JP2016109878A - Manufacturing method of optical panel for aerial imaging - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an optical panel for aerial imaging, by which crack in a flat plate or damage in a light reflection layer does not easily occur when laminating and bonding the plural flat plates.SOLUTION: A manufacturing method of an optical panel for aerial imaging includes a laminate forming step of forming a laminate 3 by laminating and bonding plural flat plates 30. The laminate forming step includes: a flat plate arranging process of interposing strings of soft thin wire 6 between the flat plates 30 and arranging the plural flat plates 30 to form a flat plate aggregate 3'; a flat plate immersing process of making a fluid bonding agent 4a flow into a laminate forming container 5 to immerse the flat plate aggregate 3'; a thin wire withdrawing process of withdrawing the strings of thin wire 6 above the flat plate aggregate 3'; a pressing process of pressing one end surface or both end surfaces of the flat plate aggregate 3'; and a bonding agent curing process of curing the bonding agent 4a to allow the flat plate aggregate 3' to form into the laminate 3.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a method for manufacturing an optical panel for aerial imaging.

  In recent years, there has been proposed an aerial imaging apparatus that forms an image of a stereoscopic image of a subject in the air on the other side when light from the subject (actual object) is incident from one side. This aerial imaging apparatus uses an aerial imaging optical panel, and it appears to the people on the other side that the subject is at the position of the stereoscopic image formed by the aerial imaging apparatus. Such an aerial imaging apparatus can be developed for application media such as an advertising medium such as digital signage and an aerial touch panel in which a stereoscopic image of the touch panel appears in the air.

  FIG. 9 shows an aerial imaging apparatus 1 having a simple structure. This aerial imaging apparatus 1 has basically the same structure as that described in Patent Documents 1 and 2. The aerial imaging apparatus 1 is configured by overlapping two aerial imaging optical panels 2 and 2 '. In the optical panel 2, a large number of light reflecting portions 22 are formed in the transparent flat plate 21 so as to extend vertically from the surface 21a on one side to the surface 21b on the other side of the transparent flat plate 21, and have a predetermined pitch. Are arranged in stripes. The optical panel 2 ′ also has a structure having a transparent flat plate 21 ′ and a light reflecting portion 22 ′ similar to the transparent flat plate 21 and the light reflecting portion 22 of the optical panel 2. In the aerial imaging apparatus 1, the two optical panels 2 and 2 'are overlapped and brought into close contact so that the light reflecting portions 22 and 22' are perpendicular to each other. The aerial imaging apparatus 1 reflects light from the subject N incident on one side of the optical panel 2 by a light reflecting portion 22 (a point indicated by a in FIG. 9), and reflects the reflected light of the optical panel 2 ′. The light is reflected again by the light reflecting portion 22 ′ (the point indicated by a ′ in FIG. 9), and the stereoscopic image N ′ is formed in the air on the other side.

  The outline of the manufacturing method of such an optical panel 2 is as follows. That is, first, the light reflecting layer 32 is attached to both surfaces or one surface of the transparent substrate 31 by metal vapor deposition or the like, thereby thinly (for example, about 0.2 to 3 mm) and a predetermined size (for example, 25 to 3 mm). A flat plate 30 of about 100 cm square is manufactured. Next, as shown in FIG. 10A, a large number of flat plates 30 (for example, about 500 to 1500) are stacked and bonded. By doing so, the laminated body 3 is formed as shown in FIG.10 (b). Next, the laminate 3 shown in FIG. 11A is cut in a direction perpendicular to the light reflecting layer 32 as shown in FIG. 11B, and a plurality of optical panels 2 are cut out. The cut surface is polished so that the panel 2 has a predetermined uniform thickness (for example, about 0.5 to 10 mm). The same applies to the optical panel 2 '.

JP 2011-175297 A JP 2013-220981 A

  By the way, the laminated body 3 in the optical panel 2 (and 2 ′) of the aerial imaging apparatus 1 has a very thin thickness (for example, about 5 μm) of the adhesive layer 4 that bonds the flat plates 30 and 30 to each other, and From the flat plate 30 located at one end of the laminated body 3 to the flat plate 30 located at the other end, it is necessary to keep constant with high accuracy. As a method for that, first, a large number of flat plates 30 are arranged at intervals between the flat plates 30 and 30 in a laminate forming container, and then a flowing adhesive is applied to the laminate. A large number of the flat plates 30 are immersed in the forming container, and the end surfaces of the flat plates 30 located at one end and / or the other end are gradually pressed to remove excess adhesive, and the adhesive is made to a desired thickness. What is cured is conceivable.

