JP2016117257A - Liquid discharge device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid discharge device capable of reducing the curvature of a wiring member without being enlarged.SOLUTION: A piezoelectric layer 42a and a piezoelectric layer 42b are arranged at an interval in a scanning direction on the upper surface of a diaphragm. The piezoelectric layers 42a and 42b are respectively covered with cover parts. The cover parts and the diaphragm form a groove 39. Electrodes 43a and 43b formed in the piezoelectric layers 42a and 42b are connected to bumps 63a, 63b, 64a, and 64b arranged nearer to parts of the cover part a side than a center position between the cover part a and the cover part b in the scanning direction in the upper surface of the diaphragm. A wiring member is joined to the parts of the upper surface of the diaphragm where the bumps 63a, 63b, 64a, and 64b are formed, pulled from the joined part with the diaphragm to the cover part b side in the scanning direction, and bent to the upper side to extend to the outside of the groove 39.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a liquid ejecting apparatus that ejects liquid from a nozzle.

  As a liquid ejecting apparatus that ejects liquid from a nozzle, Patent Document 1 describes an ink jet printer that ejects ink from a nozzle. In the ink jet printer described in Patent Document 1, a head unit that forms an ink jet head is formed by laminating a nozzle plate, a flow path forming substrate, an actuator unit, a sealing plate, and the like. The nozzle plate is bonded to the lower surface of the flow path forming substrate. A plurality of nozzles are formed on the nozzle plate, and the plurality of nozzles form two nozzle rows. In the flow path forming substrate, a plurality of pressure chambers are individually formed for a plurality of nozzles. The plurality of pressure chambers are arranged in two rows corresponding to the nozzle rows. The actuator unit has a diaphragm, a plurality of piezoelectric elements, and the like. The vibration plate covers a plurality of pressure chambers forming two rows of pressure chambers on the upper surface of the flow path substrate. The plurality of piezoelectric elements are individually provided for the plurality of pressure chambers, and are arranged in two rows corresponding to the pressure chambers on the upper surface of the diaphragm. The sealing plate is disposed on the upper surface of the diaphragm. The sealing plate has two portions that respectively cover a plurality of piezoelectric elements forming each piezoelectric element row. A groove is formed by these two portions and the diaphragm. Further, on the upper surface of the diaphragm, a lead electrode portion connected to the piezoelectric element and led out to a portion forming the wall surface of the groove is formed. The end of the lead electrode portion opposite to the piezoelectric element is connected to the wiring member. The wiring member is drawn upward from the connection portion with the lead electrode portion.

JP 2014-188717 A

  Here, in Patent Document 1, as described above, the wiring member is drawn upward from the connection portion with the lead electrode portion, but in order to pull out the wiring member in this way, the wiring member is directed upward. It needs to be curved. At this time, if the curvature of the curved portion of the wiring member is large, the wiring formed on the wiring member may be damaged. On the other hand, in order to reduce the curvature of the curved portion of the wiring member, it is conceivable to increase the interval between the two portions of the sealing plate. However, in this case, the interval between the two nozzle rows, the interval between the two pressure chamber rows, and the interval between the two piezoelectric element rows are increased, leading to an increase in the size of the head unit.

  An object of the present invention is to provide a liquid ejection apparatus capable of reducing the curvature of a wiring member as much as possible without increasing the size.

  The liquid ejection apparatus according to the present invention includes a channel substrate on which a first liquid channel, a second liquid channel aligned with the first liquid channel in a first direction, and one surface of the channel substrate The first piezoelectric element disposed corresponding to the first liquid flow path, and disposed on the one surface of the flow path substrate corresponding to the second flow path, the first piezoelectric element and the Second piezoelectric elements arranged at intervals in the first direction, and a first cover that is disposed on the one surface of the flow path substrate so as to cover the first piezoelectric element and protrudes from the one surface of the flow path substrate Disposed on the one surface of the flow path substrate so as to cover the portion and the second piezoelectric element, protrudes from the one surface of the flow path substrate, and is spaced from the first cover portion in the first direction. A second cover portion arranged side by side, the flow path substrate, the first cover portion, and the second cover on the one surface of the flow path substrate. A first connection terminal connected to the first piezoelectric element, and a wall surface of the groove on the one surface of the flow path substrate. A second connection terminal connected to the second piezoelectric element and a direction perpendicular to the one surface of the flow path substrate and spaced from the one surface of the flow path substrate. A circuit board, a flexible base, and a wiring member formed on the base and having a plurality of wirings connecting the first connection terminal and the second connection terminal to the circuit board, The first connection terminal and the second connection terminal are the center between the first cover part and the second cover part of the part that becomes the wall surface of the groove on the one surface of the flow path substrate. Disposed closer to the first cover part in the first direction than the position. The wiring member is pulled out in the first direction from the connection portion with the connection terminal toward the second cover portion, and extends to the outside of the groove.

  According to the present invention, the curvature of the wiring member is made smaller than when the first and second connection terminals are arranged at the center position between the first cover portion and the second cover portion on one surface of the flow path substrate. can do. Thereby, the wiring formed in the wiring member is not easily damaged. Or the space | interval of the 1st cover part required in order to make a wiring member into a certain curvature and a 2nd cover part can be made small, and a liquid discharge apparatus can be reduced in size.

1 is a schematic configuration diagram of a printer according to an embodiment of the present invention. It is a top view of the head unit of FIG. It is the figure which remove | excluded the cover member and the supply flow path formation member from FIG. FIG. 4 is a diagram in which a piezoelectric layer and a diaphragm are removed from FIG. 3. It is the VV sectional view taken on the line of FIG. It is a top view of the wiring member of the state extended. (A) is a sectional view taken along line VIIA-VIIA in FIG. 6, (b) is a sectional view taken along line VIIB-VIIB in FIG. 6, and (c) is a sectional view taken along line VIIC-VIIC in FIG. FIG. 6 is a diagram corresponding to FIG. FIG. 6 is a diagram corresponding to FIG. FIG. 6 is a diagram corresponding to FIG. FIG. 6 is a diagram corresponding to FIG. FIG. 10 is a diagram corresponding to FIG. FIG. 10 is a diagram corresponding to FIG. FIG. 10 is a diagram corresponding to FIG. 7A is a diagram corresponding to FIG. 7A of the modification 8, FIG. 7B is a diagram corresponding to FIG. 7B of the modification 8, and FIG. 7C is a diagram corresponding to FIG. FIG. 7A is a diagram corresponding to FIG. 7A of the modification 9, FIG. 7B is a diagram corresponding to FIG. 7B of the modification 9, and FIG. FIG. FIG. 10 is a diagram corresponding to FIG. FIG. 10 is a diagram corresponding to FIG. FIG. 10 is a diagram corresponding to FIG. FIG. 6 is a diagram corresponding to FIG.

  Hereinafter, preferred embodiments of the present invention will be described.

(Entire printer configuration)
As shown in FIG. 1, the printer 1 according to the present embodiment (the “liquid ejecting apparatus” of the present invention) includes a carriage 2, an inkjet head 3, a paper transport roller 4, and the like. The carriage 2 is supported by two guide rails 5 extending in the scanning direction, and reciprocates along the guide rail 5 in the scanning direction. In the following description, the right and left sides in the scanning direction are defined as shown in FIG. The inkjet head 3 has four head units 6 arranged in the scanning direction. The four head units 6 eject ink from a plurality of nozzles 15a and 15b formed on the lower surface thereof. More specifically, the four head units 6 eject black, yellow, cyan, and magenta inks from the one arranged on the right side in the scanning direction. The paper transport rollers 4 are disposed on both sides of the carriage 2 in the transport direction orthogonal to the scanning direction. The paper transport roller 4 transports the recording paper P in the transport direction.

