JP2016143778A - Processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing method capable of properly removing the sawdust adhering to a workpiece.SOLUTION: A processing method for processing a tabular workpiece (11) includes a protective member disposal step for providing a protective member (17) on one side (11b) of the workpiece, a split step for cutting the workpiece, held by a chuck table (4) via the protective member, by means of a cutting blade (12) and splitting into a plurality of chips (21), and a sawdust removal step for sticking an adhesive material (40b) showing stickiness to the other exposed side (11a) of the workpiece split into a plurality of chips, and then removing the sawdust (23), produced in the split step, from the other side of the workpiece by peeling the adhesive.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a processing method for processing a plate-shaped workpiece.

  A semiconductor wafer, a ceramic substrate, or the like in which an electronic device is provided in each region divided by the division line is cut by a cutting apparatus including a cutting blade (cutting blade), for example, and a plurality of corresponding devices. Is divided into chips.

  In the process of cutting a plate-like workpiece as described above, the workpiece is cut while supplying a cutting fluid such as pure water so that dust (cutting waste) generated by cutting does not adhere to the workpiece. The blade is cut. In addition, after cutting the workpiece, a cutting fluid adhering to the workpiece is removed by spraying a cleaning fluid (see, for example, Patent Document 1 and Patent Document 2).

JP 2000-306878 A JP 2004-303855 A

  However, some cutting scraps adhere strongly to the workpiece. Therefore, there has been a problem that all the cutting waste adhering to the workpiece cannot be removed simply by spraying the cleaning fluid as described above.

  This invention is made | formed in view of this problem, The place made into the objective is to provide the processing method which can remove appropriately the cutting waste adhering to a to-be-processed object.

  According to the present invention, there is provided a processing method for processing a plate-shaped workpiece, the protection member disposing step of providing a protection member on one surface of the workpiece, and holding the chuck member via the protection member After dividing the workpiece to be cut into a plurality of chips by cutting with a cutting blade, and affixing an adhesive material showing adhesiveness to the other exposed surface of the workpiece divided into a plurality of chips, There is provided a machining method comprising: a cutting waste removing step of peeling off the adhesive material and removing the cutting waste generated in the dividing step from the other surface of the workpiece.

  In this invention, it is preferable that this adhesive material is the adhesion layer exposed in the outer peripheral surface of an adhesion roller, or the adhesion layer provided in the one surface side of the adhesive tape.

  In the processing method according to the present invention, the workpiece is cut and divided into a plurality of chips, and after the adhesive material showing adhesiveness is attached to the exposed surface of the workpiece, the adhesive material is peeled off. Cutting waste adhering to the exposed surface of the workpiece can be appropriately removed.

  That is, in the processing method according to the present invention, since the adhesive force of the adhesive material is used, even the cutting waste that adheres strongly to the workpiece such that it cannot be removed simply by spraying the cleaning fluid can be appropriately removed.

It is a perspective view which shows typically a protection member arrangement | positioning step. FIG. 2A is a partial cross-sectional side view schematically showing the dividing step, and FIG. 2B is a partial cross-sectional side view schematically showing the cleaning step. FIG. 3A and FIG. 3B are partial cross-sectional side views schematically showing the cutting waste removing step. 4 (A), 4 (B), and FIG. 4 (C) are partial cross-sectional side views schematically showing a cutting waste removing step according to a modification.

  Embodiments of the present invention will be described with reference to the accompanying drawings. The processing method according to the present embodiment includes a protective member disposing step (see FIG. 1), a dividing step (see FIG. 2A), a cleaning step (see FIG. 2B), and a cutting waste removing step (FIG. 3). (A) and FIG. 3 (B)).

  In the protective member disposing step, a protective member is provided on the back surface (one surface) of the plate-like workpiece. In the dividing step, the workpiece is held by a chuck table, and is cut by a cutting blade from the surface (the other surface) side to be divided into a plurality of chips. In the cleaning step, a cleaning fluid is sprayed on the surface of the workpiece to remove a part of the cutting waste.

  In the cutting waste removing step, after sticking an adhesive material showing adhesiveness on the surface of the workpiece, the adhesive material is peeled off to remove the cutting waste remaining on the surface of the workpiece. Hereinafter, the processing method according to the present embodiment will be described in detail.

  First, a protection member disposing step for providing a protection member on the workpiece is performed. FIG. 1 is a perspective view schematically showing a protective member disposing step. As shown in FIG. 1, the workpiece 11 according to the present embodiment is, for example, a disk-shaped semiconductor wafer, a ceramic substrate, a resin substrate, or the like, and the surface (the other surface) 11a side is a central device region. The outer peripheral surplus area surrounding the device area is divided.

