JP2016116167A - Imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imaging device capable of obtaining both images at a plurality of view points and an image of high resolution.SOLUTION: An imaging device includes: a first lens; a first imaging element imaging first transmitted light of a predetermined ratio in light transmitting through the first lens and allowing light other than the first transmitted light in light transmitting through the first lens to transmit therethrough; a second lens allowing second transmitted light transmitting through the first imaging element to transmit therethrough; and a second imaging element to image the second transmitted light transmitting through the second lens. The second lens is a lens for forming a plurality of view point images on the second imaging element, and the second imaging element outputs imaging signals of a plurality of view points.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an imaging apparatus.

  Conventionally, in an image generation apparatus that generates a reconstructed image from a light field image including a plurality of sub-images captured from different viewpoints, a parameter acquisition unit that acquires a capturing parameter when the light field image is captured; An information acquisition unit that acquires area information that defines an area of the sub-image included in the light field image, a reconstructed pixel that forms the reconstructed image, and the area information, based on the shooting parameter A definition unit that defines a correspondence with a sub-pixel in a sub-image area, and a pixel value of the re-constructed pixel is determined based on a pixel value of the corresponding sub-pixel to generate the re-constructed image And a storage unit that stores a plurality of area information associated with imaging parameter conditions, and the information acquisition unit includes: A plurality of area information stored in 憶部 obtains area information matches the imaging parameter and the parameter acquisition unit has acquired, it is an image generating device according to claim (e.g., see Patent Document 1).

Japanese Patent No. 5310837

  By the way, in the conventional image generation device, the number of pixels of the obtained image is the number of pixels obtained by dividing the total number of pixels of the image generation device by the number of viewpoints, and the number of viewpoints and the number of pixels are in a trade-off relationship. It is difficult to obtain a high image.

  Therefore, an object of the present invention is to provide an imaging apparatus that can acquire both images for a plurality of viewpoints and images with high resolution.

  An imaging apparatus according to an embodiment of the present invention images a first lens and a predetermined ratio of first transmitted light out of light transmitted through the first lens, and includes the first lens and the light transmitted through the first lens. A first imaging element that transmits light other than the first transmitted light; a second lens that transmits second transmitted light that transmits through the first imaging element; and the second transmitted light that transmits through the second lens. And the second lens is a lens that forms a plurality of viewpoint images on the second image sensor, and the second image sensor outputs imaging signals for a plurality of viewpoints. To do.

  It is possible to provide an imaging apparatus that can acquire both images for a plurality of viewpoints and images with high resolution.

1 is a diagram illustrating an imaging apparatus 100 according to Embodiment 1. FIG. FIG. 11 is a diagram for explaining the operation of the imaging apparatus 100. FIG. 11 is a diagram for explaining the operation of the imaging apparatus 100. 3 is a diagram illustrating a specific example of an image sensor 120 and a lens 130. FIG. 3 is a diagram illustrating an image obtained by the imaging apparatus 100. FIG. It is a figure which shows the cross-section of the imaging device 100 by the 2nd modification of Embodiment 1. FIG. 6 is a diagram illustrating an imaging apparatus 200 according to Embodiment 2. FIG. 6 is a diagram illustrating a specific example of an imaging element 120 and a lens 230 of the imaging apparatus 200 according to Embodiment 2. FIG.

  Hereinafter, embodiments to which the imaging apparatus of the present invention is applied will be described.

<Embodiment 1>
FIG. 1 is a diagram illustrating an imaging apparatus 100 according to the first embodiment.

  The imaging apparatus 100 includes a lens 110, an imaging element 120, a lens 130, and an imaging element 140. FIG. 1 shows the arrangement of the lens 110, the image sensor 120, the lens 130, and the image sensor 140. In actuality, these are arranged as shown in FIG.

  The lens 110 is disposed at a position closest to the subject, and the lens 110, the image sensor 120, the lens 130, and the image sensor 140 are disposed in this order as viewed from the subject.

  The lens 110 is a normal lens (lens group) used for a normal digital still camera, digital movie camera, silver salt film camera, or the like.

  Since the image sensor 120 and the image sensor 140 have the same configuration, the image sensors 120 and 140 will be described together here.

