JP2016000500A - Liquid jetting head, liquid jetting device and method for manufacturing liquid jetting head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid jetting head that can secure adhesion reliability between base plates, and to provide a liquid jetting device including the same and a method for manufacturing the liquid jetting head.SOLUTION: In the liquid jetting head, a flow channel including a pressure chamber is defined by jointing a pressure chamber formation base plate with a communication base plate, an opening part of the defined flow channel is sealed by a compliance sheet, a relief hollow part 50, 56 is formed in at least one of the pressure chamber formation base plate and the communication base plate while being opened at a face jointing with the other base plate, an adhesive layer is interposed between the relief hollow part and the flow channel, and a sealing material as a moisture permeation resistance part is interposed between the relief hollow part and an ambient air opening path.

Description

  The present invention relates to a liquid ejecting head such as an ink jet recording head, a liquid ejecting apparatus including the same, and a method for manufacturing the liquid ejecting head, and in particular, a plurality of head constituent members are joined by an adhesive. The present invention relates to a liquid ejecting head, a liquid ejecting apparatus including the same, and a method for manufacturing the liquid ejecting head.

  The liquid ejecting apparatus includes a liquid ejecting head and ejects various liquids from the ejecting head. As this liquid ejecting apparatus, for example, there is an image recording apparatus such as an ink jet printer or an ink jet plotter, but recently, various types of manufacturing have been made by taking advantage of the ability to accurately land a very small amount of liquid on a predetermined position. It is also applied to devices. For example, a display manufacturing apparatus for manufacturing a color filter such as a liquid crystal display, an electrode forming apparatus for forming an electrode such as an organic EL (Electro Luminescence) display or FED (surface emitting display), a chip for manufacturing a biochip (biochemical element) Applied to manufacturing equipment. The recording head for the image recording apparatus ejects liquid ink, and the color material ejecting head for the display manufacturing apparatus ejects solutions of R (Red), G (Green), and B (Blue) color materials. The electrode material ejecting head for the electrode forming apparatus ejects a liquid electrode material, and the bioorganic matter ejecting head for the chip manufacturing apparatus ejects a bioorganic solution.

  This type of liquid ejecting head includes a nozzle from which liquid is ejected, a liquid channel communicating with the nozzle, a pressure generating unit that causes pressure fluctuations with respect to the liquid in the liquid channel, and the like. As the liquid flow path, a common liquid chamber (also referred to as a reservoir or a manifold) into which a liquid common to a plurality of nozzles is introduced, a plurality of pressure chambers provided in a one-to-one correspondence for each nozzle, a common liquid A supply port for communicating the chamber and each pressure chamber, a communication port for communicating each pressure chamber and each nozzle, and the like. In a general liquid ejecting head, the liquid flow path is defined by joining and laminating a plurality of substrates (base materials) with an adhesive.

  In the liquid jet head having such a configuration, the adhesive is applied to the bonding surface of the substrates so that excess adhesive between the substrates does not flow into the liquid flow path side when pressurized when bonding the substrates. There are some which are provided with holes and depressions (hereinafter collectively referred to as an adhesive escape space) for introduction and escape (see, for example, Patent Document 1). In the configuration having such an adhesive escape portion, the adhesive is easily introduced by the adhesive escape portion when the substrates are joined to each other, and the adhesive is accelerated in the step of promoting the curing of the adhesive by heating the substrate. In order to prevent the internal pressure of the escape space from increasing, the adhesive escape space is communicated with the atmosphere via an air communication path provided in the liquid ejecting head. That is, by making the adhesive escape space communicate with the atmosphere, the adhesive at the time of bonding between the substrates can be actively introduced into the adhesive escape space, and the adhesive flows into the flow path side. It is surely prevented. Moreover, since the increase in the internal pressure of the adhesive escape space is suppressed, problems such as poor adhesion and peeling of the bonded portion are prevented.

JP 2007-320171 A

  The atmosphere communication path through which the adhesive escape space communicates also communicates with other parts of the liquid jet head. For example, in Patent Document 1, a cavity diaphragm portion for absorbing a pressure change in the liquid flow path is provided adjacent to the liquid flow path, and the cavity diaphragm portion is also an adhesive escape portion (a relief groove portion). Like 19), it communicates with the atmosphere, and both communicate with each other. A space (also referred to as a compliance space) for absorbing and mitigating pressure fluctuations in the liquid flow path in the liquid jet head such as the above-described cavity diaphragm portion is a thin sheet material such as polyphenylene sulfide resin (PPS), for example. There is also a configuration that is separated from the liquid flow path via (hereinafter also referred to as a compliance sheet). In such a configuration, moisture on the liquid flow path side may permeate to the compliance space side through the compliance sheet, and this moisture may move to the adhesive escape space side through the atmosphere communication path. When the humidity in the vicinity of the adhesive escape space is increased, there is a possibility that the adhesive strength is reduced and the adhesive reliability is impaired. When the adhesive force between the substrates decreases, the liquid in the liquid flow channel leaks and the liquid enters, for example, the compliance space and closes the space, or in the mounting space for electrical wiring and electrical components. There is a possibility of intrusion and cause a short circuit or failure.

  SUMMARY An advantage of some aspects of the invention is that a liquid ejecting head capable of ensuring adhesion reliability between substrates, a liquid ejecting apparatus including the same, and a liquid ejecting head are provided. A manufacturing method is provided.

[Application Example 1]
The liquid jet head of the present invention has been proposed in order to achieve the above object, and includes a first substrate,
A second substrate bonded to the first substrate by an adhesive;
A liquid flow path communicating with a nozzle from which liquid is ejected;
A pressure chamber provided in the middle of the liquid flow path;
A pressure generating section for causing a pressure change in the liquid in the pressure chamber;
A flexible member that bends in response to a pressure change in the liquid channel;
A space separated from the liquid flow path with the flexible member interposed therebetween,
An air opening path for opening the space to the atmosphere;
With
By joining the first substrate and the second substrate, at least a part of the liquid flow path is defined, and the opening of the defined liquid flow path is formed by the flexible member. A sealed liquid jet head,
In at least one of the first substrate and the second substrate, a clearance space that is opened in a bonding surface with the other substrate is formed,
An adhesive layer is interposed between the escape space and the partial flow path,
A moisture permeation resistance portion is interposed between the escape space and the atmosphere opening path.

  According to the present invention, the moisture permeation resistance portion is interposed between the escape clearance portion for the adhesive and the atmosphere opening path, so that the moisture in the liquid channel easily passes through the flexible member and the humidity is likely to increase. Since the moisture permeation resistance portion blocks the state of communication with the adhesive escape space where the adhesive is introduced, moisture in the space is prevented from entering the escape space portion. Thereby, it is possible to prevent the adhesive force of the adhesive from decreasing due to an increase in the humidity in the vicinity of the escape space, and to secure the adhesion reliability.

[Application Example 2]
The said structure of the application example 1 WHEREIN: The structure by which the communication part which connects between the said escape space part and the said air release path is sealed with the sealing material as the said moisture permeation | transmission resistance part is employable.

  According to this configuration, the communication portion that communicates between the escape space and the atmosphere opening path can be easily sealed with the sealing material.

[Application Example 3]
In the above-described configuration of Application Example 2, the communication portion penetrates either the first substrate or the second substrate from the escape space side of the bonding surface of the one substrate and the bonding surface side. Is in a different plane and communicates with the open air path,
The sealing material may employ a configuration that seals a communication portion between the communication portion and the atmosphere opening path.

  According to this configuration, since the overall length of the escape space can be suppressed, it is possible to suppress a problem that the substrate on which the escape space is formed breaks from the escape space.

[Application Example 4]
In the above-described configuration of the periodic example 1, it is possible to adopt a configuration in which a resistance passage that inhibits the passage of moisture is formed as the moisture permeation resistance portion between the escape space portion and the air release path.

  According to this configuration, it is possible to maintain the atmosphere communication state of the escape space while suppressing moisture in the space from entering the escape space. For this reason, even if environmental temperature rises, for example, it is suppressed that the internal pressure of a relief space rises. Moreover, the sealing process with a sealing material can be omitted.

[Application Example 5]
In the above-described configurations of Application Examples 1 to 4, the atmosphere open path adopts a configuration including a through hole extending over a plurality of components including an assembly formed by joining the first substrate and the second substrate. Is desirable.

