to the existing correction value in the focus correction value storage area of the sub RAM board 41 (S548). When the latest focus drift correction value is equal to the existing correction value (S548: Yes), the sub CPU 400 ends the projector drift correction process. When the latest focus drift correction value is different from the existing correction value (S548: No), the sub CPU 400 proceeds to the next processing of S549.

  Next, the sub CPU 400 overwrites and saves the focus drift correction value in the focus correction value storage area (S549).

  Next, the sub CPU 400 transmits a focus drift correction value setting change request command to the projector control board B23 (S550).

  Next, the sub CPU 400 stores the focus position and the focus drift correction value in the projector setting value storage area of the sub RAM board 41 (S551). Thereafter, the sub CPU 400 ends the projector drift correction process.

(Memory map of scaler board SK)
As shown in FIGS. 96 and 97, various types of information are stored in the ROM included in the SDRAM 712 and the MCU 700 of the scaler substrate SK. The various storage areas shown in FIGS. 96 and 97 do not indicate all information used in the scaler substrate SK. For example, the control program executed by the MCU 700 of the scaler substrate SK, the work area used by the MCU 700, and the like are not shown in FIGS.

  As shown in FIG. 96, the SDRAM 712 receives a first command for receiving each command in order to exchange commands with the sub control board SS, the projector control board B23, and the sub liquid crystal I / F board SL. To third reception storage area, first to third transmission storage areas for transmitting commands to each, a scaler LSI setting storage area, a status storage area, a flag and other storage area for the multi-output scaler LSI 710, a multi-output scaler LSI 710 In addition, a scaler LSI use area of MCU (control LSI) 700 is provided. For example, the scaler LSI setting storage area stores output first to fourth screen horizontal resolution, output first to fourth screen vertical resolution, input first and second screen horizontal resolution, and output first and second screen vertical resolution. The The flag and other storage areas store the first to third reception completion flags, the first to third EXT reception flags, the scaler LSI setting flag, the reset request flag, the transmission cycle counter, the error management area, and the self-diagnosis storage area. Such stored information will be described later.

  As shown in FIG. 97, the MCU 700 ROM stores, as the initial setting values of the scaler LSI, the number of output divisions related to video division, the number of input divisions, the output first to fourth screen horizontal resolution, and the output first to fourth screen vertical resolution. , The input first and second screen horizontal resolution, the input first and second screen vertical resolution are stored, and the first to third line baud rates, the first to third line data lengths, -3rd line parity, 1st-3rd line stop are stored, and a diagnostic value (55AAH) is stored as a value for self-diagnosis. Such stored information will be described later.

(Processing of scaler substrate SK)
[Scaler board main processing by MCU700]
FIG. 98 shows the scaler substrate main processing by the MCU 700 of the scaler substrate SK. As shown in the figure, when the power is turned on, the MCU 700 performs initialization processing of the scaler substrate SK (S561). This process will be described later with reference to FIG.

  Next, the MCU 700 determines whether or not the first reception completion flag in the SDRAM 712 other storage area is “ON” (S562). When the first reception completion flag is “ON” (S562: Yes), the MCU 700 proceeds to the process of the next S563. If the first reception completion flag is not “ON” (S562: No), the MCU 700 proceeds to the process of S568.

  Next, the MCU 700 acquires reception data (command) from the first reception storage area of the SDRAM 712 (S563).

  Next, the MCU 700 sets the first reception completion flag in the flag or other storage area to “OFF” (S564).

  Next, the MCU 700 determines whether or not the transmission destination ID of the acquired reception data indicates “scaler (see ID: 30H shown in FIG. 53)” (S565). When the transmission destination ID indicates “scaler” (S565: Yes), the MCU 700 proceeds to the process of S567. When the transmission destination ID does not indicate “scaler” (S565: No), the MCU 700 proceeds to the next processing of S566.

  Next, the MCU 700 performs sub-device bypass transmission processing (S566). This process will be described later with reference to FIG.

  Next, the MCU 700 performs sub-control-scaler reception processing (S567). This process will be described later with reference to FIG.

  Next, the MCU 700 performs a scaler self-diagnosis process (S568). This process will be described later with reference to FIG.

  Next, the MCU 700 performs processing during transmission between the sub-control and the scaler (S569). This process will be described later with reference to FIG.

  Next, the MCU 700 performs a sub control bypass transmission process (S570). This process will be described later with reference to FIG.

  Next, the MCU 700 determines whether or not the flag of the SDRAM 712 or other reset request flag in the storage area is “ON” (S571). When the reset request flag is “ON” (S571: Yes), the MCU 700 proceeds to the process of the next S572. If the reset request flag is not 'ON' (S571: No), the MCU 700 proceeds to the process of S573.

  Next, the MCU 700 waits for the watchdog timer (WDT) to be reset (S572). The watchdog timer reset wait is a process of performing an infinite loop process without clearing (or setting to a predetermined value) the watchdog timer and waiting for the watchdog timer to output a reset signal to the MCU 700. When the timer outputs a reset signal to the MCU 700, the MCU 700 is reset, and the process is restarted from the first step (S561) in the scaler board main process (also referred to as “reboot”). The same applies to S700 of the projector control main process described later and S871 of the sub liquid crystal control main process.

  In S573, the MCU 700 clears the value of the watchdog timer (WDT).

  Next, the MCU 700 waits for a period of 2 msec, for example (S574). Thereafter, the MCU 700 proceeds to the process of S562.

[First serial line reception interrupt processing]
FIG. 99 shows the first serial line reception interrupt processing by the MCU 700 of the scaler board SK. The first serial line reception interrupt process is a communication interrupt process for capturing received data in response to an external request from the sub-control board BB via the first serial line during execution of the scaler board main process. The MCU 700 is configured to execute a second serial line reception interrupt process and a third serial line reception interrupt process as well as the first serial line reception interrupt process. The second serial line reception interrupt process is a communication interrupt process that captures received data in response to an external request from the projector control board B23 that passes through the second serial line. This is a communication interrupt process for capturing received data in response to an external request from the sub liquid crystal I / F board SL via the three serial lines. The second and third serial line reception interrupt processes are substantially the same as the first serial line reception interrupt process except that the lines are different.

  As shown in FIG. 99, the MCU 700 determines whether or not the received data from the first serial line (sub control board SS) is “STX (02H)” indicating the start of data (S581). If the received data is 'STX' (S581: Yes), the MCU 700 proceeds to the next process of S582. If the received data is not 'STX' (S581: No), the MCU 700 proceeds to the process of S583.

  Next, the MCU 700 sets the first ETX reception flag and the first reception completion flag in the SDRAM 712 flag and other storage areas to “OFF”, and clears the first reception storage area (S582). Thereafter, the MCU 700 ends the first serial line reception interrupt process.

  In S583, the MCU 700 saves the reception data from the first serial line (sub control board SS) in the first reception storage area of the SDRAM 712.

  Next, the MCU 700 determines whether or not the received data is “ETX (03H)” indicating the end of the data (S584). If the received data is “ETX” (S584: Yes), the MCU 700 proceeds to the process of the next S585. When the received data is not “ETX” (S584: No), the MCU 700 proceeds to the process of S586.

  Next, the MCU 700 sets the flag of the SDRAM 712 and the first ETX reception flag in the other storage area to “ON” (S585). Thereafter, the MCU 700 ends the first serial line reception interrupt process.

  In S586, the MCU 700 determines whether the first ETX reception flag in the flag 712 other storage area of the SDRAM 712 is “ON” or not. When the first ETX reception flag is 'ON' (S586: Yes), the MCU 700 proceeds to the next process of S587. If the first ETX reception flag is not “ON” (S586: No), the MCU 700 ends the first serial line reception interrupt process.

  Next, the MCU 700 performs a received data sum check process (S587).

  Next, the MCU 700 determines whether or not the sum value obtained in S587 is normal (S588). When the sum value is normal (S588: Yes), the MCU 700 proceeds to the process of S590. When the sum value is not normal (S588: No), the MCU 700 proceeds to the process of the next S589. The sum value calculation method is the same as that described in the sub-device reception interrupt process (S258 in FIG. 74).

  Next, the MCU 700 discards the data in the first serial line reception storage area (S589). Thereafter, the MCU 700 ends the first serial line reception interrupt process.

  In S590, the MCU 700 sets the flag of the SDRAM 712 and the first reception completion flag in the storage area to “ON”. Thereafter, the MCU 700 ends the first serial line reception interrupt process.

[Scaler initialization processing]
FIG. 100 shows a scaler initialization process by the MCU 700 of the scaler substrate SK. As shown in the figure, the MCU 700 initializes internal functions (S601).

  Next, the MCU 700 initializes the first to third serial lines (S602).

  Next, the MCU 700 acquires various initial setting values related to input / output of the multi-output scaler LSI 710 from the ROM (S603).

  Next, the MCU 700 performs initial settings related to input / output of the multi-output scaler LSI 710 (S604). In this processing, the MCU 700 performs initial settings for the DSF (α) 821 and DSF (β) 822 and select areas A to D801 to 804 of the multi-output scaler LSI 710 based on the initial setting values acquired from the ROM.

  Next, the MCU 700 sets the flag of the SDRAM 712 and the scaler LSI setting flag and the reset request flag in the storage area to “OFF” (S605). Thereafter, the MCU 700 ends the scaler initialization process.

[Sub-device bypass transmission processing]
FIG. 101 shows sub-device bypass transmission processing by the MCU 700 of the scaler substrate SK. As shown in the figure, the MCU 700 determines whether or not the destination ID of the received data indicates “projector (30H)” (S611). When the transmission destination ID indicates “projector” (S611: Yes), the MCU 700 proceeds to the process of the next S612. When the transmission destination ID does not indicate “projector” (S611: No), the MCU 700 proceeds to the process of S614.

  Next, the MCU 700 copies the data once taken into the first reception storage area of the SDRAM 712 to the second transmission storage area (S612).

  Next, the MCU 700 performs a second serial line transmission process (S613). In this processing, the MCU 700 outputs the data transmitted from the sub control board SS to the projector control board B23 to the second serial line. Thereafter, the MCU 700 ends the sub device bypass transmission process.

  In S614, the MCU 700 determines whether or not the transmission destination ID of the received data indicates “sub liquid crystal (ID: 40H shown in FIG. 53)”. When the transmission destination ID indicates “sub liquid crystal” (S614: Yes), the MCU 700 proceeds to the next process of S615. When the transmission destination ID does not indicate “sub liquid crystal” (S614: No), the MCU 700 ends the sub device bypass transmission process.

  Next, the MCU 700 copies the data once taken into the first reception storage area of the SDRAM 712 to the third transmission storage area (S615).

  Next, the MCU 700 performs third serial line transmission processing (S616). In this process, the MCU 700 outputs the data transmitted from the sub control board SS to the sub liquid crystal I / F board SL to the third serial line. Thereafter, the MCU 700 ends the sub device bypass transmission process.

[Processing during reception between sub-control and scaler]
FIG. 102 shows the sub control-scaler reception process by the MCU 700 of the scaler substrate SK. As shown in the figure, the MCU 700 receives a command (CMD) of received data (hereinafter referred to as “acquired received data” in this process) acquired from the first reception storage area of the SDRAM 712 by the sub control board SS through S563. It is determined whether or not it is a status request (see CMD: 03H shown in the right column of FIG. 54) (S621). When the acquired command of received data is “status request” (S621: Yes), the MCU 700 proceeds to the processing of the next S622. When the acquired received data command is not “status request” (S621: No), the MCU 700 proceeds to the process of S624.

  Next, the MCU 700 registers a command transmission request indicating a “status” corresponding to the output setting (D1: 01H) and the input setting (D1: 02H) of the “status request” to the sub control board SS (S622). ).

  Next, the MCU 700 stores various parameter values (D1) included in the acquired received data in the status storage area of the SDRAM 712 (S623). Thereafter, the MCU 700 ends the sub-control-scaler reception process.

  In S624, the MCU 700 determines whether or not the command of the acquired reception data is “setting complete (see CMD: 02H shown in the right column of FIG. 54)”. If the acquired received data command is “setting complete” (S624: Yes), the MCU 700 proceeds to the next processing of S625. If the acquired received data command is not 'setting complete' (S624: No), the MCU 700 proceeds to the process of S626.

  Next, the MCU 700 changes the setting of the multi-output scaler LSI 710 with the setting value in the scaler LSI setting storage area of the SDRAM 712 (S625). Thereafter, the MCU 700 proceeds to the process of S636.

  In S626, the MCU 700 determines whether or not the command of the acquired reception data is “activation parameter request confirmation (see CMD: 01H shown in the right column of FIG. 54)”. If the acquired command of received data is “startup parameter request confirmation” (S626: Yes), the MCU 700 proceeds to the next processing of S627. When the acquired command of the received data is not “activation parameter request confirmation” (S626: No), the MCU 700 proceeds to the process of S628.

  Next, the MCU 700 sets the flag scaler LSI setting flag in the other storage area of the SDRAM 712 to “ON” (S627). Thereafter, the MCU 700 proceeds to the process of S636.

  In S628, the MCU 700 determines whether or not the command of the acquired reception data is “output screen division setting number (see CMD: 05H shown in the right column of FIG. 54)”. If the acquired received data command is “output screen division setting number” (S628: Yes), the MCU 700 proceeds to the process of the next S629. When the acquired received data command is not the “output screen division setting number” (S628: No), the MCU 700 proceeds to the process of S630.

  Next, the MCU 700 saves the output screen division setting number included in the acquired received data in the scaler LSI setting storage area of the SDRAM 712 (S629). Thereafter, the MCU 700 proceeds to the process of S636.

  In S630, the MCU 700 determines whether or not the command of the acquired reception data is “output screen resolution setting (see CMD: 06H shown in the right column of FIG. 54)”. If the acquired received data command is “output screen resolution setting” (S630: Yes), the MCU 700 proceeds to the next processing of S631. If the acquired received data command is not “output screen resolution setting” (S630: No), the MCU 700 proceeds to the process of S632.

  Next, the MCU 700 stores the output screen resolution included in the acquired received data in the scaler LSI setting storage area of the SDRAM 712 (S631). Thereafter, the MCU 700 proceeds to the process of S636.

  In S632, the MCU 700 determines whether or not the command of the acquired reception data is “input screen division setting number (see CMD: 07H shown in the right column of FIG. 54)”. When the acquired command of received data is “input screen division setting number” (S632: Yes), the MCU 700 proceeds to the process of the next S633. If the acquired received data command is not the “input screen division setting number” (S632: No), the MCU 700 proceeds to the process of S634.

