JP2016004949A - Substrate housing container - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate housing container which inhibits swinging and instability of a posture of a blowout nozzle and enables a gas in a container body to be efficiently replaced with a gas for a substrate.SOLUTION: A substrate housing container includes: a container body 1 which stores a semiconductor wafer W; and a lid 20 which is detachably fitted in an opened front surface 2 of the container body 1. An air supply valve 30 which supplies a purge gas from an exterior part to an interior part and an exhaust valve 50 which exhausts air from the interior part to the exterior part are disposed at a bottom plate 6 of the container body 1. A hollow blowout nozzle 70 which communicates with the air supply valve 30 is erected on the bottom plate 6 of the container body 1. Blowout holes 76 for blowing out the purge gas in a semiconductor wafer W direction are opened in a peripheral wall of the blowout nozzle 70. An upper part of the blowout nozzle 70 is supported by one of an inner surface of a top plate 10 of the container body 1 and an inner surface of a rear surface wall 14 through an elastic holding member 80.

Description

  The present invention relates to a substrate storage container used when storing, storing, transporting, and transporting a substrate made of a semiconductor wafer or the like.

  Although not shown in the drawings, the conventional substrate storage container includes, for example, a container main body that aligns and stores a plurality of semiconductor wafers, and a lid that is detachably fitted to the open front of the container main body. An air supply valve for supplying a semiconductor wafer purge gas from the outside to the inside of the container main body is fitted on both sides of the rear portion of the bottom plate, and the container along with the supply of the semiconductor wafer purge gas on both sides of the bottom plate front portion of the container main body. Exhaust valves for exhausting air from the inside of the main body to the outside are fitted, and the air in the container main body is replaced with the purge gas for the semiconductor wafer by the plurality of air supply valves and exhaust valves (Patent Document) 1).

  As the purge gas, for example, an inert gas or dry air that suppresses alteration of the surface state of the semiconductor wafer is used. When it is desired to efficiently replace the air in the container main body with the purge gas, a blow nozzle is connected to each air supply valve, and a blow hole for blowing the purge gas is formed in the blow nozzle. Each blowing nozzle is formed in an elongated hollow cylindrical shape, is fixed to the rear part of the bottom plate of the container body, and communicates with the air supply valve. Perforated (see Patent Document 2).

Japanese Patent No. 4201583 Japanese Patent No. 3960787

  The conventional substrate storage container is configured as described above, and the use of the blowing nozzle communicating with the air supply valve can be expected to efficiently replace the air in the container body, but the upper part of the blowing nozzle is free. This may cause a problem in efficiently replacing the air in the container body.

  Explaining this point, when the upper part of the blowing nozzle is not particularly held and is free, if the purge gas is supplied from the outside to the inside of the substrate storage container at a high pressure or the substrate storage container is transported at a high speed, vibration will occur. Due to the action of acceleration, the upper part of the blowing nozzle swings back and forth and left and right, and the attitude of the blowing nozzle becomes unstable. If the blowing nozzle is shaken and the posture is not stable, the position of the blowing hole of the blowing nozzle is shifted laterally from the initial setting position, or the fixing to the bottom plate of the container body is loosened. Therefore, there is a possibility that it may be difficult to replace efficiently.

  The present invention has been made in view of the above, and provides a substrate storage container capable of suppressing the shaking of the blowing nozzle and the instability of the posture and efficiently replacing the gas in the container body with the gas for the substrate. It is an object.

In order to solve the above-described problems, the present invention includes a container main body that accommodates a substrate and a lid that is detachably fitted to the open front surface of the container main body. An air supply valve for supplying the gas for use and an exhaust valve for exhausting the gas from the inside to the outside,
At the bottom of the container body, a hollow blowing nozzle that communicates with the air supply valve is provided upright, and a blowing hole that blows out the gas for the substrate in the direction of the substrate is provided on the peripheral wall of the blowing nozzle. It is characterized in that it is supported on at least one of the upper part of the container main body and the inner surface of the peripheral wall via a holding member.

  The holding member is formed in a plate shape and interposed between the upper inner surface of the container body and the upper part of the blowing nozzle, and a contact portion that contacts the upper inner surface of the container body is formed on the upper surface of the holding member. On the lower surface, a fitting holding portion that fits on the upper portion of the blowing nozzle can be formed.

