JP2016124771A

JP2016124771A - Firing jig for firing electronic component

Info

Publication number: JP2016124771A
Application number: JP2015001342A
Authority: JP
Inventors: 詩門石丸; Shimon Ishimaru
Original assignee: TYK Corp
Current assignee: TYK Corp
Priority date: 2015-01-07
Filing date: 2015-01-07
Publication date: 2016-07-11
Anticipated expiration: 2035-01-07
Also published as: JP6418952B2

Abstract

PROBLEM TO BE SOLVED: To provide a firing jig that enables uniform firing when an electronic component is fired.SOLUTION: A firing jig for firing an electronic component includes an annular frame member 11 and a tabular bottom plate 10 and cover plate 12 each abutting on the frame member, and an electronic component 3 is heat treated in a state arranged in a storage space 2 partitioned by an annular shaft center of the frame member 11. Alternatively, a firing jig 4 for firing an electronic component includes a bottom-closed annular tank-like member 40 having an opening part 402 at one axial edge and a closing member 41 closing the opening part 402 and the electronic component 3 is heat treated in a state arranged in a storage space 2 partitioned by the tank-like member 40 and the closing member 41. The surface roughness (Ra) of one of abutting surfaces on which each member abuts is 15 (μm) or less.SELECTED DRAWING: Figure 1

Description

本発明は、電子部品の焼成に用いられる電子部品焼成用焼成治具に関する。 The present invention relates to a firing jig for firing electronic components used for firing electronic components.

電子部品や半導体素子等のデバイスは、焼成プロセス（熱処理プロセス）を経て製造されている。これらのデバイスは、一般に、原料を調合・成形した後、加熱炉で高温にて焼成（熱処理）することにより、セラミックス焼成体とし、次いで、これに電極を形成する等の加工をした後、最終的に組み立てることにより製造される。 Devices such as electronic components and semiconductor elements are manufactured through a firing process (heat treatment process). In general, these devices are prepared by forming and forming raw materials, and then firing (heat treatment) at a high temperature in a heating furnace to form a ceramic fired body. Manufactured by assembly.

電子部品等のデバイスは、例えば、セラミックスコンデンサ、セラミックス圧電材料、マイクロ波誘電体、高周波用フィルタ、半導体コンデンサ、サーミスタ、セラミックスバリスタ、セラミックスセンサ等をあげることができ、その原料として、例えば、チタン酸バリウム、チタン酸ジルコン酸鉛、チタン酸ストロンチウム、酸化亜鉛、酸化ジルコニウム、希土類酸化物、あるいはこれらの複合物等のセラミックス材料をあげることができる。 Devices such as electronic components can include, for example, ceramic capacitors, ceramic piezoelectric materials, microwave dielectrics, high frequency filters, semiconductor capacitors, thermistors, ceramic varistors, ceramic sensors, etc. Examples thereof include ceramic materials such as barium, lead zirconate titanate, strontium titanate, zinc oxide, zirconium oxide, rare earth oxides, and composites thereof.

電子部品等のデバイスは、焼成治具を用いて焼成（熱処理）される。焼成治具としては、例えば、特許文献１〜５に記載されている。このとき、電子部品等のデバイスは、焼成治具の所定の位置（載置面上の所定の位置）に載置される。 Devices such as electronic components are fired (heat treated) using a firing jig. As a baking jig, it describes in patent documents 1-5, for example. At this time, a device such as an electronic component is placed at a predetermined position (a predetermined position on the placement surface) of the firing jig.

特許文献１には、複数枚の棚板と、この棚板間に被焼成体収容空間が形成されるように配置された支持部材と、を有する焼成治具が記載されている。この支持部材は、４角形枠体をなし、各中央部上部にガス抜口が設けられている。 Patent Document 1 describes a firing jig having a plurality of shelf boards and a support member arranged so that a body to be fired storage space is formed between the shelf boards. This support member has a quadrangular frame and is provided with a gas vent at the upper part of each central portion.

特許文献２には、平板状の第１部材及び第３部材と、その間に配される貫通孔を中央部に備えている第２部材と、第２部材の貫通孔の中に配される被熱処理物が載置される平板状の第４部材と、を含む熱処置治具が記載されている。そして、第２部材が通気性を持つ多孔質セラミックスで形成されている。
特許文献３には、側面あるいは底面に少なくとも１つのスルーホールを設けた電子部品焼成用さや（焼成治具）が記載されている。 In Patent Document 2, a flat plate-like first member and a third member, a second member having a through hole disposed between them in the center, and a cover disposed in the through hole of the second member. There is described a heat treatment jig including a flat plate-like fourth member on which a heat-treated product is placed. And the 2nd member is formed with the porous ceramics which have air permeability.
Patent Document 3 describes an electronic component firing sheath (firing jig) provided with at least one through hole on a side surface or a bottom surface.

特許文献４には、被焼成物が積み重ねられる床部分から被焼成物を取り囲んで立ち上がる壁部分が被焼成物との対向面に被焼成物に向かって突出するとともに、その積み重ね方向に走る、積み重ねのガイド用の突条を備え、外周壁はその外周面が上記床部分に向かうテーパ面となっており、外周壁はその上端部分および下端部分にそれぞれ積重ね固定用の嵌合部分を有しているセラミック焼成用匣（焼成治具）が記載されている。
特許文献５には、収納部を有する焼成用サヤと、蓋と、焼成用サヤと蓋との間に間隙を形成する間隙開閉手段と、よりなる焼成治具が記載されている。 In Patent Document 4, a wall portion that surrounds the material to be fired from a floor portion on which the material to be fired is stacked protrudes toward the material to be fired on the surface facing the material to be fired, and runs in the stacking direction. The outer peripheral wall has a tapered surface whose outer peripheral surface faces the floor portion, and the outer peripheral wall has a fitting portion for stacking and fixing at the upper end portion and the lower end portion, respectively. A ceramic firing rod (firing jig) is described.
Patent Document 5 describes a firing jig comprising a firing sheath having a storage portion, a lid, and a gap opening / closing means for forming a gap between the firing sheath and the lid.

特開２００５−７５７１０号公報JP 2005-75710 A 特開２０１４−７０００４号公報JP 2014-70004 A 特開平８−２１３２９１号公報JP-A-8-213291 特公平７−４８０３８号公報Japanese Examined Patent Publication No. 7-48038 特開平８−１８８４７２号公報JP-A-8-188472

従来の焼成治具は、収容空間に被焼成物を配置した状態で焼成炉（熱処理炉）の内部に配され、焼成が行われる。このとき、焼成治具の収容空間に焼成炉（熱処理炉）の炉内雰囲気が自由に流入・流出し、被焼成物が焼成される。 A conventional firing jig is disposed inside a firing furnace (heat treatment furnace) in a state where an object to be fired is disposed in a housing space, and firing is performed. At this time, the furnace atmosphere of the firing furnace (heat treatment furnace) freely flows into and out of the housing space of the firing jig, and the object to be fired is fired.

しかしながら、電子部品の焼成（熱処理）では、同時に多数の電子部品を収容空間に配して焼成（熱処理）が行われる。そうすると、収容空間の中心近傍と、周縁部近傍（側壁，外周壁等の通気経路の近傍）とでは、焼成条件が異なるようになり、均一な焼成ができないという問題があった。
本発明は上記実情に鑑みてなされたものであり、電子部品を焼成するときに均一な焼成が可能な焼成治具を提供することを課題とする。 However, in firing (heat treatment) of electronic components, firing (heat treatment) is performed by simultaneously arranging a large number of electronic components in the accommodation space. As a result, the firing conditions differ between the vicinity of the center of the housing space and the vicinity of the peripheral edge (near the ventilation path such as the side wall and the outer peripheral wall), and there is a problem that uniform firing cannot be performed.
This invention is made | formed in view of the said situation, and makes it a subject to provide the baking jig which can be uniformly baked when baking an electronic component.

上記課題を解決するために本発明者は焼成治具の構成について検討を重ねた結果、本発明を完成させた。 In order to solve the above-mentioned problems, the present inventor has studied the configuration of the firing jig, and as a result, has completed the present invention.

本発明の第１の電子部品焼成用焼成治具は、環状の枠部材と、枠部材の下方の端面と当接する板状の底板と、枠部材の上方の端面と当接する板状のフタ板と、を有し、枠部材の環状の軸心に区画される収容空間に電子部品が配された状態で熱処理される電子部品焼成用焼成治具であって、枠部材と底板が当接する１対の当接面，枠部材とフタ板が当接する１対の当接面のうち、少なくとも１つの当接面の表面粗さ（Ｒａ）が１５（μｍ）以下であることを特徴とする。 The first electronic component firing jig of the present invention includes an annular frame member, a plate-shaped bottom plate that contacts the lower end surface of the frame member, and a plate-shaped lid plate that contacts the upper end surface of the frame member And a firing jig for firing an electronic component that is heat-treated in a state in which the electronic component is disposed in a housing space defined by an annular axis of the frame member, wherein the frame member and the bottom plate are in contact with each other. Of the pair of contact surfaces and the pair of contact surfaces with which the frame member and the lid plate abut, the surface roughness (Ra) of at least one of the contact surfaces is 15 (μm) or less.

本発明の第２の電子部品焼成用焼成治具は、軸方向の１方の端部に開口部を有する有底環状の槽状部材と、槽状部材の開口部と当接し、開口部を閉塞する閉塞部材と、を有し、槽状部材と閉塞部材とに区画される収容空間に電子部品が配された状態で熱処理される電子部品焼成用焼成治具であって、槽状部材と閉塞部材が当接する１対の当接面のうち、１方の当接面の表面粗さ（Ｒａ）が１５（μｍ）以下であることを特徴とする。 A firing jig for firing a second electronic component according to the present invention has a bottomed annular tank-shaped member having an opening at one end in the axial direction, and an opening of the tank-shaped member. A firing jig for firing an electronic component that is heat-treated in a state in which the electronic component is disposed in a housing space partitioned by the tank-shaped member and the closing member. The surface roughness (Ra) of one abutting surface of the pair of abutting surfaces with which the closing member abuts is 15 (μm) or less.

