CN216442328U - Grinding spindle coordinate measuring mechanism - Google Patents
Grinding spindle coordinate measuring mechanism Download PDFInfo
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- CN216442328U CN216442328U CN202123074554.0U CN202123074554U CN216442328U CN 216442328 U CN216442328 U CN 216442328U CN 202123074554 U CN202123074554 U CN 202123074554U CN 216442328 U CN216442328 U CN 216442328U
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Abstract
The utility model provides a grinding spindle coordinate measuring mechanism, wherein a circle of diamond grinding wheel seats are arranged at the edge of a grinding spindle, a circle of diamond grinding wheel teeth are arranged on the bottom surface of each grinding wheel seat, the diamond grinding wheel teeth are used for grinding wafers on a vacuum chuck table top, and the measuring mechanism comprises: a standard block gauge for obtaining a reference Z-axis coordinate of the grinding spindle; the detection sensor is fixedly arranged on the fixed seat and positioned below the grinding spindle, and is also provided with a sensor telescopic head which is positioned right below the teeth of the diamond grinding wheel and used for detecting the position data of the diamond grinding wheel of the grinding spindle; and the calculating unit is connected with the detection sensor and is used for calculating and obtaining the current Z-axis coordinate of the grinding spindle. The utility model can quickly determine the new datum Z-axis coordinate data of the grinding spindle, can save time and improve efficiency, and is simple to operate.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to a grinding spindle coordinate measuring mechanism.
Background
Semiconductor silicon wafers are basic raw materials for manufacturing semiconductor devices. The high-purity semiconductor is prepared into a wafer through the procedures of crystal pulling, slicing and the like, the wafer is subjected to a series of semiconductor manufacturing processes to form a tiny circuit structure, and then the wafer is thinned, cut, packaged and tested to form a chip which is widely applied to various electronic equipment, wherein the thinning of the wafer is an important part.
In order to improve the electrical performance of semiconductor chips, it is necessary to thin the back side of the semiconductor wafer, and the device for completing the process is a wafer thinning machine. Wafer thinners typically include a grinding spindle, a vacuum chuck table, and the like. Before the wafer is thinned, the wafer is placed on the table top of the vacuum chuck at the feeding and discharging position, then the table top is moved to the position below the grinding spindle, the grinding spindle descends to grind and thin the wafer, the grinding spindle ascends to the standby position (the distance between the lower edge of the grinding wheel and the table top of the vacuum chuck is 20mm) after grinding is completed, and the table top moves to the feeding and discharging position.
In order to improve the efficiency of thinning the silicon wafer, the grinding spindle is required to be lowered to be as close to the wafer (generally 30-50um) as possible at a high speed (300mm/min) during grinding, then the silicon wafer is thinned at a thinning process speed (50um/min), the precision requirement on the Z-axis coordinate of the grinding spindle (namely the distance value between the lower edge of the diamond grinding wheel on the grinding spindle and the table top of the vacuum chuck) is strict at this time, the grinding spindle and the table top of the vacuum chuck can collide due to error of the coordinate, the diamond grinding wheel on the grinding spindle and the silicon wafer on the table top of the vacuum chuck can be damaged, and the grinding spindle and the table top of the vacuum chuck can be damaged more seriously.
After each grinding, the diamond grinding wheel is damaged, which causes the change of the distance between the lower edge of the diamond grinding wheel and the table surface of the vacuum chuck (the damage of the grinding wheel is different according to the actual grinding quantity and the grinding material, and is normally about 10 um). If the grinding action can be normally and completely finished, the equipment can correct and correct the coordinate of the diamond grinding wheel relative to the table top of the vacuum chuck by knowing the loss of the diamond grinding wheel, and the distance between the lower edge of the diamond grinding wheel and the table top of the vacuum chuck is 20mm when the grinding spindle returns to the standby position each time. However, the coordinate value of the diamond grinding wheel relative to the table surface of the vacuum chuck cannot be corrected if the following matters occur: 1. in the grinding process, the machine alarm and the fault cause that the grinding action is not finished, and the loss of the grinding wheel cannot be known and the coordinate of the grinding spindle cannot be corrected; 2. the diamond grinding wheel is bonded, products cannot be normally ground, and the diamond grinding wheel needs to be dressed by a grinding wheel dresser (the grinding wheel dresser made of silicon carbide is placed on the table top of a vacuum chuck, the diamond grinding wheel and the silicon carbide dresser grind each other, and the surface of the diamond grinding wheel is dressed), for example, only the fact that a grinding spindle is lowered by 200um (the total loss of the diamond grinding wheel and the dresser is 200um) is known, the specific loss of the diamond grinding wheel cannot be clearly known, and the coordinate of the grinding spindle cannot be corrected; 3. after the diamond grinding wheel is replaced, the coordinate value of the lower edge of the new grinding wheel away from the table top of the vacuum chuck cannot be accurately confirmed.
