JP2016142656A - Electric current sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric current sensor that can prevent shortening of the distance intended for electrical insulation between a magnetic sensor and a conductor invited by exposed parts of the conductor that arises when machining for integrated molding is done.SOLUTION: Integrated molding of an insulative material with a conductor 1 creates a first case member 21, and integrated molding of an insulative material with this first case member 21 creates a second case member 22. Although an exposed part of a conductor 1 that is formed to fix a position of the conductor 1 during machining for integrated molding exists in the first case member 21, this exposed part is covered by the second case member 22.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a current sensor that detects a current using a magnetic sensor, and more particularly to a current sensor in which a case such as a resin to which a substrate on which a magnetic sensor is mounted is fixed is integrally formed with a conductor through which a current to be detected flows. is there.

  Patent Literature 1 below describes a current sensor in which a conductor through which a current to be detected flows and a case are integrated. In this current sensor, a U-shaped primary conductor through which a current to be detected flows and a resin case having an opening surface are integrated, and a sensor substrate on which a current detection device is arranged is fixed inside the case. . With such a structure, a distance (creeping distance, spatial distance) for electrical insulation is ensured between the sensor substrate and the primary conductor, and the withstand voltage is increased.

JP 2009-168790 A

  When resin is molded integrally with a metal member using a mold, the molten resin is filled into the mold at a high pressure, but it is placed at a desired position inside the mold so that the metal member does not move by the resin. In order to fix the metal member, a part of the surface of the metal member needs to be in contact with the mold. There is no resin at the position where the mold contacts on the surface of the metal member, and the metal member is exposed to the outside. Therefore, also in the current sensor described in Patent Document 1, when the resin is integrally molded with the primary conductor using a mold, an exposed portion of the primary conductor exists. When such an exposed portion exists, it is difficult to secure a distance for electrical insulation between the sensor and the conductor.

  The present invention has been made in view of such circumstances, and the object thereof is to have a structure in which a case of an insulating material to which a substrate on which a magnetic sensor is mounted is fixed is integrally formed with a conductor through which a current to be detected flows, and is integrally formed. It is an object of the present invention to provide a current sensor capable of preventing a distance for electrical insulation between a magnetic sensor and a conductor from being shortened due to an exposed portion of the conductor generated during the processing.

A current sensor according to a first aspect of the present invention includes a conductor through which a current to be detected flows, a first case member in which an insulating material is integrally molded with the conductor, and a first case in which an insulating material is integrally molded with the first case member. A case including two case members, a substrate fixed to the case, and a magnetic sensor located in the case and mounted on the substrate. The first case member has an exposed portion of the conductor generated in order to fix the position of the conductor during the integral molding process, and the second case member is a portion of the first case member. Cover the exposed portion.
According to said structure, since the exposed part of the said conductor produced with the integral molding process of the said 1st case member is covered by the said 2nd case member, the said exposed part becomes difficult to affect insulation, It is easy to ensure a distance (creeping distance, spatial distance) for electrical insulation between the magnetic sensor and the conductor.

Preferably, the conductor may have two end portions exposed to the outside of the case. The case may cover the entire intermediate portion sandwiched between the two ends of the conductor.
Thereby, it is easy to secure a distance for electrical insulation from the conductor.

Preferably, the current sensor is made of a ferromagnetic material, and may include a magnetic field control member that controls a magnetic field of the detected current detected by the magnetic sensor. The first case member may be formed by integrally molding an insulating material with the conductor and the magnetic field control member. The first case member may further include an exposed portion of the magnetic field control member that is generated to fix the position of the magnetic field control member during the integral molding process. The second case member may cover the exposed portion of the magnetic field control member in the first case member.
According to said structure, since the exposed part of the said magnetic field control member produced with the integral molding process of the said 1st case member is covered by the said 2nd case member, the said exposed part becomes difficult to affect insulation. In addition, it is easy to secure a distance for electrical insulation between the magnetic sensor and the magnetic field control member, and it is easy to secure a distance for electrical insulation between the conductor and the magnetic field control member. .

Preferably, the magnetic field control member may have two end portions exposed to the outside of the case. The case may cover the entire intermediate portion sandwiched between the two end portions of the magnetic field control member.
Thereby, since the stress applied to the magnetic field control member is reduced, it is difficult for the current detection characteristics to vary.

