JP2016071533A - Method for manufacturing touch panel sensor, touch panel sensor, touch panel and touch panel display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a touch panel sensor whose metal wiring is unlikely to be visually confirmed, and which is excellent in conductivity between a sensor substrate and a controller substrate; a touch panel sensor manufactured by the method; and a touch panel and a touch panel display device that comprise the touch panel sensor.SOLUTION: A method for manufacturing a touch panel sensor that is connected to a controller substrate comprises: a metal pattern forming step of forming on a substrate a wiring pattern for a touch sensor, a lead-out wiring pattern connected to the wiring pattern for a touch sensor, and a pattern for connection with a controller substrate connected to the lead-out wiring pattern, and forming a metal pattern of each of the patterns, which includes a metal surface on a surface of the pattern, opposite to the substrate; an oxidizing step of oxidizing the metal surface of the wiring pattern for a touch sensor without oxidizing the metal surface of the pattern for connection; and a connection step of connecting the pattern for connection with the controller substrate.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing a touch panel sensor, a touch panel sensor, a touch panel, and a touch panel display device.

2. Description of the Related Art In recent years, touch panel type input devices have been adopted for operation units of various electronic devices such as mobile phones, personal digital assistants, car navigation systems. A touch panel type input device is used as an input device that detects a contact position of a fingertip or a pen tip on a display surface of a display panel such as a liquid crystal display device or an organic electroluminescence (EL) device. . There are various types of touch panel type input devices such as a resistance film type and a capacitance type depending on the structure and detection method.
As a conventional method for manufacturing a touch panel sensor, methods described in Patent Documents 1 and 2 are known.

JP2013-214185A JP 2013-206315 A

Usually, a touch panel is formed with a wiring pattern for a touch sensor made of ITO (Indium Tin oxide). However, since the resistance of the ITO wiring is too high, if the peripheral wiring such as the lead-out wiring is formed of ITO, there is a disadvantage that it is not suitable for a large screen.
Therefore, in order to cope with an increase in size, a lead wiring for connecting a flexible printed circuit board (FPC) on which an integrated circuit (IC) for position detection is mounted and a touch sensor board is formed by a metal wiring, and the touch panel Drawing around the substrate periphery (non-display area) was performed. However, an ITO electrode is formed in the display portion and a metal wiring is formed in the non-display portion, so that the process is complicated and the cost tends to increase.
For these reasons, as disclosed in Patent Document 1, research for forming a wiring pattern using a metal having excellent electrical conductivity in both the display portion and the non-display portion is being actively promoted. However, since this method forms a metal wiring pattern on the display portion, there is a problem of visibility in which the metal wiring is recognized by the user's eyes.
Therefore, as disclosed in Patent Document 2, an attempt has been made to improve the visibility by oxidizing the surface of the copper wiring to copper oxide and blackening it. However, when the present inventors have tried, the visibility of the display portion can be improved by blackening the metal wiring in this way, but there is a problem that the conductivity of the connection portion between the sensor substrate and the FPC is deteriorated. It was found to occur.

  Problems to be solved by the present invention include a method for manufacturing a touch panel sensor in which metal wiring is difficult to be visually recognized and has excellent conductivity between a sensor substrate and a controller substrate, a touch panel sensor manufactured by the manufacturing method, and the touch panel sensor. It is providing a touch panel and a touch panel display device provided with.

The above-described problems of the present invention have been solved by means described in the following <1> or <11> to <13>. It is described below together with <2> to <10> which are preferred embodiments.
<1> A method for manufacturing a touch panel sensor connected to a controller board, wherein a touch sensor wiring pattern, a lead wiring pattern connected to the touch sensor wiring pattern, and the lead wiring pattern are formed on the board. Forming a connection pattern with the controller board connected to the touch panel, wherein the touch sensor wiring pattern, the lead-out wiring pattern, and the connection pattern with the controller board are opposite to the board. A metal pattern forming step including at least a part of a metal surface, and a blackening step of blacking the metal surface included in the wiring pattern for the touch sensor without blackening the metal surface included in the pattern for connection with the controller board. And a connection pattern for the controller board and the controller board Method for producing a touch panel sensor, characterized in that it comprises a connection step of connecting,
<2> Before the metal pattern forming step, a resist layer forming step of forming a resist layer on the metal surface of the substrate having a metal surface on at least one surface; and the resist layer is formed into a pattern by a photolithography method. A resist pattern forming step for processing and exposing at least a part of the metal surface, wherein the metal pattern forming step removes the exposed metal surface by etching, the wiring pattern for the touch sensor, and the lead-out pattern The touch panel sensor according to <1>, which is a step of forming a wiring pattern and a pattern for connecting to the controller board, and includes a resist removal step of removing the patterned resist after the metal pattern formation step. Manufacturing method,
<3> The metal pattern forming step is a step of collectively forming the touch sensor wiring pattern, the lead-out wiring pattern, and the connection pattern to the controller board. <1> or <2> A method for manufacturing the touch panel sensor according to claim 1,
<4> The method for producing a touch panel sensor according to any one of <1> to <3>, wherein the blackening step is a step of blackening using a blackening treatment liquid.
<5> The blackening process includes a processing liquid application process in which the blackening treatment liquid is applied onto the wiring pattern for the touch sensor without applying the blackening treatment liquid onto the pattern for connection to the controller substrate, and the blackening process. Any one of <1> to <4>, including a blackening treatment step for blackening a metal surface provided in the wiring pattern for the touch sensor with a liquid and a treatment liquid removal step for removing the blackening treatment liquid A method for manufacturing the touch panel sensor according to claim 1,
<6> The blackening step blackens the metal surface included in the touch sensor wiring pattern by the protective layer forming step of forming a protective layer on the connection pattern with the controller substrate and the blackening treatment liquid. A blackening treatment step to be processed, a treatment liquid removal step to remove the blackening treatment liquid,
A method for producing a touch panel sensor according to any one of <1> to <4>, including a protective layer removing step of removing the protective layer.
<7> Any one of <1> to <6>, wherein a metal material included in the touch sensor wiring pattern, the lead-out wiring pattern, and the connection pattern with the controller board is copper or silver. Manufacturing method of the touch panel sensor as described in
<8> Any one of <1> to <7>, wherein a metal material included in the wiring pattern for the touch sensor, the wiring pattern for the lead, and the connection pattern for the controller board is copper. A manufacturing method of the touch panel sensor according to claim,
<9> The process of <1> to <7>, wherein the blackening step is a step of blackening by oxidizing, sulfurating, or chlorinating at least a part of a metal surface included in the wiring pattern for the touch sensor. A method for manufacturing the touch panel sensor according to any one of the above,
<10> The method for producing a touch panel sensor according to <8>, wherein the blackening step is a step of blackening by oxidizing or sulfurating at least a part of a metal surface included in the wiring pattern for the touch sensor.
<11> Touch panel sensor manufactured by the method for manufacturing a touch panel sensor according to any one of <1> to <10>,
<12> A touch panel provided with a touch panel sensor manufactured by the method for manufacturing a touch panel sensor according to any one of <1> to <10>,
<13> A touch panel display device including a touch panel sensor manufactured by the method for manufacturing a touch panel sensor according to any one of <1> to <10>.

  ADVANTAGE OF THE INVENTION According to this invention, the metal wiring is hard to be visually recognized, the manufacturing method of the touch panel sensor excellent in the continuity of a sensor board | substrate and a controller board | substrate, the touch panel sensor manufactured by the said manufacturing method, and the touch panel provided with the said touch panel sensor And a touch panel display device could be provided.

It is a simplified schematic diagram which shows an example of the touch panel sensor of this invention. It is a simplified schematic diagram which shows another example of the touchscreen sensor of this invention. 1 shows a conceptual diagram of a configuration of an example of an organic EL display device. A schematic cross-sectional view of a substrate in a bottom emission type organic EL display device is shown, and a planarizing film 4 is provided. It is a composition conceptual diagram of an example of a touch panel display device of the present invention.

