JP2016064557A - Embossment plate production method, laser engraving data creation device, laser engraving data creation method and program - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an embossment plate production method and the like, capable of easily forming a desired embossment shape on an embossment plate, while suppressing increase of production time.SOLUTION: An embossment plate production method 1 comprises: a first step for performing chemical etching for forming a hollow on a surface of an embossment plate; and a second step for performing laser engraving to the embossment plate to which the hollow has been formed in the first step, based on a differential shape obtained from difference between embossment shape data indicating a desired embossment shape and etching shape data created by simulating the shape of the hollow obtained in the first step by using a same condition to an etching condition of the first step.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a technique for producing an embossed plate used for the production of wallpaper and synthetic leather, and more particularly to a method for producing an embossed plate that forms a desired embossed shape by chemical etching and laser engraving.

2. Description of the Related Art Conventionally, embossed plates (roll-shaped forms are also referred to as embossed rolls) have been used to produce sheets such as wallpaper that reproduce the textured shape of textures such as textile patterns and stone patterns. On the surface of this embossed plate, an embossed shape corresponding to the textured shape of the texture is formed, and embossing that presses this embossed plate against a desired sheet composed of paper, resin, synthetic leather, metal, etc. It becomes possible to manufacture the sheet | seat which has an uneven | corrugated shape by performing.
Examples of a method for forming an embossed shape on the surface of the embossed plate include a method by chemical etching and a method by laser engraving.

The above chemical etching is a technique mainly called wet etching. For example, a plate material whose surface other than the opening is masked with an etching mask such as a resist (if the emboss plate is an emboss roll, the plate material is an emboss This is a technique in which a depression is formed on the surface of the embossed plate by etching with a corrosive liquid (also called an etching liquid).
In the present specification, for the purpose of distinguishing from the final form of the embossed plate, the embossed plate before the surface is processed will be appropriately referred to as a plate material.

For example, as shown in FIG. 24, a resist layer 102 is formed on the surface of the plate 101 (FIG. 24A), and a predetermined position (a position corresponding to the mask portion 102b) is irradiated with the exposure laser 103 (FIG. 24A). FIG. 24 (b)). Then, since the resist layer 102 of the mask portion 102b is cured, the resist pattern 102 having the opening portion 102a and the mask portion 102b is removed by performing development processing or the like and removing the resist layer 102 in the non-exposed portion (a portion corresponding to the opening portion 102a). Is formed (FIG. 24C).
Thereafter, when a corrosive liquid is applied to the surface of the plate material 101, the exposed plate material surface is corroded and recessed (FIG. 24D). Finally, when the resist pattern mask 102b is removed by a cleaning process or the like, an embossed plate 105 having a depression 104 corresponding to the opening 102a formed on the surface is obtained (FIG. 24E).
The above is the case of a negative resist. When a positive resist is used, the resist in the exposed area is softened and removed by development processing or the like.

If the above chemical etching is used, a plurality of depressions can be formed on the surface of the embossed plate in one etching process. Therefore, even when an enormous number of depressions are formed on an embossing roll having a large surface area, the manufacturing time of the embossing plate can be shortened.
However, the recess formed is limited to a monotonous concave shape corresponding to the opening 102a, for example, as shown in FIG. 24 (d). It is difficult to form a complex embossed shape such as an asymmetric shape (for example, a shape in which the center position of the bottom surface is shifted from the center position of the opening surface) by a single chemical etching process.

On the other hand, the above-mentioned laser engraving is a technique for burning a metal or the like constituting a plate material with a high-power engraving laser to form a desired embossed shape directly on the surface of the embossed plate.
For example, as shown in FIG. 25, the surface of the plate 101 is irradiated with an engraving laser 111 whose output is controlled according to the irradiation position so as to obtain a desired embossed shape 112 (FIG. 25A )), A desired amount of metal or the like constituting the plate material 101 is burned off to form a desired embossed shape 112 directly on the surface of the embossed plate 105 (FIG. 25B).

  Laser engraving is excellent in that a desired embossed shape can be directly formed even if it is in a complicated form, but it has a drawback of a long manufacturing time. In particular, embossing rolls used for the manufacture of sheets such as wallpaper have a large surface area and the number of embossed shapes provided is enormous, so it is not realistic to form all the embossed shapes by laser engraving. Absent.

Therefore, as a method of forming an embossed shape of the above complicated form (for example, a form that narrows toward the bottom) on the surface of the embossing roll, multi-stage etching in which the above chemical etching is performed a plurality of times, Commonly used.
Multi-stage etching is a technique for forming multi-stage depressions on the surface of an embossed plate by performing etching a plurality of times using a plurality of mask data having different sizes and shapes of openings.

  For example, with respect to the embossed plate 105 obtained by the chemical etching step shown in FIG. 24 (FIG. 26A), the second and subsequent chemical etching steps, that is, resist layer formation, pattern exposure with an exposure laser, and corrosion solution. When a series of steps of chemical etching and resist pattern removal are repeated a plurality of times while changing the mask data used for the exposure laser, a plurality of depressions are formed on the surface of the embossed plate 105 as shown in FIG. An etched shape 106 is formed.

  In the above-described chemical etching process, the resist layer 102 is irradiated with the exposure laser 103 to form a resist pattern having the opening 102a and the mask 102b (pattern exposure process). Mask data for determining the position of 102b is used. This mask data can be generated by binarizing emboss shape data representing a desired emboss shape using a threshold value. In multi-stage etching, a plurality of mask data are generated by changing the threshold value (for example, Patent Documents 1, 2, and 3).

JP 2001-58459 A JP 2001-179825 A JP 2001-113891 A

  However, in the multi-step etching method as described above, the etching shape formed on the embossed plate becomes a multi-step shape having stepped steps, and the desired emboss shape corresponding to the texture composed of curved surfaces is faithfully reproduced. There was a problem that it could not be formed.

Moreover, since chemical etching using a corrosive solution is isotropic etching, a phenomenon (side etching) occurs in which etching proceeds not only under the opening of the resist pattern but also under the mask portion. .
For example, as shown in FIG. 24D, in the case where chemical etching is performed using a corrosive solution, not only the portion under the opening 102a of the resist pattern but also in the vicinity of the boundary between the opening 102a and the mask 102b. The metal or the like under the mask portion 102b is also removed by side etching.
Therefore, in order to faithfully form a desired embossed shape, it is necessary to consider the shape change due to this side etching.

  In addition, there is a technique called dry etching using reactive ions as anisotropic etching that can suppress the above side etching, but this dry etching requires processing in a vacuum apparatus, and processing of a huge emboss roll Not suitable for. Moreover, normally, only shallow processing of about several microns can be performed, and it is difficult to form an embossed shape (for example, a depth of 100 μm to 1500 μm) according to the uneven shape used for wallpaper or the like.

