JP2016139736A - Package for storing image pickup device, imaging apparatus, and imaging module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem that a vertical position of an optical system determined by a positioning hole of a lead terminal tends to vary and thus it is difficult to improve the position accuracy.SOLUTION: In a package 20 for storing a connection element, a substrate 1, a frame body, and a lead terminal 4 are joined to each other by a joint material 3. The lead terminal 4 has a hole part 4a at the outer side relative to a frame body 2. The joint material 3 includes: a first joint material 3a positioned below the lead terminal 4 and having filler particles at a first content rate; and a second joint material 4b positioned above the lead terminal 4 and having filler particles at a second content rate higher than the first content rate.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an image pickup device storage package on which an image pickup device is mounted, an image pickup apparatus including the image pickup device storage package, and an image pickup module.

  When an image pickup device such as a CCD or C-MOS is mounted on an image pickup device such as a camera, the image pickup device is mounted so that optical positional accuracy with an optical system component such as a lens of the image pickup device is maintained. Therefore, it is essential to reduce the mounting cost by simply mounting while improving the positional accuracy.

  An image pickup device storage package on which an image pickup device mounted on an image pickup device is mounted includes a substrate having a part on which the image pickup device is mounted, a lead terminal that electrically connects the image pickup device and an external electric circuit, and the image pickup device. And a frame body disposed on the substrate outside the portion on which is mounted. The substrate and the frame are joined together by a joining material sandwiched between them. The lead terminal is disposed through the bonding material from the inner part to the outer part of the frame body in plan view.

  An imaging device mounted on the substrate is electrically connected to the lead terminal to form an imaging device, and the imaging device is electrically connected to an external electric circuit via the lead terminal. Further, alignment between the optical system component and the image pickup device of the image pickup apparatus is performed by a positioning hole or the like provided in the lead terminal.

Japanese Unexamined Patent Publication No. 2006-13281

  The conventional image pickup device storage package has a problem that it is difficult to improve the positional accuracy of the lead terminals in the vertical direction (so-called z direction). This is due to the fact that the thickness of the bonding material through which the lead terminal penetrates tends to vary partially (the thickness tends to be non-uniform). When the thickness of the bonding material deviates from a predetermined value, the vertical position of the lead terminal varies depending on the thickness deviation.

One of the reasons for the low positional accuracy in the Z direction is that the low melting point glass bonding material has a low strength. In order not to leave any stress, the lead glass is sandwiched between the upper glass and the lower glass so that no strong load is applied in the vertical direction during sealing. Therefore, it is easy to change the wetness and spread of the glass due to some variation in the glass amount on the upper surface and the glass amount on the lower surface, and the unevenness, so the height of the lead sandwiched between them is also likely to change accordingly. .

  For this reason, the vertical position of the optical system tends to vary due to the positioning hole of the lead terminal, and it is difficult to improve the positional accuracy.

If the positional accuracy in the vertical direction of the lead terminal is low, the positional accuracy in the vertical direction of the optical system with respect to the imaging device mounted on the substrate tends to be low, and it is difficult to improve the performance of the imaging device in terms of imaging.

  An image pickup device storage package according to one aspect of the present invention includes a substrate having an image pickup device mounting portion at a central portion of an upper surface, a frame disposed on an outer peripheral portion of the upper surface of the substrate, the substrate, A bonding material interposed between the frame body and having a lower end bonded to the substrate and an upper end bonded to the frame body, and the bonding from the mounting portion to the outside of the frame body A lead terminal that passes between the upper end and the lower end of the material and penetrates the bonding material, and the lead terminal has a hole outside the frame, The bonding material is positioned below the lead terminal and has filler particles at a first content rate, and is positioned above the lead terminal and the first content rate. Having filler particles with a second content higher than And a second bonding material.

  An image pickup apparatus according to one aspect of the present invention includes the image pickup device storage package having the above-described configuration and an image pickup device mounted on the mounting portion.

  An imaging module according to one aspect of the present invention includes an imaging device having the above-described configuration, and an optical member that is disposed on the frame body of the imaging device and has a portion inserted into the hole of the lead terminal. Have.