  In the printer 1, the recording paper P is transported in the transport direction by the paper transport roller 4, and ink is ejected from the head unit 6 of the inkjet head 3 that reciprocates in the scanning direction together with the carriage 2. Print.

(Head unit)
Next, the head unit 6 that forms the inkjet head 3 will be described. 2 to 5, the head unit 6 includes a pressure chamber plate 31, a flow path forming member 32, a nozzle plate 33, a cover plate 34, a vibration plate 41, two piezoelectric layers 42a and 42b, a cover member 45, Two supply flow path members 46a and 46b are provided.

  In the pressure chamber plate 31, a plurality of pressure chambers 10a and 10b are formed. The plurality of pressure chambers 10a have a substantially elliptical planar shape with the scanning direction as a longitudinal direction, and are arranged at equal intervals in the transport direction to form a pressure chamber row 9a. The plurality of pressure chambers 10b have the same planar shape as the pressure chamber 10a, and are arranged at equal intervals in the transport direction to form a pressure chamber row 9b. Here, the pressure chamber row 9b is arranged on the right side of the pressure chamber row 9a with a space from the pressure chamber row 9a. Further, the plurality of pressure chambers 10a and the plurality of pressure chambers 10b are arranged so as to be shifted in the transport direction by a length that is half the interval between the pressure chambers 10a and 10b in each of the pressure chamber rows 9a and 9b.

  The flow path forming member 32 is joined to the lower surface of the pressure chamber plate 31. The flow path forming member 32 extends to the outside of the pressure chamber plate 31 on both sides in the scanning direction and both sides in the transport direction. In the flow path forming member 32, two manifold flow paths 11a and 11b, a plurality of ink flow paths 12a and 12b, a plurality of ink flow paths 13a and 13b, and two ink supply flow paths 14a and 14b are formed. Has been.

  The manifold channels 11 a and 11 b are formed in the lower part of the channel forming member 32 and open on the lower surface of the channel forming member 32. The manifold channel 11a extends in the transport direction over the entire length of the pressure chamber row 9a and overlaps the left end portions of the plurality of pressure chambers 10a forming the pressure chamber row 9a. The manifold channel 11a has a shorter length in the scanning direction as it approaches the tip at both ends in the transport direction. The manifold channel 11b extends in the transport direction over the entire length of the pressure chamber row 9b and overlaps the right end portions of the plurality of pressure chambers 10b forming the pressure chamber row 9b. The manifold channel 11b has a shorter length in the scanning direction as it approaches the tip at both ends in the transport direction.

  The plurality of ink flow paths 12a are individually provided for the plurality of pressure chambers 10a, overlap the left end portion of the pressure chamber 10a, and extend in the vertical direction. Thus, the ink flow path 12a is connected to the pressure chamber 10a at the upper end portion and is connected to the manifold flow path 11a at the lower end portion. The plurality of ink flow paths 12b are individually provided for the plurality of pressure chambers 10b, overlap the right end portion of the pressure chamber 10b, and extend in the vertical direction. As a result, the ink flow path 12b is connected to the pressure chamber 10b at the upper end and is connected to the manifold flow path 11b at the lower end.

  The plurality of ink flow paths 13a are individually provided for the plurality of pressure chambers 10a, overlap the right end portion of the plurality of pressure chambers 10a, and extend in the vertical direction. Accordingly, the ink flow path 13 a is connected to the pressure chamber 10 a at the upper end portion, and the lower end portion opens to the lower surface of the flow path forming member 32. The plurality of ink flow paths 13b are individually provided for the plurality of pressure chambers 10b, overlap the left end portions of the plurality of pressure chambers 10b, and extend in the vertical direction. Thereby, the ink flow path 13 b is connected to the pressure chamber 10 b at the upper end portion, and the lower end portion opens to the lower surface of the flow path forming member 32.

  The ink supply flow path 14a is disposed in a portion of the flow path forming member 32 that protrudes to the left in the scanning direction from the pressure chamber plate 31 and is located above the left end of the manifold flow path 11a. The ink supply channel 14a extends in the vertical direction and extends in the transport direction over substantially the entire length of the manifold channel 11a. Thus, the ink supply channel 14 a is connected to the manifold channel 11 a at the lower end portion, and the upper end portion opens at the upper surface of the channel forming member 32. The ink supply flow path 14b is disposed in a portion of the flow path forming member 32 that is located on the upper side of the right end portion of the manifold flow path 11b in a portion that protrudes from the pressure chamber plate 31 to the right in the scanning direction. The ink supply channel 14b extends in the vertical direction and extends in the transport direction over substantially the entire length of the manifold channel 11b. As a result, the ink supply channel 14 b is connected to the manifold channel 11 b at the lower end, and the upper end opens to the upper surface of the channel forming member 32.

  The nozzle plate 33 is bonded to the center of the lower surface of the flow path forming member 32 and closes the openings of the plurality of ink flow paths 13 a and 13 b on the lower surface of the flow path forming member 32. A plurality of nozzles 15 a and 15 b are formed on the nozzle plate 33. The plurality of nozzles 15a overlap with the plurality of ink flow paths 13a. Thus, each nozzle 15a communicates with the corresponding pressure chamber 10a via the ink flow path 13a. The plurality of nozzles 15b overlap the plurality of ink flow paths 13b. Thus, each nozzle 15b communicates with the corresponding pressure chamber 10a via the ink flow path 13b. The cover plate 34 is disposed on the lower surface of the flow path forming member 32 so as to surround the nozzle plate 33. The cover plate 34 closes the openings of the manifold channels 11 a and 11 b on the lower surface of the channel forming member 32.

  The diaphragm 41 is made of an insulating material, and continuously extends on the upper surface of the pressure chamber plate 31 across the plurality of pressure chambers 10a and 10b forming the pressure chamber rows 9a and 9b.

  In the present embodiment, the combination of the pressure chamber plate 31, the flow path forming member 32, the nozzle plate 33, the cover plate 34, and the vibration plate 41 corresponds to the flow path substrate according to the present invention. Further, the ink flow path including the plurality of pressure chambers 10a, the plurality of ink flow paths 12a and 13a, the manifold flow path 11a, the plurality of nozzles 15a, and the ink supply flow path 14a corresponds to the first liquid flow path of the present invention. To do. Further, the ink flow path including the plurality of pressure chambers 10b, the plurality of ink flow paths 12b and 13b, the manifold flow path 11b, the plurality of nozzles 15b, and the ink supply flow path 14b corresponds to the second liquid flow path of the present invention. To do. In the present embodiment, the first liquid channel and the second liquid channel are arranged in the scanning direction.

  The supply channel member 46a is disposed at the left end of the upper surface 41a of the diaphragm 41 (“one surface of the channel substrate” of the present invention). An ink flow path 47a is formed in the supply flow path member 46a. The ink flow path 47a overlaps with the ink supply flow path 14a and extends in the transport direction over the entire length of the ink supply flow path 14a. The ink flow path 47a extends in the vertical direction. Thereby, the ink flow path 47a is connected to the ink supply flow path 14a at the lower end. The ink flow path 47a is connected to an ink cartridge (not shown) through a tube (not shown) at the upper end.

