JP2016100351A - Electronic component built-in substrate and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component built-in substrate in which, even when distortion occurs due to application of a voltage on an electronic component embedded in a resin layer, vibration thereof is reduced and further occurrence of audible sound caused by the vibration is prevented or suppressed, and to provide a method of manufacturing the electronic component built-in substrate.SOLUTION: An electronic component built-in substrate 1 includes: a core substrate B: an electronic component 10 mounted on one principal surface of the core substrate B with a joint member S; and a resin layer R provided with the electronic component 10 embedded therein. The electronic component 10 includes: a ceramic laminate body 11; and a first external electrode 12 having an end surface portion TP12 and a second external electrode 13 having an end surface portion TP13, which each are mounted on an end surface of the ceramic laminate body 11. A surface of the resin layer R in contact with the end surface portion TP12 of the first external electrode 12 and the joint member S includes a first non-adhesive surface UA1, and a surface of the resin layer R in contact with the end surface portion TP13 of the second external electrode 13 and the joint member S includes a second non-adhesive surface UA2.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electronic component built-in substrate including a core substrate, an electronic component mounted on one main surface of the core substrate, and a resin layer provided by embedding the electronic component, and a method for manufacturing the same. .

  2. Description of the Related Art In recent years, with the reduction in thickness of portable electronic devices, an electronic component-embedded substrate that has been made thinner by embedding electronic components inside the substrate, as in International Publication No. 2011/135926 (Patent Document 1) Has been proposed.

  FIG. 11 is a cross-sectional view of the electronic component built-in substrate 100 described in Patent Document 1. In FIG. In the electronic component built-in substrate 100 shown in FIG. 11, electronic components 101 and 102 are mounted on a core substrate 108, and a resin layer 109 is formed so that these electronic components 101 and 102 are embedded.

  Such an electronic component built-in substrate 100 is light in weight and does not accompany high-temperature firing like a ceramic substrate, and therefore has an advantage that there are few restrictions on the electronic components incorporated.

  Here, a multilayer ceramic capacitor is considered as the electronic components 101 and 102 embedded in the resin layer 109 of the electronic component built-in substrate 100 described in Patent Document 1. FIG. 12 shows a cross-sectional view of the multilayer ceramic capacitor 201.

  The multilayer ceramic capacitor 201 includes a ceramic multilayer body 202 and a first external electrode 203 and a second external electrode 204 provided on the surface of the ceramic multilayer body 202. The ceramic laminate 202 is a laminate in which capacitor elements each having a ceramic dielectric layer 205 inserted between a first internal electrode 206 and a second internal electrode 207 are connected in parallel. Such a multilayer ceramic capacitor 201 is excellent in reliability and durability, and can realize a large capacity while being small.

  The small-sized and large-capacity monolithic ceramic capacitor 201 often uses a ceramic material having a high dielectric constant based on barium titanate as the material of the ceramic dielectric layer 205 constituting the ceramic laminate 202. When a voltage is applied to the multilayer ceramic capacitor 201 including such a ceramic multilayer body 202, a distortion corresponding to the magnitude of the applied voltage is generated in the ceramic multilayer body 202 due to the electrostrictive effect and the inverse piezoelectric effect. Along with this, the ceramic laminate 202 repeatedly expands in the stacking direction and contracts in the plane direction orthogonal to the stacking direction.

  In recent years, with the progress of miniaturization and thinning of the multilayer ceramic capacitor 201, the strength of the electric field applied to the dielectric has increased, and thus the degree of distortion of the ceramic multilayer body 202 has also increased.

  Here, as shown in FIG. 13A, consider a case where the multilayer ceramic capacitor 201 is mounted on the substrate B by a joining member S such as solder. When a voltage is applied to the multilayer ceramic capacitor 201, as shown in FIG. 13B, the distortion generated in the ceramic multilayer body 202 causes the substrate B that is fixed to the multilayer ceramic capacitor 201 via the bonding member S. Vibrate.

  Such vibration of the substrate B may cause malfunction of the acceleration sensor when an acceleration sensor such as a shock sensor is mounted on the substrate B.

  Further, when the frequency is 20 Hz to 20 kHz which is an audible range, it is recognized as an audible sound by a human ear. This phenomenon is also referred to as “acoustic noise”, and has become a design issue in power supply circuits of various applications such as notebook computers, mobile phones, digital cameras, etc. as electronic devices become quieter.

International Publication No. 2011/135926

  When the multilayer ceramic capacitor 201 is mounted on the substrate B with the bonding member S as described above and is embedded in the resin layer as described in Patent Document 1, the bonding member S and the resin layer are both distorted in the ceramic laminate 202. May be transmitted to the substrate B. In that case, there is a concern that the vibration of the substrate B described above becomes large and the audible sound becomes large.

  Accordingly, an object of the present invention is to incorporate an electronic component in which vibration is reduced and generation of audible sound due to vibration is prevented or reduced even when distortion due to application of voltage occurs in an electronic component embedded in a resin layer. It is to provide a substrate and a manufacturing method thereof.

  In the present invention, even if a distortion occurs due to application of a voltage to an electronic component embedded in the resin layer, the resin component is reduced in order to reduce vibration of the electronic component built-in substrate and to prevent or reduce generation of audible sound due to vibration. Improvements are made in the form of the layers.

  The present invention is first directed to an electronic component built-in substrate.

  An electronic component built-in substrate according to the present invention is provided by embedding a core substrate, at least one electronic component mounted on one main surface of the core substrate by a bonding member, and an electronic component embedded in one main surface of the core substrate. A resin layer formed thereon.

