JP2016160282A - Curable resin composition and method for producing the same, and sealing material for optical semiconductor, die bond material for optical semiconductor, and optical semiconductor package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a curable resin composition which has excellent dispersibility of inorganic particles, and has resistance against yellowing by heat, light resistance, transparency and a high refractive index and a method for producing the same; a sealing material for an optical semiconductor; a die bond material for an optical semiconductor; and an optical semiconductor package.SOLUTION: A curable resin composition contains 100 pts.mass of organopolysiloxane (I) which has an organopolysiloxane constitutional unit F1 having an unsaturated bond-containing group and an organopolysiloxane constitutional unit M1 having an Si-OR-containing group, as a unit constituting cyclic organopolysiloxane; and 10-200 pts.mass of inorganic particles. A refractive index of the inorganic particles is 1.8 or more.SELECTED DRAWING: None

Description

  The present invention relates to a curable resin composition and a method for producing the same, and an optical semiconductor sealing material, an optical semiconductor die bond material, and an optical semiconductor package.

  Conventionally, it is known that an epoxy resin composition using an acid anhydride curing agent forms a transparent cured product and is suitable as a sealing material for optical semiconductor elements such as light emitting diodes and photodiodes. .

  For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, and epoxy resin mainly composed of organic resin skeleton epoxy resin such as (3 ′, 4′-epoxycyclohexyl) methyl-3,4-epoxycyclohexanecarboxylate Compositions are used in the field of optical semiconductor devices.

  However, as the performance of optical semiconductors in recent years progresses, more excellent heat resistance, light resistance, etc. are required for sealing materials for optical semiconductor elements. Sufficient characteristics cannot be obtained.

  In view of the above-mentioned problems, various proposals have been made regarding resin compositions for various optical semiconductor applications.

  For example, a thermosetting resin composition for use in an optical semiconductor in which a specific silicone composition is cured by a hydrosilylation reaction has been proposed (see, for example, Patent Document 1).

  Moreover, the technique which applies the specific silicone composition which improved hardness to an optical semiconductor use is proposed (for example, refer patent document 2).

  Furthermore, a technique for applying a methacryloxy group-containing silicone composition to optical semiconductor applications has been proposed (see, for example, Patent Document 3).

Moreover, the technique which controls the mechanical characteristic of hardened | cured material by using the epoxy-group-containing silicone composition which has a specific structure is proposed (for example, refer patent document 4).

  On the other hand, a composition of an organopolysiloxane having a specific structure is disclosed (for example, see Patent Document 5).

  More recently, in order to efficiently use the light generated from the optical semiconductor, it has been required to increase the refractive index of the resin.

JP 2010-1358 A JP 2008-274185 A JP 2008-131209 A Japanese Patent No. 4322949 JP 2011-213868 A

  However, the above-described conventionally proposed technology has the following problems.

  The thermosetting resin composition proposed in Patent Document 1 is excellent in heat-resistant yellowing and light resistance, but has a low refractive index and cannot be suitably used for an optical semiconductor sealing material.

  The silicone composition proposed in Patent Document 2 uses a phenyl group in order to increase the refractive index. However, the phenyl group causes heat-resistant yellowing and light resistance to deteriorate, so that an optical semiconductor is used. It cannot be used suitably for a sealing material application.

  Similar to the thermosetting resin composition proposed in Patent Document 1, the silicone composition proposed in Patent Document 3 is excellent in heat yellowing and light resistance, but has a low refractive index, so that it is an optical semiconductor. It cannot be used suitably for a sealing material application.

  Although the materials proposed in Patent Document 4 are excellent in adhesion, they are all epoxy resin compositions that easily cause yellowing, and thus have not reached a satisfactory level in terms of heat yellowing and light resistance.

  In the case of the composition disclosed in Patent Document 5, although heat-resistant yellowing, light resistance, and hardness of a cured product are excellent, the refractive index is low and it is difficult to adapt to use as an optical semiconductor encapsulant. In addition, in order to increase the refractive index, it has been studied to disperse inorganic particles in an organic resin. However, it is difficult to uniformly disperse inorganic particles in these disclosed general silicone resins, and it is impossible to achieve both transparency and high refractive index.

  As described above, the conventionally proposed resin composition has a well-balanced level required in the field of optical semiconductor applications, etc. for all properties of heat-resistant yellowing, light resistance, transparency, and high refractive index. A cured product satisfying the above has not been obtained.

  The present invention has been made in view of the above problems, and is excellent in dispersibility of inorganic particles, and has all the characteristics of heat yellowing resistance, light resistance, transparency, and high refractive index, particularly required for optical semiconductor applications. A curable resin composition capable of forming a cured product and a method for producing the same, and further, the above-mentioned characteristics are required. An object of the present invention is to provide an optical semiconductor die-bonding material and an optical semiconductor package.

  As a result of intensive studies to solve the above problems, the present inventors have found that the above object can be achieved by a curable resin composition containing an organopolysiloxane having a specific structure and predetermined inorganic particles. It came to complete.

（上記一般式（１）中、Ｒ¹は、置換又は非置換の炭素数１〜１０のアルキル基、置換又は非置換の炭素数３〜１０のシクロアルキル基、置換又は非置換のアリール基、或いは、置換又は非置換のアラルキル基を示し、Ｒ²は、炭素数２〜１０の不飽和結合含有基を示し、Ｘは、炭素数２〜１０の二価の炭化水素基を示し、ａは、前記構成単位Ｆ１の含有割合を表し、１以上の整数を示す。）

（上記一般式（２）中、Ｒ¹及びＲ³は、各々独立して、置換又は非置換の炭素数１〜１０のアルキル基、置換又は非置換の炭素数３〜１０のシクロアルキル基、置換又は非置換のアリール基、或いは、置換又は非置換のアラルキル基を示し、Ｙは、炭素数２〜１０の二価の炭化水素基を示し、ｎは、１〜３の整数を示し、ｂは、前記構成単位Ｍ１の含有割合を表し、１以上の整数を示す。）
〔２〕
前記ｂに対する前記ａの比率（ａ／ｂ）が、０．０１０以上５．０以下である、前項〔１〕に記載の硬化性樹脂組成物。
〔３〕
下記一般式（３）で表される構成単位Ｍ２を、環状オルガノポリシロキサンを構成する単位としてさらに有する、前項〔１〕又は〔２〕に記載の硬化性樹脂組成物。

（上記一般式（３）中、Ｒ¹及びＲ⁴は、各々独立して、置換又は非置換の炭素数１〜１０のアルキル基、置換又は非置換の炭素数３〜１０のシクロアルキル基、置換又は非置換のアリール基、或いは、置換又は非置換のアラルキル基を示し、Ｚは、炭素数２〜１０の二価の炭化水素基を示し、ｃは、前記構成単位Ｍ２の含有割合を表し、１以上の整数を示す。）
〔４〕
前記ｃに対する前記ａの比率（ａ／ｃ）が、０．００１０以上３．０以下である、前項〔３〕に記載の硬化性樹脂組成物。
〔５〕
前記無機粒子の平均粒径が、０．１〜１００ｎｍである、前項〔１〕〜〔４〕のいずれかに記載の硬化性樹脂組成物。
〔６〕
前記無機粒子が、ジルコニア、チタン、亜鉛、鉄、銅、クロム、カドミウム、炭素、タングステン、アンチモン、ニッケル、及び白金からなる群より選ばれる少なくとも１種の元素を含む、前項〔１〕〜〔５〕のいずれかに記載の硬化性樹脂組成物。
〔７〕
前記Ｒ²が、アクリロキシ基又はメタアクリロキシ基である、前項〔１〕〜〔６〕のいずれかに記載の硬化性樹脂組成物。
〔８〕
下記一般式（４）で表される構成単位Ｓを、環状オルガノポリシロキサンを構成する単位としてさらに有する、前項〔１〕〜〔７〕のいずれかに記載の硬化性樹脂組成物。

（上記一般式（４）中、Ｒ¹は、置換又は非置換の炭素数１〜１０のアルキル基、置換又は非置換の炭素数３〜１０のシクロアルキル基、置換又は非置換のアリール基、或いは、置換又は非置換のアラルキル基を示し、ｄは、前記構成単位Ｓの含有割合を表し、１以上の整数を示す。）
〔９〕
前記ａに対する前記ｄの比率（ｄ／ａ）が、０．１０以下である、前項〔８〕に記載の硬化性樹脂組成物。
〔１０〕
前記Ｒ²を含有する構成単位として、前記一般式（１）で表される構成単位Ｆ１のみを含有する、前項〔１〕〜〔９〕のいずれかに記載の硬化性樹脂組成物。
〔１１〕
前記Ｒ¹が、炭素数１〜１０のアルキル基である、前項〔１〕〜〔１０〕のいずれかに記載の硬化性樹脂組成物。
〔１２〕
前記Ｒ¹が、メチル基である、前項〔１〕〜〔１１〕のいずれかに記載の硬化性樹脂組成物。
〔１３〕
前記Ｒ²で表される不飽和結合含有基の官能基当量が、２０〜１００００ｇ／ｍｏｌである、前項〔１〕〜〔１２〕のいずれかに記載の硬化性樹脂組成物。
〔１４〕
前記オルガノポリシロキサン（Ｉ）の重量平均分子量が、５００〜１００００００であり、
前記オルガノポリシロキサン（Ｉ）の２５℃における粘度が、１．０〜１００００００ｍＰａ・ｓである、
前項〔１〕〜〔１３〕のいずれかに記載の硬化性樹脂組成物。
〔１５〕
下記一般式（５）で表される構成単位Ｆ１’と、下記一般式（６）で表される構成単位Ｔ’と、を環状オルガノポリシロキサンを構成する単位として有するオルガノポリシロキサン（ＩＩ）０．１０〜１００質量部をさらに含有する、
前項〔１〕〜〔１４〕のいずれかに記載の硬化性樹脂組成物。

（上記一般式（５）中、Ｒ^1'は、置換又は非置換の炭素数１〜１０のアルキル基、置換又は非置換の炭素数３〜１０のシクロアルキル基、置換又は非置換のアリール基、或いは、置換又は非置換のアラルキル基を示し、Ｒ^2'は、炭素数２〜１０の不飽和結合含有基を示し、Ｘ’は、炭素数２〜１０の二価の炭化水素基を示し、ｅは、前記構成単位Ｆ１’の含有割合を表し、１以上の整数を示す。）

（上記一般式（６）中、Ｒ^1'は、置換又は非置換の炭素数１〜１０のアルキル基、置換又は非置換の炭素数３〜１０のシクロアルキル基、置換又は非置換のアリール基、或いは、置換又は非置換のアラルキル基を示し、ｆは、前記構成単位Ｔ’の含有割合を表し、０以上の整数を示し、ｅ及びｆの合計は、３〜２０の整数を示す。）
〔１６〕
前記Ｒ^1'が、炭素数１〜１０のアルキル基である、前項〔１５〕に記載の硬化性樹脂組成物。
〔１７〕
前記Ｒ^1'が、メチル基である、前項〔１５〕又は〔１６〕に記載の硬化性樹脂組成物。
〔１８〕
前記Ｒ^2'が、アクリロキシ基又はメタアクリロキシ基である、前項〔１５〕〜〔１７〕のいずれか一項に記載のオルガノポリシロキサンを含有する硬化性樹脂組成物。
〔１９〕
前記Ｒ²及び前記Ｒ^2'で表される不飽和結合含有基の総官能基当量が、２０〜１００００ｇ／ｍｏｌである、前項〔１５〕〜〔１８〕のいずれかに記載の硬化性樹脂組成物。
〔２０〕
前記オルガノポリシロキサン（ＩＩ）の重量平均分子量が、５００〜１００００００であり、
前記オルガノポリシロキサン（ＩＩ）の２５℃における粘度が、１．０〜１００００００ｍＰａ・ｓである、
前項〔１５〕〜〔１９〕のいずれかに記載の硬化性樹脂組成物。
〔２１〕
熱ラジカル発生剤をさらに含有し、
該熱ラジカル発生剤の含有量が、前記オルガノポリシロキサン（Ｉ）及び前記オルガノポリシロキサン（ＩＩ）の合計１００質量部に対して、０．５０〜１０質量部である、前項〔１〕〜〔２０〕のいずれかに記載の硬化性樹脂組成物。
〔２２〕
ヒドロシリル化反応触媒をさらに含有し、
該ヒドロシリル化反応触媒の含有量が、前記オルガノポリシロキサン（Ｉ）及び前記オルガノポリシロキサン（ＩＩ）の合計１００質量部に対して、０．００１０質量部以下である、前項〔１〕〜〔２１〕のいずれかに記載の硬化性樹脂組成物。
〔２３〕
下記一般式（７）で表される構成単位を、環状オルガノポリシロキサンを構成する単位として有するハイドロジェンポリシロキサン（ａ）と、

（上記一般式（７）中、Ｒ^1''は、置換又は非置換の炭素数１〜１０のアルキル基、置換又は非置換の炭素数３〜１０のシクロアルキル基、置換又は非置換のアリール基、或いは、置換又は非置換のアラルキル基を示し、ｊは、前記構成単位の含有割合を表し、１以上の整数を示す。）
ケイ素原子に直接結合したビニル基を１個有し、加水分解性基を１個以上含有するオルガノシロキサン（ｂ１）と、
不飽和結合含有基を２個以上有する有機化合物（ｃ）と、を、
ヒドロシリル化反応触媒（ｄ）の存在下で付加反応させて、オルガノポリシロキサンを得る付加反応工程と、
前記オルガノポリシロキサンと、屈折率が、１．８以上である無機粒子（ｅ）と、を混合する混合工程と、を有する、
硬化性樹脂組成物の製造方法。
〔２４〕
前記ハイドロジェンポリシロキサン（ａ）は、下記一般式（８）で表される構成単位を
さらに有する、前項〔２３〕に記載の硬化性樹脂組成物の製造方法。

（上記一般式（８）中、Ｒ^1''は、各々独立して、置換又は非置換の炭素数１〜１０のアルキル基、置換又は非置換の炭素数３〜１０のシクロアルキル基、置換又は非置換のアリール基、或いは、置換又は非置換のアラルキル基を示し、ｋは、前記構成単位の含有割合を表し、０以上の整数を示し、ｊ＋ｋは３〜２０の整数である。）
〔２５〕
前記付加反応工程において、ケイ素原子に直接結合したビニル基を１個有し、加水分解性基を有しないオルガノシロキサン（ｂ２）を、さらに付加反応させる、前項〔２３〕又は〔２４〕に記載の硬化性樹脂組成物の製造方法。
〔２６〕
前項〔１〕〜〔２２〕のいずれかに記載の硬化性樹脂組成物を含む、光半導体用封止材。
〔２７〕
前項〔１〕〜〔２２〕のいずれかに記載の硬化性樹脂組成物を含む、光半導体用ダイボンド材。
〔２８〕
前項〔２６〕に記載の光半導体用封止材を成形した、光半導体パッケージ。 That is, the present invention is as follows.
[1]
Organopolysiloxane (I) 100 having a structural unit F1 represented by the following general formula (1) and a structural unit M1 represented by the following general formula (2) as units constituting the cyclic organopolysiloxane. Part by mass;
Containing 10 to 200 parts by mass of inorganic particles,
The inorganic particles have a refractive index of 1.8 or more.
Curable resin composition.