  The supply flow path member 46 b is disposed at the right end portion of the upper surface 41 a of the vibration plate 41. An ink flow path 47b is formed in the supply flow path member 46b. The ink flow path 47b overlaps the ink supply flow path 14b and extends in the transport direction over the entire length of the ink supply flow path 14b. The ink flow path 47b extends in the vertical direction. Thereby, the ink flow path 47b is connected to the ink supply flow path 14b at the lower end. The ink flow path 47b is connected to an ink cartridge (not shown) through a tube (not shown) at the upper end.

  The piezoelectric layer 42 a is disposed on the upper surface 41 a of the vibration plate 41. The piezoelectric layer 42a extends in the transport direction over the entire length of the pressure chamber row 9a and overlaps the plurality of pressure chambers 10a. A plurality of individual electrodes 43a are formed on the lower surface of the piezoelectric layer 42a. The plurality of individual electrodes 43a are individually provided for the plurality of pressure chambers 10a, and overlap the central portion of the pressure chamber 10a. Either a ground potential or a predetermined drive potential (for example, about 20 V) is selectively applied to the plurality of individual electrodes 43a individually by a driver IC 85 described later. A common electrode 44a is formed on the upper surface of the piezoelectric layer 42a. The common electrode 44a extends over the entire upper surface of the piezoelectric layer 42a. The common electrode 44a is held at the ground potential. Corresponding to the arrangement of the plurality of individual electrodes 43a and the common electrode 44a, the portion sandwiched between the individual electrodes 43a and the common electrode 44a of the piezoelectric layer 42a is polarized in the thickness direction. Has been. In the present embodiment, a combination of the portion of the piezoelectric layer 42a and the common electrode 44a that overlaps each pressure chamber 10a and the individual electrode 43a corresponds to the first piezoelectric element according to the present invention. In the present embodiment, a plurality of first piezoelectric elements are arranged in the transport direction.

  The piezoelectric layer 42 b is disposed on the upper surface 41 a of the vibration plate 41. The piezoelectric layer 42b extends in the transport direction over the entire length of the pressure chamber row 9b and overlaps the plurality of pressure chambers 10b. Thereby, the piezoelectric layer 42b is aligned with the piezoelectric layer 42a at an interval in the scanning direction. A plurality of individual electrodes 43b are formed on the lower surface of the piezoelectric layer 42b. The plurality of individual electrodes 43b are individually provided for the plurality of pressure chambers 10b, and overlap the central portion of the pressure chamber 10b. Either the ground potential or the driving potential is selectively applied to the plurality of individual electrodes 43b individually by a driver IC 85 described later. A common electrode 44b is formed on the upper surface of the piezoelectric layer 42b. The common electrode 44b extends over the entire upper surface of the piezoelectric layer 42b. The common electrode 44b is held at the ground potential. Corresponding to the arrangement of the plurality of individual electrodes 43b and the common electrode 44b, the portion sandwiched between the individual electrodes 43b and the common electrode 44b of the piezoelectric layer 42b is polarized in the thickness direction. Has been. In the present embodiment, the combination of the piezoelectric layer 42b and the common electrode 44b that overlaps each pressure chamber 10a and the individual electrode 43b corresponds to the second piezoelectric element according to the present invention. In the present embodiment, a plurality of second piezoelectric elements are arranged in the transport direction.

  Here, a method of driving the head unit 6 to eject ink from the nozzles 15a and 15b will be described. In the head unit 6, all the individual electrodes 43a and 43b are previously held at the ground potential. In order to eject ink from a certain nozzle 15a, the potential of the individual electrode 43a corresponding to this nozzle 15a is switched from the ground potential to the drive potential. Then, due to the potential difference between the individual electrode 43a and the common electrode 44a, an electric field in the thickness direction parallel to the polarization direction is generated in a portion sandwiched between these electrodes of the piezoelectric layer 42a. Due to this electric field, the portion of the piezoelectric layer 42a sandwiched between these electrodes contracts in the plane direction perpendicular to the polarization direction. When the piezoelectric layer 42a contracts, the portion of the vibration plate 41 and the piezoelectric layer 42a that overlaps the pressure chamber 10a is deformed so as to protrude toward the pressure chamber 10a as a whole, and the volume of the pressure chamber 10a decreases. As a result, the pressure of the ink in the pressure chamber 10a increases, and ink is ejected from the nozzle 15a communicating with the pressure chamber 10a. Similarly to the above, when the potential of the individual electrode 43b corresponding to a certain nozzle 15b is switched from the ground potential to the driving potential, ink is ejected from the nozzle 15b.

  The cover member 45 is disposed on the upper surface 41 a of the diaphragm 41. The cover member 45 includes two cover portions 51a and 51b and two connecting portions 52a and 52b.

  The cover part 51a (the “first cover part” of the present invention) covers the piezoelectric layer 42a. If it demonstrates in detail, the cover part 51a is provided with the opposing part 51a1 and the two leg parts 51a2. The facing portion 51a1 is disposed above the piezoelectric layer 42a, away from the piezoelectric layer 42a, and extends in the scanning direction and the transport direction so as to overlap the entire piezoelectric layer 42a. Further, the facing portion 51a1 protrudes from the piezoelectric layer 42a on both sides in the scanning direction. The leg portion 51a2 extends downward from the lower surface of both end portions in the scanning direction of the facing portion 51a1, and is joined to the upper surface of the diaphragm 41 at the lower end portion. Moreover, each leg part 51a2 is extended in the conveyance direction over the full length of the opposing part 51a1. Accordingly, the piezoelectric layer 42a is covered with the cover portion 51a by being surrounded by the facing portion 51a1 and the two leg portions 51a2.

  The cover portion 51b (the “second cover portion” in the present invention) covers the piezoelectric layer 42b. If it demonstrates in detail, the cover part 51b is provided with the opposing part 51b1 and the two leg parts 51b2. The facing portion 51b1 is disposed above the piezoelectric layer 42b, away from the piezoelectric layer 42b, and extends in the scanning direction and the transport direction so as to overlap the entire piezoelectric layer 42b. The facing portion 51b1 protrudes from the piezoelectric layer 42b on both sides in the scanning direction. The leg portion 51b2 extends downward from the lower surface of both end portions in the scanning direction of the facing portion 51b1, and is joined to the upper surface of the diaphragm 41 at the lower end portion. Moreover, each leg part 51b2 is extended in the conveyance direction over the full length of the opposing part 51b1. Thereby, the piezoelectric layer 42b is covered with the cover part 51b by being surrounded by the opposing part 51b1 and the two leg parts 51b2.

  As shown in FIG. 2, the connecting portion 52a extends in the scanning direction and connects the end portions on the upstream side in the transport direction of the cover portion 51a and the cover portion 51b. The connecting portion 52b extends in the scanning direction and connects the end portions on the downstream side in the transport direction of the cover portion 51a and the cover portion 51b. In addition, the cover member 51 does not have the connection parts 52a and 52b, and the cover part 51 and the cover part 51b may be formed by separate members.

  Further, in the scanning direction, between the left end portion of the cover member 45 (left end portion of the cover portion 51a) and the supply flow path member 46a, and the right end portion of the cover member 45 (right end portion of the cover portion 51b), supply A gap exists between each of the flow path members 46b. Thus, for example, when the inkjet head 3 is manufactured, the cover member 45 is grasped from both sides in the scanning direction, and is formed by the vibration plate 41, the piezoelectric layers 42a and 42b, the electrodes 43a, 43b, 44a and 44b, and the cover member 45. Can be joined to the laminate formed by the pressure chamber plate 31, the flow path forming member 32, the nozzle plate 33, the cover plate 34, and the supply flow path members 46 and 46b.