  The electronic component is a multilayer capacitor including a multilayer body, a first external electrode, and a second external electrode.

  The multilayer body includes a capacitance developing portion in which a capacitor element in which a dielectric layer is inserted between the first internal electrode and the second internal electrode is stacked, and a first sandwiching the capacitance developing portion. A protection part and a second protection part. Moreover, a laminated body has two end surfaces which mutually oppose, and a side surface which connects two end surfaces.

  The first external electrode and the second external electrode have an end surface portion provided on the end surface of the multilayer body, and are connected to the first internal electrode and the second internal electrode at the end surface portion, respectively.

  The surface of the resin layer in contact with the end surface portion of the first external electrode and the joining member on the end surface portion includes the first non-adhesive surface, and the end surface portion of the second external electrode and the end surface portion thereof The surface in contact with the upper joining member includes the second non-adhesive surface.

  In the above electronic component built-in substrate, the surface of the resin layer in contact with the end surface portion of the first external electrode and the bonding member on the end surface portion includes the first non-adhesive surface, and the second external electrode The surface in contact with the end surface portion and the joining member on the end surface portion includes the second non-adhesive surface. For this reason, even when a distortion due to voltage application occurs in the electronic component, the distortion in which the end surface of the electronic component is a concave surface is not transmitted to the resin layer (see FIG. 13B).

  Therefore, since the distortion in the vicinity of the end face of the electronic component through the resin layer is only intermittently transmitted to the core substrate by a half wave, the vibration of the electronic component built-in substrate is reduced, and generation of audible sound due to the vibration is prevented or reduced. The

  In a preferred embodiment of the electronic component built-in substrate according to the present invention, the surface of the resin layer that is in contact with the portion not covered with the first external electrode and the second external electrode of the laminate is the third non-adhesive. Including face.

  In the electronic component built-in substrate, in addition to the first non-adhesive surface and the second non-adhesive surface, the resin layer is not covered with the first external electrode and the second external electrode of the laminate. The contacting surface includes a third non-adhesive surface. For this reason, even when distortion due to voltage application occurs in the electronic component, in addition to the distortion in which the end surface of the electronic component is a concave surface, the distortion in which the side surface is a concave surface is not transmitted to the resin layer.

  Therefore, by further suppressing the transmission of the distortion of the electronic component to the core substrate through the resin layer, the vibration of the electronic component built-in substrate is further reduced, and the generation of audible sound due to the vibration is effectively prevented or reduced. The

  The present invention is also directed to a method for manufacturing an electronic component built-in substrate.

    A method for manufacturing an electronic component built-in substrate according to the present invention includes a core substrate, at least one electronic component mounted on one main surface of the core substrate by a bonding member, and an electronic component embedded in one main surface of the core substrate. An electronic component built-in substrate provided with a resin layer provided as a target.

  The electronic component is a multilayer capacitor including a multilayer body, a first external electrode, and a second external electrode.

  The multilayer body includes a capacitance developing portion in which a capacitor element in which a dielectric layer is inserted between the first internal electrode and the second internal electrode is stacked, and a first sandwiching the capacitance developing portion. A protection part and a second protection part. Moreover, a laminated body has two end surfaces which mutually oppose, and a side surface which connects two end surfaces.

  The first external electrode and the second external electrode have an end surface portion provided on the end surface of the multilayer body, and are connected to the first internal electrode and the second internal electrode at the end surface portion, respectively.

  And the manufacturing method of the electronic component built-in substrate which concerns on this invention is equipped with the mounting process, the adhesion inhibiting material provision process, the uncured resin layer provision process, and the resin layer formation process.

  The mounting process is a process of mounting an electronic component on one main surface of the core substrate.

  The adhesion inhibiting material applying step includes at least a part on the end surface portion of the first external electrode of the electronic component mounted on the core substrate and the bonding member on the end surface portion, on the end surface portion of the second external electrode, and In this step, an adhesion inhibiting material is applied to at least a part of the joining member on the end surface.

  An uncured resin layer provision process is a process of providing the uncured resin layer which embed | buries the electronic component which provided the adhesion inhibitor in the one main surface of a core board | substrate.

  In the resin layer forming step, the uncured resin layer is heated and cured, and at least part of the surface of the resin layer that is in contact with the end surface portion of the first external electrode and the bonding member on the end surface portion by the adhesion inhibiting material. Is a first non-adhesive surface, and at least a part of the surface of the resin layer in contact with the end surface portion of the second external electrode and the joining member on the end surface portion is a second non-adhesive surface. is there.

  In the manufacturing method of the electronic component built-in substrate, by providing these steps, the vibration of the electronic component built-in substrate is reduced, and the electronic component built-in substrate in which generation of audible sound due to vibration is prevented or reduced can be efficiently performed. Can be manufactured.

  In a preferred embodiment of the method for manufacturing an electronic component built-in substrate according to the present invention, the adhesion inhibiting material application step is performed on at least a part of the laminate not covered with the first external electrode and the second external electrode. This is a step of further applying an adhesion inhibiting material.

  In addition to the heat curing of the uncured resin layer and the formation of the first non-adhesive surface and the second non-adhesive surface, the resin layer forming step includes the first step of the laminate of the resin layer by the adhesion inhibitor. In this step, at least a part of the surface in contact with the external electrode and the portion not covered with the second external electrode is a third non-adhesive surface.

  In the manufacturing method of an electronic component built-in substrate, the electronic component built-in substrate in which vibrations of the electronic component built-in substrate are further reduced and generation of audible sound due to vibration is effectively prevented or reduced by including these steps. Can be manufactured efficiently.

