JP2016159315A - Reduced-pressure/increased-pressure processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an increased-pressure/reduced-pressure processing device including a pressure resistive cylinder 20, a fixed pressure resistive plate 10, and a movable pressure resistive plate 30, variable in volume of an increased-pressure/reduced-pressure tank, structured to easily open/close the increased-pressure/reduced-pressure tank, and capable of easily performing mounting of a processing member and reduced-pressure/increased-pressure processing.SOLUTION: A reduced-pressure/increased-pressure processing device is structured to enable independent movement of a pressure resistive cylinder 20 and a movable pressure resistive plate 30. Mounting of a processing material on a fixed pressure resistive plate 10 is facilitated by retracting the pressure resistive cylinder 20, and an internal increased-pressure/reduced-pressure environment is easily realized by moving the movable pressure resistive plate 30 in its fitted state in the pressure resistive cylinder to change the volume of an increased-pressure/reduced-pressure tank.SELECTED DRAWING: Figure 1

Description

  The present invention is caused by residual bubbles such as adhesion of electronic components to a substrate, sealing of electronic components, application of a film to various components, fine transfer processing to the surface of a resin member, impregnation treatment of sintered metal, food, etc. The present invention relates to a pressure reduction / pressure processing apparatus capable of eliminating defects and performing high-quality processing.

  For example, in the electronic component bonding process to the substrate, the processing object is performed under a reduced pressure environment, thereby eliminating fine bubbles remaining on the bonding layer, the substrate or the bonding interface of the electronic component, and improving the bonding quality.

  In addition, in the impregnation treatment of the lubricating oil into the sintered metal, the processed parts are also placed in a reduced pressure environment, the gas remaining in the granule in the sintered metal is excluded and immersed in the lubricating oil, and the impregnation ratio of the lubricating oil Has improved.

  Furthermore, in order to improve the quality of these processings, after removing residual bubbles, the processing members are exposed to a high pressure environment. By adding this step, the adhesion treatment improves the adhesion of the adhesive layer, and the impregnation treatment is effective in increasing the impregnation rate.

  Conventionally, in order to perform these processings, the processing parts are placed in a pressure tank, and the pressure in the pressure tank is changed using a vacuum pump and an air pressure pump connected to the pressure tank. Was. However, due to the mechanism for opening the pressure vessel for loading processed parts, the jig for fixing the processing member, etc., the volume of the pressure vessel has to be large, and it is difficult to reduce the size of the apparatus.

  Further, along with the increase in the pressure tank volume, a great deal of consideration has been required to ensure safety including the pressure resistance of the apparatus in a high pressure state.

JP2013-052424A JP 2011-143372 A

  The problem to be solved is that a generally used pressure tank for pressurization and decompression does not have a structure in which the volume can be arbitrarily changed, and a structure in which a processed part can be easily placed. There is no point.

  In the present invention, the decompression / pressurization tank is composed of a pressure-resistant cylinder and two pressure-resistant plates, and the pressure-reducing cylinder and one of the pressure-resistant plates can be moved independently to facilitate the pressure-reducing / pressurizing environment. It is possible to change the volume of the pressure-reducing / pressurizing tank by arbitrarily changing the position of the movable pressure-resistant plate with respect to the other pressure-resistant plate and making the pressure-reducing / pressurizing tank larger. It is characterized by having a structure that can be opened.

  The decompression / pressurization processing apparatus of the present invention can change the volume of the decompression / pressurization tank to reduce or adjust the pressure in the decompression / pressurization tank. As a result, a vacuum pump or an air pressurization pump that is generally used in such an apparatus can be made unnecessary, and the processing parts can be easily placed in the decompression / pressurization tank. There is an advantage that the processing can be easily automated. Furthermore, since the volume of the decompression / pressurization tank at high pressure can be minimized in the space around the workpiece, there is an advantage that safety can be improved.

  Depending on the processing requirements, pressure exceeding the pressure reduction and pressurization values that can be realized by the equipment may be required. By installing an auxiliary vacuum pump or air pressure pump, these pumps can be used. It is possible to realize a pressure value that exceeds the capacity of the above, and it is possible to increase the set pressure when a pump having the same capacity is used.

It is a basic composition figure of the pressure reduction and pressurization processing apparatus of the device concerning the present invention. Example 1 (A)-(d) is explanatory drawing which showed the mechanism operation | movement of (Example 1) of the apparatus which concerns on this invention. It is a block diagram at the time of using the apparatus which concerns on this invention for adhesion | attachment of a board | substrate and an electronic component. (Example 2) (A)-(d) is explanatory drawing which showed the mechanism operation | movement of the said Example 2. FIG. It is a block diagram at the time of using the apparatus which concerns on this invention for the impregnation process. (Example 3) (A)-(d) is explanatory drawing which showed the mechanism operation | movement of the said Example 3. FIG. It is a block diagram at the time of attaching the vacuum pump, the air pressurization pump, and the heating means to a workpiece to the apparatus which concerns on this invention. Example 4

  The apparatus according to the present invention has the purpose of making it possible to easily place the processing member in the pressurization / decompression tank and to change the volume of the pressurization / depressurization layer without using a complicated mechanism. Realized without compromising pressure safety against pressure.

