JP2015230279A5 - - Google Patents

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Publication number
JP2015230279A5
JP2015230279A5 JP2014117730A JP2014117730A JP2015230279A5 JP 2015230279 A5 JP2015230279 A5 JP 2015230279A5 JP 2014117730 A JP2014117730 A JP 2014117730A JP 2014117730 A JP2014117730 A JP 2014117730A JP 2015230279 A5 JP2015230279 A5 JP 2015230279A5
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JP
Japan
Prior art keywords
control system
previously described
advances
executes
starts
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JP2014117730A
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Japanese (ja)
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JP6180372B2 (en
JP2015230279A (en
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Priority to JP2014117730A priority Critical patent/JP6180372B2/en
Priority claimed from JP2014117730A external-priority patent/JP6180372B2/en
Priority to DE102015108721.9A priority patent/DE102015108721B4/en
Publication of JP2015230279A publication Critical patent/JP2015230279A/en
Publication of JP2015230279A5 publication Critical patent/JP2015230279A5/ja
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Description

S208において、制御系5Aは、先に説明した(e)電流波形解析動作を実行する。
S209において、制御系5Aは、先に説明した(f)短絡量測定動作を開始する。具体的には、制御系5Aは、ステップS210に処理を進める。
In S208, the control system 5A executes the previously described (e) current waveform analysis operation.
In S209, control system 5A starts the previously described (f) a short circuit resistance measuring operation. Specifically, control system 5A advances the process to step S210.

JP2014117730A 2014-06-06 2014-06-06 Semiconductor element inspection method and inspection apparatus Active JP6180372B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014117730A JP6180372B2 (en) 2014-06-06 2014-06-06 Semiconductor element inspection method and inspection apparatus
DE102015108721.9A DE102015108721B4 (en) 2014-06-06 2015-06-02 Examination method and examination device for a semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014117730A JP6180372B2 (en) 2014-06-06 2014-06-06 Semiconductor element inspection method and inspection apparatus

Publications (3)

Publication Number Publication Date
JP2015230279A JP2015230279A (en) 2015-12-21
JP2015230279A5 true JP2015230279A5 (en) 2016-11-24
JP6180372B2 JP6180372B2 (en) 2017-08-16

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ID=54549025

Family Applications (1)

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JP2014117730A Active JP6180372B2 (en) 2014-06-06 2014-06-06 Semiconductor element inspection method and inspection apparatus

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JP (1) JP6180372B2 (en)
DE (1) DE102015108721B4 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102469942B1 (en) * 2016-04-19 2022-11-22 엘에스일렉트릭(주) Apparatus for determining parameter when estimating temperature of switching element in inverter

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5764179A (en) * 1980-10-06 1982-04-19 Mitsubishi Electric Corp Testing method for semiconductor device
JP2005345247A (en) * 2004-06-02 2005-12-15 Toyota Motor Corp Method for evaluating semiconductor element
JP5045325B2 (en) 2007-09-14 2012-10-10 トヨタ自動車株式会社 Transistor inspection method and inspection apparatus
JP5258810B2 (en) 2010-02-17 2013-08-07 三菱電機株式会社 Semiconductor device testing equipment
US9759763B2 (en) * 2011-07-28 2017-09-12 Integrated Technology Corporation Damage reduction method and apparatus for destructive testing of power semiconductors

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