JP2016122731A - Optical semiconductor device and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical semiconductor device capable of suppressing reduction in data transmission efficiency by minimizing a loading error of an optical semiconductor element with respect to the center position of a lens.SOLUTION: An optical semiconductor device A1 includes a substrate 1 having a loading surface 11a, an optical semiconductor element 2 loaded on the loading surface 11a of the substrate 1, a lens 4 arranged in the same direction as the direction which the loading surface 11a of the substrate 1 faces and having a curved surface part, and a plurality of support bodies 3 arranged on the loading surface 11a of the substrate 1 and having curved surface parts. The plurality of support bodies 3 are respectively fixed on a plurality of support parts 12 formed on the substrate 1. The lens 4 and the plurality of support bodies 3 are brought into point contact with each other on the respective curved surface parts.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an optical semiconductor device using an optical semiconductor element applied to wireless optical communication and a method for manufacturing the same.

  A method of transmitting data by using light as a carrier wave is widely adopted. An optical semiconductor device used in such a method is disclosed in Patent Document 1, for example. In the optical semiconductor device, an optical semiconductor element (light emitting element and light receiving element) is mounted on a substrate (lead frame), and the substrate and the optical semiconductor element are both covered with a sealing resin. The sealing resin has a lens for increasing the directivity of light emitted from the optical semiconductor element (light emitting element) or condensing light incident on the optical semiconductor element (light receiving element). Is provided.

  In general, the lens is formed integrally with the sealing resin by molding. However, according to this method, the arrangement position of the lens is determined based on the substrate. Therefore, if the optical semiconductor element is not mounted on the substrate at an accurate position, the mounting position of the optical semiconductor element is a horizontal error that is a direction along the substrate surface with respect to the center position of the lens. Will have. If the horizontal error is 100 μm or more, it is difficult to wirelessly transmit data. Therefore, the horizontal error is required to be as small as possible.

JP 2007-173562 A

  In view of the above circumstances, an object of the present invention is to provide an optical semiconductor device capable of minimizing a mounting error of an optical semiconductor element with respect to the center position of a lens and suppressing a decrease in data transmission efficiency.

  An optical semiconductor device provided by the first aspect of the present invention includes a substrate having a mounting surface, an optical semiconductor element mounted on the mounting surface of the substrate, and a direction in which the mounting surface of the substrate faces. An optical semiconductor device including a lens disposed in the same direction and having a curved surface portion, the optical semiconductor device including a plurality of supports disposed on the mounting surface of the substrate and having a curved surface portion. The support members are fixed to a plurality of support portions formed on the substrate, respectively, and the lens and the plurality of support members are in point contact with each other at each curved surface portion.

  In a preferred embodiment of the present invention, each of the plurality of supports is a sphere.

  In a preferred embodiment of the present invention, the lens is a sphere.

  In a preferred embodiment of the present invention, each of the plurality of supports has a relatively smaller cross-sectional dimension than the lens.

  In a preferred embodiment of the present invention, the plurality of supports are arranged separately from each other on the mounting surface of the substrate.

  In a preferred embodiment of the present invention, the plurality of supports are arranged on the mounting surface of the substrate so that a planar view shape drawn by a line connecting the centers of the plurality of supports is a polygon. Is arranged.

  In a preferred embodiment of the present invention, the polygon is a triangle.

  In a preferred embodiment of the present invention, the triangle is a regular triangle.

  In a preferred embodiment of the present invention, the triangle is an isosceles triangle.

  In a preferred embodiment of the present invention, the polygon is a quadrangle.

  In a preferred embodiment of the present invention, each of the plurality of supports has a relatively larger Young's modulus than the lens.

  In a preferred embodiment of the present invention, each of the plurality of supports has a relatively smaller linear expansion coefficient than the lens.

  In a preferred embodiment of the present invention, the plurality of support portions are holes that penetrate the substrate.

  In a preferred embodiment of the present invention, the plurality of support portions are recesses formed on the mounting surface of the substrate.

  In a preferred embodiment of the present invention, each of the plurality of support portions as viewed in the depth direction is circular.

  In a preferred embodiment of the present invention, each of the plurality of support portions viewed in the depth direction is a polygon.

  In a preferred embodiment of the present invention, each of the plurality of support portions viewed in the depth direction is a triangle.

  In a preferred embodiment of the present invention, the areas of the plurality of support portions as viewed in the depth direction are each uniform over the depth direction.

  In a preferred embodiment of the present invention, the areas of the plurality of support portions as viewed in the depth direction each change over the depth direction.

  In preferable embodiment of this invention, the sealing resin which covers the said board | substrate, the said optical-semiconductor element, and the said support body is further provided.

  In preferable embodiment of this invention, the said sealing resin contains the part which has light-shielding property.

  In a preferred embodiment of the present invention, a control circuit element covered with the sealing resin is further provided.

  In a preferred embodiment of the present invention, the control circuit element is covered with the sealing resin having a light shielding property.

  In a preferred embodiment of the present invention, the substrate further includes an external electrode disposed on the mounting surface, the mounting surface facing in a direction opposite to the mounting surface of the substrate.

  The method for manufacturing an optical semiconductor device provided by the second aspect of the present invention includes a step of forming a plurality of support portions for fixing a plurality of support bodies having curved surface portions on a substrate having a mounting surface; A step of mounting an optical semiconductor element on the mounting surface of the substrate; a step of fixing the plurality of supports to the plurality of support portions; and a curved surface portion on the curved surface portions of the plurality of support bodies. A step of fixing the lens by bringing it into point contact, and a step of forming a sealing resin that covers the substrate, the optical semiconductor element, and the plurality of supports. It is said.

