JP2016034650A - Laser beam machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser beam machine which thoroughly cleans and removes laser processing waste adhering to facing side surfaces of a pair of cutting plates regardless of whether the laser beam machine is a single machine or a compound machine.SOLUTION: A laser beam machine includes: a processing head (3) which reciprocates in a uniaxial direction above a table (1) and radiates a laser beam to the table (1); a pair of cutting plates (13L, 13R) which are provided at the table (1) and disposed facing each other and forming a space therebetween so as to form an opening part (12) corresponding to a radiation position of the laser beam; a moving member (23a) which is vertically moved by operation of the actuator (21) attached to the processing head (3); and a cleaning member (23b) which is provided at the moving member (23a) and moves between a cleaning position where the cleaning member (23b) is moved into the opening part (12) by vertical movement of the moving member (23a) to contact with facing side surfaces (13La, 13Ra) of a pair of cutting plates (13L, 13R) and a stand-by position where the cleaning member (23b) is moved out from the opening part (12) to make no-contact with the side surfaces (13La, 13Ra).SELECTED DRAWING: Figure 3

Description

  The present invention relates to a laser processing machine, and more particularly to a laser processing machine provided with a laser processing waste cleaning device that cleans and removes laser processing waste adhering to opposing side surfaces of a pair of cutting plates.

In a table device of a laser processing machine in which a laser processing head moves in the Y-axis direction, an opening for dropping work processing waste generated by laser processing downward is formed in a straight shape in the Y-axis direction.
The opening corresponds to the irradiation position of the laser beam and is formed as a gap between the opposing side surfaces of the pair of cutting plates.

Laser processing waste is a melt re-solidified product generated by laser processing, and is referred to as spatter, dross, or noro.
Laser processing scraps adhere to the opposing side surfaces of the pair of cutting plates and the vicinity thereof in laser processing. In particular, the opposing side surface is a surface that sandwiches the opening for dropping the workpiece machining waste, and therefore tends to accumulate.
The cumulative adhesion to the opposite side surface narrows the gap width of the opening and prevents the workpiece processing scraps from falling and further accelerates the cumulative adhesion. The workpiece becomes damaged above the pass line PL. This causes significant problems such as a reduction in the machining accuracy.
Therefore, it is necessary to clean and remove the laser processing waste adhering to the opposite side surface as appropriate.
Generally, this cleaning and removal is performed by an operator's hand. However, Patent Document 1 discloses a cleaning device that performs automatically in a laser / punch combined processing machine. This cleaning device is provided on a carriage that is movable in the Y-axis direction.

JP 2004-209534 A

By the way, the types of laser processing machines include a laser processing composite machine capable of performing laser processing and punching as described in Patent Document 1, and a laser processing single machine that performs only laser processing.
The laser processing complex machine usually includes a carriage that can move in both the X-axis direction and the Y-axis direction.
On the other hand, a single unit for laser processing usually includes a carriage that moves only in the X-axis direction. Then, the workpiece is moved only in the X-axis direction by the carriage, and the laser processing head is moved in the Y-axis direction to perform only laser processing.
Therefore, it is difficult to apply the workpiece machining waste cleaning device described in Patent Document 1 to a laser machining single machine in which the carriage does not move in the Y-axis direction.
For this reason, the workpiece machining waste cleaning device has a function that can satisfactorily clean and remove the laser machining waste adhering to the opposing side surfaces of the pair of cutting plates, regardless of the type of the laser processing machine to be mounted alone or in combination. It is desired.
In other words, the laser processing machine is equipped with a workpiece processing debris cleaning device that can clean and remove workpiece processing debris regardless of the type of the single machine or multi-function machine, and is attached to the opposite side surfaces of a pair of cutting plates. It is desirable that the processing waste can be cleaned and removed well.

  That is, the problem to be solved by the present invention is to provide a laser processing machine that can satisfactorily clean and remove laser processing waste adhering to the opposing side surfaces of a pair of cutting plates regardless of the type of a single machine or a multifunction machine. .