  The image sensors 120 and 140 include a photoelectric conversion unit and a signal readout circuit unit for scanning the photoelectric conversion unit and reading out signals. The photoelectric conversion unit and the signal readout circuit unit may be formed on the same plane, or the photoelectric conversion unit may be formed on the signal readout circuit unit.

  The signal readout circuit portion of the image sensor 120 uses a silicon (amorphous, microcrystalline, or polycrystalline silicon) thin film transistor provided on a glass substrate, an oxide semiconductor thin film transistor such as an indium-gallium-zinc-oxide semiconductor, or the like. Circuit (refer to “Thin Film Transistor” Corona Co., Ltd., edited by Thin Film Materials and Devices Study Group), or a single-crystal silicon layer MOS (Metal Oxide Semiconductor) transistor with a single-crystal silicon layer other than the transistor part removed or it By using a circuit in which a plurality of layers are stacked, the signal readout circuit portion has optical transparency.

  Note that the signal readout circuit unit of the image sensor 140 may have a configuration similar to that of the signal readout circuit unit of the image sensor 120, but does not need to have a function of transmitting light.

  The photoelectric conversion unit of the image sensor 120 and the photoelectric conversion unit of the image sensor 140 are made of different materials, and the wavelength range of light that is photoelectrically converted by the image sensor 120 and the image sensor 140 is at least a partial range. To be different.

  In addition, instead of such a configuration, the imaging elements 120 and 140 have the same material that constitutes the photoelectric conversion unit of the imaging element 120 and the photoelectric conversion unit of the imaging element 120, and the photoelectric conversion unit of the imaging element 120. The thickness of the material constituting the film may be such that the absorptance is not more than a predetermined ratio at a wavelength exhibiting the maximum absorptance in the wavelength range of 400 nm to 700 nm. The predetermined ratio is, for example, 80%.

  The photoelectric conversion units of the image sensors 120 and 140 include a photodiode made of selenium (amorphous, microcrystalline, or polycrystalline selenium) in addition to a photodiode made of silicon (amorphous or crystalline silicon) (S. Imura et al. , Appl. Phys. Lett. 104, 242101 (2014)) and copper-indium-gallium-sulfur photodiodes (Kikuchi, K et al., THIN SOLID FILMS 550, 635-637 (2014)) ), Photodiodes made of organic materials such as zinc phthalocyanine and quinacridone can be used.

  With the above configuration, the image sensor 120 has a function of transmitting a part of light that can be imaged by the image sensor 140.

  The lens 130 is a lens group in which pinhole lenses, microlenses, and the like are arranged in a planar shape, and is on a surface (right surface in the drawing) opposite to the light incident surface (left surface in the drawing) of the image sensor 120. It is formed. The light transmitted through the image sensor 120 passes through the lens 130 to form a plurality of viewpoint images on the image sensor 140. In the first embodiment, a mode in which the lens 130 is a pinhole lens will be described.

  The image sensor 140 captures a plurality of viewpoint images formed by the pinholes of the lens 130.

  Next, the operation of the imaging apparatus 100 will be described with reference to FIGS. 2 and 3 are diagrams for explaining the operation of the imaging apparatus 100. FIG. 2 and 3, the case where the subject 1 is divided into points 1 to 25 and the number of pixels of the image sensor 120 is 25 will be described. The lens 130 has five pinholes 131 arranged at positions corresponding to the pixels 3, 8, 13, 18, and 23 of the image sensor 120. The lens 130 has five pinholes 131 in order to form images from five viewpoints on the image sensor 140.

  The lens 110 is designed to include five regions a to e in order to realize an image from five viewpoints. For example, assuming that the aperture ratio of the lens 110 is F, the focal length is f, the pixel size of the image sensor 120 and the image sensor 140 is p, and the distance between the image sensor 120 and the image sensor 140 is l, l / Fp> 5. In addition, the aperture ratio F of the lens 110 is determined, the image sensor 120 is disposed at the focal length position f of the lens 110, and the image sensor 140 is disposed at a distance l from the image sensor 120.

  The image sensor 120 performs exactly the same operation as a normal camera having one lens group and one imaging device.

  Images of the points 1 to 25 of the subject 1 are projected onto the pixels 1 to 25 of the image sensor 120, and 25 image signals for the points 1 to 25 are obtained by the image sensor 120. That is, an image having a resolution equal to the total number of pixels of the image sensor 120 is obtained.

