JP2016127540A - Image sensor unit, image reading apparatus, and paper sheet identification apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an image sensor unit connecting a light source substrate and a sensor substrate with a lead wire with improved dust resistance.SOLUTION: An insertion hole 46 is formed on a sensor substrate 40. A lead wire 33 is connected to a lower surface 43 of the sensor substrate 40 from a light source substrate 30 through the insertion hole 46. The insertion hole 46 is closed with a closing member 22.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an image sensor unit, an image reading device, and a paper sheet identification device.

  In general, an image sensor unit is used to read an image. In Patent Document 1, reflected light from a document surface that has received light from a plurality of light emitting elements mounted on a light emitting substrate is condensed on a light receiving element mounted on the light receiving substrate via a lens array. It is configured. At this time, the lead wire connected to the light emitting substrate is connected to the power line on the lower surface of the light receiving substrate by soldering.

Japanese Patent Laid-Open No. 7-115505

  In Patent Document 1, a lead wire connected to a light emitting substrate is drawn out of a frame from a lead wire guide groove provided at a lower portion of the end surface of the frame, and then soldered to the lower surface of the light receiving substrate. That is, since the lead wire guide groove of the frame communicates with the outside, there is a problem that dust enters the frame from the outside.

  The present invention has been made in view of the above-described problems, and an object thereof is to improve dust resistance in an image sensor unit in which a light source substrate and a sensor substrate are connected by lead wires.

The image sensor unit of the present invention includes a plurality of light sources that emit light to an object to be illuminated, a light source substrate that mounts the plurality of light sources along a main scanning direction, and light from the object to be illuminated to an electrical signal. An image sensor to be converted, a sensor substrate on which the image sensor is mounted along the main scanning direction, a lead wire for electrically connecting the light source substrate and the sensor substrate, and the light source substrate and the sensor substrate are accommodated. An image sensor unit having a frame, wherein the sensor substrate is formed with a hole or a notch, and the lead wire extends from the light source substrate through the hole or the notch and the image of the sensor substrate. It is connected to the surface where the sensor is not mounted, and the hole or the notch is closed by a closing member.
The image reading apparatus of the present invention includes the above-described image sensor unit, and a transfer unit that relatively transfers the image sensor unit and the object to be illuminated.
The paper sheet identification apparatus of the present invention includes the above-described image sensor unit, a transfer unit that transfers the paper sheet as the illuminated body, and a storage unit that stores reference data serving as a reference for identifying the paper sheet And a comparison unit that compares the image information read by the image sensor unit with the reference data stored in the storage unit to identify the paper sheet.

  ADVANTAGE OF THE INVENTION According to this invention, in an image sensor unit which connects a light source board | substrate and a sensor board | substrate with a lead wire, dustproofness can be improved.

FIG. 1 is a cross-sectional view showing the main configuration of the image reading apparatus. FIG. 2 is an exploded perspective view of the image sensor unit. FIG. 3 is an enlarged exploded perspective view of a part of the image sensor unit. FIG. 4 is a plan view of the image sensor unit. FIG. 5 is a bottom view of the image sensor unit according to the first embodiment. FIG. 6 is a bottom view of the image sensor unit according to the second embodiment. FIG. 7 is a bottom view of the image sensor unit according to the third embodiment.

Hereinafter, preferred embodiments of an image sensor unit and an image reading apparatus according to the present invention will be described with reference to the drawings. In the following description, three-dimensional directions are indicated by X, Y, and Z arrows. The X direction is the main scanning direction, the Y direction is the sub scanning direction perpendicular to the main scanning direction, and the Z direction is the vertical direction (up and down direction).
(First embodiment)
The image reading apparatus 100 according to the present embodiment functions as a paper sheet identification apparatus that performs authenticity determination of paper sheets such as banknotes and securities.
FIG. 1 is a cross-sectional view illustrating a main configuration of an image reading apparatus 100 including an image sensor unit 10 according to the present embodiment. First, an outline of these overall configurations will be described. In this embodiment, it is set as the banknote S typically as a to-be-illuminated body. In addition, this invention is applicable not only to the banknote S but to another target object.