In order to solve the above problems, the present invention has the following configuration.
1) a table for placing the workpiece;
A machining head that reciprocates in a uniaxial direction above the table and irradiates the table with laser light;
A pair of cutting plates provided on the table and arranged to face each other so as to form an opening corresponding to the irradiation position of the laser beam;
An actuator attached to the machining head;
A moving member that moves up and down by the operation of the actuator;
A cleaning position that is provided on the moving member and moves into the opening and contacts the opposite side surfaces of the pair of cutting plates as a result of the vertical movement of the moving member, and a standby state in which the moving member leaves the opening and is in non-contact. A cleaning member that moves between the position;
A laser processing machine comprising:
2) The laser processing machine according to 1), wherein the cleaning member is a brush provided on the moving member.
3) The cleaning member
A plate-shaped scraper disposed opposite to the opposing side surfaces;
An urging member for urging the scraper toward the opposing side surface at the cleaning position;
The laser processing machine according to 1), characterized in that
4) The laser processing machine according to any one of 1) to 3), wherein the processing head is moved in the uniaxial direction in a state where the cleaning member is located at the contact position.
5) The laser beam machine according to 4), wherein the moving member is movable in the vertical direction while moving the machining head in the uniaxial direction.

  According to the present invention, there is an effect that it is possible to satisfactorily clean and remove the workpiece waste adhering to the opposing side surfaces of the pair of cutting plates regardless of the type of the single machine or the multifunction machine.

It is a perspective view for demonstrating the laser processing machine 52 which is Example 1 of the laser processing machine which concerns on embodiment of this invention. It is a left view in the standby state for demonstrating the cleaning apparatus 51 with which the laser beam machine 52 was equipped. It is sectional drawing in the S2-S2 position of FIG. 1 in the standby state for demonstrating the cleaning apparatus 51. FIG. It is a left view in the front-end part position in the cleaning operation state for demonstrating the cleaning apparatus 51. FIG. It is sectional drawing in the S2-S2 position of FIG. 1 in the cleaning operation state for demonstrating the cleaning apparatus 51. FIG. It is a left view in the rear-end part position in the cleaning operation state for demonstrating the cleaning apparatus 51. FIG. It is a graph which shows the time change of the Y-axis direction position of the axis line CN of the nozzle 3b in cleaning operation. It is a graph which shows the time change of the Z-axis direction position of the brush planting part 23b in cleaning operation. It is a block diagram for demonstrating the structure in connection with the cleaning operation | movement in the laser beam machine 52. FIG. It is a left view for demonstrating the cleaning apparatus 51A of Example 2. FIG. It is sectional drawing in the S2-S2 position of FIG. 1 in the standby state for demonstrating the cleaning apparatus 51A. It is sectional drawing in the S2-S2 position of FIG. 1 in the cleaning operation state for demonstrating the cleaning apparatus 51A. It is a schematic diagram for demonstrating the modification of the cleaning apparatus 51. FIG.

  A laser beam machine according to an embodiment of the present invention will be described with reference to FIGS. 1 to 13 by preferred examples 1 and 2 and modifications thereof. In this description, the X, Y, and Z axes and the front, rear, up, down, left and right directions corresponding to the respective axes are defined by arrows in FIG.

(Example 1)
Example 1 of the laser beam machine according to the embodiment of the present invention is a laser beam machine 52 that is a so-called laser beam machine unit that includes a laser beam debris cleaning device 51 (hereinafter also simply referred to as a cleaning device 51). First, the overall configuration will be described with reference to FIGS. 1 to 6 and FIG.

FIG. 1 is an external perspective view of a laser processing machine 52 provided with a cleaning device 51. 2, 4, and 6 are left side views for explaining the cleaning device 51 provided in the laser beam machine 52, and a part thereof is a cross-section at the position S <b> 1-S <b> 1 in FIG. 1. Yes.
3 and 5 are cross-sectional views at the position S2-S2 in FIG. 1, and the cleaning device 51 is a partial cross-section of the brush portion 23 for convenience. FIG. 9 is a block diagram of the laser processing machine 52.

