JP2016186833A - Inspection device and method for thermally-assisted magnetic head element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inspection device for a thermally-assisted magnetic head element capable of guaranteeing highly-accurate inspection of a thermally-assisted magnetic head even when a diameter of a measurement probe of a cantilever varies per cantilever.SOLUTION: An inspection device for a thermally-assisted magnetic head element comprises: a cantilever; a displacement detecting system which detects a displacement of the cantilever; a photodetector which detects scattered light from the cantilever; a signal processing unit which receives and processes an output signal from a displacement detecting unit and an output signal from the photodetector; and a control unit which controls the entire processing. The inspection device further comprises: a mounting part on which a near-field light generating sample is mounted; a laser light source which emits laser; a laser irradiation optical system which generates near-field light by irradiating the near-field light generating sample with laser; and a table unit mounted with the mounting part and the laser irradiation optical system and moving the near-field light generating sample between the place immediately under the cantilever and a place apart from the cantilever.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a thermal assist magnetic head element inspection apparatus and method for inspecting a heat assist light emitting section and a magnetic field generation section of a heat assist magnetic head element by measuring a minute heat source using a scanning probe microscope.

  As a background art in the technical field of measuring a minute heat source using a scanning probe microscope and inspecting a heat-assisted light emitting part and a magnetic field generating part of a thermally-assisted magnetic head element, Japanese Patent Application Laid-Open No. 2013-101099 (Patent Document 1), There exist Unexamined-Japanese-Patent No. 2011-247899 (patent document 2) and Unexamined-Japanese-Patent No. 2014- 211409 (patent document 3).

  Patent Document 1 states that “in an inspection apparatus for inspecting a thermally assisted magnetic head element, a magnetic film is formed on the surface of a probe, and a fine particle or thin film of a noble metal or an alloy containing a noble metal is formed on the surface of the magnetic film. The cantilever, the displacement detection means for detecting the vibration of the cantilever, and the scattered light by the near-field light generated from the noble metal of the cantilever probe or the alloy particles containing the noble metal or the thin film generated from the near-field light emitting part. And a processing means for processing a signal obtained by the detection by the displacement detection means and the near-field light detection means ”.

  Further, Patent Document 2 states that “a light source that irradiates a measurement target composed of a cantilever having a probe at the tip or a probe of an arbitrary shape, a light source driving circuit that drives the light source, and a light source that irradiates the measurement target. The detected light is received as a spot light at a predetermined position through alignment, and the light receiving surface for detecting the light intensity is made of a semiconductor, and the detection signal of the light detector is amplified at a predetermined amplification factor. A scanning probe microscope comprising: an amplifier; amplifier variable means for arbitrarily adjusting an amplification factor of the amplifier; and light intensity variable means for arbitrarily changing irradiation light intensity from the light source to the measurement object. In the displacement detection method, the change of the light intensity of the light source by the light intensity varying means is adjusted so that the deformation of the measurement object falls within a predetermined deformation value, and the amplification factor of the amplification variable means By adjusting a scanning probe microscope displacement detecting method, characterized in that performing optical detection at a desired sensitivity in the photodetector. "It is described.

  Further, in Patent Document 2, “the detection signal is amplified so that the detection sensitivity at the photodetector becomes a predetermined value according to the difference in the received light intensity due to the difference in the reflectance of the measurement object. Is described.

  Further, in Patent Document 3, in the heat-assisted magnetic head inspection apparatus, the temperature dependence of the magnetic properties of a thin film of a specific magnetic material is obtained in advance, and the specific magnetic material is formed on the surface of the probe. When measuring the write magnetic field in the immediate vicinity of the micro heat source by the near-field light generated by the heat-assisted magnetic head using the cantilever, the probe at the tip of the cantilever comes into contact with the micro heat source and the temperature rises. It is described that the temperature of near-field light is estimated using the temperature dependence data of magnetic properties obtained in advance using the change in magnetic properties of the formed magnetic material. ing.

JP 2013-101099 A JP 2011-247899 A JP 2014- 211409 A

  As a magnetic head for the next generation hard disk, a thermally assisted magnetic head element has been studied. Thermally assisted light generated from the thermally assisted magnetic head element, that is, near-field light, is generated within a range of several tens of nanometers (nm) or less. The energy density or absolute temperature of the near-field light as a heat source determines the write track width of the hard disk. Therefore, in order to examine the performance of the thermally assisted magnetic head element, an inspection method for acquiring information such as the spatial intensity distribution of the near-field light described above is required. In recent years, the Scan Near-field Optical, which is a kind of scanning probe microscope (SPM) inspection technology, for minute light-emitting areas such as near-field light generated by heat-assisted magnetic heads. A technique for measuring the spatial intensity distribution of near-field light using Microscope (SNOM) has attracted attention (for example, Patent Document 1).

  However, the inspection apparatus disclosed in Patent Document 1 does not take into consideration that the diameter of the measurement probe of the cantilever that is a key component in measurement varies among the cantilevers, and each time the cantilever is replaced, the measurement sensitivity Changes, it is difficult to inspect stably and accurately, and it is difficult to accurately calibrate the measurement sensitivity.

  On the other hand, in Patent Document 2, in the inspection method by SPM, “detection sensitivity is amplified so that the detection sensitivity at the photodetector becomes a predetermined value according to the difference in received light intensity”. A displacement detection method for adjusting the angle is disclosed. However, the displacement detection method of Patent Document 2 does not consider that the scattered light intensity varies depending on the difference in the diameter of the measurement probe (probe), and it is difficult to adjust the detection sensitivity with high accuracy.

  Further, in the thermally-assisted magnetic head inspection apparatus disclosed in Patent Document 3, no consideration is given to the fact that the diameter of the measuring probe of the cantilever that is a key component in the measurement varies from cantilever to cantilever. The measurement sensitivity changes every time the battery is replaced, and it is difficult to inspect stably and accurately, and it is difficult to calibrate the measurement sensitivity with high accuracy.