  FIG. 1 is a basic configuration diagram of an apparatus of the present invention that performs a pressure reduction / pressurization process on a processing member. Four struts 42 are fixed on the upper surface of the lower structural plate 40, and the upper structural plate 43 is fastened by screws and nuts formed on the upper ends of the struts 42. A pedestal 41 is fixed to the upper surface of the base 40, and a fixed pressure plate 10 is fixed to the upper portion thereof. A seal member 11 is provided on the outer periphery of the fixed pressure plate. A cylinder drive support plate 22 is fixed between the lower support member 12 and the base 41, and a cylinder drive element 23 is fixed to the lower surfaces of the left and right ends thereof. The cylinder driving element 23 and the pressure cylinder 20 fitted to the outer periphery of the fixed pressure plate 10 via the seal member 11 are coupled by a cylinder driving rod 24. An oil / pneumatic device 50 is connected to the cylinder driving element 23 via a pipe, and the pressure-resistant cylinder 20 can be moved up and down via the cylinder driving rod 24.

  A pressure plate drive element 36 is fixed at the center of the upper structure plate 43, and a pressure plate drive rod 37 extending from the lower end thereof is fastened to the moving structure plate 34. Linear motion bearings 35 are arranged at the four corners of the moving structural plate 34 and are fitted to the columns 42. A movable pressure plate 30 is fixed to the lower surface of the movable structure plate 34 via an upper support member 33, and a seal member 31 is attached to the outer periphery of the movable pressure plate 30. An oil / pneumatic device 51 is connected to the pressure plate drive element 36 via a pipe, and the movable pressure plate 30 can be moved up and down via the pressure plate drive rod 37, the moving structure plate 34, and the upper support member 33. .

  An intake / exhaust hole 32 is provided in a part of the moving pressure plate, and is connected to the switching valve 52 through a pipe, so that the flow path can be opened and closed.

  In this embodiment, the hydraulic / pneumatic devices 50 and 51 are shown as power sources for the body drive element 23 and the pressure plate drive element 36. However, as long as the force necessary for driving can be generated, the electric drive element and the electric power are used. A source may be used.

  In this embodiment, the movable pressure plate 30 is arranged above the fixed pressure plate 10. However, this arrangement is turned upside down, the fixed pressure plate 10 is arranged above, and the movable pressure plate 30 is arranged below the fixed pressure plate 10. It is also possible to adopt a configuration. In this case, as a matter of course, the pressure plate driving element 36, which is the moving means of the moving pressure plate 30, is disposed in the space below the moving pressure plate 30, and the overall height of the apparatus can be reduced.

  FIG. 2 is a diagram showing the basic operation of the device of the present invention configured as described above. In the state of FIG. 2A, a processing member is placed on the upper surface of the fixed pressure plate 10 (illustration of the processing member is omitted). Thereafter, the switching valve 52 is opened, and the pressure-resistant cylinder 20 is moved upward by the cylinder driving element 23. At the same time, the movable pressure plate 30 is moved downward by the pressure plate driving element 36 so as to be fitted to the pressure drum 20 and lowered to the upper part of the processing member placed on the fixed pressure plate 10. At this time, the pressurizing / depressurizing tank formed by the pressure-resistant body 20, the fixed pressure-resistant plate 10 and the moving pressure-resistant plate 30 has a minimum volume (FIG. 2B). Here, the switching valve 52 is closed, and the movable pressure plate 30 is moved by the pressure plate driving element 36 to the uppermost position where the fitting state with the pressure cylinder 20 can be maintained. By this operation, the pressurizing / depressurizing tank changes from the minimum volume to the maximum volume, and the pressure is reduced according to the volume ratio of the change according to Boyle's law (FIG. 2 (c)). This state is maintained, the pressure reducing process is performed on the processing member, the switching valve is opened, and air is introduced from the outside. Therefore, the switching valve is closed again, and the moving pressure plate 30 is moved downward to reduce the volume of the pressurizing / depressurizing tank. After maintaining the state where the volume of the pressurizing / depressurizing tank is minimized, and pressurizing the processing member, the switching valve is opened to complete the processing (FIG. 2D). Then, it returns to the state of Fig.2 (a) and takes out a processing member.

  In the embodiment shown in FIG. 1, the fixed pressure plate 10 is disposed below and the movable pressure plate 30 is disposed above the fixed pressure plate 10, but the movable pressure plate is disposed below and the fixed pressure plate is disposed above the movable pressure plate. Configuration is also possible. In this case, the pressure plate driving element is disposed below the moving pressure plate and the space below the device can be used effectively, so that the height of the device can be reduced.