The laser processing machine 52 includes a table device 52a having a table unit 1 on which a workpiece W is placed, an arch 2 spanned in a gate shape in the Y-axis direction (front-rear direction) with respect to the table device 52a, and an arch 2 On the other hand, the machining head 3 is supported so as to be drivable in the Y-axis and Z-axis directions (vertical direction).
A guide rail 4 that extends long in the X-axis direction (left-right direction) is attached to the rear edge of the table device 52a. A carriage 5 is supported on the guide rail 4 so as to be driven in the X-axis direction. A plurality of clampers 6 are attached to the carriage 5 apart from each other in the X-axis direction.
A workpiece W to be processed is plate-shaped and is gripped by a plurality of clampers 6. In FIG. 1, the work W is indicated by a one-dot chain line. The gripped work W moves in the X-axis direction as the carriage 5 moves.

As shown in FIG. 2, the processing head 3 includes a main body 3a, a nozzle 3b provided at the lower end thereof, and a cleaning device 51 integrated with the front side surface 3a1 of the main body 3a. ing.
Laser light is emitted from the nozzle 3b toward the lower table device 52a (to the workpiece W supported by the table device 52a during processing). The optical axis CL of the irradiated laser light is in the vertical direction. The optical axis CL coincides with the axis CN of the nozzle 3b.
While irradiating the workpiece W supported by the table device 52a and gripped by the clamper 6 from the nozzle 3b, the workpiece W is moved in the X-axis direction by the carriage 5, and the machining head 3 is moved to the Y of the arch 2. By moving in the axial direction, laser processing can be performed on a desired two-dimensional position of the workpiece W.

  As shown in FIG. 2, the cleaning device 51 includes a housing 22 that houses the actuator 21, and a brush portion 23 that moves up and down (arrow DRa) on the lower side of the housing 22 by the operation of the actuator 21. In this example, an air cylinder is used as the actuator 21.

The movement of the machining head 3 and the carriage 5 and the operation of the clamper 6 are executed by corresponding driving units (hereinafter collectively referred to as the driving unit KD) (see FIG. 9). The operations of the drive unit KD and the actuator 21 are controlled by the control unit CT. The control unit CT is accommodated in the operation panel 7 (see FIG. 1) of the laser beam machine 52, for example.
In the following description, it is assumed that the machining head 3 moves in the Y-axis direction and the Z-axis direction by the operation of the head drive unit Kh (see FIG. 9) in the drive unit KD. At least above the table unit 1, it moves in a uniaxial direction (Y-axis direction) along the table unit 1.

Along with the movement of the machining head 3 by the operation of the head drive unit Kh, the laser light irradiation path (trajectory of the optical axis CL) becomes a plane parallel to the YZ plane.
The table device 52a is provided with a cutting plate portion 11 having a straight opening 12 corresponding to the irradiation path (see FIGS. 1 and 3).
The opening 12 functions as a hole for dropping laser processing waste generated by laser processing downward.
As shown in FIG. 3, the cutting plate portion 11 includes a pair of cutting plates 13L and 13R (hereinafter simply referred to as plates 13L) that are spaced apart from each other to form an opening 12 corresponding to the irradiation position of the laser beam. , 13R). The pair of plates 13L and 13R are plate-like members that are long in the front-rear direction.

Next, the detailed configuration and operation of the cleaning device 51 will be described with reference mainly to FIGS.
As shown in FIG. 3, the plate 13L and the plate 13R are such that the right side surface 13La of the plate 13L and the left side surface 13Ra of the plate 13R are separated from each other by a distance Da with the optical axis CL of the laser light as the center on the left and right. Is arranged.
A chamfered portion 13Lb and a chamfered portion 13Lc are formed at the corners of the plate 13L where the upper and lower surfaces and the side surface 13La are connected. Similarly, a chamfered portion 13Rb and a chamfered 8 portion 13Rc are provided at the protruding corners where the upper and lower surfaces of the plate 13R are connected to the side surface 13Ra. The upper surfaces of the plates 13L and 13R are on the same plane, and the height position thereof is the position of the pass line PL.