  According to this configuration, the through hole that is a part of the atmosphere opening path can be used as a relative positioning hole between the constituent members of the liquid jet head. For this reason, it is not necessary to separately provide a through hole for the atmosphere opening path and a through hole for positioning, which contributes to downsizing of the liquid jet head.

[Application Example 6]
In the configuration of Application Example 5, it is desirable to employ a configuration in which a plurality of sets of the through holes are provided.

  According to this configuration, it is possible to further increase the positioning accuracy between the constituent members of the liquid ejecting head using the plurality of through holes.

[Application Example 7]
The liquid jet head according to the present invention includes a first substrate,
A second substrate bonded to the first substrate by an adhesive;
A liquid flow path communicating with a nozzle from which liquid is ejected;
A pressure chamber provided in the middle of the liquid flow path;
A pressure generating section for causing a pressure change in the liquid in the pressure chamber;
A flexible member that bends in response to a pressure change in the liquid channel;
A space separated from the liquid flow path with the flexible member interposed therebetween,
An air opening path for opening the space to the atmosphere;
With
By joining the first substrate and the second substrate, at least a part of the liquid flow path is defined, and the opening of the defined liquid flow path is formed by the flexible member. A sealed liquid jet head,
In at least one of the first substrate and the second substrate, a clearance space that is opened in a bonding surface with the other substrate is formed,
An adhesive layer is interposed between the escape space and the partial flow path,
The escape space is open to the atmosphere through a second open air path independent of the first open air path.

  According to this configuration, the escape space for the adhesive is released to the atmosphere through the second atmosphere release path independent of the first atmosphere release path, so that the flexible member is used for the liquid flow path. Moisture in the separated space is prevented from entering the escape space side for the adhesive into which the adhesive is introduced. Thereby, it is possible to prevent the adhesive force of the adhesive from decreasing due to an increase in the humidity in the vicinity of the escape space, and to secure the adhesion reliability.

[Application Example 8]
In the configuration of Application Example 7, the first atmosphere opening path and the second atmosphere opening path include a plurality of constituent members including an assembly formed by bonding the first substrate and the second substrate. It is desirable to employ a configuration that includes through holes.

  According to this configuration, the through hole that is a part of the atmosphere opening path can be used as a relative positioning hole between the constituent members of the liquid jet head. For this reason, it is not necessary to separately provide a through hole for the atmosphere opening path and a through hole for positioning, which contributes to downsizing of the liquid jet head.

[Application Example 9]
In the configuration of Application Example 7, a configuration is adopted in which an end portion on the side communicating with the second atmosphere opening path of the escape space in the joint surface of the one substrate is sealed with a sealing material. be able to.

[Application Example 10]
In the above configurations of Application Examples 1 to 9, a wiring space that accommodates a joint portion between a wiring member that applies a drive signal to the pressure generating unit and an electrode unit of the pressure generating unit,
A configuration including an air release path for wiring space that opens the wiring space to the atmosphere can be adopted.

  According to this configuration, the heat generated in the wiring space can be radiated through the wiring space air opening path.

[Application Example 11]
In the above-described configuration of Application Example 10, it is preferable that the wiring space atmosphere opening path includes a wiring space resistance path that inhibits passage of moisture.

  According to this configuration, moisture in the outside air of the liquid ejecting head is prevented from entering the wiring space through the wiring space atmosphere opening path.

[Application Example 12]
According to another aspect of the invention, there is provided a liquid ejecting apparatus including the liquid ejecting head having any one of the application examples 1 to 11 described above.

[Application Example 13]
The method of manufacturing a liquid jet head according to the present invention includes a liquid channel that communicates with a first substrate, a second substrate bonded to the first substrate with an adhesive, and a nozzle from which liquid is ejected. A pressure chamber provided in the middle of the liquid flow path, a pressure generating section that causes a pressure change in the liquid in the pressure chamber, a flexible member that bends in response to a pressure change in the liquid flow path, A space separated from the liquid flow path through a flexible member, an air release path for opening the space to the atmosphere, at least one of the first substrate and the second substrate, and the other substrate And a clearance gap opening at a joint surface with the substrate, and the first substrate and the second substrate are joined together to define at least a part of the liquid flow path. Of the liquid jet head in which the opening of the partial flow path formed is sealed by the flexible member. A manufacturing method,
A first step of joining the first substrate and the second substrate with an adhesive to form an assembly with the escape space opened to the atmosphere;
A second step of joining the flexible member to the assembly and sealing an opening of a partial flow path in the assembly with the flexible member;
Have
After the first step, before the second step, a sealing step is performed in which a communication portion between the escape space and the atmosphere release path is sealed with a sealing material.

  According to this manufacturing method, since the sealing step is performed after the first step, excess adhesive when the first substrate and the second substrate are joined is escaped in the first step. Can be actively guided to. This suppresses the adhesive from entering the liquid flow path side. Moreover, even if the hardening of the adhesive is accelerated at a high temperature in the first step, the internal pressure of the escape space is prevented from increasing. Thereby, it can suppress that the adhesion part of a 1st board | substrate and a 2nd board | substrate peels according to the raise of the internal pressure of an escape space part.

[Application Example 14]
In the above method of Application Example 13, the first substrate and the second substrate are formed of a silicon substrate,
The temperature of the atmosphere in the first step is suitable when it is higher than the temperature of the atmosphere in the second step.

  That is, even when the temperature in the first step is higher than the temperature in the second step, the internal pressure of the escape space increases because the escape space is open to the atmosphere in the first step. Is prevented. On the other hand, the temperature in the second step is lower than the temperature in the first step. Therefore, even if the communication portion between the escape space and the air release path is sealed with a sealing material after the first step, the escape is performed. There is little possibility that the internal pressure of the empty portion will rise.

[Application Example 15]
In addition, after the first step of Application Example 14, it is preferable to perform a step of directly or indirectly joining a synthetic resin component to the assembly.

  That is, after the first step, the work is performed at a temperature lower than that in the case of the first step. Therefore, even when an assembly having a different linear expansion coefficient is joined to a synthetic resin, the linear expansion is performed. Misalignment and the like due to the difference in coefficients can be suppressed.

[Application Example 16]
Moreover, the atmosphere release path of the application example 13 to the application example 15 includes a through hole extending over a plurality of constituent members including the assembly,
After the first step, it is desirable to perform a step of joining the constituent members in a state where the constituent members are positioned with each other using the through holes.
[Application Example 17]
Furthermore, this step is desirably performed after the sealing step.

  That is, after the first step and the sealing step, the through holes that are a part of the air release path can be joined in a state of being positioned using the relative positioning holes between the constituent members. For this reason, it is not necessary to separately provide a through hole for the atmosphere opening path and a through hole for positioning, which contributes to downsizing of the liquid jet head.

FIG. 3 is a perspective view illustrating a configuration of a printer. FIG. 3 is an exploded perspective view of the recording head as viewed obliquely from above. FIG. 3 is a cross-sectional view of a recording head. It is principal part sectional drawing of a head unit. It is a top view of a protective substrate. It is a top view of a pressure chamber formation board. It is a top view of a communication board. It is a top view of a compliance sheet. It is a top view of a sheet | seat support plate. It is a block diagram explaining the air release path | route in 1st Embodiment. It is a figure explaining the manufacturing process of a head unit. It is sectional drawing of the actuator assembly in 1st Embodiment. It is sectional drawing of the actuator assembly in 2nd Embodiment. It is sectional drawing of the actuator assembly in 3rd Embodiment. It is a block diagram explaining the air | atmosphere release path | route in 2nd Embodiment. It is a block diagram explaining the air release path | route in 3rd Embodiment. It is a block diagram explaining the air | atmosphere release path | route in 4th Embodiment. It is a top view of the sheet | seat support plate in 5th Embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the accompanying drawings. In the embodiments described below, various limitations are made as preferred specific examples of the present invention. However, the scope of the present invention is not limited to the following description unless otherwise specified. However, the present invention is not limited to these embodiments. In the following, an ink jet printer (hereinafter simply referred to as printer 1) equipped with an ink jet recording head (hereinafter simply referred to as recording head 3), which is a kind of liquid ejecting head, as the liquid ejecting apparatus of the present invention. )) As an example.