  The device region is further divided into a plurality of regions by scheduled division lines (streets) 13 arranged in a lattice pattern, and devices 15 such as ICs and LEDs are formed in each region. In the protection member disposing step according to the present embodiment, the protection member 17 is provided on the back surface (one surface) 11b side of the workpiece 11.

  The protective member 17 is a dicing tape made of a material such as resin, for example, and is attached to the back surface 11b side of the workpiece 11. An annular frame 19 is fixed to the outer peripheral portion of the protection member 17. Thereby, the workpiece 11 is supported by the frame 19 via the protection member 17.

  After performing the protective member disposing step, a dividing step for dividing the workpiece 11 into a plurality of chips is performed. FIG. 2A is a partial cross-sectional side view schematically showing the dividing step. As shown in FIG. 2A, the dividing step is performed by the cutting device 2.

  The cutting device 2 includes a disk-shaped chuck table 4 that holds the workpiece 11 by suction. The chuck table 4 is connected to a rotational drive source (not shown) such as a motor, and rotates around a vertical axis. A moving mechanism (not shown) is provided below the chuck table 4, and the chuck table 4 is moved in the horizontal direction by the moving mechanism.

  The upper surface of the chuck table 4 is a holding surface 4 a that sucks and holds the back surface 11 b side of the workpiece 11 through the protection member 17. A negative pressure of a suction source (not shown) acts on the holding surface 4 a through a flow path (not shown) formed inside the chuck table 4, and a suction force for sucking the workpiece 11 is generated. Around the chuck table 4, a plurality of clamps 6 for holding and fixing the annular frame 19 are arranged.

  A cutting unit 8 is disposed above the chuck table 4. The cutting unit 8 includes a spindle 10 serving as a rotation axis. The spindle 10 is supported by an elevating mechanism (not shown). The spindle 10 moves in the vertical direction by this lifting mechanism.

  An annular cutting blade 12 is attached to the tip of the spindle 10. A rotational drive source (not shown) such as a motor is connected to the proximal end side of the spindle 10, and the cutting blade 12 rotates with the rotational force of the rotational drive source transmitted through the spindle 10.

  In the dividing step, first, the workpiece 11 and the protection member 17 are placed on the chuck table 4 so that the surface 11 a side is exposed upward, and the frame 19 is clamped and fixed by the clamp 6. Next, a negative pressure of a suction source is applied to the holding surface 4 a and the workpiece 11 is sucked and held by the chuck table 4.

  Thereafter, the chuck table 4 and the cutting unit 8 are relatively moved and rotated so that the position of the cutting blade 12 matches the position of the target division line 13. Further, the cutting blade 12 is rotated to be cut into the workpiece 11, and the chuck table 4 is moved (processed feed) in parallel with the target division planned line 13.

  By repeating this operation, the workpiece 11 can be cut along the scheduled division line 13 and divided into a plurality of chips 21. Here, the workpiece 11 is cut while supplying a cutting fluid such as pure water. Thereby, the cutting waste generated in the dividing step is less likely to adhere to the surface 11a of the workpiece 11. However, as shown in FIG. 2A, a small amount of cutting waste 23 adheres to the surface 11a of the workpiece 11.

  After performing the dividing step, a cleaning step is performed in which a cleaning fluid is sprayed on the surface 11a of the workpiece 11 to remove a part of the cutting waste 23. FIG. 2B is a partial cross-sectional side view schematically showing the cleaning step. As shown in FIG. 2B, the cleaning step is performed by the cleaning device 22.

  The cleaning device 22 includes a disk-shaped spinner table 24 that sucks and holds the workpiece 11. The spinner table 24 is connected to a rotational drive source (not shown) such as a motor, and rotates around a vertical axis.

  The upper surface of the spinner table 24 is a holding surface 24 a that sucks and holds the back surface 11 b side of the workpiece 11 through the protective member 17. A negative pressure of a suction source (not shown) acts on the holding surface 24a through a flow path (not shown) formed inside the spinner table 24, and a suction force for sucking the workpiece 11 is generated. Around the spinner table 24, a plurality of clamps 26 for holding and fixing the annular frame 19 are arranged.

  A cleaning nozzle 28 is disposed above the spinner table 24. The cleaning nozzle 28 is configured to be swingable in the radial direction of the spinner table 24. For example, the cleaning nozzle 28 sprays a cleaning fluid in which pure water and air are mixed downward.

  In the cleaning step, first, the workpiece 11 and the protection member 17 are placed on the spinner table 24 so that the surface 11 a side is exposed upward, and the frame 19 is clamped and fixed by the clamp 26. Next, a negative pressure of a suction source is applied to the holding surface 24a, and the workpiece 11 is sucked and held by the spinner table 24.

