JP2016094659A - Production method of metal composite membrane for hydrogen permeation - Google Patents
Production method of metal composite membrane for hydrogen permeation Download PDFInfo
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- 239000001257 hydrogen Substances 0.000 title claims abstract description 154
- 229910052739 hydrogen Inorganic materials 0.000 title claims abstract description 154
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 title claims abstract description 147
- 239000012528 membrane Substances 0.000 title claims abstract description 91
- 239000002905 metal composite material Substances 0.000 title claims abstract description 70
- 238000004519 manufacturing process Methods 0.000 title claims description 45
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 133
- 238000007747 plating Methods 0.000 claims abstract description 116
- 229910052751 metal Inorganic materials 0.000 claims abstract description 80
- 239000002184 metal Substances 0.000 claims abstract description 80
- 239000004094 surface-active agent Substances 0.000 claims abstract description 55
- 238000000034 method Methods 0.000 claims abstract description 39
- 238000010438 heat treatment Methods 0.000 claims abstract description 22
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 10
- -1 alkyl ether sulfate Chemical class 0.000 claims description 31
- 238000009713 electroplating Methods 0.000 claims description 17
- 150000002815 nickel Chemical class 0.000 claims description 11
- 239000003945 anionic surfactant Substances 0.000 claims description 10
- 239000011148 porous material Substances 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 7
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 239000007789 gas Substances 0.000 abstract description 11
- 230000035699 permeability Effects 0.000 abstract description 6
- 229910052759 nickel Inorganic materials 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 105
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 25
- 229910045601 alloy Inorganic materials 0.000 description 25
- 239000000956 alloy Substances 0.000 description 25
- 229910052763 palladium Inorganic materials 0.000 description 21
- 229910001316 Ag alloy Inorganic materials 0.000 description 12
- 239000011521 glass Substances 0.000 description 12
- 229910002668 Pd-Cu Inorganic materials 0.000 description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 9
- 229910001252 Pd alloy Inorganic materials 0.000 description 9
- 150000002431 hydrogen Chemical class 0.000 description 8
- 239000010409 thin film Substances 0.000 description 8
- 238000004544 sputter deposition Methods 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 6
- 238000005868 electrolysis reaction Methods 0.000 description 6
- 238000000635 electron micrograph Methods 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000001556 precipitation Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000000446 fuel Substances 0.000 description 3
- 239000002563 ionic surfactant Substances 0.000 description 3
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003915 liquefied petroleum gas Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003002 pH adjusting agent Substances 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000344 soap Substances 0.000 description 2
- 159000000000 sodium salts Chemical class 0.000 description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- ULUAUXLGCMPNKK-UHFFFAOYSA-N Sulfobutanedioic acid Chemical compound OC(=O)CC(C(O)=O)S(O)(=O)=O ULUAUXLGCMPNKK-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001335 aliphatic alkanes Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000007942 carboxylates Chemical group 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- YRIUSKIDOIARQF-UHFFFAOYSA-N dodecyl benzenesulfonate Chemical group CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 YRIUSKIDOIARQF-UHFFFAOYSA-N 0.000 description 1
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 1
- 229940071161 dodecylbenzenesulfonate Drugs 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000003502 gasoline Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- PSZYNBSKGUBXEH-UHFFFAOYSA-M naphthalene-1-sulfonate Chemical compound C1=CC=C2C(S(=O)(=O)[O-])=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-M 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 239000006174 pH buffer Substances 0.000 description 1
- RCMHUQGSSVZPDG-UHFFFAOYSA-N phenoxybenzene;phosphoric acid Chemical class OP(O)(O)=O.C=1C=CC=CC=1OC1=CC=CC=C1 RCMHUQGSSVZPDG-UHFFFAOYSA-N 0.000 description 1
- FURYAADUZGZUGQ-UHFFFAOYSA-N phenoxybenzene;sulfuric acid Chemical class OS(O)(=O)=O.C=1C=CC=CC=1OC1=CC=CC=C1 FURYAADUZGZUGQ-UHFFFAOYSA-N 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 1
- 229940081974 saccharin Drugs 0.000 description 1
- 235000019204 saccharin Nutrition 0.000 description 1
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 description 1
- 229940038773 trisodium citrate Drugs 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Landscapes
- Separation Using Semi-Permeable Membranes (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
本発明は、燃料電池等に用いられる水素透過金属膜及びその製造技術に係り、より詳しくはパラジウム（Ｐｄ）合金膜を薄肉化し、その支持体として多孔質ニッケル（Ｎｉ）層を用いた金属複合水素透過膜とその製造方法に関する。 The present invention relates to a hydrogen permeable metal membrane used for fuel cells and the like and a manufacturing technique thereof. More specifically, the present invention relates to a metal composite using a thin palladium (Pd) alloy membrane and a porous nickel (Ni) layer as a support. The present invention relates to a hydrogen permeable membrane and a manufacturing method thereof.
水素透過膜は、メタン含有ガス、液化石油ガス（ＬＰＧ）、ガソリン、軽油、灯油、メチルシクロヘキサン、ジメチルエテルなどの気体または液体の炭化水素と水蒸気、及びメタノール、およびアルコール類と水（水蒸気）を用いる燃料改質装置等において、水素を分離精製するために使用される。通常の水素透過金属膜は、圧延法による金属薄膜単体でできているか、これを多孔質のセラミック補強支持体と貼り合わせることにより形成されている。
しかしながら、水素透過金属膜を多孔質のセラミック補強支持体に安定した状態で形成することは困難である。セラミック補強支持体は当該水素透過金属膜の振動や熱応力の発生によりセラミック自体が割れ易く、実用に必要な大面積を有したセラミック支持体の作成が困難である。かつ水素透過膜はセラミック支持体との接合は物理的な接触のみであるため、繰り返しの利用を経ると互いに剥離し、透過膜の破損が起こり、ピンホールが発生しやすく安定した水素透過性能を維持することが難しい。又、金属薄膜単体は展延法で作成できるが、少なくとも２０μｍの厚みとなってしまう。水素透過金属膜の形成に使用されるＰｄ及びこれらの合金は、非常に高価であるため、膜厚を均一かつ薄くすることが要求されている。
Hydrogen permeable membranes contain methane-containing gas, liquefied petroleum gas (LPG), gasoline, light oil, kerosene, methylcyclohexane, dimethyl ether and other gas or liquid hydrocarbons and water vapor, methanol, alcohols and water (water vapor). It is used to separate and purify hydrogen in the fuel reformer used. A normal hydrogen permeable metal film is made of a metal thin film formed by a rolling method, or is formed by laminating it with a porous ceramic reinforcing support.
However, it is difficult to stably form a hydrogen permeable metal film on a porous ceramic reinforced support. The ceramic reinforced support easily breaks due to vibration of the hydrogen permeable metal film and generation of thermal stress, and it is difficult to produce a ceramic support having a large area necessary for practical use. In addition, since the hydrogen permeable membrane is only physically contacted with the ceramic support, it peels off after repeated use, causing damage to the permeable membrane, resulting in pinholes and stable hydrogen permeability. Difficult to maintain. Moreover, although a metal thin film single-piece | unit can be produced by the spreading method, it will become a thickness of at least 20 micrometers. Since Pd and their alloys used for forming a hydrogen permeable metal film are very expensive, it is required to make the film thickness uniform and thin.
そこで、従来、非常に高価な金属及びそれらの合金の使用量を減少し、これまでの水素透過金属膜より薄くて均一な厚みの薄膜をピンホールの無い状態で形成して、その後水素透過性金属以外の別種の多孔質金属補強支持体で水素透過膜を補強した金属複合水素透過膜が開発されている（特許文献１参照）。この方法はセラミックス支持体層を用いず、金属支持体を用いるため、振動、熱応力に強く実用に必要な大面積化が可能である。この金属複合水素透過膜は、逆ビルドアップ法を用いた製膜方法により製造されるもので、Ｐｄ及びＰｄ−Ａｇ合金又はＰｄ−Ｃｕ合金からなる水素透過金属膜をプラスチック板やガラス板等の仮支持担体の表面にスパッタリング等を用いて堆積形成することにより、以前の水素透過金属膜と比較してその膜厚を薄く形成することができるので、単位面積あたりの水素透過量を格段に向上させることができ、かつ高価な水素透過金属膜（Ｐｄ及びＰｄ−Ａｇ合金、Ｐｄ及びＰｄ−Ｃｕ合金）の使用量を減少できるという効果を奏する。さらに、その金属複合水素透過膜の製造方法（逆ビルドアップ法）によれば、膜厚が薄くても水素透過金属膜にピンホールの発生を抑制することができること、等の効果が得られる。 Therefore, in the past, the amount of very expensive metals and their alloys was reduced, and a thin film with a uniform thickness was made thinner than the conventional hydrogen permeable metal film without any pinholes. A metal composite hydrogen permeable membrane in which the hydrogen permeable membrane is reinforced with another kind of porous metal reinforced support other than metal has been developed (see Patent Document 1). Since this method uses a metal support without using a ceramic support layer, it is strong against vibration and thermal stress, and can have a large area necessary for practical use. This metal composite hydrogen permeable membrane is manufactured by a film forming method using a reverse build-up method, and a hydrogen permeable metal membrane made of Pd and Pd—Ag alloy or Pd—Cu alloy is used as a plastic plate or a glass plate. By depositing the surface of the temporary support using sputtering etc., the film thickness can be reduced compared to the previous hydrogen permeable metal film, so the amount of hydrogen per unit area can be greatly improved. And the amount of expensive hydrogen permeable metal film (Pd and Pd—Ag alloy, Pd and Pd—Cu alloy) used can be reduced. Furthermore, according to the manufacturing method (reverse buildup method) of the metal composite hydrogen permeable membrane, effects such as the ability to suppress the generation of pinholes in the hydrogen permeable metal membrane can be obtained even if the film thickness is small.