本発明の第１の電子部品焼成用焼成治具及び第２の電子部品焼成用焼成治具は、２つ以上の部材（環状の枠部材，底板及びフタ板、又は槽状部材及び閉塞部材）により、電子部品が配される収容空間が区画される。そして、収容空間を区画する部材のうち、当接する部材の当接面のうち、少なくとも１つの当接面の表面粗さ（Ｒａ）が所定の範囲となることで、収容空間への通気性を制御することができ、均一な焼成が可能となる。 The first electronic component firing firing jig and the second electronic component firing firing jig of the present invention have two or more members (annular frame member, bottom plate and lid plate, or tank-shaped member and closing member). Thus, a housing space in which electronic components are arranged is defined. Of the members that divide the accommodation space, the surface roughness (Ra) of at least one of the abutting surfaces of the abutting members is within a predetermined range, thereby providing air permeability to the accommodation space. It can be controlled and uniform firing is possible.

なお、本発明において、電子部品とは、焼成プロセス（熱処理プロセス）を経て製造されたデバイスだけでなく、当該デバイスを製造するための原料を含む。すなわち、本発明の焼成治具は、デバイスの製造のための焼成プロセス（熱処理プロセス）に使用できる。
本発明において、上下方向とは各部材の積層方向での上下方向であり、貫通孔の伸びる方向であり、柱状の収容空間の軸方向である。 In the present invention, the electronic component includes not only a device manufactured through a firing process (heat treatment process) but also a raw material for manufacturing the device. That is, the firing jig of the present invention can be used in a firing process (heat treatment process) for manufacturing a device.
In the present invention, the vertical direction is the vertical direction in the stacking direction of the members, the direction in which the through holes extend, and the axial direction of the columnar accommodation space.

実施形態１の電子部品焼成用焼成治具の構成を示す組み立て図である。1 is an assembly diagram illustrating a configuration of a firing jig for firing an electronic component of Embodiment 1. FIG. 実施形態１の電子部品焼成用焼成治具の構成を示す部分分解図である。FIG. 3 is a partial exploded view illustrating a configuration of a firing jig for firing electronic components according to the first embodiment. 実施形態１の電子部品焼成用焼成治具の構成を示す断面図である。1 is a cross-sectional view illustrating a configuration of a firing jig for firing electronic components according to Embodiment 1. FIG. 実施形態１の変形形態１の電子部品焼成用焼成治具の構成を示す断面図である。It is sectional drawing which shows the structure of the baking jig for electronic component baking of the modification 1 of Embodiment 1. FIG. 実施形態１の変形形態２の電子部品焼成用焼成治具の構成を示す断面図である。It is sectional drawing which shows the structure of the baking jig for electronic component baking of the modification 2 of Embodiment 1. FIG. 実施形態１の変形形態３の電子部品焼成用焼成治具の構成を示す断面図である。It is sectional drawing which shows the structure of the baking jig for electronic component baking of the modification 3 of Embodiment 1. FIG. 実施形態２の電子部品焼成用焼成治具の構成を示す断面図である。It is sectional drawing which shows the structure of the baking jig for electronic component baking of Embodiment 2. FIG. 実施形態３の電子部品焼成用焼成治具の構成を示す組み立て図である。It is an assembly drawing which shows the structure of the baking jig for electronic component baking of Embodiment 3. FIG. 実施形態４の電子部品焼成用焼成治具の構成を示す組み立て図である。FIG. 6 is an assembly diagram illustrating a configuration of a firing jig for firing electronic components according to a fourth embodiment. 実施形態４の電子部品焼成用焼成治具の構成を示す断面図である。It is sectional drawing which shows the structure of the baking jig for electronic component baking of Embodiment 4. FIG. 実施形態４の変形形態１の電子部品焼成用焼成治具の構成を示す断面図である。FIG. 10 is a cross-sectional view illustrating a configuration of a firing jig for firing an electronic component according to Modification 1 of Embodiment 4. 実施形態４の変形形態２の電子部品焼成用焼成治具の構成を示す断面図である。FIG. 10 is a cross-sectional view illustrating a configuration of a firing jig for firing an electronic component according to a second modification of the fourth embodiment. 実施形態５の電子部品焼成用焼成治具の構成を示す断面図である。FIG. 10 is a cross-sectional view illustrating a configuration of a firing jig for firing electronic components according to a fifth embodiment.

以下、本発明の電子部品焼成用焼成治具（以下、焼成治具）を、図面を参照して説明する。 Hereinafter, a firing jig for firing an electronic component of the present invention (hereinafter, firing jig) will be described with reference to the drawings.

［実施形態１］
本形態の焼成治具１は、底板１０，枠部材１１，フタ板１２を有する。本形態の焼成治具１の構成を示す組み立て図を図１に示した。また、本形態の焼成治具１の構成を示す部分断面図を図２に示した。
本形態の焼成治具１は、上記した本発明の第１の電子部品焼成用焼成治具に相当する。 [Embodiment 1]
The firing jig 1 of this embodiment includes a bottom plate 10, a frame member 11, and a lid plate 12. An assembly diagram showing the configuration of the firing jig 1 of this embodiment is shown in FIG. Moreover, the fragmentary sectional view which shows the structure of the baking jig | tool 1 of this form was shown in FIG.
The firing jig 1 of this embodiment corresponds to the first firing jig for firing electronic parts of the present invention.

底板１０は、枠部材１１の下方の端面（下面１１ｂ）と当接する板状の部材である。より具体的には、上面１０ａ及び下面１０ｂが平面をなすように形成された、均一な厚さを持つ板状の部材である。底板１０は、その形状が限定されるものではなく、電子部品３を収容する収容空間２を区画することができる形状とする。好ましくは、枠部材１１の外形と同じ大きさである。
底板１０の厚さは限定されるものではない。 The bottom plate 10 is a plate-like member that comes into contact with the lower end surface (lower surface 11 b) of the frame member 11. More specifically, it is a plate-like member having a uniform thickness formed so that the upper surface 10a and the lower surface 10b are flat. The shape of the bottom plate 10 is not limited, and the bottom plate 10 has a shape that can partition the housing space 2 that houses the electronic component 3. Preferably, it is the same size as the outer shape of the frame member 11.
The thickness of the bottom plate 10 is not limited.

底板１０は、収容空間２の１部を区画し、その上面１０ａに電子部品３が載置される（電子部品３との当接面を有する）。電子部品３は、底板１０上に直接載置しても、セッターを配置してその上に載置しても、いずれでもよい。
底板１０は、その上面１０ａ上に枠部材１１（１枚の枠部材）が載置される。本形態では、枠部材１１が非固定の状態で載置される。 The bottom plate 10 divides a part of the accommodation space 2, and the electronic component 3 is placed on the upper surface 10 a (has a contact surface with the electronic component 3). The electronic component 3 may be placed directly on the bottom plate 10 or may be placed on a setter disposed thereon.
As for the baseplate 10, the frame member 11 (one frame member) is mounted on the upper surface 10a. In this embodiment, the frame member 11 is placed in an unfixed state.

底板１０は、その上面１０ａが平滑となるように形成される。上面１０ａの表面粗さ（Ｒａ）は、枠部材１１の下面１１ｂの表面粗さ（Ｒａ）よりも小さな値となっている。上面１０ａの好ましい表面粗さ（Ｒａ）は、枠部材１１の下面１１ｂの表面粗さ（Ｒａ）よりも０．８（μｍ）以上低い値である。 The bottom plate 10 is formed so that the upper surface 10a is smooth. The surface roughness (Ra) of the upper surface 10a is smaller than the surface roughness (Ra) of the lower surface 11b of the frame member 11. The preferable surface roughness (Ra) of the upper surface 10a is a value lower by 0.8 (μm) or more than the surface roughness (Ra) of the lower surface 11b of the frame member 11.

枠部材１１は、環状を有する部材である。枠部材１１は、軸心に区画される空間が、電子部品３を収容する収容空間２となる部材である。枠部材１１は、下面１１ｂが底板１０の上面１０ａに対応した形状（当接したときに視認可能な大きなすき間、すなわち、自由に雰囲気が通過可能なすき間が生じない略平面をなす形状）に形成されている。 The frame member 11 is an annular member. The frame member 11 is a member in which the space defined by the axial center becomes the accommodation space 2 in which the electronic component 3 is accommodated. The frame member 11 is formed in a shape in which the lower surface 11b corresponds to the upper surface 10a of the bottom plate 10 (a large gap that can be visually recognized when abutting, that is, a shape that forms a substantially flat surface that does not allow a free passage of atmosphere). Has been.

枠部材１１は、収容空間２となる空間を区画可能な形状であれば、その形状が限定されるものではない。本形態では、略板状の部材に貫通孔が形成された構成を有する。そして、形成された貫通孔が収容空間２となる空間を形成する。 The shape of the frame member 11 is not limited as long as the frame member 11 has a shape that can partition the space serving as the accommodation space 2. In this form, it has the structure by which the through-hole was formed in the substantially plate-shaped member. The formed through hole forms a space that becomes the accommodation space 2.