Hereinafter, the contents of the present invention will be described in detail. The description of the constituent elements described below may be made based on typical embodiments of the present invention, but the present invention is not limited to such embodiments.
In the present invention, the description of “lower limit to upper limit” representing a numerical range represents “lower limit or higher and lower limit or lower”, and the description of “upper limit to lower limit” represents “lower limit or higher and lower limit or higher”. That is, it represents a numerical range including an upper limit and a lower limit.
In the present invention, the “resist layer forming step of forming a resist layer on a metal film formed on a substrate” or the like is also simply referred to as “resist layer forming step” or the like.
Furthermore, in the description of the group (atomic group) in this specification, the description which does not describe substitution and non-substitution includes what does not have a substituent and what has a substituent. For example, the “alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
In the present invention, “mass%” and “wt%” are synonymous, and “part by mass” and “part by weight” are synonymous.
In the present invention, a combination of two or more preferred embodiments is a more preferred embodiment.

(Manufacturing method of touch panel sensor and touch panel sensor)
The touch panel sensor manufacturing method of the present invention is a touch panel sensor manufacturing method connected to a controller board, wherein a touch sensor wiring pattern and a lead wiring pattern connected to the touch sensor wiring pattern are formed on the substrate. And a connection pattern with the controller board connected to the lead wiring pattern, the touch sensor wiring pattern, the lead wiring pattern, and the connection pattern with the controller board. The metal pattern provided in the touch sensor wiring pattern without blackening the metal surface provided in the metal pattern provided in the at least part of the surface opposite to the substrate in the metal substrate and the connection pattern with the controller board The blackening process for blackening the controller board and And connecting patterns, characterized by comprising a connecting step of connecting a controller substrate.
In addition, the touch panel sensor manufacturing method of the present invention is a touch panel sensor manufacturing method connected to a controller substrate, wherein a resist layer is formed on the metal surface of the substrate having a metal surface on at least one surface. Forming step, resist pattern forming step of processing the resist layer into a pattern by a photolithography method to expose at least a part of the metal surface, a wiring pattern for touch sensor on the substrate, and the wiring for touch sensor Forming a lead wiring pattern connected to the pattern and a connection pattern to the controller board connected to the lead wiring pattern, the touch sensor wiring pattern, the lead wiring pattern, and , In the connection pattern with the controller board A metal pattern forming step having a metal surface on at least a part of the opposite surface, a resist removing step of removing the patterned resist, and a metal surface provided in the pattern for connecting to the controller board without blackening Preferably, the method includes a blackening step of blackening a metal surface included in the wiring pattern for the touch sensor, a connection step of connecting the pattern for connection with the controller substrate, and the controller substrate.
The touch panel sensor of the present invention is a touch panel sensor manufactured by the method for manufacturing a touch panel sensor of the present invention.
Moreover, the touch panel of this invention is a touch panel provided with the touch panel sensor manufactured by the manufacturing method of the touch panel sensor of this invention.

In the touch panel sensor of the present invention, a touch sensor wiring pattern, a lead-out wiring pattern, and a connection pattern for connecting to a controller substrate are formed on a substrate and connected to the controller substrate.
These patterns may be provided only on one side of the substrate, or may be provided on both sides of the substrate.
The touch panel sensor of the present invention may be either a capacitance type or a resistance film type, but is preferably a capacitance type touch panel sensor.
As the capacitive touch panel sensor, for example, a surface capacitive type or a projected capacitive type can be preferably cited.
This will be described below with reference to the drawings.
FIG. 1 is a simplified schematic diagram illustrating an example of a touch panel sensor of the present invention.
In the touch panel sensor 10 in FIG. 1, a touch sensor wiring pattern 14 is formed at the center of the substrate 12, and a lead wiring pattern 16 connected to the touch sensor wiring pattern 14 is formed around the touch sensor wiring pattern 14. At the end, a connection pattern 18 for connection to the controller board connected to the lead-out wiring pattern 16 is formed. The connection pattern 18 is connected to a controller board (not shown).
The touch sensor wiring pattern 14 is formed with a grit-like pattern in which wirings cross obliquely. A lead wiring pattern 16 is connected to the end of the wiring.
Further, the touch sensor wiring pattern 14 is formed in a portion to be the display unit 20 in the touch panel.
Furthermore, it is preferable that the surface of the touch sensor wiring pattern 14 visible from the display unit 20 side is blackened.

FIG. 2 is a simplified schematic diagram illustrating another example of the touch panel sensor of the present invention.
In the touch panel sensor 10 in FIG. 2, the touch sensor wiring pattern 14 is formed by arranging a plurality of strip-shaped metal meshes in the center of the substrate 12, and is connected to the touch sensor wiring patterns 14 on both sides of each metal mesh. A lead wiring pattern 16 is formed, and a connection pattern 18 to the controller board connected to the lead wiring pattern 16 is formed at the end of the substrate 12. The connection pattern 18 is connected to a controller board (not shown).
Furthermore, in FIG. 2, it is preferable that the surface of each metal mesh of the touch sensor wiring pattern 14 is blackened.

<Material of wiring>
The touch sensor wiring pattern, the lead-out wiring pattern, and the connection pattern with the controller board in the touch panel sensor of the present invention are metal wiring patterns having a metal surface at least in part. High metal is preferred. For example, aluminum, titanium, chromium, manganese, iron, nickel, copper, zinc, molybdenum, silver, tungsten, platinum, gold and the like can be exemplified, and alloys thereof may be used. Among them, from the viewpoints of conductivity, patterning properties, and blackening treatment ease, a metal selected from the group consisting of silver, copper, aluminum, titanium, chromium, molybdenum, and alloys thereof is preferable, silver, copper, Or these alloys are more preferable, silver or copper is still more preferable, and copper is especially preferable. In the present invention, for example, a silver alloy is an alloy containing silver as a main component. The metal other than the main component in the alloy is not particularly limited, but is preferably the metal described above.
In addition, the metal wiring in the touchscreen sensor of this invention may be carry | supported by the aspect with which the said metal was disperse | distributed to the organic material as a metal particle, or the organic material. From the viewpoint of conductivity, the mass ratio of the organic substance in the metal wiring is preferably 20% by mass or less, more preferably 5% by mass or less, and most preferably no organic material.

<Wiring pattern for touch sensor>
The touch sensor wiring pattern is a wiring pattern of a portion that functions as a touch sensor by detecting the approach, contact, pressing, or the like of a finger or a pen by a current change or a capacitance change.
The touch sensor wiring pattern in the touch panel sensor of the present invention is formed of metal wiring and is subjected to a blackening process described later.
The pattern shape of the touch sensor wiring pattern is not particularly limited, and examples thereof include a stripe shape and a grid shape (mesh shape). It does not necessarily need to be linear, and may be wavy or polygonal.
Moreover, each wiring of the wiring pattern is insulated from each other. For example, when wirings overlap vertically on a substrate, an insulating layer is preferably formed between the wirings.
The line width of the wiring is preferably 0.2 to 20 μm, more preferably 1.0 to 10 μm, and still more preferably 1.0 to 4.0 μm, from the viewpoint of visibility and conductivity.
Further, from the viewpoint of the shadow of the wiring (the shadow of the wiring being visible when the panel is lit), the line width of the wiring is preferably 10 μm or less, more preferably 5.0 μm or less, and even more preferably 3.0 μm or less.
The thickness of the wiring is preferably 0.05 to 20 μm, more preferably 0.10 to 10 μm, and still more preferably 0.15 to 4.0 μm, from the viewpoints of conductivity and pattern defect prevention.
Moreover, from the viewpoint of pattern defect prevention and visibility, the value of the wiring thickness / line width is preferably 0.01 to 10, more preferably 0.05 to 3, and still more preferably 0.2 to 3.
The wiring pitch (distance between the centers of adjacent wirings) is preferably 25 μm or more, preferably 50 μm or more, and more preferably 100 μm or more from the viewpoint of visibility. Moreover, from a viewpoint of touch resolution, 1,000 micrometers or less are preferable, 500 micrometers or less are more preferable, and 200 micrometers or less are still more preferable.

