JP2016173910A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress occurrence of a connection failure when an information apparatus and a peripheral device are connected with each other by means of USB.SOLUTION: A semiconductor device that enables data transfer by USB by being connected with a receptacle, comprises: a circuit board that has a wiring board with a plurality of connection pads, and a semiconductor component mounted on the wiring board; and a terminal part provided on the circuit board. The terminal part comprises: a terminal member that has a first connection part connectable with the receptacle, a tail part provided at an end part, and a junction part for joining the first connection part and the tail part; and an insulation member that holds at least a part of the junction part. The junction part has a second connection part exposed from the insulation member to the circuit board side, and electrically connected with at least one of the plurality of connection pads.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a semiconductor device.

  USB (Universal Serial Bus: USB) is known as one of the connection standards for connecting information devices such as computers and peripheral devices. For example, by connecting an information device and a peripheral device with a USB connector using a male connector (also referred to as a plug) and a female connector (also referred to as a receptacle), it is possible not only to transfer data, but also from, for example, an information device It is also possible to obtain a power source necessary for the operation of peripheral devices and to connect a plurality of devices via a USB hub.

  With USB 3.0, which is one of the USB standards, it is possible to perform high-speed transfer having a transfer speed 10 times or more that of USB 2.0 while maintaining compatibility with USB 2.0. The USB 3.0 USB connector requires five connection terminals in addition to the four connection terminals provided on the USB 2.0 USB connector. With a USB 3.0 USB connector, for example, in a semiconductor device having a plug, it is difficult to secure a space for forming a connection terminal on the wiring board itself.

  In a semiconductor device having a USB 3.0 plug, for example, a terminal component having a terminal member functioning as a connection terminal may be mounted on a wiring board. The terminal member includes a receptacle connecting portion that is protected by an insulating member and can be connected to a receptacle, a tail portion provided at an end portion, and a connecting portion that connects the receptacle connecting portion and the tail portion. By connecting the connection pad of the wiring board and the tail part of the terminal member, the terminal member and the wiring board can be electrically connected.

  However, when the tail portion of the terminal member and the connection pad of the wiring board are connected, an unnecessary load is easily applied to the tail portion, and connection failure may occur. As described above, a semiconductor device capable of data transfer by USB is required to suppress the occurrence of connection failure.

Japanese Patent No. 5144714

  The problem to be solved by the invention of the embodiment is to suppress the occurrence of poor connection between a connection terminal that can be connected to an external device by USB and a circuit board.

  A semiconductor device according to an embodiment is a semiconductor device capable of transferring data by USB by connecting to a receptacle, and includes a circuit board having a plurality of connection pads and a semiconductor component mounted on the wiring board; And a terminal portion provided on the circuit board. The terminal portion includes a first connecting portion that can be connected to the receptacle, a tail portion provided at an end portion, and a connecting member that connects the first connecting portion and the tail portion; And an insulating member that holds at least a part of the connecting portion. The connecting portion has a second connecting portion exposed from the insulating member to the circuit board side and electrically connected to at least one of the plurality of connecting pads.

It is a cross-sectional schematic diagram which shows the structural example of a semiconductor device. It is an upper surface schematic diagram which shows the structural example of a semiconductor device. It is an external appearance schematic diagram which shows the surface of a terminal part. It is an external appearance schematic diagram which shows a part of back surface of a terminal part. It is an enlarged view of a terminal part. It is a cross-sectional schematic diagram which shows the other structural example of a terminal part. It is a cross-sectional schematic diagram which shows the other structural example of a terminal part. It is a cross-sectional schematic diagram which shows the other structural example of a terminal part. FIG. 9 is a schematic top view of the terminal portion shown in FIG. 8. It is an upper surface schematic diagram for demonstrating the example of the manufacturing method of a terminal part. It is an upper surface schematic diagram for demonstrating the example of the manufacturing method of a terminal part. It is a cross-sectional schematic diagram which shows the other structural example of a semiconductor device.

