JP2016015691A - Head phone and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a head phone and a method of manufacturing the same, capable of easily adjusting acoustic resistance of a housing during manufacturing and preventing generation of abnormal sound by suppressing vibration of the housing.SOLUTION: A head phone includes: a head phone unit 10 for transmitting a sound signal; an annular baffle plate 2 having an opening to support the head phone unit; and a housing 6 which is attached to the peripheral edge of the baffle plate so as to cover the head phone unit from the rear side. The housing has a base material 7 formed by metal fiber and expanded metal.

Description

  The present invention relates to a headphone and a method for manufacturing the headphone, and more particularly to a headphone including a housing that covers a headphone unit from the rear side, and capable of adjusting an acoustic resistance value of the housing during the manufacturing, and a method for manufacturing the headphone.

  Among the headphones, the ear covering type, the ear mounting type, the supraconca type, and the like have a housing that covers the headphone unit from the rear. For example, in the headphone 40 shown in FIG. 5 as disclosed in Patent Document 1, the headphone unit 10 is mounted in the center opening portion of the annular baffle plate 2, and the baffle so as to cover the baffle plate 2 and the headphone unit 10. A housing 20 is attached to the outer surface of the plate 2.

In addition, an annular ear pad 4 having a predetermined height (thickness) with respect to the head 50 is attached to the peripheral portion of the inner surface of the baffle plate 2. As the ear pad 4, one having a high sound insulating property is used to constitute the ear covering type headphone 40.
According to such headphones 40, sound waves generated acoustically from the headphone unit 10 are applied to the ears by surrounding the user's ears 51 with the ear pads 4.

By the way, in the headphone 40 having the housing 20, the rear open type that radiates sound waves radiated from the rear part of the headphone 40 into the free space and the sound wave that surrounds the rear part of the headphone unit are not radiated into the free space. There are a back-sealed type and a half-open type in between.
In the case of the rear open type, the housing 20 is provided with an opening through which sound waves pass. In the case of the semi-open type, an acoustic resistance such as a net is used for the housing 20, and the operation is performed with the performance between the back open type and the back sealed type.

JP2013-42382A

However, the housing 20 may vibrate due to sound waves from the headphone unit 10 or sound waves from free space. There is a problem that sound waves are generated by the vibrated housing 20, and the sound waves reach the ear as abnormal noise.
Therefore, a technique for suppressing the vibration of the housing 20 is required, but there is a problem that it is generally difficult to suppress the vibration of the housing 20 formed of a resin or a high-strength metal (such as aluminum or titanium). . Further, increasing the rigidity of the housing 20 in order to suppress vibration has caused the weight of the headphones to increase. Therefore, a comfortable wearing feeling has been sacrificed.

  The present invention has been made paying attention to the above-described points, and is a headphone including a housing that covers the headphone unit from the rear, and the acoustic resistance of the housing can be easily adjusted at the time of manufacture. It is an object of the present invention to provide a headphone capable of suppressing vibration and preventing the generation of abnormal noise and a method for manufacturing the same.

In order to solve the above-described problems, a headphone according to the present invention covers a headphone unit that emits an audio signal, an annular baffle plate having an opening that supports the headphone unit, and the headphone unit from the rear side. And a housing attached to the peripheral edge of the baffle plate, the housing having a base material formed of metal fibers and expanded metal.
In addition, as for the base material of the said housing, it is desirable that the coating film is formed in the outer surface.
The metal fiber is preferably an aluminum fiber.
Moreover, it is desirable that the housing has an acoustic resistance set according to the amount of the metal fiber. Alternatively, the housing may be configured such that acoustic resistance is set according to the compressibility of the metal fiber.
Thus, since the housing is composed of a base material formed from metal fibers (aluminum fibers), the housing can have a desired acoustic resistance value by adjusting the amount of aluminum and the degree of compression during manufacture. Moreover, a coating film is formed on the surface of a base material, and an acoustic resistance value can also be adjusted by the thickness of a coating film.
That is, it is possible to obtain a headphone whose housing has a desired acoustic resistance value. Moreover, since the housing which has the base material which consists of the said metal fiber (aluminum fiber) is excellent in vibration-proof property, generation | occurrence | production of the abnormal noise resulting from the vibration of a housing can be prevented.