Moreover, a holding member can be protruded from the inner surface of the back wall of the container body in the front direction, and a fitting holding portion that fits on the upper part of the blowing nozzle can be formed on the holding member. At this time, the container body is multi-color molded, and an observation window for the substrate is integrally formed on the back wall of the container body. A holding member protrudes from the inner surface of the observation window in the front direction of the container body, and a blowing nozzle is provided at the free end thereof. It is possible to integrally form a fitting holding part that fits on the upper part of the first member.
Further, the rotation of the blowing nozzle can also be restricted by forming the upper part of the blowing nozzle and the fitting holding part of the holding member into polygons corresponding to each other.

  Here, the substrate in the claims includes a necessary number of at least φ300 or 450 mm semiconductor wafer, glass wafer, mask glass, and the like. The container body may be transparent, opaque, or translucent. Further, the number of supply valves, exhaust valves, blowout nozzles and their blowout holes, and holding members can be increased or decreased as necessary. The gas for the substrate includes at least various purge gases (for example, inert gas such as argon gas and dry air).

  The air supply valve is housed in an upper housing that is fitted into the mounting hole in the rear part of the bottom plate, a lower housing that is fitted into the opening surface of the upper housing from below, and is movable between the upper housing and the lower housing so as to be vertically movable. From the viewpoint of not modifying the container body, the lower portion of the blowing nozzle can be sandwiched between the upper housing and the lower housing.

  The upper part of the blowing nozzle can be supported by a holding member on the upper part of the container body and the inner surface of the peripheral wall (back wall or side wall), the upper part of the container body, or the inner surface of the peripheral wall of the container body. Furthermore, the holding member can be formed of various synthetic resins (for example, PC, PEEK, etc.) or a deformable elastic member, and the contact portion can be protruded or recessed depending on the shape of the upper inner surface of the container body. It is possible to do it.

  According to the present invention, the upper part of the blowing nozzle is held on at least one of the upper part of the container main body and the inner surface of the peripheral wall, and the movement of the blowing nozzle is restricted. For example, the substrate gas is supplied to the substrate storage container at a high pressure. Even if acceleration, thermal history, etc. act on the substrate storage container, the upper part of the blowing nozzle can be prevented from shaking or vibrating, and the blowing nozzle can be prevented from rotating. .

  According to the present invention, the holding member can suppress shaking of the blowing nozzle and instability of the posture, so that the gas in the container body can be efficiently replaced with the gas for the substrate. .

According to the third aspect of the present invention, since the rear wall of the container body and the holding member are integrally formed, the manufacturing of the holding member can be simplified and the configuration of the holding member can be diversified.
According to invention of Claim 4, holding | maintenance of a blowing nozzle can be made easy with a simple structure, and rotation of a blowing nozzle can be prevented effectively.

1 is an overall perspective view schematically showing an embodiment of a substrate storage container according to the present invention. It is the II-II sectional view taken on the line of FIG. It is the III-III sectional view taken on the line of FIG. It is a section explanatory view showing typically an air supply valve and a blowing nozzle in an embodiment of a substrate storage container concerning the present invention. It is a section explanatory view showing typically an exhaust valve in an embodiment of a substrate storage container concerning the present invention. It is explanatory drawing which shows typically the blowing nozzle in embodiment of the substrate storage container which concerns on this invention. It is an exploded perspective view showing typically a pair of right and left blowing nozzles and a holding member in an embodiment of a substrate storage container concerning the present invention. It is a section explanatory view showing typically a container main part, a blowing nozzle, and a holding member in an embodiment of a substrate storage container concerning the present invention. It is explanatory drawing which shows typically 2nd Embodiment of the substrate storage container which concerns on this invention. It is plane explanatory drawing which shows typically the observation window and holding member of the back wall of the container main body in 3rd Embodiment of the substrate storage container which concerns on this invention. It is a fragmentary sectional view showing typically a 3rd embodiment of a substrate storage container concerning the present invention.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. A substrate storage container in this embodiment includes a container main body 1 for storing a plurality of semiconductor wafers W, as shown in FIGS. The container body 1 includes a lid body 20 that is detachably fitted to the open front surface 2 of the container body 1 and a locking mechanism 26 that locks the lid body 20 fitted to the front surface 2 of the container body 1. A plurality of air supply valves 30 and exhaust valves 50 are respectively disposed on the bottom plate 6, and vertically long discharge nozzles 70 communicating with the plurality of air supply valves 30 are erected, respectively. The upper part is supported by the top plate 10 of the container body 1 via a holding member 80.

