JP2016126844A - Electronic apparatus and method of manufacturing electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique which allows for further cost reduction, while preventing accidental disconnection of an electronic component from a connector, in the manufacturing of an electronic apparatus where electronic components are connected each other by means of a connector.SOLUTION: An electronic apparatus 1 includes a housing 20 for an electronic apparatus, a board 30 on which a female side connector 55 for signal transmission is mounted, and a male side connector 56 for connection with the board 30 by means of the female side connector 55. In order to prevent accidental disconnection of the male side connector 56 from the female side connector 55, an elastic material having viscosity is applied to at least any one of the housing 20 or the male side connector 56. The elastic material having viscosity uses silicon gel 63 that is also used for water-proofing. In the manufacturing process of the electronic apparatus 1, the silicon gel 63 for preventing accidental disconnection of the male side connector 56 from the female side connector 55 is applied to the housing 20, in the same step as the step for applying the silicon gel 63 for water-proofing to the housing 20.SELECTED DRAWING: Figure 5

Description

  The present disclosure relates to an electronic apparatus including electronic components that are connected to each other by a connector that transmits a signal, and more particularly, to a technique that prevents erroneous disconnection in the connector.

  In an electronic device, a plurality of electronic components such as an antenna, a flexible substrate, and a circuit board are connected to each other via a connector. For example, an electronic device has a circuit board on which an application processor, a memory, a connector, and the like are mounted, and a flexible board is connected to the circuit board via a connector. For example, a camera module or the like is connected to the flexible substrate. In a manufacturing process of an electronic device, a camera module is assembled to the electronic device by bending a flexible substrate or the like.

  As described above, in an electronic device including the first electronic component on which the connector is mounted and the second electronic component that is connected to the first electronic component by the connector, the second electronic component is prevented from coming off in the connector. For this reason, a cushion with an adhesive is used.

  For example, in Japanese Patent Application Laid-Open No. 2007-215017 (Patent Document 1), in a camera-equipped electronic device, the camera is not detached from the camera mounting hole of the frame, and one end of the flexible board of the camera is connected to the connector of the circuit board. However, it describes a technique for preventing the connection with the connector from being disconnected due to vibration or dropping impact. Specifically, Patent Document 1 describes bonding a cushion member to a flexible substrate. The cushion member is stuck over the flexible substrate from the magnesium frame.

JP 2007-215017 A (released on August 23, 2007)

  According to the technique described in Patent Document 1, the flexible substrate is prevented from being detached from the connector.

  However, the cushion member needs to be prepared based on the shape of the substrate to be attached. For example, when the shape of the connector is changed, it is necessary to create a cushion member each time, and the cost increases. Therefore, there is a need for a technique that suppresses cost increases.

  An object of the present disclosure is to provide a technique that enables further cost reduction in the manufacture of electronic devices.

  An electronic device according to an embodiment includes a housing of the electronic device, a first electronic component on which a signal transmission connector is mounted, and a second electronic component that is connected to the first electronic component by the connector. In the electronic device, a viscous elastic material for preventing the second electronic component from being accidentally detached from the connector is provided in at least one of the housing, the connector, and the second electronic component.

According to one embodiment, the elastic material having viscosity includes silicon gel.
According to one embodiment, the second electronic component includes a flexible member, the first electronic component includes a closable holding member, and the flexible member inserted into the connector is closed on the holding member. The second electronic component is held by being sandwiched between the holding member, and a viscous elastic material is applied to the holding member while the holding member holds and holds the flexible member.

  According to one embodiment, the first electronic component includes a receptacle connector, the second electronic component is a plug connector having a coaxial cable, and the plug connector is inserted into the receptacle connector of the first electronic component. The first connector is connected to the first electronic component, and the plug connector is provided with an elastic material having viscosity.

