JP2016092105A - Electrostatic chuck device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrostatic chuck device in which a gap can be prevented from being generated between a first polymer material layer and a second polymer material layer, a junction plane between the first polymer material layer and the second polymer material layer can be prevented from being cracked or peeled, a temperature can be prevented from becoming discontinuous between the first polymer material layer and the second polymer material layer or heat conduction can be prevented from becoming non-uniform in a boundary between a first joint material and a second joint material, the electrostatic chuck device partitioning a polymer material layer disposed between the ceramics substrate and a support into at least the first polymer material layer and the second polymer material layer.SOLUTION: A polymer material layer 4 of the electrostatic chuck device is partitioned into at least a first polymer material layer 41 and a second polymer material layer 42 which is different from the first polymer material layer 41 and neighboring to the first polymer material layer 41 in a surface direction. The first polymer material layer 41 and the second polymer material layer 42 include portions 421 and 422 which are overlapped in a thickness direction, in a junction region 44 thereof.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electrostatic chuck device that fixes a plate-like sample by electrostatic force.

  The electrostatic chuck device is used for mounting a plate-like sample such as a silicon wafer and glass in a semiconductor process and a liquid crystal display manufacturing process. The plate-like sample placed on the electrostatic chuck device is fixed by electrostatic force. The electrostatic chuck device includes a ceramic base material for placing a plate-like sample and a support for supporting the ceramic base material. Between the ceramic substrate and the support, a resin bonding layer for bonding the ceramic substrate and the support is provided.

  The resin bonding layer is divided into a plurality of regions, and different bonding materials may be used in the respective regions. For example, the resin bonding layer is divided into two regions, a central portion and an outer peripheral portion thereof in the plane, and the first bonding material is disposed as a bonding material in the central portion, and the first bonding material is different as the bonding material in the outer peripheral portion. An electrostatic chuck device in which a second bonding material having a higher thermal conductivity than the first bonding material is arranged is known as a conventional technique (see, for example, Patent Document 1). Thus, it is supposed that the in-plane temperature distribution of the plate-like sample placed on the ceramic substrate can be adjusted by arranging the bonding materials having different thermal conductivities in the bonding layer.

JP 2006-13302 A

  However, in the bonding layer in the electrostatic chuck device described in Patent Document 1, characteristics such as a shrinkage rate and a thermal expansion coefficient during curing are different between the first bonding material and the second bonding material. In some cases, a gap is generated between the second bonding material and a crack or peeling occurs on the bonding surface between the first bonding material and the second bonding material. Furthermore, since the thermal conductivity of the first bonding material is different from the thermal conductivity of the second bonding material, the temperature becomes discontinuous between the first bonding material and the second bonding material, or the first bonding material and the second bonding material. In some cases, air bubbles enter the boundary between the bonding material and the heat conduction becomes uneven at the boundary between the first bonding material and the second bonding material.

  Therefore, the present invention provides an electrostatic chuck device in which a polymer material layer disposed between a ceramic substrate and a support is at least partitioned into a first polymer material layer and a second polymer material layer. There is a gap between the first polymer material layer and the second polymer material layer, or cracks or peeling occurs on the joint surface between the first polymer material layer and the second polymer material layer. The temperature becomes discontinuous between the first polymer material layer and the second polymer material layer, or bubbles enter the boundary between the first polymer material layer and the second polymer material layer. An object of the present invention is to provide an electrostatic chuck device capable of suppressing the occurrence of non-uniform heat conduction at the boundary between the first polymer material layer and the second polymer material layer.

As a result of intensive studies to solve the above-described problems, the present inventors have found that the first polymer material layer and the second polymer material layer are overlapped in the thickness direction in the joining region. By forming the first polymer material layer and the second polymer material layer so as to have a gap between the first polymer material layer and the second polymer material layer, Cracks or delamination occurs at the joint surface between the polymer material layer and the second polymer material layer, or the temperature becomes discontinuous between the first polymer material layer and the second polymer material layer. The present inventors have found that heat conduction can be prevented from becoming uneven at the boundary between the first polymer material layer and the second polymer material layer, and the present invention has been completed. That is, the present invention is as follows.
[1] A ceramic substrate having a plane direction and a thickness direction, a support that is disposed in the thickness direction of the ceramic substrate relative to the ceramic substrate, and supports the ceramic substrate, and the ceramic substrate and the support And a polymer material layer having a plane direction and a thickness direction, wherein the polymer material layer is different from the first polymer material layer and the first polymer material layer. At least a second polymer material layer that is adjacent to the material layer in the plane direction, and the first polymer material layer and the second polymer material layer are overlapped in the thickness direction at their junction region Electrostatic chuck device having.
[2] The polymer material layer is circular in the surface direction, the circular second polymer material layer is disposed in the center portion in the surface direction, and the first The above-mentioned [1], wherein the polymer material layer is disposed outside the second polymer material layer, and the first polymer material layer has a Young's modulus lower than that of the second polymer material layer. The electrostatic chuck device according to 1.
[3] The polymer material layer has a circular shape in the plane direction, the circular second polymer material layer is disposed in the center portion in the plane direction, and the first polymer layer has a first direction relative to the center in the plane direction of the polymer material layer. The polymer material layer is disposed outside the second polymer material layer, and the corrosion resistance of the first polymer material layer to the plasma is higher than that of the second polymer material layer [1]. Or the electrostatic chuck apparatus as described in [2].
[4] The bonding line between the first polymer material layer and the second polymer material layer on the support side surface of the polymer material layer is the first polymer on the ceramic substrate side surface of the polymer material layer. The electrostatic chuck device according to the above [3], which is located on the center side in the surface direction of the polymer material layer as compared to the joining line of the material layer and the second polymer material layer.
[5] The polymer material layer has a circular shape in the plane direction, the circular second polymer material layer is disposed in the center portion in the plane direction, and the first polymer layer has a first direction relative to the center in the plane direction of the polymer material layer. The polymer material layer is disposed outside the second polymer material layer, and the thermal conductivity of the first polymer material layer is different from the thermal conductivity of the second polymer material layer. [4] The electrostatic chuck device according to any one of [4].
[6] The first polymer material layer includes a resin and a filler, the second polymer material layer is the same resin as the resin of the first polymer material layer, and the filler of the first polymer material layer The electrostatic chuck device according to any one of the above [1] to [5], including a filler having a different type from the filler, or a filler having a content different from the content of the filler in the first polymer material layer.
[7] The above [1] to [1], wherein the ceramic base material includes a heating member that heats the ceramic base material between the ceramic base material and the polymer material layer or between the polymer material layer and the support. [6] The electrostatic chuck device according to any one of [6].