  In a preferred embodiment of the present invention, in the step of fixing the plurality of supports, the plurality of supports are applied by applying an adhesive so as to contact the mounting surface of the substrate and the plurality of supports. The plurality of supports are fixed to the portion.

  In a preferred embodiment of the present invention, in the step of fixing the plurality of supports, the melted translucent sealing resin is exposed, and the curved surface portions of the plurality of supports are exposed from the sealing resin. The plurality of support bodies are fixed to the plurality of support sections by solidifying the plurality of support sections.

  In a preferred embodiment of the present invention, in the step of fixing the lens, an adhesive is applied so as to contact the curved surface portions of the plurality of support members and the curved surface portion of the lens, thereby the plurality of support members. The lens is fixed to.

  In a preferred embodiment of the present invention, in the step of fixing the lens, the lens is fixed to the plurality of supports by solidifying the melted translucent sealing resin.

  According to the present invention, the plurality of support portions are formed on the substrate, and the support bodies that are a plurality of spheres are fixed to the plurality of support portions by engagement. The lens is fixed to the support by point contact with each other. Therefore, the fixing positions of the support and the lens on the substrate are uniquely and accurately determined. The optical semiconductor element is mounted on the substrate based on the result of image recognition of the positions and shapes of the plurality of support portions on the substrate by, for example, a computer. With this method, the horizontal mounting error, which is the direction along the mounting surface of the substrate with respect to the center position of the lens, can be reduced with respect to the optical semiconductor element mounted on the substrate. Therefore, it is possible to minimize the mounting error of the optical semiconductor element with respect to the center position of the lens, and to suppress a decrease in data transmission efficiency.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

1 is a plan view showing an optical semiconductor device according to a first embodiment of the present invention. It is sectional drawing which follows the II-II line | wire of FIG. It is sectional drawing which follows the III-III line of FIG. FIG. 2 is an enlarged cross-sectional view of a main part showing the optical semiconductor device of FIG. 1. FIG. 2 is a main part plan view and a main part sectional view showing the optical semiconductor device of FIG. 1. FIG. 2 is an enlarged cross-sectional view of a main part showing the optical semiconductor device of FIG. 1. It is sectional drawing which shows the manufacturing method of the optical semiconductor device of FIG. It is sectional drawing which shows the manufacturing method of the optical semiconductor device of FIG. It is sectional drawing which shows the manufacturing method of the optical semiconductor device of FIG. It is sectional drawing which shows the manufacturing method of the optical semiconductor device of FIG. It is sectional drawing which shows the manufacturing method of the optical semiconductor device of FIG. It is explanatory drawing which shows the analysis conditions of the light reception amount of the optical semiconductor device of FIG. It is explanatory drawing which shows the analysis result of the light reception amount of the optical semiconductor device of FIG. It is sectional drawing which shows the optical semiconductor device concerning the 1st modification of 1st Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the optical semiconductor device of FIG. It is sectional drawing which shows the manufacturing method of the optical semiconductor device of FIG. It is sectional drawing which shows the optical semiconductor device concerning the 2nd modification of 1st Embodiment of this invention. FIG. 18 is an enlarged cross-sectional view of a main part showing the optical semiconductor device of FIG. 17. It is a top view which shows the optical semiconductor device concerning 2nd Embodiment of this invention. It is a top view which shows the optical semiconductor device concerning 3rd Embodiment of this invention.

  Embodiments of an optical semiconductor device according to the present invention will be described with reference to the accompanying drawings.

[First Embodiment]
The optical semiconductor device A1 according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a plan view showing the optical semiconductor device A1. 2 is a cross-sectional view taken along the line II-II passing through the center O (the center of a lens 4 described later) in FIG. 3 is a cross-sectional view taken along line III-III passing through the center O of FIG. FIG. 4 is an enlarged cross-sectional view of a main part showing the optical semiconductor device A1. FIG. 5 is a main part plan view and main part sectional view showing the optical semiconductor device A1. FIG. 6 is an enlarged cross-sectional view of a main part showing the optical semiconductor device A1. 7-11 is sectional drawing which shows the manufacturing method of optical semiconductor device A1. FIG. 12 is an explanatory diagram showing analysis conditions for the amount of light received by the optical semiconductor device A1. FIG. 13 is an explanatory diagram showing the analysis result of the amount of light received by the optical semiconductor device A1. In FIG. 1, a sealing resin 5 described later is omitted for the sake of understanding.

  The optical semiconductor device A1 shown in these drawings is roughly divided into a transmission side using an optical semiconductor element that performs a light emitting function and a receiving side that uses an optical semiconductor element that performs a light receiving function. The transmitting side has a function of converting the supplied current into light and emitting the light to the receiving side. The receiving side has a function of detecting light emitted from the transmitting side and outputting a current based on the detection result. The optical semiconductor device A1 of the present embodiment includes a substrate 1, an optical semiconductor element 2, a support 3, a lens 4, a sealing resin 5, a control circuit element 6, and a bonding wire 7. In the present embodiment, the optical semiconductor device A1 has a rectangular shape in plan view.

