JP2016115731A - Substrate processing liquid supply method and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing liquid supply system which allows for pressure feed conveniently and inexpensively, without dissolving a gas into process liquid, in a system for pressure-feeding process liquid in a semiconductor cleaning process, and to provide a substrate processing device using the same.SOLUTION: Vapor of the same substance as the process liquid produced by a vaporization unit 33 is supplied to a process liquid pooled in process liquid storage tanks 32a, 32b. The vapor produced by a vaporization unit 33 is subjected to pressure adjustment, and supplied through a vapor supply pipe 37 to the process liquid storage tanks 32a, 32b, thus pressure-feeding the process liquid to a discharge section. A substrate processing device includes a process liquid supply section 6 internally.SELECTED DRAWING: Figure 3

Description

The present invention relates to a substrate processing liquid supply system for supplying a processing liquid to various substrates to be processed such as a semiconductor wafer, a glass substrate for a liquid crystal display device, and a glass substrate for a PDP (plasma display panel).

In a cleaning process in a semiconductor device manufacturing process, after treating a substrate with a chemical solution, the chemical solution is washed away by pure water rinsing, and finally the pure water is replaced with an organic solvent such as isopropyl alcohol (hereinafter referred to as IPA) and dried. Done. When supplying a chemical solution used in the cleaning process or an organic solvent such as IPA to each processing unit, N2 gas is supplied to the tank storing the chemical solution used or an organic solvent such as IPA, and the tank is added. The pressure is sent to each processing unit. The chemical solution and the organic solvent such as IPA are hereinafter referred to as a processing solution.

When the processing liquid is pumped with N 2 gas, the N 2 gas may be dissolved in the processing liquid and cause problems. Bubbles are generated due to cavitation caused by vibration of the piping system in the piping in the middle of pumping, causing malfunction of the flowmeter, or when chemical solution is supplied onto the substrate during chemical processing, the pressure drops and bubbles are generated in the chemical solution Even when cleaning failure occurs or when pure water is replaced with an organic solvent such as IPA and drying is performed, the pressure drops when supplied onto the substrate in the same manner as the chemical treatment, and bubbles are generated in the organic solvent such as IPA. May occur, resulting in poor drying. As semiconductor devices are highly integrated and miniaturized, the presence of fine bubbles in the processing solution that reaches the substrate is not negligible.

In order to solve such a problem, for example, in the chemical solution supply system described in Patent Document 1, a technique for providing a buffer tank and degassing the chemical solution in the buffer tank is described. The chemical solution supply system of Patent Document 1 is a system that supplies a chemical solution by pressure feeding, has a buffer tank that stores the chemical solution, and includes discharge means for discharging the chemical solution from the buffer tank to each processing unit for each predetermined amount. ing. The discharge means discharges the chemical solution by a predetermined amount by introducing pressurized gas into the buffer tank and turning the valve on and off. In addition, an exhaust pipe is connected to the buffer tank, and it is possible to deaerate the developer in the buffer tank by flowing air through the exhaust pipe and applying a suction force to the inside of the buffer tank by an aspirator method. On the other hand, Patent Document 2 discloses a method in which a processing liquid is pumped using a syringe pump, a bellows pump, or a diaphragm pump as a method in which a pumping gas such as N2 gas does not directly contact the processing liquid to be pumped. ing. By introducing the processing liquid into the pump, the pressure of the processing liquid is reduced, the gas dissolved in the processing liquid is foamed, and the bubbles are discharged from the bubble vent provided in the pump. In order to deaerate using a pump, it is necessary to provide a complicated deaeration mechanism in the pump.

JP 2000-114153 A JP 2000-77324 A

However, in the configuration disclosed in Patent Document 1, although the degassing is performed in the buffer tank, the pressurized gas and the processing liquid come into contact with each other, so that the dissolution of the gas occurs. In the configuration shown in Patent Document 2, the treatment liquid and the pressurized gas are not in contact with each other, but a complicated mechanism is required, and the equipment is expensive.

