JP2016176790A - Pressure sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pressure sensor capable of measuring a distribution of a pressure applied to a side surface over one round and having a small insensitive region and a uniform measurement sensitivity in a circumferential direction.SOLUTION: A pressure sensor includes: a wound part; and a pressure sensor sheet doubly wound around a side surface of the wound part. The pressure sensor sheet includes: a sensor part corresponding to a portion overlapping a pressure sensitive body when unwound; and a wiring part adjacent to the sensor part in a winding direction. The sensor part includes: a plurality of first wires extending in a first direction; and a plurality of second wires extending in a second direction orthogonal to the first direction. The wiring part supports the first wires drawn from the sensor part. An angular range of the sensor part in the winding direction and an angular range of the wiring part in the winding direction each correspond to one round of the side surface of the wound part.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a pressure sensor that generates a detection signal according to an applied pressure.

  In various fields such as a display device and a sensor device, a transistor circuit having a transistor including a semiconductor layer is widely used. For example, the transistor circuit is used as a drive circuit for individually driving a plurality of light emitting elements of the organic EL display device or as a sensor circuit for detecting sensor signals at a plurality of positions of the pressure sensor device. The transistor circuit is generally provided in the form of a transistor array including a base material, a plurality of transistors formed on the base material, and wiring connected to the transistors. In the following description, a transistor array including a plurality of transistors formed on a substrate is also referred to as a transistor sheet.

  Conventionally, inorganic semiconductor materials such as silicon, gallium arsenide, and indium gallium arsenide have been used as semiconductor materials for transistors. On the other hand, in recent years, research on transistors using organic semiconductor materials has been actively conducted. Organic semiconductor materials can generally be formed on a substrate at a lower temperature than inorganic semiconductor materials. For this reason, materials, such as flexible plastics, can be utilized as a material which comprises the base material in which the circuit using the organic-semiconductor material and the wiring connected to a circuit were formed. This makes it possible to provide a lightweight transistor sheet that is stable against mechanical shock. In addition, since organic semiconductor materials can be formed on a substrate using a coating process such as a printing method, a larger number of organic transistors can be formed on a substrate more efficiently than when inorganic semiconductor materials are used. It becomes possible to do. For this reason, there is a possibility that the manufacturing cost of the transistor sheet can be reduced. Therefore, a transistor sheet having a transistor containing an organic semiconductor material is used in the field of display devices such as organic EL and electronic paper, and in the field of sensor devices that detect pressure, magnetic field, temperature, light, and the like. Is expected.

  For example, in Patent Document 1, in order to safely and easily carry a large-area pressure sensor device, a pressure sensor sheet formed using a flexible sheet and protection for accommodating the pressure sensor sheet in a wound state A cylinder and a combined device have been proposed.

JP 2014-124508 A

  By the way, if there is a pressure sensor capable of measuring the pressure distribution applied to the side surface of a cylindrical member such as a grip portion of a golf club or a printing roll, it is extremely useful. However, such a pressure sensor is not known.

  The present inventor initially thought that the pressure distribution on the side surface can be measured over one round by simply wrapping the pressure sensor sheet formed using the flexible sheet around the side surface of the cylindrical shape.

  However, in fact, the pressure sensor sheet has not only a sensor unit for measuring pressure, but also a wiring unit that supports wiring drawn from the sensor unit. For this reason, when the pressure sensor sheet is wound around the side surface of the cylindrical one so as to make one round, there is a problem that an insensitive area is generated in the area of the wiring portion.

  In order to reduce the insensitive area due to the wiring part, it is conceivable to wrap the pressure sensor sheet so that a part of the sensor part overlaps the wiring part. Due to the influence of the thickness of the sheet of the portion, there is a problem that the measurement sensitivity is greatly changed between the portion overlapping with the wiring portion and the portion not overlapping with the wiring portion, resulting in uneven measurement sensitivity in the circumferential direction.

  The present invention has been made in consideration of the above points. An object of the present invention is to provide a pressure sensor that can measure the pressure distribution applied to the side surface over one round, and has a small dead area and uniform measurement sensitivity in the circumferential direction.