  In the electronic component built-in substrate according to the present invention, the surface of the resin layer in contact with the end surface portion of the first external electrode and the bonding member on the end surface portion includes the first non-adhesive surface, and the second external surface The end surface portion of the electrode and the surface in contact with the bonding member on the end surface portion include the second non-adhesive surface. For this reason, even if a distortion occurs due to voltage application in the electronic component, the distortion in which the end surface of the electronic component becomes a concave surface is not transmitted to the resin layer.

  Therefore, since the distortion in the vicinity of the end face of the electronic component through the resin layer is only intermittently transmitted to the core substrate by a half wave, the vibration of the electronic component built-in substrate is reduced, and generation of audible sound due to the vibration is prevented or reduced. The

  Moreover, the manufacturing method of the electronic component built-in substrate according to the present invention includes a mounting step, an adhesion inhibiting material applying step, an uncured resin layer applying step, and a resin layer forming step.

  Then, in the adhesion inhibiting material application step, on the end surface portion of the first external electrode of the electronic component mounted on the core substrate and on the bonding member on the end surface portion, on the end surface portion of the second external electrode and on the end surface thereof An adhesion inhibiting material is applied on the bonding member on the part.

  Furthermore, in the resin layer forming step, when the uncured resin layer is heat-cured, the adhesion inhibiting material causes the end surfaces of the first and second external electrodes of the resin layer and the bonding members on those end surfaces to The surfaces in contact with each other are defined as first and second non-adhesive surfaces, respectively.

  Therefore, the vibration of the electronic component built-in substrate is reduced by this manufacturing method, so that the electronic component built-in substrate in which generation of audible sound due to vibration is prevented or reduced can be efficiently manufactured.

1 is a top view of an electronic component built-in substrate 1 according to an embodiment of the present invention. 1 is a cross-sectional view of an electronic component built-in substrate 1 according to an embodiment of the present invention. (A) is arrow sectional drawing of the surface containing the Y1-Y1 line | wire of FIG. (B) is an arrow directional cross-sectional view of the surface containing the X1-X1 line | wire of FIG. FIGS. 1A and 1B are diagrams for explaining an example of the manufacturing method of the electronic component built-in substrate 1 according to the embodiment of the present invention, in which FIGS. 1A and 1B are a mounting process, and FIG. It is a figure which shows an inhibiting material provision process typically. FIG. 1 is a view for explaining an example of a manufacturing method of an electronic component built-in substrate 1 according to an embodiment of the present invention shown in FIGS. 1 and 2, and (A) shows an uncured resin layer application step, and (B) and ( C) is a diagram schematically showing a resin layer forming step. It is a top view equivalent to FIG. 1 of the 1st modification 1A in the electronic component built-in substrate which concerns on embodiment of this invention. It is sectional drawing equivalent to FIG. 2 of 1st modification 1A in the electronic component built-in board | substrate which concerns on embodiment of this invention. It is a top view equivalent to FIG. 1 of the 2nd modification 1B in the electronic component built-in board | substrate which concerns on embodiment of this invention. It is sectional drawing equivalent to FIG. 2 of the 2nd modification 1B in the electronic component built-in board | substrate which concerns on embodiment of this invention. It is a top view equivalent to FIG. 1 of the 3rd modification 1C in the electronic component built-in board | substrate which concerns on embodiment of this invention. It is sectional drawing equivalent to FIG. 2 of the 3rd modification 1C in the electronic component built-in board | substrate which concerns on embodiment of this invention. It is sectional drawing of the electronic component built-in board | substrate 100 of background art. It is sectional drawing of the laminated ceramic capacitor for demonstrating the subject which this invention tends to solve. It is sectional drawing of the state which mounted the multilayer ceramic capacitor in the board | substrate for demonstrating the subject which this invention tends to solve. (A) is a state in which no voltage is applied. (B) is a schematic sectional drawing explaining the state of distortion when a voltage is applied.

  Embodiments of the present invention will be described below to describe the features of the present invention in more detail.

-Embodiment of electronic component built-in substrate-
An electronic component built-in substrate 1 according to an embodiment of the present invention will be described with reference to FIGS.

<Electronic component built-in substrate structure>
FIG. 1 is a top view of an electronic component built-in substrate 1 according to an embodiment of the present invention. A dotted line in FIG. 1 represents each component of the electronic component 10 when the resin layer R is seen through, and the first mounting land L11 and the second mounting land L12. 2A is a cross-sectional view of the plane including the Y1-Y1 line of FIG. 2B is a cross-sectional view taken along the line X1-X1 in FIG.

  An electronic component built-in substrate 1 according to an embodiment of the present invention includes a core substrate B, an electronic component 10 mounted on one main surface of the core substrate B by a bonding member S, and an electronic component on one main surface of the core substrate B. And a resin layer R provided with 10 embedded therein.

  The core substrate B is a multilayer substrate corresponding to FIG. 11 described above, and is illustrated in a simplified manner with internal electrodes and vias not shown. In the embodiment of the present invention, in order to emphasize the electronic component 10, the size relationship between the core substrate B and the electronic component 10 is different from the actual one.

  The electronic component 10 is a multilayer ceramic capacitor including a ceramic multilayer body 11, a first external electrode 12, and a second external electrode 13. The ceramic multilayer body 11 includes a capacitance developing portion CP in which a capacitor element in which a ceramic dielectric layer 14 is inserted between a first internal electrode 15 and a second internal electrode 16 is laminated. The structure is sandwiched between the ceramic protection part P1 and the second ceramic protection part P2. The ceramic laminate 11 has two end faces that face each other and a side face that connects the two end faces.