  On the other hand, the laser engraving method has a drawback that the manufacturing time is long as described above. As an example, when the embossing shape for a predetermined wallpaper is formed on an embossing roll, the manufacturing time of about one week is required when the seven-step etching shape is formed on the embossing roll using the above-described multistage etching method. On the other hand, in the case of laser engraving with a laser for engraving with a diameter of about several tens of μm, the result of trial calculation is that it takes about two weeks to manufacture.

  The present invention has been made in view of the above problems, and provides an embossed plate manufacturing method and the like that can easily form a desired embossed shape on an embossed plate while suppressing an increase in manufacturing time. The purpose is to provide.

  That is, the invention according to claim 1 of the present invention includes a first step of performing chemical etching to form a depression on the surface of the embossed plate, emboss shape data representing a desired emboss shape, and the first step. Based on the difference shape obtained from the difference between the etching shape data generated by simulating the shape of the depression obtained by the above using the same conditions as the etching conditions of the first step, the depression is formed by the first step. And a second step of performing laser engraving on the embossed plate on which is formed.

  In the invention according to claim 2 of the present invention, the first step is performed by pattern exposure using mask data having an opening portion and a mask portion generated by binarizing the emboss shape data with a threshold value. The embossing plate manufacturing method according to claim 1, wherein the embossing plate having a resist pattern formed on the surface is subjected to the chemical etching using a corrosive liquid to form the depression. .

  Further, the invention according to claim 3 of the present invention is that the simulation uses the mask data to subtract a predetermined corrosion depth at a location corresponding to the opening of the mask data, and the mask portion of the mask data. In the location corresponding to the above, the distance from the boundary between the opening and the mask portion toward the mask portion and the depth of corrosion and the distance from the boundary toward the mask portion are determined based on the side etching profile. 3. The embossed plate manufacturing method according to claim 1, wherein the etching shape data is generated by subtracting a corrosion depth.

  In the invention according to claim 4 of the present invention, difference shape data obtained from a difference between emboss shape data representing a desired emboss shape and etching shape data generated by simulation of an etching shape obtained by chemical etching is obtained. Means for acquiring, means for converting the acquired differential shape data into data for laser engraving for driving an apparatus for performing laser engraving, means for setting the data for laser engraving in an apparatus for performing laser engraving, An apparatus for creating data for laser engraving.

  In the invention according to claim 5 of the present invention, an opening portion of the mask data is generated by using the mask data having an opening portion and a mask portion generated by the simulation by binarizing the emboss shape data with a threshold value. Is subtracted from a predetermined depth of corrosion, and at a location corresponding to the mask portion of the mask data, the relationship between the distance from the boundary between the opening and the mask portion toward the mask portion and the depth of corrosion is obtained. 5. The laser according to claim 4, wherein the etching shape data is generated by subtracting a corrosion depth corresponding to a distance from the boundary toward the mask portion based on a side etching profile that is expressed. This is a device for creating engraving data.

  In the invention according to claim 6 of the present invention, a computer obtains a difference obtained from a difference between emboss shape data representing a desired emboss shape and etching shape data generated by simulation of an etching shape obtained by chemical etching. Obtaining shape data; converting the obtained differential shape data into data for laser engraving that drives an apparatus for performing laser engraving; and setting the data for laser engraving in an apparatus for performing laser engraving. And a method of creating data for laser engraving.

  In the invention according to claim 7 of the present invention, an opening portion of the mask data is generated by using the mask data having an opening portion and a mask portion generated by the simulation by binarizing the emboss shape data with a threshold value. Is subtracted from a predetermined depth of corrosion, and at a location corresponding to the mask portion of the mask data, the relationship between the distance from the boundary between the opening and the mask portion toward the mask portion and the depth of corrosion is obtained. 7. The laser according to claim 6, wherein the etching shape data is generated by subtracting a corrosion depth corresponding to a distance from the boundary toward the mask portion based on a side etching profile that represents the etching shape data. This is a method for creating engraving data.

  According to an eighth aspect of the present invention, there is provided a program that causes a computer to function as the laser engraving data creation device according to the fourth or fifth aspect.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the embossing plate etc. which can form a desired embossing shape in an embossing plate easily can be provided, suppressing increase in manufacturing time.

The figure explaining an example of the manufacturing method of the embossing plate which concerns on this invention The figure which shows the structure of the embossing plate manufacturing system 1000 The figure which shows the hardware constitutions of the mask data generation process part 2100. The figure which shows the function structure of the mask data generation process part 2100. The flowchart which shows the process sequence of the mask data generation process part 2100. The figure shown about the production | generation of the mask data 22 The figure which shows the function structure of the etching shape data production | generation process part 2200. The flowchart which shows the process sequence of the etching shape data production | generation process part 2200. The flowchart which shows the process sequence of etching simulation S24 The figure shown about creation of distance data 2223 The figure explaining the side etching profile 2222 Diagram showing calculation of etching data 2224 The figure which shows the function structure of the difference shape data generation process part 2300. The flowchart which shows the process sequence of the difference shape data generation process part 2300. The figure shown about difference process S33 Flow chart showing chemical etching step 32 Schematic process diagram showing chemical etching process 32 Flow chart showing the laser engraving process 34 Schematic process diagram showing the laser engraving process 34 The figure which shows the structure of the laser engraving process part 3200. The figure which shows the hardware constitutions of the data creation apparatus 3300 for laser engravings The figure which shows the function structure of the data creation apparatus 3300 for laser engraving. The flowchart which shows the process sequence of the data creation apparatus 3300 for laser engravings. Diagram showing chemical etching process Diagram showing laser engraving Diagram showing multi-stage etching

(Embossed plate manufacturing method)
The embossing plate manufacturing method according to the present invention is obtained by the first step of performing chemical etching to form a depression on the surface of the embossing plate, the embossing shape data representing a desired embossing shape, and the first step. The dent is formed by the first step based on the difference shape obtained from the difference between the etching shape data generated by simulating the shape of the dent formed using the same etching conditions as the first step. And a second step of performing laser engraving on the embossed plate.

  And by providing the above processes, the embossed plate manufacturing method according to the present invention can easily form a desired embossed shape on the embossed plate while suppressing an increase in manufacturing time. .

  FIG. 1 is a diagram for explaining an outline of an example of a method for manufacturing an embossed plate according to the present invention. As shown in FIG. 1, the embossed plate manufacturing method 1 includes a data processing step 2 and an embossed plate manufacturing step 3.

In the data processing step 2, first, mask data generation processing S1 including binarization processing is performed on the emboss shape data 21 representing a desired emboss shape to generate mask data 22 having an opening and a mask portion. .
Next, the etching shape data generation process S2 is performed using the mask data 22, and the etching shape data 23 generated by simulation of the shape of the embossed plate obtained in the chemical etching step 32 of the embossed plate manufacturing step 3 is generated.
Thereafter, the differential shape data generation process S3 is performed using the embossed shape data 21 and the etching shape data 23, thereby generating the differential shape data 24.