The pressure sensor according to the present invention comprises:
A pressure sensor that generates a detection signal according to an applied pressure,
A wound part;
A pressure sensor sheet wound twice on the side surface of the wound portion;
With
The pressure sensor sheet has a sensor portion corresponding to a portion that overlaps the pressure sensitive body at the time of deployment, and a wiring portion adjacent to the sensor portion in the winding direction,
The sensor unit includes a plurality of first wires extending in a first direction and a plurality of second wires extending in a second direction intersecting the first direction.
The wiring portion supports the first wiring drawn from the sensor portion,
The angle range in the winding direction of the sensor part and the angle range in the winding direction of the wiring part respectively correspond to one round of the side surface of the wound part.

  In the pressure sensor according to the present invention, both the first wiring and the second wiring may be taken out from a side edge along a winding direction of the pressure sensor sheet.

  In the pressure sensor according to the present invention, the sensor section may be provided with a plurality of transistors corresponding to the intersections of the first wiring and the second wiring.

  In the pressure sensor according to the present invention, in the sensor unit, the first wiring may extend along a winding direction.

  In the pressure sensor according to the present invention, in the wiring portion, the first wiring may be curved or bent so as to go to a side edge along a winding direction of the pressure sensor sheet.

The pressure sensor sheet according to the present invention is:
A pressure sensor sheet that is wound twice around the side of the wound part,
A sensor unit corresponding to a portion that overlaps the pressure-sensitive body during deployment;
A wiring portion adjacent to the sensor portion in the winding direction;
Have
The sensor unit includes a plurality of first wires extending in a first direction and a plurality of second wires extending in a second direction intersecting the first direction.
The wiring portion supports the first wiring drawn from the sensor portion,
The angle range in the winding direction of the sensor part and the angle range in the winding direction of the wiring part respectively correspond to one round of the side surface of the wound part.

  In the pressure sensor sheet according to the present invention, both the first wiring and the second wiring may be taken out from a side edge along a winding direction of the pressure sensor sheet.

  In the pressure sensor sheet according to the present invention, the sensor section may be provided with a plurality of transistors corresponding to the intersections of the first wiring and the second wiring.

  In the pressure sensor sheet according to the present invention, in the sensor unit, the first wiring may extend along a winding direction.

  In the pressure sensor sheet according to the present invention, in the wiring portion, the first wiring may be curved or bent so as to go to a side edge along a winding direction of the pressure sensor sheet.

  ADVANTAGE OF THE INVENTION According to this invention, it is a pressure sensor which can measure the pressure distribution added to a side surface over 1 round, Comprising: A dead area is small and a pressure sensor with a uniform measurement sensitivity in the circumferential direction can be provided.

FIG. 1 is a perspective view showing a pressure sensor according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the pressure sensor of FIG. FIG. 3 is a plan view showing the pressure sensor sheet developed in a planar shape. 4 is a partial longitudinal sectional view showing an example of a layer structure of the pressure sensor sheet of FIG. FIG. 5 is a drawing corresponding to FIG. 4 and a partial longitudinal sectional view showing a modification of the layer configuration of the pressure sensor sheet. FIG. 6 is a drawing corresponding to FIG. 4 and is a partial longitudinal sectional view showing another modified example of the layer configuration of the pressure sensor sheet. FIG. 7 is a plan view showing a modification of the pressure sensor sheet developed on a plane. FIG. 8 is a cross-sectional view of a pressure sensor using the pressure sensor sheet of FIG. FIG. 9 is a plan view showing an example in which the pressure sensor sheet includes a plurality of transistor sheets.

  Embodiments of the present invention will be described below with reference to the drawings. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual ones.

  Further, in this specification, the terms “substrate” and “film” are not distinguished from each other based only on the difference in designation. For example, the “substrate” is a concept including a member that can be called a sheet or a film. Furthermore, as used in this specification, the shape and geometric conditions and the degree thereof are specified, for example, terms such as “orthogonal”, length and angle values, etc. are not limited to strict meaning and are similar. The interpretation should include the extent to which the functions of can be expected.

  FIG. 1 is a perspective view showing a pressure sensor according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the pressure sensor of FIG.

  As shown in FIGS. 1 and 2, the pressure sensor 10 includes a wound part 11 and a pressure sensor 38 (see FIG. 3) that is double-wrapped around a side surface of the wound part 11. And a sheet 20.

