JP2016050306A5 - - Google Patents

Claims (10)

A method for producing a resin molded body, comprising:
The resin molding, ultra high molecular weight polyethylene resin (A), high-density polyethylene resin (B), and containing a conductive material (C), said (A) a viscosity-average molecular weight of the component [g / mol] 100 The viscosity average molecular weight [g / mol] of the component (B) is 200,000 to less than 1,000,000, and the content of the component (A) in the composition is (A ) Component and the component (B) as a total of 100% by mass, more than 70% by mass and less than 90% by mass, and the component (C) contains metal-doped zinc oxide,
By having a step of obtaining a powdery mixture containing the components (A), (B) and (C) and a step of heat compression molding or extrusion molding the powdery mixture, the component (A) and said component (B), and wherein Rukoto be present in at least the (B) to form a phase separation structure having a continuous phase composed of the component, the continuous phase of the component (C) consists of the component (B) To
Manufacturing method of resin molding . 2. The resin molded body according to claim 1, wherein the powdery mixture is obtained using a method of dry blending the components (A), (B) and (C), or a solution mixing method. Method. The method for producing a resin molded body according to claim 1 or 2 , wherein the phase separation structure is a sea-island structure in which a discontinuous phase composed of the component (A) is dispersed in a continuous phase composed of the component (B). . The method for producing a resin molded body according to any one of claims 1 to 3, wherein a bulk specific volume of the component (C) is 200 to 1000 [ml / 100 g]. The manufacturing method of the resin molding of any one of Claims 1-4 whose content of the said (C) component in the said conductive resin composition is 2-20 mass%. The manufacturing method of the resin molding of any one of Claims 1-5 in which the said conductive resin composition contains a wax component (D) further. The manufacturing method of the resin molding of any one of Claims 1-6 whose said resin molding is a sliding member. The manufacturing method of the resin molding of any one of Claims 1-7 whose shaping | molding temperature is 160 to 240 degreeC. The method for producing a resin molded body according to any one of claims 1 to 8, wherein the conductive resin composition further contains white fine particles as a color adjusting agent. The method for producing a resin molded body according to claim 9, wherein the white fine particles are silica.