The brush portion 23 of the cleaning device 51 is a rod shaft of the actuator 21 or a brush shaft portion 23a of a moving member that moves up and down connected to the rod, and a brush planting portion 23b provided in a predetermined vertical range on the tip side thereof. ,have.
The brush planting part 23b is a part where a plurality of brush bristles 23c are erected in the radial direction on the brush shaft part 23a, and functions as a cleaning member. The length of the brush planting portion 23b in the vertical direction is set to be sufficiently longer (for example, 3 to 5 times) than the thickness of the plates 13L and 13R.
The outer shape of the brush planting portion 23b in a bottom view is a circle having a diameter Db.
The diameter Db is set to be larger than the distance Da that is the opening width of the opening 12.
Examples of the material of the brush bristles 23c are metal wires such as brass, stainless steel, and metal-plated steel, and heat-resistant and flame-retardant resin fibers.

When the cleaning operation is not being performed (hereinafter also referred to as a non-cleaning operation state), the control unit CT keeps the brush shaft portion 23a of the actuator 21 retracted.
The cleaning device 51 is brought into the non-cleaning operation state when the laser processing machine 52 is not operating or laser processing.
Before or after laser processing, the control unit CT executes the cleaning operation by an instruction via the operator's input unit 41 (see FIG. 9) or by an execution instruction for a cleaning operation set in advance in the processing program. .

The basic operation of the cleaning operation is executed as follows, for example. In executing this basic operation, the control unit CT operates the actuator 21 in advance to raise the brush shaft portion 23a, and the brush planting portion 23b exits from the opening portion 12 and comes into contact with the plates 13L and 13R without contacting them. Also, a standby position located above is set (FIGS. 2 and 3). The state at this standby position is referred to as a standby state.
(S1): The control unit CT drives the head drive unit Kh to move the machining head 3 to one end side of the machining movement range ARa in the Y-axis direction (see FIG. 2).
The position of the front end of the processing movement range ARa is defined as position P1, and the position of the rear end is defined as position P2. At the time of machining, the axis CN of the machining head 3 moves in a machining movement range ARa that is a range between the position P1 and the position P2.
FIG. 2 shows a state where the axis CN is at the position P1.

The position of the axis line CN and the axis line Ca of the brush portion 23b are separated from each other in the Y-axis direction, and the axis line Ca is located on the front side.
Therefore, as shown in FIG. 2 and the like, the plates 13L and 13R that form the opening 12 reach the lower portion corresponding to the brush portion 23b when the axis CN is at the position P1 at the front end of the processing movement range ARa. It is formed to extend forward.

(S2): The control unit CT operates the actuator 21 to extend the brush shaft portion 23a downward (FIGS. 4 and 5).
With the brush shaft portion 23a extending, the brush planting portion 23b enters the inside of the opening portion 12 and is positioned at a cleaning position where it contacts the side surfaces 13La and 13Ra of the plates 13L and 13R. This state is referred to as a cleaning state.

(S3): The control unit CT operates the head driving unit Kh to move the machining head 3 toward the position P2 on the rear end side.
With this movement, the brush bristles 23c of the brush planting portion 23b slide on the side surfaces 13La and 13Ra of the plates 13L and 13R.
Here, as shown in FIG. 3, the outer diameter Db of the brush planting portion 23 b is larger than the distance Da that is the opening width of the opening 12.
Therefore, at least the side surfaces 13La and 13Ra of the plates 13L and 13R are rubbed while being urged away from each other by the elastic repulsive force of the brush bristles 23c. Thereby, the deposits on the side surfaces 13La and 13Ra are scraped off.

FIG. 6 shows a state in which the machining head 3 has completed the one-way movement from the front end side to the rear end side in the cleaning operation.
As shown in FIG. 6, the brush planting portion 23b slides at least in a range corresponding to the processing movement range ARa on the side surfaces 13La and 13Ra (a range between the position P1 and the position P2 where the optical axis CL moves). As described above, a moving range in the cleaning operation (hereinafter referred to as a cleaning moving range ARb) is set.
More specifically, the cleaning movement range ARb coincides with the processing movement range ARa at the front side end that is the side on which the cleaning device 51 is attached to the main body 3a of the processing head 3, and the rear side on the opposite side. It is set beyond the machining movement range ARa at the end. The exceeding distance is a distance where the axis Ca of the brush shaft portion 23a exceeds the position P2. The position of the axis CN at the rear end of the cleaning movement range ARb is defined as a position P3. The position P3 is at a position P3 on the left side of the position P2 at the left end of the processing movement range ARa.

