JP2016058471A - Wound coil and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the number of turns of a coil, by reducing a region where a wire is not wound, in the winding core part of a winding coil.SOLUTION: By chamfering a flange 12, a bottom face boundary chamfered region 24, i.e., a region where the ridge lines bordering the bottom face 14 and the inner wall surface 15, and the bottom face 14 and the outer wall surface 16 are rounded, is formed. A bottom face electrode 30a is formed on the bottom face 14 and the bottom face boundary chamfered region 24, from a section X1 defined by the inner wall surface 15 and outer wall surface 16 constituting the flange 12, in a mode not projecting to the other opposing inner wall surface 15. A wire 40 is connected to a place Y1 of the bottom face electrode 30a, not projecting to the other inner wall surface 15.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a wire-wound coil capable of increasing the number of turns of a coil and a method for manufacturing the same.

  As shown in FIG. 7, one of the typical winding-type coils includes a winding core portion 111 and a pair of flange portions 112 disposed at both ends thereof. There is a wound coil 110 formed by winding 140 and connecting its start and end to a terminal electrode 130 formed at the bottom of the flange 112.

  The terminal electrode 130 of the wound coil 110 is generally formed by immersing the lower portion of the flange 112 in a solder bath. Therefore, the terminal electrode 130 is formed with a predetermined thickness not only on the bottom surface 114 of the flange portion 112 but also on the side surface 117, the inner wall surface 115, and the outer wall surface 116. Then, the wire 140 is drawn from the bottom surface 114 of the terminal electrode 130 toward the core portion 110 and wound. (See Patent Document 1 FIG. 5).

JP 2001-68343 A

  As described above, since the terminal electrode 130 is also formed on the inner wall surface 115 with a predetermined thickness, the terminal electrode 130 is formed so as to protrude from one inner wall surface 115 toward the other inner wall surface 115. Therefore, for example, when the wire 140 is pulled out from the bottom surface 114 of the terminal electrode 130 toward the core portion 111, the terminal electrode 130 formed on the inner wall surface 115 is pulled out. Therefore, in the axis CL direction of the core portion, there is a problem that the region corresponding to the thickness of the terminal electrode 130 becomes a region where the wire 140 cannot be wound and cannot be effectively used as the core portion 111.

  This invention solves the said subject, and provides the winding type coil which can reduce the area | region which cannot wind a wire in a core part, and can increase the number of turns of a coil, and its manufacturing method. Objective.

In order to solve the above problems, the wound coil of the present invention is
A core comprising a core portion and a pair of flange portions disposed on both ends of the core portion, a terminal electrode disposed on the flange portion, and a coil wound around the core portion And a wire having a starting end and a terminal end connected to the terminal electrode,
The flange portion is a bottom surface that is a surface facing the mounting target, an inner wall surface that is a surface facing the pair of flange portions, an outer wall surface that is a surface opposite to the inner wall surface, and the bottom surface. A bottom boundary chamfering that is a region in which a side surface orthogonal to the outer wall surface, a ridge line portion that forms a boundary between the bottom surface and the inner wall surface, and a ridge line portion that forms a boundary between the bottom surface and the outer wall surface are rounded. An area, a ridge line portion that forms a boundary between the side surface and the inner wall surface, and a side boundary chamfer region that is a region in which the ridge line portion that forms a boundary between the side surface and the outer wall surface is rounded. ,
The terminal electrode includes a bottom electrode to which the wire is connected and a side electrode formed near the bottom surface of the side surface so as to be connected to the bottom electrode,
The bottom electrode is located on the other side facing the area defined by the inner wall surface and the outer wall surface constituting the flange at the position where the wire is connected when viewed from the axial direction of the core portion. The bottom surface and the bottom boundary chamfered region are formed so as not to protrude toward the inner wall surface side.

  In the wound coil according to the present invention, it is preferable that the side electrode is formed in the side surface and the side surface chamfered region in a manner that does not protrude from the section to the other inner wall surface side.

  Since the side electrode is formed in such a manner that it does not protrude from the area defined by the inner wall surface and the outer wall surface that constitute the collar portion to the other inner wall surface facing each other, the wire contacts the bottom electrode and the side electrode. Without making it, it can wind to the both ends of a core part, and can increase the number of turns of a coil.

  Alternatively, the side electrode is configured such that the side surface and the side boundary chamfer are protruded from the area of the flange where the side electrode is formed to the other inner wall surface side and the outer wall surface side of the flange portion. It is preferably formed in the region.

  The side electrode is formed in the side surface and the side boundary chamfering region in such a manner that the side electrode protrudes from the area of the flange where the side electrode is formed to the other inner wall surface side and the outer wall surface side of the flange portion. Therefore, the solder joint area when mounted on the mounting object is widened, and the reliability of the joint can be improved.

