JP2016167490A - Apparatus and method for inspecting clogging of wafer chuck - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method for inspecting clogging of a wafer chuck, capable of efficiently inspecting the whole area of the wafer chuck in a short time.SOLUTION: In a clogging inspection apparatus 50, a measuring head 64 is mounted on a movement mechanism part 54, and while jetting compressed air toward the upper surface of a suction part 34 from a nozzle 66, the measuring head 64 is moved along the upper surface by the movement mechanism parts 72, 74. Then, when the air flow rate flowing out from a space between the nozzle 66 and the upper surface of the suction part 34 is detected by a detection part 56 and the detected value exceeds a threshold, the detection part 56 detects generation of clogging in the suction part 34.SELECTED DRAWING: Figure 5

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer chuck clogging inspection apparatus and inspection method, and more particularly to a wafer chuck for a dicing apparatus that sucks and holds a semiconductor wafer on which a plurality of semiconductor elements are manufactured and cuts the semiconductor elements chip by chip with a blade. The present invention relates to a clogging inspection apparatus and an inspection method.

  In the semiconductor manufacturing process, various processes are performed on the surface of a thin plate-shaped semiconductor wafer to manufacture a plurality of semiconductor elements having electronic devices. Each chip of the semiconductor element is inspected for electrical characteristics by an inspection apparatus, and then cut and separated for each chip by a cutting means such as a blade of a dicing apparatus or a laser.

  In the dicing process, generally, a disk-shaped semiconductor wafer is held by suction on a circular suction portion (wafer chuck) of a table to perform dicing.

  The table is composed of the suction part having a flat suction surface (first surface) made of a porous member such as a porous material, and a metal table main body that supports the outer periphery of the suction part.

  The adsorbing portion is regularly cleaned because clogging occurs due to cutting waste generated by dicing. When cleaning the suction part, it is inspected beforehand whether the suction part is clogged, and cleaning the suction part when clogging occurs improves the productivity of the semiconductor element This is preferable.

  Patent Document 1 discloses an inspection device that inspects clogging of a porous member.

  The inspection apparatus disclosed in Patent Document 1 includes a measurement head having an air outlet opening at a part of a lower surface covered with an elastic member, an air outlet connected to an air outlet of the measuring head, and the other end connected to an air supply source. A regulator that is arranged in the supply path and the air supply path and adjusts the pressure of the air ejected from the air ejection port of the measurement head to a predetermined value, and is arranged between the measurement head and the regulator, and ejects from the air ejection port And a pressure gauge indicating the pressure of the air.

  According to the inspection apparatus of Patent Document 1, after adjusting the pressure of the air to be ejected to a predetermined value, the air is ejected while pressing the lower surface of the measuring head against a desired position (inspection surface) of the porous material (adsorption part). Then, the measurement is performed by measuring the air pressure, and the air pressure measured on the inspection surface to be inspected is used to determine the clogged state.

JP 2014-72251 A

  In the inspection apparatus of Patent Document 1, the operator moves the measurement head above the first inspection surface of the suction unit, and then moves the measurement head downward to press the lower surface of the measurement head against the first inspection surface. The first inspection surface is inspected for clogging. When the clogging inspection on the first inspection surface is completed, the measurement head is moved upward from the first inspection surface, the measurement head is moved horizontally above the second inspection surface, and then the measurement head is moved downward. The lower surface of the measurement head is pressed against the second inspection surface.

  That is, since the inspection apparatus of Patent Document 1 is an apparatus that inspects clogging by pressing the lower surface of the measurement head against the suction portion, the clogging of the inspection surface is measured unless the measurement head is moved horizontally and vertically. I can't. For this reason, in order to inspect clogging on all the inspection surfaces of the adsorption part, it takes a long time and there is a problem that the throughput is low.

  In addition, since the inspection device of Patent Document 1 presses the lower surface constituted by the elastic member of the measuring head against the inspection surface, the lower surface is worn and debris is generated, causing clogging of the suction portion. It was.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a wafer chuck clogging inspection apparatus and inspection method capable of inspecting the entire surface of a wafer chuck efficiently and in a short time.

  In order to achieve the object of the present invention, an aspect of the wafer chuck clogging inspection apparatus according to the present invention is a wafer chuck constituted by a porous member, and holds the wafer by vacuum suction on the first surface. In a clogging inspection apparatus for a wafer chuck, a measurement head having a nozzle that is spaced apart from the first surface of the wafer chuck and that injects compressed air toward the first surface; A moving unit that relatively moves along the surface, and a detection unit that detects clogging of the wafer chuck based on a flow rate of air flowing out from a gap between the nozzle and the first surface or a pressure change caused by the change in the flow rate. .

