JP2016010018A - Dielectric resonator and electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a dielectric resonator which has a simple structure and reduces harmful effect caused by spurious emission.SOLUTION: A dielectric resonator 1 includes: a high dielectric constant body 2 having an outer surface; a first electrode 11 having a first contact surface 11a which contacts with the outer surface of the high dielectric constant body 2; a second electrode 12 having a second contact surface 12a which contacts with the outer surface of the high dielectric constant body 2; a third electrode 13 having a third contact surface 13a which contacts with the outer surface of the high dielectric constant body 2; an inductor formed by using the first electrode 11, the second electrode 12, and the high dielectric constant body 2; and a capacitor formed by using the first electrode 11, the third electrode 13, and the high dielectric constant body 2. A distance between the first contact surface 11a and the third contact surface 13a is smaller than a distance between the first contact surface 11a and the second contact surface 12a.

Description

  The present invention relates to a dielectric resonator which is a resonator configured using a dielectric, and an electronic component including the dielectric resonator.

  In recent years, a microwave band, particularly a frequency band of 0.6 GHz to 24 GHz, is often used for high-capacity and high-speed wireless communication. In general, a communication device used for wireless communication includes a resonator.

  Examples of the resonator used in the communication device include a dielectric coaxial resonator, a resonator using a distributed constant line, an LC resonator using an inductor and a capacitor, a dielectric resonator, a cavity resonator, and the like.

  By the way, spurious may occur in the resonator. In the communication device, spurious having a frequency close to twice or three times the resonance frequency of the resonator may adversely affect the characteristics. One cause of the occurrence of spurious is self-resonance due to the conductor pattern.

  Patent Document 1 has a plurality of through-holes coated with an inner conductor between a first end face and a second end face facing each other in a dielectric block, and is formed on the outer face of the dielectric block excluding the first end face. A plurality of resonators configured to be covered with an outer conductor, and input / output electrodes insulated from the outer conductor and capacitively coupled to the resonator of the input / output stage at the first end face and extended to the mounting surface A dielectric filter is described. Patent Document 1 describes a technique for obtaining good spurious characteristics by including a conductor pattern having an inductance component such that the input / output electrode self-resonates at a predetermined frequency on the first end face.

JP 2004-328118 A

  Among various resonators, the dielectric resonator has an advantage that a high unloaded Q value can be obtained with low loss. However, the conventional general dielectric resonator includes a conductor layer having a surface having a relatively large area, and due to self-resonance by the conductor layer, the resonance frequency of the dielectric resonator is twice or There was a problem that spurious signals having a frequency close to three times were likely to occur.

  In the technique described in Patent Document 1, spurious generated in the dielectric filter is suppressed by utilizing self-resonance generated by the conductor pattern. However, with this technology, it is necessary to design the shape of the conductor pattern so that the self-resonant frequency generated by the conductor pattern matches the frequency at which spurious is to be suppressed, and it is difficult to design the shape of the conductor pattern. There is.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a dielectric resonator having a simple configuration and capable of reducing adverse effects due to spurious and an electronic component including the dielectric resonator.

  A dielectric resonator according to the present invention includes a first dielectric having a first relative dielectric constant, and a high dielectric constant body having an outer surface and a first contact surface in contact with the outer surface of the high dielectric constant body. A first electrode, a second electrode having a second contact surface in contact with the outer surface of the high dielectric constant body, a third electrode having a third contact surface in contact with the outer surface of the high dielectric constant body, An inductor configured using the electrode, the second electrode, and the high dielectric constant body, and a capacitor configured using the first electrode, the third electrode, and the high dielectric body. The first to third contact surfaces are arranged at a distance from each other. The distance between the first contact surface and the third contact surface is smaller than the distance between the first contact surface and the second contact surface. In the dielectric resonator of the present invention, a resonant circuit is constituted by an inductor and a capacitor.

  The dielectric resonator of the present invention further comprises a second dielectric having a second relative dielectric constant smaller than the first dielectric constant, and a surrounding dielectric portion existing around the high dielectric constant body is provided. You may have.

  In the dielectric resonator according to the aspect of the invention, the outer surface of the high dielectric constant main body includes a first end surface and a second end surface located on opposite sides, and a connection surface that connects the first end surface and the second end surface. The first contact surface and the third contact surface may be in contact with the first end surface, and the second contact surface may be in contact with the second end surface.

  In the dielectric resonator of the present invention, the second electrode and the third electrode may be electrically connected to each other, and the resonance circuit may be a parallel resonance circuit.

  In the dielectric resonator of the present invention, the resonance frequency of the resonance circuit may exist within a range of 0.6 GHz to 24 GHz.

  The electronic component of the present invention includes one or more dielectric resonators of the present invention.

  According to the present invention, a dielectric resonator having a simple configuration can be realized. Further, in the present invention, in order to realize a capacitor, it is not necessary to provide two conductor layers each having a surface with a large area so that the surfaces face each other. Thus, according to the present invention, it is possible to prevent a large spurious from being generated at a frequency close to twice or three times the resonance frequency of the resonance circuit due to the conductor layer having a large area. From the above, according to the present invention, there is an effect that it is possible to realize a dielectric resonator and an electronic component including the dielectric resonator that have a simple configuration and can reduce the adverse effects caused by spurious.

1 is a perspective view showing a dielectric resonator according to a first embodiment of the present invention. It is sectional drawing of the dielectric resonator in the position shown by the 2-2 line in FIG. It is a perspective view which shows a part of dielectric resonator shown in FIG. FIG. 4 is a plan view showing first and third contact surfaces in the dielectric resonator shown in FIG. 1. FIG. 2 is a circuit diagram showing a circuit configuration of the dielectric resonator shown in FIG. 1. It is a perspective view which shows the dielectric resonator of the modification in the 1st Embodiment of this invention. It is sectional drawing of the dielectric resonator in the position shown by the 7-7 line | wire in FIG. It is a perspective view which shows the dielectric resonator of the 1st comparative example. It is sectional drawing of the dielectric resonator in the position shown by the 9-9 line | wire in FIG. It is explanatory drawing for demonstrating the parasitic inductance and parasitic capacitance which generate | occur | produce in the dielectric resonator of a 1st comparative example. It is a circuit diagram which shows the equivalent circuit of the dielectric resonator of the 1st comparative example including the parasitic inductance and the parasitic capacitance. FIG. 12 is a characteristic diagram illustrating a reflection attenuation characteristic of the equivalent circuit illustrated in FIG. 11. It is explanatory drawing for demonstrating the parasitic capacitance which generate | occur | produces in the dielectric resonator which concerns on the 1st Embodiment of this invention. It is a circuit diagram which shows the equivalent circuit of the dielectric resonator which concerns on 1st Embodiment including parasitic capacitance. FIG. 15 is a characteristic diagram illustrating a reflection attenuation characteristic of the equivalent circuit illustrated in FIG. 14. FIG. 5 is a characteristic diagram showing a relationship between a first relative dielectric constant and a resonance frequency in the dielectric resonator according to the first embodiment of the present invention. It is explanatory drawing which shows the 1st thru | or 4th modification of the 1st and 3rd contact surface in the 1st Embodiment of this invention. It is explanatory drawing which shows the 5th thru | or 7th modification of the 1st and 3rd contact surface in the 1st Embodiment of this invention. It is a perspective view of the electronic component which concerns on the 2nd Embodiment of this invention. It is sectional drawing of the electronic component in the position shown by the 20-20 line | wire in FIG. It is a top view which shows the lower surface of the dielectric material part in the electronic component shown in FIG. It is a top view which shows the 1st and 3rd contact surface in the electronic component shown in FIG. FIG. 20 is a circuit diagram illustrating a circuit configuration of the electronic component illustrated in FIG. 19. It is a perspective view which shows the electronic component of the 2nd comparative example. It is sectional drawing of the electronic component in the position shown by the 25-25 line | wire in FIG. It is a top view which shows the lower surface of the dielectric material part in the electronic component shown in FIG. It is a characteristic view which shows the insertion loss characteristic of the electronic component of the 2nd comparative example. It is a characteristic view which shows the insertion loss characteristic of the electronic component which concerns on the 2nd Embodiment of this invention.