  Moreover, it is preferable that the said side surface electrode is formed to the position higher than the lowest position of a core part by making the position of the said bottom face side of the said collar part into a base end.

  Since the side surface electrode is formed up to a position higher than the lowest position of the winding core portion, it is formed up to a position where the solder joint is high when mounted on the mounting target, and the reliability of the joint can be improved.

Moreover, in order to solve the said subject, the manufacturing method of the winding type coil of this invention is the following.
A core having a core and a pair of flanges disposed on both ends of the core; a terminal electrode having a bottom electrode and a side electrode disposed on the flange; and the core A winding-type coil manufacturing method comprising: a coil wound to constitute a coil; and a wire having a start end and a termination connected to the terminal electrode,
The flanges disposed on both ends of the core portion are opposite to the bottom surface, which is a surface facing the mounting target, the inner wall surface, which is a surface facing the pair of flange portions, and the inner wall surface. Chamfering a core having an outer wall surface that is a side surface, and a bottom surface and a side surface orthogonal to the outer wall surface, thereby forming a ridge line portion that forms a boundary between the bottom surface and the inner wall surface, and the bottom surface A bottom boundary chamfering region that is a region in which a ridge line portion that forms a boundary with the outer wall surface is rounded, a ridge line portion that forms a boundary between the side surface and the inner wall surface, and the side surface and the outer wall surface Preparing a core in which a side boundary chamfered region is formed, which is a region having a rounded ridgeline that forms a boundary;
Conductivity having a thickness equal to or less than a dimension in a direction perpendicular to the bottom surface from the bottom surface to the upper end portion of the inner wall surface of the chamfering region between the bottom surface of the flange and the inner wall surface on the paste holding surface of the stage A conductive paste film forming step for forming a conductive paste film;
The bottom surface of the flange portion is defined by the inner wall surface and the outer wall surface constituting the flange portion by bringing the bottom surface into contact with the conductive paste film in a posture in which the bottom surface is parallel to the paste holding surface. A bottom paste pattern forming step for forming a bottom paste pattern by applying a conductive paste to the bottom and the bottom boundary chamfering region in a manner that does not protrude from the area to the other inner wall surface facing the area,
A side surface paste pattern forming step for forming a side surface paste pattern so as to be connected to the bottom surface paste pattern near the bottom surface of the side surface and the side surface chamfered region,
Firing the bottom paste pattern and the side paste pattern, and forming a bottom electrode that does not protrude from the area toward the other inner wall, and a firing step that forms a side electrode connected to the bottom electrode. It is a feature.

Further, in the method of manufacturing a wound coil according to the present invention,
In the side surface paste pattern forming step, a thickness exceeding the dimension in the direction perpendicular to the side surface from the side surface to the front end portion of the inner wall surface and the outer wall surface of the side surface chamfering region on the paste holding surface of the stage The inner wall surface and the outer wall surface constituting the flange portion are formed by contacting the side boundary chamfered region of the flange portion and the predetermined region of the side surface with the conductive paste film. The side paste pattern is formed in such a manner as to protrude from the area defined by and to the other inner wall surface side and the outer wall surface side of the flange,
It is preferable that the side electrode protruding from the section to the other inner wall surface side and the outer wall surface side of the flange portion is formed through the firing step.

  By adopting the above configuration, it becomes possible to form the side electrodes in such a manner as to protrude from the area defined by the inner wall surface and the outer wall surface constituting the collar portion to the inner wall surface side and the outer wall surface side. It is possible to obtain a wire-wound coil with a wide bonding area of solder when mounted on a target and having high bonding reliability.

In the wound coil according to the present invention, when the bottom electrode is viewed from the axial direction of the winding core portion, at the position where the wire is connected, from the area defined by the inner wall surface and the outer wall surface constituting the collar portion, Since it is formed in such a manner that it does not protrude on the inner wall surface side of the other opposite flange part, for example, the wire connected to the bottom electrode is guided near both ends of the core part along the inner wall surface of the flange part. The wire wound around the core part can be drawn out to the bottom electrode along the inner wall surface of the flange part, and the number of turns of the coil in the core part can be increased.
As a result, it is possible to provide a small-sized and high-characteristic wound coil.

