JP2016124182A - Bonded structure bonding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bonded structure capable of improving adhesiveness between a composite material formed by impregnating a reinforced substrate with a thermoplastic resin and an adhesive while suppressing an increase in cost and complication of a production process.SOLUTION: A bonded structure 1 is formed by bonding a composite material 10 obtained by impregnating a reinforced substrate 11 with a thermoplastic resin 12 and a composite material 30 obtained by impregnating a reinforced substrate 31 with a thermoplastic resin 32 through an adhesive 20. A reinforced substrate 11A on the surface of the composite material where the thermoplastic resin is melted on a surface 13 on the adhesive side is embedded in the adhesive.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a bonding structure and a bonding method.

  In recent years, a composite material in which a reinforced base material is impregnated with a resin has been used as an automobile part to reduce the weight of the automobile body, and the automobile part is formed by joining the composite materials together with an adhesive. The

  Further, as a resin constituting the composite material, a thermosetting resin is mainly used at present because of its high mechanical properties. However, the thermosetting resin is expected to be replaced with a thermoplastic resin because of the material cost and the time required for curing.

  However, this thermoplastic resin generally has low adhesion to adhesives, and a composite material in which a reinforced base material is impregnated with a thermoplastic resin also forms a thermoplastic resin on the surface. Adhesiveness to the agent is lowered.

  In relation to this, for example, the following Patent Document 1 discloses a bonding method using an adhesive mixed with a granular / fibrous dielectric heating medium having a dielectric heating property and capable of biting into a composite material by pressing. Has been.

  According to this method, the adhesive mixed with the dielectric heating medium is disposed between the pair of composite materials, and the dielectric heating medium bites into the composite material by applying pressure while heating by induction heating. And adhesion between adhesives can be realized.

JP 2013-166904 A

  However, in the joining method described in Patent Document 1, since an adhesive is mixed with a granular / fibrous dielectric heating medium that can bite into the composite material, there is a concern about an increase in cost and a complicated manufacturing process.

  The present invention has been made to solve the above-described problems, and is capable of adhering a composite material in which a reinforced base material is impregnated with a thermoplastic resin to an adhesive while suppressing an increase in cost and complication of a manufacturing process. It is an object of the present invention to provide a bonding structure and a bonding method capable of improving the property.

  An adhesive structure according to the present invention that achieves the above object is an adhesive structure in which a composite material in which a reinforced base material is impregnated with a thermoplastic resin and a member to be bonded are bonded via an adhesive. In the adhesive structure, the reinforcing base material on the surface of the composite material in which the thermoplastic resin on the surface on the adhesive side is melted is embedded in the adhesive.

  In addition, the bonding method according to the present invention that achieves the above object is a bonding method in which a composite material in which a reinforced base material is impregnated with a thermoplastic resin and a member to be bonded are bonded via an adhesive. In the bonding method, the reinforced substrate on the surface of the composite material in which the thermoplastic resin on the surface on the adhesive side is melted is embedded in the adhesive.

  According to the bonding structure and the bonding method described above, since the reinforced base material of the composite material is embedded in the adhesive, the adhesion of the composite material to the adhesive can be improved. Moreover, since another material like the dielectric heating medium of a prior art document is not mixed with an adhesive agent, the increase in cost and complication of a manufacturing process can be suppressed. Therefore, it is possible to provide an adhesion structure and an adhesion method capable of improving the adhesiveness to an adhesive of a composite material in which a reinforced base material is impregnated with a thermoplastic resin while suppressing an increase in cost and complication of a manufacturing process. be able to.