  Next, the MCU 700 stores the input screen division setting number included in the acquired received data in the scaler LSI setting storage area of the SDRAM 712 (S633). Thereafter, the MCU 700 proceeds to the process of S636.

  In step S634, the MCU 700 determines whether or not the command of the acquired reception data is “input screen resolution setting (see CMD: 08H shown in the right column of FIG. 54)”. If the acquired received data command is “input screen resolution setting” (S634: Yes), the MCU 700 proceeds to the process of the next S635. When the acquired received data command is not “input screen resolution setting” (S634: No), the MCU 700 indicates that the acquired received data command is “status request complete (see CMD: 04H shown in the right column of FIG. 54)”. Therefore, the process proceeds to S636.

  Next, the MCU 700 saves the input screen resolution included in the acquired received data in the scaler LSI setting storage area of the SDRAM 712 (S635).

  Next, the MCU 700 registers a transmission request for a command indicating “reception confirmation (see CMD: 04H shown in the left column of FIG. 54)” with respect to the sub control board SS (S636). Thereafter, the MCU 700 ends the sub-control-scaler reception process.

[Scalar self-diagnosis processing]
FIG. 103 shows a scaler self-diagnosis process performed by the MCU 700 of the scaler substrate SK. As shown in the figure, the MCU 700 writes, for example, “55AAH” as the diagnostic value read from the ROM in the self-diagnosis storage area of the SDRAM 712 by the verify check (S641).

  Next, the MCU 700 determines whether or not the value (load value) read from the self-diagnosis storage area correctly matches the diagnosis value (S642). When the load value matches the diagnosis value (S642: Yes), the MCU 700 proceeds to the process of S644. If the load value does not match the diagnostic value (S642: No), the MCU 700 proceeds to the next process of S643.

  Next, the MCU 700 sets “self-diagnostic abnormality” as error data in the error management area of the SDRAM 712 (S643).

  Next, the MCU 700 reads the status of the multi-output scaler LSI 710 (S644).

  Next, the MCU 700 determines whether or not the status of the multi-output scaler LSI 710 is normal (S645). When the status of the multi-output scaler LSI 710 is normal (S645: Yes), the MCU 700 proceeds to the process of S647. When the status of the multi-output scaler LSI 710 is not normal (S645: No), the MCU 700 proceeds to the next process of S646.

  Next, the MCU 700 sets “WDT (watchdog timer) -scaler abnormality” as error data in the error management area of the SDRAM 712 (S646).

  Next, the MCU 700 reads the output setting of the multi-output scaler LSI 710 (S647).

  Next, the MCU 700 determines whether or not the data related to the output setting stored in the scaler LSI setting storage area of the SDRAM 712 and the output setting of the implementation of the multi-output scaler LSI 710 are the same set value (S648). When the output setting data of the SDRAM 712 and the actual output setting are the same setting value (S648: Yes), the MCU 700 proceeds to the process of S650. When the output setting data of the SDRAM 712 is different from the actual output setting (S648: No), the MCU 700 proceeds to the next process of S649.

  Next, the MCU 700 sets “scaler output setting abnormality” as error data in the error management area of the SDRAM 712 (S649).

  Next, the MCU 700 reads the input settings of the multi-output scaler LSI 710 (S650).

  Next, the MCU 700 determines whether or not the data related to the input settings stored in the scaler LSI setting storage area of the SDRAM 712 and the input settings of the multi-output scaler LSI 710 are the same set values (S651). When the input setting data of the SDRAM 712 and the actual input setting are the same setting value (S651: Yes), the MCU 700 ends the scaler self-diagnosis process. If the input setting data of the SDRAM 712 is different from the actual input setting (S651: No), the MCU 700 proceeds to the next processing of S652.

  Next, the MCU 700 sets “scaler input setting abnormality” as error data in the error management area of the SDRAM 712 (S652). Thereafter, the MCU 700 ends the scaler self-diagnosis process.

[Transmission between sub-control and scaler]
FIG. 104 shows processing during transmission between the sub control and the scaler by the MCU 700 of the scaler substrate SK. As shown in the figure, the MCU 700 adds 1 to the transmission cycle counter (S661). This transmission cycle counter is an addition counter for measuring the cycle of transmitting a command from the scaler board SK.

  Next, the MCU 700 determines whether or not the value of the transmission cycle counter is, for example, 100 or more as a predetermined value (S662). When the value of the transmission cycle counter is equal to or larger than the predetermined value (S662: Yes), the MCU 700 proceeds to the process of the next S663. If the value of the transmission cycle counter is less than the predetermined value (S662: No), the MCU 700 ends the sub-control-scaler transmission process. In the present embodiment, since the processing is performed at a cycle of 2 msec in the scaler substrate main processing described above, the value of the transmission cycle counter being 100 or more is 2 msec × 100 = 200 msec or more. As a result, data is transmitted to the sub-control board SS approximately at a cycle of 200 msec. However, the present invention is not limited to this, and the predetermined value of the transmission cycle counter is an arbitrary value (for example, transmission cycle counter: 50 × 2 msec). = 100 msec cycle).

  Next, the MCU 700 clears the value of the transmission cycle counter (S663).

  Next, the MCU 700 determines whether the flag of the SDRAM 712 and the scaler LSI setting flag in the storage area are 'OFF' (S664). When the scaler LSI setting flag is “OFF” (S664: Yes), the MCU 700 proceeds to the process of the next S665. When the scaler LSI setting flag is not “OFF” (S664: No), the MCU 700 proceeds to the process of S666.

  Next, the MCU 700 creates, as transmission data, a command indicating “activation parameter request (see CMD: 01H shown in the left column of FIG. 54)” for the sub-control board SS (S665). This transmission data is stored in the first transmission storage area of the SDRAM 712, and is transmitted as a transmission command to the sub control board SS by a first serial line transmission process of S676 described later. After the process of S665, the MCU 700 proceeds to the process of S676.

  In S <b> 666, the MCU 700 determines whether error data exists in the error management area of the SDRAM 712. When error data exists in the error management area (S666: Yes), the MCU 700 proceeds to the next process of S667. If there is no error data in the error management area (S666: No), the MCU 700 proceeds to the process of S669.

  Next, the MCU 700 creates a command indicating “error notification (see CMD: 05H shown in the left column of FIG. 54)” as transmission data for the sub control board SS (S667). This transmission data is stored in the first transmission storage area of the SDRAM 712, and is transmitted as a transmission command to the sub control board SS by a first serial line transmission process of S676 described later.

  Next, the MCU 700 sets the flag of the SDRAM 712 and other reset request flags in the storage area to “ON” (S668). Thereafter, the MCU 700 proceeds to the process of S676.

  In S669, the MCU 700 determines whether or not there is a command transmission request indicating “reception confirmation (see CMD: 04H shown in the left column of FIG. 54)” with respect to the sub control board SS. When there is a transmission request for a command indicating 'reception confirmation' (S669: Yes), the MCU 700 proceeds to the next processing of S670. If there is no transmission request for a command indicating 'reception confirmation' (S669: No), the MCU 700 proceeds to the process of S671.

  Next, the MCU 700 creates a command indicating “reception confirmation” as transmission data for the sub control board SS (S670). This transmission data is stored in the first transmission storage area of the SDRAM 712, and is transmitted as a transmission command to the sub control board SS by a first serial line transmission process of S676 described later. After the process of S670, the MCU 700 proceeds to the process of S676.

  In S671, the MCU 700 determines whether or not there is a command transmission request indicating “status (see CMD: 03H shown in the left column of FIG. 54)” with respect to the sub control board SS. If there is a transmission request for a command indicating 'status' (S671: Yes), the MCU 700 proceeds to the next processing of S672. If there is no transmission request for a command indicating 'status' (S671: No), the MCU 700 proceeds to the process of S675.

  Next, the MCU 700 determines whether or not the data in the status storage area of the SDRAM 712 is data relating to output settings (S672). When the data in the status storage area is data related to the output setting (D1: 01H) (S672: Yes), the MCU 700 proceeds to the process of the next S673. When the data in the status storage area is not data relating to output setting, that is, data relating to input setting (D1: 02H) (S672: No), the MCU 700 proceeds to the process of S674.

  Next, the MCU 700 creates, as transmission data, a command indicating “status” related to output setting for the sub-control board SS (S673). This transmission data is stored in the first transmission storage area of the SDRAM 712, and is transmitted as a transmission command to the sub control board SS by a first serial line transmission process of S676 described later. After the process of S673, the MCU 700 proceeds to the process of S676.

  In step S674, the MCU 700 creates a command indicating “status” related to the input setting for the sub control board SS as transmission data. This transmission data is stored in the first transmission storage area of the SDRAM 712, and is transmitted as a transmission command to the sub control board SS by a first serial line transmission process of S676 described later. After the process of S674, the MCU 700 proceeds to the process of S676.

  In S675, the MCU 700 creates a command indicating “parameter request” for the sub control board SS as transmission data. This transmission data is stored in the first transmission storage area of the SDRAM 712, and is transmitted as a transmission command to the sub control board SS by the first serial line transmission processing of the next S676.

  Next, the MCU 700 performs a first serial line transmission process (S676). By this transmission processing, various commands are transmitted from the scaler substrate SK to the sub control substrate SS. Thereafter, the MCU 700 ends the sub-control-scaler transmission process.

[Sub control bypass transmission processing]
FIG. 105 shows sub control bypass transmission processing by the MCU 700 of the scaler substrate SK. As shown in the figure, the MCU 700 determines whether or not the second reception completion flag in the flag and other storage areas of the SDRAM 712 is 'ON' (S681). When the second reception completion flag is “ON” (S681: Yes), the MCU 700 proceeds to the next process of S682. When the second reception completion flag is not “ON” (S681: No), the MCU 700 proceeds to the process of S684.

  Next, the MCU 700 determines whether or not the transmission destination ID of the data stored in the second reception storage area of the SDRAM 712 indicates “sub control” (S682). When the transmission destination ID indicates “sub control” (S682: Yes), the MCU 700 proceeds to the processing of the next S683. When the transmission destination ID does not indicate “sub control” (S682: No), the MCU 700 proceeds to the process of S684.

  Next, the MCU 700 copies the data once taken into the second reception storage area of the SDRAM 712 to the first transmission storage area (S683). Thereafter, the MCU 700 proceeds to the process of S687.

  In S684, the MCU 700 determines whether or not the third reception completion flag in the SDRAM 712 other storage area is “ON” (S684). When the third reception completion flag is “ON” (S684: Yes), the MCU 700 proceeds to the process of the next S685. When the third reception completion flag is not “ON” (S684: No), the MCU 700 ends the sub-control bypass transmission process.

  Next, the MCU 700 determines whether or not the transmission destination ID of the data stored in the third reception storage area of the SDRAM 712 indicates “sub control” (S685). When the transmission destination ID indicates “sub control” (S685: Yes), the MCU 700 proceeds to the processing of the next S686. When the transmission destination ID does not indicate “sub control” (S685: No), the MCU 700 ends the sub control bypass transmission processing.

  Next, the MCU 700 copies the data once taken into the third reception storage area of the SDRAM 712 to the first transmission storage area (S686).

  Next, the MCU 700 performs first serial line transmission processing (S687). By this transmission processing, various data are transmitted from the sub device (projector control board B23, sub liquid crystal I / F board SL) to the sub control board SS via the scaler board SK. Thereafter, the MCU 700 ends the sub control bypass transmission process.

(Memory map of projector control board B23)
As shown in FIG. 106, various information is stored in the DRAM, EEPROM 231 and ROM included in the control LSI 230 included in the control LSI 230 of the projector control board B23.

  As shown in FIG. 106, the DRAM of the control LSI 230 is provided with a reception storage area, a transmission storage area, various flags & work areas, a general setting value storage area, a setting data storage area, and various work areas not shown. . For example, various flags & work areas include reception completion flag, EXT reception flag, start setting flag, horizontal position setting flag, vertical position setting flag, focus position setting flag, error management area, transmission cycle counter, status storage area, reset A request flag and a self-diagnosis storage area are stored. In the general setting value storage area, horizontal position A to E offset, vertical position A to E offset, focus position offset A to E, focus drift correction value A to E, LED brightness setting, trapezoidal distortion correction value, white color Stores temperature settings, brightness settings, gamma settings, and contrast settings. The setting data storage area stores horizontal position adjustment values, vertical position adjustment values, focus position adjustment values, LED brightness settings, trapezoidal distortion correction values, white color temperature settings, brightness settings, gamma settings, and contrast settings. . Such stored information will be described later.

  The EEPROM 231 is provided with a basic set value storage area. The basic set value storage area stores horizontal position A to E adjustment values, vertical position A to E adjustment values, and focus position A to E adjustment values. The ROM of the control LSI 230 stores an LED temperature table, a control program for the projector control board B23 (not shown), and various constant values. Such stored information will be described later.

(Processing of projector control board B23)
[Projector control main processing by control LSI 230]
FIG. 107 shows projector control main processing by the control LSI 230 of the projector control board B23. As shown in the figure, when the power is turned on, the control LSI 230 performs a projector initialization process (S691). This process will be described later with reference to FIG.

  Next, the control LSI 230 determines whether or not the reception completion flag in the various flags & work area of the DRAM is “ON” (S692). When the reception completion flag is “ON” (S692: Yes), the control LSI 230 proceeds to the next process of S693. When the reception completion flag is not “ON” (S692: No), the control LSI 230 shifts to the process of S697.

  Next, the control LSI 230 acquires received data from the reception storage area of the DRAM (S693).

  Next, the control LSI 230 sets the various flags & work area flags of the DRAM to “OFF” (S694).

  Next, the control LSI 230 determines whether or not the transmission destination ID of the acquired received data indicates “projector (ID: 30H shown in FIG. 53)” (S695). When the transmission destination ID indicates “projector” (S695: Yes), the control LSI 230 shifts to the next processing of S696. When the transmission destination ID does not indicate “projector” (S695: No), the control LSI 230 proceeds to the process of S697.

  Next, the control LSI 230 performs sub-control-projector reception processing (S696). This process will be described later with reference to FIG.

  Next, the control LSI 230 performs projector self-diagnosis processing (S697). This process will be described later with reference to FIG.

  Next, the control LSI 230 performs sub-control-projector transmission processing (S698). This process will be described later with reference to FIG.

  Next, the control LSI 230 determines whether or not the various flag & work area reset flag of the DRAM is “ON” (S699). When the reset request flag is “ON” (S699: Yes), the control LSI 230 proceeds to the next processing of S700. When the reset request flag is not “ON” (S699: No), the control LSI 230 proceeds to the process of S701.