  Thereafter, the cleaning nozzle 28 is swung while the spinner table 24 is rotated, and the cleaning fluid is sprayed on the surface 11 a of the workpiece 11. Thereby, the surface 11a of the workpiece 11 can be cleaned and most of the cutting waste 23 can be removed.

  After performing the cleaning step, a cutting waste removing step for removing the cutting waste 23 remaining on the surface 11a of the workpiece 11 is performed. FIG. 3A and FIG. 3B are partial cross-sectional side views schematically showing the cutting waste removing step. This cutting waste removal step is performed by the cutting waste removal device 32 shown in FIGS. 3 (A) and 3 (B).

  The cutting waste removing device 32 includes a disk-shaped chuck table 34 that sucks and holds the workpiece 11. The upper surface of the chuck table 34 serves as a holding surface 34 a that sucks and holds the back surface 11 b side of the workpiece 11 through the protection member 17.

  A negative pressure of a suction source (not shown) acts on the holding surface 34a through a flow path (not shown) formed inside the chuck table 34, and a suction force for sucking the workpiece 11 is generated. Around the chuck table 34, a plurality of clamps 36 that sandwich and fix the annular frame 19 are arranged.

  A cutting waste removal unit 38 is disposed above the chuck table 34. The cutting waste removal unit 38 includes a first adhesive roller 40 formed to have a length equal to or larger than the diameter of the workpiece 11, and a first adhesive roller 40. And a second adhesive roller 42 disposed above the adhesive roller 40.

  The first adhesive roller 40 includes a roller body 40a that is horizontally supported. An adhesive layer (adhesive material) 40b is provided on the outer periphery of the roller body 40a. That is, the adhesive layer 40 b is exposed on the outer peripheral surface of the first adhesive roller 40.

  The adhesive layer 40b is made of a synthetic rubber having adhesiveness and elasticity. When the adhesive layer 40b is brought into contact with the surface 11a of the workpiece 11, the cutting waste 23 adheres to the adhesive layer 40b and is removed from the surface 11a of the workpiece 11. In addition, the adhesive force of the adhesion layer 40b is recovered by removing the cutting waste 23 attached to the outer peripheral surface.

  The second adhesive roller 42 includes a roller body 42a that is horizontally supported. An adhesive layer 42b is provided on the outer periphery of the roller body 42a. The adhesive layer 42b is made of synthetic rubber or the like having stronger adhesive force than the adhesive layer 40b of the first adhesive roller 40.

  The second adhesive roller 42 is positioned at a position in contact with the first adhesive roller 40 and rotates according to the rotation of the first adhesive roller 40. Therefore, the cutting waste 23 attached to the adhesive layer 40 b of the first adhesive roller 40 moves to the adhesive layer 42 b of the second adhesive roller 42. Thereby, the adhesive force of the first adhesive roller 40 is maintained. The adhesive force of the adhesive layer 42b is recovered by removing the cutting waste 23 attached to the outer peripheral surface.

  In the cutting dust removing step, first, the workpiece 11 and the protection member 17 are placed on the chuck table 34 so that the surface 11a side is exposed upward, and the frame 19 is clamped and fixed by the clamp 36. Next, the negative pressure of the suction source is applied to the holding surface 34 a, and the workpiece 11 is sucked and held by the chuck table 34.

  Then, the adhesive layer 40b of the cutting waste removal unit 38 is brought into contact with the surface 11a of the workpiece 11, and the cutting waste removal unit 38 is horizontally moved as shown in FIGS. 3 (A) and 3 (B). Move. Thereby, the outer peripheral surface of the 1st adhesion roller 40 contacts the surface 11a of the to-be-processed object 11, and the remaining cutting waste 23 can be removed.

  As described above, in the processing method according to the present embodiment, the workpiece 11 is cut and divided into a plurality of chips 21, and the adhesive (11) on the exposed surface (the other surface) 11 a of the workpiece 11 is adhesive. After the layer (adhesive material) 40b is attached, the adhesive layer 40b is peeled off, so that the cutting waste 23 attached to the surface 11a of the workpiece 11 can be appropriately removed.

  That is, in the processing method according to the present embodiment, since the adhesive force of the adhesive layer 40b is used, even the cutting waste 23 that adheres strongly to the workpiece 11 such that it cannot be removed simply by spraying the cleaning fluid can be appropriately removed.

  In addition, this invention is not limited to description of the said embodiment, A various change can be implemented. For example, in the above embodiment, the cutting waste removal step is performed after the cleaning step is performed. However, if the cutting waste 23 can be sufficiently removed only by the cutting waste removal step, cutting is performed without performing the cleaning step. A debris removal step may be performed. That is, the washing step can be omitted.