  Each semiconductor wafer W is made of, for example, a φ300 mm round silicon wafer having a thickness of 775 μm, and various processes and treatments are appropriately performed in the manufacturing process of semiconductor components (up to 500 to 600 processes). 25 sheets are horizontally inserted and stored.

  The container body 1, the lid 20, the locking mechanism 26, and the blowing nozzle 70 are injection-molded with a molding material containing a required resin, or are configured by a combination of a plurality of injection-molded parts. Examples of the resin contained in the molding material include thermoplastic resins such as polycarbonate, cycloolefin polymer, polyetherimide, polyether ketone, polyether ether ketone, polybutylene terephthalate, polyacetal, and liquid crystal polymer, and alloys thereof. .

  These resins are added with various antistatic agents such as conductive materials made of carbon fibers, carbon powder, carbon nanotubes, conductive polymers, and the like, and anions, cations, and nonionics as required. Further, benzotriazole-based, salicylate-based, cyanoacrylate-based, oxalic acid anilide-based, hindered amine-based ultraviolet absorbers are added, and glass fibers, carbon fibers, and the like that improve rigidity are also selectively added.

  As shown in FIGS. 1 to 3, the container body 1 is formed in a front open box type having an open front surface 2, and is held by a ceiling transport mechanism in a semiconductor manufacturing factory with the open front surface 2 facing horizontally. Then, it is transported between processes or positioned on a lid opening / closing device attached to the semiconductor processing apparatus.

  The container body 1 is provided with a pair of left and right support pieces 4 for horizontally supporting the semiconductor wafer W on the inner sides thereof, in other words, on the inner surfaces of the side walls 3. Position restricting portions 5 for restricting excessive insertion of W are integrally formed. The pair of left and right support pieces 4 are arranged at a predetermined pitch in the vertical direction, and each support piece 4 is formed in an elongated plate shape that supports the side edge of the semiconductor wafer W, and is formed on the front surface of the support piece 4. A step portion for restricting the jumping-out of the semiconductor wafer W is integrally formed.

  Cylindrical mounting holes 7 are drilled through both sides of the front and rear portions of the bottom plate 6 of the container body 1, and semiconductors indicated by arrows from the outside to the inside of the container body 1 in the mounting holes 7 on both sides of the rear portion of the bottom plate 6. A supply valve 30 for supplying a purge gas (for example, inert gas or dry air) for the wafer W is fitted, and the mounting holes 7 on both sides of the front portion of the bottom plate 6 are used to supply the purge gas for the semiconductor wafer W. Accordingly, exhaust valves 50 for exhausting air indicated by arrows from the inside of the container body 1 to the outside are fitted. Cylindrical ribs 7a projecting downward are integrally formed on the peripheral edge portions of the mounting holes 7 on both sides of the rear portion of the bottom plate 6 among the plurality of mounting holes 7 (see FIG. 4).

  Positioning tools 8 for positioning the container main body 1 are disposed on both sides of the front portion and the rear center of the back surface of the bottom plate 6 of the container main body 1. Each positioning tool 8 is basically formed in a substantially V-shaped cross section having a substantially elliptical shape in a plane, and a concave portion having a pair of inclined surfaces thereof is directed downward, and the concave portion is formed on the positioning pin of the lid opening / closing device from above. The container body 1 functions to be positioned with high accuracy by fitting and sliding. In addition, a separate bottom plate 9 is screwed horizontally on the rear surface of the bottom plate 6 of the container body 1 via a screw tool, and the bottom plate 9 exposes the plurality of positioning tools 8.

  At the center of the top plate 10 of the container body 1, a transfer top flange 11 gripped by a ceiling transport mechanism of a semiconductor manufacturing factory is detachably mounted. The locking holes for the locking mechanism 26 are respectively drilled. In addition, grips 12 that function for gripping operation are detachably attached to the central portions of both side walls 3 of the container body 1, and conveyance side rails 13 are selectively attached to the lower portions of the side walls 3. Mounted horizontally.