Preferably, the two end portions of the magnetic field control member may be located away from each of the two end portions of the conductor as compared with other portions of the magnetic field control member.
For example, each of the conductor and the magnetic field control member is bent in a U shape between the two end portions, the U-shaped recessed portion is adjacent, and the U-shaped recessed direction is opposite to the reverse direction. May be arranged as follows.
Thereby, the insulation of the said conductor and the said magnetic field control member becomes high. Even when the magnetic field control member is provided close to the conductor and the magnetic sensor, high insulation is ensured between the conductor and the magnetic sensor.

Preferably, the first case member and the second case member may be formed using the same insulating material.
As a result, the first case member and the second case member are easily integrated with each other, and peeling and rattling of both are less likely to occur.

Preferably, the second case member may sandwich the first case member from both sides in each of predetermined three directions orthogonal to each other.
Thereby, the precision of arrangement | positioning of the said 2nd case member and the said board | substrate with respect to a said 1st case member becomes high.

A current sensor according to a second aspect of the present invention includes a conductor through which a detected current flows, a magnetic sensor, and a ferromagnetic material, and controls a magnetic field of the detected current detected by the magnetic sensor. And a case in which an insulating material is integrally molded with the conductor and the magnetic field control member, and a substrate on which the magnetic sensor is mounted and fixed to the case. The case has an exposed portion of the conductor and the magnetic field control member generated to fix the positions of the conductor and the magnetic field control member during the integral molding, and has an insulating property. Is blocking the exposed part.
According to said structure, since the exposed part of the said conductor and the said magnetic field control member which arise with the integral molding process of the said case is covered with the potting material, these exposed parts become difficult to affect insulation. It is easy to secure a distance (creeping distance, spatial distance) for electrical insulation between the magnetic sensor and the conductor.

  According to the present invention, since the exposed portion of the conductor generated to fix the position of the conductor during the integral molding process is covered with the insulating material, the exposed portion provides electrical insulation between the magnetic sensor and the conductor. It is possible to prevent the distance for the purpose from being shortened.

It is a figure which shows an example of the current sensor which concerns on 1st Embodiment. FIG. 1A shows the overall appearance, and FIG. 1B shows an exploded view. It is a figure which shows the structure of the part integrally molded in the current sensor shown in FIG. 2A shows the appearance of the integrally molded portion, FIG. 2B shows the internal structure with the second case member removed, and FIG. 2C shows the internal structure with the first case member further removed. It is the figure which looked at the part of integral molding shown in FIG. 2 from the upper surface side. FIG. 3A shows the appearance of the integrally molded portion viewed from the upper right front, FIG. 3B shows the internal structure with the second case member removed, and FIG. 3C shows the internal structure with the first case member further removed. . It is the figure which looked at the part of integral molding shown in FIG. 2 from the bottom face side. 4A shows the appearance of the integrally molded portion as viewed from the lower left of the front, FIG. 4B shows the internal structure with the second case member removed, and FIG. 4C shows the internal structure with the first case member further removed. . It is a figure which shows an example of the current sensor which concerns on 2nd Embodiment. FIG. 5A shows the overall appearance, and FIG. 5B shows an exploded view. It is the figure which looked at the part integrally molded in the current sensor shown in FIG. 5 from the upper surface side. FIG. 6A shows the external appearance of the integrally molded part as viewed from the front upper right, and FIG. 6B shows the internal structure with the case removed. FIG. 7 is a view of a part integrally molded in the current sensor shown in FIG. 5 as seen from the bottom surface side. FIG. 7A shows the external appearance of the integrally molded portion as viewed from the lower left of the front, and FIG. 7B shows the internal structure with the case removed. The state which removed the potting material in the external appearance of the integrally molded part shown in FIG. 6 is shown. The state which removed the potting material in the external appearance of the integrally molded part shown in FIG. 7 is shown.