  According to one embodiment, a method for manufacturing an electronic device is provided. The electronic device includes a first electronic component on which a signal transmission connector is mounted, and a second electronic component connected to the first electronic component by the connector. The manufacturing method includes information including an application amount and an area in which an automatic machine applies silicon gel to a housing, a connector, or a second electronic component of an electronic device in order to prevent the second electronic component from being detached from the connector. According to the information including the step of reading from the memory and the amount and area of application of the read silicon gel to the housing, connector or second electronic component of the electronic device, the waterproof silicon gel is applied to the housing of the electronic device. Applying.

  According to one embodiment, it is not necessary to prepare a dedicated cushion member for preventing accidental disconnection in a connector in the manufacture of an electronic device, and further cost reduction is possible.

  The above and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description of the present invention taken in conjunction with the accompanying drawings.

It is a disassembled perspective view of the electronic device in related technology. It is sectional drawing in the II-II 'line | wire when the electronic device of FIG. 1 is assembled. It is a disassembled perspective view of the electronic device in another related technique. FIG. 4 is a cross-sectional view taken along line IV-IV ′ when the electronic device of FIG. 3 is assembled. 1 is an exploded perspective view of an electronic device 1 in Embodiment 1. FIG. FIG. 6 is a diagram schematically showing a state in which the housing 20 is joined to the housing 10 in the cross section indicated by the line VII-VII ′ in FIG. 5. FIG. 7 is a cross-sectional view taken along line VII-VII ′ when the electronic apparatus 1 of FIG. 5 is assembled. FIG. 6 is an exploded perspective view of an electronic device 2 in a second embodiment. It is sectional drawing in the IX-IX 'line | wire when the electronic device 2 of FIG. 8 is assembled. It is a figure which shows the detail of the connector 50. FIG. It is a figure which shows the state by which FPC (Flexible Printed Circuit) / FFC (Flexible Flat Cable) 160 was fitted by the connector 50. FIG. FIG. 10 is a diagram illustrating the inside of a housing of an electronic device according to a third embodiment. It is a flowchart which shows the manufacturing process for manufacturing an electronic device. It is a figure which shows the structure which the connector 110 with a coaxial fits into the receptacle connector 71. FIG. FIG. 6 is a view showing an example in which a coaxial connector 110 is fitted to a receptacle connector 71 of a substrate 31.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same parts are denoted by the same reference numerals. Their names and functions are also the same. Therefore, detailed description thereof will not be repeated.

<Related technologies>
First, related technologies related to the electronic device of the embodiment will be described.

  FIG. 1 is an exploded perspective view of an electronic device according to the related art. FIG. 2 is a cross-sectional view taken along the line II-II ′ when the electronic device of FIG. 1 is assembled.

  As shown in FIG. 1, a substrate 30 is mounted on a housing 10 of an electronic device of related technology. Furthermore, the housing | casing 20 and the housing | casing 10 are joined by the adhesive agent, for example. The housing 10 and the housing 20 are, for example, a metal housing such as aluminum, a resin housing, or the like. The substrate 30 is a printed circuit board, for example. The board 30 is mounted with, for example, a processor, a memory, a power control IC (Integrated Circuit), a wireless communication module, and other electronic components, and controls the operation of the electronic device. The substrate 30 is fixed to the housing 10 or the like by screwing or the like, for example.

  As shown in FIG. 1, the board 30 is mounted with a female connector 55 for connecting to other electronic components and transmitting signals to the other electronic components. In the example shown in FIG. 1, when the female connector 55 and the male connector 56 are connected, an electronic component (such as a substrate) to which the male connector 56 is connected and the substrate 30 are electrically connected. That is, the female connector 55 and the male connector 56 function as connectors (substrate-to-board connector) for connecting the substrate and the substrate. In such an electronic device, in order to prevent the male connector 56 from being accidentally detached from the female connector 55, a rib 98 is provided on the housing 20 in the related art. The rib 98 is erected at a position where the female connector 55 and the male connector 56 are arranged when the housing 20 and the housing 10 are joined.