<Drawer wiring pattern>
The lead-out wiring pattern is a portion that connects the touch sensor wiring pattern and the connection pattern to the controller board. In the final product, this portion is generally shielded and is not visually recognized (for example, a decorative portion or a frame portion).
The lead-out wiring pattern in the touch panel sensor of the present invention is formed of a metal wiring, and may or may not be subjected to a blackening process described later.
The pattern shape of the lead-out wiring pattern is not particularly limited and may be any shape as desired.
There is no particular limitation on the width of the wiring, and it may be formed with a width that can provide sufficient electrical conductivity.
The thickness of the wiring is not particularly limited, but is preferably 0.05 to 40 μm, more preferably 0.1 to 20 μm, still more preferably 0.2 to 8.0 μm, from the viewpoint of conductivity and pattern defect prevention. 0.5-4.0 micrometers is especially preferable.

<Pattern for connection with controller board>
The connection pattern with the controller board is a part for connecting the touch panel sensor board and a controller board having an IC or the like for performing drive control of the touch sensor.
The connection pattern with the controller board in the touch panel sensor of the present invention is formed by metal wiring and is not subjected to a blackening process described later.
The pattern shape of the connection pattern is not particularly limited and may be any shape as desired, but is preferably provided at an end portion on the substrate.
The width and thickness of the wiring are not particularly limited, and may be formed with a width and thickness that can provide sufficient electrical conductivity between the controller substrate and the touch panel sensor substrate.

<Controller board>
The controller board is a board provided with an IC or the like that performs drive control of the touch sensor, and has a plurality of electrodes that at least electrically connect each electrode in the connection pattern with the controller board.
The controller board is not particularly limited as long as the touch sensor can be driven and controlled, and a known controller board can be used. For example, a touch panel controller described in Japanese Patent Application Laid-Open No. 2014-13513 and Japanese Patent No. 3454579 can be given.

<Board>
Although there is no restriction | limiting in particular as a board | substrate which can be used for this invention, It is preferable that it is a transparent substrate. As the transparent substrate, a known transparent substrate can be used. For example, glass, quartz, various organic films, etc. can be mentioned.
Examples of the material of the organic film include a resin and a resin composite material.
The resins include polybutylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, polybutylene naphthalate, polystyrene, polycarbonate, polysulfone, polyethersulfone, polyarylate, allyl diglycol carbonate, polyamide, polyimide, polyamideimide, polyetherimide, poly Fluorine resins such as benzoxazole, polybenzazole, polyphenylene sulfide, polycycloolefin, norbornene resin, polychlorotrifluoroethylene, liquid crystal polymer, acrylic resin, epoxy resin, silicone resin, ionomer resin, cyanate resin, cross-linked fumaric acid diester resin , Cyclic polyolefin, aromatic ether resin, maleimide-olefin resin, cellulose, episulfur I de resin, and the like.
As the substrate, a glass substrate is preferable from the viewpoint of dimensional accuracy and transparency, and an organic film substrate is preferable from the viewpoint of lightness, resistance to cracking, and flexibility. A so-called roll-to-roll manufacturing method can be suitably employed for the organic film.

<Metal pattern formation process>
The touch panel sensor manufacturing method according to the present invention includes a touch sensor wiring pattern, a lead wiring pattern connected to the touch sensor wiring pattern, and a controller board connected to the lead wiring pattern on the substrate. Forming a connection pattern, wherein a metal surface is provided on at least a part of the surface opposite to the substrate in the connection pattern for the touch sensor, the lead-out wiring pattern, and the connection pattern with the controller substrate. Including a metal pattern forming step.
There are no particular restrictions on the method of forming the touch sensor wiring pattern, the lead wiring pattern, and the connection pattern with the controller substrate, but a method of forming a metal pattern by the inkjet method and etching of the metal film Preferably, a method of forming a metal pattern is used.
There is no restriction | limiting in particular as a method of forming a metal pattern by the inkjet method, A well-known method can be used and a metal ink or a metal nano ink can be used conveniently.
The inkjet printing method can use a known inkjet printing method and a known inkjet coating apparatus, and is not particularly limited.
Specific examples of the inkjet coating apparatus include on-demand inkjet coating apparatuses IJ-DESK-S, IJ-DESK-H (manufactured by PMT Co., Ltd.), DIMADIX Material Printer DMP-2831, DMP-3000 (FUJIFILM Dimatix). Etc.).
Examples of the ink jet coating apparatus that can be used in the present invention include an apparatus including a composition supply system and a temperature sensor.
The composition supply system includes, for example, an original tank, supply piping, a composition supply tank immediately before the inkjet head, a filter, and a piezo-type inkjet head. The piezo-type inkjet head preferably has a multi-size dot of 1 to 100 pl, more preferably 8 to 30 pl, preferably 320 × 320 to 4,000 × 4,000 dpi (dot per inch), more preferably 400 × 400. It can be driven so that it can discharge at a resolution of ˜1,600 × 1,600 dpi, more preferably 720 × 720 dpi. In the present invention, dpi represents the number of dots per 2.54 cm.
As the metal ink, a known metal ink or metal nano ink can be suitably used. For example, an ink in which the above-described metal is dispersed in the form of particles can be exemplified. Specific examples include conductive silver ink REXALPHA (manufactured by Toyochem Co., Ltd.), FlowMetal (manufactured by Bando Chemical Co., Ltd.), and the like.

As a method for forming a metal pattern by etching a metal film, the following method is preferably exemplified.
That is, it includes a resist layer forming step and a resist pattern forming step, which will be described later, wherein the metal pattern forming step removes the exposed metal surface by etching, the touch sensor wiring pattern, the lead-out wiring pattern, and the controller. It is a step of forming a pattern for connection with the substrate, and is preferably a method including a resist removing step described later after the metal pattern forming step.
There is no restriction | limiting in particular in the etching in a metal pattern formation process, A well-known etching method can be used.
In addition, the etching in the metal pattern forming step may be wet etching or dry etching, but is preferably wet etching from the viewpoint of cost.
Moreover, there is no restriction | limiting in particular also about etching conditions, It can carry out by arbitrary temperature, time, and atmosphere.
There is no restriction | limiting in particular as an etching liquid used for wet etching, A well-known etching liquid can be used, What is necessary is just to select suitably according to the material of the metal film to be used, and the material of a resist. For example, the etching liquid composition described in Unexamined-Japanese-Patent No. 2013-89731 or Unexamined-Japanese-Patent No. 2011-228618 is mentioned suitably. Specific examples include an aqueous iron chloride solution and hydrofluoric acid.
Also, the metal pattern forming step is preferably a step of collectively forming a touch sensor wiring pattern, a lead-out wiring pattern, and a connection pattern with the controller substrate from the viewpoint of process simplicity.