  Next, the control LSI 230 waits for a reset of the watchdog timer (WDT) (S700). The watchdog timer reset wait is a process for performing an infinite loop process without clearing (or setting a predetermined value) the watchdog timer and waiting for the watchdog timer to output a reset signal to the control LSI 230. When the timer outputs a reset signal to the control LSI 230, the control LSI 230 is reset, and the process is restarted from the first step (S691) in the projector control main process (also referred to as “reboot”).

  In S701, the control LSI 230 clears the value of the watchdog timer (WDT).

  Next, the control LSI 230 waits for a period of 4 msec, for example (S702). Thereafter, the control LSI 230 shifts to the process of S692.

[Projector serial line reception interrupt processing]
FIG. 108 shows projector serial line reception interrupt processing by the control LSI 230 of the projector control board B23. This process is a communication interrupt process for capturing received data in response to an external request via the second serial line during execution of the projector control main process described above.

  As shown in FIG. 108, the control LSI 230 determines whether or not the received data from the second serial line is 'STX (02H)' indicating the start of data (S711). When the received data is 'STX' (S711: Yes), the control LSI 230 proceeds to the next process of S712. If the received data is not 'STX' (S711: No), the control LSI 230 proceeds to the process of S713.

  Next, the control LSI 230 sets the ETX reception flag and the reception completion flag in the various flags & work area of the DRAM to “OFF”, and clears the reception storage area (S712). Thereafter, the control LSI 230 ends the projector serial line reception interrupt process.

  In S713, the control LSI 230 saves the reception data from the second serial line in the reception storage area of the DRAM.

  Next, the control LSI 230 determines whether or not the received data is “ETX” indicating the end of the data (S714). If the received data is “ETX” (S714: Yes), the control LSI 230 proceeds to the next process of S715. When the received data is not “ETX” (S714: No), the control LSI 230 proceeds to the process of S716.

  Next, the control LSI 230 sets the ETX reception flag in the various flags & work area of the DRAM to “ON” (S715). Thereafter, the control LSI 230 ends the projector serial line reception interrupt process.

  In S716, the control LSI 230 determines whether or not the various flags & work area of the DRAM and the ETX reception flag in the work area are 'ON'. When the ETX reception flag is 'ON' (S716: Yes), the control LSI 230 proceeds to the next process of S717. When the ETX reception flag is not “ON” (S716: No), the control LSI 230 ends the projector serial line reception interrupt process.

  Next, the control LSI 230 performs a received data sum check process (S717).

  Next, the control LSI 230 determines whether or not the sum value obtained in S717 is normal (S718). When the sum value is normal (S718: Yes), the control LSI 230 proceeds to the process of S720. When the sum value is not normal (S718: No), the control LSI 230 shifts to the next process of S719. The sum value calculation method is the same as that described in the sub-device reception interrupt process (S258 in FIG. 74).

  Next, the control LSI 230 clears the reception storage area of the DRAM (S719). Thereafter, the control LSI 230 ends the projector serial line reception interrupt process.

  In S720, the control LSI 230 sets the various flags & work area reception flags in the DRAM to 'ON'. Thereafter, the control LSI 230 ends the projector serial line reception interrupt process.

[Projector initialization processing]
FIG. 109 shows projector initialization processing by the control LSI 230 of the projector control board B23. As shown in the figure, the control LSI 230 initializes internal functions (S721).

  Next, the control LSI 230 initializes the second serial line (S722).

  Next, the control LSI 230 acquires the horizontal position A adjustment value, the vertical position A adjustment value, and other common settings from the EEPROM 231 (S723).

  Next, the control LSI 230 performs setting control processing of the DLP control circuit 232 based on the data acquired in S723 (S724).

  Next, the control LSI 230 acquires the focus adjustment value A (focus on the projection surface of the fixed screen mechanism D) from the EEPROM 231 (S725).

  Next, the control LSI 230 performs an electric focus control process of the focus mechanism 242 based on the data acquired in S725 (S726). Specifically, according to the electric focus control process, a motor drive signal (excitation signal) for the focus motor 242C is output and the focus is adjusted to the focus position. The same applies to the processing of S755 described later.

  Next, the control LSI 230 initializes various flags and work areas of the DRAM (S727). Thereafter, the control LSI 230 ends the projector initialization process.

[Sub-control-projector reception processing]
FIG. 110 shows the sub-control-projector reception processing by the control LSI 230 of the projector control board B23. As shown in the figure, the control LSI 230 determines whether the command (CMD) of the received data acquired from the second serial line is a “status request” (S731). When the command of the reception data acquired from the reception storage area of the DRAM in S693 (hereinafter referred to as “acquired reception data” in this process) is “status request” (S731: Yes), the control LSI 230 The process proceeds to S732. If the acquired command of received data is not “status request” (S731: No), the control LSI 230 proceeds to the process of S734.

  Next, the control LSI 230 registers a command transmission request corresponding to the status (see CMD: 85H to 8BH shown in the left column of FIG. 56) in accordance with the “status request” of the sub control board SS (S732).

  Next, the control LSI 230 stores various parameter values (see CMD: 83H, D1, * 1 shown in the right column of FIG. 56) included in the acquired received data in the status storage area of the DRAM (S733). Thereafter, the control LSI 230 ends the sub-control-projector reception process.

  In S734, the control LSI 230 determines whether or not the command of the acquired reception data is “setting complete (see CMD: 82H shown in the right column of FIG. 56)”. When the command of the acquired received data is “setting complete” (S734: Yes), the control LSI 230 shifts to the next process of S735. When the acquired command of received data is not “setting complete” (S734: No), the control LSI 230 proceeds to the process of S736.

  Next, the control LSI 230 performs projector internal setting change processing (S735). This process will be described later with reference to FIG. Thereafter, the control LSI 230 proceeds to the process of S742.

  In S736, the control LSI 230 determines whether or not the command of the acquired reception data is “activation parameter request confirmation (see CMD: 81H shown in the right column of FIG. 56)”. If the acquired command of received data is “startup parameter request confirmation” (S736: Yes), the control LSI 230 proceeds to the next processing of S737. If the acquired command of received data is not 'start parameter request confirmation' (S736: No), the control LSI 230 proceeds to the process of S738.

  Next, the control LSI 230 sets the activation setting flag in the DRAM flag and other storage area to “ON” (S737). Thereafter, the control LSI 230 proceeds to the process of S742.

  In S738, the control LSI 230 determines whether or not the acquired received data command is a setting-related command (see CMD: 85H to 91H shown in the right column of FIG. 56). When the acquired received data command is a setting-related command (S738: Yes), the control LSI 230 shifts to the next process of S739. When the acquired received data command is not a setting-related command (S738: No), the control LSI 230 proceeds to the process of S740.

  Next, the control LSI 230 performs projector setting value storage processing (S739). This process will be described later with reference to FIG. Thereafter, the control LSI 230 proceeds to the process of S742.

  In S740, the control LSI 230 determines whether or not the command of the acquired reception data is “refer to CMD: 92H shown in the right column of the test pattern diagram 56”. If the acquired received data command is 'test pattern' (S740: Yes), the control LSI 230 proceeds to the next step S741. If the acquired received data command is not a “test pattern” (S740: No), the control LSI 230 indicates that the acquired received data command is “status request complete (see CMD: 84H shown in the right column of FIG. 56)”. , The process proceeds to S742.

  Next, the control LSI 230 performs a test pattern display process (S741). According to this process, when the optical adjustment of the projector apparatus B2 is performed, a test pattern for the operator to confirm the adjustment degree is displayed as a projection image by the projector apparatus B2. When the test pattern is displayed, the simple test pattern is displayed on the screen of the sub liquid crystal display device DD19 as a virtual image by simulation. The display mode of the simple test pattern will be described later with reference to FIGS. 123 and 124.

  Next, the control LSI 230 registers a transmission request for a command indicating 'reception confirmation' (S742). Thereafter, the control LSI 230 ends the sub-control-projector reception process.

[Projector internal setting change processing]
FIG. 111 shows projector internal setting change processing by the control LSI 230 of the projector control board B23. As shown in the figure, the control LSI 230 determines whether or not the various flags & work areas of the DRAM are “ON” (S751). When the activation setting flag is “ON” (S751: Yes), the control LSI 230 proceeds to the next process of S752. When the activation setting flag is not “ON” (S751: No), the control LSI 230 proceeds to the process of S757.

  Next, the control LSI 230 reads the horizontal position A adjustment value, the vertical position A adjustment value, the LED brightness setting value, the trapezoidal distortion correction value, the white value from the basic setting value storage area of the EEPROM 231 and the general setting value storage area of the DRAM. A color temperature setting value, a brightness setting value, a gamma setting value, and a contrast setting value are acquired (S752).

  Next, the control LSI 230 performs setting change control processing of the DLP control circuit 232 based on the data acquired in S752 (S753).

  Next, the control LSI 230 calculates a value that becomes the focus position A adjustment value + the focus position offset A as the focus position control data value (S754).

  Next, the control LSI 230 performs an electric focus control process of the focus mechanism 242 based on the control data value acquired in S754 (S755).

  Next, the control LSI 230 sets all the setting flags in the various flags & work area of the DRAM to “OFF” (S756). Thereafter, the control LSI 230 ends the projector internal setting change process.

  In S757, the control LSI 230 determines whether or not the position type (A to E) is set in the various flags and work position setting flags in the DRAM. If the position type is set in the horizontal position setting flag (S757: Yes), the control LSI 230 proceeds to the next process of S758. If the position type is not set in the horizontal position setting flag (S757: No), the control LSI 230 proceeds to the process of S760.

  Next, the control LSI 230 calculates a value that is a horizontal position (change) adjustment value + horizontal position (change) offset as a control data value indicating the horizontal position of the video projection (S758). Note that (change) corresponds to the position after the change in the horizontal position adjustment values A to E and the horizontal position offsets A to E. For example, if the change is (B), the horizontal position control data value is the horizontal position B adjustment value + the horizontal position B offset.

  Next, the control LSI 230 clears various flags and work position setting flags in the DRAM (S759). Thereafter, the control LSI 230 transitions to the process of S763.

  In S760, the control LSI 230 determines whether or not the position type (A to E) is set in the various flags & work area of the DRAM and the vertical position setting flag in the work area. If the position type is set in the vertical position setting flag (S760: Yes), the control LSI 230 proceeds to the next step S761. When the position type is not set in the vertical position setting flag (S760: No), the control LSI 230 proceeds to the process of S7640.

  Next, the control LSI 230 calculates a value that is a vertical position (change) adjustment value + a vertical position (change) offset as a control data value indicating the vertical position of the video projection (S761). Note that (change) corresponds to the position after the change in the vertical position adjustment values A to E and the vertical position offsets A to E.

  Next, the control LSI 230 clears various flags and work position setting flags in the DRAM (S762).

  Next, the control LSI 230 performs a setting change control process of the DLP control circuit 232 based on the control data value acquired in S758 or S761 (S763). Thereafter, the control LSI 230 ends the projector internal setting change process.

  In step S764, the control LSI 230 determines whether or not the position types (A to E) are set in the various flags and work position setting flags in the DRAM. When the position type is set in the focus position setting flag (S764: Yes), the control LSI 230 proceeds to the next process of S765. When the position type is not set in the focus position setting flag (S764: No), the control LSI 230 ends the projector internal setting change process.

  Next, the control LSI 230 calculates a value that becomes the focus position (change) adjustment value + focus position offset (change) + focus drift correction (change) as the control data value of the focus position (S765). (Change) corresponds to the position after the change of the focus adjustment values A to E and the focus position offsets A to E.

  Next, the control LSI 230 clears various flags and work position setting flags in the DRAM (S766).

  Next, the control LSI 230 performs the electric focus control process of the focus mechanism 242 based on the control data value acquired in S765 as in S755 (S767). Thereafter, the control LSI 230 ends the projector internal setting change process.

[Projector setting value storage processing]
FIG. 112 shows projector setting value storage processing by the control LSI 230 of the projector control board B23. As shown in the figure, the control LSI 230 performs a setting range determination process based on the setting value data of the reception data acquired from the reception storage area in S693 (S771). In this setting range determination process, it is determined whether or not the value is in the range described in the parameter column of CMD: 85H to 8AH shown in the left column of FIG. 56, and the determination result is returned as a return value.

  Next, the control LSI 230 determines whether the acquired set value data is valid data from the return value of the determination result (S772). When the acquired set value data is valid data (S772: Yes), the control LSI 230 proceeds to the next process of S773. If the acquired setting value data is not valid data (S772: No), the control LSI 230 ends the projector setting value storage processing.

  Next, the control LSI 230 determines whether or not the acquired setting value is a type to be stored in the EEPROM 231 (basic setting value, CMD: 89H, 8B, 90H shown in the right column of FIG. 56, and EEPROM shown in FIG. 106). (S773). When the acquired setting value is a type to be stored in the EEPROM 231 (S773: Yes), the control LSI 230 proceeds to the next processing of S774. The acquired setting value is not the type to be stored in the EEPROM 231, that is, the general setting value to be stored in the DRAM (CMD: 85H to 88H, 8AH, 8CH to 8FH, 91H shown in the right column of FIG. 56 and the DRAM shown in FIG. 106) ) Or the like (S773: No), the control LSI 230 proceeds to the process of S776.

  Next, the control LSI 230 determines whether or not the transmission source ID of the acquired data is “adjustment PC (ID: 05H shown in FIG. 53)” (S774). When the transmission source ID is “adjustment PC” (S774: Yes), the control LSI 230 shifts to the next processing of S775. When the transmission source ID is not 'adjustment PC' (S774: No), the control LSI 230 ends the projector setting value storage process.

  Next, the control LSI 230 saves the acquired setting value in a designated position in the basic setting value storage area of the EEPROM 231 (see the EEPROM shown in FIG. 106) (S775). Thereafter, the control LSI 230 ends the projector setting value storage process. Thereby, the basic setting items related to the optical adjustment of the projector apparatus B2 can be changed on the EEPROM 231 in accordance with the operation of the adjustment PC 1000.

  In S776, the control LSI 230 saves the acquired setting value at a designated position in the general setting value storage area of the DRAM (see the DRAM shown in FIG. 106). Thereby, the general setting items related to the optical adjustment of the projector device B2 can be changed on the DRAM not only by the operation of the adjustment PC 1000 but also by the operation using the sub liquid crystal display device DD19 or the touch panel DD19T.

  Next, the control LSI 230 determines whether or not the type of installation value is a horizontal position offset (S777). When the type of the installation value is horizontal position offset (S777: Yes), the control LSI 230 proceeds to the next process of S778. When the type of the installation value is not the horizontal position offset (S777: No), the control LSI 230 proceeds to the process of S779.