  Accordingly, the present invention provides an inspection apparatus and method for a thermally assisted magnetic head element that can guarantee an inspection with high accuracy even if the diameter of the measurement probe of the cantilever varies among the cantilevers.

  In order to solve the above-described problems, in the present invention, an inspection apparatus for a thermally assisted magnetic head element is used in a state where a near field light is generated from a near field light emitting unit of the thermally assisted magnetic head element. A cantilever that scans the surface, a displacement detection system that irradiates the cantilever with light and detects reflected light from the cantilever, a photodetector that detects scattered light from the cantilever that scans the surface of the thermally-assisted magnetic head element, and A signal processing unit that receives the output signal from the displacement detection unit and the output signal from the photodetector and processes the signal, and a control unit that controls the whole, and further, the near-field light of the heat-assisted magnetic head element From a mounting unit for mounting a near-field light generating sample that generates substantially the same near-field light as the near-field light generated from the light emitting unit, a laser light source that emits a laser, and a laser light source A laser irradiation optical system that irradiates a near-field light generation sample placed on the placement unit to generate near-field light from the near-field light generation sample, and a placement on which the near-field light generation sample is placed The mounting portion and the laser irradiation optical system are mounted to include a table portion that moves the near-field light generating sample between a position directly below the cantilever and a location away from the cantilever.

  In order to solve the above-described problems, in the present invention, the surface of the thermally-assisted magnetic head element is scanned with a cantilever in the state where near-field light is generated from the near-field light emitting part of the thermally-assisted magnetic head element. Irradiating light to the cantilever scanning the surface of the assist magnetic head element to detect the reflected light from the cantilever, detecting the scattered light from the cantilever scanning the surface of the heat assist magnetic head element with a photodetector, In a method for inspecting a heat-assisted magnetic head element that receives a signal that detects reflected light from a cantilever and an output signal from a photodetector and processes the signal to inspect the heat-assisted magnetic head element, The laser beam emitted from the laser light source to the near-field light generating sample that generates near-field light that is almost the same as the near-field light generated from the near-field light emitting part of the laser. The surface of the near-field light generation sample is scanned with a cantilever while the near-field light generation sample is generated by irradiating the laser, and the scattered light from the cantilever probe is detected with a photodetector. The heat-assisted magnetic head element is inspected using the information of the obtained signal.

  ADVANTAGE OF THE INVENTION According to this invention, even if the diameter of the measurement probe of a cantilever has dispersion | variation for every cantilever, the test | inspection apparatus and test | inspection method of a thermally assisted magnetic head element which can ensure a test | inspection with high precision can be provided. It became so.

It is sectional drawing of the light emission sample which concerns on Example 1 thru | or 3 of this invention. It is a top view of the luminescent sample which shows the shape of the opening part of the luminescent sample which concerns on Example 1 thru | or 3 of this invention. It is a side view which shows the schematic structure of the illumination system and laser light source which irradiate a laser to the light emission sample which concerns on Example 1 thru | or 3 of this invention. It is a block diagram which shows the schematic structure of the heat-assisted magnetic head element inspection apparatus which mounts the standard light emission sample which concerns on Example 1 thru | or 3 of this invention. It is a side view of a cantilever, a luminescent sample, and a detector showing a measurement state, explaining the detection principle of the inspection apparatus according to Examples 1 to 3 of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure explaining the detection method based on Example 1 of this invention, (a) is sectional drawing of a light emission sample and cantilever when the diameter of the front-end | tip part of a cantilever probe is large, (b) is a probe of a cantilever probe. Sectional drawing of the light emission sample and cantilever in case the diameter of a front-end | tip part is small, (c) is a graph which shows the relationship between a probe diameter and a detected light quantity. It is a processing flowchart explaining the detection method which concerns on Example 1 of this invention. It is a figure explaining the detection principle which concerns on Example 2 of this invention, and is a graph explaining the relationship between the probe diameter which measured the luminescent sample, and the detected light quantity using the probe diameter (50-100nm) known in advance. is there. It is a processing flowchart explaining the detection method which concerns on Example 2 of this invention. It relates to a luminescent sample according to Example 3 of the present invention, (a) is a plan view of the luminescent sample when the aperture shape is circular, and (b) is a luminescent obtained by measuring the luminescent sample using a cantilever. (C) is a waveform diagram showing a signal waveform of line AA in the image of (b).

  The present invention relates to a heat-assisted magnetic head element inspection apparatus and a heat-assisted magnetic head inspection method capable of assuring high-precision inspection even when the diameter of the measurement probe of the cantilever varies among the cantilevers. It is about.

  The present invention also provides an apparatus for inspecting a thermally assisted magnetic head element, a standard sample capable of emitting near-field light next to a table movable in a plane on which the thermally assisted magnetic head element is mounted, and the light emission. A probe by adding an illumination optical system capable of emitting a sample, generating near-field light from the near-field light emitting portion of the light-emitting sample, and the cantilever probe oscillating up and down in the vicinity of the surface of the light-emitting sample; By detecting the scattered light component of the near-field light due to contact with the near-field light with a photodetector such as PMT or PD and exchanging the cantilever, by measuring the near-field light-emitting sample, the difference in individual cantilevers We recorded variations in near-field light measurement and eliminated variations in measurement sensitivity by adjusting the gain of the detector and adding corrections to the measurement results.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof will be omitted. As long as the gist of the present invention is not exceeded, the present invention is not limited to the examples and drawings described below.

  First, the design / manufacturing information of the standard near-field light-emitting sample of the present invention (standard sample: hereinafter referred to as a light-emitting sample) will be described with reference to FIGS. Example 1 is a thermal-assisted magnetic head element inspection apparatus equipped with a luminescent sample. By measuring the luminescent sample, the variation in near-field light measurement due to individual differences in the cantilever is recorded, and the gain adjustment of the photodetector is performed. By adding correction to the measurement result, a thermally assisted magnetic head element that can eliminate variations in measurement sensitivity is inspected.

