JP2016091261A - Non-contact communication medium and emblem - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact communication medium configured to improve durability against secular repeated bending.SOLUTION: The non-contact communication medium includes an antenna coil 3 arranged with multiple loops and an IC chip 2. Each of ends of the antenna coil 3 and each of connection sections of a pair of chip connection sections 2b, 2c are connected directly or via a jumper wire 4. An inner end 3a is directly connected to one chip connection section 2b. An outer end 3b is connected to the other chip connection section 2c via the jumper wire 4. A part of the jumper wire 4a, which is an overhang section separated from a coil formation area C-A and connected to the chip connection section, from a position separated from the coil formation area C-A to the chip connection section, has a length of 200 μm or less and a width of 120 μm or more.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an RFID tag or other non-contact communication medium, and an emblem including the non-contact communication medium.

For example, as described in Patent Document 1, the non-contact communication medium is configured such that an IC chip is installed on a sheet-like base material and the IC chip is positioned on the inner peripheral side, and the antenna coil is It arrange | positions so that it may wrap around in the shape of multiple winding loops along the surface of a material sheet.
A lead wire continuous to the inner peripheral side end of the antenna coil that circulates in the form of a multi-turn loop is bent toward the inner peripheral side from the above-mentioned peripheral direction and extends toward the IC chip, and its tip end is one chip of the IC chip. Connected to the connection.

  The outer peripheral end of the antenna coil is drawn into the inner peripheral side of the antenna coil by a jumper wire connected to the outer peripheral end, and the inner end of the jumper wire is further connected to the IC chip through another connection line. It is connected to the other chip connection part.

JP2013-114454A (FIG. 1)

When the non-contact communication medium is used by being attached to a flexible article, it is often required that the non-contact communication medium bends together with the deformation of the article to be attached.
At this time, as a result of investigations by the inventors, when the line width of the connection line to the chip connection terminal of the IC chip is thin, it has been found that the connection line portion having the narrow line width can be easily cut by being repeatedly bent. It was.

  The present invention has been made in consideration of the above points, and an object thereof is to provide a non-contact communication medium having improved durability even when it is repeatedly bent over time.

  In order to solve the problem, the non-contact communication medium according to one embodiment of the present invention is an antenna coil that is arranged in a loop shape with a loop pattern set in advance along the surface of a flexible substrate. And an IC chip, and each end of the antenna coil is connected to each connection portion of a pair of chip connection portions provided on the IC chip, either directly or via a jumper wire. When the part and the chip connecting part are directly connected, the tip extends in a direction away from the coil forming region which is the antenna coil forming region which is continuous with the end portion of the antenna coil and circulates in the shape of the multiple winding loop. A lead wire for connecting a portion to the chip connection portion, and a line portion from the position away from the coil formation region to the chip connection portion of the lead wire, When the end of the antenna coil and the chip connection portion are connected by a jumper wire, the jumper wire extends along the coil formation region in a plan view, and has a width of 200 μm or less and a width of 120 μm or more. From the position away from the coil formation region to the chip connection portion in the jumper wire portion which is the end portion connected to the chip connection portion and is separated from the coil formation region and connected to the chip connection portion. The line portion has a length of 200 μm or less and a width of 120 μm or more.

According to the knowledge of the inventors, the knowledge that the portion of the connecting line portion with a narrow line width that overlaps the circulating antenna coil and the chip is relatively difficult to cut.
According to the present invention, the protruding connection can be achieved by reducing the protruding amount of the two connecting line portions to the IC chip protruding from the coil forming region where the antenna coil is formed or by eliminating the protruding portion. Suppress cutting at the line. As a result, it is possible to provide a non-contact communication medium with improved durability even if it is repeatedly bent over time.

It is a top view which shows the inlet (non-contact communication medium) which concerns on embodiment based on this invention. It is a top view which shows another inlet which concerns on embodiment based on this invention. It is a top view which shows another inlet which concerns on embodiment based on this invention. It is a top view which shows another inlet which concerns on embodiment based on this invention. It is a top view which shows another inlet which concerns on embodiment based on this invention. It is a top view which shows another inlet which concerns on embodiment based on this invention. It is a conceptual diagram which shows a leader line. It is a figure which shows the example in the case of using a stiffening member. It is a side view which shows the example of the emblem which accommodated the inlet in the state which isolate | separated some parts. It is a figure which shows the IC chip circumference. It is a figure which shows the example of the surface of the emblem which concerns on embodiment based on this invention.

