JP2016003041A - Packaging structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inhibit rattling of a packed object.SOLUTION: A packaging structure includes: a lower buffer 10 in which a recessed part 11 for holding a chassis part 101 of an electronic device 100 is formed; an upper buffer 20 which covers a design part 102 of the electronic device 100 disposed at an opening part of the recessed part 11 in a non-contact manner; and a middle lid 30 in which through holes 31 allowing the chassis part 101 to penetrate therethrough and holding the chassis part 101 are formed, the middle lid 30 which is sandwiched between the lower buffer 10 and the upper buffer 20 to be supported thereby. The middle lid 30 holds a portion of the chassis part 101 which is located close to the design part 102 to inhibit rattling of the electronic device 100.

Description

  The present invention relates to a packing structure that is interposed between a packing box and an object to be packed and holds the object to be packed.

  An article to be packed such as an electronic device is accommodated in a packing box in a state in which the position is regulated by a shock absorber formed of a foam material (see, for example, Patent Document 1).

  FIG. 10 is a perspective view showing an example of a conventional packing structure. The electronic device 100 that is an object to be packaged includes a chassis portion 101 with high scratch resistance and a design portion 102 that needs to be protected so as not to be damaged. The chassis part 101 is accommodated in the recessed part 111 of the lower side buffer 110 formed with the foam material. The design part 102 is covered in a non-contact state by an upper shock absorber 120 formed of a foam material. The lower shock absorber 110 and the upper shock absorber 120 in which the electronic device 100 is housed are housed in a packaging box 130 made of cardboard or the like.

Japanese Utility Model Publication No. 64-42281

  FIG. 11 shows a plan view of the lower shock absorber 110, and FIG. 12A shows a cross-sectional view taken along the line EE. In order to simplify the mold structure, the lower cushioning body 110 has a shape that can be removed vertically without a complicated slide core shape. Therefore, a draft angle of the mold is necessary, the size of the bottom side of the recess 111 is small, and the size of the opening side of the recess 111 is large. When the press-fitting rib 112 is provided on the inner wall surface of the recess 111 so as to press the chassis 101 of the electronic device 100, the bottom side of the recess 111 is opened due to the draft angle of the mold. However, the amount of overlap between the press-fitting rib 112 and the chassis portion 101 increases, and the press-fitting degree increases. In FIG. 12, the slope of the press-fitting rib 112 is expressed more greatly than the actual scale so that it can be easily understood. In FIG. 12, the press-fitting ribs 112 and the chassis portion 101 are overlapped. However, when the chassis portion 101 is press-fitted, the press-fitting ribs 112 are expanded and deformed.

  The electronic device 100 is less likely to swing in the direction of the arrow C even if it vibrates during transportation when the portion closer to the design portion 102 is held than the portion far from the design portion 102 of the chassis portion 101 is held. Therefore, it is desirable that the degree of press-fitting at the opening of the recess 111 as close as possible to the design portion 102 is increased.

  However, in the structure of FIGS. 10 to 12, the degree of press-fitting at the bottom of the recess 111 far from the design part 102 is greater than the degree of press-fitting at the opening of the recess 111 close to the design part 102. For this reason, if an attempt is made to increase the press-fitting degree on the opening side of the recess 111, the press-fitting degree on the bottom side of the recess 111 becomes too large. If the degree of press-fitting increases, the bottom side becomes too tight when the chassis portion 101 is inserted into the recess 111, and does not enter. When it is forcibly inserted, the lower cushioning body 110 is scraped, and foam scraps are generated. Further, when the electronic device 100 is taken out, it is difficult to remove from the recess 111. Depending on how to cut, the force for holding the electronic device 100 may decrease.

  On the other hand, when the degree of press-fitting is reduced, the design part 102 of the electronic device 100 is likely to be shaken by transportation vibration, and is easily damaged. Further, as illustrated in FIG. 12B, when the concave portion 111 is deepened to increase the amount of holding of the electronic device 100, the clearance between the design portion 102 and the lower shock absorber 110 is reduced. Then, when an impact load is applied, the lower shock absorber 110 is deformed, the electronic device 100 sinks, and the design portion 102 and the lower shock absorber 110 may come into contact with each other and the electronic device 100 may be damaged.