[First Embodiment]
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, the structure of the dielectric resonator according to the first embodiment of the invention will be described with reference to FIGS. FIG. 1 is a perspective view showing a dielectric resonator according to the present embodiment. FIG. 2 is a cross-sectional view of the dielectric resonator at the position indicated by line 2-2 in FIG. FIG. 3 is a perspective view showing a part of the dielectric resonator shown in FIG.

  As shown in FIGS. 1 to 3, the dielectric resonator 1 according to the present embodiment is composed of a first dielectric having a first dielectric constant E1, and a high dielectric constant body 2 having an outer surface. And a surrounding dielectric portion 3 made of a second dielectric having a second relative dielectric constant E2 smaller than the first relative dielectric constant E1 and existing around the high dielectric constant body 2. 1 to 3 show an example in which the high dielectric constant body 2 has a rectangular parallelepiped shape. However, the shape of the high dielectric constant body 2 is not limited to this example.

  The first dielectric constant E1 is preferably in the range of 30 to 100,000. The second relative dielectric constant E2 is preferably 1/10 or less of the first relative dielectric constant E1.

  Examples of the dielectric material constituting the first dielectric include calcium titanate, strontium titanate, barium titanate, and metal oxide materials containing barium titanate, such as barium strontium titanate and barium titanate. Calcium can be mentioned.

  Examples of the dielectric material constituting the second dielectric material include resins such as polytetrafluoroethylene, ceramics such as alumina, glass, and composite materials thereof. Note that the second dielectric may be air.

  Here, as shown in FIG. 1, an X direction, a Y direction, and a Z direction are defined. The X direction, the Y direction, and the Z direction are orthogonal to each other. In the example shown in FIGS. 1 to 3, the high dielectric constant body 2 includes a first end surface 2 a and a second end surface 2 b located on opposite sides in the Z direction, and a first end surface 2 a and a second end surface. 2b. The connection surface includes two side surfaces 2c and 2d located on opposite sides in the X direction and two side surfaces 2e and 2f located on opposite sides in the Y direction.

  In the example shown in FIGS. 1 to 3, the surrounding dielectric portion 3 exists around the high dielectric constant body 2 in a cross section orthogonal to the Z direction, and the connection surface (side surfaces 2c, 2d, 2e, 2f). As shown in FIG. 1, the surrounding dielectric portion 3 includes a lower surface 3a and an upper surface 3b located on opposite sides in the Z direction, and four side surfaces 3c, 3d, 3e, and 3f that connect the lower surface 3a and the upper surface 3b. have. The side surfaces 3c and 3d are located on opposite sides in the X direction. The side surfaces 3e and 3f are located on opposite sides in the Y direction. The lower surface 3a of the surrounding dielectric portion 3 and the first end surface 2a of the high dielectric constant body 2 are located on the same plane. The upper surface 3b of the surrounding dielectric part 3 and the second end surface 2b of the high dielectric constant body 2 are located on the same plane.

  The dielectric resonator 1 further includes a first electrode 11, a second electrode 12, and a third electrode 13. The electrodes 11, 12, and 13 are made of a metal such as Ag or Cu. As shown in FIG. 3, the first electrode 11 has a first contact surface 11 a that contacts the outer surface of the high dielectric constant body 2. The second electrode 12 has a second contact surface 12 a in contact with the outer surface of the high dielectric constant body 2. The third electrode 13 has a third contact surface 13 a that contacts the outer surface of the high dielectric constant body 2. The first to third contact surfaces 11a, 12a, 13a are arranged at a distance from each other. In FIG. 3, the first to third contact surfaces 11a, 12a, and 13a are shown with hatching.

  In the example shown in FIGS. 1 to 3, the first electrode 11 and the third electrode 13 are both on the lower surface 3 a of the surrounding dielectric portion 3 and the first end surface 2 a of the high dielectric constant body 2. Has been placed. The first electrode 11 extends from the position of the ridge line between the side surface 3 c and the lower surface 3 a to the first end surface 2 a of the high dielectric constant body 2. The first contact surface 11 a is in contact with a part of the first end surface 2 a of the outer surface of the high dielectric constant body 2. The third contact surface 13 a is in contact with the other part of the first end surface 2 a of the outer surface of the high dielectric constant body 2.

  FIG. 4 is a plan view showing the first contact surface 11a and the third contact surface 13a. As shown in FIG. 4, the third contact surface 13a has a U-shape and is arranged so as to surround the first contact surface 11a from three directions.

  The second electrode 12 is disposed on the upper surface 3 b of the surrounding dielectric portion 3 and the second end surface 2 b of the high dielectric constant body 2. The second contact surface 12 a is in contact with the entire surface of the second end surface 2 b of the outer surface of the high dielectric constant body 2.

  The distance between the first contact surface 11a and the third contact surface 13a is the distance between the first contact surface 11a and the second contact surface 12a and the second contact surface 12a and the third contact surface 13a. Less than the distance between.

  The dielectric resonator 1 further includes conductor layers 14 and 15 disposed on the side surfaces 3e and 3f of the surrounding dielectric part 3, respectively. The conductor layers 14 and 15 are made of a metal such as Ag or Cu. The conductor layers 14 and 15 are both connected to the second electrode 12 and the third electrode 13. In this way, the second electrode 12 and the third electrode 13 are electrically connected to each other via the conductor layers 14 and 15. In FIG. 3, the conductor layers 14 and 15 are omitted.

  Next, referring to FIG. 5, a design circuit configuration of the dielectric resonator 1 shown in FIG. 1 will be described. The dielectric resonator 1 includes an input / output terminal 21, an inductor 22, and a capacitor 23. The input / output terminal 21 is configured by the first electrode 11. The inductor 22 is configured using the first electrode 11, the second electrode 12, and the high dielectric constant main body 2 interposed therebetween. The capacitor 23 is configured using the first electrode 11, the third electrode 13, and the high dielectric constant body 2. The first electrode 11 and the second electrode 12 constitute both ends of the inductor 22. The first electrode 11 and the third electrode 13 constitute both ends of the capacitor 23.

  The input / output terminal 21, one end of the inductor 22, and one end of the capacitor 23 are all constituted by the first electrode 11. Therefore, one end of the inductor 22 and one end of the capacitor 23 are electrically connected to the input / output terminal 21.

  The other end of the capacitor 23 constituted by the third electrode 13 and the other end of the inductor 22 constituted by the second electrode 12 are electrically connected to the ground. In the dielectric resonator 1, the inductor 22 and the capacitor 23 constitute a resonance circuit, particularly a parallel resonance circuit. The resonance frequency of this resonance circuit (parallel resonance circuit) is preferably in the range of 0.6 GHz to 24 GHz.

  Next, the inductor 22 in the present embodiment will be described in detail. In the present embodiment, the first contact surface 11a of the first electrode 11 is in contact with the first end surface 2a of the high dielectric constant body 2, and the second contact surface 12a of the second electrode 12 is high dielectric constant. The main body 2 is in contact with the second end surface 2b. The high dielectric constant main body 2 propagates electromagnetic waves having a frequency in the range of at least 0.6 GHz to 24 GHz between the first contact surface 11a and the second contact surface 12a. When the electromagnetic wave propagates through the high dielectric constant body 2, a magnetic field is generated, and magnetic energy is stored by this magnetic field. Therefore, the inductor 22 using the first electrode 11, the second electrode 12, and the high dielectric constant body 2 is configured.