  Further, due to the restriction in the lens 130, only the light transmitted through the pixels 3, 8, 13, 18, 23 of the image sensor 120, that is, only the light reflected by the points 3, 8, 13, 18, 23 of the subject 1 is imaged. The element 140 is reached. The image sensor 140 includes pixels 3c, 3d, 3e, 8a, 8b, 8c, 8d, 8e, 13a, 13b, 13c, 13d, 13e, 18a, 18b, 18c, 18d, 18e, 23a, 23b, and 23c. .

  FIG. 3 shows only light rays reflected from the point 8 of the subject 1 in order to explain the operation of the image sensor 140. The light reflected from the point 8 of the subject 1 is collected by the lens 110 and forms an image on the pixel 8 of the image sensor 120.

  Further, the light transmitted without being imaged by the pixel 8 of the image sensor 120 is transmitted through the lens 130 and reaches the image sensor 140, but the light reaching the pixel 8 a of the image sensor 140 is the region a of the lens 110. Only light that has passed through.

  Similarly, only the light that has passed through the regions b, c, d, and e of the lens 110 reaches the pixels 8b, 8c, 8d, and 8e of the image sensor 140, respectively.

  As a result, in the image sensor 140, the image 3a, 8a, 13a, 18a, 23a viewed from the region a of the lens 110 out of the reflected light reflected by the subject points 3, 8, 13, 18, 23, and the region images 3b, 8b, 13b, 18b, 23b viewed from b, images 3c, 8c, 13c, 18c, 23c viewed from region c, images 3d, 8d, 13d, 18d, 23d viewed from region d, Images 3e, 8e, 13e, 18e, and 23e viewed from the region e are obtained.

  That is, in the image sensor 140, a plurality of viewpoint images corresponding to the number of lenses on the plane of the lens 130 with a resolution obtained by dividing the total number of pixels of the image sensor 140 by the number of lenses on the plane of the lens 130 (here, five). Is obtained.

  FIG. 4 is a diagram illustrating a specific example of the image sensor 120 and the lens 130.

  As the image pickup element 120, a crystal selenium photodiode having a thickness of 200 nm was used as a photoelectric conversion portion, and a circuit including a single crystal silicon layer MOS transistor and having a single crystal silicon layer other than the transistor portion removed was used as a readout circuit portion.

  The image sensor 120 has a signal readout circuit section configured by a MOS transistor 60 in which a semiconductor island region 31 is configured by a single crystal silicon layer on a glass support substrate 10 with a buried oxide film 20 interposed therebetween. More specifically, the MOS transistor 60 (signal readout circuit unit) includes a semiconductor island region 31 and a source / drain region 32 formed in the insulating film 22 formed on the buried oxide film 20, and a gate insulating film 21. A gate electrode 41, a signal readout line 42, and an insulating film 23.

  The image sensor 120 is configured by forming a photoelectric conversion film 50 and a counter electrode 44 on a pixel electrode 43 connected to a MOS transistor 60 (signal readout circuit unit).

  Here, in the embodiment shown in FIG. 4, the insulating films 22 and 23, the pixel electrode 43, and the counter electrode 44 are formed of a material having a high visible light transmittance. A metal light-shielding layer having a part opened on the photodiode was formed as the lens 130. The opening of the lens 130 (metal light shielding layer) is a pinhole 131, and the lens 130 constitutes a pinhole lens. The cross-sectional structure shown in FIG. 4 corresponds to two pixels.

  Further, as the image pickup element 140, a complementary metal oxide semiconductor (CMOS) image pickup device composed of a single crystal silicon photodiode having a thickness of about 5 μm and a signal readout circuit portion is employed.

  Here, the crystalline selenium photodiode used for the imaging device 120 mainly absorbs light in the visible region of 400 to 650 nm and performs photoelectric conversion, but transmits light having a wavelength longer than 650 nm. On the other hand, a single crystal silicon photodiode having a thickness of about 5 μm used for the image sensor 140 can absorb light in the visible range of 400 to 700 nm and perform photoelectric conversion.

  Therefore, visible light with a wavelength of 400 to 650 nm can be photoelectrically converted with the imaging device 120, and visible light with a wavelength of 650 to 700 nm that has passed through the imaging device 120 can be photoelectrically converted with the imaging device 140.