  First, the configuration of the printer 1 in the present embodiment will be described with reference to FIG. The printer 1 is a device that records an image or the like by ejecting liquid ink onto the surface of a recording medium 2 such as recording paper. The printer 1 includes a recording head 3, a carriage 4 to which the recording head 3 is attached, and a carriage moving mechanism 5 that moves the carriage 4 in the main scanning direction. The printer 1 also includes a mechanism for transporting the recording medium 2 in the sub-scanning direction, that is, for example, a platen roller 6 or a drum. Here, the ink is a kind of liquid of the present invention, and is stored in an ink cartridge 7 as a liquid supply source. The ink cartridge 7 is detachably attached to the recording head 3. It is also possible to employ a configuration in which the ink cartridge 7 is disposed on the main body side of the printer 1 and is supplied from the ink cartridge 7 to the recording head 3 through an ink supply tube.

  The carriage moving mechanism 5 includes a timing belt 8. The timing belt 8 is driven by a pulse motor 9 such as a DC motor. Therefore, when the pulse motor 9 operates, the carriage 4 is guided by the guide rod 10 installed on the printer 1 and reciprocates in the main scanning direction.

  FIG. 2 is an exploded perspective view showing the configuration of the recording head 3, and FIG. 3 is a cross-sectional view of the recording head 3. In FIG. 3, a cross section of one head unit 13 is shown. The recording head 3 in the present embodiment includes a needle holder 14, an introduction path substrate 15, a filter substrate 16, a circuit substrate 17, a unit holder 18, a plurality of head units 13, a unit fixing plate 19, a head cover 20, and the like. It is configured.

  The needle holder 14 is a synthetic resin plate material on which the introduction needle 22 is erected. In the present embodiment, a total of eight introduction needles 22 are provided in the needle holder 14 side by side along the scanning direction of the recording head 3 so as to correspond to the inks of the ink cartridges 7 of the respective colors. The introduction needle 22 is a hollow needle-like member inserted into the ink cartridge 7, and introduces the ink stored in the ink cartridge 7 to the introduction path substrate 15 side through the needle flow path 22a. Further, in the needle holder 14 according to the present embodiment, an air opening 21 penetrating the plate thickness direction is formed on one side of the introduction needle juxtaposition direction. The atmosphere opening 21 is a portion corresponding to an outlet of a wiring space atmosphere opening path to be described later. The configuration for introducing the ink from the ink cartridge 7 into the recording head 3 is not limited to the configuration using the introduction needle 22, and for example, a porous member capable of absorbing ink on each of the ink supply side and the reception side. It is also possible to employ a configuration in which ink is exchanged by providing and bringing the porous members into contact with each other.

  The introduction path substrate 15 is a member in which an ink introduction path 23 is formed. The ink introduction path 23 opens at a position corresponding to the lower end side opening of the needle flow path 22a of the introduction needle 22 on the upper surface (joint surface with the needle holder 14) of the introduction path substrate 15, and the lower surface ( It is a flow path that opens at a position corresponding to the upper opening of the filter chamber 24 in the bonding surface with the filter substrate 16. That is, the ink introduction path 23 communicates the needle channel 22 a and the upper opening of the filter chamber 24. Further, an atmospheric communication passage 26 communicating with the atmospheric opening 21 of the needle holder 14 is formed in the introduction path substrate 15 along the plate thickness direction. A meandering path 27 is provided as a moisture permeation resistance portion at a position off the ink introduction path 23 on the lower surface of the introduction path substrate 15.

  The meandering path 27 is, for example, a groove-shaped passage provided on the lower surface of the introduction path substrate 15, and the opening of the passage is sealed by bonding the filter substrate 16 to the lower surface of the flow path substrate 15. . One end of the meandering path 27 communicates with the atmosphere communication path 26, and the other end communicates with the intermediate path 30 of the filter substrate 16. Further, the passage cross-sectional area of the meandering path 27 is set to be the smallest in the air opening path for wiring space. The meandering path 27 is formed in a state of meandering along the lower surface so as to avoid the ink introduction path 23 on the lower surface of the introduction path substrate 15, and its entire length is secured relatively long. The meandering path 27 has a passage cross-sectional area and a total length so as to inhibit the passage of moisture (meaning including water vapor), in other words, resistance to the passage of moisture. As a result, moisture outside the recording head 3 is prevented from entering the wiring space described later through the atmosphere opening path. Note that the moisture permeation resistance portion hardly allows gas / moisture permeation in addition to a passage that is intended to positively impart resistance to the passage of moisture, such as the meandering path 27. It is meant to include (or completely shut off), for example, a sealing material such as an adhesive or a structure (substrate itself) forming a flow path. In addition, among the moisture permeation resistance portions, those capable of passing gas (including water vapor) are particularly referred to as diffusion resistance. Therefore, the meandering path 27 is also a kind of diffusion resistance.

  The filter substrate 16 is a member in which a filter chamber 24 in which the filter 25 is disposed is formed. The filter chamber 24 is a hollow portion whose upper surface side is open. A filter 25 is fixed to the bottom portion of the filter chamber 24. The filter 25 is a member that filters the ink flowing down the ink flow path. For example, a material in which a metal is finely knitted in a mesh shape or a thin metal plate material in which a large number of through holes are formed by plastic working is used. It is done. When air bubbles and foreign matter are mixed in the ink, the air bubbles and foreign matter are prevented from being captured in the filter chamber 24 by the filter 25 and flowing into the head unit 13 side. A lead-out path 28 is opened at the bottom of the filter chamber 24. A lower end of the lead-out path 28 communicates with a holder channel 29 of the unit holder 18 through a communication hole 31a of a seal member 31 described later. Therefore, the ink flowing into the filter chamber 24 from the ink introduction path 23 is filtered by the filter 25 and then flows into the holder flow path 29 through the outlet path 28. Further, an intermediate passage 30 communicating with the meandering path 27 of the introduction path substrate 15 is formed in the filter substrate 16 so as to penetrate the plate thickness direction.

  A seal member 31 and a circuit board 17 are disposed between the filter substrate 16 and the unit holder 18. The seal member 31 is a thin plate-like member made of an elastic material such as an elastomer or rubber, for example, and a communication hole 31 a is opened at a position corresponding to the lead-out path 28 of the filter substrate 16. The communication hole 31 a is disposed between the lower end opening of the outlet path 28 in the filter substrate 16 and the upper end opening of the holder flow path 29 of the unit holder 18. And the opening peripheral part of the communicating hole 31a closely_contact | adheres with the elasticity of the sealing member 31 with respect to the peripheral part of both opening, and connects the derivation | leading-out path 28 and the holder flow path 29 in a liquid-tight state. The seal member 31 is provided with a through hole 31 b communicating with the intermediate passage 30 of the filter substrate 16.

  The circuit board 17 includes a connector 33 for connecting a wiring member (not shown) from the printer body side, receives a control signal such as a drive signal from the printer body side through the wiring member connected to the connector 33, This drive signal is configured to be applied to the piezoelectric element 45 of the head unit 13 through the flexible cable 58. That is, the circuit board 17 is a board that relays a drive signal for driving the piezoelectric element 45 as a pressure generating unit. The circuit board 17 is provided with a wiring through-hole 34 through which the flexible cable 58 is inserted and wired. The wiring through hole 34 communicates with the holder opening 18 a of the unit holder 18, the through space 78 in the case 38 of the head unit 13, and the wiring space 74 of the protective substrate 46. Further, the wiring through-hole 34 communicates with the through-hole 31 b of the seal member 31. Thereby, the wiring empty part 74 which is a part of the wiring space communicates with the atmosphere through the above-described atmosphere communication path.

  The unit holder 18 is a box-shaped member that houses a plurality of head units 13 in a storage chamber 35 formed therein. The accommodation chamber 35 is opened on the lower surface side of the unit holder 18, and a total of four head units 13 are accommodated in the accommodation chamber 35 while being positioned side by side in the main scanning direction. The number of head units 13 accommodated in the accommodation chamber 35 is not limited to four. The lower surface of each head unit 13 in the accommodation chamber 35 (more specifically, the lower surface of the compliance substrate 42) has a metal unit fixing plate 19 having four openings 19 'corresponding to the head units 13, respectively. To be joined. Further, it is fixed by a metal head cover 20 (not shown in FIGS. 3 and 4) in which four openings 20 ′ corresponding to the head units 13 are opened. Further, the unit holder 18 is formed with a holder channel 29 that communicates the lead-out channel 28 in the filter substrate 16 and the case channel 37 of the head unit 13. Further, between the paired holder flow paths 29, a holder opening 18 a communicating with the through space 78 in the case 38 of the head unit 13 is opened. A pair of holder channels 29 and a holder opening 18 a are provided corresponding to each head unit 13 in the accommodation chamber 35.

