JP2016086395A - High frequency electronic component - Google Patents

High frequency electronic component Download PDF

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JP2016086395A
JP2016086395A JP2014220219A JP2014220219A JP2016086395A JP 2016086395 A JP2016086395 A JP 2016086395A JP 2014220219 A JP2014220219 A JP 2014220219A JP 2014220219 A JP2014220219 A JP 2014220219A JP 2016086395 A JP2016086395 A JP 2016086395A
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frequency electronic
conductive
electronic component
housing
conductive cylindrical
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JP6488642B2 (en
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原田 信洋
Nobuhiro Harada
信洋 原田
謙介 田中
Kensuke Tanaka
謙介 田中
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Ube Corp
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Ube Industries Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a high frequency electronic component which is compact, small in the number of components and inexpensive.SOLUTION: A high frequency electronic component includes: a conductive cylindrical pipe 103 having a hollow part; a conductive columnar housing 101 inserted into the hollow part of the cylindrical pipe; a pedestal part formed in the conductive columnar housing by cutting the central part thereof as viewed from a side surface of the conductive columnar housing; a high frequency electronic circuit element group 203 mounted on the pedestal part; and a conductive plate 105 sandwiched in at least a part of a gap between the conductive cylindrical pipe and the conductive columnar housing so as to cover a part including at least a part of the rear side surface of the pedestal part in a circumferential surface of the conductive columnar housing.SELECTED DRAWING: Figure 2

Description

本発明は、円筒状の筐体内に部品が格納される高周波電子部品に関する。   The present invention relates to a high-frequency electronic component in which the component is stored in a cylindrical casing.

携帯電話機などの移動体通信機器では、同軸コネクタを具備する金属製の筐体内に各種部品を格納し、入出力部をケーブル等で接続するような高周波電子部品がしばしば用いられる。   In mobile communication devices such as mobile phones, high-frequency electronic components are often used in which various components are housed in a metal casing having a coaxial connector and the input / output unit is connected by a cable or the like.

このような高周波電子部品を筐体内に格納する場合、外部に電波が漏洩しないように電気的な遮蔽を良好にする必要がある。   When such a high-frequency electronic component is stored in the housing, it is necessary to provide good electrical shielding so that radio waves do not leak outside.

特許文献1では、金属製の枠に上下の金属板を具備し、夫々の金属板をねじで枠に固定する方法が開示されている。また、特許文献2では、金属筐体と上部金属板との隙間を埋めるために、金属筐体と上部金属板とにより、導電性シムを挟む方法が開示されている。   Patent Document 1 discloses a method in which a metal frame is provided with upper and lower metal plates, and each metal plate is fixed to the frame with screws. Patent Document 2 discloses a method of sandwiching a conductive shim between a metal casing and an upper metal plate in order to fill a gap between the metal casing and the upper metal plate.

特開平11−17406号公報Japanese Patent Laid-Open No. 11-17406 特開昭62−294302号公報JP 62-294302 A

近年、移動体通信機器は小型化、高性能化が求められており、同時に低コスト化も求められている。使用部品にも小型化や最適な設計による高性能化が求められ、さらには部品点数削減などによる低コスト化が求められている。しかしながら、特許文献1の場合、ねじでの固定が少ないと金属板と枠との間に隙間が生じ、電波の漏洩で特性が低下する恐れがある。また、ねじ止めを行うことで部品点数が増加し、部材費の増加でコストが高くなる課題もあった。   In recent years, mobile communication devices are required to be smaller and have higher performance, and at the same time, cost reduction is also required. The parts used are also required to have high performance through downsizing and optimal design, and further cost reduction is required by reducing the number of parts. However, in the case of Patent Document 1, if the fixing with the screw is small, a gap is generated between the metal plate and the frame, and there is a possibility that the characteristics are deteriorated due to leakage of radio waves. In addition, there is a problem that the number of parts is increased by screwing and the cost is increased due to an increase in member cost.

特許文献2では金属筐体と上部金属板との隙間を埋めるために、金属筐と上部金属板とにより、導電性シムを挟む方法が開示されているが、シムの厚み精度を厳しく管理する必要があり、また、組み立て方法も複雑でコストがかかる恐れがある。   Patent Document 2 discloses a method in which a conductive shim is sandwiched between a metal casing and an upper metal plate in order to fill a gap between the metal casing and the upper metal plate. However, it is necessary to strictly control the thickness accuracy of the shim. In addition, the assembly method may be complicated and expensive.

