JP2016072132A - Method for forming pattern, and base material for forming pattern - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for forming a pattern capable of forming a high definition pattern easily and inexpensively.SOLUTION: The method for forming a pattern includes: a release layer-forming process of forming a release layer containing a release material on a base material in a pattern shape; a processing film-forming process of forming a processing film on the base material; and a processing film-removing process of removing the processing film on the release layer to form the processing film in a pattern shape.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a pattern forming method and a pattern forming substrate.

  As a method for forming a fine pattern, a photolithography method is known. In the photolithography method, for example, film formation of a photoresist, exposure and development, etching of a film to be processed, removal of the photoresist, and the like are performed. Moreover, the said process is performed for every to-be-processed film | membrane used as object. Therefore, there are problems that the number of processes is large, the manufacturing process is complicated, the lead time is long, and the manufacturing cost is high.

  On the other hand, the printing method for directly forming a pattern does not require the use of a photoresist, and the manufacturing process can be largely omitted. As a printing method capable of forming a fine pattern, for example, a reverse offset printing method as described in Patent Document 1 and an ink jet method are known. However, in the reverse offset printing method, it is necessary to wash unnecessary ink transferred from the blanket to the plate, which is not suitable for continuous pattern formation, and usable ink is limited. In addition, in the ink jet method, a plate is not required and the number of steps is very small, but the nozzles are clogged, so that there is a problem that continuous pattern formation is difficult and tact time is long. In addition, it is necessary to convert the material suitable for the inkjet method into an ink, resulting in high costs.

JP 2011-73264 A

  The present invention has been made in view of the above problems, and it is a main object of the present invention to provide a pattern forming method capable of forming a high-definition pattern easily and inexpensively and a pattern forming substrate used therefor. And

  In order to achieve the above object, the present invention provides a mold release layer forming step for forming a mold release layer containing a mold release material on a base material in a pattern, and a workpiece to be processed on the base material and the mold release layer. A process film forming step for forming a film and a process film removing step for removing the process film on the release layer, and forming the process film on the substrate in a pattern A pattern forming method is provided.

  In the present invention, the film to be processed can be patterned using a patterned release layer, and the material of the film to be processed is not restricted, so that the manufacturing process can be simplified and the manufacturing cost can be reduced. it can. Further, by forming the release layer in a fine pattern, it becomes possible to pattern the film to be processed with high definition. Furthermore, continuous pattern formation is also possible.

  Further, in the present invention, in the release layer forming step, a relief plate in which a convex portion having the release material on the surface is formed in a pattern on the substrate is used, and the relief of the relief plate is formed on the substrate surface. It is preferable to press the part. By pressing the convex portion of the relief plate against the surface of the substrate, the release material on the surface of the convex portion is transferred to the surface of the substrate, and the release layer can be formed in a pattern on the substrate. Therefore, a patterned release layer can be formed easily and efficiently, and further productivity improvement and cost reduction are possible. Further, by forming the convex portions of the relief plate in a fine pattern, the film to be processed can be patterned with high definition.

  In said case, it is preferable that the said convex part contains a silicone rubber. In general, silicone rubber contains a low molecular weight component, and it is known that a low molecular weight component emerges on the surface of a member containing silicone rubber. Therefore, when a convex part contains silicone rubber, the low molecular weight component contained in a convex part transfers to the base-material surface, and the mold release layer containing a low molecular weight component can be formed as a mold release material.

  In the present invention, the release material is preferably silicone. This is because silicone is excellent in releasability.

  In the above case, the silicone is preferably a low molecular weight polysiloxane. Generally, a low molecular weight polysiloxane is contained in silicone rubber, and a release layer containing a low molecular weight polysiloxane can be formed as a release material by the release layer forming step using the relief printing plate.

  Moreover, in this invention, the said process film removal process uses the adhesion laminated body in which the adhesion layer was formed on the 1st base material, and the contact which contacts the said adhesion layer of the said adhesion laminate on the said process film surface It is preferable to have a process and the peeling process which peels the said adhesion laminated body. Since the adhesion between the work film and the release layer is weaker than the adhesion between the work film and the substrate, the work film on the release layer should be removed together with the pressure-sensitive adhesive laminate when peeling the adhesive laminate. Can do. Therefore, the film to be processed on the release layer can be removed by a simple method.

  Furthermore, in the present invention, the process film removal step uses a resin laminate in which a fluid resin layer is formed on the second substrate, and the resin layer of the resin laminate on the process film surface. It is also preferable to have a contact process for contacting the resin layer, a curing process for curing the resin layer in contact with the film to be processed, and a peeling process for peeling the resin laminate. As in the above case, the adhesion between the film to be processed and the release layer is weaker than the adhesion between the film to be processed and the substrate, and therefore, when the resin laminate is peeled off, the film to be processed on the release layer is removed. It can be removed together with the resin laminate. Therefore, the film to be processed on the release layer can be easily removed.

  Moreover, this invention provides the base material for pattern formation characterized by having a base material and the mold release layer which is formed in a pattern shape on the said base material, and contains a mold release material.

  In the present invention, since the release layer is formed in a pattern, a high-definition pattern can be easily and inexpensively formed by the above-described pattern forming method using the pattern forming substrate of the present invention. .

  In the said invention, it is preferable that the said mold release material is silicone. In this case, the silicone is preferably a low molecular weight polysiloxane. This is because silicone is excellent in releasability.

  In the present invention, there is an effect that a high-definition pattern can be formed easily and inexpensively.

It is process drawing which shows an example of the pattern formation method of this invention. It is a schematic diagram which shows an example of the mold release layer formation process in the pattern formation method of this invention. It is process drawing which shows an example of the to-be-processed film removal process in the pattern formation method of this invention. It is a schematic sectional drawing which shows an example of the base material for pattern formation of this invention. It is a schematic diagram which shows an example of the pattern formation apparatus of this invention. It is process drawing which shows an example of the to-be-processed film removal process using the to-be-processed film removal means in the pattern formation apparatus of this invention.

  Hereinafter, the pattern formation method, the substrate for pattern formation, and the pattern formation apparatus of this invention are demonstrated in detail.