  FIG. 4 is a cross-sectional view of an essential part showing an internal configuration of the head unit 13 (a liquid jet head in a narrow sense). 5 to 9 are schematic plan views of the constituent members of the head unit 13. Specifically, FIG. 5 shows a protective substrate 46, FIG. 6 shows a pressure chamber forming substrate 43, FIG. 7 shows a communication substrate 40, FIG. 8 shows a compliance sheet 42a, and FIG. 9 shows a sheet support plate 42b. 5 to 9, (a) shows a bottom view of the constituent member, and (b) shows a top view of the constituent member. In FIGS. 5 to 9, for convenience, one pressure chamber row is illustrated as being constituted by three pressure chambers 41, but in reality, the pressure chambers are formed by a larger number of pressure chambers 41. A column is constructed.

  The head unit 13 in this embodiment is configured by being attached to a case 38 made of synthetic resin in a state where a plurality of head unit constituent members are laminated. The head unit constituent member includes a nozzle plate 39, a communication substrate 40, a compliance substrate 42, a pressure chamber forming substrate 43, an elastic film 44, a piezoelectric element 45 (a kind of pressure generating unit in the present invention), and a protective substrate 46.

  The pressure chamber forming substrate 43 is made of a silicon single crystal substrate (hereinafter also simply referred to as a silicon substrate). In the pressure chamber forming substrate 43, a plurality of empty portions for partitioning the pressure chamber 41 are formed by anisotropic etching processing on the silicon substrate. The void is formed so as to penetrate the thickness direction of the pressure chamber forming substrate 43, and one opening is sealed with the elastic film 44 and the other opening is sealed with the communication substrate 40. Thus, the pressure chamber 41 is defined. Hereinafter, the pressure chamber 41 including this empty portion is referred to. Thus, by forming the pressure chamber 41 on the silicon substrate by anisotropic etching, higher dimensional and shape accuracy can be ensured. As will be described later, two rows of nozzles 47 are formed on the nozzle plate 39 of each head unit 13 in the present embodiment, so that the row of pressure chambers 41 is arranged on the pressure chamber forming substrate 43. Two strips are formed corresponding to the row. The pressure chamber 41 is a hollow portion that is long in a direction orthogonal to the direction in which the nozzles 47 are arranged side by side. When the pressure chamber forming substrate 43 is bonded in a state of being positioned with respect to the communication substrate 40 described later, one end portion of the pressure chamber 41 in the longitudinal direction is connected to the nozzle 47 via the nozzle communication passage 53 of the communication substrate 40 described later. Communicate with. Further, the other end of the pressure chamber 41 in the longitudinal direction communicates with the common liquid chamber 51 via an ink supply port 54 (described later) of the communication substrate 40.

  In addition, as shown in FIG. 6A, an adhesive relief groove extending along the direction in which the pressure chambers 41 are juxtaposed is provided on the lower surface of the pressure chamber forming substrate 43, which is a joint surface with the communication substrate 40. 50 (a kind of clearance gap for adhesive in the present invention) is formed by anisotropic etching in the same manner as the pressure chamber 41. The escape groove portion 50 is an empty portion that introduces an excessive adhesive when the pressure chamber forming substrate 43 and the communication substrate 40 are bonded together with an adhesive. As shown in FIG. 6, in this embodiment, the escape groove portion 50 has an adhesive region 55 (region shown by hatching in FIG. 6A) between each row of pressure chambers 41 and the row of pressure chambers 41. In the state of providing, it is formed in close proximity. That is, when the pressure chamber forming substrate 43 and the communication substrate 40 are joined, the pressure chamber 41 and the escape groove portion 50 are separated from each other by the adhesive layer in the bonding region 55. On one end side in the extending direction of the escape groove portion 50, a communication groove portion 56 is formed that extends in a direction orthogonal to the same direction and communicates the escape groove portions 50 of each pressure chamber row with each other. Similar to the escape groove 50, the communication groove 56 also functions as a clearance for the adhesive. And these escape groove part 50 and the communication groove part 56 are connected with the air release path. Details of this point will be described later. The pressure chamber forming substrate 43 and the communication substrate 40 correspond to the first substrate and the second substrate in the present invention, and in this embodiment, one substrate is the pressure chamber forming substrate 43, and the other This substrate corresponds to the communication substrate 40.

  An elastic film 44 is formed on the upper surface of the pressure chamber forming substrate 43 (the surface opposite to the bonding surface with the communication substrate 40) in a state where the upper opening of the pressure chamber 41 is sealed. The elastic film 44 is made of, for example, silicon dioxide having a thickness of about 1 μm. An insulating film (not shown) is formed on the elastic film 44. This insulating film is made of, for example, zirconium oxide. And the piezoelectric element 45 is each formed in the position corresponding to each pressure chamber 41 on this elastic film 44 and an insulating film. The piezoelectric element 45 in the present embodiment is a so-called bending mode piezoelectric element. The piezoelectric element 45 includes a metal lower electrode film, a piezoelectric layer made of lead zirconate titanate (PZT) and the like, and a metal upper electrode film (all shown) on the elastic film 44 and the insulating film. Are sequentially layered and then patterned for each pressure chamber 41. One of the upper electrode film and the lower electrode film is a common electrode, and the other is an individual electrode. Further, the elastic film 44, the insulating film, and the lower electrode film function as a diaphragm when the piezoelectric element 45 is driven.

  From the individual electrode (upper electrode film) of each piezoelectric element 45, an electrode wiring portion 45a (corresponding to the electrode portion in the present invention) is extended on the insulating film, and as shown in FIG. A terminal on one end side of the flexible cable 58 (corresponding to the wiring portion in the present invention) is connected to a portion corresponding to the electrode terminal of the wiring portion 45a. The flexible cable 58 has a configuration in which, for example, a conductor pattern is formed with a copper foil or the like on the surface of a base film such as polyimide and the conductor pattern is covered with a resist. A driving IC 59 for driving the piezoelectric element 45 is mounted on the surface of the flexible cable 58. Each piezoelectric element 45 bends and deforms when a drive signal (drive voltage) is selectively applied between the upper electrode film and the lower electrode film under the control of the drive IC 59.

  The communication substrate 40 bonded to the lower surface of the pressure chamber forming substrate 43 is a plate material made of a silicon substrate, like the pressure chamber forming substrate 43. In the communication substrate 40, a common liquid chamber 51, which is an empty portion common to the pressure chambers 41 in the pressure chamber row, is formed by anisotropic etching. The common liquid chamber 51 is formed from the first communication portion 51a penetrating the thickness direction of the communication substrate 40 and the lower surface of the communication substrate 40 (that is, the surface opposite to the bonding surface with the case 38). The second communication portion 51b is formed by being half-etched halfway in the thickness direction of 40. The first communication portion 51 a is a through opening extending along the direction in which the pressure chambers 41 are arranged side by side, and is formed at a position corresponding to the lower end opening of the case flow path 37 of the case 38. That is, the ink introduced from the introduction needle 22 sequentially flows down the ink introduction path 23, the filter chamber 24, the outlet path 28, the holder flow path 29, and the case flow path 37 and flows into the first communication portion 51a. The second communication portion 51 b is a recess having a rectangular shape in plan view formed along the direction in which the pressure chambers 41 are arranged side by side. One end portion of the second communication portion 51b in the longitudinal direction of the pressure chamber communicates with the first communication portion 51a, and the other end portion in the same direction is formed at a position corresponding to the pressure chamber 41 of the pressure chamber forming substrate 43. Has been. A plurality of ink supply ports 54 are formed in the other end portion of the second communication portion 51 b so as to penetrate the plate thickness direction corresponding to the pressure chambers 41. These ink supply ports 54 cause the common liquid chamber 51 (second communication portion 51b) and the pressure chamber 41 to communicate with each other.