Accordingly, an object of the present invention is to provide a simple and inexpensive processing liquid supply system and a substrate processing apparatus using the same without dissolving a gas in the processing liquid.

In order to achieve the above object, the invention according to claim 1 is a holding unit that holds the substrate, a discharge unit that discharges the processing liquid to the substrate held by the holding unit, and the processing liquid to the discharge unit. A substrate processing apparatus comprising: a processing liquid supply unit that supplies the processing liquid, wherein the processing liquid supply unit discharges the processing liquid from the processing liquid storage tank; A liquid supply pipe for supplying liquid to the unit, an openable / closable liquid supply valve interposed in the liquid supply pipe, a vaporization unit for generating vapor of the same substance as the treatment liquid, and the vaporization unit to the treatment liquid storage tank A steam supply pipe for supplying the steam; an openable / closable steam supply valve interposed in the steam supply pipe; and a pressure control unit connected to the steam supply pipe, wherein the treatment liquid is the treatment liquid. To the same substance vapor Characterized in that it is pumped Ri.

The invention described in claim 2 is characterized in that the treatment liquid is isopropyl alcohol.

The invention described in claim 3 is characterized in that the treatment liquid is a hydrofluoroether.

According to a fourth aspect of the present invention, there is provided heating means for maintaining the steam supply pipe at a predetermined temperature.

The invention according to claim 5 includes a second processing liquid storage tank, and supplies the steam from the vaporization unit to the second processing liquid storage tank via the pressure control unit and a second steam supply valve. A pipe is connected, and the processing liquid in the second processing liquid storage tank is fed to the discharge section.

The invention according to claim 6 is a processing liquid supply device for supplying a processing liquid to a substrate processing apparatus for processing a substrate, the processing liquid storing tank storing the processing liquid, and the processing liquid from the processing liquid storage tank A liquid supply pipe for supplying liquid to the discharge section, an openable / closable liquid supply valve interposed in the liquid supply pipe, a vaporization unit for generating vapor of the same substance as the treatment liquid, and the treatment liquid from the vaporization unit A steam supply pipe for supplying the steam to the storage tank; an openable / closable steam supply valve interposed in the steam supply pipe; and a pressure control unit connected to the steam supply pipe. A processing liquid supply apparatus, wherein the processing liquid is pumped by vapor of the same substance as the processing liquid.

The invention according to claim 7 is a processing liquid supply method for supplying a processing liquid from a processing liquid storage tank, the step of preparing the processing liquid in the processing liquid storage tank, and generating vapor of the same substance as the processing liquid And a step of adjusting the vapor to a pressure equal to or higher than the atmospheric pressure, and a step of supplying the vapor to the treatment liquid storage tank.

In the processing liquid supply system of the present invention, since the processing liquid is pumped at the same material vapor pressure as the processing liquid, no other gas is dissolved in the processing liquid. For this reason, bubbles are not generated due to cavitation caused by vibration of the piping system in the pipes in the middle of pressure feeding, causing malfunction of the flowmeter. Does not occur. Moreover, since the vapor | steam of the same substance as a process liquid is used, the contamination from the piping which supplies other gas like the case where other gas is used, and the contamination from another gas can be prevented.

It is a top view which shows schematic structure of the substrate processing apparatus which concerns on an Example. FIG. 3 is a diagram illustrating a schematic configuration of a cleaning processing unit 5. FIG. 3 is a diagram illustrating a schematic configuration of a processing liquid supply unit 6. It is a figure which shows a processing flow. It is a figure which shows schematic structure of the process liquid supply part which concerns on 2nd embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. The substrate processing apparatus 1 according to the present embodiment includes a cassette stage 2, a substrate delivery unit 3, a transport unit 4, a cleaning processing unit 5, a processing liquid supply unit 6, and a control unit 7.