A. Pattern Forming Method The pattern forming method of the present invention includes a release layer forming step of forming a release layer containing a release material on a substrate in a pattern, and a film to be processed on the substrate and the release layer. Forming a processed film on the substrate, and forming the processed film in a pattern on the substrate. It is a characteristic method.

The pattern forming method of the present invention will be described with reference to the drawings.
1A to 1G are process diagrams showing an example of the pattern forming method of the present invention. First, as shown in FIG. 1 (a), a base plate 1 and a relief plate 10 in which convex portions 12 having a release material at least on the surface are formed in a pattern on a base body 11 are prepared. As shown in b), the convex portion 12 of the relief plate 10 is pressed against the surface of the substrate 1. Thereby, the mold release material on the surface of the convex portion 12 moves to the surface of the base material 1, and the mold release layer 2 composed of the mold release material is formed on the base material 1 as shown in FIG. . Next, as shown in FIG. 1 (d), a film to be processed 3 is formed on the entire surface of the substrate 1 so as to cover the release layer 2. Next, as shown in FIG.1 (e), the adhesion laminated body 20 in which the adhesion layer 22 was formed on the 1st base material 21 was prepared, and as shown in FIG.1 (f), the adhesion laminated body 20 of FIG. The adhesive layer 22 is adhered to the film 3 to be processed. Then, as shown in FIG.1 (g), the adhesion laminated body 20 is peeled. At this time, since the adhesion force between the film to be processed 3 and the release layer 2 is weaker than the adhesion force between the film to be processed 3 and the substrate 1, the film to be processed 3 on the release layer 2 is separated from the release layer 2. Is transferred to the adhesive layer 22 side. Thereby, the film 3 to be processed on the release layer 2 is removed, and the film 3 to be processed is formed on the substrate 1 in a pattern.

In the present invention, the film to be processed can be patterned by removing the film to be processed on the release layer using the patterned release layer. Therefore, the number of processes is small and the manufacturing process can be simplified. The film to be processed may be any film that can be formed on the substrate and the release layer, and the material of the film to be processed is advantageous in that it is not restricted. Accordingly, productivity can be improved and costs can be reduced.
Further, by forming the release layer in a fine pattern, it is possible to pattern the film to be processed with high definition.
Further, continuous printing is difficult by the conventional reverse offset printing method or ink jet method, but continuous pattern formation is possible in the present invention. Furthermore, a continuous pattern can be formed by the roll-to-roll method, and the productivity can be further improved.

  Hereinafter, each process in the pattern formation method of this invention is demonstrated.

1. Release layer forming step The release layer forming step in the present invention is a step of forming a release layer containing a release material on a substrate in a pattern.

The release material contained in the release layer varies depending on the method for forming the release layer.
For example, as shown in FIGS. 1A to 1C, a release layer 2 is formed on a base 11 using a relief plate 10 in which convex portions 12 having a release material at least on the surface are formed in a pattern. In this case, it is preferable that the release material is one that can move from the convex portion to the substrate surface when the convex portion of the relief plate is pressed against the surface of the base material, and differs depending on the material of the convex portion. . For example, when the convex part contains silicone rubber, the release material may be any material that can move from the convex part containing silicone rubber to the surface of the base material. Examples include crosslinking components and by-products, decomposition products due to deterioration of silicone rubber, and additives.
Examples of these components include silicone, and specific examples include silicone oil. More specifically, the silicone is preferably a low molecular weight polysiloxane. The low molecular weight polysiloxane has a degree of polymerization of 10 or less. The molecular weight of the low molecular weight polysiloxane is, for example, in the range of 100 to 10,000. Generally, silicone rubber contains silicone oil, particularly low molecular weight polysiloxane, as a component as described above. Therefore, by pressing the convex part of the relief plate on the surface of the base material, the silicone oil contained in the convex part, particularly low molecular weight polysiloxane can be transferred to the base material surface. A release layer containing polysiloxane can be formed in a pattern.

  The silicone oil may be any of linear silicone and cyclic silicone, such as dimethyl silicone oil, methylphenyl silicone oil, methyl hydrogen silicone oil, modified silicone oil, 1,1,3,3-tetra Methyldisiloxane, pentamethyldisiloxane, hexamethyldisiloxane, octamethyltrisiloxane, hexamethylcyclotrisiloxane, octamethylcyclotetrasiloxane, decamethylcyclopentasiloxane, dodecamethylcyclohexasiloxane, tetradecamethylcycloheptasiloxane, Examples include hexadecamethylcyclooctasiloxane, octadecamethylcyclononasiloxane, and eicosamethylcyclodecasiloxane.

  In addition, when forming a release layer using a release layer forming coating solution containing a release material, the release material may be any material that has releasability. An agent can be used, and examples thereof include silicone release agents, fluorine release agents, wax release agents, and polyvinyl alcohol release agents. Especially, it is preferable that a mold release material is a silicone type mold release agent, ie, silicone. Further, the silicone release agent is preferably silicone oil. This is because silicone is excellent in releasability. The silicone oil can be the same as the silicone oil described above.

  The method for forming the release layer is not particularly limited as long as it is a method capable of forming the release layer in a pattern on the substrate. For example, a convex layer having a release material at least on the surface is formed on the substrate. A method for pressing the convex portion of the relief plate on the surface of the substrate using a relief plate having a pattern formed in the pattern, or a release layer forming coating solution containing a release material. And a method of coating the release layer on the substrate, and a method of patterning the release layer after applying the coating liquid for forming the release layer.

  Among these, a method of pressing the convex portion of the relief plate onto the substrate surface is preferable. By pressing the convex portion of the relief plate against the surface of the substrate, the release material on the surface of the convex portion is transferred to the surface of the substrate, and the release layer can be formed in a pattern on the substrate. Therefore, a patterned release layer can be formed easily and efficiently, and further productivity improvement and cost reduction are possible. Further, by forming the convex portions of the relief plate in a fine pattern, the film to be processed can be patterned with high definition.