  As shown in FIGS. 1 to 3, the lid 20 includes a lid body 21 that is press-fitted into the open front surface 2 of the container main body 1 and a surface plate that covers the open front surface of the lid main body 21. 24, and a sealing gasket 23 for sealing and sealing interposed between the inner periphery of the front surface 2 of the container body 1 and the lid body 21. The peripheral wall comes into contact. The lid main body 21 is basically formed in a substantially dish-shaped cross section with a shallow bottom, and a plurality of reinforcing and mounting ribs are disposed therein, and on the back surface, which is a facing surface facing the semiconductor wafer W, A front retainer 22 that elastically holds the front peripheral edge of the semiconductor wafer W is mounted.

  A frame-shaped fitting groove is formed in the periphery of the back surface of the lid body 21, and a seal gasket 23 that press-contacts the inner periphery of the front surface 2 of the container body 1 is tightly fitted in the fitting groove. The upper and lower side portions of the peripheral wall 21 are perforated by penetrating holes for the locking mechanism 26 facing the locking holes of the container body 1.

  The surface plate 24 is formed in a horizontally long front rectangle, and a plurality of reinforcing and mounting ribs, screw holes, and the like are provided. On both sides of the surface plate 24, operation holes 25 for the locking mechanism 26 are respectively drilled. The seal gasket 23 is formed into a frame shape that can be elastically deformed using, for example, a polyester, polystyrene, or polyolefin-based thermoplastic elastomer having excellent heat resistance, weather resistance, or the like as a molding material.

  The locking mechanism 26 is a pair of left and right rotating plates that are pivotally supported on the left and right sides of the lid body 21 of the lid body 20 and rotated from the outside, and slides in the vertical direction of the lid body 20 as each rotary plate rotates. A plurality of advancing / retracting plates, and a plurality of locking claws that come in and out of the intrusion holes of the lid main body 21 and slide into and out of the locking holes of the container main body 1 as each of the advancing / retreating plates slides. 21 and the surface plate 24.

  Each rotating plate faces the operation hole 25 of the surface plate 24 of the lid 20 and is rotated by an operation key of the lid opening / closing device passing through the operation hole 25. Each locking claw is basically formed in a bent shape with a substantially L-shaped cross section and includes a rotatable roller at the tip thereof, and is pivotally supported in the vicinity of the intrusion hole in the lid body 21 so as to advance and retreat. The roller plate is connected to the tip of the moving plate via a pin, and the roller is brought into and out of the locking hole of the container body 1.

  The plurality of air supply valves 30 and exhaust valves 50 are detachably connected to the lid opening / closing device when the substrate storage container is mounted on the lid opening / closing device, and circulate purge gas and air inside and outside the substrate storage container, It functions to suppress deterioration of the surface state of the semiconductor wafer W and to eliminate the pressure difference between the inside and outside of the substrate storage container.

  As shown in FIG. 4, each air supply valve 30 includes a mounting hole 7 on both sides of the rear portion of the bottom plate 6, an upper housing 31 that is loosely fitted in the mounting holes 7 on both sides of the rear portion, and a free play in the upper housing 31 from below. And a lower housing 37 that is screwed and fixed until it comes into contact with the rib 7a extending downward from the peripheral edge of the mounting hole 7 on both sides of the rear portion, and between these upper housing 31 and the lower housing 37, a purge gas is provided. The valve body 40 for controlling the flow of the gas is incorporated so as to be movable up and down.

  The upper housing 31 is formed, for example, in a substantially inverted U-shaped cross section with an opening for allowing the purge gas to flow into the container main body 1, and a filter retainer 34 is fitted to the opened inner periphery. From the center of the upper inner surface of the filter retainer 34, a centering 32 for guiding the valve element 40 is formed to project downward.

  A lattice rib that partitions the opening is formed in the upper part of the filter retainer 34, and a thin filter 33 for filtration is covered on the lattice rib and is held between the stepped portion on the inner periphery of the opening of the upper housing 31. Is done. Further, an O-ring 35 that is in close contact with the inner peripheral surface of the blowing nozzle 70 is fitted to the upper step of the outer peripheral surface of the upper housing 31, and a locking portion for fixing the blowing nozzle 70 radially outward from the lower portion of the outer peripheral surface. 36 is formed to project in a tapered manner.