  Hereinafter, embodiments will be described with reference to the drawings. The drawings are schematic, and for example, the relationship between the thickness and the planar dimensions, the ratio of the thickness of each layer, and the like may be different from the actual ones. In the embodiments, substantially the same constituent elements are denoted by the same reference numerals and description thereof is omitted.

  FIGS. 1 and 2 are schematic views showing a structure example of a semiconductor device capable of transferring data by USB 3.0 by connecting to a receptacle, FIG. 1 is a schematic sectional view, and FIG. 2 is a schematic top view. is there. 1 and 2 illustrate a semiconductor device including a circuit board that is a SiP (System in a Package: SiP) as an example.

  A semiconductor device 10 shown in FIGS. 1 and 2 includes a housing 1, a circuit board 2, and a terminal portion 3. The housing 1 includes an opening 11 that is a non-through hole. The housing 1 has an insulating property and is formed of, for example, a synthetic resin such as polyvinyl chloride. For example, you may form the housing | casing 1 which has the opening part 11 by bonding together a pair of housing | casing member which has a groove part and was shape | molded using the synthetic resin so that a groove part may face. The shape of the housing 1 is not limited to the shape shown in FIG. For example, the casing 1 may be provided so as to overlap with the entire circuit board 2, and a casing having a function as a cap for protecting a portion protruding from the casing 1 in the circuit board 2 is separated from the casing 1. It may be provided.

  The circuit board 2 is provided, for example, in the opening 11. The circuit board 2 is preferably fixed by the housing 1. The circuit board 2 includes a wiring substrate 21 having a first surface and a second surface opposite to the first surface, a memory chip 22 mounted on the first surface of the wiring substrate 21, A semiconductor component such as a controller chip 23 and a resin layer 24 for sealing the semiconductor component are provided. Note that the present invention is not limited to the memory chip 22 and the controller chip 23, and other semiconductor components may be used. Further, the positions of the memory chip 22 and the controller chip 23 may be reversed.

  The first surface of the wiring substrate 21 corresponds to the lower surface of the wiring substrate 21 in FIG. 1, and the second surface corresponds to the upper surface of the wiring substrate 21 in FIG. The wiring board 21 has a plurality of connection pads including at least a connection pad 211a and a connection pad 211b provided on the first surface. In addition, the wiring board 21 has a plurality of connection pads including at least a connection pad 212a and a connection pad 212b provided on the second surface. The connection pad on the first surface is electrically connected to the connection pad 212a and the connection pad 212b on the second surface through vias penetrating the wiring substrate 21, for example. As the wiring board 21, for example, a resin board such as glass epoxy having a wiring layer provided with connection pads provided on the surface can be used.

  The connection pad 211 a and the connection pad 211 b are connection pads for electrically connecting the semiconductor component and the wiring board 21. The connection pad 212b has a function as a connection terminal that can be connected to the receptacle. As the connection terminals, for example, a power supply terminal (VBUS), a signal terminal (D +, D−) for a normal transfer data signal that is a differential signal, and a USB 2.0 or USB 3.0 such as a ground terminal (GND). The connection terminals necessary for data transfer by the above are mentioned. In FIG. 1, the connection pad 212 b is provided so as to protrude from the housing 1 (opening 11). However, the connection pad 212 b is not limited to this, and the connection pad 212 b (circuit board 2) is included in the opening 11. ) May be provided.

  The memory chip 22 is electrically connected to the connection pad 211a. The memory chip 22 has, for example, a stack of a plurality of semiconductor chips, and the plurality of semiconductor chips are bonded to each other so that a part thereof is overlapped with an adhesive layer interposed therebetween. The plurality of semiconductor chips are electrically connected to each other by connecting electrode pads provided on each semiconductor chip by wire bonding. As the semiconductor chip, for example, a memory chip having a storage element such as a NAND flash memory can be used. At this time, the semiconductor chip may include a decoder or the like in addition to the memory cell.

  The controller chip 23 is electrically connected to the connection pad 211b. The controller chip 23 controls operations such as data writing and data reading with respect to the memory chip 22. The controller chip 23 is composed of a semiconductor chip, and is electrically connected to the wiring board 21 by connecting electrode pads provided on the semiconductor chip and connection pads 211b provided on the wiring board 21, for example, by wire bonding. .