  However, since the flat plate 30 is thin and has the light reflecting layer 32 attached thereto, cracking of the flat plate 30 or damage to the light reflecting layer 32 may occur during the pressing process.

  The present invention has been made in view of the above-described reason, and an object thereof is an optical for aerial imaging that makes it difficult to break a flat plate or damage a light reflection layer when a plurality of flat plates are laminated and bonded. It is in providing the manufacturing method of a panel.

  In order to achieve the above object, the method of manufacturing an optical panel for aerial imaging according to claim 1 is a flat plate manufacturing process in which a plurality of flat plates are manufactured by attaching light reflecting layers to both surfaces or one surface of a transparent substrate. And a laminate forming step of forming a laminate by laminating and bonding the plurality of flat plates, and a cutting step of cutting the laminate in a direction perpendicular to the light reflecting layer to cut out a plurality of optical panels. A polishing step of polishing the cut-out surface of the optical panel so as to have a predetermined thickness, and the laminate forming step includes a plurality of the flat plates by interposing flexible thin wires between the flat plates. A flat plate array process for forming a flat plate assembly, a flat plate dipping process in which a flowing adhesive is allowed to flow into a laminate forming container to immerse the flat plate assembly, and the thin wire is placed above the flat plate assembly. Fine wire extraction processing and the flat plate A pressing process for pressing the one end face or both end faces of the polymer, and wherein the adhesive curing process, to carry out to the laminate the flat assembly by curing the adhesive.

  An aerial imaging optical panel manufacturing method according to claim 2 is the aerial imaging optical panel manufacturing method according to claim 1, wherein in the flat plate array processing, the flat plate is disposed between two poles. Is placed from the flat plate located at one end of the flat plate assembly to the flat plate located at the other end by folding back one continuous thin wire with the two poles, One of the pole-side folded portions is cut, or one of the poles is removed.

  The method for manufacturing an optical panel for aerial imaging according to claim 3 is the method for manufacturing an optical panel for aerial imaging according to claim 2, wherein, in the thin line extraction process, the other pole is pulled up. All of the thin lines in the flat plate assembly are extracted at once.

  The method for manufacturing an optical panel for aerial imaging according to claim 4 is the method for manufacturing the optical panel for aerial imaging according to any one of claims 1 to 3, wherein the flat plate dipping treatment includes: The direction of the arrangement of the flat plates in the flat plate assembly is a horizontal direction or an oblique direction.

  According to the method for manufacturing an optical panel for aerial imaging of the present invention, when a large number of flat plates are laminated and bonded, it is possible to prevent the flat plate from cracking or the light reflecting layer from being damaged.

1A and 1B show a laminate-forming container that can be used in a laminate-forming step of a manufacturing method of an optical panel for aerial imaging according to an embodiment of the present invention, where FIG. FIG. 2 is a front view (both viewed from a state where a housing component plate located in front of the sheet is removed). It is a typical perspective view which shows the flat plate arrangement | sequence process in a laminated body formation process same as the above, (a) shows one state and (b) shows the next state. It is a typical perspective view which shows the flat plate arrangement | sequence process in a laminated body formation process same as the above, Comprising: (a) shows the next state of FIG.2 (b), (b) shows the final state. It is a typical perspective view which shows the modification of the flat plate arrangement | sequence process in a laminated body formation process same as the above, Comprising: (a) shows one state and (b) shows the next state. It is a front view which shows the flat plate immersion process in a laminated body formation process same as the above. It is a front view which shows the thin wire extraction process in a laminated body formation process same as the above. It is a front view which shows the press process in a laminated body formation process same as the above. 1 is a schematic perspective view showing an example of an aerial imaging apparatus to which the above-described aerial imaging optical panel is applied, an object, and an entire stereoscopic image. FIG. It is a three-dimensional enlarged schematic diagram showing an aerial imaging apparatus to which the above-described aerial imaging optical panel is applied. It is explanatory drawing which shows the outline of the laminated body formation process to which the manufacturing method of the optical panel for aerial imaging same as the above is applied. It is explanatory drawing which shows the outline of the cutting-out process to which the manufacturing method of the optical panel for aerial imaging same as the above is applied.