Next, embodiments of the present invention will be described with reference to the drawings.
<Configuration of non-contact communication medium>
(Inlet)
In this embodiment, an inlet used for an RFID or the like will be described as an example of a non-contact communication medium.
As shown in FIG. 1, the inlet includes a thin plate-like or sheet-like base material 1, an IC chip 2 formed on the base material 1, and an antenna coil 3.

(Substrate 1)
The substrate 1 is made of a non-conductive material and a flexible material. The base material 1 has a thickness of about 0.01 to 0.10 mm, for example, and is made of a film such as polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN). The substrate 1 is not particularly limited as long as it is flexible and non-conductive.

(Antenna coil)
The antenna coil 3 is arranged on the surface of the base material 1 so as to circulate in a plurality of loops in a loop pattern set in advance along the surface of the base material 1. FIG. 1 is a plan view schematically showing a wide gap (pitch) between the circulating antenna coils 3. In many cases, the gap between the antenna coils 3 is actually equal to or smaller than the line width of the antenna coil 3. The same applies to the other figures. The region where the above-described multi-turn loop antenna coil 3 is arranged will be referred to as a coil formation region C-A. An area surrounded by the position of the outermost antenna coil 3 and the position of the innermost antenna coil 3 of the antenna coil 3 that is arranged so as to circulate in a plurality of winding loops is a coil formation area CA. In FIG. 1, the portion of the coil formation region C-A is indicated by hatching. Further, the basin surrounded by the coil formation region C-A is referred to as an inner peripheral region SA.

In the present embodiment, as a loop pattern (circulation pattern) of the antenna coil 3, a rectangle that is one of polygonal shapes is illustrated. In this case, a rectangular inner peripheral area SA is present inside the antenna coil 3.
With the above arrangement, one end of the antenna coil 3 (also referred to as the inner peripheral end 3a) is located on the inner peripheral side of the coil formation region CA, and the other end of the antenna coil 3 (outer peripheral end 3b). Is also located on the outer peripheral side of the coil formation region C-A.
The antenna coil 3 is made of a conductive material such as copper or aluminum. Then, for example, the antenna coil 3 is disposed by etching a metal foil into a target antenna pattern or printed with conductive ink, so that the antenna coil 3 is formed on the substrate 1. The antenna coil 3 may be arranged by drawing a metal wire along the substrate 1.

(IC chip)
The IC chip 2 may be a so-called bare chip or an IC module including the IC chip. In the following description, the case where the IC chip 2 is composed of an IC module will be described. In the case of an IC module, the wiring connection to the chip connecting portion is usually performed by soldering. In the case of a bare chip, the wiring is connected to the chip connecting portion by, for example, wire bonding using a metal material, TAB, flip chip, or the like.

The IC chip 2 includes a module substrate having a pair of chip connection portions 2b and 2c connected to the end portion of the antenna coil 3, and an IC chip body 2a mounted on the module substrate. The pair of chip connection portions 2b and 2c are opposed to each other with the chip body 2a interposed therebetween.
In the present embodiment, the IC chip 2 is disposed on the inner peripheral area SA side, and the direction in which the pair of chip connection portions 2b and 2c are arranged (virtual straight line connecting the pair of chip connection portions 2b and 2c). The pair of chip connection portions 2b and 2c are arranged as close as possible to the coil formation region C-A so that one side of the rectangle forming the loop pattern is parallel to the other.

In this embodiment, “proximity” refers to setting the gap between the antenna coils to be equal to or less than 200 μm, for example.
In the example shown in FIG. 1, among the four corners of the rectangle forming the loop pattern, the IC chip 2 is arranged close to the corner located in the direction in which the tip of the inner peripheral side end 3a of the antenna coil 3 faces. In addition, the IC chip 2 is arranged so that the side located in the direction in which the tip of the inner peripheral side end 3a faces and the arrangement direction of the pair of chip connecting portions 2b and 2c are parallel to each other.