  Conveying rollers 101A and 101B and conveying rollers 102A and 102B serving as conveying units for conveying the banknotes S in pairs in the conveying direction F of the banknotes S are provided in predetermined portions of the image reading apparatus 100. Arranged at intervals. These transport rollers 101A, 101B and 102A, 102B are rotationally driven by a drive mechanism, and the bill S is transported relative to the image sensor unit 10 in the transport direction F at a predetermined transport speed. .

The image sensor unit 10 is disposed between the transport rollers 101A and 101B and the transport rollers 102A and 102B, emits light to the banknote S to be transferred, and reads image information of reflected light from the banknote S.
A comparison unit 103 is connected to the image sensor unit 10. The comparison unit 103 acquires image information read by the image sensor unit 10. Further, the comparison unit 103 reads the reference data stored in the storage unit 104 and compares it with the acquired image information to identify the authenticity of the banknote S.

Next, the configuration of the image sensor unit 10 will be described. FIG. 2 is an exploded perspective view of the image sensor unit 10. FIG. 3 is an enlarged perspective view of one side in the main scanning direction of the image sensor unit 10 shown in FIG. The image sensor unit 10 is generally formed in a rectangular parallelepiped, and the longitudinal direction thereof is the main scanning direction, and the sub-scanning direction orthogonal to this is the conveyance direction F of the bills S.
The image sensor unit 10 includes a frame 11, a plurality of light sources 25, a light source substrate 30, a filter member 35, a condenser 37, a sensor substrate 40, an image sensor 50, a cover member 55, and the like. Among these constituent members, the frame 11, the light source substrate 30, the filter member 35, the sensor substrate 40, the image sensor 50, and the cover member 55 are formed to have a length corresponding to the size of the banknote S to be read in the main scanning direction. Of these components, the frame 11, the plurality of light sources 25, and the light source substrate 30 function as an illumination device.

The frame 11 is a housing part in which a space for accommodating each component of the image sensor unit 10 is formed. The frame 11 is a rectangular parallelepiped formed by four side wall portions 12a to 12d with the main scanning direction as a longitudinal direction. Inside the frame 11, the light source substrate 30, the light collector 37, the sensor substrate 40, and the like are formed so as to be supported at predetermined positions.
As shown in FIG. 1, a light source substrate accommodating portion 13 that accommodates the light source substrate 30 and the filter member 35 is formed in the main scanning direction substantially at the center of the frame 11. In the light source substrate housing portion 13, a light source substrate support portion 14 that supports the light source substrate 30 and a filter support portion 15 that supports the filter member 35 are formed. The light source substrate support unit 14 supports the light source substrate 30 in a state of being inclined with respect to the sub-scanning direction and the vertical direction. The filter support unit 15 supports the filter member 35 so as to be parallel to the light source substrate 30. A plurality of light source substrate support portions 14 and filter support portions 15 are formed at intervals in the main scanning direction of the frame 11.

As shown in FIG. 1, on the side of the side wall portion 12 c of the frame 11, the light collector housing portion 16 that houses the light collector 37 is formed in the main scanning direction. A groove 17 along the main scanning direction is formed on the lower side of the light collector housing portion 16 in order to form an image of the light collected by the light collector 37 on the image sensor 50.
Below the frame 11, a sensor substrate housing portion 18 for housing the sensor substrate 40 is formed in a concave shape from the bottom of the frame 11 in the main scanning direction. A positioning protrusion 19 for positioning the sensor substrate 40 is formed in the sensor substrate housing portion 18 (see FIG. 5 described later). A plurality of positioning protrusions 19 are formed at intervals in the main scanning direction of the frame 11.
Note that a resin material such as polycarbonate can be applied to the frame 11.