  In the illustrated example, the wound portion 11 has a shape having a side surface that is closed in the circumferential direction, that is, a side surface that makes one round in the circumferential direction, more specifically, a columnar shape, particularly a columnar shape. Specifically, for example, a grip portion of a golf club or a printing roll can be assumed as the wound portion 11. In addition, as long as it has the side surface closed to the circumferential direction, the to-be-wrapped part 11 may have a polygonal column shape such as a quadrangular column. Alternatively, the wound portion 11 may have a cone shape such as a cone or a polygonal cone, or a truncated cone shape.

  The pressure sensor sheet 20 is wound twice around the side surface of the wound portion 11 along the circumferential direction in order to measure the pressure distribution applied to the side surface closed in the circumferential direction of the wound portion 11 over the entire circumference. .

  With reference to FIG.3 and FIG.4, the structure of the pressure sensor sheet | seat 20 is demonstrated in detail. FIG. 3 is a plan view showing the pressure sensor sheet 20 developed in a planar shape. FIG. 4 is a partial longitudinal sectional view showing an example of a layer configuration of the pressure sensor sheet 20 of FIG.

  As shown in FIG. 3, the pressure sensor sheet 20 includes a base material 21 and a plurality of transistors 30 formed on the base material 21. In the present specification, a portion of the base material 21 that overlaps the pressure-sensitive body 38 when deployed is referred to as a sensor portion 20a, and a portion adjacent to the sensor portion 20a in the winding direction DR is referred to as a wiring portion 20b.

  As the base material 21, a flexible substrate having flexibility is used. In the illustrated example, the base material 21 includes a pair of first sides extending along the first direction D1 and a pair of second sides extending along the second direction D2 intersecting the first direction D1. It has a rectangular outer shape. In the illustrated example, the second direction D2 is orthogonal to the first direction D1.

  As shown in FIG. 3, the sensor unit 20a of the base member 21 includes a plurality of first wirings W1 to Wm extending in the first direction D1 and a plurality of second wirings B1 to Bn extending in the second direction D2. Is provided. The plurality of transistors 30 are arranged in a matrix corresponding to the intersections of the first wirings W1 to Wm and the second wirings B1 to Bn.

  In the illustrated example, the first direction D1 is parallel to the winding direction DR, and the first wirings W1 to Wm extend along the winding direction DR. The wiring part 20b of the base material 21 supports the first wirings W1 to Wm drawn from the sensor part 20a.

  In the present embodiment, the first wirings W1 to Wm correspond to word lines provided for transmitting control signals for sequentially turning on the transistors 30. Each of the word lines W1 to Wm is electrically connected to a gate electrode 31 described later of the plurality of transistors 30 arranged along the first direction D1. For example, the word line W1 is positioned on the lowermost side in FIG. 3 and is electrically connected to the gate electrodes 31 of the plurality of transistors 30 arranged along the first direction D1. Therefore, when the transistor 30 is P-type, a voltage is applied to the word line W1 so that the voltage of the gate electrode 31 with respect to the source electrode 33 of the transistor 30 becomes negative, whereby a plurality of transistors connected to the word line W1 are applied. The transistors 30 can be turned on at the same time.

  On the other hand, the second wirings B1 to Bm correspond to bit lines provided to transmit detection signals including information on the electrical resistance and capacitance of the pressure sensitive body 38 described later connected to each transistor 30. Yes. Each of the bit lines B1 to Bn is electrically connected to the source electrodes 33 of the plurality of transistors 30 arranged along the second direction D2. For example, the bit line B1 is positioned on the leftmost side in FIG. 3 and is electrically connected to the source electrodes 33 of the plurality of transistor circuits arranged along the second direction D2. In this case, the detection signal extracted from one transistor 30 which is turned on by the control signals from the word lines W1 to Wm among the plurality of transistors 30 connected to the bit line B1 is transmitted to the bit line B1. Communicated.

  According to the pressure sensor sheet 20 shown in FIG. 3, even when the number of word lines W1 to Wm and bit lines B1 to Bn is smaller than the number of transistors 30, the bit lines B1 to Bn and the word lines W1 to Wm Are arranged in a matrix, a detection signal from an arbitrary transistor 30 can be taken out. For this reason, the number of lines provided on the substrate 21 can be reduced.