(In the general formula (1), R ¹ is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, Alternatively, it represents a substituted or unsubstituted aralkyl group, R ² represents an unsaturated bond-containing group having 2 to 10 carbon atoms, X represents a divalent hydrocarbon group having 2 to 10 carbon atoms, and a represents Represents the content ratio of the structural unit F1, and represents an integer of 1 or more.)

(In the general formula (2), R ¹ and R ³ are each independently a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, A substituted or unsubstituted aryl group or a substituted or unsubstituted aralkyl group, Y represents a divalent hydrocarbon group having 2 to 10 carbon atoms, n represents an integer of 1 to 3, and b Represents the content ratio of the structural unit M1 and represents an integer of 1 or more.)
[2]
The curable resin composition according to [1], wherein the ratio of a to b (a / b) is 0.010 or more and 5.0 or less.
[3]
The curable resin composition according to the above item [1] or [2], further comprising a structural unit M2 represented by the following general formula (3) as a unit constituting the cyclic organopolysiloxane.

(In the general formula (3), R ¹ and R ⁴ are each independently a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, A substituted or unsubstituted aryl group or a substituted or unsubstituted aralkyl group; Z represents a divalent hydrocarbon group having 2 to 10 carbon atoms; and c represents a content ratio of the structural unit M2. 1 represents an integer of 1 or more.)
[4]
The curable resin composition according to [3], wherein the ratio of a to c (a / c) is 0.0010 or more and 3.0 or less.
[5]
Curable resin composition in any one of the preceding clauses [1]-[4] whose average particle diameter of the said inorganic particle is 0.1-100 nm.
[6]
[1] to [5], wherein the inorganic particles contain at least one element selected from the group consisting of zirconia, titanium, zinc, iron, copper, chromium, cadmium, carbon, tungsten, antimony, nickel, and platinum. ] The curable resin composition in any one of.
[7]
The curable resin composition according to any one of [1] to [6] above, wherein R ² is an acryloxy group or a methacryloxy group.
[8]
Curable resin composition in any one of the preceding clauses [1]-[7] which has further the structural unit S represented by following General formula (4) as a unit which comprises cyclic organopolysiloxane.

(In the general formula (4), R ¹ is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, Or a substituted or unsubstituted aralkyl group is shown, d represents the content rate of the said structural unit S, and shows an integer greater than or equal to 1.)
[9]
The curable resin composition according to [8], wherein the ratio of d to a (d / a) is 0.10 or less.
[10]
Wherein the structural unit containing R ^2, containing only structural units F1 represented by the general formula (1), the curable resin composition according to any one of items [1] to [9].
[11]
The curable resin composition according to any one of [1] to [10] above, wherein R ¹ is an alkyl group having 1 to 10 carbon atoms.
[12]
The curable resin composition according to any one of [1] to [11], wherein R ¹ is a methyl group.
[13]
The curable resin composition according to any one of [1] to [12] above, wherein a functional group equivalent of the unsaturated bond-containing group represented by R ² is 20 to 10,000 g / mol.
[14]
The organopolysiloxane (I) has a weight average molecular weight of 500 to 1,000,000,
The viscosity of the organopolysiloxane (I) at 25 ° C. is 1.0 to 1000000 mPa · s.
The curable resin composition according to any one of [1] to [13] above.
[15]
Organopolysiloxane (II) 0 having a structural unit F1 ′ represented by the following general formula (5) and a structural unit T ′ represented by the following general formula (6) as units constituting the cyclic organopolysiloxane. Further containing 10 to 100 parts by mass,
The curable resin composition according to any one of [1] to [14] above.

(In the general formula (5), R ^{1 ′} is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, or a substituted or unsubstituted aryl group. Or a substituted or unsubstituted aralkyl group, R ^{2 ′} represents an unsaturated bond-containing group having 2 to 10 carbon atoms, and X ′ represents a divalent hydrocarbon group having 2 to 10 carbon atoms. E represents the content ratio of the structural unit F1 ′ and represents an integer of 1 or more.)

(In the general formula (6), R ^{1 ′} is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, or a substituted or unsubstituted aryl group. Alternatively, it represents a substituted or unsubstituted aralkyl group, f represents the content of the structural unit T ′, represents an integer of 0 or more, and the sum of e and f represents an integer of 3 to 20.)
[16]
The curable resin composition according to [15], wherein R ^{1 ′} is an alkyl group having 1 to 10 carbon atoms.
[17]
The curable resin composition according to [15] or [16] above, wherein R ^{1 ′} is a methyl group.
[18]
The curable resin composition containing the organopolysiloxane according to any one of [15] to [17] above, wherein R ^{2 ′} is an acryloxy group or a methacryloxy group.
[19]
The curable resin composition according to any one of [15] to [18] above, wherein the total functional group equivalent of the unsaturated bond-containing group represented by R ² and R ^{2 ′} is 20 to 10,000 g / mol. object.
[20]
The organopolysiloxane (II) has a weight average molecular weight of 500 to 1,000,000.
The viscosity of the organopolysiloxane (II) at 25 ° C. is 1.0 to 1000000 mPa · s.
The curable resin composition according to any one of [15] to [19] above.
[21]
Further containing a thermal radical generator,
The content of the thermal radical generator is 0.50 to 10 parts by mass relative to 100 parts by mass in total of the organopolysiloxane (I) and the organopolysiloxane (II). 20] The curable resin composition according to any one of the above.
[22]
Further containing a hydrosilylation reaction catalyst,
[1] to [21], wherein the content of the hydrosilylation reaction catalyst is 0.0010 parts by mass or less with respect to 100 parts by mass in total of the organopolysiloxane (I) and the organopolysiloxane (II). ] The curable resin composition in any one of.
[23]
Hydrogen polysiloxane (a) having a structural unit represented by the following general formula (7) as a unit constituting a cyclic organopolysiloxane;

(In the general formula (7), R ^{1 ″} represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, or a substituted or unsubstituted aryl group. A group or a substituted or unsubstituted aralkyl group, and j represents the content of the structural unit and represents an integer of 1 or more.)
An organosiloxane (b1) having one vinyl group directly bonded to a silicon atom and containing one or more hydrolyzable groups;
An organic compound (c) having two or more unsaturated bond-containing groups,
An addition reaction step of obtaining an organopolysiloxane by addition reaction in the presence of a hydrosilylation reaction catalyst (d);
A mixing step of mixing the organopolysiloxane and inorganic particles (e) having a refractive index of 1.8 or more,
A method for producing a curable resin composition.
[24]
The said hydrogen polysiloxane (a) is a manufacturing method of the curable resin composition of the preceding clause [23] which further has a structural unit represented by following General formula (8).

(In the general formula (8), each R ^{1 ″} is independently a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, and a substituted group. Or an unsubstituted aryl group or a substituted or unsubstituted aralkyl group, k represents the content of the structural unit, represents an integer of 0 or more, and j + k is an integer of 3 to 20.)
[25]
In the addition reaction step, the organosiloxane (b2) having one vinyl group directly bonded to a silicon atom and not having a hydrolyzable group is further subjected to addition reaction, according to the above item [23] or [24]. A method for producing a curable resin composition.
[26]
The sealing material for optical semiconductors containing the curable resin composition in any one of said [1]-[22].
[27]
The die-bonding material for optical semiconductors containing the curable resin composition in any one of said clause [1]-[22].
[28]
The optical semiconductor package which shape | molded the sealing material for optical semiconductors of the preceding clause [26].

  According to the present invention, the dispersibility of the inorganic particles is excellent, and all the properties of heat yellowing resistance, light resistance, transparency, and high refractive index satisfy the level required particularly in optical semiconductor applications in a well-balanced manner. And the curable resin composition which can form hardened | cured material, and its manufacturing method can be provided.

  Furthermore, according to the present invention, it is possible to provide an optical semiconductor encapsulant having the above characteristics, a material useful as an optical semiconductor die-bonding material, and the like, and an optical semiconductor package in which the optical semiconductor encapsulant is molded. .

  Hereinafter, a mode for carrying out the present invention (hereinafter referred to as “the present embodiment”) will be described in detail. In addition, this invention is not limited to the following description, It can implement by changing variously within the range of the summary.

[Curable resin composition]
In the curable resin composition of the present embodiment, a structural unit F1 represented by the following general formula (1) and a structural unit M1 represented by the following general formula (2) constitute a cyclic organopolysiloxane. It contains 100 parts by mass of organopolysiloxane (I) as a unit and 10 to 200 parts by mass of inorganic particles, and the refractive index of the inorganic particles is 1.8 or more.

（上記一般式（１）中、Ｒ¹は、置換又は非置換の炭素数１〜１０のアルキル基、置換又は非置換の炭素数３〜１０のシクロアルキル基、置換又は非置換のアリール基、或いは、置換又は非置換のアラルキル基を示し、Ｒ²は、炭素数２〜１０の不飽和結合含有基を示し、Ｘは、炭素数２〜１０の二価の炭化水素基を示し、ａは、前記構成単位Ｆ１の含有割合を表し、１以上の整数を示す。）

（上記一般式（２）中、Ｒ¹及びＲ³は、各々独立して、置換又は非置換の炭素数１〜１０のアルキル基、置換又は非置換の炭素数３〜１０のシクロアルキル基、置換又は非置換のアリール基、或いは、置換又は非置換のアラルキル基を示し、Ｙは、炭素数２〜１０の二価の炭化水素基を示し、ｎは、１〜３の整数を示し、ｂは、前記構成単位Ｍ１の含有割合を表し、１以上の整数を示す。） [Organopolysiloxane (I)]
The organopolysiloxane (I) has a structural unit F1 represented by the following general formula (1) and a structural unit M1 represented by the following general formula (2) as units constituting the cyclic organopolysiloxane. .

(In the general formula (1), R ¹ is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, Alternatively, it represents a substituted or unsubstituted aralkyl group, R ² represents an unsaturated bond-containing group having 2 to 10 carbon atoms, X represents a divalent hydrocarbon group having 2 to 10 carbon atoms, and a represents Represents the content ratio of the structural unit F1, and represents an integer of 1 or more.)

(In the general formula (2), R ¹ and R ³ are each independently a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, A substituted or unsubstituted aryl group or a substituted or unsubstituted aralkyl group, Y represents a divalent hydrocarbon group having 2 to 10 carbon atoms, n represents an integer of 1 to 3, and b Represents the content ratio of the structural unit M1 and represents an integer of 1 or more.)

[Structural unit F1]
The structural unit F1 represented by the general formula (1) is a unit constituting the cyclic organopolysiloxane.

In general formula (1), R ¹ is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, or A substituted or unsubstituted aralkyl group is shown. Such R ¹ is not particularly limited, and examples thereof include a methyl group, an ethyl group, a propyl group, a butyl group, an isobutyl group, a tertiary butyl group, a pentyl group, a neopentyl group, a hexyl group, a cyclopentyl group, a cyclohexyl group, And an alkyl group having 1 to 10 carbon atoms such as an octyl group; a cycloalkyl group having 3 to 10 carbon atoms such as a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cyclooctyl group, and a cyclodecane group; a phenyl group and a tolyl group Aryl groups such as xylyl group, cumenyl group and mesityl group; aralkyl groups such as benzyl group, phenethyl group and phenylpropyl group; or part or all of hydrogen atoms bonded to carbon atoms of these groups And a group substituted with a substituent.

  Although it does not specifically limit as a substituent, For example, a hydroxyl group, a cyano group, a halogen atom, etc. are mentioned. The substituted alkyl group having 1 to 10 carbon atoms is not particularly limited, and examples thereof include a hydroxypropyl group, a cyanoethyl group, a 1-chloropropyl group, and a 3,3,3-trifluoropyr group.

Among these, R ¹ in the general formula (1) is preferably an alkyl group having 1 to 10 carbon atoms, more preferably a methyl group. By using such a group, heat yellowing resistance and light resistance tend to be further improved.

In general formula (1), R ² represents an unsaturated bond-containing group having 2 to 10 carbon atoms. Although it does not specifically limit as a C2-C10 unsaturated bond containing group, For example, a vinyl group, an allyl group, an isopropenyl group, 3-butenyl group, 2-methylpropenyl group, 4-pentenyl group, 5-hexenyl Group, 6-heptenyl group, 7-octenyl group, 8-nonenyl group, 9-decenyl group and other unsaturated chain hydrocarbon groups; cyclohexenyl group, norbornenyl group and other unsaturated cyclic hydrocarbon groups; vinyl ether group, allyl group Examples include ether bond-containing unsaturated hydrocarbon groups such as ether groups; cyclic unsaturated hydrocarbon groups such as cyclohexenyl groups; unsaturated fatty acid ester groups such as acryloxy groups and methacryloxy groups.