  According to the present invention, in the electrostatic chuck device in which the polymer material layer disposed between the ceramic substrate and the support is at least partitioned into the first polymer material layer and the second polymer material layer, There is a gap between the first polymer material layer and the second polymer material layer, or cracks or peeling occurs on the joint surface between the first polymer material layer and the second polymer material layer. , The temperature is discontinuous between the first polymer material layer and the second polymer material layer, or heat conduction is performed at the boundary between the first polymer material layer and the second polymer material layer. It is possible to provide an electrostatic chuck device that can suppress non-uniformity.

FIG. 1A is a schematic cross-sectional view for explaining an electrostatic chuck device according to an embodiment of the present invention, and FIG. 1B is a schematic view of the electrostatic chuck device according to an embodiment of the present invention. It is a top view for demonstrating a molecular material layer. FIG. 2 is a cross-sectional view of the polymer material layer taken along line 11 in FIG. FIG. 3A and FIG. 3B are schematic views for explaining an example of a method for forming a polymer material layer in the electrostatic chuck device of one embodiment of the present invention. 4A to 4C are diagrams for explaining a bonding region between the first polymer material layer and the second polymer material layer in a modification of the electrostatic chuck device according to the embodiment of the present invention. It is a schematic diagram. FIGS. 5A to 5E are schematic diagrams for explaining an example of a method for forming a polymer material layer in a modification of the electrostatic chuck device according to the embodiment of the present invention shown in FIG. 4C. is there. FIG. 6A and FIG. 6B are plan views for explaining a polymer material layer in a modified example of the electrostatic chuck device of one embodiment of the present invention. FIG. 7 is a schematic cross-sectional view for explaining a modification of the electrostatic chuck device of one embodiment of the present invention.

[Electrostatic chuck device]
Hereinafter, an electrostatic chuck apparatus according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1A is a schematic cross-sectional view for explaining an electrostatic chuck device according to an embodiment of the present invention, and FIG. 1B is a schematic view of the electrostatic chuck device according to an embodiment of the present invention. It is a top view for demonstrating a molecular material layer. FIG. 2 is a cross-sectional view of the polymer material layer taken along line 11 in FIG. In addition, the direction of XY plane of FIG.1 (b) is a surface direction, and the Z-axis direction of Fig.1 (a) and FIG. 2 is a thickness direction.

  An electrostatic chuck device 1 according to an embodiment of the present invention is disposed in a thickness direction of a ceramic substrate 2 with respect to a ceramic substrate 2 having a surface direction and a thickness direction, and the ceramic substrate 2. A support 3 that supports the material 2 and a polymer material layer 4 that is disposed between the ceramic substrate 2 and the support 3 and that has a plane direction and a thickness direction are included.

(Ceramic substrate)
The ceramic substrate 2 mounts a plate-like sample W such as a silicon wafer. The shape of the ceramic substrate 2 in the surface direction is preferably circular. The ceramic substrate 2 includes an electrostatic adsorption electrode 21. The electrostatic chucking electrode 21 is preferably built in the ceramic substrate 2 from the viewpoints of durability, heat uniformity and production stability. Further, in order to reduce the manufacturing cost of the electrostatic chuck device, the electrostatic chucking electrode 21 may be provided on the support side of the ceramic substrate 2. The electrostatic chucking electrode 21 is connected to the power feeding terminal 22, and a DC voltage is applied to the electrostatic chucking electrode 21 through the power feeding terminal 22. When a DC voltage is applied to the electrostatic adsorption electrode 21, an electrostatic force is generated on the surface of the ceramic substrate 2 on which the plate-like sample W is placed. Thereby, the plate-like sample W is adsorbed to the ceramic substrate 2 and the plate-like sample W is fixed to the ceramic substrate 2.

The material of the ceramic substrate 2 is preferably a ceramic having a volume resistivity of about 10 ⁸ to 10 ¹⁵ Ω · cm, high mechanical strength, and durability against oxygen-based plasma and corrosive gas. Examples of such ceramics include oxides such as aluminum oxide (Al ₂ O ₃ ), zirconium oxide (ZrO ₂ ), and magnesium oxide (MgO), yttrium aluminum oxide, samarium oxide (Sm ₂ O ₃ ), and europium oxide. Rare earth oxides such as (Eu ₂ O ₃ ), nitrides such as aluminum nitride (AlN), silicon nitride (Si ₃ N ₄ ), sialon and boron nitride (BN), carbides such as silicon carbide (SiC), and Ceramic composites having the above-mentioned durability, such as yttrium aluminum composite ceramics, rare earth element-added yttrium aluminum composite ceramics, aluminum silicon carbide composite ceramics, and magnesium aluminum oxide nitride composite ceramics Such as a solid solution, and the like. The ceramic base material 2 may be a ceramic base material made of only one kind of the above materials, or may be a ceramic base material made by laminating different base materials of the above materials.

  The thickness of the ceramic substrate 2 is preferably 0.7 to 3.0 mm. If the thickness of the ceramic substrate 2 is smaller than 0.7 mm, the mechanical strength of the ceramic substrate may not be ensured. On the other hand, if the thickness of the ceramic substrate 2 is larger than 3.0 mm, the heat capacity of the ceramic substrate 2 becomes too large, and the thermal response of the plate-like sample W placed becomes worse, and the ceramic substrate 2 Due to the decrease in the heat transfer coefficient in the surface direction of 2, the in-plane temperature of the plate sample W may be difficult to maintain in a desired temperature pattern.

The electrostatic adsorption electrode 21 is an electrode for generating a charge and fixing the plate-like sample to the ceramic substrate 2 with an electrostatic adsorption force. The shape and size of the electrostatic chucking electrode 21 are appropriately adjusted depending on the application. As the material of the electrostatic chucking electrode 21, it is preferable to use a composite material of a material used for the ceramic substrate 2 and a conductive material. Conductive materials include conductive ceramics such as tantalum carbide (Ta ₄ C ₅ ), niobium carbide (NbC), silicon carbide (SiC) and carbon (C), as well as tungsten (W), molybdenum (Mo) and tantalum (Ta ) And other high melting point metals.

  The thickness of the electrostatic attraction electrode 21 is not particularly limited, but is preferably 0.01 to 200 μm, and more preferably 0.1 to 100 μm, for example. If the thickness of the electrostatic attraction electrode 21 is smaller than 0.01 μm, sufficient conductivity may not be ensured. On the other hand, if the thickness of the electrostatic adsorption electrode 21 is larger than 200 μm, a crack is generated in the ceramic substrate 2 due to the difference in thermal expansion coefficient between the ceramic substrate 2 and the electrostatic adsorption electrode 21. There is a case. The electrostatic adsorption electrode 21 is formed by a film forming method such as a sputtering method or a vapor deposition method, or a coating method such as a screen printing method.

  The power feeding terminal 22 is a rod-like electrode provided for applying a DC voltage to the electrostatic chucking electrode 21. The material of the power supply terminal 22 is not particularly limited as long as it is a conductive material having excellent heat resistance, but the thermal expansion coefficient approximates the thermal expansion coefficient of the ceramic substrate 2 and the thermal expansion coefficient of the electrostatic adsorption electrode 21. Is preferred. Examples of the material of the power supply terminal 22 include the same conductive ceramic as the conductive ceramic used for the electrostatic attraction electrode 21, tungsten (W), tantalum (Ta), molybdenum (Mo), and niobium (Nb). And metal materials such as Kovar alloy.