  This invention was made in order to solve the above problems, and it aims at suppressing the shakiness of a to-be-packaged item.

  The packaging structure according to the present invention is to hold a packaged object by interposing between a packaged object having a design part on one end side of the chassis part and a packaging box, and forming a recess for holding the chassis part. A lower buffer body, an upper buffer body that covers the design portion disposed in the opening of the concave portion in a non-contact state, and a through hole that penetrates and holds the chassis portion is formed. And an inner lid that is sandwiched between and supported by the upper buffer body.

  According to the present invention, the inner lid supported by being sandwiched between the lower buffer body and the upper buffer body is added, and the chassis portion of the object to be packed is passed through and held in the through hole of the inner lid. As a result, in addition to holding the chassis part by the concave part of the lower shock absorber, the through hole of the inner lid can hold the part close to the design part of the chassis part, thereby suppressing rattling of the packaged item. Can do.

It is a perspective view which shows the structural example of the packing structure which concerns on Embodiment 1 of this invention. It is a perspective view which shows the state which the packaging structure which concerns on Embodiment 1 assembled. FIG. 3 is a plan view of a lower buffer body of the packaging structure according to Embodiment 1. 3 is a plan view of the inner lid of the packing structure according to Embodiment 1. FIG. It is a perspective view which shows the state which assembled the lower buffer body and inner cover of the packaging structure which concerns on Embodiment 1. FIG. FIG. 3 is a plan view of an upper buffer body of the packaging structure according to Embodiment 1. It is a perspective view which shows the modification of the upper buffer body of the packing structure which concerns on Embodiment 1. FIG. It is a figure explaining the packing structure concerning Embodiment 1, Fig.8 (a) is sectional drawing which cut | disconnected the lower buffer body and the inner cover along the AA line of FIG. 5, FIG.8 (b) is BB line | wire. It is sectional drawing cut | disconnected along. 6 is a plan view showing a modification of the inner lid of the packing structure according to Embodiment 1. FIG. It is a perspective view which shows an example of the conventional packing structure. It is a top view of the lower buffer body of FIG. FIG. 12 is a cross-sectional view of the lower buffer body cut along the EE line of FIG. 11, FIG. 12A is an example in which the clearance between the design portion of the electronic device and the lower buffer body is large, and FIG. Is a small example.

Embodiment 1 FIG.
As shown in FIG. 1, the packaging structure according to the first embodiment is arranged between an electronic device 100 (packaged object) having a design portion 102 on one end side of a chassis portion 101 and a packaging box 130, and the electronic device. 100, and includes a lower buffer body 10, an upper buffer body 20, and an inner lid 30. Each of the lower buffer body 10, the upper buffer body 20, and the inner lid 30 is a mold product of a foam material such as polyethylene (PE) or polypropylene (PP). FIG. 2 shows a state where the lower shock absorber 10, the upper shock absorber 20 and the inner lid 30 are assembled.
In the first embodiment, an example in which two electronic devices 100 are packed in one packing structure will be described. However, the lower buffer body 10, the upper buffer body 20, and the inner lid according to the number of electronic devices 100 to be packed. The shape of 30 can be changed.

  The electronic device 100 is housed in the packing box 130 and transported while being housed inside the lower buffer body 10, the upper buffer body 20, and the inner lid 30. The electronic device 100 is, for example, a car navigation device, a car audio device, or the like, and the chassis portion 101 is made of a sheet metal member or the like and has high scratch resistance. On the other hand, the design part 102 is composed of, for example, a display whose peripheral part is painted with piano black and needs to be protected so as not to be scratched.

In FIG. 3, the top view which looked at the lower buffer body 10 from the top is shown. The lower shock absorber 10 is formed with a recess 11 that accommodates and holds the chassis 101 of the electronic device 100. On the inner wall surface of the recess 11, a press-fitting rib 12 that presses the chassis 101 is protruded. Each of the press-fitting ribs 12 extends in the vertical direction on the inner wall surface. Above the surface of the lower shock absorber 10 where the recess 11 is opened, there is an inner lid support portion 13 that supports the inner lid 30 by contacting it. A positioning portion 14 for positioning the inner lid 30 is formed on the inner lid support portion 13.
In the illustrated example, four press-fitting ribs 12 project from one concave portion 11, but the number and arrangement of the press-fitting ribs 12 may be arbitrary. Moreover, although the positioning part 14 is formed in each of the four corners of the inner lid support part 13, the shape, number, and arrangement of the positioning part 14 may be arbitrary.