<First Embodiment>
The current sensor according to the first embodiment of the present invention will be described below with reference to FIGS.
FIG. 1 is a diagram illustrating an example of a current sensor according to the first embodiment. FIG. 1A shows the overall appearance, and FIG. 1B shows an exploded view.
FIG. 2 is a diagram showing a configuration of a part formed integrally with the current sensor shown in FIG. 2A shows the appearance of the integrally molded portion, FIG. 2B shows the internal structure from which the second case member 22 is removed, and FIG. 2C shows the internal structure from which the first case member 21 is further removed.
FIG. 3 is a view of the integrally molded portion shown in FIG. 2 as viewed from the upper surface side. FIG. 3A shows an external appearance of the integrally molded portion as viewed from the front upper right, FIG. 3B shows an internal structure in which the second case member 22 is removed, and FIG. 3C shows an internal structure in which the first case member 21 is further removed. Indicates.
4 is a view of the integrally molded portion shown in FIG. 2 as viewed from the bottom surface side. 4A shows an external appearance of the integrally molded portion as viewed from the lower left of the front, FIG. 4B shows the internal structure from which the second case member 22 is removed, and FIG. 4C shows the internal structure from which the first case member 21 is further removed. Indicates.

  The current sensor according to this embodiment includes a conductor 1 through which a current to be detected flows, a magnetic field control member 5 made of a ferromagnetic material, and a case in which an insulating material such as resin is integrally formed with the conductor 1 and the magnetic field control member 5. 2, a substrate 3 fixed to the case 2, and a magnetic sensor U <b> 1 and electrode pins P <b> 1 to P <b> 3 located in the case 2 and mounted on the substrate 3.

  The conductor 1 is a plate-like member formed using, for example, metal (copper or the like), and has two end portions 11 and 12 exposed to the outside of the case 2 as shown in FIG. The end portions 11 and 12 of the conductor 1 are each provided with four pins arranged in a line. These pins are inserted into through holes of a circuit board (not shown). Portions other than the end portions 11 and 12 in the conductor 1 are buried in the case 2. That is, the case 2 covers the entire intermediate portion sandwiched between the end 11 and the end 12 in the conductor 1.

  The magnetic field control member 5 is a plate-like member provided to control the magnetic field of the detected current detected by the magnetic sensor U1 to increase the magnetic field detection sensitivity. As shown in FIG. It has two end portions 51 and 52 exposed to the outside. Parts other than the end portions 51 and 52 in the magnetic field control member 5 are buried in the case 2. That is, the case 2 covers the entire intermediate portion sandwiched between the two end portions 51 and 52 of the magnetic field control member 5.

  As shown in FIGS. 2C, 3C, and 4C, the conductor 1 and the magnetic field control member 5 are each bent in a U shape. That is, the conductor 1 is bent in a U shape between the end portions 11 and 12, and the magnetic field control member 5 is bent in a U shape between the end portions 51 and 52. Further, the conductor 1 and the magnetic field control member 5 are arranged so that the U-shaped recess directions are opposite to each other, and the inner sides of the recess portions face each other and are adjacent to each other. In the example of the figure, the U-shaped recess direction of the conductor 1 is the Z direction (upward), and the U-shaped recess direction of the magnetic field control member 5 is opposite to the Z direction (downward). With such an arrangement, the end portions 51 and 52 of the magnetic field control member 5 are located at locations farther from the end portions 11 and 12 of the conductor 1 than the other portions of the magnetic field control member 5. That is, the distance between the end portions 11 and 12 exposed to the outside of the case 2 and the end portions 51 and 52 is relatively larger than the other portions of the conductor 1 and the magnetic field control member 5, and the insulation distance between them. Is relatively long.

  The case 2 includes a first case member 21 and a second case member 22. The first case member 21 and the second case member 22 are each formed by integral molding. The first case member 21 is formed by integrally molding an insulating material such as PPS or PBT together with the conductor 1 and the magnetic field control member 5. The second case member 22 is formed by integrally molding the same insulating material as the first case member 21 together with the first case member 21.

  When the first case member 21 is formed by integral molding, it is necessary to fix the positions of the conductor 1 and the magnetic field control member 5 in the mold. Therefore, the integral molding process is performed in a state where a part of the surface of the conductor 1 and the magnetic field control member 5 is in contact with the mold. Since the insulating material of the first case member 21 does not exist, the contact portion of the mold is a portion where the conductor 1 and the magnetic field control member 5 are exposed to the outside. In other words, the first case member 21 has an exposed portion of the conductor 1 and the magnetic field control member 5 generated to fix the positions of the conductor 1 and the magnetic field control member 5 in the integral molding process.