In the method for manufacturing a wound coil according to the present invention, a chamfered portion is chamfered to form a bottom boundary chamfered region, and the opposite ridge is formed from an area defined by an inner wall surface and an outer wall surface constituting the ridge portion. The bottom electrode is formed so as not to protrude to the inner wall surface side of the portion. Therefore, since it is necessary to arrange the wire so as to avoid the electrode protruding to the inner wall surface side of the flange portion, it is possible to reduce the sacrifice of the area where the wire can be wound in the winding core portion, and to reduce the number of turns of the coil. A large number of wire-wound coils can be manufactured efficiently.
That is, as a conductive paste film for immersing the collar part to form a bottom paste pattern, a chamfered region between the bottom surface of the collar part and the inner wall surface, which is perpendicular to the bottom surface from the bottom surface to the upper end part of the inner wall surface. A conductive paste film having a thickness less than or equal to the dimension in the direction is formed, and the bottom paste pattern to be the bottom electrode is formed by contacting the collar portion with the conductive paste film. It is possible to reliably form a bottom electrode that does not protrude to the inner wall surface side, increase the number of turns of the coil in the winding core, and efficiently manufacture a small-sized and high-characteristic wound coil. it can.

It is the figure which showed the winding type coil concerning Embodiment 1 of this invention, Comprising: (a) is a front view, (b) is a side view. It is the figure which showed the core and terminal electrode of the winding type coil shown in FIG. 1, Comprising: (a) is the half sectional view seen from the front, (b) is a side view, (c) is P1-P1 sectional drawing, d) is a Q1-Q1 sectional view. It is a figure for demonstrating the manufacturing method of the winding type coil shown in FIG. 1, Comprising: It is the figure which showed a mode that a terminal electrode was formed in the core shown in FIG. It is the figure which showed the winding type coil concerning Embodiment 2 of this invention, Comprising: (a) is a front view, (b) is a side view. It is the figure which showed the core and terminal electrode of the winding type coil shown in FIG. 4, Comprising: (a) is the half sectional view seen from the front, (b) is a side view, (c) is P2-P2 sectional drawing, d) is a Q2-Q2 sectional view. FIG. 6 is a diagram for explaining a method of manufacturing the wire-wound coil shown in FIG. 4, and shows how a terminal electrode is formed on the core shown in FIG. 5. It is a front view of the conventional winding type coil.

[Embodiment 1]
As shown in FIGS. 1A and 1B, the wire-wound coil 10 according to the first embodiment of the present invention includes a core portion 11 and a pair of flange portions 12 disposed on both ends of the core portion 11. And a core 13 having the following. A terminal electrode 30 for joining the wound coil 10 to an object to be mounted (such as an electric circuit board) is formed at the lower part of the flange 12. Then, the wire 40 is wound around the core portion 11, the wire start end 40 a is connected to one terminal electrode 30, and the wire end point 40 b is connected to the other terminal electrode 30.

  The core 13 includes a prismatic core portion 11 and rectangular parallelepiped flange portions 12 formed at both ends of the core portion 11, and has a substantially H-shaped cross section. As a material constituting the core 13, a ceramic material such as ferrite is used. In addition, alumina, a metal magnetic material, etc. can be used.

  The wire 40 is a conducting wire whose outer periphery is coated with resin, and is wound around the core portion 11 of the core 13 to constitute a coil. The starting end 40a and the terminal end 40b of the wire are thermocompression bonded to the terminal electrodes 30 and 30, respectively, and are electrically connected in a state where the coating is peeled off.

  As shown in FIGS. 2A to 2D, the flange portion 12 of the core 13 includes a bottom surface 14 that is a surface facing the mounting target, an inner wall surface 15 that is a surface facing the pair of flange portions 12, and An outer wall surface 16 that is a surface opposite to the inner wall surface 15, a side surface 17 that is a surface orthogonal to the bottom surface 14 and the outer wall surface 16 of the flange 12, and a top surface 18 that is a surface opposite to the bottom surface 14. And.

  The corners of the collar portion 12 are chamfered and formed with roundness. That is, the flange portion 12 includes a bottom boundary chamfering region 24 (24a, 24b) that is a region in which a ridge line portion that forms a boundary between the bottom surface 14 and the inner wall surface 15 and a boundary between the bottom surface 14 and the outer wall surface 16 is rounded. Side surface chamfering regions 27 (27a, 27b), which are regions in which a ridge line portion that forms a boundary between the side surface 17 and the outer wall surface 16 is rounded, are provided. Further, the ridge line portion that forms the boundary between the bottom surface 14 and the side surface 17 is also provided with a rounded region.

  When these roundnesses are regarded as arcs, the radius is, for example, not less than 0.2 times and not more than 0.4 times the distance between the inner wall surface 15 and the outer wall surface 16. Since the corners of the flange portion 12 are not cut out linearly or stepwise, but are chamfered so as to have a large R, cracks are hardly generated at the corners of the flange portion 12.