  Next, the capacitor 23 in the present embodiment will be described in detail. In the present embodiment, the first contact surface 11 a of the first electrode 11 and the third contact surface 13 a of the third electrode 13 are in contact with the first end surface 2 a of the high dielectric constant body 2. The distance between the first contact surface 11a and the third contact surface 13a is the distance between the first contact surface 11a and the second contact surface 12a and the second contact surface 12a and the third contact. It is smaller than the distance between the surfaces 13a. In the present embodiment, since the distance between the first contact surface 11a and the third contact surface 13a is small, the first electrode 11, the third electrode 13, and the high dielectric constant body 2 are used to The capacitor 23 having both ends of the electrode 11 and the third electrode 13 is formed. That is, when a potential difference is generated between the first electrode 11 and the third electrode 13, an electric field is generated between the first contact surface 11a and the third contact surface 13a. This electric field is generated at least in part of the inside of the high dielectric constant body 2 in the vicinity of the first contact surface 11a and the third contact surface 13a. And since electric energy is stored by this electric field, the capacitor 23 using the 1st electrode 11, the 3rd electrode 13, and the high dielectric constant main body 2 is comprised.

  In the present embodiment, the first electrode 11, the third electrode 13, and the high dielectric constant are obtained by bringing the first contact surface 11 a and the third contact surface 13 a located on the outer surface of the high dielectric constant body 2 close to each other. The capacitor 23 is realized using the main body 2. In the present embodiment, the inductor 22, not the capacitor, is realized by using the first electrode 11, the second electrode 12, and the high dielectric constant body 2 interposed therebetween. When the first contact surface 11a and the second contact surface 12a are close to each other, a capacitor is formed by the first electrode 11, the second electrode 12, and the high-dielectric constant body 2, so that the inductor 22 can be realized. The distance between the first contact surface 11a and the second contact surface 12a needs to be large so that the capacitor is not constituted by the first electrode 11, the second electrode 12, and the high dielectric constant body 2. . Therefore, in order to realize the inductor 22 and the capacitor 23 by using one high dielectric constant main body 2 and the first to third electrodes 11, 12, 13 in contact with the outer surface as in the present embodiment. This is a necessary condition that the distance between the first contact surface 11a and the third contact surface 13a is smaller than the distance between the first contact surface 11a and the second contact surface 12a.

  In the dielectric resonator 1 according to the present embodiment, the input / output terminal 21 configured by the first electrode 11 is supplied with electric power having an arbitrary frequency including a frequency in the range of 0.6 GHz to 24 GHz. . The dielectric resonator 1 resonates at a resonance frequency within a range of 0.6 GHz to 24 GHz.

[Modification]
Next, with reference to FIG. 6 and FIG. 7, the dielectric resonator 1 of the modification in this Embodiment is demonstrated. FIG. 6 is a perspective view showing a dielectric resonator 1 according to a modification. FIG. 7 is a cross-sectional view of the dielectric resonator 1 according to a modification at the position indicated by line 7-7 in FIG.

  As shown in FIG. 6, in the dielectric resonator 1 according to the modification, the high dielectric constant body 2 has a cylindrical shape. As shown in FIG. 7, the high dielectric constant main body 2 includes a first end surface 2a and a second end surface 2b that are located on opposite sides in the Z direction, and a first end surface 2a and a second end surface 2b. And a connection surface 2g to be connected. The peripheral dielectric portion 3 exists around the high dielectric constant body 2 in a cross section perpendicular to the Z direction, and is in contact with the connection surface 2 g of the high dielectric constant body 2.

  As shown in FIG. 7, similarly to the example shown in FIGS. 1 to 3, in the modified example, the first electrode 11 contacts the first end face 2 a of the outer surface of the high dielectric constant body 2. The second electrode 12 has a second contact surface 12a that contacts the second end surface 2b of the outer surface of the high dielectric constant body 2, and the third electrode 13 has a first contact surface 11a. It has the 3rd contact surface 13a which contacts the 1st end surface 2a of the outer surfaces of the high dielectric constant main body 2. FIG.

  Other configurations and operations of the dielectric resonator 1 according to the modification are the same as those of the example shown in FIGS.

  Next, the effect of the dielectric resonator 1 according to the present embodiment will be described while comparing with the dielectric resonator of the first comparative example. First, the dielectric resonator of the first comparative example will be described with reference to FIGS. FIG. 8 is a perspective view showing a dielectric resonator of a first comparative example. FIG. 9 is a cross-sectional view of the dielectric resonator of the first comparative example at the position indicated by line 9-9 in FIG.

  As shown in FIGS. 8 and 9, the dielectric resonator 101 of the first comparative example includes a high-dielectric constant body 102 made of a first dielectric having a first relative dielectric constant E1, a second dielectric It is made of a second dielectric material having a relative dielectric constant E2, and includes a peripheral dielectric portion 103 existing around the high dielectric constant body 102. 8 and 9 show examples in which the high dielectric constant main body 102 has a rectangular parallelepiped shape. However, the shape of the high dielectric constant body 102 is not limited to this example, and may be, for example, a cylindrical shape.

  In the example shown in FIGS. 8 and 9, the high dielectric constant body 102 includes a first end surface 102 a and a second end surface 102 b located on opposite sides in the Z direction, and a first end surface 102 a and a second end surface. And a connecting surface for connecting 102b. The connection surface includes two side surfaces 102c and 102d located on opposite sides in the X direction and two side surfaces 102e and 102f located on opposite sides in the Y direction.

  The surrounding dielectric portion 103 has a lower surface 103a and an upper surface 103b that are located on opposite sides in the Z direction, and four side surfaces 103c, 103d, 103e, and 103f that connect the lower surface 103a and the upper surface 103b. The side surfaces 103c and 103d are located on opposite sides in the X direction. The side surfaces 103e and 103f are located on opposite sides in the Y direction. The first end face 102 a of the high dielectric constant main body 102 is located inside the surrounding dielectric portion 103. The upper surface 103b of the surrounding dielectric part 103 and the second end surface 102b of the high dielectric constant main body 102 are located on the same plane.

  In the example shown in FIGS. 8 and 9, the peripheral dielectric portion 103 includes a first layer 103A and a second layer 103B disposed on the first layer 103A.

  The dielectric resonator 101 further includes conductor layers 112, 113, 114, and 115 disposed on the lower surface 103a, the upper surface 103b, and the side surfaces 103e and 103f of the surrounding dielectric part 103, respectively. The conductor layer 112 covers most of the lower surface 103a. The conductor layer 113 covers most of the upper surface 103b. The conductor layer 114 covers the entire side surface 103 e and is electrically connected to the conductor layers 112 and 113. The conductor layer 115 covers the entire side surface 103f and is electrically connected to the conductor layers 112 and 113. The conductor layers 112, 113, 114, and 115 are connected to the ground.

  The dielectric resonator 101 further includes a conductor layer 117 disposed inside the peripheral dielectric portion 103 so as to face the conductor layer 112 with a predetermined interval. The conductor layer 117 is disposed on the first layer 103 </ b> A of the surrounding dielectric portion 103. Therefore, the first layer 103A is interposed between the conductor layer 112 and the conductor layer 117. The first end surface 102 a of the high dielectric constant main body 102 is connected to the conductor layer 117. The conductor layer 117 has an end portion 117 a exposed at the side surface 103 c of the surrounding dielectric portion 103. The second end face 102 b of the high dielectric constant body 102 is connected to the conductor layer 113. The conductor layers 112, 113, 114, 115, 117 are made of a metal such as Ag or Cu.

  Next, a design circuit configuration of the dielectric resonator 101 will be described. In the dielectric resonator 101, input / output terminals are constituted by the conductor layer 117. Further, in the dielectric resonator 101, an inductor is constituted by the conductor layers 117 and 113 and the high dielectric constant body 102 interposed therebetween. One end of the inductor is electrically connected to the input / output terminal, and the other end of the inductor is electrically connected to the ground. Further, in the dielectric resonator 101, a capacitor is configured by the conductor layers 117 and 112 and the first layer 103A of the surrounding dielectric portion 103 interposed therebetween. One end of the capacitor is electrically connected to the input / output terminal, and the other end of the capacitor is electrically connected to the ground. The design circuit configuration of the dielectric resonator 101 is the same as the design circuit configuration of the dielectric resonator 1 according to the present embodiment shown in FIG.