しかしながら、上記した特許文献１に記載の金属複合水素透過膜は、ガラスやプラスチック板等の仮支持担体の下塗り層表面に予め水素透過金属膜を被覆形成して、その後この水素透過金属膜を補強支持するために水素透過金属膜上に別種の金属膜を多孔状に被覆形成して多孔質金属膜で被覆補強して、さらに下塗り層を溶解して仮支持担体を取り外す、逆ビルドアップ法により作成されるが、水素透過金属膜上に施す金属補強支持体としてＮｉを用いた場合、この従来技術ではＮｉ支持体層の多孔質化が困難であり、水素透過量を増大できないという課題がある。 However, the metal composite hydrogen permeable membrane described in Patent Document 1 described above is formed by previously coating a hydrogen permeable metal membrane on the surface of the undercoat layer of a temporary support carrier such as glass or a plastic plate, and then reinforcing the hydrogen permeable metal membrane. In order to support, a metal film of another kind is formed on the hydrogen permeable metal film in a porous form, and the coating is reinforced with a porous metal film. Further, the undercoat layer is dissolved and the temporary support carrier is removed. Although it is prepared, when Ni is used as a metal reinforcing support to be applied on the hydrogen permeable metal film, it is difficult to make the Ni support layer porous with this conventional technique, and there is a problem that the hydrogen permeation amount cannot be increased. .
本発明は、従来技術の前記課題を解決するためになされたもので、多孔質金属補強支持体にＮｉを用いる場合、めっき浴中に特定の有機物質を添加することによりＮｉ支持体層の多孔質化を可能とし、ガス透過性に優れ、かつ強度を確保できるめっき皮膜を有する金属複合水素透過膜とその製造方法を提案しようとするものである。 The present invention has been made to solve the above-mentioned problems of the prior art. When Ni is used for the porous metal reinforcing support, the porous structure of the Ni support layer can be obtained by adding a specific organic substance to the plating bath. An object of the present invention is to propose a metal composite hydrogen permeable membrane having a plating film capable of improving the quality, having excellent gas permeability and ensuring strength, and a method for producing the same.
本発明者らは、逆ビルドアップ法により作成される金属複合水素透過膜に関して、Ｎｉ支持体層の多孔質化を可能とし、ガス透過性に優れ、かつ強度を確保できるめっき皮膜を有する金属複合水素透過膜を得る手段について種々研究を重ねた結果、Ｎｉ支持体層の多孔質化のためにはＮｉめっき浴中に特定の有機物質、即ち、界面活性剤を添加することが有効であることを知見し、特に、イオン性のもので、金属との吸着性が強い性質の界面活性剤を適度な濃度でＮｉめっき浴中に添加することにより、Ｎｉ支持体層の多孔質化が可能であることを見出した。
即ち、本発明に係る金属複合水素透過膜は、多孔質金属補強支持体にＮｉを用いた逆ビルドアップ法により作成される金属複合水素透過膜であって、水素透過金属膜上に、めっき浴中に添加された界面活性剤を共析させためっき皮膜を熱処理（高温加熱処理）して皮膜中界面活性剤のみを燃焼除去して得られた、めっき皮膜中に膜厚方向に貫通した空孔を有する多孔質化したＮｉめっき皮膜から成る多孔質Ｎｉ支持体層を有することを特徴とするものである。
又、本発明に係る金属複合水素透過膜の製造方法は、多孔質金属補強支持体にＮｉを用いた逆ビルドアップ法により作成される金属複合水素透過膜の製造方法において、仮支持担体の一表面上に設けた可溶性下塗り層上に水素透過金属膜であるＰｄ及びＰｄ−Ａｇ合金膜あるいはＰｄ及びＰｄ−Ｃｕ合金膜等の合金層を形成した後、該合金層からなる水素透過金属膜上に金属補強支持体としてＮｉめっきを施す工程において、界面活性剤を添加しためっき浴を調製し、直流あるいはパルス電解法を用い析出初期において前記界面活性剤を下地材料に分散吸着させ、得られためっき皮膜を電気炉等で熱処理することにより皮膜中の界面活性剤を焼散させて膜厚方向に貫通した空孔を有する多孔質化したＮｉめっき皮膜を得ることを特徴とするものである。
ここで、Ｎｉめっき浴中の界面活性剤の種類と濃度、めっき皮膜成膜時の浴温及びパルス電解条件、めっき皮膜中の界面活性剤を焼散させるための熱処理条件（高温加熱処理条件）は、水素透過性に優れ、かつ強度が確保できるめっき皮膜が得られるように適正に設定する。
The present inventors have made a metal composite hydrogen permeable membrane produced by a reverse build-up method, which enables the Ni support layer to be porous, has a gas permeability and has a plating film that can ensure strength. As a result of various studies on means for obtaining a hydrogen permeable membrane, it is effective to add a specific organic substance, that is, a surfactant, to the Ni plating bath in order to make the Ni support layer porous. In particular, it is possible to make the Ni support layer porous by adding a surfactant that is ionic and has a strong property of adsorbing metal to the Ni plating bath at an appropriate concentration. I found out.
That is, the metal composite hydrogen permeable membrane according to the present invention is a metal composite hydrogen permeable membrane prepared by a reverse buildup method using Ni as a porous metal reinforcing support, and a plating bath is formed on the hydrogen permeable metal membrane. The plating film co-deposited with the surfactant added inside was heat-treated (high-temperature heat treatment) to burn and remove only the surfactant in the film. It has a porous Ni support layer made of a porous Ni plating film having pores.
The method for producing a metal composite hydrogen permeable membrane according to the present invention is a method for producing a metal composite hydrogen permeable membrane produced by a reverse buildup method using Ni for a porous metal reinforced support. After forming an alloy layer such as a Pd and Pd-Ag alloy film or a Pd and Pd-Cu alloy film as a hydrogen permeable metal film on a soluble undercoat layer provided on the surface, the hydrogen permeable metal film made of the alloy layer In the step of applying Ni plating as a metal reinforcing support, a plating bath to which a surfactant was added was prepared, and the surfactant was dispersed and adsorbed on the base material at the initial stage of deposition using a direct current or pulse electrolysis method. The plating film is heat-treated in an electric furnace or the like to disperse the surfactant in the film to obtain a porous Ni plating film having pores penetrating in the film thickness direction. It is.
Here, the type and concentration of the surfactant in the Ni plating bath, the bath temperature and pulse electrolysis conditions at the time of plating film formation, and the heat treatment conditions (high-temperature heat treatment conditions) for burning the surfactant in the plating film Is appropriately set so as to obtain a plating film having excellent hydrogen permeability and ensuring strength.
上記したように、本発明の金属複合水素透過膜は、特許文献１に記載の従来の金属複合水素透過膜に比較してＮｉめっき皮膜が多孔質化されていることにより、単位面積あたりの水素透過量の増大がはかられ、水素透過性能が格段に優れかつ水素透過時の加圧力にも耐え得る強度を有するという、優れた効果を奏するものである。又、本発明の金属複合水素透過膜の製造方法によれば、Ｎｉめっき浴中に有機添加剤、即ち、イオン性のもので、金属との吸着性が強い性質の界面活性剤を適正な濃度で添加し、かつめっき皮膜成膜時の浴温及びパルス電解条件、めっき皮膜中の界面活性剤を焼散させるための熱処理条件（高温加熱処理条件）等を適正に選択することにより、多孔質かつ高温強度の優れた水素透過膜用Ｎｉ支持体を得ることができるので、この水素透過性能の優れた金属複合水素透過膜を用いた燃料改質器によってより効率的に水素分離が可能となり、高効率・高純度水素製造に大きく寄与する。 As described above, the metal composite hydrogen permeable membrane of the present invention has a hydrogen per unit area because the Ni plating film is made porous compared to the conventional metal composite hydrogen permeable membrane described in Patent Document 1. The permeation amount is increased, and the hydrogen permeation performance is remarkably excellent, and the strength is sufficient to withstand the applied pressure during hydrogen permeation. Further, according to the method for producing a metal composite hydrogen permeable membrane of the present invention, an appropriate concentration of an organic additive, that is, an ionic surfactant having a strong adsorptivity with a metal, in an appropriate concentration in a Ni plating bath. By selecting the bath temperature and pulse electrolysis conditions during plating film formation, heat treatment conditions (high-temperature heat treatment conditions) to disperse the surfactant in the plating film, etc. In addition, since a Ni support for a hydrogen permeable membrane with excellent high-temperature strength can be obtained, hydrogen separation can be performed more efficiently by a fuel reformer using this metal composite hydrogen permeable membrane with excellent hydrogen permeability, Contributes greatly to high-efficiency and high-purity hydrogen production.
