JP2016146276A - Terminal for board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a terminal for board of novel structure which allows for enhancement of the yield and arrangement of narrower pitch, while ensuring erection on a printed board stably.SOLUTION: In a tabular terminal 10 for board provided with an insertion part 14 to be inserted into the through hole 38 of a printed board 36 on one end side 12, and a connection 18 to which other member is connected on the other end side 16, a pair of board abutting portions 20, 20 stretching farther outward than the opposite sides of the insertion part 14 in the width direction but not stretching farther outward than the opposite sides of the connection 18 in the width direction are provided between the insertion part 14 and connection 18, so as to project oppositely from each other in the plate thickness direction.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a board terminal used for a printed board, and more particularly to a board terminal that can be erected directly on a printed board.

  Conventionally, a board terminal is used to connect a printed wiring formed on a printed board to other components such as a fuse and a connector. Such a board terminal is inserted into the through hole of the printed circuit board in the insertion part provided on one end side and fixed by soldering, and the other end side is a connection part with other members. The connected other member is electrically connected to the conductive path of the printed circuit board through the board terminal. Therefore, in order to secure the connection stability with other members, it is important to stably and accurately stand the board terminals on the printed board.

  By the way, board terminals are often used in the form of flat plates formed by press-punching metal flat plates or by cutting rectangular wires with a long rectangular cross section. However, there is a problem that it is difficult to stand directly on the printed circuit board.

  In order to deal with such a problem, conventionally, a support plate portion orthogonal to the connection portion is formed by bending into a crank shape, and the substrate terminal is made to contact the support plate portion with the printed board. What was supported was widely used. However, such a crank-shaped terminal for a board needs to form a large support plate in order to support the terminal for a substrate, and it occupies a large effective space on the printed circuit board. There is also a problem that an increase in cost is unavoidable due to the extra material required to provide the material.

  In view of this, Japanese Patent Application Laid-Open No. 8-321336 (Patent Document 1) forms a pair of protrusions protruding on both sides in the width direction, and further bends the protrusions in opposite directions in the plate thickness direction to contact the printed circuit board. Thus, there has been proposed a board terminal that can stably stand on a printed board.

  However, in the structure of Patent Document 1, it is necessary to provide a pair of protrusions so as to protrude on both sides in the width direction rather than both side edges in the width direction of the connection portion, resulting in poor yield and an inevitable increase in cost. Furthermore, there is a limit to reducing the pitch between adjacent board terminals due to the pair of protrusions protruding from both side edges in the width direction of the connection portion, which can meet the recent demand for higher density. It was difficult.

JP-A-8-321336

  The present invention has been made in the background of the above-mentioned circumstances, and the problem to be solved is that it is possible to improve the yield and arrange with a narrower pitch while stably ensuring the uprightness on the printed circuit board. An object of the present invention is to provide a substrate terminal having a novel structure.

  The first aspect of the present invention is a flat plate-like structure in which an insertion portion to be inserted into a through hole of a printed circuit board is provided on one end side and a connection portion to which another member is connected is provided on the other end side. In the substrate terminal, a pair of substrate abutments between the insertion portion and the connection portion that protrudes outward from both sides in the width direction of the insertion portion and does not protrude outward from both sides in the width direction of the connection portion. And the pair of substrate contact portions protrude in opposite directions in the plate thickness direction.

  According to this aspect, the pair of substrate contact portions provided between the insertion portion and the connection portion protrude outward from both sides in the width direction of the insertion portion, and outward from both sides in the width direction of the connection portion. It is designed not to overhang. Therefore, even when the substrate terminal is formed by press punching from the flat plate member, it is not necessary to provide the substrate contact portion so as to protrude outward from both sides in the width direction of the connection portion, so the substrate terminal is formed with a high yield. can do. In addition, since the board contact part does not protrude outward in the width direction from the connection part, it is possible to arrange the terminals for the board in the width direction at a narrow pitch, and respond to the demand for higher density without problems. can do.

  In addition, since the board contact portions protrude in opposite directions in the plate thickness direction of the board terminal, the board contact portion is in the plate width direction of the board terminal with respect to the insertion portion inserted through the through hole. And protrudes on both sides in the plate thickness direction and comes into contact with the printed circuit board. As a result, the board terminals are erected on the printed circuit board via the board contact portions disposed at four locations that are separated from each other in the circumferential direction around the through hole. Can be stably realized.

