JP2016152292A - Housing system and drawing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a die aggregate from being held by a holder in the state where the die aggregate is bent.SOLUTION: In a rack 110, a tabular die aggregate 90 is accommodated by supporting both the edge parts thereof. In the rack, an upper arm 130 is inserted into an upper side of the die aggregate that is accommodated in the rack 110 while being bent, and a lower arm 132 is inserted into a lower side of the die aggregate. By moving the lower arm towards the upper arm, the die aggregate is held by the upper arm and the lower arm and by moving the upper arm and the lower arm away from the rack, the die aggregate is drawn from a cabinet. Namely, the die aggregate being bent is held by the upper arm and the lower arm while being carried up from the lower side by the lower arm. Thus, the die aggregate can be held by the upper arm and the lower arm while reducing a bending amount.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a storage system including a storage for storing a plate-shaped member to be stored by supporting both ends of the plate-like member, and a method for pulling out the member to be stored from the storage.

  Some mounting machines that mount electronic components on circuit boards, etc., are equipped with storages that store plate-like members such as wafers by supporting them at both ends. During the work, a plate-like member to be stored such as a wafer is pulled out from the storage. In the following patent document, an example of a storage system including such a storage is described.

JP2012-084715A

  In a storage having a structure in which a plate-like member to be stored such as a wafer is supported at both ends thereof, a thin member to be stored may be stored in a bent state. In this way, when the member to be stored stored in a bent state is pulled out from the storage, if the member is gripped by the gripping tool, the member to be stored may be damaged. Further, the stored member gripped in a bent state is difficult to pull out from the storage, and if the stored member is forcibly pulled out, the stored member may be damaged. This invention is made | formed in view of such a situation, and makes it a subject to suppress the holding | grip by the holding tool in the state which the to-be-stored member bent.

  In order to solve the above-described problems, the storage system of the present invention includes a storage for storing a plate-shaped stored member by supporting the plate-shaped stored member at both edges thereof, and the stored member stored in the storage. A lower arm that is inserted below the upper member and an upper arm that is inserted above the member to be stored, a gripping tool that grips the member to be stored by the lower arm and the upper arm, and the storage of the gripping tool. A first moving device that moves in a direction to approach / separate the storage, a second moving device that relatively moves the gripping tool and the storage in the vertical direction, the gripping tool, the first moving device, and the A control device that controls the operation of the second moving device, wherein the control device moves the lower arm toward the upper arm, thereby gripping the member to be stored by the gripping tool, The operation of the gripping tool and the first moving device is controlled so as to pull out the member to be stored from the storage by moving the gripping tool that holds the storage member in a direction away from the storage. It is characterized by that.

  Further, in order to solve the above-described problem, the drawing method of the present invention uses a gripping tool having a lower arm and an upper arm from a storage that stores a plate-shaped member to be stored by supporting both of its edges. A method of pulling out the member to be stored, wherein the lowering arm is inserted below the member to be stored stored in the storage, and the upper arm is inserted above the member to be stored. An approaching step of bringing the gripping tool closer to the storage; a gripping step of gripping the member to be stored by the gripping tool by moving the lower arm toward the upper arm; and the member to be stored A separation step of pulling out the member to be stored from the storage by moving the gripping tool that grips the storage in a direction to separate from the storage. To.

  In the storage system and the pull-out method of the present invention, the upper arm of the gripping tool is inserted above the member to be stored stored in the storage, and the lower arm of the gripping tool is inserted below the member to be stored. Then, by moving the lower arm toward the upper arm, the member to be stored is gripped by the gripping tool, and the gripping tool that grips the member to be stored moves in a direction away from the storage, so that the member to be stored is stored. It is pulled out of the warehouse. That is, the member to be stored is gripped by the upper arm and the lower arm in a state where the member to be stored in the bent state is lifted from below by the lower arm. As a result, the member to be stored can be gripped by the upper arm and the lower arm while the amount of bending is reduced.