  One aspect of a method for inspecting clogging of a wafer chuck according to the present invention is a wafer chuck constituted by a porous member in order to achieve the object of the present invention, and holds a wafer by vacuum suction on a first surface. In the method for inspecting clogging of a wafer chuck, the measurement head is arranged away from the first surface of the wafer chuck, and the measurement head is moved while jetting compressed air from the nozzle of the measurement head toward the first surface. The wafer chuck is detected to be clogged based on a flow rate of air flowing out of the gap between the nozzle and the first surface or a pressure change caused by a change in the flow rate.

  According to one aspect of the present invention, the measurement head is disposed apart from the first surface of the wafer chuck, and the measurement head is moved to the first surface while jetting compressed air from the nozzle toward the first surface. The clogging of the wafer chuck is detected based on the flow rate of air flowing out from the gap between the nozzle and the first surface or a change in pressure caused by the change in the flow rate.

  Therefore, according to one aspect of the present invention, the entire surface of the wafer chuck can be efficiently and in a short time compared to the inspection apparatus and inspection method of Patent Document 1 in which clogging is inspected by pressing the lower surface of the measurement head against the suction portion. Can be inspected.

  In one embodiment of the present invention, it is preferable that the moving unit moves the measurement head with a certain distance from the first surface based on the flatness information of the first surface acquired in advance.

  In one embodiment of the present invention, the measurement head is preferably moved with a certain distance from the first surface based on the flatness information of the first surface acquired in advance.

  According to one aspect of the present invention, it is possible to detect clogging of a wafer chuck in a state where a minute error in air flow rate or a minute error in pressure change caused by the error in the first flatness is removed. Therefore, clogging can be detected more accurately.

  According to one aspect of the present invention, when clogging of a wafer chuck is detected, liquid is supplied to the first surface of the wafer chuck and is directed from the second surface opposite to the first surface toward the first surface. It is preferable to clean the wafer chuck by spraying air.

  According to one embodiment of the present invention, it is possible to reliably prevent the occurrence of wafer adsorption / holding failure due to clogging of a wafer chuck.

  In one embodiment of the present invention, the wafer chuck is a wafer chuck of a dicing apparatus for dicing a wafer, the measurement head is supported by a spindle or a spindle support member on which a blade of the dicing apparatus is supported, and the moving unit is a dicing It is a moving mechanism unit that moves the wafer chuck and spindle of the apparatus in the horizontal direction, and the measurement head and the detection unit are preferably configured as an air micrometer.

  According to one aspect of the present invention, when detecting clogging of a wafer chuck of a dicing apparatus, an existing functional member provided in the dicing apparatus can be used as a member constituting the inspection apparatus.

  That is, a moving mechanism unit that supports the measuring head on the spindle on which the blade of the dicing apparatus is supported and moves the wafer chuck and spindle of the dicing apparatus in the horizontal direction is used as the moving unit of the inspection apparatus. In the dicing apparatus, an air micrometer for measuring the thickness of the wafer and setting the depth of cut into the wafer can be used as a measurement head and a detection unit.

  That is, the air micrometer for wafer thickness measurement provided in the dicing apparatus can be used as an apparatus for inspecting clogging of the wafer chuck.

  According to the wafer chuck clogging inspection apparatus and inspection method of the present invention, the entire surface of the wafer chuck can be efficiently inspected in a short time.

The perspective view which showed the appearance of the dicing device of an embodiment The top view of the table of the dicing apparatus shown in FIG. Explanatory drawing using an electric micrometer as a flatness measuring device Explanatory drawing showing the measuring direction of the probe relative to the upper surface of the adsorption part of the table Explanatory drawing applying an air micrometer as a clogging inspection device Explanatory drawing which shows measuring the flatness of one measurement area | region of an adsorption | suction part with an electric micrometer, and checking the clogging of the measurement area | region by moving an air micrometer. FIG. 7 is a graph showing flatness and air flow rate measured in one measurement region shown in FIG. 6 and showing that no clogging occurs. FIG. 7 is a graph showing flatness and air flow rate measured in one measurement region shown in FIG. 6 and showing clogging. Explanatory drawing which showed moving a measuring head along the upper surface of an adsorption | suction part based on the flatness information of the upper surface of the adsorption | suction part acquired previously. Flowchart of the measuring method shown in FIG.

