JP2016137705A5 - - Google Patents
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- JP2016137705A5 JP2016137705A5 JP2015233689A JP2015233689A JP2016137705A5 JP 2016137705 A5 JP2016137705 A5 JP 2016137705A5 JP 2015233689 A JP2015233689 A JP 2015233689A JP 2015233689 A JP2015233689 A JP 2015233689A JP 2016137705 A5 JP2016137705 A5 JP 2016137705A5
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- JP
- Japan
- Prior art keywords
- wiring layer
- electric wiring
- region
- head according
- heating resistor
- Prior art date
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- 238000010438 heat treatment Methods 0.000 claims description 50
- 239000007788 liquid Substances 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 9
- 230000001681 protective Effects 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 3
- 238000009429 electrical wiring Methods 0.000 claims description 3
- 230000020169 heat generation Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 46
- 230000002093 peripheral Effects 0.000 claims 3
- 238000011084 recovery Methods 0.000 claims 2
- 238000009413 insulation Methods 0.000 claims 1
- 239000011241 protective layer Substances 0.000 claims 1
Description
本発明の液体吐出ヘッドの素子基板は、基材と、基材上に位置する絶縁膜と、液体を吐出するための熱エネルギーを発生する発熱抵抗素子と、発熱抵抗素子を覆う保護膜と、絶縁膜内に設けられ発熱抵抗素子に電流を供給するための第1の電気配線層層と、絶縁膜内を延びて第1の電気配線層と発熱抵抗素子とを接続する複数の第1の接続部材と、絶縁膜内を延びて第1の電気配線層と発熱抵抗素子とを接続する複数の第2の接続部材と、を有している。電流は、複数の第1の接続部材から複数の第2の接続部材へ、発熱抵抗素子を第1の方向に沿って流れるようにされ、素子基板の発熱抵抗素子が設けられる面に直交する方向からみて、複数の第1の接続部材および複数の第2の接続部材は第1の方向と交差する第2の方向に沿って配設されている。 The element substrate of the liquid discharge head of the present invention includes a base material, an insulating film positioned on the base material, a heating resistor element that generates thermal energy for discharging the liquid, a protective film that covers the heating resistor element, a first electric wiring layer layer for supplying an electric current to the heating resistor element provided in the insulating film, a first plurality of connecting the heating resistance element and the first electric wiring layer extends through the insulating film A connecting member and a plurality of second connecting members that extend through the insulating film and connect the first electrical wiring layer and the heating resistor element . A current is caused to flow from the plurality of first connection members to the plurality of second connection members along the first direction along the first direction, and is perpendicular to the surface of the element substrate on which the heat generation resistance elements are provided. In view of this, the plurality of first connection members and the plurality of second connection members are disposed along a second direction that intersects the first direction.
Claims (28)
前記電流は、前記複数の第1の接続部材から前記複数の第2の接続部材へ、前記発熱抵抗素子を第1の方向に沿って流れるようにされ、
前記素子基板の前記発熱抵抗素子が設けられる面に直交する方向からみて、前記複数の第1の接続部材および前記複数の第2の接続部材は前記第1の方向と交差する第2の方向に沿って配設されている、液体吐出ヘッドの素子基板。 A base material; an insulating film positioned on the base material; a heating resistance element that generates thermal energy for discharging liquid; a protective film that covers the heating resistance element; and the heat generation provided in the insulating film. a first electric wiring layer for supplying current to the resistive element, a plurality of first connecting members for connecting the and extends in the insulating film of the first electric wiring layer and the heating resistor element, wherein a device substrate of a liquid discharge head for chromatic and a plurality of second connecting members for connecting said first electric wiring layer extends through the insulating film and said heating resistor elements, a,
The current flows from the plurality of first connection members to the plurality of second connection members through the heating resistor element along a first direction;
The plurality of first connection members and the plurality of second connection members are in a second direction intersecting the first direction when viewed from a direction orthogonal to the surface of the element substrate on which the heating resistor element is provided. An element substrate of the liquid discharge head, which is disposed along the line.