枠部材１１に形成された貫通孔は、その形状が限定されるものではない。本形態では、貫通孔は厚さ方向に垂直な断面における内周形状が、一定の形状をなすように形成されている。すなわち、収容空間２が、断面一定の柱状をなすように形成されている。 The shape of the through hole formed in the frame member 11 is not limited. In this embodiment, the through hole is formed so that the inner peripheral shape in a cross section perpendicular to the thickness direction has a constant shape. That is, the accommodation space 2 is formed to have a columnar shape with a constant cross section.

枠部材１１は、貫通孔の外周において全周にわたって１体に形成されている。すなわち、枠部材１１は、貫通孔の内部の雰囲気と、枠部材１１の外部の雰囲気とが、枠部材１１を通過（透過）して自由に連通しないように形成されている。自由な雰囲気の循環が規制されていることで、収容空間２の雰囲気の自由な入れ替わりに基づく不均一な焼成が抑えられる。すなわち、電子部品３の均一な焼成が可能となる。 The frame member 11 is formed as a single body over the entire circumference of the outer periphery of the through hole. That is, the frame member 11 is formed so that the atmosphere inside the through hole and the atmosphere outside the frame member 11 do not freely communicate with each other by passing (transmitting) the frame member 11. By restricting the circulation of the free atmosphere, uneven firing based on the free exchange of the atmosphere of the accommodation space 2 can be suppressed. That is, the electronic component 3 can be uniformly fired.

収容空間２の径方向での枠部材１１の長さ（枠部材１１のワクの太さ）は、限定されるものではない。収容空間２（の断面積）を大きく確保できることから、短いほど好ましい。径方向の長さが短くなることで、枠部材１１の熱容量の増加が抑えられ、収容空間２の温度の上昇を素早く行うことができる。 The length of the frame member 11 in the radial direction of the accommodation space 2 (the thickness of the frame member 11) is not limited. Since the accommodation space 2 (the cross-sectional area) can be ensured large, the shorter the better. By shortening the length in the radial direction, an increase in the heat capacity of the frame member 11 can be suppressed, and the temperature of the accommodation space 2 can be quickly increased.

枠部材１１を形成する略板状の部材は、その厚さは限定されるものではないが、電子部品３が収容空間２に収容されたときに、電子部品３の上方に空間（すき間）を形成できる厚さとする。すなわち、収容空間２に収容された電子部品３がフタ板１２と当接しない厚さとする。好ましくは、３ｍｍ以下である。
枠部材の好ましい厚さは、底板１０やフタ板１２と同じ厚さである。
枠部材１１を形成する略板状の部材は、上面１１ａ及び下面１１ｂが平面をなすように形成された、均一な厚さの部材である。 The thickness of the substantially plate-like member forming the frame member 11 is not limited, but when the electronic component 3 is accommodated in the accommodating space 2, a space (gap) is provided above the electronic component 3. Thickness that can be formed. That is, the thickness is set such that the electronic component 3 accommodated in the accommodation space 2 does not contact the lid plate 12. Preferably, it is 3 mm or less.
A preferable thickness of the frame member is the same thickness as the bottom plate 10 and the lid plate 12.
The substantially plate-like member forming the frame member 11 is a member having a uniform thickness formed so that the upper surface 11a and the lower surface 11b are flat.

枠部材１１は、底板１０の上面１０ａ上に載置される。また、枠部材１１の上面１１ａ上にフタ部材１２が載置される。ここで、枠部材１１は、底板１０と当接する下面１１ｂ、及びフタ板１２と当接する上面１１ａの表面粗さが、１５（μｍ）以下である。 The frame member 11 is placed on the upper surface 10 a of the bottom plate 10. In addition, the lid member 12 is placed on the upper surface 11 a of the frame member 11. Here, in the frame member 11, the surface roughness of the lower surface 11b in contact with the bottom plate 10 and the upper surface 11a in contact with the lid plate 12 is 15 (μm) or less.

枠部材１１の上面１１ａと下面１１ｂの表面粗さ（Ｒａ）の下限については、雰囲気の通過が許容される程度であれば限定されるものではない。表面粗さは、１（μｍ）以上であることが好ましい。２〜１０（μｍ）であることがより好ましい。
本形態では、フタ板１２は、枠部材１１の上面１１ａ上に非固定の状態で載置される。 The lower limit of the surface roughness (Ra) of the upper surface 11a and the lower surface 11b of the frame member 11 is not limited as long as it allows passage of the atmosphere. The surface roughness is preferably 1 (μm) or more. More preferably, it is 2 to 10 (μm).
In this embodiment, the lid plate 12 is placed on the upper surface 11a of the frame member 11 in an unfixed state.

フタ板１２は、枠部材１１の上方の端面（上面１１ａ）と当接する板状の部材である。より具体的には、上面１２ａ及び下面１２ｂが平面をなすように形成された、厚さが均一な板状の部材である。フタ板１２は、その形状が限定されるものではなく、電子部品３を収容する収容空間２を区画することができる形状とする。好ましくは、底板１０と同様に枠部材１１の外形と同じ大きさである。 The lid plate 12 is a plate-like member that comes into contact with the upper end surface (upper surface 11 a) of the frame member 11. More specifically, it is a plate-like member having a uniform thickness formed so that the upper surface 12a and the lower surface 12b are flat. The shape of the lid plate 12 is not limited, and the lid plate 12 has a shape that can partition the accommodation space 2 that accommodates the electronic component 3. Preferably, it is the same size as the outer shape of the frame member 11 like the bottom plate 10.

フタ板１２は、その下面１２ｂが平滑となるように形成される。下面１２ｂの表面粗さは、底板１０の上面１０ａの時と同様に、枠部材１１の上面１１ａの表面粗さよりも小さな値となっている。下面１２ｂの好ましい表面粗さ（Ｒａ）は、枠部材１１の上面１１ａの表面粗さ（Ｒａ）よりも０．８（μｍ）以上低い値である。 The lid plate 12 is formed so that the lower surface 12b is smooth. The surface roughness of the lower surface 12 b is smaller than the surface roughness of the upper surface 11 a of the frame member 11 as in the case of the upper surface 10 a of the bottom plate 10. The preferable surface roughness (Ra) of the lower surface 12b is a value lower by 0.8 (μm) or more than the surface roughness (Ra) of the upper surface 11a of the frame member 11.

枠部材１１は、上面１１ａがフタ板１２の下面１１ｂに対応した形状（当接したときに視認可能な大きなすき間、すなわち、自由に雰囲気が通過可能なすき間が生じない略平面をなす形状）に形成されている。
フタ板１２の厚さは限定されるものではない。フタ板１２の厚さは、底板１０と同じ厚さである。
フタ板１２は、収容空間２の１部を区画し、その下面１２ｂが収容空間２に面する。 The frame member 11 has a shape in which the upper surface 11a corresponds to the lower surface 11b of the cover plate 12 (a large gap that can be visually recognized when abutting, that is, a shape that forms a substantially flat surface that does not allow a free passage of atmosphere). Is formed.
The thickness of the lid plate 12 is not limited. The thickness of the lid plate 12 is the same as that of the bottom plate 10.
The lid plate 12 defines a part of the accommodation space 2, and the lower surface 12 b faces the accommodation space 2.

底板１０とフタ板１２のそれぞれは、異なる構成の板状の部材であっても、同じ構成の板状の部材であっても、いずれでもよい。同じ構成の板状の部材を使用することが好ましい。すなわち、底板１０となる板状の部材は、フタ板１２として使用できる。 Each of the bottom plate 10 and the lid plate 12 may be a plate-shaped member having a different configuration or a plate-shaped member having the same configuration. It is preferable to use plate-like members having the same configuration. That is, a plate-like member that becomes the bottom plate 10 can be used as the lid plate 12.

本形態の焼成治具１を形成する底板１０，枠部材１１及びフタ板１２のそれぞれは、その材質が限定されるものではない。従来の焼成治具に用いられている材質を用いることができる。底板１０，枠部材１１及びフタ板１２のそれぞれを形成可能な材質としては、ＺｒＯ_２，Ａｌ_２Ｏ_３，ＭｇＯより選択される１種以上を含有するセラミックスをあげることができる。好ましくは、これらの酸化物より選択される１種以上を主成分として（５０ｍａｓｓ％以上の割合で含む）セラミックスである。これらの酸化物は、焼成（熱処理）される電子部品３に対する反応性が低い（電子部品３を汚染しない）材質や、耐熱性（耐熱衝撃性）に優れた材質である。 The materials of the bottom plate 10, the frame member 11, and the lid plate 12 that form the firing jig 1 of this embodiment are not limited. The material used for the conventional baking jig can be used. Examples of the material capable of forming the bottom plate 10, the frame member 11, and the lid plate 12 include ceramics containing one or more selected from ZrO ₂ , Al ₂ O ₃ , and MgO. Preferred is ceramics containing one or more selected from these oxides as a main component (including 50 mass% or more). These oxides are materials having low reactivity to the electronic component 3 to be fired (heat treatment) (does not contaminate the electronic component 3) and materials having excellent heat resistance (thermal shock resistance).

また、本形態の焼成治具１を形成する底板１０，枠部材１１及びフタ板１２のそれぞれの材質は、同じであっても異なる材質であってもいずれでも良い。熱伝導率の観点から、底板１０，枠部材１１及びフタ板１２のそれぞれが同一の材質（同じ材質）よりなることがより好ましい。 Moreover, the material of the bottom plate 10, the frame member 11, and the lid plate 12 forming the firing jig 1 of this embodiment may be the same or different. From the viewpoint of thermal conductivity, it is more preferable that each of the bottom plate 10, the frame member 11, and the lid plate 12 is made of the same material (same material).