  FIG. 3 is an apparatus configuration diagram in the case where the present invention is applied to processing for bonding an electronic component to a substrate. A processing jig 60 is installed on the upper surface of the fixed pressure plate 10, and a substrate 70 and an electronic component 71 are placed on the processing jig 60 via an adhesive layer (not shown). A flexible film 72 is placed on the substrate 70 and the electronic component 71, and a film fixing jig 61 having an opening smaller than the flexible film 72 is disposed so as to surround the flexible film 72. Has been. The film fixing jig 61 is coupled to the jig driving rod 63 of the jig driving element 62 installed at the lower part of the fixed pressure plate, and the film fixing jig 61 is moved up and down by operating the jig driving element 62. Thus, the flexible film 72 has a function of closely contacting or releasing the periphery of the processing jig 60. Although not shown in the figure, the shaft drive rod 63 and the fixed pressure plate 10 are naturally kept airtight by a seal member. The jig driving element 62 may be a pneumatic element or an electric element, and details are not shown.

  FIG. 4 is a diagram for explaining the processing operation of the second embodiment. FIG. 4A shows a state in which a substrate 70 and an electronic component 71 which are processing components and a flexible film 71 are placed thereon. With the switching valve 52 opened, the pressure-resistant cylinder 20 and the movable pressure-resistant plate 30 are driven to move to the position shown in FIG. In this state, the volume of the pressurization / decompression tank formed by the fixed pressure plate 10, the pressure drum 20, and the moving pressure plate 30 is minimized. Here, the switching valve 52 is closed to shut off from the outside atmosphere. Thereafter, the movable pressure plate 30 is moved to the top of the pressure cylinder 20 to reduce the internal pressure by maximizing the volume of the pressurizing / depressurizing tank. This state is maintained for a while, and the gas component of the adhesive layer applied to the interface between the substrate 70 and the electronic component 71 is released. Thereafter, the jig driving element 62 is operated to lower the film fixing jig 61, thereby sandwiching the periphery of the flexible film 72 between the processing jig 60 and the film fixing jig 61, The electronic component 71 is sealed from the upper space of the flexible film 72 (FIG. 4C). Next, the switching valve 52 is opened, and external air is sucked into the pressurizing / depressurizing tank. Since the pressurization / decompression tank changes from the depressurized state to the atmospheric pressure state, the flexible film 72 is in close contact with the substrate 71 and the electronic component 71. Further, by closing the switching valve and lowering the movable pressure-resistant plate 30 to the upper part of the flexible film to increase the internal pressure of the pressurizing / depressurizing tank, the flexible film 72 is further made to the substrate 70 and the electronic component. In addition to being in close contact with 71, pressure is also applied to the adhesive layer at the interface between the substrate 70 and the electronic component 71, and the adhesiveness of this portion is also increased.

  FIG. 5 shows an embodiment in the case where the present invention is applied to processing for impregnating a liquid component into a sintered metal part or various food products. An impregnation bath 80 is installed on the upper surface of the fixed pressure plate 10, and the impregnation liquid 85 is filled up to an appropriate liquid level in the interior thereof. A net-like rod 83 containing an impregnated component 84 is disposed at the upper part of the impregnation bath 80, and a rod driving element 81 is fixed to the left and right outer surfaces of the impregnation bath 80, and is attached to the upper end of the rod driving rod 82 of the rod driving element 81. A heel drive element 81 is coupled.

  FIG. 6 is a diagram for explaining the processing operation of the third embodiment. FIG. 6A shows a state in which the impregnated component 84 is accommodated in the mesh rod 83 and disposed at a position where it is not immersed in the impregnating liquid 85 in the impregnation bath 80. The switching valve 52 is opened to drive the pressure-resistant cylinder 20 and the moving pressure-resistant plate 30 to move them to the position shown in FIG. In this state, the volume of the pressurization / decompression tank formed by the fixed pressure plate 10, the pressure drum 20, and the moving pressure plate 30 is minimized. Here, the switching valve 52 is closed to shut off from the outside atmosphere. Thereafter, the movable pressure plate 30 is moved to the top of the pressure cylinder 20 to reduce the internal pressure by maximizing the volume of the pressurizing / depressurizing tank. While maintaining this state for a while, the gas component present in the impregnation component 84 is released, and the gas component in the impregnating liquid 85 is also released (FIG. 6C). Next, the rod driving element 81 is operated, and the mesh rod 80 is lowered until the impregnated component 84 is completely immersed in the impregnating liquid. Thereafter, the switching valve is opened, and the atmosphere is sucked into the pressurizing / pressure tank. As a result, since the atmospheric pressure is applied to the surface of the impregnating liquid 85, the impregnating liquid 85 enters the inside of the impregnation processing component 84. Further, the switching valve 52 is closed, the moving pressure plate 30 is lowered to the upper part of the mesh rod 80, and the pressure in the pressurizing / depressurizing tank is raised. As a result, the penetration of the impregnating solution 85 into the impregnated component 84 is further promoted, and a good impregnation process is possible.