It is a perspective view which shows an electronic component mounting machine. It is a top view which shows an electronic component mounting machine. It is a perspective view which shows a die supply apparatus. It is a block diagram which shows the control apparatus with which an electronic component mounting machine is provided. It is the schematic which shows the die | dye assembly accommodated in the rack. It is the schematic which shows the die | dye assembly hold | gripped by the upper arm and the lower arm in the bent state. It is the schematic which shows the die | dye assembly hold | gripped by the upper arm and the lower arm in the flat state. It is the schematic which shows the state by which the clamp was inserted in the rack. It is the schematic which shows the state by which the clamp was moved upwards. It is the schematic which shows the die | dye assembly hold | gripped by the upper arm and the lower arm in the flat state.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

<Configuration of electronic component mounting machine>
1 and 2 show an electronic component mounting machine 10 according to an embodiment of the present invention. FIG. 1 is a perspective view of the electronic component mounting machine 10, and FIG. 2 is a diagram showing the electronic component mounting machine 10 with the cover 12 and the like removed from a viewpoint from above. The electronic component mounting machine 10 is a working machine for mounting electronic components on a circuit board. The electronic component mounting machine 10 includes a transport device 20, a mounting head moving device (hereinafter sometimes abbreviated as “moving device”) 22, a mounting head 24, and a die supply device 30. In the following description, the width direction of the electronic component mounting machine 10 is referred to as an X-axis direction, and a horizontal direction perpendicular to the direction is referred to as a Y-axis direction.

  The transport device 20 includes two conveyor devices 40 and 42. The two conveyor devices 40 and 42 are arranged on the base 46 so as to be parallel to each other and extend in the X-axis direction. Each of the two conveyor devices 40, 42 conveys the circuit board in the X-axis direction by driving an electromagnetic motor (see FIG. 4) 47. The circuit board is fixedly held by a board holding device (see FIG. 4) 48 at a predetermined position.

  The moving device 22 has a pair of Y-axis direction guide rails 50 extending in the Y-axis direction and an X-axis direction guide rail 52 extending in the X-axis direction. The X-axis direction guide rail 52 is overlaid on a pair of Y-axis direction guide rails 50. The X-axis direction guide rail 52 is moved to an arbitrary position in the Y-axis direction by driving an electromagnetic motor (see FIG. 4) 53. The X-axis direction guide rail 52 holds a slider 54 so as to be movable along its own axis. The slider 54 is moved to an arbitrary position in the X-axis direction by driving an electromagnetic motor (see FIG. 4) 55. The mounting head 24 is attached to the slider 54. With such a structure, the mounting head 24 moves to an arbitrary position on the base 46.

  The mounting head 24 mounts electronic components on a circuit board. The mounting head 24 has a suction nozzle 60 provided on the lower end surface. The suction nozzle 60 communicates with a positive / negative pressure supply device (see FIG. 4) 62 via negative pressure air and positive pressure air passages. The suction nozzle 60 sucks and holds the electronic component with a negative pressure, and detaches the held electronic component with a positive pressure. The mounting head 24 has a nozzle lifting device (see FIG. 4) 64 that lifts and lowers the suction nozzle 60. The mounting head 24 changes the vertical position of the electronic component to be held by the nozzle lifting device 64. The suction nozzle 60 is detachable from the mounting head 24.

  The die supply device 30 is provided at one end of the base 46 in the Y-axis direction. Specifically, a recessed storage portion 86 is formed at the edge of the base 46, and a part of the die supply device 30 is stored in the storage portion 86. As shown in FIG. 3, the die supply device 30 supplies the die 92 from the die assembly 90. The die assembly 90 is formed by dicing a wafer in which a dicing sheet is attached.

  The die supply device 30 includes a main frame 100, a die assembly housing device 102, a die assembly holding device 104, a pickup head 106, and a pickup head moving device (hereinafter, may be abbreviated as “moving device”) 108. ing.

  The upper surface of the main frame 100 is generally rectangular, and the die assembly holding device 104, the pickup head 106, and the moving device 108 are disposed on the upper surface. The die supply device 30 is attached to the base 46 by storing the main frame 100 in the storage portion 86.

  The die assembly accommodation apparatus 102 includes a rack 110 and a lifting table 112. The rack 110 is disposed on a lifting table 112, and a plurality of die assemblies 90 are accommodated in the rack 110 in a stacked state. Specifically, the rack 110 is generally box-shaped and has an open front surface. As shown in FIG. 4, a plurality of wafer receiving portions 114 are formed in a shelf shape inside a pair of side surfaces 113 of the rack 110 facing each other. The plurality of wafer receiving portions 114 have a shape protruding toward the inside of the rack 110 and are formed at equal intervals in the vertical direction. Further, the wafer receiving portion 114 formed on one of the pair of side surfaces 113 and the wafer receiving portion 114 formed on the other of the pair of side surfaces 113 are positioned substantially horizontally. As a result, the die assembly 90 is placed on the wafer receiving portion 114 formed on each of the pair of side surfaces 113 and positioned horizontally. With such a structure, a plurality of die assemblies 90 are accommodated in the rack 110 in a stacked state. The lifting table 112 is moved up and down by being lifted and lowered by a table lifting mechanism 115 (see FIG. 4). Thereby, the die assembly 90 accommodated in the rack 110 moves to an arbitrary position in the vertical direction.