  The package for storing an image sensor according to one aspect of the present invention has the above-described configuration, and the bonding material is located below the lead terminal and has the first bonding material having filler particles at the first content rate; Since it includes a second bonding material that is located above the lead terminal and has filler particles at a second content rate higher than the first content rate, the positional accuracy in the vertical direction of the lead terminal is conventionally improved. Can also be improved.

  That is, with such a configuration, deformation of the second bonding material is suppressed when the substrate, the lead terminal, and the frame body are bonded via the bonding material. Pressure is applied through the second bonding material in which the deformation is suppressed to press the lead terminal against the substrate side, and the first bonding material wets and spreads on the surface of the second bonding material. As a result, the difference in height between the mounting portion to which the image sensor is joined and the lead terminal is reduced, and the variation in height is also reduced, so that the lead terminal and the image sensor mounted in the image sensor storage package are mutually connected. The positional accuracy in the height direction (z direction) can be improved.

  Moreover, since the content rate of the filler particles in the first bonding material is relatively low, the thickness of the lead terminal is absorbed by the deformation of the first bonding material. Therefore, the possibility that the flatness of the upper and lower surfaces of the bonding material (the bonding surface between the substrate and the frame) is reduced by the thickness of the lead terminal is reduced.

  According to the imaging device of one aspect of the present invention, since the imaging device housing package having the above-described configuration is included, the positional accuracy of the lead terminals in the vertical direction is high, and the imaging device of the optical system connected to the imaging device It is possible to provide an imaging apparatus that can easily improve the vertical position accuracy with respect to the vertical axis.

  According to the imaging module of one aspect of the present invention, since the imaging apparatus having the above-described configuration is included, an imaging module having high positional accuracy in the vertical direction with respect to the imaging element of the optical system can be provided.

(A) is a top view which shows the image pick-up element accommodation package and imaging device of embodiment of this invention, (b) is sectional drawing in the AA of (a). It is sectional drawing which expands and shows the B section of FIG.1 (b). It is sectional drawing which shows the imaging module of embodiment of this invention. It is a top view which shows the modification of an image pick-up element storage package and an imaging device shown in FIG.

  An image sensor housing package and the like according to an embodiment of the present invention will be described with reference to the accompanying drawings. In addition, the distinction between the upper and lower sides in the following description is for the sake of convenience, and does not limit the upper and lower sides when an image sensor housing package or the like is used. Further, for convenience of explanation, in FIG. 1 and FIG. 3, the orthogonal coordinate system xyz is defined, and the term “upper surface” or “lower surface” is used as appropriate with the positive side in the z direction as the upper side.

  FIG. 1A is a top view illustrating an image sensor housing package and an image pickup apparatus according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line AA in FIG.

  The image pickup device storage package 20 of the embodiment includes a substrate 1 having an image pickup device mounting portion 1a at the center of the upper surface, a frame 2 disposed on the outer periphery of the upper surface of the substrate 1, and an outer periphery of the upper surface of the substrate 1. And a bonding material 3 interposed between the portion and the lower surface of the frame 2 and lead terminals 4 for external connection. The image pickup device 30 is basically formed by mounting the image pickup device 5 in the image pickup device storage package 20.

  The substrate 1 has, for example, a rectangular flat plate shape and functions as a base for mounting and fixing the imaging device 5 on the upper surface. The substrate 1 is formed of an insulating material such as a ceramic sintered body (ceramic material). When the substrate 1 is made of a ceramic sintered body, the substrate 1 is made of a ceramic such as an aluminum oxide sintered body (alumina ceramics), a mullite sintered body, a steatite sintered body, an aluminum nitride sintered body, or the like. .

  If the substrate 1 is made of, for example, an aluminum oxide sintered body, it can be manufactured as follows. That is, an appropriate organic binder, solvent, plasticizer, and dispersant are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to make a mud, and this mud is made by a conventionally known spray drying method. The substrate 1 can be made by granulating using a press mold and press-molding the granule with a press mold having a predetermined shape, followed by firing at a high temperature of about 1500 ° C.