  Next, the control LSI 230 sets the position types (A to E) in various flags and work area setting flags in the DRAM (S778). Thereafter, the control LSI 230 ends the projector setting value storage process.

  In step S779, the control LSI 230 determines whether the type of the setting value is a vertical position offset. When the type of the installation value is the vertical position offset (S779: Yes), the control LSI 230 proceeds to the next process of S780. When the installation value type is not the vertical position offset (S779: No), the control LSI 230 proceeds to the process of S781.

  Next, the control LSI 230 sets the position type (A to E) in the various flags & work area vertical setting flag of the DRAM (S780). Thereafter, the control LSI 230 ends the projector setting value storage process.

  In step S781, the control LSI 230 determines whether the type of the setting value is a focus position offset. When the type of the setting value is the focus position offset (S781: Yes), the control LSI 230 proceeds to the next process of S782. If the installation value type is not the focus position offset (S781: No), the control LSI 230 ends the projector setting value storage process.

  Next, the control LSI 230 sets the position types (A to E) in the various flags and work position setting flags in the DRAM (S782). Thereafter, the control LSI 230 ends the projector setting value storage process.

[Projector self-diagnosis processing]
FIG. 113 shows projector self-diagnosis processing by the control LSI 230 of the projector control board B23. As shown in the figure, the control LSI 230 writes, for example, “55AAH” as the diagnostic value read from the ROM in the self-diagnosis storage area of the DRAM by the verify check (S791).

  Next, the control LSI 230 determines whether or not the value (load value) read from the self-diagnosis storage area correctly matches the diagnosis value (S792). If the load value matches the diagnostic value (S792: Yes), the control LSI 230 proceeds to the process of S794. When the load value does not match the diagnostic value (S792: No), the control LSI 230 proceeds to the next processing of S793.

  Next, the control LSI 230 sets “self-diagnostic abnormality (see projector control board error information shown in FIG. 57)” as error data in the error management area of the DRAM (S793).

  Next, the control LSI 230 performs LED temperature diagnosis processing (S794). In this process, the control LSI 230 acquires the LED temperature based on the temperature detection signal from the temperature sensor B25.

  Next, the control LSI 230 determines whether or not the acquired LED temperature is normal (S795). When the acquired LED temperature is normal (S795: Yes), the control LSI 230 shifts to the process of S797. When the acquired LED temperature is not normal (S795: No), the control LSI 230 shifts to the next process of S796.

  Next, the control LSI 230 sets “LED temperature abnormality” as error data in the error management area of the DRAM (S796). More specifically, the temperature sensor B25 detects the temperature in the vicinity of the LED light sources 240R, 240G, and 240B and in the vicinity of the lens unit B21. The control LSI 230 measures each temperature through the temperature sensor B25, so that when the condition in the condition column for abnormal LED temperature in the projector control board error information shown in FIG. Set to area. For example, the LED (G) temperature abnormality related to the LED light source 240G is a warning (01B (B means Bit) when the temperature in the vicinity of the LED light source 240G detected by the temperature sensor B25 is 105 ° C. or higher and lower than 110 ° C. )) Is set, and if it is 110 ° C. or higher, shutdown (11B) is set.

  Next, the control LSI 230 performs FAN rotation diagnosis processing (S797). In this process, the control LSI 230 acquires the FAN rotation speed based on the fan rotation speed signal from the fans 244A, 244B, and 245.

  Next, the control LSI 230 determines whether or not the acquired FAN rotation speed is normal (S798). When the acquired FAN rotation speed is normal (S798: Yes), the control LSI 230 proceeds to the process of S800. If the acquired FAN rotation speed is not normal (S798: No), the control LSI 230 proceeds to the next process of S799.

  Next, the control LSI 230 sets “FAN rotation abnormality” as error data in the error management area of the DRAM (S799). Specifically, the FAN rotation abnormality is set according to the conditions of the FAN1 to 4 rotation abnormality of the projector control board error information shown in FIG.

  Next, the control LSI 230 performs projector power supply diagnosis processing (S800). In this process, the control LSI 230 detects the operating voltage supplied to the projector device B2.

  Next, the control LSI 230 determines whether or not the operating voltage of the projector device B2 is equal to or higher than a specified voltage (S801). When the operating voltage of the projector device B2 is equal to or higher than the specified voltage (S801: Yes), the control LSI 230 proceeds to the process of S803. When the operating voltage of the projector device B2 is less than the specified voltage (S801: No), the control LSI 230 proceeds to the next process of S802.

  Next, the control LSI 230 sets “voltage abnormality” as error data in the error management area of the DRAM (S802). Specifically, the voltage abnormality is set according to the voltage abnormality condition of the projector control board error information shown in FIG.

  Next, the control LSI 230 performs a DLP operation diagnosis process (S803). In this process, the control LSI 230 checks the operation of the DLP control circuit 232.

  Next, the control LSI 230 determines whether or not the operation of the DLP control circuit 232 is normal (S804). When the operation of the DLP control circuit 232 is normal (S804: Yes), the control LSI 230 proceeds to the process of S806. When the operation of the DLP control circuit 232 is not normal (S804: No), the control LSI 230 proceeds to the next process of S805.

  Next, the control LSI 230 sets “DLP abnormality” as error data in the error management area of the DRAM (S805). Specifically, the DLP abnormality is set according to the WDT-DLP condition of the projector control board error information shown in FIG.

  Next, the control LSI 230 determines whether or not data indicating “LED temperature abnormality” (forced shutdown), “FAN rotation abnormality”, or “voltage abnormality” is set in the error management area (S806). . When data indicating any of the above abnormalities is set in the error management area (S806: Yes), the control LSI 230 proceeds to the next processing of S307. If none of the data indicating the abnormality is set in the error management area (S806: No), the control LSI 230 ends the projector self-diagnosis process.

  Next, the control LSI 230 sends a rotation stop command to the FANs 1 to 3 (fans 244A, 244B, 245) or to the DLP control circuit 232 and the LEDs (R, G, B) (LED substrates 240Ra, 240Ga, 240Ba). Then, a drive stop command is issued (S807). Thereby, the operation of the projector device B2 is stopped. Thereafter, the control LSI 230 ends the projector self-diagnosis process. In this embodiment, when data indicating “LED temperature abnormality”, “FAN rotation abnormality”, or “voltage abnormality” is set in the error management area, the operation of the projector device B2 is stopped. The power supply must be turned off for restoration. However, the present invention is not limited to this, and the operation of the projector apparatus B2 may be resumed when the abnormality that has occurred is recovered while the operation of the projector apparatus B2 is stopped.

[Sub-control-projector transmission processing]
FIG. 114 shows sub-control-projector transmission processing by the control LSI 230 of the projector control board B23. As shown in the figure, the control LSI 230 adds 1 to the transmission cycle counter (S811). This transmission cycle counter is an addition counter for measuring the cycle of transmitting a command from the projector control board B23.

  Next, the control LSI 230 determines whether or not the value of the transmission cycle counter is a predetermined value, for example, 125 (4 msec × 125 = 500 msec) or more (S812). When the value of the transmission cycle counter is equal to or greater than a predetermined value (500 msec or more has elapsed since the previous transmission) (S812: Yes), the control LSI 230 proceeds to the next process of S813. If the value of the transmission cycle counter is less than the predetermined value (S812: No), the control LSI 230 ends the sub-control-projector transmission time process.

  Next, the control LSI 230 clears the value of the transmission cycle counter (S813).

  Next, the control LSI 230 determines whether or not the various flags & work area of the DRAM is “OFF” (S814). When the projector setting flag is “OFF” (S814: Yes), the control LSI 230 proceeds to the next process of S815. When the projector setting flag is not “OFF” (S814: No), the control LSI 230 proceeds to the process of S816.

  Next, the control LSI 230 creates a command indicating “activation parameter request” as transmission data for the sub-control board SS (S815). This transmission data is stored in the transmission storage area of the DRAM, and is transmitted as a transmission command to the sub control board SS by a second serial line transmission process in S825 described later. After the process of S815, the control LSI 230 proceeds to the process of S825.

  In S816, the control LSI 230 determines whether or not error data exists in the error management area of the DRAM. When error data exists in the error management area (S816: Yes), the control LSI 230 proceeds to the next process of S817. If there is no error data in the error management area (S816: No), the control LSI 230 proceeds to the process of S820.

  Next, the control LSI 230 creates a command indicating “error notification (CMD: 84H shown in the left column of FIG. 56; see FIG. 57)” as transmission data for the sub control board SS (S817). This transmission data is stored in the transmission storage area of the DRAM, and is transmitted as a transmission command to the sub control board SS by a second serial line transmission process in S825 described later.

  Next, the control LSI 230 determines whether the error data in the error management area is data indicating a self-diagnosis abnormality or a DLP abnormality (S818). When the error data is data indicating a self-diagnosis abnormality or a DLP abnormality (S818: Yes), the control LSI 230 proceeds to the next process of S819. When the error data is neither the self-diagnosis abnormality nor the data indicating the DLP abnormality (S818: No), the control LSI 230 proceeds to the process of S825.

  Next, the control LSI 230 sets the various flags & work area reset request flag of the DRAM to “ON” (S819). Thereafter, the control LSI 230 proceeds to the process of S825.

  In S820, the control LSI 230 determines whether or not there is a command transmission request indicating “reception confirmation (see CMD: 83H in the left column of FIG. 56)” with respect to the sub-control board SS. If there is a transmission request for a command indicating 'reception confirmation' (S6820: Yes), the control LSI 230 shifts to the next processing of S821. If there is no transmission request for a command indicating 'reception confirmation' (S820: No), the control LSI 230 shifts to the processing of S822.

  Next, the control LSI 230 creates a command indicating 'reception confirmation' as transmission data for the sub-control board SS (S821). This transmission data is stored in the transmission storage area of the DRAM, and is transmitted as a transmission command to the sub control board SS by a second serial line transmission process in S825 described later. After the process of S821, the control LSI 230 proceeds to the process of S825.

  In S822, the control LSI 230 determines whether or not there is a command transmission request corresponding to the status (see the left column CMD: 85H to 8BH in FIG. 56) with respect to the sub control board SS. When there is a command transmission request corresponding to the status (S822: Yes), the control LSI 230 proceeds to the next process of S823. When there is no command transmission request corresponding to the status (S823: No), the control LSI 230 proceeds to the process of S824.

  Next, the control LSI 230 performs status transmission data creation processing (S823). This process will be described later with reference to FIG. Thereafter, the control LSI 230 proceeds to the process of S825.

  In S824, the control LSI 230 creates a command indicating “parameter request (see CMD: 82H shown in the left column of FIG. 56)” for the sub-control board SS as transmission data. This transmission data is stored in the transmission storage area of the DRAM, and is transmitted as a transmission command to the sub-control board SS by the second serial line transmission processing of the next S825.

  Next, the control LSI 230 performs a second serial line transmission process (S825). By this transmission processing, various commands are transmitted from the projector control board B23 to the sub control board SS via the scaler board SK. Thereafter, the control LSI 230 ends the sub-control-projector transmission process.

[Status transmission data creation process]
FIG. 115 shows status transmission data creation processing by the control LSI 230 of the projector control board B23. As shown in the figure, the control LSI 230 determines whether or not the parameter in the DRAM status storage area is the LED temperature (S831). When the parameter of the status storage area is the LED temperature (S831: Yes), the control LSI 230 proceeds to the next process of S832. When the parameter of the status storage area is not the LED temperature (S831: No), the control LSI 230 proceeds to the process of S834.

  Next, the control LSI 230 inputs data from the temperature sensor B25 of the LED light sources 240R, 240G, and 240B and generates temperature data (S832).

  Next, the control LSI 230 creates transmission data using the temperature data (CMD: 85H, D1 to D3 shown in the left column of FIG. 56) as parameters in the “LED temperature (CMD: 85H shown in the left column of FIG. 56)” command ( S833). Thereafter, the control LSI 230 ends the status transmission data creation process.

  In S834, the control LSI 230 determines whether or not the parameter in the status storage area is the FAN rotation speed. When the parameter of the status storage area is the FAN rotation speed (S834: Yes), the control LSI 230 proceeds to the next process of S835. When the parameter of the status storage area is not the FAN rotation speed (S834: No), the control LSI 230 shifts to the process of S837.

  Next, the control LSI 230 acquires the rotation pulse numbers of FAN1 (intake fan 244A), FAN2 (intake fan 244B), and FAN3 (exhaust fan 245) as rotation pulse data (S835).

  Next, the control LSI 230 creates transmission data using the FAN rotation pulse number (CMD: 86H shown in the left column of FIG. 56) command as a parameter for the FAN rotation pulse number (S836). Thereafter, the control LSI 230 ends the status transmission data creation process.

  In S837, the control LSI 230 determines whether or not the parameter in the status storage area is LED brightness. When the parameter of the status storage area is LED luminance (S837: Yes), the control LSI 230 proceeds to the next process of S838. When the parameter of the status storage area is not LED brightness (S837: No), the control LSI 230 proceeds to the process of S840.

  Next, the control LSI 230 acquires the luminance data of the LED light sources 240R, 240G, and 240B from the DLP control circuit 232 (S838).

  Next, the control LSI 230 creates transmission data using the LED luminance data acquired from the 'LED luminance number (see CMD: 87H shown in the left column of FIG. 56)' command including the LED luminance setting in the status as a parameter (S839). . Thereafter, the control LSI 230 ends the status transmission data creation process.

  In S840, the control LSI 230 determines whether or not the status storage area parameter is a horizontal adjustment value. When the parameter of the status storage area is the horizontal direction adjustment value (S840: Yes), the control LSI 230 proceeds to the next process of S841. When the parameter of the status storage area is not the horizontal adjustment value (S840: No), the control LSI 230 shifts to the process of S843.

  Next, the control LSI 230 acquires horizontal position A to E adjustment values from the EEPROM 231 (S841).

  Next, the control LSI 230 creates transmission data using the values of the horizontal position A to E adjustment values as parameters in the “horizontal adjustment value (see CMD: 88H shown in the left column of FIG. 56)” command (S842). Thereafter, the control LSI 230 ends the status transmission data creation process.

  In S843, the control LSI 230 determines whether the parameter in the status storage area is a vertical adjustment value. When the status storage area parameter is the vertical adjustment value (S843: Yes), the control LSI 230 proceeds to the next processing of S844. If the parameter of the status storage area is not the vertical adjustment value (S843: No), the control LSI 230 proceeds to the process of S846.

  Next, the control LSI 230 acquires vertical position adjustment values A to E from the EEPROM 231 (S844).