FIG. 4 shows a plan view of the inner lid 30 as viewed from above, and FIG. 5 shows a perspective view of the state where the lower shock absorber 10 and the inner lid 30 are assembled. The inner lid 30 is supported by being sandwiched between the lower buffer body 10 and the upper buffer body 20. The inner lid 30 is formed with a through hole 31 for penetrating and holding the chassis portion 101 of the electronic device 100. On the inner wall surface of the through hole 31, a press-fitting rib 32 that presses the chassis portion 101 is projected. Each of the press-fitting ribs 32 extends in the vertical direction on the inner wall surface. Positioning portions 33 are formed at the four corners of the inner lid 30, and the inner lid 30 is positioned with respect to the lower shock absorber 10 by engaging the positioning portions 33 with the positioning portion 14 of the lower shock absorber 10. .
In the illustrated example, four press-fitting ribs 32 project from one through hole 31, but the number and arrangement of the press-fitting ribs 32 may be arbitrary. Further, when viewed from above, the press-fitting rib 12 of the lower shock absorber 10 and the press-fitting rib 32 of the inner lid 30 may overlap each other or may be displaced. The positioning part 33 may be configured to engage with the positioning part 14 of the lower shock absorber 10 and can be positioned, and is not limited to the illustrated example.

In FIG. 6, the top view which looked at the upper buffer body 20 from the bottom is shown. The upper shock absorber 20 is formed with a recess 21 larger than the design portion 102 on the surface facing the electronic device 100 and covers the outer surface of the design portion 102 without being in contact therewith.
Note that the upper shock absorber 20 may have any shape that can be supported with the inner lid 30 sandwiched between the upper shock absorber 20 and the lower shock absorber 10. Here, FIG. 7 shows a modification of the upper buffer body 20. In the modification of FIG. 7, the design portion 102 of the electronic device 100 is covered in a non-contact state using the upper cushioning body 20-1 in which cardboard or the like is cylindrical. When the packing structure is accommodated in the packing box 130 and the lid is closed, the upper shock absorber 20-1 is in a state of pressing the inner lid 30 against the lower shock absorber 10, and the inner lid 30 is in contact with the lower shock absorber 10 and the upper shock absorber. It is sandwiched between and supported by the body 20-1.

  8A is a cross-sectional view of the lower shock absorber 10 and the inner lid 30 cut along the line AA in FIG. 5, and FIG. 8B is a cross-sectional view cut along the line BB. In the electronic device 100, the chassis portion 101 is held by the concave portion 11 of the lower shock absorber 10 and the through hole 31 of the inner lid 30. Since the inner lid 30 holds a portion (neck below) of the chassis portion 101 close to the design portion 102, the design of the lower shock absorber 10 is higher than that of a case where only the portion far from the design portion 102 of the chassis portion 101 is held. The portion 102 is less likely to swing in the direction of arrow C. Therefore, rattling of the electronic device 100 due to vibration during transportation can be suppressed, and damage to the design portion 102 due to contact with the adjacent electronic device 100 and contact with the upper buffer body 20 can be prevented. .

Further, since the inner lid support portion 13 of the lower buffer body 10 supports the inner lid 30, the inner lid 30 is in a state of floating from the lower buffer body 10 and has an elastic force. Therefore, when the electronic device 100 receives an impact load and the lower shock absorber 10 is deformed and the electronic device 100 sinks in the direction of arrow D, the inner lid 30 is elastically deformed to relieve the impact, and the design portion Damage to 102 can be prevented.
It is desirable that the inner lid support portion 13 is disposed outside the design portion 102 so that the inner lid 30 around the design portion 102 is easily elastically deformed.

