JP2016121341A5 - - Google Patents
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- JP2016121341A5 JP2016121341A5 JP2015239317A JP2015239317A JP2016121341A5 JP 2016121341 A5 JP2016121341 A5 JP 2016121341A5 JP 2015239317 A JP2015239317 A JP 2015239317A JP 2015239317 A JP2015239317 A JP 2015239317A JP 2016121341 A5 JP2016121341 A5 JP 2016121341A5
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- JP
- Japan
- Prior art keywords
- heat conductive
- sheet
- conductive sheet
- molded body
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011231 conductive filler Substances 0.000 claims 11
- 239000003795 chemical substances by application Substances 0.000 claims 8
- 229920000049 Carbon (fiber) Polymers 0.000 claims 6
- 239000004917 carbon fiber Substances 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 6
- 239000011342 resin composition Substances 0.000 claims 6
- 239000011230 binding agent Substances 0.000 claims 5
- 238000003825 pressing Methods 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- 239000011256 inorganic filler Substances 0.000 claims 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims 4
- 239000002075 main ingredient Substances 0.000 claims 4
- 239000007788 liquid Substances 0.000 claims 2
- 229920001296 polysiloxane Polymers 0.000 claims 2
- 238000005520 cutting process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000002156 mixing Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Claims (12)
前記成型体をシート状に切断して、表面において前記熱伝導性フィラーが突出した成型体シートを得る成型体シート作製工程と、
前記成型体シートをプレスして、前記成型体シートの表面を、突出した前記熱伝導性フィラーによる凸形状を追従するように、前記成型体シートから滲み出した滲出成分により覆う、プレス工程とを含むことを特徴とする熱伝導シートの製造方法。 Molding a heat conductive resin composition containing a binder resin and a heat conductive filler into a predetermined shape and curing the molded body to obtain a molded body of the heat conductive resin composition; and
Cutting the molded body into a sheet shape, and a molded body sheet manufacturing step for obtaining a molded body sheet with the thermally conductive filler protruding on the surface;
Pressing the molded body sheet, and covering the surface of the molded body sheet with an exuding component that has exuded from the molded body sheet so as to follow the convex shape of the protruding thermal conductive filler. The manufacturing method of the heat conductive sheet characterized by including.
前記主剤と前記硬化剤との配合割合が、質量比で主剤：硬化剤＝３５：６５〜６５：３５である請求項１に記載の熱伝導シートの製造方法。 The binder resin contains a liquid silicone gel main ingredient and a curing agent,
The manufacturing method of the heat conductive sheet of Claim 1 whose compounding ratio of the said main ingredient and the said hardening | curing agent is main ingredient: hardening agent = 35: 65-65: 35 by mass ratio.
前記熱伝導性フィラーが、炭素繊維、及び無機物フィラーを含有し、
前記熱伝導シートにおいて、前記炭素繊維が、ランダムに配向している、請求項１から２のいずれかに記載の熱伝導シートの製造方法。 The molded body preparation step is performed by filling the thermally conductive resin composition in a hollow mold and thermally curing the thermally conductive resin composition,
The thermally conductive filler contains carbon fiber and an inorganic filler,
The method for producing a heat conductive sheet according to claim 1, wherein the carbon fibers are randomly oriented in the heat conductive sheet.
前記熱伝導性フィラーが、炭素繊維、及び無機物フィラーを含有し、
前記シート本体の表面が、突出した前記熱伝導性フィラーによる凸形状を追従するように、前記シート本体から滲み出した滲出成分で覆われていることを特徴とする熱伝導シート。 A heat conductive sheet having a sheet body formed by curing a heat conductive resin composition containing a binder resin and a heat conductive filler,
The thermally conductive filler contains carbon fiber and an inorganic filler,
The heat conductive sheet, wherein the surface of the sheet main body is covered with an exuding component that has exuded from the sheet main body so as to follow the convex shape of the protruding heat conductive filler.
前記バインダ樹脂が、液状シリコーンゲルの主剤と、硬化剤とを含有し、The binder resin contains a liquid silicone gel main ingredient and a curing agent,
前記主剤と前記硬化剤との配合割合が、質量比で主剤：硬化剤＝３５：６５〜６５：３５であり、The mixing ratio of the main agent and the curing agent is main agent: curing agent = 35: 65 to 65:35 in mass ratio,
前記シート本体の表面が、突出した前記熱伝導性フィラーによる凸形状を追従するように、前記シート本体から滲み出した滲出成分で覆われていることを特徴とする熱伝導シート。The heat conductive sheet, wherein the surface of the sheet main body is covered with an exuding component that has exuded from the sheet main body so as to follow the convex shape of the protruding heat conductive filler.
