JP2016152392A - Printed circuit board, method of manufacturing the same and inductor product - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed circuit board which includes two chip inductors having the same electrical characteristics without reduction in mounting efficiency.SOLUTION: A pair of transmission lines is formed in a printed wiring board. Chip inductors having the same electrical characteristics are inserted into the pair of transmission lines respectively. Each of the chip inductors has the outer shape in which the dimension of the first direction of the first direction, second direction and third direction orthogonal to each other is longer than the dimensions of the second direction and the third direction, and which includes a pair of side surfaces orthogonal to the second direction and a pair of other side surfaces orthogonal to the third direction. The chip inductors are installed in the printed wiring board side by side with such a posture that the longitudinal directions are parallel to each other. The axial direction of the coil of one chip inductor is vertical to the printed wiring board and the axial direction of the coil of the other chip inductor is parallel to the printed wiring board.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a printed circuit board on which a chip inductor is mounted, a manufacturing method thereof, and an inductor product including a plurality of chip inductors accommodated in a carrier tape.

  An inductor for eliminating electromagnetic interference is inserted into the transmission line. It is desirable that a pair of inductors inserted in two transmission lines for transmitting mutually related high-frequency signals, for example, differential transmission lines, have the same electrical characteristics and have a small coupling coefficient between them.

  By increasing the distance between the two inductors, the coupling coefficient can be reduced. However, when two transmission lines run in parallel, it is difficult to widen the interval between the two inductors.

  Non-Patent Document 1 below discloses a mounting method in which two inductors are arranged such that the direction of magnetic flux is parallel to the substrate surface and orthogonal to each other, thereby reducing the coupling coefficient. Each of the two inductors has a long outer shape in the direction of the magnetic flux. When the inductor is mounted on the substrate in a posture in which the directions of the magnetic fluxes are orthogonal to each other, the two inductors are arranged in a T shape in the plane.

  Patent Document 1 below discloses an inductor array having three inductors in one chip. The directions of the magnetic fluxes of the three inductors constituting the inductor array are orthogonal to each other.

  Patent Document 2 below discloses a multilayer inductor with one identification mark for identifying the direction of magnetic flux generated in an internal coil. This multilayer inductor has a rectangular parallelepiped outer shape, and an identification mark is attached to one surface (for example, the upper surface) intersecting with the magnetic flux.

Japanese Patent Laid-Open No. 08-250333 Japanese Patent Laid-Open No. 06-215948

Transistor Technology SPECIAL for FRESHERS "Basics and Applications of Wireless Data Communication", Japan, CQ Publishing Company, January 1, 2011, SP No. 113, Part 3, Chapter 3, Page 67, Internet (URL: http://www.cqpub.co.jp/trs/sample113%20Folder/TRsp113_3S03.pdf)

  As in the mounting method disclosed in Non-Patent Document 1, in order to arrange the two inductors in a T shape, a wider mounting area is required than in the case where the two inductors are arranged side by side so that their longitudinal directions are parallel to each other. Is done. For this reason, the mounting efficiency of an inductor will fall.

  In the inductor array disclosed in Patent Document 1, a coil that generates a magnetic flux in the height direction and a coil that generates a magnetic flux in the lateral direction are formed in one chip. When a coil is formed by laminating green sheets, a winding pattern of a coil that generates magnetic flux in the height direction (the laminating direction of the green sheets) is formed in the plane of the green sheet. On the other hand, the portion of the coil winding pattern that generates the magnetic flux in the lateral direction that allows current to flow in the height direction is realized by a conductive member in the through hole formed in the green sheet.

  Thus, the structure of the coil that generates the magnetic flux in the height direction is different from that of the coil that generates the magnetic flux in the lateral direction. For this reason, it is difficult to make the electrical characteristics of the two inductors uniform. Therefore, this array inductor is not suitable for an application in which the same electrical characteristics are required for the two inductors, for example, an inductor for eliminating electromagnetic interference inserted in a differential transmission line.

  An object of the present invention is to provide a printed circuit board on which two chip inductors having the same electrical characteristics are mounted while avoiding a decrease in mounting efficiency. Another object of the present invention is to provide a method for manufacturing this printed circuit board. Still another object of the present invention is to provide an inductor product applicable to this printed circuit board manufacturing method.

A printed circuit board according to a first aspect of the present invention provides:
A printed wiring board on which a pair of transmission lines are formed;
A chip inductor inserted into each of the pair of transmission lines and having the same electrical characteristics;
Each of the chip inductors has a dimension in the first direction out of a first direction, a second direction, and a third direction orthogonal to each other, and the dimension in the second direction and the third direction. The outer shape including a pair of side surfaces orthogonal to the second direction and a pair of other side surfaces orthogonal to the third direction,
The chip inductor is mounted on the printed wiring board side by side in a posture in which the longitudinal directions are parallel to each other,
The axial direction of the coil of one chip inductor is perpendicular to the printed wiring board, and the axial direction of the coil of the other chip inductor is parallel to the printed wiring board.