The cassette C is a container that can receive and stack a plurality of substrates W. The cassette C accommodates an unprocessed substrate W, and in that state, the cassette C is transported and moved together with a plurality of substrates W to the apparatus for each step.

The unprocessed substrate W is accommodated in the cassette C, and the cassette C is placed on the cassette stage 2. The unprocessed substrate W is delivered to the substrate delivery unit 3. Further, the processed substrate W is accommodated in the empty cassette C placed on the cassette stage 2 from the substrate delivery section 3.

The substrate delivery unit 3 includes a transfer robot IR and a path 8 for temporarily storing the substrate. The transfer robot IR receives an unprocessed substrate W from the cassette C placed on the cassette stage 2 and places it on the path 8. The pass 8 functions as a buffer arranged in a plurality of stages in the vertical direction, and supports a plurality of unprocessed substrates W. The processed substrate W is accommodated in a cassette placed on the cassette stage 2 by the transfer robot IR.

The transfer robot IR can transfer the substrate W to an arbitrary position by a swingable and advancing / retracting arm as conceptually shown by a dashed arrow in FIG. 1 while holding the substrate W. Although not shown in the figure, it can be moved back and forth in the vertical direction.

The transfer unit 4 can transfer the substrate W to an arbitrary position by a swingable and advancing / retracting arm as conceptually shown by a dashed arrow in FIG. 1 while holding the substrate W. Has CR. The transfer robot CR holds the substrate W placed on the path 8 of the substrate transfer unit 3 and transfers the substrate to the cleaning processing unit 5 described later.

The cleaning processing unit 5 is a unit that receives an unprocessed substrate W from the transport unit 4 and performs a cleaning process on the substrate W.

FIG. 2 is a diagram illustrating a schematic configuration of the cleaning processing unit 5. The unprocessed substrate W delivered from the transport robot CR of the transport unit 4 is held by the substrate holding unit 21 of the cleaning processing unit 5. The substrate holding unit 21 has a suction function (not shown) that sucks the back surface of the substrate W, and can hold the substrate W. Although not shown, the outer periphery of the substrate W may be held by a mechanical chuck that mechanically chucks.

After the substrate W is held by the substrate holding unit 21, a nozzle (an embodiment of a discharge unit) 25 that supplies a processing liquid is disposed above the substrate W. By supplying the processing liquid from the nozzle 25 toward the substrate W, the surface of the substrate W is cleaned. More specifically, the surface of the substrate W is washed with an alkaline aqueous solution that is a mixed solution of ammonia water and hydrogen peroxide solution, rinsed with pure water rinse, and subsequently mixed with hydrochloric acid and an aqueous peroxide solution. It is washed with an acid aqueous solution that is a solution and rinsed with pure water rinse. The types of the aqueous alkali solution and the aqueous acid solution are not limited to these. Subsequently, the pure water on the substrate W is replaced with an organic solvent such as IPA by supplying an organic solvent such as IPA onto the substrate W, and is then shaken and dried by spin drying. Drying is not limited to spin drying. An organic solvent such as a chemical solution, pure water, and IPA used in the cleaning processing unit 5 is supplied from the processing solution supply unit 6.

The processing liquid supplied onto the substrate W flows out from the center of the substrate W in the outer peripheral direction and is collected by the cup 23. The processing liquid collected in the cup 23 is drained by a draining means (not shown).

The control unit 7 includes a CPU and a memory, and comprehensively controls the above-described units such as the transfer robot IR, CR, processing liquid supply, and cleaning procedure. In addition, various facilities of the processing liquid supply unit described later are also controlled.

  FIG. 3 is a schematic configuration diagram of the processing liquid supply unit 6 shown in the substrate processing apparatus of FIG. 1 according to the embodiment of the present invention. In this embodiment, a case where IPA is used as the processing liquid will be described. The treatment liquid supply unit 6 includes a vaporization unit 33 for vaporizing IPA, a vapor supply pipe 37 that supplies vaporized IPA, and treatment liquid storage tanks 32a and 32b in which IPA is stored. A liquid supply pipe 41 for supplying IPA to the nozzle 25 is provided.