  Here, the cover portions 51 a and 51 b arranged as described above protrude upward from the upper surface 41 a of the diaphragm 41. Moreover, the cover part 51a and the cover part 51b are arrange | positioned at intervals in the scanning direction. As a result, the head unit 6 is formed with a groove 39 that is surrounded by the cover portions 51 a and 51 b and the diaphragm 41 and opens upward.

  A plurality of individual lead wires 61a and 61b and two common lead wires 62a and 62b are disposed on the upper surface 41a of the diaphragm 41.

  As shown in FIG. 3, the plurality of individual lead wires 61a (the “first lead wire” of the present invention) are individually provided for the plurality of individual electrodes 43a. The plurality of individual lead-out wirings 61a are connected to the right end portion of the individual electrode 43a and extend to the right from the connection portion with the individual electrode 43a. The plurality of individual lead-out wirings 61a are positions on the left side of the center position T between the cover part 51a and the cover part 51b in the scanning direction (cover) in the part of the upper surface 41a of the diaphragm 41 where the groove 39 is formed. (Position close to the portion 51a). A bump 63a (the “first individual terminal” of the present invention) is formed at the tip of the individual lead-out wiring 61a. Further, the width (length in the transport direction) of the individual lead-out wiring 61a is Wh1.

  The plurality of individual lead wires 61b (the “second lead wire” of the present invention) are individually provided for the plurality of individual electrodes 43b. The plurality of individual lead wires 61b are connected to the left end portion of the individual electrode 43b and extend to the left from the connection portion with the individual electrode 43b. Further, the plurality of individual lead-out wirings 61b extend to a portion on the left side of the center position T between the cover portion 51a and the cover portion 51b in the scanning direction among the portions forming the groove 39 of the upper surface 41a of the vibration plate 41. ing. A bump 63b (the “second individual terminal” of the present invention) is formed at the tip of the individual lead-out wiring 61b. Further, the width (length in the transport direction) of the individual lead-out wiring 61b is the same Wh1 as that of the individual lead-out wiring 61a. By doing in this way, bump 63a, 63b is located in a line with the conveyance direction (arrangement direction of nozzle 10). The individual lead wires 61a and 61b may be formed integrally with the individual electrodes 43a and 43b, or may be drawn separately from the individual electrodes 43a and 43b.

  The common lead wire 62a is connected to the upstream end portion in the transport direction of the common electrode 44a. The common lead-out wiring 62a passes through the right side surface of the piezoelectric layer 42a, and covers the cover portion 51a in the scanning direction in the portion that forms the groove 39 of the upper surface 41a of the diaphragm 41 on the right side from the connection portion with the common electrode 44a. Extends to the left side of the center position T between the cover portion 51b and the cover portion 51b. A bump 64a is formed at the tip of the common lead wiring 62a. Further, the width of the common lead-out wiring 62a is Wh2 which is larger than the width Wh1 of the individual lead-out wirings 61a and 61b. In the present embodiment, a combination of the plurality of bumps 63a and the bumps 64a corresponds to the first connection terminal of the present invention.

  The common lead wire 62b is connected to the downstream end of the common electrode 44b in the transport direction. The common lead-out wiring 62b passes through the left side surface of the piezoelectric layer 42b, and is a cover portion in the traveling scanning direction among the portions forming the groove 39 of the upper surface 41a of the diaphragm 41 on the left side from the connection portion with the common electrode 44b. The center position T between 51a and the cover part 51b also extends to the left side. A bump 64b is formed at the tip of the common lead-out wiring 62b. Further, the width of the common lead-out wiring 62a is the same Wh2 as that of the common lead-out wiring 62a. In the present embodiment, a combination of the plurality of bumps 63b and the bumps 64b corresponds to the second connection terminal of the present invention.

(Circuit board, wiring member)
As shown in FIG. 5, a circuit board 71 is disposed above the head unit 6 with a space in the vertical direction from the head unit 6. The circuit board 71 is disposed on an upper surface 71b of a hard base 71a. A control circuit (not shown) for controlling a driver IC 85 to be described later is mounted. In the base material 71a, a through hole 71c extending in the transport direction is formed in a portion overlapping with a portion near the left end portion of the cover portion 51b.

  The plurality of bumps 63 a, 63 b, 64 a, and 64 b described above are connected to the circuit board 71 through the wiring member 72. As shown in FIGS. 6 and 7A to 7C, the wiring member 72 includes a base material 81, a plurality of individual wires 82a and 82b, two common wires 83a and 83b, and a plurality of individual wires 84a. , 84b. In FIG. 6, the wirings 82 a, 82 b, 83 a, 83 b, 84 a, and 84 b are hatched in order to make the arrangement of the wirings 82 a, 82 b, 83 a, 83 b, 84 a, and 84 b easier to see.

  The base material 81 is, for example, a film that is long in one direction and has flexibility. The base material 81 has a connecting portion 81a, a widened portion 81b, and a wide portion 81c. The connection part 81 a is a part including one end part in the longitudinal direction of the base material 81. The base material 81 is joined to the upper surface 41a of the vibration plate 41 at one end in the longitudinal direction of the base material 81 formed by the connection portion 81a. Further, the width (length in the transport direction) of the connecting portion 81a is Wc1. The widened portion 81 b is continuous with the connecting portion 81 a in the longitudinal direction of the base material 81. The widened portion 81b becomes wider in the longitudinal direction of the base material 81 as the distance from the connecting portion 81a increases. The wide portion 81c is connected to the opposite side of the widened portion 81b to the connecting portion 81a in the longitudinal direction of the base material 81. The width Wc2 of the wide part 81c is larger than the width Wc1 of the connection part 81a.

  The base material 81 is pulled out to the right side from the joint portion with the vibration plate 41, and is curved so as to be convex toward the cover portion 51b, and the upper side (in the direction perpendicular to the one surface of the flow path substrate of the present invention). It extends to the opposite side of the channel substrate ”). When the base material 81 is curved in this way, the joining surface of the lower surface 81d of the base material 81 at the joint portion with the vibration plate 41 with respect to the vibration plate 41 with respect to the upper surface 41a of the vibration plate 41. Even if the inclination is reduced, it is difficult to contact the cover 51b. And if this inclination is made small, joining to the diaphragm 41 of the base material 81 can be performed easily. The base material 81 extends so as to straddle the center position T between the cover part 51a and the cover part 51b in the scanning direction. Further, since the base material 81 is curved upward at the position T, the base material 81 is separated upward at the position T from the vibration plate 41. At this time, the base material 81 extends such that the curved portion overlaps the cover portion 51b in the vertical direction. At this time, the base material 81 is separated from the cover portion 51b. Furthermore, at this time, the base material 81 extends so that at least a portion having the largest curvature among the curved portions is positioned in the wide portion 81c. The base material 81 is drawn out to the upper surface of the circuit board 71 by being inserted into the through hole 71c at a portion in the vicinity of the end portion on the side opposite to the connection portion 81a in the longitudinal direction. The end of the base material 81 opposite to the connecting portion 81 a in the longitudinal direction is joined to the upper surface of the circuit board 71.

  Further, a driver IC 85 is mounted on the surface 81d of the base material 81 at a portion formed by the wide portion 81c. The driver IC 85 is for selectively applying either the ground potential or the driving potential to the individual electrodes 43a and 43b.