そこで、本発明は、小型で、かつ部品点数が少なく、安価な高周波電子部品を提供することを目的とする。   Accordingly, an object of the present invention is to provide an inexpensive high-frequency electronic component that is small in size and has a small number of components.

本発明によれば、以上の如き目的を達成するものとして、
中空部を有する導電性円筒型パイプと、前記円筒型パイプの前記中空部に挿入された導電性円柱型ハウジングと、前記導電性円柱型ハウジングを側面からみて中央部を切り欠くことにより前記導電性円柱型ハウジングに形成された台座部と、前記台座部に載置された高周波電子回路素子群と、前記導電性円柱型ハウジングの円周面のうちの前記台座部の裏面の少なくとも一部を含む部分を覆うように前記導電性円筒型パイプと前記導電性円柱型ハウジングとの隙間のうちの少なくとも一部に挟まれた導電性板と、を備えることを特徴とする高周波電子部品が提供される。
According to the present invention, the object as described above is achieved.
A conductive cylindrical pipe having a hollow portion, a conductive cylindrical housing inserted into the hollow portion of the cylindrical pipe, and the conductive portion by notching a central portion when the conductive cylindrical housing is viewed from the side. A pedestal portion formed in the cylindrical housing; a high-frequency electronic circuit element group placed on the pedestal portion; and at least a part of a back surface of the pedestal portion of a circumferential surface of the conductive cylindrical housing. A high-frequency electronic component comprising: a conductive plate sandwiched between at least a part of a gap between the conductive cylindrical pipe and the conductive cylindrical housing so as to cover a portion is provided. .

本発明によれば、小型で、かつ部品点数が少なく、安価な高周波電子部品が提供される。   The present invention provides an inexpensive high-frequency electronic component that is small in size and has a small number of components.

本発明の実施形態による高周波電子部品の模式的斜視図である。1 is a schematic perspective view of a high-frequency electronic component according to an embodiment of the present invention. 本発明の実施形態による高周波電子部品の分解斜視図である。It is a disassembled perspective view of the high frequency electronic component by embodiment of this invention. 本発明の実施形態による高周波電子部品の端面図である。1 is an end view of a high-frequency electronic component according to an embodiment of the present invention. 本発明の実施形態による高周波電子部品の減衰率の周波数特性を示すグラフである。It is a graph which shows the frequency characteristic of the attenuation factor of the high frequency electronic component by embodiment of this invention. 本発明の実施形態による高周波電子部品に含まれる高周波電子回路素子群により構成される回路に対応する等価回路である。It is an equivalent circuit corresponding to the circuit comprised by the high frequency electronic circuit element group contained in the high frequency electronic component by embodiment of this invention. 本発明の実施形態による高周波電子部品のVI−VI’に沿った側面断面図である。It is side surface sectional drawing along VI-VI 'of the high frequency electronic component by embodiment of this invention.

以下、図面を参照して本発明を実施するための形態について詳細に説明する。   DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings.

[第1の実施形態]
図1は、本発明による高周波電子部品の第1の実施形態を示す模式的斜視図である。図2は、高周波電子部品の分解斜視図である。図3は、高周波電子部品の端面図である。
[First Embodiment]
FIG. 1 is a schematic perspective view showing a first embodiment of a high-frequency electronic component according to the present invention. FIG. 2 is an exploded perspective view of the high-frequency electronic component. FIG. 3 is an end view of the high-frequency electronic component.

金属製のハウジング101は、たとえば直径8mm、長さ22mmの円柱形状である。ハウジング101の中央部にたとえば長さ13mmにわたり、上面側から深さ5mmまでの範囲のほぼ半円柱状のブロック(板蒲鉾状の切り欠きブロック)を切り欠くことにより、ハウジング101の軸方向に沿って中央付近にある台座部201がハウジング101の一部として設けられている。ハウジング101は、たとえば真鍮に金メッキを施したものが用いられる。   The metal housing 101 has a cylindrical shape having a diameter of 8 mm and a length of 22 mm, for example. A substantially semi-cylindrical block (plate notch block) having a length of, for example, 13 mm extending from the upper surface side to a depth of 5 mm in the center of the housing 101 is cut out along the axial direction of the housing 101. A pedestal portion 201 near the center is provided as a part of the housing 101. The housing 101 is made of, for example, brass plated with gold.