  A light emitting sample 100 mounted on a thermal assist magnetic head element inspection apparatus is a sample in which an opening pattern 1004 is formed on a thin film formed on a SiO 2 substrate 1001. Specifically, as shown in FIG. 1, a Cr film 1002 (thickness: about 2 to 5 nm) is formed on a SiO 2 substrate 1001 (thickness: 0.625 mm), and then an Au film 1003 (thickness: About 50 nm). Here, the Cr film 1002 is a layer formed as a buffer layer so that the Au film 1003 is firmly attached to the SiO 2 substrate 1001. The Au film 1003 is the same as the material of the near-field light emitting part of the thermally-assisted magnetic head, and is a highly stable (non-oxidizing) material that has a high near-field light emitting capability for light in the infrared region. is there.

  Opening patterns 1004 having various shapes are manufactured by electronic drawing on the deposited sample. The shape of the pattern was designed with reference to information published by each heat-assisted magnetic head manufacturer, optimized by optical simulation, and a pattern with an opening of 50 to 200 nm was produced. FIG. 2 shows the shape of each pattern. (A) is a circular shape, (b) is a C shape, (c) is a V shape, and (d) is an H shape.

  Next, the configuration of the illumination system 402 and the laser light source 301 for the luminescent sample 100 according to this embodiment will be described with reference to FIG.

  The laser light source 301 has a wavelength in the near infrared region of a wavelength of 790 nm, and the power is variable from 0 to 40W. The wavelength 790 nm of the laser light source 301 is sufficiently larger than the dimension 50 to 200 nm of the opening pattern 104 formed in the light emitting sample 100. Therefore, when this laser is emitted from the opening pattern 104, the laser light source 301 is close to the very vicinity of the opening pattern 104. Field light is generated.

  The illumination system 402 includes a collimator lens 303, a cross stage 304, a condenser lens 305, a beam splitter 306, a collimator lens 303, and a pipe 307 that fixes the condenser lens 305. The laser light source 301 and the illumination system 402 are connected by a polarization maintaining fiber 302.

  With such a configuration, the linearly polarized light emitted from the laser light source 301 is propagated to the collimator lens 303 of the illumination system 402 through the polarization maintaining fiber 302 and is made quasi-parallel light by the collimator lens 303. The quasi-parallel laser is condensed by the condenser lens 305 and enters the beam splitter 306. The laser beam condensed and incident on the beam splitter 306 reflects the S-polarized component, becomes excitation light 308, exits from the upper surface of the beam splitter 306, and enters the emission sample 100 above the beam splitter 306. The excitation light 308 incident on the luminescent sample 100 from the SiO 2 substrate 101 passes through the SiO 2 substrate 101 and reaches the light emitting surface formed by the Au film 103 on the surface.

  Here, the focal position of the condenser lens 305 is adjusted so that the focal position of the condenser lens 305 coincides with the position of the Au film 103 on the surface of the light emitting sample 100. As a result, near-field light is generated from the Au film 103 by the excitation light 308 condensed and incident on the focal point. Further, by rotating the pipe 307 that fixes the collimator lens 303 and the condenser lens 305, the amount of S-polarized light that is reflected by the beam splitter 306 and becomes the excitation light 308 can be adjusted (generally, the light emission sample). Using a power meter, the pipe 307 is rotated and adjusted so that the amount of S-polarized light emitted from the upper surface of the beam splitter 306 is maximized). The pipe 307 is fixed to the cross motion stage 304, and the position of the cross motion stage 304 is adjusted by adjusting screws 3041 and 3042, so that the light enters the luminescent sample 100 and reaches the opening pattern 104 formed in the Au film 103. The position of the light to be adjusted can be adjusted on the light emitting surface (XY plane).

  FIG. 4 is a basic configuration diagram of a first embodiment of a thermally-assisted magnetic head element inspection apparatus equipped with a luminescent sample according to the present invention.

  The heat-assisted magnetic head element inspection apparatus 1000 according to this embodiment is based on a scanning probe microscope. The heat-assisted magnetic head element inspection apparatus 1000 includes an inspection stage 101, an X stage 106, a Y stage 105, a Z stage 104, and a Y stage mounted on the inspection stage 101. , A vibration unit 122 that vibrates the cantilever 1, a piezoelectric driver 107 that drives the X stage 106, the Y stage 105, the Z stage 104, and the vibration unit 122 with a piezoelectric element (not shown), and a transmission that sends a high-frequency signal to the piezoelectric driver A camera 103 for imaging the row bar 40 mounted on the cantilever 1 and the mounting unit 114, a semiconductor laser element 109 for irradiating the cantilever 1 with a laser beam, and a laser beam reflected by the cantilever 1 Displacement sensor 110 and displacement sensor 11 A differential amplifier 111 that amplifies the output signal of the signal, a DC converter 112 that A / D converts the output signal of the differential amplifier 111, a feedback controller 113 that receives the output signal of the DC converter 112 and generates a feedback signal, and the tip of the cantilever 1 A photodetector 3 for detecting light reflected and scattered by the probe 11 formed in the portion, an illumination system 402, a laser light source 301, a polarization plane holding fiber 302, and a luminescent sample 100 described with reference to FIG. The unit 401 includes a lock-in amplifier (not shown) and a control unit PC 130 that controls the whole.