On the other hand, in the embossed plate manufacturing process 3, first, an embossed plate intermediate 33 in which a stepped step shape is formed on the surface of the plate material 31 is manufactured by a chemical etching process (first process) 32 using the mask data 22. Next, an embossed plate 35 in which a shape more faithful to the shape represented by the embossed shape data 21 is obtained by a laser engraving step (second step) 34 using the difference shape data 24.
Here, in this specification, for the purpose of distinguishing from the final embossed plate, the embossed plate after the chemical etching step 32 and before the laser engraving step 34 is appropriately referred to as an embossed intermediate. I will call it.

  In addition, in the embossed plate manufacturing method 1 shown in FIG. 1, in order to make the whole understanding easy, the form which has the data processing process 2 and the embossed plate manufacturing process 3 collectively was illustrated, but this invention The data processing step 2 may be an independent step from the embossed plate manufacturing step 3, and the mask data generation processing S1, the etching shape data generation processing S2, and the differential shape data generation processing S3 are also independent of each other. It may be the process. Further, the chemical etching step 32 and the laser engraving step 34 may be independent processes.

FIG. 2 is a diagram illustrating the configuration of an embossed plate manufacturing system 1000 for performing the embossed plate manufacturing method 1 shown in FIG.
As shown in FIG. 2, the embossed plate manufacturing system 1000 includes a data processing unit 2000 and an embossed plate manufacturing unit 3000. The data processing unit 2000 includes a mask data generation processing unit 2100, an etching shape data generation processing unit 2200, and a differential shape data generation processing unit 2300. The embossed plate manufacturing unit 3000 includes a chemical etching process unit 3100, a laser. An engraving process unit 3200 is included.

  In the embossed plate manufacturing system 1000 shown in FIG. 2, as an example, the data processing unit 2000 and the embossed plate manufacturing unit 3000 are collectively shown. However, in the present invention, the data processing unit 2000 is shown. May be a system independent of the embossed plate manufacturing unit 3000, and the mask data generation processing unit 2100, the etching shape data generation processing unit 2200, and the differential shape data generation processing unit 2300 are also independent systems. May be. The chemical etching process unit 3100 and the laser engraving process unit 3200 may also be independent systems.

  First, each data generation process used in the embossed plate manufacturing method according to the present invention, that is, each data processing process in the data processing process 2 shown in FIG. 1 will be described in detail.

<Data processing process>
(Mask data generation process)
First, the mask data generation process S1 shown in FIG. 1 will be described.

(Hardware configuration of mask data generation processing unit)
FIG. 3 is a diagram showing a hardware configuration of the mask data generation processing unit 2100 shown in FIG. As shown in FIG. 3, the mask data generation processing unit 2100 includes, for example, a control unit 2101, a storage unit 2102, a media input / output unit 2103, a peripheral device I / F (interface) unit 2104, a communication unit 2105, an input unit 2106, This can be realized by a general computer configured by connecting the display unit 2107 and the like via the bus 2108.

The control unit 2101 is configured by a CPU, ROM, RAM, and the like.
The CPU calls a program stored in the storage unit 2102, ROM, recording medium, or the like to a work memory area on the RAM and executes it, and drives and controls each unit connected via the bus 2108. The ROM permanently holds a computer boot program, a program such as BIOS, data, and the like. The RAM temporarily stores the loaded program and data, and includes a work area used by the control unit 2101 to perform various processes.

  The storage unit 2102 is, for example, a hard disk drive, and stores a program executed by the control unit 2101 during processing to be described later, data necessary for program execution, an OS, and the like. These program codes are read by the control unit 2101 as necessary, transferred to the RAM, and read and executed by the CPU.

The media input / output unit 2103 is a media input / output device such as a DVD drive, and performs data input / output.
The peripheral device I / F unit 2104 is a port for connecting a peripheral device, and transmits and receives data to and from the peripheral device via the peripheral device I / F unit 2104. The connection form with the peripheral device may be wired or wireless.
A communication unit 2105 includes a communication control device, a communication port, and the like, and is a communication interface that mediates communication with a network or the like, and performs communication control.

The input unit 2106 is, for example, an input device such as a keyboard, a pointing device such as a mouse, or a numeric keypad, and outputs input data to the control unit 2101.
The display unit 2107 is configured by a display device such as a liquid crystal panel or a CRT monitor and a logic circuit (video adapter or the like) for executing display processing in cooperation with the display device, and is input by the control of the control unit 2101. Display information is displayed on a display device.
A bus 2108 is a path that mediates transmission / reception of control signals, data signals, and the like between the devices.

(Functional configuration of the mask data generation processing unit)
Next, the functional configuration of the mask data generation processing unit 2100 will be described with reference to FIG.
As shown in FIG. 4, the mask data generation processing unit 2100 includes an emboss shape data acquisition unit 2111, a binarization processing unit 2112, a mask data storage unit as each element of the mask data generation processing S1 executed by the control unit 2101. 2113, end determination means 2114, and the like. The storage unit 2102 stores emboss shape data 21, mask data 22, and the like.
Each of the emboss shape data acquisition unit 2111, the binarization processing unit 2112, the mask data storage unit 2113, and the end determination unit 2114 realizes the processing of each unit stored in the storage unit 2102, for example. The control unit 2101 acquires the program code describing the instruction to be executed from the storage unit 2102 and executes it.

  In the emboss shape data acquisition unit 2111, the control unit 2101 acquires the emboss shape data 21 from the storage unit 2102.

  In the binarization processing means 2112, the control unit 2101 binarizes the emboss shape data 21 with a single or a plurality of different threshold values, and generates a plurality of mask data 22 corresponding to the single or each threshold value. The threshold value may be set in advance or may be input by an operator.

The mask data storage unit 2113 stores the mask data 22 generated by the binarization processing unit 2112 in the storage unit 2102 by the control unit 2101.
In the case of multistage etching, different numbers of mask data corresponding to the number of stages are stored.

  The end determination unit 2114 determines whether or not the control unit 2101 ends the generation of the mask data 22 described above.

  The emboss shape data 21 represents the desired emboss shape to be formed on the emboss plate in numerical form. The emboss shape data 21 is, for example, gray scale image data in which the surface depth at each position of the emboss shape is represented by 256 gradation values.

  The mask data 22 is data indicating a location where the chemical etching is performed on the etching target (opening portion) and a location where the etching is not performed (mask portion).

(Processing procedure of mask data generation processing unit)
Next, the processing procedure of the mask data generation processing unit 2100 will be described with reference to FIG.
In the mask data generation process S1, the emboss shape data 21 is stored in advance in the storage unit 2102 via the media input / output unit 2103, which is a hardware component of the mask data generation processing unit 2100. .

  As shown in FIG. 5, the control unit 2101 of the mask data generation processing unit 2100 first acquires the emboss shape data 21 from the storage unit 2102 (S11), and binarizes the acquired emboss shape data 21 with a given threshold value. The mask data 22 is generated (S12), and the generated mask data 22 is stored in the storage unit 2102 (S13).

  Next, the control unit 2101 determines whether or not to complete the generation of the mask data 22 (S14). For example, if the number of generated mask data 22 is smaller than the set number, the process returns to step S12, and the control unit 2101 continues to generate the mask data 22. On the other hand, when the number of generated mask data 22 reaches the set number, the mask data generation process S1 is terminated.