  Since the axial directions of the coils of the two chip inductors are orthogonal to each other, the coupling coefficient between them can be reduced. Furthermore, since the electrical characteristics of the two chip inductors are the same, the influence of the chip inductor on the high-frequency signal propagating through the two transmission lines is almost the same. Since the chip inductors are arranged side by side in a posture in which the longitudinal directions thereof are parallel, the mounting area of the two chip inductors is substantially rectangular or square. For this reason, generation of dead space can be avoided and mounting efficiency can be increased.

  In the printed circuit board according to the second aspect of the present invention, in addition to the configuration of the printed circuit board according to the first aspect, the pair of transmission lines constitutes a differential transmission line.

  The pair of chip inductors have the same electrical characteristics and can be reduced in coupling coefficient even if they are arranged close to each other, and thus are suitable for application to a differential transmission line.

  In the printed circuit board according to the third aspect of the present invention, in addition to the configuration of the printed circuit board according to the first or second aspect, each of the chip inductors has a coil having an axis parallel to the second direction. including.

  When the second direction is perpendicular to the printed wiring board, the axial direction of the coil is perpendicular to the printed wiring board. When the second direction is parallel to the printed wiring board, the axial direction of the coil is parallel to the printed wiring board.

  In the printed circuit board according to the fourth aspect of the present invention, in addition to the configuration of the printed circuit board according to the first to third aspects, the dimensions of the chip inductor in the second direction and the third direction The dimensions are different.

  The areas of the side surface perpendicular to the second direction and the side surface perpendicular to the third direction are different. The posture of the chip inductor can be detected by the difference in the area of the side surface facing upward.

  In the printed circuit board according to the fifth aspect of the present invention, in addition to the configuration of the printed circuit board according to the first to third aspects, the dimensions of the chip inductor in the second direction and the third direction The dimensions are the same.

  Chip inductor lands mounted with the coil axial direction orthogonal to the printed wiring board and chip inductor lands mounted with the coil axial direction parallel to the printed wiring board. , It becomes the same shape.

  In the printed circuit board according to the sixth aspect of the present invention, in addition to the configuration of the printed circuit board according to the first to fifth aspects, a first mark is provided on at least one of the four side surfaces of the chip inductor. Is provided.

  By detecting the first mark, it is possible to determine the posture of the chip inductor.

  In the printed circuit board according to the seventh aspect of the present invention, in addition to the configuration of the printed circuit board according to the sixth aspect, among the four side faces of the chip inductor, the pair of side faces parallel to each other, A first mark is provided.

  Even if the posture of the chip inductor is turned upside down, the first mark can be detected from above.

  In the printed circuit board according to the eighth aspect of the present invention, in addition to the configuration of the printed circuit board according to the seventh aspect, one of the chip inductors includes a pair of the side surfaces provided with the first mark. Mounted on the printed wiring board in a posture facing up and down, and the other chip inductor is mounted on the printed wiring board in a posture in which a pair of side surfaces provided with the first marks are directed in the lateral direction. Has been.

  By detecting the first mark, the two chip inductors can be easily mounted on the printed wiring board in the above-described posture.

  In the printed circuit board according to the ninth aspect of the present invention, in addition to the configuration of the printed circuit board according to the sixth aspect, one of the four side surfaces parallel to the first direction of the chip inductor is provided. The first mark is provided, and a second mark that can be distinguished from the first mark is provided on the side surface adjacent to the side surface on which the first mark is provided. Is provided.

  By detecting the first mark or the second mark, the posture of the chip inductor can be determined.

  In the printed circuit board according to the tenth aspect of the present invention, in addition to the configuration of the printed circuit board according to the sixth aspect, one of the chip inductors has the side surface on which the first mark is provided facing upward. The other chip inductor is mounted on the printed wiring board in such a posture that the side surface on which the second mark is provided faces upward.

  By detecting the first mark or the second mark, the two chip inductors can be easily mounted on the printed wiring board in the above-described posture.

A method for manufacturing a printed circuit board according to an eleventh aspect of the present invention includes:
Forming a chip inductor on one of a pair of transmission lines formed on a printed wiring board; and
Mounting the other chip inductor having the same electrical characteristics as the chip inductor on the other of the pair of transmission lines,
Each of the chip inductors has a dimension in the first direction out of a first direction, a second direction, and a third direction orthogonal to each other, and the dimension in the second direction and the third direction. The outer shape including a pair of side surfaces orthogonal to the second direction and a pair of other side surfaces orthogonal to the third direction,
A pair of the chip inductors are mounted on the printed wiring board side by side in a posture in which the longitudinal directions are parallel to each other,
The chip inductor is placed in such a posture that the axial direction of the coil of one of the chip inductors is parallel to the printed wiring board and the axial direction of the other coil of the chip inductor is perpendicular to the printed wiring board. Implement.