本発明の金属複合水素透過膜は、前記したように多孔質金属補強支持体にＮｉを用いた逆ビルドアップ法により作成される金属複合水素透過金属膜であって、めっき浴中に添加された界面活性剤を共析させためっき皮膜を熱処理（高温加熱処理）して皮膜中界面活性剤のみを燃焼除去して得られた、膜厚方向に貫通した空孔を有する多孔質化したＮｉめっき皮膜を備えたものである。具体的には、例えばＰｄ及びＰｄ−Ａｇ合金膜あるいはＰｄ及びＰｄ−Ｃｕ合金膜（水素透過金属膜）と、多孔質化したＮｉ支持体層からなり、界面活性剤が燃焼除去されて生じた空孔がガス（水素）通過路となることを特徴とするものである。なお、本発明においては、水素透過膜用の多孔質金属支持体を湿式めっきで作成することを前提とした場合、ベース金属としては低応力、高硬度、高温での相転移、コスト等を考慮し、多孔質金属支持体にＮｉを選定した。しかしながら前記［０００７］でしめした方法は一般性がありＮｉ以外のメッキ用金属にも適用でき、多孔質金属支持体の材質はＮｉに限定するものではない。 The metal composite hydrogen permeable membrane of the present invention is a metal composite hydrogen permeable metal membrane prepared by the reverse buildup method using Ni as the porous metal reinforcing support as described above, and added to the plating bath. Porous Ni plating with pores penetrating in the film thickness direction, obtained by heat treating (high temperature heat treatment) the plating film co-deposited with the surfactant and burning only the surfactant in the film. It has a film. Specifically, for example, it is made of a Pd and Pd—Ag alloy film or a Pd and Pd—Cu alloy film (hydrogen permeable metal film) and a porous Ni support layer, and is generated by burning off the surfactant. The holes are gas (hydrogen) passages. In the present invention, when it is assumed that a porous metal support for a hydrogen permeable membrane is prepared by wet plating, low stress, high hardness, phase transition at high temperature, cost, etc. are considered as the base metal. Ni was selected as the porous metal support. However, the method shown in [0007] is general and applicable to plating metals other than Ni, and the material of the porous metal support is not limited to Ni.
又、本発明の金属複合水素透過膜の製造方法は、前記したようにＮｉ支持体層の多孔質化のため、めっき浴中に特定の有機物質、即ち界面活性剤を添加し、粗であり、かつ当該界面活性剤を共析させためっき皮膜を作成し、高温加熱により皮膜中含有界面活性剤のみを燃焼除去させて多孔質化したＮｉめっき皮膜を得ることを特徴とするものである。
ここで、Ｎｉ支持体層の多孔質化のために界面活性剤を採用したのは、以下に記載する理由による。
即ち、界面活性剤はＮｉに優先して素地表面に吸着し、Ｎｉの析出を阻害する成分であり、特にイオン性のもので、金属との吸着性が強い性質のものを適度な濃度で使用することにより、Ｎｉの析出を抑制しＮｉめっき皮膜を粗にさせることができるとともに、ある熱処理条件で高温加熱処理することにより、Ｎｉ皮膜中に共析した界面活性剤が燃焼除去されて、その痕跡として素地から表面まで貫通した空孔となることが確認されたことによる。
In addition, as described above, the method for producing a metal composite hydrogen permeable membrane of the present invention is rough by adding a specific organic substance, that is, a surfactant, to the plating bath in order to make the Ni support layer porous. In addition, a plating film in which the surfactant is co-deposited is prepared, and only the surfactant contained in the film is burned and removed by high-temperature heating to obtain a porous Ni plating film.
Here, the reason why the surfactant is employed for making the Ni support layer porous is as follows.
That is, the surfactant is a component that preferentially adsorbs to the substrate surface over Ni and inhibits the precipitation of Ni, and is particularly ionic and has a strong property of adsorbing with metal at an appropriate concentration. By doing so, it is possible to suppress the precipitation of Ni and roughen the Ni plating film, and by performing high temperature heat treatment under certain heat treatment conditions, the eutectoid surfactant in the Ni film is removed by combustion. This is because it was confirmed that the holes penetrated from the substrate to the surface as traces.
上記した本発明の多孔質Ｎｉ支持体からなる金属複合水素透過膜の製造方法の一実施例を図１Ａ〜１Ｄに基づいて説明する。
本発明の金属複合水素透過膜の作成に用いる逆ビルドアップ法は、図１Ａに示すように、第１の工程で、仮支持担体４となるガラス板（プラスチック板に代えることもできる）の片面に下塗り層５としての可溶性の膜（樹脂層）を形成する。なお、仮支持担体４は、後述する多孔質Ｎｉ支持体層３が形成された後に、下塗り層５を適切な有機溶液により溶解させて、水素透過金属膜である合金層２から取り除かれるものである。
次に、第２の工程で、図１Ｂに示すように、仮支持担体４の下塗り層５の面上に、例えば、水素透過金属膜であるＰｄ及びＰｄ−Ａｇ合金あるいはＰｄ及びＰｄ−Ｃｕ合金等の薄膜からなる合金層２をスパッタ法等を用いて形成する。このＰｄ及びＰｄ−Ａｇ合金あるいはＰｄ及びＰｄ−Ｃｕ合金等の薄膜が水素透過金属膜として作用する。なお、スパッタ法は、特に極薄の膜を形成することが可能であることから、膜厚１０ｎｍ〜５μｍの範囲の極薄の均一な膜の形成も可能である。又、スパッタ法は、仮支持担体４から水素透過金属膜であるＰｄ及びＰｄ−Ａｇ合金あるいはＰｄ及びＰｄ−Ｃｕ合金等の合金層２を容易に剥離することができる。
続いて、第３の工程で、図１Ｃに示すように、Ｐｄ及びＰｄ−Ａｇ合金あるいはＰｄ及びＰｄ−Ｃｕ合金等の薄膜からなる合金層２の上に、電解めっき法によりＮｉからなる多孔質Ｎｉ支持体層３を形成する。その際、本発明では、Ｎｉ支持体層３の多孔質化をはかるため、界面活性剤を適切な濃度で添加しためっき浴を調製する。界面活性剤としては、特に限定するものではないが、例えばアニオン系界面活性剤を使用することができる。この界面活性剤を添加しためっき工程では、析出初期において界面活性剤を下地材料であるＰｄ及びＰｄ−Ａｇ合金あるいはＰｄ及びＰｄ−Ｃｕ合金等の薄膜からなる合金層２に分散吸着させ、又、めっき中においても共析を促すために、例えばパルス電解方法を用いる。
さらに、第４の工程で、図１Ｄに示すように、水素透過金属膜であるＰｄ及びＰｄ−Ａｇ合金あるいはＰｄ及びＰｄ−Ｃｕ合金等の合金層２の上に多孔質Ｎｉ支持体層３を形成した後、下塗り層５を適切な有機溶液により溶解させて、仮支持担体４から、合金層２及びＮｉ支持体層３の積層体を取り外す。なお、下塗り層５を溶解させる有機溶液としては、アセトン、メタノール、エタノール、トルエン、メチレンクロライド、脂肪族溶液等が挙げられる。さらに、仮支持担体４から積層体を取り外す方法としては、光反応を利用して溶かす方法、化学的に溶解する方法があり、光反応を利用して下塗り層５を分解・除去する方法としては、仮支持担体４側から下塗り層５に光を当ててＮ2ガスやＣＯ2ガス等を発生させる光化学反応、例えばキノンジアジド化合物を利用して剥離することも可能である。
続いて、第５の工程で、取り外した積層体を例えば電気炉にて、大気中、あるいは水素などの還元雰囲気中、もしくは窒素、アルゴンなどの不活性雰囲気中で、高温加熱（高温加熱条件としては、例えば５００℃×３０分）して、Ｎｉ支持体層３中の界面活性剤を燃焼除去することにより、その痕跡として素地から表面まで貫通した空孔を有する多孔質化したＮｉ支持体層３を得る。尚、第５の工程は仮支持担体４から積層体を取り外す工程（第４の工程）の前に実施されてもよい。
One embodiment of a method for producing a metal composite hydrogen permeable membrane comprising the above-described porous Ni support of the present invention will be described with reference to FIGS.