  Next, the control LSI 230 creates transmission data using the values of the vertical position A to E adjustment values as parameters in the “vertical adjustment value (see CMD: 89H shown in the left column of FIG. 56)” command (S845). Thereafter, the control LSI 230 ends the status transmission data creation process.

  In step S846, the control LSI 230 determines whether the parameter in the status storage area is a focus adjustment value. When the parameter of the status storage area is a focus adjustment value (S846: Yes), the control LSI 230 proceeds to the next process of S847. When the parameter of the status storage area is not the focus adjustment value (S846: No), the control LSI 230 proceeds to the process of S849.

  Next, the control LSI 230 acquires the focus position A to E adjustment values from the EEPROM 231 (S847).

  Next, the control LSI 230 creates transmission data using the values of the focus position A to E adjustment values as parameters for the “focus adjustment value (see CMD: 8AH shown in the left column of FIG. 56)” command (S848). Thereafter, the control LSI 230 ends the status transmission data creation process.

  In S849, the control LSI 230 determines whether or not the parameter in the status storage area is the drift correction temperature. When the parameter of the status storage area is the drift correction temperature (S849: Yes), the control LSI 230 proceeds to the next process of S850. If the parameter in the status storage area is not the drift correction temperature (S849: No), the control LSI 230 ends the status transmission data creation process.

  Next, the control LSI 230 receives data from the drift correction temperature sensor B25 related to the drift correction temperature, and generates temperature data (S850).

  Next, the control LSI 230 creates a “drift correction temperature (see CMD: 8BH shown in the left column of FIG. 56)” command including the drift correction temperature sensor data in the status as transmission data (S851). Thereafter, the control LSI 230 ends the status transmission data creation process.

(Memory map of sub liquid crystal I / F board SL)
As shown in FIG. 116, various information is stored in the DRAM and the ROM included in the MCU 900 of the sub liquid crystal I / F substrate SL.

  As shown in FIG. 116, the DRAM of the MCU 900 is provided with a reception storage area, a transmission storage area, a flag area, various storage areas, and a sub liquid crystal setting storage area. For example, a reception completion flag, an EXT reception flag, and a sub liquid crystal setting flag are stored in the flag area. The various storage areas store a transmission cycle counter, a status storage area, a reset request flag, an error management area, and a self-diagnosis storage area. The sub-liquid crystal setting storage area stores horizontal resolution, vertical resolution, and luminance. Such stored information will be described later.

  The ROM of the MCU 900 stores horizontal resolution, vertical resolution, and luminance as data values in the liquid crystal initial setting area, and serial line setting values include baud rate (third serial line), data length, parity, A stop is stored, and a diagnostic value (55AAH) is stored as a value for self-diagnosis. Such stored information will be described later. Although not shown in FIG. 116, the DRAM stores various other work areas used by the MCU 900, and the ROM stores a control program executed by the MCU 900 and constant data.

(Processing of sub liquid crystal I / F substrate SL)
[Sub liquid crystal control main processing by MCU900]
FIG. 117 shows sub liquid crystal control main processing by the MCU 900 of the sub liquid crystal I / F substrate SL. As shown in the figure, when the power is turned on, the MCU 900 performs the sub liquid crystal initialization process (S861). This process will be described later with reference to FIG.

  Next, the MCU 900 performs touch panel input processing (S862). In this process, the MCU 900 performs a predetermined operation based on an operation signal (a signal corresponding to a touch operation, a flick operation, or a pinch operation) from the touch panel DD19T.

  Next, the MCU 900 determines whether or not the reception completion flag in the flag area of the DRAM is “ON” (S863). When the reception completion flag is “ON” (S863: Yes), the MCU 900 proceeds to the next process of S864. If the reception completion flag is not “ON” (S863: No), the MCU 900 proceeds to the process of S868.

  Next, the MCU 900 acquires received data from the reception storage area of the DRAM (S864).

  Next, the MCU 900 sets the reception completion flag in the flag area of the DRAM to “OFF” (S865).

  Next, the MCU 900 determines whether or not the transmission destination ID of the acquired reception data indicates “sub liquid crystal (see ID: 40H shown in FIG. 53)” (S866). When the transmission destination ID indicates “sub liquid crystal” (S866: Yes), the MCU 900 proceeds to the process of next S867. When the transmission destination ID does not indicate “sub liquid crystal” (S866: No), the MCU 900 proceeds to the process of S868.

  Next, the MCU 900 performs processing during reception between the sub control and the sub liquid crystal (S867). This process will be described later with reference to FIG.

  Next, the MCU 900 performs sub liquid crystal self-diagnosis processing (S868). This process will be described later with reference to FIG.

  Next, the MCU 900 performs processing during transmission between the sub control and the sub liquid crystal (S869). This process will be described later with reference to FIG.

  Next, the MCU 900 determines whether or not the reset request flag in various storage areas of the DRAM is “ON” (S870). When the reset request flag is “ON” (S870: Yes), the MCU 900 proceeds to the next process of S871. If the reset request flag is not 'ON' (S870: No), the MCU 900 proceeds to the process of S872.

  Next, the MCU 900 waits for a watchdog timer (WDT) to be reset (S871). The watchdog timer reset wait is a process of performing an infinite loop process without clearing (or setting a predetermined value) the watchdog timer and waiting for the watchdog timer to output a reset signal to the MCU 900. When the reset signal is output to the MCU 900, the MCU 900 is reset, and the process is restarted from the first step (S861) of the sub liquid crystal control main process (also referred to as “reboot”).

  In S872, the MCU 900 clears the value of the watchdog timer (WDT).

  Next, the MCU 900 waits for a period of 4 msec, for example (S873). Thereafter, the MCU 900 proceeds to the process of S862.

[Sub LCD serial line reception interrupt processing]
FIG. 118 shows sub liquid crystal serial line reception interrupt processing by the MCU 900 of the sub liquid crystal I / F substrate SL. This process is a communication interrupt process for capturing received data in response to an external request via the third serial line during execution of the above-described sub liquid crystal control main process.

  As shown in FIG. 118, the MCU 900 determines whether or not the received data from the third serial line is “STX (02H)” indicating the start of data (S881). If the received data is 'STX' (S881: Yes), the MCU 900 proceeds to the next process of S882. If the received data is not 'STX' (S881: No), the MCU 900 proceeds to the process of S883.

  Next, the MCU 900 sets the ETX reception flag and the reception completion flag in the flag area of the DRAM to “OFF”, and clears the reception storage area (S882). Thereafter, the MCU 900 ends the sub liquid crystal serial line reception interrupt process.

  In S883, the MCU 900 saves the reception data from the third serial line in the reception storage area of the DRAM.

  Next, the MCU 900 determines whether or not the received data is “ETX (03H)” indicating the end of the data (S884). If the received data is “ETX” (S884: Yes), the MCU 900 proceeds to the process of the next S885. When the received data is not “ETX” (S884: No), the MCU 900 proceeds to the process of S886.

  Next, the MCU 900 sets the ETX reception flag in the flag area of the DRAM to “ON” (S885). Thereafter, the MCU 900 ends the sub liquid crystal serial line reception interrupt process.

  In S886, the MCU 900 determines whether or not the ETX reception flag in the DRAM flag area is 'ON'. If the ETX reception flag is 'ON' (S886: Yes), the MCU 900 proceeds to the next process of S887. If the ETX reception flag is not 'ON' (S886: No), the MCU 900 ends the sub liquid crystal serial line reception interrupt process.

  Next, the MCU 900 performs received data sum check processing (S887).

  Next, the MCU 900 determines whether or not the sum value obtained in S887 is normal (S888). When the thumb value is normal (S888: Yes), the MCU 900 proceeds to the process of S890. If the sum value is not normal (S888: No), the MCU 900 proceeds to the next process of S889. The sum value calculation method is the same as that described in the sub-device reception interrupt process (S258 in FIG. 74).

  Next, the MCU 900 clears the reception storage area of the DRAM (S889). Thereafter, the MCU 900 ends the sub liquid crystal serial line reception interrupt process.

  In S890, the MCU 900 sets the reception completion flag in the flag area of the DRAM to “ON”. Thereafter, the MCU 900 ends the sub liquid crystal serial line reception interrupt process.

[Sub LCD initialization processing]
FIG. 119 shows sub liquid crystal initialization processing by the MCU 900 of the sub liquid crystal I / F substrate SL. As shown in the figure, the MCU 900 initializes internal functions (S891).

  Next, the MCU 900 initializes the third serial line (S892).

  Next, the MCU 900 performs initial screen setting of the sub liquid crystal display device DD19 based on the horizontal resolution, vertical resolution, and luminance stored in the ROM (S893).

  Next, the MCU 900 initializes the touch panel DD19T (S894).

  Next, the MCU 900 sets the sub liquid crystal setting flag and the reset request flag to “OFF” in the flag area and various storage areas of the DRAM (S895). Thereafter, the MCU 900 ends the sub liquid crystal initialization process.

[Processing during reception between sub-control and sub-liquid crystal]
FIG. 120 shows processing during reception between the sub-control and sub-liquid crystal by the MCU 900 of the sub-liquid crystal I / F substrate SL. As shown in the figure, the MCU 900 determines whether or not the command of the received data acquired from the third serial line in S864 is “status request (see CMD: 43H shown in the right column of FIG. 55)” (S901). When the acquired command of received data is “status request” (S901: Yes), the MCU 900 proceeds to the next processing of S902. If the acquired received data command is not “status request” (S901: No), the MCU 900 proceeds to the process of S904.

  Next, the MCU 900 registers a transmission request for a command indicating “status” in response to the “status request” (S902).

  Next, the MCU 900 stores various parameter values included in the acquired received data in the status storage area of the DRAM (S903). Thereafter, the MCU 900 ends the sub-control-sub liquid crystal reception process.

  In step S904, the MCU 900 determines whether or not the command of the acquired reception data is “setting complete (see CMD: 42H shown in the right column of FIG. 55)”. If the acquired received data command is “setting complete” (S904: Yes), the MCU 900 proceeds to the next processing of S905. If the acquired received data command is not 'setting complete' (S904: No), the MCU 900 proceeds to the processing of S906.

  Next, the MCU 900 changes the setting of the sub liquid crystal I / F substrate SL with the setting value of the sub liquid crystal setting storage area of the DRAM (S905). Thereafter, the MCU 900 proceeds to the process of S912.

  In step S <b> 906, the MCU 900 determines whether the command of the acquired reception data is “startup parameter request confirmation (see CMD: 41 </ b> H shown in the right column of FIG. 55)”. If the acquired command of received data is “startup parameter request confirmation” (S906: Yes), the MCU 900 proceeds to the next processing of S907. If the acquired command of received data is not “startup parameter request confirmation” (S906: No), the MCU 900 proceeds to the process of S908.

  Next, the MCU 900 sets the sub liquid crystal setting flag in the flag area of the DRAM to “ON” (S907). Thereafter, the MCU 900 proceeds to the process of S912.

  In step S908, the MCU 900 determines whether the command of the acquired reception data is a “sub liquid crystal screen resolution setting (see CMD: 45H shown in the right column of FIG. 55)” command. If the acquired received data command is the 'sub liquid crystal screen resolution setting' command (S908: Yes), the MCU 900 proceeds to the next processing of S909. When the acquired received data command is not the 'sub liquid crystal screen resolution setting' command (S908: No), the MCU 900 proceeds to the process of S910.

  Next, the MCU 900 stores the setting value of the sub liquid crystal screen resolution of the received data acquired in the sub liquid crystal setting storage area of the DRAM (S909). Thereafter, the MCU 900 proceeds to the process of S912.

  In step S <b> 910, the MCU 900 determines whether the command of the acquired reception data is “sub-liquid crystal luminance setting” (refer to CMD: 46 </ b> H shown in the right column of FIG. 55). If the acquired received data command is “sub-liquid crystal luminance setting” (S910: Yes), the MCU 900 proceeds to the next processing of S911. If the acquired received data command is not “sub liquid crystal brightness setting” (S910: No), the acquired received data command is “status request complete (see CMD: 44H shown in the right column of FIG. 55)”. Shifts to the processing of S912.

  Next, the MCU 900 stores the luminance setting value of the sub liquid crystal display device DD19 in the sub liquid crystal setting storage area of the DRAM (S911). According to such processing, when performing the optical adjustment of the projector device B2, the resolution and brightness are arbitrarily changed so that an operator who visually recognizes the simple test pattern can easily see through the screen of the sub liquid crystal display device DD19. be able to.

  Next, the MCU 900 registers a transmission request for a command indicating 'reception confirmation' (S912). Thereafter, the MCU 900 ends the sub-control-sub liquid crystal reception process.

[Sub LCD self-diagnosis processing]
FIG. 121 shows sub liquid crystal self-diagnosis processing by the MCU 900 of the sub liquid crystal I / F substrate SL. As shown in the figure, the MCU 900 writes, for example, “55AAH” as the diagnostic value read from the ROM in the self-diagnosis storage area of the DRAM by the verify check (S921).

  Next, the MCU 900 determines whether or not the value (load value) read from the self-diagnosis storage area correctly matches the diagnosis value (S922). When the load value matches the diagnostic value (S922: Yes), the MCU 900 proceeds to the process of S924. If the load value does not match the diagnostic value (S922: No), the MCU 900 proceeds to the next process of S923.

  Next, the MCU 900 sets “self-diagnostic abnormality (see sub liquid crystal I / F substrate error information shown in FIG. 57)” as error data in the error management area of the DRAM (S923).

  Next, the MCU 900 reads the status (operation state) of the sub liquid crystal I / F substrate SL (S924).

  Next, the MCU 900 determines whether or not the status of the sub liquid crystal I / F substrate SL is normal (S925). When the status of the sub liquid crystal I / F substrate SL is normal (S925: Yes), the MCU 900 proceeds to the process of S927. When the status of the sub liquid crystal I / F substrate SL is not normal (S925: No), the MCU 900 proceeds to the next process of S926.

  Next, the MCU 900 sets “WDT-sub liquid crystal abnormality (see sub liquid crystal I / F substrate error information shown in FIG. 57)” as error data in the error management area of the DRAM (S926).

  Next, the MCU 900 reads actual data (actual resolution, brightness, etc.) regarding the sub liquid crystal image setting (S927).

  Next, the MCU 900 determines whether or not the setting value in the sub liquid crystal setting storage area and the actual data related to the sub liquid crystal image setting are the same setting value (S928). When the setting value in the sub liquid crystal setting storage area and the actual data related to the sub liquid crystal image setting are the same setting value (S928: Yes), the MCU 900 proceeds to the process of S930. If the setting value in the sub liquid crystal setting storage area and the actual data related to the sub liquid crystal image setting do not match (S928: No), the MCU 900 proceeds to the next process of S929.

