JP2015224896A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component capable of reducing noise contained in an output signal.SOLUTION: An electronic component includes: an upper substrate U provided with a stationary portion having a taper-like open hole H; a lower substrate L configured to define a space with the upper substrate U; an angular velocity sensor 1 whose tip portion is located in the space and displaceable; a conductive material 20 that is filled in the open hole H and electrically connected with the angular velocity sensor 1; and an electrode film 21 configured to cover the exposed surface of the conductive material. The cross section perpendicular to the axial direction of the open hole H gradually decreases toward the electrode film 21 from the angular velocity sensor 1.

Description

  The present invention relates to an electronic component including a movable element such as a piezoelectric element.

  Patent Document 1 and Patent Document 2 disclose an inexpensive and highly reliable semiconductor capacitive acceleration sensor by forming a good wiring pattern without disconnection. Further, in an electronic component having a movable element such as a piezoelectric element, one end of the movable element is fixed to the substrate, the movable part on the tip side is displaced, and the output signal from the movable element changes according to the amount of displacement. When detecting the amount of displacement due to the Coriolis force acting on the piezoelectric element while vibrating the piezoelectric element, the electronic component becomes an angular velocity sensor.

  Thus, when an electronic component such as an acceleration sensor or an angular velocity sensor has a movable part such as a supported mass body, an operation detected by the displacement of the movable part can be converted into an electrical signal and taken out.

  In the case of a structure in which the movable element is sealed by a substrate bonding process or the like, it is conceivable to use a through wiring to take out an electric signal.

Japanese Patent No. 4671699 Patent No. 5236712

  However, in the case of electronic components of the type described above, it has been found that the electrical signal output from the movable element contains noise. An object of this invention is to provide the electronic component which can reduce the noise contained in an output signal.

  As a result of intensive studies by the inventors of the present invention regarding the above-mentioned causes, the cause of noise generation has been found. That is, it has been found that the noise signal is generated because the vibration of the movable element is transmitted through the through wiring and vibrates the bonding wire.

  Therefore, an electronic component according to the present invention includes a first member having a fixing portion having a through hole, and a second member that is disposed to face the first member and that defines a space between the first member and the first member. A movable element partly sandwiched and fixed between the fixed part of the first member and the second member, the tip part of which is located in the space and displaceable, and the inside of the through hole And a conductive material electrically connected to the movable element, and an electrode film made of a material different from the conductive material and covering an exposed surface of the conductive material, the axial direction of the through hole The cross-sectional area perpendicular to is smaller as it goes from the movable element toward the electrode film.

  As the cross-sectional area (diameter) perpendicular to the axial direction of the through hole decreases from the movable element toward the electrode film (on the outside of the element), vibration that causes noise is suppressed and vibration is transmitted through the through hole. Attenuating as it travels through the conductive material inside, the leakage of vibration to the outside is reduced. Furthermore, since the electrode film covers the exposed surface of the conductive material, vibration of the conductive material is suppressed, and deterioration (disconnection, etc.) of wiring such as a bonding wire connected to the electrode film can be suppressed.

  The interface between the conductive material and the electrode film is preferably flat. That is, the surface of the conductive material can be planarized by polishing or the like, and the electrode film formed thereon can also be planarized. The flattened electrode film has less variation in electrical characteristics than the bent electrode film, and the material cost is low because the area is small. Since the planarized structure is simple, it is easy to reduce the size of the element.

  The movable element includes a piezoelectric element to which a driving signal is given through the conductive material, and a driving arm to which the piezoelectric element is fixed, and is provided on a detection arm mechanically coupled to the driving arm. A signal corresponding to the angular velocity is output from another piezoelectric element.

  The piezoelectric element is vibrated by an electric signal given through the conductive material, and vibrates the driving arm. The vibration of the drive arm is transmitted to the detection arm, and the vibration state is detected by another piezoelectric element. When the drive arm performs vibration including noise, the vibration is transmitted to the detection arm, and the electric signal output as the detection signal includes noise. In the present invention, the vibration of the conductive material is suppressed as described above, and noise included in the detection signal is suppressed.