As shown in FIG. 1A, the reverse build-up method used for producing the metal composite hydrogen permeable membrane of the present invention is a single side of a glass plate (which can be replaced with a plastic plate) as a temporary support carrier 4 in the first step. A soluble film (resin layer) is formed as the undercoat layer 5. The temporary support 4 is removed from the alloy layer 2 which is a hydrogen-permeable metal film by dissolving the undercoat layer 5 with an appropriate organic solution after the porous Ni support layer 3 described later is formed. is there.
Next, in the second step, as shown in FIG. 1B, on the surface of the undercoat layer 5 of the temporary support carrier 4, for example, a Pd and Pd—Ag alloy or a Pd and Pd—Cu alloy that is a hydrogen permeable metal film. An alloy layer 2 made of a thin film such as is formed by sputtering or the like. A thin film such as Pd and Pd—Ag alloy or Pd and Pd—Cu alloy acts as a hydrogen permeable metal film. Note that, since the sputtering method can form a particularly thin film, it is also possible to form a very thin uniform film having a thickness of 10 nm to 5 μm. Moreover, the sputtering method can easily peel the alloy layer 2 such as Pd and Pd—Ag alloy or Pd and Pd—Cu alloy, which is a hydrogen permeable metal film, from the temporary support carrier 4.
Subsequently, in the third step, as shown in FIG. 1C, the porous layer made of Ni by electrolytic plating on the alloy layer 2 made of a thin film such as Pd and Pd—Ag alloy or Pd and Pd—Cu alloy. The Ni support layer 3 is formed. At that time, in the present invention, in order to make the Ni support layer 3 porous, a plating bath to which a surfactant is added at an appropriate concentration is prepared. The surfactant is not particularly limited, and for example, an anionic surfactant can be used. In the plating step in which this surfactant is added, the surfactant is dispersed and adsorbed on the alloy layer 2 made of a thin film such as Pd and Pd-Ag alloy or Pd and Pd-Cu alloy as the base material in the initial stage of deposition. In order to promote eutectoid during plating, for example, a pulse electrolysis method is used.
Further, in the fourth step, as shown in FIG. 1D, the porous Ni support layer 3 is formed on the alloy layer 2 such as Pd and Pd—Ag alloy or Pd and Pd—Cu alloy which is a hydrogen permeable metal film. After the formation, the undercoat layer 5 is dissolved with an appropriate organic solution, and the laminated body of the alloy layer 2 and the Ni support layer 3 is removed from the temporary support carrier 4. Examples of the organic solution for dissolving the undercoat layer 5 include acetone, methanol, ethanol, toluene, methylene chloride, an aliphatic solution, and the like. Furthermore, as a method of removing the laminate from the temporary support carrier 4, there are a method of dissolving using a photoreaction and a method of dissolving chemically, and a method of decomposing and removing the undercoat layer 5 using a photoreaction. Further, it is possible to peel using a photochemical reaction that generates light such as N 2 gas or CO 2 gas by applying light to the undercoat layer 5 from the temporary support carrier 4 side, for example, a quinonediazide compound.
Subsequently, in the fifth step, the removed laminate is heated at a high temperature (as a high temperature heating condition) in an electric furnace, in the atmosphere, in a reducing atmosphere such as hydrogen, or in an inert atmosphere such as nitrogen or argon. Is, for example, 500 ° C. × 30 minutes), and the surfactant in the Ni support layer 3 is burned and removed to make the porous Ni support layer having pores penetrating from the substrate to the surface as traces thereof. Get 3. The fifth step may be performed before the step of removing the laminate from the temporary support carrier 4 (fourth step).
尚、第２の工程において形成される水素透過金属膜の膜厚は０．０１μｍ〜１００μｍであることが好ましく、０．５μｍ〜１０μｍであることがより好ましく、０．５μｍ〜６μｍであることが更に好ましい。水素透過金属膜の膜厚が大きすぎると水素透過性能が低下し、製造コストも上昇する。一方、水素透過金属膜の膜厚が小さすぎると、ピンホールによるガスのリークが発生しやすくなる。また所望する強度も得られにくくなる。
また、第３の工程において形成される多孔質Ｎｉ支持体層３の厚さは、０．１μｍ〜１００μｍであることが好ましく、１μｍ〜１０μｍであることがより好ましく、２μｍ〜５μｍであることが更に好ましい。多孔質Ｎｉ支持体層３の厚さが大きすぎると、多孔質化が困難になり、加工難易度が上昇し、製造コストが上昇しやすくなる。一方、多孔質Ｎｉ支持体層３の厚さが小さすぎると、強度不足になりやすい。
また、第５の工程において、界面活性剤を除去するための加熱処理の温度は、界面活性剤が燃焼除去されるような温度であればよいが、例えば３５０℃〜９００℃である。加熱時間は、例えば、１０分〜１２０分である。加熱温度が高すぎると、量産加工時におけるコストが上昇しやすくなる。また、水素透過金属膜と多孔質Ｎｉ支持体層３との間で相互拡散層が形成しやすくなり、その結果、水素透過膜ユニットとしての性能が低下しやすくなる。一方、加熱処理温度が低すぎる場合、多孔質化が発現しにくくなる。また、加熱時間が長すぎると、相互拡散層の形成による水素透過膜ユニットとしての性能低下が起こりやすくなり、短すぎると多孔質化が発現しにくくなる。
The film thickness of the hydrogen permeable metal film formed in the second step is preferably 0.01 μm to 100 μm, more preferably 0.5 μm to 10 μm, and preferably 0.5 μm to 6 μm. Further preferred. If the thickness of the hydrogen permeable metal film is too large, the hydrogen permeation performance is lowered and the manufacturing cost is also increased. On the other hand, if the thickness of the hydrogen permeable metal film is too small, gas leakage due to pinholes tends to occur. Moreover, it becomes difficult to obtain the desired strength.
Moreover, the thickness of the porous Ni support layer 3 formed in the third step is preferably 0.1 μm to 100 μm, more preferably 1 μm to 10 μm, and more preferably 2 μm to 5 μm. Further preferred. When the thickness of the porous Ni support layer 3 is too large, it becomes difficult to make the porous layer 3, the degree of difficulty in processing increases, and the manufacturing cost tends to increase. On the other hand, if the thickness of the porous Ni support layer 3 is too small, the strength tends to be insufficient.
In the fifth step, the temperature of the heat treatment for removing the surfactant may be a temperature at which the surfactant is burned and removed, and is, for example, 350 ° C. to 900 ° C. The heating time is, for example, 10 minutes to 120 minutes. If the heating temperature is too high, the cost during mass production processing tends to increase. Moreover, it becomes easy to form an interdiffusion layer between the hydrogen permeable metal membrane and the porous Ni support layer 3, and as a result, the performance as a hydrogen permeable membrane unit tends to be lowered. On the other hand, when the heat treatment temperature is too low, it becomes difficult to develop the porosity. On the other hand, if the heating time is too long, the performance of the hydrogen permeable membrane unit is likely to deteriorate due to the formation of the interdiffusion layer.
図２Ａ及び図２Ｂは仮支持担体４から取り外した本発明の金属複合水素透過膜１の断面を従来の金属複合水素透過膜と比較して模式的に示したもので、界面活性剤を使用しない電気めっき法による従来の製造方法によるものは、図２Ｂに示すようにＮｉ支持体層３´の多孔質化が不十分である金属複合水素透過膜１´であるのに対し、界面活性剤を適切な濃度で添加しためっき浴を用いた電気めっき法による本発明の製造方法によれば、図２Ａに示すように素地から表面まで貫通したガス通過路となる空孔３−１を有する十分に多孔質化したＮｉ支持体層３を有する金属複合水素透過膜１が得られる。 2A and 2B schematically show a cross section of the metal composite hydrogen permeable membrane 1 of the present invention removed from the temporary support carrier 4 in comparison with a conventional metal composite hydrogen permeable membrane, and no surfactant is used. As shown in FIG. 2B, the conventional manufacturing method using electroplating is a metal composite hydrogen permeable membrane 1 ′ in which the Ni support layer 3 ′ is insufficiently porous, whereas a surfactant is used. According to the manufacturing method of the present invention by the electroplating method using the plating bath added at an appropriate concentration, as shown in FIG. 2A, the hole 3-1 that is a gas passage that penetrates from the substrate to the surface is sufficiently formed. A metal composite hydrogen permeable membrane 1 having a porous Ni support layer 3 is obtained.