更に、本形態の焼成治具１を形成する底板１０，枠部材１１及びフタ板１２のそれぞれは、収容空間２の内部の雰囲気と、焼成治具１の外部の雰囲気とが、底板１０，枠部材１１及びフタ板１２のそれぞれを通過（透過）しないように、実質的に緻密体で形成されている。ここで、緻密体は、細孔が連続的につながっていない、すなわち、雰囲気の通過が生じない多孔質体を含む。 Further, each of the bottom plate 10, the frame member 11, and the lid plate 12 forming the firing jig 1 of the present embodiment has an atmosphere inside the housing space 2 and an atmosphere outside the firing jig 1, and the bottom plate 10, frame It is substantially formed of a dense body so as not to pass (transmit) each of the member 11 and the lid plate 12. Here, the dense body includes a porous body in which the pores are not continuously connected, that is, the passage of the atmosphere does not occur.

本形態の焼成治具１は、底板１０，枠部材１１，フタ板１２を、この順序で積層して形成される。本形態の焼成治具１は、枠部材１１の環状の軸心に区画される収容空間２に電子部品３が配された状態で熱処理が施される。 The firing jig 1 of this embodiment is formed by laminating a bottom plate 10, a frame member 11, and a lid plate 12 in this order. The firing jig 1 of this embodiment is subjected to heat treatment in a state in which the electronic component 3 is arranged in the accommodation space 2 defined by the annular axis of the frame member 11.

本形態の焼成治具１は、枠部材１１の底板１０と当接する下面１１ｂ、及びフタ板１２と当接する上面１１ａの表面粗さ（Ｒａ）がいずれも１５（μｍ）以下である。また、枠部材１１が当接する底板１０の上面１０ａ及びフタ板１２の下面１２ｂは、少なくとも枠部材１１が当接する部分（当接部）の表面粗さ（Ｒａ）がいずれも枠部材１１の両面１１ａ，１１ｂの表面粗さよりも小さい。すなわち、枠部材１１と底板１０の１対の当接面，枠部材１１とフタ板１２の１対の当接面のうち、１方の当接面の表面粗さ（Ｒａ）が所定の値となっている。また、１方の当接面以外の他の当接面（相手側の当接面）の表面粗さ（Ｒａ）は、１方の当接面の表面粗さ（Ｒａ）よりも小さい。枠部材１１の両面１１ａ，１１ｂは、所定の表面粗さを有することで、微少な凹凸を有している。この凹凸は、焼成治具１を形成したときに、表面粗さが小さい底板１０及びフタ板１２との間に微少なすき間を形成する。この微少なすき間は、焼成を行う焼成炉の炉内雰囲気の気体が収容空間２に対して通過することを許容する。しかし、微少なすき間であり、気体の自由な通過は規制される。すなわち、気体の流入・流出を、制御された状態で行うことができる。 In the firing jig 1 of the present embodiment, the surface roughness (Ra) of the lower surface 11b that contacts the bottom plate 10 of the frame member 11 and the upper surface 11a that contacts the lid plate 12 is 15 (μm) or less. Further, the upper surface 10a of the bottom plate 10 with which the frame member 11 abuts and the lower surface 12b of the lid plate 12 have at least the surface roughness (Ra) of the portion (abutting portion) with which the frame member 11 abuts on both sides of the frame member 11. It is smaller than the surface roughness of 11a and 11b. That is, the surface roughness (Ra) of one of the contact surfaces of the frame member 11 and the bottom plate 10 and the pair of contact surfaces of the frame member 11 and the cover plate 12 is a predetermined value. It has become. Further, the surface roughness (Ra) of the other contact surface (other contact surface) other than the one contact surface is smaller than the surface roughness (Ra) of the one contact surface. Both surfaces 11a and 11b of the frame member 11 have minute irregularities by having a predetermined surface roughness. When the firing jig 1 is formed, the unevenness forms a minute gap between the bottom plate 10 and the lid plate 12 having a small surface roughness. This minute gap allows the gas in the furnace atmosphere of the firing furnace that performs firing to pass through the accommodation space 2. However, it is a minute gap, and free passage of gas is restricted. That is, inflow / outflow of gas can be performed in a controlled state.

なお、枠部材１１の両面１１ａ，１１ｂの表面粗さが１５（μｍ）以下となることで、雰囲気の流入・流出を、制御された状態で行うことができる。表面粗さが１５（μｍ）以下未満となると、雰囲気の通過が不十分となり、収容空間２の温度の上昇が、焼成治具１の伝熱のみからとなり、焼成により高いエネルギーが必要となり、コストの多大な上昇を招く。また、焼成時に電子部品３からガスが発生したときに、発生したガスが排出されなくなり、収容空間２にとどまり、電子部品３を汚染する。表面粗さが１５（μｍ）を超えて大きくなると、雰囲気が自由に通過することとなり、焼成治具１の収容空間２内で雰囲気のムラが生じ、電子部品の均一な焼成ができなくなる。 In addition, since the surface roughness of both surfaces 11a and 11b of the frame member 11 is 15 (μm) or less, the inflow and outflow of the atmosphere can be performed in a controlled state. When the surface roughness is less than 15 (μm) or less, the passage of the atmosphere becomes insufficient, the temperature rise in the accommodation space 2 is only due to the heat transfer of the firing jig 1, and high energy is required for firing, resulting in cost Incurs a tremendous rise. Further, when gas is generated from the electronic component 3 during firing, the generated gas is not discharged and stays in the accommodation space 2 to contaminate the electronic component 3. When the surface roughness exceeds 15 (μm), the atmosphere passes freely, and the atmosphere is uneven in the accommodation space 2 of the firing jig 1, so that the electronic components cannot be uniformly fired.

また、枠部材１１が当接する底板１０の上面１０ａ及びフタ板１２の下面１２ｂは、表面粗さ（Ｒａ）がいずれも枠部材１１の両面１１ａ，１１ｂの表面粗さよりも小さいことで、焼成治具１を形成したときに、枠部材１１の底板１０との界面、フタ板１２との界面のいずれにおいても、微少なすき間が形成され、雰囲気が通過可能となる。 Further, the upper surface 10a of the bottom plate 10 and the lower surface 12b of the lid plate 12 with which the frame member 11 abuts are both less in surface roughness (Ra) than the surface roughness of the both surfaces 11a and 11b of the frame member 11, so that the firing treatment is performed. When the tool 1 is formed, a minute gap is formed at either the interface with the bottom plate 10 of the frame member 11 or the interface with the lid plate 12, and the atmosphere can pass therethrough.

本形態の枠部材１１の厚さ（上下方向の長さ）は、収容空間２に電子部品３が配された状態で、電子部品３の上面と、枠部材１１の上端面（フタ板１２の下面１２ｂ）と、の距離（すき間の距離）が０．１〜１．０ｍｍであることが好ましい。すき間の距離がこの範囲内となることで、より均一な焼成を行うことができる。なお、このすき間の距離が０．１ｍｍ未満となると、すき間が減少して電子部品３に均一に雰囲気が接触しなくなり、電子部品３に温度ムラが生じることとなり、均一な焼成（熱処理）が困難となる。また、すき間の距離が１．０ｍｍを超えて大きくなると、収容空間２の内部の雰囲気自体に温度ムラが生じやすくなる。 The thickness (length in the vertical direction) of the frame member 11 of this embodiment is such that the electronic component 3 is arranged in the housing space 2 and the upper surface of the electronic component 3 and the upper end surface of the frame member 11 (of the lid plate 12). The distance from the lower surface 12b) (the distance between the gaps) is preferably 0.1 to 1.0 mm. When the gap distance is within this range, more uniform firing can be performed. If the gap distance is less than 0.1 mm, the gap is reduced and the electronic component 3 is not uniformly in contact with the atmosphere, resulting in temperature unevenness in the electronic component 3 and uniform firing (heat treatment) is difficult. It becomes. Further, if the gap distance exceeds 1.0 mm, temperature unevenness tends to occur in the atmosphere inside the accommodation space 2 itself.

本形態の焼成治具１の収容空間２は、断面一定の柱状をなすように形成されている。この柱状の軸方向の長さ（枠部材の上下方向の長さに相当）と、断面の断面積（上下方向に垂直な断面における断面形状の面積に相当）と、の比が１：３００００以下である。ここで、長さと断面積の比は、単位をそろえた値で比較する。具体的には、長さの単位がｍｍの場合に、断面積はｍｍ^２での値を用いる。 The accommodation space 2 of the firing jig 1 of this embodiment is formed so as to form a columnar shape with a constant cross section. The ratio of the length in the axial direction of the column (corresponding to the length in the vertical direction of the frame member) and the cross-sectional area of the cross section (corresponding to the area of the cross-sectional shape in the cross section perpendicular to the vertical direction) is 1: 30000 or less It is. Here, the ratio of the length and the cross-sectional area is compared with a value obtained by aligning the units. Specifically, when the unit of length is mm, the cross-sectional area is a value in mm ² .

比が１：３００００以下となることで、均一な焼成（熱処理）が可能となる。比が１：３００００より大きくなると、収容空間２に対して雰囲気が多くなりすぎ、収容空間２内の部分的な温度ムラが生じやすくなる。 Uniform firing (heat treatment) is possible when the ratio is 1: 30000 or less. When the ratio is greater than 1: 30000, the atmosphere is excessive with respect to the accommodation space 2, and partial temperature unevenness in the accommodation space 2 is likely to occur.

（熱処理）
本形態の焼成治具１は、図３に断面図で示したように、収容空間２に電子部品３を収容した状態で、熱処理炉の炉内に配置して熱処理を行うことができる。 (Heat treatment)
As shown in the sectional view of FIG. 3, the firing jig 1 of this embodiment can be heat-treated by being placed in a furnace of a heat treatment furnace in a state where the electronic component 3 is housed in the housing space 2.