The vaporization unit 33 includes a steam generation tank 34a and a heater 34b. In the steam generation tank 34a, a cylindrical container made of quartz or fluorine resin such as PFA having a capacity of 10L is housed in a pressure resistant container made of metal such as stainless steel. The capacity and material are not limited to this. The cylindrical container of the steam generation tank 34a is connected to a resin pipe inside a steam supply pipe 37 composed of a double pipe described later by a dedicated joint. The metal pressure vessel of the steam generation tank 34a is connected to a metal pipe outside the steam supply pipe 37, which will be described later, by a dedicated joint. The steam generation tank 34a can be removed by removing these dedicated joints. The vapor generation tank 34a of the vaporization unit 33 is connected with a safety valve 35 for releasing the pressure when the pressure exceeds a certain pressure. When the safety valve is released, the steam is exhausted to an exhaust line (not shown) connected to the safety valve 35. The heater 34b is a resistance heating heater that covers the bottom and side surfaces of the steam generation tank 34a. However, the mechanism is not limited to this as long as the mechanism is heated. Moreover, the vaporization unit 33 can also use a commercial item.

The steam supply pipe 37 is made of a double pipe consisting of a resin pipe on the inside and a metal pipe on the outside. The steam supply pipe 37 is connected to the steam generation tank 34a of the vaporization unit 33 by a dedicated joint, and is connected to the processing liquid storage tanks 32a and 32b via the pressure control unit 36 and the steam supply pipe side valves 39a and 39b. . A line heater 38 is provided around the steam supply pipe 37 so that the steam is not cooled and liquefied.

The pressure control unit 36 includes a pressure gauge and a valve linked to the pressure gauge in order to supply IPA vapor to the treatment liquid storage tanks 32a and 32b at a predetermined pressure. The valve opening is adjusted so that the pressure of the pressure gauge becomes the set pressure.

In the treatment liquid storage tanks 32a and 32b, a cylindrical container made of quartz having a capacity of 20L or made of a fluororesin such as PFA is housed in a metal pressure resistant container such as stainless steel. The capacity and material are not limited to this. The steam inlets of the cylindrical containers of the treatment liquid storage tanks 32 a and 32 b are connected to a resin pipe inside the steam supply pipe 37 by a dedicated joint. The steam inlets of the metal pressure-resistant containers of the treatment liquid storage tanks 32 a and 32 b are connected to a metal pipe outside the steam supply pipe 37 by a dedicated joint.

The liquid supply side outlets of the cylindrical containers of the treatment liquid storage tanks 32a and 32b are connected to a resin liquid supply pipe 41 by a dedicated joint. The IPA is pumped to the nozzle 25 by the liquid feeding pipe 41, and the IPA is discharged onto the substrate.

The liquid supply pipe 41 is not a double pipe, and the liquid supply side outlet of the metal pressure vessel of the treatment liquid storage tanks 32a and 32b is sealed with a screw cap by sandwiching packing against the liquid supply pipe 41. ing. The treatment liquid storage tanks 32a and 32b can be removed by removing the above-described joints and screw caps. In the middle of the liquid feeding pipe 41, processing liquid supply side valves 40a and 40b for supplying and stopping the processing liquid are provided.