  In addition to this, the substrate 1 can be made of an insulating material such as a glass material or a resin material, or a conductive material such as a metal. Note that when a ceramic material such as an aluminum oxide sintered body is used as the material of the substrate 1, the heat dissipation generated from the imaging element 5 is excellent. For this reason, the characteristics of the image sensor 5 are hardly affected. Further, since the rigidity of the substrate 1 made of a ceramic material is high, the possibility that the image sensor 5 is distorted by heat or mechanical force is effectively reduced. For these reasons, the imaging device 5 can function more stably.

  The frame body 2 functions as a frame member for fixing a lid body as a sealing material, which will be described later, on the substrate 1 and the image sensor 5 mounted thereon. The frame body 2 can also be manufactured by the same method using, for example, the same material as the substrate 1. In this case, a frame-shaped mold corresponding to the shape of the frame 2 is used as a mold used for press molding.

The outer peripheral portion of the upper surface of the substrate 1 and the lower surface of the frame body 2 are bonded to each other by a bonding material 3 interposed therebetween. In other words, the bonding material 3 has a lower end bonded to the substrate 1 and an upper end bonded to the frame body 2. The bonding material 3 is made of a glass composition including, for example, a low-melting glass. Details of the bonding material 3 will be described later.

  The lead terminal 4 is a part that becomes a part of a conductive path for electrically connecting the imaging device 5 mounted on the mounting portion 1a to an external electric circuit (not shown). The lead terminal 4 functions as an external connection terminal in the imaging apparatus 30.

  The lead terminal 4 is made of a metal such as iron (Fe) -nickel (Ni) -cobalt (Co) alloy or 42 alloy (Fe58-Ni42 alloy). The lead terminal 4 can be manufactured by performing metal processing such as punching with a stamping die on the plate material of these metal materials. Punched out. Moreover, you may perform processes, such as a bending process by a bending die, as needed.

  As described above, the lead terminal 4 electrically connects the imaging device 5 mounted on the mounting portion 1a and an external electric circuit outside the frame body 2 of the imaging device storage package 20 (that is, outside the imaging device 30). Need to connect to. Therefore, the lead terminal 4 penetrates the bonding material 3 in the lateral direction (xy direction) through the space between the upper end and the lower end of the bonding material 3 from the mounting portion 1 a to the outside of the frame body 2.

  Note that the lead terminal 4 has a hole 4 a outside the frame 3. As will be described later, the hole 4a is a portion for positioning an optical member (not shown in FIG. 1) when the imaging element storage package 20 (actually the imaging device 30) is attached. Details of this will be described later.

  In addition, as shown in FIG. 2, for example, the bonding material 3 is positioned below the lead terminal 4, and includes a first bonding material 3 a having filler particles at a first content rate, and an upper side than the lead terminal 4. And a second bonding material 3b having filler particles at a second content rate higher than the first content rate. FIG. 2 is an enlarged cross-sectional view showing a portion B in FIG. In FIG. 2, the same parts as those in FIG.

  The filler particles are, for example, a silica-based compound having a small thermal expansion coefficient or a willemite-based compound having a negative thermal expansion coefficient as described above. The filler particles are generally for improving the characteristics of the bonding material 3 such as adjusting the thermal expansion coefficient. In the image pickup device storage package 20 or the like of the embodiment, there is a difference in fluidity between the first bonding material 3a and the second bonding material 3b depending on the filler particle content and particle size. Thereby, at the time of joining, for example, the fluidity of the first joining material 3a is large, and the fluidity of the second joining material 3b is small. Therefore, the deformation of the second bonding material 3b is suppressed and the lead terminal 4 is pressed against the substrate 1 side, and the first bonding material 3a spreads on the surface of the second bonding material 3b. Therefore, in the image pickup device storage package 20, the difference in height between the mounting portion 1a to which the image pickup device 5 is joined and the lead terminal 4 is reduced, and the height variation is also reduced. Position accuracy in the height direction (z direction) can be increased.