図2において、台座部表面201aには、高周波電子回路素子群203が載置されている。高周波電子回路素子群203は、たとえば誘電体基板とパターン電極と接地導体を含む回路基板において構成されるコンデンサと、銅系の加工された線材により構成されるインダクタとを含み、これらを接続することによりローパスフィルタの機能を得ている。高周波電子回路素子群203の入力部及び出力部にそれぞれ電気的及び機械的に接続された2つの接続端子205(図2では遠方側のみを示す。)は、ハウジング101の両端部に取り付けられた同軸型のコネクタ207の芯線側に電気的及び電気的に接続されており、この同軸型コネクタ207を介して外部回路と電気的に接続されている。この同軸コネクタ207は、ハウジング101と一体化されていても良い。なお、高周波電子回路素子群203に関連したことは詳細に後述する。   In FIG. 2, a high-frequency electronic circuit element group 203 is placed on the pedestal surface 201a. The high-frequency electronic circuit element group 203 includes, for example, a capacitor formed on a circuit board including a dielectric substrate, a pattern electrode, and a ground conductor, and an inductor formed of a copper-based processed wire, and connects them. Thus, the function of a low-pass filter is obtained. Two connection terminals 205 (only the far side is shown in FIG. 2) electrically and mechanically connected to the input part and the output part of the high-frequency electronic circuit element group 203 are attached to both ends of the housing 101. The coaxial connector 207 is electrically and electrically connected to the core wire side, and is electrically connected to an external circuit via the coaxial connector 207. The coaxial connector 207 may be integrated with the housing 101. The details related to the high-frequency electronic circuit element group 203 will be described later.

ハウジング101は、導電性パイプ103に挿入されている。また、ハウジング101と導電性パイプ103との間には、導電性板105が挟み込まれている。導電性パイプ103は、たとえば真鍮にニッケルメッキを施したものが用いられる。導電性板105の素材としては、たとえば18mm×9.5mm、厚み0.05mmのりん青銅板が用いられる。また、導電性板105の素材は、ばね性があることが好ましい。導電性板105をハウジング101と導電性パイプ103との間に挟むことにより、内蔵された高周波電子回路素子群203と高周波電子部品100の外部との間の電磁気的な遮蔽が向上し、また、高周波電子回路素子群203により構成される高周波回路の良好な特性が得られる。   The housing 101 is inserted into the conductive pipe 103. A conductive plate 105 is sandwiched between the housing 101 and the conductive pipe 103. As the conductive pipe 103, for example, brass plated with nickel is used. As a material of the conductive plate 105, for example, a phosphor bronze plate having a size of 18 mm × 9.5 mm and a thickness of 0.05 mm is used. The material of the conductive plate 105 is preferably springy. By sandwiching the conductive plate 105 between the housing 101 and the conductive pipe 103, electromagnetic shielding between the built-in high-frequency electronic circuit element group 203 and the outside of the high-frequency electronic component 100 is improved, Good characteristics of a high-frequency circuit constituted by the high-frequency electronic circuit element group 203 can be obtained.

ここで、上述したように、導電性板105は、ハウジング101と導電性パイプ103との間に挟まれるものであるが、これにより、導電性板105は、ハウジング101の円周面の一部を覆うことになる。覆う領域が、円周面に含まれる台座部裏面201bのうちの少なくとも一部を含んでいることが好ましく、更に、台座部裏面201bの全体を含んでいることが好ましい。また、覆う領域が、台座部裏面201bの全体のみならず、その周辺部を含んでいることが好ましい。   Here, as described above, the conductive plate 105 is sandwiched between the housing 101 and the conductive pipe 103, so that the conductive plate 105 is part of the circumferential surface of the housing 101. Will be covered. The covered region preferably includes at least a part of the pedestal part back surface 201b included in the circumferential surface, and further preferably includes the entire pedestal part back surface 201b. Moreover, it is preferable that the area | region to cover includes not only the whole base part back surface 201b but the peripheral part.

また、端面側から見た断面が部分円弧状の導電性板105は、例えば、図2に示すような平板状の導電性板105Aを部分円筒を形成するように丸めることにより得ることができるものであるが、導電性板105の内側面の曲率が、ハウジング101の円周面の曲率とは、同一であってもよいが、異なるようにすることにより、導電性板105のばね性が有効となり、導電性板105と台座裏面201bとの電気的接触を高めることができ、これにより、高周波回路の特性を向上させることができる。また、導電性板105の端面側から見た部分円弧状の断面形状に波形が重なるように導電性板105に凹凸を付けてもよい。この波形は、導電性板105の上面から見て一次元的なものであってもよいし、二次元的なものであってもよい。   Further, the conductive plate 105 having a partially arc-shaped cross section viewed from the end face side can be obtained by, for example, rolling a flat conductive plate 105A as shown in FIG. 2 so as to form a partial cylinder. However, the curvature of the inner surface of the conductive plate 105 may be the same as the curvature of the circumferential surface of the housing 101, but by making it different, the spring property of the conductive plate 105 is effective. Thus, the electrical contact between the conductive plate 105 and the pedestal back surface 201b can be enhanced, whereby the characteristics of the high-frequency circuit can be improved. Further, the conductive plate 105 may be uneven so that the waveform overlaps the partial arc-shaped cross-sectional shape viewed from the end face side of the conductive plate 105. This waveform may be one-dimensional when viewed from the upper surface of the conductive plate 105 or may be two-dimensional.