本形態の焼成治具１は、枠部材１１の表面１１ａ，１１ｂに微少な凹凸が形成されている。この凹凸が、底板１０，フタ板１２との間に微少なすき間を形成する。この微少なすき間は、焼成を行う焼成炉の炉内雰囲気の気体が収容空間２に対して通過することを許容する。しかし、微少なすき間であり、気体の自由な通過は規制される。すなわち、気体の流入・流出を、制御された状態で行うことができる。この結果、焼成治具１の収容空間２内で雰囲気のムラが生じなくなり、電子部品の均一な焼成ができる。
また、本形態の焼成治具１は、収容空間２の全容積に占める電子部品３の容積比が所定の範囲内となることで、均一な焼成（熱処理）が可能となっている。 In the firing jig 1 of this embodiment, minute irregularities are formed on the surfaces 11 a and 11 b of the frame member 11. This unevenness forms a minute gap between the bottom plate 10 and the lid plate 12. This minute gap allows the gas in the furnace atmosphere of the firing furnace that performs firing to pass through the accommodation space 2. However, it is a minute gap, and free passage of gas is restricted. That is, inflow / outflow of gas can be performed in a controlled state. As a result, the unevenness of the atmosphere does not occur in the housing space 2 of the firing jig 1, and the electronic component can be fired uniformly.
Further, the firing jig 1 of the present embodiment can perform uniform firing (heat treatment) when the volume ratio of the electronic component 3 occupying the entire volume of the accommodation space 2 is within a predetermined range.

また、収容空間２の軸方向の長さ（枠部材１１の厚さ）と、断面の断面積（枠部材１１の開口形状）と、の比が所定の範囲内となることで、均一な焼成（熱処理）が可能となっている。
上記のように、本形態の焼成治具１は、電子部品３を均一に焼成することができる。 Further, the ratio of the axial length of the accommodating space 2 (thickness of the frame member 11) and the cross-sectional area of the cross section (opening shape of the frame member 11) is within a predetermined range, so that uniform firing is performed. (Heat treatment) is possible.
As described above, the firing jig 1 of this embodiment can fire the electronic component 3 uniformly.

（製造方法）
本形態の焼成治具１は、その製造方法が限定されるものではない。例えば、底板１０及びフタ板１２については、通常のセラミックス板と同様に粉末の成形体を焼結して製造できる。枠部材１１については、所定の形状に成形した成形体を焼結し、当接面となる表面１１ａ，１１ｂに粗面化処理を施して製造できる。粗面化処理を施すことで、当接面となる表面１１ａ，１１ｂの表面粗さを所定の値とすることができる。 (Production method)
The method for manufacturing the firing jig 1 of this embodiment is not limited. For example, the bottom plate 10 and the lid plate 12 can be manufactured by sintering a powder compact in the same manner as a normal ceramic plate. The frame member 11 can be manufactured by sintering a molded body molded into a predetermined shape and subjecting the surfaces 11a and 11b serving as contact surfaces to a roughening treatment. By performing the roughening treatment, the surface roughness of the surfaces 11a and 11b serving as the contact surfaces can be set to a predetermined value.

なお、底板１０とフタ板１２、及び枠部材１１は、焼成体の反りや歪みを解消するために、焼結（熱処理）後に研磨等の処理を施して表面を平面化することができる。 The bottom plate 10, the lid plate 12, and the frame member 11 can be flattened by performing treatment such as polishing after sintering (heat treatment) in order to eliminate warping and distortion of the fired body.

［実施形態１の変形形態１］
本形態は、枠部材１１の１方の表面（上面１１ａ）のみに微少な凹凸が形成され、他方の表面（下面１１ｂ）は平面をなしていること以外は、実施形態１と同様な焼成治具である。
本形態の焼成治具１は、図４に示したように、底板１０，枠部材１１，フタ板１２を、この順序で積層して形成される。 [Variation 1 of Embodiment 1]
This embodiment is the same as in the first embodiment except that minute irregularities are formed only on one surface (upper surface 11a) of the frame member 11, and the other surface (lower surface 11b) is flat. It is a tool.
As shown in FIG. 4, the firing jig 1 of this embodiment is formed by laminating a bottom plate 10, a frame member 11, and a lid plate 12 in this order.

本形態の焼成治具１は、枠部材１１の底板１０と当接する下面１１ｂの表面粗さ（Ｒａ）が、底板１０の上面１０ａと同等の値となっている。すなわち、微少な凹凸のない略平面をなしている。枠部材１１のフタ板１２と当接する上面１１ａの表面粗さ（Ｒａ）が１５（μｍ）以下となっており、上面１１ａには微少な凹凸が形成されている。 In the firing jig 1 of this embodiment, the surface roughness (Ra) of the lower surface 11b that contacts the bottom plate 10 of the frame member 11 is a value equivalent to that of the upper surface 10a of the bottom plate 10. That is, it has a substantially flat surface with no minute unevenness. The surface roughness (Ra) of the upper surface 11a contacting the lid plate 12 of the frame member 11 is 15 (μm) or less, and minute irregularities are formed on the upper surface 11a.

本形態の焼成治具１は、枠部材１１の上面１１ａとフタ板１２との界面を、制御された状態で気体が通過する。枠部材１１の下面１１ｂと底板１０との界面においては、互いに平面をなしており、ほとんど気体が通過しない。つまり、実施形態１の焼成治具１と同様に、気体の流入・流出を、制御された状態で行うことができる。更に、本形態では、気体の通過をより制御できる。この結果、実施形態１と同様の効果を発揮できる。 In the firing jig 1 of this embodiment, gas passes through the interface between the upper surface 11a of the frame member 11 and the lid plate 12 in a controlled state. At the interface between the lower surface 11b of the frame member 11 and the bottom plate 10, they are flat with each other and almost no gas passes through them. That is, similarly to the firing jig 1 of the first embodiment, the inflow / outflow of gas can be performed in a controlled state. Furthermore, in this embodiment, the passage of gas can be controlled more. As a result, the same effect as in the first embodiment can be exhibited.

なお、本形態の焼成治具１は、枠部材１１の上面１１ａのみに微少な凹凸が形成されているが、下面１１ｂのみにこの微少な凹凸を形成していても、同様の効果を発揮できる。 The firing jig 1 of the present embodiment has minute irregularities formed only on the upper surface 11a of the frame member 11, but the same effect can be exhibited even if these minute irregularities are formed only on the lower surface 11b. .

加えて、枠部材１１の上面１１ａ，下面１１ｂの１部のみにこの微少な凹凸を形成していても、同様の効果を発揮できる。ここで、枠部材１１の表面１１ａ，１１ｂの１部のみにこの微少な凹凸を形成する場合、収容空間２と外部とを連通可能となるように枠部材１１を径方向で貫通した状態で微少な凹凸を形成する。 In addition, even if the minute irregularities are formed on only one part of the upper surface 11a and the lower surface 11b of the frame member 11, the same effect can be exhibited. Here, when this minute unevenness is formed on only one part of the surface 11a, 11b of the frame member 11, the frame member 11 is slightly penetrated in the radial direction so as to be able to communicate with the outside. Irregularities are formed.

［実施形態１の変形形態２］
本形態は、枠部材１１の厚さが異なること以外は、実施形態１と同様な焼成治具である。
本形態の焼成治具１は、図５に示したように、底板１０，枠部材１１，フタ板１２を、この順序で積層して形成される。 [Modification 2 of Embodiment 1]
The present embodiment is a firing jig similar to that of the first embodiment except that the thickness of the frame member 11 is different.
As shown in FIG. 5, the firing jig 1 of this embodiment is formed by laminating a bottom plate 10, a frame member 11, and a lid plate 12 in this order.

本形態の焼成治具１は、枠部材１１の厚さが異なる（底板１０及びフタ板１２よりも薄い）こと以外は、実施形態１の焼成治具１と同様な構成であり、同様の効果を発揮できる。 The firing jig 1 of this embodiment has the same configuration as that of the firing jig 1 of Embodiment 1 except that the thickness of the frame member 11 is different (thinner than that of the bottom plate 10 and the lid plate 12). Can be demonstrated.

本形態の焼成治具１は、枠部材１１の厚さが薄く形成されたことで、収容空間２の高さを低くすることができる。つまり、電子部品３の高さが低くなっている場合に、電子部品３の上に形成されるすき間の長さを調整できる。 The firing jig 1 of this embodiment can reduce the height of the accommodation space 2 by forming the frame member 11 to be thin. That is, when the height of the electronic component 3 is low, the length of the gap formed on the electronic component 3 can be adjusted.

また、本形態の焼成治具１は、底板１０及びフタ板１２は実施形態１と同じものを使用でき、枠部材１１のみを交換することで、収容空間２の高さを低くすることができる。つまり、容積比の調整を簡単に行うことができる。 Moreover, the baking jig 1 of this form can use the same thing as Embodiment 1 for the baseplate 10 and the cover board 12, and the height of the accommodation space 2 can be made low by replacing | exchanging only the frame member 11. FIG. . That is, the volume ratio can be easily adjusted.

［実施形態１の変形形態３］
本形態は、枠部材１１を２枚（複数）重ねたこと以外は、実施形態１と同様な焼成治具である。
本形態の焼成治具１は、図６に示したように、底板１０，枠部材１１，枠部材１１，フタ板１２を、この順序で積層して形成される。
本形態の焼成治具１は、枠部材１１を重ねたこと以外は、実施形態１の焼成治具１と同様な構成であり、同様の効果を発揮できる。 [Modification 3 of Embodiment 1]
The present embodiment is a firing jig similar to that of the first embodiment except that two (a plurality of) frame members 11 are stacked.
As shown in FIG. 6, the firing jig 1 of this embodiment is formed by laminating a bottom plate 10, a frame member 11, a frame member 11, and a lid plate 12 in this order.
The firing jig 1 of this embodiment has the same configuration as the firing jig 1 of Embodiment 1 except that the frame member 11 is stacked, and can exhibit the same effects.

