JP2016042099A - Sensor device and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sensor device and electronic equipment, in which an electronic component can be accurately and easily positioned while size reduction is achieved.SOLUTION: A sensor device 1 includes: a mount substrate 2 having a first rigid substrate 21 mounting an angular velocity sensor 711 and a third rigid substrate 23 mounting an angular velocity sensor 712; and a pedestal 3 fixing the mount substrate 2. The pedestal 3 includes: a base 31 having a first fixing surface along an x axis and a y axis; and projections 41 to 44 disposed on the base 31 and having at least one of a second fixing surface along the x axis and the y axis and a third fixing surface along the y axis and a z axis. Each rigid substrate 21, 22, 23 is supported by the first fixing surface, the second fixing surface or the third fixing surface; and detection axes of the angular velocity sensors 711, 712 intersect each other.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a sensor device and an electronic apparatus.

  For example, a sensor unit (sensor device) as disclosed in Patent Document 1 is known. The sensor unit described in Patent Document 1 has a rectangular parallelepiped shape, and includes a fixing member (mounting member) having three surfaces orthogonal to each other and sensor elements (sensor devices) mounted on each of the three surfaces. Yes.

  When mounting such a sensor element on a circuit board or the like, it is difficult to mount the sensor element directly on the circuit board, and it is common to mount the sensor element in a state of being accommodated in a casing made of a base and a lid member. . However, when it accommodates in such a casing, there exists a problem which a sensor element enlarges. In addition, if the sensor element is tilted and fixed with respect to the casing, the detection axis of the sensor element is tilted, and there is a problem that the detection accuracy is lowered. That is, a sensor device in which the positioning of the sensor element is accurately performed while downsizing is desired.

U.S. Pat. No. 7,040,922

  An object of the present invention is to provide a sensor device and an electronic apparatus capable of easily and accurately positioning an electronic component while reducing the size.

Such an object is achieved by the present invention described below.
The sensor device of the present invention includes a first mounting board on which a first sensor component having a first axis detection axis is mounted, and a pedestal on which the first mounting board is mounted. A first protrusion is provided, and the first mounting substrate is fixed to a side surface of the first protrusion. A second mounting substrate on which a second sensor component having a second detection axis that intersects the first axis is mounted; a second protrusion is provided on a main surface of the pedestal; The mounting substrate is fixed to a side surface of the second projecting portion. Further, the third sensor is arranged on the main surface of the pedestal, thereby providing a sensor device capable of easily and accurately positioning electronic components while achieving downsizing. Can do.

In the sensor device according to the aspect of the invention, the second protrusion is provided side by side with the first protrusion, and the second mounting substrate is fixed to a side surface of the first protrusion and the second protrusion. It is preferable. The main surface of the pedestal is provided with a third protrusion alongside the first protrusion, and the first mounting substrate is fixed to the side surfaces of the first protrusion and the third protrusion. Preferably it is.
Accordingly, at least one mounting board can be stably fixed to the base while being positioned.

In the sensor device according to the aspect of the invention, it is preferable that the base is provided with a recess on a surface along the first axis and the second axis.
Thereby, size reduction can be achieved.
In the sensor device according to the aspect of the invention, it is preferable that the first fixing surface is provided on a peripheral edge of the concave portion.
Thereby, the mounting substrate can be stably fixed to the first fixing surface.

In the sensor device according to the aspect of the invention, it is preferable that the mounting substrate supported by the first fixed surface is supported so that the mounting surface of the sensor component faces the concave portion.
Thereby, a sensor component can be accommodated in a recessed part, and size reduction of an apparatus can be achieved.
In the sensor device of the present invention, it is preferable that the concave portion is filled with a filler.
Thereby, unintentional breakage of the sensor component can be prevented.

In the sensor device according to the aspect of the invention, it is preferable that the protrusion has a fourth fixing surface that is located above the first fixing surface and includes the first axis and the second axis.
As a result, the two mounting substrates can be arranged in the third axis direction so that the apparatus can be miniaturized.
The sensor device of the present invention includes an analog circuit board having an analog circuit and a digital circuit board having a digital circuit,
Preferably, the analog circuit board is supported on one of the first fixed surface and the fourth fixed surface, and the digital circuit board is supported on the other.
Thereby, since the analog circuit and the digital circuit can be relatively separated from each other, transmission of noise can be suppressed.

In the sensor device according to the aspect of the invention, it is preferable that each of the plurality of mounting boards is connected by a foldable connecting portion.
This makes it easy to fix the mounting board.
In the sensor device of the present invention, it is preferable that the sensor component is at least one of an angular velocity sensor and an acceleration sensor.
Thereby, it becomes a sensor device which can detect angular velocity or acceleration.
An electronic apparatus according to the present invention includes the sensor device according to the present invention.
As a result, a highly reliable electronic device can be obtained.

It is a perspective view which shows suitable embodiment of the sensor device of this invention. It is an expanded view of the mounting board | substrate which the sensor device shown in FIG. 1 has. It is a top view which shows an example of the angular velocity sensor with which the sensor device shown in FIG. 1 is provided. It is a perspective view of the base which the sensor device shown in FIG. 1 has. It is a top view of the base shown in FIG. It is a perspective view which shows the state which fixed the mounting board | substrate to the base shown in FIG. It is a figure which shows an example of a structure of the electronic device carrying the electronic device of this invention.