  In addition, since the board terminal is stably erected and held on the printed circuit board through the board contact portions disposed at four locations separated in the circumferential direction around the through hole, the board terminal The load applied when the other member is connected to the connection portion can be reliably handled by the printed circuit board via the substrate contact portion, and a direct load is avoided from being applied to the solder portion. Therefore, it is possible to improve the conduction stability by suppressing the occurrence of solder cracks.

  Furthermore, by providing a board contact part that holds the board terminal on both sides in the plate thickness direction and the board width direction, the board terminal on the printed board can be reduced even if the pressure input to press the insertion part into the through hole is reduced. Can be secured. Therefore, it is possible to adopt a soldering method, and it is possible to improve the degree of freedom in selecting a connection method.

  According to a second aspect of the present invention, in the one described in the first aspect, the width dimension of the insertion part is made smaller than the width dimension of the connection part, whereby the insertion part and the connection part are arranged. And a pair of slits extending in the longitudinal direction from the pair of step surfaces toward the connecting portion in the plate thickness direction, and the pair of step surfaces. The substrate contact portion is configured by bending up in opposite directions in the thickness direction.

  According to this aspect, the pair of step surfaces between the connection portion and the insertion portion narrower than the connection portion are used, and the pair of slits extending in the longitudinal direction from the step surface toward the connection portion are formed in the plate thickness direction. The substrate contact portion of the present invention can be formed by a simple structure that penetrates and bends to the opposite side in the thickness direction of the pair of stepped surfaces, and in addition to improving the yield, the manufacturing process is simplified Further cost reduction can be realized.

  A third aspect of the present invention is the one described in the first or second aspect, wherein a crushing portion forged in the plate thickness direction is provided at a central portion of the insertion portion, and the crushing portion outwards by the crushing portion. A press-contact portion to the through hole is formed by the four corner portions of the protruding insertion portion.

  According to this aspect, by providing the crushing portion in the central portion of the insertion portion, the four corner portions of the insertion portion can be projected outward to provide the pressure contact portion to the through hole. Thereby, the positioning stability and holding property of the terminal for a board erected on the printed circuit board can be stably secured by the pressure contact force of the pressure contact portion with respect to the through hole. Therefore, for example, since the insertion portion is press-fitted into the through hole and the state of being positioned and held on the printed circuit board by the substrate abutting portion can be stably secured until the soldering process, it is necessary to retain the terminal during conventional soldering. It is also possible to eliminate the jig required for the process, further simplifying the process and reducing the cost.

  In addition, the pulling force applied when the connection of the other member connected to the connecting portion of the board terminal is released can be held by the pressing force with respect to the through hole of the pressing portion, and this pulling force is retained by the solder portion. It is also possible to avoid or reduce the problem of solder cracks that are directly applied to the solder.

  Furthermore, in the combination with the second aspect of the present invention, since both the crushing direction of the crushing part and the through direction of the slit are the same in the plate thickness direction, both processes can be performed simultaneously. It is also possible to further improve the efficiency of the process.

  According to the present invention, since it is not necessary to provide the substrate contact portion so as to protrude on both sides in the width direction from the connection portion, the substrate contact portion can be formed with high yield when formed by press punching. In addition, since the board contact part does not protrude outward in the width direction from the connection part, it is possible to arrange the terminals for the board in the width direction at a narrow pitch, and respond to the demand for higher density without problems. it can. In addition, since the board contact portion protrudes on both sides of the board terminal in the board width direction and the board thickness direction and comes into contact with the printed circuit board, the board contact parts arranged at four locations separated in the circumferential direction are provided. Thus, the board terminal is erected on the printed board. As a result, the standing property and alignment accuracy of the board terminal on the printed circuit board can be stably realized, and the load applied when another member is connected to the connection part of the board terminal via the board contact part. Therefore, it is possible to reliably handle the printed circuit board, and it is possible to improve the conduction stability by suppressing the occurrence of solder cracks due to a direct load applied to the solder portion. Furthermore, by providing a board contact part that holds the board terminal on both sides in the plate thickness direction and the board width direction, the board terminal on the printed board can be reduced even if the pressure input to press the insertion part into the through hole is reduced. Therefore, the soldering method can be adopted, and the connection method can be selected more freely.