  The light source 25 emits light to the bill S to be transferred. As shown in FIG. 3, a so-called top view type surface mount type LED package 27 in which an LED chip 26 as a light emitting element is mounted on the surface of the light source 25 can be applied. The LED package 27 is disposed in a state where the LED chip 26 is sealed on the surface of the LED package 27 with a transparent resin. Here, the LED package 27 that emits white light emission wavelength is used. However, for example, an LED package that emits light emission wavelengths of red, green, blue, infrared light, and ultraviolet light may be used. The reason why invisible light such as infrared light and ultraviolet light is emitted is to read an image of the banknote S printed with invisible ink.

  The light source substrate 30 is formed in a flat plate shape having the main scanning direction as a longitudinal direction. A plurality of light sources 25 are mounted on the upper surface 31 of the light source substrate 30 in a state of being arranged along the main scanning direction. Therefore, the plurality of light sources 25 mounted on the light source substrate 30 emit line-shaped light along the main scanning direction with respect to the banknote S. In addition, a circuit pattern (not shown) is applied to the light source substrate 30 to electrically connect the mounted light sources 25 to each other. As shown in FIG. 3, a lead wire 33 that supplies electricity to cause the light source 25 to emit light is connected to the lower surface 32 of the light source substrate 30. The lead wire 33 is connected to one side of the light source substrate 30 in the main scanning direction. Here, in order to emit only white light, the number of lead wires 33 is two. However, when the number of colors to be emitted is increased, the number of lead wires 33 is also increased.

  The filter member 35 is formed in a flat plate shape whose longitudinal direction is the main scanning direction. The filter member 35 cuts the emission wavelength of infrared light among the emission wavelengths emitted by the light source 25. Note that the filter member 35 can be omitted when there is no need to cut the emission wavelength emitted by the light source 25, such as when infrared light is emitted from the light source 25.

  The condenser 37 is an optical member that forms an image of the reflected light from the banknote S on the image sensor 50. The light collector 37 is formed in a rod shape whose longitudinal direction is the main scanning direction. For example, a rod lens array in which a plurality of erecting equal-magnification imaging elements (rod lenses) are linearly arranged in the main scanning direction can be applied to the light collecting body 37. Note that the condenser 37 is not limited to the above-described configuration as long as it can form an image on the image sensor 50. Conventionally known optical members having various condensing functions such as various microlens arrays can be applied to the condensing body 37.

The sensor substrate 40 is formed in a flat plate shape having the main scanning direction as a longitudinal direction. A drive circuit 42 (see FIG. 1) for causing the light source 25 to emit light and driving the image sensor 50 is mounted on the upper surface 41 of the sensor substrate 40. Further, a circuit pattern (not shown) is applied to the entire upper surface 41 of the sensor substrate 40. A connector 44 for connecting a cable for transmitting / receiving signals to / from the image sensor unit 10 and supplying electricity is disposed on the lower surface 43 of the sensor substrate 40 (the surface on which the image sensor 50 is not mounted). The In the sensor substrate 40, positioning holes 45 into which the positioning protrusions 19 of the frame 11 are fitted are formed at intervals in the main scanning direction.
In the sensor substrate 40 of the present embodiment, there is a relatively wide area where other components can be mounted on the lower surface 43, but the drive circuit 42 is mounted on the upper surface 41 or a circuit pattern is applied. Therefore, there is no area where other parts can be mounted.

  The image sensor 50 is mounted on the upper surface 41 of the sensor substrate 40 and disposed below the light collector 37. In the image sensor 50, a predetermined number of image sensor ICs 51 including a plurality of photoelectric conversion elements corresponding to the reading resolution of the image sensor unit 10 are linearly arranged on the upper surface 41 in the main scanning direction. The image sensor 50 receives the light reflected by the bill S and formed by the condenser 37 and converts it into an electrical signal. In addition, the image sensor 50 should just be what can convert the reflected light from the banknote S into an electrical signal, and is not limited to the structure mentioned above. Various conventionally known image sensor ICs can be applied to the image sensor IC 51.