<Blackening process>
The manufacturing method of the touch panel sensor of the present invention includes a blackening step of blackening the wiring pattern for the touch sensor without blackening the pattern for connection with the controller board.
The manufacturing method of the touch panel sensor of the present invention can achieve good conductivity and visibility by blackening the wiring pattern for the touch sensor without blackening the pattern for connection with the controller board.
The blackening in the present invention means that the metal surface is altered and / or deformed to reduce the metallic luster.
In the blackening step, at least a part of the surface of the touch sensor wiring pattern may be blackened, and it is preferable that at least a part of the surface on the viewing side of the touch sensor is blackened.
The method for blackening the wiring pattern for the touch sensor without blackening the connection pattern with the controller board in the blackening process is not particularly limited, but the metal is oxidized, nitrided, sulfided, Examples of the method include chlorination, alloying, and surface roughening. In particular, in the blackening process, it is preferable to blacken the wiring pattern for the touch sensor using a blackening treatment liquid.
Also, from the viewpoint of achieving both improved visibility and reduced resistance, it is preferable to perform blackening only in the vicinity of the surface of the wiring. Although depending on the width and thickness of the wiring, the thickness to be blackened is preferably 1 to 3000 nm, more preferably 2 to 1,500 nm, and more preferably 5 to 1,000 nm from the surface of the wiring. Is more preferable, and it is especially preferable that it is 10-500 nm.
Further, the thickness of the wiring portion that is not blackened is preferably 0.05 to 10.0 μm, more preferably 0.1 to 5.0 μm, and 0.2 to 3.0 μm. Is more preferable.
Furthermore, the line width of the wiring portion that is not blackened is preferably 0.1 to 10.0 μm, more preferably 0.5 to 5.0 μm, and 1.0 to 3.0 μm. Is more preferable.

In the blackening step, it is preferable to blacken the surface of the metal wiring pattern by oxidation, nitridation, sulfurization and / or chlorination.
When copper is used as the metal, it is more preferable to blacken by oxidation or sulfurization, and it is further preferable to blacken by oxidation.
When silver is used as the metal, it is more preferable to blacken by sulfidation or chlorination, and further preferable to blacken by sulfidation.
The blackening treatment liquid used in the present invention is not particularly limited as long as it can be blackened, a known blackening treatment liquid can be used, and a commercially available blackening treatment liquid can also be used. .
Moreover, you may perform a washing | cleaning process etc. as needed after a blackening process.

The blackening by oxidation is an oxide film on the metal surface, which can suppress the metallic luster. In some cases, the surface shape changes like a needle.
As an oxidation method, for example, copper can be oxidized by treatment with an aqueous solution of sodium chlorite and sodium hydroxide. The concentration of this solution is preferably sodium chlorite: sodium hydroxide = 20: 1 to 2: 1, and the sodium hydroxide concentration is preferably 4 to 20 g / L. By treating copper with such an aqueous solution, CuO and / or Cu ₂ O can be formed and the surface can be blackened.
Blackening by nitriding means that the metal surface is made of a nitride film, and this can suppress the metallic luster.
Blackening by sulfidation is a metal surface with a sulfide film, which suppresses metallic luster.
For example, silver or copper can be sulfided by treatment with an aqueous sodium sulfide solution. Further, as a gas phase treatment method, sulfidation can be performed by treatment with hydrogen sulfide.
Blackening by chlorination is a chlorinated coating on the metal surface, which suppresses metallic luster.

In the blackening process, the blackening treatment liquid is applied to the wiring pattern for the touch sensor without applying the blackening treatment liquid to the connection pattern with the controller board, and the touch sensor wiring is blackened by the blackening treatment liquid. A blackening process including a blackening process including a blackening process and a blackening process, or a blackening process including a protective layer forming process for forming a protective layer on the connection pattern with the controller substrate. It is preferable to include a blackening treatment step for blackening the touch sensor wiring with a liquid, a treatment liquid removal step for removing the blackening treatment liquid, and a protective layer removal step for removing the protective layer. The processing liquid is applied to the wiring pattern for the touch sensor without applying the processing liquid to the connection pattern with the controller substrate, and the touch sensor wiring is blackened by the blackening processing liquid. More preferably contains a process step, a treatment liquid removing step of removing the blackening treatment solution, a.
The formation method of the said protective layer is not specifically limited, For example, the method of forming a well-known resist layer as a protective layer is mentioned. There is no restriction | limiting in particular as a resist composition used for formation of a protective layer, A well-known resist composition is mentioned. A known resist stripping solution can be used for removing the protective layer.
The blackening treatment liquid preferably contains an oxidizing agent, a sulfurizing agent, a nitriding agent, or a chlorinating agent. Further, the blackening treatment liquid may be an aqueous treatment liquid or an organic solvent solution, but is preferably an aqueous treatment liquid.
The blackening treatment liquid may contain other additives.
Other additives include oxidation, sulfidation, nitridation, or chlorination aids, viscosity modifiers, surfactants, pH adjusters, and the like.
Examples of the viscosity modifier include a polymer compound and a polyhydric alcohol. When the blackening treatment liquid is an aqueous treatment liquid, a water-soluble polymer and / or a polyhydric alcohol is preferably exemplified.

The blackening treatment liquid preferably contains at least a polyhydric alcohol and / or a polymer from the viewpoint of viscosity adjustment.
Examples of water-soluble polymers include soybean polysaccharide, modified starch, gum arabic, dextrin, fibrin derivatives (eg, carboxymethylcellulose, carboxyethylcellulose, methylcellulose, etc.) and modified products thereof, pullulan, polyvinyl alcohol and derivatives thereof, polyvinylpyrrolidone, Examples include polyacrylamide and acrylamide copolymers, vinyl methyl ether / maleic anhydride copolymers, vinyl acetate / maleic anhydride copolymers, styrene / maleic anhydride copolymers, and the like. Among these, polyvinyl alcohol is preferable.
As the polyhydric alcohol, ethylene glycol, propylene glycol, triethylene glycol, butylene glycol, hexylene glycol, diethylene glycol, dipropylene glycol, glycerin, trimethylolpropane, diglycerin and the like are preferably used. Among these, glycerin is particularly preferable.
Viscosity modifiers may be used alone or in combination of two or more.
The content of the viscosity modifier is preferably 0.001 to 10% by mass and more preferably 0.01 to 5% by mass with respect to the total mass of the blackening treatment liquid.

The blackening treatment liquid can contain a surfactant from the viewpoint of improving coatability.
Preferred examples of the surfactant include a fluorine-based surfactant and a silicone-based surfactant.
Surfactants may be used alone or in combination of two or more.
The content of the surfactant is preferably 0.001 to 10% by mass and more preferably 0.01 to 2% by mass with respect to the total mass of the blackening treatment liquid.

The method for applying the blackening treatment liquid is not particularly limited, and a known coating method can be used. For example, known printing methods such as inkjet printing, screen printing, gravure printing, flexographic printing, slit coating, and spray coating. A liquid filling method or the like can be used.
Among these, it is preferable to apply the blackening treatment liquid by an ink jet printing method or a screen printing method, and it is more preferable to apply the blackening treatment liquid by an ink jet printing method.
The inkjet printing method can use a known inkjet printing method and a known inkjet coating apparatus, and is not particularly limited.
Specific examples of the inkjet coating apparatus include on-demand inkjet coating apparatuses IJ-DESK-S, IJ-DESK-H (manufactured by PMT Co., Ltd.), DIMADIX Material Printer DMP-2831, DMP-3000 (FUJIFILM Dimaticx). Etc.).
Examples of the ink jet coating apparatus that can be used in the present invention include an apparatus including a composition supply system and a temperature sensor.
The ink supply system includes, for example, an original tank containing a blackening treatment liquid, a supply pipe, a composition supply tank immediately before the inkjet head, a filter, and a piezo-type inkjet head. The piezo-type inkjet head preferably has a multi-size dot of 1 to 100 pl, more preferably 8 to 30 pl, preferably 320 × 320 to 4,000 × 4,000 dpi (dot per inch), more preferably 400 × 400. It can be driven so that it can discharge at a resolution of ˜1,600 × 1,600 dpi, more preferably 720 × 720 dpi. In the present invention, dpi represents the number of dots per 2.54 cm.
Also, screen printing, gravure printing, flexographic printing, and the like can use known printing methods and known printing apparatuses, and are not particularly limited.