It is a perspective view showing the adhesion structure concerning the embodiment of the present invention. It is the schematic which shows the mode of the inside of the adhesion structure concerning this embodiment. It is a figure which shows the joining apparatus at the time of using the adhesion | attachment method which concerns on 1st Embodiment. It is a flowchart of the adhesion | attachment method which concerns on 1st Embodiment. It is a figure which shows a mode that the thermoplastic resin of the surface of a composite material is fuse | melted. It is a figure which shows a mode that an adhesive agent is arrange | positioned on the surface of a composite material. It is a figure which shows a mode that another composite material is arrange | positioned on the surface on the opposite side to the side in which the composite material of an adhesive agent is provided. It is a figure which shows the joining apparatus at the time of using the adhesion | attachment method which concerns on 2nd Embodiment. It is a flowchart of the adhesion | attachment method which concerns on 2nd Embodiment. It is a figure which shows a mode that a composite material, an adhesive agent, and another composite material are laminated | stacked in order. It is a figure which shows a mode that a composite material and another composite material are pressed in the direction toward each other, heating a composite material, an adhesive agent, and another composite material. It is a figure which shows a mode that the reinforcement base material of a composite material is embed | buried in an adhesive agent. It is a figure which shows a mode that an adhesive agent is arrange | positioned discretely. It is a figure which shows the result of the shear test of the adhesion structure which concerns on a comparative example. It is a figure which shows the result of the shear test of the adhesion structure which concerns on an Example.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. The dimensional ratios in the drawings are exaggerated for convenience of explanation, and may differ from actual ratios.

  FIG. 1 is a perspective view showing an adhesive structure 1 according to an embodiment of the present invention. FIG. 2 is a schematic view showing an internal state of the bonded structure according to the present embodiment. In FIG. 1, the composite materials 10 and 30 and the adhesive 20 are shown in a simplified manner. In FIG. 2, for the sake of easy understanding, the reinforced base material 11 is indicated by black circles and is regularly configured, but actually, it is irregularly configured. Similarly, in the following drawings, the reinforcing base material 11 is indicated by a black circle and is configured regularly for easy understanding.

  First, with reference to FIG.1 and FIG.2, the structure of the adhesion structure 1 which concerns on this embodiment is demonstrated.

  In summary, the bonded structure 1 according to the present embodiment, as shown in FIGS. 1 and 2, includes a composite material 10 in which a reinforced base material 11 is impregnated with a thermoplastic resin 12 and a reinforced base material 31 with a thermoplastic resin 32. A composite material (bonded member) 30 impregnated with is bonded via an adhesive 20. Then, the reinforcing base materials 11A and 31A on the surfaces 13 and 33 of the composite materials 10 and 30 in which the thermoplastic resins 12 and 32 on the surfaces 13 and 33 on the adhesive 20 side are melted are embedded in the adhesive 20. . Since the composite material 10 and the composite material 30 have the same configuration, the composite material 10 will be described below, and the description of the composite material 30 will be omitted.

  The composite material 10 has higher strength and rigidity than the thermoplastic resin 12 alone by combining the reinforced base material 11 and the thermoplastic resin 12.

  The reinforced substrate 11 is formed of a woven fabric sheet such as carbon fiber, glass fiber, or organic fiber.

  As the thermoplastic resin 12, for example, polyethylene, polypropylene, phenol resin, or the like can be used.

  The adhesive 20 is a thermosetting adhesive, and for example, an epoxy resin adhesive can be used as appropriate.

  Next, with reference to FIGS. 3-7, the joining apparatus 100 and the adhesion | attachment method which concern on 1st Embodiment of this invention are demonstrated.

<First Embodiment>
FIG. 3 is a diagram illustrating the bonding apparatus 100 when using the bonding method according to the first embodiment. FIG. 4 is a flowchart of the bonding method according to the first embodiment. FIG. 5 is a diagram illustrating a state in which the thermoplastic resin 12 on the surface 13 of the composite material 10 is melted. FIG. 6 is a diagram illustrating a state in which the adhesive 20 is disposed on the surface 13 of the composite material 10. FIG. 7 is a diagram illustrating a state in which another composite material 30 is disposed on the surface of the adhesive 20 opposite to the side on which the composite material 10 is provided. 5-7, the laser head 110, the composite material 10, the adhesive agent 20, and the composite material 30 are simplified and shown.

  First, the configuration of the bonding apparatus 100 will be described with reference to FIG. In FIG. 3, for easy understanding, the laser L, the scanner mirror 112, and the lens 113 are shown by solid lines. In FIG. 3, the case where the composite material 30 which is a rear seat is joined to the composite material 10 which is a front seat will be described as an example.

  The joining apparatus 100 includes a laser head 110, a first hand robot 120, a second hand robot 130, an adhesive application gun 140, and a third hand robot 150.