(S4): The control unit CT reciprocates the machining head 3 a specified number of times within the cleaning movement range ARb. This reciprocating range is not limited to the entire cleaning movement range ARb, but may be a partial range within the cleaning movement range ARb.
(S5): When the predetermined number of reciprocations are completed, the control unit CT operates the actuator 21 to retract the brush shaft 23a. Thereby, the brush planting part 23b leaves the opening part 12, and is located in the original standby position.

FIG. 7 is a graph showing the change over time in the Y-axis direction position of the axis CN of the nozzle 3b in the above-described cleaning operation. This graph shows an example of an operation that makes two reciprocations in the Y-axis direction.
Specifically, the execution time of the cleaning operation is time t1 to t5, and at this time, the machining head 3 reciprocates at a constant speed between the position P1 and the position P2.

The number of reciprocations in the Y-axis direction in the cleaning operation may be increased or decreased according to the length of the laser processing time in the non-cleaning operation period from the previous cleaning operation to the current cleaning operation.
The amount of deposits adhering to the side surfaces 13La and 13Ra of the plates 13L and 13R increases as the laser processing time in the non-cleaning operation period increases. Therefore, it is preferable to increase or decrease the number of reciprocations, such as increasing the number of reciprocations as the processing time is longer.
Further, the control unit CT obtains the relationship between the position in the Y-axis direction where the laser processing is executed and the laser processing time at that position from the processing program, and the time provided for the laser processing time on the side surfaces 13La and 13Ra. The movement pattern in the Y-axis direction of the brush portion 23 may be set so that the longer the portion, the greater the number of contact times (contact time) of the brush portion 23 is (longer).

Further, the control unit CT may cause the brush unit 23 to move one way or reciprocate in the Z axis direction along with the movement in the Y axis direction in the cleaning operation.
FIG. 8 shows an example in which the brush planting portion 23b is reciprocated between a height position Z1 within a range in contact with the side surfaces 13La and 13Ra of the plates 13L and 13R and a height position Z2 at a higher position. It is the graph which showed. This example is an example of reciprocating three times in the Z-axis direction.
Specifically, in the operation at time t1 to t2 in FIG. 7 of the cleaning operation, the brush portion 23 reciprocates at a constant speed 3 times from the height position Z1 in the Z-axis direction. is there.

  By this Z-axis movement, it is possible to prevent a portion in contact with the side surfaces 13La and 13Ra from being biased to a specific portion in the brush planting portion 23b. Therefore, the wear of the brush planting part 23b is made uniform in the Z-axis direction, and the brush part 23 can be used for a long time.

In the cleaning device 51 of the first embodiment, the Z-axis direction length of the brush planting portion 23b having the elastic bristle 23c is set to be longer than the thickness of the plates 13L and 13R. Thereby, the site | part rubbed by the brush planting part 23b extends not only to the side surfaces 13La and 13Ra but also to the upper chamfered portions 13Lb and 13Rb and the lower chamfered portions 13Lc and 13Rc.
Further, by increasing the diameter Db of the brush planting portion 23b, the brush bristles 23c can reach and rub against the upper and lower surfaces of the plates 13L and 13R.
In this way, the cleaning device 51 can clean the plates 13L and 13R over a wide range of sites including the side surfaces 13La and 13Ra.

(Example 2)
The second embodiment is a laser processing machine 52A provided with a laser processing waste cleaning device 51A (hereinafter also simply referred to as a cleaning device 51A), and will be described mainly with reference to FIGS.
The external appearance of the laser processing machine 52A is obtained by replacing the brush part 23 of the laser processing machine 52 shown in FIG. 1 with a scraper part 33 described below, and other parts are common. In FIG. 1, the perspective shape of the brush part 23 is described.