  The movable element includes a piezoelectric element from which a detection signal is taken out via the conductive material, and a detection arm to which the piezoelectric element is fixed, and vibrates a drive arm mechanically coupled to the detection arm. In this case, a signal corresponding to an angular velocity is output from the piezoelectric element provided on the detection arm. Since vibration of the piezoelectric element provided on the detection arm is difficult to be transmitted to the outside through the conductive material and the electrode film, noise included in the detection signal is suppressed.

  According to the electronic component of the present invention, it is possible to reduce noise included in the output signal.

It is a figure which shows the longitudinal cross-section structure of an angular velocity detection apparatus. It is a figure which shows the longitudinal cross-section structure of an angular velocity detection apparatus. It is a top view of the board | substrate used for an angular velocity sensor. It is a perspective view of an angular velocity sensor. It is a top view of an angular velocity sensor. It is a graph which shows the relationship between the vibration frequency (Hz) of a piezoelectric element, and the displacement amount (m) of a bonding wire.

  Hereinafter, an angular velocity detection device will be described as an example of the electronic component according to the embodiment. Note that the same reference numerals are used for the same elements, and redundant description is omitted.

  FIG. 2 is a diagram illustrating a vertical cross-sectional configuration of the angular velocity detection device, and FIG. 1 is a diagram illustrating a configuration on the drive arm side of the angular velocity sensor illustrated in FIG. 2. The angular velocity sensor of this example is an H type, and the H type angular velocity sensor includes a drive arm that generates vibration and a detection arm that performs detection. In the case of a U-shaped angular velocity sensor or a rod-shaped I-shaped angular velocity sensor, only the configuration in FIG. 1 is used, and the functions of the drive arm and the detection arm can be combined and the detection signal can be extracted from the piezoelectric element. is there.

  Referring to FIG. 1, the angular velocity detection device of the present example includes a lower substrate L and an upper substrate U for sealing, and an angular velocity sensor 1 sandwiched between the lower substrate L and the upper substrate U. Yes.

  On the driving side, a recess 30 is formed on the upper surface of the lower substrate L, and a recess 31 is formed on the lower surface of the upper substrate U. The recess 30 and the recess 31 face each other to form a space. ing.

  The angular velocity sensor 1 includes a base 5 and a drive arm 3 extending in the Y-axis direction continuously to the base 5, and these are a part of a substrate 2 made of silicon (Si). That is, the substrate 2 is sandwiched between the lower substrate L and the upper substrate U, and an etching process is performed so that a region in the space (30, 31) between the lower substrate L and the upper substrate U is It is processed into an arm shape (see FIGS. 3 and 4). The periphery of the substrate 2 constitutes a rectangular frame-shaped joint portion 17, and the joint portion 17 is sandwiched and fixed between the lower substrate L and the upper substrate U.

  A piezoelectric element 6 is fixed to the base end side of the drive arm 3. The piezoelectric element 6 includes a first electrode film 6a, a second electrode film 6c, and a piezoelectric film 6b sandwiched between the first electrode film 6a and the second electrode film 6c. .

  The second electrode film 6 c of the piezoelectric element 6 is electrically connected to the upper electrode pad portion 8 on the base portion 5. The first electrode film 6 a is electrically connected to the lower electrode pad portion 14 (see FIG. 4) on the base portion 5.

  A tapered conductive material 20 is located on the upper electrode pad portion 8. The conductive material 20 is located in a through hole H provided in the fixed portion of the upper substrate U, and the exposed surface of the conductive material 20 is covered with an electrode film 21. A bonding wire 22 is bonded to the electrode film 21.

  The above is the structure on the drive side of the angular velocity sensor, but the structure on the detection side shown on the left side of FIG. 2 is the same as the structure on the drive side.