前記熱伝導シートが、請求項６から１１のいずれかに記載の熱伝導シートであることを特徴とする半導体装置。The semiconductor device according to claim 6, wherein the heat conductive sheet is the heat conductive sheet according to claim 6.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201580067250.XA CN107004651B (en) | 2014-12-25 | 2015-12-10 | Manufacturing method, thermally conductive sheet and the semiconductor device of thermally conductive sheet |
| PCT/JP2015/084665 WO2016104169A1 (en) | 2014-12-25 | 2015-12-10 | Method for producing heat-conductive sheet, heat-conductive sheet, and semiconductor device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014262740 | 2014-12-25 | ||
| JP2014262740 | 2014-12-25 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016121341A JP2016121341A (en) | 2016-07-07 |
| JP2016121341A5 true JP2016121341A5 (en) | 2016-08-18 |
| JP6178389B2 JP6178389B2 (en) | 2017-08-09 |
Family
ID=56327161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015239317A Active JP6178389B2 (en) | 2014-12-25 | 2015-12-08 | Method for manufacturing thermal conductive sheet, thermal conductive sheet, and semiconductor device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6178389B2 (en) |
| CN (1) | CN107004651B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7186788B2 (en) | 2018-06-08 | 2022-12-09 | シエナ コーポレーション | Dimensional transformation in optical communication |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6294951B2 (en) | 2016-01-26 | 2018-03-14 | デクセリアルズ株式会社 | HEAT CONDUCTIVE SHEET, HEAT CONDUCTIVE SHEET MANUFACTURING METHOD, HEAT DISSIBLING MEMBER AND SEMICONDUCTOR DEVICE |
| WO2017130740A1 (en) * | 2016-01-26 | 2017-08-03 | デクセリアルズ株式会社 | Thermally conductive sheet, production method for thermally conductive sheet, heat dissipation member, and semiconductor device |
| JP6753745B2 (en) * | 2016-09-12 | 2020-09-09 | デクセリアルズ株式会社 | Heat conduction sheet and semiconductor device |
| CN111480014B (en) * | 2017-12-15 | 2022-04-29 | 千住金属工业株式会社 | Sliding member and bearing |
| JP6739478B2 (en) * | 2018-07-18 | 2020-08-12 | デクセリアルズ株式会社 | Method for manufacturing heat conductive sheet |
| JP2020116873A (en) * | 2019-01-25 | 2020-08-06 | デクセリアルズ株式会社 | Manufacturing method of heat-conductive sheet |
| JP7384560B2 (en) | 2019-02-09 | 2023-11-21 | デクセリアルズ株式会社 | Thermal conductive sheets, mounting methods for thermal conductive sheets, manufacturing methods for electronic devices |
| WO2022085616A1 (en) * | 2020-10-20 | 2022-04-28 | デンカ株式会社 | Method for producing sheet |
| JP2021050350A (en) * | 2020-12-07 | 2021-04-01 | デクセリアルズ株式会社 | Thermally conductive sheet, method for producing the same, and method for mounting thermally conductive sheet |
| JP6999054B1 (en) | 2021-02-10 | 2022-01-18 | デクセリアルズ株式会社 | Supply form of heat conductive sheet and heat conductive sheet |
| WO2023189776A1 (en) * | 2022-03-29 | 2023-10-05 | 日東電工株式会社 | Temperature control module |
| US11615999B1 (en) | 2022-07-22 | 2023-03-28 | GuangDong Suqun New Material Co., Ltd | Oriented heat conducting sheet and preparation method thereof, and semiconductor heat dissipating device |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3182257B2 (en) * | 1993-02-02 | 2001-07-03 | 電気化学工業株式会社 | Heat dissipation sheet |
| JP3092699B2 (en) * | 1996-04-30 | 2000-09-25 | 電気化学工業株式会社 | Heat radiation spacer, its use and silicone composition |
| JP3434678B2 (en) * | 1997-09-12 | 2003-08-11 | 電気化学工業株式会社 | Rubber sheet manufacturing method |
| JP4101391B2 (en) * | 1999-03-31 | 2008-06-18 | 電気化学工業株式会社 | Heat dissipation member for electronic parts |
| JP5696325B2 (en) * | 2009-10-01 | 2015-04-08 | 日立化成株式会社 | Resin sheet, manufacturing method thereof, and thermal module using the same |
| US8808607B2 (en) * | 2010-06-17 | 2014-08-19 | Dexerials Corporation | Thermally conductive sheet and process for producing same |
| JP5740864B2 (en) * | 2010-08-03 | 2015-07-01 | 日立化成株式会社 | HEAT CONDUCTIVE SHEET, HEAT CONDUCTIVE SHEET MANUFACTURING METHOD, AND HEAT DISCHARGE DEVICE USING HEAT CONDUCTIVE SHEET |
| JP6034562B2 (en) * | 2011-12-20 | 2016-11-30 | デクセリアルズ株式会社 | Thermally conductive sheet and method for producing the thermally conductive sheet |
| EP2871205B1 (en) * | 2012-07-07 | 2020-08-26 | Dexerials Corporation | Method for producing thermally conductive sheet |
| JP6069112B2 (en) * | 2013-06-19 | 2017-02-01 | デクセリアルズ株式会社 | Thermally conductive sheet and method for producing the thermally conductive sheet |
| JP5752299B2 (en) * | 2013-07-01 | 2015-07-22 | デクセリアルズ株式会社 | Method for manufacturing heat conductive sheet, heat conductive sheet, and heat dissipation member |
-
2015
- 2015-12-08 JP JP2015239317A patent/JP6178389B2/en active Active
- 2015-12-10 CN CN201580067250.XA patent/CN107004651B/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7186788B2 (en) | 2018-06-08 | 2022-12-09 | シエナ コーポレーション | Dimensional transformation in optical communication |
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