Hereinafter, a sensor device and an electronic apparatus of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
1. 1 is a perspective view showing a preferred embodiment of the sensor device of the present invention, FIG. 2 is a development view of a mounting substrate included in the sensor device shown in FIG. 1, and FIG. 3 is a diagram showing the sensor device shown in FIG. FIG. 4 is a perspective view of a pedestal included in the sensor device shown in FIG. 1, FIG. 5 is a plan view of the pedestal shown in FIG. 4, and FIG. 6 is a pedestal shown in FIG. It is a perspective view which shows the state which fixed the mounting board | substrate. In the following description, for convenience of explanation, the upper side in FIG. 1 will be described as “upper” and the lower side as “lower”. Further, as shown in FIG. 1, three axes orthogonal to each other are defined as an x-axis (first axis), a y-axis (second axis), and a z-axis (third axis). The z-axis is an axis parallel to the normal direction of the pedestal 3, the x-axis is an axis parallel to the extending direction of a pair of opposing sides of the pedestal in plan view, and the y-axis is The axis parallel to the extending direction of the other pair of sides facing the pedestal. In addition, a direction parallel to the x-axis is referred to as “x-axis direction”, a direction parallel to the y-axis is referred to as “y-axis direction”, and a direction parallel to the z-axis is referred to as “z-axis direction”. A plane formed by the x-axis and the y-axis is referred to as an “xy plane”, a plane formed by the y-axis and the z-axis is referred to as a “yz plane”, and a plane formed by the z-axis and the x-axis is Let it be “xz plane”.

  A sensor device 1 shown in FIG. 1 is a three-axis gyro sensor device that includes angular velocity sensors 711, 712, and 713 and can detect angular velocities around the x-axis, y-axis, and z-axis that are orthogonal to each other. Such a sensor device 1 is excellent in convenience, and can be suitably used for, for example, motion tracing, motion tracking, a motion controller, PDR (pedestrian position and orientation measurement), and the like.

As shown in FIG. 1, such a sensor device 1 is fixed to the pedestal 3 so as to cover the mounting substrate 2, the mounting substrate 2 on which the electronic component 7 is mounted, the pedestal 3 that supports the mounting substrate 2, and the mounting substrate 2. And a lid member 8. In addition, FIG.1 (b) is the figure which abbreviate | omitted the cover member 8 from Fig.1 (a).
Hereinafter, these members will be sequentially described.

[Mounting board 2]
The mounting board 2 is a rigid flexible board that is a combination of a rigid board that is hard and hardly deformed, and a flexible board that is soft and easily deformed. As the mounting substrate 2, for example, a known rigid flexible substrate such as one in which a hard layer such as a glass epoxy substrate is attached to both sides of the flexible substrate and this portion is used as a rigid substrate can be used.

2A is a plan view of the mounting substrate 2 in an unfolded state as viewed from one surface side, and FIG. 2B is a plan view of the mounting substrate 2 in an unfolded state as viewed from the other surface side. FIG. As shown in FIG. 2, the mounting substrate 2 includes a first rigid substrate (mounting portion) 21, a second rigid substrate (mounting portion) 22, and a third rigid substrate (mounting portion) that are arranged apart from each other. 23, a fourth rigid substrate (mounting portion) 24 and a fifth rigid substrate (mounting portion) 25, and a flexible substrate 26 connecting them.
Hereinafter, for convenience of explanation, the surface illustrated in FIG. 2A of each of the rigid substrates 21 to 25 is referred to as a “front mounting surface”, and the surface illustrated in FIG. Say “backside mounting surface”.

  The flexible substrate 26 includes a first connecting portion 261 that connects the first rigid substrate 21 and the second rigid substrate 22, and a second connection that connects the first rigid substrate 21 and the third rigid substrate 23. Part 262, a third connecting part 263 for connecting the first rigid board 21 and the fourth rigid board 24, and a fourth connecting part 264 for connecting the second rigid board 22 and the fifth rigid board 25. have. The first connecting portion 261, the second connecting portion 262, the third connecting portion 263, and the fourth connecting portion 264 each have flexibility and easily bend and deform in the surface direction. be able to.

  Holes 21a and 21b are formed in the edge portion (both corner portions having a diagonal relationship) of the first rigid substrate 21, and the edge portion (both corner portions having a diagonal relationship) of the second rigid substrate 22 is formed. Are provided with holes 22a and 22b. A hole 23a is formed at one end of the third rigid substrate 23, and a hole 24a is formed at one end of the fourth rigid substrate 24. In addition, holes 25 a and 25 b are formed at both ends of the fifth rigid substrate 25. These holes are holes used to screw and fix the first to fifth rigid substrates 21 to 25 to the base 3.

  The mounting substrate 2 can change the postures of the rigid substrates 21 to 26 by bending the connecting portions 261 to 264 of the flexible substrate 26. Specifically, by bending the connecting portions 261 to 264 so that the front side mounting surfaces 211 to 251 of the rigid boards 21 to 25 face inward, adjacent rigid boards can be deformed into a rectangular parallelepiped shape. . In this state, the first rigid substrate 21 has a lower surface, the second rigid substrate 22 has an upper surface, and the third, fourth, and fifth rigid substrates 23, 24, and 25 have side surfaces. The mounting board 2 is fixed to the base 3 in such a deformed state.

  In this way, by configuring the mounting substrate 2 with a rigid flexible substrate, the mounting substrate 2 can be easily deformed, so that the mounting substrate 2 can be easily fixed to the base 3. Further, since the rigid substrates 21 to 25 are collectively connected by the connecting portions 261 to 264, the mounting substrate 2 can be easily and smoothly fixed to the base 3 in this respect. Moreover, the freedom degree of arrangement | positioning of the electronic component 7 increases by providing a some rigid board | substrate.

  Further, by mounting the electronic component 7 on a rigid rigid board, unnecessary vibration of the electronic component 7 (particularly, the angular velocity sensors 711 to 713) can be suppressed, and the detection accuracy of the sensor device 1 is improved. Moreover, it is easy to mount the electronic component 7 on the mounting substrate 2. Moreover, the parallelism of the electronic component 7 is easy to take, and in particular, the angular velocity sensors 711 to 713 can be easily set in a desired posture and the posture can be maintained. Also, the electronic component 7 can be mounted with high density.

  Here, in the present embodiment, the first rigid substrate 21 has a first defect portion 21c, a second defect portion 21d, and a third defect portion 21e that open to the edge (outer periphery). The first missing portion 21c is formed with a step with respect to the right side of the first rigid substrate 21 in FIG. 2A, and the first connecting portion 261 extends from the first missing portion 21c. Is extended. Further, the second defect portion 21d is formed with a step with respect to the upper side in FIG. 2A of the first rigid substrate 21, and the second connection portion 21d is connected to the second connection portion 21d. A portion 262 extends. Further, the third defect portion 21e is formed with a step with respect to the left side in FIG. 2A of the first rigid substrate 21, and the third connection portion 21e is connected to the third connection portion. A portion 263 extends.