The inspection apparatus 1000 for a thermally assisted magnetic head element on which the luminescent sample 100 according to this embodiment is mounted is based on a scanning probe microscope. When the cantilever 1 of the measurement key component is replaced, the inspection apparatus 1000 for the heat-assisted magnetic head element on which the luminescent sample 100 is mounted measures and corrects variation in measurement sensitivity due to individual differences of the cantilever 1, and heat-assisted magnetism. In the manufacturing process of the head element, the row bar 40 (block in which the head sliders are arranged) in the process before cutting the slider unit (thin film magnetic head chip) by processing a wafer on which a large number of thin film thermally assisted magnetic head elements are formed. In this state, it is possible to measure the intensity distribution of near-field light generated by the thermally-assisted magnetic head element. (Normally, about 40 to 90 head sliders (thin film magnetic head elements) are arranged on the row bar 40 cut out as a long and narrow block of about 3 cm to 10 cm from a wafer on which a large number of thin film magnetic head elements are formed. It has become a configuration.)
Above the Y stage 105, a camera 103 for measuring the amount of positional deviation between the row bar 40 and the luminescent sample 100 is provided. The Z stage 104 is fixed to the column of the inspection stage 101, and moves the cantilever 1 in the Z direction. The X stage 106, the Y stage 105, and the Z stage 104 of the inspection stage 101 are each composed of a piezo stage that is driven by a piezo element (not shown).

  When the predetermined positioning of the row bar 40 or the luminescent sample 100 is completed, a light emission and excitation command signal output from the control unit PC 130 is supplied to the row bar 40, and the row bar 40 heats the magnetic head element to the mounting unit 114. In a state where heat assist light (near-field light) and a magnetic field can be generated from the light emitting unit and the writing magnetic field generation unit, they are sucked and held by a suction unit (not shown) provided on the Y stage 105. In addition, a light emission command signal output from the control unit PC 130 is supplied to the laser light source 301 with respect to the light emission sample 100, laser light is generated from the laser light source 301, and the light emission sample 100 is transmitted through the polarization maintaining optical fiber 302 and the illumination system 402. Irradiated, the luminescent sample 100 is adsorbed and held on the luminescent sample mounting unit 401 by an adsorbing means (not shown) in a state in which near-field light can be generated from the heat-assisted light emitting unit and the writing magnetic field generating unit of the magnetic head element.

  The piezo driver 107 drives and controls piezo elements (not shown) that drive the X stage 106, Y stage 105, and Z stage 104 of the inspection stage 101, respectively. The control unit PC 130 includes a control computer and a lock-in amplifier, which are basically composed of a personal computer (PC) including a monitor. As shown in the figure, the near-field light and the row bar 40 placed on the Y stage 105 of the inspection stage 101 and the light emitting sample 100 placed on the light emitting sample placing unit 401 are opposed to each other. A cantilever 1 that can measure both the magnetic field and the magnetic field is arranged. The cantilever 1 has a probe 11 formed in the vicinity of the tip thereof, and is attached to a vibration unit 122 provided on the lower side of the Z stage 104. The excitation unit 122 is composed of a piezo element, and an alternating voltage having a frequency near the mechanical resonance frequency is applied by the excitation voltage from the piezo driver 107, and the probe 11 at the tip of the cantilever 1 is moved in the vertical direction (Z direction). Vibrated.

  The vibration in the Z direction of the probe 11 of the cantilever 1 is detected by a displacement detection unit including a semiconductor laser element 109 and a displacement sensor 110 composed of a four-split optical detector element. In this displacement detector, the laser emitted from the semiconductor laser element 109 is irradiated on the surface of the cantilever 1 opposite to the surface on which the probe 11 is formed, and the laser reflected by the cantilever 1 enters the displacement sensor 110. .

  The displacement sensor 110 is a four-divided sensor in which the light receiving surface is divided into four regions, and the laser incident on each of the divided light receiving surfaces of the displacement sensor 110 is photoelectrically converted and output as four electric signals. . Here, in the displacement sensor 110, when the laser is irradiated from the semiconductor laser element 109 in a state where the cantilever 1 is not vibrated by the vibration unit 122, that is, in a stationary state, the reflected light from the cantilever 1 is 4 It is installed at a position where it is equally incident on each of the light receiving surfaces divided into two.

  The differential amplifier 111 performs predetermined arithmetic processing on the difference signal of the four electrical signals output from the displacement sensor 110 and outputs the result to the DC converter 112. That is, the differential amplifier 111 outputs a displacement signal corresponding to the difference between the four electrical signals output from the displacement sensor 110 to the DC converter 112. Therefore, in a state where the cantilever 1 is not vibrated by the vibration unit 122, the output from the differential amplifier 111 becomes zero. The DC converter 112 is configured by an RMS-DC converter (Root Mean Squared to Direct Current converter) that converts a displacement signal output from the differential amplifier 111 into an effective DC signal.

  The displacement signal output from the differential amplifier 111 is a signal corresponding to the displacement of the cantilever 1 and is an AC signal because the cantilever 1 vibrates. A signal output from the DC converter 112 is output to the feedback controller 113. The feedback controller 113 outputs a signal output from the DC converter 112 to the control unit PC 130 as a signal for monitoring the current magnitude of the cantilever 1 and adjusts the magnitude of the excitation of the cantilever 1. A signal output from the DC converter 112 is output to the piezo driver 107 through the control unit PC 130 as a control signal for the Z stage 104. This signal is monitored by the control unit PC 130, and the piezo driver 107 controls a piezo element (not shown) that drives the Z stage 104 according to the value, so that the initial position of the cantilever 1 is determined before the measurement is started. I try to adjust it.

  When performing measurement in a magnetic force microscope (MFM) mode for measuring a write magnetic field, first, the cantilever 1 is moved from the surface of the magnetic head element portion formed on the row bar 40 to a head flying height Hf (probe). The Z stage 104 is positioned so that the tip of the probe 11 on which the magnetic film and the noble metal film of the cantilever 1 are formed at a height corresponding to the distance between the lowest vibration position and the sample surface. The head flying height Hf corresponds to the height of the magnetic head flying above the surface of the magnetic disk when the magnetic head is placed on a magnetic disk (not shown) that rotates at high speed. The cantilever 1 is scanned by a vibration plane 122 driven by a vibration unit 122 within a range of several μm to several tens of μm in a plane parallel to the surface of the row bar 40 where the write magnetic field is generated.