  FIG. 7 shows an embodiment in which other functional elements are added to the apparatus configuration shown in the first to third embodiments. In the first to third embodiments, the volume change of the pressurizing / depressurizing tank formed by the fixed pressure plate 10, the pressure cylinder 20, and the moving pressure plate 30 is realized by the movement of the moving pressure plate 30. There is a limit to the volume change of the pressurization / depressurization tank that can be realized because a space occupied by parts and various jigs for placing the parts and a useless space around the parts are generated. As a result, depending on the processing conditions, it may happen that the required pressurization / decompression values cannot be achieved. Therefore, a new switching valve 55 is installed instead of the switching valve 52 shown in the first to third embodiments, and an auxiliary air pressurizing pump 53 and a vacuum pump 54 are installed at the tip of the switching valve 55. It is possible to switch to four modes of pressurization, decompression, deadline, and air release, and these processing modes can be applied as appropriate in the processing processes of the first to third embodiments. With this configuration, the pressure in the pressurizing / depressurizing tank is increased by the air pressurizing pump 53 and then increased by the movement of the movable pressure-resistant plate 30, whereby a pressure exceeding the capacity of the air pressurizing pump can be obtained.

  Further, the heating means 90 provided on the upper portion of the lower support member 12 conducts heat to the processing member installed on the upper portion thereof via the fixed pressure plate 10 and makes it possible to adjust the temperature of the processing member. is there. Thereby, in Example 2, the flexible film | membrane 72 can be softened and the adhesiveness of the flexible film | membrane 72 to the board | substrate 70 and the electronic component 71 can be improved. Furthermore, the adhesive interposed between the substrate 70 and the electronic component 71 is softened to improve the adhesion, and the curing reaction of the adhesive can be promoted. Although it is convenient to use an electric heating element as a heat source of the heating means, a light irradiation means 91 is installed below the movable pressure-resistant plate 30, and light that is effective for processing can be directly irradiated to the processing member. Is possible. For the light irradiation means 91, infrared light, ultraviolet light, laser light, or the like can be used depending on the purpose of processing. In the figure, the light irradiation means 91 is provided at the lower part of the moving pressure plate 30, but if a material having a light transmission property is selected for a part or the whole of the moving pressure plate 30, the light is applied to the upper part of the moving pressure plate 30. It is possible to provide the irradiation means 91 and to protect the light irradiation means 91 from the pressure applied in the pressurized / reduced pressure tank.

  In the embodiment described above, the movable pressure plate 30 has been used to change the volume of the pressurizing / depressurizing tank. However, depending on the processing, the processing member placed on the upper surface of the fixed pressure plate 10 may be mechanical. It is also possible to press directly, and it is also possible to perform a press working process under a pressurized environment.

  According to the present invention, it is possible to realize a decompression / pressurization environment with an apparatus having a simple configuration, adhesion of electronic components to a substrate, sealing of electronic components, film sticking to various components, and fine transfer processing to the surface of a resin member. It is possible to eliminate defects caused by residual bubbles, such as impregnation treatment of sintered metal and food, and to perform high-quality processing. In addition to these cases, the pressure is reduced and pressurized. It can be applied to a wide range of applications for required processing.

DESCRIPTION OF SYMBOLS 10 Fixed pressure-resistant plate 11 Seal member 12 Lower support member 20 Pressure-resistant cylinder 21 Stop plate 22 Cylinder drive support plate 23 Cylinder drive element 24 Cylinder drive rod 30 Moving pressure-resistant plate 31 Seal member 32 Intake and exhaust hole 33 Upper support member 34 Moving structure plate 35 Directly Dynamic bearing 36 Pressure plate driving element 37 Pressure plate driving rod 40 Lower structure plate 41 Base 42 Support column 43 Upper structure plate 50, 51 Hydraulic / pneumatic device 52, 53 Switching valve 60 Processing jig 61 Membrane fixing jig 62 Jig driving element 63 Jig drive rod 70 Substrate 71 Electronic component 72 Flexible film 80 Impregnation bath 81 籠 Drive element 82 籠 Drive rod 83 Reticulated rod 84 Impregnation treatment component 85 Impregnation liquid 90 Heating means 91 Light irradiation means

The present invention is caused by residual bubbles such as adhesion of electronic components to a substrate, sealing of electronic components, application of a film to various components, fine transfer processing to the surface of a resin member, impregnation treatment of sintered metal, food, etc. The present invention relates to a decompression / pressurization processing method capable of eliminating defects and performing high-quality processing.

  For example, in the electronic component bonding process to the substrate, the processing object is performed under a reduced pressure environment, thereby eliminating fine bubbles remaining on the bonding layer, the substrate or the bonding interface of the electronic component, and improving the bonding quality.

  In addition, in the impregnation treatment of the lubricating oil into the sintered metal, the processed parts are also placed in a reduced pressure environment, the gas remaining in the granule in the sintered metal is excluded and immersed in the lubricating oil, and the impregnation ratio of the lubricating oil Has improved.