  The method for connecting the memory chip 22 and controller chip 23 to the wiring board 21 is not limited to wire bonding, and wireless bonding such as flip chip bonding or tape automated bonding may be used. Alternatively, a three-dimensional mounting structure such as a TSV (Through Silicon Via: TSV) system in which the memory chip 22 and the controller chip 23 are stacked on the first surface of the wiring board 21 may be used.

The resin layer 24 is provided so as to seal the memory chip 22 and the controller chip 23. The resin layer 24 contains, for example, an inorganic filler (for example, SiO ₂ ). For example, the resin layer 24 is formed by a molding method such as a transfer molding method, a compression molding method, or an injection molding method using a sealing resin obtained by mixing the inorganic filler with an organic resin or the like.

  The terminal part 3 is provided on the circuit board 2. For example, the terminal unit 3 is held by the housing 1. Here, a structural example of the terminal portion 3 will be described with reference to FIGS. 3 and 4. 3 and FIG. 4 are schematic views showing an example of the structure of the terminal portion, FIG. 3 is an external view showing the surface of the terminal portion, and FIG. 4 is an external view showing a part of the back surface of the terminal portion. In addition, it is not limited to the case where the terminal part 3 is used for the semiconductor device 10, You may use the terminal part 3 as one terminal component applicable also to the semiconductor device of another structure. For example, if the standard uses the same signal, the terminal unit 3 may be provided in a semiconductor device capable of data transfer according to another USB standard.

  As shown in FIG. 4, the terminal portion 3 includes a terminal member 31 and an insulating member 32. In addition, in FIG. 3, although the five terminal members 31 are illustrated, the number of the terminal members 31 is not specifically limited. Further, in FIG. 3, the shape of the terminal member 31 on the side connected to the receptacle is not limited to this.

  The terminal member 31 has a function as a connection terminal that can be connected to, for example, a receptacle. The connection terminals include, for example, a ground terminal (GND), signal terminals (SSTX +, SSTX−) for transmission data signals for high-speed transfer that are differential signals, and reception data signals for high-speed transfer that are differential signals. For example, connection terminals necessary for high-speed transfer by USB 3.0 such as signal terminals (SSRX +, SSRX−), and the like are included.

  FIG. 5 is an enlarged view of the terminal portion 3. As illustrated in FIG. 5, the terminal member 31 includes a connection portion 31a, a tail portion 31b, and a connecting portion 31c.

  The connecting portion 31a is a portion that can be connected to the receptacle when the semiconductor device 10 is inserted into the receptacle, for example. At this time, the connecting portion 31a is also referred to as a receptacle connecting portion. The connection part 31a includes a contact part 31d. The contact portion 31d is provided on the first surface of the connection portion 31a, for example. In FIG. 5, the connecting portion 31 a protrudes from the insulating member 32.

  It is preferable that the contact portion 31d has a curved surface that is convex on the upper side. This facilitates electrical connection between the contact portion 31d and the receptacle. Moreover, it is preferable that the connection part 31a has springiness. Since the connection between the terminal member 31 and the receptacle is performed on the upper side of the terminal member 31, when the semiconductor device 10 is inserted into the receptacle by the above structure, the terminal member 31 is pushed downward, and the spring property is the original. Since the force to return is applied toward the connection terminal of the receptacle, the contact strength with the receptacle can be increased.

  The tail part 31b is provided at the end of the terminal member 31, for example. One end of the tail part 31 b has a cut surface when the terminal part 3 is formed. One end of the tail portion 31b has a planar shape, for example. In FIG. 5, the tail portion 31 b protrudes from the insulating member 32 and is separated from the circuit board 2. That is, by adopting a structure in which the tail portion 31 b is not in contact with the circuit board 2, a load applied to the tail portion 31 b can be suppressed, and deformation of the terminal member 31 can be suppressed.