  The substrate 1 mounts the optical semiconductor element 2 and the control circuit element 6 and mounts the optical semiconductor device A1 on the circuit board of the target device. The substrate 1 has a base material 11, a support part 12, an internal electrode 13 and an external electrode 14. In the present embodiment, the substrate 1 has a rectangular shape in plan view.

  The base material 11 has a mounting surface 11a and a mounting surface 11b. The base material 11 consists of glass epoxy resin or ceramics, for example. The mounting surface 11a is an upper surface of the base material 11 shown in FIG. 2, and is a surface on which the optical semiconductor element 2 and the control circuit element 6 are mounted. The mounting surface 11b is the lower surface of the base material 11 shown in FIG. 2, and is a surface used when the optical semiconductor device A1 is mounted on a circuit board or the like of the target device. The mounting surface 11a and the mounting surface 11b face opposite sides.

  The support portion 12 is a plurality of portions formed on the substrate 1 used when fixing the support 3. In the present embodiment, as shown in FIGS. 1 and 4, each support portion 12 is a hole penetrating the substrate 1, and is formed in three places in total. Further, in the present embodiment, the shape of each support portion 12 viewed in the depth direction is circular, and the area of the shape is uniform over the depth direction.

  FIG. 5 shows only a part of the base material 11, the support portion 12, and the support body 3 of the substrate 1 in the optical semiconductor device A <b> 1 for convenience of understanding. The upper part of FIG. 5 is a main part plan view, and the lower part is a main part sectional view. The shape in the depth direction of each support portion 12 can be a triangle shown in FIG. 5B or a quadrangle shown in FIG. 5C other than the circle shown in FIG. . Furthermore, the depth direction view shape of each support portion 12 may be a polygon other than a triangle and a rectangle. 5A, 5B, and 5C, the area of the shape of the support portion 12 viewed in the depth direction is uniform throughout the depth direction.

  The area of the shape in the depth direction of each support portion 12 may change over the depth direction. For example, as shown in FIG. 6, the area of the shape in the depth direction of the support portion 12 can be gradually reduced over the depth direction for each of the areas. More specifically, in the example shown in FIG. 6, the area of the shape of the support portion 12 in the depth direction viewed from the mounting surface 11 a of the substrate 1 in the depth direction (downward in FIG. 6). It is said to be small.

  The internal electrode 13 is an electrode pad (conductive pattern) disposed on the mounting surface 11a of the substrate 1, and includes a first die pad 13a, a wire bonding pad 13b, and a second die pad 13c. The first die pad 13a is an electrode pad on which the optical semiconductor element 2 is mounted. The wire bonding pad 13b is an electrode pad to which the bonding wire 7 is connected at both ends thereof. The second die pad 13c is an electrode pad on which the control circuit element 6 is mounted.

The external electrode 14 is an electrode for mounting the optical semiconductor device A1 by interconnecting with an electrode disposed on a circuit board or the like of the target device. In the present embodiment, the external electrode 14 is disposed along one side of the substrate 1 so that the electrode is exposed on the side surface of the substrate 1. In the present embodiment, the external electrode 14 is substantially semicircular in plan view, and the cross section perpendicular to the depth direction of the substrate 1 is uniform. The internal electrode 13 and the external electrode 14 are electrically connected to each other via another wiring portion (not shown) disposed inside the base material 11.

  The optical semiconductor element 2 has an optical functional region (not shown) that performs a light emitting function or a light receiving function. Examples of the optical semiconductor element 2 in the case where the optical functional region fulfills a light emitting function include, for example, an LED or a VCSEL (Vertical Cavity Surface LASER). Examples of the optical semiconductor element 2 in the case where the optical functional region fulfills a light receiving function include, for example, a phototransistor or a photodiode. The optical functional region is located on the upper surface side of the optical semiconductor element 2 in FIG. The optical semiconductor element 2 is mounted on the first die pad 13a of the substrate 1 by die bonding via an adhesive layer 21. The adhesive layer 21 is made of, for example, an Ag paste.

  The support 3 is a plurality of members having a curved surface portion used when fixing the lens 4, and is fixed to the support portion 12 of the substrate 1 by engagement as shown in FIGS. 1 and 4. . In the present embodiment, the support 3 is three spheres, and each cross-sectional dimension is relatively smaller than that of the lens 4. In the present embodiment, as shown in FIG. 1, each of the supports 3 is formed so that the shape drawn by a line connecting the centers of the supports 3 (two-dot chain line shown in FIG. 1) is an equilateral triangle. On the mounting surface 11a of the board | substrate 1, it arrange | positions mutually spaced apart. In the present embodiment, as shown in FIG. 4, the support 3 is fixed to the support portion 12 by bonding with an adhesive 31.

  The support 3 is preferably made of a material that is less elastically deformed than the lens 4, that is, a material having a relatively higher Young's modulus than the lens 4. The support 3 is preferably made of a material that is less likely to thermally expand than the lens 4, that is, a material that has a relatively low linear expansion coefficient than the lens 4. In the present embodiment, the material of the support 3 is, for example, steel.

  The lens 4 efficiently transmits light between the optical semiconductor devices A1 by increasing the directivity of light or condensing the light. Specifically, in the optical semiconductor device A1 (transmission side Tx) using the optical semiconductor element 2 that performs the light emitting function, the directivity of the emitted light from the optical semiconductor element 2 is enhanced by the lens 4. Further, in the optical semiconductor device A1 (receiving side Rx) using the optical semiconductor element 2 that performs the light receiving function, the incident light to the optical semiconductor element 2 is condensed by the lens 4. The lens 4 is disposed in the same direction as the direction in which the mounting surface 11 a of the substrate 1 faces and is fixed by the support 3. In the present embodiment, the lens 4 is a sphere composed of a curved surface portion, and is a so-called ball lens. In the present embodiment, the material of the lens 4 is, for example, a synthetic resin having translucency. Further, in the present embodiment, the lens 4 and the support 3 are in point contact with each other at each curved surface portion.