  Hereinafter, preferred embodiments of a clogging inspection apparatus and inspection method for a wafer chuck according to the present invention will be described in detail with reference to the accompanying drawings.

[Configuration of Dicing Device 10]
FIG. 1 is a perspective view illustrating an appearance of a dicing apparatus 10 to which a wafer chuck clogging inspection apparatus according to an embodiment is applied.

  The dicing apparatus 10 includes a load port 12 for transferring a cassette containing a plurality of disk-shaped semiconductor wafers W to and from an external apparatus, and a suction pad 14, and transports the semiconductor wafers W to each part of the apparatus. A transport unit 16, a table 18 for sucking and holding the semiconductor wafer W, a processing unit 20 for dicing the semiconductor wafer W, and a spinner 22 for cleaning and drying the semiconductor wafer W after the dicing processing are provided. The operation of each part of the dicing apparatus 10 is controlled by a controller 24 as control means.

<Processing part 20>
The processing unit 20 is provided with a camera 26 that images the surface of the semiconductor wafer W. Inside the processing unit 20, a pair of disk-shaped blades 28 (one blade 28 is not shown) opposed to each other, and a spindle 32 with a built-in high-frequency motor to which a wheel cover 30 protecting the blade 28 is attached, Is provided. A blade 28 is attached to the spindle 32.

  The spindle 32 is rotated at a high speed of 6000 rpm to 80000 rpm, and index feed in the Y direction and cut feed in the Z direction in FIG. 1 are independently performed by a moving shaft (not shown). Further, the table 18 for sucking and holding the semiconductor wafer W is configured to be ground and fed in the X direction of FIG. 1 by a moving shaft (not shown). By these operations, the processing point (the lowest point) of the blade 28 that rotates at high speed comes into contact with the semiconductor wafer W, and the semiconductor wafer W is diced in the X and Y directions. Thereby, the semiconductor element is cut | disconnected from the semiconductor wafer W for every chip | tip.

  As the blade 28, a metal resin bond blade in which diamond abrasive grains or CBN abrasive grains are electrodeposited with nickel, or a resin mixed with metal powder is used.

  Further, the feed amounts in the X, Y, and Z directions described above can be controlled by controlling the respective X, Y, and Z moving mechanism portions (not shown) by the controller 24. The controller 24 controls the semiconductor wafer W from the semiconductor wafer W while controlling the cutting feed amount in the Z direction in the X direction based on the flatness information of the suction part 34 (see FIG. 2) of the table 18 obtained by an electric micrometer described later. The element can be cut for each chip.

  FIG. 2 is a plan view of the table 18.

  The table 18 has a circular suction unit (wafer chuck) 34 that holds the semiconductor wafer W by suction and a ring-shaped main body 36 that is arranged outside the suction unit 34 and supports the suction unit 34. Is provided.

  The suction portion 34 is configured in a circular shape centered on the central axis 18 </ b> A of the table 18. Moreover, the adsorption | suction part 34 is comprised with the porous member, and is connected to the vacuum source not shown through the vacuum path | route. By driving the vacuum source, air in the vacuum path is sucked, whereby the semiconductor wafer W is vacuum-sucked and held on the upper surface (first surface) of the suction part 34. The suction portion 34 is inspected for clogging by the clogging inspection device of the embodiment.

[Operation of Dicing Device 10]
In the dicing apparatus 10, first, a cassette storing a plurality of semiconductor wafers W is placed on the load port 12 by a transfer device (not shown) or manually. The semiconductor wafer W is taken out from the placed cassette and placed on the upper surface of the table 18 by the transport means 16. Thereafter, the back surface of the semiconductor wafer W is vacuum-sucked and held on the top surface of the suction part 34 of the table 18. As a result, the semiconductor wafer W is held on the table 18.

  The surface of the semiconductor wafer W held on the table 18 is imaged by the camera 26 of FIG. 1, and the position of the cut line formed on the surface of the semiconductor wafer W and the blade 28 is not shown. The table 18 is adjusted and adjusted by each moving mechanism in the X, Y, and θ directions.

  When alignment is completed and dicing is started, the spindle 32 discloses rotation, the blade 28 rotates at a high speed, and cutting fluid is supplied from a nozzle (not shown) to the machining point. In this state, the semiconductor wafer W is processed and fed in the X direction shown in FIG. 1 by a moving shaft (not shown) together with the table 18 and the spindle 32 is lowered to the predetermined height in the Z direction for dicing.