［めっき浴及びめっき条件］
続いて、第３の工程で使用されるめっき浴について詳細に説明する。本発明で使用されるめっき浴は、ニッケル塩及び界面活性剤を含む。
ニッケル塩は、ニッケルイオンの供給源として作用する。ニッケル塩としては、特に限定されるものではないが、スルファミン酸Ｎｉ、塩化Ｎｉ、硫酸Ｎｉ、及びクエン酸Ｎｉからなる群から選ばれる化合物が好ましく用いられる。これらの中でも、ニッケル塩は、スルファミン酸Ｎｉを含んでいることが好ましい。スルファミン酸Ｎｉを用いることにより、内部応力が低く、柔軟性が高い皮膜が得られる。
めっき浴中におけるニッケル塩の濃度は、１００ｇ／Ｌ〜８００ｇ／Ｌであることが好ましい。ニッケル塩の濃度が高すぎると、界面活性剤の飽和溶解濃度が低下し、多孔質化が困難になる。ニッケル塩の濃度が低すぎると、金属塩の濃度不足により限界電流密度が低下し、皮膜形成時に水素ガスが発生しやすくなり、下地Ｐｄ合金膜に水素が吸蔵し、割れが発生しやすくなる。また粗でピンホールが多いＮｉめっき皮膜になりやすい。
[Plating bath and plating conditions]
Subsequently, the plating bath used in the third step will be described in detail. The plating bath used in the present invention contains a nickel salt and a surfactant.
The nickel salt acts as a source of nickel ions. The nickel salt is not particularly limited, but a compound selected from the group consisting of Ni sulfamate, Ni chloride, Ni sulfate, and Ni citrate is preferably used. Among these, the nickel salt preferably contains Ni sulfamate. By using Ni sulfamate, a film having low internal stress and high flexibility can be obtained.
The concentration of the nickel salt in the plating bath is preferably 100 g / L to 800 g / L. If the concentration of the nickel salt is too high, the saturated dissolution concentration of the surfactant is lowered, and it becomes difficult to make it porous. If the nickel salt concentration is too low, the limit current density is lowered due to insufficient metal salt concentration, hydrogen gas is likely to be generated during film formation, hydrogen is occluded in the underlying Pd alloy film, and cracking is likely to occur. Moreover, it is easy to become a Ni plating film with many pinholes which are coarse.
界面活性剤としては、上述のように特に限定されるものではないが、イオン性界面活性剤が好ましく用いられる。イオン性界面活性剤としては、アニオン系界面活性剤が好ましく用いられる。
アニオン系界面活性剤の好適な例としては、ポリオキシアルキレンアルキルエーテル硫酸塩、ポリオキシアルキレンアルキルエーテルカルボン酸塩、ポリオキシアルキレンアルキルエーテルスルホコハク酸塩、ポリオキシアルキレンアルキルエーテルリン酸塩、ポリオキシアルキレンアルキルエーテル酢酸塩、アルキルベンゼンスルホン酸塩、高級アルコール硫酸塩、ポリオキシアルキレンスチレン化フェニルエーテル硫酸塩、アルキルジフェニルエーテルスルホン酸塩、アルファオレフィンスルホン酸塩、ジアルキルスルホコハク酸塩、アルカンスルホン酸塩、第２級アルカンスルホン酸塩、アルキルナフタレンスルホン酸塩、ナフタレンスルホン酸塩ホルマリン縮合物、更に、高級アルコールリン酸エステル塩、ポリオキシアルキレンスチレン化フェニルエーテルリン酸塩、脂肪酸石けん、不均化ロジン石けん、及びロート油からなる群から選ばれる化合物が挙げられる。これらの中でも、ポリオキシアルキレンアルキルエーテル硫酸塩、ポリオキシアルキレンアルキルエーテルカルボン酸塩、ポリオキシアルキレンアルキルエーテル酢酸塩、及びアルキルベンゼンスルホン酸塩からなる群から選ばれる化合物がより好ましい。
また、ポリオキシアルキレンアルキルエーテル硫酸塩及びポリオキシアルキレンアルキルエーテルカルボン酸塩は、下記式１で表される、エチレンオキサイド含有化合物であることが好ましい。
（式１）：Ｒ１−Ｏ−（ＣＨ2ＣＨ2Ｏ）n−Ｘ
尚、式１中、Ｒ１はアルキル基を表し、好ましくは炭素数１０〜１６、より好ましくは炭素数１２〜１４のアルキル基を表す。Ｘは、硫酸塩又はカルボン酸塩を示す。ｎは、１〜２０、好ましくは２〜１２である。
また、アルキルベンゼンスルホン酸塩としては、アルキル基の炭素数が８〜１６である化合物が好ましく、より好ましくはドデシルベンゼンスルホン酸塩である。
アニオン系界面活性剤の塩に使用される対イオンとしては、ナトリウム塩、カリウム塩等のアルカリ金属塩、アルカリ土類金属塩、アンモニウム塩、アルカノールアミン塩などが挙げられ、これらの中でもアルカリ金属塩が好ましく、ナトリウム塩であることがより好ましい。
The surfactant is not particularly limited as described above, but an ionic surfactant is preferably used. As the ionic surfactant, an anionic surfactant is preferably used.
Preferable examples of the anionic surfactant include polyoxyalkylene alkyl ether sulfate, polyoxyalkylene alkyl ether carboxylate, polyoxyalkylene alkyl ether sulfosuccinate, polyoxyalkylene alkyl ether phosphate, polyoxyalkylene Alkyl ether acetate, alkylbenzene sulfonate, higher alcohol sulfate, polyoxyalkylene styrenated phenyl ether sulfate, alkyl diphenyl ether sulfonate, alpha olefin sulfonate, dialkyl sulfosuccinate, alkane sulfonate, secondary Alkane sulfonate, alkyl naphthalene sulfonate, naphthalene sulfonate formalin condensate, higher alcohol phosphate ester salt, polyoxyalkylenes Ren phenyl ether phosphates, fatty acid soap, disproportionated rosin soaps, and a compound selected from the group consisting of funnel oil. Among these, a compound selected from the group consisting of polyoxyalkylene alkyl ether sulfate, polyoxyalkylene alkyl ether carboxylate, polyoxyalkylene alkyl ether acetate, and alkylbenzene sulfonate is more preferable.
In addition, the polyoxyalkylene alkyl ether sulfate and the polyoxyalkylene alkyl ether carboxylate are preferably ethylene oxide-containing compounds represented by the following formula 1.
(Formula 1): R1-O- (CH 2 CH 2 O) n -X
In Formula 1, R1 represents an alkyl group, preferably an alkyl group having 10 to 16 carbon atoms, more preferably an alkyl group having 12 to 14 carbon atoms. X represents a sulfate or a carboxylate. n is 1 to 20, preferably 2 to 12.
Moreover, as an alkylbenzene sulfonate, the compound whose carbon number of an alkyl group is 8-16 is preferable, More preferably, it is a dodecyl benzene sulfonate.
Examples of the counter ion used for the salt of the anionic surfactant include alkali metal salts such as sodium salts and potassium salts, alkaline earth metal salts, ammonium salts, and alkanolamine salts. Among these, alkali metal salts Is preferable, and a sodium salt is more preferable.
めっき浴中の界面活性剤の濃度は、０．１ｍＬ／Ｌ〜１００ｍＬ／Ｌであることが好ましく、１ｍＬ／Ｌ〜５０ｍＬ／Ｌであることがより好ましく、５ｍＬ／Ｌ〜３０ｍＬ／Ｌであることが更に好ましい。界面活性剤の濃度が高すぎると、めっき析出を阻害し、緻密な皮膜が得られ難くなる。一方、濃度が低すぎると、多孔質化が困難になる。
めっき浴には、更に、ｐＨ調整剤、ｐＨ緩衝剤、応力緩和剤等の他の添加剤が添加されていてもよい。ｐＨ調整剤としては、例えば、硫酸、スルファミン酸、水酸化Ｎｉ等が用いられる。応力緩和剤としては、例えば、サッカリン等が用いられる。
めっき浴のｐＨは、２．０〜４．５であることが好ましい。ｐＨが高すぎると、限界電流密度が低下し、水素ガスが発生しやすくなり、Ｐｄ合金膜に水素が吸蔵しやすくなる。また、Ｎｉ皮膜が、硬くて脆くなりやすい。一方、ｐＨが低すぎると、めっき浴成分の分解が促進されやすくなる。
めっき時におけるめっき浴の浴温は、４０℃〜６５℃であることが好ましい。浴温が高すぎると浴成分の分解が進行しやすくなる。一方、浴温が低すぎると界面活性剤が沈殿しやすくなる。また、Ｎｉが異常析出しやすくなる。
The concentration of the surfactant in the plating bath is preferably 0.1 mL / L to 100 mL / L, more preferably 1 mL / L to 50 mL / L, and 5 mL / L to 30 mL / L. Is more preferable. When the concentration of the surfactant is too high, plating deposition is hindered and it becomes difficult to obtain a dense film. On the other hand, if the concentration is too low, it will be difficult to make it porous.
In the plating bath, other additives such as a pH adjuster, a pH buffer, and a stress relaxation agent may be further added. As the pH adjuster, for example, sulfuric acid, sulfamic acid, Ni hydroxide and the like are used. As the stress relaxation agent, for example, saccharin is used.