  Positioning holes 61a and 61b are respectively provided at two corners of the four corners of the communication substrate 40, more specifically at corners on both sides of one side (upper side in FIG. 7) in the pressure chamber juxtaposition direction. , Each opened in a state penetrating the plate thickness direction. These positioning holes 61 a and 61 b are holes used for positioning when the communication board 40, the compliance board 42, and the case 38 are joined. In the present embodiment, one of the positioning holes 61a and 61b (the right side in FIG. 7A) positioning hole 61b also functions as a part of the atmosphere opening path. Further, a groove-shaped communication path 62 is formed on the lower surface of the communication substrate 40 from one positioning hole 61b to the other positioning hole 61a. The other end of the communication passage 62 is formed at a position overlapping the communication groove 56 of the pressure chamber forming substrate 43 in the component member stacking direction. A communication port 63 is opened in the communication path 62 at this position. Accordingly, when the communication substrate 40 and the pressure chamber forming substrate 43 are joined in a positioned state, the communication passage 62 and the communication groove portion 56 communicate with each other through the communication port 63. The communication path 62 functions as a part of the atmosphere opening path together with the positioning hole 61b. Further, the communication port 63 functions as a communication portion that allows the escape groove portion 50 and the communication groove portion 56 corresponding to the escape space portion in the present invention to communicate with the atmosphere release path.

  A compliance substrate 42 is bonded to the lower surface of the communication substrate 40. The compliance substrate 42 includes, for example, a thin compliance sheet 42a (a kind of flexible member in the present invention) such as polyphenylene sulfide resin (PPS), and a metal sheet support plate 42b that supports the compliance sheet 42a. It is a composite material consisting of As shown in FIG. 8, a sheet opening 65 that follows the outer shape of the nozzle plate 39 is formed in the center of the compliance sheet 42a. That is, in a state where the compliance substrate 42 and the nozzle plate 39 are joined to the communication substrate 40, the nozzle plate 39 is configured to be disposed in the sheet opening 65. In the compliance sheet 42a, sheet positioning holes 66a and 66b are opened at positions corresponding to the positioning holes 61a and 61b of the communication substrate 40 in a state of penetrating the sheet. Further, a vent 67 is opened at a position where the compliance sheet 42a overlaps the communication path 62 of the communication substrate 40 in the component member stacking direction. The vent 67 is a through hole that allows the vent path 71 of the sheet support plate 42 b to communicate with the communication path 62 of the communication substrate 40. As the compliance sheet 42a, for example, a very thin metal plate such as stainless steel may be used as long as the compliance sheet 42a is a flexible member that can bend according to the pressure change in the ink flow path (common liquid chamber 51). You can also.

  As shown in FIG. 9, a support plate opening 68 serving as a relief for the nozzle plate 39 is opened at the center of the sheet support plate 42b, as with the sheet opening 65 of the compliance sheet 42a. Further, support plate positioning holes 69a and 69b are formed at positions corresponding to the sheet positioning holes 66a and 66b in the sheet support plate 42b, respectively. Further, a portion corresponding to the common liquid chamber 51 of the communication substrate 40, more specifically, a compliance opening 70a penetrating the plate thickness direction on both sides of the support plate opening 68 in the direction orthogonal to the pressure chamber juxtaposition direction. , 70b are formed. These compliance openings 70 a and 70 b communicate with each other via an elongated slit-like air passage 71 extending along the opening edge of the support plate opening 68. Then, when the sheet support plate 42b and the compliance sheet 42a are joined in a state where the positioning holes 66 and 69 are aligned, the vent 67 communicates with the vent path 71.

  When the compliance substrate 42 and the communication substrate 40 are bonded in a positioned state, the opening of the common liquid chamber 51 in the communication substrate 40 is sealed by the compliance sheet 42 a of the compliance substrate 42. In this portion, since the metal sheet support plate 42b is partially removed to form the compliance opening 70a, the compliance sheet 42a in the portion is displaced (bends) according to the pressure fluctuation in the common liquid chamber 51. ) Is configured to be able to. Furthermore, as shown in FIG. 4, when the unit fixing plate 19 is bonded to the lower surface of the communication substrate 40 (the surface opposite to the bonding surface with the communication substrate 40), the lower opening of the compliance opening 70a, that is, The opening on the surface opposite to the side to which the compliance sheet 42 a is bonded is sealed by the unit fixing plate 19. Thereby, the upper and lower openings of the compliance opening 70a are respectively closed, and the compliance space 72 (corresponding to the space in the present invention) is defined. The compliance space 72 is a space separated from the common liquid chamber 51 which is a part of the liquid flow path with a compliance sheet 42a which is a flexible member interposed therebetween. The compliance space 72 communicates with the positioning hole 61 b through the air passage 71, the air vent 67, and the communication passage 62 of the communication substrate 40.

  A protective substrate 46 is disposed on the upper surface of the pressure chamber forming substrate 43 on which the piezoelectric element 45 is formed. The protective substrate 46 is a hollow box-like member, and is made of, for example, a silicon substrate. In the central portion of the protective substrate 46, a wiring empty portion 74 penetrating in the substrate thickness direction is formed. A connection portion between the electrode wiring portion 45 a of the piezoelectric element 45 and one end portion of the flexible cable 58 is disposed in the wiring empty portion 74. Further, on the protective substrate 46, the region facing the piezoelectric element 45, more specifically, on both sides of the wiring vacant portion 74 in the direction orthogonal to the direction in which the pressure chambers are juxtaposed, does not hinder driving of the piezoelectric element 45. A sealing space 75 having a size is formed. The sealing space 75 is a space formed from the lower surface of the protective substrate 46 (bonding surface with the pressure chamber forming substrate 43) to the upper surface side to the middle of the substrate thickness direction. These sealing spaces 75 communicate with each other via an elongated groove-like passage 76 extending along the opening edge of the wiring cavity 74. The groove-shaped passage 76 is a groove-shaped empty portion formed from the lower surface of the protective substrate 46 toward the upper surface side to the middle in the substrate thickness direction. When the protective substrate 46 is bonded to the pressure chamber forming substrate 43 on which the piezoelectric element 45 is formed, the electrode wiring portion 45a of the piezoelectric element 45 faces in the wiring empty portion 74, and sealing is performed. Each piezoelectric element 45 is accommodated in the space 75. The groove-shaped passage 76 is provided with a through hole 57 that penetrates the protective substrate 46, and the through hole 57 communicates with the wiring cavity 74. Therefore, the sealing space 75 is communicated with the atmosphere via the groove-shaped passage 76, the through hole 57, the wiring void 74, and the wiring through hole 34.

  The nozzle plate 39 is a plate material in which a plurality of nozzles 47 are opened in a row at a pitch corresponding to the dot formation density. In the present embodiment, a nozzle row (a kind of nozzle group) is configured by arranging 360 nozzles 47 at a pitch corresponding to 360 dpi. In the present embodiment, two nozzle rows are formed on the nozzle plate 39. The nozzle plate 39 in the present embodiment is made from a silicon substrate. A cylindrical nozzle 47 is formed by performing dry etching on the substrate. The vertical and horizontal dimensions of the nozzle plate 39 are larger than the vertical and horizontal dimensions of the sheet opening 65 of the compliance substrate 42, the support plate opening 68, the opening 19 ′ of the unit fixing plate 19, and the opening 20 ′ of the head cover 20. It is set small. When the nozzle plate 39 is joined in a state of being positioned with respect to the communication substrate 40, the nozzle plate 39 is arranged in the openings 65, 68, 19 ', 20'. In this state, the nozzle communication path 53 of the communication substrate 40 and the nozzle 47 of the nozzle plate 39 communicate with each other.

  The case 38 is a box-shaped member made of synthetic resin, and the communication substrate 40 is bonded to the lower surface side thereof. A through space 78 (a part of the wiring space) is formed in a central portion of the case 38 so as to penetrate the height direction of the case 38. The through space 78 communicates with the wiring space 74 of the protective substrate 46 to form a space in which the flexible cable 58 is accommodated. In addition, an accommodation space 79 that is retracted from the lower surface to the middle of the height direction of the case 38 is formed on the lower surface side of the case 38. The accommodating space 79 can accommodate the pressure chamber forming substrate 43, the piezoelectric element 41, the protective substrate 46 and the like on the communicating substrate 40 in a state where the case 38 and the communicating substrate 40 are positioned and joined. Is set to the size of The lower end of the penetrating void 78 is open to the ceiling surface of the accommodating void 79.