  As shown in FIG. 2, the male connector 56 is inserted into the female connector 55 in a state where the electronic device is assembled. Further, the male connector 56 is in contact with the rib 98 erected on the housing 20, and is sandwiched between the rib 98 and the female connector 55. Thereby, when compared with the case where the male connector 56 is inserted into the female connector 55 without receiving the reaction force from the housing 20, the reaction force from the housing 20 is applied to the rib 98 on the male connector 56. Therefore, the force for holding the male connector 56 by the female connector 55 and the rib 98 is improved. Therefore, it is difficult for the male connector 56 to be erroneously detached from the female connector 55. That is, even if a vibration or a drop impact is applied to the electronic device with the male connector 56 connected to the female connector 55, the connection between the male connector 56 and the female connector 55 is maintained.

  FIG. 3 is an exploded perspective view of an electronic device according to another related technology. 4 is a cross-sectional view taken along the line IV-IV ′ when the electronic apparatus of FIG. 3 is assembled.

  As shown in FIG. 3, a substrate 30 is mounted on a housing 10 of an electronic device according to another related technology. The board 30 has a female connector 55 mounted thereon, and the female connector 55 and the male connector 56 are connected to each other. In such an electronic device, in order to prevent the male connector 56 from being accidentally detached from the female connector 55, a cushion member 99 is attached to the housing 20 in another related technology. The cushion member 99 is affixed at a position where the male connector 56 connected to the female connector 55 is disposed when the housing 20 and the housing 10 are joined.

  As shown in FIG. 4, the male connector 56 is inserted into the female connector 55 in a state where the electronic device is assembled. The male connector 56 is in contact with the cushion member 99 attached to the housing 20, and is sandwiched between the cushion member 99 and the female connector 55. Thereby, when compared with the case where the male connector 56 is inserted into the female connector 55 without receiving the reaction force from the housing 20, the reaction force from the housing 20 is applied to the cushion member 99 with respect to the male connector 56. Therefore, the force for holding the male connector 56 by the female connector 55 and the cushion member 99 is improved. Therefore, it is difficult for the male connector 56 to be erroneously detached from the female connector 55. That is, even if a vibration or a drop impact is applied to the electronic device with the male connector 56 connected to the female connector 55, the connection between the male connector 56 and the female connector 55 is maintained.

  As described above, in the related technology, the electronic device is connected to the first electronic component (board 30) on which the female connector 55 for signal transmission is mounted, and the second electronic component is connected to the first electronic component by the female connector 55. In order to prevent accidental detachment of the second electronic component from the female connector 55, a rib 98, a cushion member 99, or the like is used.

<Embodiment 1>
Compared to the related art, in the electronic device 1 of the first embodiment, a viscous elastic material is used to prevent the second electronic component from being accidentally detached from the female connector 55. In the related art, the male connector 56 is sandwiched between the female connector 55 by the rib 98 standing on the housing 20 or the cushion member 99 affixed to the housing 20 and the female connector 55. The side connector 56 is prevented from being accidentally detached. In the first embodiment, instead of the rib 98 or the cushion member 99 in the related art, the silicone gel 63 is applied as a viscous elastic material to the housing 20 in order to prevent the male connector 56 from being accidentally detached. Yes.

  Accordingly, the silicon gel 63 for preventing the second electronic component from being accidentally detached from the female connector 55 is applied to the housing 20 in the same process as the process of applying the waterproof silicon gel 63 to the housing 20. Work can be done and the cost can be reduced. For example, when a control device such as an NC (numerical control) automatic machine reads and executes a program, a part of the manufacturing process of the electronic device 1 is performed. The NC automatic machine applies the silicon gel 63 to the housing of the electronic device 1 in order to prevent the second electronic component (male-side connector 56) from coming off from the female connector 55, and the area to be applied. The information including is read from the memory. This information includes a range in which the waterproof silicon gel 63 is applied to the electronic device 1 for waterproofing. The NC automatic machine applies the waterproof silicon gel 63 to the housing 20 in accordance with the information read from the memory (information including the application amount and the area to apply the silicon gel 63 to the housing 20).