  Since the axial directions of the coils of the two chip inductors are orthogonal to each other, the coupling coefficient between them can be reduced. Furthermore, since the electrical characteristics of the two chip inductors are the same, the influence of the chip inductor on the high-frequency signal propagating through the two transmission lines is almost the same. Since the chip inductors are arranged side by side in a posture in which the longitudinal directions thereof are parallel, the mounting area of the two chip inductors is substantially rectangular or square. For this reason, generation of dead space can be avoided and mounting efficiency can be increased.

The inductor product according to the twelfth aspect of the present invention is:
A carrier tape including a plurality of storage portions in a row;
A chip inductor respectively housed in the housing portion,
Each of the chip inductors has a dimension in the first direction out of a first direction, a second direction, and a third direction orthogonal to each other, and the dimension in the second direction and the third direction. The outer shape includes a pair of side surfaces orthogonal to the second direction and a pair of other side surfaces orthogonal to the third direction, and the first direction is the It is accommodated in the accommodating portion in a posture orthogonal to the thickness direction of the carrier tape,
The chip inductor in which the axial direction of the coil faces the thickness direction of the carrier tape and the chip inductor in which the axis of the coil faces the direction perpendicular to the thickness direction of the carrier tape are alternately arranged in the row direction. Is housed in.

  When two chip inductors adjacent in the row direction of the carrier tape are taken out and mounted on a printed wiring board while maintaining the posture, the axial direction of the coil of one chip inductor and the axial direction of the coil of the other chip inductor are Orthogonal.

  Since the axial directions of the coils of the two chip inductors are orthogonal to each other, the coupling coefficient between them can be reduced. Furthermore, since the electrical characteristics of the two chip inductors are the same, the influence of the chip inductor on the high-frequency signal propagating through the two transmission lines is almost the same. Since the chip inductors are arranged side by side in a posture in which the longitudinal directions thereof are parallel, the mounting area of the two chip inductors is substantially rectangular or square. For this reason, generation of dead space can be avoided and mounting efficiency can be increased.

1A is a perspective view of a chip inductor mounted on a printed circuit board according to an embodiment, and FIG. 1B is a perspective view of a main body of the chip inductor. 2A and 2B are a yz sectional view and a zx sectional view of the chip inductor, respectively. FIG. 3A is a schematic plan view of a part of a printed circuit board according to an embodiment, and FIG. 3B is a cross-sectional view perpendicular to the longitudinal direction of a pair of chip inductors. 4A is a plan view of two chip inductors mounted on a printed circuit board according to an embodiment, and FIG. 4AB is a plan view of two chip inductors mounted on a printed circuit board according to a comparative example. 5A is a schematic perspective view of a chip inductor mounted on a printed circuit board according to an embodiment (FIGS. 3A and 3B), and FIGS. 5B and 5C are mounted on a printed circuit board according to another embodiment. It is a schematic perspective view of a chip inductor. 6A is a cross-sectional view orthogonal to the longitudinal direction of the chip inductor according to the embodiment shown in FIG. 5C, and FIG. 6B is a cross-sectional view orthogonal to the longitudinal direction of the chip inductor according to the modification. 7A to 7C are schematic perspective views of a chip inductor mounted on a printed circuit board according to another embodiment. FIG. 8 is a schematic diagram of the chip mounter. 9A and 9B are schematic cross-sectional views of carrier tapes each accommodating a chip inductor. FIG. 10 is a schematic cross-sectional view of an inductor product used in a method for manufacturing a printed circuit board according to another embodiment.

  FIG. 1A is a perspective view of a chip inductor 10 mounted on a printed circuit board according to an embodiment. The chip inductor 10 includes a main body 11 having a rectangular parallelepiped outer shape and a pair of external electrodes 12. An xyz orthogonal coordinate system in which the vertical, horizontal, and height directions of the main body 11 are defined as an x direction, a y direction, and a z direction, respectively, is defined. The y-direction dimension of the main body 11 is longer than the x-direction dimension and the z-direction dimension. The dimensions of the main body 11 in the x direction and the dimension in the z direction are the same.

  External electrodes 12 are formed on both ends of the main body 11 in the y direction. Each of the external electrodes 12 covers the surface perpendicular to the y direction of the main body 11 and covers the vicinity of the end of the surface perpendicular to the x direction and the surface perpendicular to the z direction.

  The chip inductor 10 reflects the outer shape of the main body 11 and has an outer shape whose dimension in the y direction is longer than the dimensions in the x direction and the z direction. The chip inductor 10 includes a pair of side surfaces 13 orthogonal to the z direction and a pair of other side surfaces 14 orthogonal to the x direction.