  As shown in FIG. 4, the transistor 30 includes a gate electrode 31 provided on the first surface 21 a of the base 21 and a gate insulation provided on the first surface 21 a of the base 21 so as to cover the gate electrode 31. A source electrode 33 and a drain electrode 34 provided on the gate insulating film 32 so as to face the film 32 with a certain space therebetween, and a source electrode 33 and a drain electrode 34 so as to be in contact with the source electrode 33 and the drain electrode 34. And a semiconductor layer 35 provided therebetween. An insulating layer 36 is provided so as to cover the source electrode 33, the drain electrode 34, and the semiconductor layer 35. A connection pad 37 is provided on the insulating layer 36, and the connection pad 37 is connected to the source electrode 33 or the drain electrode 34 via a connection via in a through hole 36 a formed in a part of the insulating layer 36. Electrically connected. In the example shown in FIG. 4, a through hole 36a is formed on the drain electrode 34, and the drain electrode 34 and the connection pad 37 are electrically connected through the through hole 36a. The connection via may be filled in the entire area of the through hole 36a, or may be provided only on the wall surface of the through hole 36a.

  As materials for forming the gate electrode 31, the gate insulating film 32, the source electrode 33, the drain electrode 34, the insulating layer 36 and the connection pad 37, known materials used in transistors are used. For example, the materials disclosed in JP 2010-79196 A can be used.

  As a material constituting the semiconductor layer 35, either an inorganic semiconductor material or an organic semiconductor material may be used, but an organic semiconductor material is preferably used. As the organic semiconductor material, a low molecular organic semiconductor material such as pentacene or a high molecular organic semiconductor material such as polypyrrole can be used. More specifically, a low molecular organic semiconductor material or a high molecular organic semiconductor material disclosed in JP2013-21190A can be used. Here, the “low molecular organic semiconductor material” means, for example, an organic semiconductor material having a molecular weight of less than 10,000. The “polymeric organic semiconductor material” means, for example, an organic semiconductor material having a molecular weight of 10,000 or more.

  As shown in FIG. 4, a pressure sensitive body 38 is provided on the connection pad 37. The pressure-sensitive body 38 is configured such that the electric resistance value of the pressure-sensitive body 38 in the direction in which the pressure is applied, here in the thickness direction, changes according to the pressure applied to the pressure-sensitive body 38. That is, in the present embodiment, the pressure sensitive body 38 is configured as a so-called pressure sensitive conductor. The pressure-sensitive conductor includes, for example, rubber such as silicone rubber and a plurality of conductive particles such as carbon added to the rubber.

  As shown in FIG. 4, a common electrode 39 is provided on the pressure sensitive body 38. As long as the common electrode 39 has conductivity and can contact the pressure-sensitive body 38, the material constituting the common electrode 39 is not particularly limited. On the common electrode 39, an insulating overcoat layer 46 including polyethylene terephthalate or the like may be provided.

  In the example shown in FIG. 4, when pressure is applied to the pressure sensor sheet 20 from the side of the overcoat layer 46 via a pen or the like in a part of the pressure sensor sheet 20, the pressure-sensitive body 38 has a thickness in the applied part. Compressed in direction. As a result, the particles in the pressure sensitive body 38 come into contact with each other in the thickness direction, and the electric resistance value of the pressure sensitive body 38 in the thickness direction is lowered in a part of the pressure sensitive body 38. For this reason, in the transistor 30 connected to a part of the pressure-sensitive body 38 to which pressure is applied, the current flowing through the source electrode 33 and the drain electrode 34 increases. Therefore, the distribution of the pressure applied to the pressure sensor sheet 20 can be calculated by detecting the value of the current flowing through each transistor 30.

  As shown in FIGS. 1 and 2, the pressure sensor sheet 20 according to the present embodiment is used by being double-wound around the side surface of the wound portion 11. In the present embodiment, the angle range R1 in the winding direction DR of the sensor unit 20a and the angle range R2 in the winding direction DR of the wiring unit 20b are equal to each other, and each is a round of the side surface of the wound portion 11. Corresponds to the minute, i.e. 360 ° angular range. Here, the “angle range in the winding direction DR” refers to an angle range along the winding direction DR from the upstream end to the downstream end in the winding direction DR.

  Here, as a comparative example, a case is considered where the angle range R2 in the winding direction DR of the wiring part 20b is shorter than the angle range R1 in the winding direction DR of the sensor part 20a. In this case, the insensitive area can be reduced by winding the pressure sensor sheet 20 so that a part of the sensor unit 20a overlaps the wiring unit 20b, but due to the influence of the sheet thickness of the wiring unit 20b, The measurement sensitivity greatly changes between the portion overlapping with the wiring portion 20b and the portion not overlapping, and as a result, unevenness in the measurement sensitivity occurs in the circumferential direction.