[Measurement of flatness of upper surface of suction part 34]
As a pre-process for inspecting the clogging of the suction part 34, it is preferable to measure the flatness of the upper surface of the suction part 34 and perform the clogging inspection based on the flatness information.

  FIG. 3 is an explanatory diagram using an electric micrometer 40 as a flatness measuring device. The electrical micrometer 40 is attached to the spindle 32 from which the blade 28 has been removed.

  The electric micrometer 40 includes a measuring element 42. The measuring element 42 is brought into contact with the upper surface of the suction portion 34, and a mechanical displacement of the measuring element 42 generated by moving the measuring element 42 in a predetermined direction is converted into an electric quantity. Measure the degree.

  In the plan view of the suction part 34 shown in FIG. 4, a plurality of arrows A in the figure indicate the measurement direction of the probe 42 relative to the upper surface of the suction part 34. That is, the measurement area on the upper surface of the suction unit 34 is divided into a plurality of measurement points in the X direction, and the measuring element 42 is moved a plurality of times in the Y direction (the same direction as the A direction) for each divided measurement area. To measure the flatness. The number of measurement points is arbitrary, but a larger number of points is preferable because flatness is measured more accurately.

  When the measuring element 42 is brought into contact with the upper surface of the suction unit 34, it can be executed by controlling the existing Z moving mechanism unit of the dicing apparatus 10, and the flatness measurement is performed by the existing X of the dicing apparatus 10. , Y can be executed by controlling the moving mechanism.

[Clogging inspection device 50 of suction part 34]
FIG. 5 is an explanatory diagram in which a flow-type air micrometer 52 is applied as the clogging inspection device 50.

  Similarly to the electric micrometer 40, the air micrometer 52 is also attached to the spindle 32 or the moving mechanism portion (spindle support member) 54 of the Z.

  Note that the air micrometer 52 is not limited to a flow rate type, and an air micrometer of another measurement principle such as a back pressure type, a vacuum type, or a flow rate type can be applied as an inspection device.

  The air micrometer 52 adjusts the compressed air supplied from the pump 58 to a constant pressure by the regulator 60, and the measurement of the measurement head 64 through a throttle (not shown) installed inside the A / E converter 62. Compressed air is jetted from the nozzle 66 onto the upper surface of the suction portion 34.

  The A / E converter 62 converts a minute change in the flow rate (pressure) between the nozzle 66 and the throttle into an electric signal by a built-in bellows and a differential transformer, and outputs it to the amplifier 68. The amplifier 68 calculates a flow value based on this electric signal and displays it on the monitor 70. In addition, the threshold value of the flow rate value for determining that clogging has occurred is stored in the amplifier 68, and when the threshold value is exceeded, the fact that clogging has occurred in the suction unit 34 is displayed on the monitor 70. Also good. The pump 58, the regulator 60, the A / E converter 62, and the amplifier 68 constitute a detection unit 56.

  The measuring head 64 has a nozzle 66 that is attached to the moving mechanism portion 54 of the spindle 32 or Z and is spaced apart from the upper surface of the suction portion 34 and injects compressed air toward the upper surface. In FIG. 5, the measuring head 64 is attached to the moving mechanism unit 54.

  The measuring head 64 is relatively moved along the upper surface of the suction portion 34 by the existing X and Y moving mechanism portions (moving portions) 72 and 74 of the dicing apparatus 10.

  The moving mechanism 72 includes a pair of rails 73 extending in the X direction, and the table support member 19 is slidably mounted on the rails 73. Further, the moving mechanism unit 72 includes a drive unit (not shown) that moves the table support member 19 in the X direction along the rail 73.

  The moving mechanism unit 74 includes a pair of rails 75 extending in the Y direction, and a slider 76 is slidably supported on the rails 75. Further, the moving mechanism unit 74 includes a driving unit (not shown) that moves the slider 76 in the Y direction along the rail 75.

  The slider 76 includes a pair of rails 77 extending in the Z direction, and the slider 55 of the moving mechanism unit 54 is slidably supported on the rails 77. Further, the moving mechanism unit 54 includes a drive unit (not shown) that moves the slider 55 in the Z direction along the rail 77.

[Clogging inspection method by inspection device 50]
The measurement head 64 is attached to the movement mechanism unit 54, and the measurement head 64 is moved along the upper surface by the movement mechanism units 72 and 74 while jetting compressed air from the nozzle 66 toward the upper surface of the suction unit 34. The movement trajectory of the measurement head 64 is the same as the movement trajectory of the electric micrometer 40 shown in FIG.