  Referring to FIG. 2, also on the detection side, a recess 30A is formed on the upper surface of the lower substrate L, and a recess 31A is formed on the lower surface of the upper substrate U. The recess 30A and the recess 31A are opposed to each other. And form a space.

  The angular velocity sensor 1 includes a base 5 and a detection arm 3A extending in the Y-axis direction continuously to the base 5, and these are part of a substrate 2 made of silicon (Si). That is, the substrate 2 is sandwiched between the lower substrate L and the upper substrate U, and an etching process is performed so that a region in the space (30, 31) between the lower substrate L and the upper substrate U is Also on the detection side, it is processed into an arm shape (see FIGS. 3 and 4).

  A piezoelectric element 6A is fixed to the base end side of the detection arm 3A. The structure of the piezoelectric element 6A is the same as that of the piezoelectric element 6, and is between the first electrode film 6a, the second electrode film 6c, and the first electrode film 6a and the second electrode film 6c. And a sandwiched piezoelectric film 6b.

  The second electrode film 6 c of the piezoelectric element 6 A is electrically connected to the upper electrode pad portion 8 A on the base portion 5. The first electrode film 6 a is electrically connected to the lower electrode pad portion 14 (see FIG. 4) on the base portion 5.

  A tapered conductive material 20A is located on the upper electrode pad portion 8A. The conductive material 20A is located in the through hole H provided in the fixed portion of the upper substrate U, and the exposed surface of the conductive material 20A is covered with the electrode film 21A. A bonding wire 22A is bonded to the electrode film 21A.

  FIG. 3 is a plan view of the substrate 2 used in the angular velocity sensor.

  The substrate 2 includes a pair of drive arms 3 extending continuously from the base 5, a pair of detection arms 3 </ b> A extending in a direction opposite to the drive arms 3, and a frame-shaped joint portion 17. The distal ends of the drive arm 3 and the detection arm 3A are movable parts and can vibrate. A portion on the distal end side of the drive arm 3 is located in a space formed between the concave portion 30 and the concave portion 31, and a portion on the distal end side of the detection arm 3A is formed between the concave portion 30A and the concave portion 31A. Is located in the designated space.

  In addition, although the base 5 and the junction part 17 may be continuing via the connection part 57, they do not need to be continuing.

  As described above, the electronic component (angular velocity detection device) described above is disposed to face the first member (upper substrate U) including the fixing portion having the through hole H, the first member, Between the second member (lower substrate L) that defines the space (30, 31, 30A, 31A) and the first member fixing portion and the second member, and is fixed, A movable element (angular velocity sensor 1) whose distal end portion is positioned and displaceable in the space, a conductive material (20, 20A) filled in the through-hole H and electrically connected to the movable element, An electrode film (21, 21A) made of a material different from the conductive material (20, 20A) and covering the exposed surface of the conductive material (20, 20A) is provided.

  In addition, the cross-sectional area perpendicular to the axial direction (Z-axis direction) of the through hole H decreases from the movable element (angular velocity sensor 1) toward the electrode films (21, 21A).

  By reducing the cross-sectional area (diameter) perpendicular to the axial direction of the through hole H from the movable element toward the electrode film (on the outside of the element), vibration that causes noise is suppressed and vibration penetrates. As the conductive material (20, 20A) in the hole H is transmitted, the vibration is attenuated and leakage of vibration to the outside is reduced. Furthermore, since the electrode film (21, 21A) covers the exposed surface of the conductive material (20, 20A), the vibration of the conductive material (20, 20A) is suppressed, and the bonding is connected to the electrode film (21, 21A). Deterioration (disconnection, etc.) of wiring such as the wires (22, 22A) can be suppressed.

  The interface between the conductive material (20, 20A) and the electrode film (21, 21A) is flat. That is, the surface of the conductive material (20, 20A) can be planarized by polishing or the like, and the electrode film formed thereon can also be planarized. The flattened electrode film has less variation in electrical characteristics than the bent electrode film, and the material cost is low because the area is small. Since the planarized structure is simple, it is easy to reduce the size of the element.