  By forming the first defective portion 21c in the first rigid substrate 21, the first connecting portion 261 is located near the connection portion with the first rigid substrate 21 (more on the first rigid substrate 21 side). It can be easily bent and deformed, and the radius of curvature when bent and deformed can be kept relatively large. Moreover, the excessive protrusion of the 1st connection part 261 is suppressed, and size reduction of the sensor device 1 can be achieved. Similar effects can be obtained with respect to the second defect portion 21d and the third defect portion 21e.

  In the present embodiment, the second rigid substrate 22 has a fourth deficient portion 22c and a fifth deficient portion 22d that open to the edge (outer periphery). The fourth missing portion 22c is formed with a step with respect to the left side of the second rigid substrate 22 in FIG. 2A, and the first connecting portion 261 extends from the fourth missing portion 22c. Is extended. Similarly, the fifth defect portion 22d is formed with a step with respect to the lower side of the second rigid substrate 22 in FIG. 2A, and the fifth defect portion 22e through the fourth defect portion 22e. The connecting portion 264 extends.

By forming the fourth defective portion 22c in the second rigid substrate 22, the first connecting portion 261 is located in the vicinity of the connection portion with the second rigid substrate 22 (more on the second rigid substrate 22 side). It can be easily bent and deformed, and the radius of curvature when bent and deformed can be kept relatively large. Further, excessive protrusion of the bent portion from the outer periphery of the second rigid substrate 22 is suppressed, and the sensor device 1 can be downsized. The same effect can be obtained for the fifth defect 22d.
The mounting substrate 2 has been described above. Note that a conductor pattern (not shown) is formed on each of the rigid substrates 21 to 25 and the flexible substrate 26 of the mounting substrate 2, and a plurality of electronic components 7 are appropriately electrically connected via the conductor pattern.

  Further, a ground layer (not shown) is formed on the mounting substrate 2, and this ground layer exhibits a function of blocking an external magnetic field. For this reason, the electronic component 7 (that is, the electronic component 7 mounted on the front side mounting surfaces 211 to 251) inside the mounting substrate 2 in a state of being fixed to the pedestal 3 is from the outside of the sensor device 1. The influence of an external magnetic field (external noise) can be eliminated.

[Electronic component 7]
As shown in FIGS. 2A and 2B, a plurality of electronic components 7 are mounted on the mounting substrate 2.
On the mounting substrate 2, as the electronic component 7, three uniaxial detection type angular velocity sensors (sensor components) 711 to 713, a triaxial detection type acceleration sensor (sensor component) 72, and various electronic components are driven. Power supply circuit 73, an amplification circuit 74 for amplifying output signals from the sensor components (711 to 713, 72), an analog / digital conversion circuit 75 for converting the analog signal amplified by the amplification circuit 74 into a digital signal, A microcontroller 76 for performing desired control, a nonvolatile memory 77 such as an EEPROM, an orientation sensor (magnetic sensor) 78 for detecting the orientation, and a connector (interface connector) 79 for outputting a signal are mounted. Yes. It should be noted that the electronic component 7 to be mounted is not limited to this, and a component according to the purpose may be mounted as appropriate.
Hereinafter, the arrangement of these electronic components 7 will be described in detail.

(First rigid substrate 21)
A power circuit 73, an amplifier circuit 74, and an analog / digital conversion circuit 75 are mounted on the front side mounting surface 211 of the first rigid substrate 21, and an angular velocity sensor 713 and an acceleration sensor 72 are mounted on the back side mounting surface 212. Has been.
The analog / digital conversion circuit 75 is larger in size than the other electronic components 7 (the power supply circuit 73 and the amplification circuit 74) mounted on the front-side mounting surface 211. Therefore, it is preferable to arrange the analog / digital conversion circuit 75 at the center of the front side mounting surface 231. Accordingly, the analog / digital conversion circuit 75 can be effectively used as a reinforcing member that reinforces the strength of the first rigid substrate 21. Therefore, the unintentional vibration caused by the bending deformation of the first rigid board 21 is suppressed, and unnecessary vibration is not transmitted to the angular velocity sensors 711 to 713, and the angular velocity sensors 711 to 713 (particularly mounted on the first rigid substrate 21). The accuracy of angular velocity detection by the angular velocity sensor 713) is increased.

  Further, the angular velocity sensor 713 and the acceleration sensor 72 are preferably arranged in the vicinity of the corner portion of the front side mounting surface 211. As will be described later, the four corners of the first rigid substrate 21 are fixed to the base 3 via an adhesive. Therefore, the corner portion of the first rigid substrate 21 is not easily deformed, and unnecessary vibration is difficult to occur. Therefore, by arranging the angular velocity sensor 713 and the acceleration sensor 72 in such a place, the angular velocity and the acceleration can be detected with higher accuracy.

  Further, by mounting the angular velocity sensor 713 and the acceleration sensor 72 on the back-side mounting surface 212, the distance from the microcontroller 76 can be further increased in a state where the mounting substrate 2 is fixed to the pedestal 3. Further, the ground layer of the first rigid substrate 21 can be positioned between the angular velocity sensor 713 and the acceleration sensor 72 and the microcontroller 76. Therefore, radiation noise generated from the microcontroller 76 can be prevented from adversely affecting the angular velocity sensor 713 and the acceleration sensor 72, and the detection accuracy of the angular velocity sensor 713 and the acceleration sensor 72 can be improved.