  As shown in FIGS. 6 and 7, the plurality of individual wirings 82 a are formed on the surface 81 d of the base material 81. The plurality of individual wires 82 a extend in the longitudinal direction of the base material 81. The plurality of individual wirings 82 a are connected to the plurality of bumps 63 a in the portion arranged at the joint portion of the base material 81 with the diaphragm 41. The plurality of individual wirings 82a are connected to the driver IC 85 at the end opposite to the connection to the bump 63a. Further, in the plurality of individual wirings 82a, the width Wk2 of the portion arranged in the wide portion 81c is wider than the width Wk1 of the portion arranged in the connection portion 81a. The height of the individual wiring 82a (the length in the direction orthogonal to the surface direction of the base material 81) is Hk.

  The plurality of individual wirings 82 b are formed on the surface 81 d of the base material 81. The plurality of individual wires 82 b extend in the longitudinal direction of the base material 81. The plurality of individual wirings 82 b are connected to the plurality of bumps 63 b at the portion disposed at the joint portion of the base material 81 with the diaphragm 41. The plurality of individual wirings 82b are connected to the driver IC 85 at the end opposite to the bumps 63b. Further, in the individual wiring 82b, as in the individual wiring 82a, the width Wk2 of the portion arranged in the wide portion 81c is wider than the width Wk1 of the portion arranged in the connecting portion 81a. In addition, the individual wiring 82b has a height of Hk, like the individual wiring 82a.

  As shown in FIG. 3, the common wiring 83a is disposed on the surface 81d of the base member 81 at a portion upstream of the plurality of individual wirings 82a and 82b in the transport direction. The common wiring 83a extends over the entire length of the base material 81 in the longitudinal direction. The common wiring 83a is connected to the bumps 64a at a portion where the common wiring 83a is disposed at a joint portion of the base member 81 with the diaphragm 41. The common wiring 83 a is connected to a control circuit mounted on the circuit board 71 at the other end of the base material 81 in the longitudinal direction.

  In the common wiring 83a, the width Ws2 of the portion arranged in the wide portion 81c is larger than the width Ws1 of the portion arranged in the connection portion 81a. Here, the common wiring 83a is wider than the individual wirings 82a and 82b. That is, the width Ws2 of the common wiring 83a is larger than the width Wk2 of the individual wirings 82a and 82b, and the width Ws1 of the common wiring 83a is wider than the width Wk1 of the individual wirings 82a and 82b. Further, the height Hs of the common wiring 83a is higher than the height Hk of the individual wirings 82a and 82b.

  The common wiring 83b is disposed on the surface 81d of the base material 81 at a portion downstream of the plurality of individual wirings 82a and 82b in the transport direction. The common wiring 83b extends over the entire length of the base material 81 in the longitudinal direction. The common wiring 83b is connected to the bumps 64b at a portion where the common wiring 83b is disposed at a joint portion of the base member 81 with the diaphragm 41. The common wiring 83 b is connected to a control circuit mounted on the circuit board 71 at the other end of the base material 81 in the longitudinal direction.

  Similarly to the common wiring 83a, the common wiring 83b has a width Ws1 of the portion disposed in the connection portion 81a and a width of the portion disposed in the wide portion 81c is Ws2 (> Ws1). ing. Accordingly, the common wiring 83b is wider than the individual wirings 82a and 82b, like the common wiring 83a. The height of the common wiring 83b is the same Hs as that of the common wiring 83a, and is higher than the height Hk of the individual wirings 82a and 82b.

  The plurality of individual wirings 84 a and 84 b are individually provided for the plurality of individual wirings 82 a and 82 b, and the portion of the surface 81 d of the base material 81 formed by the wide portion 81 c in the longitudinal direction of the base material 81. The driver IC 85 is disposed on the opposite side of the plurality of individual wires 82a and 82b. The plurality of individual wirings 84 a and 84 b extend in the longitudinal direction of the base material 81, one end is connected to the driver IC 85, and the other end is connected to a control circuit mounted on the circuit board 71. The widths of the individual wires 84a and 84b are the same as Wk2 which is the same as the width of the individual wires 82a and 82b in the wide portion 81c. The height of the individual wirings 84a and 84b is the same Hk as the height of the individual wirings 82a and 82b.

  Then, the plurality of individual wires 82a and 82b, the common wires 83a and 83b, and the plurality of individual wires 84a and 84b are arranged on the surface 81d of the substrate 81 in this way, so that the plurality of individual wires 82a and the plurality of individual wires are arranged. 82b, and a plurality of individual wires 84a and a plurality of individual wires 84b are alternately arranged in the transport direction. Further, in the transport direction, the common wiring 83a and the common wiring 83b sandwich the plurality of individual wirings 82a and 82b and the plurality of individual wirings 84a and 84b, respectively.

  According to the embodiment described above, among the portions forming the wall surface of the groove 39 of the upper surface 41a of the vibration plate 41, the position closer to the cover portion 51a than the center position T between the cover portion 51a and the cover portion 51b. Further, bumps 63a, 63b, 64a, 64b are arranged. The wiring member 72 is joined to the portion where the bumps 63a, 63b, 64a, 64b of the upper surface 41a of the diaphragm 41 are disposed. In addition, the wiring member 72 is drawn from the joint portion with the diaphragm 41 to the right side in the scanning direction toward the cover portion 51b, and extends to the circuit board 71 that is curved upward and disposed outside the groove 39. Yes. Thus, the bumps 63a, 63b, 64a, 64b are arranged at the center position T between the cover part 51a and the cover part 51b in the part of the upper surface 41a of the diaphragm 41 forming the wall surface of the groove 39. Compared to the case, the curvature of the wiring member 72 can be reduced to prevent the wiring member 72 from being damaged. Or the space | interval of the cover part 51a and the cover part 51b required in order to make it small to such an extent that the curvature of the wiring member 72 is not damaged can be made small. Thereby, the head unit 6 can be reduced in size in the scanning direction. Note that the bumps 63a, 63b, 64a, 64b are arranged at any position on the cover 51a side of the center position T between the cover 51a and the cover 51b on the upper surface 41a of the diaphragm 41. Although it is good, it is more preferable to arrange at a position close to the cover portion 51a in the region between the center position T and the cover portion 51a.

  At this time, since the wiring member 72 extends in the scanning direction across the center position T between the cover portion 51a and the cover portion 51b, the curvature of the wiring member 72 can be reliably reduced.

  Further, at this time, the wiring member 72 extends so as to overlap with the cover portion 51b when viewed from the up-down direction. Thereby, the curvature of the wiring member 72 can be made small compared with the case where the wiring member 72 is extended only in the range between the cover part 51a and the cover part 51b in the scanning direction.

  Moreover, in this Embodiment, the wiring member 72 is extended so that it may not contact the cover part 51b. Thereby, damage to the wiring 82a, 82b, 83a, 83b, 84a, 84b due to the contact of the wiring member 72 with the cover portion 51b can be prevented.

  In the present embodiment, the widths of the common wires 83a and 83b are wider than the individual wires 82a, 82b, 84a, and 84b (Ws1> Wk1, Ws2> Wk2), and the heights of the common wires 83a and 83b are It is higher than the height of the individual wirings 82a, 82b, 84a, 84b (Hs> Hk). Thereby, even if the wiring member 72 contacts the cover portion 51b, the common wires 83a and 83b are likely to contact the cover portion 51b, and are difficult to contact the individual wires 82a, 82b, 84a, and 84b. Thereby, it is possible to prevent the narrow individual wires 82a, 82b, 84a, 84b from coming into contact with the cover portion 51b and being damaged. Since the common wires 83a and 83b are wider than the individual wires 82a, 82b, 84a, and 84b, they are not easily damaged even if they come into contact with the cover portion 51b.