  The sealing resin 5 is formed on the mounting surface 11 a of the substrate 1. The sealing resin 5 covers the mounting surface 11 a and the internal electrode 13 of the substrate 1, the optical semiconductor element 2, the support 3, the control circuit element 6, and the bonding wire 7. The material of the sealing resin 5 is, for example, a synthetic resin mainly composed of an epoxy resin. With the sealing resin 5, it is possible to prevent the optical semiconductor device A <b> 1 from having troubles such as foreign matters are not attached to the optical semiconductor element 2, the control circuit element 6, the bonding wire 7, and the like. In the present embodiment, the sealing resin 5 includes a first sealing resin 51a and a second sealing resin 52a.

  The first sealing resin 51 a covers the control circuit element 6 and a part of each of the internal electrode 13 and the bonding wire 7. In the present embodiment, the first sealing resin 51a is a synthetic resin having a light shielding property. The first sealing resin 51a prevents the control circuit element 6 from malfunctioning due to extraneous light. The second sealing resin 52a covers the mounting surface 11a, the internal electrode 13, the optical semiconductor element 2, the support 3, the control circuit element 6 covered with the first sealing resin 51a, and the bonding wire 7. Is. As shown in FIGS. 2 and 3, the upper half portion of the lens 4 protrudes from the top surface of the second sealing resin 52a. In the present embodiment, the second sealing resin 52a is translucent to light emitted from the transmission side Tx of the optical semiconductor device A1 or light incident on the reception side Rx of the optical semiconductor device A1. .

  On the transmission side of the optical semiconductor device A1, the control circuit element 6 converts the input signal into a control current and drives the optical semiconductor element 2. On the receiving side of the optical semiconductor device A1, the current generated by the photovoltaic power in the optical semiconductor element 2 is controlled and converted into an output signal. The control circuit element 6 is mounted on the second die pad 13c of the substrate 1 by die bonding via an adhesive layer (not shown).

  The bonding wire 7 is a wiring that connects the internal electrode 13 of the substrate 1, the optical semiconductor element 2, and the control circuit element 6. The optical semiconductor element 2 and the control circuit element 6 are electrically connected to each other through the internal electrode 13 and the bonding wire 7. The bonding wire 7 is made of, for example, Au.

  Next, a method for manufacturing the optical semiconductor device A1 will be described.

  As shown in FIG. 7, after the internal electrode 13 is disposed on the mounting surface 11a of the substrate 1, the support portion 12 is formed. Along with the arrangement of the internal electrodes 13, a metal (not shown) forming the external electrodes 14 is embedded in the base material 11 of the substrate 1. The support portion 12 is formed, for example, by drilling the base material 11.

  Next, as shown in FIG. 8, the optical semiconductor element 2 and the control circuit element 6 are mounted on the first die pad 13a and the second die pad 13c of the substrate 1 by die bonding, respectively. Through this process, the optical semiconductor element 2 is mounted on the mounting surface 11 a of the substrate 1. The optical semiconductor element 2 recognizes an image of the position and shape of the support portion 12 on the substrate 1 by, for example, a computer, and is mounted on the first die pad 13a based on the recognition result. After mounting the optical semiconductor element 2 and the control circuit element 6 on the substrate 1, the internal electrode 13 of the substrate 1, the optical semiconductor element 2, and the control circuit element 6 are connected by disposing a bonding wire 7. After the bonding wire 7 is disposed, a first sealing resin 51 a that covers the control circuit element 6 and the internal electrode 13 and a part of the bonding wire 7 is formed. In the present embodiment, the first sealing resin 51a is formed by applying a molten synthetic resin on the mounting surface 11a and solidifying the synthetic resin.

  Next, as shown in FIG. 9, the supports 3 are respectively fixed to the support portions 12 of the substrate 1. After the support bodies 3 are respectively arranged on the support sections 12, the support bodies 3 are fixed to the support sections 12 by applying an adhesive 31 so as to be in contact with the mounting surface 11 a of the substrate 1 and the support bodies 3. . In order to ensure electrical insulation between the internal electrode 13 of the substrate 1 and the support 3, the adhesive 31 preferably has electrical insulation such as polyimide resin.

  Next, as shown in FIG. 10, the lens 4 having the curved surface portion is fixed to the curved surface portion of the support 3 by making point contact. In the present embodiment, since both the support 3 and the lens 4 are spherical, the support 3 and the lens 4 are brought into point contact with each other by disposing the lens 4 on the support 3 as it is. After disposing the lens 4 on the support 3, the lens 4 is fixed to the support 3 by applying an adhesive 41 so as to contact the curved surface portion of the support 3 and the curved surface portion of the lens 4.

  Next, as shown in FIG. 11, the second sealing resin 52 a is formed on the mounting surface 11 a of the substrate 1. By the second sealing resin 52a, the mounting surface 11a and the internal electrode 13 of the substrate 1, the optical semiconductor element 2, the support 3, the control circuit element 6 covered by the first sealing resin 51a, and the bonding wire 7 And everything is covered. The second sealing resin 52a is formed by molding.