<Connection process>
The manufacturing method of the touch panel sensor of the present invention includes a connection step of connecting the controller board and the connection pattern with the controller substrate after the blackening step.
In the connecting step, when connecting the controller board and the touch sensor board, it is preferable to securely connect a large number of electrodes arranged at minute intervals and to fix the IC circuit element. For this purpose, ACF (Anisotropic Conductive Film) is preferably used.
ACF is a conductive resin in which fine conductive particles are uniformly dispersed in an adhesive binder resin, and an IC circuit element is thermocompression-bonded to a substrate via this ACF, so that the electrodes are connected to each other via the ACF conductive particles. Are electrically connected and the binder resin is cured by heating, so that the IC circuit of the controller board and the touch sensor of the touch sensor board are electrically connected and fixed.
The connection pattern with the controller board and the connection method with the controller board in the connection step are not particularly limited, but it is preferable to connect the ACF by thermocompression bonding.
Although there is no restriction | limiting in particular as a connection method using ACF, The method described in Unexamined-Japanese-Patent No. 2011-3821 or Unexamined-Japanese-Patent No. 2010-4051 can be used suitably.

<Resist layer forming step>
In the metal pattern forming step, when the metal pattern is formed by etching a substrate having a metal surface on at least one surface, the touch panel sensor manufacturing method of the present invention includes at least one before the metal pattern forming step. It is preferable to include a resist layer forming step of forming a resist layer on the metal surface of the substrate having a metal surface on the surface.
In the resist layer forming step, a known resist layer forming method can be used, and there is no particular limitation. For example, the method of forming a resist layer by apply | coating a resist composition with a well-known coating method and removing a solvent is mentioned.
There is no restriction | limiting in particular as a resist composition which can be used for this invention, A well-known etching resist can be used.
The resist composition may be a negative resist composition or a positive resist composition, but a positive resist composition is preferred from the viewpoint of forming fine lines.
Among these, a chemically amplified positive etching resist is preferable from the viewpoint of forming thinner fine wires. Further, the fine line can be patterned with high accuracy by patterning the resist by photolithography.

As the material of the metal film, the above-described wiring material can be preferably used.
The metal film only needs to be formed on at least a part of the substrate, and may or may not be in direct contact with the substrate.
The thickness of the metal film may be appropriately selected according to the wiring pattern to be formed, and is preferably 0.05 to 20 μm, more preferably 0.1 to 10 μm, still more preferably 0.15 to 4.0 μm, and 2 to 4.0 μm is particularly preferable.
There is no restriction | limiting in particular as a formation method of a metal film, A metal film can be formed by well-known methods, such as a vapor deposition method, sputtering method, a plating method, and a lamination method.

<Resist pattern formation process>
In the metal pattern forming step, when the metal pattern is formed by etching a substrate having a metal surface on at least one surface, the touch panel sensor manufacturing method of the present invention is performed after the resist layer forming step and the metal Before the pattern formation step, it is preferable to include a resist pattern formation step in which the resist layer is processed into a pattern by photolithography to expose at least a part of the metal surface.
In the resist pattern forming step, the resist layer is exposed and developed into a desired pattern, and the metal layer on the substrate is exposed to a so-called photolithography method, and the touch sensor wiring pattern, the drawing wiring pattern, and the controller substrate This is processed into an etching resist pattern for etching into the connection pattern.
There is no restriction | limiting in particular as a photolithography method, A well-known exposure means, a well-known mask, and a well-known developing solution can be used. Moreover, you may perform a well-known rinse process and a washing | cleaning process after image development.
Further, as described above, the resist used for the resist layer may be a positive resist or a negative resist, but is preferably a positive resist from the viewpoint of fine line formation, and is a chemical amplification type. More preferred is a positive resist.
As an exposure light source, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a chemical lamp, an LED light source, an excimer laser generator, or the like can be used, and g-line (436 nm), i-line (365 nm), h-line (405 nm), etc. Actinic rays having a wavelength of from 300 nm to 450 nm can be preferably used. Moreover, irradiation light can also be adjusted through spectral filters, such as a long wavelength cut filter, a short wavelength cut filter, and a band pass filter, as needed.
As the exposure apparatus, various types of exposure machines such as a mirror projection aligner, a stepper, a scanner, a proximity, a contact, a microlens array, and a laser exposure can be used.
The active radiation used for exposure includes α rays, γ rays, X rays, ultraviolet rays, visible rays, electron beams, and the like. Among these, from the viewpoint of sensitivity and availability of the apparatus, visible light and ultraviolet light are preferable, and ultraviolet light is more preferable.

As the developer, an aqueous solution of a basic compound is preferable.
Examples of basic compounds include sodium hydroxide, potassium hydroxide, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, choline (2-hydroxyethyltrimethylammonium hydroxide). Is preferred. In addition, an aqueous solution obtained by adding an appropriate amount of a water-soluble organic solvent such as methanol or ethanol or a surfactant to the aqueous solution can also be used as a developer.
The pH of the developer is preferably 10.0 to 14.0.

<Resist removal process>
In the metal pattern formation step, when the metal pattern is formed by etching a substrate having a metal surface on at least one surface, the touch panel sensor manufacturing method of the present invention is a pattern-shaped method after the metal pattern formation step. A resist removal step of removing the resist;
There is no restriction | limiting in particular as a method of removing the resist pattern in a resist removal process, A well-known resist peeling method can be used.
Among them, a method of using a resist stripping solution and removing the resist pattern is preferable.
There is no restriction | limiting in particular as a resist stripping solution which can be used for this invention, A well-known resist stripping solution can be used, What is necessary is just to select suitably according to the resist currently used.
Moreover, in order to reduce the aggressiveness to a metal, an azole compound (imidazole, a triazole, etc.) can be added suitably to a resist stripping solution.
Also, there are no particular restrictions on the resist pattern removal conditions, which can be performed at any temperature and time.
Moreover, you may perform a well-known rinse process and a washing | cleaning process after the removal of a resist pattern.

The manufacturing method of the touch panel sensor of the present invention may optionally include other steps.
There is no restriction | limiting in particular as another process, A well-known process can be included. For example, a washing process, a rinsing process, and a drying process can be used.

(Touch panel and touch panel display device)
The touch panel of this invention is a touch panel provided with the touch panel sensor manufactured by the manufacturing method of the touch panel sensor of this invention.
The touch panel display device of the present invention is a touch panel display device having at least a display function and including a touch panel sensor manufactured by the method for manufacturing a touch panel sensor of the present invention.

The touch panel of the present invention can be more suitably used as a capacitive touch panel.
In addition, the touch panel of the present invention and the touch panel display device of the present invention are not particularly limited except that the touch panel sensor manufactured by the method for manufacturing the touch panel sensor of the present invention is provided. Reference can be made to the configuration described in "Practical Course", supervised by Yuji Mitani and Yoshio Itakura, 2011, published by Techno Times Co., Ltd.
The touch panel of the present invention or the touch panel display device of the present invention is the latest touch panel technology (published July 6, 2009, Techno Times), supervised by Yuji Mitani, “Touch Panel Technology and Development”, Co., Ltd. The configurations disclosed in CM Publishing (2004, 12), FPD International 2009 Forum T-11 Lecture Textbook, Cypress Semiconductor Corporation Application Note AN2292, etc. can be applied.
The touch panel type may be an external type or a display integrated type. A film sensor can be mentioned as an external type.
Examples of the display-integrated type include a so-called on-cell type (for example, FIG. 19 in JP 2013-168125 A) and other configurations (for example, FIG. 6 in JP 2013-164871 A).

  Although the usage form of the touch panel of this invention is not specifically limited, It is suitable to set it as a combined touch panel display device with an organic EL display device or a liquid crystal display device.