The laser head 110 melts the thermoplastic resin 12 on the surface 13 by irradiating the surface 13 of the composite material 10 with the laser L. The laser head 110 includes an irradiation unit 111 from which the laser L is emitted, a scanner mirror 112 that scans the laser L, and a lens 113 that collects the laser L. The scanner mirror 112 is controlled by a control unit (not shown) so that the laser L is applied to a position where the adhesive 20 is applied on the surface 13 of the composite material 10. The laser L is, for example, a CO ₂ laser, but is not limited thereto. Moreover, it is preferable that the laser L is a pulse wave from the viewpoint of easily achieving high output.

  The first hand robot 120 holds the laser head 110. The first hand robot 120 moves the laser head 110 to a predetermined position on the composite material 10 by being controlled by a control unit (not shown).

  The second hand robot 130 holds the composite material 30. The second hand robot 130 moves the composite material 30 onto the composite material 10 by being controlled by a control unit (not shown) after the thermoplastic resin 12 on the surface 13 of the composite material 10 is melted.

  The adhesive application gun 140 applies the adhesive 20 to the surface 13 of the composite material 10 in which the thermoplastic resin 12 on the surface 13 of the composite material 10 is melted.

  The third hand robot 150 holds the adhesive application gun 140. The third hand robot 150 moves the adhesive application gun 140 to a predetermined position on the composite material 10 by being controlled by a control unit (not shown).

  Next, the bonding method according to the first embodiment will be described with reference to the flowchart of FIG.

  In summary, the bonding method according to the first embodiment of the present invention includes a composite material 10 in which a reinforced base material 11 is impregnated with a thermoplastic resin 12 and a composite material 30 in which a reinforced base material 31 is impregnated with a thermoplastic resin 32. This is a method of bonding through the adhesive 20. Further, the bonding material 10 and 30 in which the thermoplastic resins 12 and 32 on the surfaces 13 and 33 on the adhesive 20 side are melted is bonded to the adhesive 20 so that the reinforcing base materials 11A and 31A on the surfaces 13 and 33 are embedded in the adhesive 20. Is the method. Hereinafter, the bonding method according to the first embodiment will be described in detail.

  First, as shown in FIG. 5, the surface 13 on the side where the adhesive 20 of the composite material 10 is disposed is irradiated with the laser L by the irradiation unit 111 of the laser head 110 to melt the thermoplastic resin 12 on the surface 13. (S01). When irradiating the surface L with the laser L, the laser L is scanned by the scanner mirror 112, and the laser L is irradiated to an appropriate position on the surface 13. In this manner, the surface L of the composite material 10 is irradiated with the laser L, whereby the thermoplastic resin 12 on the surface 13 is melted.

  Next, as shown in FIG. 6, the adhesive 20 is applied to the surface 13 of the composite material 10 in which the thermoplastic resin 12 on the surface 13 is melted (S02). The adhesive 20 is applied by an adhesive application gun 140. In this way, the reinforcing base 11 </ b> A on the surface 13 is embedded in the adhesive 20 by applying the adhesive 20 to the surface 13 of the composite material 10 in which the thermoplastic resin 12 on the surface 13 is melted. Therefore, the adhesiveness of the composite material 10 to the adhesive 20 is improved.

  Next, as shown in FIG. 7, the composite material 30 is disposed on the surface of the applied adhesive 20 opposite to the side on which the composite material 10 is provided (S03). The composite material 30 is arranged by the second hand robot 130. In the composite material 30, like the composite material 10, the thermoplastic resin 32 is preferably melted on the surface 33 on the adhesive 20 side. By disposing the thermoplastic resin 32 on the adhesive 20 in a melted state, the reinforcing base 31 </ b> A on the surface 33 on the adhesive 20 side is embedded in the adhesive 20. Therefore, the adhesiveness of the composite material 30 to the adhesive 20 is improved. In addition, the member arrange | positioned on the upper surface of the adhesive agent 20 is not limited to the composite material 30, A metal material etc. may be sufficient.

  Through the above steps, the composite material 10 and the composite material 30 are joined via the adhesive 20, and the bonded structure 1 shown in FIG. 1 is manufactured.