  A mark 15 is provided on the pair of side surfaces 13. The mark 15 is formed of silver paste, colored glass material, or the like. By detecting the mark 15 with an optical device, the posture of the chip inductor 10 can be determined with respect to the rotation direction with the y direction as the rotation axis. Although FIG. 1A shows an example in which the mark 15 occupies almost half the area of the side surface 13, the mark 15 may have a size that occupies almost the entire area of the side surface 13 or may be smaller.

  FIG. 1B shows a perspective view of the main body 11 of the chip inductor 10 (FIG. 1A). A coil 17 is disposed in the main body 11. The axial direction of the coil 17, that is, the direction of the magnetic flux interlinking with the coil 17, is parallel to the z direction. Both ends of the coil 17 are exposed at a pair of end faces orthogonal to the y direction of the main body 11. A pair of external electrodes 12 (FIG. 1A) are electrically connected to the ends of the coils 17, respectively.

  Next, a manufacturing method of the chip inductor 10 will be described. The conductive circular pattern of the coil 17 and the conductor pillar for interlayer connection are formed on the plurality of green sheets. The green sheets are stacked, and the green sheets on which the marks 15 are formed are stacked on the lowermost layer and the uppermost layer.

  After crimping the stacked green sheets, the crimped green sheets are cut into chips. After the binder removal processing for each chip, firing is performed. The main body 11 of the chip inductor 10 is completed through the steps so far. An external electrode 12 (FIG. 1A) containing silver as a main component is applied to both ends of the main body 11 and baked. Nickel plating or solder plating is applied to the surface of the external electrode 12 that has been baked.

  2A and 2B are a yz sectional view and a zx sectional view of the chip inductor 10, respectively. A coil 17 is disposed in the main body 11. One end of the coil 17 is connected to one external electrode 12, and the other end is connected to the other external electrode 12. Marks 15 are respectively formed on a pair of side surfaces 13 perpendicular to the z direction of the main body 11. Marks are not formed on the pair of side surfaces 14 perpendicular to the x direction.

  FIG. 3A is a schematic plan view of a part of the printed circuit board 20 according to the embodiment. A pair of transmission lines 22 and a ground pattern 24 are formed on the printed circuit board 20. One transmission line 22 has a plane shape that is axisymmetric to the other transmission line 22. Further, a transmission circuit 21, a pair of chip inductors 10A and 10B, a pair of capacitors 25, and an impedance matching circuit 23 are mounted on the printed circuit board 20. An antenna 26 is connected to the impedance matching circuit 23.

  The transmission circuit 21 and the impedance matching circuit 23 are connected by a pair of transmission lines 22. Chip inductors 10 </ b> A and 10 </ b> B are inserted in series in portions of the transmission line 22 that run parallel to each other. As the chip inductors 10A and 10B, the chip inductor 10 shown in FIGS. 1A to 2B is used.

  The chip inductors 10A and 10B are arranged side by side so that their longitudinal directions (y direction in FIG. 1A) are parallel to each other. One chip inductor 10A is mounted in such a posture that the side surface 13 on which the mark 15 is provided faces upward, and the other chip inductor 10B is provided in a posture in which the side surface 13 faces in the lateral direction, that is, the mark 15 is provided. It is mounted in a posture in which no side surface 14 faces upward.

  The pair of transmission lines 22 are connected to the ground pattern 24 via the capacitors 25, respectively. High-frequency signals related to each other are transmitted from the transmission circuit 21 to the antenna 26 via the pair of transmission lines 22. As an example, a high frequency signal transmitted through one transmission line 22 is 180 degrees out of phase with a high frequency signal transmitted through the other transmission line 22. Thus, the pair of transmission lines 22 constitutes a differential transmission line. The impedance matching circuit 23 matches the output impedance of the transmission circuit 21 and the input impedance of the antenna 26.

  In the example shown in FIG. 3A, an analog signal is transmitted through the transmission line 22, but the chip inductors 10A and 10B can also be applied to a differential transmission line through which a digital signal is transmitted.

  The chip inductors 10A and 10B and the capacitor 25 have a function of increasing resistance to electromagnetic interference (EMI).

  FIG. 3B shows a cross-sectional view perpendicular to the longitudinal direction of the chip inductors 10A and 10B. Chip inductors 10 </ b> A and 10 </ b> B are mounted on the mounting surface of the printed wiring board 30. One chip inductor 10A is mounted such that the side surface 13 on which the mark 15 is formed faces in the vertical direction, and the other chip inductor 10B is mounted in a posture where the side surface 13 faces in the horizontal direction. That is, the axial direction 18A of the coil 17 of one chip inductor 10A is perpendicular to the printed wiring board 30, and the axial direction 18B of the coil 17 of the other chip inductor 10B is parallel to the printed wiring board 30. is there.

