JP2016094638A - Film deposition apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film deposition apparatus capable of suppressing increase of a production cost and shortening a task time.SOLUTION: A film deposition apparatus includes a film deposition chamber having an opening for carrying in a work piece, a hood that covers the opening of the film deposition chamber and is linked to the film deposition chamber and filled with a dry gas, a gate valve having support devices to mount each of the work piece thereon on the two opposite principal planes thereof, the gate valve closing the opening so that one principal plane is located in the film deposition chamber while the other principal plane is located in the hood, and an adjusting device that moves the gate valve in the hood between a first position where the gate valve closes the opening and a second position where the gate valve does not close the opening.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a film forming apparatus for forming a film on a processing object in a film forming chamber.

  In the film forming process of the object to be processed, the degree of vacuum in the film forming chamber before starting the film forming process is important in order not to deteriorate the quality of the product. On the other hand, the time required for evacuation in the film forming chamber is preferably short. For this reason, when storing the processing object in the film forming chamber, an increase in time required for evacuation due to exposure of the inside of the film forming chamber to an atmosphere containing moisture is a problem. Further, in the manufacture of automobile headlight reflectors and the like, a metal such as aluminum is formed on the surface of an injection-molded resin part in order to provide a mirror finish for reflection and a metallic texture. In this case, since a large amount of gas is released from the resin material, the manufacturing time (tact time) required for the film forming process including the time for evacuation increases.

  For this reason, a method has been proposed in which a load lock chamber (LC) is installed in front of the film formation chamber, and the object to be processed is transferred from the evacuated load lock chamber to the film formation chamber (see, for example, Patent Document 1). . Thereby, the inside of the film forming chamber can be maintained at a high vacuum.

  Alternatively, in order to cover an increase in tact time due to evacuation over time, a method for increasing the throughput by increasing the size of the film forming apparatus and increasing the number of objects to be processed each time can be considered.

Japanese Patent Laid-Open No. 07-161661

  However, in the method of adding the load lock chamber to the film forming apparatus, the manufacturing cost increases because the load lock chamber, the exhaust system apparatus, the gate valve, and the like are added to the film forming apparatus. Furthermore, the conveyance mechanism of the processing object is complicated. In addition, in the method of increasing the throughput by increasing the size of the film forming apparatus, the initial cost of the film forming apparatus and the equipment attached thereto increases. Furthermore, it is difficult to link the molding apparatus and the film forming apparatus or to automate the process by interlocking the apparatuses, because the throughput of the molding apparatus for forming an object to be processed and the film forming apparatus do not match. This limits task time reduction and manufacturing cost reduction.

  In view of the above problems, an object of the present invention is to provide a film forming apparatus in which an increase in manufacturing cost is suppressed and task time can be shortened.

  According to one aspect of the present invention, (a) a film forming chamber provided with an opening for carrying a processing object into the inside, and (a) an opening of the film forming chamber is connected to the film forming chamber, A hood filled with a dry gas inside and (c) a support device on which an object to be processed is mounted are respectively disposed on two opposing main surfaces, and one main surface is located inside the film formation chamber and the other A gate valve that closes the opening with the main surface positioned inside the hood; (d) a first position where the gate valve closes the opening; and a second position where the gate valve does not close the opening. A film forming apparatus is provided that includes an adjustment device that moves the gate valve in the hood between the two.

  ADVANTAGE OF THE INVENTION According to this invention, the raise of manufacturing cost can be suppressed and the film-forming apparatus which can shorten task time can be provided.