  The case 38 is formed with a case flow path 37 that penetrates the height direction of the case 38. The case flow path 37 is formed at a position outside the housing empty portion 79 in the case 38 in the direction perpendicular to the pressure chamber juxtaposition direction. More specifically, a total of two case flow paths 37 are formed, one on each side of the accommodation cavity 79, corresponding to each common liquid chamber 51 of the communication substrate 40. In the state where the communication substrate 40 is bonded to the case 38, each case channel 37 communicates with the corresponding common liquid chamber 51. Further, although not shown, the case 38 is provided with a positioning hole used for relative positioning of the communication substrate 40 and the compliance substrate 42. And in the assembly process of the head unit 13, the positioning pin of the jig | tool which is not shown in figure is each penetrated to the positioning hole of each structural member, and the relative position of each structural member is prescribed | regulated. Since each component member has two positioning holes, positioning between the component members can be performed with higher accuracy by using two corresponding positioning pins.

  Moreover, in the state assembled in the state where each component member is positioned, each positioning hole is connected in series. Hereinafter, the state in which the positioning holes are connected is referred to as a positioning communication hole (corresponding to a through hole in the present invention). The head unit 13 of this embodiment has a total of two positioning communication holes. In the present embodiment, one of the positioning communication holes, specifically, the positioning communication holes formed by connecting the positioning holes 61b, 66b, 69b and the positioning holes of the case 38 in series are open to the atmosphere. It functions as part of the road and communicates with the atmosphere. In this way, by using the positioning communication hole as a part of the atmosphere opening path, it is not necessary to separately provide a through hole for the atmosphere opening path and a through hole for positioning, which contributes to downsizing of the recording head 3.

  FIG. 10 is a block diagram illustrating the air release path in the present embodiment. One positioning communication hole (positioning communication hole including the positioning hole 61 b) formed by positioning the constituent members is connected to the relief clearances 50 and 56 for the adhesive and the compliance space 72 through the communication path 62. Has been. A moisture permeation resistance portion 80 that provides resistance to moisture passage is provided in the middle of the air release path using the positioning communication hole, like the meandering path 27 described above. In the present embodiment, the communication port 63, which is a communication portion between the escape gaps 50 and 56 and the communication path 62, is sealed with the sealing material 81 during the manufacturing process of the head unit 13. Further, as described above, the wiring through-hole 34, the holder opening 18a, the through space 78, and the wiring space 74, which are wiring spaces, are also communicated with the atmosphere via the meandering path 27. The sealing space 75 is communicated with the atmosphere via the meandering path 27 in the same manner as the wiring space. Note that gaps between components, such as a gap between the unit holder 18 in the recording head 3 and the case 38 of the head unit 13, can also function as part of the air release path.

Next, a process of manufacturing the head unit 13 having the above configuration will be described with reference to FIG.
First, after an elastic film 44 and an insulating film are sequentially formed on the upper surface of the pressure chamber forming substrate 43, the piezoelectric element 45 is formed by firing. On top of this, the protective substrate 46 is bonded by an adhesive in a state where the piezoelectric element 45 is accommodated in the sealing space 75. Next, the communication substrate 40 is bonded to the lower surface of the pressure chamber forming substrate 43 with an adhesive in a state where the pressure chamber 41 and the nozzle communication passage 53 communicate with each other and the pressure chamber 41 and the ink supply port 54 communicate with each other (this book). Equivalent to the first step in the invention). In addition, the nozzle plate 39 is bonded to the lower surface of the communication substrate 40 with an adhesive in a state where the nozzle communication path 53 and the nozzle 47 communicate with each other. Hereinafter, the assembled state is referred to as an actuator assembly (corresponding to the assembly in the present invention) (FIG. 11A). The adhesive between the pressure chamber forming substrate 43 and the communication substrate 40 is transferred in advance to a region other than the pressure chamber 41, the escape groove portion 50, and the communication groove portion 56 on the lower surface of the pressure chamber forming substrate 43, for example. In the first step, the actuator assembly is placed in a high temperature atmosphere (for example, 100 ° C. to 150 ° C.) to accelerate the curing of the adhesive.

  Here, in the first step, the escape groove portion 50 provided in the pressure chamber forming substrate 43 is opened to the atmosphere by the communication passage 62 and the positioning hole 61 b through the communication groove portion 56 and the communication port 63. For this reason, excess adhesive when the pressure chamber forming substrate 43 and the communication substrate 40 are joined can be guided to the escape groove portion 50 and the communication groove portion 56. Thereby, it is suppressed that an adhesive agent penetrates into the flow path side of the pressure chamber 41 or the like. Further, even when the temperature rises at the time of curing of the adhesive or when gas (degas) is generated from the adhesive, the internal pressure of the escape groove 50 is prevented from increasing. Thereby, it can suppress that the adhesion part of the pressure chamber formation board | substrate 43 and the communication board | substrate 40 peels resulting from the raise of the internal pressure of the escape space parts 50 and 56. FIG. Further, in the step after the first step, assembly of components including synthetic resin components such as the case 38 and the compliance sheet 42a of the compliance substrate 42 (directly or indirectly to the actuator assembly). Therefore, the temperature applied at the time of curing of the adhesive is lower than the temperature at the time of curing of the adhesive between the pressure chamber forming substrate 43 and the communication substrate 40 than at the above step, and is 25 ° C. Set to ~ 180 ° C. Although the lower limit is 25 ° C., the adhesive may be cured without being placed in a high temperature atmosphere. For this reason, there is little possibility that the internal pressure of the escape groove part 50 will rise. In view of this point, in the present embodiment, at the stage where the first step is finished (at the stage where the work of accelerating the curing of the adhesive is completed at a high temperature), the escape clearance for the adhesive (the relief groove 50 and A communicating portion between the through groove portion 56) and the atmosphere opening path is sealed with a sealing material 81 such as an adhesive (corresponding to a sealing step in the present invention).

  FIG. 12 is a cross-sectional view of the actuator assembly in the direction along the communication groove portion 56 of the pressure chamber forming substrate 43 and the communication passage 62 of the communication substrate 40. As shown in the figure, the sealing process in the present embodiment includes a communication groove 56 that also functions as an escape space for the adhesive, a communication path 62 that functions as a part of the air release path, and a positioning hole 61b. The communication part, specifically, the opening part on the communication path 62 side of the communication port 63 is closed by the sealing material 81. The communication port 63 is also an end portion on the side communicating with the atmosphere opening path of the escape space. As this sealing material 81, an adhesive, other sealing materials, etc. can be used, and what has high moisture resistance and inhibits permeation of moisture is more desirable. Such a sealing material 81 functions as a moisture permeation resistance portion in the present invention, and prevents moisture (water vapor) from passing between the escape space side and the atmosphere communication path side.

  After the sealing step, subsequently, one end of the flexible cable 58 is electrically connected to the electrode wiring part 45a of the piezoelectric element 45 in the wiring empty part 74 of the protective substrate 46 by a conductive adhesive or the like. Further, as shown in FIG. 11B, the case 38, the actuator assembly, and the compliance board 42 are inserted into the positioning holes of the respective constituent members by inserting the positioning pins of the jigs, so that the relative positions of the respective constituent members are increased. These members are joined with an adhesive in a state in which a proper position is defined (corresponding to the second step in the present invention). Thereby, the opening of the common liquid chamber 51 in the communication substrate 40 is sealed by the compliance sheet 42 a of the compliance substrate 42. The nozzle plate 39 of the actuator assembly is disposed in the openings 65 and 68 of the compliance substrate 42. Further, the protective substrate 46, the piezoelectric element 45, the pressure chamber forming substrate 43 and the like are accommodated in the accommodating space 79 of the case 38, and the case flow path 37 and the common liquid chamber 51 communicate with each other. As described above, since the compliance sheet 42a of the case 38 and the compliance substrate 42 is made of synthetic resin, the temperature applied when the adhesive is cured is set lower than that in the first step than in the first step. Is done. Therefore, even if the escape space for the adhesive is sealed with the sealing material, the internal pressure of the escape space is suppressed from increasing. In addition, even when an actuator assembly having a different linear expansion coefficient and a synthetic resin are joined, misalignment caused by the difference in the linear expansion coefficient can be suppressed. The assembled state becomes the head knit 13. In the head unit 13, a flow path (a part of the liquid flow path in the present invention) from the common liquid chamber 51, the ink supply port 54, the pressure chamber 41, and the nozzle communication path 53 to the nozzle 47 is provided. Is equivalent).