  After the above steps, the optical semiconductor device A1 is manufactured by dividing the substrate 1 into pieces with a dicing saw (not shown).

  Next, the function and effect of the optical semiconductor device A1 will be described.

  According to the present embodiment, a plurality of support portions 12 made of through holes are formed in the substrate 1, and the support bodies 3 that are a plurality of spheres are fixed to the plurality of support portions 12 by engagement. The lens 4 is fixed to the support 3 by point contact with each other. Accordingly, the fixing positions of the support 3 and the lens 4 on the substrate 1 are uniquely and accurately determined. The optical semiconductor element 2 is mounted on the substrate 1 based on the result of image recognition of the positions and shapes of the plurality of support portions 12 on the substrate 1 by, for example, a computer. With this method, the mounting error in the horizontal direction, which is the direction along the mounting surface 11 a of the substrate 1 with respect to the center position of the lens 4, can be set to 10 μm or less for the optical semiconductor element 2 mounted on the substrate 1. Therefore, it is possible to minimize the mounting error of the optical semiconductor element 2 with respect to the center position of the lens 4 and to suppress a decrease in data transmission efficiency. The radial error with respect to the standard diameter of the support 3 is ± 1 μm (standard diameter 1 mm), and the radial error with respect to the standard diameter of the lens 4 is ± 2 μm (standard diameter 2 mm). The error is very small.

  In order to verify the effect of the optical semiconductor device A1 according to the present invention, optical wireless communication by a transmitting side Tx using the optical semiconductor element 2 that performs the light emitting function and a receiving side Rx using the optical semiconductor element 2 that performs the light receiving function. The amount of light received by the receiving side Rx in the state was analyzed.

  Based on FIG. 12, this analysis condition will be described. FIG. 12 shows only the substrate 1, the optical semiconductor element 2, the lens 4, and the sealing resin 5 in the optical semiconductor device A 1 for convenience of understanding. The output of the transmission side Tx was 1 mW. The distance D between the top surface of the lens 4 on the transmission side Tx and the top surface of the lens 4 on the reception side Rx was 10 mm. On the transmitting side Tx, the optical semiconductor element 2 mounted on the substrate 1 has no mounting error with respect to the central axis Ot of the lens 4 in the horizontal direction and the vertical direction perpendicular to the horizontal direction with respect to the central axis Ot. It was. On the receiving side Rx, the mounting error in the vertical direction of the separation distance between the optical functional region of the optical semiconductor element 2 and the top surface of the lens 4 is 30 μm toward the lens 4 in consideration of the actual manufacturing condition. It was supposed to be. For the optical semiconductor element 2 mounted on the substrate 1 on the receiving side Rx, a total of four cases of 0 μm (no error), 10 μm, 20 μm, and 50 μm were set as the horizontal mounting error Δl with respect to the central axis Or of the lens 4. . Further, it is assumed that the mounting error Δl occurs only in the left direction of FIG. 12 with respect to the central axis Or. Note that, as shown in FIG. 12, the mounting position of the optical semiconductor element 2 mounted on the substrate 1 on the receiving side Rx when there is no mounting error in both the horizontal direction and the vertical direction is indicated by an imaginary line.

  Based on FIG. 13, the results of this analysis will be described. The horizontal axis in FIG. 13 indicates the horizontal device lateral deviation ΔL (mm) between the central axes Ot and Or of the lenses 4 on the transmitting side Tx and the receiving side Rx of the optical semiconductor device A1. The device lateral deviation ΔL is positive in the right direction in FIG. 12 with respect to the center axis Ot of the lens 4 on the transmission side Tx. Further, the vertical axis in FIG. 13 indicates the amount of light received (dBm) of the optical semiconductor element 2 on the receiving side Rx. As shown in FIG. 13, the case where the mounting error Δl is 10 μm is substantially the same as the case of 0 μm. Further, the maximum received light amount on the receiving side Rx is about −5 dBm (= 0.316 mW) in the case where the mounting error Δl is 0 μm, and about −16 dBm (= 0.025 mW) in the case of 50 μm. Therefore, when the mounting error Δl is 50 μm, it can be said that the amount of received light is reduced to 1/10 or less compared to the case where the error does not occur. Further, when the device lateral deviation ΔL is −1 mm, the received light amount is about −7 dBm (= 0.2 mW) in the case where the mounting error Δl is 0 μm, about −10 dBm (= 0.1 mW) in the case of 10 μm, and 20 μm. In the case, it is about -14 dBm (= 0.04 mW). Therefore, if the mounting error Δl is 10 μm or less, it can be said that there is no significant reduction in data transmission efficiency due to the manufacturing error of the optical semiconductor device A1.

  Since the support part 12 of the board | substrate 1 is a hole which penetrates the board | substrate 1, the support part 12 can be formed easily. The support 3 is made of a material having a Young's modulus relatively larger than that of the lens 4 and a linear expansion coefficient relatively smaller than that of the lens 4, such as steel. Therefore, it is possible to prevent the fixing position of the lens 4 from being shifted due to elastic deformation or thermal expansion of the support 3 in the manufacturing process of the optical semiconductor device A1.

  14 to 20 show other embodiments of the present invention. In these drawings, the same or similar elements as those of the optical semiconductor device A1 described above are denoted by the same reference numerals, and redundant description is omitted.