  Next, the parasitic inductance and parasitic capacitance generated in the dielectric resonator 101 will be described with reference to FIGS. FIG. 10 is an explanatory diagram for explaining the parasitic inductance and the parasitic capacitance generated in the dielectric resonator 101. FIG. 11 is a circuit diagram showing an equivalent circuit of the dielectric resonator 101 including parasitic inductance and parasitic capacitance.

  As described above, the design circuit configuration of the dielectric resonator 101 is the same as the design circuit configuration of the dielectric resonator 1 according to the present embodiment shown in FIG. That is, as shown in FIG. 11, the dielectric resonator 101 includes an input / output terminal 121, an inductor 122, and a capacitor 123. One end of the inductor 122 is electrically connected to the input / output terminal 121, and the other end of the inductor 122 is electrically connected to the ground. One end of the capacitor 123 is electrically connected to the input / output terminal 121, and the other end of the capacitor 123 is electrically connected to the ground. The input / output terminal 121 is composed of a conductor layer 117. The inductor 122 is configured using a conductor layer 117, a conductor layer 113, and a high dielectric constant body 102 interposed therebetween. The capacitor 123 is configured using the conductor layer 117, the conductor layer 112, and the first layer 103A of the surrounding dielectric portion 103 interposed therebetween.

  In the dielectric resonator 101, the capacitor 123 is realized by providing two conductor layers 112 and 117 each having a surface with a large area so that the surfaces face each other. The conductor layer 117 has a parasitic inductance and a parasitic capacitance. Hereinafter, the parasitic inductance and parasitic capacitance of the conductor layer 117 are represented as an inductor 131 and a capacitor 132, respectively. Further, in the dielectric resonator 101, in addition to the parasitic capacitance represented as the capacitor 132, the parasitic capacitance represented as the capacitors 133, 134, and 135 in FIGS. 10 and 11 is generated.

  The parasitic capacitance expressed as the capacitor 133 is generated between the conductor layers 114 and 115 connected to the ground other than the conductor layer 112 and the conductor layer 117. As shown in FIG. 11, one end of the inductor 131 and one end of the capacitor 132 are electrically connected to the input / output terminal 121. One end of the capacitor 133 is electrically connected to the other end of the inductor 131 and the other end of the capacitor 132. The other end of the capacitor 133 is connected to the ground.

  Parasitic capacitances expressed as capacitors 134 and 135 are generated due to the inductor 122 (the high dielectric constant body 102 and the conductor layers 117 and 113). In FIG. 11, the inductor 122 is represented as two inductors 122A and 122B connected in series. The capacitor 134 is connected in parallel to the inductor 122A. The capacitor 135 is connected in parallel to the inductor 122B.

  In the equivalent circuit shown in FIG. 11, self-resonance caused by the conductor layer 117 and self-resonance caused by the inductor 122 occur. The self-resonance caused by the conductor layer 117 is resonance by the inductor 131 and the capacitors 132 and 133. The self-resonance caused by the inductor 122 is resonance caused by the inductors 122A and 122B and the capacitors 134 and 135. The resonance frequency of these self-resonances is higher than the resonance frequency of the dielectric resonator 101.

  FIG. 12 is a characteristic diagram showing the reflection attenuation characteristic of the equivalent circuit shown in FIG. In FIG. 12, the horizontal axis represents frequency and the vertical axis represents attenuation. In the reflection attenuation characteristic shown in FIG. 12, the attenuation amount is maximum at about 5.9 GHz. The frequency at which the attenuation amount is maximum is the resonance frequency of the dielectric resonator 101. In the reflection attenuation characteristics shown in FIG. 12, there are two peaks of attenuation at about 12 GHz and about 18 GHz. The attenuation peak at about 12 GHz is caused by self-resonance caused by the conductor layer 117. The attenuation peak at about 18 GHz is caused by self-resonance caused by the inductor 122. The two peaks of attenuation cause spurious at a frequency close to twice or three times the resonance frequency of the dielectric resonator 101 in the communication device including the dielectric resonator 101.

  Next, with reference to FIG. 13 and FIG. 14, the parasitic inductance and the parasitic capacitance generated in the dielectric resonator 1 according to the present embodiment will be described. FIG. 13 is an explanatory diagram for explaining the parasitic inductance and the parasitic capacitance generated in the dielectric resonator 1. FIG. 14 is a circuit diagram showing an equivalent circuit of the dielectric resonator 1 including parasitic inductance and parasitic capacitance.

  In dielectric resonator 1 according to the present embodiment, parasitic capacitances represented as capacitors 34 and 35 in FIGS. 13 and 14 are generated as in dielectric resonator 101 of the first comparative example. . The parasitic capacitances expressed as the capacitors 34 and 35 are similar to the parasitic capacitances expressed as the capacitors 134 and 135 in the dielectric resonator 101 of the first comparative example, and the inductor 22 (the high dielectric constant body 2 and the electrode 11, 12). In FIG. 13, the inductor 22 is represented as two inductors 22A and 22B connected in series. The capacitor 34 is connected in parallel to the inductor 22A. The capacitor 35 is connected in parallel with the inductor 22B.

  In the equivalent circuit shown in FIG. 14, self-resonance due to the inductor 22 occurs. The self-resonance caused by the inductor 22 is resonance caused by the inductors 22A and 22B and the capacitors 34 and 35. The resonance frequency of this self-resonance is higher than the resonance frequency of the dielectric resonator 1.

  In dielectric resonator 1 according to the present embodiment, in order to realize capacitor 23, it is not necessary to provide two conductor layers each having a large area so that the surfaces face each other. Therefore, in the dielectric resonator 1 according to the present embodiment, the dielectric resonator 1 according to the first comparative example is caused by the conductor layer for realizing the capacitor 23 such as the inductor 131 and the capacitors 132 and 133 in the dielectric resonator 101 of the first comparative example. Parasitic inductors and parasitic capacitances do not occur, and self-resonance due to this conductor layer does not occur.

  FIG. 15 is a characteristic diagram showing the reflection attenuation characteristic of the equivalent circuit shown in FIG. In FIG. 15, the horizontal axis represents frequency and the vertical axis represents attenuation. In the reflection attenuation characteristics shown in FIG. 15, the attenuation amount is maximum at about 5.9 GHz. The frequency at which the attenuation amount becomes maximum is the resonance frequency of the dielectric resonator 1. In the reflection attenuation characteristic shown in FIG. 15, a peak of attenuation exists at about 18 GHz. The attenuation peak at about 18 GHz is caused by self-resonance due to the high dielectric constant body 2. In the reflection attenuation characteristic shown in FIG. 15, there is no peak of attenuation at about 12 GHz that existed in the reflection attenuation characteristic shown in FIG. 12. This is because, as described above, in the dielectric resonator 1 according to the present embodiment, self-resonance due to the conductor layer for realizing the capacitor 23 does not occur.

  The attenuation at 18 GHz was 3.17 dB in the reflection attenuation characteristic shown in FIG. 12, and 1.05 dB in the reflection attenuation characteristic shown in FIG. Thus, in the dielectric resonator 1 according to the present embodiment, the attenuation at 18 GHz is smaller than that of the dielectric resonator 101 of the first comparative example. In this embodiment, the area of the surface of the conductor (electrodes 11 and 12) for forming the inductor 22 is the same as the conductor (conductor layers 113 and 117) for forming the inductor 122 in the first comparative example. This is because the capacitances of the capacitors 34 and 35 are smaller than the capacitances of the capacitors 134 and 135. In particular, in the present embodiment, the area of the surface of the electrode 11 used to configure the inductor 22 and the capacitor 23 is used to configure the inductor 122 and the capacitor 123 in the first comparative example. The area of the surface of the conductor layer 117 is very small. This is considered to contribute greatly to the fact that the attenuation at 18 GHz is smaller in the dielectric resonator 1 according to the present embodiment than in the dielectric resonator 101 of the first comparative example. .