  When measuring near-field light generated by a thermally assisted magnetic head and a luminescent sample in a scanning near-field optical microscope (SNOM) mode for measuring near-field light, the scanning height of the cantilever 1 is measured. Set in the range of 0 to 150 nm. Further, an oscillation signal for exciting the cantilever 1 is supplied from the transmitter 102 to the piezo driver 107 in order to control the vibration state of the cantilever. The piezo driver 107 drives the excitation unit 122 based on the oscillation signal from the transmitter 102 to vibrate the cantilever 1 at a predetermined frequency. Depending on the measurement purpose, the excitation unit 122 causes the cantilever 1 to vibrate at the predetermined frequency. The vibration amplitude can be changed.

  In addition, an optical signal detected by the photodetector 3 including a photomultiplier tube (PMT) or a photodiode (Photodiode: PD) is a lock-in amplifier (not shown) in the control unit PC130. The probe 11 of the cantilever 1 is located in the vicinity of the surface of the sample 40 by a lock-in amplifier in which the detection light signal is input as a predetermined frequency signal of the cantilever 1 or an integer multiple of the predetermined frequency as a reference signal. The period of the cantilever 1 of the scattered light component of the near-field light caused by the contact between the probe 11 and the near-field light by vibrating up and down, and other propagating light components in the vicinity of the near-field light reflected from the side surface of the probe 11. The light component related to vibration can be detected.

The measurement of near-field light generated by the luminescent sample according to Example 1 of the present invention will be described with reference to FIG.
In the luminescent sample 100, an opening 1004 for generating near-field light is formed in the Au film 1003 on the surface, and when the excitation light 308 is irradiated onto the opening 1004 from the SiO 2 substrate 1001 side of the luminescent sample 100. The near-field light 502 is generated in the vicinity of the opening 1004 on the surface of the Au film 1003. The distance between the probe 11 of the cantilever 1 and the light emitting surface of the opening 1004 formed in the Au film 1003 of the light emitting sample 100 is set to 10 nm or less (or as in the atomic force microscope (AFM) mode). By scanning along the sample surface), the tip portion 12 of the probe 11 enters the light emitting region of the near-field light 502 and comes into contact with the near-field light 502, whereby the surface of the tip portion 12 of the probe 11 Scattered light 503 is generated. The photodetector 3 detects the scattered light 503 generated from the surface of the tip portion 12 of the probe 11 and outputs a detection signal to the control unit PC130.

  On the other hand, since the cantilever 1 which is a key component of measurement is a consumable item, it must be periodically replaced. When the cantilever 1 is replaced, measurement variations due to individual differences in the cantilever 1 occur. FIG. 6 shows, as an example of measurement variation due to the diameter of the tip portion 12 of the probe 11 of the cantilever 1, when the diameter of the tip portion 12 of the probe 11 is large (a), the diameter of the tip portion 12 of the probe 11 is large. The small case is shown in (b). Further, (c) shows the relationship between the variation in the diameter of the tip portion 12 of the probe 11 and the detected light amount (peak value of the detection signal).

  From the graph shown in (c), it can be seen that when the diameter of the tip portion 12 of the probe 11 changes, a difference occurs in the amount of light detected. That is, even if the near-field light emission intensity on the surface of the luminescent sample 100 is the same, the difference in the intensity of the scattered light detected by the detector 3 occurs due to the difference in the diameter of the tip portion 12 of the probe 11. It will end up. Therefore, in order to suppress variation in measurement due to individual differences in the cantilever 1 generated by exchanging the cantilever 1, a difference is detected in advance in the intensity of scattered light due to a change in the diameter of the tip portion 12 of the probe 11. It is necessary to correct this.

  The tip portion 12 of the probe 11 is made by forming a magnetic film and a very thin film of Au on the surface of the carbon nanofiber, and the diameter is about 70 nm to about 20 nm. In this embodiment, a cantilever 1 having a tip portion 12 of a probe 11 having a diameter of 70 nm is selected in advance by SEM observation, and the selected cantilever 1 is used as a standard sample. Then, measurement is performed on the luminescent sample 100 in which the emission of near-field light is constant using this standard sample, and scattered light from the tip portion 12 of the probe 11 is detected when a standard probe is used. The detection value detected by the device 3 was confirmed and recorded as a reference value.

  Next, when the cantilever 1 is replaced, the replaced cantilever 1 scans the region where the near-field light is generated on the luminescent sample 100, and the scattered light from the tip portion 12 of the probe 11 is detected by the detector 3. And compare with the detected value (reference value) when measured using the previously stored standard sample. As a result of this comparison, if it is different from the reference value, the gain (for example, bias voltage) of the photodetector 3 is adjusted so as to be the same as the reference value, and the near-field light on the luminescent sample 100 is adjusted. The detection signal level when the scattered light from the tip portion 12 of the probe 11 when the generated region is scanned is detected by the detector 3 is matched.

  In this way, the X stage is used in the state where the gain of the detector 3 is adjusted to the same output level as in the case of using the luminescent sample 100 for the replaced cantilever 1 and using the reference cantilever 1. 106 is driven to move the row bar 40 placed on the placement unit 114 under the replaced cantilever 1, and the heat-assisted light emitting unit of each element formed on the row bar 40 using the replaced cantilever 1. And inspect the writing magnetic field generator.

FIG. 7 shows an inspection flow in this embodiment.
First, the cantilever 1 in which the diameter of the tip portion 12 of the probe 11 is a reference having a predetermined value is selected (S101), the reference cantilever 1 is attached to the vibration unit 122 (S102), and the X stage 106 is moved. The opening 1004 formed in the luminescent sample 100 by driving is positioned immediately below the probe 11 of the cantilever 1 (S103). Next, in a state where near-field light is generated in the vicinity of the opening 1004 of the luminescent sample 100 by emitting a laser from the laser light source 301, the Y stage 105 is vibrated while vibrating the cantilever 1 serving as a reference by the vibration unit 122. Is driven to scan the near-field light generation region in the vicinity of the opening 1004 of the luminescent sample 100, and the scattered light generated from the tip portion 12 of the probe 11 is detected by the photodetector 3 (S104). . This detected value is stored in the control unit PC 130 as a reference value (S105).