  Examples of the conductive material (20, 20A) include copper (Cu), nickel (Ni), and / or aluminum (Al). Examples of the material of the electrode film (21, 21A) include chromium (Cr), titanium (Ti), and / or gold (Au). The upper substrate U and the lower substrate L can be made of a semiconductor material or a glass material. After the tapered through hole H is formed in the upper substrate U, a conductive material is filled in the through hole H using a vapor deposition method, a plating method, a sputtering method, or the like, and both surfaces of the upper substrate U are polished. The planarization is performed. Note that the upper exposed plane of the conductive material (20, 20A) may be somewhat recessed.

  The angular velocity sensor 1 includes a piezoelectric element 6 to which a driving signal is given via the conductive material 20 and a driving arm 3 to which the piezoelectric element 6 is fixed, and is mechanically coupled to the driving arm 3. A signal corresponding to the angular velocity is output from another piezoelectric element 6A provided on the arm 3A. The piezoelectric element 6 vibrates by an electric signal given through the conductive material, and vibrates the driving arm 3. The vibration of the drive arm 3 is transmitted to the detection arm 3A, and the vibration state is detected by another piezoelectric element 6A. When the drive arm 3 performs vibration including noise, the vibration is also transmitted to the detection arm 3A, and the electric signal output as the detection signal includes noise. In the present invention, the vibration of the conductive material is suppressed as described above, and noise included in the detection signal is suppressed.

  Further, the angular velocity sensor 1 includes a piezoelectric element 6A from which a detection signal is taken out via a conductive material 20A, and a detection arm 3A to which the piezoelectric element 6A is fixed, and a drive arm 3 mechanically coupled to the detection arm 3A. Is vibrated, a signal corresponding to the angular velocity is output from the piezoelectric element 6A provided on the detection arm 3A. Since the vibration of the piezoelectric element 6A provided on the detection arm 3A is difficult to be transmitted to the outside through the conductive material 20A and the electrode film 21A, noise included in the detection signal is suppressed.

  FIG. 6 is a graph showing the relationship between the vibration frequency (Hz) of the piezoelectric element and the displacement amount (m) of the bonding wire in the Z-axis direction.

  In the embodiment adopting the above structure, the displacement of the bonding wire is suppressed as compared with the comparative example. In the comparative example, the electrode film was connected to the electrode pad portion through the inner surface of the through hole without using a conductive material. The displacement due to vibration of the bonding wire itself was measured with a laser Doppler vibrometer. In the case of the structure of the comparative example, it was confirmed that the vibration of the bonding wire rapidly increased near the drive resonance frequency, whereas the vibration of the bonding wire was suppressed in the structure of the example. Moreover, in the structure of the Example, it was confirmed that the leakage signal was also reduced as compared with the comparative example.

  In the embodiment, the vibration and leakage signals in the bonding wire are measured, but the same effect can be obtained in other structures such as flip chip bonding as the connection to the external circuit.

  Next, the angular velocity sensor will be described in detail.

  First, with reference to FIG.1 and FIG.2, the structure of the angular velocity sensor 1 which concerns on this embodiment is demonstrated. FIG. 4 is a perspective view showing the angular velocity sensor according to the present embodiment. FIG. 5 is a top view showing the angular velocity sensor according to the present embodiment (piezoelectric elements are shown except for the upper electrode film 6c).

  As shown in FIGS. 4 and 5, the angular velocity sensor 1 includes a base portion 5, a pair of drive arms 3 and 3 extending in parallel in a certain direction from the base portion 5, and an extending direction of the pair of drive arms 3 and 3. Are provided with a pair of detection arms 3A, 3A extending in parallel in different directions. The base 5, the pair of drive arms 3, 3, and the pair of detection arms 3A, 3A are integrally formed by etching the substrate 2 made of silicon (Si).