図1、図3に示すように、導電性パイプ103の円周面の両端部付近が、それぞれの適当な4つの箇所でカシメられている。これにより、導電性パイプ103がハウジング101から抜け落ちることを防止することができ、また、安定した特性を得ることが出来る。また、カシメる位置は、導電性板105を共にカシメるような位置であっても、そうでない位置であってもよい。   As shown in FIGS. 1 and 3, the vicinity of both end portions of the circumferential surface of the conductive pipe 103 is caulked at appropriate four locations. Thereby, it is possible to prevent the conductive pipe 103 from falling out of the housing 101 and to obtain stable characteristics. Further, the caulking position may be a position where the conductive plate 105 is caulked together, or may be a position where it is not.

図4は、本実施形態の高周波電子部品に含まれる高周波電子回路素子群などにより構成される高周波回路の減衰率の周波数特性を実線により示す。また、図4は、比較のため導電性板105を挟んでいない場合の高周波回路の減衰率の周波数特性を破線により示す。図4より、導電性板105を挟むことで3GHzから6GHzの領域で減衰特性が向上しているのがわかる。減衰率は、例えば、4GHzにおいては、導電性板105を挟んでいなければ約55dBであるのに対して、導電性板105を挟んでいれば約70dBであり、約15dB改善される。また、減衰率は、例えば、5GHzにおいては、導電性板105を挟んでいなければ45dBであるのに対して、導電性板105を挟んでいれば約70dBであり、約25dB改善される。また、図示していないが、位相の周波数特性も、例えば、設計した特性に近くなるなどの改善がされる。   FIG. 4 shows, with a solid line, the frequency characteristics of the attenuation rate of a high-frequency circuit configured by a high-frequency electronic circuit element group included in the high-frequency electronic component of this embodiment. In addition, FIG. 4 shows the frequency characteristics of the attenuation rate of the high-frequency circuit when the conductive plate 105 is not sandwiched for comparison, by a broken line. FIG. 4 shows that the attenuation characteristics are improved in the region of 3 GHz to 6 GHz by sandwiching the conductive plate 105. For example, at 4 GHz, the attenuation factor is about 55 dB if the conductive plate 105 is not sandwiched, whereas it is about 70 dB if the conductive plate 105 is sandwiched, which is improved by about 15 dB. Further, for example, at 5 GHz, when the conductive plate 105 is not sandwiched, the attenuation factor is 45 dB. When the conductive plate 105 is sandwiched, the attenuation factor is approximately 70 dB, which is improved by about 25 dB. Although not shown, the frequency characteristics of the phase are improved, for example, close to the designed characteristics.

本実施形態によれば、導電性円柱型ハウジング101を導電性円筒型パイプ103に挿入し、これらの間に導電性板105を挟むことで、高周波回路と外部との間の電磁気的な遮蔽が良好な筐体を構成でき、更に、特性の良好な高周波電子部品が提供される。また、導電性板105の形状は、簡単な矩形で良く、複雑な加工を必要としないので、安価な高周波電子部品が提供される。   According to this embodiment, the conductive cylindrical housing 101 is inserted into the conductive cylindrical pipe 103, and the conductive plate 105 is sandwiched between them, thereby preventing electromagnetic shielding between the high frequency circuit and the outside. A high-frequency electronic component that can form a good housing and has good characteristics is provided. Further, the shape of the conductive plate 105 may be a simple rectangle and does not require complicated processing, so that an inexpensive high-frequency electronic component is provided.