  Since the ceramic dielectric layer 14 has an electrostrictive property or an inverse piezoelectric effect, the electronic component 10 including the ceramic dielectric layer 14 is distorted when a voltage is applied. As a typical ceramic material having an electrostrictive property or an inverse piezoelectric effect, for example, a high dielectric constant ceramic material having barium titanate as a basic material can be given.

  In this embodiment, the multilayer ceramic capacitor is illustrated as the electronic component 10 as described above. However, the present invention is a multilayer metallization in which the dielectric layer is a multilayer capacitor composed of a resin material as the electronic component 10. The present invention can also be applied when a film capacitor is used.

  The first external electrode 12 and the second external electrode 13 are each provided on the surface of the ceramic laminate 11. The first external electrode 12 has an end face portion TP12 provided on one end face of the ceramic laminate 11, and a side face portion SP12 extending from the end face portion TP12 to the side face of the ceramic laminate 11. The second external electrode 13 has an end surface portion TP13 provided on the other end surface of the ceramic multilayer body 11, and a side surface portion SP13 extending from the end surface portion TP13 to the side surface of the ceramic multilayer body 11. The end surface portion TP12 of the first external electrode 12 and the end surface portion TP13 of the second external electrode 13 do not have to cover the entire end surface of the ceramic laminate 11.

  The first external electrode 12 is connected to the first internal electrode 15 at the end face portion TP12, and the second external electrode 13 is connected to the second internal electrode 16 at the end face portion TP13.

  In this embodiment, the electronic component 10 is mounted on the core substrate B such that the stacking direction of the capacitor elements of the ceramic multilayer body 11 is orthogonal to one main surface of the core substrate B. In the stacking direction, the lower side of the capacitance developing portion CP, that is, the portion located between the capacitance developing portion CP and one main surface of the core substrate B in the ceramic laminate 11 is the first protective portion. P1 and the upper side of the capacitance developing part CP is the second protection part P2.

  In the electronic component built-in substrate 1 according to the embodiment of the present invention, the electronic component 10 may be mounted on the core substrate B such that the stacking direction of the capacitor elements is along one main surface of the core substrate B.

  2A and 2B, the electronic component 10 is connected to the first mounting land L11 and the second mounting land L12 using a bonding member S. The material of the first mounting land L11 and the second mounting land L12 and the material of the joining member can be appropriately selected from existing ones. As the joining member S, for example, solder, a conductive adhesive, a via conductor, or the like can be used. The first mounting land L11 and the second mounting land L12 are on a wiring including a conductive pattern (not shown). A voltage is applied to the electronic component 10 through this wiring.

  The electronic component built-in substrate 1 according to the embodiment of the present invention may have a plurality of electronic components 10 mounted thereon. Similarly, electronic components other than the multilayer ceramic capacitor may be mounted on the electronic component built-in substrate 1.

  As will be described later, the resin layer R is formed using a resin material in which a glass material or silica is dispersed as a filler. The resin layer R is provided on one main surface of the core substrate B so as to embed the electronic component 10. Note that a conductive material portion may be formed on the surface of the resin layer R.

  Since the electronic component 10 that is a multilayer ceramic capacitor is often made of a high dielectric constant ceramic material based on barium titanate as described above, there is a risk of vibration due to distortion during voltage application. This vibration is transmitted to the substrate B fixed to the electronic component 10 via the bonding member S. However, when the electronic component 10 is embedded in the resin layer R, the substrate is also transmitted via the resin layer R. B can be transmitted.

  On the other hand, in the electronic component built-in substrate 1 according to the embodiment of the present invention, the surface of the resin layer R that is in contact with the end surface portion TP12 of the first external electrode 12 and the joining member S on the end surface portion TP12 is the first. A non-adhesive surface UA1 is included. Further, the surface of the resin layer R that is in contact with the end surface portion TP13 of the second external electrode 13 and the bonding member S on the end surface portion TP13 includes a second non-adhesive surface UA2.

  The first non-adhesive surface UA1 and the second non-adhesive surface UA2 are represented as hatched portions in FIG. 1 showing a case where the resin layer R is seen through from the upper surface. Moreover, in FIG. 2A which is a cross-sectional view of the plane including the Y1-Y1 line, it is represented as a thick dotted line portion seen through the resin layer R. Furthermore, in FIG. 2B, it is represented as a thick solid line portion.

  Here, each non-adhesion surface of the resin layer R is in contact with the end surface portion of each external electrode and the bonding member on each end surface portion in a state where no voltage is applied to the electronic component 10, but the adhesion is It refers to the surface that is not. In addition, there is a possibility that inclusions such as an adhesion inhibiting material used in the manufacturing method described later remain between the resin layer R and the end surface portions of the external electrodes and the bonding members on the end surface portions. However, this state is also regarded as a state in which the resin layer R is in contact with the end surface portion of each external electrode and the bonding member on each end surface portion.

  As a result, when the resin layer R is distorted so that the end surface portion of each external electrode and the joining member on each end surface portion are separated from the resin layer R, the resin layer R does not follow the distortion. This distortion corresponds to the distortion illustrated in FIG. 13B in which the end surface of the electronic component 10 becomes concave when a voltage is applied.

  That is, in the electronic component built-in substrate 1 according to the embodiment of the present invention, even when the electronic component 10 is distorted due to voltage application, the distortion in which the end surface of the electronic component 10 is concave is not transmitted to the resin layer R.