  In the present embodiment, the base member 81 of the wiring member 72 has a connection part 81a joined to the diaphragm 41 and a wide part 81c wider than the connection part 81a. And the part arrange | positioned at the wide part 81c of wiring 82a, 82b, 83a, 83b, 84a, 84b is wider than the part arrange | positioned at the connection part 81a. On the other hand, the part with the largest curvature of the base material 81 is located in the wide part 81c. Thereby, it is possible to prevent the wires 82a, 82b, 83a, 83b from being damaged by the bending of the wiring member 72.

  Next, modified examples in which various changes are made to the present embodiment will be described.

  When the bumps 63 a, 63 b, 64 a, and 64 are connected to the circuit board 71 by the wiring member 72 as in the above-described embodiment, when the external force is applied to the wiring member 72, the wiring member 72 is detached from the diaphragm 41. There is a risk of peeling. Therefore, a configuration for preventing the wiring member 72 from peeling off may be provided.

  For example, in Modification 1, as shown in FIG. 8, the wiring member 72 is fixed to the cover portion 51 b by the insulating adhesive 101 at a portion closest to the cover portion 51 b and its peripheral portion. In the first modification, the wiring member 72 and the cover portion 51b are not in contact with each other as in the above-described embodiment. In this case, since the wiring member 72 is fixed to the cover portion 51b, it is possible to prevent the wiring member 72 from being detached from the diaphragm 41 when an external force is applied to the wiring member 72.

  In the second modification, as shown in FIG. 9, the wiring member 72 is in contact with the upper left corner 51b3 of the cover 51b. Moreover, in the modification 3, as shown in FIG. 10, the corner | angular part 51b3 of the wiring member 72 of the cover part 51b is chamfered. The wiring member 72 is in contact with the chamfered corner portion 51b3 of the cover portion 51b.

  In the modified examples 2 and 3, the wiring member 72 is supported by the cover part 51b because the wiring member 72 is in contact with the corner part 51b3 of the cover part 51b. Thereby, when an external force is applied to the wiring member 72, it is difficult to apply a force to the joint portion of the wiring member 72 with the vibration plate 41, and the wiring member 72 can be prevented from being peeled off from the vibration plate 41.

  In the second modification, the corner portion 51b3 of the cover portion 51b with which the wiring member 72 comes into contact is not chamfered. Therefore, when the wiring member 72 comes into contact with the cover portion 51b, the wires 82a, 82b, 83a, 83b, and 84a. 84b may be damaged. On the other hand, in the modified example 3, since the corner portion 51b3 of the cover portion 51b with which the wiring member 72 contacts is chamfered, the wiring 82a, 82b, 83a, and the like due to the wiring member 72 contacting the cover portion 51b. Damage to 83b, 84a, and 84b can be prevented.

  Further, as in Modifications 2 and 3, even when the wiring member 72 is in contact with the cover part 51b, the wiring member 72 may be fixed to the cover part 51b as in Modification 1.

  In the fourth modification, the driver IC 85 is in contact with the heat sink 102 as shown in FIG. The heat sink 102 is attached to a frame (not shown) provided on the carriage 2. In this case, the heat generated in the driver IC 85 can be efficiently released via the heat sink 102. In this case, the portion of the wiring member 72 where the driver IC 85 is mounted is supported by the heat sink 102. Thus, when an external force in the scanning direction is applied to the portion around the driver IC 85 of the wiring member 72, the force is less likely to act on the joint portion of the wiring member 72 with the diaphragm 41. On the other hand, since the heat sink is arranged on the right side in the scanning direction of the portion where the driver IC 85 of the wiring member 72 is mounted, another member contacts the portion of the wiring member 72 where the driver IC 85 is mounted from the right side. It is unlikely that external force is applied. For these reasons, it is possible to prevent the wiring member 72 from being peeled off from the diaphragm 41.

  In the fourth modification, the heat sink 102 for releasing heat generated in the driver IC 85 supports a portion located between the joint portion of the wiring member 72 and the vibration plate 41 and the connection portion with the circuit board 71. However, it is not limited to this. The wiring member 72 may be supported by a dedicated support member or the like other than the heat sink. In this case, the support member is a portion where the driver IC 85 is mounted among the portions between the joint portion of the wiring member 72 with the diaphragm 41 and the joint portion with the circuit board 71. It may support a different part.

  Moreover, in the modification 5, as shown in FIG. 12, the edge part 81e by the side of the connection part 81a in the elongate direction of the base material 81 of the wiring member 72 is contacting the leg part 51a2 on the right side of the cover part 51a. . In this case, when the joint portion of the wiring member 72 with the vibration plate 41 is about to move upward away from the vibration plate 41, the joint portion of the wiring member 72 with the vibration plate 41 is the end of the base material 81. The upward movement is hindered by the frictional force between the part 81e and the leg part 51a2 of the cover part 51a. Thereby, it is possible to prevent the wiring member 72 from being peeled off from the vibration plate 41.

  Moreover, in the modification 6, as shown in FIG. 13, the edge part 81e by the side of the connection part 81a in the elongate direction of the base material 81 of the wiring member 72 is made into the leg part 51a2 on the right side of the cover part 51a with the adhesive agent 103. It is fixed. Also in this case, it is possible to prevent the wiring member 72 from being detached from the diaphragm 41 when an external force is generated in the wiring member 72.

  In the modified example 6, the end portion 81e of the base material 81 is separated from the right leg portion 51a2 of the cover portion 51a. However, the end portion 81e of the base material 81 is covered with the adhesive 103 and the right leg portion of the cover portion 51a. Even in the case of being fixed to 51a2, as in the fifth modification, the end portion 81e of the base material 81 may be in contact with the right leg portion 51a2 of the cover portion 51a.

  In addition, the method of fixing the cover portions 51a and 51b of the wiring member 72 is not limited to the above-described modified examples 1 and 6. In the modified example 7, as shown in FIG. 14, the wiring member 72 is fixed to the cover portions 51a and 51b by filling the entire groove 39 with a resin material. Even in this case, it is possible to prevent the wiring member 72 from being detached from the diaphragm 41 when an external force is applied to the wiring member 72.

  In the above-described embodiment, the individual wiring 82a and the individual wiring 82b have the same width (Wk1, Wk2). However, the present invention is not limited to this. In Modification 8, as shown in FIGS. 15A to 15C, the width of the individual wiring 82b is wider than the width of the individual wiring 82a. That is, the width Wk3 of the individual wiring 82b in the connection portion 81a is wider than the width Wk1 of the individual wiring 82a in the connection portion 81a. Further, the width Wk4 of the individual wiring 82b in the wide part 81c is wider than the width Wk2 of the individual wiring 82a in the wide part 81c. However, the width Wk3 is narrower than the width Ws1 of the common wires 83a and 83b in the connection portion 81a, and the width Wk4 is narrower than the width Ws2 of the common wires 83a and 83b in the wide portion 81c. The widths of the individual wirings 84a and 84b are both Wk2 as in the above-described embodiment. In the modification 8, the individual wiring 82a corresponds to the first individual wiring of the present invention, and the individual wiring 82b corresponds to the second individual wiring of the present invention.