図5は、本実施形態の高周波電子部品に含まれる高周波電子回路素子群などにより構成される高周波回路に対応する等価回路である。図6は、図5の等価回路に含まれる高周波電子部品の内部構造を示す側面断面図である。本実施形態では、3つのコンデンサC1〜C3と2つのコイルL1、L2とを有する5段のローパスフィルタが構成されている。   FIG. 5 is an equivalent circuit corresponding to a high-frequency circuit configured by a high-frequency electronic circuit element group included in the high-frequency electronic component of the present embodiment. FIG. 6 is a side sectional view showing the internal structure of the high-frequency electronic component included in the equivalent circuit of FIG. In the present embodiment, a five-stage low-pass filter having three capacitors C1 to C3 and two coils L1 and L2 is configured.

誘電体基板301の第1の面(上面側)には、一列の島状に3つのパターン電極303−1、303−2、303−3が形成される。誘電体基板301の第2の面(下面側)全体には接地導体(電極)305が形成され、これは、誘電体基板301を挟んで、3つのパターン電極303−1、303−2、303−3と対向する。このようにして誘電体基板301に3つのパターン電極303−1、303−2、303−3と接地導体305を形成することにより、3つのコンデンサC1〜C3が構成される。   On the first surface (upper surface side) of the dielectric substrate 301, three pattern electrodes 303-1, 303-2, and 303-3 are formed in a row of island shapes. A ground conductor (electrode) 305 is formed on the entire second surface (lower surface side) of the dielectric substrate 301, and this includes three pattern electrodes 303-1, 303-2, 303 across the dielectric substrate 301. -3. In this way, by forming the three pattern electrodes 303-1, 303-2, 303-3 and the ground conductor 305 on the dielectric substrate 301, three capacitors C1 to C3 are configured.

誘電体基板301は、長さL、幅W及び厚さTの基本形状を持つ。誘電体基板301の長さLはたとえば約12mmであり、幅Wはたとえば約5mmであり、厚さTはたとえば約0.6mmである。誘電体基板301の材質としては、たとえばTi/Ca/Mg系セラミックであって比誘電率εが20程度の誘電体セラミックスを使用することができる。 The dielectric substrate 301 has a basic shape having a length L, a width W, and a thickness T. The length L of the dielectric substrate 301 is, for example, about 12 mm, the width W is, for example, about 5 mm, and the thickness T is, for example, about 0.6 mm. The material of the dielectric substrate 301, for example, Ti / Ca / Mg system a ceramic dielectric constant epsilon r can be used 20 degree of dielectric ceramics.

パターン電極303−1、303−2、303−3及び接地導体305としては、たとえば銀電極が用いられる。コンデンサC1〜C3の容量値はローパスフィルタの減衰率の周波数特性によって決められ、パターン電極303−1、303−2、303−3の面積を変えることで容量値を変えることができる。コンデンサC1〜C3の容量値は全て同じとすることもできるが、それぞれ異なるように設定することもできる。パターン電極303−1、303−2、303−3の間隔は等間隔であってもよいが、等間隔でなくともよく、これらの間隔は、パターン電極間の線状導体の長さを変えるために適宜設定することができる。接地導体305は、たとえば半田によってハウジング101と接合されるが、導電性接着剤等を用いてハウジング101と接合されるようにしても良い。また、ハウジング101は、コネクタ207−1、207−2の接地側に接続される。   As the pattern electrodes 303-1, 303-2, 303-3 and the ground conductor 305, for example, silver electrodes are used. The capacitance values of the capacitors C1 to C3 are determined by the frequency characteristics of the attenuation rate of the low-pass filter, and the capacitance values can be changed by changing the areas of the pattern electrodes 303-1, 303-2, and 303-3. The capacitance values of the capacitors C1 to C3 can all be the same, but can also be set differently. The intervals between the pattern electrodes 303-1, 303-2, and 303-3 may be equal intervals, but may not be equal intervals, and these intervals change the length of the linear conductor between the pattern electrodes. Can be set as appropriate. The ground conductor 305 is joined to the housing 101 by, for example, solder, but may be joined to the housing 101 using a conductive adhesive or the like. The housing 101 is connected to the ground side of the connectors 207-1 and 207-2.

2つのコイルL1、L2は、1本の線状導体で形成されている。線状導体としては導線を用いることができ、たとえば直径0.5mmの丸棒線材で、材質としては、たとえば銅系材料が用いられる。線状導体は、同一面でメアンダ(蛇行)状に折り曲げられている。ここで線状導体は1本で2つのコイルを構成しているが、2個の線状導体に分けても良い。   The two coils L1 and L2 are formed of one linear conductor. As the linear conductor, a conductive wire can be used, for example, a round bar wire having a diameter of 0.5 mm, and the material is, for example, a copper-based material. The linear conductor is bent in a meander (meander) shape on the same surface. Here, one linear conductor constitutes two coils, but may be divided into two linear conductors.