(Support)
The support 3 supports the ceramic substrate 2. The support 3 may include a flow path 31 through which a cooling medium such as water and an organic solvent flows. By allowing a cooling medium such as water and an organic solvent to flow through the flow path 31, the plate-like sample W placed on the ceramic substrate 2 can be cooled, and the plate-like sample W placed on the ceramic substrate 2. The surface can be controlled to a desired temperature. In order to insulate between the power feeding terminal 22 and the support 3, an insulator 32 is provided around the power feeding terminal 22 in the support 3.

  The material of the support 3 is not particularly limited as long as it is a metal, ceramic, or metal-ceramic composite material excellent in thermal conductivity, conductivity, and workability. Examples of the material of the support 3 include aluminum (Al), copper (Cu), and stainless steel (SUS). A surface exposed to plasma such as the side surface of the support 3 may be anodized, or the surface may be coated with an insulating thermal spray material such as alumina and yttria.

(Polymer material layer)
The polymer material layer 4 having a surface direction and a thickness direction is disposed between the ceramic substrate 2 and the support 3. In addition, another layer may be disposed between the polymer material layer 4 and the ceramic substrate 2 and / or between the polymer material layer 4 and the support 3. The polymer material layer 4 is partitioned into a first polymer material layer 41 and a second polymer material layer 42. Unlike the first polymer material layer 41, the second polymer material layer 42 is adjacent to the first polymer material layer in the surface direction. For example, as shown in FIG. 1B, the polymer material layer 4 has a circular shape in the plane direction, and a circular second polymer material 42 is arranged at the center in the plane direction. The first polymer material layer 41 is disposed outside the second polymer material layer 42 with respect to the center in the plane direction.

  The thickness of the polymer material layer 4 is not particularly limited, but is preferably 40 to 500 μm, more preferably considering the bonding strength of the polymer material layer 4 and the ease of forming the polymer material layer 4. Is 55 to 200 μm. When the thickness of the polymer material layer 4 is 40 to 500 μm, the bonding strength between the ceramic substrate 2, the support 3, or another layer adjacent to the polymer material layer 4 in the thickness direction is improved. The heat conduction between the ceramic substrate 2 and the support 3 becomes good. Further, the thickness of the polymer material layer 4 becomes more uniform, and as a result, the heat conduction between the ceramic substrate 2 and the support 3 becomes uniform in the plane direction, and the plate placed on the ceramic substrate 2 The in-plane temperature of the sample W is made uniform.

  As shown in FIG. 2, the bonding surface 43 of the first polymer material layer 41 and the second polymer material layer 42 is an inclined surface with respect to the surface direction of the polymer material layer 4. Therefore, the first polymer material layer 41 and the second polymer material layer 42 have portions 411 and 421 that overlap in the thickness direction in the bonding region 44 thereof. As a result, the area of the joint surface 43 of the first polymer material layer 41 and the second polymer material layer 42 is increased, so that the area between the first polymer material layer 41 and the second polymer material layer 42 is increased. This increases the bonding force of the first polymer material layer 41 and suppresses the generation of a gap between the first polymer material layer 41 and the second polymer material layer 42. Moreover, since the area of the joint surface 43 of the first polymer material layer 41 and the second polymer material layer 42 is increased, the area between the first polymer material layer 41 and the second polymer material layer 42 is increased. The concentration of stress generated on the joint surface 43 is alleviated, and cracks and peeling are suppressed from occurring on the joint surface 43 between the first polymer material layer 41 and the second polymer material layer 42. Further, since the bonding surface 43 of the first polymer material layer 41 and the second polymer material layer 42 is inclined with respect to the surface direction of the polymer material layer 4, the first polymer material layer 41 and the second polymer material layer 42 are inclined. The temperature becomes discontinuous at the joint surface 43 between the material layer 41 and the second polymer material layer 42, or the joint surface 43 between the first polymer material layer 41 and the second polymer material layer 42. It is possible to suppress the occurrence of non-uniform heat conduction at the boundary between the first bonding material and the second bonding material.

  In FIG. 1A, reference numeral 45 denotes a bonding line between the first polymer material layer 41 and the second polymer material layer 42 on the surface of the polymer material layer 4 on the ceramic substrate 2 side, Reference numeral 46 indicates a bonding line between the first polymer material layer 41 and the second polymer material layer 42 on the surface of the polymer material layer 4 on the support 3 side. In FIG. 1A, the region between the bonding line 45 and the bonding line 46 corresponds to the bonding region 44 of the first polymer material layer 41 and the second polymer material layer 42 (see FIG. 2).

  The width of the bonding region 44 in the direction from the center of the polymer material layer 4 to the outside is preferably 50 to 10,000 μm, more preferably 100 to 5000 μm. When the width of the bonding region 44 is 50 to 10,000 μm, a gap is generated between the first polymer material layer 41 and the second polymer material layer 42, or the first polymer material layer 41 and the second polymer material layer 41 are separated from each other. It is possible to further suppress the occurrence of cracks and peeling on the joint surfaces 43 between the polymer material layers 42. Further, the temperature becomes discontinuous at the joint surface 43 between the first polymer material layer 41 and the second polymer material layer 42, or the first polymer material layer 41 and the second polymer material layer 41 It is possible to further suppress the occurrence of air bubbles at the boundary between the first bonding material and the second bonding material due to the presence of bubbles on the bonding surface 43 between the first bonding material and the second bonding material.

  The value obtained by dividing the width of the bonding region 44 in the direction outward from the center of the polymer material layer 4 by the thickness of the polymer material layer 4 is preferably 0.5 to 50, more preferably 1 to 20. is there. When the divided value is 0.5 to 50, a gap is generated between the first polymer material layer 41 and the second polymer material layer 42 in this case, or the first polymer material layer 41 is used. Further, it is possible to further suppress the occurrence of cracks or peeling on the joint surface 43 between the second polymer material layers 42. Further, the temperature becomes discontinuous at the joint surface 43 between the first polymer material layer 41 and the second polymer material layer 42, or the first polymer material layer 41 and the second polymer material layer 41 It is possible to further suppress the occurrence of air bubbles at the boundary between the first bonding material and the second bonding material due to the presence of bubbles on the bonding surface 43 between the first bonding material and the second bonding material.