The pH of the plating bath is preferably 2.0 to 4.5. If the pH is too high, the limiting current density is lowered, hydrogen gas is likely to be generated, and hydrogen is easily stored in the Pd alloy film. Also, the Ni coating is hard and fragile. On the other hand, if the pH is too low, the decomposition of the plating bath components tends to be accelerated.
The bath temperature of the plating bath during plating is preferably 40 ° C to 65 ° C. If the bath temperature is too high, decomposition of the bath components tends to proceed. On the other hand, if the bath temperature is too low, the surfactant tends to precipitate. Further, Ni is likely to be abnormally precipitated.
既述のように、めっきは、直流電解でも可能であるが、パルス電解めっきにより行われることがより好ましい。この場合、平均電流密度は、１Ａ／ｄｍ2〜２０Ａ／ｄｍ2であることが好ましい。平均電流密度が高すぎると、過剰に水素が発生し、下地Ｐｄ合金に影響を与える場合がある。また、Ｎｉの異常析出を招く場合がある。一方、平均電流密度が低すぎると多孔質化が進行しにくくなり、生産性が低下する。
パルス電流密度は、２Ａ／ｄｍ2〜２０Ａ／ｄｍ2であることが好ましい。パルス電流密度が高すぎると、過剰に水素が発生を伴い、下地Ｐｄ合金に影響を与える場合がある。また、Ｎｉの異常析出を招くことがある。一方、パルス電流密度が低すぎると、多孔質化が進行しにくくり、生産性が低下する。
パルス印加時間ｔｏｎとパルス休止時間ｔｏｆｆとの比（ｔｏｎ／ｔｏｆｆ）は、０．１〜１０であることがより好ましい。比（ｔｏｎ／ｔｏｆｆ）が大きすぎると多孔質化が困難になり、低すぎても多孔質化が困難になる。
パルス周波数は、０．１〜１０００（Ｈｚ）であることが好ましい。パルス周波数が大きすぎると多孔質化が困難になり、低すぎても多孔質化が困難になる。
As described above, the plating can be performed by direct current electrolysis, but is more preferably performed by pulse electrolytic plating. In this case, the average current density is preferably 1 A / dm 2 to 20 A / dm 2 . If the average current density is too high, excessive hydrogen is generated, which may affect the underlying Pd alloy. Moreover, abnormal precipitation of Ni may be caused. On the other hand, when the average current density is too low, the porosity is difficult to proceed and the productivity is lowered.
The pulse current density is preferably 2 A / dm 2 to 20 A / dm 2 . If the pulse current density is too high, hydrogen is excessively generated, which may affect the underlying Pd alloy. Moreover, abnormal precipitation of Ni may be caused. On the other hand, if the pulse current density is too low, the porosity is difficult to proceed and the productivity is lowered.
The ratio (ton / toff) between the pulse application time ton and the pulse pause time toff is more preferably 0.1-10. If the ratio (ton / toff) is too large, it will be difficult to make it porous.
The pulse frequency is preferably 0.1 to 1000 (Hz). If the pulse frequency is too high, it will be difficult to make it porous, and if it is too low, it will be difficult to make it porous.
以下、実施例に基づいて本発明をより具体的に説明する。ただし、本発明は下記実施例によって制限を受けるものではなく、趣旨を逸脱しない範囲で変更・実施することは、全て本発明の技術的範囲に含まれる。 Hereinafter, based on an Example, this invention is demonstrated more concretely. However, the present invention is not limited by the following examples, and all modifications and implementations within the scope not departing from the spirit are included in the technical scope of the present invention.
第１の工程で、仮支持担体となるガラス板（サイズ：７６×５２ｍｍ）の片面に下塗り層として可溶性の樹脂層（５μｍ）を形成し、第２の工程で、仮支持担体であるガラス板の下塗り層の面上に膜厚３．８μｍのＰｄ合金層をスパッタ法を用いて形成した。続いて、第３の工程で、Ｐｄ合金層の上にＮｉからなる支持体層をスルファミン酸Ｎｉを用いた電解めっき法により形成した。その電解めっきは、浴組成として、スルファミン酸Ｎｉ６００ｇ／Ｌ、塩化Ｎｉ１０ｇ／Ｌ、ホウ酸４０ｇ／Ｌ、アニオン系界面活性剤（ドデシルベンゼンスルホン酸ナトリウム）１０ｍＬ／Ｌ、ｐＨ３．５、浴温６０℃のめっき浴を用い、平均電流密度が５．９Ａ／ｄｍ2、比（ｔｏｎ／ｔｏｆｆ）が１．４、の条件で行った。その後、第４の工程で、下塗り層を有機溶液（アセトン）により溶解させて、仮支持担体であるガラス板から、合金層と支持体層との積層体（厚み約７．１μｍ）を取り外した。しかる後、第５の工程で、この積層体を電気炉にて大気中で５００℃×３０分加熱した。
このようにして得られた本発明の金属複合水素透過膜の断面写真（電子顕微鏡写真）を図３Ａに示す。この水素透過膜の断面は、走査型電子顕微鏡（ＳＥＭ：倍率３０００倍）観察による。
In the first step, a soluble resin layer (5 μm) is formed as an undercoat layer on one side of a glass plate (size: 76 × 52 mm) to be a temporary support carrier, and in the second step, a glass plate that is a temporary support carrier A Pd alloy layer having a film thickness of 3.8 μm was formed on the surface of the undercoat layer by sputtering. Subsequently, in the third step, a support layer made of Ni was formed on the Pd alloy layer by an electrolytic plating method using Ni sulfamate. In the electroplating, sulfamic acid Ni 600 g / L, Ni chloride 10 g / L, boric acid 40 g / L, anionic surfactant (sodium dodecylbenzenesulfonate) 10 mL / L, pH 3.5, bath temperature 60 ° C. And an average current density of 5.9 A / dm 2 and a ratio (ton / toff) of 1.4. Thereafter, in the fourth step, the undercoat layer was dissolved with an organic solution (acetone), and the laminate (thickness: about 7.1 μm) of the alloy layer and the support layer was removed from the glass plate as the temporary support carrier. . Thereafter, in the fifth step, the laminate was heated in an electric furnace at 500 ° C. for 30 minutes.
FIG. 3A shows a cross-sectional photograph (electron micrograph) of the metal composite hydrogen permeable membrane of the present invention thus obtained. The cross section of the hydrogen permeable membrane is observed with a scanning electron microscope (SEM: 3000 times magnification).
第１の工程で、仮支持担体となるガラス板（サイズ：７６×５２ｍｍ）の片面に下塗り層として可溶性の樹脂層（５μｍ）を形成し、第２の工程で、仮支持担体であるガラス板の下塗り層の面上に膜厚４μｍのＰｄ−Ａｇ合金層をスパッタ法を用いて形成した。続いて、第３の工程で、Ｐｄ−Ａｇ合金層の上にＮｉからなる支持体層をスルファミン酸Ｎｉを用いた電解めっき法により形成した。
その電解めっきは、浴組成として、スルファミン酸Ｎｉ６００ｇ／Ｌ、塩化Ｎｉ１０ｇ／Ｌ、ホウ酸４０ｇ／Ｌ、アニオン系界面活性剤（ポリオキシエチレンアルキルエーテル酢酸ナトリウム）１０ｍＬ／Ｌ、ｐＨ３．５、浴温４０℃のめっき浴を用い、平均電流密度が５．９Ａ／ｄｍ2、比（ｔｏｎ／ｔｏｆｆ）が１．４の電解条件で行った。その後、第４の工程で、下塗り層を有機溶液（アセトン）により溶解させて、仮支持担体であるガラス板から、合金層と支持体層との積層体（厚み約７．１μｍ）を取り外した。しかる後、第５の工程で、この積層体を電気炉にて大気中で５００℃×３０分加熱した。
このようにして得られた本発明の金属複合水素透過膜の断面写真（電子顕微鏡写真）を図３Ｂに示す。この水素透過膜の断面も、前記実施例１と同様の走査型電子顕微鏡（ＳＥＭ：倍率３０００倍）観察による。
In the first step, a soluble resin layer (5 μm) is formed as an undercoat layer on one side of a glass plate (size: 76 × 52 mm) to be a temporary support carrier, and in the second step, a glass plate that is a temporary support carrier A Pd—Ag alloy layer having a thickness of 4 μm was formed on the surface of the undercoat layer by sputtering. Subsequently, in the third step, a support layer made of Ni was formed on the Pd—Ag alloy layer by an electrolytic plating method using Ni sulfamate.