[First Modification of First Embodiment]
An optical semiconductor device A11 according to a first modification of the first embodiment of the present invention will be described based on FIGS. 14, 15 and 16. FIG. FIG. 14 is a cross-sectional view showing the optical semiconductor device A11. 15 and 16 are cross-sectional views showing a method for manufacturing the optical semiconductor device A11.

  The optical semiconductor device A11 of this modification is different from the above-described optical semiconductor device A1 in the configuration of the sealing resin 5 and the manufacturing method thereof. In this modification, the sealing resin 5 includes a first sealing resin 51b, a second sealing resin 52b, and a third sealing resin 53 as shown in FIG. The first sealing resin 51b covers a part of the internal electrode 13 of the substrate 1 and the optical semiconductor element 2, and functions as an adhesive for fixing the support 3 to the support portion 12 of the substrate 1, respectively. Have. The first sealing resin 51b is translucent to light emitted from the transmission side Tx of the optical semiconductor device A11 or light incident on the reception side Rx of the optical semiconductor device A11. The second sealing resin 52 b covers the first sealing resin 51 b and has a function as an adhesive for fixing the lens 4 to the support 3. The second sealing resin 52b is a synthetic resin having translucency similar to the first sealing resin 51b. The third sealing resin 53 includes the mounting surface 11a and the internal electrode 13 of the substrate 1, the support 3, the side surfaces of the first sealing resin 51b and the second sealing resin 52b, the control circuit element 6, and bonding wires. 7 is covered. Unlike the first sealing resin 51b and the second sealing resin 52b, the third sealing resin 53 is a synthetic resin having a light shielding property.

  Although the sealing resin 5 of the optical semiconductor device A11 appears to be formed by the third sealing resin 53 having a light shielding property from the appearance, the first sealing resin 51b having a light transmitting property is provided inside. In addition, the second sealing resin 52 b is sandwiched between the optical semiconductor element 2 and the lens 4. Therefore, emission of light from the optical semiconductor element 2 via the lens 4 or incidence of light to the optical semiconductor element 2 is not hindered by the sealing resin 5.

  Next, a method for manufacturing the optical semiconductor device A11 will be described.

  After the internal electrode 13 is disposed on the mounting surface 11a of the substrate 1, the step of forming the support portion 12 is the same as the optical semiconductor device A1 shown in FIG. In addition, the process of embedding a metal (not shown) for forming the external electrode 14 on the substrate 1 in the base material 11 of the substrate 1 is the same as that of the optical semiconductor device A1.

  Next, the process of mounting the optical semiconductor element 2 and the control circuit element 6 on the internal electrode 13 of the substrate 1 by die bonding and the process of disposing the bonding wire 7 are the same as those of the optical semiconductor device A1 shown in FIG. It is. Subsequent processes are different from those of the optical semiconductor device A1.

  Next, as shown in FIG. 15, the supports 3 are respectively fixed to the support portions 12 of the substrate 1. After the support bodies 3 are arranged on the support portions 12, a first sealing resin 51 b that covers a part of the internal electrodes 13 of the substrate 1 and the optical semiconductor element 2 is formed. In the present modification, the first sealing resin 51b is formed by applying a molten synthetic resin on the mounting surface 11a of the substrate 1 and solidifying the synthetic resin. In forming the first sealing resin 51b, the synthetic resin is solidified so that the curved surface portion of the support 3 is exposed so that the top surface of the resin does not interfere with the bottom surface of the lens 4 (imaginary line in FIG. 15). . By forming the first sealing resin 51b, the support bodies 3 are fixed to the support portion 12, respectively.

  Next, as shown in FIG. 16, the lens 4 having the curved surface portion is fixed to the curved surface portion of the support 3 by making point contact. In the present modification, after the lens 4 is disposed on the support 3, a second sealing resin 52b that covers the first sealing resin 51b is formed. Similar to the first sealing resin 51b, the second sealing resin 52b is formed by applying a molten synthetic resin on the first sealing resin 51b and solidifying the synthetic resin. In the formation of the second sealing resin 52b, a space located between the optical semiconductor element 2 and the lens 4 and surrounded by the support 3 is a gap between the first sealing resin 51b and the second sealing resin 52b. To be filled without any problems. The lens 4 is fixed to the support 3 by forming the second sealing resin 52b.

  After the above steps, a third sealing resin 53 shown in FIG. 14 is formed on the mounting surface 11a of the substrate 1. By the third sealing resin 53, the mounting surface 11a and the internal electrode 13 of the substrate 1, the support 3, the side surfaces of the first sealing resin 51b and the second sealing resin 52b, the control circuit element 6, and the bonding wire 7 and all are covered. The third sealing resin 53 is formed by molding. After forming the third sealing resin 53, the optical semiconductor device A11 is manufactured by separating the substrate 1 into pieces by a dicing saw (not shown).

  Also according to this modification, the mounting error of the optical semiconductor element 2 with respect to the center position of the lens 4 can be reduced as much as possible, and a decrease in data transmission efficiency can be suppressed. Further, since the outer surface of the optical semiconductor device A11 is formed by the third sealing resin 53, an upright wall having light shielding properties is formed over the entire circumference of the optical semiconductor element 2. The upright wall can block light that should not be received, such as light traveling from the side of the optical semiconductor element 2. Therefore, it is possible to improve the light detection accuracy of the receiving side Rx using the optical semiconductor element 2 that performs the light receiving function in the optical semiconductor device A11.