The existing solution to solve the above problems is by manual means: a standard block gauge (generally 1mm) for measurement is placed on a table top of a vacuum chuck, a grinding wheel spindle is lowered to be in contact with the standard block gauge, the Z coordinate of the upper surface of the table top of the vacuum chuck is regarded as 0 at this time, and the coordinate of the lower end face of the grinding wheel is the thickness value of the standard block gauge, namely 1000 um. However, the existing scheme is troublesome to operate, takes time and has higher requirement on the skill level of an operator.
SUMMERY OF THE UTILITY MODEL
The utility model provides a grinding spindle coordinate measuring mechanism for overcoming the defects in the prior art.
The utility model provides a grinding spindle coordinate measuring mechanism, wherein a circle of diamond grinding wheel seats are arranged at the edge of a grinding spindle, a circle of diamond grinding wheel teeth are arranged on the bottom surface of each grinding wheel seat, and the diamond grinding wheel teeth are used for grinding wafers on a table top of a vacuum chuck, and the measuring mechanism is characterized by comprising: the standard block gauge is used for obtaining a reference Z-axis coordinate of the grinding spindle, the reference Z-axis coordinate is a distance value between the lower edge of a diamond grinding wheel tooth on the grinding spindle and a vacuum chuck table top, and the vacuum chuck table top is taken as a Z-axis origin; the detection sensor is fixedly arranged on the fixed seat and positioned below the grinding spindle, and is also provided with a sensor telescopic head, the sensor telescopic head is positioned right below the teeth of the diamond grinding wheel and is used for detecting the position data of the diamond grinding wheel of the grinding spindle, and the position data of the diamond grinding wheel is the distance value between the lower edge of the teeth of the diamond grinding wheel and the table top of the vacuum chuck; and the calculating unit is connected with the detection sensor and calculates and obtains the current Z-axis coordinate of the grinding spindle according to the reference Z-axis coordinate data of the grinding spindle and the position data of the diamond grinding wheel.
Preferably, the detection sensor and the calculation unit are in data transmission through wired or wireless connection.
Preferably, the fixing base and the detection sensor are arranged in the area outside the vacuum chuck table-board.
Preferably, the detection sensor is a contact type displacement sensor.
Preferably, the computing unit is a computer.
The utility model has the following beneficial effects: according to the grinding spindle coordinate measuring mechanism, after the Z-axis coordinate of the grinding spindle, namely the reference Z-axis coordinate, is confirmed for the first time, the position of the diamond grinding wheel is detected by using the detection sensor, and according to the measured data of the sensor and the Z-axis coordinate of the grinding spindle or the difference value of the two, when a new diamond grinding wheel is replaced or the current Z-axis position of the grinding spindle needs to be confirmed, the Z-axis coordinate data of the grinding spindle can be obtained only by using the sensor for measurement, so that the time can be saved, the efficiency can be improved, and the operation is simple.
Drawings
Fig. 1 is a schematic cross-sectional view of a grinding spindle coordinate measuring mechanism of the present invention, with the grinding spindle in a standby position.
Figure 2 is a schematic cross-sectional view of the grinding spindle coordinate measuring mechanism of the present invention with the grinding spindle in the working position.
Fig. 3 is a flowchart of the operation of the grinding spindle coordinate measuring mechanism of the present invention.
Detailed Description
The embodiments of the present invention will be described below with reference to the drawings attached to the specification. It should be noted that the embodiments mentioned in the present description are not exhaustive and do not represent the only embodiments of the present invention. The following examples are given for the purpose of clearly illustrating the utility model and are not intended to limit the embodiments thereof. It will be apparent to those skilled in the art that various changes and modifications can be made in the embodiment without departing from the spirit and scope of the utility model, and it is intended to cover all such changes and modifications as fall within the true spirit and scope of the utility model.