  The axial direction 18A of the coil 17 of one chip inductor 10A and the axial direction 18B of the coil 17 of the other chip inductor 10B are orthogonal to each other. For this reason, the coupling coefficient between the chip inductors 10A and 10B can be reduced.

  Next, the results of actually measuring the coupling coefficient after mounting the chip inductors 10A and 10B on the printed wiring board 30 will be described. The dimension (length) in the y direction of each of the chip inductors 10A and 10B is 1600 μm, and the dimension in the x direction and the dimension in the z direction are both 800 μm. The distance between the two chip inductors 10A and 10B is 200 μm. The inductances of the chip inductors 10A and 10B are both 150 nH.

  When the two chip inductors 10A and 10B were mounted in a posture in which the axial direction of the coil 17 was both perpendicular to the printed wiring board 30, the coupling coefficient was 0.05. On the other hand, as shown in FIG. 3B, when the two chip inductors 10A and 10B are mounted in a posture in which the axial directions 18A and 18B of the coil 17 are orthogonal to each other, the coupling coefficient is 0.01 or less. It was. Like the printed circuit board 20 according to the embodiment, the axial directions 18A and 18B of the coils 17 of the chip inductors 10A and 10B can be made to be substantially uncoupled by mutually orthogonally crossing each other.

  The two chip inductors 10A and 10B are of the same product standard and have the same structure. For this reason, it is easy to make the electrical characteristics of the chip inductors 10A and 10B, for example, the inductance the same. Here, “the same electrical characteristics” means that the electrical characteristics are within the range allowed by the product standard in consideration of manufacturing variations.

  Next, with reference to FIG. 4A and FIG. 4B, the outstanding effect of employ | adopting the structure of the printed circuit board by an Example is demonstrated.

  FIG. 4A shows a plan view of two chip inductors 10A and 10B mounted on the printed circuit board according to the embodiment. Two chip inductors 10A and 10B are arranged side by side in a posture in which the longitudinal directions are parallel to each other. For this reason, the mounting region 31 occupied by the two chip inductors 10A and 10B is substantially square or rectangular.

  FIG. 4B shows a plan view of chip inductors 10C and 10D mounted by the method according to the comparative example. The axial directions 18C and 18D of the coils of the chip inductors 10C and 10D are parallel to the longitudinal directions of the chip inductors 10C and 10D, respectively. The longitudinal direction of one chip inductor 10D is orthogonal to the longitudinal direction of the other chip inductor 10C. For this reason, the axial direction 18D of one coil is orthogonal to the axial direction 18C of the other coil.

  The pair of chip inductors 10 </ b> C and 10 </ b> D is disposed in the T-shaped mounting region 32. A difference area 33 between the smallest rectangle that encloses the mounting area 32 and the mounting area 32 becomes a dead space, and the mounting efficiency of the components is reduced.

  As in the embodiment, by arranging the pair of chip inductors 10A and 10B side by side in a posture in which the longitudinal direction is parallel, dead space can be reduced and component mounting efficiency can be increased.

  FIG. 5A is a schematic perspective view of the chip inductor 10 mounted on the printed circuit board 20 (FIGS. 3A and 3B) according to the embodiment. A mark 15 is provided on each of two side surfaces 13 of the chip inductor 10 having a substantially rectangular parallelepiped shape perpendicular to the axial direction of the coil. The other two side surfaces 14 are not provided with marks.

  When the mark 15 can be detected from above with a plurality of chip inductors 10 arranged on a horizontal tray (the left side of FIG. 5A), the axial direction of the coil of the chip inductor 10 is perpendicular to the horizontal plane. Can be determined. On the contrary, when the mark 15 cannot be detected from above (the diagram on the right side of FIG. 5A), it can be determined that the axial direction of the coil of the chip inductor 10 is parallel to the horizontal plane. For this reason, the chip inductor 10 in which the axis of the coil is oriented in the vertical direction and the chip inductor 10 in which the axis of the coil is oriented in the horizontal direction can be distinguished and picked up easily from the plurality of chip inductors 10 distributed in the tray. .

  5B and 5C are schematic perspective views of the chip inductor 10 mounted on the printed circuit board 20 (FIGS. 3A and 3B) according to another embodiment.

  In the embodiment shown in FIG. 5B, the mark 15 is provided on one of the two side surfaces 13 of the chip inductor 10 orthogonal to the axial direction of the coil. Another mark 16 is provided on one side surface 14 adjacent to the side surface 13 on which the mark 15 is provided. The other two side surfaces 13 and 14 are not provided with marks. The mark 15 and the mark 16 are different in shape, color, reflectance and the like, and can be distinguished by an optical detection device. For this reason, it is possible to detect which mark is facing upward by various detection devices such as an image recognition device and a reflected light intensity measurement device.