The perspective view which shows the terminal for board | substrates as one Embodiment of this invention. The front view of FIG. The perspective view for demonstrating the manufacturing method of the board | substrate terminal shown in FIG. 1 (After (a) press punching, (b) After board | substrate contact part formation, (c) After press-contact part formation). The perspective view which shows the state by which the terminal for board | substrates as one Embodiment of this invention and this terminal for board | substrates stand upright on the printed circuit board. The front view of FIG. The principal part enlarged view of the VI-VI cross section in FIG. The perspective view which shows the band rear form of the terminal for board | substrates shown in FIG.

  Embodiments of the present invention will be described below with reference to the drawings.

  First, FIG.1 and FIG.2 shows the terminal 10 for a board | substrate as one Embodiment of this invention. In the following description, the length direction and the vertical direction refer to the vertical direction in FIG. 2, and the width direction refers to the horizontal direction in FIG. The plate thickness direction is a direction perpendicular to the paper surface in FIG.

  The board terminal 10 is formed by press-punching a metal plate, such as a copper plate, plated with tin or the like, and is an integrally formed product having a substantially strip-like flat plate shape as a whole. An insertion portion 14 is provided on one end side 12 in the length direction of the board terminal 10, while a connection portion 18 is provided on the other end side 16. Further, the pair of substrate contact portions 20, 20 are provided between the insertion portion 14 and the connection portion 18, that is, on the intermediate side 22 in the length direction of the substrate terminal 10.

  One end 12 in the length direction of the board terminal 10 is provided with an insertion portion 14 that protrudes downward in a substantially narrow flat plate shape. A concave groove-shaped crushing portion 24 is provided in the central portion in the width direction (arrow A direction in FIGS. 1 and 2) on the base end side of the insertion portion 14, while the four corner portions of the insertion portion 14 near the crushing portion 24 are provided. Pressing portions 26 are formed at the four corners by projecting outward in a dome shape.

  On the other hand, the intermediate side 22 (upper side in FIGS. 1 and 2) in the length direction of the board terminal 10 is wider than the insertion portion 14. And a pair of board | substrate contact parts 20 and 20 are comprised by the width direction (arrow A direction of FIG. 1, 2) both sides wider than the insertion part 14 in this intermediate side 22. As shown in FIG. That is, the pair of substrate contact portions 20 and 20 are formed to protrude outward from both sides in the width direction of the insertion portion 14. More specifically, on the intermediate side 22, both sides in the width direction projecting to both sides in the width direction from the insertion portion 14 extend in the longitudinal direction of the intermediate side 22 and penetrate in the plate thickness direction (arrow B direction in FIG. 1). The pair of slits 30, 30 are partially separated from the central portion in the width direction of the intermediate side 22 in a state where the upper end portion is connected to the connecting portion 18 side. And a pair of board | substrate contact parts 20 and 20 are comprised by raising the lower end side of this width direction both-sides part so that it may protrude in the opposite direction mutually in a plate | board thickness direction.

  The other end side 16 in the length direction of the board terminal 10 is provided with a connecting portion 18 that protrudes upward from the upper end portion of the intermediate side 22 in a substantially vertical plate shape. Here, the connecting portion 18 has the same width as the intermediate side 22. That is, the pair of board contact portions 20 and 20 provided on the intermediate side 22 are formed so as not to protrude outward from both sides in the width direction of the connection portion 18 (the direction of arrow A in FIGS. 1 and 2). It is.

  An example of a manufacturing method of the board terminal 10 having such a structure will be described with reference to FIG. First, for example, a metal plate having a surface of a copper plate or the like plated with tin or the like is prepared and subjected to press punching, thereby producing a substantially strip-like flat plate member 32 shown in FIG. Here, in the flat plate member 32, the width dimension of the one end side 12 constituting the insertion portion 14 is the width of the other end side 16 constituting the connection portion 18 and the width of the intermediate side 22 where the pair of substrate contact portions 20 and 20 are provided. It is press punched so as to be smaller than the dimensions. Due to such a width difference, a pair of step surfaces 34 and 34 are provided between the insertion portion 14 and the connection portion 18. In addition, among the one end side 12 which comprises the insertion part 14, the width dimension near intermediate | middle side 22 is comprised a little wider than the other part, in order to ensure the alignment precision at the time of the forging process mentioned later.