  As described above, in the present embodiment, in order to realize the capacitor 23, it is not necessary to provide two conductor layers each having a surface with a large area so that the surfaces face each other. As a result, according to the present embodiment, it is possible to prevent a large spurious from occurring at a frequency close to twice or three times the resonance frequency of the resonance circuit due to the conductor layer having a large area. it can.

  The main components of the dielectric resonator 1 according to the present embodiment include a high dielectric constant body 2 having an outer surface, and first to third electrodes 11, 12, 12 that are in contact with the outer surface of the high dielectric constant body 2. 13. Therefore, the configuration of the dielectric resonator 1 is simple.

  From the above, according to the present embodiment, it is possible to realize the dielectric resonator 1 having a simple configuration and capable of reducing the adverse effects due to the spurious.

  Next, the reason why the first relative permittivity E1 is preferably in the range of 30 to 100,000 in the present embodiment will be described with reference to simulation results. In the simulation, first to third models described below were used. Each of the first to third models is a model using the dielectric resonator 1 shown in FIGS. 1 to 3. In the first to third models, the shape of the cross section orthogonal to the Z direction of the high dielectric constant body 2 is a square. In the first model, the length of one side of the square was 0.5 mm. In the second model, the length of one side of the square was 0.6 mm. In the third model, the length of one side of the square was 0.7 mm. In the first to third models, the length of the high dielectric constant body 2 in the Z direction is 1 mm. In the simulation, the resonance frequency of the dielectric resonator 1 was obtained by changing the first relative permittivity E1 to 100, 500, 2,000, and 10,000 in each of the first to third models. . The second relative dielectric constant E2 was 7.

  FIG. 16 is a characteristic diagram showing the relationship between the first relative permittivity E1 and the resonance frequency in the dielectric resonator 1. In FIG. 16, the horizontal axis represents the first relative dielectric constant E1, and the vertical axis represents the resonance frequency. In FIG. 16, a broken straight line denoted by reference numeral 51 indicates a relationship between the first relative permittivity E1 and the resonance frequency obtained by extrapolation from the simulation result of the first model. In FIG. 16, a broken straight line indicated by reference numeral 52 indicates the relationship between the first relative permittivity E1 and the resonance frequency obtained by extrapolation from the simulation result of the third model.

  In the present embodiment, the dielectric resonator 1 is designed so that its resonance frequency is in the range of 0.6 GHz to 24 GHz. A point 53 on the straight line 51 indicates a maximum value 100,000 of the first relative permittivity E1 that can set the resonance frequency of the dielectric resonator 1 to about 0.6 GHz within the range of the simulation conditions. Yes. A point 54 on the straight line 52 indicates the minimum value 30 of the first relative permittivity E1 that can set the resonance frequency of the dielectric resonator 1 to about 24 GHz within the range of the simulation conditions. Therefore, within the range of the simulation conditions, the resonance frequency of the dielectric resonator 1 is within the range of about 0.6 GHz to about 24 GHz by setting the first relative permittivity E1 within the range of 30 to 100,000. It becomes possible. From this point, in the present embodiment, the first relative permittivity E1 is preferably in the range of 30 to 100,000.

[Modification]
Next, first to seventh modifications of the first and third contact surfaces 11a and 13a in the present embodiment will be described with reference to FIGS. FIG. 17 is an explanatory diagram showing first to fourth modifications. FIG. 18 is an explanatory diagram showing fifth to seventh modification examples. 1st thru | or 4th modification is an example in case the high dielectric constant main body 2 has a rectangular parallelepiped shape like the example shown in FIG. 1 thru | or FIG. The fifth to seventh modifications are examples in the case where the high dielectric constant body 2 has a cylindrical shape as in the examples shown in FIGS. 6 and 7.

  FIG. 17A shows a first modification. In the first modification, the third contact surface 13a is disposed so as to sandwich the first contact surface 11a from both sides in the Y direction.

  FIG. 17B shows a second modification. In the second modification, the first contact surface 11a and the third contact surface 13a are arranged in the Y direction.

  (C) in FIG. 17 shows a third modification. In the third modification, the first contact surface 11a and the third contact surface 13a are arranged in the X direction.

  (D) in FIG. 17 shows a fourth modification. In the fourth modification, the shape of the cross section of the high dielectric constant body 2 orthogonal to the Z direction is a rectangle that is long in the Y direction. In this example, the third contact surface 13a has a U-shape and is disposed so as to surround the first contact surface 11a from three directions.

  FIG. 18A shows a fifth modification. In the fifth modification, the third contact surface 13a is disposed so as to sandwich the first contact surface 11a from both sides in the Y direction.

  FIG. 18B shows a sixth modification. In the sixth modification, the first contact surface 11a and the third contact surface 13a are arranged in the Y direction.

  FIG. 18C shows a seventh modification. In the seventh modification, the first contact surface 11a and the third contact surface 13a are arranged in the X direction.

[Second Embodiment]
Next, a dielectric resonator and an electronic component according to the second embodiment of the present invention will be described. First, the structure of the dielectric resonator and the electronic component according to the present embodiment will be described with reference to FIGS. FIG. 19 is a perspective view of the electronic component according to the present embodiment. 20 is a cross-sectional view of the electronic component at the position indicated by line 20-20 in FIG. FIG. 21 is a plan view showing the lower surface of the dielectric portion in the electronic component according to the present embodiment.

  Electronic component 200 according to the present embodiment includes two dielectric resonators 201A and 201B to realize a bandpass filter. The configuration of each of the dielectric resonators 201A and 201B is the same as that of the dielectric resonator 1 according to the first embodiment. That is, the dielectric resonator 201A includes a high dielectric constant body 202A made of a first dielectric having a first relative dielectric constant E1, and a second dielectric having a second relative dielectric constant E2. A peripheral dielectric portion 203A existing around the dielectric constant body 202A, a first electrode 211A, a second electrode 212A, and a third electrode 213A are provided. The dielectric resonator 201B includes a high dielectric constant body 202B made of the first dielectric having the first relative dielectric constant E1, and a second dielectric having the second relative dielectric constant E2. A peripheral dielectric portion 203B existing around the dielectric constant body 202B, a first electrode 211B, a second electrode 212B, and a third electrode 213B are provided.

  FIGS. 19 to 21 show an example in which the high dielectric constant bodies 202A and 202B have a rectangular parallelepiped shape. However, the shape of the high dielectric constant bodies 202A and 202B is not limited to this example, and may be, for example, a cylindrical shape.

  Here, as shown in FIG. 19, the X direction, the Y direction, and the Z direction are defined. The X direction, the Y direction, and the Z direction are orthogonal to each other. The high dielectric constant main body 202A has a first end surface 202Aa and a second end surface 202Ab that are located on opposite sides in the Z direction, and a connection surface that connects the first end surface 202Aa and the second end surface 202Ab. Yes. The connection surface of the high dielectric constant body 202A includes two side surfaces 202Ac and 202Ad located on opposite sides in the X direction and two side surfaces 202Ae and 202Af located on opposite sides in the Y direction.

  The high dielectric constant body 202B has a first end face 202Ba and a second end face 202Bb located on opposite sides in the Z direction, and a connection face connecting the first end face 202Ba and the second end face 202Bb. doing. The connection surface of the high dielectric constant main body 202B includes two side surfaces 202Bc and 202Bd located on opposite sides in the X direction and two side surfaces 202Be and 202Bf located on opposite sides in the Y direction.

  The high dielectric constant bodies 202A and 202B are arranged in the X direction so that the side surface 202Ad of the high dielectric constant body 202A and the side surface 202Bc of the high dielectric constant body 202B face each other.

  The surrounding dielectric portion 203A exists around the high dielectric constant body 202A in a cross section perpendicular to the Z direction, and is in contact with the connection surface (side surfaces 202Ac, 202Ad, 202Ae, 202Af) of the high dielectric constant body 202A. The surrounding dielectric portion 203B exists around the high dielectric constant body 202B in a cross section orthogonal to the Z direction, and is in contact with the connection surface (side surfaces 202Bc, 202Bd, 202Be, 202Bf) of the high dielectric constant body 202B. In the present embodiment, the surrounding dielectric portions 203A and 203B are integrated to form one dielectric portion 203. In FIG. 20, the boundary between the surrounding dielectric portion 203A and the surrounding dielectric portion 203B is indicated by a dotted line.