  In this manner, in the present embodiment, four head units 13 are assembled per recording head 3. These head units 13 are joined to the unit fixing plate 19 with the nozzle plate 39 exposed from the opening 19 ′ (FIG. 11C). Thereby, the opening of the surface opposite to the side where the compliance sheet 42 a is bonded in the compliance substrate 42 is sealed by the unit fixing plate 19, thereby defining the compliance space 72. Here, the adhesive 82 is formed in a gap generated between the nozzle plate 39 and the opening edge of the opening 19 ′ of the unit fixing plate 19 and a gap generated between the nozzle plate 39 and the opening edge of the compliance substrate 42. Filled. As a result, it is possible to prevent problems such as ink entering the gap and accumulating or recording paper to be printed entering the gap.

  Each head unit 13 fixed to the unit fixing plate 19 is fixed to the unit holder 18 by the head cover 20 while being accommodated in the accommodation chamber 35. Thereafter, the circuit board 17, the seal member 31, the filter board 16, the introduction path board 15, and the needle holder 14 are sequentially assembled on the unit holder 18, and the assembled state is the recording head 3. Thereby, the case flow path 37 in the head unit 13 communicates with the holder flow path 29 of the unit holder 18, and the ink introduced from the ink cartridge 7 through the introduction needle 22 is introduced to the head unit 13 side through the holder flow path 29. It will be in a state to be. A series of channels from the needle channel 22a of the introduction needle 22 to the nozzle 47 corresponds to the liquid channel in the present invention.

  Further, the through space 78 in the case 38 of the head unit 13 communicates with the holder opening 18 a of the unit holder 18. Thereby, the wiring empty part 74 of the head unit 13 communicates with the atmosphere through a path different from the atmosphere communication path using the positioning communication hole. This path functions as an air opening path for wiring space in the present invention. Thereby, the heat generated in the wiring space can be dissipated through the air opening path for wiring space. Since the above-described meandering path 27 is provided in the middle of the wiring space air opening path, the moisture outside the recording head 3 passes through the air opening path, and the wiring through hole 34 that is the wiring space, the holder It is possible to prevent the opening 18a, the through space 78, the wiring space 74, and the sealing space 75 communicating with the wiring space from entering.

  As described above, in the recording head 3 according to the present invention, the escape space for the adhesive (the escape groove 50 and the communication groove 56), the communication path 62 and the positioning hole 61b that function as a part of the atmosphere release path, By closing the opening portion of the communication port 63, which is a communication portion of the liquid, with the sealing material 81, the moisture in the ink in the common liquid chamber 51 passes through the compliance sheet 42a and the humidity is likely to increase, and the adhesive Since the sealing material 81 blocks the state of communication with the escape clearance for adhesive (where the clearance groove 50 and the communication groove 56) are introduced, the moisture in the compliance space 72 is on the escape clearance 50, 56 side. Is prevented from entering. As a result, the humidity in the vicinity of the escape gaps 50 and 56 is prevented from increasing and the adhesive force is reduced, and it is possible to ensure adhesion reliability. As a result, it is possible to prevent problems due to a decrease in adhesive force, for example, leakage of ink in the ink flow path, and intrusion into the mounting space for electrical wiring and electrical components, thereby preventing problems such as short circuits and breakdowns. . The sealing step is performed after the pressure chamber forming substrate 43 and the communication substrate 40 are joined in a state in which the escape voids 50 and 56 are open to the atmosphere, and the curing of the adhesive is accelerated at a high temperature (first). In the first step, excess adhesive when the pressure chamber forming substrate 43 and the communication substrate 40 are joined can be positively guided to the escape spaces 50 and 56 in the first step. . Thereby, it is suppressed that an adhesive agent penetrates into the flow path side of the pressure chamber 41 or the like. Furthermore, even if the hardening of the adhesive is accelerated at a high temperature in the first step, it is possible to prevent the internal pressure of the clearance gaps 50 and 56 from increasing. Thereby, it can suppress that the adhesion part of the pressure chamber formation board | substrate 43 and the communication board | substrate 40 peels resulting from the raise of the internal pressure of the escape space parts 50 and 56. FIG. Further, by using the sealing material 81 such as an adhesive, the communication port 63 between the escape space portions 50 and 56 and the communication passage 62 can be easily sealed.

  Further, in the present embodiment, the communication part 63 penetrates the communication board 40 from the escape space parts 50 and 56 side, reaches the surface opposite to the joint surface, and communicates with the atmosphere release path. Since the communicating portion with the communication passage 62 is sealed by the sealing material 81, the escape space, in particular, the overall length of the communication groove 56 can be suppressed, so that the pressure chamber forming substrate 43 is broken from the communication groove 56. It becomes possible to suppress defects. That is, in the present embodiment, the rigidity of the pressure chamber forming substrate 43 is suppressed from significantly decreasing.

  By the way, the present invention is not limited to the above-described embodiment, and various modifications can be made based on the description of the scope of claims.

  In the above-described embodiment, the configuration in which the escape clearances 50 and 56 for the adhesive and the compliance space 72 are opened to the atmosphere through a common atmosphere release path is exemplified, but the present invention is not limited thereto. For example, as in the second embodiment shown in FIG. 13 and FIG. 15, it is possible to make the atmosphere release path for the escape spaces 50 and 56 and the atmosphere release path of the compliance space 72 different from each other. is there. In the second embodiment, with respect to the compliance space 72, as in the first embodiment, one positioning communication hole (first atmosphere opening path) including the communication path 62 and the positioning hole 61b of the communication board 40 is used. In contrast, the escape air spaces 50 and 56 are not communicated with the communication passage 62, but the communication groove portion 56 extends to the side edge of the pressure chamber forming substrate 43 and communicates with the atmosphere. This is different from the first embodiment. Specifically, the communication groove portion 56 opens to the side surface of the head unit 13 and communicates with the housing empty portion 79 of the case 38, and further, a gap between constituent members of the recording head 3 (for example, a unit in the recording head 3). Through a gap between the holder 18 and the case 38 of the head unit 13) and the like, and communicates with the atmosphere via the moisture permeation resistance portion 80 ′. This route corresponds to the second atmosphere opening passage in the present invention. As in the first embodiment, the pressure chamber forming substrate 43 and the communication substrate 40 are joined in a state in which the escape spaces 50 and 56 are open to the atmosphere, and the curing of the adhesive is accelerated at a high temperature. After that (after the first step), the opening portion at the side edge of the pressure chamber forming substrate 43 of the communication groove portion 56, that is, the end portion of the escape space portion on the atmosphere communication side is sealed with the sealing material 81. In the second embodiment, the same operational effects as in the first embodiment are obtained. Other configurations are the same as those in the first embodiment.

  Further, in the third embodiment shown in FIGS. 14 and 16, the communication passage 62 in the communication substrate 40 is connected to two mutually independent passages, specifically, the first positioning communication hole 62a. The second communication path 62b communicated with the communication path 62a and the one positioning hole 61b, and the escape space portions 50 and 56 are communicated with the first communication path 62a through the communication port 63, while the compliance space 72 is The point which is made to communicate with the 2nd communicating path 62b differs from said each embodiment. The escape spaces 50 and 56 and the compliance space 72 are opened to the atmosphere through different paths through the positioning holes 61a and 62b, respectively. That is, the atmosphere opening path including one positioning hole 61b corresponds to the first atmosphere opening path in the present invention, and the atmosphere opening path including the other positioning hole 61a corresponds to the second atmosphere opening path in the present invention. In the third embodiment, the same operational effects as in the first embodiment are obtained. Other configurations are the same as those in the first embodiment.

  In the fourth embodiment shown in FIG. 17, a resistance passage 84 that inhibits the passage of moisture is provided between the communication passage 62 that is a part of the atmosphere opening passage and the escape spaces 50 and 56. This is different from the above embodiments. Similarly to the meandering path 27, the resistance passage 84 has a passage cross-sectional area and a total length determined so as to inhibit the passage of moisture (water vapor), in other words, resistance to the passage of moisture. It is a passage. The resistance passage 84 suppresses moisture on the compliance space 72 side from entering the escape spaces 50 and 56 side. According to the fourth embodiment, it is possible to maintain the atmospheric communication state of the escape spaces 50 and 56 while suppressing the moisture in the compliance space 72 from entering the escape spaces 50 and 56 side. For this reason, for example, even if the ambient temperature around the recording head 3 is increased, the internal pressure of the escape air spaces 50 and 56 is suppressed from increasing. Moreover, the sealing process by said sealing material 81 can be skipped. Other configurations are the same as those in the first embodiment.