  The material of the first polymer material layer 41 and the second polymer material layer 42 is not particularly limited as long as it is a polymer material having heat resistance and insulation. Examples of the material of the first polymer material layer 41 and the second polymer material layer 42 include phenol resin, urea resin, melamine resin, diallyl phthalate resin, unsaturated polyester resin, silicone resin, epoxy resin, polyethylene, Cross-linked polyethylene, chlorinated polyethylene, ethylene / vinyl acetate copolymer, polypropylene, polyisobutylene, polyvinyl chloride, polyvinyl chloride, polyvinyl alcohol, polyvinyl acetal, acrylic resin, polyvinyl acetate, polyacrylonitrile, polystyrene, styrene / acrylonitrile Copolymer, acrylonitrile / butadiene / styrene terpolymer, cellulose plastic, fluorine resin, polyamide, polyethylene terephthalate, polybutylene terephthalate, polyarylate Polyacetal, polycarbonate, polyphenylene sulfide, polysulfone, polyimide, wholly aromatic polyimide, polyamideimide, polyetherimide, polyetheretherketone, polybenzimidazole, natural rubber, isoprene rubber, butadiene rubber, styrene / butadiene rubber, chloroprene rubber, nitrile Rubber, butyl rubber, ethylene / propylene rubber, chlorosulfonated polyethylene, acrylic rubber, polysulfide rubber, fluorine rubber, silicone rubber, styrene elastomer, olefin elastomer, vinyl chloride elastomer, urethane elastomer, polyamide elastomer, perfluoroelastomer Etc. You may use these 1 type individually or in combination of these 2 or more types as a material of the 1st polymeric material layer 41 and the 2nd polymeric material layer 42. FIG.

  Preferred materials for the first polymer material layer 41 and the second polymer material layer 42 are silicone resin, epoxy resin, acrylic resin, fluorine resin, polyimide resin, and perfluoro from the viewpoint of heat resistance and insulation. It is at least one selected from the group consisting of elastomers. A more preferable material of the first polymer material layer 41 is at least one selected from the group consisting of a silicone resin, an acrylic resin, a fluorine resin, and a perfluoroelastomer, and a more preferable second polymer material layer 41 The material is at least one selected from the group consisting of silicone resins and acrylic resins.

  In order to increase the thermal conductivity, to increase the elastic modulus, to increase the deflection temperature under load, to reduce the molding shrinkage and thermal expansion coefficient and to improve the dimensional accuracy, to improve the electrical characteristics Therefore, the first polymer material layer 41 and the second polymer material layer 42 may further contain a filler in order to control fluidity during molding or to improve flame retardancy. . The fillers of the first polymer material layer 41 and the second polymer material layer 42 are not particularly limited as long as they are generally used in resin compositions. Examples of the filler of the first polymer material layer 41 and the second polymer material layer 42 include aluminum nitride, titanium boride, talc, silicic acid, calcium, kaolin, aluminum hydroxide, aluminum oxide, magnesium oxide, Examples include mica, aerosil and glass beads.

  As described above, the second polymer material layer 42 is different from the first polymer material layer 41. A mode in which the second polymer material layer 42 is different from the first polymer material layer 41 is not particularly limited. For example, when the type of the polymer material of the second polymer material layer 42 is different from the type of the polymer material of the material of the first polymer material layer 41, the second polymer material layer 42 is changed to the first polymer material layer 42. The polymer material layer 41 may be different. Further, when the first polymer material layer 41 and the second polymer material layer 42 include a filler, the type of filler of the second polymer material layer 42 is the same as that of the filler of the first polymer material layer 41. Depending on the type, the second polymer material layer 42 may be different from the first polymer material layer 41. When the filler type of the second polymer material layer 42 is the same as the filler type of the first polymer material layer 41, the filler content of the second polymer material layer 42 is the first The second polymer material layer 42 may be different from the first polymer material layer 41 by being different from the filler content of the polymer material layer 41.

  Since the second polymer material layer 42 is different from the first polymer material layer 41, for example, the first polymer material layer 41 has a Young's modulus lower than the Young's modulus of the second polymer material layer 42. You may make it have. Compared with the center side of the ceramic base material 2, the outer circumference side of the ceramic base material 2 has a larger elongation due to the temperature rise of the ceramic base material 2. Therefore, as described above, by making the first polymer material layer 41 have a Young's modulus lower than the Young's modulus of the second polymer material layer 42, the polymer material layer 4 is made a single layer. The rigidity of the polymer material layer 4 can be ensured to some extent as compared with the case where it is made of a material, and the stress generated in the ceramic base material due to the temperature rise of the ceramic base material 2 can be further relaxed.

  The Young's modulus of the first polymer material layer 41 is preferably 1 to 100 MPa, more preferably 1 to 8 MPa. On the other hand, the Young's modulus of the second polymer material layer 42 is preferably smaller than the Young's modulus of the first polymer material layer 41, more preferably 8 MPa or less, and even more preferably 1 MPa or less. . When the Young's modulus of the first polymer material layer 41 is 1 to 100 MPa and the Young's modulus of the second polymer material layer 42 is 8 MPa or less, the rigidity of the polymer material layer 4 can be secured to some extent. At the same time, the stress generated in the ceramic substrate due to the temperature rise of the ceramic substrate 2 can be further relaxed.

  Next, a method for forming the polymer material layer 4 will be described with reference to FIG. It is preferable to form the first polymer material layer 41 and the second polymer material layer 42 by combining a material whose shape is determined before heat curing and a fluid material before heat curing. By using such a material in combination, the shape of the joint surface 43 of the first polymer material layer 41 and the second polymer material layer 42 can be controlled, and defects and bubbles in the joint surface 43 can be controlled. Can be reduced. FIG. 3A and FIG. 3B are schematic views for explaining an example of a method for forming the polymer material layer 4 in the electrostatic chuck device 1 according to the embodiment of the present invention. In this method of forming the polymer material layer 4, a step of attaching a thermocompression-bonded polymer material sheet 420 for forming the second polymer material layer 42 and the first polymer material layer 41 are formed. A step of applying a polymer material paste 410 for the purpose.

  As shown in FIG. 3A, a thermocompression-bonding polymer material sheet 420 for forming the second polymer material layer 42 is bonded onto the ceramic substrate 200 by thermocompression bonding. The end surface 422 of the polymer material sheet 420 is inclined with respect to the main surface 423 of the polymer material sheet 420. Next, as shown in FIG. 3B, a polymer material paste 410 for forming the first polymer material layer 41 is applied onto the ceramic substrate 200 outside the sheet 420 by a printing method or the like. . Then, the polymer material paste 410 applied on the ceramic substrate 200 is dried.

  Next, after placing the ceramic base material 200 on which the polymer material paste 410 and the polymer material sheet 420 are arranged on the support, the ceramic material paste 410 and the polymer material sheet 420 are heated. Harden. As a result, the first polymer material layer 41 and the second polymer material layer 42 have the portions 411 and 421 that overlap in the thickness direction in the joining region 44 (see FIG. 2). Can be formed. Examples of the printing method of the polymer material paste 410 for forming the first polymer material layer 41 include a method of applying manually using a spatula, a bar coating method, a screen printing method, and the like. . The method of heat-curing the polymer material layer 4 includes, for example, reducing the pressure in order to suppress the occurrence of bubbles and defects on the joint surfaces 43 of the first polymer material layer 41 and the second polymer material layer 42. In which the polymer material layer 4 is heated and cured, and after the bubbles generated on the joint surfaces 43 of the first polymer material layer 41 and the second polymer material layer 42 are removed under reduced pressure, There is a method in which the polymer material layer 4 is cured by heating.