  The terminal electrode 30 includes a bottom electrode 30a to which the wire 40 is connected, and a side electrode 30b formed near the bottom surface of the side surface 17 so as to be connected to the bottom electrode 30a. Silver is used as the material constituting the terminal electrode 30. In addition, copper, conductive resin, or the like can be used. As shown in FIG. 1B, the starting end 40a and the terminating end 40b of the wire are connected to a position Y1 near the center of the bottom electrode 30a when viewed from the axis CL direction of the core.

  As shown in FIG. 2A, the bottom electrode 30a is formed from the bottom surface 14 to the bottom boundary chamfer regions 24a and 24b. And it forms in the aspect which does not protrude from the area X1 prescribed | regulated by the inner wall surface 15 and the outer wall surface 16 which comprise the collar part 12 to the other inner wall surface 15 side which opposes. Moreover, it forms in the aspect which does not protrude also in the outer wall surface 16 side which prescribes | regulates the said area X1. That is, the bottom electrode 30 a is not formed on the inner wall surface 15 and the outer wall surface 16 of the flange portion 12, but is formed so as to fit in the bottom surface chamfering region 24.

  On the other hand, as shown in FIG. 2D, the side electrode 30b is formed from the side surface 17 to the side boundary chamfered regions 27a and 27b. And it forms in the aspect which does not protrude from the area X1 prescribed | regulated by the inner wall surface 15 and the outer wall surface 16 which comprise the collar part 12 to the other inner wall surface 15 side which opposes. Moreover, it forms in the aspect which does not protrude also in the outer wall surface 16 side which prescribes | regulates the said area X1. That is, the side surface electrode 30 b is not formed on the inner wall surface 15 and the outer wall surface 16 of the flange portion 12, but is formed so as to fit in the side surface chamfered region 27.

  Further, the side electrode 30b is formed to have a height (Z direction) higher than that of the bottom electrode 30a. Specifically, it is formed up to a position that is higher than the lowest position of the core part 11 with the position on the bottom surface 14 side of the collar part 12 as the base end. With this configuration, when the wire-wound coil 10 is joined to a mounting target with solder, the position of the solder is formed so as to be high, so that the joining reliability can be increased.

  In the wound coil 10 according to the first embodiment, the bottom electrode 30a and the side electrode 30b are opposed to the other inner wall surface 15 side from the area X1 defined by the inner wall surface 15 and the outer wall surface 16 constituting the flange portion 12. Is formed in a manner that does not protrude. With the above configuration, the wire 40 can be wound to both ends of the core part 11 without contacting the bottom electrode 30a and the side electrode 30b, and the number of turns of the coil can be increased.

  Further, the terminal electrode 30 is formed only on the bottom surface 14, the bottom surface boundary chamfered region 24, the side surface 17, and the side surface boundary chamfered region 27, and extends along the outer edge of the flange portion 12 when viewed from the axis CL direction of the core portion. Therefore, the magnetic flux passing in the direction of the axis CL of the coil can be prevented from being blocked.

  In this embodiment, the bottom electrode 30a and the side electrode 30b are formed in the bottom boundary chamfering region 24 and the side boundary chamfering region 27, and extend to the outer wall surface 16 beyond the bottom boundary chamfering region 24 and the side boundary chamfering region 27. Is not formed, but may be formed to protrude toward the outer wall surface 16 in some cases.

  Next, the manufacturing method of the wire wound coil concerning Embodiment 1 of this invention is demonstrated.

  First, a sintered core having the above-described configuration is prepared. This sintered core is before chamfering, and is obtained, for example, by forming a ceramic material into powder and then firing it.

  Then, this sintered core is put in a barrel, and barrel polishing is performed by rotating the barrel, and the ridge line portion of the flange portion 12 is chamfered. By this chamfering, a core in which the bottom boundary chamfering region 24 and the side boundary chamfering region 27 are formed on the flange 12 is produced (step of preparing the core).

  On the other hand, a conductive paste film P for forming the terminal electrode 30 is formed on the stage 70 (conductive paste film forming step). The stage 70 has a flat paste holding surface 70a, and is made of a metal material such as stainless steel, for example. The transfer paste is a conductive paste used as a material for the terminal electrode 30. After applying this conductive paste to the paste holding surface 70a, it is scraped off with a squeegee to form a conductive paste film P having a predetermined thickness. At this time, the thickness (height) h1 of the conductive paste film P is the upper end of the chamfered region (bottom boundary chamfered region) 24a between the bottom surface 14 and the inner wall surface 15 of the flange 12 from the bottom surface 14 to the inner wall surface 15. When the bottom surface 14 of the flange portion 12 of the core 13 is brought into contact with the thickness of the dimension A1 or less in the direction perpendicular to the bottom surface 14 to the portion, that is, the paste holding surface 70a, the bottom boundary chamfering of the flange portion 12 In the region 24, the distance between the paste holding surface 70a and the squeegee is set so that the flange 12 does not soak into the paste film P up to a position exceeding the chamfered region 24a at the boundary between the bottom surface 14 and the inner wall surface 15. . The upper end portion refers to the boundary between the bottom boundary chamfering region 24 a and the inner wall surface 15.