  The connecting portion 31c is provided so as to connect the connecting portion 31a and the tail portion 31b. For example, the connecting portion 31c preferably has a curved shape in which the lower side in FIG. 5 is convex. The connecting portion 31c has a connecting portion 311 exposed from the insulating member 32 to the circuit board 2 side and electrically connected to at least one of the plurality of connecting pads (here, the connecting pad 212a). By holding the periphery of the connection portion 311 with the insulating member 32, it is possible to suppress a connection failure between the terminal portion 3 and the circuit board 2 due to foreign matter.

  In FIG. 5, the connecting portion 31c is electrically connected to the connection pad 212a. At this time, the connection portion 311 is also referred to as a substrate connection portion. The connecting portion 31c may be joined to the connection pad 212a by, for example, pressure bonding or soldering. Further, in the extending direction of the terminal member 31, the length of the tail portion 31 b is made shorter than the length of the connection portion 311, whereby the terminal portion 3 can be reduced in size.

  As the terminal member 31, for example, a material capable of imparting spring properties such as a copper alloy (for example, beryllium copper, phosphor bronze, cobalt copper) or a nickel alloy (for example, beryllium nickel) can be used.

  The insulating member 32 holds at least a part of the connecting portion 31c. 1 to 5, the connection portion 31 a and the tail portion 31 b protrude from the insulating member 32. As the insulating member 32, for example, a resin or the like can be used. The connecting member 311 is provided with a surface continuous with one surface of the insulating member 32 (the lower surface of the insulating member 32 in FIG. 5) located between the connection pad 212a and the connecting portion 31c. Therefore, the connection failure between the connection portion 311 and the connection pad 212a can be suppressed.

  The structure of the terminal portion 3 is not limited to the structure shown in FIGS. 6 to 7 are schematic cross-sectional views showing other structural examples of the terminal portion 3.

  The terminal part 3 shown in FIG. 6 is different from the terminal part 3 shown in FIG. 5 in that it has a connecting part 311 provided so as to protrude from the insulating member 32. In FIG. 6, the connecting portion 311 is provided so as to protrude from the insulating member 32 to the circuit board 2 side. At this time, it is preferable that an adhesive layer 4 is provided between the terminal portion 3 and the circuit board 2 (wiring board 21), and the terminal section 3 and the circuit board 2 (wiring board 21) are bonded by the adhesive layer 4. As the adhesive layer 4, for example, an acrylic adhesive or an epoxy adhesive can be used. An anisotropic conductive resin can also be used for the adhesive layer 4. Note that the adhesive layer 4 is not necessarily provided.

  By making the structure of the terminal portion 3 as shown in FIG. 6, the area of the connecting portion 31c exposed from the insulating member 32 in the connecting portion 31c is larger, so the area of the connecting portion 311 is larger than that of the terminal portion 3 shown in FIG. Easy to enlarge. By increasing the area of the connection portion 311, the connection resistance between the terminal member 31 and the circuit board 2 can be reduced, and poor connection is less likely to occur.

  The terminal portion 3 shown in FIG. 7 has a connection portion 311 provided so as to be retracted into the insulating member 32 as compared with the terminal portion 3 shown in FIG. 5, in other words, the opening portion 320 that exposes the connection portion 311. The difference is that at least the insulating member 32 is provided. In FIG. 7, an opening 320 is provided on the insulating substrate 32 on the circuit board 2 side. At this time, it is preferable that the conductive layer 5 is provided between the terminal portion 3 and the circuit board 2 (wiring substrate 21), and the terminal portion 3 and the circuit board 2 (wiring substrate 21) are connected by the conductive layer 5. Further, by providing the opening 320 for each terminal member 31 and providing the conductive layer 5 for each opening 320, the plurality of terminal members 31 are electrically separated from each other.

  By making the structure of the terminal portion 3 as shown in FIG. 7, for example, a connection failure between the terminal member 31 and the connection pad 212a due to a foreign substance can be suppressed.

  As the conductive layer 5, a metal material such as copper or a conductive material such as solder can be used. In addition to the material applicable to the adhesive layer 4 shown in FIG. 6, an adhesive material containing a conductive material (such as a conductive filler) may be used. Thereby, in the opening part 320, the terminal member 31 and the circuit board 2 (wiring board 21) can be electrically connected via the conductive layer 5.