<Organic EL display device>
The touch panel display device of the present invention is not particularly limited except that the touch panel of the present invention is used, and examples thereof include various known organic EL display devices and liquid crystal display devices having various structures.
For example, specific examples of TFT (Thin-Film Transistor) included in the organic EL display device include amorphous silicon-TFT, low-temperature polysilicon-TFT, oxide semiconductor TFT, and the like.
FIG. 3 is a conceptual diagram of a configuration of an example of an organic EL display device. A schematic cross-sectional view of a substrate in a bottom emission type organic EL display device is shown, and a planarizing film 4 is provided.
A bottom gate type TFT 1 is formed on a glass substrate 6, and an insulating film 3 made of Si ₃ N ₄ is formed so as to cover the TFT 1. A contact hole (not shown) is formed in the insulating film 3, and then a wiring 2 (height: 1.0 μm) connected to the TFT 1 through the contact hole is formed on the insulating film 3. The wiring 2 is for connecting the TFT 1 with an organic EL element formed between the TFTs 1 or in a later process.
Further, in order to flatten the unevenness due to the formation of the wiring 2, a planarizing film 4 is formed on the insulating film 3 in a state where the unevenness due to the wiring 2 is embedded.
On the planarizing film 4, a bottom emission type organic EL element is formed. That is, the first electrode 5 made of ITO is formed on the planarizing film 4 so as to be connected to the wiring 2 through the contact hole 7. The first electrode 5 corresponds to the anode of the organic EL element.
An insulating film 8 having a shape covering the periphery of the first electrode 5 is formed. By providing the insulating film 8, a short circuit between the first electrode 5 and the second electrode formed in the subsequent process is prevented. can do.
Further, although not shown in FIG. 3, a hole transport layer, an organic light emitting layer, and an electron transport layer are sequentially deposited through a desired pattern mask, and then a second layer made of Al is formed on the entire surface above the substrate. An active matrix type in which two electrodes are formed, sealed by bonding using a sealing glass plate and an ultraviolet curable epoxy resin, and TFTs 1 for driving the organic EL elements are connected. An organic EL display device is obtained.

<Liquid crystal display device>
Examples of the touch panel display device of the present invention include a liquid crystal display device having the touch panel of the present invention.
Further, as a liquid crystal driving method that the liquid crystal display device can take, a TN (Twisted Nematic) method, a VA (Vertical Alignment) method, an IPS (In-Plane-Switching) method, an FFS (Fringe Field Switching) method, an OCB (Optical Fully). Bend) method. The IPS method is preferable from the viewpoint of a wide viewing angle and less disturbance of the screen when touched.
In the panel configuration, the cured film of the present invention can also be used in a COA (Color Filter on Array) type liquid crystal display device. For example, the organic insulating film (115) of JP-A-2005-284291, -346054 can be used as the organic insulating film (212). Specific examples of the alignment method of the liquid crystal alignment film that the liquid crystal display device of the present invention can take include a rubbing alignment method and a photo alignment method. Further, the polymer orientation may be supported by a PSA (Polymer Sustained Alignment) technique described in JP-A Nos. 2003-149647 and 2011-257734.
Specific examples of TFT (Thin-Film Transistor) included in the liquid crystal display device include amorphous silicon-TFT, low-temperature polysilicon-TFT, oxide semiconductor TFT (for example, indium gallium zinc oxide) and the like.
The light source of the backlight is not particularly limited, and a known light source can be used. For example, white LED, multicolor LED such as blue, red, and green, fluorescent lamp (cold cathode tube), organic EL, and the like can be mentioned.
Further, the liquid crystal display device can be a 3D (stereoscopic) type or a flexible type.

  In addition, a statically driven liquid crystal display device can display a pattern with high designability by applying the present invention. As an example, the present invention can be applied as an insulating film of a polymer network type liquid crystal as described in JP-A No. 2001-125086.

FIG. 4 is a conceptual diagram of a configuration of an example of the touch panel display device of the present invention.
A lower display panel 200 corresponding to a thin film transistor display panel provided with a thin film transistor (TFT) 440, and a color filter display panel provided with a plurality of color filters 330 on the surface facing the lower display panel 200 and facing the lower display panel 200. And the liquid crystal layer 400 formed between the lower display panel 200 and the upper display panel 300. The liquid crystal layer 400 includes liquid crystal molecules (not shown).

The lower display panel 200 is disposed on the first insulating substrate 210, the thin film transistor (TFT) disposed on the first insulating substrate 210, the insulating film 280 formed on the upper surface of the thin film transistor (TFT), and the insulating film 280. A pixel electrode 290 is included. The thin film transistor (TFT) may include a gate electrode 220, a gate insulating film 240 covering the gate electrode 220, a semiconductor layer 250, ohmic contact layers 260 and 262, a source electrode 270, and a drain electrode 272.
A contact hole 282 is formed in the insulating film 280 so that the drain electrode 272 of the thin film transistor (TFT) is exposed.

  The upper display panel 300 is disposed on one surface of the second insulating substrate 310, the light shielding members 320 arranged in a matrix, the color filter 330 disposed on the second insulating substrate 310, and the color filter 330. And a common electrode 370 for applying a voltage to the liquid crystal layer 400 corresponding to the pixel electrode 290 of the lower display panel 200.

  In the liquid crystal display device shown in FIG. 4, metal wiring 410 and a protective film 420 formed by the touch panel sensor manufacturing method of the present invention are disposed on the other surface of the second insulating substrate 310. As described above, in the manufacture of the liquid crystal display device shown in FIG. 4, when forming the upper display panel 300, the metal wiring 410 and the protective film 420, which are constituent elements of the touch screen, are used for the touch panel sensor of the present invention. They can be formed together by a manufacturing method. The illustrated metal wiring 410 forms a touch sensor wiring pattern.

  The present invention will be described more specifically with reference to the following examples. The materials, amounts used, ratios, processing details, processing procedures, and the like shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. Unless otherwise specified, “part” and “%” are based on mass.

Example 1
(1) Resist layer formation process The resist composition which consists of the following composition was inkjet-coated on the board | substrate with which the copper film was formed by the thickness of 2.0 micrometers on the glass substrate (300 mm x 400 mm), and was dried.

<Resist composition>
The following components were dissolved and mixed, and filtered through a polytetrafluoroethylene filter having a diameter of 0.2 μm to obtain a resist composition.
-PHS-EVE (1-ethoxyethyl protected product of p-hydroxystyrene / p-hydroxystyrene copolymer (30 mol% / 70 mol%), the following structure): 71.4 parts-Acrylic polymer: 28.6 Part ・ IRGACURE PAG103 (manufactured by BASF): 2.7 parts ・ dibutoxyanthracene: 2.7 parts ・ epoxy resin (JER157S65, manufactured by Japan Epoxy Resin Co., Ltd.): 2.7 parts ・ solvent PGMEA (propylene glycol monomethyl ether) Acetate): The non-volatile content was adjusted to 10% by mass with respect to the entire composition.

  In addition, the number on the lower right of the parenthesis in each structural unit of the acrylic polymer represents a molar ratio.

(2) Resist pattern forming step The substrate on which the photosensitive composition layer (resist layer) produced in (1) is formed is used for a mesh-shaped touch sensor using MPA 5500CF (high pressure mercury lamp) manufactured by Canon Inc. Each of the wiring pattern, the drawing wiring pattern, and the pattern for connecting to the controller board was exposed.
Then, the exposed photosensitive resin composition layer was developed with an alkali developer (0.4% tetramethylammonium hydroxide aqueous solution), and then rinsed with ultrapure water. By these operations, the resist layer was processed into a touch sensor wiring pattern, a lead wiring pattern, and a connection pattern to the controller board.