  Therefore, since the distortion in the vicinity of the end face of the electronic component 10 through the resin layer R is only intermittently transmitted to the core substrate B by a half wave, the vibration of the electronic component built-in substrate 1 is reduced and audible sound is generated due to the vibration. Prevented or reduced.

  In FIG. 1 and FIG. 2, the first non-adhesive surface UA1 and the second non-adhesive surface UA2 have the same shape, but the present invention is not limited to this, and the first non-adhesive surface UA1 and the second non-adhesive surface UA2 are the same. The non-adhesion surface UA2 may have an asymmetric shape.

  Further, when the bonding member S connects the side surface portion SP12 of the first external electrode 12 and the first mounting land L11 and does not cover the end surface portion TP12, the resin layer R of the first external electrode 12 The surface in contact with the end surface portion TP12 may include the first non-adhesive surface UA1. Similarly, when the joining member S connects the side surface portion SP13 of the second external electrode 13 and the second mounting land L12 and does not cover the end surface portion TP13, the second external electrode 13 of the resin layer R is used. The surface in contact with the end surface portion TP13 may include the second non-adhesive surface UA2.

  Further, of the surfaces of the resin layer R that are in contact with the end surface portion TP12 of the first external electrode 12 and the bonding member S on the end surface portion TP12, the surface that is in contact with the capacitance developing portion CP is the first. The non-adhesive surface UA1 may be included. Similarly, among the surfaces of the resin layer R that are in contact with the end surface portion TP13 of the second external electrode 13 and the bonding member S on the end surface portion TP13, the surface that is in contact with the capacitance developing portion CP is the second. The non-adhesive surface UA2 may be included.

  When a voltage is applied to the electronic component 10, a distortion corresponding to the magnitude of the applied voltage is generated in the ceramic laminate 11 due to the electrostrictive effect and the inverse piezoelectric effect. Is due to.

  Therefore, if the surface of the resin layer R on the capacitance developing portion CP that is in contact with the end surface portion of each external electrode and the bonding member S on each end surface portion includes a non-adhesive surface, as described above. Vibration of the electronic component built-in substrate 1 is reduced, and generation of audible sound due to vibration is prevented or reduced.

  In the embodiment shown in FIGS. 1 and 2, the thickness of the first protective part P1 and the thickness of the second protective part P2 of the ceramic laminate 11 are substantially the same. You may make the thickness of the 1st protection part P1 of the components 10 thicker than the thickness of the 2nd protection part P2.

<Method for manufacturing electronic component built-in substrate>
An example of the manufacturing method of the electronic component built-in substrate 1 according to the embodiment of the present invention will be described with reference to FIGS. 3 and 4 are diagrams schematically showing a mounting step, an adhesion inhibiting material applying step, an uncured resin layer applying step, and a resin layer forming step, which are sequentially performed in the example of the method for manufacturing the electronic component built-in substrate 1. is there. Each of FIGS. 3 and 4 corresponds to an arrow cross-sectional view (FIG. 2B) of a plane including the X1-X1 line of FIG.

<Mounting process>
3A and 3B are diagrams schematically showing a mounting process of the method for manufacturing the electronic component built-in substrate 1. Through the mounting process, the electronic component 10 is mounted on one main surface of the core substrate B.

  FIG. 3A shows a stage of preparing the electronic component 10 and the core substrate B on which the electronic component 10 is mounted. The electronic component 10 is a multilayer ceramic capacitor having the above-described structure and generating distortion when a voltage is applied. The core substrate 10 includes a first mounting land L11 and a second mounting land L12 (second mounting land L12 not shown) for joining the electronic component 10 on one main surface.

  FIG. 3B shows a stage in which the electronic component 10 is mounted on one main surface of the core substrate 10 by bonding the electronic component 10 to the first mounting land L11 and the second mounting land L12 using the bonding member S. . In the case of FIG. 3 (B), the electronic component 10 has a structure in which the stacking direction, which is the direction in which the capacitor elements of the ceramic laminate 11 are stacked, is orthogonal to the one main surface of the core substrate B. It is mounted on the substrate B. As described above, the electronic component 10 may be mounted on the core substrate B so that the stacking direction of the capacitor elements is along one main surface of the core substrate B.

<Adhesion inhibiting material application process>
FIG. 3C is a diagram schematically showing an adhesion inhibiting material applying step of the method for manufacturing the electronic component built-in substrate 1. The bonding member S on the end surface portion TP12 and the end surface portion TP12 of the first external electrode 12 and on the end surface portion TP13 and the end surface portion TP13 of the second external electrode 13 by the adhesion inhibiting material applying step. It will be in the state where adhesion inhibition material RL was given to the upper part. The adhesion-inhibiting material RL is represented as a thick solid line portion in FIG.

  As the adhesion inhibiting material RL, for example, a silicone-based or fluorine-based release agent can be used. Application of the adhesion-inhibiting material RL to each end surface portion and each joining member can be performed by using a liquid adhesion-inhibiting material RL with a dispenser or spray (not shown).

  FIG. 3C shows a case where the adhesion inhibiting material RL is applied on each end face part and each joining member so as to have the same volume using the same material. On the other hand, the adhesion inhibiting material RL may use different materials on the first external electrode 12 side and the second external electrode 13 side. Moreover, you may provide so that it may become a different area by the 1st external electrode 12 side and the 2nd external electrode 13 side. Furthermore, you may provide so that it may cover partially on each end surface part and each joining member.