  In the case of the method using a relief plate, the material used for the relief portion of the relief plate may be any material as long as it contains the release material, but when the relief portion of the relief plate is pressed against the substrate surface, the release material is used. It is preferable that it can be transferred to the surface of the substrate, and among these, silicone rubber is preferable. In general, silicone rubber contains a silicone component as described above, and silicone has releasability. Therefore, by pressing the convex part of the relief plate on the substrate surface, the silicone contained in the convex part can be transferred to the substrate surface, and a release layer containing silicone is formed in a pattern on the substrate. be able to. In addition, since silicone rubber has elasticity, it can apply pressure to the relief plate evenly when pressing the relief plate onto the surface of the substrate, and can improve the adhesion between the relief plate and the substrate, thereby increasing the pattern of the release layer. It can be formed finely. As a result, it becomes possible to pattern a high-definition film to be processed.

  Examples of the material of the silicone rubber include polydimethylsiloxane and a copolymer thereof, fluorine group-containing polydimethylsiloxane and a copolymer thereof, polyvinylmethylsiloxane, and polyphenylmethylsiloxane. Of these, polydimethylsiloxane is preferred. This is because polydimethylsiloxane is a material widely used as a plate for imprint technology, so that fine irregularities can be easily formed by shaping. In addition, polydimethylsiloxane has an advantage that it is excellent in releasability.

The relief plate may be any substrate having a base and a convex part formed on the base in a pattern and having a release material on at least the surface. For example, as shown in FIG. 2A, the base body 11 and the convex portion 12 may be integrally formed, and as shown in FIG. 2B, the first convex portion in which the convex portion 12 is formed on the base body 11 is formed. The base 12 and the first convex portion 12a may be formed integrally with the portion 12a and the second convex portion 12b formed on the first convex portion 12a and having a release material at least on the surface thereof. As shown in FIG. 2C, the base body 11 and the convex portion 12 may be separate bodies. 2A to 2C are schematic views showing other examples of the release layer forming step.
In the case where the substrate is separate from the convex portion, for example, a glass substrate, a resin substrate, a ceramic substrate, a metal substrate, or the like can be used as the substrate.

  The shape of the relief plate may be a plate shape or a roll shape. When the relief printing is in a roll shape, a continuous release layer can be formed by a roll-to-roll method.

The method for producing the relief plate is not particularly limited as long as it is a method capable of producing a relief plate having a base and a convex portion formed on the base in a pattern and having a release material on at least the surface.
The relief plate 10 illustrated in FIG. 2A can be manufactured by shaping, for example. In this case, the relief plate can be easily produced, and the relief plate can be easily duplicated.
In addition, the relief plate 10 illustrated in FIG. 2B is prepared, for example, as a relief plate in which the first protrusions 12a are formed in a pattern on the base 11, and at least the surface of the release material on the first protrusions 12a. It is obtained by forming the 2nd convex part 12b which has. In this case, it is easy to form the second convex portion having a release material on at least the surface, and the material of the base and the first convex portion is not restricted, so that the choice of materials is widened. Examples of the method for forming the second protrusion include a method of applying a release material on the first protrusion, and a method of pressing the first protrusion on a sheet-like silicone rubber.
Further, the relief plate 10 illustrated in FIG. 2C is obtained by preparing a blanket having a surface layer having a release material on the surface and patterning the surface layer of the blanket with a laser or the like. In this case, since patterning is performed with a laser or the like, the pattern of the convex portions can be formed with high definition. As a result, the pattern of the release layer can be formed with high definition, and high-definition film to be processed can be patterned.

In the case of a method using a release layer forming coating solution, the release layer forming coating solution may contain a solvent or the like in addition to the release material.
When the release layer forming coating solution is applied in a pattern on the substrate, the application method may be any method that can apply the release layer forming coating solution in a pattern on the substrate. For example, an inkjet method, a screen printing method, etc. are mentioned.
In addition, when the release layer is patterned after coating the release layer forming coating solution on the substrate, the application method may be to apply the release layer forming coating solution over the entire surface of the substrate. Any method can be used as long as it can be used, and for example, it can be appropriately selected from general methods such as spin coating, die coating, and bar coating. Examples of the patterning method for the release layer include a method using a laser.

The thickness of the release layer is not particularly limited as long as the release property can be exhibited, and is appropriately adjusted according to the method for forming the release layer.
For example, when a release layer is formed using a relief printing plate, the release layer preferably has a thickness in the range of 30 nm to 300 nm. If the release layer is thin, sufficient release properties may not be obtained. Moreover, it is difficult to form a thick release layer by a method of forming a release layer using a relief printing plate.
Moreover, when forming a mold release layer using the mold release layer forming coating liquid, it is preferable that the thickness of a mold release layer exists in the range of 500 nm-1000 nm. If the release layer is thin, sufficient release properties may not be obtained. In addition, since the release layer remains on the base material after the later-described processed film removal step, if the release layer is thick, it may be difficult to form another layer on the processed film. . Further, if the release layer is thick, it may adversely affect the adjacent film to be processed, such as dripping, and it may be difficult to form a high-definition pattern.

The substrate used in the present invention is not particularly limited as long as it can support the release layer and the film to be processed, and is appropriately selected depending on the application, for example, a glass substrate or a resin substrate. , Ceramic substrates, metal substrates and the like. Moreover, the base material may have rigidity and may have flexibility.
Among these, the base material is preferably one that has been subjected to surface treatment in order to enhance adhesion to the film to be processed, or one in which an anchor coat layer is formed on the surface. Examples of the surface treatment method include UV-ozone treatment, vacuum ultraviolet light irradiation, and plasma irradiation. When the adhesion between the substrate and the film to be processed is high, peeling of the film to be processed from the substrate in the later-described process film removal step can be suppressed.

  The substrate may be a single wafer or may be long. In the case of a long substrate, a continuous release layer can be formed by a roll-to-roll method.

2. Processed film formation process The process film formation process in this invention is a process of forming a process film on the said base material and the said mold release layer.

  The material used for the film to be processed is appropriately selected according to the application, for example, a conductive material, a semiconductor material, an insulating material, a light emitting material, a hole injecting material, a coloring material, a resin material. And biomaterials. Moreover, both inorganic materials and organic materials can be used. Among these, inorganic materials are preferable, and metal materials are more preferable. Examples of the metal material include metal compounds such as metals, alloys, and metal oxides. This is because the inorganic material can be formed by a dry method such as a PVD method or a CVD method, and a film to be processed having good adhesion to the substrate can be obtained as described later.