It is a schematic diagram which shows the structure of the film-forming apparatus which concerns on embodiment of this invention. It is another schematic diagram which shows the structure of the film-forming apparatus which concerns on embodiment of this invention. FIG. 3A is a schematic plan view showing an example of a method for adjusting the direction of a gate valve of a film forming apparatus according to an embodiment of the present invention, FIG. 3A shows a state before adjustment, and FIG. The state during adjustment is shown, and FIG. 3C shows the state after adjustment. FIG. 4A is a schematic diagram illustrating an example of a workpiece replacement method in a film forming apparatus according to an embodiment of the present invention. FIG. 4A illustrates a state in which a processed workpiece is taken out from the film forming apparatus, and FIG. The state which stores an unprocessed workpiece | work in the film-forming apparatus is shown. FIG. 5A is a schematic diagram illustrating an example of a method for transporting a work holder in a film forming chamber in a film forming apparatus according to an embodiment of the present invention, and FIG. FIG. 5B shows a state in which the work holder is conveyed to the processing area. It is a typical top view which shows the example of the conveying apparatus in the film-forming apparatus which concerns on embodiment of this invention. It is a schematic diagram which shows the example of the process in the 1st process area | region of the film-forming apparatus which concerns on embodiment of this invention. It is a schematic diagram which shows the example of the process in the 2nd process area | region of the film-forming apparatus which concerns on embodiment of this invention. It is a schematic diagram which shows the example which links the film-forming apparatus which concerns on embodiment of this invention with a shaping | molding apparatus. It is a schematic diagram which shows the example which supplies an unprocessed workpiece | work to the film-forming apparatus which concerns on embodiment of this invention. It is a schematic diagram which shows the structure of the film-forming apparatus which concerns on the modification of embodiment of this invention.

  Embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic. Further, the embodiment described below exemplifies an apparatus and a method for embodying the technical idea of the present invention, and the embodiment of the present invention has the following structure and arrangement of components. It is not something specific. The embodiment of the present invention can be variously modified within the scope of the claims.

  A film forming apparatus 1 according to an embodiment of the present invention is an apparatus that performs a film forming process on an object to be processed (hereinafter referred to as “work 100”). As shown in FIG. 1, the film forming apparatus 1 includes a film forming chamber 10, a hood 20 connected to the film forming chamber 10, a gate valve 30 that moves in parallel in the hood 20 as indicated by an arrow, and a hood of the gate valve 30. The adjusting device 40 which adjusts the movement in 20 is provided.

  A film is formed on the workpiece 100 inside the film forming chamber 10. The film forming chamber 10 is provided with an opening 15 for carrying the workpiece 100 into the inside. The opening 15 is opened and closed by the gate valve 30. FIG. 1 shows a state in which the opening 15 is closed by the gate valve 30.

  The hood 20 covers the opening 15 of the film forming chamber 10 and is connected to the film forming chamber 10. The hood 20 is provided with a dry gas supply device 21 that supplies the dry gas 200 into the hood 20. Thereby, the inside of the hood 20 is filled with the dry gas 200. As the dry gas 200, dry air, dry nitrogen gas, or the like can be used.

  The gate valve 30 has two main surfaces 300 facing each other. Support devices 50 on which the workpiece 100 is mounted are respectively disposed on the two main surfaces 300. In the example shown in FIG. 1, the work holder 110 in which the work 100 is accommodated is mounted on the support device 50. The work holder 110 has, for example, a concave shape having an opening on the upper surface, and the work 100 is accommodated inside the concave.

  As already described, the opening 15 is opened and closed by the gate valve 30. As shown in FIG. 1, when the opening 15 is closed by the gate valve 30, one main surface 300 of the gate valve 30 is located inside the film forming chamber 10, and the other main surface 300 is the hood. 20 inside. That is, the support device 50 arranged on one main surface 300 is arranged in the film forming chamber 10, and the support device 50 arranged on the other main surface 300 is arranged in the hood 20.

  On the other hand, the state where the opening 15 is not closed by the gate valve 30 is shown in FIG. As shown in FIGS. 1 and 2, the opening 15 is opened and closed by the gate valve 30 moving inside the hood 20.

  The movement of the gate valve 30 is adjusted by the adjusting device 40. That is, the first position 201 where the opening 15 is closed by the gate valve as shown in FIG. 1 and the second position 202 where the opening 15 is not closed by the gate valve as shown in FIG. In the meantime, the moving mechanism 41 of the adjusting device 40 moves the gate valve 30 in the horizontal direction inside the hood 20.

  Furthermore, the adjustment device 40 adjusts the direction of the gate valve 30 so that one of the two main surfaces 300 of the gate valve 30 faces the opening 15 at the second position 202. That is, as shown in FIGS. 3A to 3C, the rotation mechanism 42 of the adjustment device 40 rotates the gate valve 30 with the vertical direction as the rotation axis. Hereinafter, the main surface 300 facing the opening 15 is referred to as a “main surface on the film forming chamber side”. Further, the main surface 300 facing the main surface 300 on the film forming chamber side is referred to as a “hood-side main surface”.