  Embodiments of the present invention will be described below. An aerial imaging optical panel manufacturing method according to an embodiment of the present invention is the above-described aerial imaging optical panel 2, 2 ′ manufacturing method, which will be described below with reference to the drawings. , A laminate forming process, a cutting process, and a polishing process.

  The flat plate manufacturing step is a step of manufacturing a large number of flat plates 30 having a constant thickness by attaching the light reflecting layers 32 to both or one surface of the transparent substrate 31 (see FIG. 10A described above). As the transparent substrate 31, a transparent glass plate is usually used. In some cases, a transparent ceramic plate or the like is also possible. For example, the transparent substrate 31 having a size of about 25 to 100 cm square and a thickness of about 0.2 to 3 mm can be used. The light reflecting layer 32 is made of a material that reflects light well, such as a metal material (for example, aluminum, silver, copper, etc.), and is attached to the transparent substrate 31 by sputtering, vapor deposition, plating, or the like. The thickness of the light reflection layer 32 can be, for example, about several thousand angstroms.

  The laminated body forming step is a step of forming the laminated body 3 by laminating and bonding a large number of flat plates 30 as shown in FIGS. For example, the number of flat plates 30 to be stacked can be about 500 to 1500, and the height can be about 25 to 100 cm. If the light reflecting layer 32 to be attached to the transparent substrate 31 is a single surface, a large number of flat plates 30 are laminated so that the light reflecting layer 32 is located on one side.

  In detail, the laminated body forming step performs flat plate arrangement processing, flat plate dipping processing, thin wire extraction processing, press processing, and adhesive curing processing described later. Of course, other processes may be included.

  Specifically, the laminated body forming step can be performed using a laminated body forming container 5 as shown in FIGS. The laminated body forming container 5 forms a casing with six casing constituent plates 51 to 56 (for example, made of stainless steel). This housing is used after being disassembled as appropriate. A plurality of pairs of poles 57 and 57 ′ (two pairs in FIGS. 1A and 1B) can be erected on the casing constituting plate 51. The distance between the poles 57 and 57 'is the same as or slightly larger than the size of the flat plate 30. A press plate 58 (for example, made of stainless steel) can be provided inside the housing configuration plate 52 opposite to the housing configuration plate 51, and a press plate operating tool 58A for moving the press plate 58 can be provided. . Further, an adhesive outflow path 59 through which an adhesive 4a described later can be poured out can be provided.

  In the flat plate arrangement process, a flexible thin wire 6 is interposed between the flat plates 30 and 30, and a large number of flat plates 30 are arranged. The fine wires 6 are usually arranged at a plurality of locations (two locations in FIG. 2 and the like) in one space between the flat plates 30 and 30 so that the flat plates 30 do not incline and are substantially parallel to each other. . Moreover, each thin wire | line 6 passes between the flat plates 30 and 30, and is normally arrange | positioned so that it may protrude out of the flat plate 30. FIG. A large number of flat plates 30 arranged in this way constitute a flat plate assembly 3 '.

  This arrangement can be performed as follows using the laminate forming container 5 described above. First, the casing component plate 51 is used as the bottom, and the poles 57 and 57 'are in an upright state (see FIGS. 1A and 1B). The other casing constituent plates 52 to 56 are not normally assembled. Hereinafter, a description will be given based on FIG. 2 and FIG. In these drawings, the casing component plate 51 is not shown. In FIG. 2, FIG. 3 and other drawings, for easy illustration, the thickness of the flat plate 30 and the diameter of the thin wire 6 are shown enlarged, and the number of the many flat plates 30 is shown small.