  When the mark 15 can be detected from above with the chip inductor 10 placed on a horizontal tray (the upper left diagram in FIG. 5B), the axial direction of the coil of the chip inductor 10 is perpendicular to the horizontal plane. Can be determined. When the mark 16 can be detected from above (the upper right diagram in FIG. 5B), it can be determined that the axial direction of the coil of the chip inductor 10 is parallel to the horizontal plane. When neither the mark 15 nor the mark 16 can be detected from above (the left and right figures in the lower part of FIG. 5B), the axial direction of the coil of the chip inductor 10 cannot be determined.

  In the embodiment shown in FIG. 5B, the chip inductor 10 in which the axis of the coil is oriented in the vertical direction and the chip inductor 10 in which the axis of the coil is oriented in the horizontal direction are easily distinguished from the plurality of chip inductors 10 dispersed on the horizontal plane. Can be picked up. The chip inductor 10 whose coil axial direction cannot be determined is redistributed in the tray. Due to the redistribution, some of the chip inductors 10 change to a posture in which the axial direction of the coil can be identified.

  In the embodiment shown in FIG. 5C, the mark 15 is provided on the two side surfaces 13 of the chip inductor 10 orthogonal to the axial direction of the coil. Another mark 16 is provided on the other side surface 14.

  When the mark 15 can be detected from above with the chip inductor 10 placed on a horizontal tray (the left and right diagrams in the upper stage of FIG. 5C), the axial direction of the coil of the chip inductor 10 is perpendicular to the horizontal plane. Can be determined. When the mark 16 can be detected from above (the left and right diagrams in the lower part of FIG. 5C), it can be determined that the axial direction of the coil of the chip inductor 10 is parallel to the horizontal plane.

  In the embodiment shown in FIG. 5C, the chip inductor 10 in which the axis of the coil is oriented in the vertical direction and the chip inductor 10 in which the axis of the coil is oriented in the horizontal direction are easily distinguished from the plurality of chip inductors 10 distributed in the tray. Can be picked up.

  The chip inductor 10 shown in FIGS. 5A to 5C has the same dimension in the two minor axis directions. For this reason, the land for the chip inductor 10 mounted in a posture in which the axial direction of the coil is orthogonal to the printed wiring board, and the chip inductor 10 mounted in a posture in which the axial direction of the coil is parallel to the printed wiring board. The land for use has the same shape. For this reason, the chip inductor 10 is mounted in an arbitrary one of the two mounting locations in a posture in which the axial direction of the coil is orthogonal to the printed wiring board, and on the other side, the axial direction of the coil is parallel to the printed wiring board. The chip inductor 10 may be mounted with a proper attitude.

  FIG. 6A shows a cross-sectional view orthogonal to the longitudinal direction of the chip inductor 10 according to the embodiment shown in FIG. 5C. A mark 15 is provided on a side surface 13 orthogonal to the axial direction of the coil 17. Another mark 16 is provided on two side surfaces 14 adjacent to the side surface 13. The mark 15 is already formed at a stage before the stacked green sheets are cut into chips.

  The mark 16 is formed by cutting a green sheet into a chip shape and then applying a silver paste, a colored glass material or the like to the side surface 14 of each chip. After applying a silver paste, a colored glass material, etc., a binder removal process and baking are performed.

  FIG. 6B shows a cross-sectional view orthogonal to the longitudinal direction of the chip inductor 10 according to a modification of the embodiment shown in FIG. 6A. In the embodiment shown in FIG. 6B, an isolated conductive pattern 16a isolated from the conductive pattern of the coil 17 is formed on the green sheet. The isolated conductive pattern 16a is arranged so as to straddle the cut portion of the stacked green sheets.

  After the laminated green sheets are cut into chips, the end surfaces of the isolated conductive patterns 16a are exposed on the side surfaces 14 of each chip. On the side surface 14, a striped pattern composed of the isolated conductive pattern 16a appears. This striped pattern corresponds to the mark 16. In the embodiment shown in FIG. 6B, it is not necessary to execute the step of forming the mark 16 after the green sheet is cut off.

  A chip inductor mounted on a printed circuit board according to another embodiment will be described with reference to FIGS. 7A to 7C. In the embodiment shown in FIGS. 1A to 5C, the dimensions of the chip inductor 10 in the two minor axis directions (the x direction and the z direction in FIG. 1A) are the same. In the example shown in FIGS. 7A to 7C, the two short-axis dimensions of the chip inductor 10 are different. 7A to 7C show an example in which the size of the chip inductor 10 in the direction parallel to the axial direction 18 of the coil is shorter than the sizes in the other two directions.

  In the embodiment shown in FIG. 7A, no mark is formed on either the side surface 13 orthogonal to the axial direction 18 of the coil or the side surface 14 adjacent to the side surface 13. The width of the side surface 13 is wider than the width of the side surface 14. Therefore, it is possible to discriminate between the chip inductor 10 with the side surface 13 facing upward and the chip inductor 10 with the side surface 14 facing upward in a state where the plurality of chip inductors 10 are arranged on a horizontal tray.