FIG. 6 is a diagram illustrating generation of the mask data 22.
As shown in FIG. 6A, when the mask data 22 is generated, the emboss shape data 21 is binarized by a threshold value 21a. FIG. 6B is an example of the mask data 22 generated in this way.
For example, the opening 22a of the mask data 22 shown in FIG. 6B corresponds to a region having the same depth as the threshold 21a or a depth larger than the threshold 21a in the embossed shape data 21, and the mask portion 22b of the mask data 22 is The emboss shape data 21 corresponds to a region having a depth smaller than the threshold value 21a.
In the case of generating a plurality of different mask data for multi-stage etching, the same processing is performed for different threshold values corresponding to each stage, and the number of mask data corresponding to the number of stages is generated.

(Etching shape data generation process)
Next, the etching shape data generation process S2 shown in FIG. 1 will be described.
The hardware configuration of the etching shape data generation processing unit 2200 shown in FIG. 2 can be realized by a general computer having the same configuration as the hardware configuration of the mask data generation processing unit 2100 shown in FIG. Description of is omitted.
In the present invention, the mask data generation process S1 and the etching shape data generation process S2 may be executed by one computer, or each may be executed by another computer.

(Functional configuration of etching shape data generation processing unit)
FIG. 7 is a diagram showing a functional configuration of the etching shape data generation processing unit 2200 shown in FIG. As shown in FIG. 7, the etching shape data generation processing unit 2200 includes a mask data acquisition unit 2211, a corrosion depth data acquisition unit 2212, a side etching profile as each element of the etching shape data generation processing S2 executed by the control unit 2201. An acquisition unit 2213, an etching simulation unit 2214, an etching shape data storage unit 2215, an end determination unit 2216, and the like. The storage unit 2202 has a mask data 22, a corrosion depth data 2221, a side etching profile 2222, an etching shape data 23, and the like. Remember.
The mask data acquisition unit 2211, corrosion depth data acquisition unit 2212, side etching profile acquisition unit 2213, etching simulation unit 2214, etching shape data storage unit 2215, and end determination unit 2216 are stored in the storage unit 2202, for example. The control unit 2201 acquires the program code describing the instruction for realizing the processing of each means described above from the storage unit 2202 and executes it.

  In the mask data acquisition unit 2211, the control unit 2201 acquires the mask data 22 from the storage unit 2202.

  The corrosion depth data acquisition unit 2212 is used by the control unit 2201 to acquire the corrosion depth data 2221 from the storage unit 2202.

  In the side etching profile acquisition unit 2213, the control unit 2201 acquires the side etching profile 2222 from the storage unit 2202.

  The etching simulation means 2214 is for the controller 2201 to generate the etching shape data 23 by performing an etching simulation using the mask data 22, the corrosion depth data 2221, the side etching profile 2222, and the like.

  The etching shape data storing unit 2215 stores the etching shape data 23 created by the control unit 2201 using the etching simulation unit 2214 in the storage unit 2202.

  The end determination unit 2216 determines whether or not the control unit 2201 ends the creation of the etching shape data 23 described above.

  As described above, the mask data 22 is data indicating a location where the chemical etching is performed on the etching target (opening portion) and a location where the etching is not performed (mask portion).

  The corrosion depth data 2221 determines a predetermined corrosion depth corresponding to a threshold value when generating mask data. A threshold used for generating the mask data 22 and a predetermined corrosion depth in one-step etching using the mask data 22 are determined in association with each other.

  The side etching profile 2222 represents the influence of side etching in which etching proceeds even on the mask portion side during chemical etching, and in particular, the side of the mask portion 22b from the boundary between the opening 22a and the mask portion 22b when chemical etching is performed. Represents the shape of the object to be etched.

  The etching shape data 23 is generated by etching simulation of an etching shape obtained by chemical etching. In the case of multistage etching, a multistage shape having a number of stages corresponding to the number of mask data 22 is obtained.

(Processing procedure of etching shape data generation processing unit)
Next, the processing procedure of the etching shape data generation processing unit 2200 will be described with reference to FIG.
In the etching shape data generation process S2, the mask data 22, the corrosion depth data 2221, and the side etching profile 2222 are stored in advance via a media input / output unit that is a hardware component of the etching shape data generation processing unit 2200. It is assumed that the data is stored in the unit 2202.

As shown in FIG. 8, the control unit 2201 of the etching shape data generation processing unit 2200 first acquires the mask data 22, the corrosion depth data 2221, and the side etching profile 2222 from the storage unit 2202 (S21 to S23).
In FIG. 8, for the sake of convenience, mask data acquisition (S21), corrosion depth data acquisition (S22), and side etching profile acquisition (S23) are performed in this order, but in the present invention, etching simulation (S24) is performed. ), The mask data 22, the corrosion depth data 2221 and the side etching profile 2222 need only be acquired from the storage unit 2202, and the above order is not particularly limited. Further, the processes of steps S21 to S23 may be performed in parallel.

Next, the control unit 2201 generates etching shape data 23 by performing an etching simulation using the mask data 22, the corrosion depth data 2221, the side etching profile 2222, and the like (S24). This etching simulation will be described in detail later with reference to FIGS.
Thereafter, the control unit 2201 stores the generated etching shape data 23 in the storage unit 2202 (S25).

Next, the control unit 2201 determines whether or not to end the generation of the etching shape data 23 (S26).
For example, if the number of steps of the generated etching shape data 23 is smaller than the number of mask data 22, the control unit 2201 continues to generate the etching shape data 23 by returning to step S21. On the other hand, when the number of steps of the generated etching shape data 23 reaches the number of mask data 22, the control unit 2201 ends the etching shape data generation process S2.

(Etching simulation)
Next, the etching simulation (S24) will be described with reference to FIGS.
FIG. 9 is a flowchart showing a processing procedure in the etching simulation (S24). As shown in FIG. 9, in the etching simulation (S24), first, the distance from the boundary between the opening 22a and the mask 22b in each pixel (cell) of the mask data 22 acquired in step S21 shown in FIG. 8 is calculated. Then, the distance data 2223 is created (S241).

To create the distance data 2223, first, as shown in FIG. 10A, distance data 2223a having the same cell arrangement as the mask data 22 is prepared, and the values of all cells are set to the maximum values (shown in FIG. 10). In the example, it is initialized with “99”).
In FIG. 10A, the white numerals are the cells corresponding to the mask portion 22b in the mask data 22, and the other portions are the cells corresponding to the opening 22a.

  Next, as shown in FIG. 10B, distance data 2223b is created in which the distance 0 is stored in the cell value corresponding to the boundary between the opening 22a and the mask 22b in the mask data 22.