  The driving arms 3 and 3 are each composed of a cantilever beam having one end connected to the base portion 5 and extending in the Y direction (longitudinal direction). That is, in the present embodiment, the two drive arms 3 and 3 are connected to the base portion 5 and are arranged substantially in parallel. Thus, only one end of each drive arm 3, 3 is connected to the base 5, and the other end is a free end. The driving arms 3 and 3 can vibrate the end portions which are free ends in the X direction in the figure. Each of the driving arms 3 and 3 has a piezoelectric element 6 formed on the arm, and the piezoelectric element 6 has a driving electrode portion having a piezoelectric film sandwiched between electrode films, which functions as a driving electrode. To do.

  The detection arms 3A and 3A are each composed of a cantilever having one end connected to the base 5 and extending in the Y direction in the figure. That is, in this embodiment, the two detection arms 3A are connected to the base portion 5 and are arranged substantially in parallel. Thus, only one end of each detection arm 3A, 3A is connected to the base 5, and the other end is a free end. The detection arms 3A and 3A can vibrate an end portion which is a free end in the Z direction shown in the figure. Each detection arm 3A, 3A has a piezoelectric element 6A formed on the arm, and the piezoelectric element 6A has a detection electrode portion having a piezoelectric film sandwiched between electrode films. Functions as an electrode. Here, the drive arms 3 and 3 and the detection arms 3A and 3A extend in opposite directions with the base 5 interposed therebetween. That is, the angular velocity sensor 1 in the present embodiment has a so-called H shape.

  The Y-direction length of the piezoelectric element 6 is preferably 30% or more and 50% or less of the Y-direction length of the drive arm 3, and in this case, the amplitude of the drive arm is moderated, and the reliability is high without damage. effective. The Y-direction length of the piezoelectric element 6A is preferably 20% or more and 40% or less of the Y-direction length of the detection arm 3A. In this case, there is an effect that high sensitivity can be obtained by appropriately suppressing the stray capacitance.

  The base 5 is located at the center of the angular velocity sensor 1 and has a substantially rectangular shape. The base portion 5 has a base electrode portion 15 for taking out input / output signals on one main surface, and the other main surface serves as a fixing portion connected to a package (not shown).

  The base electrode portion 15 includes upper electrode pad portions 8 and 8A and a lower electrode pad portion 14. In the present embodiment, it is composed of four upper electrode pad portions 8, 8, 8 A, 8 A and one lower electrode pad portion 14.

  The upper electrode pad portions 8 and 8 are provided on one main surface of the base portion 5 and in the vicinity of the connecting portion with the drive arms 3 and 3, and are connected to the drive electrode portion via the wiring W (see FIG. 5). Electrically connected. More specifically, the upper electrode pad portions 8, 8 are electrically connected to the second electrode film 6c (see FIG. 1) of the piezoelectric element 6 constituting the drive electrode portion. The upper electrode pad portions 8A and 8A are provided on one main surface of the base portion 5 and in the vicinity of a connection portion with the detection arms 3A and 3A, and are electrically connected to the detection electrode portion via the wiring W. ing. More specifically, the upper electrode pad portions 8A and 8A are electrically connected to the second electrode film 6c of the piezoelectric element 6A constituting the detection electrode portion (see FIG. 1: the same structure as the piezoelectric element 6). ing. The upper electrode pad portions 8 and 8A are also connected to an external electric circuit (not shown). As a method for connecting to this external electric circuit, for example, a method of connecting by wire bonding can be mentioned.

  The lower electrode pad portion 14 is provided substantially at the center of the base portion 5. The lower electrode pad portion 14 is electrically connected to the drive electrode portion and the detection electrode portion, respectively. More specifically, the lower electrode pad section 14 is electrically connected to the first electrode film 6a (see FIG. 1) of the piezoelectric elements 6 and 6A constituting the drive electrode section and the detection electrode section. The lower electrode pad section 14 is also connected to an external electric circuit (not shown). As a method for connecting to this external electric circuit, for example, a method of connecting by wire bonding can be mentioned.