  The cover member 55 prevents dust from entering the frame 11 by covering the opening of the frame 11 from the upper side (the banknote S side). The cover member 55 is formed in a flat plate shape having the main scanning direction as a longitudinal direction. A part of the cover member 55 is provided with a transmission member 56 for transmitting light from the light source 25 to the bill S and transmitting reflected light from the bill S into the frame 11.

Next, the basic operation of the image sensor unit 10 configured as described above will be described. The transport rollers 101A, 101B and 102A, 102B transport the banknote S in the transport direction F at a predetermined transport speed. At this time, each light source 25 emits light toward the reading position O of the banknote S as shown by an arrow E typically shown in FIG. Therefore, the line-shaped light is uniformly emitted to the lower surface of the banknote S over the main scanning direction.
The condenser 37 forms an image of the light reflected by the banknote S on the image sensor 50. The image sensor 50 converts the imaged reflected light into an electrical signal. A signal processing unit (not shown) processes the converted electric signal as an image.

  The image sensor 50 reads the reflected light for one scanning line, thereby completing the reading operation for one scanning line in the main scanning direction of the banknote S. After the reading operation for one scanning line is completed, the reading operation for the next one scanning line is performed in the same manner as described above as the bill S moves in the sub-scanning direction. In this way, by repeating the reading operation for each scanning line while transferring the banknote S in the transport direction F, the entire surface of the banknote S is sequentially scanned, and image information is read by reflected light.

In the present embodiment, since the driving circuit 42 for causing the light source 25 to emit light is mounted on the upper surface 41 of the sensor substrate 40, the lead wire 33 extending from the light source substrate 30 is electrically connected to the sensor substrate 40. There is a need. At this time, there is no region for connecting the lead wire 33 on the upper surface 41 of the sensor substrate 40, and it is difficult to connect the lead wire 33 to the upper surface 41 of the sensor substrate 40.
Therefore, in the present embodiment, the lead wire 33 is connected to the lower surface 43 of the sensor substrate 40 having a sufficient area.

  In an image sensor unit in which the lead wire 33 is connected to the lower surface 43 of the sensor substrate 40, dust may enter the frame 11 in some cases. The image sensor unit 10 of the present embodiment employs a structure that improves dustproofness even when the light source substrate 30 and the sensor substrate 40 are connected by the lead wire 33.

Hereinafter, a structure for improving the dust resistance of the image sensor unit 10 will be described.
As shown in FIG. 1, a through hole 20 is formed in the frame 11 so as to penetrate the light source substrate housing portion 13 and the sensor substrate housing portion 18 in the vertical direction. As shown in FIGS. 2 and 3, the through hole 20 is formed at a position close to the side wall portion 12 a of the frame 11, that is, on one side of the frame 11 in the main scanning direction. Further, on the upper side continuous with the through hole 20 of the frame 11, a tapered portion 21 that is expanded and inclined toward the upper side is formed.
As shown in FIG. 1, the sensor substrate 40 is formed with an insertion hole 46 as a hole along the vertical direction. The insertion hole 46 is formed on one side of the sensor substrate 40 in the main scanning direction. Here, in the state where the sensor substrate 40 is accommodated in the sensor substrate accommodating portion 18 of the frame 11, as shown in FIG. 1, the through hole 20 and the insertion hole 46 communicate in the vertical direction.
Therefore, the lead wire 33 is wired on the lower surface 43 side of the sensor substrate 40 by inserting the lead wire 33 extending from the light source substrate 30 across the through hole 20 and the insertion hole 46. In the present embodiment, the insertion hole 46 of the sensor substrate 40 has a larger diameter than the through hole 20 of the frame 11.