Next, the value of each cell of the distance data 2223b is set to the value stored in the cell near the periphery 8 and the distance to the cell near the periphery 8 (up and down, left and right is 1, and the diagonal direction is √2). Update the smallest value among the values added for each.
The distance data 2223c shown in FIG. 10C is obtained by performing the above processing while scanning from the left to the right for the cells in the first row from the top of the distance data 2223b.
Then, after the processing for the cells in the first row is completed, the above processing is performed up to the last row while scanning the cells in the second and subsequent rows from left to right.
After the processing is completed up to the rightmost cell of the last row, the above processing is performed while scanning the cells of the last row from right to left. After the processing for the cells in the last row is completed, the above processing is performed while scanning from the right to the left for the cells in the first row from the last row, and thereafter, the same processing is repeated for the cells in the first row. This process is performed until the leftmost cell in the first row is finally reached.
By this series of processing, distance data 2223 indicating the distance from the boundary between the opening 22a and the mask 22b in the mask data 22 is created as shown in FIG.

  The distance data 2223 is used after being converted into an actual distance. For example, when the resolution of the mask data 22 is 508 dpi, the size of one pixel corresponds to 50 μm. At this time, a value obtained by multiplying the value stored in each cell of the distance data 2223 by 50 μm is the distance from the boundary. Used as

  Returning to FIG. 9, the control unit 2201 then calculates etching data 2224 when chemical etching is performed using the mask data 22 based on the corrosion depth data 2221, the side etching profile 2222, and the distance data 2223 ( S242).

  FIG. 11 is a diagram for explaining the side etching profile 2222. The side etching profile 2222 represents the influence of the side etching described above, and particularly represents the shape of the etching target 41 on the mask portion 22b side from the boundary between the opening 22a and the mask portion 22b when chemical etching is performed. It is.

More specifically, the side etching profile 2222 in etching target 41 shown in FIG. 11 (a), the relationship of the distance a _n corrosion depth h _n going from the boundary of the opening 22a and a mask part 22b in the mask portion 22b side For example, as shown in FIG. Here, the corrosion depth at the distance 0 (that is, the boundary between the opening 22a and the mask portion 22b) is h, and the corrosion depth at the distance a is 0. The side etching profile 2222 is determined for each predetermined corrosion depth h.

  Note that the side etching profile 2222 is not limited to this, and may represent the shape of the etching target 41 on the mask portion 22b side when chemical etching is performed. It is possible to accurately reflect the influence of side etching.

  FIG. 12 is a diagram illustrating calculation of the etching data 2224 using the side etching profile 2222. In the example illustrated in FIG. 12, the corrosion depth h in one time (one step) of chemical etching using the mask data 22 is acquired based on the corrosion depth data 2221 according to the threshold value 21 a used for generating the mask data 22. Then, the etching data 2224 is calculated when one chemical etching is performed using one mask data 22.

At this time, as the value of the etching data 2224 corresponding to the opening 22a, one corrosion depth h (“30” in the example shown in FIG. 12B) is written. On the other hand, as the corrosion depth of the portion corresponding to the mask portion 22b, the distance from the boundary between the opening 22a and the mask portion 22b using the distance data 2223 and the side etching profile 2222 determined in advance corresponding to the corrosion depth h. writes a value h _n corresponding to a _n (in the example shown in FIG. 12 (b), "15").
As described above, the etching data 2224 in consideration of the influence of the side etching in one chemical etching is obtained. The etching data 2224 is image data having the same cell arrangement as the mask data 22.

  Returning to FIG. 9, the controller 2201 then performs etching after performing chemical etching using the mask data 22 by subtracting the corrosion depth of the corresponding portion of the mask data 22 using the etching data 2224. Etching shape data 23 representing the shape is generated (S243).

That is, a predetermined corrosion depth h is subtracted at a location corresponding to the opening 22a of the mask data 22, and based on the side etching profile 2222 corresponding to the corrosion depth h at a location corresponding to the mask portion 22b of the mask data 22. by subtracting the corrosion depth h _n corresponding to the distance a _n going from the boundary of the opening 22a and a mask part 22b in the mask portion 22b side, generates the etching shape data 23.

In this way, one-stage etching shape data 23 using one mask data 22 is generated. Then, as shown in FIG. 8, the generated etching shape data 23 is stored in the storage unit 2202 by the control unit 2201 (S25).
In multi-stage etching, the etching shape data 23 for one step is the shape of the etching target 41 in the next simulation performed by changing the mask data 22. Then, as shown in FIG. 8, the control unit 2201 repeats the above processing (steps S21 to S25) for all the acquired mask data, performs the above processing for all the mask data, and then generates etching shape data. The process S2 ends.

Note that the etching shape formed by chemical etching varies depending on the type / concentration / temperature of the corrosive liquid (etching liquid) and the type of metal constituting the embossed plate to be etched. For example, when corrosive liquids having different concentrations are used, the shape varies depending on the progress of etching even if etching is performed for the same time.
For this reason, as the side etching profile 2222, different data corresponding to the etching environment including the type, concentration and temperature of the above-described corrosive solution and the type of metal of the embossed plate is determined and stored in the storage unit 2202. It is preferable to select and use one according to the assumed etching environment.

(Differential shape data generation process)
Next, the difference shape data generation process S3 shown in FIG. 1 will be described.
The hardware configuration of the differential shape data generation processing unit 2300 shown in FIG. 2 can be realized by a general computer having the same configuration as the hardware configuration of the mask data generation processing unit 2100 shown in FIG. Description of is omitted.
In the present invention, the mask data generation process S1, the etching shape data generation process S2, and the difference shape data generation process S3 may be executed by one computer, or each may be executed by another computer.

(Functional configuration of differential shape data generation processing unit)
FIG. 13 is a diagram showing a functional configuration of the differential shape data generation processing unit 2300 shown in FIG.
As shown in FIG. 13, the differential shape data generation processing unit 2300 includes emboss shape data acquisition means 2311, etching shape data acquisition means 2312, difference processing as each element of the differential shape data generation processing S <b> 3 executed by the control unit 2301. Means 2313, differential shape data storage means 2314, etc., and the storage unit 2302 stores embossed shape data 21, etching shape data 23, differential shape data 24, and the like.
The emboss shape data acquisition unit 2311, the etching shape data acquisition unit 2312, the difference processing unit 2313, and the difference shape data storage unit 2314, for example, perform the processing of each unit stored in the storage unit 2302. It functions when the control unit 2301 acquires the program code describing the instruction to be realized from the storage unit 2302 and executes it.

  In the emboss shape data acquisition unit 2311, the control unit 2301 acquires the emboss shape data 21 from the storage unit 2302.

  In the etching shape data acquisition unit 2312, the control unit 2301 acquires the etching shape data 23 from the storage unit 2302.

  In the difference processing unit 2313, the control unit 2301 calculates difference shape data 24 representing a difference shape between the shape represented by the embossed shape data 21 and the shape represented by the etching shape data 23.

  The difference shape data storage unit 2314 stores the difference shape data 24 calculated by the control unit 2301 by the difference processing unit 2313 in the storage unit 2302.

  As described above, the emboss shape data 21 represents a desired emboss shape to be formed on the emboss plate.