線状導体の両端部は、両端のパターン電極303−1、303−3に接続されており、中央部分は、中央のパターン電極303−2に接続されている。コイルL1、L2を構成する線状銅体とパターン電極303−1、303−2、303−3とは、たとえば半田によって接合されるが、導電性接着剤等を用いても良い。   Both ends of the linear conductor are connected to the pattern electrodes 303-1 and 303-3 at both ends, and the central portion is connected to the center pattern electrode 303-2. The linear copper bodies constituting the coils L1, L2 and the pattern electrodes 303-1, 303-2, 303-3 are joined by, for example, solder, but a conductive adhesive or the like may be used.

両端のパターン電極303−1、303−3には、それぞれ、接続端子205−1、205−2が接続されている。この接続は、たとえば半田によるものであってもよいが、導電性接着剤等を用いたものであってもよい。接続端子205−1、205−2は、それぞれ外部回路に接続され、信号の受け渡しを行う。接続端子205−1、205−2は、同軸状のコネクタ207−1、207−2の芯線側を構成し、これらのコネクタは、導電性のハウジング101と一体化されている。なお、コネクタ207−1、207−2の芯線側と接地側とは絶縁体により絶縁されている。   Connection terminals 205-1 and 205-2 are connected to the pattern electrodes 303-1 and 303-3 at both ends, respectively. This connection may be made by solder, for example, but may be made using a conductive adhesive or the like. The connection terminals 205-1 and 205-2 are each connected to an external circuit and exchange signals. The connection terminals 205-1 and 205-2 constitute the core wire side of the coaxial connectors 207-1 and 207-2, and these connectors are integrated with the conductive housing 101. In addition, the core wire side and the ground side of the connectors 207-1 and 207-2 are insulated by an insulator.

以上の如く電極パターン303−1、303−2、303−3と線状導体(L1、L2)を3点で接続させることにより構成された回路部品がハウジング101と導電性パイプ103で構成される筐体内に内蔵された、5段のローパスフィルタが構成される。   As described above, the circuit component constituted by connecting the electrode patterns 303-1, 303-2, 303-3 and the linear conductors (L1, L2) at three points is constituted by the housing 101 and the conductive pipe 103. A 5-stage low-pass filter built in the housing is configured.

上述した実施形態は、本発明の好適な実施形態ではあるが、上記実施形態のみに本発明の範囲を限定するものではなく、本発明の要旨を逸脱しない範囲において種々の変更を施した形態での実施が可能である。   Although the above-described embodiment is a preferred embodiment of the present invention, the scope of the present invention is not limited only to the above-described embodiment, and various modifications are made without departing from the gist of the present invention. Can be implemented.

例えば、下記のように変更を施した形態での実施が可能である。   For example, the present invention can be implemented in a modified form as described below.

金属製のハウジング101の材質は、導電性を有すればよく、真鍮の他に、銅系材質、鉄系材質等を用いてもよい。   The material of the metal housing 101 is only required to be conductive, and other than brass, a copper-based material, an iron-based material, or the like may be used.

パイプ103の材質も、同様に、導電性を有すればよく、真鍮の他に、銅系材質、鉄系材質等を用いてもよい。   Similarly, the material of the pipe 103 only needs to have conductivity, and other than brass, a copper-based material, an iron-based material, or the like may be used.

導電性板105の材質は、導電性とバネ性を有すればよく、りん青銅板の他に、銅系材質板、鉄系材質板等を用いてもよい。   The material of the conductive plate 105 only needs to have conductivity and springiness, and a copper-based material plate, an iron-based material plate, or the like may be used in addition to the phosphor bronze plate.

ハウジング101に金メッキを施す代わりに、ニッケルメッキを施してもよい。また、メッキ処理以外の処理(例えば、蒸着、塗布など)によりこれらの金属をハウジング101に施すようにしてもよい。   Instead of applying gold plating to the housing 101, nickel plating may be applied. Further, these metals may be applied to the housing 101 by a process other than the plating process (for example, vapor deposition, coating, etc.).

導電性パイプ103にニッケルメッキを施す代わりに、金メッキを施してもよい。また、メッキ処理以外の処理(例えば、蒸着、塗布など)によりこれらの金属を導電性パイプ103に施すようにしてもよい。   Instead of nickel plating on the conductive pipe 103, gold plating may be applied. Further, these metals may be applied to the conductive pipe 103 by a process other than the plating process (for example, vapor deposition, coating, etc.).