  The die assembly holding device 104 includes a pair of guide rails 116 and a holding frame 118 as shown in FIGS. 2 and 3. The pair of guide rails 116 are disposed on the main frame 100 so as to extend in the Y-axis direction, and support the holding frame 118 so as to be movable in the Y-axis direction. The holding frame 118 is moved in the Y-axis direction along the guide rail 116 by a frame moving mechanism (see FIG. 4) 119.

  The pickup head 106 picks up the die 92 from the die assembly 90, and a plurality of suction nozzles 120 are mounted on the lower surface. Each suction nozzle 120 communicates with a positive / negative pressure supply device 121 (see FIG. 4). The suction nozzle 120 sucks and holds the die 92 with a negative pressure, and releases the held die 92 with a positive pressure. Further, the pickup head 106 can be inverted in the vertical direction and the nozzle port of the suction nozzle 120 can be directed upward. As a result, the die 92 sucked and held by the suction nozzle 120 is supplied at the top of the pickup head 106.

  The moving device 108 has a pair of Y-axis direction guide rails 122 extending in the Y-axis direction and an X-axis direction guide rail 124 extending in the X-axis direction. The X-axis direction guide rail 124 is overlaid on a pair of Y-axis direction guide rails 122. Then, the X-axis direction guide rail 124 moves to an arbitrary position in the Y-axis direction by driving an electromagnetic motor (see FIG. 4) 125. The X-axis direction guide rail 124 holds a slider 126 so as to be movable along its own axis. The slider 126 is moved to an arbitrary position in the X-axis direction by driving an electromagnetic motor (see FIG. 4) 127. A pickup head 106 is attached to the slider 126. With such a structure, the pickup head 106 moves to an arbitrary position on the main frame 100.

  A clamp 128 is attached to the back surface of the X-axis direction guide rail 124 of the moving device 108. The clamp 128 holds the die assembly 90 accommodated in the rack 110 of the die assembly accommodation apparatus 102. Specifically, the clamp 128 includes an upper arm 130 and a lower arm 132 (see FIG. 5) that extend toward the inside of the rack 110. The upper arm 130 and the lower arm 132 are disposed apart from each other in the vertical direction, and the upper arm 130 is positioned above the lower arm 132. The lower arm 132 approaches the upper arm 130 by driving an electromagnetic motor (not shown). As a result, the die assembly 90 positioned between the upper arm 130 and the lower arm 132 is gripped by the upper arm 130 and the lower arm 132. The clamp 128 includes a position sensor 134, and the position sensor 134 is located above and below the die assembly 90 at a position facing the clamp 128 among the plurality of die assemblies 90 housed in the rack 110. Detect the position of the direction.

  Moreover, the electronic component mounting machine 10 is provided with the control apparatus 150, as shown in FIG. The control device 150 includes a controller 152 and a plurality of drive circuits 154. The plurality of drive circuits 154 are connected to the electromagnetic motors 47, 53, 55, 125, 127, the substrate holding device 48, the positive / negative pressure supply devices 62, 121, the nozzle lifting / lowering device 64, the table lifting / lowering mechanism 115, and the frame moving mechanism 119. ing. The controller 152 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 154. Thereby, the operation of the transport device 20, the moving device 22, etc. is controlled by the controller 152.

<Mounting work with electronic component mounting machine>
With the above-described configuration, the electronic component mounting machine 10 performs a mounting operation for mounting the die 92 on the circuit board. Specifically, the circuit board is transported to the work position according to a command from the controller 152 of the electronic component mounting machine 10, and the circuit board is fixedly held at the position. In addition, the die supply device 30 supplies the die 92 using the pickup head 106.

  Specifically, the elevator table 112 is raised and lowered by a command from the controller 152, and any die assembly 90 among the plurality of die assemblies 90 accommodated in the rack 110 is moved to a position facing the clamp 128. To do. At this time, the X-axis direction guide rail 124 is moved away from the rack 110, and the clamp 128 is pulled out from the inside of the rack 110. Thereby, the die assembly 90 accommodated in the rack 110 moves in the vertical direction without interfering with the clamp 128.