  As described above, the adhesive structure 1 according to this embodiment includes the composite material 10 in which the reinforced base material 11 is impregnated with the thermoplastic resin 12 and the composite material 30 in which the reinforced base material 31 is impregnated with the thermoplastic resin 32. Is bonded via an adhesive 20. The bonding structure 1 is formed by embedding the reinforcing base material 11 on the surface 13 of the composite material 10 in which the thermoplastic resin 12 on the surface 13 on the adhesive 20 side is melted in the adhesive 20. According to the adhesion structure 1, the reinforcing base material 11 of the composite material 10 is embedded in the adhesive 20, so that the adhesion of the composite material 10 to the adhesive 20 can be improved. Moreover, since another material like the dielectric heating medium of a prior art document is not mixed with the adhesive agent 20, the increase in cost and complication of a manufacturing process can be suppressed. Therefore, the adhesive structure 1 capable of improving the adhesion of the composite material 10 in which the reinforced base material 11 is impregnated with the thermoplastic resin 12 to the adhesive 20 is suppressed while suppressing an increase in cost and complication of the manufacturing process. Can be provided.

  Further, the bonded structure 1 includes a composite material 10 in which a reinforced base material 11 is impregnated with a thermoplastic resin 12 and a composite material 30 in which a reinforced base material 31 is impregnated with a thermoplastic resin 32 are bonded via an adhesive 20. Being done. For this reason, the composite materials 10 and 30 can be bonded to each other, and the present invention can also be applied to automobile parts formed by bonding composite materials.

  In addition, as described above, the bonding method according to this embodiment includes the composite material 10 in which the reinforced base material 11 is impregnated with the thermoplastic resin 12 and the composite material 30 in which the reinforced base material 31 is impregnated with the thermoplastic resin 32. Is an adhesive method in which the adhesive is bonded via the adhesive 20. Further, the reinforcing base material 11 on the surface 13 of the composite material 10 in which the thermoplastic resin 12 on the surface 13 on the adhesive 20 side is melted is embedded in the adhesive 20. According to this bonding method, since the reinforcing base material 11 of the composite material 10 is embedded in the adhesive 20, the adhesiveness of the composite material 10 to the adhesive 20 can be improved. Moreover, since another material like the dielectric heating medium of a prior art document is not mixed with the adhesive agent 20, the increase in cost and complication of a manufacturing process can be suppressed. Therefore, the adhesive structure 1 capable of improving the adhesion of the composite material 10 in which the reinforced base material 11 is impregnated with the thermoplastic resin 12 to the adhesive 20 is suppressed while suppressing an increase in cost and complication of the manufacturing process. Can be provided.

  Further, the composite material 10 in which the reinforced base material 11 is impregnated with the thermoplastic resin 12 and the composite material 30 in which the reinforced base material 31 is impregnated with the thermoplastic resin 32 are bonded via the adhesive 20. For this reason, the composite materials 10 and 30 can be bonded to each other, and the present invention can also be applied to automobile parts formed by bonding composite materials.

  Moreover, the thermoplastic resin 12 on the surface 13 on the adhesive 20 side of the composite material 10 is melted, and the adhesive 20 is disposed on the surface 13 on which the thermoplastic resin 12 is melted, whereby the reinforced base material 11 is bonded to the adhesive. It is buried in 20. According to this method, the reinforcing substrate 11 can be embedded in the adhesive 20 simply by disposing the adhesive 20 on the surface 13 on which the thermoplastic resin 12 has been melted. 11 can be embedded in the adhesive 20.

Second Embodiment
Next, with reference to FIGS. 8-12, the joining apparatus 200 and the adhesion | attachment method which concern on 2nd Embodiment of this invention are demonstrated.

  FIG. 8 is a diagram illustrating a bonding apparatus 200 when using the bonding method according to the second embodiment. FIG. 9 is a flowchart of the bonding method according to the second embodiment. FIG. 10 is a diagram illustrating a state in which the composite material 10, the adhesive 20, and the composite material 30 are stacked in this order. FIG. 11 is a diagram illustrating a state in which the composite material 10, the adhesive 20, and the composite material 30 are heated and the composite material 10 and the composite material 30 are pressed toward each other. FIG. 12 is a diagram illustrating a state in which the reinforcing base materials 11 </ b> A and 31 </ b> A of the composite materials 10 and 30 are embedded in the adhesive 20.