  Furthermore, in order to improve the quality of these processings, after removing residual bubbles, the processing members are exposed to a high pressure environment. By adding this step, the adhesion treatment improves the adhesion of the adhesive layer, and the impregnation treatment is effective in increasing the impregnation rate.

Conventionally, in order to perform these processings, as described in the prior art documents described later, the processed parts are placed in a pressure tank, and a vacuum pump and an air pressure pump connected to the pressure tank are used. This was carried out by changing the pressure in the pressure vessel. However, due to the mechanism for opening the pressure vessel for loading processed parts, the jig for fixing the processing member, etc., the volume of the pressure vessel has to be large, and it is difficult to reduce the size of the apparatus.

  Further, along with the increase in the pressure tank volume, a great deal of consideration has been required to ensure safety including the pressure resistance of the apparatus in a high pressure state.

JP2013-052424A JP 2011-143372 A

  The problem to be solved is that a generally used pressure tank for pressurization and decompression does not have a structure in which the volume can be arbitrarily changed, and a structure in which a processed part can be easily placed. There is no point.

  In the present invention, the decompression / pressurization tank is composed of a pressure-resistant cylinder and two pressure-resistant plates, and the pressure-reducing cylinder and one of the pressure-resistant plates can be moved independently to facilitate the pressure-reducing / pressurizing environment. It is possible to change the volume of the pressure-reducing / pressurizing tank by arbitrarily changing the position of the movable pressure-resistant plate with respect to the other pressure-resistant plate and making the pressure-reducing / pressurizing tank larger. It is characterized by having a structure that can be opened.

The decompression / pressurization processing apparatus according to the method of the present invention is a combination of the vertical movement of the pressure cylinder and the vertical movement of the movable pressure plate movable within the pressure cylinder without using a vacuum pump or an air pressure pump. , to change the volume of the vacuum and pressurized圧槽a pressure in the vacuum and pressure圧槽can be depressurized or pressurized adjustment. As a result, a vacuum pump or an air pressurization pump that is generally used in such an apparatus can be made unnecessary, and the processing parts can be easily placed in the decompression / pressurization tank. There is an advantage that the processing can be easily automated. Furthermore, since the volume of the decompression / pressurization tank at high pressure can be minimized in the space around the workpiece, there is an advantage that safety can be improved.

1 is a basic configuration diagram of a reduced pressure / pressure processing apparatus used in a method according to the present invention. Example 1 (A)-(d) is explanatory drawing which showed the mechanism operation | movement of the said Example 1. FIG. It is a block diagram at the time of using for the adhesion | attachment of a board | substrate and an electronic component with the apparatus used for the method which concerns on this invention. (Example 2) (A)-(d) is explanatory drawing which showed the mechanism operation | movement of the said Example 2. FIG. It is a block diagram at the time of using the apparatus used for the method which concerns on this invention for the impregnation process. (Example 3) (A)-(d) is explanatory drawing which showed the mechanism operation | movement of the said Example 3. FIG. It is reference explanatory drawing at the time of attaching the vacuum pump, the air pressurization pump, and the heating means to a workpiece to the apparatus used for the method which concerns on this invention.

  The purpose of enabling the processing member to be easily placed in the pressurization / decompression tank and making the volume of the pressurization / depressurization layer variable without complicating the mechanism and impairing the pressure safety against internal pressure. Realize without.

  FIG. 1 is a basic configuration diagram of an apparatus of the present invention that performs a pressure reduction / pressurization process on a processing member. Four struts 42 are fixed on the upper surface of the lower structural plate 40, and the upper structural plate 43 is fastened by screws and nuts formed on the upper ends of the struts 42. A pedestal 41 is fixed to the upper surface of the base 40, and a fixed pressure plate 10 is fixed to the upper portion thereof. A seal member 11 is provided on the outer periphery of the fixed pressure plate. A cylinder drive support plate 22 is fixed between the lower support member 12 and the base 41, and a cylinder drive element 23 is fixed to the lower surfaces of the left and right ends thereof. The cylinder driving element 23 and the pressure cylinder 20 fitted to the outer periphery of the fixed pressure plate 10 via the seal member 11 are coupled by a cylinder driving rod 24. An oil / pneumatic device 50 is connected to the cylinder driving element 23 via a pipe, and the pressure-resistant cylinder 20 can be moved up and down via the cylinder driving rod 24.

  A pressure plate drive element 36 is fixed at the center of the upper structure plate 43, and a pressure plate drive rod 37 extending from the lower end thereof is fastened to the moving structure plate 34. Linear motion bearings 35 are arranged at the four corners of the moving structural plate 34 and are fitted to the columns 42. A movable pressure plate 30 is fixed to the lower surface of the movable structure plate 34 via an upper support member 33, and a seal member 31 is attached to the outer periphery of the movable pressure plate 30. An oil / pneumatic device 51 is connected to the pressure plate drive element 36 via a pipe, and the movable pressure plate 30 can be moved up and down via the pressure plate drive rod 37, the moving structure plate 34, and the upper support member 33. .