(Second rigid substrate 22)
A microcontroller 76 is mounted on the front side mounting surface 221 of the second rigid board 22, and a nonvolatile memory 77 and an orientation sensor 78 are mounted on the back side mounting surface 222.
The microcontroller 76 is larger in size than the other electronic components 7 (nonvolatile memory 77 and orientation sensor 78) mounted on the second rigid board 22. Therefore, it is preferable to arrange the microcontroller 76 at the center of the front side mounting surface 221. Thereby, the microcontroller 76 can be effectively used as a reinforcing member that reinforces the strength of the second rigid substrate 22. Therefore, unnecessary vibration due to bending deformation of the second rigid substrate 22 is suppressed, unnecessary vibration is not transmitted to the angular velocity sensors 711 to 713, and the angular velocity detection accuracy by the angular velocity sensors 711 to 713 is increased.

  Further, by mounting the azimuth sensor 78 on the mounting surface opposite to the microcontroller 76, radiation noise generated from the microcontroller 76 can be blocked by the ground layer of the second rigid substrate 22. It is possible to effectively prevent the magnetic field) from reaching the direction sensor 78 and adversely affecting the direction sensor 78. Therefore, the detection accuracy of the direction sensor 78 can be improved.

(Third rigid substrate 23)
An angular velocity sensor 711 is mounted on the front side mounting surface 231 of the third rigid board 23.
(Fourth rigid substrate 24)
An angular velocity sensor 712 is mounted on the front mounting surface 241 of the fourth rigid substrate 24.
(Fifth rigid substrate 25)
A connector 79 is mounted on the back side mounting surface 252 of the fifth rigid board 25.
The arrangement of the electronic component 7 has been described in detail above.

In the mounting substrate 2, an analog circuit including a power circuit 73, an amplifier circuit 74, an analog / digital conversion circuit 75 and the like is formed on the first rigid substrate 21, and a microcontroller 76 and a nonvolatile memory 77 are formed on the second rigid substrate 22. Etc. are formed. As described above, the first rigid substrate that is an analog circuit substrate and the second rigid substrate 22 that is a digital circuit substrate are provided, and the analog circuit and the digital circuit are formed on different rigid substrates, thereby reducing noise. Generation and transmission can be effectively suppressed, and the detection accuracy of the sensor device 1 becomes higher.
The angular velocity sensors 711 to 713 are not particularly limited as long as the angular velocity can be detected, and a known uniaxial detection type angular velocity sensor can be used. As such angular velocity sensors 711 to 713, for example, a sensor having the resonator element 5 as shown in FIG. 3 can be used.

  The resonator element 5 is made of quartz (piezoelectric material). The resonator element 5 includes a base 51, a pair of detection vibrating arms 52 and 53 extending in the vertical direction from both sides of the base 51, and a pair of connecting arms extending in the horizontal direction from both sides of the base 51. 54 and 55, and a pair of drive vibrating arms 56, 57, 58, and 59 that extend in the vertical direction from the both sides of the front ends of the connecting arms 54 and 55, respectively. Further, detection electrodes (not shown) are formed on the surfaces of the detection vibrating arms 52 and 53, and driving electrodes (not shown) are formed on the surfaces of the driving vibration arms 56, 57, 58 and 59. ) Is formed.

In such a vibrating piece 5, by applying a voltage to the driving electrode, the driving vibrating arms 56 and 58 and the driving vibrating arms 57 and 59 are vibrated so as to repeatedly approach and separate from each other. When the angular velocity ω around the normal A (detection axis A) of the vibration piece 5 is applied, a Coriolis force is applied to the vibration piece 5 and the vibrations of the detection vibrating arms 52 and 53 are excited. The angular velocity applied to the resonator element 5 can be obtained by detecting the distortion of the detection vibrating arms 52 and 53 generated by the vibration of the detection vibrating arms 52 and 53 with the detection electrode.
The angular velocity sensors 711 to 713 configured as described above are each mounted on a corresponding rigid board so that the thickness direction is a detection axis.

[Pedestal 3]
As shown in FIGS. 4, 5, and 6, the pedestal 3 includes a plate-like base portion 31, a first support portion 32, a second support portion 33, and a third support portion 34 provided on the base portion 31. The fourth support part 35 and the fifth support part 36 are provided. Hereinafter, although the base 3 is demonstrated based on FIGS. 4-6, in FIG. 6, illustration of a one part member is abbreviate | omitted for convenience of explanation.

(base)
The base portion 31 has a lower surface and an upper surface 312 parallel to the xy plane formed by the x-axis and the y-axis, with the z-axis direction being the thickness direction. The base 31 has a recess 313 that opens to the upper surface 312. The concave portion 313 is open to the central portion excluding the edge portion of the upper surface 312, and is not open to the side surface of the base portion 31. That is, the recessed part 313 has comprised the tank shape where the circumference | surroundings were enclosed by the side wall.

  Such a recess 313 functions as a storage unit that stores the angular velocity sensor 711 and the acceleration sensor 72 mounted on the back surface mounting surface 212 of the first rigid substrate 21 in a state where the mounting substrate 2 is fixed to the base 3. . In other words, the recess 313 constitutes an escape portion for preventing contact between the pedestal 3 and the angular velocity sensor 711 and the acceleration sensor 72. By forming such a recess 313, the space of the pedestal 3 can be used effectively, and the sensor device 1 can be reduced in size (thinner and lower in height).

(First support part)
As shown in FIG. 5, the first support portion 32 has four fixing surfaces 321, 322, 323, and 324 provided around the recess 313. The four fixing surfaces 321 to 324 are surfaces for fixing the first rigid substrate 21 to the pedestal 3 while positioning the first rigid substrate 21 with respect to the pedestal 3. Specifically, the fixing surfaces 321 to 324 have a function of positioning and fixing the first rigid substrate 21 with respect to the pedestal 3 so that the detection axis of the angular velocity sensor 711 is parallel to the z-axis. Yes.

The fixing surfaces (first fixing surfaces) 321 to 324 are formed around the recess 313 so as to correspond to the four corners of the first rigid substrate 21. Each of such fixing surfaces 321 to 324 is composed of an upper surface 312. As described above, by using the upper surface 312 as the fixed surfaces 321 to 324, the first support portion 32 can be formed easily and accurately.
Since the fixed surfaces 321 to 324 are located on the same plane parallel to the xy plane, as shown in FIG. 6, when the first rigid substrate 21 is placed on the fixed surfaces 321 to 324, the angular velocity sensor 711. The detection axis A1 is parallel to the z-axis. Thus, the positioning of the angular velocity sensor 711 with respect to the pedestal 3 (the alignment of the detection axis A1) can be performed with high accuracy simply by placing the first rigid substrate 21 on the fixed surfaces 321 to 324.