  When the bonding material 3 is made of a glass composition containing a low-melting glass, for example, as the first glass paste to be the first bonding material 3a, lead oxide is 56 to 66% by mass and boron oxide is 4 to 14% by mass. The glass component containing 1 to 6% by mass of silicon oxide and 1 to 11% by mass of zinc oxide, 4 to 8% by mass of silica compound having a small thermal expansion coefficient or willemite compound having a negative thermal expansion coefficient as a filler. Those added externally are used. The second glass paste to be the second bonding material 3b is composed of 10 to 15 masses of a silica compound having a small thermal expansion coefficient or a willemite compound having a negative thermal expansion coefficient as a filler in the same glass component as the first glass paste. % Externally added is used.

In this case, the first glass paste obtained by adding and mixing an appropriate organic solvent and solvent to the glass composition powder is laminated to a predetermined thickness on the outer peripheral portion of the upper surface of the substrate 1 by a printing method such as a screen printing method. After the printing and coating, baking at a temperature of about 430 ° C., and the frame 2 on which the second glass paste is laminated and printed to a predetermined thickness are also baked in the same manner, the lead described later on the substrate 1 having the first bonding material 3a bonded to the upper surface. After placing the frame 2 in which the terminal 4 and the second bonding material 3b are bonded to the lower surface, about 430 ° C.
The bonding material 3 (the first bonding material 3a on the substrate 1 side and the second bonding material 3b on the frame body 2 side) is provided between the substrate 1 and the frame 2 by firing again at the temperature of As a result, the substrate 1 and the frame body 2 are joined to each other, whereby the image sensor housing package 20 is obtained.

  The imaging device 30 manufactured by mounting the imaging device 5 on the mounting portion 1a of the imaging device storage package 20 in which the substrate 1 and the frame 2 are bonded via the bonding material 3 is transparent as necessary. The imaging element 5 is sealed with a sealing material such as the lid 7. In the example of FIG. 1, the outer peripheral portion of the lower surface of the transparent lid 7 is bonded to the upper surface of the frame body 2 with an adhesive 8, and the imaging element 5 is a container ( It is sealed in (no symbol).

  For example, as in the example shown in FIG. 3, for the imaging device 30 in which the imaging device 5 is sealed, the optical member 6 is provided on the upper portion, and the imaging module 40 is manufactured. FIG. 3 is a cross-sectional view showing the imaging module 40 according to the embodiment of the present invention. In FIG. 3, the same parts as those in FIG.

  The optical member 6 includes, for example, the lens 10 as a basic member. In the example of FIG. 3, the lens 10 is attached to the upper end of a holding portion (not shown) such as a lens barrel to form the optical member 6. The imaging module 40 is mounted as a component in an imaging device such as a digital camera.

  The optical member 6 is attached in alignment with the imaging device 30 by, for example, inserting a protrusion 6 a provided at the lower end (the lower surface of the lens barrel or the like) into the hole 4 a of the lead terminal 4. . In this case, the hole 4a also functions as an alignment unit for aligning the lens 10 at the upper end of the optical member 6 with respect to the imaging device 5 mounted on the mounting unit 1a. Although not shown in the drawing, the imaging module 40 is positioned with a fixing screw or the like so as to be pressed against the lower surface of the optical member 6, for example. At the time of this alignment, not only the horizontal direction (xy direction) but also the accuracy of the position of the hole 4a in the vertical direction (z direction) with respect to the image sensor 5 is required. On the other hand, in the imaging module 40 of the embodiment, as described later, since the variation in the position of the lead terminal 4 in the vertical direction is reduced as compared with the conventional case, the positioning accuracy in the z direction as described above is also improved. ing.

  In this case, as described above, since the bonding material 3 includes the first bonding material 3a and the second bonding material 3b as described above, the positional accuracy in the vertical direction of the lead terminal 4 is improved as compared with the conventional case. be able to.