  On the other hand, in the present embodiment, the angle range R1 in the winding direction DR of the sensor unit 20a and the angle range R2 in the winding direction DR of the wiring unit 20b correspond to one round of the side surface of the wound portion 11 respectively. Therefore, the sensor unit 20a is overlapped with the wiring unit 20b over the entire length in the winding direction DR. Therefore, it is possible to effectively suppress the occurrence of unevenness in measurement sensitivity in the circumferential direction due to the influence of the sheet thickness of the wiring portion 20b.

  In the example illustrated in FIG. 2, the sensor unit 20a is wound around the wiring unit 20b, but may be wound around the sensor unit 20a.

  Moreover, in this Embodiment, as shown in FIG. 3, in the wiring part 20b of the base material 21, the 1st wiring W1-Wm is directed to the side edge 21E along the winding direction DR of the pressure sensor sheet 20. Curved or bent. And both the 1st wiring W1-Wm and 2nd wiring B1-Bn are taken out from the side edge 21E along the winding direction DR of the pressure sensor sheet | seat 20. As shown in FIG.

  Here, as a comparative example, the first wirings W1 to Wm supported by the wiring part 20b extend linearly along the first direction D1, and the end of the wiring part 20b opposite to the sensor part 20a side. Consider the case where it is removed from the edge. In this case, as shown in FIG. 2, when the sensor unit 20a is wound on the wiring unit 20b, the first wirings W1 to Wm are taken out from the edge of the wiring unit 20b. Since the overlapped sensor unit 20a is in the way, it is necessary to perform complicated work on the inside of the wound portion 11 and take out the first wires W1 to Wm.

  On the other hand, in the present embodiment, the first wirings W1 to Wm supported by the wiring part 20b are taken out from the side edge 21E along the winding direction DR of the pressure sensor sheet 20, so There is no need to perform complicated work, and the first wirings W1 to Wm can be easily taken out to the outside.

  In the present embodiment, as shown in FIGS. 1 and 3, both the first wirings W1 to Wm and the second wirings B1 to Bn are taken out from the side edge 21E along the winding direction DR of the pressure sensor sheet 20. A connector 12 is attached, and a control circuit 13 is electrically connected to the connector 12.

  According to the present embodiment configured as described above, the angle range R1 in the winding direction DR of the sensor unit 20a and the angle range R2 in the winding direction DR of the wiring unit 20b are respectively Since it corresponds to one side of the side surface, the sensor unit 20a is overlapped with the wiring unit 20b over the entire length in the winding direction DR. Therefore, it is possible to effectively suppress the occurrence of unevenness in measurement sensitivity in the circumferential direction due to the influence of the sheet thickness of the wiring portion 20b.

  Further, according to the present embodiment, since both the first wirings W1 to Wm and the second wirings B1 to Bn are taken out from the side edge 21E along the winding direction DR of the pressure sensor sheet 20, the portion to be wound is 11 does not need to be complicatedly crafted, and both the first wirings W1 to Wm and the second wirings B1 to Bn can be easily taken out.

  Various changes can be made to the above-described embodiment. Hereinafter, modified examples will be described with reference to the drawings. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding parts in the above embodiment are used for the parts that can be configured in the same manner as the above embodiment. The duplicated explanation is omitted. In addition, when it is clear that the operational effects obtained in the above-described embodiment can be obtained in the modified example, the description thereof may be omitted.

  FIG. 7 is a plan view showing a modification of the pressure sensor sheet developed on a plane. FIG. 8 is a cross-sectional view of a pressure sensor using the pressure sensor sheet of FIG.

  In the example shown in FIGS. 7 and 8, the pressure sensor sheet 20 is provided with two wiring portions 20b. One wiring part 20b is adjacent to one side of the winding direction DR with respect to the sensor part 20a, and the other wiring part 20b is adjacent to the other side of the winding direction DR with respect to the sensor part 20a.

  Further, the angle range in the winding direction DR of one wiring part 20b and the angle range in the winding direction DR of the other wiring part 20b are equal to each other, and the sum of the angle ranges in the winding direction DR of the wiring part 20b is The angle range in the winding direction DR of the sensor unit 20a is equal.