本形態の焼成治具１は、積層した２枚の枠部材１１，１１の間においても、表面粗さに起因する微少なすき間が形成されている。このため、この２枚の枠部材１１，１１の間においても、雰囲気の制御された通過が許容される。 In the firing jig 1 of this embodiment, a minute gap due to the surface roughness is also formed between the two laminated frame members 11 and 11. For this reason, the controlled passage of the atmosphere is allowed between the two frame members 11.

なお、本形態では、積層した２枚の枠部材１１，１１の間の当接面においても、実施形態１に上記した表面粗さを有しているが、この界面は平面をなしていてもよい。 In this embodiment, the contact surface between the two laminated frame members 11 and 11 also has the surface roughness described in the first embodiment, but this interface may be a flat surface. Good.

更に、本形態の焼成治具１は、２枚以上の枠部材１１を重ねたことで、収容空間２の高さを高くすることを簡単にできる。つまり、電子部品３の高さが高くなっている場合に、積層枚数を増やすことで、簡単に枚数の調整を行うことができる。 Furthermore, the firing jig 1 of this embodiment can easily increase the height of the accommodation space 2 by stacking two or more frame members 11. That is, when the height of the electronic component 3 is high, the number can be easily adjusted by increasing the number of stacked layers.

［実施形態２］
本形態は、図７に断面図で示したように、上記した実施形態１の焼成治具１を複数段（図７では４段）で積層した形態である。 [Embodiment 2]
In this embodiment, as shown in the sectional view of FIG. 7, the firing jig 1 of the first embodiment described above is laminated in a plurality of stages (four stages in FIG. 7).

本形態の焼成治具１は、図７に示したように、板状部材１３，枠部材１１，板状部材１３，枠部材１１，・・・と、板状部材１３と枠部材１１とを交互に積層して形成される。
枠部材１１は、実施形態１の枠部材１１である。 As shown in FIG. 7, the firing jig 1 of this embodiment includes a plate-like member 13, a frame member 11, a plate-like member 13, a frame member 11,..., A plate-like member 13 and a frame member 11. It is formed by alternately laminating.
The frame member 11 is the frame member 11 of the first embodiment.

板状部材１３は、実施形態１の底板１０（フタ板１２）である。すなわち、本形態の焼成治具１では、積層方向で隣接する２つの収容空間２，２が、板状部材１３により区画されている。すなわち、この板状部材１３は、実施形態１の底板１０とフタ板１２が１体に形成されたものと同様に機能する。
本形態の焼成治具１は、実施形態１の焼成治具１を積層して形成したものであり、実施形態１と同様の効果を発揮できる。 The plate member 13 is the bottom plate 10 (lid plate 12) of the first embodiment. That is, in the firing jig 1 of this embodiment, the two accommodation spaces 2 and 2 adjacent in the stacking direction are partitioned by the plate-like member 13. That is, this plate-like member 13 functions in the same manner as the one in which the bottom plate 10 and the lid plate 12 of the first embodiment are formed as one body.
The firing jig 1 of this embodiment is formed by laminating the firing jig 1 of Embodiment 1, and can exhibit the same effects as those of Embodiment 1.

更に、本形態の焼成治具１は、実施形態１の焼成治具１を積層して形成したものであり、積層数に応じて多数の電子部品３を焼成（熱処理）できる。すなわち、多数の電子部品３を同時に焼成（熱処理）できる。 Furthermore, the firing jig 1 of this embodiment is formed by laminating the firing jig 1 of Embodiment 1, and can fire (heat treat) a large number of electronic components 3 according to the number of layers. That is, a large number of electronic components 3 can be fired (heat treated) simultaneously.

また、本形態の焼成治具１では、積層方向で隣接する２つの収容空間２，２が、それに挟まれた板状部材１３で区画されている。この板状部材１３は、実施形態１の底板１０とフタ板１２に相当する部材であり、１体に形成されたことで、底板１０とフタ板１２とを積層した構成と比べて薄くすることができ、熱処理炉内に多数の焼成治具１を配置することができる。つまり、より多くの電子部品３を同時に焼成（熱処理）できる。 Further, in the firing jig 1 of this embodiment, the two accommodation spaces 2 and 2 adjacent in the stacking direction are partitioned by the plate-like member 13 sandwiched therebetween. This plate-like member 13 is a member corresponding to the bottom plate 10 and the lid plate 12 of the first embodiment, and is formed as a single body, so that it is thinner than the configuration in which the bottom plate 10 and the lid plate 12 are laminated. A large number of firing jigs 1 can be arranged in the heat treatment furnace. That is, more electronic components 3 can be fired (heat treated) simultaneously.

［実施形態３］
本形態は、枠部材１１の厚さが異なること以外は、実施形態１と同様な焼成治具である。
本形態の焼成治具１は、図８に示したように、底板１０，枠部材１１，フタ板１２を、この順序で積層して形成される。 [Embodiment 3]
The present embodiment is a firing jig similar to that of the first embodiment except that the thickness of the frame member 11 is different.
As shown in FIG. 8, the firing jig 1 of this embodiment is formed by laminating a bottom plate 10, a frame member 11, and a lid plate 12 in this order.

本形態の焼成治具１は、枠部材１１の厚さが異なる（底板１０及びフタ板１２よりもはるかに厚く、実質的に筒状を有している）こと以外は、実施形態１の焼成治具１と同様な構成であり、同様の効果を発揮できる。 The firing jig 1 of the present embodiment is the firing of the first embodiment except that the thickness of the frame member 11 is different (much thicker than the bottom plate 10 and the lid plate 12 and has a substantially cylindrical shape). The configuration is the same as that of the jig 1, and the same effect can be exhibited.

本形態の焼成治具１は、枠部材１１の厚さをはるかに厚く形成したことで、収容空間２の高さを高くすることができる。つまり、電子部品３の高さが高くなっている場合に、電子部品３の上に形成されるすき間の長さを調整できる。このとき、電子部品３は、図６に示したように、複数層に積層されたセッター上に多数を配することができる。 The firing jig 1 of this embodiment can increase the height of the accommodation space 2 by forming the frame member 11 to be much thicker. That is, when the height of the electronic component 3 is high, the length of the gap formed on the electronic component 3 can be adjusted. At this time, as shown in FIG. 6, a large number of electronic components 3 can be arranged on setters stacked in a plurality of layers.

［実施形態４］
本形態の焼成治具４は、槽状部材４０，閉塞部材４１を有する。本形態の焼成治具４の構成を示す組み立て図を図９に示した。また、本形態の焼成治具４の構成を示す断面図を図１０に示した。
本形態の焼成治具４は、上記した本発明の第２の電子部品焼成用焼成治具に相当する。 [Embodiment 4]
The firing jig 4 of this embodiment has a tank-like member 40 and a closing member 41. An assembly diagram showing the configuration of the firing jig 4 of this embodiment is shown in FIG. A cross-sectional view showing the configuration of the firing jig 4 of this embodiment is shown in FIG.
The firing jig 4 of this embodiment corresponds to the above-described second firing jig for firing electronic components of the present invention.

槽状部材４０は、電子部品３を収容する収容空間２の１部を区画する。槽状部材４０は、軸方向の１方の端部に開口部を有する有底環状の部材である。槽状部材４０は、有底環状の底面を形成する底部４００と、底部４００の周縁部から立設した立壁部４０１と、を有する。
底部４００は、その形状が限定されるものではなく、電子部品３を収容する収容空間２を区画することができる形状とする。
立壁部４０１は、底部４００の上面４００ａの外周から立設する。立壁部４０１は、底部４００の外周形状と一致する筒状を有する。 The tank-shaped member 40 defines a part of the housing space 2 that houses the electronic component 3. The tank-shaped member 40 is a bottomed annular member having an opening at one end in the axial direction. The tank-shaped member 40 includes a bottom portion 400 that forms a bottomed annular bottom surface, and a standing wall portion 401 that stands from the peripheral edge of the bottom portion 400.
The shape of the bottom portion 400 is not limited, and the bottom portion 400 has a shape that can partition the housing space 2 that houses the electronic component 3.
The standing wall 401 is erected from the outer periphery of the upper surface 400 a of the bottom 400. The standing wall portion 401 has a cylindrical shape that matches the outer peripheral shape of the bottom portion 400.

槽状部材４０は、立壁部４０１の先端面４０１ａ上に閉塞部材４１が載置され、筒状の端部４０２の端面４０１ａが閉塞部材４１と全周にわたって当接する。ここで、槽状部材４０の閉塞部材４１と当接する先端面４０１ａの表面粗さは、１５（μｍ）以下である。 In the tank-shaped member 40, the closing member 41 is placed on the front end surface 401 a of the standing wall portion 401, and the end surface 401 a of the cylindrical end portion 402 contacts the closing member 41 over the entire circumference. Here, the surface roughness of the front end surface 401 a that contacts the closing member 41 of the tank-shaped member 40 is 15 (μm) or less.

槽状部材４０の底部４００と立壁部４０１の厚さはいずれも限定されるものではない。底部４００と立壁部４０１の厚さは同じであっても、異なっていても、いずれでも良い。 The thickness of the bottom part 400 and the standing wall part 401 of the tank-shaped member 40 is not limited. The thickness of the bottom part 400 and the standing wall part 401 may be the same or different.