  FIG. 3A shows a state before the adjustment device 40 adjusts the direction of the gate valve 30. The main surface 300 on which the support device 50 on which the work holder 110A containing the processed workpiece 100A that has been processed in the film forming chamber 10 is mounted is the main surface 300 on the film forming chamber side. On the other hand, the main surface 300 on which the support device 50 on which the work holder 110B accommodating the unprocessed work 100B is mounted is the main surface 300 on the hood side.

  FIG. 3B shows a state in which the direction of the gate valve 30 is adjusted by the adjusting device 40. That is, as indicated by the arrow, the rotation mechanism 42 rotates the gate valve 30.

  FIG. 3C shows a state after the direction of the gate valve 30 is adjusted by the adjusting device 40. The main surface 300 on which the support device 50 on which the work holder 110A that accommodates the processed workpiece 100A is mounted is the main surface 300 on the hood side. The main surface 300 on which the support device 50 on which the work holder 110B containing the unprocessed workpiece 100B is mounted is the main surface 300 on the film forming chamber side.

  By adjusting the direction of the gate valve 30 by the adjusting device 40 as described above, the processed workpiece 100 is mounted on the main surface 300 on the hood side, and the unprocessed workpiece 100 is mounted on the main surface 300 on the film forming chamber side. It will be installed.

  In the film forming apparatus 1, on the main surface 300 on the hood side of the gate valve 30, the processed work 100 that has been subjected to the film forming process in the film forming chamber 10 is replaced with an unprocessed work 100 before the film forming process. The The replacement of the workpiece 100 is performed inside the hood 20 in a state where the gate valve 30 is located at the first position 201.

  That is, as shown in FIG. 4A, the processed workpiece 100A is taken out from the workpiece holder 110 mounted on the support device 50 disposed on the main surface 300 of the gate valve 30 on the hood side. Thereafter, as shown in FIG. 4B, the unprocessed workpiece 100 </ b> B is accommodated in the workpiece holder 110 mounted on the support device 50 arranged on the main surface 300 on the hood side. The exchange of the workpiece 100 is performed by, for example, a robot arm. The workpiece 100 may be replaced with the workpiece holder 110 that houses the workpiece 100.

  As shown in FIGS. 4A and 4B, a shutter 23 that opens and closes in order to take out the processed workpiece 100 </ b> A from the inside of the hood 20 and store the unprocessed workpiece 100 </ b> B in the inside of the hood 20, It is installed in the hood 20. The shutter 23 is closed except when the workpiece 100 is taken in and out, and the dry gas 200 is supplied into the hood 20 by the dry gas supply device 21, thereby filling the hood 20 with the dry gas 200. For example, the dry gas supply device 21 constantly supplies the dry gas 200 into the hood 20. In filling the interior with the dry gas 200, the hood 20 is preferably as small as possible.

  In the film forming apparatus 1, the opening 15 is opened in a state where the shutter 23 is closed and the inside of the hood 20 is filled with the dry gas 200. For this reason, even when the direction of the gate valve 30 is adjusted, it is possible to prevent the atmosphere containing moisture from being introduced into the film forming chamber 10. Then, in a state where the gate valve 30 is located at the first position 201 and the opening 15 is closed so that the inside of the film forming chamber 10 is not exposed to moisture containing moisture, the shutter 23 is opened and the workpiece 100 is Exchange is performed.

  Since the workpiece 100 is exchanged in a state where the opening 15 is closed by the gate valve 30, the workpiece 100 can be exchanged during the film forming process of the workpiece 100 stored in the film forming chamber 10. Thus, by performing the film forming process and the workpiece exchange in parallel, the efficiency of the film forming process for the plurality of works 100 is improved, and the task time can be suppressed.

