JP2016086395A - High frequency electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high frequency electronic component which is compact, small in the number of components and inexpensive.SOLUTION: A high frequency electronic component includes: a conductive cylindrical pipe 103 having a hollow part; a conductive columnar housing 101 inserted into the hollow part of the cylindrical pipe; a pedestal part formed in the conductive columnar housing by cutting the central part thereof as viewed from a side surface of the conductive columnar housing; a high frequency electronic circuit element group 203 mounted on the pedestal part; and a conductive plate 105 sandwiched in at least a part of a gap between the conductive cylindrical pipe and the conductive columnar housing so as to cover a part including at least a part of the rear side surface of the pedestal part in a circumferential surface of the conductive columnar housing.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a high-frequency electronic component in which the component is stored in a cylindrical casing.

  In mobile communication devices such as mobile phones, high-frequency electronic components are often used in which various components are housed in a metal casing having a coaxial connector and the input / output unit is connected by a cable or the like.

  When such a high-frequency electronic component is stored in the housing, it is necessary to provide good electrical shielding so that radio waves do not leak outside.

  Patent Document 1 discloses a method in which a metal frame is provided with upper and lower metal plates, and each metal plate is fixed to the frame with screws. Patent Document 2 discloses a method of sandwiching a conductive shim between a metal casing and an upper metal plate in order to fill a gap between the metal casing and the upper metal plate.

Japanese Patent Laid-Open No. 11-17406 JP 62-294302 A

  In recent years, mobile communication devices are required to be smaller and have higher performance, and at the same time, cost reduction is also required. The parts used are also required to have high performance through downsizing and optimal design, and further cost reduction is required by reducing the number of parts. However, in the case of Patent Document 1, if the fixing with the screw is small, a gap is generated between the metal plate and the frame, and there is a possibility that the characteristics are deteriorated due to leakage of radio waves. In addition, there is a problem that the number of parts is increased by screwing and the cost is increased due to an increase in member cost.

  Patent Document 2 discloses a method in which a conductive shim is sandwiched between a metal casing and an upper metal plate in order to fill a gap between the metal casing and the upper metal plate. However, it is necessary to strictly control the thickness accuracy of the shim. In addition, the assembly method may be complicated and expensive.

  Accordingly, an object of the present invention is to provide an inexpensive high-frequency electronic component that is small in size and has a small number of components.

According to the present invention, the object as described above is achieved.
A conductive cylindrical pipe having a hollow portion, a conductive cylindrical housing inserted into the hollow portion of the cylindrical pipe, and the conductive portion by notching a central portion when the conductive cylindrical housing is viewed from the side. A pedestal portion formed in the cylindrical housing; a high-frequency electronic circuit element group placed on the pedestal portion; and at least a part of a back surface of the pedestal portion of a circumferential surface of the conductive cylindrical housing. A high-frequency electronic component comprising: a conductive plate sandwiched between at least a part of a gap between the conductive cylindrical pipe and the conductive cylindrical housing so as to cover a portion is provided. .

  The present invention provides an inexpensive high-frequency electronic component that is small in size and has a small number of components.

1 is a schematic perspective view of a high-frequency electronic component according to an embodiment of the present invention. It is a disassembled perspective view of the high frequency electronic component by embodiment of this invention. 1 is an end view of a high-frequency electronic component according to an embodiment of the present invention. It is a graph which shows the frequency characteristic of the attenuation factor of the high frequency electronic component by embodiment of this invention. It is an equivalent circuit corresponding to the circuit comprised by the high frequency electronic circuit element group contained in the high frequency electronic component by embodiment of this invention. It is side surface sectional drawing along VI-VI 'of the high frequency electronic component by embodiment of this invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings.

[First Embodiment]
FIG. 1 is a schematic perspective view showing a first embodiment of a high-frequency electronic component according to the present invention. FIG. 2 is an exploded perspective view of the high-frequency electronic component. FIG. 3 is an end view of the high-frequency electronic component.

  The metal housing 101 has a cylindrical shape having a diameter of 8 mm and a length of 22 mm, for example. A substantially semi-cylindrical block (plate notch block) having a length of, for example, 13 mm extending from the upper surface side to a depth of 5 mm in the center of the housing 101 is cut out along the axial direction of the housing 101. A pedestal portion 201 near the center is provided as a part of the housing 101. The housing 101 is made of, for example, brass plated with gold.