  In addition, although it does not specifically limit as a method to fix the 1st rigid board | substrate 21 to the fixing surfaces 321-324, In this embodiment, fixing by an adhesive agent and screwing are used together. Specifically, first, the fixing surfaces 321 to 324 and the first rigid substrate 21 are fixed with an adhesive. In this state, since the holes 21a and 21b formed in the first rigid substrate 21 are located on the fixing surfaces 321 and 323, the first rigid substrate 21 is fixed to the fixing surfaces 321 and 323 through the holes 21a and 21b. Screw on (base 31). Thereby, the 1st rigid board | substrate 21 can be fixed to the 1st support part 32 reliably. In addition, since an adhesive layer is interposed between the base 3 and the first rigid substrate 21, the adhesive absorbs and relaxes vibration from the base 3 and suppresses unnecessary vibration of the first rigid substrate 21. Is done. As a result, the detection accuracy of the sensor device 1 is further improved.

  The recess 313 is filled with a filler (not shown), and a gap between the base 3 and the first rigid substrate 21 is filled with the filler. As a result, the first rigid board 21 (angular velocity sensor 711, acceleration sensor 72) and the connecting portions 261, 262, 263 extending from the first rigid board 21 are fixed, and are unnecessary for the first rigid board 21. Generation of vibration can be effectively prevented. Therefore, the detection accuracy of the sensor device 1 is improved.

  As a constituent material of the filler, an insulating material is preferable. Such a material is not particularly limited. For example, polyolefin such as polyethylene, polypropylene, ethylene-propylene copolymer, polyvinyl chloride, polystyrene, polyamide, polyimide, polycarbonate, poly- (4-methylpentene- 1), ionomer, acrylic resin, polymethyl methacrylate, acrylonitrile-butadiene-styrene copolymer (ABS resin), acrylonitrile-styrene copolymer (AS resin), butadiene-styrene copolymer, polyethylene terephthalate (PET), Polybutylene terephthalate (PBT) and other polyesters, polyethers, polyether ketones (PEK), polyether ether ketones (PEEK), polyether imides, polyacetals (POM), polyphenols Ren oxide, polysulfone, polyethersulfone, polyphenylene sulfide, polyarylate, aromatic polyester (liquid crystal polymer), polytetrafluoroethylene, polyvinylidene fluoride, other fluororesins, epoxy resin, phenol resin, urea resin, melamine resin, silicone Resins, polyurethane, and the like, or copolymers, blends, polymer alloys, and the like mainly containing them, can be used, and one or more of these can be used in combination.

(Second support part)
As shown in FIG. 5, the second support portion 33 is a part for positioning the third rigid substrate 23 with respect to the pedestal 3 and fixing the third rigid substrate 23 to the pedestal 3. Specifically, the second support portion 33 has a function of positioning and fixing the third rigid board 23 with respect to the pedestal 3 so that the detection axis of the angular velocity sensor 712 is parallel to the x-axis. ing.

  Such a second support portion 33 has a pair of protrusion portions 41 and 42 that protrude from the upper surface of the base portion 31 and are spaced apart from each other in the y-axis direction, and a space 61 formed therebetween. ing. The protrusions 41 and 42 are respectively formed with surfaces (third fixed surfaces) 411 and 421 that face the outside of the base 3 and are parallel to the yz plane. These surfaces 411 and 421 are located on the same plane. Such surfaces 411 and 421 function as a fixing surface for fixing the third rigid substrate 23 (hereinafter, referred to as “fixing surface 411” and “fixing surface 421”).

  Since the fixed surfaces 411 and 421 are located on the same plane parallel to the yz plane, when the third rigid substrate 23 is fixed to the fixed surfaces 411 and 421 as shown in FIG. The axis is parallel to the x axis. That is, the positioning of the angular velocity sensor 711 with respect to the pedestal 3 (alignment of the detection axis) can be easily performed with high accuracy simply by fixing the third rigid substrate 23 to the fixing surfaces 411 and 421.

  A method for fixing the third rigid substrate 23 to the fixing surfaces 411 and 421 is not particularly limited, but in this embodiment, fixing with an adhesive and screwing are used in combination. Specifically, first, the fixing surfaces 411 and 421 and the third rigid substrate 23 are fixed with an adhesive. In this state, since the hole 23a formed in the third rigid substrate 23 is located on the fixed surface 411, the third rigid substrate 23 is screwed to the protruding portion 41 through the hole 23a. Thereby, the 3rd rigid board | substrate 23 can be fixed to the 2nd support part 33 reliably. In addition, since an adhesive layer is interposed between the base 3 and the third rigid substrate 23, the adhesive absorbs and relaxes vibration from the base 3, and unnecessary vibration of the third rigid substrate 23 is suppressed. Is done. As a result, the detection accuracy of the sensor device 1 is further improved.

  In a state where the third rigid substrate 23 is fixed to the fixing surfaces 411 and 421, the angular velocity sensor 711 is located in the space 61 between the pair of protrusions 41 and 42. From this, it can be said that the space 61 constitutes an escape portion for preventing contact between the base 3 and the angular velocity sensor 712 (hereinafter referred to as “escape portion 61”). By forming such a relief portion 61, the angular velocity sensor 712 can be prevented from being damaged and the sensor device 1 can be downsized.

  The escape portion 61 is connected to the space in the recess 313, and the recess 313 has a region 313 a that protrudes to the outer peripheral side of the pedestal 3 from the fixed surfaces 411 and 421 in the xy plan view. By adopting such a configuration, the second connecting portion 262 that connects the first rigid substrate 21 and the third rigid substrate 23 is not excessively deformed inside the escape portion 61 and the region 313a. Can be arranged. Therefore, damage to the mounting substrate 2 due to excessive deformation is effectively prevented, and the reliability of the sensor device 1 is improved.