Here, in this embodiment, the antenna coil 3 is designed so that the inner peripheral side end portion 3a is positioned in the vicinity of the corner portion where the IC chip 2 is brought close.
As a result, the inner peripheral side end 3a of the antenna coil 3 is directly connected to one of the chip connecting portions 2b by soldering without passing through the lead wire 5. The connection method is not limited to soldering, and may be configured to connect by other known methods.

In addition, when using a bare chip, it can mount using anisotropic conductive paste (ACP).
In addition, the inner peripheral side end 3a of the antenna coil 3 is configured to be directly connected to one chip connecting portion 2b, but one chip connection is provided at the tip of the inner peripheral side end 3a in the coil formation region C-A. As a result of the arrangement of the part 2b, there is no lead wire portion that is bent inward from the circuit coil and extends inward.

(Connection using jumper wires)
Further, the other chip connecting portion 2 c and the outer peripheral side end portion 3 b of the antenna coil 3 are connected by a jumper wire 4. The jumper wire 4 is a back side wiring (wiring on the back side of the substrate 1).
The jumper wire 4 has one end connected to the outer peripheral side end 3b of the antenna coil 3 and extends (crosses) along the coil formation region C-A in plan view toward the other chip connection 2c. In other words, the other end portion is connected to the other chip connection portion 2c across the coil formation region C-A.

At this time, since the other chip connection portion 2c is arranged as close as possible to the coil formation region CA, the jumper wire 4 from the coil formation region CA to the inner peripheral region SA. The length of the jumper wire portion 4a which is the overhanging portion is shortened.
In the present embodiment, among the jumper wire portion 4a, the wire portion from the position away from the coil formation region CA to the chip connection portion 2c is designed so that the length L1 is 200 μm or less. Moreover, it is made difficult to cut | disconnect by setting the line | wire width of at least said jumper line part 4a among the jumper lines 4 to 120 micrometers or more. Here, the above-described line portion is a portion that does not overlap the antenna coil 3 or the IC chip 2.

Here, the wider the line width, the harder it is to break, but the shorter the line portion length L1 is 200 μm or less, the more difficult it is to break if the line width is 120 μm or more.
If it is this range, the probability of disconnection can be remarkably lowered when 100 washing tests are carried out by the water washing test (JIS L 0217).
In the example of FIG. 1, the outer peripheral side end 3b is arranged close to the other chip connecting portion 2c, and therefore the jumper wire 4 extends so as to be orthogonal to the loop of the antenna coil 3 in plan view.

  At this time, depending on the frequency band required for the antenna (characteristic required for the antenna), the outer peripheral side end 3b may not be disposed at the position as shown in FIG. Thus, it may be necessary to shift the position of the outer peripheral side end 3b and the position of the other chip connecting portion 2c. Even in this case, as shown in FIG. 2, the jumper wire 4 has one end connected to the outer peripheral side end 3b of the antenna coil 3 and is coiled in plan view toward the other chip connection 2c. It suffices to extend along the region C-A, that is, to extend so as to intersect the coil formation region C-A, and to connect the other end to the other chip connection portion 2c. Even in this case, in the jumper wire portion 4a, the wire portion from the position away from the coil formation region CA to the chip connection portion is designed so that the length L1 is 200 μm or less.

Thus, the electrical characteristics of the antenna can be adjusted by adjusting the connection position between the jumper wire 4 and the antenna coil 3.
Here, the jumper wire 4 need not be wired in a straight line. As shown in FIG. 3, after extending so as to enter the coil formation region C-A, it extends along the coil formation region C-A to the vicinity of the other chip connection portion 2c, and then changes direction to the other chip. The jumper wire portion 4a of the overhang portion may be made shorter so as to extend toward the connection portion 2c. In FIG. 3, the jumper wire portion 4 a extends obliquely, but may be set so as to extend in a direction orthogonal to the antenna coil 3. Note that the jumper wire portion 4a arranged in the coil forming region C-A may be arranged in a curved shape, and the jumper wire 4 may be wired so that there is no bent portion with a steep angle.