  Specifically, as shown in FIG. 3B, openings 21A, 21B, and 21C exist on the upper surface of the first case member 21, and portions 5A, 5B, and 5C of the surface of the magnetic field control member 5 are exposed from these openings. doing. As shown in FIG. 4B, openings 21D, 21E, 21F, 21G, 21H, and 21J exist on the bottom surface of the first case member 21, and a part 5D, 5E, and a part of the surface of the magnetic field control member 5 are formed from these openings. 5F, 5G, 5H, and 5J are exposed. At the time of integral molding, the magnetic field control member 5 is sandwiched and fixed in the vertical direction (Z direction) and the horizontal direction (X direction) inside the mold when the mold contacts a part of these surfaces. The

  On the other hand, in the conductor 1, the upper surface portions 1 </ b> R and 1 </ b> S (FIG. 3B) and the lower surface portions 1 </ b> T and 1 </ b> U (FIG. 4B) are exposed to the outside of the first case member 21. At the time of integral molding, the conductor 1 is sandwiched and fixed in the upper and lower directions inside the mold by contacting the mold with a part of these surfaces.

  The second case member 22 covers the above-described exposed portion generated to fix the positions of the conductor 1 and the magnetic field control member 5 when the first case member 21 is integrally molded. Even when the insulating material is integrally molded with the first case member 21, a part of the surface of the first case member 21 is brought into contact with the mold in order to fix the position of the first case member 21 inside the mold. There is a need. Since this contact location is at a position different from the above-described exposed portion of the first case member 21, the conductor 1 and the magnetic field control member 5 are not exposed to the outside of the second case member 22 from this contact location.

  Specifically, as shown in FIG. 3A, openings 22K, 22L, 22M, 22N, and 22P exist on the upper surface of the second case member 22, and a part 21K of the surface of the first case member 21 extends from these openings. 21L, 21M, 21N, and 21P are exposed. As shown in FIG. 4A, an opening 22Q exists on the bottom surface of the second case member 22, and a part 21Q of the surface of the first case member 21 is exposed from this opening. During the integral molding process, the first case member 21 is sandwiched and fixed from above and below in the mold by the mold coming into contact with a part of these surfaces. The surface portions (21K, 21L, 21M, 21N, 21P, 21Q) of the first case member 21 exposed to the outside of the second case member 22 are all covered with the insulating material of the first case member 21. Therefore, the conductor 1 and the magnetic field control member 5 are not exposed in these exposed portions.

  As shown in FIG. 1A, the substrate 3 is fixed to the upper surface of the case 2 from which the two end portions 51 and 52 of the magnetic field control member 5 protrude. Mounting holes 31 to 34 are formed in the substrate 3, and the bosses B 31 to B 34 of the case 2 are inserted into the mounting holes 31 to 34. The substrate 3 is fixed to the case 2 by, for example, covering a cover (not shown) from the upper side of the substrate 3. When the substrate 3 is fixed to the case 2, the magnetic sensor U <b> 1 mounted on the back surface of the substrate 3 (the surface facing the surface of the case 2) is disposed inside the concave portion of the U-shaped magnetic field control member 5. At this time, one end 52 of the magnetic field control member 5 passes through the hole 35 provided in the substrate 3. Further, the electrode pins P <b> 1 to P <b> 3 mounted on the back surface of the substrate 3 pass through the pin holes HP <b> 1 to HP <b> 3 provided in the case 2 and project to the lower surface of the case 2. The electrode pins P <b> 1 to P <b> 3 are inserted into through holes of a circuit board (not shown) together with the pins formed at the end portions 11 and 12.

  According to the current sensor of the present embodiment having the above-described configuration, the first case member 21 is created by integrally molding the insulating material with the conductor 1, and the insulating material is integrally molded with the first case member 21. The second case member 22 is created. The first case member 21 has an exposed portion of the conductor 1 that is generated to fix the position of the conductor 1 during the integral molding process, and this exposed portion is covered by the second case member 22. For this reason, it is possible to prevent a distance (creeping distance, spatial distance) for electrical insulation between the magnetic sensor U1 and the conductor 1 from being shortened by the exposed portion of the conductor 1 that is generated by the integral molding process. Therefore, the insulation between the conductor 1 and the magnetic sensor U1 can be enhanced.