FIG. 4 is a plan view in which a part of the image sensor unit 10 in the main scanning direction is omitted. Here, the filter member 35 and the cover member 55 are not shown.
As shown in FIG. 4, the through hole 20 and the insertion hole 46 are formed at a position overlapping at least a part of the light source substrate 30 when viewed in a plan view. Further, the through hole 20 and the insertion hole 46 are formed at positions outside the light source 25 mounted at the end of the light source substrate 30 in the main scanning direction. That is, the through hole 20 and the insertion hole 46 are located outside the two-dot chain line L shown in FIG. Here, the lead wire 33 is connected to one end of the light source substrate 30 in the main scanning direction, that is, outside the two-dot chain line L in the main scanning direction. Therefore, the lead wire 33 is inserted into the through hole 20 and the insertion hole 46 at the shortest or relatively short distance by extending downward from the light source substrate 30. Therefore, the assembly can be facilitated, and the part cost can be reduced as much as the wiring length of the lead wire 33 can be shortened. Further, by shortening the wiring length of the lead wire 33, the lead wire 33 is not bent and wiring misalignment can be prevented.

FIG. 5 is a bottom view in which a part of the image sensor unit 10 in the main scanning direction is omitted.
As shown in FIG. 5, the lead wire 33 inserted through the through hole 20 and the insertion hole 46 is connected to a connection pad 47 formed on the lower surface 43 of the sensor substrate 40 by soldering or the like. Therefore, the image sensor unit 10 of the present embodiment can connect the lead wire 33 from the light source substrate 30 to the lower surface 43 of the sensor substrate 40. Note that the connection pad 47 is electrically connected to the drive circuit 42 through the inside of the sensor substrate 40.

  Next, as shown in FIG. 1, the insertion hole 46 through which the lead wire 33 is inserted is closed by the closing member 22. The closing member 22 prevents dust from entering the frame 11 through the insertion hole 46. For the closing member 22, for example, a resin material having a light shielding property can be applied. Therefore, even if it is the structure which connects the light source board | substrate 30 and the sensor board | substrate 40 with the lead wire 33, dustproofness can be improved.

Next, a method for manufacturing the image sensor unit 10 will be described.
First, the constituent members of the image sensor unit 10 are prepared. At this time, a plurality of light sources 25 are mounted in advance on the light source substrate 30 at predetermined positions, or lead wires 33 are connected to predetermined positions on the lower surface 32 by soldering or the like. Similarly, the image sensor 50, the drive circuit 42, and the like are mounted on the sensor substrate 40 at predetermined positions in advance.

  Next, the light source substrate 30 is housed in the light source substrate housing portion 13 and the light collector 37 is housed in the light collector housing portion 16. At this time, the lead wire 33 connected to the light source substrate 30 is inserted into the through hole 20 from the upper side of the frame 11. Here, since the tapered portion 21 is continuously formed in the through hole 20, the lead wire 33 is guided by the tapered portion 21 and is easily inserted into the through hole 20. In a state where the light source substrate 30 is accommodated in the light source substrate accommodating portion 13, the light source substrate 30 is supported in an inclined state by the light source substrate supporting portion 14. Next, the filter member 35 is disposed on the upper side of the light source substrate 30 in parallel with the light source substrate 30. The filter member 35 is supported in an inclined state by the filter support portion 15. Thereafter, the cover member 55 is fixed to the upper side of the frame 11 so as to overlap the frame 11.

Next, the sensor substrate 40 is accommodated in the sensor substrate accommodating portion 18. At this time, the lead wire 33 extending from the through hole 20 of the frame 11 is inserted into the insertion hole 46, and the positioning protrusion 19 is fitted into the positioning hole 45 of the frame 11. Here, since the through hole 20 has a small diameter, the lead wires 33 are pulled out from the through hole 20 together. On the other hand, since the insertion hole 46 has a large diameter, the lead wire 33 can be easily inserted into the insertion hole 46. Thereafter, the sensor substrate 40 is fixed to the frame 11 by thermally crimping the tip of the positioning protrusion 19 protruding from the positioning hole 45. Further, the lead wire 33 is connected to the lower surface 43 of the sensor substrate 40 by soldering to the connecting pad 47.
Finally, the closing member 22 is inserted into the insertion hole 46 to close the insertion hole 46. If necessary, a first sealing agent may be applied between the frame 11 and the cover member 55, or a second sealing agent may be applied between the frame 11 and the sensor substrate 40. It is possible to prevent dust from entering the frame 11. Silicone resin can be used as the sealing agent.