  Next, the MCU 900 sets “sub liquid crystal screen setting abnormality (see sub liquid crystal I / F board error information shown in FIG. 57)” as error data in the error management area of the DRAM (S929).

  Next, the MCU 900 reads temperature information (sensor temperature) based on a signal from a temperature sensor (not shown) incorporated in the sub liquid crystal display device DD19 (S930).

  Next, the MCU 900 determines whether or not the sensor temperature is 100 ° C. or higher (S931). When the sensor temperature is 100 ° C. or higher (S931: Yes), the MCU 900 proceeds to the next process of S931. When the sensor temperature is less than 100 ° C. (S931: No), the MCU 900 proceeds to the process of S933.

  Next, the MCU 900 sets “sub liquid crystal temperature abnormality (see sub liquid crystal I / F substrate error information shown in FIG. 57)” as error data in the error management area of the DRAM (S932).

  Next, the MCU 900 performs an operation state determination process of the touch panel DD19T (S933).

  Next, the MCU 900 determines whether or not the ON state (touch, flick, or pinch state) of the touch panel DD19T is detected for 30 minutes or more (S934). When the ON state of the touch panel DD19T is detected for 30 minutes or more (S934: Yes), the MCU 900 proceeds to the next process of S935. When the state is not detected for 30 minutes or more (S934: No), the MCU 900 proceeds to the process of S936.

  Next, the MCU 900 sets “touch panel input abnormality (see sub liquid crystal I / F substrate error information shown in FIG. 57)” as error data in the error management area of the DRAM (S935).

  Next, the MCU 900 determines whether or not data indicating a status, a set value, or 'temperature abnormality' is set in the error management area (S936). If any of the above data is set in the error management area (S936: Yes), the MCU 900 proceeds to the process of the next S937. If none of the above data is set in the error management area (S936: No), the MCU 900 ends the sub liquid crystal self-diagnosis process.

  Next, the MCU 900 performs sub liquid crystal operation stop processing (S937). As a result, the operations of the sub liquid crystal display device DD19 and the touch panel DD19T are stopped. Thereafter, the MCU 900 ends the sub liquid crystal self-diagnosis process.

[Transmission between sub-control and sub-liquid crystal]
FIG. 122 shows sub-liquid crystal transmission processing between the sub control and the sub liquid crystal by the MCU 900 of the sub liquid crystal I / F substrate SL. As shown in the figure, the MCU 900 adds 1 to the transmission cycle counter (S941). This transmission cycle counter is an addition counter for measuring the cycle of transmitting a command from the sub liquid crystal I / F substrate SL.

  Next, the MCU 900 determines whether or not the value of the transmission cycle counter is a predetermined value, for example, 50 (200 msec) or more (S942). When the value of the transmission cycle counter is equal to or larger than the predetermined value (S942: Yes), the MCU 900 proceeds to the next process of S943. When the value of the transmission cycle counter is less than the predetermined value (S942: No), the MCU 900 ends the transmission process between the sub control and the sub liquid crystal.

  Next, the MCU 900 clears the value of the transmission cycle counter (S943).

  Next, the MCU 900 determines whether error data exists in the error management area of the DRAM (S944). When error data exists in the error management area (S944: Yes), the MCU 900 proceeds to the next process of S945. If there is no error data in the error management area (S944: No), the MCU 900 proceeds to the process of S947.

  Next, the MCU 900 sends an “error notification (see CMD: 45H shown in the left column of FIG. 55)” command to the sub control board SS in an error management area (CMD: 45H, D1: error information shown in the left column of FIG. 55). The transmission data is created (S945). This transmission data is stored in the transmission storage area of the DRAM, and is transmitted as a transmission command to the sub control board SS by a third serial line transmission process in S956 described later.

  Next, the MCU 900 sets a reset request flag in various storage areas of the DRAM to ‘ON’ (S946). Thereafter, the MCU 900 proceeds to the process of S956.

  In step S947, the MCU 900 determines whether or not the sub liquid crystal setting flag in the flag area of the DRAM is “OFF”. When the sub liquid crystal setting flag is “OFF” (S947: Yes), the MCU 900 proceeds to the next process of S948. If the sub liquid crystal setting flag is not “OFF” (S947: No), the MCU 900 proceeds to the process of S949.

  Next, the MCU 900 creates transmission data of a “startup parameter request (see CMD: 41H shown in the left column of FIG. 55)” command for the sub control board SS (S948). This transmission data is stored in the transmission storage area of the DRAM, and is transmitted as a transmission command to the sub control board SS by a third serial line transmission process in S956 described later. After the process of S948, the MCU 900 proceeds to the process of S956.

  In S949, the MCU 900 determines whether or not there is a transmission request for the “reception confirmation” command to the sub control board SS. If there is a transmission request for the 'reception confirmation' command (S949: Yes), the MCU 900 proceeds to the next processing of S950. When there is no transmission request for the “reception confirmation” command (S949: No), the MCU 900 proceeds to the process of S951.

  Next, the MCU 900 creates transmission data of the “reception confirmation (see CMD: 44H shown in the left column of FIG. 55)” command with respect to the sub-control board SS (S950). This transmission data is stored in the transmission storage area of the DRAM, and is transmitted as a transmission command to the sub control board SS by a third serial line transmission process in S956 described later. After the process of S950, the MCU 900 proceeds to the process of S956.

  In step S951, the MCU 900 determines whether there is a transmission request for the “status” command to the sub control board SS. If there is a transmission request for the 'status' command (S951: Yes), the MCU 900 proceeds to the next process of S952. If there is no transmission request for the 'status' command (S951: No), the MCU 900 proceeds to the process of S955.

  Next, the MCU 900 determines whether or not the data type in the status storage area of the DRAM relates to touch input (S952). If the data type of the status storage area is related to touch input (S952: Yes), the MCU 900 proceeds to the next process of S953. When the data type of the status storage area is not related to touch input, that is, related to liquid crystal setting (S952: No), the MCU 900 proceeds to the process of S954.

  Next, the MCU 900 creates the transmission data by adding the touch panel input area data to the 'status (see CMD: 43H shown in the left column of FIG. 55)' command related to the touch input to the sub control board SS (S953). ). This transmission data is stored in the transmission storage area of the DRAM, and is transmitted as a transmission command to the sub control board SS by a third serial line transmission process in S956 described later. After the process of S953, the MCU 900 proceeds to the process of S956.

  In S954, the MCU 900 creates transmission data of a command indicating “status (refer to CMD: 43H shown in the left column of FIG. 55)” related to the liquid crystal setting for the sub control board SS. This transmission data is stored in the third transmission storage area of the DRAM, and is transmitted as a transmission command to the sub control board SS by a third serial line transmission process in S956 described later. After the process of S954, the MCU 900 proceeds to the process of S956.

  In step S955, the MCU 900 creates transmission data of a command indicating “parameter request (see CMD: 42H shown in the left column of FIG. 55)” for the sub control board SS. This transmission data is stored in the third transmission storage area of the DRAM, and is transmitted as a transmission command to the sub-control board SS by the third serial line transmission processing of the next S956.

  Next, the MCU 900 performs a third serial line transmission process (S956). By this transmission processing, various commands are transmitted from the sub liquid crystal I / F substrate SL to the sub control substrate SS via the scaler substrate SK. Thereafter, the MCU 900 ends the sub-control-sub liquid crystal transmission process.

(Optical adjustment of projector device B2)
FIG. 123 is a diagram showing a test pattern projected during optical adjustment of projector device B2. A factory inspection person (also called a quality assurance person) activates application software for optical adjustment on the adjustment PC 1000 and performs a predetermined operation according to the menu of the software, whereby the fixed screen mechanism D and the front screen mechanism E1. Alternatively, the reel screen mechanism F1 can be operated to display a test pattern TP as shown in FIG. 123 on each projection plane. FIG. 123 shows a state where the test pattern TP is displayed on the reflection portion D1 of the fixed screen mechanism D as an example. The factory inspection worker can observe the display mode of the test pattern TP from the upper display window UD1 of the gaming machine 1.

  The test pattern TP is, for example, a pattern in which a SMPTE (Society of Motion Picture and Television Engineers) color bar is sprite-shaped in a circle and small circular patterns arranged in four corners on a background cross-hatch pattern It is.

  Specifically, the factory inspector operates the fixed screen mechanism D, the front screen mechanism E1, and the reel screen mechanism F1 so that they are projection targets. While observing the display mode of the test pattern TP, the projector apparatus B2 can be adjusted so that the display mode is appropriate. Thereby, for the projector device B2, the horizontal position adjustment value, the vertical position adjustment value, the focus position adjustment value, the LED brightness setting, the keystone distortion correction value, the white color temperature setting, the brightness setting, the contrast setting, the gamma setting, and the test. Optical adjustment can be performed for each item such as a pattern, a horizontal position offset, a vertical position offset, and a focus position offset.

  In this embodiment, at the time of adjustment work such as before assembly of the gaming machine, identification symbols 'A' to 'C' are assigned to the fixed screen mechanism D, the front screen mechanism E1, and the reel screen mechanism F1, for example. Using these identification symbols, different horizontal position A to C adjustment values, vertical position A to C adjustment values, and focus position A to C adjustment values for each projection target are set in the EEPROM 231 of the projector control board B23. Other adjustment items (LED brightness setting, keystone distortion correction value, white color temperature setting, brightness setting, contrast setting, gamma setting, test pattern, horizontal position offset, vertical position offset, focus position offset) After being assembled, it is set in the SRAM 401 of the sub control board SS. Note that the horizontal position offset, the vertical position offset, and the focus position offset can be adjusted by offset adjustment by a maintenance worker at a site such as a game arcade at the factory.

  On the other hand, FIG. 124 is a diagram showing a test pattern TP ′ and the like displayed on the screen (touch panel DD19T) of the sub liquid crystal display device DD19 at the time of optical adjustment of the projector device B2 in the field such as a game hall. After the gaming machine 1 is installed in a game arcade or the like, the test pattern TP ′ or the like can be displayed on the touch panel DD19T serving as the screen of the sub liquid crystal display device DD19 by performing a predetermined operation by the maintenance worker. . The maintenance worker can appropriately perform optical adjustment of the projector apparatus B2 individually using such a test pattern TP '.

  Unlike the test pattern TP displayed directly on the projection target, the test pattern TP ′ displayed on the touch panel DD19T is displayed as an operation target that can be intuitively deformed as a virtual image by simulation. In addition, the touch panel DD19T displays buttons T1 and T2 for changing the setting of horizontal position offset, vertical position offset, focus position offset, and focus drift correction for each projection target, as well as trapezoidal distortion correction and LED brightness. A button T3 and an indicator T4 for changing the setting of white color temperature, brightness, contrast, and gamma value are displayed, and a numeric keypad T5 for inputting various numerical values is also displayed.

  Specifically, the maintenance worker displays a test pattern TP ′ or the like on the touch panel DD19T by performing a predetermined operation, and any one of the fixed screen mechanism D, the front screen mechanism E1, and the reel screen mechanism F1 is projected. Operate to be the target. Thereafter, the maintenance operator operates the buttons T1 and T2 to select any one of the horizontal position offset, the vertical position offset, the focus position offset, and the focus drift correction, and the test pattern TP ′ is directly selected by operating the touch panel. Adjustment can be performed so that the display mode becomes appropriate while changing. In other words, the display position of the test pattern TP ′ changes vertically and horizontally and the image quality changes according to the operation of the maintenance worker. Thereby, about projector apparatus B2, a setting change can be performed for every different projection object about horizontal position offset, vertical position offset, focus position offset, and focus drift correction. At this time, the maintenance operator can also observe the actual test pattern TP because the test pattern TP is projected from the projector device B2 onto the national screen mechanism D at the same time. The horizontal position offset, vertical position offset, focus position offset, and focus drift correction are set in the projector setting value storage area of the SRAM 401 and the projector setting value storage area of the sub RAM board 41 of the sub control board SS.

  In addition, the maintenance worker operates the button T3, the numeric keypad T5, etc. while observing the test pattern TP ′ together with the actual test pattern TP, thereby correcting trapezoidal distortion, LED brightness, white color temperature, brightness, contrast, and gamma value. These settings can be changed by directly inputting numerical values. At this time, the overall shape or color tone of the test pattern TP ′ changes according to the operation of the maintenance worker. The values of various items such as trapezoidal distortion correction, LED brightness, white color temperature, brightness, contrast, and gamma value that have been changed in this way are the projector setting value storage area of the SRAM 401 of the sub control board SS and the sub RAM board 41. Is set in the projector setting value storage area.

  Next, a modified example of the present invention will be described. Note that the same or similar components as those according to the above-described embodiment are denoted by the same reference numerals and description thereof is omitted.

(Projector cooling structure)
FIG. 125 shows a first modification of the projector device. The projector apparatus X shown in the figure has a bottom plate X21 and a cover case X22. In the interior partitioned by the bottom plate X21 and the cover case X22, the lens unit B21 (partially not shown) including the projection lens 210, the LED light sources (240R, 240G, 240B), and DMD (the same as described above) are provided. 241) and other optical mechanisms (not shown) are provided, and an exhaust fan 245, heat radiation plates 2430 and 2431, and a heat sink 243Xa are further provided. A heat sink 243Xc is externally attached to the outside of the cover case X22 so as to be exposed. An opening X22B for guiding the irradiation light from the projection lens 210 to the outside is provided on one surface (front surface in FIG. 125) of the cover case X22. The projector device X of the first modification is directly attached to the upper surface wall G4 of the cabinet G and is provided so as to guide the irradiation light directly to the projection target without using a mirror.

  An LED light source (240Ra, 240Ga, 240Ba) (not shown) and a DMD substrate (241a) are provided in contact with one surface (the lower surface in FIG. 125) of the heat radiating plate 2430. Another heat radiating plate 2431 is disposed on the other surface (the upper surface in FIG. 125) of the heat radiating plate 2430, and the two heat radiating plates 2430 and 2431 are attached by screws. A heat conducting sheet (or heat conducting gel) is attached to the surface where the heat radiating plate 2430 and the heat radiating plate 2431 are in contact, and a screw fixing tap is cut into a screw shape on the heat radiating plate 2430 (not shown). ) A mounting hole for screwing with a screw is provided on the upper surface of the heat radiating plate 2431. Further, the heat pipe 243Xd and the heat sink 243Xc can be removed by removing the screws of the heat sink 2431. The heat radiating plate 2430 is connected to transmit heat generated in the LED light source and the DMD substrate to the heat sink 243Xa through the heat pipe 243Xb. The heat dissipated in the air by the heat sink 243Xa is forcibly exhausted by the exhaust fan 245 through the exhaust port X22D provided in the cover case X22.