  When an arbitrary die assembly 90 of the plurality of die assemblies 90 accommodated in the rack 110 moves to a position facing the clamp 128, the X-axis direction guide rail 124 moves in a direction approaching the rack 110. Then, the clamp 128 enters the inside of the rack 110. At this time, the upper arm 130 of the clamp 128 is inserted above the die assembly 90 at a position facing the clamp 128, and the lower arm 132 is inserted below the die assembly 90. The die assembly 90 is gripped by the upper arm 130 and the lower arm 132, but the die assembly 90 may be gripped in a bent state.

  Specifically, in recent years, when there is a thin wafer having a thickness of 200 μm or less and the outer diameter of such a thin wafer is, for example, 6 inches, the die assembly 90 of such a wafer is placed in the rack 110. When it is housed, it bends by about 1.5 mm due to its own weight. Therefore, for example, as shown in FIG. 6, the die assembly 90 in a bent state may be gripped by the upper arm 130 and the lower arm 132. Thus, if the die assembly 90 is gripped in a bent state, the die assembly 90 may be damaged. Further, the die assembly 90 held by the clamp 128 is pulled out from the rack 110, but the die assembly 90 held by the clamp 128 in a bent state is difficult to pull out from the rack 110, and the die assembly 90 is When it is pulled out from the rack 110, the die assembly 90 may be damaged.

  In view of the above, in the die supply apparatus 30, the die assembly 90 is gripped by the clamp 128 in a flat state without being bent. Specifically, the rack 110 is raised and lowered by the lifting table 112 so that the die assembly 90 to be gripped among the plurality of die assemblies 90 accommodated in the rack 110 and the clamp 128 face each other. When the rack 110 moves up and down, the X-axis direction guide rail 124 is moved in a direction away from the rack 110 as described above, and the clamp 128 is pulled out from the inside of the rack 110. When the rack 110 is moved up and down, as shown in FIG. 5, the vertical position of the portion where the die assembly 90 to be grasped is supported by the wafer receiving portion 114 of the rack 110 and the lower surface of the upper arm 130. The rack 110 is moved up and down by the lifting table 112 so that the position in the vertical direction matches. That is, the position in the vertical direction of the uppermost position of the die assembly 90 in the bent state (hereinafter sometimes referred to as “the position of the uppermost point of the die assembly 90”) and the grip of the upper arm 130 The rack 110 is moved up and down by the lifting table 112 so that the vertical position of the surface matches. The vertical position of the wafer receiving portion 114 of the rack 110 is stored in the controller 152, and the position of the uppermost point of the die assembly 90 is calculated based on the vertical position of the wafer receiving portion 114. The

  When the raising / lowering of the rack 110 is completed, the position sensor 134 attached to the clamp 128 detects the vertical position of the die assembly 90 to be grasped. At this time, the position sensor 134 detects a position located at the lowest position of the die assembly 90 in a bent state. Then, when the clamp 128 is inserted into the rack 110 in a state where the position of the uppermost point of the die assembly 90 in the bent state and the position of the upper arm 130 in the vertical direction of the grip surface coincide with each other. Whether or not the lower arm 132 is inserted below the bent die assembly 90 is determined based on the detection value of the position sensor 134.

  Specifically, the position of the uppermost point of the die assembly 90 is calculated based on the operation amount of the lifting table 112. Next, the position of the uppermost point of the die assembly 90 and the detection value of the position sensor 134, that is, the vertical position of the position located at the lowest position of the die assembly 90 in the bent state (hereinafter referred to as “die”). The amount of deflection of the die assembly 90 is calculated on the basis of “the position of the lowest point of the assembly 90”. Then, it is determined whether or not the bending amount of the die assembly 90 is smaller than the maximum separation amount between the gripping surface (lower surface) of the upper arm 130 of the clamp 128 and the gripping surface (upper surface) of the lower arm 132. The maximum distance between the gripping surface of the upper arm 130 and the gripping surface of the lower arm 132 is specified by the structure of the clamp 128. When the amount of bending of the die assembly 90 is smaller than the maximum distance between the gripping surface of the upper arm 130 and the gripping surface of the lower arm 132, the die 128 is bent when inserted into the rack 110. It is determined that the lower arm 132 is inserted below the die assembly 90 in the state. On the other hand, when the bending amount of the die assembly 90 is equal to or larger than the maximum separation amount between the gripping surface of the upper arm 130 and the gripping surface of the lower arm 132, the bending is performed when the clamp 128 is inserted into the rack 110. It is determined that the lower arm 132 is not inserted below the die assembly 90 in the dead state.