<Uncured resin layer application step>
FIG. 4A is a diagram schematically illustrating an uncured resin layer application step of the method for manufacturing the electronic component built-in substrate 1. By the uncured resin layer application step, the uncured resin layer UCR is applied to one main surface of the core substrate B, and the electronic component 10 to which the adhesion inhibiting material RL is applied is embedded.

  In FIG. 4A, the one main surface of the core substrate B on which the electronic component 10 to which the adhesion inhibiting material RL is applied is mounted has a predetermined thickness represented by a one-dot chain line by, for example, the dispenser D. A mode that liquid resin LR is apply | coated is shown.

  The apparatus used for coating is not limited to the dispenser D, and an existing coating apparatus can be used. For example, various coaters such as a curtain coater and a spin coater may be used.

  The liquid resin LR is not limited to a single resin material, and a resin material containing a glass material or silica as a filler can be used.

  The uncured resin layer UCR is not limited to the method of applying the liquid resin LR as shown in FIG. 4A, and a sheet-like prepreg is placed on one main surface of the core substrate B in a semi-cured state. Alternatively, it may be applied by pressing so that the electronic component 10 to which the adhesion inhibiting material RL is applied is embedded.

<Resin layer forming step>
4B and 4C are diagrams schematically showing a resin layer forming step of the method for manufacturing the electronic component built-in substrate 1. By the resin layer forming step, the uncured resin layer UCR is heated and cured, and the electronic component 10 is embedded in the one main surface of the core substrate B so that the resin layer R is provided. At that time, the portion to which the adhesion inhibiting material RL is imparted by the above-described adhesion inhibiting material imparting step becomes a non-adhesive surface.

  FIG. 4B shows a stage in which the uncured resin layer UCR in which the electronic component 10 provided with the adhesion inhibiting material RL is embedded is heat-cured. At this stage, the adhesion inhibiting material RL may be absorbed into the uncured resin layer UCR. On the other hand, the adhesion inhibiting material RL may remain as an inclusion on the resin layer R, each end surface portion of the external electrode, and between each joining member.

  As a result, of the surface of the resin layer R that is in contact with the end surface portion TP12 of the first external electrode 12 and the joining member S on the end surface portion TP12, the portion to which the adhesion inhibiting material RL is applied is the first non-adhesive. It becomes surface UA1. Of the surface of the resin layer R that is in contact with the end surface portion TP13 of the second external electrode 13 and the joining member S on the end surface portion TP13, the portion to which the adhesion inhibiting material RL is applied is the second non-adhesive surface. It becomes UA2.

  4C, the electronic component 10 is embedded by the above process, and the resin layer R including the first non-adhesive surface UA1 and the second non-adhesive surface UA2 is provided on one main surface of the core substrate B. The stage in which the electronic component built-in substrate 1 according to the embodiment of the present invention is completed is shown.

  Adjustment of the thickness of the resin layer R is preferably performed by applying the liquid resin LR to the core substrate B in consideration of a volume change when the uncured resin layer UCR is cured. Alternatively, a large amount of liquid resin LR may be applied in advance, and the excess resin may be removed after curing to set the thickness of the resin layer to a desired value.

<First Modification of Embodiment>
A first modification 1A of the electronic component built-in substrate according to the embodiment of the present invention will be described with reference to FIGS.

  The first modification 1A of the electronic component built-in substrate according to the embodiment of the present invention is different from the above-described electronic component built-in substrate 1 in the aspect of the non-adhesive surface included in the resin layer R, but is otherwise common. Therefore, description of common parts is omitted. The core substrate B is illustrated in a simplified manner as in the above-described embodiment.

  FIG. 5 is a top view of a first modification 1A of the electronic component built-in substrate according to the embodiment of the present invention. FIG. 6A is a cross-sectional view taken along the line Y2-Y2 in FIG. FIG. 6B is a cross-sectional view taken along the line X2-X2 in FIG.

  In the first modification 1A of the electronic component built-in substrate according to the embodiment of the present invention, in addition to the first non-adhesive surface UA1 and the second non-adhesive surface UA2, the resin layer R of the ceramic laminate 11 A surface in contact with a portion not covered with the first external electrode 12 and the second external electrode 13 includes a third non-adhesive surface UA3.

  5 and FIG. 6, the third non-adhesive surface UA3 surrounds the side surface of the ceramic laminate 11 in an annular shape, and is connected to the first non-adhesive surface UA1 and the second non-adhesive surface UA2. The case where it becomes the non-adhesion surface UA is shown.

  The integral non-adhesive surface UA is represented as a hatched portion in FIG. 5 showing a case where the resin layer R is seen through from the upper surface. Moreover, in FIG. 6 (A) which is a cross-sectional view of the plane including the Y2-Y2 line, the thick solid line portion and the thick dotted line portion seen through the resin layer R are shown. Furthermore, in FIG. 6B, it is represented as a thick solid line portion.

  A first modified example 1A of the electronic component built-in substrate according to the above-described embodiment is an electronic component 10 mounted on one main surface of the core substrate B in the adhesion inhibiting material applying step of the above-described electronic component built-in substrate manufacturing method. It is manufactured by applying an adhesion inhibiting material so as to wrap the material.

  That is, in the first modification 1A of the electronic component built-in substrate according to the embodiment of the present invention, even if the electronic component 10 is distorted due to voltage application, in addition to the distortion in which the end surface of the electronic component 10 is concave, Strain whose side surface is concave is not transmitted to the resin layer R.

  Therefore, by further suppressing the transmission of the distortion of the electronic component 10 to the core substrate B through the resin layer R, the vibration of the electronic component built-in substrate 1A is further reduced, and the generation of audible sound due to the vibration is effectively generated. Prevented or reduced.