  An intake / exhaust hole (through-hole) 32 is provided in a part of the moving pressure plate, and is connected to the switching valve 52 via a pipe so that the flow path can be opened and closed.

  In this embodiment, the hydraulic / pneumatic devices 50 and 51 are shown as power sources for the body drive element 23 and the pressure plate drive element 36. However, as long as the force necessary for driving can be generated, the electric drive element and the electric power are used. A source may be used.

  In this embodiment, the movable pressure plate 30 is arranged above the fixed pressure plate 10. However, this arrangement is turned upside down, the fixed pressure plate 10 is arranged above, and the movable pressure plate 30 is arranged below the fixed pressure plate 10. It is also possible to adopt a configuration. In this case, as a matter of course, the pressure plate driving element 36, which is the moving means of the moving pressure plate 30, is disposed in the space below the moving pressure plate 30, and the overall height of the apparatus can be reduced.

  FIG. 2 is a diagram showing the basic operation of the device of the present invention configured as described above. In the state of FIG. 2A, a processing member is placed on the upper surface of the fixed pressure plate 10 (illustration of the processing member is omitted). Thereafter, the switching valve 52 is opened, and the pressure-resistant cylinder 20 is moved upward by the cylinder driving element 23. At the same time, the movable pressure plate 30 is moved downward by the pressure plate driving element 36 so as to be fitted to the pressure drum 20 and lowered to the upper part of the processing member placed on the fixed pressure plate 10. At this time, the pressurizing / depressurizing tank formed by the pressure-resistant body 20, the fixed pressure-resistant plate 10 and the moving pressure-resistant plate 30 has a minimum volume (FIG. 2B). Here, the switching valve 52 is closed, and the movable pressure plate 30 is moved by the pressure plate driving element 36 to the uppermost position where the fitting state with the pressure cylinder 20 can be maintained. By this operation, the pressurizing / depressurizing tank changes from the minimum volume to the maximum volume, and the pressure is reduced according to the volume ratio of the change according to Boyle's law (FIG. 2 (c)). This state is maintained, the pressure reducing process is performed on the processing member, the switching valve is opened, and air is introduced from the outside. Therefore, the switching valve is closed again, and the moving pressure plate 30 is moved downward to reduce the volume of the pressurizing / depressurizing tank. After maintaining the state where the volume of the pressurizing / depressurizing tank is minimized, and pressurizing the processing member, the switching valve is opened to complete the processing (FIG. 2D). Then, it returns to the state of Fig.2 (a) and takes out a processing member.

  In the embodiment shown in FIG. 1, the fixed pressure plate 10 is disposed below and the movable pressure plate 30 is disposed above the fixed pressure plate 10, but the movable pressure plate is disposed below and the fixed pressure plate is disposed above the movable pressure plate. Configuration is also possible. In this case, the pressure plate driving element is disposed below the moving pressure plate and the space below the device can be used effectively, so that the height of the device can be reduced.

  FIG. 3 is an apparatus configuration diagram in the case where the present invention is applied to processing for bonding an electronic component to a substrate. A processing jig 60 is installed on the upper surface of the fixed pressure plate 10, and a substrate 70 and an electronic component 71 are placed on the processing jig 60 via an adhesive layer (not shown). A flexible film 72 is placed on the substrate 70 and the electronic component 71, and a film fixing jig 61 having an opening smaller than the flexible film 72 is disposed so as to surround the flexible film 72. Has been. The film fixing jig 61 is coupled to the jig driving rod 63 of the jig driving element 62 installed at the lower part of the fixed pressure plate, and the film fixing jig 61 is moved up and down by operating the jig driving element 62. Thus, the flexible film 72 has a function of closely contacting or releasing the periphery of the processing jig 60. Although not shown in the figure, the shaft drive rod 63 and the fixed pressure plate 10 are naturally kept airtight by a seal member. The jig driving element 62 may be a pneumatic element or an electric element, and details are not shown.

  FIG. 4 is a diagram for explaining the processing operation of the second embodiment. FIG. 4A shows a state in which a substrate 70 and an electronic component 71 which are processing components and a flexible film 71 are placed thereon. With the switching valve 52 opened, the pressure-resistant cylinder 20 and the movable pressure-resistant plate 30 are driven to move to the position shown in FIG. In this state, the volume of the pressurization / decompression tank formed by the fixed pressure plate 10, the pressure drum 20, and the moving pressure plate 30 is minimized. Here, the switching valve 52 is closed to shut off from the outside atmosphere. Thereafter, the movable pressure plate 30 is moved to the top of the pressure cylinder 20 to reduce the internal pressure by maximizing the volume of the pressurizing / depressurizing tank. This state is maintained for a while, and the gas component of the adhesive layer applied to the interface between the substrate 70 and the electronic component 71 is released. Thereafter, the jig driving element 62 is operated to lower the film fixing jig 61, thereby sandwiching the periphery of the flexible film 72 between the processing jig 60 and the film fixing jig 61, The electronic component 71 is sealed from the upper space of the flexible film 72 (FIG. 4C). Next, the switching valve 52 is opened, and external air is sucked into the pressurizing / depressurizing tank. Since the pressurization / decompression tank changes from the depressurized state to the atmospheric pressure state, the flexible film 72 is in close contact with the substrate 71 and the electronic component 71. Further, by closing the switching valve and lowering the movable pressure-resistant plate 30 to the upper part of the flexible film to increase the internal pressure of the pressurizing / depressurizing tank, the flexible film 72 is further made to the substrate 70 and the electronic component. In addition to being in close contact with 71, pressure is also applied to the adhesive layer at the interface between the substrate 70 and the electronic component 71, and the adhesiveness of this portion is also increased.