As shown in fig. 1-2, the grinding spindle coordinate measuring mechanism of the present invention, which is used for measuring the Z-axis coordinate of the grinding spindle of the wafer thinning machine, comprises a standard block gauge 11, a detection sensor 6, a fixed seat 8 and a calculating unit 10. The components are explained in detail below.
Fig. 1 is a schematic sectional view of a grinding spindle coordinate measuring mechanism with a grinding spindle in a standby position. Figure 2 is a schematic cross-sectional view of a grinding spindle coordinate measuring mechanism with the grinding spindle in an operating position. The edge of the grinding spindle 1 is provided with a circle of diamond grinding wheel seats 2, a circle of diamond grinding wheel teeth 3 are arranged below the grinding wheel seats 2, and the grinding spindle 1 can move up and down and can rotate around a central shaft so as to grind the upper surface of a wafer bearing table 5, namely a silicon wafer 4 on a vacuum chuck table top 9.
The standard block gauge 11 of the present invention is placed on the vacuum chuck table 9 for obtaining the reference Z-axis coordinate of the grinding spindle 1 and providing it to the calculation unit 10. The detection sensor 6 is fixed on the fixed seat 8 and is positioned below the grinding spindle 1, and the fixed seat 8 and the detection sensor 6 are arranged in the area outside the vacuum chuck table-board 9. The detection sensor 6 may be a contact type displacement sensor. The sensor telescopic head 7 of the detection sensor 6 is arranged right below the diamond grinding wheel teeth 3 and used for detecting position data of the lower edge of the diamond grinding wheel teeth 31.
The calculation unit 10 is connected to the detection sensor 6, receives the detection data of the detection sensor 6, and performs calculation processing based on the reference Z-axis coordinate and the detection data of the detection sensor. The detection sensor 6 and the computation unit 10 can here be connected in a wired or wireless manner for data transmission.
The working process of the grinding spindle measuring mechanism of the present invention will be described in detail with reference to fig. 3. Step a: the reference Z-axis coordinate of the grinding spindle is obtained manually using the standard block gauge 10 and supplied to the calculation unit 10. And the reference Z-axis coordinate is a distance value between the lower edge of a diamond grinding wheel tooth on the grinding spindle and the table top of the vacuum chuck, and the table top of the vacuum chuck is taken as a Z-axis origin. Specifically, a standard block gauge 10 for measurement is placed on a vacuum chuck table top 9, the thickness of the standard block gauge is generally 1mm, the grinding spindle is lowered to the surface of the standard block gauge, so that the lowest end of the grinding spindle, namely the lower edge of the diamond grinding wheel tooth, is in contact with the upper surface of the standard block gauge, and at the moment, the upper surface of the vacuum chuck table top is taken as the Z-axis origin, so that the coordinate of the lowest end of the grinding spindle, namely the lower edge of the diamond grinding wheel tooth (namely the Z-axis coordinate of the grinding spindle) is the thickness value of the standard block gauge, namely 1000 microns.
Step b: the position data of the diamond wheel when the grinding spindle returns to the standby position is obtained by the detection sensor 6. The position data of the diamond grinding wheel is the distance value between the lower edge 31 of the tooth of the diamond grinding wheel and the table top 9 of the vacuum chuck. Specifically, the detection sensor 6 is arranged right below the diamond grinding wheel tooth of the grinding spindle, the detection sensor 6 is fixed by the fixing seat 7, and the sensor telescopic head 7 of the detection sensor 6 measures the distance value between the lower edge 31 of the diamond grinding wheel tooth and the vacuum chuck table top 9. For example, in one embodiment, the detection sensor 6 detects the position data 2000um of the diamond wheel while the grinding spindle is in the standby position.
Step c: the calculation unit 10 calculates and obtains difference data of the reference Z-axis coordinate data of the grinding spindle 1 obtained in step a and the position data of the diamond grinding wheel obtained in step b. When the reference Z-axis coordinate of the grinding spindle is 1000um, the position of the diamond grinding wheel when the grinding spindle returns to the standby position is 2000um, and the difference value of the two is 1000 um. The computing unit 10 may be any device having a computing processing function, such as a computer or the like.