  In the above method, the polymer material layer is formed on the ceramic substrate 200, but the polymer material layer may be formed on the support 3. In addition to the above method, the polymer material layer 4 is formed by forming either the first polymer material layer 41 or the second polymer material layer 42 on the ceramic substrate 2 or the support 3. After that, the method of processing the bonding surface 43 into a desired shape, and either the first polymer material layer 41 or the second polymer material layer 42 are placed on the ceramic substrate 2 or the support 3. The method of apply | coating and hardening so that it may become a desired shape is mentioned. A material having adhesiveness or adhesiveness may be used as the material of the first polymer material layer 41 and / or the second polymer material layer 42, and the first polymer material layer 41 and / or the second polymer material layer 41 and / or the second polymer material layer 41 may be used. A material having no tackiness or adhesiveness may be used as the material of the polymer material layer 42 and a layer having tackiness or adhesiveness may be formed on the surface of the material.

[Modification]
The electrostatic chuck device 1 according to the embodiment of the present invention can be modified as follows.
(Modification 1)
As shown in FIG. 2, the bonding surface 43 of the first polymer material layer 41 and the second polymer material layer 42 in the electrostatic chuck device 1 according to the embodiment of the present invention is a plane inclined surface. However, if the first polymer material layer 41 and the second polymer material layer 42 have overlapping portions in the thickness direction in the joining region 44, the first polymer material layer 41 and the second polymer material layer 41 The bonding surface 43 of the polymer material layer 42 may not be a flat inclined surface.

  For example, as in the polymer material layer 4A shown in FIG. 4A, the bonding surface 43A of the first polymer material layer 41 and the second polymer material layer 42 is on the first polymer material layer 41 side. Alternatively, it may be an inclined surface having a convexly curved surface. Further, the joint surface of the first polymer material layer and the second polymer material layer may be a curved inclined surface that is convex toward the second polymer material layer side (not shown). Further, like the polymer material layer 4B shown in FIG. 4B, the joint surface 43B of the first polymer material layer 41 and the second polymer material layer 42 is an inclined surface having an S-shaped cross section. There may be. Moreover, like the polymer material layer 4C shown in FIG. 4C, the joint surface 43C of the first polymer material layer 41 and the second polymer material layer 42 may be stepped. 4A to 4C show the bonding region 44 of the first polymer material layer 41 and the second polymer material layer 42 in the modification of the electrostatic chuck device 1 according to the embodiment of the present invention. It is a schematic diagram for demonstrating.

  Next, an example of a method for forming the stepped joint surface 43C between the first polymer material layer 41 and the second polymer material layer 42 shown in FIG. 4C will be described with reference to FIG. . FIGS. 5A to 5E are schematic diagrams for explaining an example of a method for forming the polymer material layer 4C in the modification of the electrostatic chuck device 1 according to the embodiment of the present invention shown in FIG. 4C. FIG. The method for forming the polymer material layer 4 includes a step of applying the second polymer material paste 420C for forming the second polymer material layer 42 a plurality of times while gradually reducing the size in the surface direction. A step of applying a polymer material paste 410C for forming the first polymer material layer 41 is included.

  As shown in FIG. 5A, a polymer material paste 420C for forming the second polymer material layer 42 is applied onto the ceramic substrate 200 by a screen printing method. After the polymer material paste 420C applied on the ceramic substrate 200 is dried, as shown in FIG. 5B, the dried polymer material paste 420C is dried on the dried polymer material paste 420C. The polymer material paste 420C for forming the second polymer material layer 42 is applied by a screen printing method in an application range slightly narrower than the application range. After the polymer material paste 420C applied on the ceramic substrate 200 is dried, as shown in FIG. 5C, the polymer material paste 420C previously applied on the dried polymer material paste 420C. The polymer material paste 420C for forming the second polymer material layer 42 is applied by a screen printing method in an application range slightly narrower than the application range. After the polymer material paste 420C applied on the ceramic substrate 200 is dried, as shown in FIG. 5D, the polymer material paste 420C previously applied on the dried polymer material paste 420C. The polymer material paste 420C for forming the second polymer material layer 42 is applied by a screen printing method in an application range slightly narrower than the application range.

  Next, as shown in FIG. 5E, a polymer material paste 410C for forming the first polymer material layer 41 is formed by a printing method or the like to form the second polymer material layer 42. The polymer material paste 420C is applied on the ceramic substrate 200 outside. Then, the polymer material paste 410C for forming the first polymer material layer 41 applied on the ceramic substrate 200 is dried. Next, after placing the ceramic base material 200 on which the polymer material pastes 410C and 420C are applied on the support, it is heated to cure the polymer material pastes 410C and 420C. Thereby, the joint surface 43 between the first polymer material layer 41 and the second polymer material layer 42 shown in FIG. 4C can be formed.

  Instead of applying the second polymer material paste 420C a plurality of times while gradually reducing the size in the surface direction, a plurality of sheets having different sizes in the surface direction are stacked to have a stepped end surface. Two polymer material layers 42 may be formed.

(Modification 2)
As shown in FIG. 1B, in the electrostatic chuck device 1 according to the embodiment of the present invention, the first polymer material layer 41 and the second polymer material layer 4 on the surface of the polymer material layer 4 on the ceramic substrate 2 side. The bonding line 45 of the polymer material layer 42 is higher than the bonding line 46 of the first polymer material layer 41 and the second polymer material layer 42 on the surface of the polymer material layer 4 on the support 3 side. It was located outside the center of the molecular material layer 4. However, the bonding line 45 between the first polymer material layer 41 and the second polymer material layer 42 on the surface of the polymer material layer 4 on the ceramic base material 2 side is on the support 3 side of the polymer material layer 4. Compared to the bonding line 46 of the first polymer material layer 41 and the second polymer material layer 42 on the surface, the polymer material layer 4 may be located on the center side. Also in this case, the first polymer material layer 41 and the second polymer material layer 42 can have a portion that overlaps in the thickness direction in the bonding region 44.

(Modification 3)
In the electrostatic chuck device 1 according to the embodiment of the present invention, the first polymer material layer 41 has a Young's modulus different from that of the second polymer material layer 42. However, the first polymer material layer 41 may have a different plasma corrosion resistance compared to the plasma resistance of the second polymer material layer 42. For example, the polymer material layer 4 is circular in the plane direction, the circular second polymer material layer 42 is disposed at the center in the plane direction, and the The first polymer material layer 41 is disposed outside the second polymer material layer 42, and the corrosion resistance of the first polymer material layer 41 to the plasma is the same as that of the second polymer material layer 42. You may make it become high compared with.