  Next, the case where the cantilever 1 is replaced will be described. First, the cantilever 1 to be replaced is attached to the vibration unit 122 (S106), and the X stage 106 is driven to position the opening 1004 formed in the luminescent sample 100 directly below the probe 11 of the cantilever 1 (S107). Next, in a state where near-field light is generated in the vicinity of the opening 1004 of the luminescent sample 100 by emitting a laser from the laser light source 301, the Y stage 105 is vibrated while vibrating the cantilever 1 serving as a reference by the vibration unit 122. Is driven to scan the near-field light generation region in the vicinity of the opening 1004 of the luminescent sample 100, and the scattered light generated from the tip portion 12 of the probe 11 is detected by the photodetector 3 (S108). . The gain of the photodetector 3 is adjusted so that the detected value becomes the same value as the value measured using the reference cantilever 1 stored in S105 (S109).

  Next, in a state where the gain of the photodetector 3 is adjusted, the X stage 106 is driven and moved from below the cantilever 1 where the luminescent sample 100 is exchanged, and instead the position is below the cantilever 1 where the row bar 40 is exchanged. The element formed on the row bar 40 is inspected (S110). The inspection of the row bar 40 is performed by the methods described in Patent Documents 1 and 3.

  According to the present embodiment, when the cantilever 1 is replaced, first, the near-field light is measured using the luminescent sample 100, and the detection value of the photodetector 3 is previously measured and stored using the standard sample. The gain of the photodetector 3 is adjusted to be the same as the reference value, and each element formed in the row bar 40 is inspected using the photodetector 3 whose gain is adjusted according to the replaced cantilever. Therefore, variation in measurement sensitivity due to variation in characteristics of the replaced cantilever 1 can be reduced. As a result, it has become possible to accurately inspect the dimensional variation of the near-field light emitting region.

A second embodiment of the present invention will be described with reference to the drawings.
The heat-assisted magnetic head inspection apparatus equipped with the luminescent sample used in the measurement method according to Example 2 of the present invention is basically the same as the heat-assisted magnetic head element inspection apparatus equipped with the luminescent sample described in Example 1. It has a structure. The description of duplication here is omitted.

  The second embodiment is different from the first embodiment in that the diameter of the probe is reversely estimated from the output value of the photodetector 3 when the cantilever is replaced in the second embodiment.

  In this embodiment, the diameter of the tip portion 12 of the probe 11 is measured with a SEM for a plurality of cantilevers 1, and the light when the near-field light generated in the luminescent sample 100 is measured using the cantilever 1. The output of the detector 3 is recorded, and a calibration curve showing the relationship between the diameter of the tip portion 12 of the probe 11 and the output of the photodetector 3 as shown in FIG. Next, when the cantilever is replaced, the near-field light generated in the luminescent sample 100 is measured by using the replaced cantilever 1 to obtain the output of the photodetector 3, and the calibration curve prepared previously The diameter of the tip portion 12 of the probe 11 corresponding to the output of the photodetector 3 measured from is obtained.

  By using the obtained information on the diameter of the tip portion 12 of the probe 11, when the element of the row bar 40 is inspected with the replaced cantilever 1, the dimension of the near-field light emitting region of the element can be obtained.

FIG. 9 shows an inspection flow in this embodiment.
First, with respect to a plurality of cantilevers 1, the diameter of the tip portion 12 of the probe 11 is measured using an SEM (S201), and one of these cantilevers 1 is attached to the excitation unit 122 (S202), and the X stage 106 And the opening 1004 formed in the luminescent sample 100 is positioned directly below the probe 11 of the cantilever 1 (S203). Next, in a state where near-field light is generated in the vicinity of the opening 1004 of the luminescent sample 100 by emitting a laser from the laser light source 301, the Y stage 105 is vibrated while vibrating the cantilever 1 serving as a reference by the vibration unit 122. Is driven to scan the near-field light generation region in the vicinity of the opening 1004 of the luminescent sample 100, and the scattered light generated from the tip portion 12 of the probe 11 is detected by the photodetector 3 (S204). . The detected value is stored in the control unit PC 130 (S205).

  Next, S202 to S205 are executed at least twice by exchanging with another cantilever 1 in which the diameter of the tip portion 12 is measured using the SEM. After executing S202 to S205 at least three times in this way, the relationship between the diameter of the tip 12 of the probe 11 and the detection value of the photodetector 3 as shown in the graph of FIG. 8 is used as basic data for calibration. Create (S206).

  Next, the case where the cantilever 1 is replaced will be described. First, the cantilever 1 to be exchanged is attached to the vibration unit 122 (S207), and the X stage 106 is driven to position the opening 1004 formed in the luminescent sample 100 directly below the probe 11 of the cantilever 1 (S208). Next, the Y stage 105 is driven while the cantilever 1 is vibrated by the vibration unit 122 in a state in which near-field light is generated in the vicinity of the opening 1004 of the luminescent sample 100 by emitting a laser from the laser light source 301. Then, the probe 11 is scanned in the near-field light generation region near the opening 1004 of the luminescent sample 100, and the scattered light generated from the tip portion 12 of the probe 11 is detected by the photodetector 3 (S209). The detected diameter of the tip portion 12 of the probe 11 of the cantilever 1 is obtained from the relationship between the diameter of the tip portion 12 of the probe 11 obtained in S206 and the detection value of the photodetector 3 (S210).

  Next, the X stage 106 is driven to move the luminescent sample 100 from below the exchanged cantilever 1, and instead, the element formed on the row bar 40 is inspected by placing the row bar 40 below the exchanged cantilever 1. (S211). At this time, the size of the near-field light emission region of the element formed on the row bar 40 is the diameter of the tip portion 12 of the probe 11 obtained in S210 from the near-field light emission region size obtained from the output signal of the photodetector 3. The actual size of the near-field light emitting region can be obtained by subtracting. In addition, about the test | inspection of the rover 40, it performs by the method described in patent document 1 and 3. FIG.