Among these, as R ² , acryloxy group represented by the following general formula (9) or methacryloxy group represented by the following general formula (10) (hereinafter, these are collectively referred to as “(meth) acryloxy group”). Is preferred). By using the (meth) acryloxy group, the reactivity of the curable resin composition, that is, the property of being easily heat-cured and promptly reacting, tends to be further improved.

The organopolysiloxane (I) preferably contains only the structural unit F1 represented by the general formula (1) as a structural unit containing R ² . By adopting such a configuration, the refractive index tends to be further improved.

The functional group equivalent of the unsaturated bond-containing group represented by R ² is preferably 20 to 10000 g / mol, more preferably 50 to 9000 g / mol, and still more preferably 100 to 8000 g / mol. When the functional group equivalent of the unsaturated bond-containing group represented by R ² is 20 g / mol or more, the heat-resistant yellowing and light resistance of the cured product of the curable resin composition tend to be further improved. Moreover, when the functional group equivalent of the unsaturated bond-containing group represented by R ² is 10,000 g / mol or less, the refractive index of the curable resin composition tends to be further improved. The functional group equivalent of the unsaturated bond-containing group represented by R ² can be measured by the method described in Examples described later.

In the general formula (1), X represents a divalent hydrocarbon group having 2 to 10 carbon atoms. Examples of the divalent hydrocarbon group having 2 to 10 carbon atoms is not particularly limited, for _{example, - (CH 2) 2 -} , - (CH 2) 3 -, - (CH 2) 4 -, - (CH 2 ) ₅ -,-(CH ₂ ) ₆ -,-(CH ₂ ) ₇ -,-(CH ₂ ) ₈ -,-(CH ₂ ) ₉ -,-(CH ₂ ) _10- , -CH (CH ₃ ) CH ₂ —, —C (CH ₃ ) ₂ — and the like can be mentioned. Among these, — (CH ₂ ) ₂ —, — (CH ₂ ) ₃ —, and — (CH ₂ ) ₄ — are readily available and reactive, that is, they are easily cured by heat and react quickly. It is preferable from the viewpoint of progress.

[Structural unit M1]
The structural unit M1 represented by the general formula (2) is a unit constituting the cyclic organopolysiloxane.

In general formula (2), R ¹ and R ³ are each independently a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted group. An unsubstituted aryl group, or a substituted or unsubstituted aralkyl group is shown. Specifically, as R ¹ and R ³ , the same groups as those exemplified in the general formula (1) can be exemplified. Note that R ¹ in R ¹ and the general formula of the general formula (1) (2) may be the same or different.

Among these, as R < ¹ > and / or R < ³ > in General formula (2), a C1-C10 alkyl group is preferable and a methyl group is more preferable. By using such a group, heat yellowing resistance and light resistance tend to be further improved.

In general formula (2), Y represents a divalent hydrocarbon group having 2 to 10 carbon atoms. Although it does not specifically limit as a C2-C10 bivalent hydrocarbon group, For example, the group similar to the group illustrated by X in the said General formula (1) can be illustrated. Among these, — (CH ₂ ) ₃ —, — (CH ₂ ) ₄ —, and — (CH ₂ ) ₆ — are readily available and reactive, that is, they are easily heat-cured and react quickly. It is preferable from the viewpoint of progress. X in the general formula (1) and Y in the general formula (2) may be the same or different.

  In general formula (2), n is an integer of 1-3. From the viewpoint of improving the adhesion, it is preferably an integer of 2 to 3, more preferably an integer of 3. From the viewpoint of storage stability, it is preferably an integer of 1.

  The ratio of a to b (a / b) is preferably 0.010 or more and 5.0 or less, more preferably 0.020 or more and 4.5 or less, and further preferably 0.050 or more and 4.0 or less. It is. When the ratio (a / b) is 0.010 or more, the ratio of F1 units is relatively increased, and the refractive index of the curable resin composition tends to be further improved. Further, when the ratio (a / b) is 5.0 or less, the ratio of M1 units is relatively increased, and the light resistance tends to be further improved.

（上記一般式（３）中、Ｒ¹及びＲ⁴は、各々独立して、置換又は非置換の炭素数１〜１０のアルキル基、置換又は非置換の炭素数３〜１０のシクロアルキル基、置換又は非置換のアリール基、或いは、置換又は非置換のアラルキル基を示し、Ｚは、炭素数２〜１０の二価の炭化水素基を示し、ｃは、前記構成単位Ｍ２の含有割合を表し、１以上の整数を示す。） [Structural unit M2]
The organopolysiloxane (I) may further have a structural unit M2 represented by the following general formula (3) as a unit constituting the cyclic organopolysiloxane.

(In the general formula (3), R ¹ and R ⁴ are each independently a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, A substituted or unsubstituted aryl group or a substituted or unsubstituted aralkyl group; Z represents a divalent hydrocarbon group having 2 to 10 carbon atoms; and c represents a content ratio of the structural unit M2. 1 represents an integer of 1 or more.)

In general formula (3), R ¹ and R ⁴ each independently represent a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted group, An unsubstituted aryl group, or a substituted or unsubstituted aralkyl group is shown. Specifically, as R ¹ and R ⁴ , the same groups as those exemplified in the general formula (1) can be exemplified. Note that R ¹ in R ¹ and the general formula of the general formula (1) in (3) in may be the same or different.

Among these, in General Formula (3), as R < ¹ > and / or R < ⁴ >, a C1-C10 alkyl group is preferable and a methyl group is more preferable. By using such a group, heat yellowing resistance and light resistance tend to be further improved.

In the general formula (3), Z represents a divalent hydrocarbon group having 2 to 10 carbon atoms. Although it does not specifically limit as a C2-C10 bivalent hydrocarbon group, For example, the group similar to the group illustrated by X in the said General formula (1) can be illustrated. Among these, — (CH ₂ ) ₃ —, — (CH ₂ ) ₄ —, and — (CH ₂ ) ₆ — are readily available and reactive, that is, they are easily heat-cured and react quickly. It is preferable from the viewpoint of progress. X in the general formula (1) and Z in the general formula (3) may be the same or different.

  The ratio of a to c (a / c) is preferably 0.0010 or more and 3.0 or less, more preferably 0.0020 or more and 2.8 or less, and further preferably 0.0050 or more and 2.5 or less. It is. When the ratio (a / c) is 0.0010 or more, the ratio of F1 units is relatively increased, and the refractive index of the curable resin composition tends to be further improved. Further, when the ratio (a / c) is 3.0 or less, the ratio of M2 units is relatively increased, and the storage stability tends to be further improved.

（上記一般式（４）中、Ｒ¹は、置換又は非置換の炭素数１〜１０のアルキル基、置換又は非置換の炭素数３〜１０のシクロアルキル基、置換又は非置換のアリール基、或いは、置換又は非置換のアラルキル基を示し、ｄは、前記構成単位Ｓの含有割合を表し、１以上の整数を示す。） [Structural unit S]
The organopolysiloxane (I) may further have a structural unit S represented by the following general formula (4) as a unit constituting the cyclic organopolysiloxane.

(In the general formula (4), R ¹ is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, Or a substituted or unsubstituted aralkyl group is shown, d represents the content rate of the said structural unit S, and shows an integer greater than or equal to 1.)

In General Formula (4), R ¹ is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, or A substituted or unsubstituted aralkyl group is shown. Specifically, examples of R ¹ include the same groups as those exemplified in the general formula (1). The above general formula (1) R ¹ and the general formula in the (4) R ¹ in may be the same or different.

Among these, in the general formula (4), the R ^1, preferably an alkyl group having 1 to 10 carbon atoms, more preferably a methyl group. By using such a group, heat yellowing resistance and light resistance tend to be further improved.

  The ratio of d to a (d / a) is preferably 0.10 or less, more preferably 0.0001 or more and 0.08 or less, and further preferably 0.001 or more and 0.06 or less. When the ratio (d / a) is 0.0001 or more, heat yellowing tends to be further improved. In addition, when the ratio (d / a) is 0.10 or less, it is possible to suppress SiH from reacting with an unsaturated bond and gelling at the time of distilling off the solvent or at the time of storage. However, it tends to be improved.

  The total functional group equivalent of the unsaturated bond-containing group contained in the organopolysiloxane (I) is preferably 20 to 10000 g / mol, more preferably 50 to 9000 g / mol, and still more preferably 100 to 8000 g. / Mol. When the total functional group equivalent of the unsaturated bond-containing group is 20 g / mol or more, the heat-resistant yellowing and light resistance of the cured product of the curable resin composition tend to be further improved. Moreover, it exists in the tendency which the refractive index of curable resin composition improves more because the total functional group equivalent of an unsaturated bond containing group is 10000 g / mol or less. The total functional group equivalent of the unsaturated bond-containing group can be measured by the method described in Examples described later.

  The weight average molecular weight of the organopolysiloxane (I) is preferably 500 to 1,000,000, more preferably 700 to 800,000, and still more preferably 1,000 to 500,000. When the weight average molecular weight of the organopolysiloxane (I) is 500 or more, the dispersion stability of the inorganic particles tends to be further improved. Moreover, when the weight average molecular weight of organopolysiloxane (I) is 1000000 or less, the hardness of the curable resin composition tends to be further improved. In addition, a weight average molecular weight can be measured by the method as described in an Example.

  The viscosity of the organopolysiloxane (I) at 25 ° C. is preferably 1.0 to 1,000,000 mPa · s, more preferably 5.0 to 500,000 mPa · s, and further preferably 10 to 100,000 mPa · s. When the viscosity of the organopolysiloxane (I) at 25 ° C. is 1.0 mPa · s or more, the dispersion stability of the inorganic particles tends to be further improved. Further, when the viscosity of the organopolysiloxane (I) at 25 ° C. is 1000000 mPa · s or less, the handleability tends to be further improved. The viscosity at 25 ° C. can be measured by the method described in the examples.

[Inorganic particles]
In the present embodiment, the inorganic particles are particles composed of an inorganic simple substance or an inorganic compound. Specifically, it refers to a compound that does not contain hydrocarbons. By using inorganic particles, the refractive index is further improved.

  As an element which comprises an inorganic particle, the periodic table group 1-16 group element is mentioned, for example. Although this element is not specifically limited, the element which belongs to periodic table group 2-14 is preferable. Specific examples thereof include group 2 elements (Mg, Ca, Ba, etc.), group 3 elements (La, Ce, Eu, Ac, Th, etc.), group 4 elements (Ti, Zr, Hf, etc.), group 5 elements ( V, Nb, Ta, etc.), Group 6 elements (Cr, Mo, W, etc.), Group 7 elements (Mn, Re, etc.), Group 8 elements (Fe, Ru, Os, etc.), Group 9 elements (Co, Rh, etc.) Ir, etc.), Group 10 elements (Ni, Pd, Pt, etc.), Group 11 elements (Cu, Ag, Au, etc.), Group 12 elements (Zn, Cd, etc.), Group 13 elements (Al, Ga, In, etc.), And Group 14 elements (Si, Ge, Sn, Pb, etc.).

  Examples of inorganic compounds containing these elements include oxides (including complex oxides), halides (fluorides, chlorides, bromides, iodides), oxo acid salts (nitrates, sulfates, phosphates, borons). Acid salts, perchlorates, carbonates, etc.), compounds formed from negative elements such as carbon monoxide, carbon dioxide and carbon disulfide and the above elements, as well as cyanic acid, cyanate, cyanate, thiocyanate And salts such as acid salts and carbides.

  Among the carbon compounds, those that are exceptionally classified as inorganic compounds include, for example, diamond, ronsdaylite, graphite, graphene, fullerenes (buckminsterfullerene, carbon nanotube, carbon nanohorn, etc.), glassy carbon, and calvin. And carbon allotropes such as amorphous carbon and carbon nanofoam.

  One inorganic particle may contain 1 type (s) or 2 or more types among the said elements. The plural kinds of elements may be present uniformly or unevenly in the particle, and the surface of the particle of a compound of one element may be coated with a compound of another element. These inorganic particles may be used alone or in combination.

Among these, preferable inorganic particles are not particularly limited, but for example, at least selected from the group consisting of zirconia, titanium, zinc, iron, copper, chromium, cadmium, carbon, tungsten, antimony, nickel, and platinum. Contains one element. More specifically, zirconia oxide and zirconia composite oxide such as zirconium oxide and zircon; titanium oxide and titanium composite oxide such as titanium oxide, barium titanate and strontium titanate; zinc, zinc oxide and zinc sulfide Zinc, zinc oxide and zinc composite oxides; iron and iron oxides such as iron, ferric oxide and ferric trioxide; copper such as copper, copper oxide and cuprous chloride, copper oxides and copper compounds Chromium oxides such as chromium oxide; cadmium oxides and cadmium compounds such as cadmium oxide and cadmium sulfide; carbon compounds such as diamond; tungsten compounds; antimony compounds; nickel compounds; Among these, from the viewpoint of availability and stability, zirconia oxides such as zirconium oxide and zircon and zirconia composite oxides, titanium oxides such as titanium oxide, barium titanate, strontium titanate and titanium composite oxides. More preferred. The surface of these particles may be coated with SiO ₂ , Al ₂ O ₃ or the like. These may be used alone or in combination. By using such inorganic particles, the refractive index tends to be further improved.

  The average particle diameter (average value of the outer diameter of the particles) of the inorganic particles (particularly spherical particles) is preferably 0.1 to 100 nm, more preferably 0.5 to 50 nm, and further preferably 1 to 30 nm. is there. When the average particle diameter of the inorganic particles is 100 nm or less, problems such as light scattering tend to hardly occur when the curable resin composition is used as an optical material. Moreover, it exists in the tendency which can suppress that the characteristic intrinsic | native to the substance which comprises an inorganic particle changes because the average particle diameter of an inorganic particle is 0.1 nm or more. The average particle size of the inorganic particles can be measured with a transmission electron microscope.