  Inside the film forming chamber 10, a transfer device 11 is provided for transferring the workpiece 100 mounted on the support device 50 to a predetermined processing region defined inside the film forming chamber 10. The transfer device 11 moves the transfer table 111 on which the workpiece 100 is mounted, the lifting mechanism 112 that moves the transfer table 111 up and down, and the work holder 110 mounted on the transfer table 111 in the film forming chamber 10 in the horizontal direction. A transport mechanism 113 is provided.

  As shown in FIG. 5A, the transport table 111 is lifted upward by the lifting mechanism 112 with the transport table 111 inserted below the work holder 110. As a result, the workpiece 100 is transferred to the transfer table 111 together with the workpiece holder 110. Then, as shown in FIG. 5B, the transfer table 111 on which the work holder 110 is mounted is transferred to the processing region in the film forming chamber 10 by the transfer mechanism 113. For example, as shown in FIG. 6, the transport table 111 is moved in the film forming chamber 10 by rotating the gear of the transport mechanism 113 meshed with the side surface of the transport table 111.

  Note that the processing region inside the film forming chamber 10 is not limited to one place, and a plurality of processing regions may be defined. FIG. 7 shows an example of the film forming chamber 10 in which two processing regions where the film forming process of the workpiece 100 is performed are arranged. In the film forming chamber 10 shown in FIG. 7, the transfer device 11 transfers the workpiece 100 across the first processing region 101 and the second processing region 102.

  For example, the first processing is performed on the workpiece 100 in the first processing area 101. After the first processing, the workpiece 100 is transferred to the second processing region 102 and the second processing is performed. As described above, according to the film forming apparatus 1 having the film forming chamber 10 in which two processing regions are defined, the first processing in the first processing region 101 and the second processing in the second processing region 102 are performed. Can be carried out by continuous vacuum. For this reason, it is not necessary to make a high vacuum in the chamber for each treatment, and the treatment time can be shortened. Moreover, since the workpiece | work 100 is not exposed to air | atmosphere, it can prevent that the film | membrane formed, for example in the workpiece | work 100 is oxidized.

  The order of the processing in the first processing area 101 and the processing in the second processing area 102 is arbitrary. Therefore, the processing may be performed in the first processing region 101 after performing processing in the second processing region 102.

  Hereinafter, the film forming process by the film forming apparatus 1 will be described by taking the case of the film forming chamber 10 shown in FIG. 7 as an example. The workpiece 100 is, for example, an injection molded resin part. Here, a case where a film formation process by a sputtering method is performed in the first process region 101 and a film formation process by a plasma chemical vapor deposition (CVD) method is performed in the second process region 102 will be described as an example. For example, after a first film (for example, an aluminum film) that is easily oxidized is formed on the workpiece 100 by sputtering, a second film (for example, a silicon oxide film) that prevents oxidation of the first film in a continuous vacuum. Is formed by the plasma CVD method so as to cover the first film. For example, the above film forming method is effective when an aluminum film is formed on the surface of a resin component in manufacturing a reflector for an automobile headlamp.

  First, the opening 15 of the film forming chamber 10 is closed by the gate valve 30 so that the support device 50 on which the work holder 110 containing the unprocessed work 100 is mounted is disposed in the film forming chamber 10. After the inside of the film forming chamber 10 is evacuated, as shown in FIG. 7, the work holder 110 stored in the film forming chamber 10 is transferred to the first processing region 101 by the transfer device 11.

  Then, the film forming process of the workpiece 100 is performed by the sputtering method in the first processing region 101. A target 123 is mounted on the target electrode 122 in the first processing region 101. The target electrode 122 is connected to a sputtering power source 121 that supplies radio frequency (RF) power or direct current (DC) power. As shown in FIG. 7, an inert gas 120 such as argon (Ar) gas is introduced into the film forming chamber 10 from the first gas supply device 124. Electric power is supplied from the sputtering power source 121 to the target electrode 122 to discharge it, and plasma is formed in the gas phase near the surface of the target 123. Positive ions of the inert gas 120 accelerated in the plasma collide with the surface of the target 123, and target atoms are released by sputtering. Atoms emitted from the surface of the target 123 are deposited and deposited on the surface of the workpiece 100 to form a first film. Thereafter, the inert gas 120 is exhausted from the inside of the film forming chamber 10 by the exhaust device 140.