  FIG. 5 shows an embodiment in the case where the present invention is applied to processing for impregnating a liquid component into a sintered metal part or various food products. An impregnation bath 80 is installed on the upper surface of the fixed pressure plate 10, and the impregnation liquid 85 is filled up to an appropriate liquid level in the interior thereof. A net-like rod 83 containing an impregnated component 84 is disposed at the upper part of the impregnation bath 80, and a rod driving element 81 is fixed to the left and right outer surfaces of the impregnation bath 80, and is attached to the upper end of the rod driving rod 82 of the rod driving element 81. A heel drive element 81 is coupled.

  FIG. 6 is a diagram for explaining the processing operation of the third embodiment. FIG. 6A shows a state in which the impregnated component 84 is accommodated in the mesh rod 83 and disposed at a position where it is not immersed in the impregnating liquid 85 in the impregnation bath 80. The switching valve 52 is opened to drive the pressure-resistant cylinder 20 and the moving pressure-resistant plate 30 to move them to the position shown in FIG. In this state, the volume of the pressurization / decompression tank formed by the fixed pressure plate 10, the pressure drum 20, and the moving pressure plate 30 is minimized. Here, the switching valve 52 is closed to shut off from the outside atmosphere. Thereafter, the movable pressure plate 30 is moved to the top of the pressure cylinder 20 to reduce the internal pressure by maximizing the volume of the pressurizing / depressurizing tank. While maintaining this state for a while, the gas component present in the impregnation component 84 is released, and the gas component in the impregnating liquid 85 is also released (FIG. 6C). Next, the rod driving element 81 is operated, and the mesh rod 80 is lowered until the impregnated component 84 is completely immersed in the impregnating liquid. Thereafter, the switching valve is opened, and the atmosphere is sucked into the pressurizing / pressure tank. As a result, since the atmospheric pressure is applied to the surface of the impregnating liquid 85, the impregnating liquid 85 enters the inside of the impregnation processing component 84. Further, the switching valve 52 is closed, the moving pressure plate 30 is lowered to the upper part of the mesh rod 80, and the pressure in the pressurizing / depressurizing tank is raised. As a result, the penetration of the impregnating solution 85 into the impregnated component 84 is further promoted, and a good impregnation process is possible.

Reference Example FIG. 7 shows a reference example in which other functional elements are added to the apparatus configuration shown in the first to third embodiments. In the first to third embodiments, the volume change of the pressurizing / depressurizing tank formed by the fixed pressure plate 10, the pressure cylinder 20, and the moving pressure plate 30 is realized by the movement of the moving pressure plate 30. There is a limit to the volume change of the pressurization / depressurization tank that can be realized because a space occupied by parts and various jigs for placing the parts and a useless space around the parts are generated. As a result, depending on the processing conditions, it may happen that the required pressurization / decompression values cannot be achieved. Therefore, a new switching valve 55 is installed instead of the switching valve 52 shown in the first to third embodiments, and an auxiliary air pressurizing pump 53 and a vacuum pump 54 are installed at the tip of the switching valve 55. It is possible to switch to four modes of pressurization, decompression, deadline, and air release, and these processing modes can be applied as appropriate in the processing processes of the first to third embodiments. With this configuration, the pressure of the pressurized pressure reducing tank is increased by the air pressure pump 53 and then increased by the movement of the moving pressure plate 30 so that a pressure higher than the capacity of the air pressure pump can be obtained. .

  Further, the heating means 90 provided on the upper portion of the lower support member 12 conducts heat to the processing member installed on the upper portion thereof via the fixed pressure plate 10 and makes it possible to adjust the temperature of the processing member. is there. Thereby, in Example 2, the flexible film | membrane 72 can be softened and the adhesiveness of the flexible film | membrane 72 to the board | substrate 70 and the electronic component 71 can be improved. Furthermore, the adhesive interposed between the substrate 70 and the electronic component 71 is softened to improve the adhesion, and the curing reaction of the adhesive can be promoted. Although it is convenient to use an electric heating element as a heat source of the heating means, a light irradiation means 91 is installed below the movable pressure-resistant plate 30, and light that is effective for processing can be directly irradiated to the processing member. Is possible. For the light irradiation means 91, infrared light, ultraviolet light, laser light, or the like can be used depending on the purpose of processing. In the figure, the light irradiation means 91 is provided at the lower part of the moving pressure plate 30, but if a material having a light transmission property is selected for a part or the whole of the moving pressure plate 30, the light is applied to the upper part of the moving pressure plate 30. It is possible to provide the irradiation means 91 and to protect the light irradiation means 91 from the pressure applied in the pressurized / reduced pressure tank.