  The refractive index of the inorganic particles is 1.8 or more from the viewpoint of increasing the refractive index. Moreover, from the viewpoint of the balance between the refractive index design and the film formability, the refractive index of the inorganic particles is preferably 1.8 to 4.5, more preferably 1.8 to 3.0, and still more preferably 1. 8-2.5. The refractive index of the inorganic particles can be measured by the method described in the examples.

The density of the high refractive index inorganic particles is not particularly limited, but is preferably 2.5 to 8 g / cm ³ in order to easily obtain a high refractive index in a molded product or the like. Moreover, from the viewpoint of the balance between the refractive index design and the moldability, the density of the inorganic particles is more preferably 3.5 to 5.5 g / cm ³ .

  The shape and crystal form of the inorganic particles are not particularly limited, and may be various shapes such as, for example, spherical, crystalline, scale-like, columnar, tubular, fibrous, hollow, porous, and beaded. It's okay.

  Content of an inorganic particle is 10-200 mass parts with respect to 100 mass parts of said organopolysiloxane (I), Preferably it is 15-180 mass parts, More preferably, it is 20-160 mass parts. A high refractive index can be obtained when the content of the inorganic particles is 10 parts by mass or more. Moreover, when content of an inorganic particle is 200 mass parts or less, the curable resin composition and hardened | cured material which are excellent in transparency are obtained.

（上記一般式（５）中、Ｒ^1'は、置換又は非置換の炭素数１〜１０のアルキル基、置換又は非置換の炭素数３〜１０のシクロアルキル基、置換又は非置換のアリール基、或いは、置換又は非置換のアラルキル基を示し、Ｒ^2'は、炭素数２〜１０の不飽和結合含有基を示し、Ｘ’は、炭素数２〜１０の二価の炭化水素基を示し、ｅは、前記構成単位Ｆ１’の含有割合を表し、１以上の整数を示す。）

（上記一般式（６）中、Ｒ^1'は、置換又は非置換の炭素数１〜１０のアルキル基、置換又は非置換の炭素数３〜１０のシクロアルキル基、置換又は非置換のアリール基、或いは、置換又は非置換のアラルキル基を示し、ｆは、前記構成単位Ｔ’の含有割合を表し、０以上の整数を示し、ｅ及びｆの合計は、３〜２０の整数を示す。） [Organopolysiloxane (II)]
The curable resin composition of this embodiment is represented by the structural unit F1 ′ represented by the following general formula (5) and the following general formula (6) with respect to 100 parts by mass of the organopolysiloxane (I). In addition, 0.10 to 100 parts by mass of organopolysiloxane (II) having the structural unit T ′ as a unit constituting the cyclic organopolysiloxane may be further contained. By containing organopolysiloxane (II), the crosslinking density of the cured product obtained from the curable resin composition increases, and the refractive index tends to be further improved.

(In the general formula (5), R ^{1 ′} is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, or a substituted or unsubstituted aryl group. Or a substituted or unsubstituted aralkyl group, R ^{2 ′} represents an unsaturated bond-containing group having 2 to 10 carbon atoms, and X ′ represents a divalent hydrocarbon group having 2 to 10 carbon atoms. E represents the content ratio of the structural unit F1 ′ and represents an integer of 1 or more.)

(In the general formula (6), R ^{1 ′} is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, or a substituted or unsubstituted aryl group. Alternatively, it represents a substituted or unsubstituted aralkyl group, f represents the content of the structural unit T ′, represents an integer of 0 or more, and the sum of e and f represents an integer of 3 to 20.)

[Structural unit F1 ′]
The structural unit F1 ′ represented by the general formula (5) is a unit constituting the cyclic organopolysiloxane.

In General Formula (5), R ^{1 ′} represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, or Represents a substituted or unsubstituted aralkyl group. Specifically, as R ^{1 ′} , the same groups as those exemplified in the general formula (1) can be exemplified. In addition, R < ¹ > in the said General formula (1) and R < ^{1 '} > in General formula (5) may be same or different.

Among these, as R < ^{1 '} > in General formula (5), a C1-C10 alkyl group is preferable and a methyl group is more preferable. By using such a group, heat yellowing resistance and light resistance tend to be further improved.

In General Formula (5), R ^{2 ′} represents an unsaturated bond-containing group having 2 to 10 carbon atoms. Examples of the unsaturated bond-containing group having 2 to 10 carbon atoms is not particularly limited, for example, can be exemplified the same groups as exemplified for R ² in formula (1). Among these, a (meth) acryloxy group is preferable. By using the (meth) acryloxy group, the reactivity of the curable resin composition, that is, the property of being easily heat-cured and promptly reacting, tends to be further improved. In addition, R ² in the general formula (1) and R ^{2 ′} in the general formula (5) may be the same or different.

In the general formula (5), X ′ represents a divalent hydrocarbon group having 2 to 10 carbon atoms. Although it does not specifically limit as a C2-C10 bivalent hydrocarbon group, For example, the group similar to the group illustrated by X in the said General formula (1) can be illustrated. Among these, — (CH ₂ ) ₃ —, — (CH ₂ ) ₄ —, and — (CH ₂ ) ₆ — are readily available and reactive, that is, they are easily heat-cured and react quickly. It is preferable from the viewpoint of progress. X in the general formula (1) and X ′ in the general formula (5) may be the same or different.

[Structural unit T ']
The structural unit T ′ represented by the general formula (6) is a unit constituting the cyclic organopolysiloxane.

In General Formula (6), R ^{1 ′} represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, or Represents a substituted or unsubstituted aralkyl group. Specifically, as R ^{1 ′} , the same groups as those exemplified in the general formula (1) can be exemplified. In addition, R < ¹ > in the said General formula (1) and R < ^{1 '} > in General formula (6) may be same or different.

Among these, as R < ^{1 '} > in General formula (6), a C1-C10 alkyl group is preferable and a methyl group is more preferable. By using such a group, heat yellowing resistance and light resistance tend to be further improved.

  The content of the organopolysiloxane (II) is preferably 0.10 to 100 parts by mass, more preferably 1 to 90 parts by mass, further preferably 100 parts by mass of the organopolysiloxane (I). 5 to 80 parts by mass. When the content of the organopolysiloxane (II) is 0.10 parts by mass or more, workability tends to be further improved because the viscosity is lowered. Moreover, it exists in the tendency for light resistance to improve more because content of organopolysiloxane (II) is 100 mass parts or less.

The functional group equivalent of the unsaturated bond-containing group represented by R ^{2 ′} is preferably 20 to 10000 g / mol, more preferably 50 to 9000 g / mol, and still more preferably 100 to 8000 g / mol. When the functional group equivalent of the unsaturated bond-containing group represented by R ^{2 ′} is 20 g / mol or more, the light resistance of the cured product of the curable resin composition tends to be further improved. Moreover, when the functional group equivalent of the unsaturated bond-containing group represented by R ^{2 ′} is 10,000 g / mol or less, the refractive index of the curable resin composition tends to be further improved. In addition, the functional group equivalent of the unsaturated bond-containing group represented by R ^{2 ′} can be measured by the method described in Examples described later.

  The weight average molecular weight of the organopolysiloxane (II) is preferably 500 to 1,000,000, more preferably 700 to 800,000, and still more preferably 1,000 to 500,000. When the weight average molecular weight of the organopolysiloxane (II) is 500 or more, the dispersion stability of the inorganic particles tends to be further improved. Moreover, when the weight average molecular weight of organopolysiloxane (II) is 1,000,000 or less, the refractive index of the curable resin composition tends to be further improved. In addition, a weight average molecular weight can be measured by the method as described in an Example.

  The viscosity of the organopolysiloxane (II) at 25 ° C. is preferably 1.0 to 1,000,000 mPa · s, more preferably 5.0 to 500,000 mPa · s, and further preferably 10 to 100,000 mPa · s. . When the viscosity of the organopolysiloxane (II) at 25 ° C. is 1.0 mPa · s or more, the dispersion stability of the inorganic particles tends to be further improved. Moreover, when the viscosity at 25 ° C. of the organopolysiloxane (II) is 1000000 mPa · s or less, the handleability of the curable resin composition tends to be further improved. The viscosity at 25 ° C. can be measured by the method described in Examples described later.

[Organopolysiloxane (III)]
The curable resin composition of this embodiment is a linear organopolysiloxane (III) 0.10 having an unsaturated bond-containing group having 2 to 10 carbon atoms with respect to 100 parts by mass of the organopolysiloxane (I). You may further contain -100 mass parts. By containing organopolysiloxane (III), the light resistance of the cured product obtained from the curable resin composition tends to be improved.

  The content of the organopolysiloxane (III) is preferably 0.10 to 100 parts by mass, more preferably 1 to 90 parts by mass, further preferably 100 parts by mass of the organopolysiloxane (I). 5 to 80 parts by mass.

In the curable resin composition, the total functional group equivalent of the unsaturated bond-containing group represented by R ² and R ^{2 ′} is preferably 20 to 10,000 g / mol, more preferably 50 to 9000 g / mol, More preferably, it is 100-8000 g / mol. When the total functional group equivalent of the unsaturated bond-containing group represented by R ² and R ^{2 ′} is 20 g / mol or more, heat-resistant yellowing and light resistance of the cured product of the curable resin composition tend to be further improved. It is in. Moreover, when the total functional group equivalent of the unsaturated bond-containing group represented by R ² and R ^{2 ′} is 10,000 g / mol or less, the refractive index of the curable resin composition tends to be further improved. In addition, the total functional group equivalent of the unsaturated bond-containing group represented by R ² and R ^{2 ′} can be measured by the method described in Examples described later.

  The combined weight average molecular weight of the organopolysiloxane (I) and the organopolysiloxane (II) is preferably 500 to 1,000,000, more preferably 700 to 800,000, and still more preferably 1,000 to 500,000. When the weight average molecular weight of the organopolysiloxane (I) and the organopolysiloxane (II) is 500 or more, the dispersion stability of the inorganic particles tends to be further improved. Further, when the weight average molecular weight of the organopolysiloxane (I) and the organopolysiloxane (II) is 1,000,000 or less, the refractive index of the curable resin composition tends to be further improved. In addition, a weight average molecular weight can be measured by the method as described in an Example.

  The viscosity at 25 ° C. of the organopolysiloxane (I) and the organopolysiloxane (II) is preferably 1.0 to 1000000 mPa · s, more preferably 5.0 to 500000 mPa · s, Preferably it is 10-100,000 mPa * s. When the viscosity at 25 ° C. in which the organopolysiloxane (I) and the organopolysiloxane (II) are combined is 1.0 mPa · s or more, the dispersion stability of the inorganic particles tends to be further improved. Moreover, when the viscosity at 25 ° C. of the organopolysiloxane (I) and the organopolysiloxane (II) is 1,000,000 mPa · s or less, the handleability of the curable resin composition tends to be further improved. The viscosity at 25 ° C. can be measured by the method described in Examples described later.

[Thermal radical generator]
The curable resin composition of this embodiment may further have a thermal radical generator. The thermal radical generator is not particularly limited as long as unsaturated bonds in the unsaturated bond-containing group are radically polymerized by heat, and examples thereof include benzoyl peroxide, lauryl peroxide, t-butyl peroxide, and cumene. And organic peroxides such as hydroperoxide; azo compounds such as azobisisobutyronitrile. More specifically, 2,2-azobis (4-methoxy-2,4-dimethylvaleronitrile) (V-70, manufactured by Wako Pure Chemical Industries), 2,2′-azobis (2,4-dimethylvaleronitrile) (V-65, manufactured by Wako Pure Chemical Industries), 2,2'-azobisisobutyronitrile (V-60, manufactured by Wako Pure Chemical Industries), and 2,2'-azobis (2-methylbutyronitrile) (V- 59, manufactured by Wako Pure Chemical Industries, Ltd.); octanoyl peroxide (Perroyl O, manufactured by Nippon Oil & Fats), lauroyl peroxide (Perroyl L, manufactured by Nippon Oil & Fats), stearoyl peroxide (Perroyl S, manufactured by Nippon Oil & Fats), SC Cynic acid peroxide (Perroyl SA, manufactured by Nippon Oil & Fats), Benzoyl peroxide (Niper BW, manufactured by Nippon Oil & Fats), Isobutyryl peroxide (Perroyl IB, Nippon Oil) Diacyl peroxides such as 2,4-dichlorobenzoyl peroxide (Niper CS, manufactured by NOF Corporation) and 3,5,5-trimethylhexanoyl peroxide (Perroyl 355, manufactured by NOF Corporation); -Propyl peroxydicarbonate (paroyl NPP-50M, manufactured by NOF Corporation), diisopropyl peroxydicarbonate (paroyl IPP-50, manufactured by NOF Corporation), bis (4-t-butylcyclohexyl) peroxydicarbonate (paroyl TCP, Nippon Oil & Fats), di-2-ethoxyethyl peroxydicarbonate (Perroyl EEP, manufactured by Nippon Oil & Fats), di-2-ethoxyhexyl peroxydicarbonate (Perroyl OPP, manufactured by Nippon Oil & Fats), di-2-methoxybutyl per Oxydicarbonate (Parroyl MB Peroxydicarbonates such as di (3-methyl-3-methoxybutyl) peroxydicarbonate (Perroyl SOP, manufactured by Nippon Oil &Fats); t-butyl hydroperoxide (perbutyl H-69, Hydroperoxides such as Nippon Oil & Fats) and 1,1,3,3-tetramethylbutyl hydroperoxide (Perocta H, manufactured by Nippon Oil &Fats); Di-t-butyl peroxide (Perbutyl D, manufactured by Nippon Oil & Fats) ), 2,5-dimethyl-2,5-bis (t-butylperoxy) hexane (Perhexa 25B, manufactured by NOF Corporation); α, α′-bis (neodecanoylperoxy) diisopropyl Benzene (Dyper ND, manufactured by Nippon Oil & Fats), Cumylperoxyneodecanoate (Park Mill ND, manufactured by Nippon Oil & Fats), , 1,3,3-tetramethylbutylperoxyneodecanoate (Perocta ND, manufactured by NOF Corporation), 1-cyclohexyl-1-methylethylperoxyneodecanoate (PercycloND, manufactured by NOF Corporation), t- Hexyl peroxyneodecanoate (perhexyl ND, manufactured by NOF Corporation), t-butyl peroxyneodecanoate (perbutyl ND, manufactured by NOF Corporation), t-hexyl peroxypivalate (perhexyl PV, manufactured by NOF Corporation), t-butyl peroxypivalate (perbutyl PV, manufactured by NOF Corporation), 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate (Perocta O, manufactured by NOF Corporation) 2,5-dimethyl -2,5-bis (2-ethylhexanoylperoxy) hexane (Perhexa 250, manufactured by NOF Corporation), 1- Chlohexyl-1-methylethylperoxy-2-ethylhexanoate (Percyclo O, manufactured by NOF Corporation), t-hexylperoxy 2-ethylhexanoate (Perhexyl O, manufactured by NOF Corporation), t-butylperoxy-2 -Ethylhexanoate (perbutyl O, manufactured by NOF Corporation), t-butyl peroxyisobutyrate (perbutyl IB, manufactured by NOF Corporation), t-hexyl peroxyisopropyl monocarbonate (perhexyl I, manufactured by NOF Corporation), and t -Butyl peroxymaleic acid (Perbutyl MA, manufactured by NOF Corporation), t-amylperoxy 2-ethylhexanoate (Trigonox 121, manufactured by Kayaku Akzo), t-amylperoxy 3,5,5-trimethylhexa Peroxyesters such as Noate (Kaya Ester AN, Kayaku Akzo) Organic peroxides, etc.