  Moreover, in the said embodiment, although the division | segmentation step, the washing | cleaning step, and the cutting waste removal step are implemented using the cutting device 2, the cleaning device 22, and the cutting waste removal device 32, the cutting device 2, the cleaning device 22 is carried out. Each step may be performed using an integrated processing device having the function of the cutting waste removing device 32.

  Furthermore, in the said embodiment, although the cutting waste removal step is implemented using the cutting waste removal apparatus 32 provided with the cutting waste removal unit 38 containing the 1st adhesion roller 40 and the 2nd adhesion roller 42, this invention. Is not limited to this. 4 (A), 4 (B), and FIG. 4 (C) are partial cross-sectional side views schematically showing a cutting waste removing step according to a modification.

  The cutting waste removal device 52 used in the cutting waste removal step according to the modification includes a disk-shaped chuck table 54 that sucks and holds the workpiece 11. The upper surface of the chuck table 54 is a holding surface 54 a that sucks and holds the back surface 11 b side of the workpiece 11 through the protection member 17.

  A negative pressure of a suction source (not shown) acts on the holding surface 54a through a flow path (not shown) formed inside the chuck table 54, and a suction force for sucking the workpiece 11 is generated. Around the chuck table 54, a plurality of clamps 56 for holding and fixing the annular frame 19 are arranged.

  Above the chuck table 54, for example, an adhesive tape 58 formed in a rectangular shape in plan view is disposed so as to cover the workpiece 11. The adhesive tape 58 includes a film-like base material 58a and an adhesive layer (adhesive material) 58b provided on the lower surface (one surface) side of the base material 58a. For the adhesive layer 58b, for example, a curable resin that is cured by a stimulus such as heat or ultraviolet light may be used.

  Linear frames 60a and 60b are fixed to two opposing ends of the adhesive tape 58, respectively. A pressing roller 62 that presses the adhesive tape 58 downward is disposed above the adhesive tape 58. The roller 62 is configured to move in the horizontal direction.

  In the cutting waste removing step according to the modified example, first, the workpiece 11 and the protection member 17 are placed on the chuck table 54 so that the surface 11 a side is exposed upward, and the frame 19 is clamped and fixed by the clamp 56. Next, a negative pressure of a suction source is applied to the holding surface 54 a, and the workpiece 11 is sucked and held by the chuck table 54.

  Then, as shown in FIG. 4A, the adhesive tape 58 is attached to the surface 11a of the workpiece 11, and the roller 62 is positioned at the end of the workpiece 11 close to the frame 60a. In this state, as shown in FIGS. 4B and 4C, when the frame 60a is moved to the frame 60b side, the adhesive tape 58 is pressed downward by the roller 62 and then the workpiece 11 is pressed. Is peeled off. Thereby, the cutting waste 23 remaining on the surface 11a of the workpiece 11 can be removed.

  In addition, the configurations, methods, and the like according to the above-described embodiments can be appropriately modified and implemented without departing from the scope of the object of the present invention.

11 Workpiece 11a Surface (the other surface)
11b Back side (one side)
13 Scheduled line (street)
DESCRIPTION OF SYMBOLS 15 Device 17 Protective member 19 Frame 21 Chip 23 Cutting waste 2 Cutting device 4 Chuck table 4a Holding surface 6 Clamp 8 Cutting unit 10 Spindle 12 Cutting blade 22 Cleaning device 24 Spinner table 24a Holding surface 26 Clamp 28 Cleaning nozzle 32 Cutting waste removal device 34 Chuck table 34a Holding surface 36 Clamp 38 Cutting waste removal unit 40 First adhesive roller 40a Roller body 40b Adhesive layer (adhesive material)
42 Second Adhesive Roller 42a Roller Body 42b Adhesive Layer 52 Debris Removal Device 54 Chuck Table 54a Holding Surface 56 Clamp 58 Adhesive Tape 58a Base Material 58b Adhesive Layer (Adhesive Material)
60a, 60b Frame 62 Roller

Claims (3)

A processing method for processing a plate-shaped workpiece,
A protective member disposing step of providing a protective member on one surface of the workpiece;
A dividing step of cutting a workpiece held by the chuck table via the protective member with a cutting blade and dividing the workpiece into a plurality of chips;
After sticking an adhesive material exhibiting adhesiveness on the other exposed surface of the workpiece divided into a plurality of chips, the adhesive material is peeled off and the cutting waste generated in the dividing step is removed from the workpiece. And a cutting waste removing step of removing from the other surface.   The processing method according to claim 1, wherein the adhesive material is an adhesive layer exposed on an outer peripheral surface of the adhesive roller.   The processing method according to claim 1, wherein the adhesive material is an adhesive layer provided on one surface side of the adhesive tape.

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