  As described above, the etching shape data 23 is generated by etching simulation of an etching shape obtained by chemical etching. In the case of multistage etching, a multistage shape having a number of stages corresponding to the number of mask data is obtained.

  The difference shape data 24 represents the difference between the emboss shape data 21 and the etching shape data 23.

(Processing procedure of differential shape data generation processing unit)
Next, the processing procedure of the difference shape data generation processing unit 2300 will be described with reference to FIG.
Note that the emboss shape data 21 and the etching shape data 23 are stored in the storage unit 2302 in advance via the media input / output unit, which is a hardware component of the difference shape data generation processing unit 2300, during the differential shape data generation processing S3. It is assumed that

As illustrated in FIG. 14, the control unit 2301 of the differential shape data generation processing unit 2300 first acquires the embossed shape data 21 and the etching shape data 23 from the storage unit 2302 (S31 to S32).
In FIG. 14, for the sake of convenience, the emboss shape data acquisition (S31) and the etching shape data acquisition (S32) are performed in this order. However, in the present invention, before the difference processing (S33), the storage unit It is only necessary to obtain the emboss shape data 21 and the etching shape data 23 from 2302, and the order is not particularly limited. Further, the processes of steps S31 and S32 may be performed in parallel.

Next, as shown in FIG. 15, the control unit 2301 has a differential shape (FIG. 15) between the shape represented by the embossed shape data 21 (FIG. 15A) and the shape represented by the etching shape data 23 (FIG. 15B). The differential shape data 24 (FIG. 15 (d)) representing the shaded area shown in FIG. 15 (c) is calculated (S33).
For example, the control unit 2301 calculates the difference between the value of the emboss shape data 21 and the value of the etching shape data 23 for each pixel (cell) corresponding to the position, and uses this for all the pixels (cells). Then, the difference shape data 24 is calculated.
Thereafter, the control unit 2301 stores the calculated difference shape data 24 in the storage unit 2302 (S34), and ends the difference shape data generation process S3.

Heretofore, each data generation process used in the embossed plate manufacturing method 1, that is, each data processing process in the data processing process 2 shown in FIG. 1 has been described in detail.
Next, each step in the embossed plate manufacturing step 3 shown in FIG. 1 will be described in detail.

<Embossed plate manufacturing process>
(Chemical etching process)

  First, the chemical etching step 32 in the embossed plate manufacturing step 3 shown in FIG. 1 will be described with reference to FIGS. 16 and 17. Here, FIG. 16 is a flowchart showing the chemical etching process 32, and FIG. 17 is a schematic process diagram showing the chemical etching process 32. The chemical etching step 32 can be the same as the conventional multistage etching.

  For example, in order to manufacture the embossed plate intermediate 33 in which stepped multi-step depressions are formed on the surface of the plate material 31 by the chemical etching step 32, first, the plate material 31 is prepared, and the resist layer 51 is formed on the surface thereof. (Step 32a shown in FIG. 16, FIG. 17 (a)). A broken line shown in FIG. 17A represents a desired embossed shape 61 to be finally formed in the embossed plate manufacturing process 3.

  Next, using the mask data 22 generated in the mask data generation process S1 of the data processing step 2 shown in FIG. 1, the resist layer 51 is irradiated with an exposure laser and subjected to development processing, etc., and the opening 51a and the mask A resist pattern having a portion 51b is formed (step 32b shown in FIG. 16, FIG. 17B).

Next, chemical etching is performed using a corrosive solution (step 32c shown in FIG. 16, FIG. 17C), and then the resist pattern is removed (step 32d shown in FIG. 16, FIG. 17D).
Although not shown in FIG. 17, in the case of multi-stage etching, as shown in FIG. 16, the above steps 32a to 32d are repeated according to the number of stages.
Through the above steps, the embossed plate intermediate body 33 having the stepped multi-step etched shape 62 formed on the surface is manufactured.
Note that the etching shape 62 formed on the surface of the embossed plate intermediate 33 is also affected by side etching.

(Laser engraving process)
Next, the laser engraving process 34 in the embossed plate manufacturing process 3 shown in FIG. 1 will be described with reference to FIGS. Here, FIG. 18 is a flowchart showing the laser engraving process 34, and FIG. 19 is a schematic process diagram showing the laser engraving process 34.
This laser engraving process 34 is a characteristic technique of the present invention, unlike the conventional technique in which an embossed plate is manufactured by multistage etching.

  For example, in order to manufacture the embossed plate 35 having the desired embossed shape 61 from the embossed plate intermediate body 33 having the etched shape 62 formed on the surface by the laser engraving step 34, first, the chemical etching step 32 is used. An embossed plate intermediate 33 is prepared, and the differential shape data 24 generated in the differential shape data generation process S3 of the data processing step 2 shown in FIG. 1 is converted into data for laser engraving that drives an apparatus for performing the laser engraving 34a. Then, a predetermined amount of engraving laser is irradiated to a predetermined location (step 34a and FIG. 19 (a) shown in FIG. 18), and a portion of a differential shape 63 between a desired embossed shape 61 and an etched shape 62 (FIG. 19 (a) ) Is burned off to obtain an embossed plate 35 having a desired embossed shape 61 (FIG. 19B).

(Laser engraving process unit 3200)
FIG. 20 is a diagram showing a configuration of the laser engraving process unit 3200.
As shown in FIG. 20, the laser engraving process unit 3200 includes a laser engraving data creation device 3300 and a laser engraving device 3400. The laser engraving apparatus 3400 includes a scanning unit 3401, a laser irradiation unit 3402, a rotation driving unit 3403, a rotation shaft 3404, and the like.

  The laser engraving data creation device 3300 converts the differential shape data 24 into laser engraving data 3321 and sets the laser engraving data 3321 in the laser engraving data creation device 3300. Details will be described later with reference to FIGS.

The laser engraving device 3400 performs laser engraving on the surface of the embossed plate intermediate 33 in accordance with the laser engraving data 3321 set by the laser engraving data creation device 3300.
The laser engraving apparatus 3400 can have the same configuration as a conventional laser engraving apparatus. However, the present invention is different from the conventional technique in that the object to be burned using the laser engraving apparatus 3400 is only the portion of the differential shape 63 in the embossed plate intermediate 33.
Hereinafter, each part which comprises the laser engraving apparatus 3400 is demonstrated.

  The scanning unit 3401 controls the output of the engraving laser 52 emitted from the laser irradiation unit 3402 according to the laser engraving data 3321 set by the laser engraving data creation device 3300 and also inputs from the laser engraving data creation device 3300 In accordance with the instruction, the laser irradiation unit 3402 is moved in the direction along the rotation axis 3404 (direction AA in the figure).

  The rotation drive unit 3403 drives the rotation shaft 3404 according to the instruction input from the laser engraving data creation device 3300 to rotate the embossed plate intermediate 33 supported by the rotation shaft 3404.