  Thus, if the diameter of the tip portion 12 of the probe 11 can be estimated, when measuring the width of the near-field light, the width of the actual light spot is determined from the difference between the measurement width and the diameter of the tip portion 12 of the probe 11. And the measurement variation in the near-field light width caused by the variation in the probe diameter can be suppressed.

A third embodiment of the present invention will be described.
The heat-assisted magnetic head inspection apparatus equipped with the luminescent sample using the measurement method according to the third embodiment has basically the same structure as the heat-assisted magnetic head element inspection apparatus equipped with the luminescent sample described in the first embodiment. Since it has, description of duplication is abbreviate | omitted.

  In Example 3, it will be described that the measurement algorithm of the apparatus is determined by performing measurement on a luminescent sample whose design information is known.

  In the invention of Example 3, the luminescent sample was designed and manufactured with a structure similar to the near-field light emitting part of the thermally-assisted magnetic head. Since the shape information of the light emitting part (opening) of the luminescent sample is known, the measurement algorithm for the measurement result of various heat-assisted magnetic heads can be easily determined using the measurement result for the luminescent sample.

  FIG. 10 shows an example in which the shape of the opening 1004 formed in the luminescent sample 100 is circular. The luminescent sample 100 was designed and manufactured in the same shape as the near-field light generating opening of the thermally-assisted magnetic head (circular about 100 nm). The dimensions of the opening for generating near-field light in the actual sample were measured by SEM.

  As a result, as shown in (a), the opening width is 90.6 nm. FIG. 10B shows an image obtained by measuring the sample using the cantilever 1, and FIG. 10C shows a signal profile in the AA section of the image shown in FIG. 10B. A reference for a width that matches the size of the near-field light emission opening 1004 of the actual light emission sample 100 is searched from the signal profile of the measurement result. As a result, it was found that 30% of the measurement profile peak was 90 nm. Therefore, when the element formed on the row bar 40 is inspected using the cantilever 1, it is considered that the width measurement standard should be set at 30% from the peak of the measurement profile.

  When the cantilever 1 is consumed and replaced with another cantilever 1, the opening 1004 formed in the luminescent sample 100 is similarly measured, and the obtained measurement profile matches the size of the near-field light emitting opening of the luminescent sample. Find the width standard and use it as the measurement standard when inspecting with this replaced cantilever.

  With respect to the other shape openings, the measurement algorithm, that is, the width measurement standard can be set by measuring the luminescent sample in advance by the same method as described above.

  Thus, in the present invention, the light-emitting sample is designed and manufactured with a structure similar to the near-field light-emitting portion of the thermally-assisted magnetic head. Since the shape information of the light emitting unit is known, it becomes easy to determine the measurement algorithm for the measurement results of various heat-assisted magnetic heads using the measurement results of the light emitting sample.

  In the above embodiment, the magnetic head element is inspected in the state of the row bar. However, the present invention is not limited to this. For example, a slider in which the magnetic head elements are cut out from the row bar one by one. Even in this state, it can be measured by the heat-assisted magnetic head element inspection apparatus described in the first embodiment, the second embodiment, or the third embodiment.

  In the above embodiment, the light emitting sample formed on the glass substrate has been described. However, the present invention is not limited to this. For example, the heat assist capable of performing stable light emission that can be confirmed in advance. Even if the magnetic head element is used as a substitute for the luminescent sample, it can be measured by the heat-assisted magnetic head element inspection apparatus equipped with the luminescent sample described in the first, second, or third embodiment.

  As mentioned above, although the invention made by the present inventor has been specifically described based on the embodiments, it is needless to say that the present invention is not limited to the above embodiments and can be variously modified without departing from the gist thereof. Yes.

DESCRIPTION OF SYMBOLS 1 ... Cantilever 11 ... Cantilever tip probe 3 ... Photodetector
40 ... Rover 101 ... Measurement stage 102 ... Transmitter 103 ... Camera 104 ... Z stage 105 ... Y stage 106 ... X stage 107 ... Piezo driver 109 ... Semiconductor laser device 100 ... Luminescent sample 110 ... Displacement sensor 111 ... Differential amplifier 112 ... DC converter 113 ... Feedback controller 114 ... Mounting part 122 ... Excitation part 130- ..Control unit PC 301 ... Laser light source 302 ... Polarization maintaining fiber 303 ... Collimator lens 304 ... Cross motion stage 305 ... Condensing lens 306 ... Polarizing beam splitter 307 ... Lens fixing pipe 401... Luminescence sample placement section 402... Illumination system 1004. Opening.

Claims (12)