  In FIG. 2, a high-frequency electronic circuit element group 203 is placed on the pedestal surface 201a. The high-frequency electronic circuit element group 203 includes, for example, a capacitor formed on a circuit board including a dielectric substrate, a pattern electrode, and a ground conductor, and an inductor formed of a copper-based processed wire, and connects them. Thus, the function of a low-pass filter is obtained. Two connection terminals 205 (only the far side is shown in FIG. 2) electrically and mechanically connected to the input part and the output part of the high-frequency electronic circuit element group 203 are attached to both ends of the housing 101. The coaxial connector 207 is electrically and electrically connected to the core wire side, and is electrically connected to an external circuit via the coaxial connector 207. The coaxial connector 207 may be integrated with the housing 101. The details related to the high-frequency electronic circuit element group 203 will be described later.

  The housing 101 is inserted into the conductive pipe 103. A conductive plate 105 is sandwiched between the housing 101 and the conductive pipe 103. As the conductive pipe 103, for example, brass plated with nickel is used. As a material of the conductive plate 105, for example, a phosphor bronze plate having a size of 18 mm × 9.5 mm and a thickness of 0.05 mm is used. The material of the conductive plate 105 is preferably springy. By sandwiching the conductive plate 105 between the housing 101 and the conductive pipe 103, electromagnetic shielding between the built-in high-frequency electronic circuit element group 203 and the outside of the high-frequency electronic component 100 is improved, Good characteristics of a high-frequency circuit constituted by the high-frequency electronic circuit element group 203 can be obtained.

  Here, as described above, the conductive plate 105 is sandwiched between the housing 101 and the conductive pipe 103, so that the conductive plate 105 is part of the circumferential surface of the housing 101. Will be covered. The covered region preferably includes at least a part of the pedestal part back surface 201b included in the circumferential surface, and further preferably includes the entire pedestal part back surface 201b. Moreover, it is preferable that the area | region to cover includes not only the whole base part back surface 201b but the peripheral part.

  Further, the conductive plate 105 having a partially arc-shaped cross section viewed from the end face side can be obtained by, for example, rolling a flat conductive plate 105A as shown in FIG. 2 so as to form a partial cylinder. However, the curvature of the inner surface of the conductive plate 105 may be the same as the curvature of the circumferential surface of the housing 101, but by making it different, the spring property of the conductive plate 105 is effective. Thus, the electrical contact between the conductive plate 105 and the pedestal back surface 201b can be enhanced, whereby the characteristics of the high-frequency circuit can be improved. Further, the conductive plate 105 may be uneven so that the waveform overlaps the partial arc-shaped cross-sectional shape viewed from the end face side of the conductive plate 105. This waveform may be one-dimensional when viewed from the upper surface of the conductive plate 105 or may be two-dimensional.

  As shown in FIGS. 1 and 3, the vicinity of both end portions of the circumferential surface of the conductive pipe 103 is caulked at appropriate four locations. Thereby, it is possible to prevent the conductive pipe 103 from falling out of the housing 101 and to obtain stable characteristics. Further, the caulking position may be a position where the conductive plate 105 is caulked together, or may be a position where it is not.

  FIG. 4 shows, with a solid line, the frequency characteristics of the attenuation rate of a high-frequency circuit configured by a high-frequency electronic circuit element group included in the high-frequency electronic component of this embodiment. In addition, FIG. 4 shows the frequency characteristics of the attenuation rate of the high-frequency circuit when the conductive plate 105 is not sandwiched for comparison, by a broken line. FIG. 4 shows that the attenuation characteristics are improved in the region of 3 GHz to 6 GHz by sandwiching the conductive plate 105. For example, at 4 GHz, the attenuation factor is about 55 dB if the conductive plate 105 is not sandwiched, whereas it is about 70 dB if the conductive plate 105 is sandwiched, which is improved by about 15 dB. Further, for example, at 5 GHz, when the conductive plate 105 is not sandwiched, the attenuation factor is 45 dB. When the conductive plate 105 is sandwiched, the attenuation factor is approximately 70 dB, which is improved by about 25 dB. Although not shown, the frequency characteristics of the phase are improved, for example, close to the designed characteristics.

  According to this embodiment, the conductive cylindrical housing 101 is inserted into the conductive cylindrical pipe 103, and the conductive plate 105 is sandwiched between them, thereby preventing electromagnetic shielding between the high frequency circuit and the outside. A high-frequency electronic component that can form a good housing and has good characteristics is provided. Further, the shape of the conductive plate 105 may be a simple rectangle and does not require complicated processing, so that an inexpensive high-frequency electronic component is provided.