閉塞部材４１は、槽状部材４０の開口部４０２と当接し、開口部４０２を閉塞する。閉塞部材４１は、槽状部材４０の開口部４０２を形成する先端面４０１ａと当接する板状の部材である。より具体的には、上面４１ａ及び下面４１ｂが平面をなすように形成された、厚さが均一な板状の部材である。閉塞部材４１は、その形状が限定されるものではなく、電子部品３を収容する収容空間２を区画することができる形状とする。好ましくは、槽状部材４０の底部４００と同様な形状である。 The closing member 41 abuts on the opening 402 of the tank-like member 40 and closes the opening 402. The closing member 41 is a plate-like member that comes into contact with the distal end surface 401 a that forms the opening 402 of the tank-like member 40. More specifically, it is a plate-like member having a uniform thickness formed so that the upper surface 41a and the lower surface 41b are flat. The shape of the closing member 41 is not limited, and the closing member 41 has a shape that can partition the housing space 2 that houses the electronic component 3. Preferably, the shape is the same as that of the bottom 400 of the tank-like member 40.

閉塞部材４１は、は、その下面４１ｂが平滑となるように形成される。下面４１ｂの表面粗さは、当接する槽状部材４０の先端面４０１ａの表面粗さよりも小さな値となっている。
閉塞部材４１の厚さは限定されるものではない。閉塞部材４１の厚さは、底部４００と同じ厚さである。
閉塞部材４１は、収容空間２の１部を区画し、その下面４１ｂが収容空間２に面する。 The closing member 41 is formed such that its lower surface 41b is smooth. The surface roughness of the lower surface 41b is a value smaller than the surface roughness of the front end surface 401a of the tank-like member 40 that abuts.
The thickness of the closing member 41 is not limited. The thickness of the closing member 41 is the same as that of the bottom portion 400.
The closing member 41 defines a part of the accommodation space 2, and the lower surface 41 b faces the accommodation space 2.

槽状部材４０と閉塞部材４１のそれぞれは、異なる構成の板状の部材であっても、同じ構成の板状の部材であっても、いずれでもよい。同じ構成の板状の部材を使用することが好ましい。 Each of the tank-shaped member 40 and the closing member 41 may be a plate-shaped member having a different configuration or a plate-shaped member having the same configuration. It is preferable to use plate-like members having the same configuration.

本形態の焼成治具４は、実施形態１の焼成治具１の底板１０と枠部材１１とが１体に形成された構成と同様な構成である。本形態の焼成治具４の上記しない構成については、実施形態１の焼成治具１と同様な構成とすることができる。（本形態の焼成治具４は、実質的に、実施形態１の焼成治具１の変形形態である。）
本形態の焼成治具４は、実質的に実施形態１の焼成治具１と同様な構成であり、実施形態１と同様な効果を発揮する。 The firing jig 4 of the present embodiment has a configuration similar to the configuration in which the bottom plate 10 and the frame member 11 of the firing jig 1 of Embodiment 1 are formed as one body. About the structure which is not mentioned above of the baking jig 4 of this form, it can be set as the structure similar to the baking jig 1 of Embodiment 1. FIG. (The firing jig 4 of this embodiment is substantially a modified form of the firing jig 1 of the first embodiment.)
The firing jig 4 of this embodiment has substantially the same configuration as that of the firing jig 1 of the first embodiment, and exhibits the same effects as those of the first embodiment.

［実施形態４の変形形態１］
本形態は、図１１に示したように、閉塞部材４１上に槽状部材４０を開口部４０２が下方に位置する構成となっていること以外は、実施形態４と同様な焼成治具４である。
本形態でも実施形態４と同様な効果を発揮する。 [Variation 1 of Embodiment 4]
As shown in FIG. 11, this embodiment is a firing jig 4 similar to that of Embodiment 4 except that the tank-like member 40 is arranged on the closing member 41 and the opening 402 is positioned below. is there.
This embodiment also exhibits the same effect as that of the fourth embodiment.

［実施形態４の変形形態２］
本形態は、図１２に示したように、閉塞部材４２が、上端が閉塞した環状の形状を有していること以外は、実施形態４と同様な焼成治具４である。本形態では、閉塞部材４２は、実施形態４の槽状部材４０をひっくり返した構成（ただし、深さ方向の長さは異なる）を有する。
本形態でも実施形態４と同様な効果を発揮する。 [Modification 2 of Embodiment 4]
As shown in FIG. 12, the present embodiment is a firing jig 4 similar to the fourth embodiment except that the closing member 42 has an annular shape with the upper end closed. In this embodiment, the closing member 42 has a configuration in which the tank-like member 40 of the fourth embodiment is turned over (however, the length in the depth direction is different).
This embodiment also exhibits the same effect as that of the fourth embodiment.

［実施形態５］
本形態の焼成治具５は、図１３に断面図で示したように、槽状部材５０を複数段（図１３では３段）で積層した形態である。本形態の焼成治具５は、槽状部材５０上に別の槽状部材５０’を積層して形成される。
槽状部材５０は、上記した実施形態４の焼成治具４の槽状部材４０と同様に、軸方向の１方の端部に開口部を有する有底環状の部材である。 [Embodiment 5]
As shown in the sectional view of FIG. 13, the firing jig 5 of this embodiment has a form in which the tank-like members 50 are stacked in a plurality of stages (three stages in FIG. 13). The firing jig 5 of this embodiment is formed by stacking another tank-shaped member 50 ′ on the tank-shaped member 50.
The tank-like member 50 is a bottomed annular member having an opening at one end in the axial direction, like the tank-like member 40 of the firing jig 4 of the fourth embodiment described above.

本形態の槽状部材５０’の底部５００’の下面５００’ｂは、直下段に位置する別の槽状部材５０の開口部５０２を閉塞する。すなわち、本形態の槽状部材５０の底部５００は、実施形態４の焼成治具４の底部４００と板状の閉塞部材４１とが１体に形成された構成を有している。 The lower surface 500 ′ b of the bottom 500 ′ of the tank-like member 50 ′ of this embodiment closes the opening 502 of another tank-like member 50 located immediately below. That is, the bottom portion 500 of the tank-shaped member 50 of the present embodiment has a configuration in which the bottom portion 400 of the firing jig 4 and the plate-shaped closing member 41 of the fourth embodiment are formed as one body.

本形態の焼成治具５は、最上段の槽状部材５０’’の開口部５０２は、閉塞部材５１で閉塞している。この閉塞部材５１は、実施形態４の閉塞部材４１と同様の構成である。 In the firing jig 5 of this embodiment, the opening 502 of the uppermost tank-like member 50 ″ is closed by the closing member 51. The closing member 51 has the same configuration as the closing member 41 of the fourth embodiment.

本形態の焼成治具５は、槽状部材５０の底部５００が、実施形態４の底部４００と板状の閉塞部材４１とが１体に形成された構成であること以外は焼成治具４と同様の構成であり、同様の効果を発揮する。 The firing jig 5 of this embodiment is the same as the firing jig 4 except that the bottom portion 500 of the tank-like member 50 has a configuration in which the bottom portion 400 of Embodiment 4 and the plate-like closing member 41 are formed as one body. It has the same configuration and exhibits the same effect.

本形態の焼成治具５は、槽状部材５０の底部５００が、実施形態４の底部４００と板状の閉塞部材４１とが１体に形成された構成であることから、実施形態４の閉塞部材４１の上に底部４００を配置する構成と比較して、底部５００を薄く形成することができる。この結果、底部５００の熱量量の増加が抑えられ、焼成に要するエネルギーの増加を抑えることができる。
また、焼成炉内に、収容できる焼成治具５の数を増加することができる。 In the firing jig 5 of this embodiment, the bottom portion 500 of the tank-like member 50 has a configuration in which the bottom portion 400 of the fourth embodiment and the plate-like closing member 41 are formed as one body. Compared to the configuration in which the bottom portion 400 is disposed on the member 41, the bottom portion 500 can be formed thinner. As a result, an increase in the amount of heat at the bottom 500 can be suppressed, and an increase in energy required for firing can be suppressed.
Further, the number of firing jigs 5 that can be accommodated in the firing furnace can be increased.

以下、実施例を用いて本発明の焼成治具を具体的に説明する。 Hereinafter, the firing jig of the present invention will be specifically described with reference to examples.

（実施例）
実施例として、上記した実施形態１の焼成治具１（各試料の焼成治具）を、表１に示した構成で製造した。なお、本例の焼成治具１は、底板１０，枠部材１１及びフタ板１２のいずれも、ジルコニア（ＺｒＯ_２）よりなる緻密質な（通気性をもたない）セラミックスで形成された。 (Example)
As an example, the above-described firing jig 1 of Embodiment 1 (the firing jig of each sample) was manufactured with the configuration shown in Table 1. In the firing jig 1 of this example, the bottom plate 10, the frame member 11, and the lid plate 12 are all made of a dense (non-breathable) ceramic made of zirconia (ZrO ₂ ).

底板１０及びフタ板１２は、表１に示したように、１辺の長さが２００（ｍｍ）で厚さが１．５（ｍｍ）の正方形の板である。
底板１０及びフタ板１２は、枠部材１１との当接面の表面粗さ（Ｒａ）が表１に示したように０．２（μｍ）であった。すなわち、表面粗さ（Ｒａ）の値は、枠部材１１の表面粗さの値よりも小さな値（差がある値）となっている。なお、実施例の底板１０及びフタ板１２は、両面が同じ表面粗さ（Ｒａ）の平板であり、底板１０及びフタ板１２は、入れ替え可能である。このため、表１中では、当接面表面粗さとして示した。 As shown in Table 1, the bottom plate 10 and the lid plate 12 are square plates having a side length of 200 (mm) and a thickness of 1.5 (mm).
As shown in Table 1, the bottom plate 10 and the lid plate 12 had a surface roughness (Ra) of a contact surface with the frame member 11 of 0.2 (μm). That is, the value of the surface roughness (Ra) is smaller than the value of the surface roughness of the frame member 11 (a value with a difference). Note that the bottom plate 10 and the lid plate 12 of the embodiment are flat plates having the same surface roughness (Ra) on both sides, and the bottom plate 10 and the lid plate 12 can be interchanged. For this reason, in Table 1, it showed as contact surface roughness.