  Next, as shown in FIG. 3A, the conductive paste film P is brought into contact with one side surface 17 side of the flange 12, and the side surface paste pattern SP <b> 1 is formed on the one side surface 17 and the side surface chamfered region 27. (Side paste pattern forming step).

  First, the core 13 is tilted by a predetermined angle and attached to a holding substrate 65 provided with a resin member 66 having elasticity and adhesiveness. The inclination angle of the core 13 is set so that the side surface paste pattern SP1 is applied to a position higher than the lowest position of the core part 11. For example, when the bottom surface 14 of the flange portion 12 is 0 °, the core 13 is attached with an inclination of 75 ° about the axis CL of the core portion. Then, the holding substrate 65 is lowered while the core 13 is inclined, and the pair of flanges 12 are brought into contact with the paste holding surface 70 a of the stage 70. As a result, the side paste pattern SP1 is formed on the one side 17 and the side boundary chamfered region 27.

  The thickness (height) h1 of the conductive paste film P is, as described above, from the bottom surface 14 to the upper end portion of the inner wall surface 15 of the chamfered region 24a at the boundary between the bottom surface 14 of the flange 12 and the inner wall surface 15. The thickness is equal to or less than the dimension A1 in the direction perpendicular to the bottom surface 14. Further, the chamfering of the core 13 is performed by a barrel polishing method, and the degree of chamfering of the chamfering region 24a at the boundary between the bottom surface 14 and the inner wall surface 15 of the flange 12 and the side surface chamfering region 27 is approximate. Therefore, the conductive paste is not substantially formed on the inner wall surface 15 beyond the side boundary chamfered region 27 of the flange 12. Accordingly, the side surface paste pattern SP1 does not protrude from the area X1 defined by the inner wall surface 15 and the outer wall surface 16 constituting the flange 12 to the other inner wall surface 15 side facing the side surface 17 and the side surface chamfer. Formed in region 27.

  Next, as shown in FIG. 3B, the conductive paste film P is brought into contact with the bottom surface 14 side of the flange 12, and a bottom surface paste pattern BP is formed on the bottom surface 14 and the bottom surface chamfering region 24 (bottom surface paste pattern). Forming step).

  First, the holding substrate 65 is moved in the arrow T1 direction (a direction substantially parallel to the paste holding surface 70a and perpendicular to the axis CL of the core portion). Then, the core 13 is rotated clockwise around the axis CL of the winding core, and is rolled on the stage 70 so that the bottom surfaces 14 of the pair of flanges 12 are in contact with the paste holding surface 70a. As a result, the bottom paste pattern BP is formed on the bottom surface 14 of the flange 12 and the bottom boundary chamfered region 24.

  At this time, the thickness (height) h1 of the conductive paste film P is equal to the upper end portion of the chamfered region 24a at the boundary between the bottom surface 14 of the flange 12 and the inner wall surface 15 from the bottom surface 14 to the inner wall surface 15 as described above. Therefore, when the bottom surface 14 of the collar portion 12 is brought into contact with the paste holding surface 70a, the bottom boundary chamfering region 24 of the collar portion 12 is obtained. Of these, the flange portion 12 is not soaked to a position exceeding the chamfered region 24a at the boundary between the bottom surface 14 and the inner wall surface 15, and the conductive paste is applied to the inner wall surface 15 beyond the chamfered region 24a at the boundary between the bottom surface 14 and the inner wall surface 15. Is not formed. Therefore, the bottom surface paste pattern BP is not protruded from the area X1 defined by the inner wall surface 15 and the outer wall surface 16 constituting the collar portion 12 toward the other inner wall surface 15 side. Formed in region 24.

Next, as shown in FIG. 3C, the conductive paste film P is brought into contact with the other side surface 17 of the flange 12, and the side surface paste pattern SP <b> 2 is formed on the other side surface 17 and the side surface chamfered region 27. (Side paste pattern forming step).
Here again, the holding substrate 65 is moved in the direction of the arrow T1. Then, while rotating the core 13 around the axis CL of the winding core in the clockwise direction, the core 13 is rolled on the stage 70 so that the core 13 is inclined by 75 ° as opposed to FIG. Thereby, the side surface paste pattern SP2 is formed on the other side surface 17 and the side surface chamfered region 27 of the collar portion 12.