  Next, the details of the press-fitting rib 12 of the lower shock absorber 10 and the press-fitting rib 32 of the inner lid 30 will be described. The lower shock absorber 10 and the inner lid 30 have a shape that can be removed vertically without a complicated slide core shape in order to simplify the mold structure. For this reason, the concave portion 11 of the lower buffer body 10 needs a draft of the mold, and as shown in FIG. 8B, the gradient is such that the size of the opening decreases from the upper side to the lower side of the concave portion 11. Is attached. Similarly, the press-fitting rib 12 protruding from the inner wall surface of the recess 11 has a gradient so that the press-fitting amount of the chassis 101 increases from the upper side to the lower side, as shown in FIG. .

  The through hole 31 of the inner lid 30 also requires a draft angle of the mold like the lower buffer body 10, but the draft angle of the mold of the inner lid 30 is opposite to the draft angle of the lower buffer body 10. To. That is, as shown in FIG. 8B, the through hole 31 has a gradient such that the hole diameter decreases from the lower side toward the upper side. Similarly, the press-fitting rib 32 protruding from the inner wall surface of the through-hole 31 has a gradient so that the press-fitting amount of the chassis portion 101 increases from the lower side to the upper side, as shown in FIG. Yes. As a result, the inner lid 30 can strongly press the neck near the design portion 102 of the chassis portion 101, and vibration resistance is improved. In addition, it is not necessary to fix the electronic device 100 by forming the concave portion 11 of the lower buffer body 10 into a deep concave shape. Therefore, the influence of the draft of the mold can be reduced as much as the concave portion 11 can be made shallower, and the amount of overlap of the press-fitting ribs 12 with respect to the chassis portion 101 can be reduced. Will improve. Further, it is possible to suppress a decrease in holding force due to the lower buffer body 10 being shaved when the electronic device 100 is inserted, and to suppress the generation of shavings.

  In FIG. 8, the slope of the concave portion 11, the through hole 31, and the press-fitting ribs 12, 32 is expressed more greatly than the actual scale so that it can be easily understood. In FIG. 8, the press-fitting ribs 12 and 32 and the chassis portion 101 are overlapped. However, when the chassis portion 101 is press-fitted, the press-fitting ribs 12 and 32 are expanded and deformed.

  As described above, according to the first embodiment, the packing structure includes the lower shock absorber 10 in which the recess 11 that holds the chassis 101 of the electronic device 100 is formed, and the electronic device that is disposed in the opening of the recess 11. An upper shock absorber 20 that covers 100 design portions 102 in a non-contact state and a through hole 31 that penetrates and holds the chassis portion 101 are formed and sandwiched between the lower shock absorber 10 and the upper shock absorber 20. And an inner lid 30 that is supported. In addition to holding the chassis portion 101 by the concave portion 11 of the lower shock absorber 10, the through hole 31 of the inner lid 30 can hold a portion close to the design portion 102 of the chassis portion 101. Shaking can be suppressed. Thereby, the damage by the contact with the design part 102 and another member can be prevented.

  In addition, according to the first embodiment, the press-fitting rib 32 that presses the chassis portion 101 of the electronic device 100 protrudes from the inner wall surface of the through hole 31 of the inner lid 30. A portion close to 102 can be stably held.

  Further, according to the first embodiment, the press-fitting rib 32 of the inner lid 30 extends in the vertical direction on the inner wall surface of the through hole 31, and the press-fitting amount of the chassis portion 101 is larger on the upper side than the lower side of the press-fitting rib 32. Therefore, the portion closer to the design portion 102 of the chassis portion 101 can be held, and rattling of the electronic device 100 can be further suppressed.

  Further, according to the first embodiment, the inner lid 30 has the positioning portion 33 that positions the lower shock absorber 10, so that the inner lid 30 has vibration resistance and the back of the electronic device 100. Suppression can be suppressed.

  In addition, according to the first embodiment, the press-fitting rib 12 that presses the chassis portion 101 of the electronic device 100 is protruded from the inner wall surface of the recess 11 of the lower shock absorber 10. The wall surface extends in the vertical direction, and the press-fitting amount of the chassis portion 101 is larger on the lower side than the upper side of the press-fitting rib 12. Therefore, the lower shock absorber 10 has a shape that can be removed vertically, and the mold structure can be simplified. Moreover, since the part near the design part 102 of the chassis part 101 is hold | maintained with the inner cover 30, it becomes unnecessary to make the recessed part 11 of the lower side shock absorber 10 into a deep recessed shape, and to raise holding | maintenance force. The influence of the draft can be reduced as much as the depth can be reduced, and the insertion / removability of the electronic device 100 is improved. Moreover, generation | occurrence | production of the shavings when inserting the electronic device 100 in the recessed part 11 can be suppressed, and the fall of the retention strength by being shaved can be suppressed.