  When an electrostatic chuck device is used in the plasma processing apparatus, the outer peripheral portion of the polymer material layer 4 may be exposed to plasma. The first polymer material layer having a high corrosion resistance against plasma is provided in the region of the polymer material layer 4 that is greatly affected by the plasma, and the corrosion resistance against the plasma of the region of the polymer material layer 4 that is not greatly affected by the plasma is Although not particularly high, by providing a second polymer material layer suitable for use as the polymer material layer 4 in other respects, the corrosion resistance against plasma is excellent, and the other points are also excellent. A polymeric material layer can be formed on the electrostatic chuck device.

  Since the plasma is radiated on the ceramic substrate 2 in the direction from the ceramic substrate 2 to the support 3, the first polymer material layer 41 on the surface of the polymer material layer 4 on the support 3 side and The joint line 46 of the second polymer material layer 41 is connected to the joint line 45 of the first polymer material layer 41 and the second polymer material layer 42 on the surface of the polymer material layer 4 on the ceramic substrate 2 side. Compared to the center side in the surface direction of the polymer material layer 4 is preferable. As a result, the area of the first polymer material layer 41 on the support 3 side is increased, so that the polymer material layer in the bonding region 44 between the first polymer material layer 41 and the second polymer material layer 42. Reliability can be ensured when 4 is deteriorated by plasma.

  For example, the material of the first polymer material layer 41 is a silicone resin, and the material of the second polymer material layer 41 is at least one selected from the group consisting of an acrylic resin, a fluorine resin, and a perfluoroelastomer. Thus, the corrosion resistance of the first polymer material layer 41 can be made higher than the corrosion resistance of the second polymer material layer 42.

(Modification 4)
In the electrostatic chuck device 1 according to the embodiment of the present invention, the first polymer material layer 41 has a Young's modulus different from that of the second polymer material layer 42. However, the first polymer material layer 41 may have a different thermal conductivity than the corrosion resistance of the second polymer material layer 42. For example, the polymer material layer 4 is circular in the plane direction, the circular second polymer material layer 42 is disposed at the center in the plane direction, and the The first polymer material layer 41 is disposed outside the second polymer material layer 42, and the thermal conductivity of the first polymer material layer 41 is equal to the thermal conductivity of the second polymer material layer 42. And may be different.

  When the electrostatic chuck device is used in the plasma processing apparatus, the temperature of the electrostatic chuck device on the center side in the surface direction of the electrostatic chuck device and the electrostatic chuck on the outside depending on the conditions of the plasma and the surrounding conditions of the electrostatic chuck device. The temperature of the device may be different. For example, the plasma intensity may be higher on the outer peripheral side of the ceramic substrate 2 than on the center side of the ceramic substrate 2. In this case, the temperature on the outer peripheral side of the ceramic substrate 2 is higher than the temperature on the center side of the ceramic substrate 2. In this case, the thermal conductivity of the first polymer material layer 41 is higher than the thermal conductivity of the second polymer material layer 42, thereby cooling the ceramic substrate by the support 3. The efficiency is higher on the outer peripheral side of the ceramic substrate 2 than on the center side of the ceramic substrate 2. Therefore, the temperature distribution in the surface of the ceramic substrate 2 can be made more uniform, and thereby the temperature distribution in the surface of the plate-like sample W placed on the ceramic substrate 2 can also be made more uniform. .

  When the thermal conductivity of the first polymer material layer 41 is merely higher than the thermal conductivity of the second polymer material layer 42, the first polymer material layer 41 and the second polymer material 41 In some cases, the temperature distribution becomes discontinuous at the joint surface between the material layers 42, and the joint surface may be easily damaged. However, in the modified example of the electrostatic chuck device 1 according to the embodiment of the present invention, the first polymer material layer 41 and the second polymer material layer 42 are overlapped in the thickness direction at the bonding region 44 thereof. Since the portions 411 and 421 are included, the discontinuity of the temperature distribution is alleviated and the occurrence of breakage due to the discontinuity of the temperature distribution can be suppressed.

  The thermal conductivity of the first polymer material layer 41 and the thermal conductivity of the second polymer material layer 42 can be appropriately selected depending on the plasma conditions and the conditions around the electrostatic chuck device. For example, when the thermal conductivity of the first polymer material layer 41 is higher than the thermal conductivity of the second polymer material layer 42, the thermal conductivity of the first polymer material layer 41 is preferably 0. 0.5 W / mk or more, more preferably 1.0 W / mk or more. On the other hand, the thermal conductivity of the second polymer material layer 42 is preferably 0.05 to 0.5 W / mk, and more preferably 0.1 to 0.3 W / mk. When the thermal conductivity of the first polymer material layer 41 is 0.5 W / mk or more and the thermal conductivity of the second polymer material layer 42 is 0.05 to 0.5 W / mk, the ceramic substrate The in-plane temperature distribution of the plate-like sample W placed on the material 2 can be made more uniform.

  In order to make the temperature distribution in the surface of the plate-like sample W placed on the ceramic substrate 2 more uniform, the thermal conductivity of the first polymer material layer 41 is changed to that of the second polymer material layer 42. The thermal conductivity is preferably 2 times or more, more preferably 5 times or more, and even more preferably 10 times or more. If the thermal conductivity of the first polymer material layer 41 is more than twice the thermal conductivity of the second polymer material layer 42, a plate-like sample is obtained depending on the plasma conditions and the conditions surrounding the electrostatic chuck device. It is possible to further suppress the non-uniform temperature distribution in the W plane. Further, the temperature becomes discontinuous at the joint surface 43 between the first polymer material layer 41 and the second polymer material layer 42, or the first polymer material layer 41 and the second polymer material layer 41 The effect of the present invention that the presence of bubbles on the joint surface 43 between 42 and the non-uniform heat conduction at the joint surface 43 can be suppressed becomes more significant.

When the first polymer material layer 41 and the second polymer material layer 42 include a filler, the polymer materials of the first polymer material layer 41 and the second polymer material layer 42 are the same type, Since the type of filler of the second polymer material layer 42 is different from the type of filler of the first polymer material layer 41, the thermal conductivity of the second polymer material layer 42 is changed to the first polymer material layer 42. The thermal conductivity of 41 may be different. Further, when the first polymer material layer 41 and the second polymer material layer 42 include a filler, the polymer materials of the first polymer material layer 41 and the second polymer material layer 42 are of the same type. Yes, the fillers of the first polymer material layer 41 and the second polymer material layer 42 are the same type, and the filler content of the second polymer material layer 42 is the same as that of the first polymer material layer 41. The thermal conductivity of the second polymer material layer 42 may be different from the thermal conductivity of the first polymer material layer 41 by being different from the filler content. Since the polymer materials of the first polymer material layer 41 and the second polymer material layer 42 are of the same type, the bonding surfaces 43 of the first polymer material layer 41 and the second polymer material layer 42 The bonding strength can be further increased. Examples of the filler that can improve the thermal conductivity of the first polymer material layer 41 and the second polymer material layer 42 include a filler made of an inorganic oxide, an inorganic nitride, or an inorganic oxynitride. Can be mentioned. Such a filler is, for example, surface-coated aluminum nitride (AlN) particles in which a coating layer made of silicon oxide (SiO ₂ ) is formed on the surface of aluminum nitride (AlN) particles.