  According to the present embodiment, the lead wire 33 connected to the light source substrate 30 is connected to the lower surface 43 of the sensor substrate 40 through the insertion hole 46 of the sensor substrate 40, and the insertion hole 46 is closed by the closing member 22. Therefore, since it is possible to prevent dust from entering the frame 11 from the insertion hole 46 by the closing member 22, even if the light source substrate 30 and the lower surface 43 of the sensor substrate 40 are connected by the lead wire 33, Dustproofness can be improved.

The lead wire 33 is connected to one side of the light source substrate 30 in the main scanning direction, and the insertion hole 46 is formed on one side of the sensor substrate 40 in the main scanning direction. That is, the lead wire 33 extending from the light source substrate 30 is connected to the lower surface 43 of the light source substrate 30 at a short distance through the insertion hole 46.
In particular, the insertion hole 46 is formed on the outer side in the main scanning direction with respect to the light source 25 mounted on the most end portion on one side in the main scanning direction of the light source substrate 30 when viewed in a plan view. In this case, the lead wire 33 is inserted into the insertion hole 46 at a short distance by extending from the light source substrate 30 substantially downward. Accordingly, the cost of parts can be reduced by the amount that the wiring length of the lead wire 33 can be shortened, and the lead wire 33 can be prevented from being bent and wiring misalignment can be prevented.

Further, the frame 11 is formed with a through hole 20 that communicates with the insertion hole 46 when seen in a plan view. Therefore, the lead wire 33 can be wired from the light source substrate housing portion 13 to the sensor substrate housing portion 18.
Further, since the through hole 20 has a smaller diameter than the insertion hole 46, the lead wire 33 is pulled out from the through hole 20 together. Conversely, since the insertion hole 46 has a larger diameter than the through hole 20, the lead wire 33 drawn from the through hole 20 can be easily inserted into the insertion hole 46.

(Second Embodiment)
In the first embodiment, the case where the insertion hole 46 is formed in the sensor substrate 40 has been described. In the present embodiment, a case where a cutout portion 48 is formed instead of the insertion hole 46 will be described. In addition, the same structure as 1st Embodiment attaches | subjects the same code | symbol as 1st Embodiment, and abbreviate | omits the description.

FIG. 6 is a bottom view in which a part of the image sensor unit 10 of the second embodiment is omitted in the main scanning direction.
As shown in FIG. 6, the sensor substrate 40 of the present embodiment is formed with a notch 48 that is notched from one end in the main scanning direction. As in the first embodiment, the notch 48 is formed at a position outside the light source 25 mounted at the end of the light source substrate 30 in the main scanning direction. Further, at least a part of the notch 48 communicates with the through hole 20 of the frame 11 in the vertical direction.

  The lead wire 33 is inserted into the through hole 20 of the frame 11 and the notch 48 of the sensor substrate 40. The lead wire 33 inserted into the through hole 20 and the notch 48 is connected to a connecting pad 47 formed on the lower surface 43 of the sensor substrate 40. Further, by blocking the portion of the cutout portion 48 that communicates with the through hole 20 with the closing member 22 (not shown), it is possible to prevent dust from entering the frame 11 through the cutout portion 48.

(Third embodiment)
In the first embodiment, the case where the insertion hole 46 is formed in the sensor substrate 40 has been described. In the present embodiment, a case where a cutout portion 49 is formed instead of the insertion hole 46 will be described. In addition, the same structure as 1st Embodiment attaches | subjects the same code | symbol as 1st Embodiment, and abbreviate | omits the description.

FIG. 7 is a bottom view in which a part of the image sensor unit 10 of the third embodiment is omitted in the main scanning direction.
As shown in FIG. 7, the sensor substrate 40 of the present embodiment is formed with a notch 49 that is notched from one end in the sub-scanning direction. As in the first embodiment, the notch 49 is formed at a position outside the light source 25 mounted at the end of the light source substrate 30 in the main scanning direction. Further, at least a part of the notch 49 communicates with the through hole 20 of the frame 11 in the vertical direction.