  Subsequently, as shown in FIG. 3B, the flat plate member 32 is cut and raised on the intermediate side 22. As a result, the pair of stepped surfaces 34, 34 extend in the longitudinal direction from the inner side edge portion in the width direction (direction of arrow A in FIG. 3B) toward the other end side 16 constituting the connecting portion 18. The pair of slits 30 and 30 are formed so as to penetrate in the plate thickness direction (the direction of arrow B in FIG. 3B), and at the same time, the pair of stepped surfaces 34 and 34 are opposite to each other in the plate thickness direction. Is bent up. Thus, a pair of board | substrate contact parts 20 and 20 are formed.

  Finally, as shown in FIG. 3 (c), in the central portion of the width direction (direction of arrow A in FIG. 3 (b)) of the region near the intermediate side 22 of the one end side 12 constituting the insertion portion 14. Forging is performed in the plate thickness direction (the direction of arrow B in FIG. 3B). As a result, a substantially hexagonal concave groove-like crushing portion 24 is formed in front view, and at the same time, the four corner portions of the insertion portion 14 in the vicinity of the crushing portion 24 face outward due to the formation of the crushing portion 24. Projected in a dome shape. And the press-contact part 26 is formed by the four corners of the insertion part 14 in the vicinity of the crushing part 24 projecting in a dome shape. In this way, the board terminal 10 can be obtained.

  The insertion portion 14 of the board terminal 10 formed in this way is inserted through the through hole 38 of the printed board 36 as shown in FIGS. The amount of insertion of the board terminal 10 into the through hole 38 is defined by the pair of board contact portions 20, 20 being in contact with the printed circuit board 36, and at the four corners of the insertion portion 14. The formed pressure contact portion 26 is inserted into the through hole 38. Here, of the press contact portions 26 formed at the four corners, the width dimension between the pair of press contact portions 26, 26 at the opposing positions is formed to be larger than the inner diameter size of the through hole 38. Therefore, the board terminal 10 is press-fitted into the through hole 38 by the press contact part 26 of the insertion part 14, and the press contact part 26 is press contacted to the inner surface of the through hole 38, so that the board terminal 10 connects the connection part 18. It is fixed to the printed circuit board 36 in a protruding state (see FIG. 6). Then, the insertion portion 14 of the board terminal 10 is soldered in a state of being inserted into the through hole 38, whereby the insertion portion 14 of the board terminal 10 is electrically connected to a printed wiring (not shown) formed on the printed board 36. And a connecting portion 18 to which a mating other member such as a connector (not shown) is connected is held upright with respect to the printed circuit board 36 (see FIGS. 4 to 6). . More specifically, the insertion part 14 of the board terminal 10 includes a solder part 40 formed by such soldering, a copper foil (not shown) provided on the inner surface of the through hole 38 or the land part 41 of the printed board 36, and the like. It is electrically connected to a printed wiring (not shown) formed on the printed circuit board 36 through the conductive layer (see FIG. 6).

  The board terminal 10 of this embodiment can also be provided as a so-called band rear by mounting a plurality of board terminals 10 on a carrier 42, as shown in FIG. The specific shape of the carrier 42 is not limited. For example, the carrier 42 is formed of a thin, easily deformable belt-like metal plate or the like, and a plurality of holding portions 44 are continuously formed. A pair of substantially U-shaped support portions 46, 46 that support the connection portion 18 of the board terminal 10 at two locations in the length direction are raised and formed at both edge portions of the holding portion 44. . Further, a hook-like locking portion 48 that locks the connecting portion 18 is formed between the support portions 46 and 46 in the holding portion 44 by cutting and raising.

  By attaching the board terminal 10 to each holding portion 44 of such a carrier 42 and configuring it as a band rear, the handling work at the time of insertion into the printed circuit board 36 is improved to simplify the terminal insertion work, or at the time of transportation. By winding the carrier 42, the handling property can be improved and a large parts feeder and a terminal cutting operation at an assembly site can be made unnecessary.

  According to the substrate terminal 10 having such a structure, the pair of substrate contact portions 20 and 20 do not need to be provided to protrude outward from both sides in the width direction of the connection portion 18 as in the prior art, and the yield is high. Since it can be formed, it can be manufactured at low cost. In addition, since the board terminals 10 can be arranged in the width direction at a narrow pitch, it is possible to meet the demand for higher density without problems.