  Next, as shown in FIG. 8, the work holder 110 is transported from the first processing region 101 to the second processing region 102 by the transport device 11.

  In the film forming process by the plasma CVD method in the second processing region 102, the process gas 130 containing the raw material gas for the film to be formed on the workpiece 100 is introduced into the film forming chamber 10 by the second gas supply device 133. A cathode electrode 132 facing the workpiece 100 is disposed in the second processing region 102. The transfer table 111 functions as an anode electrode, and predetermined AC power is supplied between the transfer table 111 and the cathode electrode 132 by an AC power supply 131. Thereby, the process gas 130 containing the source gas in the film forming chamber 10 is turned into plasma. By exposing the workpiece 100 to the formed plasma, a desired second film is formed on the surface of the first film formed on the workpiece 100. Thereafter, the process gas 130 is exhausted from the film forming chamber 10 by the exhaust device 140.

  As already described, the workpiece 100 is exchanged during the deposition process of the workpiece 100 stored in the deposition chamber 10. For example, the workpiece 100 is replaced by the method described with reference to FIGS. 4 (a) and 4 (b).

  After the film forming process, although not shown, the work holder 110 is transferred to the support device 50 disposed in the film forming chamber 10 by the transfer device 11. Then, the gate valve 30 is moved from the first position 201 to the second position 202 by the adjusting device 40.

  In the second position 202, the direction of the gate valve 30 is adjusted by the method described with reference to FIGS. 3A to 3C. That is, the main surface 300 on which the support device 50 on which the work holder 110 containing the unprocessed work 100 is mounted is opposed to the opening 15 of the film forming chamber 10.

  Next, the opening 15 is closed by moving the gate valve 30 to the first position 201. As a result, the support device 50 on which the work holder 110 containing the unprocessed work 100 is mounted is disposed in the film forming chamber 10. On the other hand, the support device 50 arranged in the hood 20 is in a state where a work holder 110 containing the work 100 on which a film is formed by the immediately preceding film forming process is mounted.

  Thereafter, film formation processing by sputtering in the first processing region 101 and film formation processing by plasma CVD in the second processing region 102 are performed on the new unprocessed workpiece 100. In parallel with the film forming process, the processed workpiece 100 and the unprocessed workpiece 100 are exchanged. Thereafter, the above process is repeated until the film forming process is completed for all unprocessed workpieces 100.

  As described above, during the period in which the direction of the gate valve 30 is adjusted, the opening 15 of the film forming chamber 10 is in an open state with respect to the inside of the hood 20 at atmospheric pressure. However, during this period, the inside of the hood 20 is filled with the dry gas 200. That is, at least the inside of the hood 20 in a state where the opening 15 of the film forming chamber 10 is not closed by the gate valve 30 is filled with the dry gas 200 by the dry gas supply device 21. For this reason, the inside of the film forming chamber 10 is also at atmospheric pressure and filled with the dry gas 200. Therefore, the inside of the film forming chamber 10 is prevented from being exposed to the atmosphere containing moisture.

  The dry gas 200 in the hood 20 is exhausted to the outside through the exhaust mechanism 22. Since the purpose of supplying the dry gas 200 is to fill the hood 20 with the dry gas 200, it is not necessary to forcibly exhaust the inside of the hood 20 to a vacuum. For this reason, it is not necessary to install an evacuation apparatus in the hood 20, and an increase in manufacturing cost by the film forming apparatus 1 can be suppressed.

  Further, in the film forming apparatus 1, the continuous film forming process for the plurality of works 100 is efficiently performed by exchanging the work 100 in a state where the opening 15 is closed by the gate valve 30 located at the first position 201. Can be done automatically. Since the time required for the film formation process is generally longer than the time required for the exchange of the workpiece 100, the exchange of the workpiece 100 does not reduce the throughput of the film formation process.

  By the way, by using the concave work holder 110, the side wall portion of the concave portion of the work holder 110 serves as a barrier, and the processing in one of the first processing area 101 and the second processing area 102 is performed in the other processing area. The influence on the processing in the is suppressed. For example, when the sputtering process is performed in one processing region, it is possible to suppress the target atoms generated by the sputtering from diffusing from the inside of the recess of the work holder 110 to the other processing region.