  A thermal radical generator may be used individually by 1 type, or may use 2 or more types together.

  The content of the thermal radical generator is preferably 0.50 to 10 parts by mass, more preferably 1.0 to 100 parts by mass in total of the organopolysiloxane (I) and organopolysiloxane (II). It is -8.0 mass parts, More preferably, it is 2.0-5.0 mass parts. When the content of the thermal radical generator is 0.5 parts by mass or more, the curability tends to be further improved. Moreover, it exists in the tendency which heat-resistant yellowing improves more because content of a thermal radical generator is 10 mass parts or less. In addition, when curable resin composition does not contain organopolysiloxane (II), content of a thermal radical generator becomes a region with respect to 100 mass parts of said organopolysiloxane (I).

[Hydrosilylation catalyst]
The curable resin composition of this embodiment may further contain a hydrosilylation reaction catalyst. Examples of the hydrosilylation reaction catalyst include those described later.

  The content of the hydrosilylation reaction catalyst is preferably 0.0010 parts by mass or less, more preferably 0 to 0.0. Part by mass, with respect to 100 parts by mass in total of the organopolysiloxane (I) and the organopolysiloxane (II). 0,080,000 parts by mass, more preferably 0-0.00050 parts by mass. When the content of the hydrosilylation reaction catalyst is within the above range, heat-resistant yellowing and light resistance tend to be further improved. In addition, when curable resin composition does not contain organopolysiloxane (II), content of a hydrosilylation reaction catalyst becomes a region with respect to 100 mass parts of said organopolysiloxane (I).

[Other ingredients]
In the curable resin composition of this embodiment, for the purpose of accelerating curability with respect to thermal energy (improvement of sensitivity) as required, (meth) acrylate monomers, oligomers, vinyl (meth) acrylate, etc. A radical polymerizable compound or the like may be added.

  In addition, addition of deterioration inhibitors, mold release agents, diluents, antioxidants, thermal stabilizers, flame retardants, plasticizers, surfactants, and the like within the quantitative and qualitative range not departing from the scope of the present invention An agent can be blended.

（上記一般式（７）中、Ｒ^1''は、置換又は非置換の炭素数１〜１０のアルキル基、置換又は非置換の炭素数３〜１０のシクロアルキル基、置換又は非置換のアリール基、或いは、置換又は非置換のアラルキル基を示し、ｊは、前記構成単位の含有割合を表し、１以上の整数を示す。）
ケイ素原子に直接結合したビニル基を１個有し、加水分解性基を１個以上含有するオルガノシロキサン（ｂ１）と、
不飽和結合含有基を２個以上有する有機化合物（ｃ）と、を、
ヒドロシリル化反応触媒（ｄ）の存在下で付加反応させて、オルガノポリシロキサンを得る付加反応工程と、
前記オルガノポリシロキサンと、屈折率が、１．８以上である無機粒子（ｅ）と、を混合する混合工程と、を有する。 [Method for producing curable resin composition]
The method for producing the curable resin composition of the present embodiment is as follows.
Hydrogen polysiloxane (a) having a structural unit represented by the following general formula (7) as a unit constituting a cyclic organopolysiloxane;

(In the general formula (7), R ^{1 ″} represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, or a substituted or unsubstituted aryl group. A group or a substituted or unsubstituted aralkyl group, and j represents the content of the structural unit and represents an integer of 1 or more.)
An organosiloxane (b1) having one vinyl group directly bonded to a silicon atom and containing one or more hydrolyzable groups;
An organic compound (c) having two or more unsaturated bond-containing groups,
An addition reaction step of obtaining an organopolysiloxane by addition reaction in the presence of a hydrosilylation reaction catalyst (d);
A mixing step of mixing the organopolysiloxane and the inorganic particles (e) having a refractive index of 1.8 or more.

[Addition reaction step]
[Hydrogen polysiloxane (a)]
The hydrogen polysiloxane (a) is a compound having the structural unit represented by the general formula (7) as a unit constituting the cyclic organopolysiloxane.

In General Formula (7), R ^{1 ″} represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, Or a substituted or unsubstituted aralkyl group is shown. Specifically, as R ^{1 ″,} the same groups as those exemplified in the general formula (1) can be exemplified.

Among these, as R < ^{1 ''} in General formula (7), a C1-C10 alkyl group is preferable and a methyl group is more preferable. By using such a group, heat yellowing resistance and light resistance tend to be further improved.

（上記一般式（８）中、Ｒ^1''は、各々独立して、置換又は非置換の炭素数１〜１０のアルキル基、置換又は非置換の炭素数３〜１０のシクロアルキル基、置換又は非置換のアリール基、或いは、置換又は非置換のアラルキル基を示し、ｋは、前記構成単位の含有割合を表し、０以上の整数を示し、ｊ＋ｋは３〜２０の整数である。） The hydrogen polysiloxane (a) preferably further has a structural unit represented by the following general formula (8). By further having a structural unit represented by the following general formula (8), heat-resistant yellowing and light resistance tend to be further improved.

(In the general formula (8), each R ^{1 ″} is independently a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, and a substituted group. Or an unsubstituted aryl group or a substituted or unsubstituted aralkyl group, k represents the content of the structural unit, represents an integer of 0 or more, and j + k is an integer of 3 to 20.)

In addition, the hydrogen polysiloxane (a) is not particularly limited, and examples thereof include compounds represented by the following general formulas (11) to (13). Hydrogen polysiloxane (a) may be used individually by 1 type, or may use 2 or more types together.

（上記一般式（１４）中、Ｒ^3''は、各々独立して、置換又は非置換の炭素数１〜１０のアルキル基、置換又は非置換の炭素数３〜１０のシクロアルキル基、置換又は非置換のアリール基、及び置換又は非置換のアラルキル基からなる群より選ばれるいずれかを示し、Ｙ’’は、炭素数０〜８の二価の炭化水素基を示し、ｎは１〜３の整数である。） [Organosiloxane (b1)]
Organosiloxane (b1) is a compound having one vinyl group directly bonded to a silicon atom and containing one or more hydrolyzable groups. The organosiloxane (b1) is not particularly limited, and examples thereof include compounds represented by the following general formula (14). The organosiloxane (b1) can also include an organopolysiloxane.

(In the general formula (14), each R ^{3 ″} is independently a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, or a substituted group. Or any one selected from the group consisting of an unsubstituted aryl group and a substituted or unsubstituted aralkyl group, Y ″ represents a divalent hydrocarbon group having 0 to 8 carbon atoms, and n represents 1 to 1 It is an integer of 3.)

  In addition, although it does not specifically limit as a hydrolysable group, For example, a methoxy group and an ethoxy group are mentioned.

  Organosiloxane (b1) may be used alone or in combination of two or more.

（上記一般式（１５）中、Ｒ^4''は、各々独立して、置換又は非置換の炭素数１〜１０のアルキル基、置換又は非置換の炭素数３〜１０のシクロアルキル基、置換又は非置換のアリール基、及び置換又は非置換のアラルキル基からなる群より選ばれるいずれかを示し、Ｚ’’は、炭素数０〜８の二価の炭化水素基を示す。 [Organosiloxane (b2)]
In the addition reaction step, an organosiloxane (b2) having one vinyl group directly bonded to a silicon atom and having no hydrolyzable group may be further subjected to an addition reaction. Although it does not specifically limit as organosiloxane (b2), For example, the compound represented by following General formula (15) is mentioned. The organosiloxane (b2) can also include an organopolysiloxane.

(In the general formula (15), each R ^{4 ″} is independently a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, or a substituted group. Or any one selected from the group consisting of an unsubstituted aryl group and a substituted or unsubstituted aralkyl group, and Z ″ represents a divalent hydrocarbon group having 0 to 8 carbon atoms.

  Organosiloxane (b2) may be used individually by 1 type, or may use 2 or more types together.

（上記一般式（１６）中、Ｒ^2''は炭素数２〜１０の不飽和結合含有基を示し、Ｘ’’は、炭素数０〜８の二価の炭化水素基を示す。） [Organic compound (c)]
The organic compound (c) is a compound having two or more unsaturated bond-containing groups. Although it does not specifically limit as an organic compound (c), For example, the compound represented by following General formula (16) is mentioned.

(In the general formula (16), R ^{2 ″} represents an unsaturated bond-containing group having 2 to 10 carbon atoms, and X ″ represents a divalent hydrocarbon group having 0 to 8 carbon atoms.)

  In particular, X ″ is preferably a divalent hydrocarbon group having 1 to 4 carbon atoms. As a result, the hydrosilylation reaction tends to proceed more efficiently. In addition, when X ″ is a divalent hydrocarbon group having 1 to 4 carbon atoms, the boiling point of the organic compound (c) decreases, and the excess organic compound (c) is more easily distilled off from the reaction solution. It tends to be possible.

  An organic compound (c) may be used individually by 1 type, or may use 2 or more types together.

  In the addition reaction step, the amount of use (molar amount) of the organic compound (c) is determined from the viewpoint of reacting to the end without leaving any SiH groups, and the amount of SiH groups in the hydrogen polysiloxane (a), as well as organosiloxane ( It is preferable to add so that it may become larger than the sum of the molar amount of the vinyl group of b1) and organosiloxane (b2).

Specifically, the usage-amount ratio of the organic compound (c) represented by a following formula becomes like this. Preferably it is 1.2-3.0, More preferably, it is 1.3-2.5, More preferably 1.4-2.0. When the amount of the organic compound (c) used is 1.2 or more, the reactivity tends to be further improved. Moreover, it exists in the tendency which can reduce the load of refinement | purification because the usage-amount ratio of an organic compound (c) is 3.0 or less.
Use amount ratio of organic compound (c) = [molar amount of organic compound (c)] / [(molar amount of SiH group of hydrogen polysiloxane (a)) − (molar amount of vinyl group of organosiloxane (b1)) + Mole amount of vinyl group of organosiloxane (b2)]

[Hydrosilylation reaction catalyst (d)]
The hydrosilylation reaction catalyst (d) is not particularly limited, and any conventionally known catalyst can be used. More specifically, platinum-based catalysts such as platinum black, secondary platinum chloride, chloroplatinic acid, reaction products of chloroplatinic acid and monohydric alcohol, complexes of chloroplatinic acid and olefins, platinum bisacetoacetate, etc. A platinum group metal catalyst other than the platinum catalyst, such as a palladium catalyst and a rhodium catalyst; The hydrosilylation reaction catalyst (d) may be used alone or in combination of two or more.

  The amount of the hydrosilylation reaction catalyst (d) used is preferably 0.010 to 100 ppm, more preferably 0.020 to 50 ppm, and still more preferably based on 100 parts by mass of the product organopolysiloxane. 0.050 to 20 ppm. When the amount of the hydrosilylation reaction catalyst (d) used is 0.010 ppm or more, a sufficient catalytic effect tends to be obtained. Moreover, it exists in the tendency for cost to fall more because the usage-amount of a hydrosilylation reaction catalyst (d) is 100 ppm or less.

The addition reaction temperature is preferably room temperature to 110 ° C, more preferably 40 ° C to 100 ° C, and further preferably 50 to 90 ° C. When R ² is a (meth) acryloxy group, the addition reaction temperature is preferably 40 ° C to 100 ° C. When the addition reaction temperature is within the above range, gelation derived from the reaction of the unsaturated bond-containing group tends to be further suppressed.

〔solvent〕
You may perform the said addition reaction in a solvent as needed. The solvent is not particularly limited. For example, aromatic solvents such as toluene and xylene; aliphatic solvents such as hexane and octane; ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone; esters such as ethyl acetate and isobutyl acetate Solvents; ether solvents such as diisopropyl ether, 1,4-dioxane, diethyl ether, tetrahydrofuran, ethylene glycol dimethyl ether, ethylene glycol diethyl ether and propylene glycol monomethyl ether acetate; and alcohol solvents such as isopropanol; or a mixture thereof A solvent is mentioned.