[Second Modification of First Embodiment]
An optical semiconductor device A12 according to a second modification of the first embodiment of the present invention will be described based on FIGS. FIG. 17 is a cross-sectional view showing the optical semiconductor device A12. FIG. 18 is an enlarged cross-sectional view of a main part showing the optical semiconductor device A12.

  The optical semiconductor device A12 of this modification is different from the above-described optical semiconductor device A1 in the configuration of the support portion 12 of the substrate 1. As shown in FIG. 18, each support portion 12 is a recess formed on the mounting surface 11 a of the substrate 1. In this modification, the shape in the depth direction of each support portion 12 is circular, and the area of the shape is gradually reduced in the depth direction. Moreover, in this modification, the outer edge of the cross section along the said depth direction of each support part 12 is a circular arc, and the curvature of this circular arc and the curvature of the support body 3 correspond. Therefore, each of the support portion 12 and the support body 3 is in surface contact with each other over the entire support portion 12. In addition, the said depth direction view shape of each support part 12 can be made into polygons, such as a triangle, other than a circle. In addition, the area of the shape in the depth direction of the support portion 12 may be uniform over the depth direction.

  Also according to this modification, the mounting error of the optical semiconductor element 2 with respect to the center position of the lens 4 can be reduced as much as possible, and a decrease in data transmission efficiency can be suppressed. Each of the support portions 12 of the substrate 1 is a recess formed on the mounting surface 11 a of the substrate 1, and each of the support portion 12 and the support 3 is in surface contact with each other over the entire support portion 12. Yes. Therefore, when the adhesive 31 is applied to the support 12 and the support 3 in the step of fixing the support 3 to the support 12, the effect that the support 3 is difficult to roll is obtained. Furthermore, since the support portion 12 does not penetrate the substrate 1, the effective area of the mounting surface 11b of the substrate 1 is relatively enlarged as compared with the optical semiconductor device A1. Therefore, as shown in FIG. 17, the external electrode 14 can be arranged on the mounting surface 11b, and the mounting space of the optical semiconductor device A12 can be reduced.

[Second Embodiment]
Based on FIG. 19, an optical semiconductor device A2 according to a second embodiment of the present invention will be described. FIG. 19 is a plan view showing the optical semiconductor device A2. In FIG. 19, the sealing resin 5 is omitted for convenience of understanding. In the present embodiment, the optical semiconductor device A2 has a rectangular shape in plan view.

  The optical semiconductor device A2 of the present embodiment is different from the above-described optical semiconductor device A1 in the arrangement of the support portion 12 and the support 3 of the substrate 1. In the present embodiment, each of the supports 3 is a substrate so that the shape drawn by a line connecting the centers of the supports 3 (two-dot chain line shown in FIG. 19) is an isosceles triangle as shown in FIG. The first mounting surface 11a is spaced from each other. And the arrangement | positioning form of the support part 12 is set based on the arrangement | positioning form of the support body 3. FIG. The support 3 is three spheres as in the optical semiconductor device A1. Similarly, a total of three support portions 12 are formed.

  Also according to the present embodiment, it is possible to minimize the mounting error of the optical semiconductor element 2 with respect to the center position of the lens 4 and to suppress a decrease in data transmission efficiency. In addition, the arrangement form of the support portion 12 and the support body 3 of the substrate 1 is set so that the shape drawn by the line connecting the centers of the support bodies 3 is an isosceles triangle. Therefore, the entire area of the mounting surface 11a and the mounting surface 11b of the substrate 1 is relatively reduced as compared with the optical semiconductor device A1. Therefore, the optical semiconductor device A2 can be made compact.

[Third Embodiment]
Based on FIG. 20, an optical semiconductor device A3 according to a third embodiment of the present invention will be described. FIG. 20 is a plan view showing the optical semiconductor device A3. In FIG. 20, the sealing resin 5 is omitted for convenience of understanding. In the present embodiment, the optical semiconductor device A3 has a rectangular shape in plan view.

  The optical semiconductor device A3 of the present embodiment is different from the above-described optical semiconductor devices A1 and A2 in the arrangement form of the support portion 12 and the support body 3 of the substrate 1. In this embodiment, the support body 3 is four spheres as shown in FIG. Further, in the present embodiment, each of the supports 3 is mounted on the mounting surface 11a of the substrate 1 so that a shape drawn by a line connecting the centers of the supports 3 (two-dot chain line shown in FIG. 20) is a quadrangle. They are spaced apart from each other on the top. And the arrangement | positioning form of the support part 12 is set based on the arrangement | positioning form of the support body 3. FIG. Accordingly, in the present embodiment, a total of four support portions 12 are formed.

  Also according to the present embodiment, it is possible to minimize the mounting error of the optical semiconductor element 2 with respect to the center position of the lens 4 and to suppress a decrease in data transmission efficiency. In addition, the arrangement form of the support portion 12 and the support body 3 of the substrate 1 is set so that the shape drawn by a line connecting the centers of the support bodies 3 is a quadrangle. Therefore, when the lens 4 is fixed, the number of point contacts between the support 3 and the lens 4 may be larger than that of the optical semiconductor devices A1 and A2.

  The configuration of the support portion 12 of the substrate 1 in the present invention is not limited to a hole penetrating the substrate 1 or a recess formed in the mounting surface 11a of the substrate 1, and for example, a plurality of frames on the mounting surface 11a. The support portion 12 may be configured by providing a shape-like protrusion. The optical semiconductor device according to the present invention is not limited to the above-described embodiment. The specific configuration of each part of the optical semiconductor device according to the present invention can be modified in various ways.