  Further, in a state where the third rigid substrate 23 is fixed to the fixing surfaces 411 and 421, the angular velocity sensor 711 is positioned on the inner side than the third rigid substrate 23. Therefore, for example, when the sensor device 1 is manufactured, contact between the angular velocity sensor 711 and an operator, manufacturing equipment, or the like is suppressed, and breakage of the angular velocity sensor 711 can be effectively prevented. Further, as described above, since the external magnetic field can be blocked by the ground layer of the mounting substrate 2, the detection accuracy of the angular velocity sensor 711 is improved.

(Third support part)
The third support portion 34 is a part for positioning the fourth rigid substrate 24 with respect to the pedestal 3 and fixing the fourth rigid substrate 24 to the pedestal 3. Specifically, the third support portion 34 has a function of positioning and fixing the fourth rigid board 24 with respect to the pedestal 3 so that the detection axis of the angular velocity sensor 712 is parallel to the y-axis. ing.

  Such a third support portion 34 has a pair of protrusion portions 42 and 43 that protrude from the upper surface of the base portion 31 and are spaced apart from each other in the x-axis direction, and a space 62 formed therebetween. ing. The protrusions 42 and 43 are respectively formed with surfaces (second fixed surfaces) 422 and 431 that face the outside of the base 3 and are parallel to the xz plane. These surfaces 422 and 431 are located on the same plane. Such surfaces 422 and 431 function as fixing surfaces for fixing the fourth rigid substrate 24 (hereinafter referred to as “fixing surface 422” and “fixing surface 431”).

  Since the fixed surfaces 422 and 431 are located on the same plane parallel to the xz plane, as shown in FIG. 6, when the fourth rigid substrate 24 is fixed to the fixed surfaces 422 and 431, the angular velocity sensor 712 The detection axis is parallel to the y-axis. That is, the positioning of the angular velocity sensor 712 with respect to the pedestal 3 (the alignment of the detection axis) can be easily performed with high accuracy simply by fixing the fourth rigid substrate 24 to the fixing surfaces 422 and 431.

  A method of fixing the fourth rigid substrate 24 to the fixing surfaces 422 and 431 is not particularly limited, but in the present embodiment, fixing with an adhesive and screwing are used in combination. Specifically, first, the fixing surfaces 422 and 431 and the fourth rigid substrate 24 are fixed with an adhesive. In this state, since the hole 24a formed in the fourth rigid substrate 24 is located on the fixed surface 422, the fourth rigid substrate 24 is screwed to the protruding portion 42 through the hole 24a. As a result, the fourth rigid substrate 24 can be reliably fixed to the third support portion 34. Further, since an adhesive layer is interposed between the base 3 and the fourth rigid substrate 24, the adhesive absorbs and relaxes vibrations from the base 3, and suppresses unnecessary vibration of the fourth rigid substrate 24. Is done. As a result, the detection accuracy of the sensor device 1 is further improved.

  In a state where the fourth rigid substrate 24 is fixed to the fixing surfaces 422 and 431, the angular velocity sensor 712 is located in the space 62 between the pair of protrusions 42 and 43. From this, it can be said that the space 62 constitutes an escape portion for preventing contact between the base 3 and the angular velocity sensor 712 (hereinafter referred to as “escape portion 62”). By forming such a relief portion 62, the angular velocity sensor 712 can be prevented from being damaged and the sensor device 1 can be downsized.

  Moreover, the escape part 62 is connected with the space in the recessed part 313, and the recessed part 313 has the area | region 313b which protrudes to the outer peripheral side of the base 3 rather than the fixed surfaces 422 and 431 in xy planar view. With such a configuration, the third connecting portion 263 that connects the first rigid substrate 21 and the fourth rigid substrate 24 inside the escape portion 62 and the region 313b is not excessively deformed. Can be arranged. Therefore, damage to the mounting substrate 2 due to excessive deformation is effectively prevented, and the reliability of the sensor device 1 is improved.

  Further, in a state where the fourth rigid substrate 24 is fixed to the fixing surfaces 422 and 431, the angular velocity sensor 712 is located on the inner side than the fourth rigid substrate 24. Therefore, for example, when the sensor device 1 is manufactured, contact between the angular velocity sensor 712 and an operator, manufacturing equipment, or the like is suppressed, and damage to the angular velocity sensor 712 can be effectively prevented. Further, as described above, since the external magnetic field can be blocked by the ground layer of the mounting substrate 2, the detection accuracy of the angular velocity sensor 712 is improved.

(4th support part)
The fourth support portion 35 is a part for fixing the second rigid substrate 22 to the pedestal 3 so as to face the first rigid substrate 21 in the z-axis direction. By fixing the second rigid substrate 22 so as to overlap the first rigid substrate 21, the sensor device 1 can be reduced in size (particularly in xy plan view).

  Since the physical quantity sensor such as the angular velocity sensors 711 to 713 and the acceleration sensor 72 is not mounted on the second rigid substrate 22, the fourth support portion 35 has the first to third as described above. The precision regarding positioning of the support portions 32 to 34 is not required. However, from the viewpoint of downsizing (thinning and low profile) of the sensor device 1, the fourth support portion 35 is configured to support and fix the second rigid substrate 22 in parallel with the first rigid substrate 21. It is preferable.

  Such a fourth support portion 35 has four projecting portions 41, 42, 43, 44 projecting from the upper surface of the base portion 31. The protrusions 41 to 44 are positioned so as to correspond to the four corners of the second rigid substrate 22. The upper surfaces 413, 423, 433, and 443 of the four protrusions 41, 42, 43, and 44 are surfaces (fourth fixed surfaces) that are parallel to the xy plane and are located on the same plane. These four upper surfaces 413 to 443 are fixed surfaces for fixing the second rigid substrate 22 (hereinafter referred to as “fixed surface 413”, “fixed surface 423”, “fixed surface 433”, and “fixed surface 443”). Say).