  In addition, according to the current sensor according to the present embodiment, the magnetic field control member 5 is integrally formed with the conductor 1 in the first case member 21. The first case member 21 has an exposed portion of the magnetic field control member 5 that is generated to fix the position of the magnetic field control member 5 during the integral molding process. The exposed portion is also covered by the second case member 22. Is called. Therefore, the exposed portion of the magnetic field control member 5 generated by the integral molding process can prevent the distance for electrical insulation between the magnetic sensor U1 and the magnetic field control member 5 from being shortened, and the exposed portion can be used as a conductor. It is also possible to prevent the distance for achieving electrical insulation between 1 and the magnetic field control member 5 from being shortened. Therefore, the magnetic field control member 5 can be positioned near the conductor 1 and the magnetic sensor U1 to obtain good detection sensitivity, and the insulation between the magnetic sensor U1 and the conductor 1 can be improved.

Furthermore, according to the current sensor according to the present embodiment, the two end portions 51 and 52 of the magnetic field control member 5 are exposed to the outside of the case 2.
The insulating material (plastic resin or the like) forming the case 2 and the ferromagnetic material (ferrite or the like) forming the magnetic field control member 5 generally have different thermal expansion coefficients. Therefore, if the magnetic field control member 5 is entirely embedded in the case 2, the stress applied to the magnetic field control member 5 is likely to change according to changes in temperature. When the stress changes, the magnetic characteristics of the magnetic field control member 5 change, and the current detection characteristics change. That is, the current detection characteristics are likely to vary depending on the temperature. Further, if the magnetic field control member 5 is entirely embedded in the case 2, the residual stress associated with the integral molding process is easily applied to the magnetic field control member 5, so that the current detection characteristics are likely to vary from individual to individual. In the current sensor according to the present embodiment, the stress applied to the magnetic field control member 5 is reduced by exposing the end portions 51 and 52 of the magnetic field control member 5 to the outside of the case 2. Is less likely to occur, and the detection accuracy can be increased.
Further, by covering the entire intermediate portion of the magnetic field control member 5 sandwiched between the two end portions 51 and 52 with the case 2, the insulation between the magnetic sensor U1 and the conductor 1 can be enhanced.

  In addition, according to the current sensor according to the present embodiment, the end portions 51 and 52 of the magnetic field control member 5 exposed to the outside of the case 2 are exposed to the outside of the case 2 as compared with other portions of the magnetic field control member 5. The conductor 1 is located away from the ends 11 and 12 of the conductor 1. Thereby, since the insulation between the conductor 1 and the magnetic field control member 5 can be enhanced, even when the magnetic field control member 5 is provided close to the conductor 1 and the magnetic sensor U1, the gap between the conductor 1 and the magnetic sensor U1 is increased. High insulation can be secured.

  Further, according to the current sensor according to the present embodiment, since the first case member 21 and the second case member 22 are formed using the same insulating material, the first case member 21 and the second case member 22 are It can be made easy to integrate. As a result, rattling is unlikely to occur between the first case member 21 and the second case member 22, so that it is possible to prevent a decrease in current detection accuracy due to a displacement of the position of the magnetic sensor U 1 with respect to the conductor 1 or the magnetic field control member 5. .

  In addition, according to the current sensor according to the present embodiment, the first case member 21 is sandwiched by the second case member 22 from both sides in each of three directions orthogonal to each other (X direction, Y direction, and Z direction in the figure). The substrate 3 is fixed to the outer surface of the second case member 22. Therefore, the accuracy of the arrangement of the second case member 22 and the substrate 3 with respect to the first case member 21 can be increased, and good current detection accuracy can be obtained.

<Second Embodiment>
Next, a second embodiment of the present invention will be described.
In the current sensor according to the first embodiment described above, two integral moldings are performed to cover the exposed portions of the conductors and the like that are generated in the process of integral molding. The exposed part by molding is blocked by the potting material.

FIG. 5 is a diagram illustrating an example of a current sensor according to the second embodiment. FIG. 5A shows the overall appearance, and FIG. 5B shows an exploded view.
FIG. 6 is a view of the integrally molded portion of the current sensor shown in FIG. 5 as viewed from the upper surface side. FIG. 6A shows the external appearance of the integrally molded portion as viewed from the front upper right, and FIG. 6B shows the internal structure with the case 7 removed.
FIG. 7 is a view of a part integrally molded in the current sensor shown in FIG. 5 as seen from the bottom surface side. FIG. 7A shows the external appearance of the integrally molded portion as viewed from the lower left side of the front, and FIG.
FIG. 8 shows a state in which the potting material is removed in the appearance of the integrally molded portion shown in FIG.
FIG. 9 shows a state where the potting material is removed in the appearance of the integrally molded portion shown in FIG.