  As shown in FIG. 19, the dielectric portion 203 includes a lower surface 203a and an upper surface 203b that are opposite to each other in the Z direction, and four side surfaces 203c, 203d, 203e, and 203f that connect the lower surface 203a and the upper surface 203b. Have. The side surfaces 203c and 203d are located on opposite sides in the X direction. The side surfaces 203e and 203f are located on opposite sides in the Y direction.

  The lower surface 203a of the dielectric portion 203, the first end face 202Aa of the high dielectric constant body 202A, and the first end face 202Ba of the high dielectric constant body 202B are located on the same plane. The upper surface 203b of the dielectric portion 203, the second end face 202Ab of the high dielectric constant body 202A, and the second end face 202Bb of the high dielectric constant body 202B are located on the same plane. The high dielectric constant main body 202A is disposed in the vicinity of the side surface 203c of the dielectric portion 203. The high dielectric constant main body 202B is disposed in the vicinity of the side surface 203d of the dielectric portion 203.

  The first electrode 211A of the dielectric resonator 201A has a first contact surface 211Aa (see FIG. 20) in contact with the outer surface of the high dielectric constant body 202A. The second electrode 212A has a second contact surface 212Aa (see FIG. 20) in contact with the outer surface of the high dielectric constant body 202A. The third electrode 213A has a third contact surface 213Aa in contact with the outer surface of the high dielectric constant body 202A. The third contact surface 213Aa is not shown in FIGS. 19 to 21, but is shown in FIG. 22 described later. The first to third contact surfaces 211Aa, 212Aa, 213Aa are arranged at a distance from each other.

  In the example shown in FIGS. 19 to 21, the first electrode 211A and the third electrode 213A are both disposed on the lower surface 203a of the dielectric portion 203 and the first end surface 202Aa of the high dielectric constant body 202A. Has been. The first electrode 211A extends from the position of the ridge line between the side surface 203c and the lower surface 203a to the first end surface 202Aa of the high dielectric constant body 202A. The first contact surface 211Aa is in contact with a part of the first end surface 202Aa of the outer surface of the high dielectric constant body 202A. The third contact surface 213Aa is in contact with the other part of the first end surface 202Aa of the outer surface of the high dielectric constant body 202A.

  The first electrode 211B of the dielectric resonator 201B has a first contact surface 211Ba (see FIG. 20) in contact with the outer surface of the high dielectric constant body 202B. The second electrode 212B has a second contact surface 212Ba (see FIG. 20) in contact with the outer surface of the high dielectric constant body 202B. The third electrode 213B has a third contact surface 213Ba in contact with the outer surface of the high dielectric constant body 202B. The third contact surface 213Ba is not shown in FIGS. 19 to 21, but is shown in FIG. 22 described later. The first to third contact surfaces 211Ba, 212Ba, 213Ba are arranged at a distance from each other.

  In the example shown in FIGS. 19 to 21, the first electrode 211B and the third electrode 213B are both disposed on the lower surface 203a of the dielectric portion 203 and the first end surface 202Ba of the high dielectric constant body 202B. Has been. The first electrode 211B extends from the position of the ridge line between the side surface 203d and the lower surface 203a to the first end surface 202Ba of the high dielectric constant body 202B. The first contact surface 211Ba is in contact with a part of the first end surface 202Ba of the outer surface of the high dielectric constant body 202B. The third contact surface 213Ba is in contact with the other part of the first end surface 202Ba of the outer surface of the high dielectric constant body 202B.

  FIG. 22 is a plan view showing the first and third contact surfaces 211Aa and 213Aa of the dielectric resonator 201A and the first and third contact surfaces 211Ba and 213Ba of the dielectric resonator 201B. As shown in FIG. 22, the third contact surface 213Aa is disposed so as to sandwich the first contact surface 211Aa from both sides in the Y direction. The third contact surface 213Ba is arranged so as to sandwich the first contact surface 211Ba from both sides in the Y direction.

  The second electrode 212A of the dielectric resonator 201A is disposed on the upper surface 203b of the dielectric part 203 and the second end surface 202Ab of the high dielectric constant body 202A. The second contact surface 212Aa is in contact with the entire surface of the second end surface 202Ab of the outer surface of the high dielectric constant body 202A. The distance between the first contact surface 211Aa and the third contact surface 213Aa is the distance between the first contact surface 211Aa and the second contact surface 212Aa and the second contact surface 212Aa and the third contact surface 213Aa. Less than the distance between.

  The second electrode 212B of the dielectric resonator 201B is disposed on the upper surface 203b of the dielectric portion 203 and the second end surface 202Bb of the high dielectric constant body 202B. The second contact surface 212Ba is in contact with the entire surface of the second end surface 202Bb of the outer surface of the high dielectric constant body 202B. The distance between the first contact surface 211Ba and the third contact surface 213Ba is the distance between the first contact surface 211Ba and the second contact surface 212Ba and the second contact surface 212Ba and the third contact surface 213Ba. Less than the distance between.

  As shown in FIGS. 20 and 21, in the present embodiment, the third electrode 213A of the dielectric resonator 201A and the third electrode 213B of the dielectric resonator 201B are integrated into one conductor. Layer 213 is formed. The conductor layer 213 is disposed on the lower surface 203 a of the dielectric part 203. 20 and 21, the boundary between the third electrode 213A and the third electrode 213B is indicated by a dotted line.

  The electronic component 200 further includes conductor layers 214 and 215 disposed on the side surfaces 203e and 203f of the dielectric portion 203, respectively. The conductor layers 213 to 215 are made of a metal such as Ag or Cu.

  The conductor layers 214 and 215 are both connected to the second and third electrodes 212A and 213A of the dielectric resonator 201A and the second and third electrodes 212B and 213B of the dielectric resonator 201B. In this way, the second electrode 212A and the third electrode 213A of the dielectric resonator 201A are electrically connected to each other through the conductor layers 214 and 215. Further, the second electrode 212B and the third electrode 213B of the dielectric resonator 201B are also electrically connected to each other through the conductor layers 214 and 215.

  Next, with reference to FIG. 23, a design circuit configuration of the electronic component 200 shown in FIG. 19 will be described. The electronic component 200 includes two dielectric resonators 201A and 201B. The dielectric resonator 201A includes an input terminal 221, an inductor 222A, and a capacitor 223A. The dielectric resonator 201B includes an output terminal 224, an inductor 222B, and a capacitor 223B.

  The input terminal 221 is configured by the first electrode 211A of the dielectric resonator 201A. The inductor 222A is configured using a first electrode 211A, a second electrode 212A, and a high dielectric constant body 202A interposed therebetween. The capacitor 223A is configured by using a first electrode 211A, a third electrode 213A (conductor layer 213), and a high dielectric constant body 202A. The first electrode 211A and the second electrode 212A constitute both ends of the inductor 222A. The first electrode 211A and the third electrode 213A constitute both ends of the capacitor 223A.

  The input terminal 221, one end of the inductor 222A, and one end of the capacitor 223A are all configured by the first electrode 211A. Accordingly, one end of the inductor 222A and one end of the capacitor 223A are electrically connected to the input terminal 221.

  The other end of the capacitor 223A configured by the third electrode 213A and the other end of the inductor 222A configured by the second electrode 212A are electrically connected to the ground. In the dielectric resonator 201A, the inductor 222A and the capacitor 223A constitute a resonance circuit, particularly a parallel resonance circuit.