  If it is determined by the above procedure that the lower arm 132 is inserted below the bent die assembly 90 when the clamp 128 is inserted into the rack 110, the X-axis direction guide rail 124 is The clamp 128 is inserted into the rack 110. Accordingly, as shown in FIG. 5, the upper arm 130 is inserted above the die assembly 90 to be grasped, and the lower arm 132 is inserted below the die assembly 90 to be grasped. At this time, the vertical position of the gripping surface of the upper arm 130 coincides with the position of the uppermost point of the die assembly 90 as described above. Then, the lower arm 132 moves in a direction approaching the upper arm 130 according to a command from the controller 152. As a result, the die assembly 90 to be grasped is grasped by the upper arm 130 and the lower arm 132 in a flat state without bending as shown in FIG.

  Further, when the die assembly 90 to be gripped is stored in the rack 110 in a greatly bent state, the position of the uppermost point of the bent die assembly 90 and the upper and lower sides of the grip surface of the upper arm 130 are When the clamp 128 is inserted into the rack 110 in a state where the direction position matches, the lower arm 132 may not be inserted below the bent die assembly 90. That is, according to the above procedure, it may be determined that the lower arm 132 is not inserted below the bent die assembly 90 when the clamp 128 is inserted into the rack 110. In such a case, the die assembly 90 to be grasped is positioned between the upper arm 130 and the lower arm 132 based on the detection value of the position sensor 134, that is, the position of the lowest point of the die assembly 90. As described above, the elevating table 112 is raised and lowered. Note that the clamp 128 is not inserted into the rack 110 as described above when the elevating table 112 is raised or lowered.

  When the lifting of the lifting table 112 is completed, the X-axis direction guide rail 124 moves toward the rack 110 and the clamp 128 is inserted into the rack 110. As a result, as shown in FIG. 8, the upper arm 130 is inserted above the die assembly 90 to be grasped, and the lower arm 132 is inserted below the die assembly 90 to be grasped. However, the vertical position of the gripping surface of the upper arm 130 does not coincide with the position of the uppermost point of the die assembly 90 due to the lifting and lowering of the lifting table 112. For this reason, the lifting table 112 is lifted and lowered with the clamp 128 inserted into the rack 110. At this time, as shown in FIG. 9, the elevating table 112 is moved up and down so that the vertical position of the gripping surface of the upper arm 130 matches the position of the uppermost point of the die assembly 90. Then, the lower arm 132 moves in a direction approaching the upper arm 130. As a result, the die assembly 90 to be grasped is grasped by the upper arm 130 and the lower arm 132 in a flat state without being bent as shown in FIG.

  When the die assembly 90 is gripped by the upper arm 130 and the lower arm 132, the X-axis direction guide rail 124 moves in the X-axis direction. As a result, the die assembly 90 held by the upper arm 130 and the lower arm 132 is pulled out onto the holding frame 118. The die assembly 90 drawn from the rack 110 is positioned on the holding frame 118 shown by the solid line in FIG. Next, the pickup head 106 moves above the die 92 to be picked up, and the suction nozzle 120 holds the die 92 by suction.

  Subsequently, the pickup head 106 is inverted in the vertical direction. As a result, the die 92 sucked and held by the suction nozzle 120 is supplied at the top of the pickup head 106. When the die 92 is supplied at the top of the pickup head 106, the mounting head 24 moves above the pickup head 106, and the suction nozzle 60 holds the die 92 by suction. Then, the mounting head 24 moves onto the circuit board, and the die 92 is mounted on the circuit board.

  Further, the die supply device 30 can directly supply the die 92 from the die supply device 30 without using the pickup head 106. Specifically, after the die assembly 90 is pulled out from the rack 110 onto the holding frame 118, the holding frame 118 is moved in the Y-axis direction. Thus, the die assembly 90 is positioned on the holding frame 118 indicated by the dotted line in FIG. Then, the mounting head 24 moves above the die assembly 90 and the die 92 is sucked and held by the suction nozzle 60. Thereby, the die 92 picked up directly from the die assembly 90 is mounted on the circuit board.