  The lower housing 37 is formed, for example, in a substantially U-shaped cross section with an opening 38 through which purge gas flows from the outside to the inside of the container body 1 and is loosely fitted to the upper housing 31 from the outside via a gap. On the inner peripheral surface of the peripheral wall of the lower housing 37, a screw groove 39 for mounting the blowing nozzle 70 is formed by screwing.

  The valve body 40 is formed, for example, in a substantially convex shape in cross section, and a guide hole 41 that is slidably fitted into the centering 32 of the upper housing 31 is drilled in the central convex portion. The upper surface of the valve body 40 is formed with a fitting hole that surrounds the convex portion, and a coil-shaped spring that closes the opening 38 of the lower housing 37 by urging the valve body 40 downwardly in the fitting hole. The member 42 is fitted. An endless notch is formed in the lower surface of the valve body 40, and an O-ring 35A that surrounds the opening 38 at the center of the lower housing 37 and restricts the flow of purge gas is fitted into the notch.

  When such a valve body 40 comes into contact with the lower housing 37, the valve body 40 functions to block the opening 38 at the center of the lower housing 37 and to restrict the purge gas from flowing into the container body 1 from the outside. On the other hand, when the gas is raised and separated from the lower housing 37 with the supply of the purge gas, the opening 38 of the lower housing 37 is opened, and the purge gas functions to flow from the outside to the inside of the container body 1.

  As shown in FIG. 5, each exhaust valve 50 is fitted from below into an upper housing 51 fitted into the mounting hole 7 in the front portion of the bottom plate 6 via an O-ring, and an open lower surface of the upper housing 51. A lower housing 58 is provided, and a valve body 61 for controlling the flow of air is housed between the upper housing 51 and the lower housing 58 so as to be movable up and down.

  The upper housing 51 is formed, for example, in a substantially inverted U-shaped cross section with an opening through which the air of the container body 1 flows, and a lattice rib that partitions the opening is formed above the inside. A thin filter 52 is covered with a filter holder 53 having a substantially dish-shaped cross section. The upper housing 51 has an engaging portion 54 that projects from the upper peripheral surface of the mounting hole 7 so as to be tapered, and a screw 55 for mounting the lower housing 58 is screwed to the lower portion of the outer peripheral surface. Engraved. Further, the filter retainer 53 has an O-ring 56 for the filter 52 fitted into an upper step on the outer peripheral surface thereof, and a centering 57 for guiding the valve element 61 is formed to project downward from the center of the lower surface.

  The lower housing 58 is formed in a substantially U-shaped cross section with an opening 59 that allows air to flow out from the inside of the container body 1 to the outside, and is screwed into the upper housing 51 from the outside. On the inner peripheral surface of the peripheral wall of the lower housing 58, a screw groove 60 that is screwed into the screw 55 of the upper housing 51 is formed by screwing.

  The valve body 61 is formed, for example, in a substantially reverse convex shape in cross section, and a guide hole 62 that is slidably fitted into the centering 57 of the filter retainer 53 is formed in the center of the upper surface. An endless notch is formed on the peripheral edge of the upper surface of the valve body 61, and an O-ring 56 </ b> A that presses the filter retainer 53 from below to prevent air leakage is fitted into the notch. A coil-shaped spring member 63 that presses and presses the valve body 61 upward and presses against the filter retainer is fitted to the convex portion on the lower surface of the valve body 61, and the spring member 63 is the periphery of the opening 59 on the inner surface of the lower housing. Supported near the section.

  Such a valve body 61 functions to restrict the outflow of air from the inside of the container body 1 to the outside when contacting the filter retainer 53 of the upper housing 51. When the container main body 1 is filled with the purge gas and the air is pushed down, the air flows out from the inside of the container main body 1 to the outside when the container main body 1 is lowered and separated from the filter holder 53.

  As shown in FIGS. 3, 4, 6, and 7, each blowing nozzle 70 is formed in, for example, a hollow cylindrical shape elongated in the vertical direction, and is provided between the upper housing 31 and the lower housing 37 of the air supply valve 30. And is detachably connected to the upper housing 31. The blowout nozzle 70 has a flange 71 projecting radially outward from a lower portion of the peripheral wall of the mounting hole 7, and a cylindrical tube 72 is integrally formed on the flange 71. 31 and the lower housing 37 are fitted and fixed. On the inner peripheral surface of the cylindrical portion 72, a recess 73 that is locked to the locking portion 36 of the upper housing 31 of the air supply valve 30 is cut out.