  When the side surface 13 can be detected from above (the left diagram in FIG. 7A), the axial direction 18 of the coil of the chip inductor 10 can be determined to be perpendicular to the horizontal plane. On the other hand, when the side surface 14 can be detected from above (the diagram on the right side of FIG. 7A), the axial direction 18 of the coil of the chip inductor 10 can be determined to be parallel to the horizontal plane.

  As shown in FIG. 7B, a mark 15 may be provided on the side surface 13. Further, as shown in FIG. 7C, the mark 15 may be provided on the side surface 13 and the mark 16 may be provided on the side surface 14. By providing the mark 15 and the mark 16, the accuracy of determining the posture of the chip inductor 10 can be increased.

  Next, a method for manufacturing the printed circuit board 20 according to the embodiment will be described with reference to FIGS.

  FIG. 8 shows a schematic diagram of the chip mounter. A printed wiring board 30 before chip component mounting is prepared in the chip mounter. A pair of transmission lines 22 is formed on the printed wiring board 30, and a place where the pair of chip inductors 10 are to be mounted is secured. Carrier tapes 40 </ b> A and 40 </ b> B that accommodate a plurality of chip inductors 10 are loaded in the component supply unit of the chip mounter.

  9A and 9B are schematic cross-sectional views of carrier tapes 40A and 40B that accommodate the chip inductor 10, respectively. The carrier tapes 40 </ b> A and 40 </ b> B have a plurality of accommodating portions 41 that form a row. In both carrier tapes 40A and 40B, the longitudinal direction of the chip inductor 10 is accommodated in the accommodating portion 41 in a posture orthogonal to the thickness direction of the carrier tapes 40A and 40B.

  As shown in FIG. 9A, the chip inductor 10 is held on one carrier tape 40A in a posture in which the side surface 13 (FIGS. 1A and 1B) provided with the mark 15 is directed upward. That is, the axial direction 18 of the coil of the chip inductor 10 is parallel to the thickness direction of the carrier tape 40A. As shown in FIG. 9B, the chip inductor 10 is held on the other carrier tape 40B in a posture in which the side surface 13 (FIGS. 1A and 1B) provided with the marks 15 is directed sideways. That is, the axial direction 18 of the coil of the chip inductor 10 is orthogonal to the thickness direction of the carrier tape 40B.

  The suction nozzle 43 shown in FIG. 8 takes out the chip inductor 10 from one carrier tape 40 </ b> A and mounts it on one mounting location of the chip inductor 10. Thereafter, the suction nozzle 43 takes out the chip inductor 10 from the other carrier tape 40 </ b> B and mounts it on the other mounting location of the chip inductor 10. The chip inductor 10 taken out from one carrier tape 40A is mounted on the printed wiring board 30 with the side surface 13 provided with the marks 15 facing upward. The chip inductor 10 taken out from the other carrier tape 40B is mounted on the printed wiring board 30 such that the side surface 13 provided with the mark 15 faces in the lateral direction.

  As described above, the two carrier tapes 40A and 40B that accommodate the chip inductor 10 in different postures are prepared. Thereby, a pair of chip inductors 10 of the same standard can be mounted on the printed wiring board 30 in a posture in which the axial directions 18 of the coils are orthogonal to each other.

  FIG. 10 is a schematic cross-sectional view of an inductor product used in a method for manufacturing a printed circuit board 20 according to another embodiment. This inductor product includes a carrier tape 40 and a plurality of chip inductors 10 </ b> A and 10 </ b> B accommodated in the carrier tape 40. Hereinafter, differences from the embodiment shown in FIGS. 8, 9A, and 9B will be described, and description of common configurations will be omitted.

  In the embodiment shown in FIG. 10, the chip inductor 10 </ b> A in which the side surface 13 provided with the mark 15 faces upward and the chip inductor 10 </ b> B in which the side surface 13 provided with the mark 15 faces in the lateral direction are the length of the carrier tape 40. They are housed alternately in the vertical direction. In other words, the chip inductor 10A has a posture in which the axial direction 18A of the coil is parallel to the thickness direction of the carrier tape 40, and the chip inductor 10B has a posture in which the axial direction 18B of the coil is perpendicular to the thickness direction of the carrier tape 40. Alternately housed

  The odd-numbered chip inductor 10 </ b> A is mounted at one mounting location of the chip inductor 10, and the even-numbered chip inductor 10 </ b> B is mounted at the other mounting location of the chip inductor 10. Thereby, a pair of chip inductors 10A and 10B of the same standard can be mounted on the printed wiring board 30 in a posture in which the axial directions 18A and 18B of the coils are orthogonal to each other.