金属性105のハウジング101の直径は、8mm以外であってもよい。   The metallic 105 housing 101 may have a diameter other than 8 mm.

導電性板105のハウジング101の長さ及び導電性パイプの長さは、22mm以外であってもよい。   The length of the housing 101 of the conductive plate 105 and the length of the conductive pipe may be other than 22 mm.

切り欠きの長さは、13mm以外であってもよい。切り欠きの深さは5mm以外であってもよい。   The length of the cutout may be other than 13 mm. The depth of the notch may be other than 5 mm.

導電性板105の長さ、幅、厚みは、18mm、9.5mm、0.05mm以外であってもよい。   The length, width, and thickness of the conductive plate 105 may be other than 18 mm, 9.5 mm, and 0.05 mm.

導電性板105の厚み0.05mmに対応して、金属製のハウジング101と導電性パイプとの隙間は、約0.05mmから0.3mmとしてよいが、0.08mm程度が好適である。導電性板105の厚みは、0.05mm以外でもよく、0.03mmから0.2mmが好適である。これに応じて、金属製のハウジング101と導電性パイプ103との隙間の寸法を適宜調整してもよい。なお、導電性板105は、薄すぎるとハウジング101とパイプ103との間に挟み込むときに裂けたり、しわになったりする。また、導電性板105は、厚すぎると曲げた状態でハウジング101とパイプ103との間に差し込むことが困難になる。   Corresponding to the thickness of the conductive plate 105 of 0.05 mm, the gap between the metal housing 101 and the conductive pipe may be about 0.05 mm to 0.3 mm, but about 0.08 mm is preferable. The thickness of the conductive plate 105 may be other than 0.05 mm, and is preferably 0.03 mm to 0.2 mm. Accordingly, the size of the gap between the metal housing 101 and the conductive pipe 103 may be adjusted as appropriate. Note that if the conductive plate 105 is too thin, the conductive plate 105 may be torn or wrinkled when sandwiched between the housing 101 and the pipe 103. If the conductive plate 105 is too thick, it is difficult to insert the conductive plate 105 between the housing 101 and the pipe 103 in a bent state.

導電性パイプ103の円柱側面部の両端部付近は、それぞれ、4箇所でカシメることとしたが、カシメる箇所の数は、4以外であってもよい。   The vicinity of both ends of the cylindrical side surface portion of the conductive pipe 103 is caulked at four locations, but the number of caulking locations may be other than four.

高周波電子部品に含まれる高周波電子回路素子群などにより構成される高周波回路は、ローパスフィルタの特性以外の特性を有するものであってもよい。これに応じて、高周波電子回路素子群に含まれる回路素子とそれらの結合を適宜選択してもよい。   A high-frequency circuit configured by a high-frequency electronic circuit element group included in the high-frequency electronic component may have characteristics other than the characteristics of the low-pass filter. In accordance with this, circuit elements included in the high-frequency electronic circuit element group and their combination may be appropriately selected.

なお、上記実施形態で用いられる金属の電気抵抗率ρに関する定義とデータを下に示す。   In addition, the definition and data regarding the electrical resistivity ρ of the metal used in the above embodiment are shown below.

電気抵抗率ρ (R=ρ・L/A) R:抵抗値、L:長さ、A:面積
金 2.21×10のマイナス8乗(オーム・メートル)
ニッケル 6.99×10のマイナス8乗(オーム・メートル)
黄銅(=真鍮) 5〜7×10のマイナス8乗(オーム・メートル)
Electrical resistivity ρ (R = ρ · L / A) R: resistance value, L: length, A: area gold 2.21 × 10 minus 8th power (ohm / meter)
Nickel 6.99 × 10 minus 8th power (ohm meter)
Brass (= brass) 5-7x10 minus 8th power (ohm meter)

本発明は、高周波電子回路素子群などにより構成される高周波回路を含む高周波電子部品に利用することができる。   The present invention can be used for a high-frequency electronic component including a high-frequency circuit including a high-frequency electronic circuit element group.