Thus, by setting the jumper wire 4 so as to overlap with the antenna coil 3 as much as possible, the risk of disconnection in the jumper wire portion 4a can be further reduced while adjusting the electrical characteristics of the antenna.
Further, in the arrangement shown in FIG. 1, the arrangement configuration is such that the extending directions of the pair of chip connecting portions 2b and 2c and the inner peripheral side end portion 3a are orthogonal to each other. As shown in FIG. 4, the arrangement direction of the pair of chip connection portions 2b and 2c and the extending direction of the inner peripheral side end portion 3a may be arranged in the same direction.

Even in this case, the opposing direction (alignment direction) of the pair of chip connection portions 2b and 2c is as much as possible in a state in which the IC chip 2 is directed in the direction along the circumferential direction of the antenna coil 3 portion. Close to the antenna coil 3 portion. Or you may arrange | position so that a part of IC chip 2 may overlap with the antenna coil 3. FIG.
In this case, the jumper wire 4 may be set according to the position of the IC chip 2 with respect to the rotating direction of the adjacent antenna coil 3. Specifically, the other chip connection portion 2c extends to the antenna coil 3 side that is closest to the other side, and then extends to the antenna coil 3 side, and then reaches a position that is close to the outer peripheral side end portion 3b. It extends to the vicinity of the outer peripheral side end 3b along the antenna coil 3 that is wound around the winding, and the other end of the jumper wire 4 is connected to the outer peripheral side end 3b.

  Further, the IC chip 2 may not be arranged close to the corner of the inner peripheral area SA. Since the pair of chip connection portions 2b and 2c may be arranged as close as possible to the coil formation region C-A, the inner peripheral side end of the four sides of the rectangle forming the loop pattern as shown in FIG. The IC chip 2 may be arranged so that the side where the part 3a is located is as close as possible and the side and the direction in which the pair of chip connection parts 2b and 2c are arranged in parallel.

  Further, if the pair of chip connection portions 2b and 2c are both arranged as close as possible to the coil forming region C-A, the arrangement direction of the pair of chip connection portions 2b and 2c needs to be parallel to the loop of the antenna coil 3. There is no. For example, the IC chip 2 may be brought close to one corner of the inner peripheral area SA, and the two chip connection portions 2b and 2c may be arranged so as to be close to two sides sandwiching the corner. . In this case, the IC chip 2 is disposed at an angle of 45 degrees with respect to the rectangular side.

  In the above description, the loop pattern is exemplified as a pattern having a straight line portion, but there is no particular problem as long as the pair of chip connection portions 2b and 2c can be arranged as close as possible to the coil formation region C-A. An example is shown in FIG. The example of FIG. 6 is a case where the loop pattern of the antenna coil 3 is circular, a pair of chip connection portions 2b and 2c are arranged along the loop pattern, and the IC chip 2 is as close as possible to the coil formation region C-A. This is an example. That is, in this embodiment, the loop pattern is not particularly limited.

Here, in the above example, as shown in FIG. 7A, for example, one chip connection portion 2b and the inner peripheral side end portion 3a are connected to one chip connection portion inward from the circumferential direction of the antenna coil 3. The case where the length of the antenna connection part extended toward 2b is set to zero is illustrated.
On the other hand, as shown in FIG. 7B, one chip connecting portion 2b and the inner peripheral side end 3a are connected via a lead wire 5 extending to the IC chip 2 side continuously to the inner peripheral side end 3a. And may be connected. In this case, the coil forming region of the lead wire 5 that is an end portion that is connected to the chip connecting portion 2b and is an overhanging portion that is separated from the coil forming region C-A and is connected to the chip connecting portion 2b. The line portion from the position away from C-A to the chip connection portion 2b is designed so that the length L2 is 200 μm or less and the width is 120 μm or more.

Here, the wider the line width, the harder it is to break, but the shorter the line portion length L2 is 200 μm or less, the more difficult it is to break if the line width is 120 μm or more.
If it is this range, the probability of disconnection can be remarkably lowered when 100 washing tests are carried out by the water washing test (JIS L 0217).
As described above, the protruding amount of the two connecting line portions to the IC chip 2 protruding from the coil forming region C-A where the antenna coil 3 is formed is reduced or no protruding portion is provided. Suppress the disconnection at the connecting line. As a result, it is possible to provide a non-contact communication medium with improved durability even if it is repeatedly bent over time.