FIG. 10 is a partial cross-sectional view showing the scraper unit 33 and the processing head 3 in a cleaning operation state at the position S1-S1 in FIG. For convenience, a part of the scraper shaft portion 33a of the scraper portion 33 is shown broken away. Moreover, the non-cleaning operation state in which the scraper unit 33 is raised is indicated by a two-dot chain line.
FIG. 11 is a cross-sectional view in the non-cleaning operation state at the S2-S2 position in FIG. 1, and FIG. 12 is a cross-sectional view in the cleaning operation state at the same position. In both figures, the scraper portion 33 is shown as an external front view.

The scraper portion 33 includes a scraper shaft portion 33a that is a rod of the actuator 21, and a pair of scrapers 33c that are connected to the left and right sides of the tip portion via compression coil springs 33b as elastic urging members, respectively. Have.
The pair of scrapers 33c are inclined portions 33c1 that are inclined so that the lower tip side approaches each other as it goes downward. Further, a portion above the inclined portion 33c1 is a flat plate portion 33c2 that extends in the up-down and front-back directions and is provided so as to be substantially parallel to each other.
In other words, the pair of scrapers 33c are plate-like members disposed to face the side surfaces 13La and 13Ra, respectively.

The distance DAb, which is the distance between the left and right outer surfaces of the pair of flat plate portions 33c2, is set to be larger than the distance Da of the opening width of the opening portion 12.
The distance DAc in the left-right direction outside the lower tip of the pair of inclined portions 33c1 is set to be smaller than the distance Da.
Thus, when the actuator 21 is operated and the scraper shaft portion 33a extends downward to be in a cleaning operation state under the control of the control portion CT, the inclined portion 33c1 first contacts the plates 13L and 13R, and the compression coil spring. 33b contracts and the scrapers 33c approach each other.
And as FIG. 12 shows, in a cleaning operation state, a pair of flat plate part 33c2 carries out the urging | biasing contact with side surfaces 13La and 13Ra so that they may be expanded.
The scraper 33c is made of, for example, a metal material or a hard resin material.

Also in the second embodiment provided with the scraper section 33 instead of the brush section 23, the basic operation of the cleaning operation is executed in the same procedures (S1) to (S5) as in the first embodiment.
In this cleaning operation, the flat plate portion 33c2 of the scraper 33c slides with respect to the side surfaces 13La and 13Ra of the plates 13L and 13R, and the sliding is caused by the elastic repulsive force of the elastic biasing member (for example, compression coil spring) 33b. It is performed while energizing in the direction of releasing.
Thereby, the deposits on the side surfaces 13La and 13Ra are scraped off.

  Also in the second embodiment, the reciprocating motion in the Y-axis direction described with reference to FIG. 7 in the first embodiment and the reciprocating motion in the Z-axis direction illustrated with reference to FIG. 8 may be applied as the operation of the scraper 33c. .

  According to the embodiments 1 and 2 described in detail above, the cleaning devices 51 and 51A including the brush planting portion 23b which is a cleaning member reciprocate in the Y-axis direction integrally with the processing head 3. . Therefore, even if the laser processing machines 52 and 52A provided with the cleaning devices 51 and 51A are of a type in which the carriage 5 is moved only in the X-axis direction (for example, a single laser processing machine), the X-axis and Y-axis Even if it is the type (for example, laser compound processing machine) which moves 2 axis | shaft of this, the laser processing waste adhering to the opposing side surface of a cutting plate can be cleaned and removed favorably.

  The embodiments of the present invention are not limited to the above-described configuration, and modifications may be made without departing from the spirit of the present invention.

The cleaning devices 51 and 51A may allow the user to replace the rod of the actuator 21 or the actuator 21 itself by applying a known replaceable structure.
That is, when performing the cleaning operation, the user may be able to select the mode of the first embodiment including the brush unit 23 and the mode of the second embodiment including the scraper unit 33.
By adopting this exchangeable mode, it is possible to selectively use the brush portion 23 having a different specification of the brush bristles 23c or to selectively use the scraper portion 33 having a different urging force.