  In the embodiment described above, the movable pressure plate 30 has been used to change the volume of the pressurizing / depressurizing tank. However, depending on the processing, the processing member placed on the upper surface of the fixed pressure plate 10 may be mechanical. It is also possible to press directly, and it is also possible to perform a press working process under a pressurized environment.

  According to the present invention, it is possible to realize a decompression / pressurization environment with an apparatus having a simple configuration, adhesion of electronic components to a substrate, sealing of electronic components, film sticking to various components, and fine transfer processing to the surface of a resin member. It is possible to eliminate defects caused by residual bubbles, such as impregnation treatment of sintered metal and food, and to perform high-quality processing. In addition to these cases, the pressure is reduced and pressurized. It can be applied to a wide range of applications for required processing.

DESCRIPTION OF SYMBOLS 10 Fixed pressure-resistant plate 11 Seal member 12 Lower support member 20 Pressure-resistant body 21 Stop plate 22 Body drive support plate 23 Body drive element 24 Body drive rod 30 Moving pressure plate 31 Seal member 32 Intake / exhaust hole (through hole)
33 Upper support member 34 Moving structure plate 35 Linear motion bearing 36 Pressure-resistant plate drive element 37 Pressure-resistant plate drive rod 40 Lower structure plate 41 Base 42 Post 43 Upper structure plate 50, 51 Hydraulic / pneumatic device 52, 53 Switching valve 60 Processing jig 61 Membrane Fixing Jig 62 Jig Drive Element 60 Jig Drive Rod 70 Substrate 71 Electronic Component 72 Flexible Membrane 70 Substrate 80 Impregnation Bath 81 Acupuncture Drive Element 82 Acupuncture Drive Rod 83 Reticulated Sponge 84 Impregnation Treatment Component 85 Impregnation Solution 90 Heating means 91 Light irradiation means

Claims (6)

  A fixed pressure plate, a pressure cylinder that is fitted to the outer periphery of the fixed pressure plate via a seal member, and a movement that is fitted to the inner surface of the pressure cylinder via a seal member and is disposed at an opposite position of the fixed pressure plate. A pressure plate, a cylinder drive mechanism that is connected to one end of the pressure cylinder and that can move the pressure cylinder in the direction of the central axis, a pressure plate drive mechanism that can move the movable pressure plate along the inner surface of the cylindrical pressure cylinder, A pressure-reducing cylinder, a switching valve connected via a pipe connected to a through-hole provided in any part of the pressure-reducing and pressurizing tank formed by the fixed pressure-resistant plate and the movable pressure-resistant plate, After the processing member is placed inside the pressure tank and the ventilation between the decompression / pressurization tank and the outside is shut off, the movable pressure plate is moved by the pressure plate driving mechanism, and the decompression / pressurization tank Depressurization and pressurization processing, characterized in that the internal pressure can be reduced or increased by changing the volume of Management apparatus.   The decompression / pressurization processing apparatus according to claim 1, wherein either or both of an auxiliary vacuum pump and an air pressurization pump are connected to the tip of the switching valve to improve the pressurization / decompression capability. A depressurizing / pressurizing processing apparatus characterized by being made.   The decompression / pressurization processing apparatus according to claim 1 or 2, further comprising a heating means or a light irradiation means for acting on the processing member mounted on the fixed pressure-resistant plate. Decompression and pressure processing equipment.   The pressure reduction / pressure processing apparatus according to any one of claims 1 to 3, wherein a flexible film is placed on an upper surface of a processing member placed on the fixed pressure plate, and the pressure reduction A decompression / pressurization processing apparatus characterized in that means for tightly fixing the flexible membrane to the fixed pressure-resistant plate is provided after the pressure in the pressurization tank is reduced.   5. The decompression / pressurization processing apparatus according to claim 1, wherein the decompression / pressurization tank formed by the pressure-resistant cylinder, the fixed pressure-resistant plate, and the movable pressure-resistant plate is formed. A function of bringing the moving pressure plate into contact with the processing member placed on the fixed pressure plate by the pressure plate driving mechanism and further applying mechanical pressure to the processing member via the moving pressure plate A pressure reduction / pressure processing apparatus having   The decompression / pressurization processing apparatus according to any one of claims 1 to 3, wherein the impregnation bath is placed on the fixed pressure-resistant plate, and a mesh strip containing a processing member on the top thereof. A decompression / pressurization processing apparatus, comprising: scissors moving means for moving the mesh stirrer to the impregnation bath and immersing the processing member in the impregnating liquid.