  As a method for forming the film to be processed, for example, a PVD method such as a sputtering method, a vacuum deposition method, an ion plating method, or a dry method such as a CVD method may be used. It may be a wet method in which a coating liquid for forming a processed film is applied, and is appropriately selected depending on the material.

  The method for applying the coating liquid for forming a film to be processed is not particularly limited as long as it is a method capable of applying the coating liquid for forming a film to be processed to the entire surface of the substrate. For example, a spin coating method, It can be appropriately selected from general methods such as a die coating method and a bar coating method.

  In particular, the method for forming the film to be processed is preferably a dry method. This is because a film to be processed having good adhesion to the substrate can be obtained. Thereby, peeling of the to-be-processed film | membrane from the base material in the below-mentioned to-be-processed film removal process can be suppressed.

  The thickness of the film to be processed may be any thickness that allows the film to be processed on the release layer to be removed in the process of removing the film to be processed, which will be described later, but is preferably in the range of, for example, 20 nm to 10 μm. If the thickness of the workpiece film is large, it may be difficult to remove the workpiece film on the release layer in the workpiece film removal step. Further, if the thickness of the film to be processed is thin, the film to be processed in a region where the release layer is not formed may be removed.

3. Processed film removal process The process film removal process in this invention is a process of removing the said processed film on the said mold release layer.

  As a method for removing the film to be processed on the release layer, any method can be used as long as it can remove the film to be processed on the release layer and leave the film to be processed in a region where the release layer is not formed. Although it is not limited, it is preferable that it is either of the following two aspects among them.

(1) 1st aspect The process film removal process of this aspect uses the adhesion laminated body in which the adhesion layer was formed on the 1st base material, and contacts the said adhesion layer of the said adhesion laminated body on the said to-be-processed film surface. And a peeling step for peeling the pressure-sensitive adhesive laminate.

  1E to 1G are process diagrams showing an example of a processed film removal process of this embodiment. First, as shown in FIG.1 (e), the adhesion laminated body 20 in which the adhesion layer 22 was formed on the 1st base material 21 was prepared, and as shown in FIG.1 (f), the adhesion of the adhesion laminated body 20 was shown. The layer 22 is adhered to the film 3 to be processed. Then, as shown in FIG.1 (g), the adhesion laminated body 20 is peeled. At this time, since the adhesion force between the film to be processed 3 and the release layer 2 is weaker than the adhesion force between the film to be processed 3 and the substrate 1, the film to be processed 3 on the release layer 2 is separated from the release layer 2. Is transferred to the adhesive layer 22 side. Thereby, the film 3 to be processed on the release layer 2 is removed, and the film 3 to be processed is formed on the substrate 1 in a pattern.

In this case, since the adhesion between the work film and the release layer is weaker than the adhesion between the work film and the substrate, when peeling the adhesive laminate, the work film on the release layer is attached together with the adhesive laminate. Can be removed. Therefore, the film to be processed on the release layer can be removed by a simple method.
Hereafter, each process in the to-be-processed film removal process of this aspect is demonstrated.

(A) Contacting step In the contacting step in this embodiment, the pressure-sensitive adhesive laminate in which the pressure-sensitive adhesive layer is formed on the first substrate is used, and the pressure-sensitive adhesive layer of the pressure-sensitive adhesive laminate is brought into contact with the processed film surface.

As the material of the adhesive layer in the adhesive laminate, the adhesive force between the adhesive layer and the film to be processed is larger than the adhesive force between the film to be processed and the release layer, and smaller than the adhesive force between the film to be processed and the substrate. What is necessary is just to be able to select, and it can select suitably from a general adhesive.
The thickness of the adhesive layer is not particularly limited as long as desired adhesiveness can be obtained, and can be, for example, about 25 μm to 100 μm.

  As a 1st base material in an adhesion laminated body, what is necessary is just to be able to support an adhesion layer, for example, a glass base material, a resin base material, etc. can be mentioned. Moreover, the 1st base material may have rigidity and may have flexibility. Moreover, the 1st base material may be a sheet | seat, and may be long. In the case of a long length, it becomes possible to remove the film to be processed continuously by a roll-to-roll method.

  As a method of bringing the pressure-sensitive adhesive layer of the pressure-sensitive adhesive laminate into contact with the surface of the film to be processed, any method that can press-bond the pressure-sensitive adhesive layer to the surface of the film to be processed is acceptable.

(B) Peeling process In the peeling process in this aspect, the said adhesive laminated body is peeled. When peeling the pressure-sensitive adhesive laminate, the film to be processed on the release layer can be removed, and the film to be processed can be formed in a pattern on the substrate.
In FIG. 1G, the film 3 to be processed in the region where the release layer 2 is not formed is not transferred to the adhesive layer 22 side, but although not shown, the release layer 2 is not formed. A part of the processed film 3 in the region may also be transferred to the adhesive layer 22 side, and delamination may occur.

(2) 2nd aspect The process film removal process of this aspect uses the resin laminated body by which the resin layer which has fluidity | liquidity was formed on the 2nd base material, and the said resin laminated body on the said to-be-processed film surface. A contact step for contacting the resin layer; a curing step for curing the resin layer in contact with the film to be processed; and a peeling step for peeling the resin laminate.

  3A to 3C are process diagrams showing an example of the processed film removal process of this embodiment. First, as shown to Fig.3 (a), the resin laminated body 30 by which the resin layer 32 which has fluidity | liquidity was formed on the 2nd base material 31 was prepared, and as shown to FIG.3 (b), a fluid state The resin layer 32 is brought into contact with the film 3 to be processed. Next, as shown in FIG. 3B, the resin layer 32 is irradiated with ultraviolet rays 33 from the second base material 31 side to cure the resin layer 32. Thereby, the resin layer 32 can be firmly attached to the film 3 to be processed. Then, as shown in FIG.3 (c), the 2nd base material 31 and the cured resin layer 32 are peeled. At this time, since the adhesion force between the film to be processed 3 and the release layer 2 is weaker than the adhesion force between the film to be processed 3 and the substrate 1, the film to be processed 3 on the release layer 2 is separated from the release layer 2. And transferred to the resin layer 32 side. Further, in the region where the release layer 2 is not formed, a part of the processed film 3 is transferred to the resin layer 32 side, but the processed film 3 remains on the substrate 1. Thereby, the film 3 to be processed on the release layer 2 is removed, and the film 3 to be processed is formed on the substrate 1 in a pattern.