(3) Metal pattern formation process After the substrate on which the patterned resist layer was formed was immersed in copper etchant (CleanEtch SE-07, manufactured by Hishoe Chemical Co., Ltd., 7-fold diluted product) at 30 ° C. for 2 minutes, Rinse with ultrapure water. By these operations, copper was wet etched to form a copper wiring pattern.
Thereby, a wiring pattern for touch sensor made of metallic copper, a wiring pattern for drawing made of metallic copper connected to the wiring pattern for touch sensor, and a controller board made of metallic copper connected to the wiring pattern for drawing The connection pattern was formed.

(4) Resist removal step The patterned copper substrate prepared in (3) was immersed in a resist remover (N-300, manufactured by Nagase ChemteX Corp.) at 60 ° C. for 2 minutes, and then with ultrapure water. Rinse. By these operations, the patterned resist layer was removed.

(5) Blackening step The following components were mixed to prepare a blackening treatment liquid 1 having a viscosity of 10 mPa · s.
-Sodium chlorite: 25 parts by mass-Sodium hydroxide: 10 parts by mass-Trisodium phosphate: 2 parts by mass-Polyvinyl alcohol (Nippon Vinegar, manufactured by Poval Co., VP-18): 5 parts by mass-Pure water : 1,000 parts by mass-Glycerin (viscosity adjusting agent): appropriate amount The prepared blackening treatment liquid 1 was subjected to an inkjet coating apparatus (Dimatics Material Printer DMP-2831, manufactured by FUJIFILM Dimatix, drive voltage 16 V, frequency 5 kHz. ) And applied to the wiring pattern for the touch sensor without applying to the pattern for connection with the controller board.
This substrate was heated at 60 ° C. for 5 minutes to blacken the touch sensor wiring pattern without blackening the connection pattern with the controller substrate.
Thereafter, the substrate was sufficiently washed with pure water to remove the blackening solution.

(6) Connection process Using an ACF tape (manufactured by Hitachi Chemical Co., Ltd., ANISOLM) and an ACF crimping machine (manufactured by Toray Engineering Co., Ltd., DA-100) with the controller substrate of the touch panel sensor substrate produced above. The connection pattern portion and the controller board on which the resistance measuring instrument was installed were crimped.

<Evaluation>
-Visibility-
The touch panel sensor produced above was placed on a black desk (not reflecting light) under a fluorescent lamp (about 500 lux), and the whiteness of the touch sensor wiring pattern was evaluated according to the following criteria. The less whitish, the better, and A, B, and C are practical ranges.
A: There is no whitishness when viewed from any direction.
B: Although it is not whitish when viewed from the front, it is slightly whitish when viewed from an oblique direction.
C: Slightly whitish when viewed from the front, and slightly whitish when viewed from an oblique direction.
D: Slightly whitish when viewed from the front, and whitish can be clearly recognized when viewed from an oblique direction.
E: The whitish can be clearly recognized when viewed from the front or obliquely.

-Conductivity-
With the resistance detector installed on the controller board, the resistance values of any five circuits of the touch panel sensor were measured, and the average value was calculated. Evaluation was made according to the following criteria. The smaller the resistance value, the better, and A, B, and C are practical ranges.
A: 10Ω or less B: Over 10Ω and 15Ω or less C: Over 15Ω and 20Ω or less D: Over 20Ω and 30Ω or less E: Over 30Ω

-Shadow-
The touch panel sensor was placed on a light table, and the transmissive part was visually observed from a distance. We measured the distance we were approaching and the wiring was visible. It is preferable that the wiring is difficult to see.
A: Even if it approaches less than 20 cm, it cannot be seen.
B: Slightly visible when approaching less than 20 cm.
C: Slightly visible at a position of 20 cm or more and less than 50 cm.
D: Slightly visible from a position separated by 50 cm or more.
E: It is clearly visible from a position separated by 50 cm or more.

-Blackening layer thickness-
The obtained metal pattern was cut by FIB (focused ion beam), and the cross section was observed with a scanning electron microscope (SEM). Further, elemental mapping was performed on the obtained sample using an SEM-EDX (energy dispersive X-ray spectroscopy) apparatus (manufactured by JEOL Ltd., JSM-6010PLUS / LA), and the thickness of the blackened layer was calculated.

(Examples 2 to 41 and Comparative Examples 1 to 8)
Example 1 except that the metal type, metal film thickness (sensor film thickness), resist exposure pattern (sensor line width), blackening treatment liquid, and blackening treatment were changed as shown in Tables 1 to 3 In the same manner, touch panel sensors of each Example and Comparative Example were produced.

<Blackening treatment liquid 2>
As the blackening treatment liquid 2, BO-7770V (manufactured by Mec Co., Ltd.) was used.
The processing conditions were 25 ° C. and 30 seconds.

<Blackening treatment liquid 3>
The following components were mixed to prepare a blackening treatment liquid 3 having a viscosity of 10 mPa · s.
-Potassium sulfide: 2 parts by mass-Pure water: 1,000 parts by mass-Glycerin (viscosity modifier): Appropriate amount

<Blackening treatment solution 4>
The following components were mixed to prepare a blackening treatment liquid 4 having a viscosity of 10 mPa · s.
-Potassium sulfide: 1.4 parts by mass-Pure water: 1,000 parts by mass-Glycerin (viscosity modifier): Appropriate amount

<Blackening treatment solution 5>
The following components were mixed to prepare a blackening treatment liquid 5 having a viscosity of 10 mPa · s.
-Sodium hypochlorite: 1.4 parts by mass-Pure water: 1,000 parts by mass-Glycerin (viscosity modifier): Appropriate amount

<Blackening process of Example 6>
The blackening treatment liquid 1 was applied to the wiring pattern for the touch sensor by the screen printing method without applying it to the connection pattern for the controller substrate.
This substrate was heated at 65 ° C. for 6 minutes to blacken the touch sensor wiring pattern without blackening the connection pattern with the controller substrate. Thereafter, the substrate was sufficiently washed with pure water to remove the blackening solution.

<Blackening process of Example 7>
The resist composition was applied and dried on the entire copper pattern substrate by a slit coating method to form a dried film having a thickness of 2.5 μm. The portions other than the connection pattern with the controller board were exposed using MPA5500CF (high pressure mercury lamp), developed with an alkali developer (0.4% tetramethylammonium hydroxide aqueous solution), and then rinsed with ultrapure water. . Thereby, the protective film was formed only on the pattern portion for connection with the controller substrate.
The blackening treatment solution 1 was applied to the entire surface of the substrate with the protective film, heated at 65 ° C. for 6 minutes to perform blackening treatment, washed thoroughly with pure water, and the blackening treatment solution was removed.
The protective film was removed with a resist remover, washed thoroughly with pure water, and the wiring pattern for the touch sensor was blackened without blackening the pattern for connecting to the controller board.

<Blackening process of Comparative Example 1>
Using the blackening treatment liquid 1 of Example 1, the entire substrate was blackened. That is, the touch sensor wiring pattern, the lead wiring pattern, and the connection pattern with the controller board were all blackened.

<Blackening process of Comparative Example 3>
The blackening process was not performed.

  Note that “IJ” in the liquid supply method column of Tables 1 to 3 represents the same method as that in Example 1 that is coating by the inkjet method, and “printing” is the same as that in Example 6 that is coating by the screen printing method. “Protective film” represents the same method as in Example 7, which is a method for forming a protective layer, and “entire surface treatment” represents the same method as in Comparative Example 1 where the entire surface was applied.