  Further, the pair of substrate contact portions 20 and 20 are formed by bending and raising the lower end sides of both side portions in the width direction of the intermediate side 22 of the substrate terminal 10 so as to protrude in opposite directions in the plate thickness direction. . Therefore, with respect to the insertion part 14 inserted through the through hole 38, the pair of board contact parts 20, 20 protrudes on both sides in the board width direction and the board thickness direction of the board terminal 10 and protrudes from the printed board 36. Will come into contact. Accordingly, the plate width direction of the pair of stepped surfaces 34 and 34 of the pair of substrate contact portions 20 and 20 and the plate with respect to the four positions spaced apart in the circumferential direction of the surface of the printed circuit board 36 in the vicinity of the opening of the through hole 38. Two side edges that are the most separated in the thickness direction, that is, a total of four side edge portions are provided. Accordingly, the board terminal 10 can be stably held on the printed circuit board 36 in a standing state, and the load when another member is connected to the connection portion 18 via the pair of board contact portions 20 and 20. The printed circuit board 36 can surely handle it. Therefore, it is possible to avoid a load from being directly applied to the solder portion 40 and to suppress the occurrence of solder cracks, thereby improving conduction stability.

  Further, by using a pair of step surfaces 34, 34 provided between the insertion portion 14 and the connection portion 18 due to the difference in width, the pair of step surfaces 34, 34 are connected to the other end 16 constituting the connection portion 18. The pair of slits 30, 30 extending in the longitudinal direction toward the plate thickness direction are penetrated in the plate thickness direction, and at the same time, the pair of stepped surfaces 34, 34 are bent so as to be opposite to each other in the plate thickness direction. A pair of board | substrate contact parts 20 and 20 can be formed. Therefore, further cost reduction can be realized by simplifying the process.

  In addition, it is possible to provide the press contact portion 26 that is press-contacted to the inner surface of the through hole 38 by a simple process of forging in the thickness direction center portion of the insertion portion 14 in the plate thickness direction. In addition, the board terminal 10 can be stably held on the printed circuit board 36 in a standing state by the pressure contact force of the pressure contact portion 26 with respect to the through hole 38. Thereby, for example, the state in which the insertion part 14 is press-fitted into the through hole 38 and is held upright on the printed board 36 by the pair of board contact parts 20 and 20 can be stably secured until the soldering process. . Therefore, it is possible to eliminate the jig that has been necessary for holding the terminals in the conventional soldering, and it is possible to further simplify the process and reduce the cost. Further, since the pulling force applied when the connection of the other member connected to the connecting portion 18 is released can be held by the press contact portion 26, the pulling force is directly applied to the solder portion 40, and solder cracks are generated. Problems such as occurrence can be avoided or reduced.

  As mentioned above, although embodiment of this invention has been described, this invention is not limited at all by the specific description in this embodiment. For example, in the above-described embodiment, the board terminal 10 is fixed and connected to the printed circuit board 36 by soldering. However, soldering is not required by changing the structure of the insertion portion 14 to a press-fit terminal. You can also Moreover, in the said embodiment, although the process of forming a pair of slits 30 and 30 and the process of forming the press-contact part 26 were made into a separate process, since both are the processes of a plate | board thickness direction, both processes are performed simultaneously. It is possible to reduce costs by reducing processes.

10: Board terminal, 12: One end side, 14: Insertion part, 16: Other end side, 18: Connection part, 20: Board contact part, 24: Crushing part, 26: Pressure contact part, 30: Slit, 34: Step surface, 36: Printed circuit board, 38: Through hole

Claims (3)

In the plate-like board terminal in which the insertion part inserted into the through hole of the printed circuit board is provided on one end side and the connection part to which the other member is connected is provided on the other end side,
Between the insertion part and the connection part, there is provided a pair of substrate contact parts that protrude outward from both sides in the width direction of the insertion part and do not protrude outward from both sides in the width direction of the connection part. And
The board terminal according to claim 1, wherein the pair of board contact portions protrude in opposite directions in the plate thickness direction.   When the width dimension of the insertion part is made smaller than the width dimension of the connection part, a pair of step surfaces are provided between the insertion part and the connection part, and the connection part extends from the pair of step surfaces. A pair of slits extending in the longitudinal direction toward the plate is provided so as to penetrate in the plate thickness direction, and the pair of stepped surfaces are bent in opposite directions in the plate thickness direction to form the substrate contact portion. The terminal for a board according to claim 1.   A crushing portion forged in the thickness direction is provided at a central portion of the insertion portion, and a pressure contact portion to a through hole is formed by four corner portions of the insertion portion protruding outward by the crushing portion. The terminal for a board | substrate of 1 or 2.

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