  Here, the mechanism by which the angular velocity sensor 1 detects the angular velocity will be described. An AC voltage is applied to the piezoelectric elements 6 constituting the drive electrode portions of the two drive arms 3 and 3 via the base electrode portion 15 to excite the two drive arms 3 and 3 having the drive electrode portions. At this time, the two drive arms 3 and 3 are moved in the X direction (drive vibration) by shifting the phase of the voltage applied to the piezoelectric elements 6 constituting the drive electrode portions of the two drive arms 3 and 3 by 180 °. Direction). That is, when one drive arm 3 is tilted in one direction, the vibration state is such that the other drive arm 3 is tilted in the opposite direction. When the angular velocity sensor 1 is caused to perform angular velocity motion around an axis parallel to the extending direction of the driving arms 3 and 3 during such vibration, the driving arms 3 and 3 are distorted in the vertical direction by Coriolis force. The vibration in the Z direction (detection vibration direction) shown in the figure is generated. When this vibration is transmitted to the detection arms 3A, 3A via the base 5, vibrations in the Z direction (detection vibration direction) are also generated in the detection arms 3A, 3A. Due to this vibration, a potential is generated in the piezoelectric element 6A constituting the detection electrode unit, and the angular velocity applied to the angular velocity sensor 1 can be detected by detecting this potential as a detection signal through the base electrode unit 15. .

The piezoelectric film 6b is formed on the first electrode film 6a. The piezoelectric film 6b is, for example, a perovskite complex oxide represented by the general formula ABO ₃ . Here, as A, calcium (Ca), barium (Ba), strontium (Sr), lead (Pb), potassium (K), sodium (Na), lithium (Li), lanthanum (La) and cadmium (Cd) And at least one selected from titanium (Ti), zirconium (Zr), tantalum (Ta) and niobium (Nb). Specifically, as the material of the piezoelectric film 6b, lead zirconate titanate (PZT), lead magnesium niobate-PZT system (PMN-PZT), lead nickel niobate-PZT system (PMN-PZT), magnesium niobium Lead acid-PT system (PMN-PT), lead nickel niobate-PT system (PMN-PT), and the like are suitable. Among these, lead zirconate titanate (PZT) showing excellent piezoelectric characteristics is preferable. As the piezoelectric film, KNN (potassium, niobium, sodium) or the like can also be used.

  The first electrode film 6 a is formed on the substrate 2. That is, it is provided between the substrate 2 and one surface of the piezoelectric film 6b. The material of the first electrode film 6a is not particularly limited as long as it is a conductive material suitable for controlling the crystal orientation of the piezoelectric film 6b. For example, platinum (Pt), iridium (Ir) Palladium (Pd) and the like are preferable. In addition, gold (Au), copper (Cu), titanium (Ti), and the like can be given, and they may be laminated in combination.

  The second electrode film 6c is formed on the piezoelectric film 6b. That is, it is provided on the other surface of the piezoelectric film 6b. The material of the second electrode film 6c may be any conductive material suitable for controlling the crystal orientation of the piezoelectric film 6b, and is not particularly limited. For example, platinum (Pt), gold (Au) Aluminum alloy and the like are preferable. In addition, copper (Cu), titanium (Ti), etc. are mentioned, and may be laminated by combining them. Each of the first electrode film 6a, the piezoelectric film 6b, and the second electrode film 6c can be formed by a vacuum deposition method or a sputtering method.

  Next, a manufacturing method of the angular velocity sensor 1 having the above-described configuration will be described.