  First, the configuration of the bonding apparatus 200 will be described with reference to FIG. In FIG. 8, the composite materials 10 and 30 and the adhesive 20 are shown in a simplified manner.

  The joining apparatus 200 includes a press working mold 210, a thermostatic chamber 220, a first hand robot 120, a second hand robot 130, an adhesive application gun 140, and a third hand robot 150. Since the first hand robot 120, the second hand robot 130, the adhesive application gun 140, and the third hand robot 150 have the same configuration as that of the first embodiment, the description thereof is omitted.

  The press working mold 210 presses the composite material 10 in which the thermoplastic resin 12 on the surface 13 is melted and the composite material 30 in which the thermoplastic resin 32 on the surface 33 is melted in the direction toward each other via the adhesive 20. As illustrated in FIG. 8, the press working mold 210 includes an upper mold 211 and a lower mold 212. The upper mold 211 and the lower mold 212 are configured to be relatively movable in the direction toward each other. Note that the press mold 210 may not be provided, and the second hand robot 130 may press the composite material 30 against the composite material 10.

  The thermostat 220 can adjust the temperature of the internal space. More specifically, the thermoplastic resin 12 on the surface 13 of the composite material 10 and the thermoplastic resin 32 on the surface 33 of the composite material 30 are melted by adjusting the temperature of the internal space (see FIG. 11).

  Next, an adhesion method according to the second embodiment will be described with reference to the flowchart of FIG.

  First, as shown in FIG. 10, the composite material 10, the adhesive 20, and the composite material 30 are laminated in this order (S11). More specifically, the adhesive 20 is applied to the surface 13 of the composite material 10 by the adhesive application gun 140, and the composite material 30 is placed on the surface of the adhesive 20 by the third hand robot 130.

  Next, as shown in FIG. 11, the composite material 10 and the composite material are controlled by the press mold 210 while heating the composite material 10, the adhesive 20, and the composite material 30 by controlling the temperature of the thermostatic chamber 220. 30 are pressed in the direction toward each other (S12). Although the temperature in the internal space of the thermostat 220 is 170 degree | times, for example, it is not specifically limited. At this time, it is preferable that the adhesive 20 is heated to the melting point of the thermoplastic resin 12 at the timing when the viscosity of the adhesive 20 is increased, and pressed simultaneously. As a result, the thermoplastic resins 12 and 32 on the surfaces 13 and 33 of the composite materials 10 and 30 are melted, and the reinforcing base materials 11A and 31A on the surfaces 13 and 33 are embedded in the adhesive 20 as shown in FIG. The Therefore, the adhesiveness of the composite materials 10 and 30 to the adhesive 20 is improved.

  As described above, in the bonding method according to the second embodiment, the composite material 10, the adhesive 20, and the composite material 30 are stacked in this order, and the composite material 10, the adhesive 20, and the composite material 30 are heated. The composite material 10 and the composite material 30 are pressed toward each other. In this way, the reinforcing base materials 11A and 31A are embedded in the adhesive 20. According to this bonding method, the reinforced base material 11A on the surface 13 of the composite material 10 and the reinforced base material 31A on the surface 33 of the composite material 30 are once pressed by pressing the composite material 10 and the composite material 30 in the direction toward each other. It can be embedded in the adhesive 20. Therefore, the composite materials 10 and 30 can be easily bonded to each other.

  Hereinafter, modifications of the above-described embodiment will be exemplified.

  In 1st Embodiment mentioned above, although the laser L was mentioned as a means to fuse the thermoplastic resin 12 in the surface 13 of the composite material 10, it is not limited to this, An infrared lamp, induction heating, etc. may be sufficient. Furthermore, it is not limited to the above-mentioned melting by heating, and may be chemically melted by applying an organic solvent to the surface 13 of the composite material 10.