  An upper portion of the outer peripheral surface of the cylindrical portion 72 is fitted with an O-ring 74 for airtightness that is pressed into the mounting hole 7, and a lower portion of the outer peripheral surface of the cylindrical portion 72 is threaded in the lower housing 37 of the air supply valve 30. A screw 75 screwed to 39 is formed by screwing. Further, in the vertical direction of the peripheral wall of the blowing nozzle 70, a plurality of blowing holes 76 for blowing the purge gas from the air supply valve 30 are drilled side by side in the front semiconductor wafer W direction, in other words, in the two front directions of the container body 1. Each blowout hole 76 blows out a purge gas between the semiconductor wafers W.

  As shown in FIGS. 3, 7, and 8, the holding member 80 is formed into a flat plate shape with a predetermined material, and is interposed between the inner surface of the top plate 10 of the container body 1 and the upper end portion of the blowing nozzle 70. Is done. The predetermined material of the holding member 80 is not particularly limited, and examples thereof include deformable polyester-based, polystyrene-based, and polyolefin-based thermoplastic elastomers.

  The holding member 80 is formed in a generally arcuate shape so as to match the shape of the rear portion of the top plate 10 of the container main body 1, and both end portions thereof are bent and formed in a substantially plane V shape in the front-rear direction of the container main body 1. A flat circular button-shaped contact portion 81 that is in close contact with the inner surface of the top plate 10 of the container body 1 without a gap is formed on the holding member 80 in the vicinity of the bent portion and on the upper surfaces of both ends. On the lower surface of 80, a flat circular circular cross-section fitting holding portion 82 that is press-fitted to the upper end portions of the plurality of blowing nozzles 70 from above is integrally formed.

  In the above configuration, in order to replace the air in the substrate storage container with the purge gas, when the purge gas is supplied to the container body 1 at a high pressure, the purge gas pushes up the valve body 40 of the supply valve 30 and blows out from the supply valve 30. It flows into the nozzle 70 and is sprayed between the semiconductor wafers W from the plurality of blowing holes 76 of the blowing nozzle 70. At this time, since the upper end portion of the blowing nozzle 70 is held and fixed by the holding member 80, even if the purge gas is supplied at a high pressure, the upper portion of the blowing nozzle 70 is shaken back and forth and left and right, and the posture of the blowing nozzle 70 is changed. It is possible to effectively prevent instability.

  When the purge gas is supplied to the container main body 1 at a high pressure and filled, the air in the container main body 1 is pushed by the purge gas and pushes down the valve body 61 of the exhaust valve 50 and flows out of the container main body 1 from the exhaust valve 50. This outflow of air replaces the air in the substrate storage container with the purge gas.

  According to the above configuration, the holding function of the holding member 80 causes the position of the blowout hole 76 of the blowout nozzle 70 to rotate in the circumferential direction so that the blowout nozzle 70 is deviated laterally or rearward from the initial set position. There is nothing. Accordingly, since the purge gas can be always properly injected in the direction of the semiconductor wafer W, the air in the container body 1 can be efficiently replaced with the purge gas.

  Moreover, since the container main body 1 and the holding member 80 are not integrated but separate, it is not necessary to change the configuration of the container main body 1 at all, and the container main body 1 can be manufactured by an existing manufacturing method. In addition, a plurality of contact portions 81 are formed on the upper surface of the holding member 80 so as to project at intervals, and the height of the plurality of contact portions 81 is made uniform, so that the posture of the holding member 80 can be stabilized without being inclined. become. Furthermore, if the holding member 80 is elastically compressible and deformable, the top plate 10 of the container body 1 and the upper end portions of the plurality of blowing nozzles 70 can be brought into close contact with each other without any gaps. Can be effectively prevented.

  Next, FIG. 9 shows a second embodiment of the present invention. In this case, the upper end portion of the blowing nozzle 70 and the fitting holding portion 82 of the holding member 80 are formed in a planar rectangular shape corresponding to each other. Each is formed to restrict the rotation of the blowing nozzle 70. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  Also in this embodiment, the same effect as the above embodiment can be expected, and the upper end portion of the blowing nozzle 70 and the fitting holding portion 82 of the holding member 80 are polygonal shapes each having directivity. It is obvious that the holding can be facilitated and the rotation of the blowing nozzle 70 can be effectively prevented.