(Example 42)
A touch panel sensor was produced in the same manner as in Example 16 except that the following steps were changed and added as follows.
(1) Resist layer formation process The film thickness of copper was 1.0 micrometer.
(2) Resist pattern formation process The wiring pattern for touch sensors was made into the stripe form with a pitch of 100 micrometers.
(3) Metal pattern formation process It performed by the method similar to Example 16. FIG.
(4) Resist removal process It performed by the method similar to Example 16. FIG.
(5) Blackening step: Performed in the same manner as in Example 16.
(6) Insulating layer forming step The following photosensitive composition is applied to a substrate on which a blackened stripe-shaped wiring pattern for a touch sensor is obtained in the above blacking step, dried, and a film having a thickness of 3.0 μm Formed.
By exposing and developing in the same manner as the etching resist, only the portion that becomes the intersection of the touch sensor wiring was removed. The insulating layer was cured by heating at 200 ° C. for 30 minutes.
-Acrylic polymer 2 below: 100 parts-IRGACURE PAG103 (manufactured by BASF): 3.0 parts-Solvent PGMEA (propylene glycol monomethyl ether acetate): Non-volatile content is 15% by mass with respect to the entire composition It adjusted so that it might become.

(7) Wiring pattern formation process for orthogonal touch sensors A silver thin film having a thickness of 0.6 μm was formed by sputtering on the substrate on which the insulating film was formed. Subsequently, in the same manner as in the resist formation process to the blackening process in Example 29, an orthogonal silver stripe pattern was formed on the copper stripe pattern on the substrate with the insulating layer portion as an intersection.
(8) Connection process It performed by the method similar to Example 1. FIG.

(Example 43)
A touch panel sensor was produced in the same manner as in Example 3 except that the following steps were changed and added as follows.
(1) Resist forming step The substrate was a polyethylene terephthalate film.
Copper was formed on both sides of the film.
Furthermore, the film thickness of copper was 1.0 μm.
(2) Resist pattern formation process The resist pattern was formed on both surfaces of the film.
Further, the wiring pattern for the touch sensor on one side was formed in a stripe shape with a pitch of 80 μm. The wiring pattern for the touch sensor on the other surface was formed in a stripe shape with a pitch of 80 μm perpendicular to the one surface.
(3) Metal pattern formation process The etching process similar to Example 3 was performed on both surfaces, and the touch sensor wiring pattern of one surface was made into the copper stripe of a pitch of 80 micrometers. The wiring pattern for the touch sensor on the other surface was a copper stripe with a pitch of 80 μm perpendicular to the one surface.
(4) Resist removing step The resist on both sides was removed in the same manner as in Example 3.
(5) Blackening step Both surfaces were blackened in the same manner as in Example 3.
(6) Connection process The connection pattern part formed in both surfaces similarly to Example 3, and the controller board | substrate were connected.

(Example 44)
Conductive silver ink (manufactured by Toyochem Co., Ltd., REXALPHA (model number RAFS 074)) is made of glass using an ink jet coating apparatus (Daimatics Material Printer DMP-2831, manufactured by FUJIFILM Dimatics, drive voltage 16 V, frequency 5 kHz). It apply | coated to the board | substrate (150 mm x 100 mm). The glass substrate was heated at 120 ° C. for 60 minutes to form a touch sensor wiring pattern, a lead wiring pattern, and a connection pattern to the controller substrate. The touch sensor wiring pattern was a mesh pattern having a line width of 6.0 μm, a thickness of 1.0 μm, and a pitch of 120 μm.
In the same manner as in Example 27, the blackening treatment process and the connection process were performed.

  The touch panel sensor obtained in Examples 42 to 44 was evaluated in the same manner as in Example 1. The evaluation results are shown in Table 4.

  1: TFT (thin film transistor), 2: wiring, 3: insulating film, 4: planarization film, 5: first electrode, 6: glass substrate, 7: contact hole, 8: insulating film, 10: touch panel sensor, 12: Substrate, 14: Touch sensor wiring pattern, 16: Drawer wiring pattern, 18: Controller connection pattern, 20: Display unit, 200: Lower display panel, 210: First insulating substrate, 220: Gate electrode, 240: gate insulating film, 250: semiconductor layer, 260, 262: ohmic contact layer, 270: source electrode, 272: drain electrode, 280: insulating film, 282: contact hole, 290: pixel electrode, 300: upper display panel, 310: second insulating substrate, 320: light shielding member, 330: color filter, 370: common electrode, 400: liquid crystal layer, 410: gold Wiring, 420: protective film, 440: TFT

Claims (13)

A method of manufacturing a touch panel sensor connected to a controller board,
Forming a touch sensor wiring pattern, a lead wiring pattern connected to the touch sensor wiring pattern, and a connection pattern connecting to the controller board connected to the lead wiring pattern on the substrate; A metal pattern forming step comprising a metal surface on at least a part of the surface opposite to the substrate in the connection pattern with the touch sensor wiring pattern, the lead-out wiring pattern, and the controller substrate;
A blackening step of blackening the metal surface provided in the wiring pattern for the touch sensor without blackening the metal surface provided in the pattern for connection with the controller board;
A method for manufacturing a touch panel sensor, comprising: a connection pattern for connecting to the controller substrate; and a connection step for connecting the controller substrate. Before the metal pattern forming step,
A resist layer forming step of forming a resist layer on the metal surface of the substrate having a metal surface on at least one surface;
Processing the resist layer into a pattern by a photolithography method and exposing at least a part of the metal surface; and
The metal pattern forming step is a step of removing the exposed metal surface by etching to form the touch sensor wiring pattern, the lead-out wiring pattern, and a connection pattern to the controller board,
After the metal pattern forming step,
Including a resist removal step of removing the resist in the form of a pattern,
The manufacturing method of the touch-panel sensor of Claim 1.   The touch panel sensor according to claim 1, wherein the metal pattern forming step is a step of collectively forming the touch sensor wiring pattern, the lead-out wiring pattern, and the connection pattern to the controller board. Manufacturing method.   The manufacturing method of the touch panel sensor of any one of Claims 1-3 whose said blackening process is a process of blackening using a blackening process liquid. The blackening step is
A treatment liquid application step of applying the blackening treatment liquid on the wiring pattern for the touch sensor without applying the blackening treatment liquid on the connection pattern with the controller board;
A blackening treatment step of blackening a metal surface provided in the wiring pattern for the touch sensor with the blackening treatment liquid;
A treatment liquid removal step for removing the blackening treatment liquid,
The manufacturing method of the touch-panel sensor of any one of Claims 1-4. The blackening step is
A protective layer forming step of forming a protective layer on the connection pattern with the controller substrate;
A blackening treatment step of blackening a metal surface provided in the wiring pattern for the touch sensor with the blackening treatment liquid;
A treatment liquid removal step of removing the blackening treatment liquid;
A protective layer removing step for removing the protective layer,
The manufacturing method of the touch-panel sensor of any one of Claims 1-4.   The touch panel according to claim 1, wherein a metal material included in the touch sensor wiring pattern, the lead-out wiring pattern, and the connection pattern with the controller board is copper or silver. Sensor manufacturing method.   The touch panel sensor according to any one of claims 1 to 7, wherein a metal material included in the touch sensor wiring pattern, the lead-out wiring pattern, and the connection pattern with the controller board is copper. Production method.   The said blackening process is a process of blackening by oxidizing, sulfurating, or chlorinating at least one part of the metal surface with which the said wiring pattern for touch sensors is provided. The manufacturing method of the touch-panel sensor of description.   The touch panel sensor manufacturing method according to claim 8, wherein the blackening step is a step of blackening by oxidizing or sulfurating at least a part of a metal surface included in the wiring pattern for the touch sensor.   The touch panel sensor manufactured by the manufacturing method of the touch panel sensor of any one of Claims 1-10.   The touch panel provided with the touch panel sensor manufactured by the manufacturing method of the touch panel sensor of any one of Claims 1-10.   A touch panel display device comprising a touch panel sensor manufactured by the method for manufacturing a touch panel sensor according to claim 1.

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