  In the fifth embodiment shown in FIG. 18, the air passage 71 of the sheet support plate 42b is communicated with one positioning hole 69b. That is, the present embodiment is different from the above embodiments in that the compliance space 72 is opened to the atmosphere by the atmosphere opening path including the positioning hole 69b without passing through the communication path 62 on the side of the communication board 40. . For this reason, the vent 67 in the compliance sheet 42a becomes unnecessary. Other configurations are the same as those in the first embodiment.

In each of the above embodiments, the configuration in which the escape spaces 50 and 56 are provided on the pressure chamber forming substrate 43 side is illustrated, but the present invention is not limited to this, and a configuration in which the clearance space portions 50 and 56 are provided on the communication substrate 40 side can also be adopted. It is.
Further, the escape spaces 50 and 56 may be formed in a state of penetrating the substrate.
And the escape space parts 50 and 56 should just interpose a permeation | transmission resistance part with respect to the space where water | moisture content easily enters, and about an air release path, it is not restricted to what was illustrated by said each embodiment. .

  In the above description, the ink jet recording head 3 (head unit 13), which is a type of liquid ejecting head, has been described as an example. However, in the present invention, constituent members that define the liquid flow path are made of an adhesive. The present invention can also be applied to other liquid ejecting heads that employ the configuration. For example, a color material ejecting head used for manufacturing a color filter such as a liquid crystal display, an electrode material ejecting head used for forming an electrode such as an organic EL (Electro Luminescence) display, FED (surface emitting display), a biochip (biochemical element) The present invention can also be applied to bioorganic matter ejecting heads and the like used in the production of

  DESCRIPTION OF SYMBOLS 1 ... Printer, 3 ... Recording head, 13 ... Head unit, 14 ... Needle holder, 15 ... Introduction path board, 16 ... Filter board, 17 ... Circuit board, 18 ... Unit holder 18, 19 ... Unit fixing plate, 21 ... Air | atmosphere Open port, 26 ... atmosphere communication path, 27 ... meandering path, 29 ... holder flow path, 31 ... seal member, 34 ... through hole for wiring, 35 ... housing chamber, 37 ... case flow path, 38 ... case, 39 ... nozzle Plate, 40 ... Communication substrate, 41 ... Pressure chamber, 42 ... Compliance substrate, 43 ... Pressure chamber forming substrate, 44 ... Elastic film, 45 ... Piezoelectric element, 46 ... Protection substrate, 47 ... Nozzle, 50 ... Escape groove, 51 ... Common liquid chamber, 53 ... nozzle communication path, 54 ... ink supply port, 56 ... communication groove, 57 ... through hole, 58 ... flexible cable, 61 ... positioning hole, 62 ... communication path, 63 ... communication , 66 ... Sheet positioning hole, 67 ... Ventilation hole, 69 ... Support plate positioning hole, 70 ... Ventilation path, 72 ... Compliance space, 74 ... Wiring space, 75 ... Sealing space, 76 ... Groove-shaped passage, 78 ... Through Empty part, 79 ... Accommodating empty part, 80 ... Moisture permeation resistance part, 81 ... Sealing material

Claims (17)

A first substrate;
A second substrate bonded to the first substrate by an adhesive;
A liquid flow path communicating with a nozzle from which liquid is ejected;
A pressure chamber provided in the middle of the liquid flow path;
A pressure generating section for causing a pressure change in the liquid in the pressure chamber;
A flexible member that bends in response to a pressure change in the liquid channel;
A space separated from the liquid flow path with the flexible member interposed therebetween,
An air opening path for opening the space to the atmosphere;
With
By joining the first substrate and the second substrate, at least a part of the liquid flow path is defined, and the opening of the defined liquid flow path is formed by the flexible member. A sealed liquid jet head,
In at least one of the first substrate and the second substrate, a clearance space that is opened in a bonding surface with the other substrate is formed,
An adhesive layer is interposed between the escape space and the partial flow path,
A liquid ejecting head, wherein a moisture permeation resistance portion is interposed between the escape space portion and the air release path.   The liquid ejecting head according to claim 1, wherein a communication portion that communicates between the escape space and the atmosphere opening path is sealed with a sealing material as the moisture permeation resistance portion. The communication portion passes through either the first substrate or the second substrate from the escape space side of the bonding surface of the one substrate and reaches a surface different from the bonding surface side to release the atmosphere. Communicate with the road,
The liquid ejecting head according to claim 2, wherein the sealing material seals a communication portion between the communication portion and the atmosphere opening path.   2. The liquid jet head according to claim 1, wherein a resistance passage that inhibits passage of moisture is formed as the moisture permeation resistance portion between the escape space and the atmosphere opening path.   5. The air release path includes a through-hole extending over a plurality of constituent members including an assembly formed by joining the first substrate and the second substrate. The liquid jet head according to one item.   The liquid ejecting head according to claim 5, wherein a plurality of sets of the through holes are provided. A first substrate;
A second substrate bonded to the first substrate by an adhesive;
A liquid flow path communicating with a nozzle from which liquid is ejected;
A pressure chamber provided in the middle of the liquid flow path;
A pressure generating section for causing a pressure change in the liquid in the pressure chamber;
A flexible member that bends in response to a pressure change in the liquid channel;
A space separated from the liquid flow path with the flexible member interposed therebetween,
An air opening path for opening the space to the atmosphere;
With
By joining the first substrate and the second substrate, at least a part of the liquid flow path is defined, and the opening of the defined liquid flow path is formed by the flexible member. A sealed liquid jet head,
In at least one of the first substrate and the second substrate, a clearance space that is opened in a bonding surface with the other substrate is formed,
An adhesive layer is interposed between the escape space and the partial flow path,
The liquid ejecting head, wherein the escape space is opened to the atmosphere through a second atmosphere opening path that is independent of the first atmosphere opening path.   The first atmosphere opening path and the second atmosphere opening path each include a through hole extending over a plurality of constituent members including an assembly formed by joining the first substrate and the second substrate. The liquid jet head according to claim 7.   8. The liquid according to claim 7, wherein an end portion of the joint surface of the one substrate on the side communicating with the second atmosphere opening path of the escape space is sealed with a sealing material. Jet head. A wiring space for accommodating a joint portion between a wiring member for applying a driving signal to the pressure generating unit and an electrode unit of the pressure generating unit;
The liquid ejecting head according to claim 1, further comprising a wiring space air opening path that opens the wiring space to the air.   The liquid ejecting head according to claim 10, wherein the wiring space atmosphere opening path includes a wiring space resistance path that inhibits passage of moisture.   A liquid ejecting apparatus comprising the liquid ejecting head according to claim 1. A first substrate, a second substrate bonded to the first substrate by an adhesive, a liquid channel communicating with a nozzle from which liquid is ejected, and a pressure provided in the middle of the liquid channel A pressure generating section that causes a pressure change in the liquid in the pressure chamber, a flexible member that bends in response to a pressure change in the liquid flow path, and the liquid flow path with the flexible member interposed therebetween. A space separated from each other; an air opening path for opening the space to the atmosphere; and at least one of the first substrate and the second substrate, and a clearance space opened at a bonding surface with the other substrate; And the first substrate and the second substrate are joined together to define at least a part of the liquid channel, and the opening of the defined partial channel is the flexible A method of manufacturing a liquid jet head sealed by a member,
A first step of joining the first substrate and the second substrate with an adhesive to form an assembly with the escape space opened to the atmosphere;
A second step of joining the flexible member to the assembly and sealing an opening of a partial flow path in the assembly with the flexible member;
Have
After the first step, before the second step, a liquid step is performed in which a sealing step of sealing the communication portion between the escape space portion and the air release path with a sealing material is performed. Manufacturing method of the head. The first substrate and the second substrate are composed of a silicon substrate,
The method of manufacturing a liquid jet head according to claim 13, wherein the temperature of the atmosphere in the first step is higher than the temperature of the atmosphere in the second step.   The method of manufacturing a liquid jet head according to claim 14, wherein after the first step, a step of directly or indirectly joining a synthetic resin component to the assembly is performed. The atmosphere opening path includes a through hole extending over a plurality of components including the assembly,
The step of joining the constituent members with each other in a state where the constituent members are mutually positioned using the through holes after the first step. A manufacturing method of the liquid jet head according to the above.   The method of manufacturing a liquid jet head according to claim 16, wherein the step of joining the component members in a positioned state is performed after the sealing step.

Images