  The lead wire 33 is inserted into the through hole 20 of the frame 11 and the notch 49 of the sensor substrate 40. The lead wire 33 inserted into the through hole 20 and the notch 49 is connected to a connecting pad 47 formed on the lower surface 43 of the sensor substrate 40. Further, by blocking the portion of the cutout portion 49 that communicates with the through-hole 20 with the closing member 22 (not shown), it is possible to prevent dust from entering the frame 11 through the cutout portion 49.

As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.
Although the image sensor unit 10 of the above-described embodiment has been described with respect to the case where the filter member 35 is provided, the present invention is not limited to this case, and the filter member 35 may be omitted.
The image sensor unit 10 of the above-described embodiment has been described with respect to the case where the cover member 55 is provided. However, the cover member 55 may be omitted by providing the frame 11 with the function of the cover member 55.

  In the image sensor unit 10 of the above-described embodiment, the case where the plurality of light sources 25 are mounted in a line along the main scanning direction on the upper surface 31 of the light source substrate 30 has been described. However, the present invention is not limited to this case. For example, a plurality of light sources 25 may be mounted on the upper surface 31 of the light source substrate 30 in a staggered manner or in two or more rows along the main scanning direction.

  10: Image sensor unit 11: Frame 19: Through hole 22: Closing member 25: Light source 30: Light source board 33: Lead wire 37: Light collector 40: Sensor board 44: Connector 46: Insertion hole (hole) 48, 49 : Notch part 50: Image sensor 55: Cover member 100: Image reading apparatus (paper sheet identification apparatus) 101A, 101B, 102A, 102B: Conveying roller (transfer part) 103: Comparison part 104: Storage part S: Illuminated body (Banknote S)

Claims (10)

A plurality of light sources for emitting light to the object to be illuminated;
A light source substrate for mounting the plurality of light sources along a main scanning direction;
An image sensor that converts light from the illuminated body into an electrical signal;
A sensor substrate for mounting the image sensor along a main scanning direction;
A lead wire for electrically connecting the light source substrate and the sensor substrate;
An image sensor unit having a frame for accommodating the light source substrate and the sensor substrate,
The sensor substrate is formed with a hole or a notch,
The lead wire is connected to the surface of the sensor substrate where the image sensor is not mounted, from the light source substrate through the hole or the notch,
The image sensor unit, wherein the hole or the notch is closed by a closing member. The lead wire is connected to one side in the main scanning direction of the light source substrate,
The image sensor unit according to claim 1, wherein the hole or the notch is formed on one side of the sensor substrate in a main scanning direction.   The hole portion or the notch portion is located on the outer side in the main scanning direction with respect to the light source arranged at the extreme end on one side in the main scanning direction among the plurality of light sources mounted on the light source substrate in a plan view. The image sensor unit according to claim 1, wherein the image sensor unit is formed.   4. The image sensor unit according to claim 1, wherein the frame is formed with a through hole that communicates with the hole or the notch when viewed in a plan view. 5. The sensor substrate is formed with the hole,
The image sensor unit according to claim 4, wherein the hole has a larger diameter than the through hole.   The image sensor unit according to claim 1, wherein the closing member is a resin material having a light shielding property.   The image sensor unit according to claim 1, wherein a first sealing agent is applied between the frame and the sensor substrate. A cover member for covering the frame from the illuminated body side;
The image sensor unit according to claim 1, wherein a second sealing agent is applied between the frame and the cover member. The image sensor unit according to any one of claims 1 to 8,
A transfer unit that relatively transfers the image sensor unit and the object to be illuminated;
An image reading apparatus comprising: The image sensor unit according to any one of claims 1 to 8,
A transfer unit for transferring paper sheets as the object to be illuminated;
A storage unit for storing reference data serving as a reference for identifying the paper sheet;
A comparison unit that compares the image information read by the image sensor unit with the reference data stored in the storage unit to identify the paper sheet;
A paper sheet identification device comprising:

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