  In the related art, when the shape of the male connector 56 is changed, it may be necessary to newly create a cushion member. However, in Embodiment 1, it is not necessary to create the cushion member itself. Assembling and manufacturing of the electronic device 1 can be simplified and the cost can be reduced.

  FIG. 5 is an exploded perspective view of electronic device 1 according to the first embodiment. FIG. 6 is a diagram schematically showing a state in which the housing 20 is joined to the housing 10 in the cross section taken along the line VII-VII ′ of FIG. 5. FIG. 7 is a cross-sectional view taken along line VII-VII ′ when the electronic apparatus 1 of FIG. 5 is assembled.

  In the electronic device 1 according to the first embodiment shown in FIG. 5, a viscous elastic material such as silicon gel 63 is applied to the housing 20 in order to prevent the second electronic component from being accidentally detached from the female connector 55. Has been. As shown in FIGS. 6 and 7, the silicon gel 63 is applied to a position where the female connector 55 and the male connector 56 are arranged when the housing 20 and the housing 10 are joined.

  As shown in FIG. 7, the male connector 56 is in contact with the silicon gel 63 applied to the housing 20 in a state where the electronic device 1 is assembled. Thereby, when compared with the case where the male connector 56 is inserted into the female connector 55 without receiving the reaction force from the housing 20, the reaction force from the housing 20 is applied to the silicon gel 63 against the male connector 56. Therefore, the male connector 56 is easily held by the female connector 55. Therefore, it is difficult for the male connector 56 to be erroneously detached from the female connector 55. That is, even if a shock of vibration or dropping is applied to the electronic device 1 with the male connector 56 connected to the female connector 55, the connection between the male connector 56 and the female connector 55 is maintained.

<Embodiment 2>
FIG. 8 is an exploded perspective view of the electronic device 2 according to the second embodiment. FIG. 9 is a cross-sectional view taken along line IX-IX ′ when the electronic apparatus 2 of FIG. 8 is assembled.

  In the second embodiment, the electronic device 2 includes a first electronic component (board 30) on which a signal transmission connector 50 is mounted, and a second electronic component (flexible) connected to the first electronic component by the connector 50. In order to prevent erroneous removal of the second electronic component from the connector 50, the silicon gel 60 is used as a viscous elastic material. FIG. 8 shows an example of a connector having a sandwiching plate that can be opened and closed (in FIG. 8, the sandwiching plate is open) as the connector 50. The connector 50 holds the flexible substrate 40 by sandwiching the flexible substrate 40 with a sandwiching plate. In the electronic device 1 of Embodiment 1 shown in FIG. 5, a viscous elastic material (silicon gel 63) is applied to the housing 20. On the other hand, in the electronic device 2 according to the second embodiment, the connector 50 is coated with a viscous elastic material (silicon gel 60).

  As shown in FIG. 8, the board 30 is mounted with a connector 50 for connecting to other electronic components and transmitting signals to the other electronic components. In the example shown in FIG. 8, the flexible substrate 40 and the substrate 30 are electrically connected by the connector 50.

  The electronic device 2 according to the second embodiment shown in FIG. 8 is an elastic material having a viscosity for preventing the flexible substrate 40 from being detached from the connector 50 on the outer surface of the connector 50 facing the housing 20 ( For example, silicon gel 60) is applied. Even when a vibration or a drop impact is applied to the electronic device, the connection between the flexible substrate 40 and the connector 50 needs to be maintained. When the connector 50 and the housing 20 are joined by the silicon gel 60, a reaction force from the housing 20 is applied to the connector 50, and the flexible substrate 40 and the connector 50 are affected by an impact on the electronic device. Connection is maintained.

  As shown in FIG. 9, the flexible substrate 40 is inserted into the connector 50 in a state where the electronic device 2 is assembled. A silicon gel 60 is disposed between the connector 50 and the wall surface of the housing 20 as an elastic material having viscosity. The connector 50 is sandwiched between the housing 20 and the substrate 30. As a result, a reaction force from the housing 20 is applied to the connector 50, so that the flexible substrate 40 is not easily detached from the connector 50. Compared to the related art, in the second embodiment, it is not necessary to prepare a dedicated cushion member such as the cushion member 99 when the electronic device 2 is assembled and manufactured. In the related art, when the shape of the connector 50 is changed, it may be necessary to newly create a cushion member. However, in the second embodiment, it is not necessary to create the cushion member itself. Assembling and manufacturing of the device 2 can be simplified and the cost can be reduced.