  That is, such a configuration effectively suppresses deformation of the second bonding material 3b when the substrate 1, the lead terminal 4, and the frame body 2 are bonded via the bonding material 3. Therefore, variation in the force pressing the lead terminal 4 is suppressed. Thereby, the partial dispersion | variation in the thickness of the whole joining material 3 containing the 2nd joining material 3b is suppressed.

  That is, the second bonding material 3b, which is a portion that directly receives pressure from the frame body 2 in the bonding material 3, is not easily deformed by the action of the relatively large amount of filler particles. Therefore, the variation in the thickness of the bonding material 3 due to a part of the bonding material 3 being greatly recessed as compared with the other portions is effectively reduced.

  Moreover, since the content rate of the filler particles in the first bonding material 3a is relatively low, the thickness of the lead terminal 4 is absorbed by the deformation of the first bonding material 3a. That is, the bonding material 3 can be easily deformed following the thickness of the lead terminal 4. Therefore, the possibility that the upper and lower surfaces of the bonding material 3 (bonding surfaces with the substrate 1 and the frame body 2) are uneven depending on the thickness of the lead terminal 4 is reduced. That is, the possibility that the flatness of the upper and lower surfaces (the above upper end and lower end) of the entire bonding material 3 is reduced by the thickness of the lead terminal 4 is reduced.

  The filler particle content in the first bonding material 3a and the second bonding material 3b includes the material of the bonding material 3 to be used, the thickness of the bonding material 3, the material of the filler particles, the particle size of the filler particles, the thickness of the lead terminals 4, and the like. It can be set as appropriate in consideration of conditions, productivity and economy.

  The content rate of the filler particles in the first bonding material 3a may be set as follows, for example, when an aluminum oxide sintered body is used as the material for forming the substrate 1 and the frame body 2. That is, as a glass composition (powder or the like) for the bonding material 3 containing the glass component and filler as described above, lead oxide is 56 to 66 mass%, boron oxide is 4 to 14 mass%, and silicon oxide is 1 to 1. A glass component containing 6% by mass and 1 to 11% by mass of zinc oxide, silica having a thermal expansion coefficient smaller than 1/2 of the thermal expansion coefficient of the substrate 1 or the frame 2, and a willemite compound having a negative thermal expansion coefficient What added the filler particle which consists of can be used. In this case, if the average particle size of the filler particles is about 3 to 5 μm and the maximum particle size is about 30 μm, if the filler particles are contained in the glass composition in an amount of about 4 to 8% by mass as an external addition. Good.

  Regarding the content rate of the filler particles in the second bonding material 3b, for example, when an aluminum oxide sintered body is used for the substrate 1 or the frame body 2, 56 to 66% by mass of lead oxide and boron oxide are used as the glass composition. In a glass component containing 4 to 14% by mass of silicon, 1 to 6% by mass of silicon oxide and 1 to 11% by mass of zinc oxide, the filler particles have a thermal expansion coefficient of ½ that of the substrate 1 or the frame 2 It is only necessary to add filler particles made of smaller silica or a willemite compound having a negative thermal expansion coefficient. The average particle size of the filler particles is about 3 to 5 μm, and the maximum particle size is about 30 μm. For example, the filler particles may be set to about 10 to 15% by mass as an external addition to the glass composition.

  That is, the first bonding material 3a and the second bonding material 3b have a smaller thermal stress generated between the first bonding material 3a and the second bonding material 3b as the coefficients of thermal expansion are closer to each other. The connection reliability between the substrate 1 and the frame body 2 through the material 3 is increased. When the bonding material 3 is manufactured at the above ratio, the thermal expansion coefficient of the second bonding material 3b with respect to the first bonding material 3a is easily set in a range of +10 to −10%, which is preferable.

  Note that alumina or zirconium oxide having a thermal expansion coefficient larger than 1/2 of the substrate 1 or the frame body 2 and smaller than 2 times as the second filler particles is appropriately added to the second bonding material 3b. May be. By adding the second filler particles, even when the difference in viscosity between the first bonding material 3a and the second bonding material 3b is large, the bonding material (the molten first and second bonding materials 3a, 3b) ) The difference in coefficient of thermal expansion can be reduced more effectively, so that workability and reliability can be further improved.