  Here, in the above-described embodiment, the plurality of bumps 63a and 63b are covered from the center position T between the cover portion 51a and the cover portion 51b in the portion forming the wall surface of the groove 39 of the diaphragm 41. It arrange | positions in the part which shifted | deviated to the part 51a side. For this reason, the length of the individual lead-out wiring 61b is longer than the length of the individual lead-out wiring 61a. On the other hand, in the above-described embodiment, the individual lead-out wiring 61a and the individual lead-out wiring 61b have the same width Wh1. For these reasons, the individual lead-out wiring 61b has a larger electrical resistance than the individual lead-out wiring 61a.

  Therefore, in the modified example 8, as described above, the width of the individual wiring 82b connected to the individual extraction wiring 61b is made wider than the width of the individual wiring 82a connected to the individual extraction wiring 61a. As a result, the individual wiring 82b has a smaller electrical resistance than the individual wiring 82a. As a result, the electrical resistance of the entire wiring connecting the driver IC 85 and the individual electrode 43a and the electrical resistance of the entire wiring connecting the driver IC 85 and the individual electrode 43b can be made uniform.

  In Modification 9, as shown in FIGS. 16A to 16C, the height Hk2 of the individual wiring 82b is higher than the height Hk1 of the individual wiring 82a. However, the height Hk2 of the individual wiring 82b is lower than the height Hs of the common wirings 83a and 83b.

  Here, in the above-described embodiment, as described above, the individual lead-out wiring 61b has a larger electrical resistance than the individual lead-out wiring 61a. Therefore, in the modified example 9, as described above, the height Hk2 of the individual wiring 82b connected to the individual extraction wiring 61b is set higher than the height Hk1 of the individual wiring 82a connected to the individual extraction wiring 61a. . As a result, the individual wiring 82b has a smaller electrical resistance than the individual wiring 82a. As a result, the electrical resistance of the entire wiring connecting the driver IC 85 and the individual electrode 43a and the electrical resistance of the entire wiring connecting the driver IC 85 and the individual electrode 43b can be made uniform.

  In the above-described embodiment, the individual lead-out wiring 61a and the individual lead-out wiring 61b have the same width Wk1, but the present invention is not limited to this. In Modification 10, as shown in FIG. 17, the width Wh3 of the individual lead-out wiring 61b is wider than the width Wh1 of the individual lead-out wiring 61a.

  Since the width Wh3 of the individual lead-out wiring 61b is wider than the width Wh1 of the individual lead-out wiring 61a, the individual lead-out wiring 61b has a smaller electrical resistance per unit length than the individual lead-out wiring 61a. Therefore, as described above, even when the length of the individual lead-out wiring 61b is longer than the length of the individual lead-out wiring 61a, the electrical resistance of the individual lead-out wiring 61a and the electrical resistance of the individual lead-out wiring 61b are made uniform. Can do.

  Further, in the modified example 10, by making the width Wh3 of the individual lead-out wiring 61b wider than the width Wh1 of the individual lead-out wiring 61a, the electrical resistance per unit length of the individual lead-out wiring 61b is reduced to the unit length of the individual lead-out wiring 61a. Although it is smaller than the internal resistance, it is not limited to this. For example, the unit length of the individual lead-out wiring 61b is made by making the height of the individual lead-out wiring 61b higher than the height of the individual lead-out wiring 61a or by making the material different between the individual lead-out wiring 61a and the individual lead-out wiring 61b. The electrical resistance per unit may be smaller than the electrical resistance per unit length of the individual lead-out wiring 61a.

  In the above-described embodiment, the common wirings 83a and 83b have the same height Hs, which is higher than the height Hk1 of the individual wirings 82a, 82b, 84a, and 84b. However, the present invention is not limited to this. . For example, the height Hs of the common wires 83a and 83b may be the same as the height Hk1 of the individual wires 82a, 82b, 84a, and 84b.

  Moreover, in the above-mentioned embodiment, although the part with the largest curvature of the base material 81 was located in the wide part 81c, it is not restricted to this. For example, the part with the largest curvature of the base material 81 may be located in the connection part 81a or the wide part 81b.

  Moreover, the base material 81 is not restricted to having the wide part 81b and the wide part 81c. The substrate 81 may extend in the longitudinal direction with a certain width.

  In the above-described embodiment, the wirings 82a, 82b, 83a, 83b, 84a, and 84b formed on the surface 81d of the base material 81 are exposed, but the present invention is not limited to this. A cover film or the like covering the wirings 82a, 82b, 83a, 83b, 84a, 84b may be provided on the surface 81d of the base material 81. At this time, the cover film is not limited to extending over the entire surface 81 d of the base material 81, and may be disposed only on a part of the surface 81 d of the base material 81. In this case, from the viewpoint of preventing the wires 82a, 82b, 83a, 83b, 84a, and 84b from being damaged due to contact with the cover portion 51b, the cover film includes at least the cover portion of the surface 81d of the substrate 81. It is preferable that they are arranged in the portion closest to 51b and the peripheral portion thereof.

  Further, in the above-described embodiment, the wiring member 72 extends so that at least a part of the curved portion overlaps the cover portion 51b when viewed in the vertical direction, but is not limited thereto. In the modification 11, as shown in FIG. 18, the wiring member 72 is curved only in the range between the cover part 51a and the cover part 51b in the scanning direction, and does not overlap the cover part 51b. Even in this case, the portion where the bumps 63a, 63b, 64a, 64b form the wall surface of the groove 39 on the upper surface of the diaphragm 41 is located at the center position T between the cover portion 51a and the cover portion 51b. The curvature of the wiring member 72 can be reduced as compared with the case where the wiring member 72 is disposed.

  In the above-described embodiment, the piezoelectric layer 42a continuously extends over the plurality of pressure chambers 10a forming the pressure chamber row 9a, and the piezoelectric layer 42b has a plurality of pressure chambers forming the pressure chamber row 9b. Although it extended continuously over 10b, it is not restricted to this.

  In Modification 12, as shown in FIG. 19, slits 104a extending in the scanning direction are formed in portions of the piezoelectric layer 42a located on both sides of each pressure chamber 10a in the transport direction. In addition, slits 104b extending in the scanning direction are formed in portions of the piezoelectric layer 42b located on both sides of each pressure chamber 10b in the transport direction. In this case, the deformation of the portion of the piezoelectric layer 42a and the diaphragm 41 that overlaps the pressure chamber 10a reduces crosstalk that affects the deformation of the piezoelectric layer 42a and the portion of the diaphragm 41 that overlaps the adjacent pressure chamber 10a. can do. Similarly, the deformation of the portion that overlaps the pressure chamber 10b with the piezoelectric layer 42b and the vibration plate 41 reduces crosstalk that affects the deformation of the portion of the piezoelectric layer 42b and the vibration plate 41 that overlaps the adjacent pressure chamber 10b. Can do.

  Moreover, in the above-mentioned embodiment and the said modification 12, although the piezoelectric layers 42a and 43a each have a part which forms a some piezoelectric element, it is not restricted to this. For example, a piezoelectric body for forming a piezoelectric element may be individually disposed on a portion of the upper surface of the vibration plate 41 that overlaps each pressure chamber 10.