  Details of the connector 50 mounted on the board 30 will be described with reference to FIGS. 10 and 11. FIG. 10 is a view showing the appearance of the connector 50. FIG. 11 is a diagram illustrating a state in which the FPC / FFC 160 is fitted to the connector 50. As shown in FIGS. 10 and 11, the connector 50 includes, for example, an FPC / FFC connector 210 and a sandwiching plate 220. In the example of FIGS. 10 and 11, the case where the FPC / FFC 160 is inserted into the connector 50 is described. As shown in FIGS. 10 and 11, the FPC / FFC 160 is held by closing the sandwiching plate 220 with the FPC / FFC 160 being inserted into the FPC / FFC connector 210 disposed on the substrate 30. Can do. As shown in FIG. 11, the silicon gel 60 is applied to the upper surface of the sandwiched sandwiching plate 220, and the surface on which the silicone gel 60 is coated is pressed from the wall surface of the housing, thereby preventing the sandwiching plate 220 from opening. It is possible to prevent the FPC / FFC 160 from being accidentally detached from the FPC / FFC connector 210.

  When the electronic device 2 is manufactured, the silicon gel 60 is applied to electronic components such as the connector 50 of the electronic device 2 under the control of an NC automatic machine, for example. By changing the programming of the NC automatic machine, it is possible to change the application amount and the application area of the silicon gel 60, so that the silicon gel 60 is connected to the electronic from the connector 50 in accordance with various shapes of electronic components. It can be applied to electronic components to prevent accidental removal of the components. In the second embodiment, the silicon gel 60 is disposed on the outer surface of the connector 50 into which the flexible substrate 40 is inserted, thereby preventing the flexible substrate 40 from being accidentally detached from the connector 50. In addition, the silicon gel 60 may be disposed on an electronic component other than the connector 50 (for example, the flexible substrate 40), and the flexible substrate 40 may be sandwiched between some components (for example, the housing 20 and the substrate 30). Good. A reaction force from the component is applied to the flexible substrate 40, and the erroneous removal of the flexible substrate 40 from the connector 50 can be prevented.

  In the second embodiment, the electronic device 2 includes a first electronic component (board 30) on which a signal transmission connector 50 is mounted, and a second electronic device connected to the first electronic component by the connector 50. The example provided with components (flexible board 40) was explained. Not only this but the electronic device 2 mounts the female side connector 55 on the board | substrate 30, and connects the female side connector 55 and the male side connector 56 similarly to Embodiment 1, and the board | substrate 30 and the male side are connected. It is good also as a structure which electrically connects with the electronic components (board | substrate etc.) which the side connector 56 connects. In this case, in a state where the male connector 56 is connected to the female connector 55, the male connector 56 is mistakenly removed from the female connector 55 on the outer surface of the male connector 56 facing the housing 20. A silicon gel is applied to prevent it. A reaction force from the housing 20 is applied to the male connector 56, and the connection between the female connector 55 and the male connector 56 is maintained when an impact is applied to the electronic device 2.

<Embodiment 3>
With reference to FIG. 12, the electronic apparatus of Embodiment 3 is demonstrated.

  FIG. 12 is a diagram illustrating the inside of the housing of the electronic device according to the third embodiment. In FIG. 12, the housing 20 that covers the substrate 30 is not shown in order to show the inside of the housing of the electronic device.

  The electronic device of the third embodiment uses the silicon gel 60 as an elastic material having viscosity for preventing the flexible substrate 40 from being accidentally detached from the connector 50.