That is, in this embodiment, even if it is the structure where a non-contact communication medium bends, the durability can be made and the non-contact communication medium suitable for attaching to the article which bends can be provided.
Further, as shown in FIG. 8, the IC chip 2 may be sealed by covering the IC chip 2 with a potting member 6 made of a resin such as silicon resin or epoxy resin. The potting member 6 constitutes a stiffening member. At this time, the antenna coil 3 portion adjacent to each chip connection portion is also sealed. As a result, the rigidity of the lead wire 5 and the jumper wire portion 4a connected to the chip connecting portions 2b and 2c is improved by the potting member 6. As a result, the durability is further improved even when the potting member 6 is repeatedly bent over time. It is possible to provide a contactless communication medium.

  Here, in the above description, the case where the inner peripheral side end portion 3a and the outer peripheral side end portion 3b of the antenna coil 3 are connected to the pair of chip connecting portions 2b and 2c of the IC chip 2, respectively, is exemplified, but the present invention is not limited thereto. . For example, the antenna line portion located at the innermost periphery of the antenna coil 3 is divided in the middle to form a pair of connection portions on the antenna coil 3 side, and the inner peripheral side end 3a and the outer peripheral side end of the antenna coil 3 are formed. 3b may be connected by a jumper wire. In this case, both end portions of the antenna coil connected to the IC chip 2 are located on the inner peripheral side, and the chip connecting portions 2b and 2c of the IC chip 2 are directly connected to the respective end portions of the antenna coil 3. What should I do? In this case, the IC chip 2 partially overlaps with the coil formation region C-A. In addition, you may connect each edge part of the antenna coil 3, and each chip | tip connection part 2b, 2c via the lead wire below the length of the above-mentioned range.

<emblem>
Next, an emblem will be described as an example of an article to which the above inlet (non-contact communication medium) is attached. In addition, although the inlet of this embodiment can be attached and used even if it is articles | goods other than an emblem, the inlet of this embodiment is a non-contact communication medium suitable for articles | goods to which bending stress is repeatedly applied.

(Constitution)
The configuration of the inlet is the configuration described above. As shown in FIGS. 9 and 10, the IC chip 2 is sealed with the potting member 6 and is connected to the IC chip 2 and the chip connecting portions 2b and 2c. The part is stiffened and watertight.
Films 7 having barrier properties are laminated on both sides of the inlet. However, the film 7 is not laminated at the position of the potting member 6. However, the metal portion such as the antenna coil 3 is protected by being oxidized when it comes into contact with moisture to form an oxide film. Reference numeral 8 represents an adhesive.

The film 7 having a barrier property is made of, for example, polyimide resin, polyethylene terephthalate resin, polyethylene naphthalate resin, epoxy resin, silicon resin, or the like.
The inlet configured as described above is accommodated between the front cloth 10 and the back cloth 11 forming the emblem. Reference numeral 12 denotes an adhesive for bonding the front cloth 10 and the back cloth 11 with the inlet interposed therebetween.

At this time, in this embodiment, as shown in FIG. 9, the thin plate-like reinforcing material 9 is arranged on the side (back side) opposite to the surface on which the IC chip 2 is formed, of the surface of the substrate 1. And the inlet is reinforced. Reinforcement can cope with stronger bending.
If the reinforcing material is too thick, the end of the reinforcing material will be visible as a streak, detracting from aesthetics. Therefore, the thickness of the reinforcing material is preferably 100 μm or less. In particular, it is preferably about 50 to 100 μm, more preferably about 75 to 100 μm.

Polyethylene terephthalate or the like can be used as the reinforcing material.
The front cloth 10 and the back cloth 11 constituting the emblem are made of artificial leather such as polyester fiber, polyurethane resin, and acrylic fiber.
Further, as shown in FIG. 9 and FIG. 11, a convex portion 13 is formed of a silicon resin on the surface of the front cloth 10 and a target design is applied. In FIG. 11, reference numeral 14 denotes a stamped portion, and a symbol corresponding to information stored in the inlet is attached.