In addition, in order to solve the above-described problem, a headphone manufacturing method according to the present invention includes a step of forming a plate member made of metal fiber to produce a housing-shaped base material, and a paint on the surface of the base material. A step of coating and forming a housing on which a coating film having a predetermined film thickness is formed, and an annular baffle plate that supports the headphone unit that emits an audio signal so as to cover the headphone unit from the rear side. Attaching the housing to the peripheral edge of the baffle plate.
In the step of coating the surface of the base material and forming a housing in which a coating film having a predetermined film thickness is formed, the acoustic resistance value of the housing is set by adjusting the film thickness to be formed. It is desirable.
Alternatively, the acoustic resistance value of the housing may be set by adjusting the compression rate of the metal fibers of the base material in the step of forming the plate member and preparing the housing-shaped base material.
According to such a method, the housing can have a desired acoustic resistance value by adjusting the thickness of the coating film during production or by adjusting the compressibility of the metal fibers of the base material.
That is, it is possible to obtain a semi-open type headphone whose housing has a desired acoustic resistance value. Moreover, since the housing which has the base material which consists of the said metal fiber (aluminum fiber) is excellent in vibration-proof property, generation | occurrence | production of the abnormal noise resulting from the vibration of a housing can be prevented.

  A headphone comprising a housing that covers a headphone unit from the rear, the headphone capable of easily adjusting the acoustic resistance of the housing at the time of manufacture, and suppressing the vibration of the housing and preventing the generation of abnormal noise, and the headphone A manufacturing method can be obtained.

FIG. 1 is a cross-sectional view of a headphone according to the present invention. 2 is a cross-sectional view of a base material of a housing included in the headphones of FIG. FIG. 3 is a cross-sectional view of a state in which a coating film is formed on the substrate of FIG. FIG. 4 is a cross-sectional view showing an example in which the thickness of the base material of the housing is increased in the headphones according to the present invention. FIG. 5 is a cross-sectional view of a conventional headphone.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view of a headphone according to the present invention.
In this embodiment, dynamic headphones that drive the diaphragm by vibration of the voice coil will be described as an example. However, the present invention is not limited to this, and can be applied to other driving methods, for example, capacitor-type headphones.
In the following description, the same reference numerals are used for members that are the same as the members of the conventional headphones already shown in FIG.

  As shown in FIG. 1, the headphone 1 includes a headphone unit 10 that is an electroacoustic transducer. The headphone unit 10 includes a diaphragm 11 and a magnetic circuit unit 12. When an audio signal is supplied as an electric current to the voice coil 13 of the headphone unit 10 from an audio reproduction device (not shown), the diaphragm 11 vibrates and operates as a speaker. Sound is emitted from the headphone unit 10 when the diaphragm 11 vibrates.

  The headphone 1 also has an annular baffle plate 2 that supports the headphone unit 10. On one surface side, an ear pad 4 addressed to the ear part of the listener when the headphones are worn is joined. The ear pad 4 includes an outer skin 4a and a stuffing member 4b in which an elastic material is packed. The member having elasticity is, for example, porous urethane or sponge.

A housing 6 is provided on the other surface side of the baffle plate 2, that is, on the rear side of the headphone unit 10 so as to cover the headphone unit 10.
The housing 6 is sandwiched between the baffle plate 2 and an annular frame member 3 whose periphery is disposed on the periphery of the baffle plate 2, and is fixed on the baffle plate 2 by screws 5.

  The housing 6 includes a base material 7 and a coating film 8 painted on the surface of the base material 7. The base material 7 of the housing 6 is molded from a plate member having sound absorption and acoustic resistance obtained by molding metal fibers, preferably aluminum fibers, into a plate shape. Specifically, for example, an aluminum fiber formed by sandwiching an expanded metal from both sides (such as UNIC's Poal C1) can be used. The base material 7 can be obtained by pressing into a predetermined housing shape as shown in FIG.