  Next, FIGS. 10 and 11 show a third embodiment of the present invention. In this case, the container main body 1 is molded in two colors and is visible on the back wall 14 of the semiconductor wafer W. The observation window 15 is integrally formed in a vertically long shape, and a plurality of holding members 80 project horizontally from the upper part of the inner surface of the observation window 15 in the two directions on the front surface of the container body 1, and each holding member 80 is elongated and formed. The free end portion is integrally formed with a fitting holding portion 82 having a dish-shaped cross section that is fitted to the upper end portion of the blowing nozzle 70. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  Also in this embodiment, the same effect as the above embodiment can be expected, and the observation window 15 of the container body 1 and the plurality of holding members 80 are integrally formed, so that the manufacturing of the holding member 80 can be simplified. Obviously you can. Further, since all the blowing nozzles 70 are not held together by the holding member 80 but are held by the holding members 80 one by one, diversification of the configuration of the holding member 80 can be expected. Furthermore, since the contact portion 81 can be omitted, the configuration of the holding member 80 can be simplified.

  In addition, in the said embodiment, although the blowing nozzle 70 was formed in the hollow cylinder shape, you may form in a hollow truncated cone shape. Moreover, although the upper end part of the blowing nozzle 70 and the fitting holding | maintenance part 82 of the holding member 80 were each formed in the plane square shape, you may form in a plane triangle, a hexagon, an octagon, etc., respectively. Further, it may be a shape with a rotation stop with a part of a circle cut off, and the outer peripheral surface of the upper end portion of the blowing nozzle 70 and the inner peripheral surface of the fitting holding portion 82 are respectively formed by screwing, These may be screwed together to regulate the rotation of the blowing nozzle 70.

  Further, although the contact portion 81 of the holding member 80 is formed so as to protrude, the contact portion 81 of the holding member 80 can be formed in a recessed manner as long as it is in close contact with the inner surface of the top plate 10 of the container body 1. Further, a plurality of holding members 80 are projected horizontally from the upper part of the inner surface of the side wall 3 of the container body 1 inwardly of the container body 1, and are fitted to the upper ends of the blowing nozzles 70 at the free ends of the holding members 80. It is also possible to integrally form the fitting holding portion 82 having a dish-shaped cross section.

  The substrate storage container according to the present invention is used in the field of manufacturing semiconductors and the like.

1 Container body 2 Front 3 Side wall (peripheral wall)
6 Bottom plate 7 Mounting hole 7a Rib 10 Top plate 14 Back wall (peripheral wall)
15 Observation window 20 Lid 30 Supply valve 31 Upper housing 37 Lower housing 40 Valve body 50 Exhaust valve 51 Upper housing 58 Lower housing 61 Valve body 70 Blow nozzle 76 Blow hole 80 Holding member 81 Contact portion 82 Fitting holding portion W Semiconductor Wafer (substrate)

Claims (4)

A container body that stores the substrate, and a lid body that is detachably fitted to the front surface of the container body, and an air supply valve that supplies gas for the substrate from the outside to the bottom of the container body; A substrate storage container equipped with an exhaust valve for exhausting gas from the inside to the outside,
A hollow blowing nozzle that communicates with the air supply valve is provided upright at the bottom of the container body, and a blowing hole that blows out gas for the substrate in the direction of the substrate is provided on the peripheral wall of the blowing nozzle. And a substrate storage container characterized by being supported on at least one of the inner surface of the peripheral wall via a holding member.   A holding member is formed in a plate shape and interposed between the upper inner surface of the container body and the upper part of the blowing nozzle, and a contact portion that contacts the upper inner surface of the container body is formed on the upper surface of the holding member. The board | substrate storage container of Claim 1 which formed the fitting holding | maintenance part fitted to the upper part of a blowing nozzle.   The substrate storage container according to claim 1, wherein a holding member is protruded in a front direction from an inner surface of the back wall of the container body, and a fitting holding portion that fits on an upper portion of the blowing nozzle is formed on the holding member.   4. The substrate storage container according to claim 2 or 3, wherein rotation of the blowing nozzle is restricted by forming the upper part of the blowing nozzle and the fitting holding portion of the holding member in a mutually corresponding polygon.

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