  The current sensor according to this embodiment includes a conductor 6 through which a current to be detected flows, a magnetic field control member 9 made of a ferromagnetic material, and a case in which an insulating material such as resin is integrally formed with the conductor 6 and the magnetic field control member 9. 7, a substrate 8 fixed to the case 7, and a magnetic sensor U 1 and electrode pins P 1 to P 3 mounted on the substrate 8.

  The conductor 6 is a plate-like member formed using a metal such as copper, for example, and has two end portions 61 and 62 exposed to the outside of the case 7 as shown in FIG. The case 7 covers the entire intermediate portion sandwiched between the end 61 and the end 62 in the conductor 6.

  The magnetic field control member 9 is a plate-like member provided to control the magnetic field of the detected current detected by the magnetic sensor U1 to increase the magnetic field detection sensitivity. As shown in FIG. It has two end portions 91 and 92 exposed to the outside. The case 7 covers the entire intermediate portion sandwiched between the two end portions 91 and 92 of the magnetic field control member 9.

  As shown in FIGS. 6B and 7B, the conductor 6 and the magnetic field control member 9 are each bent in a U shape. That is, the conductor 6 is bent in a U shape between the end portions 61 and 62, and the magnetic field control member 9 is bent in a U shape between the end portions 91 and 92. Further, the conductor 6 and the magnetic field control member 9 are arranged so that the U-shaped recess directions are opposite to each other, and the inner sides of the recess portions face each other and are adjacent to each other. For this reason, the end portions 91 and 92 of the magnetic field control member 9 are located farther from the end portions 61 and 62 of the conductor 6 than the other portions of the magnetic field control member 9.

  As shown in FIG. 5A, the substrate 8 is fixed to the upper surface of the case 2 from which the two end portions 91 and 92 of the magnetic field control member 9 protrude. Notches 81 and 82 are formed in the substrate 8, and the bosses B 71 and 72 of the case 7 are fitted into the notches 81 and 82. The substrate 8 is fixed to the case 7 by, for example, covering a cover (not shown) from the upper side of the substrate 8. When the substrate 8 is fixed to the case 7, the magnetic sensor U <b> 1 mounted on the back surface of the substrate 8 is disposed inside the U-shaped recess of the magnetic field control member 9. At this time, one end 92 of the magnetic field control member 9 passes through the hole 83 provided in the substrate 8. Further, the electrode pins P <b> 1 to P <b> 3 mounted on the back surface of the substrate 8 pass through the pin holes HP <b> 1 to HP <b> 3 provided in the case 7 and protrude to the lower surface of the case 7. The electrode pins P1 to P3 are inserted into, for example, through holes of a circuit board.

  The case 7 has an exposed portion of the conductor 1 and the magnetic field control member 5 that are generated along with the integral molding process. That is, when the case 7 is formed by integral molding, a portion where the mold is brought into contact with each other in order to fix the positions of the conductor 1 and the magnetic field control member 5 is exposed to the outside of the case 7. Specifically, as shown in FIG. 8, openings 7A, 7B, 7C, 7E, 7D, and 7F exist on the upper surface of the case 7, and a part 6A, 6B, 6C, and a part of the surface of the conductor 6 are formed from these openings. 6E and parts 9D and 9F of the surface of the magnetic field control member 9 are exposed. 9, openings 7G, 7H, 7J, and 7K exist on the bottom surface of the case 7. From these openings, the conductor surfaces 6G and 6H and the magnetic field control member 9 surface 9J. , 9K is exposed.

  In the current sensor according to the present embodiment, the exposed portions of the conductor 1 and the magnetic field control member 5 that are generated when the case 7 is integrally molded are closed with an insulating potting material such as plastic resin. Specifically, as shown in FIG. 6A, the surface portions (6A, 6B, 6C, 6E) of the conductor 6 exposed from the case 7 and the surface portions (9D, 9F) of the magnetic field control member 9 are potting materials PT1, PT2. , PT3, PT4. Further, as shown in FIG. 7A, the surface portions (6G, 6H) of the conductor 6 exposed from the case 7 and the surface portions (9J, 9K) of the magnetic field control member 9 are blocked by the potting materials PT5, PT6, PT7, PT8. It is.