  In order from the light incident side, the lens 110, the image sensor 120, the lens 130 (pinhole lens), and the image sensor 140 may be arranged, and the lens 130 may be adjusted to be installed at the focal position of the lens 110.

  FIG. 5 is a diagram illustrating an image obtained by the imaging apparatus 100. Here, as an example, an image when hiragana “a” is captured by the imaging apparatus 100 is shown.

  FIG. 5A shows an image obtained by the image sensor 120. Since the image sensor 120 can obtain an image having a resolution equal to the total number of pixels of the image sensor 120, the image sensor 120 can obtain an image with a high resolution as shown in FIG.

  FIG. 5B shows an image obtained by the imaging element 140. In the image sensor 140, a plurality of viewpoint images corresponding to the number of lenses on the plane of the lens 130 are obtained with a resolution obtained by dividing the total number of pixels of the image sensor 140 by the number of lenses on the plane of the lens 130 (here, five). It is done.

  FIG. 5B shows three of the five images originally obtained corresponding to the five viewpoints. It can be seen that the resolution is lower than that of the image shown in FIG.

  As described above, according to the first embodiment, an image for a plurality of viewpoints (see FIG. 5B) and an image having a higher resolution than an image for a plurality of viewpoints (see FIG. 5A). Thus, it is possible to provide the imaging apparatus 100 that can simultaneously acquire both images.

  In the above description, the wavelength band of wavelengths from 400 nm to 700 nm has been described. However, the band in which the imaging apparatus 100 has spectral sensitivity is not limited to such a band. Similarly, the imaging apparatus 100 can display images of a plurality of viewpoints for a wider band, a band spread to the shorter wavelength side, a band spread to the longer wavelength side, or a narrower band (see FIG. 5B). ) And an image (see FIG. 5A) having a higher resolution than images for a plurality of viewpoints can be acquired simultaneously.

  Further, the imaging elements 120 and 140 may have the following forms.

  Here, as a first modification, a mode in which the photoelectric conversion unit of the image sensor 120 is replaced with a quinacridone (organic material) photodiode having a thickness of 200 nm will be described. The 200 nm thick quinacridone (organic material) photodiode used for the image sensor 120 mainly absorbs light in the green light region having a wavelength of 480 to 600 nm to perform photoelectric conversion, and transmits light that is not absorbed. That is, the quinacridone (organic material) photodiode transmits blue light and red light in the wavelength region of 400 to 480 nm and 600 to 700 nm.

  On the other hand, a single crystal silicon photodiode having a thickness of about 5 μm used for the image sensor 140 can absorb light in the visible range of 400 to 700 nm and perform photoelectric conversion.

  Therefore, the image sensor 120 can photoelectrically convert the light in the green region of the incident light, and the image sensor 140 can photoelectrically convert the light in the blue and red regions transmitted through the image sensor 120.

  In order from the light incident side, the lens 110, the image sensor 120, the lens 130 (pinhole lens), and the image sensor 140 may be arranged, and the lens 130 may be adjusted to be installed at the focal position of the lens 110.

  As a result, according to the first modification, similarly to the image shown in FIG. 5, an image with a plurality of viewpoints (see FIG. 5B) and an image with a higher resolution than an image with a plurality of viewpoints (see FIG. 5). 5 (A)) can be obtained at the same time, the imaging apparatus 100 can be provided.

  Next, a second modification will be described with reference to FIG.

  FIG. 6 is a diagram illustrating a cross-sectional structure of the imaging apparatus 100 according to the second modification of the first embodiment. FIG. 6 shows a cross-sectional structure diagram for two pixels.

  In the second modified example, as the image sensor 120, a circuit in which a single crystal silicon photodiode having a thickness of 50 nm is provided in the photoelectric conversion portion, a MOS transistor made of a single crystal silicon layer is provided, and a single crystal silicon layer other than the transistor portion is removed is read. Adopted in the circuit section.

  Here, the photoelectric conversion unit and the signal readout circuit unit are formed on the same plane. The image pickup device 120 has a signal readout circuit section configured by a MOS transistor 60 in which a semiconductor island region 31 is formed of a single crystal silicon layer on a glass support substrate 10 with a buried oxide film 20 interposed therebetween. The photoelectric conversion film 50 is connected to the (signal readout circuit unit).