100 高周波電子部品
101 ハウジング
103 導電性パイプ
105 導電性板
201 台座部
201a 台座部表面
201b 台座部裏面
203 高周波電子回路群
205 接続端子
207 同軸コネクタ
209 カシメ
301 誘電体基板
303 パターン電極
305 接地導体
L1,L2 線状導体
DESCRIPTION OF SYMBOLS 100 High frequency electronic component 101 Housing 103 Conductive pipe 105 Conductive plate 201 Base part 201a Base part surface 201b Base part back surface 203 High frequency electronic circuit group 205 Connection terminal 207 Coaxial connector 209 Caulking 301 Dielectric substrate 303 Pattern electrode 305 Ground conductor L1, L2 linear conductor

Claims (6)

中空部を有する導電性円筒型パイプと、
前記円筒型パイプの前記中空部に挿入された導電性円柱型ハウジングと、
前記導電性円柱型ハウジングを側面からみて中央部を切り欠くことにより前記導電性円柱型ハウジングに形成された台座部と、
前記台座部に載置された高周波電子回路素子群と、
前記導電性円柱型ハウジングの円周面のうちの前記台座部の裏面の少なくとも一部を含む部分を覆うように前記導電性円筒型パイプと前記導電性円柱型ハウジングとの隙間のうちの少なくとも一部に挟まれた導電性板と、
を備えることを特徴とする高周波電子部品。
A conductive cylindrical pipe having a hollow portion;
A conductive cylindrical housing inserted into the hollow portion of the cylindrical pipe;
A pedestal formed on the conductive cylindrical housing by cutting the central portion of the conductive cylindrical housing from the side;
A high-frequency electronic circuit element group placed on the pedestal, and
At least one of the gaps between the conductive cylindrical pipe and the conductive cylindrical housing so as to cover a portion including at least a part of the back surface of the pedestal portion of the circumferential surface of the conductive cylindrical housing. A conductive plate sandwiched between parts,
A high-frequency electronic component comprising:
前記導電性円筒型パイプは、前記導電性円柱型ハウジングにカシメにより固定されていることを特徴とする請求項1に記載の高周波電子部品。   The high-frequency electronic component according to claim 1, wherein the conductive cylindrical pipe is fixed to the conductive cylindrical housing by caulking. 前記導電性円柱型ハウジングの両端には、外部と電気的に接続するための接続端子が設けられており、
前記両端に設けられた接続端子は、それぞれ、前記高周波電子回路素子群と電気的に接続されていることを特徴とする請求項1又は2に記載の高周波電子部品。
Connection terminals for electrical connection to the outside are provided at both ends of the conductive cylindrical housing,
The high-frequency electronic component according to claim 1, wherein the connection terminals provided at both ends are electrically connected to the high-frequency electronic circuit element group.
前記導電性板は、バネ性を有することを特徴とする請求項1乃至3の何れか1項に記載の高周波電子部品。   The high-frequency electronic component according to claim 1, wherein the conductive plate has a spring property. 前記導電性板は、部分円筒の形状を有し、その曲率は、前記導電性円柱型ハウジングの円周面の曲率と異なることを特徴とする請求項1乃至4の何れか1項に記載の高周波電子部品。   The said electroconductive board has a shape of a partial cylinder, The curvature differs from the curvature of the circumferential surface of the said electroconductive column type housing, The any one of Claims 1 thru | or 4 characterized by the above-mentioned. High frequency electronic components. 前記部分円筒の形状には、凹凸が加えられていることを特徴とする請求項5に記載の高周波電子部品。   6. The high-frequency electronic component according to claim 5, wherein unevenness is added to the shape of the partial cylinder.
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JPS4925335U (en) * 1972-06-05 1974-03-04
JPS5167651U (en) * 1974-11-21 1976-05-28
US4451803A (en) * 1982-06-23 1984-05-29 Eagle Comtronics, Inc. Split tuning filter
JPS63152818A (en) * 1986-12-17 1988-06-25 多摩電気工業株式会社 Cable connection integration type cable with shield
JPH0615333U (en) * 1992-07-27 1994-02-25 ミツミ電機株式会社 Electrical signal filter
JP2002305480A (en) * 2000-06-12 2002-10-18 Maspro Denkoh Corp Noise-eliminating device and method for mounting the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
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JPS4925335U (en) * 1972-06-05 1974-03-04
JPS5167651U (en) * 1974-11-21 1976-05-28
US4451803A (en) * 1982-06-23 1984-05-29 Eagle Comtronics, Inc. Split tuning filter
JPS63152818A (en) * 1986-12-17 1988-06-25 多摩電気工業株式会社 Cable connection integration type cable with shield
JPH0615333U (en) * 1992-07-27 1994-02-25 ミツミ電機株式会社 Electrical signal filter
JP2002305480A (en) * 2000-06-12 2002-10-18 Maspro Denkoh Corp Noise-eliminating device and method for mounting the same

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