  FIG. 5 is an equivalent circuit corresponding to a high-frequency circuit configured by a high-frequency electronic circuit element group included in the high-frequency electronic component of the present embodiment. FIG. 6 is a side sectional view showing the internal structure of the high-frequency electronic component included in the equivalent circuit of FIG. In the present embodiment, a five-stage low-pass filter having three capacitors C1 to C3 and two coils L1 and L2 is configured.

  On the first surface (upper surface side) of the dielectric substrate 301, three pattern electrodes 303-1, 303-2, and 303-3 are formed in a row of island shapes. A ground conductor (electrode) 305 is formed on the entire second surface (lower surface side) of the dielectric substrate 301, and this includes three pattern electrodes 303-1, 303-2, 303 across the dielectric substrate 301. -3. In this way, by forming the three pattern electrodes 303-1, 303-2, 303-3 and the ground conductor 305 on the dielectric substrate 301, three capacitors C1 to C3 are configured.

The dielectric substrate 301 has a basic shape having a length L, a width W, and a thickness T. The length L of the dielectric substrate 301 is, for example, about 12 mm, the width W is, for example, about 5 mm, and the thickness T is, for example, about 0.6 mm. The material of the dielectric substrate 301, for example, Ti / Ca / Mg system a ceramic dielectric constant epsilon _r can be used 20 degree of dielectric ceramics.

  As the pattern electrodes 303-1, 303-2, 303-3 and the ground conductor 305, for example, silver electrodes are used. The capacitance values of the capacitors C1 to C3 are determined by the frequency characteristics of the attenuation rate of the low-pass filter, and the capacitance values can be changed by changing the areas of the pattern electrodes 303-1, 303-2, and 303-3. The capacitance values of the capacitors C1 to C3 can all be the same, but can also be set differently. The intervals between the pattern electrodes 303-1, 303-2, and 303-3 may be equal intervals, but may not be equal intervals, and these intervals change the length of the linear conductor between the pattern electrodes. Can be set as appropriate. The ground conductor 305 is joined to the housing 101 by, for example, solder, but may be joined to the housing 101 using a conductive adhesive or the like. The housing 101 is connected to the ground side of the connectors 207-1 and 207-2.

  The two coils L1 and L2 are formed of one linear conductor. As the linear conductor, a conductive wire can be used, for example, a round bar wire having a diameter of 0.5 mm, and the material is, for example, a copper-based material. The linear conductor is bent in a meander (meander) shape on the same surface. Here, one linear conductor constitutes two coils, but may be divided into two linear conductors.

  Both ends of the linear conductor are connected to the pattern electrodes 303-1 and 303-3 at both ends, and the central portion is connected to the center pattern electrode 303-2. The linear copper bodies constituting the coils L1, L2 and the pattern electrodes 303-1, 303-2, 303-3 are joined by, for example, solder, but a conductive adhesive or the like may be used.

  Connection terminals 205-1 and 205-2 are connected to the pattern electrodes 303-1 and 303-3 at both ends, respectively. This connection may be made by solder, for example, but may be made using a conductive adhesive or the like. The connection terminals 205-1 and 205-2 are each connected to an external circuit and exchange signals. The connection terminals 205-1 and 205-2 constitute the core wire side of the coaxial connectors 207-1 and 207-2, and these connectors are integrated with the conductive housing 101. In addition, the core wire side and the ground side of the connectors 207-1 and 207-2 are insulated by an insulator.

  As described above, the circuit component constituted by connecting the electrode patterns 303-1, 303-2, 303-3 and the linear conductors (L1, L2) at three points is constituted by the housing 101 and the conductive pipe 103. A 5-stage low-pass filter built in the housing is configured.

  Although the above-described embodiment is a preferred embodiment of the present invention, the scope of the present invention is not limited only to the above-described embodiment, and various modifications are made without departing from the gist of the present invention. Can be implemented.

  For example, the present invention can be implemented in a modified form as described below.

  The material of the metal housing 101 is only required to be conductive, and other than brass, a copper-based material, an iron-based material, or the like may be used.

  Similarly, the material of the pipe 103 only needs to have conductivity, and other than brass, a copper-based material, an iron-based material, or the like may be used.