The electrolytic plating is performed by using a bath composition of Ni sulfamic acid 600 g / L, Ni chloride 10 g / L, boric acid 40 g / L, anionic surfactant (polyoxyethylene alkyl ether sodium acetate) 10 mL / L, pH 3.5, bath temperature. Using a plating bath at 40 ° C., the electrolysis was carried out under an electrolytic condition of an average current density of 5.9 A / dm 2 and a ratio (ton / toff) of 1.4. Thereafter, in the fourth step, the undercoat layer was dissolved with an organic solution (acetone), and the laminate (thickness: about 7.1 μm) of the alloy layer and the support layer was removed from the glass plate as the temporary support carrier. . Thereafter, in the fifth step, the laminate was heated in an electric furnace at 500 ° C. for 30 minutes.
FIG. 3B shows a cross-sectional photograph (electron micrograph) of the metal composite hydrogen permeable membrane of the present invention thus obtained. The cross section of the hydrogen permeable membrane is also observed by the same scanning electron microscope (SEM: magnification 3000 times) as in Example 1.
［従来例］
第１の工程で、仮支持担体となるガラス板（サイズ：７６×５２ｍｍ）の片面に下塗り層として可溶性の樹脂層（５μｍ）を形成し、第２の工程で、仮支持担体であるガラス板の下塗り層の面上に膜厚４．５μmのＰｄ合金層をスパッタ法を用いて形成する。続いて、第３の工程で、Ｐｄ合金層の上にＮｉからなる支持体層を硫酸Ｎｉを用いた電解めっき法により形成した。その電解めっきは、浴組成として、硫酸Ｎｉ３５０ｇ／Ｌ、塩化Ｎｉ６０ｇ／Ｌ、クエン酸三ナトリウム３０ｇ／Ｌ、ｐＨ４．６、浴温６０℃のめっき浴を用い、電流０．１Ａの一定条件で行った。その後、第４の工程で、下塗り層を有機溶液（アセトン）により溶解させて、仮支持担体であるガラス板から合金層とＮｉ支持体層からなる金属複合水素透過膜（厚み約１３．５μｍ）を取り外した。
このようにして得られた従来の金属複合水素透過膜の断面写真（電子顕微鏡写真）を図３Ｃに示す。この水素透過膜の断面も、前記実施例１、２と同様の走査型電子顕微鏡（ＳＥＭ：倍率３０００倍）観察による。
[Conventional example]
In the first step, a soluble resin layer (5 μm) is formed as an undercoat layer on one side of a glass plate (size: 76 × 52 mm) to be a temporary support carrier, and in the second step, a glass plate that is a temporary support carrier A Pd alloy layer having a thickness of 4.5 μm is formed on the surface of the undercoat layer using a sputtering method. Subsequently, in the third step, a support layer made of Ni was formed on the Pd alloy layer by an electrolytic plating method using Ni sulfate. The electroplating is performed under a constant condition of current 0.1 A using a plating bath of Ni sulfate 350 g / L, Ni chloride 60 g / L, trisodium citrate 30 g / L, pH 4.6, bath temperature 60 ° C. as a bath composition. It was. Thereafter, in a fourth step, the undercoat layer is dissolved with an organic solution (acetone), and a metal composite hydrogen permeable membrane (thickness of about 13.5 μm) comprising an alloy layer and a Ni support layer from a glass plate as a temporary support carrier Removed.
A cross-sectional photograph (electron micrograph) of the conventional metal composite hydrogen permeable membrane thus obtained is shown in FIG. 3C. The cross section of this hydrogen permeable membrane is also observed by the same scanning electron microscope (SEM: 3000 times magnification) as in Examples 1 and 2.
実施例１及び実施例２と従来例の図３に示す金属複合水素透過膜の断面写真より、図３Ｃに示す従来技術による金属複合水素透過膜１´は、Ｎｉ支持体層３´の多孔質化が不十分なものであるのに対し、界面活性剤を適切な濃度で添加しためっき浴を用いた電気めっき法による本発明の製造方法による実施例１、２の金属複合水素透過膜は、図３Ａ、図３Ｂに示すように素地から表面まで貫通したガス通過路となる図２Ａ中の空孔３−１を有する十分に多孔質化したＮｉ支持体層３を有する金属複合水素透過膜１であることが明らかである。 From the cross-sectional photographs of the metal composite hydrogen permeable membrane shown in FIG. 3 of Example 1 and Example 2 and the conventional example, the metal composite hydrogen permeable membrane 1 ′ according to the prior art shown in FIG. The metal composite hydrogen permeable membranes of Examples 1 and 2 according to the production method of the present invention by an electroplating method using a plating bath to which a surfactant is added at an appropriate concentration, are insufficient. 3A and 3B, a metal composite hydrogen permeable membrane 1 having a sufficiently porous Ni support layer 3 having pores 3-1 in FIG. 2A, which is a gas passage that penetrates from the substrate to the surface. It is clear that
上記実施例１及び実施例２と従来例の金属複合水素透過膜の水素透過試験の結果を実施例３として図４に、実施例１と実施例２の水素選択率を図５Ａ及び図５Ｂにそれぞれ示す。
図４、図５Ａ、図５Ｂに示すデータより明らかなように、本発明の実施例１、２の多孔質Ｎｉ支持体層を備えた金属複合水素透過膜は共に、５００℃での水素選択率は９９％以上を示し、水素分離膜として機能した。又、特に本発明の実施例１の水素透過係数（φ）[ｍｏｌ ｍ-2 ｓ-1 Ｐａ-0.5]は、従来例の水素透過金属膜の２倍以上向上した。これらの結果より、本発明の金属複合水素透過膜は、Ｎｉ層が多孔質化された多孔質Ｎｉ支持体層が水素透過性能の向上に優れた効果を発揮することが明らかである。
本発明のまた別の態様は、以下のとおりであってもよい。
〔１〕多孔質Ｎｉめっき皮膜を形成するための電解めっき用Ｎｉめっき浴であって、
ニッケル塩と、
界面活性剤と、
を含有するめっき浴。
〔２〕前記界面活性剤が、アニオン系界面活性剤を含む、
前記〔１〕に記載されためっき浴。
〔３〕前記アニオン系界面活性剤が、ポリオキシアルキレンアルキルエーテル硫酸塩、ポリオキシアルキレンアルキルエーテルカルボン酸塩、及びアルキルベンゼンスルホン酸塩からなる群から選ばれる化合物を含む、
前記〔２〕に記載されためっき浴。
〔４〕前記界面活性剤の濃度が、０．１ｍＬ／Ｌ〜１００ｍＬ／Ｌである、
前記〔１〕から〔３〕のいずれかに記載されためっき浴。
〔５〕前記ニッケル塩が、スルファミン酸Ｎｉを含む、
前記〔１〕から〔４〕のいずれかに記載されためっき浴。
〔６〕前記〔１〕から〔５〕のいずれかに記載されためっき浴を用いて、前記Ｎｉめっき皮膜を形成する工程と、
前記Ｎｉめっき皮膜を形成する工程の後に、熱処理により、前記Ｎｉめっき皮膜中の界面活性剤を燃焼除去する工程と、
を含む、多孔質Ｎｉめっき皮膜の製造方法。
〔７〕前記Ｎｉめっき皮膜を形成する工程は、パルス電解めっきにより行われる、前記〔６〕に記載された多孔質Ｎｉめっき皮膜の製造方法。
〔８〕前記Ｎｉめっき皮膜の厚さが、０．１μｍ〜１００μｍである、前記〔６〕又は〔７〕に記載された多孔質Ｎｉめっき皮膜の製造方法。
〔９〕前記〔６〕から〔８〕のいずれかに記載された多孔質Ｎｉめっき皮膜の製造方法により製造された、Ｎｉめっき皮膜。
〔１０〕水素透過金属膜と、
前記〔９〕に記載されたＮｉめっき皮膜と、
を備える金属複合水素透過膜。
〔１１〕水素透過金属膜を形成する工程と、
前記〔６〕から〔８〕のいずれかに記載された多孔質Ｎｉめっき皮膜の製造方法を用いて、前記Ｎｉめっき皮膜を形成する工程と、
を含む、金属複合水素透過膜の製造方法。
〔１２〕前記水素透過金属膜を形成する工程は、仮支持担体上に下塗り層を介して前記水素透過金属膜を形成する工程を含み、
金属複合水素透過膜の製造方法は、更に、前記Ｎｉめっき皮膜を形成する工程の後に、前記下塗り層を除去する工程を含む、
前記〔１１〕に記載された金属複合水素透過膜の製造方法。
〔１３〕前記水素透過金属膜は、Ｐｄを含有する、
前記〔１１〕又は〔１２〕に記載された金属複合水素透過膜の製造方法。
〔１４〕前記水素透過金属膜の膜厚は、０．５μｍ〜１００μｍである
前記〔１１〕から〔１３〕のいずれかに記載された金属複合水素透過膜の製造方法。
〔１５〕多孔質金属補強支持体にＮｉを用いた逆ビルドアップ法により作成される金属複合水素透過膜であって、水素透過金属膜上に、めっき浴中に添加された界面活性剤を共析させためっき皮膜を熱処理（高温加熱処理）して皮膜中界面活性剤のみを燃焼除去して得られた、めっき皮膜中に膜厚方向に貫通した空孔を有する多孔質化したＮｉめっき皮膜から成る多孔質Ｎｉ支持体層を有することを特徴とする金属複合水素透過膜。
〔１６〕多孔質金属補強支持体にＮｉを用いた逆ビルドアップ法により作成される金属複合水素透過膜の製造方法において、仮支持担体の一表面上に設けた可溶性下塗り層上に水素透過金属膜を形成した後、該水素透過金属膜上に金属補強支持体としてＮｉめっきを施す工程において、界面活性剤を添加しためっき浴を調製し、電解めっき法を用い前記界面活性剤を下地材料に分散吸着させ、得られためっき皮膜を熱処理することにより当該皮膜中の界面活性剤を焼散させて膜厚方向に貫通した空孔を有する多孔質化したＮｉめっき皮膜を得ることを特徴とする金属複合水素透過膜の製造方法。
The results of the hydrogen permeation test of the metal composite hydrogen permeable membranes of Examples 1 and 2 and the conventional example are shown in FIG. 4 as Example 3, and the hydrogen selectivity of Examples 1 and 2 is shown in FIGS. 5A and 5B. Each is shown.