  Here, “fluidity” or “fluid state” refers to a property or state in which the resin layer flows due to pressure when the resin layer and the film to be processed are brought into contact with each other.

In this case, since the adhesion between the work film and the release layer is weaker than the adhesion between the work film and the substrate, when peeling the resin laminate, the work film on the release layer is combined with the resin laminate. Can be removed. Therefore, the film to be processed on the release layer can be easily removed.
Hereafter, each process in the to-be-processed film removal process of this aspect is demonstrated.

(A) Contacting step In the contacting step in this aspect, a resin laminate in which a fluid resin layer is formed on the second substrate is used, and the resin layer of the resin laminate is brought into contact with the surface of the film to be processed. Let

The resin composition used for the resin layer in the resin laminate is not particularly limited as long as it can form a fluid resin layer. For example, an ionizing radiation curable resin composition, a thermosetting resin composition, and a thermoplastic resin. A composition can be mentioned.
Here, the “ionizing radiation curable resin composition” means a material that is cured by irradiation with ionizing radiation. "Ionizing radiation" refers to electromagnetic waves or charged particle beams having energy quanta that can polymerize or crosslink molecules. For example, in addition to ultraviolet rays and electron beams, electromagnetic waves such as visible light, X-rays, γ-rays, etc. And charged particle beams such as α rays.

  As the ionizing radiation curable resin composition, a monomer that is cured by ionizing radiation, a prepolymer, or an oligomer can be used. Examples of the monomer, prepolymer, and oligomer include ionizing radiation curable resins used for the primer layer described in Japanese Patent No. 4436441. A monomer and a prepolymer may be used individually by 1 type, may be used in mixture of 2 or more types, and may mix and use a monomer and a prepolymer.

  As a thermosetting resin composition, an epoxy resin, a phenol resin, a melamine resin, an unsaturated polyester resin, a urea resin etc. are mentioned, for example.

  Examples of the thermoplastic resin composition include acrylic resins such as polymethyl methacrylate, vinyl chloride-vinyl acetate copolymers, polyester resins, and polyolefin resins.

  The thickness of the resin layer is not particularly limited as long as a desired adhesion to the film to be processed can be obtained.

  The second substrate in the resin laminate may be any material that can support the resin layer. However, when the resin layer is cured by irradiating ultraviolet rays or the like in the curing step described below, the first substrate is used. The material is preferably light transmissive. For example, a glass substrate, a resin substrate, etc. can be mentioned. Moreover, the 2nd base material may have rigidity and may have flexibility. Further, the second substrate may be a single wafer or may be long. In the case of a long length, it becomes possible to remove the film to be processed continuously by a roll-to-roll method.

  When the resin layer of the resin laminate is brought into contact with the surface of the film to be processed, the resin layer is brought into a fluid state. For example, when using an ionizing radiation curable resin composition or a thermosetting resin composition, the curable resin composition may be applied on the second substrate. On the other hand, when using a thermoplastic resin composition, after applying a thermoplastic resin composition on a 2nd base material, it should just heat and make a curable resin layer into a softened state. The heating temperature at this time varies depending on the type of the thermoplastic resin composition and the like, but can be about 50 ° C. to 200 ° C., for example. In addition, the heating may be performed before bringing the resin layer into contact with the surface of the film to be processed, or may be performed simultaneously with bringing the resin layer into contact with the surface of the film to be processed using a heating roll or the like.

  As a method for bringing the resin layer of the resin laminate into contact with the surface of the film to be processed, any method that can press-bond the resin layer to the surface of the film to be processed may be used.

(B) Curing step In the curing step in this embodiment, the resin layer in contact with the film to be processed is cured.

  The method for curing the resin layer varies depending on the type of the resin composition. For example, when an ionizing radiation curable resin composition is used, a method of irradiating ionizing radiation is used, and when a thermosetting resin composition is used, a heating method is used. Moreover, when using a thermoplastic resin composition, the method of cooling is used.

  When the resin layer is cured, it is only necessary that the adhesion between the resin layer and the film to be processed can be within a desired range. For example, the resin layer may be completely cured or semi-cured. The adhesion between the resin layer and the film to be processed can be adjusted depending on the cured state of the resin layer.

(C) Peeling process In the peeling process in this aspect, the said resin laminated body is peeled. When the resin laminate is peeled off, the film to be processed on the release layer can be removed, and the film to be processed can be formed in a pattern on the substrate.
When peeling the resin laminate, the resin layer is set in a cured state. For example, when a thermoplastic resin composition is used, the resin layer may be kept cooled to such an extent that the fluidity of the resin layer is lost.

4). Applications The pattern forming method of the present invention includes, for example, formation of electrodes, semiconductor layers and insulating layers in semiconductor elements such as transistors and diodes, formation of electrodes and wiring in touch panel sensors, formation of back electrodes in solar cells, organic Formation of back electrode in EL element, formation of non-volatile memory electrode and polymer layer, formation of pressure sensor electrode and polymer layer, formation of wiring in wiring substrate, formation of colored layer and light shielding part in color filter, biochip Preparation etc. can be mentioned. In particular, the pattern forming method of the present invention can be suitably used for forming electrodes, wirings, and the like that require pattern miniaturization in electronic devices.

B. Pattern-forming substrate The pattern-forming substrate of the present invention comprises a substrate and a release layer that is formed in a pattern on the substrate and contains a release material. .

  FIG. 4 is a schematic cross-sectional view showing an example of the pattern forming substrate of the present invention. As illustrated in FIG. 4, the pattern forming substrate 40 includes a substrate 1 and a release layer 2 formed in a pattern on the substrate 1.

  The base material for pattern formation of this invention is used for the above-mentioned pattern formation method. By using the pattern forming substrate of the present invention, it is possible to perform high-definition patterning easily and inexpensively using a pattern-like release layer.