(Modification 5)
As shown in FIG. 1B, in the electrostatic chuck device 1 according to one embodiment of the present invention, the shape of the polymer material layer 4 is circular, but the shape of the polymer material layer is not limited to a circle. For example, when the shape of the ceramic substrate is rectangular, the shape of the polymer material layer may also be rectangular.

(Modification 6)
As shown in FIG. 1B, in the electrostatic chuck device 1 according to one embodiment of the present invention, in the polymer material layer 4, a circular second polymer material layer 42 is disposed at the center in the plane direction, The first polymer material layer 41 is disposed outside the second polymer material layer 42 with respect to the center in the surface direction of the polymer material layer 4. However, unlike the first polymer material layer 41 and the first polymer material layer 41, the polymer material layer 4 is adjacent to the first polymer material layer 41 in the plane direction. 1 is not limited to the structure of the first polymer material layer 41 and the second polymer material layer 42 shown in FIG.

  For example, like the polymer material layer 4D shown in FIG. 6A, the polymer material layer 4D has a circular shape in the surface direction, and the circular third polymer material layer 48D is arranged at the center in the surface direction. The second polymer material layer 42D is disposed outside the third polymer material layer 48D with respect to the center in the surface direction of the polymer material layer 4D, and the center in the surface direction of the polymer material layer 4D. Thus, the first polymer material layer 41D may be disposed outside the second polymer material layer 42D.

  Further, as shown in the polymer material layer 4E of FIG. 6B, the polymer material layer 4E is circular in the surface direction, and the second polymer material layer 42E having a circular outer shape is in the center in the surface direction. The plurality of first polymer material layers 41E are arranged inside the second polymer material layer 42E, and the third polymer material layer 48E with respect to the center in the surface direction of the polymer material layer 4E. May be arranged outside the second polymer material layer 42E. The region in which the plurality of first polymer material layers 41E are disposed includes, for example, a region of a gas hole that supplies a plasma gas source, a region in which lift pins for moving the plate-like sample W up and down, and This corresponds to a region where electrodes are arranged. In these regions, the plasma intensity may be higher, the temperature may be higher, or the temperature may be lower than the surrounding region. Then, the second polymer material layer 42E having a circular outer shape is arranged at the center in the surface direction, and the plurality of first polymer material layers 41E are arranged inside the second polymer material layer 42E. The corrosion resistance against plasma of the electrostatic chuck device can be improved, and the temperature distribution in the surface direction of the plate-like sample W can be made uniform.

  In FIG. 6A, reference numeral 45D indicates a bonding line between the first polymer material layer 41D and the second polymer material layer 42D on the surface of the polymer material layer 4D on the ceramic substrate 2 side, Reference numeral 46D indicates a bonding line between the first polymer material layer 41D and the second polymer material layer 42D on the surface of the polymer material layer 4D on the support 3 side. Further, in FIG. 6B, reference numeral 45E indicates a bonding line between the first polymer material layer 41E and the second polymer material layer 42E on the surface of the polymer material layer 4E on the ceramic substrate 2 side, Reference numeral 46E denotes a bonding line between the first polymer material layer 41E and the second polymer material layer 42E on the surface of the polymer material layer 4E on the support 3 side.

(Modification 7)
The electrostatic chuck device may further include a heating member that heats the ceramic substrate between the ceramic substrate and the polymer material layer, or between the polymer material layer and the support, in the ceramic substrate. . Thereby, the temperature of the plate-shaped sample W mounted on the ceramic base material 2 can be controlled more freely. Further, when the electrostatic chuck device includes a heating member, the temperature difference between the ceramic substrate 2 and the support 3 becomes larger, so that the gap between the first polymer material layer and the second polymer material layer is increased. A gap is likely to occur, and a crack or peeling is likely to occur on the joint surface between the first polymer material layer and the second polymer material layer. Therefore, the first polymer material layer 41 and the second polymer material layer 42 have portions overlapping each other in the thickness direction in their joining regions, whereby the first polymer material layer 41 and the second polymer material layer 41 It is possible to suppress the generation of a gap between the first and second polymer material layers 42, and to suppress the occurrence of cracks and separation on the joint surface 43 between the first polymer material layer 41 and the second polymer material layer 42. The effect of the present invention becomes more remarkable. Further, the temperature becomes discontinuous at the joint surface 43 between the first polymer material layer 41 and the second polymer material layer 42, or the first polymer material layer 41 and the second polymer material layer 41 The effect of the present invention that the presence of air bubbles in the joint surface 43 between the first joint member 42 and the heat conduction at the boundary between the first joint material and the second joint material can be suppressed more significantly. Become.

  A modification of the electrostatic chuck device of one embodiment of the present invention will be described with reference to the drawings. FIG. 7 is a schematic cross-sectional view illustrating a modified example of the electrostatic chuck device according to the embodiment of the present invention. An electrostatic chuck device 1F shown in FIG. 7 includes a heating member 5F that heats the ceramic substrate 2 between the ceramic substrate 2 and the polymer material layer 4. Hereinafter, with respect to the electrostatic chuck device 1 </ b> F, portions different from the electrostatic chuck device 1 in one embodiment of the present invention will be mainly described.

  The electrostatic chuck device 1 </ b> F includes a ceramic substrate 2 having a surface direction and a thickness direction, and a support body that is disposed in the thickness direction of the ceramic substrate 2 with respect to the ceramic substrate 2 and supports the ceramic substrate 2. 3, a polymer material layer 4 disposed between the ceramic substrate 2 and the support 3 and having a surface direction and a thickness direction, and a heating member disposed between the ceramic substrate 2 and the polymer material layer 4 5F, an adhesive layer 6F that is disposed between the ceramic substrate 2 and the polymer material layer 4 and embeds the heating member 5F, and an insulating member 7F that is disposed between the heating member 5F and the polymer material layer 4 including.

<Heating member>
The heating member 5F is a belt-like heating element having a predetermined pattern, and generates heat by a current supplied from a power supply terminal (not shown). When the heating member 5F generates heat, the ceramic substrate 2 is heated, whereby the plate-like sample W placed on the ceramic substrate 2 is heated.