The processing liquid storage tanks 32a and 32b are provided with a liquid level gauge (not shown) so that the remaining amount of the processing liquid can be detected. When the remaining amount of the processing liquid storage tank 32a reaches the lower limit, the steam supply piping side valve 39a and the processing liquid supply side valve 40a connected to the processing liquid storage tank 32a are closed, and the steam supply piping connected to the processing liquid storage tank 32b. The side valve 39b and the processing liquid supply side valve 40b are opened. After the supply of IPA is switched to the processing liquid storage tank 32b, the processing liquid storage tank 32a is removed, the new liquid is stored again, and it is installed again. After the supply of the IPA is switched to the processing liquid storage tank 32b, it is used until the remaining amount reaches the liquid level gauge lower limit as in the case of the processing liquid storage tank 32a. Thereby, it can operate | move, without closing supply of IPA. Temperature setting and temperature control of the heater 34b, pressure setting of the pressure control unit 36 and valve opening adjustment with respect to the set pressure, temperature setting and temperature control of the line heater 38 provided in the steam supply pipe 37, steam supply pipe side valve 39a 39b and processing liquid supply side valves 40a and 40b are controlled by the control unit 7 of the substrate processing apparatus 1.

Next, supply of the treatment liquid by the treatment liquid supply unit 6 having the above-described configuration will be described with reference to FIG. FIG. 4 is a flowchart for explaining the processing flow of the embodiment of the present invention.

The steam generation tank 34a in which the IPA of the new liquid is stored is installed in the vaporization unit 33 and connected to the steam supply pipe 37 (step S1). Further, when IPA is supplied as a factory equipment through a centralized pipe, the IPA may be supplied by connecting the pipe directly to the steam generation tank 34a.

Next, with the steam supply pipe side valves 39a and 39b closed, the heater 34b is set to 100 ° C. to generate IPA steam (step S2). IPA has a vapor pressure of 199.3 kPa at 100 ° C. Since the atmospheric pressure is 101.3 kPa, the pressure is about 2 atm, and the IPA can be pressurized and pumped. The temperature of the heater may be 100 ° C. or higher. At the same time, the line heater 38 provided in the steam supply pipe 37 is set to 83 ° C. It is necessary to heat the steam supply pipe 37 in advance so that the IPA vapor is not liquefied in the pipe. Since the boiling point of IPA is 82.5 ° C., the set temperature of the line heater 38 may be 82.5 ° C. or higher.

Subsequently, the set pressure of the pressure control unit 36 is set to 190 kPa. The pressure is set by the control unit 7, but may be set manually in the pressure control unit 36. While the steam supply pipe side valve 39a is closed, the pressure is adjusted by controlling the opening of the valve linked to the pressure gauge so that the set pressure becomes 190 kPa (step S3).

In order to supply the IPA vapor to the treatment liquid storage tank 32a, the vapor supply pipe side valve 39a is opened with the treatment liquid supply side valves 40a and 40b and the vapor supply pipe side valve 39b closed (step S4).

The IPA stored in the processing liquid storage tank 32a is pressurized by the IPA vaporized by the vaporizing unit 33, is pumped to the nozzle 25 through the liquid feeding pipe 41, and is discharged onto the substrate (step S5).

When stopping the discharge of IPA, the processing liquid supply side valve 40a is closed (step S6). When discharging IPA again, the process returns to the steam supply step of step S4. The IPA on the processing liquid storage tank 32a side is used until the remaining amount of the processing liquid storage tank 32a reaches the lower limit, and after the remaining amount reaches the lower limit, the processing liquid storage tank 32b is switched to operate continuously. The treatment liquid storage tank 32a whose remaining amount has reached the lower limit is removed by removing the pipe joint, and new IPA is stored and installed again.

According to the embodiment as described above, the processing liquid can be pumped without dissolving the gas in the processing liquid. In addition, implementation of this case is not restricted to said form.

A second embodiment will be described below. FIG. 5 is a schematic configuration diagram of a processing liquid supply unit according to the second embodiment. Although the tank specification is used in the first embodiment described above, a case will be described in which IPA is supplied through centralized piping as factory equipment. The processing liquid storage tanks 32a and 32b, the pressure control unit 36, the steam supply pipe 37, the line heater 38, the steam supply pipe side valves 39a and 39b, the processing liquid supply side valves 40a and 40b, and the liquid supply pipe 41 are shown in FIG. This is the same as the first embodiment shown in FIG. Therefore, the same reference numerals are given and detailed description is omitted.