  In the embodiment shown in FIGS. 1A to 10, the multilayer inductor is exemplified as the chip inductor 10, but an inductor having another structure can also be used. For example, a spiral film type inductor can be used as the chip inductor 10.

  Each embodiment is an exemplification, and needless to say, partial replacement or combination of the configurations shown in the different embodiments is possible. About the same effect by the same composition of a plurality of examples, it does not refer to every example one by one. Furthermore, the present invention is not limited to the embodiments described above. It will be apparent to those skilled in the art that various modifications, improvements, combinations, and the like can be made.

10, 10A, 10B, 10C, 10D Chip inductor 11 Main body 12 External electrodes 13, 14 Side surface 15, 16 Mark 16a Isolated conductive pattern 17 Coil 18, 18A, 18B, 18C, 18D Coil axial direction 20 Printed circuit board 21 Transmitting circuit 22 Transmission line 23 Impedance matching circuit 24 Ground pattern 25 Capacitor 26 Antenna 30 Printed wiring board 31 Mounting area 32 T-shaped mounting area 33 Difference area 40, 40A, 40B Carrier tape 41 Housing part 43 Adsorption nozzle

Claims (10)

A printed wiring board on which a pair of transmission lines are formed;
A chip inductor inserted into each of the pair of transmission lines and having the same electrical characteristics;
Each of the chip inductors has a dimension in the first direction out of a first direction, a second direction, and a third direction orthogonal to each other, and the dimension in the second direction and the third direction. The outer shape including a pair of side surfaces orthogonal to the second direction and a pair of other side surfaces orthogonal to the third direction,
The chip inductor is mounted on the printed wiring board side by side in a posture in which the longitudinal directions are parallel to each other,
A printed circuit board in which an axial direction of a coil of one of the chip inductors is perpendicular to the printed wiring board, and an axial direction of the coil of the other chip inductor is parallel to the printed wiring board.   The printed circuit board according to claim 1, wherein the pair of transmission lines constitutes a differential transmission line.   The printed circuit board according to claim 1, wherein a dimension of the chip inductor in the second direction is different from a dimension in the third direction.   3. The printed circuit board according to claim 1, wherein a dimension of the chip inductor in the second direction is the same as a dimension of the third direction. 4.   5. The printed circuit board according to claim 1, wherein, of the four side surfaces of the chip inductor, the first mark is provided on a pair of the side surfaces parallel to each other. 6. One of the chip inductors is mounted on the printed wiring board in a posture in which a pair of the side surfaces provided with the first mark face upward and downward,
6. The printed circuit board according to claim 5, wherein the other chip inductor is mounted on the printed wiring board in a posture in which a pair of side surfaces provided with the first mark face in a lateral direction.   One of the four side surfaces parallel to the first direction of the chip inductor is provided with the first mark, and adjacent to the side surface on which the first mark is provided. The printed circuit board according to claim 5, wherein a second mark that can be distinguished from the first mark is provided on the matching side surface. One of the chip inductors is mounted on the printed wiring board in a posture in which the side surface on which the first mark is provided faces upward,
The printed circuit board according to claim 7, wherein the other chip inductor is mounted on the printed wiring board in a posture in which the side surface on which the second mark is provided faces upward. Forming a chip inductor on one of a pair of transmission lines formed on a printed wiring board; and
Mounting the other chip inductor having the same electrical characteristics as the chip inductor on the other of the pair of transmission lines,
Each of the chip inductors has a dimension in the first direction out of a first direction, a second direction, and a third direction orthogonal to each other, and the dimension in the second direction and the third direction. The outer shape including a pair of side surfaces orthogonal to the second direction and a pair of other side surfaces orthogonal to the third direction,
A pair of the chip inductors are mounted on the printed wiring board side by side in a posture in which the longitudinal directions are parallel to each other,
The chip inductor is placed in such a posture that the axial direction of the coil of one of the chip inductors is parallel to the printed wiring board and the axial direction of the other coil of the chip inductor is perpendicular to the printed wiring board. Manufacturing method of printed circuit board to be mounted. A carrier tape including a plurality of storage portions in a row;
A chip inductor respectively housed in the housing portion,
Each of the chip inductors has a dimension in the first direction out of a first direction, a second direction, and a third direction orthogonal to each other, and the dimension in the second direction and the third direction. The outer shape includes a pair of side surfaces orthogonal to the second direction and a pair of other side surfaces orthogonal to the third direction, and the first direction is the It is accommodated in the accommodating portion in a posture orthogonal to the thickness direction of the carrier tape,
The chip inductor in which the axial direction of the coil faces the thickness direction of the carrier tape and the chip inductor in which the axis of the coil faces the direction perpendicular to the thickness direction of the carrier tape are alternately arranged in the row direction. Inductor products housed in.

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