  More specifically, the MOS transistor 60 (signal readout circuit unit) includes a semiconductor island region 31 and a source / drain region 32 formed on the buried oxide film 20, a gate insulating film 21, a gate electrode 41, and a signal readout line 42. And an insulating film 23.

  On the photodiode, a metal light-shielding layer having a part opened was formed as a lens 130. The opening of the lens 130 is a pinhole 131.

  In addition, as the image pickup element 140, a CMOS image pickup device composed of a single crystal silicon photodiode having a thickness of about 5 μm and a signal readout circuit portion was employed.

  Here, the single-crystal silicon photodiode having a thickness of 50 nm used for the image sensor 120 has a visible region of 400 to 700 nm in which light in the blue region is about 10%, light in the green region is about 5%, and light in the red region. Is absorbed by about 2% to perform photoelectric conversion, and light that is not absorbed is transmitted.

  That is, the image sensor 120 transmits about 90% of the light in the blue region, about 95% of the light in the green region, and about 98% of the light in the red region.

  On the other hand, a single crystal silicon photodiode having a thickness of about 5 μm used for the image sensor 140 can absorb light in the visible range of 400 to 700 nm and perform photoelectric conversion.

  Therefore, 2 to 10% of incident light can be photoelectrically converted by the image sensor 120, and 90 to 98% of light transmitted through the image sensor 120 can be photoelectrically converted by the image sensor 140.

  In order from the light incident side, the lens 110, the image sensor 120, the lens 130 (pinhole lens), and the image sensor 140 may be arranged, and the lens 130 may be adjusted to be installed at the focal position of the lens 110.

  As a result, according to the second modification, similarly to the image shown in FIG. 5, an image for a plurality of viewpoints (see FIG. 5B) and an image with a higher resolution than an image for a plurality of viewpoints (FIG. 5 (A)) can be obtained at the same time, the imaging apparatus 100 can be provided.

  As described above, according to the first embodiment, with a simple optical system, a low-resolution multi-viewpoint image having the number of pixels obtained by dividing the total number of pixels of the imaging device 100 by the number of viewpoints and a high value equal to the total number of pixels of the imaging device 100. A single resolution image can be acquired at the same time.

  That is, it is possible to realize a camera having two functions of a normal camera that can obtain a high-resolution image and a multi-view camera (low-resolution / multi-view).

  Further, the distance to the subject 1 can be calculated from the multi-viewpoint image obtained by the image sensor 140 by the principle of triangulation. As a result, the distance to an arbitrary subject 1 can be obtained in the high-resolution image obtained by the image sensor 120, and an image including distance information is obtained.

  Also, by comparing the subject 1 in the low-resolution multi-viewpoint image with the subject 1 in the high-resolution image, the subject 1 in the multi-viewpoint image can be increased in resolution.

<Embodiment 2>
FIG. 7 is a diagram illustrating the imaging apparatus 200 according to the second embodiment.

  The imaging apparatus 200 has a configuration in which the lens 130 (pinhole lens) of the imaging apparatus 100 of Embodiment 1 is replaced with a lens 230 (microlens).

  The lens 230 is formed on a surface (right surface in the drawing) opposite to the light incident surface (left surface in the drawing) of the image sensor 120.

  In FIG. 7, the case where the subject 1 is divided into points 1 to 25 and the number of pixels of the image sensor 120 is 25 will be described. The lens 110 will be described by dividing it into regions a to e. Further, the lens 230 includes microlenses 231 corresponding to five pixels in the cross section shown in FIG.

  When the lens 230 is used, the light reflected from the points 6 to 10 of the subject passes through the areas a, b, c, d, and e of the lens 110 and is photoelectrically converted by the image sensor 120. The part passes through the image sensor 120 and further passes through the lens 230 and enters the image sensor 140.

  Focusing on the light beam reflected at the point 8 of the subject 1, the light reflected at the point 8 of the subject 1 is collected by the lens 110 and forms an image on the pixel 8 of the image sensor 120. The light transmitted through the pixel 8 of the image sensor 120 passes through the lens 230 and enters the pixels 8a, 8b, 8c, 8d, and 8e on the image sensor 140.

  FIG. 8 is a diagram illustrating a specific example of the imaging element 120 and the lens 230 of the imaging device 200 according to the second embodiment. FIG. 8 shows a cross-sectional structure diagram for two pixels.