  In addition, since it described in detail in the said "A. pattern formation method 1. mold release layer formation process" about the base material and the mold release layer, description here is abbreviate | omitted.

C. Pattern forming apparatus The pattern forming apparatus of the present invention forms a film to be processed in a pattern on a substrate, and forms a release layer containing a release material on the substrate in a pattern. A layer forming means, a processed film forming means for forming a processed film on the substrate and the release layer, and a processed film removing means for removing the processed film on the release layer. It is characterized by.

  FIG. 5 is a schematic view showing an example of the pattern forming apparatus of the present invention. A pattern forming apparatus 60 illustrated in FIG. 5 includes a roll-shaped relief plate 10 that is a release layer forming means for forming the release layer 2 in a pattern on the substrate 1, and the substrate 1 and the release layer 2. A processing film forming means 50 for forming the processing film 3 and a processing film removing means 25 for removing the processing film 3 on the release layer 2 are provided. The convex plate 10 has a base 11 and a convex portion 12 formed on the base 11 in a pattern and having a release material on at least the surface. The base 11 and the convex portion 12 are integrally formed. . The processed film forming means 50 is a sputtering apparatus and includes a chamber 51, a target 52, and a stage 53. The processed film removing means 25 includes an adhesive laminate 20 in which an adhesive layer is formed on a second substrate, and an impression cylinder 26 that conveys the adhesive laminate 20 and contacts the surface of the processed film 3. .

  In this pattern forming apparatus 60, first, the release layer 2 is formed in a pattern on the substrate 1 by pressing the convex portions 12 of the relief plate 10 against the surface of the substrate 1. Next, the base material 1 on which the release layer 2 is formed is conveyed into the sputtering apparatus 50, and the film to be processed 3 is formed on the base material 1 and the release layer 2. Next, the base material 1 on which the release layer 2 and the processed film 3 are formed is unloaded from the sputtering apparatus 50, and the processed film 3 comes into contact with the pressure-sensitive adhesive laminate 20 conveyed by the impression cylinder 26. Thereby, the to-be-processed film 3 on the mold release layer 2 transfers to the adhesion laminated body 20 side, and the to-be-processed film 3 is formed in pattern shape on the base material 1. FIG.

  In the present invention, as described in the above “A. Pattern formation method”, high-definition patterning of a film to be processed can be performed easily and inexpensively.

  Hereinafter, each structure in the pattern formation apparatus of this invention is demonstrated.

1. Release layer forming means The release layer forming means in the present invention forms a release layer containing a release material in a pattern on a substrate.

  The release layer forming means is not particularly limited as long as the release layer can be formed in a pattern on the base material. For example, a convex portion having a release material on at least the surface on the substrate. Is applied in a pattern to a relief printing plate formed in a pattern, a coating machine for applying a release layer forming coating solution containing a release material, and a release layer forming coating solution containing a release material The thing etc. which have a coating machine and the patterning means which patterns a mold release layer are mentioned.

  Especially, it is preferable that a mold release layer formation means has a letterpress. By pressing the convex portion of the relief plate against the surface of the substrate, the release material on the surface of the convex portion is transferred to the surface of the substrate, and the release layer can be formed in a pattern on the substrate. Therefore, a patterned release layer can be formed easily and efficiently, and further productivity improvement and cost reduction are possible. Further, by forming the convex portions in a fine pattern, it becomes possible to pattern the film to be processed with high definition.

In the above case, the release layer forming means has a relief plate and a moving means for moving the relief plate so as to contact the substrate surface. When the relief plate is in a roll shape, the relief plate also serves as a moving means. On the other hand, when the relief plate is plate-like, moving means is provided for holding the relief plate and moving the relief plate so as to contact the substrate surface.
Since the relief printing plate is described in detail in the above “A. Pattern formation method”, the description is omitted here.

  The coating machine for applying the release layer forming coating liquid in a pattern may be any coating machine that can apply the release layer forming coating liquid in a pattern on a substrate, for example, inkjet printing. And a screen printing machine.

The coating machine for applying the release layer forming coating solution may be any coating machine that can apply the release layer forming coating solution to the entire surface of the substrate. For example, a spin coater or a die coater. It can be appropriately selected from general coating machines such as a bar coater.
Any patterning means may be used as long as it can pattern the release layer, and examples thereof include a laser device.

2. Processed film forming means The processed film forming means in the present invention forms a processed film on the substrate and the release layer.

  The film forming means is appropriately selected according to the material of the film to be processed. For example, a PVD apparatus such as a sputtering apparatus or a vacuum evaporation apparatus, a CVD apparatus, or a film forming coating liquid is applied. Examples include a coating machine. Especially, it is preferable that a to-be-processed film formation means is a PVD apparatus and a CVD apparatus. This is because a film to be processed having good adhesion to the substrate can be obtained. Thereby, peeling of the to-be-processed film from the base material in the below-mentioned to-be-processed film removal means can be suppressed.

  The coating machine is not particularly limited as long as it can apply the release layer forming coating solution to the entire surface of the base material. For example, a spin coater, die coater, bar coater, etc. You can choose.

3. Workpiece film removal means The workfilm removal means in the present invention removes the work film on the release layer.

  The work film removal means is not particularly limited as long as it can remove the work film on the release layer and leave the work film in a region where the release layer is not formed. Either of the two embodiments is preferred.

(1) Third Aspect The film removal means of this aspect comprises an adhesive laminate in which an adhesive layer is formed on a first substrate, and the adhesive layer of the adhesive laminate contacts the surface of the workpiece film. And a moving means for moving the adhesive laminate.

  For example, the processed film removing means 25 shown in FIG. 5 includes an adhesive laminate 20 in which an adhesive layer is formed on a first substrate, and an impression cylinder 26 that holds and conveys the adhesive laminate 20. In this example, the impression cylinder 26 is a moving means. By contacting the pressure-sensitive adhesive layer 20 of the pressure-sensitive adhesive laminate 20 with the surface of the film to be processed 3 and transporting the pressure-sensitive adhesive laminate 20, the film to be processed 3 on the release layer 2 is transferred to the pressure-sensitive adhesive laminate 20 side. The film 3 to be processed is formed in a pattern on the substrate 1.