  FIG. 6B shows a case where the first non-adhesive surface UA1, the second non-adhesive surface UA2, and the third non-adhesive surface UA3 are connected to form an integrated non-adhesive surface UA. However, as shown in FIG. 6C, each may be formed independently.

  Moreover, about the aspect of formation of 1st non-adhesion surface UA1 and 2nd non-adhesion surface UA2, it can apply to the above-mentioned embodiment.

<Second Modification of Embodiment>
A second modification 1B of the electronic component built-in substrate according to the embodiment of the present invention will be described with reference to FIGS.

  In the second modification 1B of the electronic component built-in substrate according to the embodiment of the present invention, the aspect of the electronic component 10 is different from the electronic component built-in substrate 1 described above, but the other parts are the same. The description of is omitted. The core substrate B is illustrated in a simplified manner as in the above-described embodiment.

  FIG. 7 is a top view of a second modification 1B of the electronic component built-in substrate according to the embodiment of the present invention. FIG. 8A is a cross-sectional view taken along the line Y3-Y3 in FIG. FIG. 8B is a cross-sectional view taken along the line X3-X3 in FIG.

  In the second modification 1B of the electronic component built-in substrate according to the embodiment of the present invention, the electronic component 10 is a multilayer capacitor with electrode terminals. The multilayer capacitor with electrode terminals includes a first electrode terminal T11 having one side connected to the first external electrode 12 by a bonding member S, and a second electrode terminal T12 having one side connected to the second external electrode 13. Is provided.

  In the electronic component 10, the other side of the first electrode terminal T11 is connected to the first mounting land L11 by the bonding member S, and the other side of the second electrode terminal T12 is connected to the second mounting land L12. As a result, it is mounted on one main surface of the core substrate B.

  In the second modification 1B of the electronic component built-in substrate according to the embodiment of the present invention, the surface of the resin layer R that is in contact with the first electrode terminal T11 and the bonding member S on the first electrode terminal T11 is 1 non-bonded surface UA1. The surface of the resin layer R that is in contact with the second electrode terminal T12 and the bonding member S on the second electrode terminal T12 includes a second non-adhesive surface UA2.

  The first non-adhesive surface UA1 and the second non-adhesive surface UA2 are represented as hatched portions in FIG. 7 showing a case where the resin layer R is seen through from the upper surface. Moreover, in FIG. 8A which is a cross-sectional view of the plane including the Y3-Y3 line, it is represented as a thick dotted line portion seen through the resin layer R. Furthermore, in FIG. 8B, it is represented as a thick solid line portion.

  In the electronic component built-in substrate 1B, since the resin layer R includes a non-adhesive surface at the above-described location, the distortion in which the end surface of the electronic component 10 is a concave surface is transmitted to the resin layer as in the electronic component built-in substrates 1 and 1A described above. Not.

  Therefore, since the distortion in the vicinity of the end face of the electronic component 10 through the resin layer R is only intermittently transmitted to the core substrate B by a half wave, the vibration of the electronic component built-in substrate 1B is reduced and audible sound is generated due to the vibration. Prevented or reduced.

  FIG. 8B shows a case where the first non-adhesive surface UA1 and the second non-adhesive surface UA2 reach the first mounting land L11 and the second mounting land L12, respectively. On the other hand, as shown in FIG. 8C, each non-adhesive surface may stop in the middle of the portion where the first electrode terminal T11 and the second electrode terminal T12 are upright with respect to the core substrate B. Good.

<Third Modification of Embodiment>
A third modification 1C of the electronic component built-in substrate according to the embodiment of the present invention will be described with reference to FIGS.

  The third modification 1C of the electronic component built-in substrate according to the embodiment of the present invention is different from the above-described electronic component built-in substrates 1, 1A, and 1B in the aspect of the electronic component 10, but is otherwise common. The description of common parts is omitted. The core substrate B is illustrated in a simplified manner as in the above-described embodiment.

  FIG. 9 is a top view of a third modification 1C of the electronic component built-in substrate according to the embodiment of the present invention. FIG. 10A is a cross-sectional view taken along the line Y4-Y4 in FIG. FIG. 10B is a cross-sectional view taken along the line X4-X4 in FIG.

  In the third modification 1C of the electronic component built-in substrate according to the embodiment of the present invention, the electronic component 10 has a so-called interposer I. The interposer I has one main surface and the other main surface that are substantially parallel to each other, the third mounting land IL11 and the fourth mounting land IL12 are provided on the one main surface, and the first main surface is provided on the other main surface. Mounting electrode IL21 and second mounting electrode IL22 are provided. The third mounting land IL11 and the fourth mounting land IL12 are electrically connected to the first mounting electrode IL21 and the second mounting electrode IL22, respectively.

  The third mounting land IL11 and the fourth mounting land IL12 of the interposer I are connected to the first external electrode 12 and the second external electrode 13 by the bonding member S, respectively. Further, the first mounting electrode IL21 and the second mounting electrode IL22 provided on the other main surface of the interposer I are joined to the first mounting land L11 and the second mounting land on the core substrate B by the bonding member S, respectively. L12 is connected.

  In the third modification 1C of the electronic component built-in substrate according to the embodiment of the present invention, the resin layer R has the end surface portion TP12 of the first external electrode 12, the joining member S on the end surface portion TP12, the interposer I, and the interposer. The surface in contact with the joining member S that connects I and the first mounting land L11 includes the first non-adhesive surface UA1. Further, the resin layer R is in contact with the end surface portion TP13 of the second external electrode 13, the bonding member S on the end surface portion TP13, the interposer I, and the bonding member S that connects the interposer I and the second mounting land L12. The surface to be included includes the second non-adhesive surface UA2.