  On the other hand, the heat radiating plate 2431 is connected to transfer heat to the heat sink 243Xc through the heat pipe 243Xd. The heat pipe 243Xd extends from the inside of the cover case X22 to the outside through a hole X22A provided in the cover case X22, and is connected to a heat sink 243Xc provided outside. That is, the heat radiating plate 2431 receives heat generated from the LED light source and the DMD substrate from the heat radiating plate 2430, and is further connected to transmit heat to the heat sink 243Xc via the heat pipe 243Xd. Thereby, the heat generated in the LED light source and the DMD substrate is transmitted to the heat sink 243Xc located outside the cover case X22 through the heat radiating plate 2431 and the heat pipe 243Xd, and is guided to the outside of the projector device X and is transmitted by the heat sink 243Xc. The heat is exhausted. Such an external heat sink 243Xc can also effectively eliminate the accumulation of heat inside the projector apparatus X and prevent overheating of optical components such as lenses.

  FIG. 126 shows a second modification of the projector device. The projector device X ′ shown in the figure has a bottom plate X21 and a cover case X22, and a lens unit B21 (partially omitted) including a projection lens 210 therein, as in the first modification. In addition, an optical mechanism (not shown) including an LED light source (240R, 240G, 240B) and DMD (241) is provided, and an exhaust fan 245, a heat radiating plate 2430, and heat sinks 243Xa, 243Xc are provided. Yes. Unlike the above-described first modification, the heat sink 243Xc is arranged as follows.

  The heat sink 243Xc is directly bonded to one surface (the upper surface in FIG. 126) of the heat radiating plate 2430, and is provided so that heat is directly transmitted from the heat radiating plate 2430. Further, the fin portion of the heat sink 243Xc is exposed to the outside through an opening X22C provided on one surface (the upper surface in FIG. 126) of the cover case X22. According to such an arrangement structure of the heat sink 243Xc, the heat generated in the LED light source and the DMD substrate is efficiently transmitted to the fin portion of the heat sink 243Xc located outside the cover case X22 through the heat radiating plate 2430. It will be exhausted outside. Such a heat sink 243Xc with the fin portion exposed to the outside can also effectively eliminate the accumulation of heat inside the projector apparatus X and prevent overheating of optical components such as lenses.

  FIG. 127 shows an arrangement of projector apparatuses according to the third modification. The projector apparatus X ″ shown in the figure does not have a detailed structure, but employs the same structure as the projector apparatus X ′ shown in FIG. 126 described above except that a heat sink exposed to the outside is not provided. That is, in the projector apparatus X ″, a heat radiating plate 2430 is provided so as to face the opening X22C of the cover case X22 instead of the heat sink 243Xc described above, and the upper surface of the heat radiating plate 2430 is slightly protruded from the opening X22C. It is exposed (not shown in FIG. 127). In such a projector device X ″, the heat radiating plate 2430 exposed from the opening X22C of the cover case X22 is connected to the upper surface wall G4 of the cabinet G via the metal heat conducting member Y, and the upper surface wall G4 is not shown. The top wall G4 is made of a metal plate member having a high thermal conductivity such as stainless steel. According to such a mounting structure of the projector device X ″, the upper surface wall G4 is generated inside the device. Heat is efficiently transmitted to the upper surface wall G4 through the heat radiating plate 2430 and the heat conducting member Y, and the upper surface wall G4 itself functions as a heat radiating member, so that the heat accumulation inside the projector device X ″ is effectively eliminated. And overheating of optical components such as lenses can be prevented.

  In addition, this invention is not limited to the pachislot machine which concerns on said embodiment, For example, you may apply to what is called a pachinko machine.

  As above, the gaming machine 1 according to the embodiment of the present invention and the modification examples of the projector device provided therein have been described. It is disclosed as an additional note that the gaming machine 1 described above basically has the following features and effects.

[Appendix A-1]
A projection device (for example, projector device B2 etc.) that projects an image by irradiation light;
A plurality of projection surfaces (for example, the reflection surfaces of the reflection portions D1 to D4, the projection surface E11a, the projection surface F1a, etc.) capable of displaying the image projected by the projection device;
A projection surface drive mechanism (for example, front screen drive mechanism E2, reel) that displaces at least one of the plurality of projection surfaces (for example, projection surface E11a, projection surface F1a, etc.) relative to the projection device. Screen drive mechanism F2 etc.),
Control means for controlling the projection surface drive mechanism and the projection apparatus (for example, a sub-control board SS),
The projector is
A plurality of optical means for projecting an image (for example, LED light sources 240R, 240G, 240B, DMD 241, lens unit B21, focus mechanism 242 of projection lens 210, etc.);
Optical control means for controlling the plurality of optical means (for example, control LSI 230 of projector control board B23 for performing projector control processing),
The optical control means can control the plurality of optical means based on various setting information,
Setting information changing means (for example, control LSI 230) for changing the various setting information according to an external input;
Setting information external request means for requesting the various setting information to the outside (for example, a control LSI 230 for performing sub-control-projector reception processing and sub-control-projector transmission processing),
The control means includes setting information output means (for example, a sub CPU 400 of the sub control board SS that performs projector control processing) capable of outputting the various setting information to the optical control means,
The setting information output means outputs the various setting information in response to a request for the various setting information from the setting information external request means (for example, a start parameter request command output by the control LSI 230). And

  According to such a configuration, various setting information for controlling the LED light sources 240R, 240G, 240B, the DMD 241, the focus mechanism 242 and the like in the projector device B2 is requested to the sub control board SS, and the sub control board is accordingly responded. Since the setting information can be changed based on various setting information output from the SS and the optical adjustment of the projector device B2 can be performed, a plurality of high-definition images with high image visual effects can be obtained for each gaming machine. The projection surfaces E11a, F1a and the reflecting surfaces of the reflecting portions D1 to D4 can be projected.

[Appendix A-2]
The setting information external request means is a startup setting request signal for acquiring the various setting information when the projection apparatus is turned on (for example, in sub-transmission-projector transmission time processing performed by the control LSI 230 in S815). The “start parameter request” command or the like) is output to the setting information output means.

  According to such a configuration, when the projector apparatus B2 is powered on, a startup parameter request command is output to the sub control board SS, and various setting information is output from the sub control board SS in response to the command, so that the power The optical adjustment of the projector device B2 can be performed every time it is turned on.

[Appendix B-1]
A projection device (for example, projector device B2 etc.) that projects an image by irradiation light;
A plurality of projection surfaces (for example, the reflection surfaces of the reflection portions D1 to D4, the projection surface E11a, the projection surface F1a, etc.) capable of displaying the image projected by the projection device;
A projection surface drive mechanism (for example, front screen drive mechanism E2, reel) that displaces at least one of the plurality of projection surfaces (for example, projection surface E11a, projection surface F1a, etc.) relative to the projection device. Screen drive mechanism F2 etc.),
Control means for controlling the projection surface drive mechanism and the projection apparatus (for example, a sub-control board SS),
The projector is
A plurality of optical means for projecting an image (for example, LED light sources 240R, 240G, 240B, DMD 241, lens unit B21, focus mechanism 242 of projection lens 210, etc.);
Optical control means (for example, control LSI 230 of projector control board B23) for controlling the plurality of optical means,
The optical control means can control the plurality of optical means based on various setting information,
Setting information input means (for example, control LSI 230, second serial line, etc.) for inputting the various setting information from the outside;
Optical setting information storage means (for example, DRAM of the projector control board B23) for storing the various setting information input by the setting information input means,
The control means includes
Setting information output means for outputting the various setting information to the optical control means (for example, the sub CPU 400 of the sub control board SS, the first serial line, the second serial line);
Control setting information storage means for storing the various setting information (for example, the sub-RAM board 41 of the sub-control board SS);
Setting information changing means for changing the various setting information based on the switching of the plurality of projection planes by the projection plane driving mechanism (for example, the sub CPU 400 of the sub control board SS that performs processing at the time of projector control reception) Etc.)
The various setting information changed by the setting information changing means is externally output through the setting information output means.

  According to such a configuration, when the projection plane E11a and the projection plane F1a are switched by operating the screen driving mechanisms E2 and F2, for example, the focus position adjustment value or the like as various setting information for controlling the focus mechanism 242 The sub-control board SS changes the focus position offset, and the optical adjustment of the projector device B2 can be appropriately and dynamically performed for each projection target based on various setting information output from the sub-control board SS after the change. Therefore, a high-definition image with a high visual effect can be displayed on any of a plurality of projection surfaces.

[Appendix C-1]
A projection device (for example, projector device B2 etc.) that projects an image by irradiation light;
A plurality of projection surfaces (for example, the reflection surfaces of the reflection portions D1 to D4, the projection surface E11a, the projection surface F1a, etc.) capable of displaying the image projected by the projection device;
A projection surface drive mechanism (for example, front screen drive mechanism E2, reel) that displaces at least one of the plurality of projection surfaces (for example, projection surface E11a, projection surface F1a, etc.) relative to the projection device. Screen drive mechanism F2 etc.),
Control means for controlling the projection surface drive mechanism and the projection apparatus (for example, a sub-control board SS),
The projector is
Optical means for projecting an image (for example, the focus mechanism 242 of the projection lens 210);
Optical control means for controlling the optical means (for example, the control LSI 230 of the projector control board B23);
Temperature detection means (for example, temperature sensor B25 etc.) for detecting the temperature in the projection device,
The optical control means acquires temperature information related to the temperature detected by the temperature detection means, and outputs temperature information to the control means (for example, sub-control-projector transmission time processing) Control LSI 230, etc.)
The control means corrects the setting information related to the projection apparatus based on the temperature information output from the temperature information output means and predetermined temperature information, and also corrects the corrected setting information (for example, focus drift). Temperature correction information output means (for example, a sub CPU 400 that performs projector drift correction processing and projector control reception processing) that outputs a correction value or the like) to the optical control means,
The optical control means is capable of controlling the optical means based on the setting information output from the temperature correction information output means.

  According to such a configuration, the sub CPU 400 of the sub control board SS corrects the focus drift correction value as the setting information according to the temperature change in the projector device B2, and the projector control board B23 is based on the focus drift correction value. Since the control LSI 230 can dynamically control the focus mechanism 242, it is possible to project a high-quality image with a high image visual effect on a plurality of projection surfaces.

[Appendix D-1]
A projection device (for example, projector device X, X ′, X ″, etc.) that projects an image by irradiation light;
A plurality of projection surfaces (for example, the reflection surfaces of the reflection portions D1 to D4, the projection surface E11a, the projection surface F1a, etc.) capable of displaying the image projected by the projection device;
A projection plane drive mechanism (for example, front screen drive mechanism E2, reel) that displaces at least one projection plane (for example, projection plane E11a, projection plane F1a, etc.) of the plurality of projection planes relative to the projection apparatus. Screen drive mechanism F2 etc.),
The projector is
A case (for example, a cover case X22),
A plurality of optical means (for example, LED light sources 240R, 240G, 240B, DMD241, etc.) disposed inside the case for projecting images;
A heat radiating member (for example, a heat sink 243Xc) for dissipating heat generated by the plurality of optical means,
The heat dissipation member is exposed to the outside of the case.

  According to such a configuration, the heat generated in the cover case X22 of the projector devices X and X ′ can be efficiently exhausted to the outside of the cover case X22 by the heat sink 243Xc, so that the projector devices X and X ′ On the other hand, it is possible to stably operate by taking appropriate heat countermeasures, to cope with various game machine specifications, and to display high-quality images with a high visual effect on a plurality of projection surfaces.

[Appendix D-2]
The projection apparatus has other heat radiating means (for example, heat radiating plates 2430 and 2431, heat sink 243Xa, etc.) disposed at a position different from the heat radiating member,
The heat radiating means is housed in the case.

  According to such a configuration, heat can be efficiently exhausted by the other heat radiating plates 2430 and 2431 and the heat sink 243Xa arranged in the cover case X22, so that heat appropriate for the projector devices X and X ′ can be obtained. Measures can be taken.

[Appendix D-3]
The heat radiating member is configured to be removable from the projection device.

  According to such a configuration, since it is possible to remove the heat sink 243Xc from the projector devices X and X ′ according to the specifications of the gaming machine, appropriate heat countermeasures for the projector device B2 are taken for each gaming machine unit. Can do.

[Appendix D-4]
A gaming machine body (for example, a housing 2),
A front door (for example, an upper door mechanism UD, a lower door mechanism DD, etc.) disposed in the gaming machine main body;
A projection device for projecting an image by irradiation light (for example, a projector device X ″);
A display device (for example, display unit A) capable of displaying the image projected by the projection device,
The projector is
A case (for example, a cover case X22),
A plurality of optical means (for example, LED light sources 240R, 240G, 240B, DMD241, etc.) disposed inside the case for projecting images;
A heat dissipating member (heat dissipating plate 2430) for dissipating heat generated by the plurality of optical means,
The heat radiating member is connected to an upper portion (upper wall G4) of the gaming machine main body.

  According to such a configuration, the heat generated in the case of the projector device X ″ can be efficiently exhausted to the upper surface wall G4 of the gaming machine main body by the heat radiating plate 2430. Appropriate heat countermeasures can be taken to ensure stable operation, as well as compatibility with various gaming machine specifications, and high-quality images with a high visual effect can be displayed on a plurality of projection surfaces.

[Appendix E-1]
A projection device (for example, projector device B2 etc.) that projects an image by irradiation light;
A plurality of projection surfaces (for example, the reflection surfaces of the reflection portions D1 to D4, the projection surface E11a, the projection surface F1a, etc.) capable of displaying the image projected by the projection device;
A projection surface drive mechanism (for example, front screen drive mechanism E2, reel) that displaces at least one of the plurality of projection surfaces (for example, projection surface E11a, projection surface F1a, etc.) relative to the projection device. Screen drive mechanism F2 etc.),
Control means for controlling the projection surface drive mechanism and the projection apparatus (for example, a sub-control board SS),
The projector is
Based on a plurality of focal position information (for example, focus position A to E adjustment values stored in the EEPROM 231) corresponding to the plurality of projection planes, a focus mechanism (for example, focusing) while changing a focal distance Focusing mechanism 242 etc.)
The control means controls the projection plane driving mechanism to relatively displace at least one projection plane among the plurality of projection planes (for example, a screen accessory control task performed by the sub CPU 400). , Instructing the projection device to change the focal length;
The projection apparatus is characterized in that, based on a command from the control unit, the focal point is adjusted while changing a focal length of the focus mechanism.