  Then, when the flow rate of the air flowing out from the gap between the nozzle 66 and the upper surface of the suction unit 34 (or the pressure change caused by the flow rate change) is detected by the detection unit 56 and the detected value exceeds the threshold value, The detection unit 56 detects that the suction unit 34 is clogged. Alternatively, the operator visually recognizes the flow rate value displayed on the monitor 70 to detect that the suction part 34 is clogged.

  In other words, the inspection apparatus 50 according to the embodiment can detect clogging of the suction unit 34 only by horizontally moving the measurement head 64 along the upper surface of the suction unit 34 in a non-contact manner with respect to the upper surface of the suction unit 34. it can.

  Therefore, according to the inspection apparatus 50 of the embodiment, compared with the inspection apparatus and inspection method of Patent Document 1 in which clogging is inspected by pressing the lower surface of the measurement head against the adsorption part, the entire surface of the adsorption part 34 is efficiently performed. Inspection can be performed in a short time.

  FIG. 6 shows an example in which the electric micrometer 40 is moved relatively in the direction of the arrow A in one measurement region of the suction portion 34, the flatness of the region is measured, and the measurement region is clogged. It is explanatory drawing which shows having moved the air micrometer 52 to the arrow A direction.

  7 and 8, the flatness measured by the electric micrometer 40 in one measurement region shown in FIG. 6 is indicated by the line B as the displacement in the height direction of the Z axis, and is detected by the air micrometer 52. 6 is a graph showing the air flow rate indicated by line C. 7 and 8 indicate the position of the suction portion 34 in the arrow A direction.

  According to FIG. 7, the air flow rate is constant, and the flow rate is lower than a threshold value that is determined to be clogged. Therefore, it can be determined that no clogging has occurred in the suction portion 34 of the one measurement region.

  According to FIG. 8, since the air flow rate increases at the position a and the air flow rate exceeds the threshold value, it can be determined that clogging occurs at the point a.

  FIG. 9 is an explanatory diagram showing that the measurement head 64 is translated along the upper surface of the suction portion 34 based on the flatness of the upper surface of the suction portion 34 acquired in advance by the electric micrometer 40. That is, it is an explanatory diagram for detecting clogging of the suction portion 34 while moving the measuring head 64 along the movement locus indicated by the line D parallel to the flatness indicated by the line B.

  According to the clogging detection method of FIG. 9, the measurement head 64 moves at a constant distance with respect to the upper surface of the suction unit 34, so that the air micro is caused by an error in flatness of the upper surface of the suction unit 34. The clogging of the suction portion 34 can be detected in a state in which a minute error in the air flow rate of the meter 52 or a minute error in pressure change is removed. Therefore, clogging can be detected more accurately.

  FIG. 10 is a flowchart showing an example of the measurement method shown in FIG.

  First, in the flatness measurement step of S (Step) 10, the electric micrometer 40 of FIG. 3 is moved along the measurement trajectory indicated by the arrow A in FIG. To do.

  Next, in the clogging detection process of S12 of FIG. 10, clogging is performed in S14 while the air micrometer 52 of FIG. 5 is moved along the measurement trajectory of the electric micrometer 40 indicated by the arrow A of FIG. Is detected by the detection unit 56.

  If clogging is detected in S14, the table 18 is cleaned in the table cleaning process in S16. In this cleaning process, when clogging is detected by the detection unit 56, the clogging detection process may be interrupted and the process may be immediately shifted to the cleaning process. May be.

  In the cleaning process, liquid is supplied to the upper surface of the adsorption unit 34, and compressed air is jetted from the lower surface (second surface) opposite to the upper surface toward the upper surface. The compressed air enters the inside of the adsorbing portion 34 that is a porous member from the lower surface of the adsorbing portion 34 and is ejected from the upper surface. At the time of this ejection, the cutting waste and the like clogged in the adsorbing portion 34 are separated from the upper surface together with the liquid. Thereby, since the suction part 34 is washed, it is possible to reliably prevent the occurrence of the suction holding failure of the wafer W due to the clogging of the suction part 34.

  When the table cleaning process is completed, the process returns to the clogging inspection process of S12, the measuring head 64 is moved above the position where clogging is detected, and clogging at that position is inspected. When there are a plurality of clogging positions, the measuring head 64 is sequentially moved to that position to check for clogging.