Such an emblem is attached to a uniform.
When the uniform is washed as appropriate, bending is applied to the emblem and further to the inlet of the emblem.
At this time, the bending of the inlet is suppressed by inserting the reinforcing material 9 as a backing.
In addition, when the inventors conducted a washing test on a uniform with an emblem containing the inlet as described above, among the antenna wires, the jumper wire portion 4a and the lead wire in which the antenna wire is routed independently The knowledge that it was easy to cut | disconnect when the line width of 5 part was thin was acquired. It was also confirmed that even if the line width was the same, the portion overlapping the antenna coil 3 was difficult to cut.

On the other hand, the inlet of the present embodiment has little or no lead-out portion, and the jumper wire 4 has only a few portions extending from the coil formation region C-A to the IC chip 2 side. Even if it is washed repeatedly like this, it becomes difficult to disconnect the antenna wire.
Moreover, when the convex part 13 which comprises a design is formed in the surface of an emblem, when the boundary of the part which formed the convex part 13 and the part (cloth | gear part) which does not have the convex part 13 becomes linear, the linear boundary Makes it easier to turn. Therefore, it is preferable to arrange the inlet so that the IC chip 2, particularly the vicinity of the chip connecting portion, is not located at or near the position of such a linear boundary.
Here, the convex portion 13 is often made of a rubber resin such as silicon resin or soft PVC.

DESCRIPTION OF SYMBOLS 1 Base material 2 IC chip 2a Chip body 2b, 2c Chip connection part 3 Antenna coil 3a Inner peripheral side edge part 3b Outer peripheral side edge part 4 Jumper wire 4a Jumper wire part 5 Lead wire 6 Potting member 7 Film 9 Reinforcement material 10 Top cloth 11 Back cloth 13 Convex part

Claims (8)

Comprising an antenna coil and an IC chip arranged around a plurality of winding loops in a loop pattern set in advance along the surface of a flexible substrate;
Each end of the antenna coil and each connection portion of a pair of chip connection portions provided on the IC chip are connected directly or via a jumper wire,
When the end portion of the antenna coil and the chip connection portion are directly connected, the antenna coil is separated from the coil formation region that is the formation region of the antenna coil that is continuous with the end portion of the antenna coil and circulates in the shape of the multiple winding loop. A lead wire extending in the direction to connect the tip portion to the chip connection portion, and a portion of the lead wire from the position away from the coil forming region to the chip connection portion has a length of 200 μm or less and a width of 120 μm And above
When connecting the end of the antenna coil and the chip connecting portion with a jumper wire, the jumper wire extends along the coil forming region in plan view and is connected to the chip connecting portion. Of the jumper wire portion, which is an overhanging portion that is connected to the chip connection portion apart from the coil formation region, and the line portion from the position away from the coil formation region to the chip connection portion has a length of 200 μm or less and A non-contact communication medium having a width of 120 μm or more.   When the end portion of the antenna coil and the chip connecting portion are directly connected, the end portion of the antenna coil extending in the circumferential direction is connected to the chip connecting portion without passing through the lead wire. Item 2. A non-contact communication medium according to item 1.   The IC chip is disposed on the inner peripheral region side surrounded by the coil formation region, and both of the pair of chip connection portions are disposed so as to be close to or partially overlap the coil formation region. The non-contact communication medium according to claim 1 or 2, characterized by the above.   The loop pattern has a polygonal shape, and the IC chip is arranged so that one side forming the polygonal shape is parallel to an arrangement direction of the pair of chip connection portions. The non-contact communication medium according to any one of claims 1 to 3.   A stiffening member that seals at least the chip connection portion and increases the rigidity of the connection portion position is provided. The stiffening member also seals the antenna coil portion adjacent to the chip connection portion together with the connection portion position. The non-contact communication medium according to claim 1, wherein the non-contact communication medium is stopped.   The contactless communication according to any one of claims 1 to 5, further comprising a film that covers a surface of the substrate on which the IC chip and the antenna coil are formed and has a barrier property against water. Medium.   The emblem characterized by containing the non-contact communication medium according to any one of claims 1 to 6 between a front cloth and a back cloth forming the emblem.   The emblem according to claim 7, wherein a reinforcing material is placed as a backing on the surface of the substrate opposite to the surface on which the IC chip is provided.

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