  The thickness of the heating member 5F is preferably 0.2 mm or less, and more preferably 0.1 mm or less. When the thickness of the heating member 5F exceeds 0.2 mm, the pattern shape of the heating member 5F is reflected as the temperature distribution of the plate sample W, and the in-plane temperature of the plate sample W can be maintained in a desired temperature pattern. It can be difficult. The material of the heating member 5F is preferably a nonmagnetic metal such as titanium (Ti), tungsten, and molybdenum (Mo). For example, the heating member 5F can be formed by etching a nonmagnetic metal thin plate having a certain thickness into a desired pattern by photolithography.

  In addition, it is preferable that the heating member 5F can be divided into a plurality of regions and the heat generation of the heating member 5F in each region can be independently controlled. For example, the heating member 5F is divided into a region where the first polymer material layer 41 is provided and a region where the second polymer material layer 42 is provided, and the heating member 5F generates heat in each region. It is preferable that it can be controlled independently. Even in such a case, since the first polymer material layer 41 and the second polymer material layer 41 have overlapping portions in the thickness direction in their joining regions, a plate-like shape is formed at the boundary between the two regions. A sudden change in the temperature of the sample W can be suppressed.

<Adhesive layer>
The adhesive layer 6F relieves the thermal stress between the ceramic substrate 2 and the support 3 heated by the heating member 5F. The thickness of the adhesive layer 6F is preferably 50 to 500 μm. If the thickness of the adhesive layer 6F is smaller than 50 μm, the thermal conductivity between the ceramic 2 and the support 3 is improved, but the thermal stress relaxation becomes insufficient, and cracks and cracks are likely to occur. On the other hand, if the thickness of the adhesive layer 6F exceeds 500 μm, the thermal conductivity between the ceramic 2 and the support 3 may not be sufficiently ensured.

  The material of the adhesive layer 6F is, for example, a cured body obtained by heat-curing a silicone resin composition or an acrylic resin. When the material of the adhesive layer 6F is a cured body obtained by heat-curing a silicone resin composition, the silicone resin composition preferably has a thermosetting temperature of 70 ° C to 140 ° C. When the thermosetting temperature of the silicone-based resin composition is lower than 70 ° C., curing starts in an undesirable stage in the assembly process of the electrostatic chuck device, and the workability of the assembly operation of the electrostatic chuck device is deteriorated. There is. On the other hand, when the thermosetting temperature of the silicone resin composition exceeds 140 ° C., the thermal expansion difference between the ceramic substrate 2 and the support 3 becomes large when the silicone resin composition is cured, and the ceramic substrate 2 And the stress between the support bodies 3 increases and the ceramic base material 2 may peel off.

The adhesive layer 6F preferably contains a filler made of an inorganic oxide, an inorganic nitride, or an inorganic oxynitride. Such a filler is, for example, surface-coated aluminum nitride (AlN) particles in which a coating layer made of silicon oxide (SiO ₂ ) is formed on the surface of aluminum nitride (AlN) particles. By adjusting the content of the surface-coated aluminum nitride (AlN) particles in the adhesive layer 6F, the thermal conductivity of the adhesive layer 6F can be controlled.

  The average particle diameter of the filler of the adhesive layer 6F is preferably 1 to 10 μm, more preferably 2 to 5 μm or less. When the average particle diameter of the filler of the adhesive layer 6F is smaller than 1 μm, the contact between the fillers becomes insufficient, and as a result, the thermal conductivity may be lowered, and the workability such as handling may be further lowered. There is. On the other hand, when the average particle size of the filler of the adhesive layer 6F exceeds 10 μm, the thickness of the adhesive layer 6F may vary greatly.

<Insulating member>
The insulating member 7F is a film-like or sheet-like resin having insulation and voltage resistance such as polyimide resin, silicone resin, and epoxy resin. The insulation between the heating member 5F and the support 3 is ensured by the insulating member 7F.

  The above description is merely an example, and the present invention is not limited to the above embodiment.

DESCRIPTION OF SYMBOLS 1,1F Electrostatic chuck apparatus 2,200 Ceramic base material 3 Support body 4,4A-4E Polymer material layer 5F Heating member 6F Adhesive layer 7F Insulating member 21 Electrostatic adsorption electrode 22 Feed terminal 31 Channel 32 Insulation Insulator 41, 41D, 41E First polymer material layer 42, 42D, 42E Second polymer material layer 43, 43A-43C Joint surface 44 Join region 45, 45D, 45E, 46, 46D, 46E Join line 48D, 48E Third polymer material layer 410, 410C, 420C Polymer material paste 420 Polymer material sheet

Claims (7)

A ceramic substrate having a surface direction and a thickness direction;
With respect to the ceramic substrate, the support is disposed in the thickness direction of the ceramic substrate and supports the ceramic substrate;
A polymer material layer disposed between the ceramic substrate and the support, and having a surface direction and a thickness direction;
Unlike the first polymer material layer and the first polymer material layer, the polymer material layer is at least partitioned into a second polymer material layer adjacent to the first polymer material layer in the surface direction. ,
The electrostatic chuck device, wherein the first polymer material layer and the second polymer material layer have a portion in which the first polymer material layer and the second polymer material layer overlap in a thickness direction in a joining region thereof. The polymer material layer is circular in the plane direction, and the second polymer material layer having a circular shape is disposed in the center in the plane direction;
The first polymer material layer is disposed outside the second polymer material layer with respect to the center in the surface direction of the polymer material layer,
The electrostatic chuck device according to claim 1, wherein the first polymer material layer has a Young's modulus lower than that of the second polymer material layer. The polymer material layer is circular in the plane direction, and the second polymer material layer having a circular shape is disposed in the center in the plane direction;
The first polymer material layer is disposed outside the second polymer material layer with respect to the center in the surface direction of the polymer material layer,
The electrostatic chuck device according to claim 1, wherein the first polymer material layer has a higher corrosion resistance to plasma than the second polymer material layer has a corrosion resistance to plasma.   A bonding line between the first polymer material layer and the second polymer material layer on the support side surface of the polymer material layer is formed on the ceramic substrate side surface of the polymer material layer. 4. The electrostatic chuck device according to claim 3, wherein the electrostatic chuck device is located on a center side in a surface direction of the polymer material layer as compared to a bonding line of one polymer material layer and the second polymer material layer. The polymer material layer is circular in the plane direction, and the second polymer material layer having a circular shape is disposed in the center in the plane direction;
The first polymer material layer is disposed outside the second polymer material layer with respect to the center in the surface direction of the polymer material layer,
The electrostatic chuck device according to claim 1, wherein the first polymer material layer has a thermal conductivity different from that of the second polymer material layer. The first polymer material layer includes a resin and a filler;
The second polymer material layer is the same resin as the resin of the first polymer material layer and a filler of a different type from the filler of the first polymer material layer, or the first polymer The electrostatic chuck apparatus of any one of Claims 1-5 containing the said filler of content different from content of the said filler in a material layer.   The heating member which heats the ceramic base material between the ceramic base material and the polymer material layer or between the polymer material layer and the support is included in the ceramic base material. The electrostatic chuck apparatus of any one of -6.