The atmosphere for the addition reaction may be either air or inert gas. Among these, in an inert gas such as nitrogen, argon, and helium is preferable in that the resulting organopolysiloxane is less colored. Further, when R ² is a (meth) acryloxy group, a small amount of oxygen can be introduced for the purpose of preventing the polymerization reaction of the (meth) acryloxy group.

Further, when R ² is a (meth) acryloxy group, for the purpose of preventing the polymerization reaction of the (meth) acryloxy group, the reaction system includes phenothiazine, a hindered phenol compound, an amine compound, and a quinone compound. It is preferable to add a polymerization inhibitor. The type and amount of such a polymerization inhibitor are particularly limited as long as the addition of them can prevent the polymerization reaction of (meth) acryloxy groups, that is, acryloxy groups or methacryloxy groups, without hindering the progress of the hydrosilylation reaction. Not.

[Catalyst removal step]
The method for producing an organopolysiloxane may have a catalyst removal step of removing the hydrosilylation reaction catalyst (d) from the organopolysiloxane after the addition reaction. Although it does not specifically limit as catalyst removal, For example, the method of removing with adsorption materials, such as washing with water and activated alumina, activated carbon, is mentioned.

  The residual amount (content) of the hydrosilylation reaction catalyst (d) is preferably 0 to 0.0010 parts by mass, more preferably 0 to 0.00080 parts with respect to 100 parts by mass of the product organopolysiloxane. It is a mass part, More preferably, it is 0-0.00050 mass part. When the residual amount of the hydrosilylation reaction catalyst (d) is 0.0010 parts by mass or less, heat yellowing resistance and light resistance tend to be further improved. The residual amount of the hydrosilylation reaction catalyst (d) can be measured by analyzing the curable resin composition.

  The surplus organic compound (c) and the solvent that can be used as necessary may be distilled off under heating and / or reduced pressure.

  In addition, in the said manufacturing method, by adjusting the usage-amount of hydrogen polysiloxane (a), organosiloxane (b1), organosiloxane (b2), and organic compound (c), organopolysiloxane (I), Organopolysiloxane (II) can be produced simultaneously. Moreover, the method of mixing organopolysiloxane (I) manufactured with the manufacturing method of the said organopolysiloxane, and organopolysiloxane (II) manufactured separately is also mentioned.

[Mixing process]
The mixing step is a step of mixing the obtained organopolysiloxane and inorganic particles. By this step, inorganic particles are dispersed in the curable resin composition. The mixing method is not particularly limited, but is a wet method in which a solution containing an organopolysiloxane and a solution containing inorganic particles are mixed to remove the solvent, a bead mill dispersion method, a jet mill dispersion method, a ball mill dispersion method, an ultrasonic wave. Examples thereof include a homogenizer dispersion method and a paint shaker dispersion method. Among these, from the viewpoint of dispersibility and simplicity, a wet method, a bead mill dispersion method, and a jet mill dispersion method are more preferable.

[Use]
The curable resin composition of the present embodiment is liquid or solid before curing, and can be cured by applying a predetermined treatment. For example, a cured product can be obtained by heat treatment.
The curing temperature is usually 100 to 250 ° C.

  The curing method and molding method of the curable resin composition are not particularly limited. When the curable resin composition is liquid, it can be molded by, for example, casting, low-pressure transfer molding, potting, dipping, pressure molding, and injection molding.

  When the curable resin composition is solid, it can be molded by heating and curing under pressure using a press machine, a low-pressure transfer molding machine or the like.

  The curable resin composition of this embodiment is suitably used for optical semiconductor device applications such as optical semiconductor encapsulants, die bonding materials for optical semiconductors such as die bonding paste, coating materials covering the periphery of chips, and lens materials. can do.

  In this case, examples of the optical semiconductor include an LED lamp, a chip LED, a semiconductor laser, a photocoupler, and a photodiode.

  Further, the optical semiconductor device using the cured product of the curable resin composition of the present embodiment as a sealing material for the optical semiconductor includes a housing material, a silicon chip provided in the housing, It is the hardened | cured material of curable resin composition, and has the structure which comprises the sealing material which seals the said silicon chip.

  The material of the housing material is not particularly limited, and examples thereof include aromatic polyamides such as polyphthalamide, engineering plastics such as 66 nylon, and ceramics. In the case of polyphthalamide, particularly high adhesion is exhibited. The

  It is preferable to add glass fiber to the housing material because the adhesive strength is increased. The glass fiber content is preferably 5 to 40% by mass, more preferably 10 to 30% by mass, and particularly preferably 15 to 25% by mass with respect to the mass of the housing material. When the glass fiber content is within these numerical ranges, the adhesion tends to be further improved.

  The curable resin composition of the present embodiment utilizes the heat-resistant yellowing property and high transparency to provide spectacle lenses, optical device lenses, CD and DVD pickup lenses, automobile headlamp lenses, projector lenses, and the like. It is also suitably used for various optical members such as lens materials, optical fibers, optical waveguides, optical filters, optical adhesives, optical disk substrates, display substrates, and curable resins for nanoimprinting.

  Moreover, the curable resin composition of this embodiment can also be used as a sealing material for optical semiconductors, and the cured product is suitable as a transparent resin for semiconductor packages. The optical semiconductor package of the present embodiment is obtained by molding the optical semiconductor sealing material.

  The optical semiconductor encapsulant is formed by directly applying an application material such as a dispenser or a spinner to an object to be processed with a primer after the plasma treatment. The applied optical semiconductor sealing material may be cured or cured using a molding machine or the like.

  Hereinafter, the present invention will be described with reference to specific examples and comparative examples, but the present invention is not limited to the following examples.

  In Examples and Comparative Examples, measurement and evaluation were performed by the following methods.

<Calculation of reaction rate of SiH>
Deuterated chloroform was added to 0.05 g of the solution before the start of the reaction and the sampled reaction solution (the reaction solution in the synthesis of organopolysiloxane in the examples and comparative examples described later and 72 hours after the start of the reaction). Each sample was dissolved in 1 g of a solvent to prepare a measurement sample. This measurement sample was subjected to ¹ H NMR measurement using α-400 (400 MHz) manufactured by JASCO Corporation, and the obtained results were analyzed.

The reaction rate of SiH was calculated according to the following formula by determining the area ratio between the 0.2 ppm peak derived from Si—CH ₃ before the reaction and the 4.6 ppm peak derived from SiH.
SiH reaction rate (%) = [((X1-Y1) / X1] × 100
X1: Ratio of peak area before reaction: (peak area of SiH before reaction) / (peak area of Si—CH ₃ before reaction)
Y1: Peak area ratio after reaction: (SiH peak area after reaction) / (peak area of Si—CH ₃ after reaction)

<Identification of molecular structure>
A solution obtained by dissolving 20 mg of each of the organopolysiloxanes (A1) to (A2) and (B1) prepared in Examples and Comparative Examples described later in 1 g of deuterated chloroform solvent was used as a measurement sample. ¹ H NMR measurement was performed on this measurement sample using α-400 (400 MHz) manufactured by JASCO Corporation, and the obtained results were analyzed.

In addition, each solution obtained by dissolving 0.3 g of each sample in 1 g of deuterated chloroform solvent was used as a measurement sample. The measurement of ¹³ C NMR of this measurement sample was performed using α-400 (400 MHz) manufactured by JASCO Corporation at an integration number of 20000 times, and the obtained results were analyzed.

Further, 0.15 g of each sample was dissolved in 1 g of deuterated chloroform solvent, and a solution in which 8 mass% of chromium (III) acetylacetonate (Cr (acac) ₃ ) was added to the sample was used as a measurement sample. did. The measurement of ²⁹ Si NMR of this measurement sample was performed using α-400 (400 MHz) manufactured by JASCO Corporation at a total number of 4000 times, and the obtained results were analyzed.

^The results obtained by ¹ H NMR, ¹³ C NMR, and ²⁹ Si NMR were analyzed to identify the molecular structures of organopolysiloxanes (A1) to (A2) and (B1).

<Calculation of functional group equivalent of unsaturated bond-containing group>
A solution obtained by dissolving 30 mg of each of the organopolysiloxanes (A1) to (A2) and (B1) prepared in Examples and Comparative Examples described later in 1 g of deuterated chloroform solvent was used as a measurement sample. The measurement of ¹ H NMR of this measurement sample was carried out using α-400 (400 MHz) manufactured by JASCO Corporation at a total number of 200 times, and the obtained results were analyzed to determine the average composition in one molecule of organopolysiloxane. Asked.

Further, 0.15 g of each sample was dissolved in 1 g of deuterated chloroform solvent, and a solution obtained by adding 8 mass% of Cr (acac) ₃ to the sample was used as a measurement sample. The measurement of ²⁹ Si NMR of this measurement sample was performed using α-400 (400 MHz) manufactured by JASCO Corporation at a total number of 4000 times, and the obtained results were analyzed to determine the average composition in one molecule of organopolysiloxane. Asked.

^The results obtained by ¹ H NMR and ²⁹ Si NMR were analyzed, and the functional group equivalent (mass per mole of functional group) of the unsaturated bond-containing group ((meth) acryloxy group) was calculated.

<Calculation of weight average molecular weight>
100 mg of each sample of organopolysiloxanes (A1) to (A2) and (B1) prepared in Examples and Comparative Examples described later were dissolved in 2 g of a chloroform solvent and filtered through a 0.45 μm filter. A measurement sample solution was obtained.

The eluent (chloroform) was passed through a column having the following constitution at a column temperature of 40 ° C. under a flow rate of 1 mL / min.
(Column configuration)
Guard column: Tsquardcolumn H-H (registered trademark) manufactured by Tosoh Corporation
Separation column: Tskgel (registered trademark) G5000H manufactured by Tosoh Corporation, Tskel (registered trademark) G3000H manufactured by Tosoh Corporation, and Tskel (registered trademark) G1000H manufactured by Tosoh Corporation are arranged in series.

  In addition, molecular weights 7,500,000, 2,560,000, 841,700, 320,000, 148,000, 59,500, 28,500, 10,850, 2,930, 580 manufactured by Polymer Laboratories A calibration curve obtained in advance from the elution time by RI detection of a monodisperse polypolystyrene standard substance having a known molecular weight and a styrene monomer (molecular weight 104) was prepared in advance. From the elution time and detection intensity of the measurement sample solution, the molecular weight was calculated using the above calibration curve.

<Refractive index of inorganic particles>
The refractive index of the inorganic particles was determined by the following method using a standard refractive liquid (manufactured by Cargill). However, when a standard refractive liquid having a desired refractive index was not available, a reagent with a known refractive index was substituted.
(1) The dispersion liquid of inorganic particles was taken in an evaporator and the dispersion medium was evaporated.
(2) This was dried with a vacuum dryer at 120 ° C. to obtain powder.
(3) Two to three drops of a standard refractive liquid with a known refractive index was dropped on the glass plate, and the above powder was mixed therewith.
(4) The operation of (3) above was performed with various standard refractive liquids, and the refractive index of the standard refractive liquid when the mixed liquid became transparent was defined as the refractive index of the inorganic particles.

<Viscosity measurement>
The viscosity at 25 ° C. of organopolysiloxanes (A1) to (A2) and (B1) prepared in Examples and Comparative Examples described later was measured using TVE-22H manufactured by Toki Sangyo Co., Ltd.

<Heat resistant yellowing>
YI (yellowness) was measured with a spectrocolorimeter CM-3600d (trade name) manufactured by Konica Minolta, Inc. using a cured product having a thickness of 3 mm prepared in Examples and Comparative Examples described later. Next, each cured product was wrapped in aluminum foil and heat-treated at 150 ° C. for 150 hours under air. Thereafter, YI (yellowness) was measured again with a spectrocolorimeter CM-3600d (trade name) manufactured by Konica Minolta. The change in YI before and after the heat treatment was ΔYI, and heat yellowing was evaluated according to the following evaluation criteria.
(Evaluation criteria)
◎: When ΔYI is less than 1.0 ○: When ΔYI is 1.0 or more and less than 3.0 ×: When ΔYI is 3.0 or more

<Light resistance>
YI (yellowness) was measured with a spectrocolorimeter CM-3600d (trade name) manufactured by Konica Minolta, Inc. using a cured product having a thickness of 3 mm prepared in Examples and Comparative Examples described later. Next, each cured product is set in a constant temperature dryer set at 50 ° C., and a wavelength of 365 nm is used using a UV irradiation apparatus (trade name: SP-7, manufactured by USHIO INC.) Equipped with a 365 nm bandpass filter. Was irradiated at an illuminance of 4 W / cm ² for 100 hours. Thereafter, YI (yellowness) was again measured with a spectrocolorimeter CM-3600d (trade name) manufactured by Konica Minolta. The change in YI before and after the UV irradiation was ΔYI, and the light resistance was evaluated according to the following evaluation criteria.
(Evaluation criteria)
◎: When ΔYI is less than 1.0 ○: When ΔYI is 1.0 or more and less than 3.0 ×: When ΔYI is 3.0 or more

<Transparency>
A cured product having a thickness of 1 mm prepared in Examples and Comparative Examples described later was used as a measurement sample, and a haze meter NDH 5000W (trade name) manufactured by Nippon Denshoku Industries Co., Ltd. was used. “JIS K7105: Plastic optical The total light transmittance was measured according to the “characteristic test method”. Based on the obtained total light transmittance, transparency was evaluated according to the following evaluation criteria.
(Evaluation criteria)
◎: When the total light transmittance is 95% or more ○: When the total light transmittance is 85% or more and less than 95% ×: When the total light transmittance is less than 85%

<Refractive index>
A cured product having a thickness of 1 mm prepared in Examples and Comparative Examples described later is used as a measurement sample, and using MODEL 2010 PRISM COUPLER (trade name) manufactured by Metricon, mode: single film mode, measurement wavelength: 633 nm, 25 The refractive index was measured at ° C.
(Evaluation criteria)
◎: When the refractive index is 1.60 or more ○: When the refractive index is 1.50 or more and less than 1.60 ×: When the refractive index is less than 1.50

[Example 1]
<Production of organopolysiloxane (A1)>
The following components were added to a 0.5 L three-necked flask equipped with a stirrer, a thermometer, and a reflux condenser, and heated to 80 ° C. with stirring in a nitrogen gas atmosphere.
(A) Component: 1,3,5,7-tetramethylcyclotetrasiloxane 15 g (0.06 mol)
Component (b1): 3.7 g (0.03 mol) of vinyltrimethoxysilane
Component (b2): Dimethylphenylvinylsilane 28.34 (0.18 mol)
(C) Component: 14 g (0.1 mol) of 3-butenyl methacrylate
Solvent: 216 g of toluene,
Polymerization inhibitor: Hydroquinone monomethyl ether 0.05 g

  Thereafter, an isopropanol solution of chloroplatinic acid was added in an amount such that the platinum metal was 20 ppm based on the weight of the organopolysiloxane as an addition reaction product. After confirming the start of the hydrosilylation reaction, the reaction system was stirred for 72 hours while being kept at 55 to 65 ° C. by heat insulation, water cooling or air cooling. The “weight of the organopolysiloxane that is an addition reaction product” means that the component (b1) and the component (b2) all react with the component (a) and the component (c) with respect to the remaining reaction point. The weight of organopolysiloxane when reacted.