  First, a substrate 2 that is a disk-shaped wafer made of silicon is prepared. Subsequently, the piezoelectric element 6 constituting the two drive electrode portions and the piezoelectric element 6A constituting the two detection electrode portions are formed on the substrate 2. In each piezoelectric element, a first electrode film 6a corresponding to the lower electrode is formed by depositing a conductive film made of platinum (Pt) on the substrate 2 with a desired film thickness by vacuum deposition or sputtering. A piezoelectric film 6b made of lead zirconate titanate (PZT) is formed on the first electrode film 6a with a desired film thickness by sputtering, and platinum (Pt) is further formed on the piezoelectric film 6b. A second electrode film 6c corresponding to the upper electrode is formed by forming a conductive film made of the above to a desired thickness by sputtering.

  Subsequently, each formed thin film is processed into a desired pattern shape of the drive electrode portion and the detection electrode portion by photolithography and etching.

  Subsequently, each thin film is formed and the substrate 2 processed into a pattern shape is separated into element shapes by silicon etching and dicing. Thus, the angular velocity sensor 1 is obtained.

  The preferred embodiments of the present invention have been described above. However, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. The above-described components include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the above-described components can be appropriately combined. In addition, various omissions, substitutions, or changes of components can be made without departing from the scope of the present invention.

  For example, in the present embodiment, the angular velocity sensor 1 has been described as having an H shape, but is not limited to this, and can be applied to various shapes of angular velocity sensors such as a columnar shape and a tuning fork shape. Regardless of the shape of the angular velocity sensor, the generation of noise can be suppressed if the drive electrode portion and the detection electrode portion have the configuration of the piezoelectric elements 6 and 6A according to the present embodiment. Moreover, when utilizing the mechanism in which a capacity | capacitance changes with a motion of a movable element, it can also apply to a semiconductor capacitive acceleration sensor, for example. In this case, a structure in which the capacitance between the movable element and the inner wall (conductor) of the substrate changes can be adopted.

  As described above, the electronic component is an electronic component having a sealed movable part and having a through hole for electrically connecting the movable part and the outside of the element, A shape in which the cross-sectional area of the through hole gradually decreases from the movable part side toward the outside of the element, and the through hole has a through wiring filled with a conductive material, and the electrode film is formed on one surface. Yes.

  The present invention can be used for an angular velocity detection device, an acceleration detection device, and the like that detect an angular velocity due to rotation of a substance such as an automobile, a car navigation system, and a camera shake prevention camera.

  DESCRIPTION OF SYMBOLS 1 ... Angular velocity sensor, 2 ... Board | substrate, 3 ... Drive arm, 3A ... Detection arm, 5 ... Base, 6 ... Piezoelectric element, 15 ... Base electrode part, W ... Wiring, 6a ... 1st electrode film (lower electrode), 6b: piezoelectric film, 6c: second electrode film (upper electrode).

Claims (4)

A first member having a fixing portion having a through hole;
A second member disposed opposite to the first member and defining a space with the first member;
A movable element that is partly sandwiched and fixed between the fixed portion of the first member and the second member, and whose tip portion is located in the space and can be displaced;
A conductive material filled in the through-hole and electrically connected to the movable element;
An electrode film made of a material different from the conductive material and covering an exposed surface of the conductive material;
With
The cross-sectional area perpendicular to the axial direction of the through hole is smaller from the movable element toward the electrode film,
An electronic component characterized by that.   The electronic component according to claim 1, wherein an interface between the conductive material and the electrode film is flat. The movable element is
A piezoelectric element to which a drive signal is given via the conductive material;
A driving arm to which the piezoelectric element is fixed;
With
A signal corresponding to the angular velocity is output from another piezoelectric element provided on the detection arm mechanically coupled to the drive arm.
The electronic component according to claim 1, wherein the electronic component is an electronic component. The movable element is
A piezoelectric element from which a detection signal is taken out via the conductive material;
A detection arm to which the piezoelectric element is fixed;
With
When a driving arm mechanically coupled to the detection arm is vibrated, a signal corresponding to an angular velocity is output from the piezoelectric element provided on the detection arm.
The electronic component according to claim 1, wherein the electronic component is an electronic component.

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