JP2016128205A - 化学機械研磨パッドの製造方法 - Google Patents

化学機械研磨パッドの製造方法 Download PDF

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Publication number
JP2016128205A
JP2016128205A JP2015251944A JP2015251944A JP2016128205A JP 2016128205 A JP2016128205 A JP 2016128205A JP 2015251944 A JP2015251944 A JP 2015251944A JP 2015251944 A JP2015251944 A JP 2015251944A JP 2016128205 A JP2016128205 A JP 2016128205A
Authority
JP
Japan
Prior art keywords
sheet
acceptable
sheets
cutting
image data
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015251944A
Other languages
English (en)
Japanese (ja)
Inventor
フランシス・ブイ・アコーラ
V Acholla Francis
アンドリュー・アール・ワンク
Andrew R Wank
マーク・ガッツェ
Gazze Mark
スコット・チャン
Chang Scott
ジェフ・ツァイ
Tsai Jeff
ウィリアム・エー・ヒーシェン
A Heeschen William
ジェームズ・デイビッド・テイト
David Tate James
レオ・エイチ・チャン
H Chiang Leo
スウィー−テン・チン
Chin Swee-Teng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials CMP Holdings Inc
Dow Global Technologies LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Dow Global Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Dow Global Technologies LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of JP2016128205A publication Critical patent/JP2016128205A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/009—Tools not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/59—Transmissivity

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2015251944A 2014-12-29 2015-12-24 化学機械研磨パッドの製造方法 Pending JP2016128205A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462097171P 2014-12-29 2014-12-29
US62/097,171 2014-12-29

Publications (1)

Publication Number Publication Date
JP2016128205A true JP2016128205A (ja) 2016-07-14

Family

ID=56116795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015251944A Pending JP2016128205A (ja) 2014-12-29 2015-12-24 化学機械研磨パッドの製造方法

Country Status (6)

Country Link
JP (1) JP2016128205A (fr)
KR (1) KR20160082930A (fr)
CN (1) CN105729326B (fr)
DE (1) DE102015016891A1 (fr)
FR (1) FR3031107A1 (fr)
TW (1) TW201623381A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106891246A (zh) * 2017-03-30 2017-06-27 湖北鼎龙控股股份有限公司 一种用于半导体、光学材料和磁性材料表面平坦化的化学机械抛光垫
CN107639554A (zh) * 2017-11-10 2018-01-30 江苏瑞和磨料磨具有限公司 一种粗磨抛光一次完成的双面磨砂布

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102612601B1 (ko) * 2022-10-17 2023-12-12 주식회사 서연테크 반도체 공정용 정밀 석정반의 제작 시스템

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
KR100436861B1 (ko) 2001-08-27 2004-06-30 나노메트릭스코리아 주식회사 화학적 기계적 연마장치에 사용하는 연마 패드의 결함검사 방법 및 장치
JP3779636B2 (ja) * 2002-03-27 2006-05-31 株式会社東芝 光学測定による残膜の判定方法
US6838169B2 (en) * 2002-09-11 2005-01-04 Psiloquest, Inc. Polishing pad resistant to delamination
US20060189269A1 (en) * 2005-02-18 2006-08-24 Roy Pradip K Customized polishing pads for CMP and methods of fabrication and use thereof
TWI378844B (en) * 2005-08-18 2012-12-11 Rohm & Haas Elect Mat Polishing pad and method of manufacture
TW200720023A (en) * 2005-09-19 2007-06-01 Rohm & Haas Elect Mat A method of forming a stacked polishing pad using laser ablation
US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window
CN103753382B (zh) * 2014-01-06 2016-04-27 成都时代立夫科技有限公司 一种抛光垫及其制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106891246A (zh) * 2017-03-30 2017-06-27 湖北鼎龙控股股份有限公司 一种用于半导体、光学材料和磁性材料表面平坦化的化学机械抛光垫
CN107639554A (zh) * 2017-11-10 2018-01-30 江苏瑞和磨料磨具有限公司 一种粗磨抛光一次完成的双面磨砂布

Also Published As

Publication number Publication date
CN105729326A (zh) 2016-07-06
TW201623381A (zh) 2016-07-01
KR20160082930A (ko) 2016-07-11
FR3031107A1 (fr) 2016-07-01
CN105729326B (zh) 2018-03-30
DE102015016891A1 (de) 2016-06-30

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