  The material of the conductive plate 105 only needs to have conductivity and springiness, and a copper-based material plate, an iron-based material plate, or the like may be used in addition to the phosphor bronze plate.

  Instead of applying gold plating to the housing 101, nickel plating may be applied. Further, these metals may be applied to the housing 101 by a process other than the plating process (for example, vapor deposition, coating, etc.).

  Instead of nickel plating on the conductive pipe 103, gold plating may be applied. Further, these metals may be applied to the conductive pipe 103 by a process other than the plating process (for example, vapor deposition, coating, etc.).

  The metallic 105 housing 101 may have a diameter other than 8 mm.

  The length of the housing 101 of the conductive plate 105 and the length of the conductive pipe may be other than 22 mm.

  The length of the cutout may be other than 13 mm. The depth of the notch may be other than 5 mm.

  The length, width, and thickness of the conductive plate 105 may be other than 18 mm, 9.5 mm, and 0.05 mm.

  Corresponding to the thickness of the conductive plate 105 of 0.05 mm, the gap between the metal housing 101 and the conductive pipe may be about 0.05 mm to 0.3 mm, but about 0.08 mm is preferable. The thickness of the conductive plate 105 may be other than 0.05 mm, and is preferably 0.03 mm to 0.2 mm. Accordingly, the size of the gap between the metal housing 101 and the conductive pipe 103 may be adjusted as appropriate. Note that if the conductive plate 105 is too thin, the conductive plate 105 may be torn or wrinkled when sandwiched between the housing 101 and the pipe 103. If the conductive plate 105 is too thick, it is difficult to insert the conductive plate 105 between the housing 101 and the pipe 103 in a bent state.

  The vicinity of both ends of the cylindrical side surface portion of the conductive pipe 103 is caulked at four locations, but the number of caulking locations may be other than four.

  A high-frequency circuit configured by a high-frequency electronic circuit element group included in the high-frequency electronic component may have characteristics other than the characteristics of the low-pass filter. In accordance with this, circuit elements included in the high-frequency electronic circuit element group and their combination may be appropriately selected.

  In addition, the definition and data regarding the electrical resistivity ρ of the metal used in the above embodiment are shown below.

Electrical resistivity ρ (R = ρ · L / A) R: resistance value, L: length, A: area gold 2.21 × 10 minus 8th power (ohm / meter)
Nickel 6.99 × 10 minus 8th power (ohm meter)
Brass (= brass) 5-7x10 minus 8th power (ohm meter)

  The present invention can be used for a high-frequency electronic component including a high-frequency circuit including a high-frequency electronic circuit element group.

DESCRIPTION OF SYMBOLS 100 High frequency electronic component 101 Housing 103 Conductive pipe 105 Conductive plate 201 Base part 201a Base part surface 201b Base part back surface 203 High frequency electronic circuit group 205 Connection terminal 207 Coaxial connector 209 Caulking 301 Dielectric substrate 303 Pattern electrode 305 Ground conductor L1, L2 linear conductor

Claims (6)

A conductive cylindrical pipe having a hollow portion;
A conductive cylindrical housing inserted into the hollow portion of the cylindrical pipe;
A pedestal formed on the conductive cylindrical housing by cutting the central portion of the conductive cylindrical housing from the side;
A high-frequency electronic circuit element group placed on the pedestal, and
At least one of the gaps between the conductive cylindrical pipe and the conductive cylindrical housing so as to cover a portion including at least a part of the back surface of the pedestal portion of the circumferential surface of the conductive cylindrical housing. A conductive plate sandwiched between parts,
A high-frequency electronic component comprising:   The high-frequency electronic component according to claim 1, wherein the conductive cylindrical pipe is fixed to the conductive cylindrical housing by caulking. Connection terminals for electrical connection to the outside are provided at both ends of the conductive cylindrical housing,
The high-frequency electronic component according to claim 1, wherein the connection terminals provided at both ends are electrically connected to the high-frequency electronic circuit element group.   The high-frequency electronic component according to claim 1, wherein the conductive plate has a spring property.   The said electroconductive board has a shape of a partial cylinder, The curvature differs from the curvature of the circumferential surface of the said electroconductive column type housing, The any one of Claims 1 thru | or 4 characterized by the above-mentioned. High frequency electronic components.   6. The high-frequency electronic component according to claim 5, wherein unevenness is added to the shape of the partial cylinder.

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