  The terminal portion 3 shown in FIGS. 5 to 7 is manufactured, for example, by forming the insulating member 32 using a mold having a desired shape. Further, the connecting portion 311 may be exposed by forming the insulating member 32 so as to cover a part of the terminal member 31 by the above method and then removing a part of the insulating member 32.

  The terminal part 3 shown in FIG. 8 is at least different from the terminal part 3 shown in FIG. 5 in that the structure of the insulating member 32 and the connection pad 33 electrically connected to the semiconductor component are provided. The connection pad 33 includes a connection portion 33a that can be connected to the receptacle, and a connection portion 33b. When connecting to the receptacle, the connection pad 212b is not directly connected to the receptacle, and the connecting portion 33a is connected to the receptacle.

  The insulating member 32 has a region 32 a that holds at least a part of the connecting portion 31 c and a region 32 b that holds at least a part of the connection pad 33.

  In the terminal portion 3 shown in FIG. 8, the connection pad 33 includes a connection portion 33a that can be connected to the receptacle, and a connection portion 33b that is exposed from the insulating member 32 and is electrically connected to the connection pad 212b. . The connection pad 33 is formed using a material applicable to the terminal member 31, for example. However, the connection pad 33 may be formed using a material different from that of the terminal member 31.

  By making the structure of the terminal portion 3 as shown in FIG. 8, the area of the connection pad 212b in the wiring board 21 can be reduced. Therefore, the degree of freedom of the wiring layout in the wiring board 21 can be increased.

  FIG. 9 is a top view of the terminal portion 3 shown in FIG. As shown in FIG. 9, the connection portion 33b may have a structure that does not overlap with the connection portion 33a when viewed from above. In addition, the connection pads 33 may be provided between the respective terminal members 31 in the region 32a as viewed from above, without being limited to the region 32b. At this time, the region 32b may not be provided.

  The connection pad 33 has a function as a connection terminal, for example. As the connection terminals, for example, a power supply terminal (VBUS), a signal terminal (D +, D−) for a normal transfer data signal that is a differential signal, and a USB 2.0 or USB 3.0 such as a ground terminal (GND). The connection terminals necessary for data transfer by the above are mentioned.

  10 and 11 are schematic views for explaining an example of a method for manufacturing the terminal portion 3. As shown in FIG. 10, the terminal member 30 is prepared first. The terminal member 30 has a comb-tooth shape including a plurality of teeth that later become the plurality of terminal members 31.

  Next, by providing the insulating member 32 so as to hold a part of each tooth of the terminal member 30 by insert molding or the like, the connection portion 31c is held while the connection portion 311 is exposed. Insert molding is a molding method in which a resin is injected around a metal part inserted into a mold and the metal and the resin are integrated.

  Next, as shown in FIG. 11, the terminal member 30 is cut | disconnected on the basis of the line segment XY, and the several terminal member 31 is formed by isolate | separating a several tooth | gear. The cut surface at this time becomes a part of the tail portion 31b. The terminal part 3 can be formed by the above.

  As described above, in the present embodiment, the connection portion with the circuit board in the terminal portion is provided not in the tail portion but in the connecting portion, so that connection failure or the like due to external force can be suppressed. The tail portion may be deformed by an external force applied during cutting or the like. Moreover, when providing a connection part in a tail part, it is necessary to lengthen the exposed part containing the tail part exposed from the insulating member. For this reason, a short circuit and poor connection may occur between the plurality of terminal members and the circuit board in the exposed portion. On the other hand, by providing the connection part with the circuit board in the connection part, the exposed part including the tail part can be shortened while covering the periphery of the connection part with an insulating member, and connection failure is suppressed. In addition, the terminal portion can be reduced in size.