Centralized piping of factory equipment is connected to the second vaporization unit 52 via the vaporization unit introduction valve 51. Since the central piping of general factory equipment is made of stainless steel, and the piping in the second vaporization unit 52 is made of fluororesin such as PFA, metal and PFA are connected at the connecting portion between the central piping and the vaporization unit introduction valve 51. It is connected by a conversion joint with fluororesin. The second vaporization unit 52 is connected to the steam supply pipe 37 via the pressure control unit 36.

The vaporization unit introduction valve 51 is interlocked with a timer (not shown), and an opening / closing operation is executed by the control unit 7 with time management.

The second vaporizing unit 52 has an annular shape made of stainless steel, and is provided with a heater around it. The heater is a resistance heating type heater, but is not limited thereto. The pipe connected via the vaporization unit introduction valve 51 is spirally formed in the second vaporization unit 52 and is made of a fluorine resin such as PFA having an inner diameter of 4 mm and an outer diameter of 6 mm. The piping is made of a fluororesin such as PFA, but is not limited thereto. Moreover, although the piping in the 2nd vaporization unit 52 is formed in the helical form, if a heating area | region is ensured and fully vaporized in the 2nd vaporization unit 52, it will not restrict to this shape.

On the other hand, IPA is also supplied to the treatment liquid storage tanks 32a and 32b from the centralized piping of the factory equipment. As shown in FIG. 5, the concentrated piping of the factory equipment is connected to the processing liquid storage tanks 32a and 32b via the processing liquid storage tank introduction valves 53a and 53b. The treatment liquid storage tanks 32a and 32b are made of fluororesin such as quartz or PFA, and the central piping of the factory equipment is made of stainless steel. Therefore, in the introduction part of the treatment liquid storage tanks 32a and 32b, the metal and resin Connected with a conversion joint.

Next, the processing operation of the second embodiment will be described. In response to an instruction from the control unit 7, the processing liquid storage tank introduction valves 53a and 53b are opened, and IPA is supplied to the processing liquid storage tanks 32a and 32b. When IPA is supplied to the upper limit of the level gauge (not shown) of the processing liquid storage tanks 32a and 32b, the processing liquid storage tank introduction valves 53a and 53b are closed to stop the supply of IPA.

The timer setting of the vaporization unit introduction valve 51 is a relationship between the amount of IPA supplied in advance from the centralized piping and the amount consumed by pressurizing the IPA of the treatment liquid storage tanks 32a and 32b after being vaporized by the second vaporization unit 52. Is determined as data. The data is stored in the memory of the control unit 7, and the control unit 7 performs an opening / closing operation of the vaporization unit introduction valve 51. As another form, IPA can be supplied to the second vaporization unit 52 using a liquid flow meter with a minute flow rate. By acquiring the relationship between the IPA supply amount and the IPA vapor consumption amount as data in advance, an amount corresponding to the consumption amount can be supplied at a constant flow rate by the liquid flow meter. In this case, timer management is not necessarily required.

The IPA supplied to the second vaporization unit 52 is vaporized inside the pipe by the heating of the heater. Where it enters the second vaporization unit 52, it is still liquid, but is vaporized on the piping path to become vapor. By setting the set temperature of the heater to 100 ° C., the vapor pressure becomes 199.3 kPa. Since the atmospheric pressure is 101.3 kPa, the pressure is about 2 atm, and the IPA can be pressurized and pumped. The set temperature of the heater may be 100 ° C. or higher.

Since the operation after entering the pressure control unit 36 is the same as that of the first embodiment, the description thereof is omitted.

By doing in this way, the steam generation tank is unnecessary, the installation space for the vaporization unit can be saved, and the cost can be reduced.