As described above, in the laser engraving apparatus 3400, the laser irradiation unit 3402 is moved in the direction along the rotation axis 3404 (direction AA in the figure) by the scanning unit 3401, and the embossed plate intermediate is rotated by the rotation driving unit 3403. By rotating 33, laser engraving can be performed on the entire area of the surface of the embossed plate intermediate 33.
Then, in accordance with the laser engraving data 3321 set by the laser engraving data creation device 3300, by controlling the output of the engraving laser 52 irradiated by the laser irradiation unit 3402, the portion of the differential shape 63 in the embossed plate intermediate 33 Can only burn off.

In the above, the method of controlling the output of the engraving laser 52 irradiated by the laser irradiation unit 3402 is exemplified as the method of burning only the portion of the difference shape 63 in the embossed plate intermediate 33. However, the present invention is not limited to this, and any embossing plate intermediate 33 can be used as long as only the portion of the differential shape 63 can be burned off.
For example, instead of the method of controlling the output of the engraving laser 52, a method of controlling the irradiation time of the engraving laser 52 or the like may be used.

(Laser engraving data creation device 3300)
Next, the laser engraving data creation device 3300 shown in FIG. 20 will be described with reference to FIGS.

(Hardware configuration of laser engraving data creation device)
FIG. 21 is a diagram showing a hardware configuration of the laser engraving data creation device 3300 shown in FIG. As shown in FIG. 21, the laser engraving data creation device 3300 has, for example, a control unit 3301, a storage unit 3302, a media input / output unit 3303, peripheral devices, as in the hardware configuration of the mask data generation processing unit 2100 and the like described above. A device I / F (interface) unit 3304, a communication unit 3305, an input unit 3306, a display unit 3307, and the like can be realized by a general computer configured by being connected via a bus 3308.

The control unit 3301 includes a CPU, a ROM, a RAM, and the like.
The CPU calls a program stored in the storage unit 3302, ROM, recording medium, or the like to a work memory area on the RAM and executes it, and drives and controls each unit connected via the bus 3308. The ROM permanently holds a computer boot program, a program such as BIOS, data, and the like. The RAM temporarily stores the loaded program and data, and includes a work area used by the control unit 3301 for performing various processes.

  The storage unit 3302 is, for example, a hard disk drive, and stores a program executed by the control unit 3301 during processing to be described later, data necessary for program execution, an OS, and the like. These program codes are read by the control unit 3301 as necessary, transferred to the RAM, and read and executed by the CPU.

The media input / output unit 3303 is a media input / output device such as a DVD drive, and performs data input / output.
The peripheral device I / F unit 3304 is a port for connecting a peripheral device, and transmits / receives data to / from the peripheral device via the peripheral device I / F unit 3304. The connection form with the peripheral device may be wired or wireless.
A communication unit 3305 includes a communication control device, a communication port, and the like, and is a communication interface that mediates communication with a network or the like, and performs communication control.

The input unit 3306 is, for example, an input device such as a keyboard, a pointing device such as a mouse, or a numeric keypad, and outputs input data to the control unit 3301.
The display unit 3307 includes a display device such as a liquid crystal panel or a CRT monitor, and a logic circuit (video adapter or the like) for executing display processing in cooperation with the display device, and is input under the control of the control unit 3301. Display information is displayed on a display device.
A bus 3308 is a path that mediates transmission / reception of control signals, data signals, and the like between the devices.

(Functional configuration of laser engraving data creation device)
Next, the functional configuration of the laser engraving data creation device 3300 will be described with reference to FIG.
As shown in FIG. 22, the laser engraving data creation apparatus 3300 includes, as means executed by the control unit 3301, differential shape data acquisition means 3311, data conversion means 3312, laser engraving data storage means 3313, and laser engraving data. The storage unit 3302 stores differential shape data 24, laser engraving data 3321, and the like.
Each of the above-described difference shape data acquisition means 3311, data conversion means 3312, laser engraving data storage means 3313, and laser engraving data setting means 3314 is, for example, stored in the storage unit 3302 of each of the above means. It functions when the control unit 3301 acquires the program code describing the instruction for realizing the processing from the storage unit 3302 and executes it.

  In the differential shape data acquisition unit 3311, the control unit 3301 acquires the differential shape data 24 from the storage unit 3302.

  In the data conversion means 3312, the control unit 3301 converts the difference shape data 24 into laser engraving data 3321.

  The laser engraving data storage unit 3313 stores the laser engraving data 3321 created by the data conversion unit 3312 in the storage unit 3302 by the control unit 3301.

  In the laser engraving data setting unit 3314, the control unit 3301 sets the laser engraving data 3321 in the laser engraving data creation device 3300 based on preset values.

  The difference shape data 24 represents the difference shape between the emboss shape data 21 and the etching shape data 23 as described above.

  The laser engraving data 3321 instructs the laser engraving apparatus 3400 to output the engraving laser 52 irradiated by the laser irradiation unit 3402 to a predetermined surface position of the embossed plate intermediate 33.

(Processing procedure of laser engraving data creation device)
Next, a processing procedure of the laser engraving data creation device 3300 will be described with reference to FIG.
In the process of creating the laser engraving data, the difference shape data 24 is stored in advance in the storage unit 3302 via the media input / output unit 3303 that is a hardware component of the laser engraving data creation device 3300. Shall.

  As shown in FIG. 23, the control unit 3301 of the laser engraving data creation device 3300 first obtains the differential shape data 24 from the storage unit 3302 (S3311), and converts the differential shape data 24 into laser engraving data 3321. (S3312).

The specific processing of this data conversion is, for example, as follows.
That is, the control unit 3301 calculates the output of the engraving laser 52 irradiated by the laser irradiation unit 3402 according to the value (difference value) of each pixel (cell) of the difference shape data 24, and uses this as the difference shape data. This is performed for all 24 pixels (cells).
In addition, the control unit 3301 calculates the position at which the engraving laser 52 is irradiated on the surface of the embossed plate intermediate body 33 according to the arrangement of each pixel (cell) in the difference shape data 24, and performs the scanning unit 3401 and rotation. Information for instructing the drive unit 3403 is created.
In this way, the control unit 3301 converts the difference shape data 24 that is image data into laser engraving data 3321 for driving the laser engraving apparatus 3400.

  After that, the control unit 3301 saves the created laser engraving data 3321 in the storage unit 3302 (S3313), and sets the laser engraving data 3321 to a preset value set in the laser engraving data creation device 3300. Based on the setting (S3314).

  As described above, in the laser engraving apparatus 3400, the rotation driving unit 3403 drives the rotating shaft 3404 and is supported by the rotating shaft 3404 in accordance with an instruction input from the laser engraving data creation apparatus 3300. The intermediate unit 33 is rotated, and the scanning unit 3401 moves the laser irradiation unit 3402 in a direction along the rotation axis 3404 (A-A direction in the drawing) in accordance with an instruction input from the laser engraving data creation device 3300. By irradiating the engraving laser 52 whose output is controlled according to the laser engraving data 3321, the laser irradiation unit 3402 burns off only the portion of the differential shape 63 in the embossed plate intermediate 33, and the desired embossed shape 61 is obtained. It can be formed on the embossed plate 35.