In this case, since the adhesion between the work film and the release layer is weaker than the adhesion between the work film and the substrate, when peeling the adhesive laminate, the work film on the release layer is attached together with the adhesive laminate. Can be removed. Therefore, the film to be processed on the release layer can be removed by a simple method.
Hereinafter, each structure in the to-be-processed film removal means of this aspect is demonstrated.

(A) Adhesive Laminate The adhesive laminate has been described in detail in the above “A. Pattern Forming Method”, and the description thereof is omitted here.

(B) Moving means A moving means moves the said adhesion laminated body so that the said adhesion layer of the said adhesion laminated body may contact the said to-be-processed film surface.
The moving means is not particularly limited as long as the pressure-sensitive adhesive layer of the pressure-sensitive adhesive laminate can be pressure-bonded to the surface of the film to be processed, and examples thereof include an impression cylinder that holds and conveys the pressure-sensitive adhesive laminate.

(2) Fourth Aspect The film removal means of this aspect includes a resin laminate in which a fluid resin layer is formed on a second substrate, and the resin layer of the resin laminate is the workpiece film. Means for moving the resin laminate so as to be in contact with the surface and curing means for curing the resin layer in contact with the film to be processed.

  FIGS. 6A to 6D are process diagrams showing an example of a film removal process using the film removal means of this embodiment. As shown in FIGS. 6A to 6D, the film removal means includes a coating machine 37 that applies a resin composition on the second base material 31, and fluidity on the second base material 31. The resin layered body 30 having the resin layer 32 formed thereon, the transport rolls 36a to 36d that hold and transport the resin layered body 30, and the resin layered body 30 from the second base material 31 side toward the processed film 3 A pressing roll 34 for pressing and a curing means 35 for curing the resin layer 32 by irradiating ultraviolet rays or the like are provided. In this example, the conveying rolls 36c and 36d and the pressing roll 34 are moving means.

  First, as shown to Fig.6 (a), the resin composition 32 is apply | coated with the coating machine 37 on the 2nd base material 31 conveyed with the conveyance rolls 36a-36d, and the resin layer 32 which has fluidity | liquidity is formed. To do. Next, as shown in FIG. 6B, the application of the resin composition by the coating machine 37 is stopped, and the transport rolls 36 c and 36 d and the pressing roll 34 are used until the resin layer 32 contacts the film to be processed 3. Then, the resin laminate 30 is moved. For example, at least one of the pair of transport rolls 36 c and 36 d moves toward the workpiece film 3. Thereafter, the pressing roll 34 presses the resin laminate 30 toward the film 3 to be processed from the second base material 31 side. Thereby, the resin layer 32 adheres to the surface of the film 3 to be processed. Subsequently, as illustrated in FIG. 6C, the curing unit 35 irradiates the resin layer 32 with ultraviolet rays 33 from the second base material 31 side to cure the resin layer 32. Thereby, the resin layer 32 can be firmly attached to the film 3 to be processed. Next, as shown in FIG. 6D, the second base material 31 and the cured resin layer 32 are peeled off. At this time, since the adhesion force between the film to be processed 3 and the release layer 2 is weaker than the adhesion force between the film to be processed 3 and the substrate 1, the film to be processed 3 on the release layer 2 is separated from the release layer 2. And transferred to the resin layer 32 side. Further, in the region where the release layer 2 is not formed, a part of the processed film 3 is transferred to the resin layer 32 side, but the processed film 3 remains on the substrate 1. Thereby, the film 3 to be processed on the release layer 2 is removed, and the film 3 to be processed is formed on the substrate 1 in a pattern.

In this case, since the adhesion between the work film and the release layer is weaker than the adhesion between the work film and the substrate, when peeling the resin laminate, the work film on the release layer is combined with the resin laminate. Can be removed. Therefore, the film to be processed on the release layer can be easily removed.
Hereinafter, each structure in the to-be-processed film removal means of this aspect is demonstrated.

(A) Resin Laminate Since the resin layer laminate has been described in detail in the above “A. Pattern Forming Method”, description thereof is omitted here.

  As the resin laminate, a resin laminate in which a resin layer is previously formed on the second substrate may be used. In this case, since the resin layer is generally covered with a release sheet or the like, the film removal means for processing can have means for removing the release sheet.

  Moreover, the to-be-processed film removal means may have the coating machine 37 which apply | coats a resin composition on the 2nd base material 31, as illustrated to Fig.6 (a). In this case, it is possible to control the time from when the resin layer is formed by the coating machine until the resin layer comes into contact with the film to be processed and the surrounding environment. Therefore, it is possible to adjust the characteristics of the resin layer, for example, the fluidity when contacting the film to be processed.

  In the coating machine 37, as shown to Fig.6 (a), a resin composition is apply | coated until the resin composition spreads over the area | region facing the to-be-processed film 3 among the 2nd base materials 31 at least. Thereafter, as shown in FIG. 6B, the application of the resin composition in the coating machine 37 may be stopped.

  If the film removal means has a coating machine, and the solvent is contained in the resin composition applied by the coating machine, the solvent in the resin composition is removed downstream of the coating machine. A drying means may be further provided. Thereby, the fluidity | liquidity of the resin layer at the time of reaching | working a to-be-processed film can be adjusted appropriately, improving the coating performance at the time of application | coating of the resin composition by a coating machine.

  In addition, in order to make the drying of a solvent unnecessary, the resin composition may contain at least 1 type of monomer. Thereby, even if it is a case where the solvent is not contained in the resin composition, sufficient coating performance and appropriate fluidity | liquidity of a resin composition can be ensured. That is, a so-called solventless resin composition can be employed. As a result, since a drying process becomes unnecessary, the number of processes and equipment can be reduced, thereby reducing manufacturing costs.