²⁹Ｓｉ ＮＭＲ測定の結果、構成単位に相当する次に示すピークが観察された。
Ｆ１：−１９．９ｐｐｍ
Ｍ１：−４１．５ｐｐｍ
Ｍ２：−１．２ｐｐｍ
Ｓ：−３４．６ｐｐｍ
構成単位Ｆ１と構成単位Ｍ１の比率（ａ／ｂ）は、２．０であった。
構成単位Ｆ１と構成単位Ｓの比率（ｄ／ａ）は、０．０５であった。 When the contents of the flask after 72 hours from the start of the reaction were analyzed, the reaction rate of SiH groups was 95%. Then, activated carbon treatment was performed, and volatile components were distilled off to obtain 51 g of an organopolysiloxane (A1) represented by the following general formula (15). The functional group equivalent of the unsaturated bond-containing group of the obtained organopolysiloxane (A1) was 1083 g / mol, the weight average molecular weight calculated from GPC measurement was 800, and the viscosity at 25 ° C. was 37 mPa · s. . Moreover, when the amount of hydrosilylation reaction catalyst remaining by ICP / MS was measured, it was 0.0002 parts by mass with respect to 100 parts by mass of the obtained organopolysiloxane.

As a result of ²⁹ Si NMR measurement, the following peaks corresponding to the structural units were observed.
F1: -19.9 ppm
M1: -41.5ppm
M2: -1.2 ppm
S: -34.6 ppm
The ratio (a / b) between the structural unit F1 and the structural unit M1 was 2.0.
The ratio (d / a) between the structural unit F1 and the structural unit S was 0.05.

<Manufacture and characteristic evaluation of curable resin composition and cured product>
In 100 parts by mass of organopolysiloxane (A1), a methanol dispersion of zirconium oxide (E1) (manufactured by Sakai Chemical Co., Ltd., trade name: SZR-M, average particle size: 3 nm, refractive index: 2.2, 30% by mass solution) ) Was mixed with 100 parts by mass in terms of zirconium oxide and stirred at 50 ° C. for 12 hours. Thereafter, volatile components were distilled off to obtain a curable resin composition.

  To 100 parts by mass of the obtained curable resin composition, tert-amylperoxy-2-ethylhexanoate (manufactured by Kayaku Akzo, trade name: Trigonox 121-50E, 50% by mass solution) as a thermal radical generator. 2.5 parts by mass were mixed under nitrogen, stirred until the whole became uniform, and then degassed.

  This curable resin composition was poured into a mold made of SUS316 and cured at 100 ° C. for 4 hours and further at 150 ° C. for 1 hour to obtain a cured product. The evaluation results of the properties of the obtained cured product are shown in Table 1 below.

[Example 2]
<Manufacture and characteristic evaluation of curable resin composition and cured product>
Methyl cellosolve dispersion of barium titanate (E2) (manufactured by JGC Catalysts & Chemicals Co., Ltd., average particle size: 10 nm, refractive index: 2.3, 10 mass% solution) is titanic acid to 100 parts by mass of organopolysiloxane (A1). 100 parts by mass in terms of barium were mixed and stirred at 50 ° C. for 12 hours. Thereafter, volatile components were distilled off to obtain a curable resin composition.

  To 100 parts by mass of the obtained curable resin composition, tert-amylperoxy-2-ethylhexanoate (manufactured by Kayaku Akzo, trade name: Trigonox 121-50E, 50% by mass solution) as a thermal radical generator. 2.5 parts by mass were mixed under nitrogen, stirred until the whole became uniform, and then degassed.

  This curable resin composition was poured into a mold made of SUS316 and cured at 100 ° C. for 4 hours and further at 150 ° C. for 1 hour to obtain a cured product. The evaluation results of the properties of the obtained cured product are shown in Table 1 below.

[Example 3]
<Production of organopolysiloxane (A2) having an unsaturated bond-containing group>
The following components were added to a 0.5 L three-necked flask equipped with a stirrer, a thermometer, and a reflux condenser, and heated to 80 ° C. with stirring in a nitrogen gas atmosphere.
(A) Component: 1,3,5,7-tetramethylcyclotetrasiloxane 20 g (0.08 mol)
Component (b1): 4.9 g (0.03 mol) vinyltrimethoxysilane
Component (b2): 23.3 g (0.2 mol) of vinyltrimethylsilane
(C) component: 19 g (0.1 mol) of 3-butenyl methacrylate
Solvent: 230 g of toluene,
Polymerization inhibitor: Hydroquinone monomethyl ether 0.05 g

  Thereafter, an isopropanol solution of chloroplatinic acid was added in an amount such that the platinum metal was 20 ppm based on the weight of the organopolysiloxane as an addition reaction product. After confirming the start of the hydrosilylation reaction, the reaction system was stirred for 72 hours while being kept at 55 to 65 ° C. by heat insulation, water cooling or air cooling.

²⁹Ｓｉ ＮＭＲ測定の結果、構成単位に相当する次に示すピークが観察された。
Ｆ１：−２０．０ｐｐｍ
Ｍ１：−４１．５ｐｐｍ
Ｍ２：３．１ｐｐｍ
Ｓ ：−３４．６ｐｐｍ
構成単位Ｆ１と構成単位Ｍ１の比率（ａ／ｂ）は、２．０であった。
構成単位Ｆ１と構成単位Ｓの比率（ｄ／ａ）は、０．０４であった。 When the contents of the flask were analyzed after 72 hours from the start of the reaction, the reaction rate of SiH groups was 96%. Then, activated carbon treatment was performed, and volatile components were distilled off to obtain 53 g of an organopolysiloxane (A2) represented by the following general formula (16). The functional group equivalent of the obtained organopolysiloxane (A2) was 867 g / mol, the weight average molecular weight calculated from GPC measurement was 700, and the viscosity at 25 ° C. was 29 mPa · s. Further, when the amount of the hydrosilylation reaction catalyst remaining by ICP / MS was measured, it was 0.0003 parts by mass with respect to 100 parts by mass of the obtained organopolysiloxane.

As a result of ²⁹ Si NMR measurement, the following peaks corresponding to the structural units were observed.
F1: -20.0 ppm
M1: -41.5ppm
M2: 3.1 ppm
S: -34.6 ppm
The ratio (a / b) between the structural unit F1 and the structural unit M1 was 2.0.
The ratio (d / a) between the structural unit F1 and the structural unit S was 0.04.

<Manufacture and characteristic evaluation of curable resin composition and cured product>
To 100 parts by mass of the unsaturated bond-containing organopolysiloxane (A2), a methanol dispersion of zirconium oxide (E1) (manufactured by Sakai Chemical Co., Ltd., trade name: SZR-M, average particle size: 3 nm, refractive index: 2.2, 30 mass% solution) was mixed with 100 parts by mass in terms of zirconium oxide and stirred at 50 ° C. for 12 hours. Thereafter, volatile components were distilled off to obtain a curable resin composition.

  To 100 parts by mass of the obtained curable resin composition, tert-amylperoxy-2-ethylhexanoate (manufactured by Kayaku Akzo, trade name: Trigonox 121-50E, 50% by mass solution) as a thermal radical generator. 2.5 parts by mass were mixed under nitrogen, stirred until the whole became uniform, and then degassed.

  This curable resin composition was poured into a mold made of SUS316 and cured at 100 ° C. for 4 hours and further at 150 ° C. for 1 hour to obtain a cured product. The evaluation results of the properties of the obtained cured product are shown in Table 1 below.

[Example 4]
<Production of organopolysiloxane (B1)>
The following components were added to a 0.5 L three-necked flask equipped with a stirrer, a thermometer, and a reflux condenser, and heated to 80 ° C. with stirring in a nitrogen gas atmosphere.
(A) Component: 1,3,5,7-tetramethylcyclotetrasiloxane 15 g (0.06 mol)
(C) Component: 70 g (0.5 mol) of 3-butenyl methacrylate
Solvent: 200 g of toluene,
Polymerization inhibitor: Hydroquinone monomethyl ether 0.05 g

  Thereafter, an isopropanol solution of chloroplatinic acid was added in an amount such that the platinum metal was 20 ppm based on the weight of the organopolysiloxane as an addition reaction product. After confirming the start of the hydrosilylation reaction, the reaction system was stirred for 72 hours while being kept at 55 to 65 ° C. by heat insulation, water cooling or air cooling.

²⁹Ｓｉ ＮＭＲ測定の結果、構成単位に相当する次に示すピークが観察された。
Ｆ１：−１９．９ｐｐｍ When the contents of the flask after 72 hours from the start of the reaction were analyzed, the reaction rate of SiH groups was 99%. Then, activated carbon treatment was performed, and volatile components were distilled off to obtain 44 g of an organopolysiloxane (B1) represented by the following general formula (17). The functional group equivalent of the obtained organopolysiloxane (B1) was 200 g / mol, the weight average molecular weight calculated from GPC measurement was 600, and the viscosity at 25 ° C. was 20 mPa · s. Further, when the amount of the hydrosilylation reaction catalyst remaining by ICP / MS was measured, it was 0.0003 parts by mass with respect to 100 parts by mass of the obtained organopolysiloxane.

As a result of ²⁹ Si NMR measurement, the following peaks corresponding to the structural units were observed.
F1: -19.9 ppm

<Manufacture and characteristic evaluation of curable resin composition and cured product>
50 parts by mass of organopolysiloxane (A1), 50 parts by mass of organopolysiloxane (B1), a methanol dispersion of zirconium oxide (E1) (product name: SZR-M, average particle size: 3 nm, refractive index) 100 parts by mass in terms of zirconium oxide were mixed and stirred at 50 ° C. for 12 hours. Thereafter, volatile components were distilled off to obtain a curable resin composition.

  To 100 parts by mass of the obtained curable resin composition, tert-amylperoxy-2-ethylhexanoate (manufactured by Kayaku Akzo, trade name: Trigonox 121-50E, 50% by mass solution) as a thermal radical generator. 2.5 parts by mass were mixed under nitrogen, stirred until the whole became uniform, and then degassed.

  This curable resin composition was poured into a mold made of SUS316 and cured at 100 ° C. for 4 hours and further at 150 ° C. for 1 hour to obtain a cured product. The evaluation results of the properties of the obtained cured product are shown in Table 1 below.

[Example 5]
<Organopolysiloxane (B2)>
As the organopolysiloxane (B2), X-22-164B manufactured by Shin-Etsu Chemical Co., Ltd. represented by the following general formula (18) was used.

<Manufacture and characteristic evaluation of curable resin composition and cured product>
50 parts by mass of organopolysiloxane (A1), 50 parts by mass of organopolysiloxane (B2), a methanol dispersion of zirconium oxide (E1) (product name: SZR-M, average particle size: 3 nm, refractive index) 100 parts by mass in terms of zirconium oxide were mixed and stirred at 50 ° C. for 12 hours. Thereafter, volatile components were distilled off to obtain a curable resin composition.

  To 100 parts by mass of the obtained curable resin composition, tert-amylperoxy-2-ethylhexanoate (manufactured by Kayaku Akzo, trade name: Trigonox 121-50E, 50% by mass solution) as a thermal radical generator. 2.5 parts by mass were mixed under nitrogen, stirred until the whole became uniform, and then degassed.

  This curable resin composition was poured into a mold made of SUS316 and cured at 100 ° C. for 4 hours and further at 150 ° C. for 1 hour to obtain a cured product. The evaluation results of the properties of the obtained cured product are shown in Table 1 below.

[Example 6]
<Manufacture and characteristic evaluation of curable resin composition and cured product>
In 100 parts by mass of organopolysiloxane (A1), a methanol dispersion of zirconium oxide (E1) (manufactured by Sakai Chemical Co., Ltd., trade name: SZR-M, average particle size: 3 nm, refractive index: 2.2, 30% by mass solution) ) Was mixed with 10 parts by mass in terms of zirconium oxide and stirred at 50 ° C. for 12 hours. Thereafter, volatile components were distilled off to obtain a curable resin composition.

  To 100 parts by mass of the obtained curable resin composition, tert-amylperoxy-2-ethylhexanoate (manufactured by Kayaku Akzo, trade name: Trigonox 121-50E, 50% by mass solution) as a thermal radical generator. 2.5 parts by mass were mixed under nitrogen, stirred until the whole became uniform, and then degassed.

  This curable resin composition was poured into a mold made of SUS316 and cured at 100 ° C. for 4 hours and further at 150 ° C. for 1 hour to obtain a cured product. The evaluation results of the properties of the obtained cured product are shown in Table 1 below.