  The output terminal 224 is configured by the first electrode 211B of the dielectric resonator 201B. The inductor 222B is configured using a first electrode 211B, a second electrode 212B, and a high dielectric constant body 202B interposed therebetween. The capacitor 223B is configured by using the first electrode 211B, the third electrode 213B (conductor layer 213), and the high dielectric constant body 202B. The first electrode 211B and the second electrode 212B constitute both ends of the inductor 222B. The first electrode 211B and the third electrode 213B constitute both ends of the capacitor 223B.

  The output terminal 224, one end of the inductor 222B, and one end of the capacitor 223B are all configured by the first electrode 211B. Therefore, one end of the inductor 222B and one end of the capacitor 223B are electrically connected to the output terminal 224.

  The other end of the capacitor 223B configured by the third electrode 213B and the other end of the inductor 222B configured by the second electrode 212B are electrically connected to the ground. In the dielectric resonator 201B, the inductor 222B and the capacitor 223B constitute a resonance circuit, particularly a parallel resonance circuit.

  The dielectric resonator 201A and the dielectric resonator 201B are electromagnetically coupled. This electromagnetic field coupling is due to inductive coupling between the inductors 222A and 222B. In FIG. 23, the inductive coupling between the inductors 222A and 222B is represented by a curve with a symbol M attached thereto.

  The principle of configuring the inductors 222A and 222B is the same as the principle of configuring the inductor 22 described in the first embodiment. The principle of configuring the capacitors 223A and 223B is the same as the principle of configuring the capacitor 23 described in the first embodiment.

  In the electronic component 200 according to the present embodiment, when a signal is input to the input terminal 221 configured by the first electrode 211A, a signal having a frequency within a predetermined passband is selectively transmitted to the second terminal 221. The signal is output from the output terminal 224 constituted by the electrode 212B.

  Next, effects of the electronic component 200 according to the present embodiment will be described while comparing with the electronic component of the second comparative example. First, the electronic component of the second comparative example will be described with reference to FIGS. FIG. 24 is a perspective view showing an electronic component of a second comparative example. FIG. 25 is a cross-sectional view of the electronic component of the second comparative example at the position indicated by line 25-25 in FIG. FIG. 26 is a plan view showing the lower surface of the dielectric portion in the electronic component of the second comparative example.

  As shown in FIGS. 24 and 25, the electronic component 300 of the second comparative example includes two dielectric resonators 301A and 301B and realizes a bandpass filter. The dielectric resonators 301A and 301B are different from the dielectric resonator of the present invention. The dielectric resonator 301A includes a high dielectric constant body 302A made of a first dielectric having a first relative dielectric constant E1, and a second dielectric having a second relative dielectric constant E2, and has a high dielectric constant. And a surrounding dielectric portion 303A existing around the main body 302A. The dielectric resonator 301B includes a high dielectric constant body 302B made of a first dielectric having a first relative dielectric constant E1, and a second dielectric having a second relative dielectric constant E2, and has a high dielectric constant. And a surrounding dielectric portion 303B existing around the main body 302B.

  24 and 25 show an example in which the high dielectric constant bodies 302A and 302B have a rectangular parallelepiped shape. However, the shape of the high dielectric constant bodies 302A and 302B is not limited to this example, and may be, for example, a cylindrical shape.

  In the example shown in FIGS. 24 and 25, the high-dielectric constant body 302A includes a first end surface 302Aa and a second end surface 302Ab that are opposite to each other in the Z direction, and a first end surface 302Aa and a second end surface. And a connecting surface for connecting 302 Ab. The connection surface includes two side surfaces 302Ac and 302Ad located on opposite sides in the X direction and two side surfaces 302Ae and 302Af located on opposite sides in the Y direction.

  The high dielectric constant main body 302B has a first end surface 302Ba and a second end surface 302Bb located on opposite sides in the Z direction, and a connection surface connecting the first end surface 302Ba and the second end surface 302Bb. doing. The connection surface includes two side surfaces 302Bc and 302Bd located on opposite sides in the X direction and two side surfaces 302Be and 302Bf located on opposite sides in the Y direction.

  The high dielectric constant bodies 302A and 302B are arranged in the X direction so that the side surface 302Ad of the high dielectric constant body 302A and the side surface 302Bc of the high dielectric constant body 302B face each other.

  The surrounding dielectric portion 303A exists around the high dielectric constant body 302A in a cross section perpendicular to the Z direction, and is in contact with the connection surfaces (side surfaces 302Ac to 302Af) of the high dielectric constant body 302A. The peripheral dielectric portion 303B exists around the high dielectric constant main body 302B in a cross section orthogonal to the Z direction, and is in contact with the connection surfaces (side surfaces 302Bc to 302Bf) of the high dielectric constant main body 302B. The surrounding dielectric portions 303A and 303B are integrated to form one dielectric portion 303. In FIG. 25, the boundary between the surrounding dielectric portion 303A and the surrounding dielectric portion 303B is indicated by a dotted line.

  The dielectric portion 303 has a lower surface 303a and an upper surface 303b located on opposite sides in the Z direction, and four side surfaces 303c, 303d, 303e, and 303f that connect the lower surface 303a and the upper surface 303b. The side surfaces 303c and 303d are located on opposite sides in the X direction. The side surfaces 303e and 303f are located on opposite sides in the Y direction.

  The first end face 302Aa of the high dielectric constant body 302A and the first end face 302Ba of the high dielectric constant body 302B are located inside the dielectric portion 303. The upper surface 303b of the dielectric portion 303, the second end face 302Ab of the high dielectric constant body 302A, and the second end face 302Bb of the high dielectric constant body 302B are located on the same plane. The high dielectric constant main body 302 </ b> A is disposed in the vicinity of the side surface 303 c of the dielectric portion 303. The high dielectric constant main body 302B is disposed in the vicinity of the side surface 303d of the dielectric portion 303.

  In the example illustrated in FIGS. 24 and 25, the dielectric portion 303 includes a first layer 3031 and a second layer 3032 disposed on the first layer 3031.

  The electronic component 300 further includes conductor layers 312A, 312B, and 312C disposed on the lower surface 303a of the dielectric portion 303, a conductor layer 313 disposed on the upper surface 303b of the dielectric portion 303, and a side surface 303e of the dielectric portion 303. , 303f and conductor layers 314 and 315. The conductor layer 312A is disposed in the vicinity of the ridge line between the lower surface 303a and the side surface 303c. The conductor layer 312B is disposed in the vicinity of the ridge line between the lower surface 303a and the side surface 303d. The conductor layer 312C covers most of the lower surface 303a excluding the conductor layers 312A and 312B and the vicinity thereof. The conductor layer 313 covers most of the upper surface 303b. The conductor layer 314 covers the entire side surface 303e and is electrically connected to the conductor layers 312C and 313. The conductor layer 315 covers the entire side surface 303f and is electrically connected to the conductor layers 312C and 313. The conductor layers 312C, 313, 314, and 315 are connected to the ground.

  The electronic component 300 further has a conductor layer 317A disposed inside the dielectric portion 303 so as to face the conductor layers 312A and 312C with a predetermined gap, and a predetermined layer with respect to the conductor layers 312B and 312C. And a conductor layer 317B disposed inside the dielectric portion 303 so as to face each other with a gap. The conductor layers 317A and 317B are disposed on the first layer 3031 of the dielectric portion 303. Therefore, the first layer 3031 is interposed between the conductor layer 312C and the conductor layers 317A and 317B. The first end face 302Aa of the high dielectric constant body 302A is connected to the conductor layer 317A. The first end face 302Ba of the high dielectric constant body 302B is connected to the conductor layer 317B. The second end face 302Ab of the high dielectric constant body 302A and the second end face 302Bb of the high dielectric constant body 302B are connected to the conductor layer 313.

  The electronic component 300 further includes conductor portions 318A and 318B disposed inside the dielectric portion 303. The conductor portion 318A electrically connects the conductor layer 312A and the conductor layer 317A. The conductor portion 318B electrically connects the conductor layer 312B and the conductor layer 317B. The conductor layers 312A to 312C, 313 to 315, 317A, and 317B and the conductor portions 318A and 318B are made of a metal such as Ag or Cu.