  Further, in the above-described embodiment, the wiring member 72 is drawn out from the connection portion with the bumps 63a, 63b, 64a, and 64b to the cover portion 51b side in the scanning direction and is curved so as to be convex toward the cover portion 51b side. However, it is not limited to this. In Modification 13, as shown in FIG. 20, the wiring member 72 is curved and extends upward so as to be convex on the side opposite to the cover portion 51a. When the wiring member 72 is arranged in this way, the surface of the upper surface 41a of the diaphragm 41 at the end of the wiring member 72 on the connection side with the bumps 63a, 63b, 64a, 64b as compared with the above-described embodiment. The inclination with respect to the direction increases. Therefore, in the modified example 20, as shown in FIG. 20, the end portion of the inclined wiring member 72 is fixed to the diaphragm 41 with an adhesive 111. Further, the end portion of the wiring member 72 opposite to the connection portion with the bumps 63a, 63b, 64a, 64b is joined to the lower surface 71d of the base material 71a. In this case, for example, a plurality of connection terminals for connecting to the wiring member 71 are formed on the lower surface 71d of the base material 71a, and these connection terminals serve as through holes formed in the base material 71a. And a control circuit formed on the upper surface 71b of the base material 71a.

  Moreover, although the example which applied this invention to the inkjet printer which discharges an ink from a nozzle was demonstrated above, it is not restricted to this. The present invention can also be applied to another liquid ejecting apparatus that ejects liquid other than ink from the nozzles.

DESCRIPTION OF SYMBOLS 1 Inkjet printer 31 Pressure chamber plate 32 Channel formation member 33 Nozzle plate 10a, 10b Pressure chamber 12a, 12b, 13a, 13b Ink channel 14 Ink supply channel 15a, 15b Nozzle 39 Groove 41 Vibration plate 42a, 42b Piezoelectric layer 43a , 43b Individual electrode 44a, 44b Common electrode 51a, 51b Cover portion 51b3 Corner portion 61a, 61b Individual lead wire 62a, 62b Common lead wire 63a, 63b, 64a, 64b Bump 71 Circuit board 72 Wiring member 81 Base material 82a, 82b Individual Wiring 83a, 83b Common wiring

Claims (15)

A flow path substrate on which a first liquid flow path and a second liquid flow path aligned in the first direction with the first liquid flow path are formed;
A first piezoelectric element disposed on one surface of the flow path substrate in correspondence with the first liquid flow path;
A second piezoelectric element disposed on the one surface of the flow path substrate in correspondence with the second flow path, and arranged in a row in the first direction with the first piezoelectric element;
A first cover portion disposed on the one surface of the flow path substrate so as to cover the first piezoelectric element, and protruding from the one surface of the flow path substrate;
The second piezoelectric element is disposed on the one surface of the flow path substrate so as to cover the second piezoelectric element, protrudes from the one surface of the flow path substrate, and is arranged with an interval in the first direction with the first cover portion. A cover part;
The first piezoelectric element is disposed on a portion of the one surface of the flow path substrate that becomes a wall surface of a groove formed by being surrounded by the flow path substrate, the first cover portion, and the second cover portion. A first connection terminal connected to
A second connection terminal disposed on a portion of the one surface of the flow path substrate that serves as a wall surface of the groove and connected to the second piezoelectric element;
A circuit board disposed at a distance from the one surface of the flow path substrate in a direction perpendicular to the one surface of the flow path substrate;
A flexible base material, and a wiring member formed on the base material and having a plurality of wirings connecting the first connection terminal and the second connection terminal and the circuit board,
The first connection terminal and the second connection terminal are located more than the center position between the first cover part and the second cover part of the part of the flow path substrate that becomes the wall surface of the groove. , Disposed in a portion close to the first cover portion in the first direction,
The liquid ejecting apparatus according to claim 1, wherein the wiring member is pulled out in the first direction from a connection portion with the connection terminal toward the second cover portion and extends to the outside of the groove. The wiring member is
Having the substrate in film form,
From the connection portion between the first connection terminal and the second connection terminal, it is pulled out in the first direction toward the second cover portion, and is curved so as to protrude toward the second cover portion, The liquid ejection device according to claim 1, wherein the liquid ejection device extends to a side opposite to the flow path substrate in a direction orthogonal to one surface.   3. The liquid ejection according to claim 2, wherein the curved portion of the wiring member extends so as to straddle the center position between the first cover portion and the second cover portion in the first direction. apparatus.   The at least part of the curved part of the said wiring member has overlapped with the said 2nd cover part seeing from the direction orthogonal to the said one surface of the said flow-path board | substrate, The Claim 2 or 3 characterized by the above-mentioned. Liquid ejection device.   The liquid ejection apparatus according to claim 1, wherein the wiring member is separated from the second cover portion.   The liquid ejection apparatus according to claim 1, wherein the wiring member is in contact with the second cover portion. The second cover part has a corner at an end on the first cover part side,
The wiring member is in contact with the corner portion of the second cover portion,
The liquid ejecting apparatus according to claim 6, wherein the corner portion of the second cover portion is chamfered.   The liquid ejection apparatus according to claim 1, wherein the wiring member is fixed to the second cover portion.   The liquid ejection apparatus according to claim 1, further comprising a support member that is disposed between the second cover portion and the circuit board and supports the wiring member. The wiring member is
A portion closer to the circuit board than a connection portion with the connection terminal, and having a wide portion wider than a connection portion with the connection terminal;
In the wide portion, the width of the wiring is larger than the connection portion with the connection terminal,
The portion of the wiring member between the connection portion with the connection terminal and the connection portion with the circuit board is located in the wide portion, the portion having the largest curvature. Item 10. The liquid ejection device according to any one of Items 1 to 9.   11. The end of the wiring member closer to the connection portion with the connection terminal is in contact with the end surface of the first cover portion on the second cover portion side. The liquid ejection device according to any one of the above.   The liquid ejection device according to claim 1, wherein an end portion of the wiring member that is closer to a connection portion with the connection terminal is fixed to the first cover portion. A plurality of the first piezoelectric elements arranged in a second direction orthogonal to the first direction;
A plurality of the second piezoelectric elements arranged in the second direction,
The wiring member is
A plurality of individual wirings individually provided for the plurality of first piezoelectric elements and the plurality of second piezoelectric elements and arranged in the second direction;
A first common wiring provided in common to the plurality of first piezoelectric elements;
A second common wiring provided in common to the plurality of second piezoelectric elements,
The first common wiring and the second common wiring are arranged so as to sandwich the plurality of individual wirings from the second direction,
The liquid ejecting apparatus according to claim 1, wherein the first common wiring and the second common wiring have a width and thickness larger than the individual wiring. A plurality of the first piezoelectric elements;
A plurality of the second piezoelectric elements,
The connection terminal is
A plurality of first individual terminals individually provided for the plurality of first piezoelectric elements;
A plurality of second individual terminals individually provided for the plurality of second piezoelectric elements,
A plurality of first lead wires connecting the plurality of first piezoelectric elements and the plurality of first individual terminals;
A plurality of second lead wires connecting the plurality of second piezoelectric elements and the plurality of second individual terminals; and
The wiring member is
A plurality of first individual wires connected to the plurality of first connection terminals;
A plurality of second individual wirings connected to the plurality of second connection terminals,
The liquid ejection apparatus according to claim 1, wherein the first individual wiring has an electric resistance larger than that of the second individual wiring. A plurality of the first piezoelectric elements;
A plurality of the second piezoelectric elements,
The connection terminal is
A plurality of first individual terminals individually provided for the plurality of first piezoelectric elements;
A plurality of second individual terminals individually provided for the plurality of second piezoelectric elements,
A plurality of first lead wires connecting the plurality of first piezoelectric elements and the plurality of first individual terminals;
A plurality of second lead wires connecting the plurality of second piezoelectric elements and the plurality of second individual terminals; and
The liquid ejection device according to claim 1, wherein the first lead wiring has a larger electrical resistance per unit length than the second lead wiring.

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