(B) Moving means A moving means moves the said resin laminated body so that the said resin layer of the said resin laminated body may contact the said to-be-processed film surface.
The moving means is not particularly limited as long as it can press-bond the resin layer of the resin laminate to the surface of the film to be processed. For example, as shown in FIGS. 3 having a pair of transport rolls 36 c and 36 d transported along the direction 3, and a pressing roll 34 that presses the resin laminate 30 toward the film 3 to be processed from the second base material 31 side. The pressing roll may be configured to press the resin laminate toward the film to be processed while rotating between the pair of transport rolls. Thereby, even if the base material on which the release layer and the processed film are formed is in a stationary state, the processed film on the release layer can be transferred to the resin layer side.

(C) Curing unit The curing unit cures the resin layer in contact with the film to be processed.
The curing means varies depending on the type of the resin composition. For example, when an ionizing radiation curable resin composition is used, irradiation means for irradiating ionizing radiation such as ultraviolet rays or electron beams is used, and when a thermosetting resin composition is used, heating means such as a heater is used. Moreover, when using a thermoplastic resin composition, a cooling means is used.

  The arrangement of the irradiation means, the heating means, and the cooling means is appropriately set according to the configurations of the second base material, the base material, the release layer, and the film to be processed. For example, when the second substrate has light permeability, the irradiation means can be arranged so as to irradiate the resin layer with ultraviolet rays or the like through the second substrate. In addition, when the base material, the release layer, and the film to be processed are light transmissive, the irradiating means is disposed so as to irradiate the resin layer with ultraviolet rays or the like through the base material, the release layer, and the film to be processed. Can do. The irradiation unit may irradiate the resin layer with ultraviolet rays or the like while moving following the pressing roll between the pair of transport rolls. A heating means may heat a resin layer, moving following a press roll between a pair of conveyance rolls. The cooling means may cool the resin layer while moving following the pressing roll between the pair of transport rolls.

  In general, curing with ionizing radiation can be completed more quickly than curing with heating. Therefore, in order to increase the throughput when removing the film to be processed, the curing unit is preferably an irradiation unit that irradiates ionizing radiation.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

  The following examples illustrate the present invention in more detail.

[Example 1]
First, the blanket which has polydimethylsiloxane as a main component was pressed on the base material, and it verified by the system which forms a release layer on a base material.
A polycarbonate film was used as the substrate. As the polycarbonate film, a pre-treatment and a non-implemented VUV treatment for 3 minutes using an excimer irradiation unit manufactured by USHIO INC. Were used. First, a blanket of 30 mm □ was formed by pressing a blanket against the substrate. At this time, the thickness of the release layer was adjusted by the thickness of the blanket and the number of pressings. Next, a silver palladium copper alloy (APC) was formed on the base material and the release layer by a sputtering method so as to have a thickness of 100 nm, thereby forming a film to be processed. Thereafter, a grid of 5 vertical x 5 horizontal was formed at intervals of 1 mm using a cutter in a 30 mm square frame. Next, the substrate surface formed up to the film to be processed was traced while applying a load of 2 kg with a clean roller YC-12P manufactured by Showa Trading Co., Ltd., and the film to be processed formed on the release layer was removed.

The peeling rate of the work film on the release layer was measured. The peeling rate of the film to be processed was calculated by counting the number of the films to be processed that were removed from the total 25 squares that were cut. That is, the peeling rate was calculated by the following formula.
(Peeling rate) = (number of processed films removed) × 4
The results are shown in Table 1.

  In either case, the film to be processed could be removed.

[Example 2]
Next, it verified by the system which forms a mold release layer by the die-coating method.
A polycarbonate film was used as the substrate. A polycarbonate film that was not subjected to VUV treatment was used. First, a silicone oil KF96 manufactured by Shin-Etsu Chemical Co., Ltd. was coated on the substrate by a die coating method to form a solid release layer of 30 mm □. Next, a silver palladium copper alloy (APC) was formed on the base material and the release layer by a sputtering method so as to have a thickness of 100 nm, thereby forming a film to be processed. Next, the processed film on the release layer was removed in the same manner as in Example 1.

  In the same manner as in Example 1, the peeling rate of the film to be processed on the release layer was measured. The results are shown in Table 2.

  In either case, the film to be processed could be removed. However, when the thickness of the release layer is 3000 nm or more, it is expected that it is difficult to form another layer on the processed film because a thick release layer remains in the processed film removal portion.

DESCRIPTION OF SYMBOLS 1 ... Base material 2 ... Release layer 3 ... Workpiece film 10 ... Letterpress 11 ... Base 12 ... Convex part 20 ... Adhesive laminated body 21 ... 1st base material 22 ... Adhesive layer 30 ... Resin laminated body 31 ... 2nd base material 32 ... Resin layer 40 ... Base material for pattern formation

Claims (10)

A release layer forming step of forming a release layer containing a release material on the substrate in a pattern,
A film forming process for forming a film to be processed on the substrate and the release layer;
And a process film removing step of removing the process film on the release layer, and forming the process film on the substrate in a pattern.   In the release layer forming step, using a relief plate in which a convex portion having the release material at least on the surface is formed in a pattern on the substrate, the convex portion of the relief plate is pressed against the substrate surface. The pattern forming method according to claim 1, wherein:   The pattern forming method according to claim 2, wherein the convex portion contains silicone rubber.   The pattern forming method according to claim 1, wherein the release material is silicone.   The pattern forming method according to claim 4, wherein the silicone is a low molecular weight polysiloxane.   The process film removing step uses a pressure-sensitive adhesive laminate in which a pressure-sensitive adhesive layer is formed on a first substrate, and a contact step in which the pressure-sensitive adhesive layer of the pressure-sensitive adhesive laminate is brought into contact with the surface of the film to be processed; A pattern forming method according to claim 1, further comprising a peeling step for peeling the body.   The process film removing step uses a resin laminate in which a resin layer having fluidity is formed on a second substrate, and a contact step of bringing the resin layer of the resin laminate into contact with the process film surface; 6. The method according to claim 1, further comprising a curing step of curing the resin layer in contact with the film to be processed, and a peeling step of peeling the resin laminate. Pattern forming method. A substrate;
A pattern-forming substrate comprising: a release layer formed in a pattern on the substrate and containing a release material.   9. The pattern forming substrate according to claim 8, wherein the release material is silicone.   The substrate for pattern formation according to claim 9, wherein the silicone is a low molecular weight polysiloxane.

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