枠部材１１は、底板１０及びフタ板１２と同じ外形（１辺の長さが２００（ｍｍ）の正方形）を有する。そして、中心（軸心）に、１辺の長さが１８０（ｍｍ）の略正方形状（それぞれの角がなめらかに丸められている正方形状）の貫通孔が形成されている。枠部材１１は、径方向の太さが１０（ｍｍ）の環状をなすように形成されている。また、枠部材１１の厚さは、０．５（ｍｍ）（試料１），１．５（ｍｍ）（試料２），２．０（ｍｍ）（試料３），２．５（ｍｍ）（試料４），３．０（ｍｍ）（試料５），３．５（ｍｍ）（試料６）となるように製造された。 The frame member 11 has the same external shape as the bottom plate 10 and the lid plate 12 (a square having a side length of 200 mm). A through hole having a substantially square shape (a square shape in which each corner is smoothly rounded) having a side length of 180 (mm) is formed in the center (axial center). The frame member 11 is formed to have an annular shape with a radial thickness of 10 (mm). The thickness of the frame member 11 is 0.5 (mm) (Sample 1), 1.5 (mm) (Sample 2), 2.0 (mm) (Sample 3), 2.5 (mm) ( Samples 4), 3.0 (mm) (sample 5), and 3.5 (mm) (sample 6) were produced.

各試料の枠部材１１は、その表面１１ａ，１１ｂに粗面化処理を施し、表面粗さ（Ｒａ）を、２０（μｍ），１５（μｍ），１０（μｍ），５（μｍ），１（μｍ）とした。 The frame member 11 of each sample is subjected to a roughening process on the surfaces 11a and 11b, and the surface roughness (Ra) is 20 (μm), 15 (μm), 10 (μm), 5 (μm), 1 (Μm).

（評価）
実施例の各試料の焼成治具１を用いて電子部品３の焼成を行い、得られた焼成体により評価を行った。
電子部品３は、すき間の距離が異なる条件（表２に示した条件）で、各試料の焼成治具１の収容空間２に配置された。電子部品３は、小片よりなり、この小片を底板１０の表面１０ａ上に均等な間隔で載置して配置された。 (Evaluation)
The electronic component 3 was fired using the firing jig 1 of each sample of the example, and the obtained fired body was evaluated.
The electronic component 3 was placed in the accommodation space 2 of the firing jig 1 of each sample under conditions (the conditions shown in Table 2) in which the gap distance was different. The electronic component 3 is composed of small pieces, and these small pieces are placed on the surface 10a of the bottom plate 10 at equal intervals.

電子部品３は、底板１０の表面１０ａ上に載置された状態で、その上方にすき間が１．５（ｍｍ），１．０（ｍｍ），０．１（ｍｍ），０．０５（ｍｍ）となる大きさを有する。
そして、電子部品３の焼成を行った。焼成は、炉内雰囲気：大気雰囲気，熱処理温度：１２００℃，熱処理時間：１０時間で行った。 The electronic component 3 is placed on the surface 10a of the bottom plate 10, and the gaps above the electronic component 3 are 1.5 (mm), 1.0 (mm), 0.1 (mm), 0.05 (mm). ).
And the electronic component 3 was baked. Firing was performed in a furnace atmosphere: air atmosphere, heat treatment temperature: 1200 ° C., and heat treatment time: 10 hours.

得られた焼成体を９分割し、それぞれの密度を測定した。密度の測定は、ＪＩＳＲ１６３４に規定の方法で行った。測定された分割体の密度を比較して、密度ムラが１％未満の焼成体を良品（○），密度ムラが１％以上の焼成体を使用可能品（△），目視で確認できる割れや歪みが発生した焼成体を不良品（×）と評価し、評価結果を表２〜表６に示した。評価結果が○及び△の焼成体は、電子部品としての実用に供することができる。 The obtained fired body was divided into nine, and the density of each was measured. The density was measured by the method specified in JIS R 1634. Comparing the measured density of the divided bodies, a fired body having a density unevenness of less than 1% is good (◯), a fired body having a density unevenness of 1% or more can be used (△), cracks that can be visually confirmed, The fired body in which distortion occurred was evaluated as a defective product (x), and the evaluation results are shown in Tables 2 to 6. The fired bodies having the evaluation results of “◯” and “Δ” can be put to practical use as electronic parts.

表２は枠部材１１の表面１１ａ，１１ｂの表面粗さ（Ｒａ）が２０（μｍ）の試料の評価結果を、表３は表面粗さ（Ｒａ）が１５（μｍ）の試料の評価結果を、表４は表面粗さ（Ｒａ）が１０（μｍ）の試料の評価結果を、表５は表面粗さ（Ｒａ）が５（μｍ）の試料の評価結果を、表６は表面粗さ（Ｒａ）が１（μｍ）の試料の評価結果を、それぞれ示した。 Table 2 shows the evaluation result of the sample having the surface roughness (Ra) of the surface 11a, 11b of the frame member 11 of 20 (μm), and Table 3 shows the evaluation result of the sample having the surface roughness (Ra) of 15 (μm). Table 4 shows the evaluation results of the sample with a surface roughness (Ra) of 10 (μm), Table 5 shows the evaluation results of the sample with a surface roughness (Ra) of 5 (μm), and Table 6 shows the surface roughness ( The evaluation results of the samples with Ra) of 1 (μm) are shown.

表２に示したように、枠部材１１の表面粗さ（Ｒａ）の値が２０（μｍ）の各試料では、いずれも×の評価となっている。これに対し、表３〜表６に示されたように、枠部材１１の表面粗さ（Ｒａ）の値が１５（μｍ）以下の各試料では、密度ムラの見られた焼成体が確認されたが、実用上の問題が生じない程度の電子部品３（焼成体）を得られている。 As shown in Table 2, each sample with a surface roughness (Ra) value of the frame member 11 of 20 (μm) is evaluated as x. On the other hand, as shown in Tables 3 to 6, in each sample having a surface roughness (Ra) value of the frame member 11 of 15 (μm) or less, a fired body in which density unevenness was observed was confirmed. However, an electronic component 3 (fired body) that does not cause a practical problem is obtained.

すなわち、電子部品３が配される収容空間２が３つの部材１０，１１，１２で区画され、これらの部材１０，１１，１２のうち、枠部材１１の当接面１１ａ，１１ｂの表面粗さ（Ｒａ）が１５（μｍ）以下となることで、収容空間への通気性を制御することができ、均一な焼成が可能となっている。
その上で、電子部品３の上方のすき間が、０．１〜１．０（ｍｍ）となることで、より密度ムラが抑えられた焼成体を得られることがわかる。 That is, the accommodation space 2 in which the electronic component 3 is arranged is partitioned by three members 10, 11, 12, and the surface roughness of the contact surfaces 11 a, 11 b of the frame member 11 among these members 10, 11, 12. When (Ra) is 15 (μm) or less, the air permeability into the accommodation space can be controlled, and uniform firing is possible.
In addition, it can be seen that when the gap above the electronic component 3 is 0.1 to 1.0 (mm), a fired body in which density unevenness is further suppressed can be obtained.

１，４，５：焼成治具
１０：底板
１１：枠部材
１２：フタ板
１３：板状部材
２：収容空間
３：電子部品
４０，５０：槽状部材
４１，５１：閉塞部材 1, 4, 5: Firing jig 10: Bottom plate 11: Frame member 12: Cover plate 13: Plate member 2: Housing space 3: Electronic component 40, 50: Tank member 41, 51: Closure member

Claims

An annular frame member (11);
A plate-like bottom plate (10) that contacts the lower end surface of the frame member;
A plate-like lid plate (12) in contact with the upper end surface of the frame member;
A firing jig (1) for firing an electronic component that is heat-treated in a state in which the electronic component (3) is disposed in a housing space (2) partitioned by an annular axis of the frame member,
At least one of the pair of contact surfaces (11b, 10a) on which the frame member and the bottom plate abut, and the pair of contact surfaces (11a, 12b) on which the frame member and the lid plate abut. A firing jig for firing electronic parts, wherein the surface has a surface roughness (Ra) of 15 (μm) or less.

The firing jig for firing electronic parts according to claim 1, wherein the surface roughness (Ra) of other contact surfaces other than the at least one contact surface is smaller than the surface roughness of the at least one contact surface.

The firing jig for firing an electronic component according to any one of claims 1 to 2, wherein an upper surface of the electronic component is spaced from the upper end surface of the frame member by 0.1 to 1.0 mm.

The said frame member is the baking treatment for electronic component baking of any one of Claims 1-3 formed by laminating | stacking the said plate-shaped member of 2 sheets, or the said 2 or more plate-shaped member. Ingredients.

A bottomed annular tank-like member (40) having an opening at one end in the axial direction;
A closing member (41) that contacts the opening of the tank-shaped member and closes the opening;
A firing jig (4) for firing an electronic component that is heat-treated in a state in which the electronic component (3) is disposed in a housing space (2) partitioned by the tank-shaped member and the closing member. ,
For firing electronic parts, wherein the surface roughness (Ra) of one abutment surface of the pair of abutment surfaces on which the tank-shaped member and the closing member abut are 15 (μm) or less Firing jig.

6. The firing jig for firing electronic parts according to claim 5, wherein the surface roughness (Ra) of the other contact surface of the pair of contact surfaces is smaller than the surface roughness of the one contact surface.