  Since the thickness (height) h1 of the conductive paste film P is not more than the above-described dimension A1, the conductive paste is applied to the inner wall surface 15 beyond the side boundary chamfered region 27 of the flange portion 12. Never formed. Further, since the bottom paste pattern BP and the side paste patterns SP1 and SP2 are continuously applied without drying the conductive paste applied to the collar portion 12, the paste patterns are not overlapped and are applied to the section X1. It can form in the aspect which does not protrude to the other inner wall surface 15 side which opposes.

  Next, the bottom paste pattern BP and the side paste patterns SP1 and SP2 are baked to form the bottom electrode 30a and the side electrode 30b connected to the bottom electrode 30a. Thereby, the bottom electrode 30a and the side electrode 30b which do not protrude to the other inner wall surface 15 side facing from the above-mentioned section X1 are formed (firing process).

  Then, the wire 40 is wound around the core part 11 of the core 13 and the starting end 40a and the terminal end 40b of the wire are connected to the center of the bottom electrode 30a when viewed from the axis CL direction of the core part (winding step). ). The position Y1 that connects the starting end 40a and the terminal end 40b of the wire is not limited to the center of the bottom electrode 30a, but is a place that does not protrude from the area X1 defined by the inner wall surface 15 and the outer wall surface 16 to the other inner wall surface 15 side. I just need it. Through the above steps, the wound coil 10 having the structure shown in FIG. 1 is obtained.

  According to the manufacturing method described above, the bottom surface of the chamfered region 24a at the boundary between the bottom surface 14 and the inner wall surface 15 of the collar portion 12 is used as the conductive paste film P for immersing the collar portion 12 to form the bottom paste pattern BP. A conductive paste film P having a thickness equal to or smaller than a dimension A1 in a direction perpendicular to the bottom surface 14 from the upper end portion 14 to the upper end portion of the inner wall surface 15 is formed, and the flange portion 12 is brought into contact with the conductive paste film P to form a bottom electrode Since the bottom paste pattern BP to be 30a is formed, it becomes possible to reliably form the bottom electrode 30a that does not protrude toward the inner wall surface 15 side of the other flange portion 12 that faces the other. As a result, the number of turns of the coil in the winding core part 11 can be increased, and the small-sized and high-characteristic wound coil 10 can be efficiently manufactured.

[Embodiment 2]
A winding coil 10A according to another embodiment (second embodiment) of the present invention will be described. In addition, about the structure which is common in the winding type coil 10 demonstrated in Embodiment 1, the same code | symbol is described in the figure explaining 10 A of winding type coils of Embodiment 2, and the description is abbreviate | omitted.

  As shown in FIGS. 4A and 4B and FIGS. 5A to 5D, the wire-wound coil 10A according to the second embodiment has a width dimension of the side electrode 30b along the axis CL direction of the core portion. Is formed to be large. That is, the side electrode 30b is formed so as to protrude from the area X1 defined by the inner wall surface 15 and the outer wall surface 16 constituting the flange portion 12 in the axis CL direction of the core portion. And it is formed so that it may go around the side surface chamfering area 27 from the side surface 17 and cover a part of the inner wall surface 15 and the outer wall surface 16.

  In the wound coil 10A, the width dimension of the bottom electrode 30a at the position Y1 to which the wire 40 is connected is the same as that of the first embodiment, and the width dimension of the side electrode 30b is larger than that. Thereby, while obtaining the effect based on the configuration of the first embodiment, in addition, in the second embodiment, since the solder joint area when mounted on the mounting target is widened, it is possible to obtain the effect of improving the joint reliability. .

Next, the manufacturing method of the wire wound coil concerning Embodiment 2 is demonstrated. This manufacturing method includes a first conductive paste film forming step for forming the bottom electrode 30a and a second conductive paste film forming step for forming the side electrode 30b.
The thickness (height) h2 of the second conductive paste film P2 is a dimension B1 in the direction perpendicular to the side surface 17 from the side surface 17 to the tip of the inner wall surface 15 of the side surface chamfered region 27, and The thickness from the side surface 17 to the tip of the outer wall surface 16 exceeds the dimension B2 in the direction orthogonal to the side surface 17. Here, the tip of the inner wall surface 15 refers to the boundary between the side boundary chamfered region 27 and the inner wall surface 15. Further, the front end portion of the outer wall surface 16 refers to the boundary between the side boundary chamfered region 27 and the outer wall surface 16.

  The step of preparing the core and the step of forming the conductive paste film are the same as in the first embodiment. In the second embodiment, the conductive paste film forming process in the first embodiment is handled as the first conductive paste film forming process.