  The first non-adhesive surface UA1 and the second non-adhesive surface UA2 are represented as hatched portions in FIG. 9 showing a case where the resin layer R is seen through from the upper surface. Moreover, in FIG. 10A which is a cross-sectional view of the plane including the Y4-Y4 line, it is represented as a thick dotted line portion seen through the resin layer R. Furthermore, in FIG. 10B, it is represented as a thick solid line portion.

  In the electronic component built-in substrate 1C, since the resin layer R includes a non-adhesive surface at the above-described location, the distortion in which the end surface of the electronic component 10 is a concave surface is the same as the above-described electronic component built-in substrates 1, 1A and 1B. Not transmitted to.

  Accordingly, since the distortion in the vicinity of the end face of the electronic component 10 through the resin layer R is only intermittently transmitted to the core substrate B by a half wave, the vibration of the electronic component built-in substrate 1C is reduced and audible sound is generated due to the vibration. Prevented or reduced.

  FIG. 8B shows a case where the first non-adhesive surface UA1 and the second non-adhesive surface UA2 reach the first mounting land L11 and the second mounting land L12, respectively. On the other hand, as shown in FIG. 8C, each non-adhesive surface may be stopped on the upper surface of the interposer I.

  In addition, this invention is not limited to said embodiment, A various application and deformation | transformation are possible within the scope of this invention.

1 Electronic component built-in substrate 10 Electronic component (multilayer ceramic capacitor)
DESCRIPTION OF SYMBOLS 11 Ceramic laminated body 12 1st external electrode 13 2nd external electrode 14 Ceramic dielectric layer 15 1st internal electrode 16 2nd internal electrode B Core board | substrate CP Capacitance expression part P1 1st ceramic protection part P2 Second ceramic protective part R Resin layer S Joining member TP12 End face part TP13 of the first external electrode End face part UA1 of the second external electrode First non-adhesive face UA2 Second non-adhesive face UA3 Third non-adhesive Surface UCR Uncured resin layer RL Adhesion inhibitor

Claims (4)

A core substrate;
At least one electronic component mounted on one main surface of the core substrate by a bonding member;
An electronic component built-in substrate comprising: a resin layer embedded in the electronic component on one main surface of the core substrate,
The electronic component includes a capacitance developing portion in which a capacitor element in which a dielectric layer is inserted between a first internal electrode and a second internal electrode is laminated, and a first electrode sandwiching the capacitance developing portion. A laminated body having two end faces facing each other and a side face connecting the two end faces, and an end face provided on the end face of the laminated body. A multilayer capacitor comprising: a first external electrode and a second external electrode connected to the first internal electrode and the second internal electrode, respectively, at the end surface portion;
The surface of the resin layer in contact with the end surface portion of the first external electrode and the bonding member on the end surface portion includes a first non-adhesive surface, and the end surface portion of the second external electrode and the end surface An electronic component built-in substrate, wherein a surface in contact with a bonding member on the part includes a second non-adhesive surface.   The surface of the resin layer that is in contact with a portion of the laminate that is not covered with the first external electrode and the second external electrode includes a third non-adhesive surface. Item 9. The electronic component built-in substrate according to Item 1. An electronic component comprising: a core substrate; at least one electronic component mounted on one main surface of the core substrate; and a resin layer provided by embedding the electronic component on one main surface of the core substrate A method of manufacturing a built-in substrate,
The electronic component includes a capacitance developing portion in which a capacitor element in which a dielectric layer is inserted between a first internal electrode and a second internal electrode is laminated, and a first electrode sandwiching the capacitance developing portion. A laminated body having two end faces facing each other and a side face connecting the two end faces, and an end face provided on the end face of the laminated body. A multilayer capacitor comprising: a first external electrode and a second external electrode connected to the first internal electrode and the second internal electrode, respectively, at the end surface portion;
A mounting step of mounting the electronic component on one main surface of the core substrate;
At least part of the electronic component mounted on the core substrate on the end surface portion of the first external electrode and on the joining member on the end surface portion, on the end surface portion of the second external electrode, and the end surface portion An adhesion inhibiting material applying step of applying an adhesion inhibiting material to at least a part of the upper joining member;
An uncured resin layer application step for applying an uncured resin layer for embedding the electronic component to which the adhesion inhibitor has been applied to one main surface of the core substrate;
The uncured resin layer is cured by heating, and at least part of the surface of the resin layer that is in contact with the end surface portion of the first external electrode and the bonding member on the end surface portion is formed by the adhesion inhibitor. A non-adhesive surface of the resin layer, and at least a part of the surface of the resin layer in contact with the end surface portion of the second external electrode and the bonding member on the end surface portion is a second non-adhesive surface Forming process;
A method for manufacturing an electronic component built-in substrate, comprising: In the adhesion inhibiting material application step, the adhesion inhibiting material is further applied to at least a part of the laminate that is not covered with the first external electrode and the second external electrode,
In the resin layer forming step, in addition to the heat curing of the uncured resin layer and the formation of the first non-adhesive surface and the second non-adhesive surface, the lamination of the resin layer by the adhesion inhibitor 4. The method according to claim 3, wherein at least a part of a surface of the body that is in contact with a portion that is not covered with the first external electrode and the second external electrode is a third non-adhesive surface. The manufacturing method of the electronic component built-in board of description.

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