[Example 7]
<Manufacture and characteristic evaluation of curable resin composition and cured product>
In 100 parts by mass of organopolysiloxane (A1), a methanol dispersion of zirconium oxide (E1) (manufactured by Sakai Chemical Co., Ltd., trade name: SZR-M, average particle size: 3 nm, refractive index: 2.2, 30% by mass solution) ) Was mixed with 200 parts by mass in terms of zirconium oxide and stirred at 50 ° C. for 12 hours. Thereafter, volatile components were distilled off to obtain a curable resin composition.

  To 100 parts by mass of the obtained curable resin composition, tert-amylperoxy-2-ethylhexanoate (manufactured by Kayaku Akzo, trade name: Trigonox 121-50E, 50% by mass solution) as a thermal radical generator. 2.5 parts by mass were mixed under nitrogen, stirred until the whole became uniform, and then degassed.

  This curable resin composition was poured into a mold made of SUS316 and cured at 100 ° C. for 4 hours and further at 150 ° C. for 1 hour to obtain a cured product. The evaluation results of the properties of the obtained cured product are shown in Table 1 below.

[Comparative Example 1]
<Manufacture and characteristic evaluation of curable resin composition and cured product>
In 100 parts by mass of organopolysiloxane (B1), a methanol dispersion of zirconium oxide (E1) (trade name: SZR-M, average particle size: 3 nm, refractive index: 2.2, 30% by mass solution manufactured by Sakai Chemical Co., Ltd.) ) Was mixed with 100 parts by mass in terms of zirconium oxide and stirred at 50 ° C. for 12 hours. Thereafter, volatile components were distilled off to obtain a curable resin composition.

  To 100 parts by mass of the obtained curable resin composition, tert-amylperoxy-2-ethylhexanoate (manufactured by Kayaku Akzo, trade name: Trigonox 121-50E, 50% by mass solution) as a thermal radical generator. 2.5 parts by mass were mixed under nitrogen, stirred until the whole became uniform, and then degassed.

  This curable resin composition was poured into a mold made of SUS316 and cured at 100 ° C. for 4 hours and further at 150 ° C. for 1 hour to obtain a cured product. The evaluation results of the properties of the obtained cured product are shown in Table 1 below.

[Comparative Example 2]
<Manufacture and characteristic evaluation of curable resin composition and cured product>
A methanol dispersion of zirconium oxide (E1), trade name: SZR-M, average particle size: 3 nm, refractive index: 2.2, 30% by mass solution with 100 parts by mass of organopolysiloxane (B2) ) Was mixed with 100 parts by mass in terms of zirconium oxide and stirred at 50 ° C. for 12 hours. Thereafter, volatile components were distilled off to obtain a curable resin composition.

  To 100 parts by mass of the obtained curable resin composition, tert-amylperoxy-2-ethylhexanoate (manufactured by Kayaku Akzo, trade name: Trigonox 121-50E, 50% by mass solution) as a thermal radical generator. 2.5 parts by mass were mixed under nitrogen, stirred until the whole became uniform, and then degassed.

  This curable resin composition was poured into a mold made of SUS316 and cured at 100 ° C. for 4 hours and further at 150 ° C. for 1 hour to obtain a cured product. The evaluation results of the properties of the obtained cured product are shown in Table 1 below.

[Comparative Example 3]
<Curable resin composition (C1)>
As the curable resin composition (C1), KE-2500 manufactured by Shin-Etsu Chemical Co., Ltd., which is commercially available as a curable resin for optical semiconductor encapsulating materials, was used.

<Manufacture and characteristic evaluation of curable resin composition and cured product>
Commercially available KER-2500A and KER-2500B were mixed by 100 parts by mass, stirred until the whole became uniform, and then defoamed.

  This curable resin composition was poured into a mold made of SUS316 and cured at 100 ° C. for 1 hour and further at 150 ° C. for 5 hours to obtain a cured product. The evaluation results of the properties of the obtained cured product are shown in Table 1 below.

[Comparative Example 4]
<Curable resin composition (C2)>
As the curable resin composition (C2), ASP-1010 manufactured by Shin-Etsu Chemical Co., Ltd., which is commercially available as a curable resin for optical semiconductor encapsulants, was used.

<Manufacture and characteristic evaluation of curable resin composition and cured product>
Commercially available ASP-1010A (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) and ASP-1010B (trade name, manufactured by Shin-Etsu Chemical) were mixed by 100 parts by mass, stirred until the whole became uniform, and then defoamed.

  This curable resin composition was poured into a mold made of SUS316 and cured at 100 ° C. for 1 hour and further at 150 ° C. for 5 hours to obtain a cured product. The evaluation results of the properties of the obtained cured product are shown in Table 1 below.

[Comparative Example 5]
<Manufacture and characteristic evaluation of curable resin composition and cured product>
100 parts by mass of organopolysiloxane (A1), methyl ethyl ketone dispersion of colloidal silica (E3) (manufactured by Nissan Chemical Industries, trade name: MEK-ST, average particle size: 15 nm, refractive index: 1.4, 30% by mass solution ) Was mixed with 100 parts by mass in terms of colloidal silica and stirred at 50 ° C. for 12 hours. Thereafter, volatile components were distilled off to obtain a curable resin composition.

  To 100 parts by mass of the obtained curable resin composition, tert-amylperoxy-2-ethylhexanoate (manufactured by Kayaku Akzo, trade name: Trigonox 121-50E, 50% by mass solution) as a thermal radical generator. 2.5 parts by mass were mixed under nitrogen, stirred until the whole became uniform, and then degassed.

  This curable resin composition was poured into a mold made of SUS316 and cured at 100 ° C. for 4 hours and further at 150 ° C. for 1 hour to obtain a cured product. The evaluation results of the properties of the obtained cured product are shown in Table 1 below.

  An organopolysiloxane having one or more unsaturated bond-containing groups in one molecule and having a structural unit of a combination of structural units F1 and M1 represented by the general formulas (1) to (2) was obtained. . The inorganic particles can be uniformly dispersed by locally including in the molecular structure a site that forms a cross-linked structure composed of the structural unit F1 and a site that consists of siloxane that includes the structural unit M1.

  Moreover, according to Examples 1-7, the transparent hardened | cured material which fully satisfy | fills the level requested | required especially in an optical semiconductor use in any point of heat-resistant yellowing, light resistance, transparency, and a high refractive index. An organopolysiloxane that can be formed and a curable resin composition using the same were obtained.

  Since Comparative Examples 1 to 5 do not have the configuration of the present embodiment described above, from the viewpoint of predetermined characteristics among heat-resistant yellowing, light resistance, transparency, and high refractive index, and a balance of these characteristics. In practice, sufficient characteristics were not obtained.

  The organopolysiloxane of the present invention and the curable resin composition using the organopolysiloxane have industrial applicability as a sealing material for optical semiconductors and a die bond material for optical semiconductors.

Claims (28)

Organopolysiloxane (I) 100 having a structural unit F1 represented by the following general formula (1) and a structural unit M1 represented by the following general formula (2) as units constituting the cyclic organopolysiloxane. Part by mass;
Containing 10 to 200 parts by mass of inorganic particles,
The inorganic particles have a refractive index of 1.8 or more.
Curable resin composition.

(In the general formula (1), R ¹ is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, Alternatively, it represents a substituted or unsubstituted aralkyl group, R ² represents an unsaturated bond-containing group having 2 to 10 carbon atoms, X represents a divalent hydrocarbon group having 2 to 10 carbon atoms, and a represents Represents the content ratio of the structural unit F1, and represents an integer of 1 or more.)

(In the general formula (2), R ¹ and R ³ are each independently a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, A substituted or unsubstituted aryl group or a substituted or unsubstituted aralkyl group, Y represents a divalent hydrocarbon group having 2 to 10 carbon atoms, n represents an integer of 1 to 3, and b Represents the content ratio of the structural unit M1 and represents an integer of 1 or more.)   The curable resin composition according to claim 1, wherein a ratio (a / b) of the a to the b is 0.010 or more and 5.0 or less. The curable resin composition of Claim 1 or 2 which has further the structural unit M2 represented by following General formula (3) as a unit which comprises cyclic organopolysiloxane.

(In the general formula (3), R ¹ and R ⁴ are each independently a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, A substituted or unsubstituted aryl group or a substituted or unsubstituted aralkyl group; Z represents a divalent hydrocarbon group having 2 to 10 carbon atoms; and c represents a content ratio of the structural unit M2. 1 represents an integer of 1 or more.)   The curable resin composition according to claim 3, wherein the ratio of a to c (a / c) is 0.0010 or more and 3.0 or less.   The curable resin composition in any one of Claims 1-4 whose average particle diameter of the said inorganic particle is 0.1-100 nm.   6. The method according to claim 1, wherein the inorganic particles contain at least one element selected from the group consisting of zirconia, titanium, zinc, iron, copper, chromium, cadmium, carbon, tungsten, antimony, nickel, and platinum. A curable resin composition according to claim 1. The curable resin composition according to any one of claims 1 to 6, wherein R ² is an acryloxy group or a methacryloxy group. The curable resin composition in any one of Claims 1-7 which has further the structural unit S represented by following General formula (4) as a unit which comprises cyclic organopolysiloxane.

(In the general formula (4), R ¹ is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, Or a substituted or unsubstituted aralkyl group is shown, d represents the content rate of the said structural unit S, and shows an integer greater than or equal to 1.)   The curable resin composition according to claim 8, wherein a ratio of d to the a (d / a) is 0.10 or less. Wherein the structural unit containing R ^2, containing only structural units F1 represented by the general formula (1), the curable resin composition according to any one of claims 1 to 9. The curable resin composition according to any one of claims 1 to 10, wherein R ¹ is an alkyl group having 1 to 10 carbon atoms. The curable resin composition according to claim 1, wherein R ¹ is a methyl group. Functional group equivalent of the unsaturated bond-containing group represented by R ² is 20~10000g / mol, the curable resin composition according to any one of claims 1 to 12. The organopolysiloxane (I) has a weight average molecular weight of 500 to 1,000,000,
The viscosity of the organopolysiloxane (I) at 25 ° C. is 1.0 to 1000000 mPa · s.
Curable resin composition in any one of Claims 1-13. Organopolysiloxane (II) 0 having a structural unit F1 ′ represented by the following general formula (5) and a structural unit T ′ represented by the following general formula (6) as units constituting the cyclic organopolysiloxane. Further containing 10 to 100 parts by mass,
The curable resin composition in any one of Claims 1-14.

(In the general formula (5), R ^{1 ′} is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, or a substituted or unsubstituted aryl group. Or a substituted or unsubstituted aralkyl group, R ^{2 ′} represents an unsaturated bond-containing group having 2 to 10 carbon atoms, and X ′ represents a divalent hydrocarbon group having 2 to 10 carbon atoms. E represents the content ratio of the structural unit F1 ′ and represents an integer of 1 or more.)

(In the general formula (6), R ^{1 ′} is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, or a substituted or unsubstituted aryl group. Alternatively, it represents a substituted or unsubstituted aralkyl group, f represents the content of the structural unit T ′, represents an integer of 0 or more, and the sum of e and f represents an integer of 3 to 20.) The curable resin composition according to claim 15, wherein R ^{1 ′} is an alkyl group having 1 to 10 carbon atoms. The curable resin composition according to claim 15 or 16, wherein R ^{1 '} is a methyl group. The curable resin composition containing an organopolysiloxane according to any one of claims 15 to 17, wherein R ^{2 '} is an acryloxy group or a methacryloxy group. Total functional group equivalent of the unsaturated bond-containing group represented by R ² and the R ^{2 'is} a 20~10000g / mol, the curable resin composition according to any one of claims 15 to 18. The organopolysiloxane (II) has a weight average molecular weight of 500 to 1,000,000.
The viscosity of the organopolysiloxane (II) at 25 ° C. is 1.0 to 1000000 mPa · s.
The curable resin composition in any one of Claims 15-19. Further containing a thermal radical generator,
The content of the thermal radical generator is 0.50 to 10 parts by mass with respect to 100 parts by mass in total of the organopolysiloxane (I) and the organopolysiloxane (II). The curable resin composition according to any one of the above. Further containing a hydrosilylation reaction catalyst,
The content of the hydrosilylation reaction catalyst is 0.0010 parts by mass or less with respect to a total of 100 parts by mass of the organopolysiloxane (I) and the organopolysiloxane (II). A curable resin composition according to claim 1. Hydrogen polysiloxane (a) having a structural unit represented by the following general formula (7) as a unit constituting a cyclic organopolysiloxane;

(In the general formula (7), R ^{1 ″} represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, or a substituted or unsubstituted aryl group. A group or a substituted or unsubstituted aralkyl group, and j represents the content of the structural unit and represents an integer of 1 or more.)
An organosiloxane (b1) having one vinyl group directly bonded to a silicon atom and containing one or more hydrolyzable groups;
An organic compound (c) having two or more unsaturated bond-containing groups,
An addition reaction step of obtaining an organopolysiloxane by addition reaction in the presence of a hydrosilylation reaction catalyst (d);
A mixing step of mixing the organopolysiloxane and inorganic particles (e) having a refractive index of 1.8 or more,
A method for producing a curable resin composition. The said hydrogen polysiloxane (a) is a manufacturing method of the curable resin composition of Claim 23 which further has a structural unit represented by following General formula (8).

(In the general formula (8), each R ^{1 ″} is independently a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, and a substituted group. Or an unsubstituted aryl group or a substituted or unsubstituted aralkyl group, k represents the content of the structural unit, represents an integer of 0 or more, and j + k is an integer of 3 to 20.)   25. The curable resin according to claim 23 or 24, wherein in the addition reaction step, an organosiloxane (b2) having one vinyl group directly bonded to a silicon atom and having no hydrolyzable group is further subjected to an addition reaction. A method for producing the composition.   The sealing material for optical semiconductors containing the curable resin composition in any one of Claims 1-22.   The die-bonding material for optical semiconductors containing the curable resin composition in any one of Claims 1-22.   An optical semiconductor package, wherein the optical semiconductor sealing material according to claim 26 is molded.