  According to such a configuration, when the projection surfaces E11a and F1a are displaced relative to the projector device B2, the focal length is dynamically changed based on the focus position A to E adjustment values stored in the EEPROM 231. Since the image can be projected with the focus on the projection planes E11a and F1a correctly while being changed or statically changed, there is no focus deviation with respect to the projection plane during or after the displacement. High-definition images can be projected.

[Appendix E-2]
The focus mechanism is
A projection lens (for example, projection lens 210 etc.) held so as to be movable along the optical axis direction;
A movable member (for example, a rack member 242A and the like) that can move integrally with the projection lens;
A lead screw (e.g., lead screw 242B) that is disposed along the optical axis direction and is rotatable while being screwed with the movable member;
And a drive motor (for example, a focus motor 242C) for rotating the lead screw.

  According to such a configuration, the projection lens 210 can be moved in the optical axis direction with high accuracy and high speed by the lead screw 242B. Therefore, when the projection surfaces E11a and F1a are displaced relative to the projector device B2. In addition, the focus position can be adjusted so that the focal length of the projection lens 210 is appropriate for both the projection surfaces E11a and F1a, and the projection surfaces E11a and F1a are accurately focused. Can display images.

[Appendix E-3]
The projection device, the plurality of projection planes, and the projection plane driving mechanism are integrated as a display unit (for example, display unit A) that is detachable from an appropriate part of the gaming machine. .

  According to such a configuration, the adjustment work can be performed on the focus mechanism 242 of the focus device B2 for each display unit A before being mounted on the gaming machine 1.

[Appendix F-1]
A projection device (for example, projector device B2 etc.) that projects an image by irradiation light;
A plurality of projection surfaces (for example, the reflection surfaces of the reflection portions D1 to D4, the projection surface E11a, the projection surface F1a, etc.) capable of displaying the image projected by the projection device;
A projection surface drive mechanism (for example, front screen drive mechanism E2, reel) that displaces at least one of the plurality of projection surfaces (for example, projection surface E11a, projection surface F1a, etc.) relative to the projection device. Screen drive mechanism F2 etc.),
Control means for controlling the projection surface drive mechanism (for example, a sub-control board SS),
The projector is
A plurality of optical means for projecting an image (for example, LED light sources 240R, 240G, 240B, DMD 241, lens unit B21, focus mechanism 242 of projection lens 210, etc.);
Optical control means (for example, projector control board B23) for controlling the plurality of optical means,
The optical control means can control the plurality of optical means based on various setting information,
Non-volatile setting information storage means (for example, EEPROM 231 of the projector control board B23) that stores the various setting information in a changeable manner according to an external input,
It can be connected to setting information changing means (for example, the adjustment PC 1000) for changing the various setting information stored in the setting information storage means by external input,
The control means is a control signal output means for outputting a control signal for controlling the plurality of optical means to the optical control means (for example, a sub CPU 400 of the sub control board SS that performs a projector control process). Have
The optical control unit controls the optical unit based on the various setting information stored in the setting information storage unit and a control signal output from the control signal output unit.

  According to such a configuration, various setting information stored in the EEPROM 231 of the projector control board B23 in order to control various optical means in the projector device B2 is changed according to an external input from the adjustment PC 1000. Thus, the optical adjustment of the projector device B2 can be performed, so that a high-definition image with a high image visual effect can be projected on a plurality of projection planes for each gaming machine.

[Appendix G-1]
A projection device (for example, projector device B2 etc.) that projects an image by irradiation light;
A plurality of projection surfaces (for example, the reflection surfaces of the reflection portions D1 to D4, the projection surface E11a, the projection surface F1a, etc.) capable of displaying the image projected by the projection device;
A projection surface drive mechanism (for example, front screen drive mechanism E2, reel) that displaces at least one of the plurality of projection surfaces (for example, projection surface E11a, projection surface F1a, etc.) relative to the projection device. Screen drive mechanism F2 etc.),
Control means for controlling the projection surface drive mechanism and the projection apparatus (for example, a sub-control board SS);
An auxiliary display device (for example, a sub liquid crystal display device DD19) disposed at a position different from the projection device,
The projector is
A plurality of optical means for projecting an image (for example, LED light sources 240R, 240G, 240B, DMD 241, lens unit B21, focus mechanism 242 of projection lens 210, etc.);
Optical control means (for example, control LSI 230 of projector control board B23) for controlling the plurality of optical means,
The optical control means can control the plurality of optical means based on various setting information that can be changed according to an external input,
The control means causes the auxiliary display device to display an adjustment screen (for example, an adjustment screen displayed on the sub liquid product display device DD19) for adjusting the various setting information, and uses the adjustment screen. And setting information changing means (for example, the sub CPU 400 of the sub control board SS) for changing the setting information.

  According to such a configuration, various setting information for controlling the optical means is received according to the external input from the touch panel DD19T while displacing the projection planes E11a and F1a by operating the screen driving mechanisms E2 and F2. When changing, the operator can dynamically perform the optical adjustment of the projector device B2 while confirming the test pattern TP ′ as the image adjustment image displayed on the adjustment screen of the sub liquid crystal display device DD19. Optical adjustment of the projector device B2 can be performed at the time of manufacturing or maintenance of the gaming machine, and a high-quality image with a high image visual effect can be displayed over a long period of time.

[Appendix H-1]
A plurality of display devices (for example, projector device B2, sub liquid crystal display device DD19, etc.);
Control means (for example, sub-control board SS) capable of outputting display signals to the plurality of display devices;
Display signal conversion means (for example, a scaler substrate SK) provided between the plurality of display devices and the control means,
The control means includes
Display signal synthesizing means for synthesizing display signals corresponding to each of the plurality of display devices (for example, a sub CPU 400 that generates a divided display pattern);
Combined signal output means (for example, a sub CPU 400 that generates a divided display pattern) that outputs one combined signal combined by the display signal combining means;
The display signal converting means includes
Combined signal input means (for example, a multi-output scaler LSI 710 of the scaler substrate SK) for inputting one combined signal output from the combined signal output means;
Combined signal dividing means (for example, a multi-output scaler LSI 710 on the scaler substrate SK) for dividing one combined signal input by the combined signal input means into a plurality of display signals;
Display signal output means (for example, a multi-output scaler LSI 710 of the scaler substrate SK) that outputs the plurality of display signals divided by the combined signal dividing means to the corresponding display devices, respectively.
The composite signal dividing means can convert each display signal output to the plurality of display devices.

  According to such a configuration, although there are a plurality of display devices such as the projector device B2 and the sub liquid crystal display device DD19, a plurality of display signals corresponding to these are output together as one composite signal, and then the one Is divided into a plurality of original display signals and supplied to the corresponding projector device B2 and sub liquid crystal display device DD19, so that a display control system can be easily constructed, and hardware and software surfaces Cost increase can be suppressed.

[Appendix I-1]
A plurality of display devices (for example, projector device B2, sub liquid crystal display device DD19, etc.);
Control means (for example, sub-control board SS) capable of outputting display signals to the plurality of display devices;
Display signal conversion means (for example, a scaler substrate SK) provided between the plurality of display devices and the control means,
The control means includes
Display signal synthesizing means for synthesizing display signals corresponding to each of the plurality of display devices (for example, a sub CPU 400 that generates a divided display pattern);
Combined signal output means for outputting one combined signal combined by the display signal combining means (for example, the sub CPU 400 for generating a divided display pattern);
Display information setting instruction means (for example, a sub CPU 400 that performs a scaler control process) for instructing to set display numbers and display characteristics corresponding to each of the plurality of display devices as display information;
The display signal converting means includes
Display information setting means for setting the display number and display characteristics instructed by the display information setting instruction means (for example, MCU 700 for performing the scaler board main processing);
Combined signal input means (for example, a multi-output scaler LSI 710 of the scaler substrate SK) for inputting one combined signal output from the combined signal output means;
Combined signal dividing means (for example, a multi-output scaler LSI 710 on the scaler substrate SK) for dividing one combined signal input by the combined signal input means into a plurality of display signals;
Display signal output means (for example, a multi-output scaler LSI 710 of a scaler substrate SK) that outputs a plurality of display signals divided by the combined signal dividing means to the corresponding display devices, respectively. To do.

  According to such a configuration, although there are a plurality of display devices such as the projector device B2 and the sub liquid crystal display device DD19, a plurality of display signals corresponding to these display devices are collectively output from the sub-control board SS as one composite signal. The one composite signal is divided into a plurality of original display signals based on the display number and display characteristics instructed to be set by the sub control board SS, and these display signals correspond to the projector device B2 and the sub liquid crystal display device, respectively. Since it is supplied to the DD 19, the display control system can be easily constructed, and the increase in hardware and software costs can be suppressed.

[Appendix I-2]
The display signal conversion means sets the number of composites of one composite signal input by the composite signal input means and the display characteristics of the plurality of display signals divided by the composite signal division means by the display information setting instruction means. It is characterized by being instructed.

  According to such a configuration, since it is possible to instruct the setting of display characteristics for each of a plurality of display signals divided according to the number of synthesized signals and the number of synthesized signals, the scaler substrate SK can It is possible to efficiently convert the combined signal into a plurality of display signals that differ depending on display characteristics.

[Appendix J-1]
A main control means (for example, a main control board MS) for performing main control processing related to the game and outputting various control signals;
Game operation control means (for example, a reel drive board RD) for controlling a predetermined game operation in response to a control signal from the main control means;
Relay means for relaying various signals to the main control means (for example, a door relay board DS),
The main control means and the game operation control means are connected to output a control signal in one direction from the main control means to the game operation control means,
The gaming operation control unit and the relay unit are connected via a first optical fiber cable (for example, the first optical fiber cable FC1) so as to transmit a signal in one direction from the gaming operation control unit to the relay unit. Has been
The relay unit and the main control unit are connected via a second optical fiber cable (for example, the second optical fiber cable FC2) so as to transmit a signal in one direction from the relay unit to the main control unit. It is characterized by being.

  According to such a configuration, the main control board MS, the reel drive board RD, and the door relay board DS are connected in a loop so that signals are transmitted only in one direction via the first optical fiber cable FC1 and the second optical fiber cable FC2. Therefore, it is possible to easily reduce the number of connection lines compared to the case where all harnesses are used, and it is possible to prevent malfunctions of internal devices due to noise of the connection lines, and the internal structure including wiring. The degree of design freedom can be increased.

[Appendix K-1]
A projection device (for example, projector device B2 etc.) that projects an image by irradiation light;
A plurality of projection surfaces (for example, the reflection surfaces of the reflection portions D1 to D4, the projection surface E11a, the projection surface F1a, etc.) capable of displaying the image projected by the projection device;
A projection surface drive mechanism (for example, front screen drive mechanism E2, reel) that displaces at least one of the plurality of projection surfaces (for example, projection surface E11a, projection surface F1a, etc.) relative to the projection device. Screen drive mechanism F2 etc.),
Control means for controlling the operation of the projection plane drive mechanism and controlling the projection apparatus (for example, a sub-control board SS),
The projector is
Optical means for projecting an image (e.g., projection lens 210);
Optical control means (for example, focus mechanism 242, control LSI 230 of projector control board B23, etc.) having a focus mechanism for controlling the optical means,
The optical control unit includes a focus mechanism control unit (for example, a lead screw 242B of the focus mechanism 242 and a control LSI 230) that controls the focus mechanism.
The control means performs a focus change time calculation means (for example, a focus change request process) that calculates a focus change time based on a required operation time of the projection plane drive mechanism and a time required for changing the focus position of the focus mechanism. Sub CPU 400 etc.)
The control means instructs the optical control means (for example, a sub CPU 400 that performs a screen accessory control process) to control the focus mechanism based on the focus change time calculated by the focus change time calculation means. It is characterized by doing.

  According to such a configuration, when the projection planes E11a and F1a are displaced by operating the screen drive mechanisms E2 and F2, the required operation time for the operation and the time required for changing the focus position of the focus mechanism 242 are obtained. By controlling the focus mechanism 242 based on the calculated focus change time, the focus adjustment of the projection lens 210 can be performed efficiently, so that a high-quality image visual effect is high even on the projection surface after displacement. Can quickly display the right image.

[Appendix K-2]
The control means can cancel the focus change time calculated by the focus change time calculation means (for example, the process in S191 of the focus change request process).

  According to such a configuration, the sub CPU 400 of the sub control board SS can control the focus mechanism 242 after canceling the focus change time, so that the focus adjustment can be performed quickly and efficiently.

DESCRIPTION OF SYMBOLS 1 Game machine G Cabinet G4 Upper surface wall A Display unit B1 Projector cover B12 Upper wall part B2, X, X ', X "Projector apparatus B21 Lens unit B22, X22 Case B23 Projector control board B25 Temperature sensor 210 Projection lens 230 Control LSI
240R, 240G, 240B LED light source 241 DMD
242 Focus mechanism 242A Rack member 242B Lead screw 242C Focus motor 243R, 243G, 243B, 243D, 243Xa, 243Xc Heat sink 245 Exhaust fan 400 Sub CPU
401 SRAM
700 MCU
710 Multi-output scaler LSI
2430, 2431 Radiating plates D1 to D4 Reflector E11a Projection surface (movable projection surface)
F1a projection plane (movable projection plane)
E2 Front screen drive mechanism F2 Reel screen drive mechanism MS Main control board SS Sub control board SK Scaler board RD Reel drive board DS Door relay board FC1 First optical fiber cable FC2 Second optical fiber cable DD19 Sub liquid crystal display DD19T Touch panel

Claims (4)

A projection device that projects an image by irradiation light;
A plurality of projection planes capable of displaying an image projected by the projection device;
A projection surface drive mechanism that displaces at least one of the plurality of projection surfaces relative to the projection device;
The projector is
Case and
A plurality of optical means disposed within the case for projecting an image;
A heat dissipating member for dissipating heat generated by the plurality of optical means,
The gaming machine, wherein the heat radiating member is exposed to the outside of the case. The projection device has other heat radiating means arranged at a position different from the heat radiating member,
The gaming machine according to claim 1, wherein the heat dissipating means is housed inside the case.   The gaming machine according to claim 1, wherein the heat radiating member is configured to be removable from the projection device. A gaming machine body,
A front door disposed in the gaming machine body;
A projection device that projects an image by irradiation light;
A display device capable of displaying an image projected by the projection device,
The projector is
Case and
A plurality of optical means disposed within the case for projecting an image;
A heat dissipating member for dissipating heat generated by the plurality of optical means,
The gaming machine, wherein the heat radiating member is connected to an upper portion of the gaming machine main body.

Images