  Then, the flat plate 30 provided with the protection plate 50 is placed between the poles 57 and 57 '. Next, as shown in FIG. 2A, the thin wire 6 whose one end is fixed to the pole 57 (for example, fixed with a tape or the like) is traversed on the flat plate 30. Subsequently, the next flat plate 30 (ordinary flat plate 30 not provided with the protective plate 50) is placed, and as shown in FIG. 2 (b), the thin wire 6 is folded back by a pole 57 ', and the flat plate Cross over 30. Subsequently, the next flat plate 30 is placed, and as shown in FIG. 3A, the thin wire 6 is folded back by a pole 57 and traversed on the flat plate 30. Repeat this process. And finally, as shown in FIG.3 (b), the flat plate 30 with which the protection board body 50 was provided is mounted. The folded portion of the thin wire 6 in the pole 57 is preferably fixed with tape or the like. Thus, the flat plate assembly 3 'can be configured. Note that the protective plate 50 is in close contact with the end surface of the flat plate 30 to protect the end surface, and a portion made in close contact with the end surface may be a ceramic plate such as alumina.

  Further, the arrangement method can be modified as follows. That is, after placing the flat plate 30 provided with the protective plate 50, as shown in FIG. 4A, the thin wire 6 is crossed over the flat plate 30 and folded back at the pole 57 ', and then crossed over the flat plate 30 again. Let Subsequently, the next flat plate 30 is placed, and as shown in FIG. 4B, the thin wire 6 is folded back at the pole 57, traversed on the flat plate 30 and folded back at the pole 57 ′, and again on the flat plate 30. To cross. Repeat this process. Finally, the flat plate 30 provided with the protection plate 50 is placed.

  In this way, by folding back at the poles 57 and 57 ', one continuous thin wire 6 can be arranged from the flat plate 30 located at one end of the flat plate assembly 3' to the flat plate 30 located at the other end. In this case, in order to extract the fine wire 6 from the pole 57 side in the fine wire extraction process described in detail later, the flat plate assembly 3 ′ is formed, and then the folded portion on the pole 57 ′ side is cut off by the pole 57 ′. The movement of the thin line 6 is not restricted. In the case as shown in FIGS. 4A and 4B, the pole 57 'can be removed.

  In addition, after assembling the other casing constituent plates 52 to 55, the flat plate assembly 3 ′ is operated by operating the press plate operating tool 58A so that the press plate 58 contacts the protective plate 50 of the flat plate assembly 3 ′. The position can be fixed. Further, in this example of the flat plate arrangement processing, the flat plates 30 are arranged upward, but the direction of the arrangement is not particularly limited until the flat plate immersion treatment described in detail later.

  The thin wire 6 is thin (for example, about 0.01 to 1 mm in diameter) synthetic fiber in consideration of flexibility and strength (particularly, flexibility and strength against pulling in the thin wire extraction process described in detail later). (For example, nylon or polyethylene) is preferable.

  The flat plate dipping treatment is a treatment in which the flowing adhesive 4a is caused to flow into the laminate forming container 5 and the flat plate aggregate 3 'is dipped. Thereby, the adhesive 4a flows between the flat plates 30 and 30. As the adhesive 4a, for example, an epoxy resin adhesive that cures in about 20 to 24 hours can be used. In the flat plate dipping treatment, the direction of the arrangement of the flat plates 30 in the flat plate assembly 3 ′ is preferably set to the horizontal direction (see FIG. 5). Then, even if the bubbles generated when the adhesive 4a is caused to flow into the laminate forming container 5 are present between the flat plates 30 and 30, they move upward and are released into the atmosphere after a while. The The direction of the arrangement of the flat plates 30 may be an oblique direction (a direction slightly inclined from the horizontal direction).

  As shown in FIG. 5, the flat plate dipping process using the laminate forming container 5 is performed with the casing constituting plate 55 as a bottom surface in a state where the casing constituting plates 51 to 55 are assembled. Reinstall container 5. The casing component plate 56 is not assembled. Then, an opening is formed on the upper surface of the laminate forming container 5. Then, the adhesive 4a is caused to flow from above.

  The thin line extraction process is a process of extracting the thin line 6 above the flat plate assembly 3 '. This process is performed while the adhesive 4a can flow. When the thin wire 6 is pulled from above, it is flexible even if there is a frictional resistance between the flat plates 30 and 30 on both sides of the thin wire 6, so that the wire 6 extends upward and shrinks somewhat. Thereby, the thin wire 6 can be extracted without damaging the flat plate 30 (in particular, the light reflection layer 32). When the thin wire 6 is extracted, the adhesive 4a flows, and the space between the flat plates 30 and 30 is filled with only the adhesive 4a.