  As described above, in the die supply device 30, the die assembly 90 accommodated in the rack 110 is gripped by the upper arm 130 and the lower arm 132 in a flat state without being bent. For this reason, it becomes possible to prevent damage to the die assembly 90 due to gripping. In addition, since the die assembly 90 held in a flat state is pulled out from the rack 110, the die assembly 90 can be easily pulled out from the rack 110, and damage due to excessive pulling out of the die assembly 90 can be prevented. Is possible.

  Incidentally, in the above-described embodiment, the die supply device 30 is an example of a storage system. The die assembly 90 is an example of a member to be stored and a wafer. The moving device 108 is an example of a first moving device. The rack 110 is an example of a storage. The lifting table 112 is an example of a second moving device. The clamp 128 is an example of a gripping tool. The upper arm 130 is an example of an upper arm. The lower arm 132 is an example of a lower arm. The position sensor 134 is an example of a detection sensor. The control device 150 is an example of a control device.

  In addition, this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, the rack 110 in which the die assembly 90 is accommodated moves in the vertical direction, so that the relative relationship between the die assembly 90 to be grasped and the clamp 128 is increased. Although the position has been changed, the relative vertical position between the die assembly 90 to be grasped and the clamp 128 may be changed by moving the clamp 128 in the vertical direction.

  Further, in the above embodiment, the present invention is applied when the die assembly 90 is pulled out from the rack 110, but the present invention can be applied when a tray or the like is pulled out from the storage. .

  In the above embodiment, the position of the uppermost point of the die assembly 90 is calculated based on the position of the wafer receiving portion 114 in the vertical direction. The position sensor 134 determines the position of the uppermost point of the die assembly 90. It may be detected.

  30: Die supply device (storage system) 90: Die assembly (member to be stored) (wafer) 108: Moving device (first moving device) 110: Rack (housing) 112: Lift table (second moving device) 128 : Clamp (gripping tool) 130: Upper arm 132: Lower arm 134: Position sensor (detection sensor) 150: Control device

Claims (6)

A storage for storing a plate-shaped member to be stored by supporting both of its edges,
A lower arm inserted below the member to be stored stored in the storage; an upper arm inserted above the member to be stored; and the member to be stored is gripped by the lower arm and the upper arm. A gripping tool,
A first moving device that moves the gripping tool in a direction to approach or separate from the storage;
A second moving device that relatively moves the gripping tool and the storage in the vertical direction;
A control device for controlling the operation of the gripping tool, the first moving device, and the second moving device;
The control device is
By moving the lower arm toward the upper arm, the stored member is gripped by the gripping tool, and the gripping tool gripping the stored member is moved away from the storage, A storage system that controls operations of the gripping tool and the first moving device so as to pull out a member to be stored from the storage. The storage system
A detection sensor for detecting a vertical position of the member to be stored stored in the storage;
The control device is
Using the detection value detected by the detection sensor, the lower arm is inserted below the member to be stored stored in the storage, and the upper arm is inserted above the member to be stored. The storage system according to claim 1, wherein the operation of the first moving device and the second moving device is controlled. The control device is
The lower arm is inserted below the member to be stored stored in the storage, and the upper arm is detected using a detection value of a position located at the lowest position of the member to be stored detected by the detection sensor. 3. The storage system according to claim 2, wherein the operation of the first moving device and the second moving device is controlled such that the first moving device and the second moving device are inserted above the member to be stored. The control device is
Before gripping the member to be stored by the gripping tool, the gripping tool is moved upward, and after the gripping tool is moved upward, the member to be stored is gripped by the gripping tool. The operation of the gripping tool, the first moving device, and the second moving device is controlled so that the gripped member to be stored is pulled out from the storage. The storage system according to any one of the above.   The storage system according to claim 1, wherein the member to be stored is a wafer. In a pulling-out method of pulling out the member to be stored by a gripping tool having a lower arm and an upper arm from a storage that stores the plate-like member to be stored by supporting both edges of the plate-like member,
The withdrawal method is
An approaching step of bringing the gripper close to the storage so that the lower arm is inserted below the stored member stored in the storage and the upper arm is inserted above the stored member;
A gripping step of gripping the member to be stored with the gripping tool by moving the lower arm toward the upper arm;
A drawing method comprising: a separation step of pulling out the member to be stored from the storage by moving the gripping tool that holds the member to be stored in a direction to separate from the storage.

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