  As described above, according to the current sensor according to the present embodiment, the exposed portions of the conductor 6 and the magnetic field control member 9 that are generated when the case 7 is integrally molded are covered with the potting material (PT1 to PT8). Therefore, it is possible to prevent a distance (creeping distance, spatial distance) for electrical insulation between the magnetic sensor U1 and the conductor 6 from being shortened by these exposed portions. Therefore, the insulation between the conductor 6 and the magnetic sensor U1 can be enhanced.

  In addition, according to the current sensor according to the present embodiment, since the case 7 can be integrally molded only once, the manufacturing process can be simplified as compared with the current sensor according to the first embodiment.

  In addition, this invention is not limited only to embodiment mentioned above, Various modifications are included.

  In the first embodiment described above, an example is given in which the materials of the first case member 21 and the second case member 22 are the same. However, in other embodiments of the present invention, these are different materials. Also good.

For example, the second case member may be formed of a material having higher elasticity than the first case member. Specifically, the first case member may be formed of glass-containing PBT, and the second case member may be formed of PBT without glass. Thereby, even if stress is applied to the second case member, it is difficult for cracks to be generated due to elasticity, so that it is possible to prevent the internal conductor and the magnetic field control member from being exposed to the outside and deteriorating the insulation performance.
Alternatively, the first case member may be formed of a material having a lower melting temperature than the second case member. Thereby, the first case member is easily melted during the integral molding process of the second case member, and the first case member and the second case member are easily integrated.

  In the above-described embodiment, an example of a current sensor having a magnetic field control member is given. However, the present invention is also applicable to a current sensor having no magnetic field control member.

DESCRIPTION OF SYMBOLS 1,6 ... Conductor through which a to-be-detected electric current flows 11, 11, 61, 62 ... End part of a conductor, 2, 7 ... Case, 21 ... 1st case member, 22 ... 2nd case member, 3, 8 ... Board | substrate, 5, 9 ... Magnetic field control member, 51, 52, 91, 92 ... End of magnetic field control member, U1 ... Magnetic sensor U1, PT1-PT8 ... Potting material

Claims (9)

A conductor through which the current to be detected flows;
A first case member in which an insulating material is integrally molded with the conductor; and a case including a second case member in which an insulating material is integrally molded with the first case member;
A substrate fixed to the case;
A magnetic sensor located in the case and mounted on the substrate,
The first case member has an exposed portion of the conductor generated in order to fix the position of the conductor during the integral molding process;
The current sensor, wherein the second case member covers the exposed portion of the first case member. The conductor has two ends exposed outside the case;
The current sensor according to claim 1, wherein the case covers an entire intermediate portion sandwiched between the two end portions of the conductor. A magnetic field control member that is made of a ferromagnetic material and controls a magnetic field of the detected current detected by the magnetic sensor;
The first case member is formed by integrally molding an insulating material with the conductor and the magnetic field control member, and the magnetic field control member generated to fix the position of the magnetic field control member during the integral molding process. And further having an exposed portion of
The current sensor according to claim 1, wherein the second case member covers the exposed portion of the magnetic field control member in the first case member. The magnetic field control member has two end portions exposed to the outside of the case,
The current sensor according to claim 3, wherein the case covers an entire intermediate portion sandwiched between the two end portions of the magnetic field control member. The two end portions of the magnetic field control member are located farther from each of the two end portions of the conductor than other portions of the magnetic field control member. Current sensor. The conductor and the magnetic field control member are each bent in a U shape between the two end portions, the U-shaped recessed portions are adjacent to each other, and the U-shaped recessed direction is opposite. The current sensor according to claim 4, wherein The current sensor according to any one of claims 1 to 6, wherein the first case member and the second case member are formed using the same insulating material. The second case member sandwiches the first case member from both sides in each of predetermined three directions orthogonal to each other,
The current sensor according to any one of claims 1 to 7, wherein the substrate is fixed to an outer surface of the second case member. A conductor through which the current to be detected flows;
A magnetic sensor;
A magnetic field control member that is made of a ferromagnetic material and controls a magnetic field of the detected current detected by the magnetic sensor;
A case in which an insulating material is integrally molded with the conductor and the magnetic field control member;
The magnetic sensor is mounted, and includes a substrate fixed to the case,
The case has an exposed portion of the conductor and the magnetic field control member generated to fix the position of the conductor and the magnetic field control member during the integral molding process,
A current sensor characterized in that an insulating potting material blocks the exposed portion.