  In the thin wire extraction process using the laminate forming container 5, the thin wire 6 is extracted above the flat plate assembly 3 'by pulling up the pole 57 as shown in FIG. As described above, at this time, the movement of the folded portion on the pole 57 'side in the thin wire 6 is not limited by the pole 57'. Therefore, by pulling up the pole 57, all of the thin wires 6 in the flat plate assembly 3 'can be extracted from the flat plate assembly 3' at a stroke without resistance.

  The pressing process is a process of gradually pressing one end surface or both end surfaces (usually one end surface) of the flat plate assembly 3 '. As a result, the space between the flat plates 30 and 30 is narrowed, and excess of the adhesive 4a filling the space is gradually discharged out of the flat plate assembly 3 '. And between the flat plates 30 and 30 is made into the desired very thin thickness (for example, about 5 micrometers).

  Here, in the flat plate assembly 3 ′, the gap between the flat plates 30 and 30 can be already narrowed in the flat plate arrangement process, so that the moving distance of each flat plate 30 is short. Therefore, the crack of the flat plate 30 accompanying the movement or the damage of the light reflection layer 32 does not easily occur.

  As shown in FIG. 7, the pressing process using the laminate forming container 5 moves the pressing plate 58 by operating the pressing plate operating tool 58 </ b> A in a state where the casing constituting plates 51 to 56 are assembled. The flat plate assembly 3 ′ is pressed through the protective plate 50. The adhesive 4a in the laminated body forming container 5 can be poured out by opening the adhesive outlet path 59. As shown in FIG. 7, this pressing process preferably causes the flat plate assembly 3 'to stand upright, that is, the arrangement direction of the flat plate assemblies 3' is set to the upright direction. In this case, the protection plate 30 is on the upper side and the lower side. The flat plate assembly 3 ′ may be upright when the distance between the flat plates 30 and 30 is shortened to some extent during the pressing process. From the flat plate dipping process to the completion of the press process, it is performed in a time (for example, within about 12 hours) in which the adhesive 4a can be kept in a flowable state.

  The adhesive curing process is a process for curing the adhesive 4a. Usually, the flat plate assembly 3 'is erected and left for a long time (for example, about 20 to 24 hours). As a result, the adhesive 4 a becomes the adhesive layer 4, and the flat plate assembly 3 ′ becomes the laminate 3. After the adhesive 4a is cured, a process of slightly removing the vicinity of the surface of the side surface of the laminated body 3 is performed. As a result, the adhesive 4a that has adhered and hardened on the side surface of the laminate 3 is also cut off. Moreover, the protection board bodies 50 and 50 provided on both sides of the laminated body 3 are removed.

  In the cutting process, as shown in FIGS. 11A and 11B described above, the laminated body 3 is cut in the vertical direction with respect to a large number of light reflecting layers 32 to cut out the optical panel 2 (or 2 ′). It is a process. As a cutting method, it is possible to employ outer peripheral blade cutting, inner peripheral blade cutting, blade saw cutting, wire saw cutting and the like. The peripheral blade cutting is a method in which a thin grinding wheel rotating at high speed is used as a cutting member and cutting is performed on the outer periphery thereof. The inner peripheral edge cutting is a method in which a donut-shaped thin grindstone that rotates at high speed is used as a cutting member and is cut at the inner periphery. The blade saw cutting is a method in which a thinly stretched thin plate (blade) is used as a cutting member and is cut while reciprocating. Wire saw cutting is a method in which a wire is used as a cutting member and is cut while reciprocating.

  The polishing step is a step of polishing the cut surface so that the optical panel 2 (or 2 ') has a predetermined uniform thickness (for example, about 0.5 to 10 mm). Further, after the polishing process, it is possible to perform processing such as adjusting the outer shape of the optical panel 2 (or 2 ') as necessary.