  Further, according to the first embodiment, the lower shock absorber 10 has the inner lid support portion 13 that supports the inner lid 30 by contacting the inner lid 30 above the surface of the opening of the recess 11. Therefore, the inner lid 30 can be given elastic force. Thereby, when the packaging box 130 falls, even if the lower shock absorber 10 is crushed by the weight of the electronic device 100 and the design part 102 contacts the inner lid 30, the inner lid 30 absorbs the impact and the design part Damage to 102 can be prevented.

In the first embodiment, the configuration in which the press-fit rib 32 is provided in the through hole 31 of the inner lid 30 has been described. However, the press-fit rib 32 can be omitted.
Here, FIG. 9 shows a modification of the inner lid 30 in which the press-fitting rib 32 is omitted. The through hole 31 of the inner lid 30 shown in FIG. 9 is smaller in size than the chassis portion 101 of the electronic device 100 (not shown). Therefore, the chassis part 101 is held in a state of being press-fitted into the through hole 31. Also in this modified example, in the same manner as in the first embodiment, in addition to holding the chassis portion 101 by the concave portion 11 of the lower shock absorber 10, a portion where the through hole 31 of the inner lid 30 is close to the design portion 102 of the chassis portion 101. Therefore, rattling of the electronic device 100 can be suppressed.
Also in the modified example of FIG. 9, as in the first embodiment, the amount of press-fitting of the chassis portion 101 is made by reversing the draft angle of the mold of the inner lid 30 from the draft angle of the lower shock absorber 10. Is larger on the upper side than the lower side of the through hole 31, so that a portion of the chassis portion 101 closer to the design portion 102 can be held.

  In addition to the above, within the scope of the present invention, any component of the embodiment can be modified or any component of the embodiment can be omitted.

  DESCRIPTION OF SYMBOLS 10 Lower shock absorber, 11 Concave part, 12 Press-fit rib, 13 Middle lid support part, 14 Positioning part, 20, 20-1 Upper shock absorber, 21 Recessed part, 30 Middle cover, 31 Through-hole, 32 Press-fit rib, 33 Positioning part , 100 electronic equipment, 101 chassis part, 102 design part, 110 lower buffer, 111 recess, 112 press-fitting rib, 120 upper buffer, 130 packing box.

Claims (7)

A packing structure for holding the packing object by interposing between the packing object and the packing box having a design part on one end side of the chassis part,
A lower buffer body in which a recess for holding the chassis portion is formed;
An upper buffer body that covers the design portion arranged in the opening of the recess in a non-contact state;
A packaging structure comprising a through hole for penetrating and holding the chassis portion, and an inner lid supported by being sandwiched between the lower buffer body and the upper buffer body.   The packing structure according to claim 1, wherein the through hole of the inner lid is smaller in size than the chassis portion of the article to be packed and press-fits and holds the chassis portion.   The packing structure according to claim 1, wherein a press-fitting rib that presses the chassis portion of the article to be packed is protruded from an inner wall surface of the through hole of the inner lid.   The press-fitting rib of the inner lid extends in the vertical direction on the inner wall surface of the through hole, and has a shape in which the press-fitting amount of the chassis part is larger on the upper side than the lower side of the press-fitting rib. Item 4. The packaging structure according to item 3.   The packing structure according to any one of claims 1 to 4, wherein the inner lid includes a positioning portion that positions the lower buffer body.   On the inner wall surface of the concave portion of the lower shock absorber, a press-fitting rib that presses the chassis portion of the article to be packed is projected, and the press-fitting rib extends in the vertical direction on the inner wall surface, The packing structure according to any one of claims 1 to 5, wherein the amount of press-fitting of the chassis portion is larger than the upper side of the press-fitting rib.   The said lower buffer body has an inner lid support part which contacts and supports the said inner lid above the surface where the said recessed part is opening, The inside of Claims 1-6 characterized by the above-mentioned. The packaging structure according to any one of claims.

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