  Therefore, as shown in FIG. 8, in the state where the pressure sensor sheet 20 is doubly wound around the side surface of the wound portion 11, the angle range in the winding direction DR of the sensor portion 20a and the winding direction DR of the wiring portion 20b. The sum of the angle ranges corresponds to one round of the side surface of the wound part 11, that is, an angle range of 360 °.

  Even in such an aspect, since the sensor unit 20a is overlapped with the wiring unit 20b over the entire length in the winding direction DR, the measurement sensitivity is uneven in the circumferential direction due to the influence of the sheet thickness of the wiring unit 20b. It can be effectively suppressed.

  In the above-described embodiment, an example in which the transistor 30 is a so-called bottom gate type is shown. However, the type of the transistor 30 is not limited to the bottom gate type. For example, as illustrated in FIG. 5, the transistor 30 may be a so-called top gate type in which the gate electrode 31 is disposed at a position farther from the base material 21 than the source electrode 33, the drain electrode 34, and the semiconductor layer 35. .

  Further, in the above-described embodiment, an example in which the transistor 30 is in contact with the pressure sensitive body 38 is shown. Specifically, an example is shown in which the first electrode 37 physically connected to the drain electrode 34 of the transistor 30 is also in contact with the pressure sensitive body 38. However, the present invention is not limited to this, and as shown in FIG. 6, the first electrode 37 and the pressure sensitive body 38 have an opening such as a through hole 36 a formed in a part of the insulating layer 36. You may face each other. In this case, in a state where no pressure is applied to the pressure sensor sheet 20, it is guaranteed that the first electrode 37 and the pressure sensitive body 38 are not in contact with each other. For this reason, generation | occurrence | production of noise can be suppressed in the state in which the pressure is not applied to the pressure sensor sheet | seat 20. FIG. Then, only when a pressure of a certain value or more is applied to the pressure sensitive body 38 in the thickness direction of the pressure sensitive body 38, a part of the pressure sensitive body 38 pushed into the through hole 36 a comes into contact with the first electrode 37. Become. That is, the drain electrode 34 is electrically connected to the pressure sensitive body 38 when pressure is applied to the pressure sensitive body 38. For this reason, the pressure of the pressure sensitive body 38 pressed against the first electrode 37 can be reduced as compared with the conventional case. Accordingly, even when a large pressure is applied to the pressure sensitive body 38, it is possible to suppress an excessive current from flowing to the first electrode 37 and the pressure sensitive body 38. Accordingly, it is possible to suppress an increase in power consumption of the transistor 30 and power consumption of an external drive circuit for driving the transistor 30. In addition, it is possible to suppress an excessive load from being applied to an external drive circuit for driving the transistor 30.

  FIG. 6 shows an example in which the first electrode 37 connected to the drain electrode 34 faces the pressure sensitive body 38 with the opening interposed therebetween. However, although not illustrated, the drain electrode 34 may be opposed to the pressure sensitive body 38 with the opening interposed therebetween.

  In FIG. 6, in the bottom gate type transistor 30, the first electrode 37 and the pressure sensitive body 38 face each other with an opening such as a through hole 36a formed in a part of the insulating layer 36 therebetween. An example configured as shown above was shown. However, the present invention is not limited to this, and although not shown, in the top gate type transistor 30, the first electrode 37 and the first electrode 37 are sandwiched between openings such as a through hole 36 a formed in a part of the insulating layer 36. You may arrange | position so that the pressure sensitive body 38 may oppose.

  In the above-described embodiment, the pressure sensor sheet 20 is an active type that uses a plurality of transistors 30, but may be a passive type that does not use the transistors 30. In the case of the passive type, one of the first wirings W1 to Wm and the second wirings B1 to Bn is disposed below the pressure sensitive body 38, and the other is disposed on the pressure sensitive body 38.

  In the above-described embodiment, the pressure-sensitive body 38 is a so-called pressure-sensitive conductor in which the electric resistance of the pressure-sensitive body 38 changes according to the pressure applied to the pressure-sensitive body 38. An example is given. However, as long as information corresponding to the pressure applied to the pressure sensitive body can be extracted, the specific configuration of the pressure sensitive body 38 is not particularly limited. For example, the pressure sensitive body 38 may be configured such that the capacitance of the pressure sensitive body 38 changes in accordance with the pressure applied to the pressure sensitive body 38.