A cantilever that scans the surface of the thermally-assisted magnetic head element in a state in which near-field light is generated from the near-field light emitting part of the thermally-assisted magnetic head element;
A displacement detection system for irradiating the cantilever with light and detecting reflected light from the cantilever;
A photodetector for detecting scattered light from the cantilever that scans the surface of the thermally-assisted magnetic head element;
A heat-assisted magnetic head element inspection apparatus comprising: a signal processing unit that receives an output signal from the displacement detection unit and an output signal from the photodetector; and a control unit that controls the whole,
Furthermore, a mounting unit for mounting a near-field light generating sample that generates near-field light that is substantially the same as the near-field light generated from the near-field light emitting unit of the thermally-assisted magnetic head element;
A laser light source for emitting a laser;
A laser irradiation optical system that irradiates the near-field light generation sample placed on the mounting portion with a laser emitted from the laser light source and generates the near-field light from the near-field light generation sample;
A table on which the mounting section for mounting the near-field light generating sample and the laser irradiation optical system are mounted to move the near-field light generating sample between a position directly below the cantilever and a location away from the cantilever. And a thermally assisted magnetic head element inspection apparatus.   2. The inspection apparatus for a heat-assisted magnetic head element according to claim 1, wherein the control unit is emitted from the laser light source onto the near-field light generating sample placed on the placement unit in the laser irradiation optical system. An apparatus for inspecting a thermally assisted magnetic head element, wherein the gain of the photodetector is adjusted based on a signal detected by the photodetector by operating the cantilever in a state where the laser is irradiated.   3. The thermal assist magnetic head element inspection apparatus according to claim 2, wherein the control unit receives an output of the photodetector having the gain adjusted and receives an output region of the near-field light of the thermal assist magnetic head element. An inspection apparatus for a thermally assisted magnetic head element, characterized by managing variations in length.   2. The inspection apparatus for a heat-assisted magnetic head element according to claim 1, wherein the control unit is emitted from the laser light source onto the near-field light generating sample placed on the placement unit in the laser irradiation optical system. The diameter of the cantilever probe obtained in advance from the signal detected by the photodetector by operating the cantilever while irradiating the laser and generating near-field light from the near-field light emitting unit. An inspection apparatus for a heat-assisted magnetic head element, wherein the diameter of the probe of the cantilever is calculated based on a relationship with the output of the photodetector.   5. The inspection apparatus for a thermally assisted magnetic head element according to claim 4, wherein the control unit generates near-field light from a near-field light emitting unit of the thermally-assisted magnetic head element. A dimension related to the light emission region of the near-field light is detected from a signal detected by the photodetector when the surface of the cantilever is scanned with the cantilever, and the dimension related to the detected light emission region of the near-field light is An inspection apparatus for a heat-assisted magnetic head element, wherein a value obtained by subtracting the calculated value of the diameter of the probe of the cantilever is used as the length of the light emitting region of the near-field light.   2. The inspection apparatus for a heat-assisted magnetic head element according to claim 1, wherein the control unit uses the dimensional information of the near-field light emitting unit formed on the near-field light generating sample, and uses the laser irradiation optical system. And irradiating the near-field light generating sample placed on the placement part with a laser emitted from the laser light source to generate near-field light from the near-field light emitting part and operating the cantilever. The measurement standard for determining the diameter of the probe of the cantilever from the waveform of the signal detected by the photodetector is set, and near-field light is emitted from the near-field light emitting unit of the thermally-assisted magnetic head based on the set reference. The length of the light emitting region of the near-field light is obtained from a signal detected by the photodetector when the surface of the heat-assisted magnetic head element is scanned with the cantilever in the generated state. Inspection device of the thermally assisted magnetic head element that. Scanning the surface of the thermally-assisted magnetic head element with a cantilever in the state in which near-field light is generated from the near-field light emitting part of the thermally-assisted magnetic head element,
Irradiating the cantilever scanning the surface of the thermally-assisted magnetic head element with light to detect reflected light from the cantilever;
Detecting scattered light from the cantilever that scans the surface of the thermally-assisted magnetic head element with a photodetector,
A method for inspecting a thermally assisted magnetic head element that receives a signal detected from reflected light from the cantilever and an output signal from the photodetector and processes the signal to inspect the thermally assisted magnetic head element,
The near-field light is irradiated by irradiating a laser emitted from a laser light source to a near-field light generating sample that generates near-field light substantially the same as the near-field light generated from the near-field light emitting unit of the thermally-assisted magnetic head element in advance. A signal obtained by scanning the surface of the near-field light generating sample with the cantilever while the near-field light is generated from the generated sample and detecting the scattered light from the probe of the cantilever with the photodetector. A method for inspecting a heat-assisted magnetic head element, wherein the heat-assisted magnetic head element is inspected using information.   8. The inspection method for a thermally assisted magnetic head element according to claim 7, wherein the surface of the near-field light generating sample is scanned with the cantilever, and scattered light from the probe of the cantilever is detected with the photodetector. Using the obtained signal information, the gain of the photodetector is adjusted so that the level of the signal from which the scattered light is detected becomes a preset level, and the thermal detector is used to adjust the gain. A method for inspecting a thermally-assisted magnetic head element, comprising: inspecting an assist magnetic head element.   9. The method for inspecting a thermally assisted magnetic head element according to claim 8, wherein a variation in length of a light emitting region of the near field light of the thermally assisted magnetic head element is received by receiving an output of a photodetector having the gain adjusted. A method for inspecting a thermally-assisted magnetic head element, characterized by comprising:   8. The inspection method for a heat-assisted magnetic head element according to claim 7, wherein the laser emitted from the laser light source is irradiated onto the near-field light generating sample placed on the placement unit by the laser irradiation optical system. From the signal detected by the photodetector by operating the cantilever in the state where near-field light is generated from the near-field light emitting unit, the diameter of the probe of the cantilever previously obtained and the light detector A method for inspecting a thermally-assisted magnetic head element, wherein the diameter of the probe of the cantilever is calculated based on a relationship with an output.   11. The inspection method for a thermally assisted magnetic head element according to claim 10, wherein the surface of the thermally assisted magnetic head element is formed on the surface of the thermally assisted magnetic head element in a state where near field light is generated from a near field light emitting portion of the thermally assisted magnetic head element. The size related to the light emission region of the near-field light is detected from the signal detected by the light detector when scanning with the above, and the size of the cantilever calculated from the size related to the light emission region of the detected near-field light is detected. A method for inspecting a thermally-assisted magnetic head element, characterized in that a value obtained by subtracting a value of a probe diameter is used as a length of the light emitting region of the near-field light.   8. The inspection method for a thermally-assisted magnetic head element according to claim 7, wherein the laser irradiation optical system uses the dimensional information of the near-field light emitting part formed on the near-field light generating sample. The photodetector is operated by operating the cantilever in a state in which the near-field light generation unit is irradiated with the laser emitted from the laser light source and the near-field light emitting unit generates near-field light. A measurement standard for obtaining the diameter of the probe of the cantilever from the waveform of the signal detected in step 1, is set, and near-field light is generated from the near-field light emitting part of the thermally-assisted magnetic head element based on the set reference And determining the length of the light emitting region of the near-field light from the signal detected by the photodetector when the surface of the thermally-assisted magnetic head element is scanned with the cantilever. Inspection method DOO magnetic head element.

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