前記絶縁膜の、前記第1の電気配線層および前記第2の電気配線層とは異なる層に設けられ、前記発熱抵抗素子を駆動するためのロジック電源配線を含む第3の電気配線層と、を備える、請求項1から3のいずれか1項に記載の液体吐出ヘッドの素子基板。 A second electric wiring layer provided in a layer different from the first electric wiring layer of the insulating film for supplying a current to the heating resistance element;
A third electric wiring layer provided in a layer different from the first electric wiring layer and the second electric wiring layer of the insulating film and including a logic power supply wiring for driving the heating resistance element ; The element substrate of the liquid ejection head according to claim 1, comprising:
前記絶縁膜の、前記第1の電気配線層および前記第2の電気配線層とは異なる層に設けられ、前記発熱抵抗素子を駆動するための信号配線を含む第4の電気配線層と、を備える、請求項1から5のいずれか1項に記載の液体吐出ヘッドの素子基板。 A second electric wiring layer provided in a layer different from the first electric wiring layer of the insulating film for supplying a current to the heating resistance element;
A fourth electric wiring layer provided in a layer different from the first electric wiring layer and the second electric wiring layer of the insulating film and including a signal wiring for driving the heating resistor element ; The element substrate of the liquid ejection head according to claim 1, further comprising:
前記素子基板は、基材と、前記基材上に位置する絶縁膜と、液体を吐出するための熱エネルギーを発生する発熱抵抗素子と、前記発熱抵抗素子を覆う保護膜と、前記絶縁膜内に設けられ前記発熱抵抗素子に電流を供給するための第1の電気配線層と、前記第1の電気配線層と前記発熱抵抗素子の前記保護膜が設けられる側の裏面とを接続する、前記絶縁膜内を延びる複数の第1の接続部材と、前記第1の電気配線層と前記発熱抵抗素子の前記裏面とを接続する、前記絶縁膜内を延びる複数の第2の接続部材と、を有し、
前記素子基板の前記発熱抵抗素子が設けられる面に直交する方向からみて、前記複数の第1の接続部材は前記発熱抵抗素子の第1の方向における一端側と接続され、前記複数の第2の接続部材は前記発熱抵抗素子の前記第1の方向における他端側と接続され、
前記直交する方向からみて、前記複数の第1の接続部材および前記複数の第2の接続部材は、前記第1の方向と交差する第2の方向に沿って配設されている、液体吐出ヘッド。 A liquid discharge head comprising an element substrate,
The element substrate includes a base material, an insulating film positioned on the base material, a heating resistor element that generates thermal energy for discharging a liquid, a protective film that covers the heating resistor element, and an insulating film Connecting the first electrical wiring layer for supplying current to the heating resistor element and the back surface of the heating resistor element on the side where the protective film is provided, A plurality of first connecting members extending in the insulating film; and a plurality of second connecting members extending in the insulating film for connecting the first electrical wiring layer and the back surface of the heating resistor element. Have
The plurality of first connection members are connected to one end side in the first direction of the heating resistor element when viewed from a direction orthogonal to the surface on which the heating resistor element is provided on the element substrate, The connecting member is connected to the other end side in the first direction of the heating resistor element,
Viewed from the direction of the perpendicular, the plurality of first connecting members and said plurality of second connecting members, the first along the second direction crossing the direction are disposed, the liquid discharge head .
前記絶縁膜の、前記第1の電気配線層および前記第2の電気配線層とは異なる層に設けられ、前記発熱抵抗素子を駆動するためのロジック電源配線を含む第3の電気配線層と、を備える、請求項24に記載の液体吐出ヘッド。 A second electric wiring layer provided in a layer different from the first electric wiring layer of the insulating film for supplying a current to the heating resistance element;
A third electric wiring layer provided in a layer different from the first electric wiring layer and the second electric wiring layer of the insulating film and including a logic power supply wiring for driving the heating resistance element ; comprising a liquid discharge head according to claim 2 4.
前記絶縁膜の、前記第1の電気配線層および前記第2の電気配線層とは異なる層に設けられ、前記発熱抵抗素子を駆動するための信号配線を含む第4の電気配線層と、を備える、請求項24または25に記載の液体吐出ヘッド。 A second electric wiring layer provided in a layer different from the first electric wiring layer of the insulating film for supplying a current to the heating resistance element;
A fourth electric wiring layer provided in a layer different from the first electric wiring layer and the second electric wiring layer of the insulating film and including a signal wiring for driving the heating resistor element ; comprising, a liquid discharge head according to claims 2 to 4 or 2 5.