  Next, a design circuit configuration of the electronic component 300 will be described. In the electronic component 300, the conductor layer 312A constitutes an input terminal, and the conductor layer 312B constitutes an output terminal. In the electronic component 300, the conductor layers 317A and 313 and the high dielectric constant main body 302A interposed therebetween constitute a first inductor, and the conductor layers 317B and 313 and the high dielectric layer interposed therebetween are formed. A second inductor is configured by the dielectric constant body 302B. One end of the first inductor is electrically connected to the input terminal, and the other end of the first inductor is electrically connected to the ground. One end of the second inductor is electrically connected to the output terminal, and the other end of the second inductor is electrically connected to the ground.

  In the electronic component 300, the conductor layers 317A and 312C and the first layer 3031 of the dielectric portion 303 interposed therebetween constitute a first capacitor, and the conductor layers 317B and 312C are interposed between them. A second capacitor is configured by the first layer 3031 of the dielectric portion 303 interposed therebetween. One end of the first capacitor is electrically connected to the input terminal, and the other end of the first capacitor is electrically connected to the ground. One end of the second capacitor is electrically connected to the output terminal, and the other end of the second capacitor is electrically connected to the ground.

  The dielectric resonator 301A includes an input terminal, a first inductor, and a first capacitor. The dielectric resonator 301B includes an output terminal, a second inductor, and a second capacitor. The dielectric resonator 301A and the dielectric resonator 301B are electromagnetically coupled. This electromagnetic field coupling is due to inductive coupling between the first and second inductors. The design circuit configuration of the electronic component 300 is the same as the design circuit configuration of the electronic component 200 according to the present embodiment shown in FIG.

  Next, parasitic inductance and parasitic capacitance generated in the electronic component 300 will be described. In the electronic component 300, the first capacitor is realized by providing the conductor layer 312C and the conductor layer 317A each having a surface having a large area so that the surfaces face each other, and the conductor layer having a surface having a large area. The second capacitor is realized by providing 312C and the conductor layer 317A so that their surfaces face each other. The conductor layers 317A and 317B both have parasitic inductance and parasitic capacitance. In the electronic component 300, a plurality of parasitic capacitances are generated between the conductor layers 314 and 315 connected to the ground other than the conductor layer 312C and the conductor layers 317A and 317B. In the electronic component 300, the parasitic capacitance caused by the first inductor (the high dielectric constant body 302A and the conductor layers 317A and 313) and the second inductor (the high dielectric constant body 302B and the conductor layers 317B and 313) are caused. Parasitic capacitance is generated. As described above, when a plurality of parasitic inductances and a plurality of parasitic capacitances are generated, in the electronic component 300, self-resonance caused by the conductor layers 317A and 317B and self-resonance caused by the first and second inductors occur. Occur.

  FIG. 27 is a characteristic diagram showing insertion loss characteristics of the electronic component 300 of the second comparative example. In FIG. 27, the horizontal axis represents frequency and the vertical axis represents attenuation. In the insertion loss characteristic shown in FIG. 27, the attenuation is minimum at about 5.8 GHz. A predetermined range including a frequency at which the attenuation amount is minimized is a pass band of the electronic component 300 (bandpass filter). In the insertion loss characteristic shown in FIG. 27, there are four peaks with a small attenuation at about 10.6 Hz, about 10.9 GHz, about 16.4 GHz, and about 17.5 GHz. Two peaks of attenuation at about 10.6 Hz and about 10.9 GHz are caused by self-resonance caused by the conductor layers 317A and 317B. Two peaks of attenuation at about 16.4 GHz and about 17.5 GHz are caused by self-resonance due to the first and second inductors. The four attenuation peaks cause a spurious frequency having a frequency close to twice or three times the pass band of the electronic component 300 in the communication device including the electronic component 300.

  Next, the insertion loss characteristic of the electronic component 200 according to the present embodiment will be described. FIG. 28 is a characteristic diagram showing an insertion loss characteristic of the electronic component 200 according to the present embodiment. In FIG. 28, the horizontal axis represents frequency and the vertical axis represents attenuation. In the insertion loss characteristic shown in FIG. 28, four attenuations at about 10.6 Hz, about 10.9 GHz, about 16.4 GHz, and about 17.5 GHz that existed in the insertion loss characteristic shown in FIG. 27 are reduced. There is no peak. This is considered to be due to the following reason.

  In electronic component 200 according to the present embodiment, in order to realize capacitors 223A and 223B, it is not necessary to provide a plurality of conductor layers having surfaces with large areas so that the surfaces face each other. Therefore, in electronic component 200 according to the present embodiment, conductors for realizing capacitors 223A and 223B, such as parasitic inductors and parasitic capacitances caused by conductor layers 317A and 317B in electronic component 300 of the second comparative example, are used. The parasitic inductor and parasitic capacitance caused by the layer do not occur, and the self-resonance caused by the conductor layer does not occur. Further, in electronic component 200 according to the present embodiment, parasitic capacitance caused by inductor 222A (high dielectric constant body 202A and electrodes 211A and 212A) and inductor 222B (high dielectric constant body 202B and electrodes 211B and 212B) is generated. . However, in this embodiment, since the areas of the surfaces of the electrodes 211A and 211B are particularly small, the parasitic capacitance caused by the inductors 222A and 222B is small.

  As described above, in this embodiment, in order to realize capacitors 223A and 223B, it is not necessary to provide a plurality of conductor layers each having a surface with a large area so that the surfaces face each other. As a result, according to the present embodiment, it is possible to prevent a large spurious from occurring at a frequency close to twice or three times the resonance frequency of the resonance circuit due to the conductor layer having a large area. it can.

  Other configurations, operations, and effects in the present embodiment are the same as those in the first embodiment.

  In addition, this invention is not limited to said each embodiment, A various change is possible. For example, the first to third electrodes of the dielectric resonator may be arranged on the same plane. Further, the electronic component of the present invention is not limited to the band-pass filter configured using the dielectric resonator of the present invention, and may be any one that includes the dielectric resonator of the present invention.

  DESCRIPTION OF SYMBOLS 1 ... Dielectric resonator, 2 ... High dielectric constant main body, 3 ... Surrounding dielectric part, 11 ... 1st electrode, 12 ... 2nd electrode, 13 ... 3rd electrode, 21 ... Input-output terminal, 22 ... Inductor, 23 capacitors.

Claims (6)

A high dielectric constant body comprising a first dielectric having a first dielectric constant and having an outer surface;
A first electrode having a first contact surface in contact with the outer surface of the high dielectric constant body;
A second electrode having a second contact surface in contact with the outer surface of the high dielectric constant body;
A third electrode having a third contact surface in contact with the outer surface of the high dielectric constant body;
An inductor configured using the first electrode, the second electrode, and the high dielectric constant body;
A dielectric resonator comprising a capacitor configured using the first electrode, the third electrode, and the high dielectric constant body,
The first to third contact surfaces are arranged at a distance from each other;
A distance between the first contact surface and the third contact surface is smaller than a distance between the first contact surface and the second contact surface;
A dielectric resonator comprising a resonance circuit composed of the inductor and the capacitor.   Further, it is characterized by comprising a surrounding dielectric portion that is formed of a second dielectric having a second relative dielectric constant smaller than the first relative dielectric constant and exists around the high dielectric constant body. The dielectric resonator according to claim 1. The outer surface of the high dielectric constant body has a first end surface and a second end surface located on opposite sides of each other, and a connection surface connecting the first end surface and the second end surface;
The first contact surface and the third contact surface are in contact with the first end surface;
The dielectric resonator according to claim 1, wherein the second contact surface is in contact with the second end surface. The second electrode and the third electrode are electrically connected to each other;
4. The dielectric resonator according to claim 1, wherein the resonance circuit is a parallel resonance circuit.   5. The dielectric resonator according to claim 1, wherein a resonance frequency of the resonance circuit is in a range of 0.6 GHz to 24 GHz.   An electronic component comprising one or more dielectric resonators according to claim 1.

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