As is clear from the data shown in FIGS. 4, 5A, and 5B, both of the metal composite hydrogen permeable membranes having the porous Ni support layers of Examples 1 and 2 of the present invention have a hydrogen selectivity at 500 ° C. Of 99% or more, functioning as a hydrogen separation membrane. In particular, the hydrogen permeation coefficient (φ) [mol m −2 s −1 Pa −0.5 ] of Example 1 of the present invention was improved more than twice that of the conventional hydrogen permeable metal film. From these results, it is clear that in the metal composite hydrogen permeable membrane of the present invention, the porous Ni support layer in which the Ni layer is made porous exhibits an excellent effect of improving the hydrogen permeation performance.
Another aspect of the present invention may be as follows.
[1] An Ni plating bath for electrolytic plating for forming a porous Ni plating film,
Nickel salt,
A surfactant,
A plating bath containing
[2] The surfactant includes an anionic surfactant,
The plating bath described in [1] above.
[3] The anionic surfactant includes a compound selected from the group consisting of polyoxyalkylene alkyl ether sulfates, polyoxyalkylene alkyl ether carboxylates, and alkylbenzene sulfonates.
The plating bath described in [2] above.
[4] The concentration of the surfactant is 0.1 mL / L to 100 mL / L.
The plating bath described in any one of [1] to [3].
[5] The nickel salt contains Ni sulfamate.
The plating bath according to any one of [1] to [4].
[6] A step of forming the Ni plating film using the plating bath described in any one of [1] to [5];
After the step of forming the Ni plating film, a step of burning and removing the surfactant in the Ni plating film by heat treatment;
A method for producing a porous Ni plating film, comprising:
[7] The method for producing a porous Ni plating film according to [6], wherein the step of forming the Ni plating film is performed by pulse electrolytic plating.
[8] The method for producing a porous Ni plating film according to [6] or [7], wherein the thickness of the Ni plating film is 0.1 μm to 100 μm.
[9] A Ni plating film produced by the method for producing a porous Ni plating film according to any one of [6] to [8].
[10] a hydrogen permeable metal membrane;
Ni plating film described in the above [9],
A metal composite hydrogen permeable membrane comprising:
[11] forming a hydrogen permeable metal film;
Using the method for producing a porous Ni plating film according to any one of [6] to [8], and forming the Ni plating film;
A method for producing a metal composite hydrogen permeable membrane, comprising:
[12] The step of forming the hydrogen permeable metal film includes a step of forming the hydrogen permeable metal film on a temporary support carrier through an undercoat layer,
The method for producing a metal composite hydrogen permeable membrane further includes a step of removing the undercoat layer after the step of forming the Ni plating film.
The method for producing a metal composite hydrogen permeable membrane as described in [11] above.
[13] The hydrogen permeable metal film contains Pd.
The method for producing a metal composite hydrogen permeable membrane according to [11] or [12].
[14] The method for producing a metal composite hydrogen permeable membrane according to any one of [11] to [13], wherein a film thickness of the hydrogen permeable metal membrane is 0.5 μm to 100 μm.
[15] A metal composite hydrogen permeable membrane prepared by a reverse build-up method using Ni as a porous metal reinforced support, wherein the surfactant added in the plating bath is co-located on the hydrogen permeable metal membrane. Porous Ni plating film with pores penetrating in the film thickness direction in the plating film obtained by heat-treating the deposited plating film (high temperature heat treatment) and burning and removing only the surfactant in the film A metal composite hydrogen permeable membrane comprising a porous Ni support layer comprising:
[16] In a method for producing a metal composite hydrogen permeable membrane prepared by a reverse buildup method using Ni for a porous metal reinforced support, a hydrogen permeable metal is formed on a soluble undercoat layer provided on one surface of a temporary support carrier. After forming the film, in the step of performing Ni plating as a metal reinforcing support on the hydrogen permeable metal film, a plating bath to which a surfactant is added is prepared, and the surfactant is used as a base material using an electrolytic plating method. Dispersing and adsorbing, and heat treating the obtained plating film to disperse the surfactant in the film to obtain a porous Ni plating film having pores penetrating in the film thickness direction A method for producing a metal composite hydrogen permeable membrane.
１ 金属複合水素透過金属膜
２ Ｐｄ又はＰｄ合金層
３ 多孔質Ｎｉ支持体層
３−１ 空孔
４ 仮支持担体
５ 下塗り層
DESCRIPTION OF SYMBOLS 1 Metal composite hydrogen permeable metal film 2 Pd or Pd alloy layer 3 Porous Ni support layer 3-1 Pore 4 Temporary support carrier 5 Undercoat layer
Claims (16)
ニッケル塩と、
界面活性剤と、
を含有するめっき浴。 An Ni plating bath for electrolytic plating for forming a porous Ni plating film,
Nickel salt,
A surfactant,
A plating bath containing
請求項１に記載されためっき浴。 The surfactant includes an anionic surfactant.
The plating bath according to claim 1.
請求項２に記載されためっき浴。 The anionic surfactant includes a compound selected from the group consisting of polyoxyalkylene alkyl ether sulfate, polyoxyalkylene alkyl ether carboxylate, and alkylbenzene sulfonate.
The plating bath according to claim 2.
請求項１から３のいずれかに記載されためっき浴。 The concentration of the surfactant is 0.1 mL / L to 100 mL / L.
The plating bath according to any one of claims 1 to 3.
請求項１から４のいずれかに記載されためっき浴。 The nickel salt comprises Ni sulfamate,
The plating bath according to any one of claims 1 to 4.
前記Ｎｉめっき皮膜を形成する工程の後に、熱処理により、前記Ｎｉめっき皮膜中の界面活性剤を燃焼除去する工程と、
を含む、多孔質Ｎｉめっき皮膜の製造方法。 Using the plating bath according to any one of claims 1 to 5 to form the Ni plating film;
After the step of forming the Ni plating film, a step of burning and removing the surfactant in the Ni plating film by heat treatment;
A method for producing a porous Ni plating film, comprising:
請求項９に記載されたＮｉめっき皮膜と、
を備える金属複合水素透過膜。 A hydrogen permeable metal membrane,
Ni plating film according to claim 9,
A metal composite hydrogen permeable membrane comprising:
請求項６から８のいずれかに記載された多孔質Ｎｉめっき皮膜の製造方法を用いて、前記Ｎｉめっき皮膜を形成する工程と、
を含む、金属複合水素透過膜の製造方法。 Forming a hydrogen permeable metal film;
Using the method for producing a porous Ni plating film according to any one of claims 6 to 8, and forming the Ni plating film;
A method for producing a metal composite hydrogen permeable membrane, comprising:
金属複合水素透過膜の製造方法は、更に、前記Ｎｉめっき皮膜を形成する工程の後に、前記下塗り層を除去する工程を含む、
請求項１１に記載された金属複合水素透過膜の製造方法。 The step of forming the hydrogen permeable metal film includes the step of forming the hydrogen permeable metal film on a temporary support carrier via an undercoat layer,
The method for producing a metal composite hydrogen permeable membrane further includes a step of removing the undercoat layer after the step of forming the Ni plating film.
The method for producing a metal composite hydrogen permeable membrane according to claim 11.
請求項１１又は１２に記載された金属複合水素透過膜の製造方法。 The hydrogen permeable metal film contains Pd;
The method for producing a metal composite hydrogen permeable membrane according to claim 11 or 12.
請求項１１から１３のいずれかに記載された金属複合水素透過膜の製造方法。 14. The method for producing a metal composite hydrogen permeable membrane according to claim 11, wherein a film thickness of the hydrogen permeable metal membrane is 0.5 μm to 100 μm.
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