Since the fixing surfaces 413 to 443 are located on the same plane parallel to the xy plane, when the second rigid substrate 22 is fixed to the fixing surfaces 413 to 443, as shown in FIG. The substrate 22 faces the first rigid substrate 21 in the z-axis direction and is parallel to the xy plane. Thereby, size reduction of the sensor device 1 can be achieved.
A method for fixing the second rigid substrate 22 to the fixing surfaces 413 to 443 is not particularly limited, but in the present embodiment, fixing by an adhesive and screwing are used in combination. Specifically, first, the fixing surfaces 413 to 443 and the second rigid substrate 22 are fixed with an adhesive. In this state, since the holes 22a and 212 formed in the second rigid substrate 22 are located on the fixing surfaces 413 and 433, the second rigid substrate 22 is projected through the holes 22a and 22b. Screw on to. As a result, the second rigid substrate 22 can be reliably fixed to the fourth support portion 35.

(5th support part)
The fifth support portion 36 is a portion for fixing the fifth rigid substrate 25. Note that physical quantity sensors such as the angular velocity sensors 711 to 713 and the acceleration sensor 72 are not mounted on the fifth rigid board 25. Therefore, like the above-mentioned 4th support part 35, the 5th support part 36 does not require the precision regarding positioning like the above-mentioned 1st-3rd support parts 32-34. However, from the viewpoint of miniaturization of the sensor device 1, the fifth support portion 36 is preferably configured to support the fifth rigid substrate 25 so as to be parallel to the yz plane.

  Such a fifth support portion 36 has a protruding portion 45 protruding from the upper surface of the base portion 31. The protruding portion 45 is provided so as to face the second support portion 33 via the concave portion 313, and extends in the y-axis direction. A surface 451 that faces the outside of the pedestal 3 and is parallel to the yz plane is formed on such a protrusion 45, and the surface 451 fixes a fifth rigid substrate 25 (hereinafter referred to as a fixing surface). It functions as “fixed surface 451”. As shown in FIG. 6, when the fifth rigid substrate 25 is fixed to such a fixing surface 451, the fifth rigid substrate 25 is parallel to the yz plane. Thereby, size reduction of the sensor device 1 can be achieved.

A method of fixing the fifth rigid substrate 25 to the fixing surface 451 is not particularly limited, but in this embodiment, fixing with an adhesive and screwing are used in combination. Specifically, first, the fixing surface 451 and the fifth rigid substrate 25 are fixed with an adhesive. In this state, since the holes 25a and 25b formed in the fifth rigid substrate 25 are positioned on the fixed surface 451, the fifth rigid substrate 25 is screwed to the protruding portion 45 through the holes 25a and 25b. As a result, the fifth rigid substrate 25 can be reliably fixed to the fifth support portion 36.
The first to fifth support portions 32 to 36 have been described above.

  The pedestal 3 further has projecting portions 46 and 47 projecting from the two corner portions of the base portion 31 in a diagonal relationship. The protrusion 46 has a larger cross-sectional area than the protrusion 41 and is formed integrally with the protrusion 41. Thereby, the mechanical strength of the protrusion 41 is improved. On the other hand, the protrusion 47 has a larger cross-sectional area than the protrusion 43 and is formed integrally with the protrusion 43. Thereby, the mechanical strength of the protrusion 43 is improved. Further, the protruding portion 47 is integrally formed with the protruding portions 44 and 45, thereby improving the mechanical strength of the protruding portions 44 and 45, respectively. Thus, by providing the protrusions 46 and 47, the mechanical strength of the protrusions 41 to 45 included in the first to fifth support parts 32 to 36 can be improved, and the mounting substrate 2 can be more reliably secured. Can be fixed in a desired posture.

The constituent material of the pedestal 3 is not particularly limited, but is preferably a material having vibration damping characteristics. Thereby, unnecessary vibration of the mounting substrate 2 is suppressed, and the detection accuracy of the sensor device 1 is improved. Such a material is not particularly limited, and examples thereof include various damping alloys such as a magnesium alloy, an iron-based alloy, a copper alloy, a manganese alloy, and a Ni—Ti-based alloy.
According to such a pedestal 3, the detection axes of the angular velocity sensors 711, 712, and 713 can be made parallel to the x-axis, y-axis, and z-axis by simply fixing the mounting substrate 2 at a predetermined position. Therefore, the sensor device 1 that can exhibit excellent detection accuracy can be easily obtained.

  When the sensor device 1 is mounted on a circuit board (object) such as a mother board, the detection axes of the angular velocity sensors 711 and 712 can be simplified by using the two orthogonal side surfaces 3a and 3b as a reference. Can be directed in a desired direction. Specifically, the side surface 3a is a surface parallel to the detection axis of the angular velocity sensor 712, and the side surface 3b is a surface parallel to the detection axis of the angular velocity sensor 711. Therefore, by positioning with respect to the circuit board on the basis of these side surfaces 3a and 3b, the detection axes of the angular velocity sensors 711 and 712 can be directed in a desired direction easily and reliably.

[Cover member]
The lid member 8 is fixed to the pedestal 3 so as to cover the mounting substrate 2. Thereby, the electronic component 7 can be protected. Further, an opening is formed in the side surface of the lid member 8, and the connector 79 is exposed to the outside through the opening in a state where the lid member 8 is fixed to the base 3. Thereby, the electrical connection between the external device and the connector 79 can be easily performed. The fixing method of the base 3 and the lid member 8 is not particularly limited, and fitting, screwing, and bonding with an adhesive can be used.