  Since the base material 7 is formed of aluminum fiber, the acoustic resistance value can be easily adjusted. The said base material 7 can change an acoustic resistance value by changing the quantity of the aluminum fiber to be used, and the compression rate at the time of pressing. If the base material 7 processed to have a low acoustic resistance value is used as a housing, a headphone having the same characteristics as a back-open headphone can be configured. On the other hand, as shown in FIG. 4, the base material 7 can be formed thick by increasing the amount of aluminum fibers, and a headphone having characteristics similar to a sealed headphone can be configured.

In addition, the acoustic resistance value can be adjusted by applying a resin material, paint, or the like to the outer surface of the base material 7 after press working. As the resin material to be applied, for example, a thermoplastic liquid resin, an ultraviolet curable liquid resin, a liquid glass that is cured by drying, or the like can be used. In the present embodiment, a coating film 8 having a predetermined thickness can be formed as shown in FIG. That is, since the acoustic resistance value varies depending on the thickness of the coating film 8, the housing 6 having a desired acoustic resistance value can be obtained. Therefore, the semi-open type and sealed type headphones 1 can be selectively configured by applying a paint or a resin material to the outer surface of the base material.
Moreover, since the said base material 7 is formed from the aluminum fiber, it has vibration proof property. Thereby, the housing 6 has an effect of suppressing unnecessary vibration.

As described above, according to the embodiment of the present invention, the housing 6 is composed of the base material 7 formed of aluminum fibers and the coating film 8 coated on the surface of the base material 7. By adjusting the thickness of the coating film 8, the housing 6 can have a desired acoustic resistance value. Furthermore, the acoustic resistance value of the housing 6 can also be set by increasing or decreasing the amount of aluminum fibers used for the base material 7 during manufacture or adjusting the degree of compression during press working.
That is, the headphone 1 in which the housing 6 has a desired acoustic resistance value can be obtained, and an open type, a semi-open type, and a closed type headphone can be realized by the housing 6 made of the same material, so that productivity is also improved. Moreover, since the housing 6 having the base material 7 made of the aluminum fiber is excellent in vibration proofing, it is possible to prevent the generation of abnormal noise due to the vibration of the housing 6. Moreover, since the housing 6 is comprised of a lightweight base material, a lightweight headphone with a good wearing feeling can be realized.

  In the above-described embodiment, the aluminum fiber is described as a preferred example of the metal fiber used for the base material 7 of the housing 6. However, the present invention is not limited to this and other metal fibers are not limited thereto. For example, stainless steel fibers may be used.

DESCRIPTION OF SYMBOLS 1 Headphone 2 Baffle board 4 Ear pad 4a Skin 4b Stuffing member 6 Housing 7 Base material 8 Coating film 10 Headphone unit 50 Head 51 Ear

Claims (8)

A headphone unit that emits an audio signal;
An annular baffle plate having an opening for supporting the headphone unit;
A housing attached to a peripheral portion of the baffle plate so as to cover the headphone unit from the rear side;
The headphone characterized in that the housing has a base material formed of metal fibers and expanded metal.   The headphone according to claim 1, wherein the base material of the housing has a coating film formed on an outer surface thereof.   The headphone according to claim 1, wherein the metal fiber is an aluminum fiber.   The headphone according to any one of claims 1 to 3, wherein an acoustic resistance of the housing is set according to an amount of the metal fiber.   5. The headphone according to claim 1, wherein the housing has an acoustic resistance set by a compressibility of the metal fiber. Molding a plate member made of metal fibers and producing a housing-shaped base material;
Painting a paint on the surface of the base material, and forming a housing in which a coating film having a predetermined thickness is formed;
Mounting the housing to a peripheral edge of the baffle plate so as to cover the headphone unit from the rear side with respect to an annular baffle plate that supports a headphone unit that emits an audio signal. Production method. In the step of coating the surface of the substrate and forming a housing in which a coating film having a predetermined thickness is formed,
The method for manufacturing headphones according to claim 6, wherein an acoustic resistance value of the housing is set by adjusting a film thickness to be formed. In the step of molding the plate member and producing a housing-shaped base material,
The method for manufacturing a headphone according to claim 6 or 7, wherein an acoustic resistance value of the housing is set by adjusting a compressibility of the metal fiber of the base material.

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