  As shown in FIG. 9 described above, the manufactured optical panel 2 has a large number of light reflecting portions 22 in the transparent flat plate 21 extending from one surface 21 a to the other surface 21 b of the transparent flat plate 21. They are formed perpendicular to them and arranged in stripes at a predetermined pitch. A large number of pieces of the transparent substrate 31 used for manufacturing constitute the transparent flat plate 21 of the optical panel 2, and each of the pieces of the light reflecting layer 32 becomes the light reflecting portion 22. The thickness of the flat plate 30 is a predetermined pitch between the light reflecting portions 22. The same applies to the transparent flat plate 21 ′ and the light reflecting portion 22 ′ of the optical panel 2 ′ manufactured in the same manner as the optical panel 2.

  The above-described aerial imaging apparatus 1 is configured by bringing two optical panels 2 and 2 'into close contact with each other so that the respective light reflecting portions 22 and 22' are perpendicular to each other. The optical panel 2 and the optical panel 2 'are fixed with an optical adhesive or the like. It can then be cut into various planar shapes.

  As shown in FIG. 9 described above, the aerial imaging apparatus 1 reflects light from the subject N incident on one side of the optical panel 2 by the light reflecting section 22 and reflects the reflected light of the optical panel 2 ′. The light is reflected again by the light reflecting portion 22 ′, and the stereoscopic image N ′ is formed in the air on the other side (see FIG. 8).

  As described above, the optical panel 2, 2 ′ in which cracking of the flat plate 30 or damage to the light reflecting layer 32 is eliminated, and bubbles are not left in the adhesive 4 a, that is, the adhesive layer 4, is used for imaging. It is possible to suppress deterioration of characteristics and deterioration of physical strength over time.

  The method for manufacturing the optical panel for aerial imaging according to the embodiment of the present invention has been described above. However, the present invention is not limited to that described in the above-described embodiment, and the matters described in the claims. Various design changes can be made within the range. For example, the size and thickness of the flat plate 30, the number of sheets to be stacked, and the like can be appropriately determined according to the application equipment.

DESCRIPTION OF SYMBOLS 1 Aerial imaging device 2 Optical panel 21 Transparent flat plate 22 Light reflection part 3 Laminate 3 'Flat plate assembly 30 Flat plate 31 Transparent substrate 32 Light reflection layer 4 Adhesive layer 4a Adhesive 5 Laminate formation container 50 Protective plate 51- 56 Housing component plates 57, 57 'Pole 58 Press plate 58A Press plate operating tool 6 Fine wire

Claims (4)

A flat plate manufacturing process for manufacturing a large number of flat plates by attaching a light reflecting layer to both or one side of a transparent substrate;
A laminated body forming step of laminating and bonding the multiple flat plates to form a laminated body;
Cutting out the plurality of optical panels by cutting the laminate in a direction perpendicular to the light reflecting layer;
A polishing step of polishing the cut-out surface of the optical panel to a predetermined thickness,
The laminate forming step includes
A flat plate arrangement process in which a flexible thin wire is interposed between the flat plates, and a plurality of the flat plates are arranged to form a flat plate assembly,
A flat plate dipping treatment in which a flowing adhesive is allowed to flow into the laminate forming container to immerse the flat plate assembly;
A thin wire extraction process for extracting the thin wire above the flat plate assembly;
A pressing process for pressing one end face or both end faces of the flat plate assembly;
An adhesive curing process for curing the adhesive to make the flat plate assembly the laminate;
A method of manufacturing an optical panel for aerial imaging. In the manufacturing method of the optical panel for aerial imaging according to claim 1,
In the flat plate arrangement process, the flat plate is placed between two poles, and the continuous single thin wire is folded back by the two poles, thereby the flat plate positioned at one end of the flat plate assembly. A method for producing an optical panel for aerial imaging, wherein the optical plate for aerial imaging is characterized by disposing up to the flat plate located at the other end and then cutting off the folded portion on one pole side or removing one pole. In the manufacturing method of the optical panel for aerial imaging according to claim 2,
In the thin line extraction process, an optical panel for aerial imaging is characterized in that all of the thin lines in the flat plate assembly are extracted at once by pulling up the other pole. In the manufacturing method of the optical panel for aerial imaging of any one of Claims 1-3,
The method for manufacturing an optical panel for aerial imaging, characterized in that, in the flat plate immersion treatment, the direction of the arrangement of the flat plates in the flat plate assembly is a horizontal direction or an oblique direction.

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