  The constituent material of the lid member 8 is not particularly limited. For example, polyolefin such as polyethylene, polypropylene, ethylene-propylene copolymer, polyvinyl chloride, polystyrene, polyamide, polyimide, polycarbonate, poly- (4- Methylpentene-1), ionomer, acrylic resin, polymethyl methacrylate, acrylonitrile-butadiene-styrene copolymer (ABS resin), acrylonitrile-styrene copolymer (AS resin), butadiene-styrene copolymer, polyethylene terephthalate ( PET), polyesters such as polybutylene terephthalate (PBT), polyether, polyether ketone (PEK), polyether ether ketone (PEEK), polyether imide, polyacetal (POM), polyester Phenylene oxide, polysulfone, polyethersulfone, polyphenylene sulfide, polyarylate, aromatic polyester (liquid crystal polymer), polytetrafluoroethylene, polyvinylidene fluoride, other fluororesins, epoxy resins, phenol resins, urea resins, melamine resins, Silicone resin, polyurethane, and the like, or copolymers, blends, polymer alloys, and the like mainly containing these, can be used, and one or more of these can be used in combination.

2. Electronic device The sensor device 1 as described above can be incorporated into various electronic devices. Hereinafter, the electronic apparatus of the present invention equipped with the sensor device 1 will be described. FIG. 7 is a diagram illustrating an example of a configuration of an electronic device 500 in which the sensor device 1 is mounted. The electronic device 500 is not particularly limited, and examples thereof include a digital camera, a video camera, a car navigation system, a mobile phone, a mobile PC, a robot, a game machine, and a game controller.

An electronic device 500 illustrated in FIG. 7 includes a sensor module 510 including the sensor device 1, a processing unit 520, a memory 530, an operation unit 540, and a display unit 550. These are connected by a bus 560. A processing unit (CPU, MPU, etc.) 520 performs control of the sensor module 510 and the like and overall control of the electronic device 500. The processing unit 520 performs processing based on the angular velocity information detected by the sensor module 510. For example, processing for camera shake correction, attitude control, GPS autonomous navigation, and the like is performed based on the angular velocity information. The memory 530 stores control programs and various data, and functions as a work area and a data storage area. The operation unit 540 is for the user to operate the electronic device 500. The display unit 550 displays various information to the user.
As described above, the sensor device and the electronic apparatus according to the present invention have been described based on the illustrated embodiments. However, the present invention is not limited to this, and the configuration of each unit may be any configuration having the same function. Can be substituted.

In the embodiment described above, the configuration in which the three angular velocity sensors are mounted on the mounting substrate has been described. However, the number of angular velocity sensors is not limited to this, and may be one or two. Further, the number of rigid substrates may be changed according to the number of angular velocity sensors.
In the above-described embodiment, the mounting substrate is configured by a rigid flexible substrate. However, the configuration of the mounting substrate is not limited thereto, and may be configured by, for example, a plurality of rigid substrates that are not connected to each other. Good. In this case, after the rigid boards are fixed to the pedestal, the rigid boards can be electrically connected to each other using a connector or the like.

  DESCRIPTION OF SYMBOLS 1 ... Sensor device 2 ... Mounting board 21 ... 1st rigid board 211 ... Front side mounting surface 212 ... Back side mounting surface 21a, 21b ... Hole 21c ... 1st defect | deletion part 21d ... 2nd Defect portion 21e... Third defect portion 22... 2nd rigid substrate 221... Front side mounting surface 222... Back side mounting surface 22a, 22b ... Hole 22c ... Fourth defect portion 22d. Defects 23 ... 3rd rigid board 231 ... Front side mounting surface 23a ... Hole 24 ... 4th rigid board 241 ... Front side mounting face 24a ... Hole 25 ... 5th rigid board 251 ... Front side Mounting surface 252... Back side mounting surface 25a, 25b... Hole 26... Flexible substrate 261... First connection portion 262... Second connection portion 263... Third connection portion 264. Connection 3 ... Base 3a, 3b ... Side 31 ... Base 312 ... Top 313 ... Recess 313a, 313b ... Area 32 ... First support part 321, 322, 323, 324 ... Fixing surface 33 2nd support part 34 3rd support part 35 4th support part 36 5th support part 41, 42, 43, 44, 45, 46, 47 ... Projection part 411, 413, 421, 422, 423, 431, 433, 443, 451 ... fixed surface 5 ... vibrating piece 51 ... base 52, 53 ... detection vibrating arm 54, 55 ... connecting arm 56, 57, 58, 59 ... Vibration arm for driving 61, 62 ... Space 7 ... Electronic components 711, 712, 713 ... Angular velocity sensor 72 ... Acceleration sensor 73 ... Power supply circuit 74 ... Amplifier circuit 75 ... Analog / digital conversion Circuit 76 ... Microcontroller 77 ... Non-volatile memory 78 ... Direction sensor 79 ... Connector 8 ... Lid member 500 ... Electronic equipment 510 ... Gyro sensor 520 ... Processing part 530 ... Memory 540 ... Operation part 550 ... Display section 560 ... Bus

Claims (5)

A first mounting board on which a first sensor component having a detection axis of the first axis is mounted;
A second mounting substrate on which a second sensor component having a second detection axis intersecting the first axis is mounted;
A third mounting board on which a third sensor component having a third axis detection axis intersecting the first axis and the second axis is mounted;
A pedestal on which the first mounting substrate, the second mounting substrate, and the third mounting substrate are mounted;
The main surface of the pedestal is provided with a first protrusion, a second protrusion, a third protrusion, and a recess,
In the first mounting substrate, the first sensor component is positioned between the first protrusion and the third protrusion on the first side surface of the first protrusion and the side surface of the third protrusion. Fixed to
In the second mounting substrate, the second sensor component is located between the first protrusion and the second protrusion on the second side surface of the first protrusion and the side surface of the second protrusion. Fixed to
The sensor device, wherein the third mounting substrate is fixed so that the third sensor component is located on the concave portion side at four spaced locations around the concave portion.   The sensor device according to claim 1, wherein the recess is filled with a filler.   The sensor device according to claim 1, wherein the first sensor component, the second sensor component, and the third sensor component are at least one of an angular velocity sensor and an acceleration sensor. The concave portion is provided so as to include a region between the first protruding portion and the third protruding portion in a plan view from the main surface direction of the pedestal,
The flexible substrate that connects the first mounting substrate and the third mounting substrate is bent and disposed in a region of the recess between the first protrusion and the third protrusion. 4. The sensor device according to any one of 3.   An electronic apparatus comprising the sensor device according to claim 1.

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