  In the above-described embodiment, an example in which the pressure sensor sheet 20 includes one base material 21 has been described, but the present invention is not limited thereto. For example, as illustrated in FIG. 9, the pressure sensor sheet 20 may include a plurality of transistor sheets 25 and a connection member 26 that electrically connects two adjacent transistor sheets 25. The transistor sheet 25 includes a base material 21 and a plurality of transistors 30 formed on the base material 21. Thus, when the pressure sensor sheet 20 includes the plurality of transistor sheets 25, it is possible to easily realize an increase in size of the pressure sensor sheet 20 or the pressure sensor 10.

  In the above-described embodiment, the first wirings W1 to Wm correspond to the word lines and the second wiring corresponds to the bit lines B1 to Bn. However, the present invention is not limited to this. For example, the first wirings W1 to Wm may correspond to bit lines, and the second wirings B1 to Bn may correspond to word lines.

  Although not shown, the common electrode 39 of the pressure sensor sheet 20 may be taken out from the side edge 21E along the first wirings W1 to Wm, or the side edge 21E along the second wirings B1 to Bn. May be taken from.

  In addition, although some modified examples with respect to the above-described embodiment have been described, naturally, a plurality of modified examples can be applied in combination as appropriate.

DESCRIPTION OF SYMBOLS 10 Pressure sensor 11 Wound part 12 Connector 13 Control circuit 20 Pressure sensor sheet | seat 20a Sensor part 20b Wiring part 21 Base material 21E Side edge 21a 1st surface 25 Transistor sheet 26 Connecting member 30 Transistor 31 Gate electrode 32 Gate insulating film 33 Source Electrode 34 Drain electrode 35 Semiconductor layer 36 Insulating layer 36a Through hole 37 Connection pad 38 Pressure sensitive body 39 Common electrode 46 Overcoat layer

Claims (10)

A pressure sensor that generates a detection signal according to an applied pressure,
A wound part;
A pressure sensor sheet wound twice on the side surface of the wound portion;
With
The pressure sensor sheet has a sensor portion corresponding to a portion that overlaps the pressure sensitive body when deployed, and a wiring portion adjacent to the sensor portion in the winding direction,
The sensor unit includes a plurality of first wires extending in a first direction and a plurality of second wires extending in a second direction intersecting the first direction.
The wiring portion supports the first wiring drawn from the sensor portion,
The angle range in the winding direction of the sensor part and the angle range in the winding direction of the wiring part respectively correspond to one round of the side surface of the wound part. 2. The pressure sensor according to claim 1, wherein both the first wiring and the second wiring are taken out from a side edge along a winding direction of the pressure sensor sheet. 3. The pressure sensor according to claim 1, wherein the sensor unit includes a plurality of transistors corresponding to the intersections of the first wiring and the second wiring. 4. The pressure sensor according to claim 1, wherein the first wiring extends in a winding direction in the sensor unit. In the said wiring part, the said 1st wiring is curved or bent so that it may go to the side edge along the winding direction of the said pressure sensor sheet | seat, The pressure in any one of Claims 1-4 characterized by the above-mentioned. Sensor. A pressure sensor sheet that is wound twice around the side of the wound part,
A sensor unit corresponding to a portion that overlaps the pressure sensitive body during deployment;
A wiring portion adjacent to the sensor portion in the winding direction;
Have
The sensor unit includes a plurality of first wires extending in a first direction and a plurality of second wires extending in a second direction intersecting the first direction.
The wiring portion supports the first wiring drawn from the sensor portion,
The angle range in the winding direction of the sensor part and the angle range in the winding direction of the wiring part respectively correspond to one round of the side surface of the wound part. The pressure sensor sheet according to claim 6, wherein both of the first wiring and the second wiring are taken out from a side edge along a winding direction of the pressure sensor sheet. The pressure sensor sheet according to claim 6 or 7, wherein the sensor unit is provided with a plurality of transistors corresponding to each intersection of the first wiring and the second wiring. The pressure sensor sheet according to any one of claims 6 to 8, wherein, in the sensor unit, the first wiring extends along a winding direction. In the said wiring part, the said 1st wiring is curved or bent so that it may go to the side edge along the winding direction of the said pressure sensor sheet | seat, The pressure in any one of Claims 6-9 Sensor sheet.

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