  The structure of the circuit board 2 is not limited to FIG. Another structural example of the semiconductor device is shown in FIG. In FIG. 12, a semiconductor device having a circuit board 2 which is a PCBA (Printed Circuit Board Assembly: PCBA) is illustrated as an example. In the semiconductor device shown in FIG. 12, the upper surface of the wiring board 21 is the first surface compared to the semiconductor device 10 shown in FIG. 1, and the connection pads 212 a or connections provided on the first surface of the wiring board 21. It differs at least in that it has a semiconductor package 27 mounted on the first surface of the wiring board 21 instead of the pad 212c and the memory chip 22 and the controller chip 23. Note that in FIG. 12, the description of FIG. 1 can be used as appropriate for the same components as those of the semiconductor device 10 illustrated in FIG.

  In the semiconductor package 27, the lead frame is electrically connected to the connection pads 212 c provided on the first surface of the wiring substrate 21. The semiconductor package 27 may be provided with semiconductor components such as a memory chip and a controller chip. As shown in FIG. 12, a semiconductor package including a lead frame may be used as a semiconductor component, and a sealing resin layer may be formed on the semiconductor package. Further, the memory chip and the controller chip are not necessarily provided.

  Further, the structure is not limited to the structure shown in FIG. 12, and the terminal portion having the above structure may be used for a plug of a plug combination type semiconductor device. For example, the plug includes, for example, a first wiring board using the wiring board 21, a second wiring board different from the first wiring board, a terminal portion provided on the second wiring board, and a second wiring board. And a housing made of a metal material or the like that covers the wiring board and the terminal portion. At this time, the terminal portion is electrically connected to the second wiring board, and the second wiring board is electrically connected to the first wiring board by a connection terminal or the like. In the semiconductor device having the above structure, data transfer by USB can be performed between the semiconductor device and an information device including the receptacle by connecting the plug and the receptacle.

  Each embodiment is presented as an example and is not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  DESCRIPTION OF SYMBOLS 1 ... Housing, 2 ... Circuit board, 3 ... Terminal part, 4 ... Adhesive layer, 5 ... Conductive layer, 10 ... Semiconductor device, 11 ... Opening part, 21 ... Wiring board, 211a ... Connection pad, 211b ... Connection pad, 212b ... connection pad, 212b ... connection pad, 22 ... memory chip, 23 ... controller chip, 24 ... resin layer, 27 ... semiconductor package, 30 ... terminal member, 31 ... terminal member, 31a ... connection part, 31b ... tail part, 31c ... articulation part, 31d ... contact part, 32 ... insulating member, 32a ... area, 32b ... area, 33 ... connection pad, 33a ... connection part, 33b ... connection part, 311 ... connection part, 320 ... opening.

Claims (5)

A semiconductor device capable of transferring data by USB by connecting to a receptacle,
A circuit board comprising a wiring board having a plurality of connection pads, and a semiconductor component mounted on the wiring board;
A terminal portion provided on the circuit board,
The terminal portion is
A terminal member having a first connecting portion capable of being connected to the receptacle, a tail portion provided at an end portion, and a connecting portion connecting the first connecting portion and the tail portion;
An insulating member that holds at least a part of the connecting portion,
The connecting portion includes a second connection portion exposed from the insulating member to the circuit board side and electrically connected to at least one of the plurality of connection pads.   The semiconductor device according to claim 1, wherein the tail portion protrudes from the insulating member and is separated from the circuit board.   The semiconductor device according to claim 2, wherein a length of the tail portion is shorter than a length of the second connection portion.   4. The second connection portion according to claim 1, wherein the second connection portion has a surface that is continuous with at least one of the plurality of connection pads and the one surface of the insulating member that is located between the connection portions. 5. A semiconductor device according to 1. The plurality of connection pads include a first connection pad electrically connected to the second connection part, and a second connection pad electrically connected to the semiconductor component,
The terminal portion further includes a third connection pad,
The insulating member has a first region that holds at least a part of the connecting portion, and a second region that holds at least a part of the third connection pad,
The third connection pad includes a third connection portion that can be connected to the receptacle, and a third connection portion that is exposed to the circuit board side from the insulating member and is electrically connected to the second connection pad. 5. The semiconductor device according to claim 1, comprising four connection portions.

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