In the above example, the fillers added to the first bonding material 3a and the second bonding material 3b are those having the same particle size variation indicated by the average particle size and the maximum particle size. However, the present invention is not limited to this. For example, the particle size variation of the filler particles added to the first bonding material 3a may be made smaller than the particle size variation of the filler added to the second bonding material 3b. In this case, the following effects can be obtained when the substrate 1, the lead terminal 4, and the frame 2 are joined through the joining material 3. That is, the height of the lead terminal 4 when the lead terminal 4 is pressed against the substrate 1 side is determined by the maximum particle size of the filler particles. Therefore, as described above, the smaller the variation in the particle size of the filler particles in the first bonding material 3a, the smaller the variation in the height of the lead terminal 4, which is preferable.

  In addition, as a method of reducing the variation in the particle size of the filler particles in the bonding material 3, a method such as classifying unclassified filler particles in a narrow range may be used, but the yield decreases when classified in a narrow range. However, the cost tends to increase. Therefore, for example, the maximum particle size of the filler added to the first bonding material 3a in advance may be set smaller than the maximum particle size of the filler added to the second bonding material 3b, and the filler particles obtained by classifying them may be used. . In this case, as the particle size of the filler particles decreases, the absolute value of the particle size variation decreases, so that the variation in the height of the lead terminal 4 can be reduced. Therefore, it is more preferable in terms of man-hour (productivity) and cost (economic efficiency).

In addition, about the joining material 3, bismuth oxide 70-90 mass%, boron oxide 3-15 mass%, barium oxide 2-8 mass%, copper oxide 1-3 mass%, aluminum oxide 0.5-2 mass%, silicon oxide 0.5 A glass component containing ˜2% by mass and zinc oxide of 0.5˜2% by mass and containing no lead may contain 4 to 15% by mass of silica or willemite-based compound as a filler. In this case, the thermal expansion coefficient (linear expansion coefficient) of the bonding material 3 can be set to about 10 × 10 ⁻⁶ to 18 × 10 ⁻⁶ / ° C. That is, the thermal expansion coefficient of the bonding material 3 can be approximated to the thermal expansion coefficient of copper (16 × 10 ⁻⁶ / ° C.).

  Further, in the same glass composition as described above, 4 to 8% by mass of filler is added to the first bonding material 3a, and 10 to 15% by mass of filler is added to the second bonding material 3b. Good. In this case, for example, since the difference in the thermal expansion coefficient is reduced, a copper alloy can be used for the substrate 1, the frame body 2, and the lead terminal 4, so that heat dissipation and conductivity are further improved. The image pickup device storage package 20 can be obtained. In this case as well, a second filler may be appropriately added to the second bonding material 3b.

  Further, when a metal such as a copper alloy is used for the substrate 1 and the frame 2, for example, as in the example of FIG. 1, the frame 2 convex portion 2a and the substrate 1 are connected to a conductive connecting material such as solder. The substrate 1 and the ground electrode of the lead terminal 4 may be electrically connected by a bonding wire 9. In this case, since the lead terminal 4 has a stripline structure in which the upper and lower sides are sandwiched between the metal substrate 1 and the frame body 2, the characteristic impedance is further easily adjusted, which is preferable.

  In addition, the frame convex part 2a is a part provided so that a part of the inner periphery of the frame 2 projects inward (on the mounting part 1a side) in plan view. The frame protrusion 2a has a function of improving the positioning accuracy and workability of the frame 2 with respect to the substrate 1 as described above, for example.

  As described above, the imaging device 30 according to the embodiment of the present invention includes the imaging device storage package 20 having the above-described configuration and the imaging device 5 mounted on the mounting portion 1a. The variation in the position in the vertical direction (z direction) is effectively reduced. Therefore, when the optical member 6 is attached as described above, the alignment accuracy of the lens 10 of the optical member 6 and the imaging element 5 in the z direction or the like through the hole 4a of the lead terminal 4 is high.