  The film forming apparatus 1 according to the embodiment is effective when, for example, as shown in FIG. 9, the injection molding and the film forming process are continuously performed in conjunction with the molding apparatus 2 that performs injection molding of the workpiece 100.

  In the example shown in FIG. 9, the workpiece 100 injection molded by the molding apparatus 2 is transferred to the conveyance holder 6 and conveyed to the film forming apparatus 1 by the conveyance path 3. Then, the workpiece 100 is moved from the transfer holder 6 into the hood 20 of the film forming apparatus 1 by a robot arm or the like and mounted on the support device 50 of the gate valve 30 at the first position 201. At this time, the film-formed workpiece 100 mounted on the support device 50 of the gate valve 30 is taken out from the film forming apparatus 1. For example, the workpiece 100 is transferred to the conveyance holder 7 and taken out from the film forming line by the carry-out belt 4.

  On the other hand, when the forming apparatus 2 and the film forming apparatus 1 are not interlocked, the forming apparatus performs injection molding on a predetermined amount of the workpiece 100, and then the film forming apparatus performs a film forming process on the work 100. That is, a series of processes proceeds, such as injection molding, stock of the workpiece 100, undercoat for protecting the surface of the workpiece 100, stock of the workpiece 100, and film formation. On the other hand, the film forming process can be performed immediately after the injection molding by interlocking the molding apparatus 2 and the film forming apparatus 1 as in the configuration shown in FIG. As a result, there are effects such as preventing foreign matter from adhering to the stocked workpiece 100 and lowering the quality, or eliminating the need to secure a large space for stocking. In addition, automation is achieved by using a robot arm to move the workpiece 100 from the molding apparatus 2 to the film forming apparatus 1, and labor costs and task time can be reduced.

  As a method of supplying the unprocessed workpiece 100 to the film forming apparatus 1, the workpiece 100 may be kept waiting at a predetermined standby location, and the workpiece 100 may be stored in the film forming device 1 from this standby location. For example, as shown in FIG. 10, the workpiece 100 before the film forming process is arranged on the pallet 5. Then, the workpiece 100 from the pallet 5 is mounted on the gate valve 30 in the hood 20 by a robot arm or the like.

  Thus, the method of using the pallet 5 is effective, for example, when the throughputs of the molding apparatus 2 and the film forming apparatus 1 are different. That is, when the throughput of the molding apparatus 2 is higher, the molding apparatus 2 and the film forming apparatus 1 can be interlocked by waiting the injection molded workpiece 100 on the pallet 5.

  As described above, in the film forming apparatus 1 according to the embodiment of the present invention, the workpiece 100 is mounted on the support devices 50 respectively disposed on the two main surfaces 300 facing the gate valve 30. Thus, the processed workpiece 100 and the unprocessed workpiece 100 can be exchanged while the gate valve 30 closes the opening of the film forming chamber 10. For this reason, during the film-forming process of the other workpiece | work 100, the processed workpiece | work 100 mounted in the support apparatus 50 can be replaced | exchanged for the untreated workpiece | work 100. FIG. Therefore, the throughput of the film forming apparatus 1 can be improved without requiring an increase in the size of the apparatus. For this reason, it is easy to automate in conjunction with a molding apparatus or the like. As a result, the throughput of the entire process is improved and personnel costs can be reduced. As described above, the film forming apparatus 1 is particularly effective when interlocked with another manufacturing apparatus such as the molding apparatus 2.

  Furthermore, when opening the opening 15 in order to adjust the direction of the gate valve 30, the opening is released inside the hood 20 filled with the dry gas 200. For this reason, the inside of the film forming chamber 10 is not exposed to the atmosphere containing moisture. As a result, an increase in time required for evacuation can be suppressed without using a load lock chamber or the like. In addition, the interval of the period for cleaning the inside of the film forming chamber 10 can be increased.

  Therefore, according to the film forming apparatus 1, it is possible to provide a film forming apparatus in which an increase in manufacturing cost is suppressed and a task time can be shortened.