  That is, the NC automatic machine operates according to the program to read out information on the amount and area of application of the silicon gel 60 from the memory in order to prevent the flexible substrate 40 from being accidentally detached from the connector 50. In accordance with the information, the silicon gel 60 is applied to an electronic component such as the connector 50. Thereby, compared with the case where a dedicated cushion member is provided in order to prevent the electronic component from being accidentally detached from the connector 50, the manufacturing cost of the electronic device can be reduced.

  FIG. 13 is a flowchart showing a manufacturing process for manufacturing an electronic device. When a control device such as an NC automatic machine reads and executes the program, the processing shown in FIG. 13 is performed.

  In step S <b> 5, the NC automatic machine reads the application amount and application range for applying the elastic material (silicon gel) having viscosity in order to prevent the electronic component from being accidentally detached from the connector.

  In step S7, the NC automatic machine drives a mechanism for applying the silicon gel to the electronic device, and in accordance with the information read from the memory in step S5, the silicon gel is prevented from accidental removal of the electronic component from the connector. Is applied to at least one of a housing, a connector, and an electronic component connected to the connector.

  In addition, a process for manufacturing an electronic device such as applying a waterproof silicon gel 60 to a component such as the housing 10 is executed in accordance with the control of the NC automatic machine (step S9).

<Embodiment 4>
With reference to FIG. 14 and FIG. 15, the electronic device of Embodiment 4 is demonstrated.

  FIG. 14 is a view showing a configuration in which the coaxial connector 110 is fitted to the receptacle connector 71. FIG. 15 is a diagram illustrating an example in which the coaxial connector 110 is fitted to the receptacle connector 71 of the substrate 31. In the electronic device of the fourth embodiment, a coaxial connector 110 (plug connector) is fitted to the receptacle connector 71 in the substrate 31 having the coaxial cable 70 and the receptacle connector 71. Silicon gel 120 is applied to the outer surface of the coaxial connector 110 that faces the wall surface of the housing or the like. As a result, the coaxial connector 110 is pressed from the housing wall surface via the silicon gel 120, and the erroneous removal of the coaxial connector 110 from the receptacle connector 71 is prevented.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  1, 2 Electronic equipment 10, 20 Case, 30, 31 Substrate, 40 Flexible substrate, 50 Connector, 55 Female connector, 56 Male connector, 60, 63, 120, 230 Silicon gel, 70 Coaxial cable, 71 Receptacle Connector, 98 rib, 99 cushion member, 110 connector with coaxial, 210 FPC / FFC connector, 220 sandwiching plate.

Claims (5)

Electronic equipment,
An electronic device casing,
A first electronic component equipped with a signal transmission connector;
A second electronic component connected to the first electronic component by the connector;
An electronic apparatus, wherein an elastic material having viscosity for preventing erroneous removal of the second electronic component from the connector is provided in at least one of the housing, the connector, or the second electronic component.   The electronic device according to claim 1, wherein the elastic material having viscosity includes silicon gel. The second electronic component includes a flexible member,
The first electronic component includes a holding member that can be closed, and holds the second electronic component by sandwiching the flexible member inserted into the connector by closing the holding member. Configured,
The electronic device according to claim 1, wherein an elastic material having the viscosity is applied to the holding member in a state where the holding member holds the flexible member in between. The first electronic component includes a receptacle connector;
The second electronic component is a plug connector having a coaxial cable, and the plug connector is inserted into the receptacle connector of the first electronic component to be connected to the first electronic component,
The electronic device according to claim 1, wherein the plug connector is provided with an elastic material having the viscosity. A method of manufacturing an electronic device,
The electronic device includes a first electronic component on which a connector for signal transmission is mounted;
A second electronic component connected to the first electronic component by the connector;
The manufacturing method includes:
Information including an application amount and an area for applying silicon gel to the casing of the electronic device, the connector, or the second electronic component in order for the automatic machine to prevent the second electronic component from coming off from the connector Reading from the memory;
According to the information including the amount and area of application of the read silicon gel to the electronic device casing, the connector or the second electronic component, the waterproof silicon gel is applied to the electronic device casing. Applying the electronic device.

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