Further, as shown in FIG. 13, the cleaning device 51 may be modified to include a motor M that rotates the brush portion 23 and the entire actuator 21 that moves the brush portion 23 up and down. The operation of the motor M is controlled by the control unit CT. The motor M is applicable only to the cleaning device 51, and is indicated by a one-dot chain line in FIG. 9 for convenience.
Thereby, the brush bristles 23c of the brush planting portion 23b rub against the side surfaces 13La and 13Ra while rotating. That is, the side surfaces 13La and 13Ra are rubbed in the Y-axis direction in addition to rubbing in the Z-axis direction by the brush bristles 23c. Further, the side surfaces 13La and 13Ra can be rubbed obliquely upward or obliquely downward by moving up and down in the Z-axis direction together with the rotation. For this reason, the deposit is scraped off better than the case of rubbing in one direction.

  The rotation direction of the motor M may be reversed during the cleaning operation. Thereby, it is possible to easily peel off deposits that bite in one direction on the side surfaces 13La and 13Ra.

  The laser processing waste is formed by forming file-like irregularities on the surface on the side facing the side surfaces 13La and 13Ra of the scraper 33c in the cleaning device 51A, or containing hard particles in the vicinity of the surface on the facing side as a material. It is better to be able to scrape better.

In the first and second embodiments, the cleaning movement range is made larger than the processing movement range, so that the side surface of the processing movement range can be obtained even when the brush unit 23 and the scraper unit 33 are biased in the Y-axis direction with respect to the processing head 3. Although the configuration in which 13La and 13Ra are always cleaned by the brush portion 23 and the scraper portion 33 has been described, the present invention is not limited to this.
For example, the processing movement range and the cleaning movement range may be matched, and the area where the brush part 23 and the scraper part 33 are not cleaned may be manually cleaned.
Further, a pair of brush portions 23 or scraper portions 33 may be attached to the side surface of the processing head 3 on the Y axis direction side.
In this case, the side surfaces 13La and 13Ra of the machining movement range are reliably cleaned even if the machining movement range and the cleaning movement range are matched.

DESCRIPTION OF SYMBOLS 1 Table unit 2 Arch 3 Processing head 3a Main body part, 3a1 Front side surface, 3b Nozzle 4 Guide rail, 5 Carriage, 6 Clamper 7 Operation panel 11 Cutting plate part, 12 Opening part 13L, 13R (Cutting) plate, 13La, 13Ra Side face 13Lb, 13Lc, 13Rb, 13Rc Chamfered portion 21 Actuator 22 Housing 23 Brush portion 23a Brush shaft portion, 23b Brush planting portion, 23c Brush hair 33 Scraper portion 33a Scraper shaft portion, 33b Compression coil spring (elastic biasing member)
33c scraper, 33c1 inclined portion, 33c2 flat plate portion 41 input portions 51, 51A cleaning device 52, 52A laser processing machine, 52a table device ARa processing movement range, ARb cleaning movement range Ca (brush shaft portion 23a) axis, CN (nozzle 3b) axis CL optical axis CT control unit Da, DAb distance, Db diameter KD drive unit, Kh head drive unit, M motor PL pass line, P1-P3 position Z1, Z2 height position W work

Claims (5)

A table for placing a workpiece;
A machining head that reciprocates in a uniaxial direction above the table and irradiates the table with laser light;
A pair of cutting plates provided on the table and arranged to face each other so as to form an opening corresponding to the irradiation position of the laser beam;
An actuator attached to the machining head;
A moving member that moves up and down by the operation of the actuator;
A cleaning position that is provided on the moving member and moves into the opening and contacts the opposite side surfaces of the pair of cutting plates as a result of the vertical movement of the moving member, and a standby state in which the moving member leaves the opening and is in non-contact. A cleaning member that moves between the position;
A laser processing machine comprising:   The laser processing machine according to claim 1, wherein the cleaning member is a brush provided on the moving member. The cleaning member is
A plate-shaped scraper disposed opposite to the opposing side surfaces;
An urging member for urging the scraper toward the opposing side surface at the cleaning position;
The laser processing machine according to claim 1, comprising:   The laser processing machine according to any one of claims 1 to 3, wherein the processing head is moved in the uniaxial direction in a state where the cleaning member is located at the cleaning position.   5. The laser beam machine according to claim 4, wherein the moving member is movable in the vertical direction while moving the machining head in the uniaxial direction.

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