<Modification>
As shown in FIG. 11, a storage area 210 for storing the workpiece 100 before the film forming process may be set inside the hood 20. That is, the unprocessed workpiece 100 is temporarily stored in the storage area 210 in the hood 20 before being mounted on the support device 50. Then, the film forming process is sequentially performed on the workpiece 100 stored in the storage area 210. Since the inside of the hood 20 is filled with the dry gas 200, it is possible to prevent the work 100 before the film formation process from being exposed to the atmosphere and being deteriorated.

(Other embodiments)
As mentioned above, although this invention was described by embodiment, it should not be understood that the description and drawing which form a part of this indication limit this invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  In the above description, the example in which the sputtering method film forming process is performed in the first processing region 101 and the film forming process by the plasma CVD method is performed in the second processing region 102 has been described. However, the combination of processing in the first processing area 101 and the second processing area 102 is not limited to the above. Further, although an example in which two processing regions are defined in the film forming chamber 10 has been shown, the present invention can also be applied to a case where the processing regions defined in the film forming chamber 10 are three or more. The present invention is also effective when the film forming process in the film forming chamber 10 is one type such as a plasma CVD method, a sputtering method, or a vapor deposition method.

  In addition, by disposing a heating device such as a heater inside the hood 20, the workpiece 100 can be preheated before the film forming process.

  As described above, the present invention naturally includes various embodiments not described herein. Therefore, the technical scope of the present invention is defined only by the invention specifying matters according to the scope of claims reasonable from the above description.

DESCRIPTION OF SYMBOLS 1 ... Film formation apparatus 2 ... Molding apparatus 5 ... Pallet 10 ... Film formation chamber 11 ... Conveyance apparatus 15 ... Opening part 20 ... Hood 21 ... Dry gas supply apparatus 22 ... Exhaust mechanism 23 ... Shutter 30 ... Gate valve 40 ... Adjustment apparatus 41 ... Movement mechanism 42 ... Rotation mechanism 50 ... Support device 100 ... Workpiece 101 ... First treatment area 102 ... Second treatment area 110 ... Work holder 200 ... Dry gas 201 ... First position 202 ... Second position 210 ... Storage area 300 ... Main surface

Claims (9)

A film forming chamber provided with an opening for carrying a processing object inside;
A hood that covers the opening of the film forming chamber and is connected to the film forming chamber and filled with a dry gas;
Supporting devices on which the processing object is mounted are respectively disposed on two opposing main surfaces, one main surface is located inside the film forming chamber, and the other main surface is located inside the hood. A gate valve that closes the opening in a state;
An adjustment device for moving the gate valve within the hood between a first position where the gate valve closes the opening and a second position where the gate valve does not close the opening; A film forming apparatus comprising:   2. The film forming apparatus according to claim 1, wherein the adjusting device adjusts the direction of the gate valve at the second position so that one of the two main surfaces faces the opening. . The adjusting device is
A moving mechanism for moving the gate valve between the first position and the second position;
The film forming apparatus according to claim 2, further comprising: a rotation mechanism that rotates the gate valve at the second position.   4. The process object according to claim 1, wherein, in the first position, the processed object to be processed mounted on the support device located inside the hood is replaced with the unprocessed object to be processed. 5. The film forming apparatus according to claim 1.   A shutter that opens and closes in order to store the unprocessed object to be processed in the hood and take out the processed object to be processed from the inside of the hood is installed in the hood. Item 5. The film forming apparatus according to Item 4.   The apparatus further includes a dry gas supply device that supplies the dry gas to the inside of the hood, and the dry gas supply device includes the dry gas in the hood with at least the opening not closed by the gate valve. The film forming apparatus according to claim 1, wherein the film forming apparatus is satisfied.   The film forming apparatus according to claim 1, further comprising an area for storing the unprocessed object to be processed before being mounted on the support device inside the hood.   The film forming chamber includes a transfer device for transferring the processing object mounted on the support device, and the transfer device transfers the processing object to a processing region defined in the film forming chamber. The film forming apparatus according to claim 1, wherein the film forming apparatus is a film forming apparatus.   9. The process according to claim 8, wherein a plurality of the processing regions are defined in the film forming chamber, and the transfer device transports the processing object in the film forming chamber over the plurality of processing regions. Membrane device.

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