  In the second embodiment, first, as shown in FIG. 6A, the core 13 is attached to the holding substrate 65 in such a posture that the bottom surface 14 is parallel to the paste holding surface 70a. Then, the first conductive paste film P1 is brought into contact with the bottom surfaces 14 of the pair of flanges 12 to form the bottom paste pattern BP in the bottom surface 14 and the bottom boundary chamfer region 24 (bottom paste pattern forming step). The thickness (height) h1 of the first conductive paste film P1 formed on the paste holding surface 70a of the stage 70 is a chamfered region at the boundary between the bottom surface 14 of the flange 12 and the inner wall surface 15 as in the first embodiment. The thickness 24a is a dimension A1 or less in the direction perpendicular to the bottom surface 14 from the bottom surface 14 to the upper end of the inner wall surface 15.

  Next, the core 13 is pulled up from the stage 70, and the conductive paste is dried. Then, as shown in FIG. 6 (b), a rotating member 68 for rotating the core 13 is brought into contact with the core 13, and the rotating member 68 is in the direction of arrow T2 (substantially parallel to the paste holding surface 70a and the core portion. In the direction perpendicular to the axis CL). Thereby, the core 13 is rotated counterclockwise around the axis CL of the core part. As shown in FIG. 6C, the rotated core 13 is held by the holding substrate 65 in a state inclined by a predetermined angle (core rotation step). As the rotating member 68, for example, a resin member having a high friction coefficient can be used.

  On the other hand, another stage 71 is prepared, and the second conductive paste film P2 is formed on the paste holding surface 71a of the stage 71 (second conductive paste film forming step). The thickness (height) h2 of the conductive paste film P2 is such that the dimension B1 in the direction perpendicular to the side surface 17 from the side surface 17 to the tip of the inner wall surface 15 of the side boundary chamfered region 27 It is set as the thickness which a conductive paste contacts exceeding the dimension B2 of the direction orthogonal to the side surface 17 to the front-end | tip part in the wall surface 16. FIG.

  Then, as shown in FIG. 6D, the second conductive paste film P2 is brought into contact with the one side surface 17 of the flange 12, and the side surface paste pattern SP1 is formed on the one side surface 17 and the side surface chamfered region 27. (Side paste pattern forming step).

  Thus, by setting the thickness (height) h <b> 2 of the second conductive paste film P <b> 2 to exceed the above-described dimensions B <b> 1 and B <b> 2, the side boundary chamfered region 27 is formed on the side surface 17 side of the flange 12. The conductive paste is formed on the inner wall surface 15 and the outer wall surface 16 beyond the above. Accordingly, the side surface paste pattern SP1 is formed so as to protrude from the area X1 defined by the inner wall surface 15 and the outer wall surface 16 constituting the flange portion 12 in the axis CL direction of the core portion. That is, the width of the side paste pattern SP1 is formed to be larger than the width of the bottom paste pattern BP.

  Next, after pulling up the core 13 from the stage 71, the core 13 is rotated counterclockwise by 150 ° using the rotating member 68. Then, the other side surface 17 side is brought into contact with the second conductive paste film P2 formed on the paste holding surface 71a, and the side surface pace pattern SP2 is also formed in the other side surface 17 and the side surface chamfered region 27.

  The firing process and the winding process are the same as in the first embodiment. By these steps, a wound coil 10A having a structure as shown in FIG. 4 is obtained.

  According to the manufacturing method described above, it is possible to easily and surely manufacture a wire-wound coil having a wide bonding area of solder when mounted on a mounting target and having high bonding reliability.

  The present invention is not limited to the above-described embodiments, and various applications and modifications can be made within the scope of the invention.

DESCRIPTION OF SYMBOLS 10, 10A Winding type coil 11 Core part 12 Collar part 13 Core 14 Bottom face 15 Inner wall face 16 Outer wall face 17 Side face 18 Top face 24, 24a, 24b Bottom face chamfer area 27, 27a, 27b Side face chamfer area 30 Terminal electrode 30a Bottom electrode 30b Side electrode 40 Wire 40a Wire start end 40b End of wire 65 Holding substrate 68 Rotating member 70, 71 Stage 70a, 71a Paste holding surface A1 In the bottom boundary chamfering region from the bottom surface to the upper end of the inner wall surface, Dimension in the vertical direction B1 Dimension of the side boundary chamfered region from the side surface to the tip of the inner wall surface in a direction orthogonal to the side surface B2 Perpendicular to the side surface of the side boundary chamfered region from the side surface to the tip of the outer wall wall surface Dimensions in direction CL Core axis P, P1, P2 Conductive paste film BP Bottom paste pattern SP1, SP2 Side paste pattern X1 Area defined by inner wall and outer wall Y1 Position where wire is connected

Claims (6)