  As described above, in the embossed plate manufacturing method 1, first, an embossed plate intermediate in which a multistage etched shape 62 is formed on the surface of the plate material 31 by performing the chemical etching step 32 using the mask data 22. The body 33 is manufactured, and then the embossed plate intermediate body 33 is subjected to a laser engraving process 34 using the differential shape data 24 generated in consideration of the shape change due to the side etching, thereby obtaining a desired embossed shape 61. Since the portion of the differential shape 63 between the etching shape 62 and the etching shape 62 is burned off, the desired embossed shape 61 can be easily formed on the embossed plate 35.

  Further, in the laser engraving process 34, the portion burned off by the irradiation of the engraving laser 52 is only the portion of the differential shape 63 in the embossed plate intermediate 33, and the volume of the portion to be burned out is the volume of the desired embossed shape 61. Is significantly smaller than Therefore, compared to the case where the desired embossed shape 61 is formed directly on the embossed plate 35 from the plate material 31 using the engraving laser 52, the embossed plate manufacturing method 1 can significantly shorten the manufacturing time. .

  As mentioned above, although each embodiment was described about the manufacturing method of the embossing plate concerning the present invention, the creation device of the data for laser engraving, the creation method of the data for laser engraving, and the program, the present invention is limited to the above-mentioned embodiment. It is not something. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention and exhibits the same function and effect regardless of the case. Are included in the technical scope.

DESCRIPTION OF SYMBOLS 1 Embossing plate manufacturing method 2 Data processing process 3 Embossing plate manufacturing process 21 Emboss shape data 21a Threshold value 22 Mask data 22a Opening 22b Mask part 23 Etching shape data 24 Differential shape data 31 Plate material 32 Chemical etching process 32a Resist layer formation 32b Pattern Exposure 32c Chemical etching 32d Resist pattern removal 33 Embossed plate intermediate 34 Laser engraving process 34a Laser engraving 35 Embossed plate 41 Etching target 51 Resist layer 51a Opening 51b Mask portion 52 Engraving laser 61 Embossed shape 62 Etched shape 63 Differential shape 101 Plate Material 102 Resist layer 102a Opening portion 102b Mask portion 103 Exposure laser 104 Depression 105 Embossed plate 106 Etching shape 111 Engraving laser 11 Embossed shape 1000 Embossed plate manufacturing system 2000 Data processing unit 2100 Mask data generation processing unit 2101 Control unit 2102 Storage unit 2103 Media input / output unit 2104 Peripheral device I / F (interface) unit 2105 Communication unit 2106 Input unit 2107 Display unit 2108 Bus 2111 Emboss shape data acquisition means 2112 Binarization processing means 2113 Mask data storage means 2114 End determination means 2200 Etching shape data generation processing section 2201 Control section 2202 Storage section 2211 Mask data acquisition means 2212 Corrosion depth data acquisition means 2213 Side etching profile acquisition means 2214 Etching simulation means 2215 Etching shape data storage means 2216 Completion judging means 2221 Corrosion depth data 2 22 Side etching profile 2223, 2223a, 2223b, 2223c Distance data 2224 Etching data 2300 Differential shape data generation processing unit 2301 Control unit 2302 Storage unit 2311 Emboss shape data acquisition unit 2312 Etching shape data acquisition unit 2313 Difference processing unit 2314 Differential shape data storage Means 3000 Embossed plate manufacturing section 3100 Chemical etching process section 3200 Laser engraving process section 3300 Laser engraving data creation device 3301 Control section 3302 Storage section 3303 Media input / output section 3304 Peripheral equipment I / F (interface) section 3305 Communication section 3306 Input section 3307 Display unit 3308 Bus 3311 Differential shape data acquisition means 3312 Data conversion means 3313 Laser engraving data storage hand 3314 data setting means 3321 laser engraving data 3400 laser engraver 3401 scanning unit 3402 laser irradiator 3403 rotating unit 3404 rotates shaft

Claims (8)

Performing a chemical etching to form a depression on the surface of the embossing plate;
The difference between the emboss shape data representing the desired emboss shape and the etching shape data generated by simulating the shape of the recess obtained by the first step using the same conditions as the etching conditions of the first step A second step of performing laser engraving on the embossed plate in which the depression is formed by the first step, based on the differential shape obtained from
An embossed plate manufacturing method comprising: The first step includes
The chemical etching is performed using a corrosive solution on the embossed plate in which a resist pattern is formed on the surface by pattern exposure using a mask data having an opening and a mask, which is generated by binarizing the emboss shape data with a threshold value. The method for producing an embossed plate according to claim 1, wherein the step is to form the depression. The simulation is
Using the mask data,
In a location corresponding to the opening of the mask data, a predetermined corrosion depth is subtracted,
In a portion corresponding to the mask portion of the mask data, based on a side etching profile representing a relationship between a distance from the boundary between the opening and the mask portion toward the mask portion and a corrosion depth, the boundary from the boundary to the mask portion side. By subtracting the corrosion depth according to the distance to
The method for manufacturing an embossed plate according to claim 1, wherein the method is a simulation for generating the etching shape data. Means for obtaining difference shape data obtained from a difference between emboss shape data representing a desired emboss shape and etching shape data generated by simulation of an etching shape obtained by chemical etching;
Means for converting the acquired differential shape data into data for laser engraving for driving a laser engraving device;
Means for setting the laser engraving data in the laser engraving apparatus;
An apparatus for creating data for laser engraving. The simulation is
Using the mask data having an opening and a mask part generated by binarizing the emboss shape data with a threshold value,
In a location corresponding to the opening of the mask data, a predetermined corrosion depth is subtracted,
In a portion corresponding to the mask portion of the mask data, based on a side etching profile representing a relationship between a distance from the boundary between the opening and the mask portion toward the mask portion and a corrosion depth, the boundary from the boundary to the mask portion side. By subtracting the corrosion depth according to the distance to
5. The apparatus for creating laser engraving data according to claim 4, wherein the apparatus is a simulation for generating the etching shape data. Computer
Obtaining differential shape data obtained from a difference between emboss shape data representing a desired emboss shape and etching shape data generated by simulation of an etching shape obtained by chemical etching;
Converting the acquired differential shape data into data for laser engraving for driving an apparatus for performing laser engraving; and
Setting the laser engraving data in a laser engraving apparatus;
A method of creating data for laser engraving, characterized in that The simulation is
Using the mask data having an opening and a mask part generated by binarizing the emboss shape data with a threshold value,
In a location corresponding to the opening of the mask data, a predetermined corrosion depth is subtracted,
In a portion corresponding to the mask portion of the mask data, based on a side etching profile representing a relationship between a distance from the boundary between the opening and the mask portion toward the mask portion and a corrosion depth, the boundary from the boundary to the mask portion side. By subtracting the corrosion depth according to the distance to
The method for creating data for laser engraving according to claim 6, wherein the method is a simulation for generating the etching shape data.   A program that causes a computer to function as the laser engraving data creation device according to claim 4 or 5.

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