  In FIG. 8, the imaging element 120 is formed of a thin film transistor in which a 80 nm thick copper-indium-gallium-sulfur photodiode is used for the photoelectric conversion portion and the semiconductor portion is made of indium-gallium-zinc oxide. The circuit was adopted as the readout circuit section.

  The image sensor 120 includes a signal readout circuit unit configured by a thin film transistor 61 in which a semiconductor island region 31 is formed of an indium-gallium-zinc oxide semiconductor layer on a glass substrate. The image sensor 120 includes a thin film transistor 61 (signal readout circuit) and a photoelectric conversion film 50 formed thereon.

  As the lens 230, a lens group in which microlenses 231 are arranged on a matrix is formed on the image sensor 120.

  As the imaging element 140, a CMOS imaging device composed of a single crystal silicon photodiode having a thickness of about 5 μm and a signal readout circuit portion was employed.

  Here, the copper-indium-gallium-sulfur photodiode with a thickness of 80 nm used for the image sensor 120 absorbs about 50% of light for all wavelengths in the visible range of 400 to 700 nm, performs photoelectric conversion, and does not absorb light. To Penetrate. That is, the image sensor 120 transmits about 50% of the incident light with respect to all wavelengths in the visible light range of 400 to 700 nm.

  A photodiode made of single crystal silicon and having a thickness of about 5 μm used for the image sensor 140 can absorb light in the visible range of 400 to 700 nm and perform photoelectric conversion.

  Therefore, the image sensor 120 can photoelectrically convert 50% of the incident light, and the image sensor 140 can photoelectrically convert the remaining 50% light transmitted through the image sensor 120.

  The lens 110, the image sensor 120, the lens 230 (microlens 231), and the image sensor 140 are arranged in this order from the light incident side. Further, adjustment may be made so that the lens 230 is installed at the focal position of the lens 110 and the imaging element 140 is arranged at the focal position of the lens 230.

  As a result, according to the second embodiment, similarly to the image shown in FIG. 5, an image with a plurality of viewpoints (see FIG. 5B) and an image with a higher resolution than an image with a plurality of viewpoints (see FIG. 5). 5 (A)) can be obtained at the same time, the imaging device 200 can be provided.

  As described above, according to the second embodiment, with a simple optical system, a low-resolution multi-viewpoint image having the number of pixels obtained by dividing the total number of pixels of the imaging device 200 by the number of viewpoints and a high value equal to the total number of pixels of the imaging device 200. A single resolution image can be acquired at the same time.

  The imaging device according to the exemplary embodiment of the present invention has been described above, but the present invention is not limited to the specifically disclosed embodiment, and does not depart from the scope of the claims. Various modifications and changes are possible.

DESCRIPTION OF SYMBOLS 100 Image pick-up device 110 Lens 120 Image pick-up element 130 Lens 131 Pinhole 140 Image pick-up element 200 Image pick-up device 230 Lens 231 Micro lens

Claims (4)

A first lens that transmits light reflected by the subject;
A first imaging device that images a predetermined ratio of the first transmitted light out of the light transmitted through the first lens and transmits light other than the first transmitted light out of the light transmitted through the first lens. When,
A second lens that transmits second transmitted light that passes through the first image sensor;
A second imaging element that images the second transmitted light that has passed through the second lens;
The image pickup apparatus, wherein the second lens is a lens that forms a plurality of viewpoint images on the second image pickup element, and the second image pickup element outputs image pickup signals for a plurality of viewpoints.   The material constituting the first photoelectric conversion unit of the first image sensor is different from the material constituting the second photoelectric conversion unit of the second image sensor, and the first photoelectric conversion unit and the second photoelectric conversion unit are The imaging apparatus according to claim 1, wherein a wavelength range of light for performing photoelectric conversion is different in at least a part of the range.   The first photoelectric conversion unit of the first image sensor and the material constituting the second photoelectric conversion unit of the second image sensor are the same, and the thickness of the first photoelectric conversion unit is the maximum absorption rate. The imaging device according to claim 1, wherein the imaging device is set to have an absorptance equal to or less than the predetermined ratio at a wavelength of   4. The device according to claim 1, wherein the first image sensor is disposed in the vicinity of a focal position of the first lens, and the second lens is disposed in the vicinity of a light emitting surface of the first image sensor. The imaging device according to one item.

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