A core comprising a core portion and a pair of flange portions disposed on both ends of the core portion, a terminal electrode disposed on the flange portion, and a coil wound around the core portion And a wire having a starting end and a terminal end connected to the terminal electrode,
The flange portion is a bottom surface that is a surface facing the mounting target, an inner wall surface that is a surface facing the pair of flange portions, an outer wall surface that is a surface opposite to the inner wall surface, and the bottom surface. A bottom boundary chamfering that is a region in which a side surface orthogonal to the outer wall surface, a ridge line portion that forms a boundary between the bottom surface and the inner wall surface, and a ridge line portion that forms a boundary between the bottom surface and the outer wall surface are rounded. An area, a ridge line portion that forms a boundary between the side surface and the inner wall surface, and a side boundary chamfer region that is a region in which the ridge line portion that forms a boundary between the side surface and the outer wall surface is rounded. ,
The terminal electrode includes a bottom electrode to which the wire is connected and a side electrode formed near the bottom surface of the side surface so as to be connected to the bottom electrode,
The bottom electrode is located on the other side facing the area defined by the inner wall surface and the outer wall surface constituting the flange at the position where the wire is connected when viewed from the axial direction of the core portion. The wound coil is characterized in that it is formed in the bottom surface and the bottom boundary chamfering region in a manner that does not protrude toward the inner wall surface side. 2. The wound coil according to claim 1, wherein the side surface electrode is formed in the side surface and the side surface chamfering region so as not to protrude from the section to the other inner wall surface side. The side electrode protrudes from the section of the flange where the side electrode is formed to the other inner wall surface side and the outer wall surface side of the flange portion in the side surface and the side boundary chamfering region. The wire-wound coil according to claim 1, wherein the wire-wound coil is formed. The said side electrode is formed to the position higher than the lowest position of a core part by making the position of the said bottom face side of the said collar part into a base end, The Claim 1 characterized by the above-mentioned. Winding coil. A core having a core and a pair of flanges disposed on both ends of the core; a terminal electrode having a bottom electrode and a side electrode disposed on the flange; and the core A winding-type coil manufacturing method comprising: a coil wound to constitute a coil; and a wire having a start end and a termination connected to the terminal electrode,
The flanges disposed on both ends of the core portion are opposite to the bottom surface, which is a surface facing the mounting target, the inner wall surface, which is a surface facing the pair of flange portions, and the inner wall surface. Chamfering a core having an outer wall surface that is a side surface, and a bottom surface and a side surface orthogonal to the outer wall surface, thereby forming a ridge line portion that forms a boundary between the bottom surface and the inner wall surface, and the bottom surface A bottom boundary chamfering region that is a region in which a ridge line portion that forms a boundary with the outer wall surface is rounded, a ridge line portion that forms a boundary between the side surface and the inner wall surface, and the side surface and the outer wall surface Preparing a core in which a side boundary chamfered region is formed, which is a region having a rounded ridgeline that forms a boundary;
Conductivity having a thickness equal to or less than a dimension in a direction perpendicular to the bottom surface from the bottom surface to the upper end portion of the inner wall surface of the chamfering region between the bottom surface of the flange and the inner wall surface on the paste holding surface of the stage A conductive paste film forming step for forming a conductive paste film;
The bottom surface of the flange portion is defined by the inner wall surface and the outer wall surface constituting the flange portion by bringing the bottom surface into contact with the conductive paste film in a posture in which the bottom surface is parallel to the paste holding surface. A bottom paste pattern forming step for forming a bottom paste pattern by applying a conductive paste to the bottom and the bottom boundary chamfering region in a manner that does not protrude from the area to the other inner wall surface facing the area,
A side surface paste pattern forming step for forming a side surface paste pattern so as to be connected to the bottom surface paste pattern near the bottom surface of the side surface and the side surface chamfered region,
Firing the bottom paste pattern and the side paste pattern to form a bottom electrode that does not protrude from the area to the other inner wall surface, and a side electrode connected to the bottom electrode;
A method for manufacturing a wire-wound coil, comprising: In the side surface paste pattern forming step, a thickness exceeding the dimension in the direction perpendicular to the side surface from the side surface to the front end portion of the inner wall surface and the outer wall surface of the side surface chamfering region on the paste holding surface of the stage The inner wall surface and the outer wall surface constituting the flange portion are formed by contacting the side boundary chamfered region of the flange portion and the predetermined region of the side surface with the conductive paste film. The side paste pattern is formed in such a manner as to protrude from the area defined by and to the other inner wall surface side and the outer wall surface side of the flange,
6. The wound coil according to claim 5, wherein, after the firing step, the side electrode protruding from the area to the other inner wall surface side and the outer wall surface side of the flange portion is formed. Manufacturing method.

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