In addition, although it is the process liquid supply part 6 demonstrated in the said embodiment, although it is preferable that the installation place of the process liquid supply part 6 exists in the inside of the substrate processing apparatus 1, it may be provided as an incidental equipment outside the apparatus. it can. If it is inside the substrate processing apparatus 1, the piping path can be designed in the shortest time, so the cost can be reduced. When it is provided outside the apparatus, it can be supplied to a plurality of substrate processing apparatuses. Moreover, although the supply method of IPA was demonstrated in the said embodiment, it can apply also when supplying other organic solvents and chemicals, such as hydrofluoroether.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Cassette stage 3 Substrate delivery part 4 Transfer part 5 Cleaning process part 6 Process liquid supply part 7 Control part 8 Pass 21 Substrate holding part 23 Cup 25 Discharge part 32a Process liquid storage tank 32b Process liquid storage tank 33 Vaporization unit 34a Steam generation tank 34b Heating heater 35 Safety valve 36 Pressure control unit 37 Steam supply piping 38 Line heater 39a Steam supply piping side valve 39b Steam supply piping side valve 40a Treatment liquid supply side valve 40b Treatment liquid supply side valve 41 Liquid supply piping 51 Vaporization Unit introduction valve 52 Second vaporization unit 53a Treatment liquid storage tank introduction valve 53b Treatment liquid storage tank introduction valve

Claims (7)

A substrate processing apparatus comprising: a holding unit that holds a substrate; a discharge unit that discharges a processing liquid to the substrate held by the holding unit; and a processing liquid supply unit that supplies the processing liquid to the discharge unit. The processing liquid supply unit includes a processing liquid storage tank capable of storing the processing liquid, a liquid supply pipe for supplying the processing liquid from the processing liquid storage tank to the discharge unit, and a liquid supply pipe. An intervening openable and closable liquid supply valve, a vaporization unit that generates vapor of the same substance as the treatment liquid, a vapor supply pipe for supplying the vapor from the vaporization unit to the treatment liquid storage tank, and the vapor supply A substrate comprising: a steam supply valve that can be opened and closed interposed in a pipe; and a pressure control unit connected to the steam supply pipe, wherein the processing liquid is pumped by vapor of the same material as the processing liquid. Processing equipment . The substrate processing apparatus according to claim 1, wherein the processing liquid is isopropyl alcohol. The substrate processing apparatus according to claim 1, wherein the processing liquid is hydrofluoroether. The substrate processing apparatus according to claim 1, further comprising a heating unit that holds the vapor supply pipe at a predetermined temperature. The processing liquid supply unit includes a second processing liquid storage tank, and the steam supply pipe from the vaporization unit to the second processing liquid storage tank via the pressure control unit and a second steam supply valve. The substrate processing apparatus according to claim 1, wherein the processing liquid in the second processing liquid storage tank is fed to the discharge unit. A processing liquid supply apparatus for supplying a processing liquid to a substrate processing apparatus for processing a substrate, wherein the processing liquid is stored in the processing liquid storage tank, and the processing liquid is sent from the processing liquid storage tank to the discharge unit. A liquid supply pipe, an openable / closable liquid supply valve interposed in the liquid supply pipe, a vaporization unit that generates vapor of the same material as the treatment liquid, and the vapor from the vaporization unit to the treatment liquid storage tank A steam supply pipe for opening and closing, an openable / closable steam supply valve interposed in the steam supply pipe, and a pressure control unit connected to the steam supply pipe, wherein the treatment liquid is a vapor of the same substance as the treatment liquid A treatment liquid supply apparatus, wherein the treatment liquid supply apparatus is pumped by the above. A processing liquid supply method for supplying a processing liquid from a processing liquid storage tank, comprising: preparing a processing liquid in the processing liquid storage tank; generating a vapor of the same substance as the processing liquid; A process liquid supply method comprising: adjusting to a pressure equal to or higher than atmospheric pressure; and supplying the steam to the process liquid storage tank.

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