  Examples of the organic solvent include carbon disulfide, carbon tetrachloride, glycerin, ethylene glycol, formic acid, glacial acetic acid, oxalic acid, benzene, toluene, xylene, n-hexane, n-heptane, methanol, ethanol, propanol, butanol, Examples include cyclohexane, chlorobenzene, pyridine, aniline, decalin, chloroform, ethyl ether, ethyl acetate, acetone, petroleum benzine, petroleum ether, and methyl ethyl ketone.

  Moreover, in 2nd Embodiment mentioned above, the composite material 10, the adhesive agent 20, and the composite material 30 were heated entirely by the thermostat 220. FIG. However, the press working mold 210 may be configured to be hot pressed and may be heated and pressed by hot pressing. According to this method, compared to the second embodiment, the composite materials 10 and 30 can be prevented from being heated entirely and partially heated, so that deformation of the composite materials 10 and 30 is suppressed. it can.

  Moreover, in 2nd Embodiment mentioned above, as shown in FIG. 11, the adhesive agent 20 was arrange | positioned uniformly on the surfaces 13 and 33 of the composite materials 10 and 30. As shown in FIG. However, as shown in FIG. 13, the adhesive 20 may be discretely disposed on the surfaces 13 and 33 of the composite materials 10 and 30. According to this configuration, when the composite material 10 and the composite material 30 are pressed in the direction toward each other, the place where the adhesive 20 is disposed is higher than the case where the adhesive 20 is disposed uniformly. . For this reason, the reinforcing fibers 11 and 31 are buried deeper into the adhesive 20, and the adhesiveness of the composite material 10 and the composite material 30 is further improved.

<Example>
EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited thereto.

  In a carbon fiber reinforced plastic (reinforced base material 11), which is generally made of polypropylene (thermoplastic resin 12) that is difficult to bond, a composite material 10, using a general-purpose epoxy adhesive (adhesive 20). 30 were bonded together and the shear test was done. As a result, the adhesive strength was as low as 2 MPa, and the failure mode was interface peeling between the adhesive 20 and the composite material 10 as shown in FIG.

  On the other hand, in the second embodiment described above, a shear test was similarly performed on the bonded structure 1 bonded with the temperature of the thermostat 220 set at 170 degrees. As a result, the adhesive strength was as high as 11.7 MPa, and the fracture mode was a base material fracture in the adhesive 20 as shown in FIG.

  As a result, the adhesiveness of the composite materials 10 and 30 to the adhesive 20 was improved by embedding the reinforcing base materials 11A and 31A on the surfaces 13 and 33 of the composite materials 10 and 30 in the adhesive 20. Furthermore, the adhesive strength between the composite materials 10 and 30 was improved.

1 Adhesive structure,
10 composite materials,
11, 31 reinforced base material,
11A, 31A Reinforced substrate on the surface,
12, 32 thermoplastic resin,
13,33 surface,
20 Adhesive,
30 Composite material (bonded member).

Claims (7)

A composite material in which a reinforced base material is impregnated with a thermoplastic resin and a member to be bonded are bonded via an adhesive,
An adhesive structure in which the reinforcing base material on the surface of the composite material in which the thermoplastic resin on the surface on the adhesive side is melted is embedded in the adhesive.   The bonded structure according to claim 1, wherein the member to be bonded is a composite material in which a reinforced base material is impregnated with a thermoplastic resin. A bonding method in which a composite material in which a reinforced substrate is impregnated with a thermoplastic resin and a member to be bonded are bonded via an adhesive,
A bonding method in which the reinforcing base material on the surface of the composite material in which the thermoplastic resin on the surface on the adhesive side is melted is embedded in the adhesive.   The bonding method according to claim 3, wherein the member to be bonded is a composite material in which a reinforced base material is impregnated with a thermoplastic resin. Melting the thermoplastic resin on the adhesive-side surface of the composite material;
The bonding method according to claim 3 or 4, wherein the reinforcing base is embedded in the adhesive by disposing the adhesive on the surface where the thermoplastic resin is melted. Laminate in order of the composite material, the adhesive, and the adherend,
The reinforced substrate is embedded in the adhesive by pressing the composite material and the member to be bonded in a direction toward each other while heating at least the surface of the composite material on the adhesive side. 4. The bonding method according to 4.   The adhesion method according to claim 6, wherein the adhesive is discretely disposed on a surface of the composite material.