  The coordinate information of the clogging position detected by the air micrometer 52 is output from the amplifier 68 in FIG. 5 to the controller 24 in FIG. 1 and stored in the controller 24. Then, the controller 24 controls the moving mechanism units 72 and 72 in FIG. 5 to move the measuring head 64 above the clogging position.

  Each step of S12 to S16 is repeated until the clogging is eliminated, and then clogging inspection is terminated when clogging is not detected in all measurement regions.

[Advantages of clogging inspection device 50 provided in dicing device 10]
The measuring head 64 is supported by the spindle 32 or the moving mechanism unit 54 on which the blade 28 of the dicing apparatus 10 is supported, and the moving mechanism units 72 and 74 for moving the suction unit 34 and the spindle 32 of the dicing apparatus 10 in the horizontal direction are inspected. It is used as a moving part of the device 50. In the dicing apparatus 10, the measurement head 64 and the detection unit 56 of the air micrometer for measuring the thickness of the wafer W and setting the depth of cut into the wafer W are combined with a measurement head for detecting clogging. It is used as a detector.

  That is, since the air micrometer for wafer thickness measurement provided in the dicing apparatus 10 can be used together as an apparatus for clogging inspection of the suction unit 34, a dedicated clogging detection apparatus is provided for the dicing apparatus 10. The clogging of the adsorption part 34 can be inspected without installing.

  In the embodiment, the inspection apparatus 50 for inspecting the clogging of the table 18 of the dicing apparatus 10 has been described. However, the present invention is not limited to this. Can be applied.

  W ... Semiconductor wafer, 10 ... Dicing machine, 12 ... Load port, 14 ... Suction pad, 16 ... Conveying means, 18 ... Table, 19 ... Table support member, 20 ... Processing part, 22 ... Spinner, 24 ... Controller, 26 ... Camera, 28 ... Blade, 30 ... Wheel cover, 32 ... Spindle, 34 ... Suction unit, 40 ... Electric micrometer, 42 ... Measuring element, 50 ... Clogging inspection device, 52 ... Air micrometer, 54 ... Moving mechanism unit, 56 ... Detector, 58 ... Pump, 60 ... Regulator, 62 ... A / E converter, 64 ... Measurement head, 66 ... Nozzle, 68 ... Amplifier, 70 ... Monitor, 72 ... Moving mechanism, 73 ... Rail, 74 ... Moving mechanism section, 75 ... rail, 76 ... slider, 77 ... rail

Claims (6)

In a wafer chuck clogging inspection apparatus configured by a porous member, wherein the wafer chuck is held by vacuum suction on a first surface,
A measurement head having a nozzle that is disposed apart from the first surface of the wafer chuck and that injects compressed air toward the first surface;
A moving unit that relatively moves the measuring head along the first surface;
A detection unit for detecting clogging of the wafer chuck based on a flow rate of air flowing out from a gap between the nozzle and the first surface or a pressure change caused by a change in the flow rate;
A clogging inspection device for wafer chucks.   2. The wafer chuck according to claim 1, wherein the moving unit moves the measurement head while maintaining a certain distance from the first surface based on the flatness information of the first surface acquired in advance. Clogging inspection device. The wafer chuck is a wafer chuck of a dicing apparatus for dicing the wafer,
The measuring head is supported by a spindle or a spindle support member on which a blade of the dicing device is supported,
The moving unit is a moving mechanism unit that moves the wafer chuck and the spindle of the dicing apparatus in a horizontal direction,
3. The wafer chuck clogging inspection apparatus according to claim 1, wherein the measurement head and the detection unit are configured as an air micrometer. In a wafer chuck clogging inspection method comprising a porous member, wherein the wafer chuck is held by vacuum suction on the first surface,
The measurement head is disposed away from the first surface of the wafer chuck, and the measurement head is moved to the first surface while jetting compressed air from the nozzle of the measurement head toward the first surface. A wafer chuck that detects clogging of the wafer chuck based on a flow rate of air flowing out of a gap between the nozzle and the first surface or a pressure change caused by a change in the flow rate. Clogging inspection method.   5. The wafer chuck clogging inspection according to claim 4, wherein the measurement head is moved at a certain distance from the first surface based on the flatness information of the first surface acquired in advance. Method.   When clogging of the wafer chuck is detected, liquid is supplied to the first surface of the wafer chuck, and air is supplied from the second surface opposite to the first surface toward the first surface. 6. The wafer chuck clogging inspection method according to claim 4, wherein the wafer chuck is cleaned by spraying.

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