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105100394A TWI610820B (en) | 2015-01-27 | 2016-01-07 | Element substrate and liquid ejection head |
US15/000,544 US10035346B2 (en) | 2015-01-27 | 2016-01-19 | Element substrate and liquid ejection head |
CN201810154140.2A CN108372722B (en) | 2015-01-27 | 2016-01-22 | Element substrate and liquid ejection head |
CN201610045927.6A CN105818537B (en) | 2015-01-27 | 2016-01-22 | Device substrate and fluid ejection head |
EP21202653.8A EP3970977A1 (en) | 2015-01-27 | 2016-01-25 | Element substrate and liquid ejection head |
EP16152512.6A EP3050707B1 (en) | 2015-01-27 | 2016-01-25 | Element substrate and liquid ejection head |
RU2016102322A RU2645565C2 (en) | 2015-01-27 | 2016-01-26 | Element substrate and head for liquid ejection |
SG10201600629QA SG10201600629QA (en) | 2015-01-27 | 2016-01-27 | Element substrate and liquid ejection head |
US16/019,714 US10814623B2 (en) | 2015-01-27 | 2018-06-27 | Element substrate and liquid ejection head |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015013197 | 2015-01-27 | ||
JP2015013197 | 2015-01-27 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016137705A JP2016137705A (en) | 2016-08-04 |
JP2016137705A5 true JP2016137705A5 (en) | 2018-12-27 |
JP6598658B2 JP6598658B2 (en) | 2019-10-30 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015233689A Active JP6598658B2 (en) | 2015-01-27 | 2015-11-30 | Element substrate for liquid discharge head and liquid discharge head |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6598658B2 (en) |
CN (2) | CN105818537B (en) |
RU (1) | RU2645565C2 (en) |
SG (1) | SG10201600629QA (en) |
TW (1) | TWI610820B (en) |
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WO2018150830A1 (en) * | 2017-02-17 | 2018-08-23 | Canon Kabushiki Kaisha | Liquid discharge head substrate, method of manufacturing the same, liquid discharge head, and liquid discharge apparatus |
JP2018130942A (en) * | 2017-02-17 | 2018-08-23 | キヤノン株式会社 | Manufacturing method of substrate for liquid discharge head |
JP7037334B2 (en) | 2017-02-17 | 2022-03-16 | キヤノン株式会社 | Substrate for liquid discharge head, its manufacturing method, liquid discharge head and liquid discharge device |
US10300698B2 (en) | 2017-06-05 | 2019-05-28 | Canon Kabushiki Kaisha | Liquid ejection head |
JP6625158B2 (en) * | 2017-06-05 | 2019-12-25 | キヤノン株式会社 | Liquid ejection head |
JP6942537B2 (en) * | 2017-06-29 | 2021-09-29 | キヤノン株式会社 | Liquid discharge head |
EP3470228B1 (en) * | 2017-10-11 | 2021-06-30 | Canon Kabushiki Kaisha | Element substrate, manufacturing method thereof, printhead, and printing apparatus |
JP7005376B2 (en) | 2018-02-15 | 2022-01-21 | キヤノン株式会社 | Device substrate, recording head, and recording device |
JP6701255B2 (en) * | 2018-04-12 | 2020-05-27 | キヤノン株式会社 | Liquid ejection head substrate, liquid ejection head, liquid ejection device, and method for manufacturing liquid ejection head substrate |
JP7114380B2 (en) * | 2018-07-20 | 2022-08-08 | キヤノン株式会社 | Element substrate and liquid ejection head |
WO2020068035A1 (en) * | 2018-09-24 | 2020-04-02 | Hewlett-Packard Development Company, L.P. | Connected field effect transistors |
JP7171426B2 (en) * | 2018-12-27 | 2022-11-15 | キヤノン株式会社 | Liquid ejection head, manufacturing method thereof, and liquid ejection apparatus |
JP7344669B2 (en) * | 2019-04-23 | 2023-09-14 | キヤノン株式会社 | Element substrate, liquid ejection head, and recording device |
JP7328787B2 (en) | 2019-04-23 | 2023-08-17 | キヤノン株式会社 | ELEMENT SUBSTRATE, LIQUID EJECTION HEAD, AND RECORDING APPARATUS |
JP7465096B2 (en) | 2020-01-20 | 2024-04-10 | キヤノン株式会社 | Element substrate, liquid ejection head, and recording apparatus |
JP2021187121A (en) | 2020-06-03 | 2021-12-13 | キヤノン株式会社 | Element substrate, liquid discharge head, and recording device |
JP2022078882A (en) * | 2020-11-13 | 2022-05-25 | キヤノン株式会社 | Substrate for liquid discharge head, and liquid discharge head |
JP2022078883A (en) | 2020-11-13 | 2022-05-25 | キヤノン株式会社 | Substrate for liquid discharge head, and liquid discharge head |
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JP2708557B2 (en) * | 1988-07-26 | 1998-02-04 | キヤノン株式会社 | Element substrate for liquid jet recording head, liquid jet recording head, head cartridge and recording apparatus |
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JP2005067164A (en) * | 2003-08-28 | 2005-03-17 | Sony Corp | Liquid ejection head, liquid ejector, and process for manufacturing liquid ejection head |
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JP5328608B2 (en) * | 2008-12-15 | 2013-10-30 | キヤノン株式会社 | Substrate for liquid discharge head, liquid discharge head and manufacturing method thereof |
JP5404121B2 (en) * | 2009-03-25 | 2014-01-29 | キヤノン株式会社 | Recording substrate, method for manufacturing the recording substrate, and liquid discharge head |
JP5606213B2 (en) * | 2009-09-04 | 2014-10-15 | キヤノン株式会社 | Manufacturing method of substrate for liquid discharge head |
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-
2015
- 2015-11-30 JP JP2015233689A patent/JP6598658B2/en active Active
-
2016
- 2016-01-07 TW TW105100394A patent/TWI610820B/en active
- 2016-01-22 CN CN201610045927.6A patent/CN105818537B/en active Active
- 2016-01-22 CN CN201810154140.2A patent/CN108372722B/en active Active
- 2016-01-26 RU RU2016102322A patent/RU2645565C2/en active
- 2016-01-27 SG SG10201600629QA patent/SG10201600629QA/en unknown
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