Step d: and when the current Z-axis coordinate of the grinding spindle 1 needs to be obtained under a specific condition, measuring the current position of the diamond grinding wheel by using the detection sensor 6 to obtain the current position data of the diamond grinding wheel. Here, the specific condition is various conditions when the coordinate value of the diamond grinding wheel relative to the vacuum chuck table cannot be corrected, including that a machine alarm occurs during the grinding process, the grinding operation is not completed due to a fault, or the diamond grinding wheel is bonded, and the product cannot be normally ground, or after a new diamond grinding wheel is replaced, the coordinate value of the lower edge of the new grinding wheel away from the vacuum chuck table cannot be accurately confirmed, and the like, in these conditions, the reference Z-axis coordinate of the original grinding spindle is already inaccurate, and therefore a new reference Z-axis coordinate needs to be obtained. In the present invention, the current position of the diamond wheel is measured by the detection sensor 6, and the current position data of the diamond wheel is obtained to be 2500um, for example.
Step e: and c, calculating and obtaining the current Z-axis coordinate of the grinding spindle by the calculating unit 10 according to the current position data of the diamond grinding wheel obtained in the step d and the difference data obtained in the step c. Here, the current position data of the diamond grinding wheel is a distance value between the lower edge of the tooth of the diamond grinding wheel and the table top of the vacuum chuck. Specifically, the difference data is subtracted from the current position data of the diamond grinding wheel, and the current Z-axis coordinate of the grinding spindle is obtained. When the current position data of the diamond grinding wheel is 2500um and the difference data is 1000um, the current Z-axis coordinate of the grinding spindle is 2500-.
It will be apparent to those skilled in the art that the above embodiments are merely illustrative of the present invention and are not to be construed as limiting the present invention, and that changes and modifications to the above described embodiments may be made within the spirit and scope of the present invention as defined in the appended claims.
Claims (5)
1. The utility model provides a grinding main shaft coordinate measuring mechanism, the marginal round of grinding main shaft sets up diamond wheel seat, the bottom surface of wheel seat sets up round diamond wheel tooth, diamond wheel tooth is used for grinding the wafer on the vacuum chuck mesa, its characterized in that, measuring mechanism includes: the standard block gauge is used for obtaining a reference Z-axis coordinate of the grinding spindle, the reference Z-axis coordinate is a distance value between the lower edge of a diamond grinding wheel tooth on the grinding spindle and a vacuum chuck table top, and the vacuum chuck table top is taken as a Z-axis origin; the detection sensor is fixedly arranged on the fixed seat and positioned below the grinding spindle, and is also provided with a sensor telescopic head, the sensor telescopic head is positioned right below the teeth of the diamond grinding wheel and is used for detecting the position data of the diamond grinding wheel of the grinding spindle, and the position data of the diamond grinding wheel is the distance value between the lower edge of the teeth of the diamond grinding wheel and the table top of the vacuum chuck; and the calculating unit is connected with the detection sensor and calculates and obtains the current Z-axis coordinate of the grinding spindle according to the reference Z-axis coordinate data of the grinding spindle and the position data of the diamond grinding wheel.
2. The grinding spindle coordinate measurement mechanism of claim 1, wherein the detection sensor and the calculation unit are in data transmission via a wired or wireless connection.
3. The grinding spindle coordinate measurement mechanism of claim 2, wherein the holder and the detection sensor are disposed in an area outside of the vacuum chuck table.
4. The grinding spindle coordinate measurement mechanism of claim 3, wherein the detection sensor is a contact type displacement sensor.
5. The grinding spindle coordinate measurement mechanism of claim 4, wherein the computing unit is a computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123074554.0U CN216442328U (en) | 2021-12-09 | 2021-12-09 | Grinding spindle coordinate measuring mechanism |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202123074554.0U CN216442328U (en) | 2021-12-09 | 2021-12-09 | Grinding spindle coordinate measuring mechanism |
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| CN216442328U true CN216442328U (en) | 2022-05-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116922281A (en) * | 2023-09-18 | 2023-10-24 | 久智光电子材料科技有限公司 | Double-sided diamond grinding wheel, system and method for processing end face of quartz rod into arc shape |
-
2021
- 2021-12-09 CN CN202123074554.0U patent/CN216442328U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116922281A (en) * | 2023-09-18 | 2023-10-24 | 久智光电子材料科技有限公司 | Double-sided diamond grinding wheel, system and method for processing end face of quartz rod into arc shape |
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