A1, A11, A12, A2, A3: Optical semiconductor device 1: Substrate 11: Base material 11a: Mounting surface 11b: Mounting surface 12: Support part 13: Internal electrode 13a: First die pad 13b: Wire bonding pad 13c: Second Die pad 14: External electrode 2: Optical semiconductor element 21: Adhesive layer 3: Support 31: Adhesive 4: Lens 41: Adhesive 5: Sealing resin 51a, 51b: First sealing resin 52a, 52b: Second sealing Stop resin 53: Third sealing resin 6: Control circuit element 7: Bonding wire O: Center Tx: Transmission side Rx: Reception side D: Separation distance Ot, Or: Center axis Δl: Mounting error ΔL: Device lateral deviation

Claims (29)

A substrate having a mounting surface;
An optical semiconductor element mounted on the mounting surface of the substrate;
An optical semiconductor device comprising: a lens disposed in the same direction as the mounting surface of the substrate and having a curved surface portion;
A plurality of supports disposed on the mounting surface of the substrate and having a curved surface;
The plurality of supports are respectively fixed to a plurality of support portions formed on the substrate,
The optical semiconductor device, wherein the lens and the plurality of supports are in point contact with each other at each curved surface portion.   The optical semiconductor device according to claim 1, wherein each of the plurality of supports is a sphere.   The optical semiconductor device according to claim 1, wherein the lens is a sphere.   4. The optical semiconductor device according to claim 1, wherein each of the plurality of supports has a relatively smaller cross-sectional dimension than the lens.   5. The optical semiconductor device according to claim 1, wherein each of the plurality of supports is disposed apart from each other on the mounting surface of the substrate.   The plurality of supports are arranged on the mounting surface of the substrate so that a planar view shape drawn by a line connecting the centers of the plurality of supports is a polygon. The optical semiconductor device described.   The optical semiconductor device according to claim 6, wherein the polygon is a triangle.   The optical semiconductor device according to claim 7, wherein the triangle is an equilateral triangle.   The optical semiconductor device according to claim 7, wherein the triangle is an isosceles triangle.   The optical semiconductor device according to claim 6, wherein the polygon is a quadrangle.   The optical semiconductor device according to claim 1, wherein each of the plurality of supports has a relatively larger Young's modulus than the lens.   The optical semiconductor device according to claim 1, wherein each of the plurality of supports has a linear expansion coefficient relatively smaller than that of the lens.   The optical semiconductor device according to claim 1, wherein the plurality of support portions are holes penetrating the substrate.   13. The optical semiconductor device according to claim 1, wherein the plurality of support portions are concave portions formed on the mounting surface of the substrate.   The optical semiconductor device according to claim 13 or 14, wherein each of the plurality of support portions has a circular shape when viewed in the depth direction.   The optical semiconductor device according to claim 13 or 14, wherein each of the plurality of support portions has a polygonal shape when viewed in the depth direction.   The optical semiconductor device according to claim 16, wherein each of the plurality of support portions has a triangular shape when viewed in the depth direction.   18. The optical semiconductor device according to claim 13, wherein each of the plurality of support portions has an area in a depth direction view shape that is uniform over the depth direction.   18. The optical semiconductor device according to claim 13, wherein each of the plurality of support portions has an area as viewed in a depth direction, each of which changes over the depth direction.   The optical semiconductor device according to claim 1, further comprising a sealing resin that covers the substrate, the optical semiconductor element, and the support.   21. The optical semiconductor device according to claim 20, wherein the sealing resin includes a portion having a light shielding property.   The optical semiconductor device according to claim 1, further comprising a control circuit element covered with the sealing resin.   23. The optical semiconductor device according to claim 22, wherein the control circuit element is covered with the sealing resin having a light shielding property.   The optical semiconductor device according to any one of claims 1 to 23, wherein the substrate has a mounting surface facing a direction opposite to the mounting surface of the substrate, and further includes an external electrode disposed on the mounting surface. Forming a plurality of support portions for fixing a plurality of support bodies having curved surface portions on a substrate having a mounting surface;
Mounting an optical semiconductor element on the mounting surface of the substrate;
Fixing the plurality of supports to the plurality of support parts;
Fixing the lens by making point contact with the lens having the curved surface portion on the curved surface portion of the plurality of supports;
And a step of forming a sealing resin that covers the substrate, the optical semiconductor element, and the plurality of supports.   In the step of fixing the plurality of supports, the plurality of supports are fixed to the plurality of support portions by applying an adhesive so as to be in contact with the mounting surface of the substrate and the plurality of supports. 26. A method of manufacturing an optical semiconductor device according to claim 25.   In the step of fixing the plurality of supports, the plurality of the sealing resins having translucency are solidified so as to expose the curved surface portions of the plurality of supports from the sealing resin. 26. The method of manufacturing an optical semiconductor device according to claim 25, wherein the plurality of supports are fixed to a support portion of the optical semiconductor device.   26. In the step of fixing the lens, the lens is fixed to the plurality of supports by applying an adhesive so as to be in contact with the curved surface portion of the plurality of supports and the curved surface portion of the lens. 28. A method of manufacturing an optical semiconductor device according to any one of items 27 to 27.   28. The light according to claim 25, wherein in the step of fixing the lens, the lens is fixed to the plurality of supports by solidifying the melted translucent sealing resin. A method for manufacturing a semiconductor device.

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