  The imaging module 40 includes the imaging device 30 having the above-described configuration, and a protrusion 6 a that is disposed on the frame 2 of the imaging device 30 and is a portion inserted into the hole 4 a of the lead terminal 4. And an optical member 6. Therefore, the positional accuracy between the image sensor 5 and the optical member 6 (lens 10) is high.

  FIG. 4 is a top view showing a modification of the image sensor housing package 20 and the image pickup device 30 shown in FIG. 4, parts similar to those in FIG. 1 are denoted by the same reference numerals.

  In the example shown in FIG. 4, the lead terminal 4 has a frame portion (no symbol) on the outer periphery. The frame portion is a portion in which a part of the lead terminal 4 extends so as to surround the outside of the plurality of lead terminals 4 in plan view, and a hole 4a is provided in the frame portion.

  In this case, the hole 4a is farther from the mounting portion 1a of the image sensor 5 than in the example of FIG. That is, in the imaging device 30 and the imaging module 40, the distance between the imaging element 5 and the hole 4a is larger. Therefore, the distance from the image sensor 5 to the portion of the lead terminal 4 where the hole 4a is provided is larger, and the amount of heat conducted from the image sensor 5 to the lead terminal 4 around the hole 4a is further reduced.

  In this example, the frame portion has a large opening in the portion surrounding the lead terminal 4 between the mounting portion 1a (imaging element 5) and the hole portion 4a. That is, a portion (opening) that does not contribute to heat conduction exists in the portion from the mounting portion 1a to the hole portion 4a. This also reduces the amount of heat conducted between the mounting portion 1a (imaging element 5) and the hole 4a.

  With these configurations, deformation around the hole 4a of the lead terminal 4 due to heat generated by the imaging device 5 is more effectively reduced. Therefore, it is possible to provide the imaging module 40 in which the positional accuracy of the lead terminals 4 in the vertical direction is further improved. Further, it is possible to provide the imaging device 30 in which it is easier to manufacture such an imaging module 40. Further, it is possible to provide the image pickup device storage package 20 in which it is easier to manufacture such an image pickup device 30.

  For example, as described above, when the plurality of lead terminals 4 are manufactured by punching a metal plate material, the frame portion is formed by forming a die used for punching into a pattern including a predetermined frame portion. It can be manufactured integrally with the terminal 4.

DESCRIPTION OF SYMBOLS 1 ... Board | substrate 1a ... Mounting part 2 ... Frame body 2a ... Frame body convex part 3 ... Joining material 3a ... First joining material 3b ... ... 2nd bonding material 4 ... Lead terminal 4a ... Hole 5 ... Imaging element 6 ... Optical member 6a ... Projection 7 ... Transparent lid 8 ... Adhesive 9 ... Bonding wire
10 ... Lens
20 ・ ・ ・ ・ ・ Image sensor storage package
30 ... Imaging device
40: Imaging module

Claims (4)

A substrate having an image sensor mounting portion at the center of the upper surface;
A frame disposed on an outer peripheral portion of the upper surface of the substrate;
A bonding material interposed between the substrate and the frame, and having a lower end bonded to the substrate and an upper end bonded to the frame;
From the mounting part to the outside of the frame body, the lead material is provided between the upper end and the lower end of the bonding material and penetrates the bonding material,
The lead terminal has a hole outside the frame body;
The bonding material is positioned below the lead terminal and has filler particles at a first content rate, and is positioned above the lead terminal and the first content rate. And a second bonding material having filler particles at a second content rate higher than that of the image pickup element housing package.   2. The image sensor housing package according to claim 1, wherein a variation in the particle size of the filler particles in the first bonding material is smaller than a variation in the particle size of the filler particles in the second bonding material. The image sensor housing package according to claim 1 or 2,
An imaging device comprising: an imaging device mounted on the mounting unit. An imaging device according to claim 3;
An imaging module comprising: an optical member disposed on the frame of the imaging device and having a portion inserted into the hole of the lead terminal.

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